Substrate processing apparatus, substrate processing method, article manufacturing method, program, recording medium

Abstract

There was a need for a technology that would be advantageous in drying a highly uniform coating film applied with high precision to a large-area substrate. [Solution] A substrate processing apparatus comprising a container, a depressurization mechanism for reducing the pressure inside the container, a substrate holding part disposed inside the container for holding a substrate having a film, a cover unit disposed inside the container and capable of defining a substrate housing space surrounding the substrate held by the substrate holding part, and a control unit, wherein the cover unit comprises a roof, a side wall connected to the roof, and a movable member supported by the side wall so as to be able to change its orientation in the substrate housing space, and the control unit controls the orientation of the movable member.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, a substrate processing method, and the like.

Background Art

[0002] As a method for manufacturing an article such as an organic EL element (OLED), a method is known in which a coating solution composed of a solvent and a solute is applied onto a substrate to form a coating film, and the solvent is evaporated from the coating film to dry the film. Conventionally, a method of heating the substrate in the atmosphere to dry the solvent in the coating film has been frequently used, but there has been a problem of a long processing time. Recently, in order to shorten the processing time, a reduced-pressure drying method is used in which a substrate on which a coating film is formed is placed in a chamber and the solvent is dried by reducing the pressure inside the chamber.

[0003] In the reduced-pressure drying method, the solvent vapor is more likely to diffuse in a place where the air flow easily moves toward the exhaust port inside the chamber, and evaporation is promoted and the drying rate becomes faster. Therefore, uneven drying of the coating film is likely to occur in the substrate.

[0004] In Patent Document 1, a reduced-pressure drying apparatus is proposed in which a rectifying plate parallel to the main surface of the substrate is provided in the upper space of the substrate inside the chamber, and the air flow toward the exhaust port is regulated by the rectifying plate and the surrounding wall to fill the vapor of the solvent.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, the vacuum drying apparatus described in Patent Document 1 sometimes failed to sufficiently reduce uneven drying within the substrate when drying a coating film that had been applied precisely over a large area. Therefore, when drying a coating film using such a vacuum drying apparatus, it was difficult to achieve a high level of uniformity in the characteristics of a large number of organic EL elements formed on the substrate.

[0007] Therefore, there was a need for a technology that would be advantageous in drying a highly uniform coating film applied to a large-area substrate with high precision. [Means for solving the problem]

[0008] A first aspect of the present invention is a substrate processing apparatus comprising: a container; a depressurization mechanism for reducing the pressure inside the container; a substrate holding portion disposed inside the container for holding a substrate having a film; a cover unit disposed inside the container and capable of defining a substrate housing space surrounding the substrate held by the substrate holding portion; and a control unit, wherein the cover unit comprises a roof; a side wall connected to the roof; and a movable member supported by the side wall so as to be able to change its orientation in the substrate housing space; and the control unit controls the orientation of the movable member.

[0009] Furthermore, a second aspect of the present invention is a method for processing a substrate using a substrate processing apparatus having a control unit, characterized in that a substrate having a film is placed on a substrate holding portion arranged inside a container, the substrate placed on the substrate holding portion is surrounded by a cover unit having a roof and side walls to define a substrate housing space inside the container, the inside of the container is depressurized using a depressurization mechanism, and the control unit controls the posture of a movable member supported by the side wall of the cover unit. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a technology that is advantageous for drying a coating film applied with high precision to a large-area substrate with high uniformity. [Brief explanation of the drawing]

[0011] [Figure 1] A schematic diagram illustrating the manufacturing process of a circuit board. [Figure 2] A schematic cross-sectional view showing the internal structure of a substrate processing apparatus according to the embodiment. [Figure 3] A schematic diagram illustrating the operation of the transport mechanism used to load circuit boards into a container. [Figure 4] A schematic diagram showing a substrate in which a grid-like bank is provided on the main surface, and a liquid is applied to each region enclosed by the bank to form a solution film. [Figure 5] A schematic diagram showing a substrate in which linear banks are provided on the main surface, and a solution film is formed by applying liquid to each of the groove regions surrounded by the banks. [Figure 6] A schematic diagram showing an example in which movable members are installed along each of the four sides of the circuit board. [Figure 7] A schematic partial cross-sectional view showing the first position of the movable member. [Figure 8] A schematic partial cross-sectional view showing the second position of the movable member. [Figure 9] A schematic partial cross-sectional view to specifically explain the first posture. [Figure 10] A cross-sectional view taken along line AA in Figure 9 to illustrate the drive mechanism of a movable member. [Figure 11] A flowchart illustrating the procedure for the drying process according to the embodiment. [Figure 12] (a) A schematic diagram illustrating step S1. (b) A schematic diagram illustrating step S2. (c) A schematic diagram illustrating step S3. [Figure 13] (a) A schematic diagram illustrating step S6. (b) A schematic diagram illustrating step S7. (c) A schematic diagram illustrating the standby state. [Figure 14] A graph showing pressure control during vacuum drying. [Figure 15] A schematic perspective view showing the surrounding structure of the movable part of the vacuum drying apparatus according to Embodiment 2. [Figure 16](a) Diagram showing an example where the main surface of the movable member is bent in Embodiment 3. (b) Diagram showing an example where the main surface of the movable member is a curved surface in Embodiment 3. [Figure 17] Schematic diagram showing the movable part of the vacuum drying device according to Embodiment 4. [Figure 18] Schematic diagram showing the movable part of the vacuum drying device according to Embodiment 5.

Embodiments for Carrying out the Invention

[0012] To facilitate the understanding of the embodiments of the present invention, when drying a coating film finely coated on a large-area substrate, the inventor's findings on the reason why the conventional vacuum drying device sometimes cannot sufficiently reduce the drying unevenness in the substrate are described.

[0013] To form a coating film (solution film) by applying a liquid containing a solvent and a solute on a substrate, a coating device such as an inkjet device is used, for example. However, the drying of the solution film formed by the coating device is performed by a vacuum drying device. When transporting the substrate coated with the solution film from the coating device to the vacuum drying device, natural drying may occur in the transport path. However, natural drying does not proceed uniformly over the entire surface of the substrate and proceeds unevenly under the influence of the air flow acting during transport. The vicinity of the central part of the substrate is surrounded by the vapor evaporating from the peripheral region, so the progress of natural drying during transport is slow. However, the vicinity of the edge of the substrate is easily exposed to the flow of the atmosphere during transport, and the progress of natural drying is fast.

[0014] Therefore, at the time of being carried into the vacuum drying device, the degree of progress of natural drying already differs depending on the part in the substrate. If, at the time of being transferred into the chamber of the vacuum drying device, the degree of natural drying is uniform within the substrate, that is, if vapor is generated uniformly from the entire surface of the substrate, the air flow toward the exhaust port may be regulated by the rectifying plate and the surrounding wall as in Patent Document 1.

[0015] However, if the degree of natural drying is uneven within the substrate when it is transported into the chamber of the vacuum drying apparatus, restricting the airflow within the chamber to ensure uniform vacuum drying will result in different drying conditions in different areas. Differences in the drying process within the vacuum drying apparatus can lead to differences in the shape and quality of the solid film after drying.

[0016] For example, when manufacturing organic light-emitting diodes (OLEDs), bank-like partition members are formed on the substrate to define the shape of the solution film to be applied, and liquid is applied to each region enclosed by the banks. If the degree of natural drying that has progressed before the start of vacuum drying differs, the depth (thickness of the solution film), viscosity, and amount of liquid in contact with the side walls of each bank will differ at the time vacuum drying begins. As a result, the shape and quality of the solid film after vacuum drying will be non-uniform within the substrate.

[0017] In this embodiment, if the degree of natural drying is already uneven within the substrate when it is brought into the chamber of the vacuum drying apparatus, the evaporation rate of each region on the substrate is controlled in the initial stage of the vacuum drying process according to the degree of natural drying. The apparatus includes a mechanism that controls the evaporation of solvent in the regions where natural drying had progressed when the substrate was brought into the apparatus to be suppressed more than in the regions where natural drying had not progressed, in the initial stage (low vacuum). Once the vacuum drying process has progressed to a certain extent and the drying state of the regions where natural drying had not progressed has become the same as the drying state of the regions where natural drying had progressed, the mechanism changes the control so that vacuum drying of the entire substrate proceeds quickly and uniformly thereafter.

