Multilayer electronic components

Abstract

We provide highly reliable stacked electronic components. [Solution] A stacked electronic component according to one embodiment of the present disclosure includes a body comprising a dielectric layer and internal electrodes arranged alternately with the dielectric layer, an external electrode disposed on the body and connected to the internal electrode, and at least a portion of the outer surface of the body, and an organic layer disposed on at least a portion of the outer surface of the external electrode and comprising an organosilicon compound, wherein the Si content of at least a portion of the organic layer disposed on the body may be 2.2 at% or more and 5.8 at% or less as measured by X-ray photoelectron spectroscopy (XPS).

Description

[Technical Field]

[0001] This disclosure relates to a stacked electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones to charge or discharge electricity. Due to their advantages of being small, yet guaranteeing high capacitance and being easy to mount, these multilayer ceramic capacitors are used as components in a wide range of electronic devices.

[0003] In the case of high-voltage multilayer ceramic capacitors used in electrical components, there is a risk of arc discharge occurring, where current flows between external electrodes of opposite polarities through the surface of the multilayer ceramic capacitor. One method to suppress arc discharge in multilayer ceramic capacitors is to coat the surface of the multilayer ceramic capacitor with a water-repellent agent. Silane coupling agents can be used as water-repellent agents for coating multilayer ceramic capacitors, but it is necessary to suppress the side effects of the water-repellent coating. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2017-135239 [Overview of the project] [Problems that the invention aims to solve]

[0005] One of the various purposes of this disclosure is to provide highly reliable stacked electronic components.

[0006] However, the purpose of this disclosure is not limited to what is described above, and this will become clearer in the course of describing specific embodiments of this disclosure. [Means for solving the problem]

[0007] A stacked electronic component according to one embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, an external electrode disposed on the body and connected to the internal electrode, and at least a portion of the outer surface of the body, and an organic layer disposed on at least a portion of the outer surface of the external electrode and containing an organosilicon compound, wherein the Si content of at least a portion of the organic layer disposed on the body may be 2.2 at% or more and 5.8 at% or less as measured by X-ray photoelectron spectroscopy (XPS). [Effects of the Invention]

[0008] One of the various benefits of this disclosure is the ability to provide highly reliable stacked electronic components. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present disclosure. [Figure 2] This is a diagram from Figure 1 with the organic layer removed, and it is a perspective view that schematically shows the appearance of the main body and external electrodes. [Figure 3] This is a schematic cross-sectional view showing a section along the line I-I' in Figure 1. [Figure 4] This is a schematic cross-sectional view showing a section along the line II-II' in Figure 1. [Figure 5] This is a schematic enlarged view of the K1 region in Figure 3. [Figure 6] This is a schematic, enlarged view of the K2 region in Figure 3. [Figure 7]It is a schematic diagram showing the process of forming an organic layer.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present disclosure can be modified into several other forms, and the scope of the present disclosure is not limited to the embodiments described below. Also, the embodiments of the present disclosure are provided to more fully explain the present disclosure to ordinary technicians. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0011] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present disclosure, and the size and thickness of each illustrated configuration are arbitrarily shown for the convenience of explanation, so the present disclosure is not necessarily limited by the illustration. Also, components with the same function within the scope of the same idea are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included rather than excluding other components, unless there is a particularly contrary description.

[0012] In the drawings, the first direction X can be defined as the thickness (T) direction, the second direction Y as the length (L) direction, and the third direction Z as the width (W) direction.

[0013] Stacked electronic component Figure 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present disclosure; Figure 2 is a perspective view of the main body and external electrodes with the organic layer removed from Figure 1; Figure 3 is a schematic cross-sectional view of a section taken along line I-I' in Figure 1; Figure 4 is a schematic cross-sectional view of a section taken along line II-II' in Figure 1; Figure 5 is a schematic enlarged view of region K1 in Figure 3; Figure 6 is a schematic enlarged view of region K2 in Figure 3; and Figure 7 is a schematic diagram illustrating the process of forming the organic layer.

