Exothermic structure
The heat dissipation structure addresses substrate stress by using a displaceable heat dissipation member connected via flexible wiring and elastic members, enhancing heat dissipation efficiency and reducing substrate stress.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- JVC KENWOOD CORP
- Filing Date
- 2024-12-19
- Publication Date
- 2026-07-01
AI Technical Summary
The existing heat dissipation structures generate stress on the substrate due to manufacturing errors in the housing opening, causing the heat generating member to be pushed through the dissipation member, leading to substrate stress.
A heat dissipation structure with a heat dissipation member not mounted on the substrate, connected via flexible wiring, and fixed to the housing to be displaceable, using an elastic member between the housing and dissipation member, and a bracket to press the dissipation member towards the housing.
Reduces stress on the substrate by allowing the heat generating member to move freely without loading the substrate, improving heat dissipation efficiency through airflow and heat transfer.
Smart Images
Figure 2026109056000001_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a heat dissipation structure.
Background Art
[0002] There may be a configuration in which a heat dissipation member is fixed to a heat generating member mounted on a substrate disposed inside a housing, thereby dissipating the heat of the heat generating member. For example, the heat dissipation structure of Patent Document 1 has a configuration in which a heat dissipation member is fixed to a heat generating member mounted on a substrate disposed inside a housing, and the heat dissipation member is exposed to the outside of the housing through an opening of the housing.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In the heat dissipation structure of Patent Document 1, for example, when a manufacturing error occurs in the position of the opening of the housing, with the heat dissipation member passing through the opening of the housing, the heat generating member is pushed in through the heat dissipation member by the opening. As a result, there is a problem that stress is generated in the substrate.
[0005] An object of the present disclosure is to solve the above-described problems and provide a heat dissipation structure capable of reducing stress on a substrate.
Means for Solving the Problems
[0006] A heat dissipation structure according to one aspect of the present disclosure is a heat dissipation member that is not mounted on a substrate housed in a housing, is electrically connected to the substrate via a flexible wiring, and is fixed to the housing so as to be displaceable with respect to the housing, and An elastic member disposed between the housing and the heat dissipation member, Equipped with, The elastic member protrudes outward from the side of the housing relative to the side of the housing to which a bracket for fixing the housing to a fixed member is fixed, and with the bracket fixed to the housing, the elastic member presses the heat dissipation member toward the bracket. [Effects of the Invention]
[0007] According to this disclosure, it is possible to provide a heat dissipation structure that can reduce stress on the substrate. [Brief explanation of the drawing]
[0008] [Figure 1] This is a perspective view showing the heat dissipation structure of the embodiment fixed to an electronic device. [Figure 2] This is a view from the Z-axis+ side of the heat dissipation structure of the embodiment, showing it fixed to an electronic device. [Figure 3] This is a view from the X-axis+ side showing the heat dissipation structure of the embodiment fixed to an electronic device. [Figure 4] This is a cross-sectional view taken along the line IV-IV in Figure 2. [Figure 5] This is a view of the heating element of the embodiment as seen from the X-axis + side. [Figure 6] This is a view from the Z-axis+ side showing the heat dissipation structure of the embodiment with the bracket fixed to the electronic device. [Figure 7] This diagram illustrates the arrangement of the second through-holes of the heat dissipation member in the heat dissipation structure of the embodiment. [Figure 8] This diagram shows the arrangement of the heat-generating member, the first bolt, and the second bolt in a heat dissipation structure of another embodiment, as viewed from the X-axis+ side. [Figure 9] This is an XZ cross-sectional view showing a heat dissipation structure of another embodiment fixed to an electronic device. [Modes for carrying out the invention]
[0009] The following describes specific embodiments applying this disclosure with reference to the drawings. However, this disclosure is not limited to the following embodiments, and the following description and drawings have been simplified as appropriate.