[0018] Figure 1 is a schematic diagram illustrating the substrate manufacturing process to explain the difference between the conventional technology and this embodiment. The substrate manufacturing process proceeds from left to right in the diagram in the following order: application of liquid by a coating device, transport of the substrate, and drying treatment by a vacuum drying device.

[0019] The upper section A of the figure shows the drying progress of a liquid applied to the central part of the substrate in a plan view. In the central part of the substrate, the drying of the solution film proceeds similarly whether using the conventional technology or the vacuum drying apparatus of the embodiment.

[0020] In the middle section B of the figure, the drying progress of a liquid film applied near the outer edge of a substrate is illustrated when using a conventional vacuum drying apparatus. In the lower section C of the figure, the drying progress of a solution film applied near the outer edge of a substrate is illustrated when using the vacuum drying apparatus of the embodiment.

[0021] First, a liquid is applied to the recesses defined by the bank using a coating device. To ensure that a solid film of sufficient thickness is formed after drying, the liquid is applied to both the central and peripheral areas of the substrate so that it rises above the bank due to surface tension, as shown in upper A to lower C.

[0022] The substrate coated with the liquid is transported from the coating device to the vacuum drying device by a transport device. During transport, the substrate moves in an atmospheric pressure environment, but the area near the outer edge of the substrate, which is more susceptible to the effects of the airflow acting on it during transport, dries more quickly than the center of the substrate.

[0023] For example, as shown in middle B and lower C, near the outer edge of the substrate, the liquid level (solution film thickness) may drop to near the upper edge of the bank by the end of transport (when it is set in the vacuum drying device). In contrast, the central part of the substrate is surrounded by solvent vapor evaporated from the surroundings, so natural drying does not proceed easily during transport. Therefore, as shown in upper A, the liquid level (solution film thickness) at the end of transport (when it is set in the vacuum drying device) is maintained at a level higher than the upper edge of the bank.

[0024] Vacuum drying is performed under pressure lower than atmospheric pressure after evacuating the chamber. However, drying performed under low vacuum conditions (small pressure difference from atmospheric pressure) is called low vacuum drying, and drying performed under high vacuum conditions (large pressure difference from atmospheric pressure) is called high vacuum drying. In low vacuum drying, the evaporation rate of the solvent from the solution film is small, while in high vacuum drying, the evaporation rate of the solvent from the solution film is large.

[0025] Generally, if high-vacuum drying is performed immediately when the liquid level is higher than the upper edge of the bank, the evaporation rate will be too high, making the evaporation process unstable and resulting in an unstable (non-uniform) shape and quality of the solid film after drying. Therefore, drying is initially carried out stably at a low vacuum with a low evaporation rate, and once the liquid level has dropped to near the upper edge of the bank, it is switched to high-vacuum drying to dry at a high drying rate. This is because increasing the drying rate after the liquid level has dropped to near the upper edge of the bank ensures that the dried film is stably formed on the bottom surface of the bank without adhering to the sides of the bank, resulting in a uniform shape and quality of the solid film.

[0026] In other words, if low-vacuum drying is performed at a low drying rate after the liquid level has dropped to near the upper edge of the bank, the already concentrated liquid will be dried at a slow speed. This will cause solute to adhere more easily to the sides of the bank, and the shape and quality of the solid film formed on the bottom of the bank after drying will deteriorate, such as by reducing the thickness of the solid film.

[0027] In the central part of the substrate, there is a sufficient level of liquid when the substrate is transported. As shown in upper A, once the liquid level drops to near the upper edge of the bank due to low-vacuum drying, the process transitions to high-vacuum drying to dry at a high drying rate. Therefore, once high-vacuum drying is complete, a highly flat solid film is formed on the bottom surface of the bank, as shown in the figure.

[0028] On the other hand, near the outer edge of the substrate, if high-vacuum drying is performed after normal low-vacuum drying, as in the conventional method, solute adheres to the sides of the bank during the low-vacuum drying stage, as shown in middle section B. Once solute adheres to the sides of the bank, the shape of the film does not change even after subsequent high-vacuum drying, resulting in a decrease in the thickness of the film formed on the bottom surface of the bank, and thus a deterioration in the shape and quality of the solid film after drying.

[0029] In this embodiment, during the low-vacuum drying stage, a mechanism (movable member), described later, controls the evaporation of solvent vapor near the outer edge of the substrate, preventing drying from progressing, as schematically shown in lower C. When the liquid level in the center of the substrate drops to near the upper edge of the bank due to low-vacuum drying, the mechanism (movable member) opens the exhaust channel for the accumulated solvent vapor. Until the exhaust channel is opened, the liquid level (solution film thickness) near the outer edge of the substrate is maintained at a level close to that at the start of low-vacuum drying (natural drying state due to transport). In other words, high-vacuum drying can be initiated with the liquid level (solution film thickness) in the center of the substrate and near the outer edge of the substrate being uniform. Therefore, even if natural drying during transport is uneven within the substrate, a solid film with uniform shape and film quality can be formed across the entire substrate on the bottom surface of the bank, as shown in upper A and lower C.

[0030] With reference to the drawings, a substrate processing apparatus, a substrate processing method, and the like according to an embodiment of the present invention will be described in detail. The embodiments shown below are illustrative, and for example, those skilled in the art can modify the detailed configuration as appropriate without departing from the spirit of the present invention.

[0031] In the drawings referenced in the following descriptions of embodiments and examples, elements indicated by the same reference numerals shall have the same function unless otherwise specified. If multiple identical elements are shown in a drawing, the assignment of reference numerals and their descriptions may be omitted.

[0032] Furthermore, since drawings may be schematically represented for the convenience of illustration and explanation, the shape, size, and arrangement of elements shown in the drawings may not strictly correspond to those of actual objects. In addition, notations such as "XX or greater and YY or less" or "XX~YY" that indicate a numerical range mean a numerical range that includes the endpoints XX (lower limit) and YY (upper limit). When numerical ranges are described in steps, the upper and lower limits of each numerical range can be combined in any way.

[0033] In the following explanation, for example, when we refer to the X-plus direction, it refers to the same direction as the X-axis arrow in the illustrated Cartesian coordinate system, and when we refer to the X-minus direction, it refers to the direction 180 degrees opposite to the direction indicated by the X-axis arrow in the illustrated Cartesian coordinate system. Furthermore, when we simply refer to the X direction, it refers to the direction parallel to the X-axis, regardless of whether it is the same as or different from the direction indicated by the illustrated X-axis arrow. The same applies to directions other than X. Unless otherwise specified, in the Cartesian coordinate system XYZ coordinate system, the XY plane is the horizontal plane, and the negative Z-axis direction is the vertical direction (direction of gravity).

[0034] [Embodiment 1] Figure 2 is a schematic cross-sectional view showing the internal structure of a vacuum drying apparatus DU, which is an example of a substrate processing apparatus according to the embodiment. The vacuum drying apparatus DU is used, for example, when manufacturing an organic EL panel equipped with a large number of organic EL elements, and specifically in the process of drying a substrate S on which a solution film F made of functional ink is arranged on the main surface MS to form a solid film. The vacuum drying apparatus DU comprises a container 10 as a chamber, a vacuum mechanism 30 that can reduce the pressure inside the container 10, and a control unit 90.

[0035] The control unit 90 is a computer for controlling the operation of each part of the vacuum drying apparatus DU. The control unit 90 internally includes a CPU, ROM, RAM, I / O ports, etc. (not shown). The ROM stores the operation program for the vacuum drying apparatus DU (substrate processing apparatus).

[0036] The program for executing the various processes related to the substrate processing method of this embodiment may be stored in ROM, like other operating programs, but may also be loaded into RAM from an external source via a network. Alternatively, it may be loaded into RAM via a recording medium readable by the computer on which the program is stored. The program may be stored on any recording medium that is readable by a computer. For example, ROM, disks, external storage devices, etc., may be used as the recording medium for supplying the program.

[0037] To give specific examples, flexible disks, optical disks, magneto-optical disks, magnetic tapes, USB memory sticks, SSDs, etc., can be used as recording media.

