Wiring circuit board

Abstract

The present invention provides a wiring circuit board that allows the first and second wirings to be supported by a metal support layer, even when the width of the metal support layer is limited. [Solution] The wiring circuit board 1 comprises a metal support layer 11, a first insulating layer 12, and wirings 133A and 133B. Wiring 133A has a first outer edge E21 and a first inner edge E22. Wiring 133B has a second outer edge E31 and a second inner edge E32. At least one of the first outer edge E21 and the second outer edge E31 does not overlap with the metal support layer 11 in the thickness direction. The first inner edge E22 and the second inner edge E32 overlap with the metal support layer 11 in the thickness direction.

Description

Technical Field

[0001] The present invention relates to a wiring circuit board.

Background Art

[0002] Conventionally, a wiring circuit board has been proposed that includes a metal-based support layer, a base insulating layer disposed on one side in the thickness direction of the metal-based support layer, and a wiring (main wiring portion) disposed on one side in the thickness direction of the base insulating layer (see, for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the wiring circuit board as described in Patent Document 1, in order to ensure the flexibility of the wiring body on which the wiring (main wiring portion) is disposed, the width of the metal-based support layer may be limited.

[0005] In that case, it may be difficult to arrange a plurality of wirings (main wiring portions). For example, if the wiring supported by the metal-based support layer and the wiring disposed outside the metal-based support layer and not supported by the metal-based support layer are mixed, when an external force is applied to the wiring body, stress may concentrate on the wiring not supported by the metal-based support layer.

[0006] The present invention provides a wiring circuit board that can support the first wiring and the second wiring with a metal support layer even when the width of the metal support layer is limited.

Means for Solving the Problems

[0007] The present invention [1] includes a wiring circuit board comprising: an insulating layer; a first wiring arranged on one side of the insulating layer in the thickness direction of the insulating layer; a second wiring arranged on one side of the insulating layer in the thickness direction and away from the first wiring in the width direction perpendicular to the thickness direction; and a metal support layer arranged on the other side of the insulating layer in the thickness direction, wherein the first wiring has a first outer edge and a first inner edge arranged between the first outer edge and the second wiring in the width direction, and the second wiring has a second outer edge and a second inner edge arranged between the second outer edge and the first wiring in the width direction, wherein at least one of the first outer edge and the second outer edge does not overlap with the metal support layer in the thickness direction, and the first inner edge and the second inner edge overlap with the metal support layer in the thickness direction.

[0008] With this configuration, the width of the metal support layer is limited, and even if at least one of the first outer edge and the second outer edge does not overlap with the metal support layer in the thickness direction, the first inner edge and the second inner edge will overlap with the metal support layer in the thickness direction.

[0009] Therefore, even when the width of the metal support layer is limited, both the first and second wiring can be supported by the metal support layer.

[0010] The present invention [2] includes the wiring circuit board of [1], wherein the width of the first wiring is greater than the width of the second wiring, the first outer edge does not overlap with the metal support layer in the thickness direction, and the second outer edge overlaps with the metal support layer in the thickness direction.

[0011] With this configuration, the first outer edge of the first wiring, which is wide and highly rigid, is positioned outside the metal support layer, and the second wiring, which is narrower and less rigid, can be reliably supported by the metal support layer.

[0012] Therefore, even if the width of the first wiring is greater than the width of the second wiring, both the first and second wirings can be reliably supported by the metal support layer.

[0013] The present invention [3] includes the wiring circuit board described in [2] above, wherein the center in the width direction of the region between the first outer edge and the second outer edge is defined as the first center, and the center of the metal support layer in the width direction is defined as the second center, and the first center is located between the second center and the first outer edge in the width direction.

[0014] In this configuration, the first center is shifted in the width direction relative to the second center, towards the first outer edge.

[0015] Therefore, when the width of the first wiring is greater than the width of the second wiring, the first outer edge of the first wiring can be placed outside the metal support layer, and the second wiring can be placed inside the metal support layer.

[0016] The present invention [4] includes the wiring circuit board described in [3] above, wherein the ratio of the distance between the first center and the second center to the distance between the first outer edge and the second outer edge is 1 / 3 or less.