[0014] Hereinafter, with reference to Figures 1 to 7, a multilayer electronic component 100 according to one embodiment of this disclosure will be described in detail. While a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, this disclosure is not limited to this and can be applied to a variety of multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0015] A stacked electronic component 100 according to one embodiment of the present disclosure may include a body 110 including a dielectric layer 111 and internal electrodes 121, 122, external electrodes 131, 132 and an organic layer 140.

[0016] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process and the polishing process on the corners of the main body 110, the main body 110 may not be a perfectly straight hexahedron, but it can be substantially hexahedral.

[0017] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0018] The main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0019] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5), and can include one or more of them.

[0020] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0021] The internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged to face each other with the dielectric layer 111 interposed therebetween.

[0022] The first internal electrode 121 is separated from the fourth surface and can be connected to the first external electrode 131 at the third surface 3. The second internal electrode 122 is separated from the third surface 3 and can be connected to the second external electrode 132 at the fourth surface 4.

[0023] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably may include Ni, but is not limited thereto.

[0024] The average thickness te of the internal electrodes 121 and 122 is not particularly limited. The average thickness te of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0025] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 refer to the average thickness of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thickness at multiple points on one dielectric layer 111, for example, five points equally spaced in the second direction, and then calculating the average value. Similarly, the average thickness te of one internal electrode 121 and 122 can be measured by measuring the thickness at multiple points on one internal electrode 121 and 122, for example, five points equally spaced in the second direction, and then calculating the average value. The five equally spaced points can be specified in the capacitance forming section Ac. On the other hand, if such average value measurements are performed for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average value is measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0026] The main body 110 may include a capacitance forming section Ac disposed inside the main body 110 and comprising first internal electrodes 121 and second internal electrodes 122 arranged alternately with respect to the dielectric layer 111 in between, to form a capacitance, and cover sections 112 and 113 disposed on both sides of the capacitance forming section Ac facing the first direction. The cover sections 112 and 113 may have a configuration similar to the dielectric layer 111, except that they do not include internal electrodes.

[0027] The average thickness tc of the cover portions 112 and 113 is not particularly limited. The average thickness of the cover portions 112 and 113 may be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness tc of the cover portions 112 and 113 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tc of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively.

[0028] The average thickness tc of the cover portions 112 and 113 can mean the average thickness of the cover portions 112 and 113 in the first direction, and can be the average value of the thickness in the first direction measured at five equally spaced points in the cross-section of the main body 110 in the first and second directions.

[0029] The main body 110 may include margin portions 114 and 115 arranged on both sides of the capacitance forming portion Ac facing the third direction. The margin portions 114 and 115 may represent the regions between the ends of the internal electrodes 121 and 122 and the interface of the main body 110 in cross-sections obtained by cutting the main body 110 in the first and third directions. The margin portions 114 and 115 may have a configuration similar to the dielectric layer 111, except that they do not include the internal electrodes 121 and 122.

[0030] The average thickness of the margin portions 114 and 115 is not particularly limited. The average thickness wm of the margin portions 114 and 115 may be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness wm of the margin portions 114 and 115 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness wm of the margin portions 114 and 115 refers to the average thickness of the first margin portion 114 and the second margin portion 115, respectively.

[0031] The average thickness wm of the margin portions 114 and 115 can represent the average thickness of the margin portions 114 and 115 in the third direction, and can be the average value of the thickness in the third direction measured at five equally spaced points in the cross-section of the main body 110 in the first and third directions.

[0032] External electrodes 131 and 132 can be positioned on the main body 110 and connected to internal electrodes 121 and 122. External electrodes 131 and 132 can be positioned on the third surface 3 and the fourth surface 4 of the main body 110 and can extend over parts of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first external electrode 131 can be positioned on the third surface 3 and can extend over parts of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The second external electrode 132 can be positioned on the fourth surface 4 and can extend over parts of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0033] Of the first external electrode 131, the region located on the third surface 3 can be defined as the first connection portion CP1, and the region extending from the first connection portion CP1 onto parts of the first surface 1 and the second surface 2 can be defined as the first band portion BP1. Of the second external electrode 132, the region located on the fourth surface 4 can be defined as the second connection portion CP2, and the region extending from the second connection portion CP2 onto parts of the first surface 1 and the second surface 2 can be defined as the second band portion BP2.

