Electronic devices and methods for manufacturing electronic devices

Abstract

Ensuring quality. [Solution] The device comprises a spring member 22A2b that contacts the outer circumference of the contacted member (connection terminal 12B) with elastic force, a wall member 25 that surrounds the outside of the spring member 22A2b and has a distance D1 between it and the outside of the spring member 22A2b that is less than or equal to the distance D2 inside the spring member 22A2b, and an insert resin that is filled inside the wall member 25.

Description

Technical Field

[0001] The present invention relates to an electronic device and a method for manufacturing an electronic device.

Background Art

[0002] For example, a imaging device module is disclosed in Patent Document 1. This imaging device module includes an imaging element substrate, an imaging element mounted on the imaging element substrate, a cylindrical lens holding member that is fixed to the imaging element substrate and holds a lens that condenses light onto the imaging element, and a molded resin that surrounds from the side surface of the lens holding member to the imaging element substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In electronic devices, a structure in which substrates and internal components are insert-molded and sealed is known for waterproofing, dustproofing, explosion-proofing, and heat dissipation of internal components. However, as a problem of insert molding, since an injection pressure is applied during molding to extrude the resin molding material, pressure is also applied to the substrates and internal components. In particular, when there is a structure having spring properties for ensuring conduction such as a connector, there is a risk of deformation due to the influence of the injection pressure and causing a contact failure. Therefore, conventionally, it is necessary to adjust molding conditions such as reducing the injection pressure, or to adjust the viscosity during melting so that the resin does not reach the details of the spring portion, and to set conditions that do not affect the spring portion. As a result, the restrictions on materials and molding conditions increase, and there is a risk of degrading the quality such as waterproofing, dustproofing, explosion-proofing, and heat dissipation.

[0005] An object of the present invention is to provide an electronic device and a method for manufacturing an electronic device that can ensure quality. [Means for solving the problem]

[0006] To achieve the above objective, an electronic device according to one aspect of the present invention comprises: a spring member that contacts the outer periphery of a member to be contacted with elastic force; a wall member that surrounds the outside of the spring member and is positioned such that the distance between the wall member and the outside of the spring member is less than or equal to the distance between the inside of the spring member; and an insert resin filled inside the wall member.

[0007] To achieve the above objective, a method for manufacturing an electronic device according to one aspect of the present invention comprises: a spring member that contacts the outer periphery of a member to be contacted with elastic force; and a wall member that surrounds the outside of the spring member and is positioned such that the distance between the wall member and the outside of the spring member is less than or equal to the distance between the inside of the spring member, wherein the method for manufacturing an electronic device includes a step of filling the inside of the wall member with an insert resin after the step of positioning the spring member and the wall member. [Effects of the Invention]

[0008] This invention can ensure quality. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a front view perspective of the electronic device according to the embodiment. [Figure 2] Figure 2 is a rear-view perspective view of the electronic device according to the embodiment. [Figure 3] Figure 3 is a plan view of the electronic device according to the embodiment. [Figure 4] Figure 4 is a cross-sectional view of the electronic device according to the embodiment (cross-sectional view at position AA in Figure 3). [Figure 5] Figure 5 is a rear view perspective of the substrate unit of the electronic device according to the embodiment. [Figure 6] Figure 6 is a plan view of the circuit board unit of the electronic device according to the embodiment. [Figure 7] Figure 7 is a front view perspective of the frame portion of the electronic device according to the embodiment. [Figure 8]Figure 8 is a cross-sectional view of the electronic device according to the embodiment (cross-sectional view of the BB position in Figure 4). [Figure 9] Figure 9 is a cross-sectional view of another example of the electronic device according to the embodiment (a cross-sectional view of the BB position in Figure 4). [Figure 10] Figure 10 is a process diagram of the manufacturing method of an electronic device according to an embodiment. [Figure 11] Figure 11 is a process diagram of a method for manufacturing an electronic device according to an embodiment. [Figure 12] Figure 12 is a flowchart of the manufacturing method of an electronic device according to an embodiment. [Figure 13] Figure 13 is a cross-sectional view of another example of the electronic device according to the embodiment (cross-sectional view at position AA in Figure 3). [Modes for carrying out the invention]

[0010] Hereinafter, embodiments for carrying out the invention (hereinafter referred to as "embodiments") will be described in detail with reference to the drawings. However, the present invention is not limited to the embodiments described below. Furthermore, the components in the embodiments described below include those that are easily conceivable by those skilled in the art, those that are substantially the same, and those that fall within the so-called equivalent range. Moreover, the components disclosed in the embodiments described below can be combined as appropriate.

[0011] Figures 1 to 4 show the electronic equipment according to this embodiment. Figures 5 to 9 show the circuit board unit of the electronic equipment according to this embodiment.