[0038] The I / O ports are connected to external devices and networks, allowing for data input and output to an external computer, for example, to perform the drying process of circuit boards. The I / O ports are also connected to monitors and input devices (not shown), enabling the display of operating status information for the vacuum drying apparatus DU to the operator and the acceptance of commands from the operator.

[0039] In addition, the control unit 90 may be configured in ways other than those described above, such as a PLD (Programmable Logic Device) including an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program installed, or a combination of all or part of these.

[0040] The pressure reduction mechanism 30 may include, for example, at least one of a dry pump, diaphragm vacuum pump, turbomolecular pump, cryopump, sorption pump, oil diffusion pump, mechanical booster pump, ejector pump, or oil rotary vacuum pump. The pressure reduction mechanism 30 may also include piping connecting the aforementioned pumps to the container 10, and a control valve for controlling the exhaust speed.

[0041] The container 10, which serves as a chamber, can be an airtight container. A gate valve 12 that can be opened and closed is provided on the side of the container 10. Opening the gate valve 12 opens an inlet for loading the substrate S into or out of the container 10. Closing the gate valve 12 closes the inlet and outlet for the substrate S, and the atmosphere inside the container 10 is isolated from the outside air.

[0042] The container 10 is provided with a substrate holding section 20, which serves as a stage on which the delivered substrate S is placed. The substrate holding section 20 includes a temperature control unit 70 for controlling the temperature of the placed substrate S to a temperature suitable for drying. The temperature control unit 70 controls the temperature of the substrate S or the solution film F on the substrate S by controlling the temperature of the substrate holding section 20. The temperature control unit 70 may typically include a heater for heating the substrate holding section 20. The temperature control unit 70 may also include a cooler for cooling the substrate holding section 20. The temperature control unit 70 controls the temperature of the substrate holding section 20 by performing at least one of heating and / or cooling on the substrate holding section 20.

[0043] The temperature control unit 70 can control multiple regions of the substrate holding unit 20 to the same temperature or different temperatures from one another so that the substrate S has a uniform temperature distribution. Preferably, the temperature control unit 70 controls the temperature difference between multiple regions of the substrate S held by the substrate holding unit 20 to be within 10°C. More preferably, the temperature control unit 70 controls the temperature difference between multiple regions of the substrate S held by the substrate holding unit 20 to be within 5°C. The temperature control unit 70 controls the temperature of the substrate holding unit 20 so that the temperature of the substrate S is within a predetermined range of 0°C to 100°C. For example, by heating the substrate holding unit 20, the drying rate of the solution film F applied on the substrate S can be increased, and by cooling the substrate holding unit 20, the drying rate of the solution film F can be decreased.

[0044] Inside the container 10, the cover unit SB is positioned so as to face the substrate holding portion 20 in the Z direction. That is, the cover unit SB is positioned to face the main surface MS of the substrate S placed on the substrate holding portion 20. The main material of the cover unit SB is metal, and for example, stainless steel or aluminum is preferably used. As for stainless steel, for example, austenitic stainless steel containing 0.045% or less phosphorus and 0.030% or less sulfur (i.e., stainless steel specified as SUS304 in the Japanese Industrial Standards: JIS) is preferred.

[0045] The cover unit SB is supported by a support mechanism (not shown) that allows it to move up and down in the Z direction within the container 10. The cover unit SB can define a substrate housing space within the container 10 so as to surround the substrate S placed on the substrate holding section 20. When loading the substrate S into the container 10 and placing it on the substrate holding section 20, or when moving the substrate S away from the substrate holding section 20 and removing it from the container 10, the cover unit SB can move in the Z-plus direction to prevent interference with the substrate S or the substrate transport mechanism. When the inside of the container 10 is depressurized to dry the solution film F, the cover unit SB is positioned in a predetermined location in contact with or close to the substrate S in the Z direction.

[0046] In this embodiment, when drying the solution film F by reducing the pressure inside the container 10, the space above the area where the solution film F is placed is covered with a cover unit SB to control the flow of steam, in order to prevent uneven drying of the solution film F depending on its location on the substrate S. The cover unit SB controls the flow of exhausted steam, so it can also be called a flow straightening box or airflow regulator.

[0047] The cover unit SB comprises a top plate 43 and side walls 44, and is positioned to surround the substrate S. The cover unit SB can define the space inside the container 10 into an outer space (space SP0) and an inner space (first space SP1 and second space SP2). The first space SP1 is the space above the outer peripheral region of the substrate S on which the solution film F is formed, and the second space SP2 is the space above the central region of the substrate S on which the solution film F is formed. As will be described later, a movable member 45 that can change its orientation is arranged on the side wall 44.

[0048] The top plate 43, which serves as the roof of the cover unit SB, is positioned parallel to the upper surface of the substrate holding section 20 or to the main surface MS of the substrate S. It can also be said that the top plate 43, which serves as the roof, is positioned where the surface normal to the main surface MS of the substrate S held by the substrate holding section 20 passes through.

[0049] The top plate 43 is provided with multiple openings 42 that connect the inside and outside of the cover unit SB. The openings 42 connect the space SP0 located outside the cover unit SB within the container 10 with the first space SP1 and the second space SP2. When the cover unit SB covers the substrate S for vacuum drying of the solution film F, the first space SP1 and the second space SP2 communicate with space SP0 through the multiple openings 42. Therefore, the solvent gas evaporated from the solution film F moves from the first space SP1 and the second space SP2 to space SP0 and is exhausted to the outside of the container 10 by the vacuum mechanism 30. The arrangement pattern and density of the openings 42 on the top plate 43, as well as the shape of each opening 42, can be set to improve the uniformity of the drying rate of the solution film F at each position on the substrate S.

[0050] The container 10 is equipped with a gas inlet 51 and a gas inlet 52. The gas inlet 51 and gas inlet 52 are examples of pressure adjustment means. The gas inlet 51 can introduce an inert gas into space SP0, and the gas inlet 52 can supply an inert gas, solvent vapor, or a mixture thereof to the first space SP1 and the second space SP2. The pressure in space SP0 can be adjusted by exhausting through the depressurization mechanism 30 and supplying gas from the gas inlet 51. The pressures in the first space SP1 and the second space SP2 can be adjusted by exhausting through the opening 42 and supplying gas from the gas inlet 52. The gas inlet 51 and gas inlet 52 may be flexible tubes, such as fiberglass tubes, or bellows. Valves (not shown) are provided in the gas inlet 51 and gas inlet 52.

[0051] Furthermore, a gas analyzer 60 for analyzing the atmosphere (pressure, gas type) of the space SP0 is connected to the container 10 via a connecting member 62. The gas from space SP0 is introduced into the gas inlet of the gas analyzer 60 via the connecting member 62. The gas analyzer 60 may be, for example, a residual gas analyzer (RGA) such as a mass spectrometer, or a quartz crystal microbarance (QCM) for quantitatively evaluating the amount and rate of adsorption of solvent vapor molecules. The specific gas detected by the gas analyzer 60 may be the vapor (gas) of the solvent evaporating from the solution film F of the substrate S. The connecting member 62 may be a flexible tube, such as a fiberglass tube, or a bellows. The connecting member 62 may have a first end and a second end, the first end being connected to the gas inlet of the gas analyzer 60, and the second end being positioned to protrude into space SP0 in the container 10. Furthermore, a pressure gauge capable of detecting the pressure inside the container 10 from atmospheric pressure to high vacuum can be provided separately from the gas analyzer 60.

[0052] (Circuit board transport mechanism) Next, a transport mechanism for loading substrates S into or out of container 10 will be described. The external pressure of container 10 is, for example, atmospheric pressure, i.e., 1 atmosphere, but when loading / unloading substrates S, the pressure inside container 10 is made the same as the external pressure.

[0053] Figure 3 is a schematic diagram illustrating the operation of the transport mechanism when loading a substrate S into the container 10. Loading and unloading of the substrate S into and out of the container 10 is performed by a transport robot RB located outside the container 10. The transport robot RB loads the substrate S onto the substrate holding section 20 or unloads the substrate S from the substrate holding section 20, for example, in response to a command from the control unit 90. The substrate S can be transported through an opening 13 in the container 10 that is on the transport route. The opening 13 for transporting the substrate can be closed by a gate valve 12 when the substrate S is not being transported. The gate valve 12 is a mechanical shutter and may be part of the container 10 that defines the space SP0.