[0010] First, the configuration of the heat dissipation structure of this embodiment will be described. For clarity, the following description will use a three-dimensional (XYZ) coordinate system. Figure 1 is a perspective view showing the heat dissipation structure of this embodiment fixed to an electronic device. Figure 2 is a view of the heat dissipation structure of this embodiment fixed to an electronic device, seen from the Z-axis+ side. Figure 3 is a view of the heat dissipation structure of this embodiment fixed to an electronic device, seen from the X-axis+ side. Figure 4 is a cross-sectional view taken along the line IV-IV in Figure 2.
[0011] Here, the positive Y-axis is the back of the electronic device, and the negative Y-axis is the front. The positive X-axis is the right side of the electronic device, and the negative X-axis is the left side. The positive Z-axis is the top side of the electronic device, and the negative Z-axis is the bottom side. In other words, the X-axis direction is the width direction of the electronic device, the Y-axis direction is the front-to-back direction of the electronic device, and the Z-axis direction is the thickness direction of the electronic device.
[0012] As shown in Figures 1 to 4, the heat dissipation structure 1 of this embodiment is suitable for dissipating heat from the electronic device 2 and for fixing the electronic device 2 to a vehicle (not shown), which is a typical example of a fixed member.
[0013] The electronic device 2 is, for example, a car navigation system, a display audio system, or an audio system, as shown in Figures 1 to 4, and includes a housing 2b in which a circuit board 2a and the like are housed, and a monitor (not shown) fixed to the Y-axis end of the housing 2b.
[0014] As shown in Figure 4, a heat-generating component 4 is electrically connected to the circuit board 2a via flexible wiring 3. The heat-generating component 4 is, for example, a power amplifier or a CPU (Central Processing Unit). The heat-generating component 4 is located outside the housing 2b.
[0015] FIG. 5 is a view of the heating member of the present embodiment as seen from the +X axis side. The heating member 4, for example, as shown in FIG. 5, has a substantially rectangular shape when viewed from the X-axis direction, and notch portions 4a with the outer ends on the outer side of the heating member 4 in the Y-axis direction are provided at the +Y-axis end and the -Y-axis end of the heating member 4.
[0016] The heat dissipation structure 1, for example, as shown in FIGS. 1 to 4, includes a heat dissipation member 5, an elastic member 6, a support member 7, a first bolt 8, and a second bolt 9. The heat dissipation member 5 is a so-called heat sink, and for example, it may be an extruded material of a material with excellent thermal conductivity such as aluminum. The heat dissipation member 5, for example, includes a base 5a and heat dissipation fins 5b.
[0017] The base 5a, for example, as shown in FIGS. 1 to 4, has a substantially rectangular shape when viewed from the X-axis direction and is a plate body substantially parallel to the YZ plane. The heat dissipation fins 5b project from the base 5a toward the +X axis side in order to form a plurality of grooves 5c extending in the Z-axis direction at intervals in the Y-axis direction, and are arranged at intervals in the Y-axis direction.
[0018] The heat dissipation fins 5b, for example, as shown in FIGS. 1 to 4, have a substantially rectangular shape when viewed from the Y-axis direction and are a plate body substantially parallel to the XZ plane. The heat dissipation fins 5b extend in the Z-axis direction and, for example, may be arranged substantially over the entire Z-axis direction of the base 5a.
[0019] Such a heat dissipation member 5, for example, as shown in FIGS. 1 and 2, is arranged in a recess 2c formed at the +Y-axis end of the +X-axis side surface of the housing 2b. At this time, the +X-axis end of the heat dissipation fin 5b projects toward the +X axis with respect to a portion 2d on the -Y-axis side from the recess 2c on the +X-axis side surface of the housing 2b.
[0020] The elastic member 6 has a cylindrical shape when viewed from the X-axis direction and extends in the X-axis direction. The elastic member 6 is arranged between the housing 2b and the heat dissipation member 5 as shown in FIGS. 1 to 4. And the elastic members 6 are arranged at intervals in the Y-axis direction and the Z-axis direction.
[0021] As shown in Figure 4, the support member 7 is positioned to cover the heat-generating member 4, which is located on the X-axis side relative to the heat dissipation member 5, from the X-axis side. The support member 7 is, for example, a sheet metal member formed by bending a plate, and is equipped with a female screw portion 7a.