[0012] In this embodiment, a camera module 1 is described as an example of an electronic device. The camera module 1 of this embodiment is fixed, for example, inside or outside the vehicle to which it is to be mounted. The camera module 1 includes a camera unit 10 which is a circuit board unit, a frame 20, and an exterior resin 30.

[0013] Here, in the following description, each direction is defined based on the optical axis O of the camera module 1. Specifically, the direction along (parallel to) the optical axis O is defined as the front-rear direction X, the direction in which the lens 11A faces is defined as "front", and the opposite direction of the front is defined as "rear". Further, the direction horizontally orthogonal to the front-rear direction X is defined as the width direction Y. Also, the direction orthogonal to both the front-rear direction X and the width direction Y is defined as the vertical direction Z, the direction facing upward is defined as "upward", and the direction facing downward is defined as "downward". The front-rear direction X, the width direction Y, and the vertical direction Z are orthogonal in three dimensions.

[0014] As shown in FIGS. 4 to 6, the camera unit 10 includes a lens unit 11, an imaging substrate (substrate) 12, and an optical axis reference unit 13.

[0015] The lens unit 11 holds the lens 11A. As shown in FIG. 4, the lens unit 11 includes a lens 11A, a lens defining unit 11B, and a lens holding unit 11C. The lens 11A has an optical axis O that extends parallel to the front-rear direction X at the center of a disk shape. The lens defining unit 11B defines the optical axis O of the lens 11A. The lens defining unit 11B is formed in a cylindrical shape so that the optical axis O passes through the inside, and by abutting its front surface against the rear surface of the lens 11A, the optical axis O of the lens 11A is defined. The lens holding unit 11C holds the lens 11A together with the lens defining unit 11B. The lens holding unit 11C is formed in a ring shape so that the optical axis O passes through the inside, and by meshing and tightening the female screw 11Ca on the inner peripheral surface thereof with the male screw 11Ba on the outer peripheral surface of the lens defining unit 11B, it functions to press the rear surface of the lens 11A against the front surface of the lens defining unit 11B.

[0016] The imaging substrate 12 has a thickness in the front-rear direction X and is formed in a rectangular plate shape having planes facing each direction in the vertical direction Z and planes facing each direction in the width direction Y. An imaging element 12A, which is an electronic component, is mounted on the front surface of the imaging substrate 12. The imaging element 12A has a center so as to coincide with the optical axis O of the lens unit 11. Further, a cylindrical connection terminal 12B extending in the front-rear direction X is fixed to the rear surface of the imaging substrate 12. Also, although not shown in the figure, other electronic components constituting a circuit are mounted on the front surface and the rear surface of the imaging substrate 12.

[0017] The optical axis reference part 13 is fixed to the lens part 11 and the imaging substrate 12, and aligns the optical axis O of the lens 11A with the center of the imaging element 12A. The optical axis reference part 13 includes a positioning part 13A and a fixing part 13B.

[0018] The fixing part 13B is formed in a cylindrical shape for fixing the lens part 11 therein. The fixing part 13B defines the positions of the lens part 11 in the two-dimensional directions of the width direction Y and the up-down direction Z of the optical axis O of the lens part 11 with respect to itself by engaging the female screw 13Ba on its inner peripheral surface with the male screw 11Bb on the outer peripheral surface of the lens defining part 11B of the lens part 11. Further, the fixing part 13B defines the position of the lens part 11 in the front-rear direction X of the optical axis O of the lens part 11 with respect to itself by adjusting the tightening of the engagement between the female screw 13Ba and the male screw 11Bb.

[0019] The fixing part 13B is fixed to the imaging substrate 12 by an adhesive 13C on the side opposite to the front-rear direction X with respect to the lens 11A of the fixed lens part 11. When fixing to the imaging substrate 12, the fixing part 13B aligns the optical axis O of the lens 11A with the center of the imaging element 12A. Therefore, the optical axis reference part 13 has a positioning part 13A.

[0020] The positioning part 13A is provided at a plurality of positions (four positions in the embodiment) on the outer peripheral part of the fixing part 13B. The positioning part 13A is provided around the optical axis O of the lens 11A of the fixed lens part 11. The positioning part 13A is provided at a total of four positions at equal intervals in the width direction Y and the up-down direction Z (two positions in the embodiment) that are orthogonal to the optical axis O of the lens 11A (front-rear direction X) around the optical axis O of the lens 11A. Therefore, all the positioning parts 13A coincide in the front-rear direction X with respect to the optical axis O. The upper two positions of the positioning part 13A that are arranged in the width direction Y in the up-down direction Z are formed as recesses that are open upward. Also, the lower two positions of the positioning part 13A that are arranged in the width direction Y in the up-down direction Z are formed as recesses that are open downward.