[0054] The opening 13 is positioned on the movement path of the substrate S being loaded into / unloaded from the container 10. Substrate S coated with the solution film F to be dried is loaded into the container 10 through the opening 13 when the gate valve 12 is open. After the drying process, the substrate S is unloaded from the container 10 through the opening 13 when the gate valve 12 is open.

[0055] When the robot hand RH of the transport robot RB holds the substrate S and loads / unloads it into / out of the container 10, if the cover unit SB is positioned in the location where the drying process is performed (Figure 2), there is a possibility that the robot hand RH and the substrate S may interfere with the cover unit SB. Therefore, when loading / unloading the substrate S, a lifting mechanism (not shown) can be used to raise the cover unit SB in the Z-plus direction, and it can be moved to a height where the robot hand RH and the substrate S do not interfere, as shown in Figure 3.

[0056] Furthermore, at times other than during loading / unloading, the cover unit SB can be lowered to a position where it contacts the substrate S or the substrate holding part 20, and the cover unit SB can be positioned at a height that defines the first space SP1 and the second space SP2.

[0057] The substrate holder 20 is equipped with a lifting pin PI configured to extend and retract relative to the holding surface of the substrate holder 20. By making the lifting pin PI protrude relative to the holding surface, the robot hand RH can place the substrate S on the lifting pin PI. By lowering the lifting pin PI, on which the substrate S is placed, from above the upper surface of the substrate holder 20, the substrate S placed on the lifting pin PI can be placed onto the substrate holder 20.

[0058] (Pressure control mechanism) When the substrate S is subjected to vacuum drying, the control unit 90 drives the vacuum mechanism 30 to reduce the pressure inside the container 10. When the vacuum mechanism 30 starts to evacuate, the pressure in the space SP0 inside the container 10 decreases. Then, the inside of the cover unit SB is also evacuated through the opening 42, and the pressure decreases. Solvent vapor evaporated from the solution film F of the substrate S moves from the first space SB1 and the second space SP2 to space SP0 through the opening 42 and is evacuated by the vacuum mechanism 30.

[0059] In this embodiment, in order to control the pressure in space SP0, the control unit 90 can not only control the drive of the pressure reduction mechanism 30 but also supply gas to space SP0 from the gas introduction unit 51. Furthermore, in order to control the pressure in the first space SB1 and the second space SP2, the control unit 90 can not only control the drive of the pressure reduction mechanism 30 but also supply gas to the first space SB1 and the second space SP2 from the gas introduction unit 52.

[0060] The gas supplied from the gas inlet 51 to the space SP0 is preferably an inert gas, solvent vapor, or a mixture thereof, but clean dry air may also be used. As the inert gas, at least one gas selected from, for example, nitrogen, helium, neon, krypton, argon, and xenon is preferred.

[0061] Furthermore, as the solvent vapor supplied from the gas introduction section 52 to the first space SP1 and the second space SP2, a solvent vapor is preferably used in which the saturated vapor pressure of the solvent is equal to or greater than the saturated vapor pressure of the solution film F coated on the substrate S. For example, one or more materials selected from the following group of solvents can be used, including cyclohexanol, cyclohexanone, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripylene glycol, 1,3-butanediol, 2,3-butanediol, 1,4-butanediol, propylene glycol, hexylene glycol, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, n-hexyl acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, and the like.

[0062] For example, if the solvent of the solution film F coated on the substrate S is cyclohexanone (saturated vapor pressure 0.45 kPa (20°C)), the solvent vapor supplied to the first space SP1 and the second space SP2 may be selected from a solvent species with a saturated vapor pressure higher than that of cyclohexanone. For example, vapor of cyclohexanone (saturated vapor pressure 0.45 kPa (20°C)), which is the same type as the solvent of the solution film F, or vapor of propylene glycol monomethyl ether acetate (saturated vapor pressure 0.46 kPa (20°C)) are preferably selected.

[0063] Furthermore, if, for example, the solution film F applied to the substrate S contains multiple types of solvents with different saturated vapor pressures, it is preferable to configure the system to supply the vapors of these multiple types of solvents with different saturated vapor pressures to the first space SP1 and the second space SP2.

[0064] (Natural drying of circuit boards during transport) In this embodiment, the control unit 90 can change the orientation of the movable member 45 located on the side wall 44 in order to adjust the flow of solvent vapor in the first space SB1. As a prerequisite for explaining the specific configuration, operation, and effects of the movable member 45, we will first explain the natural drying that occurs when a substrate coated with liquid is transported by a transport device to a vacuum drying device.

[0065] As mentioned above, for example, when manufacturing organic light-emitting diodes (OLEDs), bank-shaped partition members are formed on the substrate to define the coating shape, and liquid is applied to each of the regions enclosed by the banks.

[0066] Figure 4 schematically shows a substrate S in which a grid-like bank for separating each pixel of an organic EL element is provided on the main surface MS, and a solution film F is formed by applying liquid to each region enclosed by the bank. Figure 5 schematically shows a substrate S in which a line-shaped bank extending along the X direction is provided on the main surface MS, and a solution film F is formed by applying liquid to each line-shaped groove region enclosed by the bank and extending in the X direction.

[0067] When transporting the substrate to the vacuum drying apparatus DU, the substrate moves through an atmospheric pressure environment. However, the outer edges of the substrate, which are susceptible to the effects of the airflow during transport, dry more quickly than the central part of the substrate. In other words, as explained with reference to upper A and lower C in Figure 1, the rate of natural drying during transport differs depending on the location on the substrate.

[0068] In the case of the substrate illustrated in Figure 4, the solution film F of each pixel is independent. In this case, pixels in the frame-shaped region DA between the two dotted lines, that is, pixels located near the four edges (edges L1 to L4) that constitute the outer edge of the main surface MS when the substrate S is viewed from above, will dry more easily than pixels in the central region of the substrate.

[0069] In the case of the substrate illustrated in Figure 5, natural drying proceeds easily in the region DA enclosed by the dotted line, that is, near the edges L1 and L2 that are parallel to the linear bank and constitute the outer edge of the main surface MS when the substrate S is viewed from above. Since the solution can move in the X direction within the grooves enclosed by the linear bank, even if evaporation of the solvent progresses near both ends of the linear bank (near edges L3 and L4) in the central region of the substrate when viewed in the Y direction, the liquid level does not drop much as the solution moves within the grooves. On the other hand, in the vicinity of edges L1 and L2, natural drying proceeds throughout the entire linear groove region.

[0070] (Movable member) In the vacuum drying apparatus DU according to this embodiment, a movable member 45 is attached to the side wall 44 of the cover unit SB, whose orientation can be changed by control of the control unit 90. In the case of the vacuum drying apparatus DU handling a substrate as illustrated in Figure 4, it is preferable to install the movable member 45 along each of the four sides (sides L1 to L4) of the substrate S, as schematically shown in Figure 6. In other words, it is preferable to install the movable member 45 along each of the intersecting sides of the substrate S. The movable member 45 is supported on the side wall 44 (not shown in Figure 6) so as to be rotatable about a rotation axis 82. Furthermore, in the case of the vacuum drying apparatus DU handling a substrate as illustrated in Figure 5, it is preferable to install the movable member 45 along at least each of sides L1 and L2 of the substrate S.

[0071] Figures 7 and 8 are schematic partial cross-sectional views illustrating the possible positions of the movable member 45. The movable member 45 is positioned in the space above the outer peripheral region of the substrate S and is supported by the side wall 44 so as to be rotatable about a rotation axis 82.

[0072] Figure 7 shows the first position of the movable member 45 to facilitate the accumulation of solvent vapor evaporated from the solution film F near the outer edge of the substrate S (i.e., region DA in Figures 4 and 5) in the first space SP1. Figure 8 shows the second position of the movable member 45 to facilitate the movement of solvent vapor evaporated from the solution film F near the outer edge of the substrate S (i.e., region DA in Figures 4 and 5) from the first space SP1 to the second space SP2 (or opening 42). The control unit 90 controls the position of the movable member 45 according to the pressure inside the container 10, as will be described later.

[0073] As can be seen from Figures 7 and 8, the movable member 45 is supported by the side wall 44 so that its projected area can be changed when projected onto the main surface of the substrate S from the Z direction. The movable member 45 is also supported by the side wall 44 so that its angle with respect to the main surface of the substrate S can be changed. Furthermore, the movable member 45 is supported by the side wall 44 so that it can rotate around the rotation axis 82.