[0017] This configuration prevents the first outer edge from being positioned excessively outside the metal support layer.

[0018] As a result, even when the width of the first wiring is greater than the width of the second wiring, both the first and second wirings can be reliably supported by the metal support layer.

[0019] The present invention [5] includes any one of the wiring circuit boards described in [2] to [4] above, wherein the ratio of the width of the second wiring to the width of the metal support layer is 2 / 3 or less.

[0020] With this configuration, the second wiring can be placed inside the metal support layer, ensuring that the second wiring is securely supported by the metal support layer.

[0021] The present invention [6] includes any one of the wiring circuit boards [1] to [5] above, in which the ratio of the distance between the first outer edge and the second outer edge to the width of the metal support layer is 3.0 or less.

[0022] According to such a configuration, it is possible to suppress the first outer edge and the second outer edge from being excessively disposed outside the metal support layer.

[0023] As a result, the first wiring and the second wiring can be reliably supported by the metal support layer.

Effect of the Invention

[0024] According to the wiring circuit board of the present invention, even when the width of the metal support layer is limited, the first wiring and the second wiring can be supported by the metal support layer.

Brief Description of the Drawings

[0025] [Figure 1] FIG. 1 is a plan view showing an embodiment of the wiring circuit board of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line A-A of the wiring circuit board shown in FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view showing a modification (1) of the wiring circuit board. [Figure 4] FIG. 4 is a cross-sectional view showing a modification (2) of the wiring circuit board.

Embodiments for Carrying Out the Invention

[0026] 1. Wiring Circuit Board As shown in FIG. 1, the wiring circuit board 1 includes a plurality of support portions 2A and 2B and a plurality of wiring portions 3A and 3B.

[0027] Support parts 2A and 2B are arranged spaced apart from each other in the first direction. Each of support parts 2A and 2B extends in the second direction, which is perpendicular to the first direction. The shapes of support parts 2A and 2B are not limited. Support part 2A supports one end of each of the wiring parts 3A and 3B. Terminals 131A, 131B, 131C, and 131D of the circuit pattern 13, described later, may be placed on support part 2A. Support part 2B supports the other end of each of the wiring parts 3A and 3B. Terminals 132A, 132B, 132C, and 132D of the circuit pattern 13, described later, may be placed on support part 2B.

[0028] The wiring sections 3A and 3B are positioned between support section 2A and support section 2B in the first direction. The wiring sections 3A and 3B are aligned in the second direction. In the second direction, wiring section 3B is positioned at a distance from wiring section 3A. At least a portion of the wiring 133A, which will be described later, is positioned in wiring section 3A. Wiring section 3A has a width in the width direction of wiring 133A and extends in the direction in which wiring 133A extends. In this embodiment, the direction in which wiring 133A extends is the same as the first direction, and the width direction of wiring 133A is the same as the second direction. The direction in which wiring 133A extends may be different from the first direction. Also, the width direction of wiring 133A may be different from the second direction. At least a portion of the wiring 133C, which will be described later, is positioned in wiring section 3B. Wiring section 3B has a width in the width direction of wiring 133C and extends in the direction in which wiring 133C extends. The wiring section 3B extends in the same direction as the wiring section 3A. One end of each wiring section 3A and 3B is connected to the support section 2A. The other end of each wiring section 3A and 3B is connected to the support section 2B. The shape of each wiring section 3A and 3B is not limited. Each wiring section 3A and 3B may be straight or curved. The length of each wiring section 3A and 3B may be longer than the distance between the support section 2A and the support section 2B in the first direction.

[0029] As shown in Figure 2, the wiring section 3A comprises a metal support layer 11, a first insulating layer 12, a circuit pattern 13, and a second insulating layer 14. In other words, the wiring circuit board 1 comprises a metal support layer 11, a first insulating layer 12 (insulating layer), a circuit pattern 13, and a second insulating layer 14.