[0021] The optical axis reference unit 13 is installed on a focus adjustment jig (not shown) with the lens unit 11 fixed to the fixing unit 13B, so that the projection of the focus adjustment jig fits into the positioning unit 13A. Thus, the optical axis reference unit 13 is installed on the focus adjustment jig so that the optical axis O of the lens 11A of the lens unit 11 is aligned with the focus adjustment chart (not shown) of the focus adjustment jig. The optical axis O of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing unit 13B and the male screw 11Bb of the lens reference unit 11B. In addition, with the optical axis reference unit 13 installed on the focus adjustment jig, the center of the image sensor 12A is aligned with the focus adjustment chart, and the image substrate 12 is fixed with adhesive 13C. In this way, the optical axis reference unit 13 is fixed to the lens unit 11 and the image substrate 12, so that the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. As stated above, the front-to-back X direction adjustment of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing part 13B and the male screw 11Bb of the lens reference part 11B. However, adjustment may also be made by using adhesive to suspend and fix the image substrate 12 and the optical axis reference part 13 without using screws.

[0022] Therefore, the camera unit 10 is assembled with the optical axis O of the lens 11A and the center of the image sensor 12A aligned, using the positioning part 13A of the optical axis reference part 13 as a reference. Although not shown in the diagram, there are actually multiple lenses inside the lens reference part 11B, and together with the lens 11A, multiple lenses form a lens assembly, and the optical axis O determined by these multiple lenses is aligned with the center of the image sensor 12A.

[0023] Returning to the description of camera module 1, as shown in Figures 1 to 4, the frame portion 20 is positioned behind the camera unit 10. The frame portion 20 includes a base portion 21, a connector portion 22, a locking portion 23, a shield case 24, and a wall member 25.

[0024] The base portion 21 is molded from a synthetic resin material and has a predetermined thickness in the front-to-back direction X, and is formed in a rectangular plate shape with planes facing in each direction in the width direction Y and each direction in the up-and-down direction Z. The base portion 21 has a positioning portion 21A.

[0025] The positioning portions 21A are provided at a total of four locations (two in the embodiment) at equal intervals in the width direction Y on a plane facing each direction in the vertical direction Z. In the upper plane in the vertical direction Z, the two upper positioning portions 21A aligned in the width direction Y are formed as recesses that open upward. In the lower plane in the vertical direction Z, the two lower positioning portions 21A aligned in the width direction Y are formed as recesses that open downward.

[0026] The connector portion 22 is integrally provided with the base portion 21 and is formed in a cylindrical shape that extends toward the rear. Inside the cylindrical shape of the connector portion 22 is a connecting fitting 22A that connects to a connection terminal 12B (contacted member) fixed to the imaging substrate 12. The connecting fitting 22A extends forward from the connector portion 22 through the base portion 21 and is electrically connected to the connection terminal 12B of the camera unit 10 at the rear of the imaging substrate 12.

[0027] As shown in Figure 4, the connecting fitting 22A includes an external connecting portion 22A1 that extends rearward through the base portion 21 and an internal connecting portion 22A2 that extends forward through the base portion 21. The external connecting portion 22A1 is connected to a cable connector (not shown) for a recording device or the like. The internal connecting portion 22A2 is connected to the connection terminal 12B of the camera unit 10. The connection terminal 12B is formed in a cylindrical shape extending in the front-rear direction X as described above, and the internal connecting portion 22A2 connected to this connection terminal 12B includes a connecting pin 22A2a that is inserted into the connection terminal 12B, and a spring member 22A2b that surrounds the connecting pin 22A2a and contacts the outer circumference of the cylindrical connection terminal 12B with elastic force.

[0028] The spring member 22A2b is provided in the internal connection portion 22A2, extending from rear to front, with its rear end becoming a base end 22A2ba that is integrally joined to the internal connection portion 22A2, and its front end becoming a free end 22A2bb, and is elastic so as to move closer to or further away from the outer circumference of the connection terminal 12B. Furthermore, the spring member 22A2b is formed so that the free end 22A2bb moves away from the outer circumference of the connection terminal 12B, and the rear of the free end 22A2bb is formed to narrow so as to move closer to the outer circumference of the connection terminal 12B. This narrowed portion of the spring member 22A2b becomes a contact portion 22A2bc that contacts the outer circumference of the connection terminal 12B. When the contact portion 22A2bc of the spring member 22A2b contacts the outer circumference of the connection terminal 12B, it is pushed away from the outer circumference of the connection terminal 12B and generates an elastic force to move closer to the outer circumference of the connection terminal 12B. Therefore, the spring member 22A2b makes contact with the outer periphery of the connection terminal 12B with elastic force. As shown in Figure 7, the spring member 22A2b is arranged to surround the outer periphery of the connection terminal 12B, and notches 22A2bd are formed from the free end 22A2bb toward the base end 22A2ba so that the free end 22A2bb side of the connection terminal 12B is divided into multiple sections (four in this embodiment) in the circumferential direction.