[0074] As shown in Figure 7, in the first orientation, where the projection area is large when projected onto the main surface of the substrate S, solvent vapor present in space SP1 has difficulty moving to the second space SP2. Therefore, even if the inside of the container 10 is under reduced pressure, drying will not progress easily in the solution film F near the outer edge of the substrate S. On the other hand, as shown in Figure 8, in the second orientation, where the projection area is small when projected onto the main surface of the substrate S, solvent vapor present in space SP1 has easy movement to the second space SP2. Therefore, the solution film F near the outer edge of the substrate S dries out, as evaporated solvent vapor is exhausted from the opening 42, similar to the solution film F in the center.

[0075] Referring to Figure 9, a specific example of the first position of the movable member 45 is given: the distance Z2 between the movable member 45 and the solution film F is within 50% of the distance Z1 between the top plate 43 of the cover unit SB and the solution film F. It is desirable to bring the movable member 45 close to the solution film F without its tip making contact. When projected onto the main surface of the substrate S, it is desirable that the width Y1 over which the movable member 45 overlaps with the area where the solution film F is formed is at least 2 mm. With this configuration, solvent vapor can be retained in the first space SP1, and the vapor pressure can be locally increased at the periphery of the panel. Therefore, even if the pressure inside the container 10 is reduced during period D1 (Figure 14) described later, the drying of the solution film F near the outer edge of the substrate S can be suppressed. As a result, the amount (thickness) of the solution film F at the stage of transitioning to period D2 (Figure 14) described later can be made uniform across the entire panel.

[0076] Referring to Figure 10, a specific configuration of the drive mechanism for the movable member 45 is illustrated. Figure 10 is a schematic partial cross-sectional view obtained by cutting along line AA in Figure 9 at the portion where the movable member 45 is supported by the side wall 44. The drive mechanism for changing the posture of the movable member 45 may include, for example, an actuator AC such as a motor and a sliding member 80 such as a bearing. To prevent contamination of the substrate S by particles generated from the sliding member 80, it is desirable to seal the space between the sliding member 80 and the solution film F. In this embodiment, a magnetic fluid seal 81 is placed between the sliding member 80 and the solution film F. The magnetic fluid seal 81 is a component that applies magnetic fluid around a rotating shaft 82 to which a magnetic field is applied, and seals the gap around the rotating shaft 82 by retaining the magnetic fluid. By sealing the sliding member 80 with a magnetic fluid seal, the scattering of particles (contaminants) into the solution film F can be prevented.

[0077] (Drying method) This document describes a drying process (substrate processing method) for drying substrates using a vacuum drying apparatus DU. The drying process is performed, for example, in the manufacturing process of organic EL panels, following processes such as the application of a solution to the substrate and the transport of the substrate. Figure 11 is a flowchart illustrating the procedure for the drying process. For example, when a substrate on which a solution film has been formed by applying a solution using an inkjet device is transported from the inkjet device to the vicinity of the vacuum drying apparatus DU, the drying process begins.

[0078] First, in step S1, the vacuum drying apparatus DU prepares to load the substrate into the apparatus. For example, as shown in Figure 12(a), the control unit 90 retracts the cover unit SB upward (in the Z-positive direction) within the container 10 and moves the gate valve 12 to the open position. The control unit 90 also controls the temperature control unit 70 to adjust the temperature of the substrate holding unit 20 to a temperature suitable for starting the drying process.

[0079] Next, in step S2, as shown in Figure 12(b), the control unit 90 operates the transport robot RB to set the substrate S in a predetermined position on the substrate holder 20. To receive the substrate S, the lifting pin PI (Figure 3) waits in a position where it protrudes above the upper surface of the substrate holder 20. The control unit 90 moves the robot hand RH, which is holding the substrate S, in the Y-minus direction, and moves it into the container 10. After the substrate S arrives directly above the substrate holder 20, the control unit 90 lowers the robot hand RH in the Z-minus direction, placing the substrate S on the lifting pin PI. After lowering the robot hand RH further in the Z-minus direction, the robot hand RH is moved in the Y-plus direction to retract it from inside the container 10. After that, the control unit 90 lowers the lifting pin PI, placing the substrate S on the substrate holder 20. This completes the setting of the substrate S on the substrate holder 20.

[0080] Next, in step S3, as shown in Figure 12(c), the control unit 90 lowers the cover unit SB in the Z-minus direction. The control unit 90 also moves the gate valve 12 to the closed position, sealing the internal space of the container 10.

[0081] Next, in step S4, the control unit 90 executes a reduced-pressure drying process. The control unit 90 monitors the measured values ​​from the gas analyzer 60 and controls the pressure reduction mechanism 30 to reduce the pressure inside the container 10. The control unit 90 controls the pressure inside the container 10 according to, for example, the profile shown in Figure 14. In the graph of Figure 14, the horizontal axis represents the passage of time, and the vertical axis represents the pressure inside the container 10. In this example, the drying process is explained by dividing it into four processes from period D1 to period D4, but in actual drying processes, the process may be divided into even more detailed steps for control.

[0082] Figure 14 shows a graph illustrating the temporal change in pressure in the space SP0 inside the container 10 when the solution film F contains only one type of solvent. The pressure can be measured using a gas analyzer 60 or another pressure gauge. When the decompression mechanism 30 starts evacuating the container 10 at time T1, the pressure inside the container 10 decreases from atmospheric pressure over time. Period D1 corresponds to the process of reducing the pressure in the space SP0 from atmospheric pressure to a predetermined pressure (first pressure P1).

[0083] At time T2, when the pressure inside the container 10 drops to a first pressure P1 that is slightly higher than the saturated vapor pressure of the solvent contained in the solution film F, the control unit 90 changes the position of the movable member 45 from the first position shown in Figure 7 to the second position shown in Figure 8. During period D1, which is the initial stage of the vacuum drying process, the movable member 45 is in the first position, so as shown in lower C of Figure 1, the solvent vapor in the space above the solution film near the outer edge of the substrate (first space SP1) is trapped, and evaporation from the solution film in region DA (Figures 4 and 5) is suppressed. On the other hand, as shown in upper A of Figure 1, the height of the solution film in the central part of the substrate decreases as the solvent evaporates due to vacuum drying during period D1, and its height becomes almost equal to that of the solution film near the outer edge.

[0084] At time T2, after the pressure inside the container 10 has decreased to a first pressure P1 that is slightly higher than the saturated vapor pressure of the solvent contained in the solution film F, the control unit 90 controls the pressure so that the pressure inside the container 10 is maintained at pressure P1 only for the duration of period D2. This is because if the rate at which the solvent evaporates from the solution film F is too fast in the initial stage of the drying process, the shape and quality of the solid film formed after drying will deteriorate. Therefore, the evaporation rate is limited by maintaining the space SP0 at a pressure slightly higher than the saturated vapor pressure for a predetermined period D2. In other words, period D2 is the process of maintaining the pressure in space SP0 at a predetermined pressure P1, and the control unit 90 controls the depressurization mechanism 30 and the gas introduction unit 51 to maintain pressure P1. During period D2, as shown in upper A and lower C of Figure 1, the height of the solution film decreases almost uniformly across the entire substrate surface.

[0085] After period D2 has elapsed, when the height of the solution film approaches or equals, for example, the edge level of the bank, the vacuum level inside the container is increased to speed up the drying process in order to prevent the solute from adhering to the bank wall due to the slow drying rate. That is, in period D3, the control unit 90 controls the pressure reduction mechanism 30 to control the pressure inside the container 10 so that the second pressure P2 is less than the vapor pressure of the solvent. Period D3 is the process of reducing the pressure in the space SP0 from the first pressure P1 to a predetermined second pressure P2. During this time, the supply of gas from the gas introduction unit 51 to the space SP0 can be stopped.

[0086] After reaching the second pressure P2, the pressure inside the container 10 is maintained at the second pressure P2 for a predetermined period D4, causing the solvent to evaporate from the solution film and forming a solid film. Period D4 is the process of maintaining the pressure in the space SP0 at the second pressure P2. During period D4, the control unit 90 controls the depressurization mechanism 30 and the gas introduction unit 51 to maintain the pressure inside the container 10 at the second pressure P2. At the end of period D4, as shown in upper A and lower C of Figure 1, a solid film with a uniform cross-sectional shape is formed on the entire substrate and on the bottom surface of the bank recess.