[0034] The type and form of the external electrodes 131 and 132 are not particularly limited and can have a multilayer structure. For example, the external electrodes 131 and 132 may include base electrode layers 131a and 132a connected to the internal electrodes 121 and 122, and plating layers 131b and 132b disposed on the base electrode layers 131a and 132a. The plating layers 131b and 132b may be arranged in contact with the organic layer 140.

[0035] The base electrode layers 131a and 132a may be fired electrode layers containing metal and glass. The metal contained in the base electrode layers 131a and 132a may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys containing these. The glass contained in the base electrode layers 131a and 132a may include, for example, one or more oxides of Ba, Ca, Zn, Al, B, and Si.

[0036] On the other hand, while the base electrode layers 131a and 132a may consist only of fired electrode layers, the disclosure is not limited thereto, and the base electrode layers 131a and 132a may include fired electrode layers containing metal and glass, and resin electrode layers disposed on the fired electrode layers and containing metal particles and resin.

[0037] The metal particles contained in the resin electrode layer may include one or more spherical particles and flake-shaped particles. The metal particles contained in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn and / or alloys containing these. The resin contained in the resin electrode layer may include, for example, one or more epoxy resins, acrylic resins, and ethylcellulose.

[0038] The plating layers 131b and 132b may include, for example, Ni, Sn, Pd, and / or alloys containing these, and may be formed from multiple layers. The plating layers 131b and 132b may be, for example, Ni plating layers or Sn plating layers, and may include Ni plating layers disposed on the under electrode layers 131a and 132a and Sn plating layers disposed on the Ni plating layers. The plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0039] The drawing illustrates a structure in which the stacked electronic component 100 has two external electrodes 131 and 132, but it is not limited to this, and the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 or other purposes.

[0040] The organic layer 140 can be placed on at least a portion of the outer surface of the main body 110 and at least a portion of the outer surface of the external electrodes 131 and 132. The organic layer 140 may include a first organic layer 141 placed on the main body 110 and second organic layers 142 and 143 placed on the external electrodes 131 and 132.

[0041] The first organic layer 141 can be positioned so as to be in contact with at least a portion of the outer surface of the main body 110. The first organic layer 141 can be positioned so as to be in contact with one or more of the first surface 1, second surface 2, fifth surface 5, and sixth surface 6. The first organic layer 141 can be positioned so as to be in contact with the first surface 1, second surface 2, fifth surface 5, and sixth surface 6, respectively.

[0042] The second organic layers 142 and 143 can be arranged to be in contact with at least a portion of the outer surface of the external electrodes 131 and 132. More specifically, the second organic layers 142 and 143 can be arranged to be in contact with at least a portion of the outer surface of the plating layers 131b and 132b. The second organic layers 142 and 143 can be arranged to be in contact with the connecting portions CP1 and CP2 and / or the band portions BP1 and BP2.

[0043] The organic layer 140 may contain an organosilicon compound. In this disclosure, "organosilicon compound" can mean an organic compound whose molecular structure contains at least one silicon (Si) atom. The organic layer 140 can essentially prevent external moisture from penetrating the surface of the main body 110, thereby suppressing the occurrence of arc discharge phenomena in the laminated electronic component 100 due to external moisture.

[0044] The organosilicon compound contained in the organic layer 140 may include, for example, repeating units derived from an alkoxysilane represented by the following chemical formula 1. The repeating units derived from an alkoxysilane can refer to repeating units having a structure obtained by hydrolysis and dehydration condensation reactions of the alkoxysilane. The alkoxysilane may be, for example, an alkyltrialkoxysilane. [Chemical formula 1] R-Si(OR')3 (where R is an alkyl group from C1 to C20, and R' is an alkyl group from C1 to C6)

[0045] The organosilicon compound may, for example, have siloxane bonds (Si-O-Si) formed by the hydrolysis and dehydration condensation reactions of the alkoxysilane. The organosilicon compound may, for example, have C1-C20 alkyl groups derived from the alkoxysilane. In one embodiment, the organosilicon compound may have C3-C10 alkyl groups. The alkyl groups of the organosilicon compound can serve to impart hydrophobic properties to the outer surfaces of the main body 110 and / or external electrodes 131, 132 in order to improve the moisture resistance reliability of the multilayer electronic component 100.