[0029] The locking portion 23 is integrally provided with the base portion 21 and is positioned along the connector portion 22. The locking portion 23 is formed as a projection into which the claws of a connector (not shown) of a cable such as a recording device, which is inserted into the connector portion 22 and electrically connected to the connecting fitting 22A, engage.

[0030] The shield case 24 is formed of an elastic metal plate and includes a main plate 24A, a plurality of plate pieces 24B, and through holes 24C, as shown in Figures 4, 7, and 8.

[0031] The main plate 24A is formed in a rectangular shape with thickness in the front-to-back direction X, and two sides facing each direction in the up-and-down direction Z and two sides facing each direction in the width direction Y. The main plate 24A is formed in a rectangular shape that is slightly larger than the rectangular shape of the imaging substrate 12. The main plate 24A is positioned with its front surface facing the rear surface (one of the plate surfaces) of the imaging substrate 12. The main plate 24A is fixed by the connecting fitting 22A passing through it.

[0032] The plate pieces 24B are formed by bending each side around the main plate 24A and extending forward. Therefore, in this embodiment, the plate pieces 24B are formed at four locations around the main plate 24A. The plate piece 24B has first plate pieces 24BA that are bent and extend from each side in the width direction Y of the rectangular main plate 24A, and second plate pieces 24BB that are bent and extend from each side in the vertical direction Z of the rectangular main plate 24A. Therefore, the plate pieces 24B alternately have first plate pieces 24BA and second plate pieces 24BB around the rectangular main plate 24A. Each first plate piece 24BA is formed so that the length extending from the side of the main plate 24A is longer than the length of each second plate piece 24BB that extends from the side of the main plate 24A. In this way, the plate pieces 24B are formed with different lengths extending from the main plate 24A.

[0033] Each first plate piece 24BA has a tongue portion 24Ba that extends outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at a 45-degree angle to the plate surface of the first plate piece 24BA. Each first plate piece 24BA also has a bulging portion 24Bb that expands inward along its extension. The bulging portion 24Bb extends in the direction in which the first plate piece 24BA extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Furthermore, each first plate piece 24BA has bent portions 24Bc on both sides adjacent to the second plate piece 24BB in the circumferential direction of the main plate 24A, which are bent so as to overlap the side edges of the second plate piece 24BB from the outside.

[0034] Each second plate piece 24BB has a tongue portion 24Ba bent outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at 45 degrees relative to the plate surface of the second plate piece 24BB. Each second plate piece 24BB also has a bulging portion 24Bb that expands inward along its extension. The bulging portion 24Bb extends in the direction in which the second plate piece 24BB extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Each second plate piece 24BB also has projections 24Bd on both ends where the bent portion 24Bc of the first plate piece 24BA overlaps, projecting toward the bent portion 24Bc. The projections 24Bd are not limited to the second plate piece 24BB, but may also be provided on the first plate piece 24BA so as to project toward the second plate piece 24BB on the bent portion 24Bc that overlaps the side end of the second plate piece 24BB.

[0035] The plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around a rectangular main plate 24A facing the rectangular imaging substrate 12. However, for example, the first plate pieces 24BA and second plate pieces 24BB may be alternating around a hexagonal main plate 24A facing the hexagonal imaging substrate 12. That is, the plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around an even-sided main plate 24A.

[0036] Each plate piece 24B makes elastic contact with the peripheral edge of the imaging substrate 12. As shown in Figure 8, the imaging substrate 12 has a recess 12C formed at its peripheral edge so that a protective film made of resin or the like is peeled off, exposing the ground electrode. Each plate piece 24B has a bulge 24Bb that fits into the recess 12C and makes elastic contact with the peripheral edge of the imaging substrate 12. In addition, each plate piece 24B is formed with a sharp bend from the main plate 24A so that the tip side (tongue 24Ba side) faces inward beforehand, in order to generate an elastic force that contacts the peripheral edge of the imaging substrate 12.

[0037] The through-hole 24C penetrates the shield case 24 both internally and externally. The through-hole 24C is formed by cutting out a corner portion of the main plate 24A and the base end of each circumferentially adjacent plate piece 24B that bends from the main plate 24A. This through-hole 24C is provided to penetrate the box-shaped shield case 24, which consists of the main plate 24A and each plate piece 24B, connecting the inside and the outside.