[0087] Returning to Figure 11, we determine whether the vacuum drying process is complete in step S5. For example, a timer may be used to determine if a predetermined period D4 has been completed, or the solvent may be determined from the measurements of the gas analyzer 60 to determine if it is sufficiently dried.

[0088] If it is determined that the vacuum drying process is not complete (Step S5: NO), the vacuum drying process in Step S4 is continued. If the solution film F contains two or more solvents, vacuum drying is performed near the saturated vapor pressure of each solvent, starting with those with the highest saturated vapor pressures. In this case, Step S5 determines whether drying is complete for the solvent with the lowest saturated vapor pressure.

[0089] If it is determined that the vacuum drying process is complete (Step S5: YES), the process proceeds to Step S6, where the control unit 90 prepares to remove the substrate S, which has undergone vacuum drying, from the vacuum drying apparatus DU. The control unit 90 closes the valve connecting the vacuum mechanism 30 and the container 10, and introduces gas from the gas introduction section 51 to return the inside of the container 10 to atmospheric pressure. Then, as shown in Figure 13(a), the cover unit SB is raised in the Z-plus direction, and the gate valve 12 is moved to the open position.

[0090] Next, in step S7, as shown in Figure 13(b), the control unit 90 operates the transport robot RB to receive the substrate S from the substrate holding unit 20 and transports the substrate S to the outside of the vacuum drying apparatus DU.

[0091] With the above steps, the vacuum drying process for one substrate is complete. However, in preparation for the next vacuum drying process, it is desirable to put the vacuum drying apparatus DU into standby mode, as shown in Figure 13(c). Specifically, the gate valve 12 is closed, the cover unit SB is raised, and the movable member 45 is set to the first position. Then, it is desirable to use the vacuum mechanism 30 to reduce the pressure inside the container 10, exhaust the solvent molecules adhering to the inner wall of the container 10 and the surfaces of the cover unit SB and movable member 45, and clean the surfaces inside the container 10.

[0092] As described above, according to this embodiment, in the initial stage of vacuum drying, the evaporation of the solvent from the solution film in the central region of the substrate is suppressed from the region near the outer edge of the substrate where natural drying has progressed during transport, while the solvent is evaporated from the solution film in the central region of the substrate. When the height of the solution film in the region near the outer edge of the substrate and the solution film in the central region of the substrate are the same, the pressure is reduced and the drying rate by vacuum drying is increased, so that a solid film with a uniform shape can be formed on the bottom surface of the bank over the entire surface of the substrate.

[0093] [Embodiment 2] A modified example of Embodiment 1 will now be described. Matters common to Embodiment 1 will be simplified or omitted from the explanation.

[0094] Figure 15 is a schematic perspective view showing the surrounding structure of the movable member 45 of the vacuum drying apparatus according to Embodiment 2. In this embodiment, partition plates 47 are arranged in space SP1 to enhance the containment effect of solvent vapor when the movable member 45 is in the first position. The partition plates 47 are positioned at both ends of region DA (Figure 5) when viewed in the X direction, and suppress the movement of solvent vapor in the X direction.

[0095] According to this embodiment, by providing the partition plate 47, when the movable member 45 takes the first position, the evaporation of the solvent from the solution film F near the outer edge of the substrate is effectively suppressed.

[0096] [Embodiment 3] A modified example of Embodiment 1 will now be described. Matters common to Embodiment 1 or Embodiment 2 will be simplified or omitted from the explanation.

[0097] In Embodiment 1, the movable member 45 was a plate-shaped member with a flat main surface. However, it does not need to be a flat plate as long as it has a shape that can contain the solvent vapor in the first space SP1 in the first position and appropriately secure an exhaust path for the solvent vapor from the solution film in the outer peripheral region of the substrate in the second position. For example, the movable member 45 can be shaped so that, in the first position, the height in the Z direction of the first space SP1 that contains the solvent vapor is secured, the tip of the movable member 45 is close to the substrate S, and the solvent vapor is easily guided to the opening 42 of the top plate 43 in the second position.

[0098] Figure 16(a) shows an example, in which the movable member 45 is a plate-shaped member with a bent main surface, that is, a member with a shape formed by connecting multiple flat plates. Note that the bent shape is not limited to the example shown, and may be bent at multiple points, for example. Figure 16(b) shows another example, in which the movable member 45 is a plate-shaped member with a curved main surface. Note that the curved shape is not limited to the example shown.

[0099] According to this embodiment, when the movable member 45 takes the first position, its tip can be brought close to the substrate surface, thus enhancing the containment effect of the solvent vapor in the first space SP1. When it takes the second position, the solvent vapor can be easily guided from the first space SP1 to the opening 42 of the top plate 43.

[0100] [Embodiment 4] A modified example of Embodiment 1 will now be described. Matters common to the above-described embodiment will be simplified or omitted from the explanation.

[0101] As shown in Figure 17, in this embodiment, the movable member 45 is equipped with a temperature control mechanism to effectively suppress the evaporation of the solvent from the solution film F in region DA (Figures 4 and 5) when the movable member 45 is in the first position. If the temperature of the atmosphere in the first space SP1 can be lowered when the movable member 45 is in the first position, the saturated vapor pressure of the solvent in the first space SP1 can be lowered, and the evaporation of the solvent from the nearby solution film F can be suppressed.

[0102] In other words, the movable member 45 incorporates a temperature control unit 49. The temperature control unit 49 controls the ambient temperature of the first space SP1 by changing the temperature of the movable member 45. The ambient temperature of the first space SP1 may be adjusted by cooperating the temperature control unit 49 with the local temperature control of the substrate holding unit 20. The temperature control unit 49 may include a cooler that cools the surface of the movable member 45. The temperature control unit 49 can be operated by the temperature control unit 48 or by direct control by the control unit 90.

[0103] The temperature control unit 49 controls multiple regions to the same temperature or different temperatures from one another so that the movable member 45 has a uniform temperature distribution. Preferably, the temperature control unit 49 controls the temperature distribution on the surface of the movable member 45 to be within 10°C. More preferably, it controls the temperature difference to be within 5°C. The temperature control unit 49 can cool the surface temperature of the movable member 45 to a predetermined temperature within the range of 5°C to the temperature of the substrate S.

[0104] According to this embodiment, when the movable member 45 assumes the first position, the temperature of the atmosphere in the first space SP1 can be lowered, and the vapor pressure of the solvent can be reduced, thereby effectively suppressing the evaporation of the solvent from the solution film F in region DA (Figures 4 and 5).

[0105] [Embodiment 5] A modified example of Embodiment 1 will now be described. Matters common to the above-described embodiment will be simplified or omitted from the explanation.

[0106] The movable member 45 has the function of retaining solvent vapor in the first space SP1 by assuming a first position. However, when processing substrates continuously in a mass production line, it may not be possible to secure a sufficient waiting time as shown in Figure 13(c). In that case, the amount of solvent molecules evaporated from the solution film that adhere to the movable member 45 increases. If a large amount of solvent molecules adhere to the surface of the movable member 45, the vapor pressure in the first space SP1 when it is in the first position becomes unstable, and it may become difficult to effectively suppress the evaporation of solvent from the solution film F in region DA (Figures 4 and 5).

[0107] Therefore, in this embodiment, in order to prevent the solvent evaporated from the solution film F from adhering to the surface of the movable member 45, the surface of the movable member 45 is coated with a liquid-repellent material 46, as shown in Figure 18. Preferably, by using a material for the liquid-repellent material 46 that has a receding contact angle of 90 degrees or more with respect to pure water, solvent adhesion can be suppressed. The liquid-repellent material 46 can be formed as a film containing at least one selected from the group consisting of fluorine-containing resins such as tetrafluoroethylene resin (PTFE), perfluoroalkoxy resin (PFA), fluoroethylene propylene resin (FEP), ethylene tetrafluoroethylene resin, and polychlorotrifluoroethylene resin. Alternatively, a fluorine-containing silane coupling agent may be used as the liquid-repellent material 46. The surfaces of other members defining the first space SP1 can also be coated with the liquid-repellent material 46.