[0046] According to one embodiment of the present disclosure, at least a portion of the organic layer 140 disposed on the main body 110 (hereinafter referred to as the first region) may have a Si element content of 2.2 at% or more and 5.8 at% or less, as measured by X-ray photoelectron spectroscopy (XPS). For example, the first organic layer 141 may have a Si element content of 2.2 at% or more and 5.8 at% or less, as measured by XPS. When the above numerical range is met, the arc discharge phenomenon of the multilayer electronic component 100 can be effectively prevented. If the Si element content is less than 2.2 at%, the coverage of the organic layer 140 over the main body 110 is insufficient, and the arc discharge suppression effect of the present disclosure may be slight. If the Si element content exceeds 5.8 at%, the coverage of the organic layer 140 over the main body 110 is excessive, and static electricity may be generated due to the surface adhesion of the organic layer 140. As a result, the multilayer electronic component 100 may not be able to be stably mounted on a printed circuit board (PCB).

[0047] In one embodiment, the ratio of the Si element content to the Ba element content (Si / Ba) measured via XPS in the first region may be 0.16 or more and 1.8 or less. When the above numerical range is satisfied, the arc discharge phenomenon of the multilayer electronic component 100 can be prevented more effectively.

[0048] In one embodiment, the first region may have a ratio of C element content to Si element content (C / Si) of 2.5 to 12.0 as measured via XPS. The C element measured via XPS may originate from the R group of the alkoxysilane. When the above numerical range is satisfied, the moisture resistance reliability of the multilayer electronic component 100 can be effectively improved while preventing arc discharge phenomena in the multilayer electronic component 100. More preferably, the first region may have a ratio of C element content to Si element content (C / Si) of 5.0 or less as measured via XPS.

[0049] The Si, Ba, and C content can be measured, for example, by etching the outer surface of the first organic layer 141, which is placed on the first or second surface 1, 2, by 3 nm to 5 nm, then analyzing the cross-section of the exposed first organic layer 141 using XPS (X-ray type: monochromatic Al-Kα), removing the background signal, and then measuring based on the peak areas of Si2s, Ba3d5, and C1s and the sensitivity coefficient of the measuring instrument. From the measured Si, Ba, and C content, the ratio of Si content to Ba content (Si / Ba) and the ratio of C content to Si content (C / Si) can be calculated.

[0050] The thickness of the organic layer 140 does not need to be particularly limited. However, arc discharge in the multilayer electronic component 100 may occur due to insufficient insulation of the surface of the main body 110 that is not covered by the first external electrode 131 and the second external electrode 132. Therefore, in one embodiment, the average thickness of the organic layer 140 placed on the main body 110 may be thicker than the average thickness of the organic layer 140 placed on the external electrodes 131 and 132. That is, the average thickness of the first organic layer 141 may be thicker than the average thickness of the second organic layers 142 and 143. This makes it possible to effectively suppress arc discharge in the multilayer electronic component 100.

[0051] An example of measuring the average thickness of the first organic layer 141 is described below. Referring to Figures 3 and 5, the first organic layer 141, which is placed on the first or second surface 1, 2 of the main body 110, can be analyzed by HRTEM (High-resolution transmission electron microscopy) in the first and second cross-sections of the multilayer electronic component 100. After measuring the thickness (t1, t3, t5, t7, ... tn) at five or more points spaced apart from each other in the first organic layer 141 from the image analyzed by HRTEM, the average value can be considered as the average thickness of the first organic layer 141.

[0052] An example of measuring the average thickness of the second organic layer 142 will be described. Referring to Figures 3 and 6, the second organic layer 142, which is placed on the connection parts CP1 and CP2 of the multilayer electronic component 100, can be analyzed by HRTEM in the cross-sections in the first and second directions. In the image analyzed by HRTEM, the thickness (t2, t4, t6, t8, ... tm) of the second organic layer 142 at five or more points spaced apart from each other can be measured, and the average value can be considered as the average thickness of the second organic layer 142.