[0030] (1) Metal support layer The metal support layer 11 supports the first insulating layer 12, the circuit pattern 13, and the second insulating layer 14. The metal support layer 11 is made of metal. Examples of materials for the metal support layer 11 include copper, nickel, cobalt, iron, and alloys thereof. Examples of alloys include stainless steel and copper alloys. Preferably, the material for the metal support layer 11 is a copper alloy.

[0031] The metal support layer 11 has one end 11A and the other end 11B in the thickness direction. In this embodiment, the width of the metal support layer 11 increases from the other end 11B toward the one end 11A. However, the width of the metal support layer 11 may be approximately the same from the other end 11B toward the one end 11A.

[0032] The metal support layer 11 of the wiring section 3A is positioned in the center of the wiring section 3A in the width direction. The width W1 of one end 11A of the metal support layer 11 of the wiring section 3A is smaller than the width W11 of the first insulating layer 12 of the wiring section 3A. The metal support layer 11 of the wiring section 3A is positioned between one end edge E11 of the first insulating layer 12 of the wiring section 3A and the other end edge E12 of the first insulating layer 12 of the wiring section 3A in the width direction. The metal support layer 11 of the wiring section 3A is positioned away from one end edge E11 of the first insulating layer 12 of the wiring section 3A in the width direction. The metal support layer 11 of the wiring section 3A is positioned away from the other end edge E12 of the first insulating layer 12 of the wiring section 3A in the width direction.

[0033] The thickness T1 of the metal support layer 11 of the wiring section 3A is, for example, 10 μm to 300 μm, preferably 50 μm to 250 μm.

[0034] The width W1 of one end portion 11A of the metal support layer 11 of the wiring section 3A is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0035] The ratio (T1 / W1) of the thickness T1 of the metal support layer 11 of the wiring section 3A to the width W1 of one end 11A of the metal support layer 11 of the wiring section 3A is, for example, 2 or more, preferably 5 or more. The ratio (T1 / W1) is, for example, 30 or less, preferably 10 or less. The ratio (T1 / W1) may be 2 to 30, or 5 to 10.

[0036] The metal support layer 11 may also have a protective metal layer (first protective metal layer). The protective metal layer is disposed on one side surface of the metal support layer 11 in the thickness direction. The protective metal layer protects the metal support layer 11. The protective metal layer is, for example, a sputtering layer. Examples of materials for the protective metal layer include chromium, copper, nickel, titanium, and alloys thereof.

[0037] (2) First insulating layer The first insulating layer 12 is positioned on one side of the metal support layer 11 in the thickness direction. In other words, the metal support layer 11 is positioned on the other side of the first insulating layer 12 in the thickness direction. The first insulating layer 12 is positioned on one side surface of the metal support layer 11 in the thickness direction. The first insulating layer 12 is positioned between the metal support layer 11 and the circuit pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the circuit pattern 13. The first insulating layer 12 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0038] (3) Circuit Pattern As shown in Figure 1, the circuit pattern 13 comprises multiple terminals 131A, 131B, 131C, 131D, multiple terminals 132A, 132B, 132C, 132D, and multiple wires 133A, 133B, 133C, 133D. In other words, the wiring circuit board 1 comprises wire 133A (first wire) and wire 133B (second wire). The shape of the circuit pattern 13 is not limited.

[0039] Terminals 131A, 131B, 131C, and 131D are positioned on support portion 2A. Each of terminals 131A, 131B, 131C, and 131D has a corner land shape.

[0040] Terminals 132A, 132B, 132C, and 132D are positioned on the support portion 2B. Each of terminals 132A, 132B, 132C, and 132D has a corner land shape.

[0041] Wiring 133A electrically connects terminals 131A and 132A. One end of wiring 133A is connected to terminal 131A. The other end of wiring 133A is connected to terminal 132A.

[0042] Wiring 133B electrically connects terminals 131B and 132B. One end of wiring 133B is connected to terminal 131B. The other end of wiring 133B is connected to terminal 132B.

[0043] At least a portion of wiring 133A and at least a portion of wiring 133B are arranged in wiring section 3A. That is, wiring section 3A has wiring 133A and wiring 133B. One end of wiring 133A and one end of wiring 133B may be arranged in support section 2A. The other end of wiring 133A and the other end of wiring 133B may be arranged in support section 2B.