[0108] As shown in Figure 18, when the movable member 45 is a flat plate, it is desirable to set the first position such that the inclination angle θ of the main surface of the movable member 45 with respect to the main surface (horizontal plane) of the substrate S is 0 degrees or more and 30 degrees or less. If the inclination angle θ is less than 0°, solvent vapor is likely to leak from the first space SP1, and if it is greater than 30°, the volume of the first space SP1 increases, diluting the solvent vapor and reducing its effectiveness. This angle setting can be applied regardless of whether the flat plate-shaped movable member 45 is covered with a liquid-repellent material 46 or whether the movable member 45 has a built-in temperature control mechanism.

[0109] [Other embodiments] It should be noted that the present invention is not limited to the embodiments described above, and many modifications are possible within the technical concept of the present invention. For example, all or part of the different embodiments described above may be combined and implemented.

[0110] For example, in the embodiment described above, the control unit 90 controlled the posture of the movable member 45 according to the pressure inside the container 10, but the system is not limited to this configuration. Alternatively, a program could be created that acquires a profile of the pressure change inside the container 10 in advance and sets a time corresponding to the timing of the change, or a timer could be set to start control at that time.

[0111] A method for manufacturing an article using the vacuum drying apparatus or vacuum drying method described above is also included in the embodiments of the present invention. The method for manufacturing an article according to this embodiment may include a step (coating step) of obtaining a coated substrate by arranging or coating a solution film (a solution containing a solute that is a functional material and a solvent) on a substrate by printing using an inkjet coating apparatus or the like. Furthermore, the method for manufacturing an article according to this embodiment of of this embodiment of of of drying the solution film on the coated substrate with the vacuum drying apparatus described above to obtain a dried substrate on which a dried film has been formed (drying step). Moreover, such a manufacturing method may further include other well-known steps (such as firing, cooling, dehumidification, dry cleaning, electrode formation, and sealing film formation). The method for manufacturing an article according to this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0112] The method for manufacturing an article according to this embodiment can be suitably implemented, for example, when manufacturing an article such as an organic light-emitting diode (OLED) panel using an inkjet coating apparatus and a vacuum drying apparatus. The vacuum drying apparatus is used in part of the process for manufacturing an organic EL panel equipped with an OLED, which is an organic EL element. That is, the vacuum drying apparatus can form a thin film constituting an organic EL element on the substrate S by performing a drying process to dry a solution film F coated on the substrate S.

[0113] The solution film F is composed of a solution containing, for example, a solute and a solvent for forming an organic film. The solvent contained in the solution film F preferably has properties that promote evaporation in a reduced-pressure environment below atmospheric pressure. The evaporation of the solvent is preferably promoted at temperatures higher than room temperature (25°C).

[0114] The solvent is preferably an organic solvent. The solvent contains at least one organic solvent. Examples of organic solvents include N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, diethylene glycol monomethyl ether, cyclohexanone, N,N-dimethylisobutylamide, N-methylformamide, N-methylacetamide, N-diethylformamide, cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 1,3-butanediol, and 1,4-butanediol. Examples include propylene glycol, hexylene glycol, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, N-hexyl acetate, and ethyl cellosolve acetate.

[0115] The organic film is an organic layer, and may be, for example, a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an OLED. The method for manufacturing an organic EL element includes the step of forming at least one of the organic films of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer on a substrate S. The solution film F is applied to the required locations on the substrate S by a coating device, such as an inkjet device, before the substrate S is brought into the vacuum drying device. By forming a uniform organic film over the entire surface of the substrate using the vacuum drying device according to the embodiment, an organic EL (OLED) panel with extremely high image quality can be manufactured.

[0116] The present invention can also be realized by supplying a program that implements one or more of the functions of the embodiments to a system or device via a network or storage medium, and by having one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that implements one or more functions.

[0117] This specification discloses at least the following: [Matter 1] Container and A depressurization mechanism for reducing the pressure inside the container, The container includes a substrate holding section that holds a substrate having a film, A cover unit is disposed inside the container and is capable of defining a substrate housing space surrounding the substrate held by the substrate holding portion. It comprises a control unit and, The cover unit comprises a roof, a side wall connected to the roof, and a movable member supported by the side wall so as to be able to change its orientation within the substrate housing space. The control unit controls the posture of the movable member. A substrate processing apparatus characterized by the following: [Matter 2] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the projected area when projected onto the main surface of the substrate is changed. A substrate processing apparatus as described in item 1, characterized by the features described above. [Matter 3] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the distance between the tip of the movable member and the substrate is changed. A substrate processing apparatus according to item 1 or 2, characterized by the above. [Matter 4] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the angle of the main surface of the movable member with respect to the main surface of the substrate is changed. A substrate processing apparatus according to any one of items 1 to 3, characterized by the features described herein. [Matter 5] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and is rotatably supported by the side wall. A substrate processing apparatus according to any one of items 1 to 4, characterized by the features described herein. [Matter 6] The control unit reduces the internal pressure of the container from a first pressure to a second pressure, and controls the posture of the movable member such that the projected area when the movable member is projected onto the main surface of the substrate is smaller at the second pressure than at the first pressure. A substrate processing apparatus according to any one of items 1 to 5, characterized by the features described herein. [Matter 7] The control unit reduces the pressure inside the container from a first pressure to a second pressure, and controls the posture of the movable member such that the distance between the tip of the movable member and the substrate is greater at the second pressure than at the first pressure. A substrate processing apparatus according to any one of items 1 to 6, characterized by the features described herein. [Matter 8] The control unit changes the position of the movable member when the pressure inside the container is greater than the vapor pressure of the solvent contained in the membrane. A substrate processing apparatus according to any one of items 1 to 7, characterized by the features described herein. [Matter 9] The movable member is a plate-shaped member with a flat main surface. A substrate processing apparatus according to any one of items 1 to 8, characterized by the above. [Matter 10] The movable member is a plate-shaped member with a bent main surface. A substrate processing apparatus according to any one of items 1 to 8, characterized by the above. [Matter 11] The movable member is a plate-shaped member whose main surface is curved. A substrate processing apparatus according to any one of items 1 to 8, characterized by the above. [Matter 12] When the substrate holding portion is viewed from above, the side walls are arranged along the four sides of the substrate held by the substrate holding portion. The movable member includes at least a first movable member and a second movable member, The first movable member is supported by the side wall positioned along the first edge of the substrate, The second movable member is supported by the side wall, which is positioned along the second side facing the first side, with the region where the membrane is formed in between. A substrate processing apparatus according to any one of items 1 to 11, characterized by the features described herein. [Matter 13] When the substrate holding portion is viewed from above, the side walls are arranged along the four sides of the substrate held by the substrate holding portion. The movable member includes at least a first movable member and a second movable member, The first movable member is supported by the side wall positioned along the first edge of the substrate, The second movable member is supported by the side wall which is positioned along the second side intersecting the first side. A substrate processing apparatus according to any one of items 1 to 11, characterized by the features described herein. [Matter 14] The system includes a temperature control unit for adjusting the temperature of the movable member. A substrate processing apparatus according to any one of items 1 to 13, characterized by the features described herein. [Matter 15] The movable member has a liquid-repellent material on its surface. A substrate processing apparatus according to any one of items 1 to 14, characterized by the features described herein. [Matter 16] The mechanism for controlling the posture of the movable member includes a magnetic fluid seal. A substrate processing apparatus according to any one of items 1 to 15, characterized by the features described herein. [Matter 17] The roof has an opening that allows communication between the inside and outside of the substrate housing space. A substrate processing apparatus according to any one of items 1 to 16, characterized by the features described herein. [Matter 18] A method for processing a substrate using a substrate processing apparatus having a control unit, A substrate having a film is placed on a substrate holder located inside the container. The substrate placed on the substrate holding portion is surrounded by a cover unit having a roof and side walls, thereby defining a substrate housing space inside the container. The inside of the container is depressurized using a depressurization mechanism. The control unit controls the posture of the movable member supported on the side wall of the cover unit. A substrate processing method characterized by the following: [Matter 19] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the projected area when projected onto the main surface of the substrate is changed. The substrate processing method according to item 18, characterized by the features described above. [Matter 20] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the distance between the tip of the movable member and the substrate is changed. A substrate processing method according to item 18 or 19, characterized by the above. [Matter 21] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the angle of the main surface of the movable member with respect to the main surface of the substrate is changed. A substrate processing method according to any one of items 18 to 20, characterized by the following: [Matter 22] The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and is rotatably supported by the side wall. A substrate processing method according to any one of items 18 to 21, characterized by the features described herein. [Matter 23] The control unit reduces the internal pressure of the container from a first pressure to a second pressure, and controls the posture of the movable member such that the projected area when the movable member is projected onto the main surface of the substrate is smaller at the second pressure than at the first pressure. A substrate processing method according to any one of items 18 to 22, characterized by the following: [Matter 24] The control unit reduces the pressure inside the container from a first pressure to a second pressure, and controls the posture of the movable member such that the distance between the tip of the movable member and the substrate is greater at the second pressure than at the first pressure. A substrate processing method according to any one of items 18 to 23, characterized by the features described herein. [Matter 25] The control unit changes the position of the movable member when the pressure inside the container is greater than the vapor pressure of the solvent contained in the membrane. A substrate processing method according to any one of items 18 to 24, characterized by the following: [Matter 26] A program that causes the control unit of the substrate processing apparatus to execute the substrate processing method described in any one of items 18 to 25. [Matter 27] A computer-readable recording medium containing the program described in item 26. [Matter 28] A step of forming a solvent-containing film on a substrate, The substrate processing method described in any one of items 18 to 24 is performed. A method for manufacturing an article, characterized by the following: [Matter 29] The process includes a step of drying the film applied to the substrate using a substrate processing apparatus described in any one of items 1 to 17. A method for manufacturing an article, characterized by the following: [Matter 30] The aforementioned film is a liquid film containing a functional material. A method for manufacturing an article as described in item 28 or 29, characterized by the features described herein. [Matter 31] The aforementioned film is a liquid film for forming one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. A method for manufacturing an article as described in any one of items 28 to 30, characterized by the following: [Explanation of Symbols]