[0053] The average thickness of the organic layer 140 arranged on the main body 110, i.e., the average thickness of the first organic layer 141, is not particularly limited, but may be, for example, 5 nm or more and 15 nm or less. If the average thickness of the first organic layer 141 is less than 5 nm, the coverage of the organic layer 140 over the main body 110 may be insufficient, and the arc discharge suppression effect of this disclosure may be slight. If the average thickness of the first organic layer 141 exceeds 15 nm, the coverage of the organic layer 140 over the main body 110 may be excessive, and the static electricity generated by the organic layer 140 may reduce the mounting stability of the multilayer electronic component 100.

[0054] Referring to Figures 5 and 6, the first organic layer 141 can be discontinuously arranged on the main body 110, and the second organic layer 142 can be discontinuously arranged on the external electrode 131. In one embodiment, the coverage of the first organic layer 141 may be greater than the coverage of the second organic layer 142. This makes it possible to more effectively suppress the arc discharge phenomenon of the multilayer electronic component 100.

[0055] The coverage rate of the first organic layer 141 can mean the ratio of the total length of the surface of the main body 110 covered by the first organic layer 141 to the total length of the surface of the main body 110 in a predetermined region. The coverage rate of the second organic layer 142 can mean the ratio of the total length of the surface of the external electrodes 131 and 132 covered by the second organic layers 142 and 143 to the total length of the surface of the external electrodes 131 and 132 in a predetermined region.

[0056] Microporous structures MP may be present on the surface of the main body 110. The main body 110 may have the properties of a sintered body. As a result, unlike the relatively denser plating layers 131b and 132b, microporous structures MP may be present on the surface of the main body 110. Since moisture from the outside may penetrate into the interior of the main body 110 through the microporous structures MP, the microporous structures MP may be a factor that degrades the moisture resistance reliability of the multilayer electronic component 100. According to one embodiment of the present disclosure, the organic layer 140 can fill the interior of the microporous structures MP. That is, the first organic layer 141 can fill the interior of the microporous structures MP. As a result, the moisture resistance reliability of the multilayer electronic component 100 can be improved.

[0057] In one embodiment, when the surface roughness of the surface of the organic layer 140 in contact with the main body 110 is R1, and the surface roughness of the surface of the organic layer 140 in contact with the external electrodes 131 and 132 is R2, it is possible to satisfy R1 > R2. That is, the surface roughness R1 of the surface of the first organic layer 141 in contact with the main body 110 may be greater than the surface roughness R2 of the surfaces of the second organic layers 142 and 143 in contact with the external electrodes 131 and 132. Here, surface roughness can mean the centerline average roughness Ra measured using an AFM (Atomic Force Microscope) device. The outer surface of the main body 110, which has the properties of a sintered body, can be rougher than the plating layers 131b and 132b. This makes it possible to satisfy R1 > R2.

[0058] On the other hand, the size of the multilayer electronic component 100 is not particularly limited. However, arc discharge may occur in the multilayer electronic component 100 when a high voltage is applied to it, and the risk of arc discharge is particularly high when the multilayer electronic component 100 is 1005 size (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm) or larger. Therefore, when the multilayer electronic component 100 according to one embodiment of this disclosure is applied to a high-voltage electrical component having a size of 1005 size (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm) or larger, the reliability improvement effect can be more pronounced.

[0059] Next, an example of a method for forming the multilayer electronic component 100 will be described. However, the manufacturing method of the multilayer electronic component 100 is not limited thereto.

[0060] First, ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder can include, for example, one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). The BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the synthesis method of the ceramic powder include, but are not limited to, the solid-phase method, the sol-gel method, the hydrothermal synthesis method, etc. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and the ceramic slurry is applied and dried on a carrier film to prepare a ceramic green sheet.

[0061] Next, an internal electrode pattern is formed by printing a conductive paste for the internal electrode containing metal powder, binder, organic solvent, etc. on the ceramic green sheet with a predetermined thickness using a screen printing method or a gravure printing method, etc.