[0022] As shown in Figure 4, the first bolt 8 is threaded into the female threaded portion 7a of the support member 7, passing through the first through hole 5d formed in the base 5a of the heat dissipation member 5 and the notch 4a of the heat heating member 4.
[0023] As a result, the heat-generating element 4 is fixed to the heat-dissipating element 5 by being sandwiched between the base 5a of the heat-dissipating element 5 and the support member 7, as shown in Figure 4. At this time, the X-axis positive side surface of the heat-generating element 4 is in substantially surface contact with the base 5a of the heat-dissipating element 5, either via the heat transfer member or directly.
[0024] As shown in Figure 4, the second bolt 9 is threaded through a second through hole 5e formed in the base 5a of the heat dissipation member 5 and through the elastic member 6, and then screwed into a bolt hole 2f formed in the portion 2e of the recess 2c on the X-axis+ side of the housing 2b. In this way, the heat dissipation member 5, to which the heat generating member 4 is fixed, is fixed to the housing 2b so as to be slidable in the X-axis direction relative to the second bolt 9. In other words, the heat dissipation member 5 is fixed so as to be displaceable relative to the housing 2b.
[0025] In this case, the second bolt 9 should be positioned at the corner of the virtual rectangular region R1 in which the heat-generating member 4 is located, as viewed from the X-axis direction, in order to securely fix the heat dissipation member 5 to the housing 2b in a stable state, as shown in Figure 3. For this reason, the second bolt 9 is positioned on the Z-axis+ side and the Z-axis- side with respect to the heat-generating member 4.
[0026] Furthermore, the second bolt 9 is preferably a stepped bolt, and the stepped portion of the second bolt 9 is in contact with the portion 2e of the recess 2c on the X-axis + side of the housing 2b, thereby applying a desired compressive force to the elastic member 6.
[0027] Furthermore, although the detailed functions will be described later, as shown in Figure 3, the second bolt 9 is preferably positioned so as to overlap with the Y-axis positive end and the Y-axis negative end of the heating element 4 when viewed from the Z-axis direction. For example, when viewed from the Z-axis direction, the second bolt 9 is preferably positioned so as to overlap with the first bolt 8.
[0028] Next, we will describe the state in which the bracket is fixed to the electronic device 2 to which the heat dissipation structure 1 of this embodiment is fixed. Figure 6 is a view from the Z-axis+ side of the state in which the bracket is fixed to the electronic device to which the heat dissipation structure of this embodiment is fixed. The electronic device 2 to which the heat dissipation structure 1 is fixed is fixed to the vehicle via a bracket 10 as shown in Figure 6.
[0029] As shown in Figure 6, for example, the bracket 10 is a bent body with a roughly L-shape when viewed from the Z-axis direction, and is fixed to the Y-axis-side portion 2d of the recess 2c on the X-axis-side side of the housing 2b. At this time, the X-axis-side end of the heat dissipation fin 5b of the heat dissipation member 5 protrudes toward the X-axis-side relative to the said portion 2d of the housing 2b, so the bracket 10 pushes the heat dissipation member 5 toward the X-axis-side.
[0030] Consequently, the heat-generating element 4, which is fixed to the heat dissipation element 5, moves toward the Y-axis. However, since the heat-generating element 4 is not mounted on the substrate 2a and is electrically connected to the substrate 2a via flexible wiring 3, it can move freely together with the heat dissipation element 5 without putting a load on the substrate 2a. Therefore, stress on the substrate 2a can be reduced.
[0031] Furthermore, the elastic member 6 is compressed in the X-axis direction, biasing the heat dissipation member 5 towards the X-axis + side and pressing it against the bracket 10. As a result, the X-axis + side end of the heat dissipation fin 5b of the heat dissipation member 5 makes secure contact with the bracket 10, allowing heat to be transferred from the heat dissipation member 5 to the bracket 10.
[0032] Next, the heat dissipation effect of the heat dissipation structure 1 of this embodiment will be explained. In the heat dissipation structure 1 of this embodiment, as shown in Figure 6, the open portion on the X-axis+ side of the groove 5c in the heat dissipation member 5 is covered by the bracket 10, while the Z-axis+ end and the Z-axis- end of the groove 5c are open. As a result, an upward airflow is generated by the chimney effect, and the heat transferred to the heat dissipation member 5 can be efficiently dissipated.