[0118] 10...Container / 12...Gate valve / 13...Opening / 20...Substrate holder / 30...Depressurization mechanism / 42...Opening / 43...Top plate / 44...Side wall / 45...Movable member / 46...Liquid repellent material / 47...Partition plate / 48...Temperature control unit / 49...Temperature adjustment unit / 51...Gas introduction unit / 52...Gas introduction unit / 60...Gas analyzer / 62...Connecting member / 70...Temperature Degree control unit / 80...Sliding member / 81...Magnetic fluid seal / 82...Rotating shaft / 90...Control unit / AC...Actuator / DU...Vacuum drying device / F...Solution film / L1-L4...Edge / MS...Main surface / PI...Lifting pin / RB...Transport robot / RH...Robot hand / S...Substrate / SB...Cover unit / SP1...First space / SP2...Second space

Claims

1. Container and A depressurization mechanism for reducing the pressure inside the container, The container includes a substrate holding section that holds a substrate having a film, A cover unit is disposed inside the container and is capable of defining a substrate housing space surrounding the substrate held by the substrate holding portion. It comprises a control unit and, The cover unit comprises a roof, a side wall connected to the roof, and a movable member supported by the side wall so as to be able to change its orientation within the substrate housing space. The control unit controls the posture of the movable member. A substrate processing apparatus characterized by the following:

2. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the projected area when projected onto the main surface of the substrate is changed. The substrate processing apparatus according to claim 1.

3. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the distance between the tip of the movable member and the substrate is changed. The substrate processing apparatus according to claim 1.

4. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the angle of the main surface of the movable member with respect to the main surface of the substrate is changed. The substrate processing apparatus according to claim 1.

5. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and is rotatably supported by the side wall. The substrate processing apparatus according to claim 1.

6. The control unit reduces the internal pressure of the container from a first pressure to a second pressure, and controls the posture of the movable member such that the projected area when the movable member is projected onto the main surface of the substrate is smaller at the second pressure than at the first pressure. A substrate processing apparatus according to any one of claims 1 to 5.

7. The control unit reduces the pressure inside the container from a first pressure to a second pressure, and controls the posture of the movable member such that the distance between the tip of the movable member and the substrate is greater at the second pressure than at the first pressure. A substrate processing apparatus according to any one of claims 1 to 5.

8. The control unit changes the position of the movable member when the pressure inside the container is greater than the vapor pressure of the solvent contained in the membrane. A substrate processing apparatus according to any one of claims 1 to 5.

9. The movable member is a plate-shaped member with a flat main surface. A substrate processing apparatus according to any one of claims 1 to 5.

10. The movable member is a plate-shaped member with a bent main surface. A substrate processing apparatus according to any one of claims 1 to 5.

11. The movable member is a plate-shaped member whose main surface is curved. A substrate processing apparatus according to any one of claims 1 to 5.

12. When the substrate holding portion is viewed from above, the side walls are arranged along the four sides of the substrate held by the substrate holding portion. The movable member includes at least a first movable member and a second movable member, The first movable member is supported by the side wall arranged along the first edge of the substrate, The second movable member is supported by the side wall which is positioned along the second side that is opposite to the first side, with the region where the membrane is formed in between. A substrate processing apparatus according to any one of claims 1 to 5.

13. When the substrate holding portion is viewed from above, the side walls are arranged along the four sides of the substrate held by the substrate holding portion. The movable member includes at least a first movable member and a second movable member, The first movable member is supported by the side wall arranged along the first edge of the substrate, The second movable member is supported by the side wall which is positioned along the second side intersecting the first side. A substrate processing apparatus according to any one of claims 1 to 5.

14. The system includes a temperature control unit for adjusting the temperature of the movable member. A substrate processing apparatus according to any one of claims 1 to 5.

15. The movable member has a liquid-repellent material on its surface. A substrate processing apparatus according to any one of claims 1 to 5.

16. The mechanism for controlling the posture of the movable member includes a magnetic fluid seal. A substrate processing apparatus according to any one of claims 1 to 5.

17. The roof has an opening that allows communication between the inside and outside of the substrate housing space. A substrate processing apparatus according to any one of claims 1 to 5.

18. A method for processing a substrate using a substrate processing apparatus having a control unit, A substrate having a film is placed on a substrate holder located inside the container. The substrate placed on the substrate holding portion is surrounded by a cover unit having a roof and side walls, thereby defining a substrate housing space inside the container. The inside of the container is depressurized using a depressurization mechanism. The control unit controls the posture of the movable member supported on the side wall of the cover unit. A substrate processing method characterized by the following:

19. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the projected area when projected onto the main surface of the substrate is changed. The substrate processing method according to feature 18.

20. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the distance between the tip of the movable member and the substrate is changed. The substrate processing method according to feature 18.

21. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and its orientation is controlled so that the angle of the main surface of the movable member with respect to the main surface of the substrate is changed. The substrate processing method according to feature 18.

22. The movable member is positioned in the space above the outer peripheral region of the substrate held by the substrate holding portion, and is rotatably supported by the side wall. The substrate processing method according to feature 18.

23. The control unit reduces the internal pressure of the container from a first pressure to a second pressure, and controls the posture of the movable member such that the projected area when the movable member is projected onto the main surface of the substrate is smaller at the second pressure than at the first pressure. The substrate processing method according to any one of claims 18 to 22.

24. The control unit reduces the pressure inside the container from a first pressure to a second pressure, and controls the posture of the movable member such that the distance between the tip of the movable member and the substrate is greater at the second pressure than at the first pressure. The substrate processing method according to any one of claims 18 to 22.

25. The control unit changes the position of the movable member when the pressure inside the container is greater than the vapor pressure of the solvent contained in the membrane. The substrate processing method according to any one of claims 18 to 22.

26. A program that causes the control unit of the substrate processing apparatus to execute the substrate processing method according to any one of claims 18 to 22.

27. A computer-readable recording medium storing the program described in claim 26.

28. A step of forming a solvent-containing film on a substrate, The substrate processing method according to any one of claims 18 to 22 is performed. A method for manufacturing an article characterized by the following:

29. The process includes a step of drying the film applied to the substrate using a substrate processing apparatus according to any one of claims 1 to 5. A method for manufacturing an article characterized by the following:

30. The aforementioned film is a liquid film containing a functional material. A method for manufacturing an article according to the feature described in 28.

31. The aforementioned film is a liquid film for forming one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. A method for manufacturing an article according to the feature described in 28.

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