[0044] Wiring 133C electrically connects terminals 131C and 132C. One end of wiring 133C is connected to terminal 131C. The other end of wiring 133C is connected to terminal 132C.

[0045] Wiring 133D electrically connects terminals 131D and 132D. One end of wiring 133D is connected to terminal 131D. The other end of wiring 133D is connected to terminal 132D.

[0046] At least a portion of wiring 133C and at least a portion of wiring 133D are arranged in wiring section 3B. That is, wiring section 3B has wiring 133C and wiring 133D. One end of wiring 133C and one end of wiring 133D may be arranged in support section 2A. The other end of wiring 133C and the other end of wiring 133D may be arranged in support section 2B.

[0047] As shown in Figure 2, the circuit pattern 13 is positioned on one side of the first insulating layer 12 in the thickness direction. The circuit pattern 13 is positioned on one side surface of the first insulating layer 12 in the thickness direction. The circuit pattern 13 is positioned on the opposite side of the metal support layer 11 from the first insulating layer 12 in the thickness direction.

[0048] The circuit pattern 13 may also have a protective metal layer (a second protective metal layer). The protective metal layer is disposed on one side surface of the first insulating layer 12 in the thickness direction. The protective metal layer protects the circuit pattern 13. The protective metal layer is, for example, a sputtering layer. Examples of materials for the protective metal layer include chromium, copper, nickel, titanium, and alloys thereof.

[0049] (4) Second insulating layer The second insulating layer 14 is positioned on one side of the first insulating layer 12 in the thickness direction. The second insulating layer 14 is positioned on one side surface of the first insulating layer 12 in the thickness direction. The second insulating layer 14 covers all wirings 133A, 133B, 133C, and 133D. However, the second insulating layer 14 does not cover terminals 131A, 131B, 131C, 131D, 132A, 132B, 132C, and 132D. The second insulating layer 14 is made of resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0050] 2. Details of the wiring section Next, with reference to Figure 2, the details of the wiring section 3A will be described. The wiring section 3B has the same structure as the wiring section 3A. Therefore, the description of the wiring section 3B will be omitted.

[0051] As described above, the wiring section 3A has wiring 133A and wiring 133B.

[0052] The wiring 133A is positioned on one side of the first insulating layer 12 in the thickness direction of the first insulating layer 12. The wiring 133A is positioned on one side surface of the first insulating layer 12 in the thickness direction. The wiring 133A is positioned on the opposite side of the metal support layer 11 from the first insulating layer 12 in the thickness direction.

[0053] The width W21 of wiring 133A is greater than the width W22 of wiring 133B. However, the thickness of wiring 133A is the same as that of wiring 133B. Therefore, a larger current can flow through wiring 133A than through wiring 133B. Wiring 133A may be thicker than wiring 133B.

[0054] Specifically, the width W21 of wiring 133A is, for example, 10 μm to 25 μm, preferably 15 μm to 20 μm. The width W22 of wiring 133B is, for example, 5 μm to 20 μm, preferably 8 μm to 17 μm. The thickness of wiring 133A and wiring 133B is, for example, 1 μm to 20 μm, preferably 5 μm to 15 μm.

[0055] Wiring 133A has a first outer edge E21 and a first inner edge E22 in the width direction.

[0056] The first outer edge E21 is one side edge of the wiring 133A in the width direction. In the width direction, the first outer edge E21 is located on one side of the one side edge E1 of the metal support layer 11. In other words, in the width direction, the first outer edge E21 is located on the opposite side of the other side edge E2 of the metal support layer 11 with respect to the one side edge E1 of the metal support layer 11. That is, in the width direction, the first outer edge E21 is located outside the metal support layer 11. In the thickness direction, the first outer edge E21 does not overlap with the metal support layer 11. Therefore, the width W21 of the wiring 133A can be secured up to the outside of the metal support layer 11.