[0033] Here, Figure 7 is a diagram illustrating the arrangement of the second through-holes of the heat dissipation member in the heat dissipation structure of this embodiment. Note that the heat dissipation member 5 is shown in a simplified manner in Figure 7. The heat from the heat generating member 4 is transferred in the heat dissipation member 5 toward the Z-axis+ side.
[0034] In this case, the heat from the heat-generating element 4 spreads and moves in the heat-dissipating element 5 to both the Y-axis+ and Y-axis- directions. However, if a second through-hole 5e is formed in the region where the heat spreads and moves, the heat transfer is obstructed by the second through-hole 5e, and the heat dissipation efficiency deteriorates.
[0035] Therefore, in this embodiment, as shown in Figure 7, the second through-hole 5e is positioned so as to roughly coincide with the vertical axis L1 extending in the Z-axis direction from the Y-axis-side and Y-axis-side ends of the heating element 4, which is the boundary between the region R2 in which the heat from the heating element 4 moves toward the Z-axis+ side in the heat dissipation element 5 and the region R3 in which the heat from the heating element 4 spreads toward the Y-axis+ and Y-axis- sides in the heat dissipation element 5 while moving toward the Z-axis+ side.
[0036] As a result, when viewed from the Z-axis direction, the second bolt 9 is positioned so as to substantially overlap the Y-axis+ and Y-axis- ends of the heat-generating element 4. This allows the heat from the heat-generating element 4 to not only move toward the Z-axis+ side in the heat-dissipating element 5, but also to spread well toward the Y-axis+ and Y-axis- sides in the heat-dissipating element 5, thereby improving heat dissipation efficiency.
[0037] In this heat dissipation structure 1 of this embodiment, for example, the heat-generating element 4 fixed to the heat dissipation member 5 is not mounted on the substrate 2a, and is electrically connected to the substrate 2a via flexible wiring 3. Therefore, it can move freely together with the heat dissipation member 5 without putting a load on the substrate 2a. As a result, stress on the substrate 2a can be reduced.
[0038] Furthermore, in the heat dissipation structure 1 of this embodiment, if the second bolt 9 is positioned so as to substantially overlap the Y-axis+ end and the Y-axis- end of the heat-generating member 4, the heat from the heat-generating member 4 not only moves toward the Z-axis+ side in the heat dissipation member 5, but also spreads well toward the Y-axis+ and Y-axis- sides in the heat dissipation member 5, thereby improving heat dissipation efficiency.
[0039] Furthermore, in the heat dissipation structure 1 of this embodiment, the open portion on the X-axis+ side of the groove 5c in the heat dissipation member 5 is covered by the bracket 10, while the Z-axis+ end and the Z-axis- end of the groove 5c are open. As a result, an upward airflow is generated by the chimney effect, and the heat transferred to the heat dissipation member 5 can be efficiently dissipated.
[0040] In the above embodiment, the heat dissipation member 5 was fixed to the housing 2b using second bolts 9 positioned on the Z-axis+ and Z-axis- sides relative to the heat generating member 4. However, as shown in Figure 8, the heat dissipation member 5 may also be fixed to the housing 2b using a second bolt 9 positioned on the Z-axis- side relative to the heat generating member 4.
[0041] In this case, as shown in Figure 9, the elastic member 11 positioned on the Z-axis+ side relative to the heat-generating member 4 may be fixed to the housing 2b using the third bolt 12. For example, the elastic member 11, which has a substantially cylindrical shape, has a recess 11a formed at its X-axis+ end for accommodating the bolt head of the third bolt 12. The third bolt 12 can be passed through the inside of the elastic member 11 without passing it through the heat-dissipating member 5, and the bolt head of the third bolt 12 can be accommodated in the recess 11a of the elastic member before being screwed into the housing 2b.