[0062] After this, the ceramic green sheet with the printed internal electrode pattern is peeled off the carrier film, and then a predetermined number of layers of ceramic green sheets with the printed internal electrode pattern are laminated and pressed together to form a ceramic laminate. A predetermined number of ceramic green sheets without the printed internal electrode pattern may be laminated on the upper and lower parts of the ceramic laminate to form cover portions 112 and 113 after firing. After this, the ceramic laminate can be cut to have a predetermined chip size, and the cut chips can be fired at a temperature of 1000°C to 1400°C to form the main body 110.

[0063] On the other hand, the margin portions 114 and 115 may be formed by applying a conductive paste for internal electrodes to the ceramic green sheet and firing it, except where the margin portions are formed. Alternatively, in order to suppress the step caused by the internal electrodes 121 and 122, the ceramic laminate may be cut so that the internal electrode pattern is exposed on both sides of the cut chip in the third direction, then a margin portion forming sheet may be attached to both sides of the cut chip in the third direction, and then fired to form the margin portions 114 and 115.

[0064] Next, external electrodes 131 and 132 are formed. For example, if the base electrode layers 131a and 132a include a fired electrode layer, the main body 110 can be dipped in a conductive paste for external electrodes containing metal powder, glass frit, binder, and organic solvent, and then the conductive paste for external electrodes can be fired at a temperature of 500°C to 900°C to form a fired electrode layer.

[0065] For example, if the base electrode layers 131a and 132a include a resin electrode layer, the main body can be dipped in a conductive resin composition containing metal powder, resin, binder, and organic solvent, and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0066] Furthermore, electroplating and / or electroless plating may be performed to form plating layers 131b and 132b on the underlying electrode layers 131a and 132a.

[0067] Next, an organic coating liquid can be applied to cover the surface of the main body 110 and the surfaces of the external electrodes 131 and 132, or the main body 110 with the external electrodes 131 and 132 formed on it can be immersed in the organic coating liquid. After this, the organic layer 140 can be formed by drying the main body 110 with the external electrodes 131 and 132 formed on it. The drying temperature is not particularly limited, but for example it may be 100°C to 200°C.

[0068] The above organic coating solution may contain an alkoxysilane represented as R-Si(OR')3 (where R is a C1-C20 alkyl group and R' is a C1-C6 alkyl group) and a solvent such as an alcohol. The weight of the alkoxysilane in the total weight of the organic coating solution may be 1% by weight or more and 15% by weight or less, but this disclosure is not limited thereto.

[0069] Referring to Figure 7, the process of forming the organic layer will be explained in detail. First, the alkoxysilane can be dissolved in a solvent such as alcohol to form an organic coating solution (S1). In this process, the alkoxy group (Si-OR') of the alkoxysilane is hydrolyzed and converted to a silanol group (Si-OH), forming a siloxane bond (Si-O-Si) (S2). When the organic coating solution is applied to the surface of the multilayer electronic component 100, or when the multilayer electronic component 100 is immersed in the organic coating solution, hydrogen bonds can be formed between the hydroxyl group (-OH) and silanol group (Si-OH) present on the surface of the multilayer electronic component 100 (S3). After this, an organic layer can be formed by a dehydration condensation reaction due to heating and drying, while covalent bonds are formed between the organosilicon compound and the multilayer electronic component 100 (S4).

[0070] On the other hand, in order to adjust the average thickness of the first organic layer 141 and the second organic layers 142 and 143, the first organic layer 141 and the second organic layers 142 and 143 may be formed separately. For example, the first organic layer 141 can be formed by applying and drying the first organic coating liquid only on the outer surface of the main body 110 using a mask, and then the second organic layers 142 and 143 can be formed by applying and drying the second organic coating liquid only on the outer surfaces of the external electrodes 131 and 132 using a mask. For example, the weight ratio of the alkoxysilane to the total weight of the first organic coating liquid may be greater than the weight ratio of the alkoxysilane to the total weight of the second organic coating liquid. This makes it possible to make the average thickness of the first organic layer 141 thicker than the average thickness of the second organic layers 142 and 143.

[0071] (Example of experiment) After preparing sample chips of size 1005 (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm), the moisture resistance reliability with and without an organic layer was evaluated. The average thickness of the first organic layer in the experimental example was 10 nm. In the comparative example, no organic layer was formed. The average thickness of the first organic layer was calculated by analyzing the thickness at five points spaced apart from each other in the cross-section of the first and second directions of the sample chip, which had been polished to the center of the third direction, using HRTEM, and then averaging the results.