[0057] The ratio (D1 / W21) of the widthwise distance D1 between one side edge E1 and the first outer edge E21 of the metal support layer 11 to the width W21 of the wiring 133A is, for example, greater than 0, 1 / 20 or more, preferably 1 / 10 or more. If the ratio (D1 / W21) is greater than or equal to the lower limit above, the width W21 of the wiring 133A can be more securely maintained. The ratio (D1 / W21) is, for example, less than 2 / 3, preferably 1 / 2 or less. If the ratio (D1 / W21) is less than or equal to the upper limit above, the wiring 133A can be reliably supported by the metal support layer 11.

[0058] The first inner edge E22 is the other edge of the wiring 133A in the width direction. The first inner edge E22 is positioned between the first outer edge E21 and the wiring 133B in the width direction. The first inner edge E22 is positioned on the other side of the one edge E1 of the metal support layer 11 in the width direction. In other words, the first inner edge E22 is positioned between the one edge E1 and the other edge E2 of the metal support layer 11 in the width direction. That is, the first outer edge E21 is positioned inside the metal support layer 11 in the width direction. The first inner edge E22 overlaps with the metal support layer 11 in the thickness direction. Therefore, the wiring 133A can be supported by the metal support layer 11.

[0059] The ratio (D2 / W21) of the widthwise distance D2 between one side edge E1 and the first inner edge E22 of the metal support layer 11 to the width W21 of the wiring 133A is, for example, 1 / 3 or more, preferably greater than 1 / 2. If the ratio (D2 / W21) is greater than or equal to the above lower limit, the wiring 133A can be reliably supported by the metal support layer 11. The ratio (D2 / W21) is, for example, less than 1 / 1, preferably 19 / 20 or less, and more preferably 9 / 10 or less. If the ratio (D2 / W21) is less than or equal to the above lower limit, the width W21 of the wiring 133A can be more securely secured.

[0060] The wiring 133B is positioned on one side of the first insulating layer 12 in the thickness direction. The wiring 133B is positioned on one side surface of the first insulating layer 12 in the thickness direction. The wiring 133B is positioned on the opposite side of the metal support layer 11 from the first insulating layer 12 in the thickness direction. The wiring 133B is positioned on the other side of the wiring 133A in the width direction. The wiring 133B is positioned away from the wiring 133A in the width direction. The entirety of the wiring 133B is positioned between one side edge E1 of the metal support layer 11 and the other side edge E2 of the metal support layer 11 in the width direction. In other words, the entirety of the wiring 133B is positioned inside the metal support layer 11 in the width direction. The entirety of the wiring 133B overlaps with the metal support layer 11 in the thickness direction.

[0061] The wiring 133B has a second outer edge E31 and a second inner edge E32 in the width direction. The second outer edge E31 is the other edge of the wiring 133B in the width direction. The second outer edge E31 is positioned to one side of the other edge E2 of the metal support layer 11 in the width direction. The second outer edge E31 overlaps with the metal support layer 11 in the thickness direction. The second inner edge E32 is the other edge of the wiring 133B in the width direction. The second inner edge E32 is positioned between the second outer edge E31 and the wiring 133A in the width direction. The second inner edge E32 overlaps with the metal support layer 11 in the thickness direction. Therefore, the wiring 133B can be supported by the metal support layer 11.

[0062] The ratio (D3 / W1) of the distance D3 between the first outer edge E21 and the second outer edge E31 to the width W1 of one end 11A of the metal support layer 11 is, for example, 3.0 or less, preferably 2.0 or less. When the ratio (D3 / W1) is less than or equal to the above lower limit, both wirings 133A and 133B can be reliably supported by the metal support layer 11 while ensuring the width W21 of the wiring 133A. The ratio (D3 / W1) is, for example, 1.0 or more, preferably 1.5 or more.

[0063] If the center in the width direction of the region between the first outer edge E21 and the second outer edge E31 is defined as the first center C1, and the center of the metal support layer 11 in the width direction is defined as the second center C2, then the first center C1 is positioned between the second center C2 and the first outer edge E21 in the width direction. In other words, the first center C1 does not coincide with the second center C2. In the width direction, the first center C1 is shifted toward the first outer edge E21 relative to the second center C2. This allows the wiring 133B to be positioned inside the metal support layer 11.