[0042] In the configurations shown in Figures 8 and 9, the second through-hole 5e located in the Z-axis+ region of the heat dissipation member 5 relative to the heat generating member 4 can be omitted. This allows the heat dissipation member 5 to expand toward the Y-axis+ and Y-axis- while not hindering heat transfer toward the Z-axis+ side, thereby improving heat dissipation efficiency.
[0043] For example, in the above embodiment, the heat dissipation structure 1 is placed in a recess 2c formed at the Y-axis-plus end of the X-axis-plus side of the housing 2b of the electronic device 2, but the placement of the heat dissipation structure 1 can be changed as appropriate.
[0044] For example, in the above embodiment, the heat dissipation member 5 was fixed to the housing 2b using the second bolt 9, but the heat dissipation member 5 may also be fixed to the housing 2b using an adhesive or the like.
[0045] For example, in the above embodiment, the substrate 2a and the heating element 4 are directly electrically connected by wiring 3, but other substrates may be placed between the substrate 2a and the heating element 4. In short, it is preferable that the heating element 4 and the substrate are electrically connected by flexible wiring.
[0046] For example, in the above embodiment, the second bolt 9, which is positioned on the Z-axis+ side relative to the heat-generating member 4, is placed at the corner of the virtual rectangular region R1. However, the second bolt 9, which is positioned on the Z-axis+ side relative to the heat-generating member 4, and the second through-hole 5e into which the second bolt 9 is inserted, only need to be positioned in a location that does not obstruct the flow of heat dissipated from the heat-generating member 4. Therefore, the second through-hole 5e may be positioned not only at a location corresponding to the end of the heat-generating member 4 in the Y-axis direction when viewed from the Z-axis direction, but also in the center or other locations.
[0047] For example, the electronic device 2 in the above embodiment may be a car navigation system, a display audio system, or an audio system, but it can be any electronic device that is fixed to a fixed member.
[0048] This disclosure is not limited to this embodiment and may be modified as appropriate without departing from the spirit of the invention. [Explanation of Symbols]
[0049] 1 Heat dissipation structure 2 Electronic device, 2a Circuit board, 2b Enclosure, 2d Y-axis-side portion of the recess on the X-axis+ side of the enclosure 3. Wiring 4. Heat-generating components 5 Heat dissipation component, 5a Base, 5b Heat dissipation fins 5d First through hole 5e Second through hole 6 Elastic members 8. First bolt 9. Second bolt 10 brackets R1 Virtual rectangular region
Claims
1. A heat-generating element is fixed to a circuit board housed in a casing, without being mounted on the circuit board, and is electrically connected to the circuit board via flexible wiring; a heat dissipation element is fixed to the casing so as to be displaceable relative to the casing; An elastic member disposed between the housing and the heat dissipation member, Equipped with, A heat dissipation structure in which the elastic member protrudes outward from the side of the housing relative to the side of the housing to which a bracket for fixing the housing to a fixed member is fixed, and with the bracket fixed to the housing, the elastic member presses the heat dissipation member toward the bracket.
2. The heat dissipation member is a heat sink having a base and a plurality of heat dissipation fins that protrude from the base toward the opposite side of the housing and extend in the vertical direction. The base of the heat dissipation member is fixed to the housing via bolts that pass through the inside of the elastic member. The heat dissipation structure according to claim 1, wherein at least two of the bolts are positioned below the heat-generating member and are located at the corners of a virtual rectangular region in which the heat-generating member is located, as viewed from the thickness direction of the base of the heat-dissipating member.
3. The heat dissipation structure according to claim 2, wherein the bolt is also positioned above the heat generating member.
4. The heat dissipation structure according to any one of claims 1 to 3, wherein, with the bracket fixed to the housing, the heat dissipation fins of the heat dissipation member are in contact with the bracket and heat can be transferred from the heat dissipation member to the bracket.
5. The heat-generating member contacts the surface of the heat-dissipating member on the housing side outside the housing, The heat dissipation structure according to any one of claims 1 to 3, wherein, with the bracket fixed to the housing, the space formed by the base of the heat dissipation member, the heat dissipation fins of the heat dissipation member, and the bracket extends in the vertical direction, and the upper and lower ends of the space are open.