[0072] First, for 20 samples each of the experimental and comparative examples, the voltage at the moment when the current value reached 10 mA was measured using the dielectric breakdown voltage (BDV) under boost conditions of 25°C and 400 V / s, and the average value was calculated and is shown in Table 1 below.

[0073] For the humidity resistance reliability evaluation, 400 samples each of the experimental and comparative examples were subjected to a reference voltage (1Vr) for 24 hours under conditions of 85°C and 85% relative humidity. Samples whose insulation resistance fell to 1 / 10 or less of the initial value were judged to be defective and are listed in Table 1 below.

[0074] [Table 1]

[0075] Referring to Table 1 above, it can be seen that when an organic layer is formed, the dielectric breakdown voltage (BDV) and moisture resistance reliability of the multilayer electronic component are improved.

[0076] This disclosure is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims attached. Therefore, within the scope of the technical idea of ​​this disclosure as described in the claims, various forms of substitution, modification, and alteration are possible by a person with ordinary skill in the art, and these also fall within the scope of this disclosure.

[0077] Furthermore, the expression "one embodiment" does not mean that each embodiment is identical to the others, but is provided to highlight and explain the unique and distinct characteristics of each embodiment. However, the above-presented embodiments do not preclude their implementation in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or inconsists with that matter.

[0078] In this disclosure, the term "connected" includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, the term "electrically connected" includes both physically connected and non-connected cases. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component. [Explanation of symbols]

[0079] 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 132 External electrode 131a, 132a Base electrode layer 131b, 132b Plating layer 140 Organic layer

Claims

1. A body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, An external electrode is placed on the main body and connected to the internal electrode, The organic layer comprising an organosilicon compound is disposed on at least a portion of the outer surface of the main body and at least a portion of the outer surface of the external electrode, A multilayer electronic component in which at least a portion of the organic layer disposed on the main body has a Si element content of 2.2 at% or more and 5.8 at% or less, as measured by X-ray photoelectron spectroscopy (XPS).

2. The aforementioned region is a multilayer electronic component according to claim 1, wherein the ratio of the Si element content to the Ba element content (Si / Ba), measured via XPS, is 0.16 or more and 1.8 or less.

3. The aforementioned region is a multilayer electronic component according to claim 1, wherein the ratio of the content of element C to the content of element Si (C / Si), measured via XPS, is 2.5 or more and 12.0 or less.

4. The multilayer electronic component according to claim 3, wherein the ratio of the content of element C to the content of element Si (C / Si), measured via XPS, is 5.0 or less in the region.

5. The multilayer electronic component according to claim 1, wherein the organosilicon compound has a siloxane bond.

6. The multilayer electronic component according to claim 1, wherein the organosilicon compound has a C1 to C20 alkyl group.

7. The stacked electronic component according to claim 1, wherein the average thickness of the organic layer arranged on the main body is greater than the average thickness of the organic layer arranged on the external electrode.

8. The stacked electronic component according to claim 1, wherein the average thickness of the organic layer disposed on the main body is 5 nm or more and 15 nm or less.

9. The surface of the main body has fine pores, The laminated electronic component according to claim 1, wherein the organic layer fills the interior of the micropores.

10. The laminated electronic component according to claim 1, wherein when the surface roughness of the surface of the organic layer in contact with the main body is R1, and the surface roughness of the surface of the organic layer in contact with the external electrode is R2, R1 > R2.

11. The stacked electronic component according to claim 1, wherein the organic layer includes a first organic layer discontinuously arranged on the main body and a second organic layer discontinuously arranged on the external electrode.

12. The multilayer electronic component according to any one of claims 1 to 11, wherein the external electrode includes a base electrode layer connected to the internal electrode, and a plating layer disposed on the base electrode layer and in contact with the organic layer.

13. The laminated electronic component according to claim 12, wherein the plating layer includes a Ni plating layer disposed on the underlayer electrode layer and a Sn plating layer disposed on the Ni plating layer.

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