[0064] The ratio (D4 / D3) of the distance D3 between the first center C1 and the second center C2 to the distance D3 between the first outer edge E21 and the second outer edge E31 is, for example, 1 / 3 or less, preferably 1 / 4 or less. When the ratio (D4 / D3) is below the above upper limit, it is possible to prevent the first outer edge E21 from being excessively positioned outside the metal support layer 11. As a result, even when the width W21 of the wiring 133A is greater than the width W22 of the wiring 133B, both the wiring 133A and the wiring 133B can be reliably supported by the metal support layer 11. The ratio (D4 / D3) is, for example, 1 / 20 or more, preferably 1 / 10 or more.

[0065] The ratio (W22 / W1) of the width W22 of the wiring 133B to the width W1 of one end 11A of the metal support layer 11 is, for example, 2 / 3 or less, preferably 1 / 2 or less. When the ratio (W22 / W1) is less than or equal to the above upper limit, the wiring 133B can be placed inside the metal support layer 11 and the wiring 133B can be reliably supported by the metal support layer 11. The ratio (W22 / W1) is, for example, 1 / 10 or more, preferably 1 / 5 or more.

[0066] 3. Effects (1) According to the wiring circuit board 1, as shown in Figure 2, the first outer edge E21 does not overlap with the metal support layer 11 in the thickness direction, and the first inner edge E22 overlaps with the metal support layer 11 in the thickness direction. Also, the second outer edge E31 and the second inner edge E32 overlap with the metal support layer 11 in the thickness direction. In other words, the entirety of the wiring 133B overlaps with the metal support layer 11 in the thickness direction.

[0067] Therefore, even when the width W1 of the metal support layer 11 is limited, both wiring 133A and wiring 133B can be supported by the metal support layer 11. This suppresses stress concentration on wiring 133A and wiring 133B when an external force is applied to the wiring section 3A. As a result, the occurrence of cracks in wiring 133A and wiring 133B can be suppressed.

[0068] (2) According to the wiring circuit board 1, as shown in Figure 2, the width W21 of wiring 133A is greater than the width W22 of wiring 133B. The first outer edge E21 does not overlap with the metal support layer 11 in the thickness direction, while the second outer edge E31 overlaps with the metal support layer 11 in the thickness direction.

[0069] Therefore, the first outer edge E21 of the wiring 133A, which has a large width W21 and high rigidity, is placed outside the metal support layer 11, and the wiring 133B, which has a small width W22 and low rigidity, can be reliably supported by the metal support layer 11.

[0070] Therefore, even if the width W21 of wiring 133A is greater than the width W22 of wiring 133B, both wiring 133A and wiring 133B can be reliably supported by the metal support layer 11.

[0071] (3) According to the wiring circuit board 1, as shown in Figure 2, the first center C1 is positioned in the width direction between the second center C2 and the first outer edge E21. In other words, in the width direction, the first center C1 is shifted toward the first outer edge E21 relative to the second center C2.

[0072] Therefore, when the width W21 of wiring 133A is greater than the width W22 of wiring 133B, the first outer edge E21 of wiring 133A can be placed outside the metal support layer 11, and wiring 133B can be placed inside the metal support layer 11.

[0073] (4) According to the wiring circuit board 1, as shown in Figure 2, the ratio of the distance D4 between the first center C1 and the second center C2 to the distance D3 between the first outer edge E21 and the second outer edge E31 (D4 / D3) is, for example, 1 / 3 or less.

[0074] Therefore, it is possible to prevent the first outer edge E21 from being positioned excessively outside the metal support layer 11.

[0075] As a result, even if the width W21 of wiring 133A is greater than the width W22 of wiring 133B, both wiring 133A and wiring 133B can be reliably supported by the metal support layer 11.

[0076] (5) According to the wiring circuit board 1, as shown in Figure 2, the ratio of the width W22 of the wiring 133B to the width W1 of the metal support layer 11 (W22 / W1) is, for example, 2 / 3 or less.

[0077] Therefore, the wiring 133B can be placed inside the metal support layer 11, ensuring that the wiring 133B is securely supported by the metal support layer 11.