[0038] The shield case 24 is supported by the camera unit 10 by sandwiching the imaging substrate 12 of the camera unit 10 between opposing plate pieces 24B. At this time, in the internal region IN of the shield case 24, which is partitioned by the shield case 24 and the imaging substrate 12, the internal connection portion 22A2 of the connecting fitting 22A in the connector portion 22 is connected to the connection terminal 12B of the imaging substrate 12, and the spring member 22A2b is in contact with the outer circumference of the connection terminal 12B.

[0039] In this type of shield case 24, the shielding effect is enhanced by having multiple plate pieces 24B that contact the peripheral edge of the imaging substrate 12, such that a portion of one plate piece 24B overlaps the outer surface of the other plate piece 24B that is adjacent in the circumferential direction. As a result, this shield case 24 can achieve further improvement in electromagnetic compatibility. In particular, in this shield case 24, each plate piece 24B that is adjacent in the circumferential direction is formed with a different length extending from the main plate 24A. Therefore, when contacting the peripheral edge of the imaging substrate 12, the longer plate piece 24BA makes contact first and spreads outward, and then the shorter plate piece 24BB makes contact with the peripheral edge of the imaging substrate 12 and spreads outward, thus avoiding interference between the overlapping portions of adjacent plate pieces 24B.

[0040] As shown in Figures 4 and 8, the wall member 25 is positioned in the internal region IN of the shield case 24, which is partitioned by the shield case 24 and the imaging substrate 12. The wall member 25 surrounds the outside of the spring member 22A2b in the internal connection portion 22A2. The wall member 25 is formed of synthetic resin material in a cylindrical shape extending in the front-rear direction X, as shown in Figure 8, and is provided extending integrally from the base portion 21 of the frame portion 20, as shown in Figure 4. Although not explicitly shown in the figures, the wall member 25 may also be formed of a metal plate and provided extending integrally from the main plate 24A of the shield case 24 by welding or the like. As shown in Figure 4, the length of the wall member 25 is set in the front-rear direction X so that the extended tip does not come into contact with the imaging substrate 12. As shown in Figure 8, the wall member 25 is positioned such that the distance D1 between it and the outside of the spring member 22A2b is set to be less than or equal to the distance D2 between it and the inside of the spring member 22A2b (the distance between the spring member 22A2b and the connection terminal 12B). These distances D1 and D2 are the maximum distances. Note that in Figure 7, the wall member 25 is cut off to mainly show the connector portion 22 and is not shown in its entirety.

[0041] The wall member 25 may have through-holes 25A, such as notches or holes, as shown in Figure 9. The through-holes 25A connect the outside and inside (spring member 22A2b side) of the wall member 25. In the case of a notch, the through-hole 25A is formed extending in the front-rear direction X from the tip and is positioned to overlap with the notch 22A2bd of the spring member 22A2b, as shown in Figure 9. In the case of a hole, the through-hole 25A is formed midway along its extension in the front-rear direction X and may be positioned to overlap with the notch 22A2bd of the spring member 22A2b, as shown in Figure 9, or it may be positioned away from the position where it overlaps with the notch 22A2bd of the spring member 22A2b. Furthermore, the through-hole 25A may include both a notch and a hole.

[0042] Returning to the description of camera module 1, as shown in Figures 1 to 4, the exterior resin 30 is formed by insert molding so as to cover the outside of the lens portion 11, imaging substrate 12, and optical axis reference portion 13 of the camera unit 10. The exterior resin 30 is integrally formed from a main exterior resin 31 that covers the outside of the imaging substrate 12 and the optical axis reference portion 13, and a sub-exterior resin 32 that covers the outside of the lens portion 11.

[0043] The main exterior resin 31 is formed from insert resin (also called mold resin) 40, and as shown in Figure 4, it is positioned in front of the base portion 21 of the frame portion 20, in the external region OUT of the shield case 24, covering the outer circumference of the optical axis reference portion 13 and the outer circumference of the adhesive 13C, and extending into the internal region IN of the shield case 24. Furthermore, as shown in Figure 5, the main exterior resin 31 is provided so that the exterior reference portion 31A, which fits into the positioning portion 13A of the optical axis reference portion 13, is exposed to the outside.

[0044] The sub-exterior resin 32 is formed integrally with the main exterior resin 31 using insert resin 40, and as shown in Figure 4, it is provided to continuously cover the outer circumference of a part of the lens holding portion 11C of the lens portion 11, the outer circumference of a part of the lens regulating portion 11B, and the outer circumference of a part of the optical axis reference portion 13 in the front-to-back direction X.

[0045] Therefore, the exterior resin 30 continuously covers the outer periphery of the camera module 1 in the front-to-back direction X, from the lens holding portion 11C of the lens portion 11 to the frame portion 20.

[0046] Figures 10 to 12 show a method for manufacturing a camera module according to an embodiment.

[0047] The camera module 1 is molded by placing the camera unit 10 and frame portion 20, which are insert parts, into the insert mold 50 shown in Figure 11, and filling the insert mold 50 with insert resin 40 (see Figure 4). The insert mold 50 includes a lower mold 50A and an upper mold 50B.

[0048] As shown in Figure 10, the lower mold 50A has a cavity 51 and engagement holes 52. The cavity 51 is where the camera unit 10 and the frame portion 20 are placed and filled with insert resin 40. The cavity 51 has a reference portion 51A that protrudes from its inner surface and fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10. The cavity 51 also has a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement holes 52 engage with each other via guides (not shown) that are inserted together into the engagement holes 52 of the upper mold 50B.

[0049] As shown in Figure 10, the upper mold 50B has a cavity 51 and an engagement hole 52. The cavity 51 is where the camera unit 10 and the frame portion 20 are placed and filled with insert resin 40. The cavity 51 has a reference portion 51A that protrudes from its inner surface and fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10. The cavity 51 also has a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement holes 52 engage with each other via a guide (not shown) which is inserted together with the engagement hole 52 of the lower mold 50A.

[0050] When the camera unit 10 is placed in the insert mold 50, the frame portion 20 is assembled in advance. Therefore, the camera unit 10 and the frame portion 20 assembled to the camera unit 10 are positioned and placed in the cavities 51 of the lower mold 50A and upper mold 50B by fitting their respective positioning portions 13A and 21A to the reference portions 51A and 51B. In the camera unit 10, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned by the positioning portion 13A, and the optical axis O of the lens 11A is positioned relative to the cavities 51 of the lower mold 50A and upper mold 50B by fitting this positioning portion 13A to the reference portion 51A.

[0051] Then, the lower mold 50A and the upper mold 50B engage their mutual engagement holes 52, thereby positioning the optical axis O of the lens 11A relative to their respective cavities 51, and the camera unit 10 is positioned accordingly.

[0052] As shown in Figure 12, the manufacturing method of the camera module 1 involves assembling the lens unit 11, the imaging substrate 12, and the optical axis reference unit 13 as a camera unit 10 based on the positioning unit 13A in step S1 (see Figure 11). By assembling the camera unit 10 based on the positioning unit 13A of the optical axis reference unit 13, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. Furthermore, in step S1, the camera unit 10 and the frame unit 20 are assembled, and in the internal region IN of the shield case 24, which is partitioned by the shield case 24 and the imaging substrate 12, the internal connection part 22A2 of the connecting fitting 22A in the connector unit 22 is connected to the connection terminal 12B of the imaging substrate 12, and the spring member 22A2b is brought into contact with the outer circumference of the connection terminal 12B to connect the connector unit 22.

[0053] Next, as shown in Figure 12, in step S2, the camera module 1 is positioned in the insert mold 50 by fitting the positioning portion 13A of the camera unit 10 into the reference portion 51A of the insert mold 50 (see Figure 11). As described above, the camera unit 10 is positioned relative to the insert mold 50 by fitting the positioning portion 13A into the reference portion 51A.

[0054] Next, as shown in Figure 12, in step S3, the insert resin 40 is filled into the insert mold 50. The filled insert resin 40 becomes the outer resin 30 of the camera module 1. The outer resin 30 is then fitted together with the positioning portion 13A and the reference portion 51A to form the outer reference portion 31A. Since the reference portion 51A is formed protruding from the inner surface of the cavity 51, the outer reference portion 31A formed at the point where the reference portion 51A is fitted with the positioning portion 13A appears as a recessed trace on the outside of the outer resin 30. In step S3, the insert resin 40 filled into the insert mold 50 covers the outer region OUT of the shield case 24 and enters the inner region IN of the shield case 24 through the through hole 24C, filling the space between the main plate 24A and the imaging substrate 12.

[0055] The insert resin 40 that has entered the internal region IN of the shield case 24 fills the space between the main plate 24A and the imaging substrate 12, and also enters the inside of the wall member 25 within the internal region IN. At this time, as shown in Figure 12, in step S4, the gap D1 between the wall member 25 and the outside of the spring member 22A2b is set to be less than or equal to the gap D2 inside the spring member 22A2b. As a result, the dynamic pressure of the insert resin 40 entering into gap D1 becomes greater than the dynamic pressure trying to enter into gap D2, and this pressure difference generates a force that presses the spring member 22A2b against the connection terminal 12B. Therefore, the spring member 22A2b, in combination with its own elastic force, ensures contact with the connection terminal 12B. Consequently, this camera module 1 does not experience poor contact in the connector portion 22.