[0078] (6) According to the wiring circuit board 1, as shown in Figure 1, the ratio of the distance D3 between the first outer edge E21 and the second outer edge E31 to the width W1 of the metal support layer 11 (D3 / W1) is, for example, 3.0 or less.

[0079] Therefore, it is possible to prevent the first outer edge E21 from being positioned excessively outside the metal support layer 11.

[0080] As a result, wiring 133A and wiring 133B can be reliably supported by the metal support layer 11.

[0081] 4. Variations Next, a modified example will be described. In the modified example, the same reference numerals are used for components similar to those in the embodiment, and their descriptions are omitted.

[0082] (1) As shown in Figure 3, the width W22 of wiring 133B may be the same as the width W21 of wiring 133A. Also, the first center C1 may coincide with the second center C2.

[0083] In this case, the second outer edge E31 is positioned on the other side of the other edge E2 of the metal support layer 11 in the width direction. In other words, the second outer edge E31 is positioned on the opposite side of the other edge E2 of the metal support layer 11 from the one edge E1 of the metal support layer 11 in the width direction. That is, the second outer edge E31 is positioned on the outside of the metal support layer 11 in the width direction.

[0084] In this modified example, neither the first outer edge E21 nor the second outer edge E31 overlaps with the metal support layer 11 in the thickness direction. Therefore, both the width W21 of the wiring 133A and the width W22 of the wiring 133B can be secured to the outside of the metal support layer 11.

[0085] This modified example also provides the same effects and benefits as the embodiment described above.

[0086] (2) As shown in Figure 4, the width W22 of wiring 133B may be the same as the width W21 of wiring 133A, and the first center C1 may be separated from the second center C2. In this case, as in the embodiment described above, the second outer edge E31 may overlap with the metal support layer 11 in the thickness direction.

[0087] This modified example also provides the same effects and benefits as the embodiment described above. [Explanation of symbols]

[0088] 1 Wiring circuit board 11 Metal support layer W1 Width of the metal support layer 12. First insulating layer (insulating layer) 133A wiring (1st wiring) E21 First outer edge E22 First inner edge W21 Width of the first wiring 133B Wiring (Second Wiring) E31 Second outer edge E32 2nd inner edge W22 Width of the second wiring C1 1st center C2 2nd center D3 Distance between the first outer edge and the second outer edge D4 Distance between the first center and the second center

Claims

1. Insulating layer and, A first wiring, arranged on one side of the insulating layer in the thickness direction of the insulating layer, A second wiring is arranged on one side of the insulating layer in the thickness direction and is arranged away from the first wiring in the width direction perpendicular to the thickness direction, A metal support layer disposed on the other side of the insulating layer in the thickness direction, Equipped with, The first wiring has, in the width direction, a first outer edge and a first inner edge positioned between the first outer edge and the second wiring, The second wiring has, in the width direction, a second outer edge and a second inner edge positioned between the second outer edge and the first wiring, At least one of the first outer edge and the second outer edge does not overlap with the metal support layer in the thickness direction. The first inner edge and the second inner edge overlap the metal support layer in the thickness direction, wherein the wiring circuit board is a wiring circuit board.

2. The width of the first wiring is greater than the width of the second wiring. The first outer edge does not overlap with the metal support layer in the thickness direction. The wiring circuit board according to claim 1, wherein the second outer edge overlaps with the metal support layer in the thickness direction.

3. The wiring circuit board according to claim 2, wherein the center in the width direction of the region between the first outer edge and the second outer edge is defined as the first center, and the center of the metal support layer in the width direction is defined as the second center, and the first center is positioned between the second center and the first outer edge in the width direction.

4. The wiring circuit board according to claim 3, wherein the ratio of the distance between the first center and the second center to the distance between the first outer edge and the second outer edge is 1 / 3 or less.

5. The wiring circuit board according to claim 2, wherein the ratio of the width of the second wiring to the width of the metal support layer is 2 / 3 or less.

6. The wiring circuit board according to claim 1, wherein the ratio of the distance between the first outer edge and the second outer edge to the width of the metal support layer is 3.0 or less.

Images