[0056] Incidentally, in the shield case 24, each plate piece 24B contacts the peripheral edge of the imaging substrate 12 by elastic force. That is, each plate piece 24B corresponds to a spring member, and the imaging substrate 12 corresponds to the contacted member that the spring member contacts. As shown in Figure 11, the shield case 24 has a spacing D1' between the outside of each plate piece 24B (which is a spring member) and the wall member forming the cavity 51 of the insert mold 50, which is set to be less than or equal to the spacing D2' on the inside of each plate piece 24B. Therefore, the dynamic pressure of the insert resin 40 entering the spacing D1' is greater than or equal to the dynamic pressure entering the spacing D2', and this pressure difference generates a force that presses each plate piece 24B (which is a spring member) against the imaging substrate 12. As a result, each plate piece 24B, in combination with its own elastic force, ensures contact with the imaging substrate 12. Consequently, this camera module 1 does not experience poor contact at the contact point between the shield case 24 and the ground electrode.

[0057] As described above, the electronic device (camera module 1) of this embodiment is characterized by comprising: a spring member 22A2b (or plate piece 24B) that elastically contacts the outer periphery of the contacted member (connection terminal 12B or imaging substrate 12); a wall member 25 (or cavity 51) that surrounds the outside of the spring member 22A2b (or plate piece 24B) and is positioned such that the gap D1 (or gap D1') between the wall member 25 and the outside of the spring member 22A2b (or plate piece 24B) is less than or equal to the gap D2 (or gap D2') inside the spring member 22A2b (or plate piece 24B); and an insert resin 40 that is filled inside the wall member 25 (or cavity 51) so as to cover the area around the spring member 22A2b (or plate piece 24B).

[0058] According to this electronic device (camera module 1), the dynamic pressure of the insert resin 40 that fits into the gap D1 (or gap D1') becomes greater than or equal to the dynamic pressure of the insert resin that fits into the gap D2 (or gap D2'), and this pressure difference generates a force that presses the spring member 22A2b (or plate piece 24B) against the contacted member (connection terminal 12B or imaging substrate 12).

[0059] Conventionally, the spring member 22A2b (or plate piece 24B) may deform due to the pressure of the insert resin 40, but in this embodiment, such a problem does not occur, and contact between the spring member 22A2b (or plate piece 24B) and the contacted member can be ensured. As a result, the electronic device (camera module 1) of this embodiment does not require constraints on materials or molding conditions, and can ensure qualities such as waterproofing, dustproofing, explosion-proofing, and heat dissipation. Moreover, the electronic device (camera module 1) of this embodiment does not require any sealing members or parts to prevent the insert resin 40 from entering between the contacted member and the spring member 22A2b (or plate piece 24B).

[0060] Furthermore, in the electronic device (camera module 1) of this embodiment, the spring member 22A2b (or plate piece 24B) is arranged to surround the contacted member (connection terminal 12B or imaging substrate 12), and the wall member 25 (or cavity 51) is arranged to continuously surround the outside of the spring member 22A2b (or plate piece 24B).

[0061] With this electronic device (camera module 1), since the wall member 25 (or cavity 51) is arranged to continuously surround the outside of the spring member 22A2b (or plate piece 24B), it is possible to prevent the insert resin 40 from entering the contact area between the contacted member and the spring member 22A2b (or plate piece 24B).

[0062] Furthermore, in the electronic device (camera module 1) of the embodiment, the spring member 22A2b is arranged to surround the connection terminal 12B with a notch 22A2bd, and the wall member 25 is arranged to surround the outside of the spring member 22A2b with a notch, which is a through-hole 25A, excluding the notch 22A2bd of the spring member 22A2b.

[0063] In other words, the wall member 25 has a notch, which is a through-hole 25A, that overlaps with the notch 22A2bd of the spring member 22A2b. With this electronic device (camera module 1), since the wall member 25 is arranged to surround the outside of the spring member 22A2b except for the notch 22A2bd of the spring member 22A2b, it is possible to reliably generate a force that presses the spring member 22A2b against the connection terminal 12B, while actively filling the inside and outside of the spring member 22A2b with the insert resin 40. As a result, the quality of waterproofing, dustproofing, explosion-proofing, and heat dissipation can be improved. In this electronic device (camera module 1), the wall member 25 is arranged to surround the outside of the spring member 22A2b with the notch, which is a through-hole 25A, except for at least a part of the notch 22A2bd of the spring member 22A2b. In other words, this electronic device (camera module 1) can achieve the above effect even if the wall member 25 has a through-hole 25A which is a notch that overlaps with at least a portion of the notch 22A2bd of the spring member 22A2b.

[0064] Furthermore, in the electronic device (camera module 1) of the embodiment, the wall member 25 has a through-hole 25A.

[0065] The through-hole 25A referred to herein is formed as a hole, and includes cases where it is formed together with the notch, or where it is formed without the notch. With this electronic device (camera module 1), since the wall member 25 has a through-hole 25A, the insert resin 40 can be actively inserted into and coated on the inside and outside of the spring member 22A2b. As a result, the pressure difference of the dynamic pressure of the insert resin 40 generates a force that presses the spring member 22A2b against the contacted member, improving qualities such as waterproofing, dustproofing, explosion-proofing, and heat dissipation without causing poor contact.

[0066] The manufacturing method for the electronic device (camera module 1) of the embodiment is characterized by comprising: a spring member 22A2b (or plate piece 24B) that elastically contacts the outer periphery of a contacted member (connection terminal 12B or imaging substrate 12); and a wall member 25 (or cavity 51) that surrounds the outside of the spring member 22A2b (or plate piece 24B) and is positioned such that the distance D1 (or distance D1') between the spring member 22A2b (or plate piece 24B) and the outside of the spring member 22A2b (or plate piece 24B) is less than or equal to the distance D2 (or distance D2') inside the spring member 22A2b (or plate piece 24B). The manufacturing method comprises a step of filling the inside of the wall member 25 (or cavity 51) after the step of arranging the spring member 22A2b (or plate piece 24B) and the wall member 25 (or cavity 51).

[0067] According to this manufacturing method for the electronic device (camera module 1), the dynamic pressure of the insert resin 40 entering the gap D1 (or gap D1') is greater than or equal to the dynamic pressure entering the gap D2 (or gap D2'), and this pressure difference generates a force that presses the spring member 22A2b (or plate piece 24B) against the contacted member (connection terminal 12B or imaging substrate 12). As a result, the manufacturing method for the electronic device (camera module 1) of this embodiment does not require constraints on materials or molding conditions, and can ensure qualities such as waterproofing, dustproofing, explosion-proofing, and heat dissipation. Moreover, the manufacturing method for the electronic device (camera module 1) of this embodiment does not require any sealing members or parts to prevent the insert resin 40 from entering between the contacted member and the spring member 22A2b (or plate piece 24B).

[0068] In the embodiment described above, the wall member 25 was configured to extend in the front-rear direction X from the main plate 24A side of the shield case 24 toward the imaging substrate 12 side, as shown in Figure 4. However, the configuration is not limited to this, and as shown in Figure 13, the wall member 25' may extend in the front-rear direction X from the imaging substrate 12 side toward the main plate 24A side of the shield case 24. In this case, as shown in Figure 13, the length of the wall member 25' is set so that it does not come into contact with the main plate 24A of the shield case 24. That is, the wall member 25' is configured to cover the outside of the contact portion 22A2bc and the free end 22A2bb of the spring member 22A2b, thereby preventing the insert resin 40 from entering from there, and generating a force that pushes the insert resin 40 into the spring member 22A2b from the base end 22A2ba side, pressing the spring member 22A2b against the connection terminal 12B. As a result, the electronic device (camera module 1) of the embodiment can reliably ensure contact between the spring member 22A2b and the connection terminal 12B by arranging the wall member 25'.

[0069] Although the electronic device of the embodiment described above was explained using an example where it is applied to the camera module 1, it is not limited to application to the camera module 1 and can be applied to other electronic devices as well. Furthermore, the shape of the spring member 22A2b described above is just one example, and the features of the camera module 1 as an electronic device of the embodiment can be applied to a connecting fitting 22A having a spring member that contacts the outer circumference of the connecting terminal 12B. [Explanation of symbols]

[0070] 1. Camera module (electronic device) 12. Imaging substrate (substrate: non-contact component) 12B Connection terminal (non-contact component) 22A2b Spring component 24B Plate piece (spring component) 25,25' wall parts 51 Cavity (wall component)

Claims

1. A spring member that contacts the outer periphery of the member to be contacted with elastic force, A wall member surrounds the outside of the spring member, and the distance between the wall member and the outside of the spring member is less than or equal to the distance between the inside of the spring member, The insert resin is filled inside the wall member, An electronic device equipped with the following features.

2. The spring member is arranged to surround the member to be contacted, The wall member is arranged to continuously surround the outside of the spring member. The electronic device according to claim 1.

3. The spring member is arranged to surround the contacted member with a notch, The wall member is arranged to surround the outside of the spring member, except for at least a portion of the notch of the spring member. The electronic device according to claim 1.

4. The wall member has a hole, The electronic device according to claim 1.

5. A spring member that contacts the outer periphery of the member to be contacted with elastic force, A wall member surrounds the outside of the spring member, and the distance between the wall member and the outside of the spring member is less than or equal to the distance between the inside of the spring member, A method for manufacturing an electronic device comprising: The process includes, after the step of arranging the spring member and the wall member, filling the inside of the wall member with insert resin. A method for manufacturing electronic devices.

Images