Printed wiring board, electronic circuit board, and method for manufacturing an electronic circuit board

Abstract

This allows the probe to be stably applied to the tip of the terminal inserted through the through-hole. [Solution] A printed circuit board comprising a plate-shaped mounting portion provided with through-holes into which terminals are inserted, and a plate-shaped through-hole forming portion provided with insulating through-holes, wherein, when viewed from the direction of penetration of the through-holes, a part of the edge of the mounting portion and a part of the edge of the through-hole forming portion overlap, and the through-holes and the through-holes overlap.

Description

Technical Field

[0001] The present disclosure relates to a printed wiring board, an electronic circuit board, and a method for manufacturing an electronic circuit board.

Background Art

[0002] For example, Patent Document 1 discloses performing an electrical characteristic inspection by bringing a probe of a measuring instrument into contact with a lead terminal derived from a package of a semiconductor device. The semiconductor device disclosed in Patent Document 1 is provided with a recess having a lead terminal as a bottom surface, and prevents short-circuiting between terminals by a probe of a measuring instrument.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The electrical characteristics of electronic components such as the semiconductor device disclosed in Patent Document 1 may be measured after mounting the electronic component on a printed wiring board. For example, an electrical characteristic inspection may be performed by applying a probe to the tip of a terminal of an electronic component inserted through a through hole of a printed wiring board. Since the semiconductor device disclosed in Patent Document 1 forms the above-described recess as part of the package, when applying a probe to the tip of a terminal protruding from a through hole, the position of the probe cannot be stabilized.

[0005] In view of the above problems, the present disclosure provides a printed wiring board, an electronic circuit board, and a method for manufacturing an electronic circuit board that can stably apply a probe to the tip of a terminal inserted through a through hole.

Means for Solving the Problems

[0006] A printed circuit board according to one aspect of the present disclosure has a plate-shaped mounting portion provided with through-holes into which terminals are inserted, and a plate-shaped through-hole forming portion provided with insulating through-holes, wherein, when viewed from the direction of penetration of the through-holes, a part of the edge of the mounting portion and a part of the edge of the through-hole forming portion overlap, and the through-holes and the through-holes overlap.

[0007] An electronic circuit board according to one aspect of the present disclosure comprises an electronic component having the above-mentioned terminals and the above-mentioned printed wiring board.

[0008] A method for manufacturing an electronic circuit board according to one aspect of the present disclosure comprises a substrate before processing, which includes a mounting portion provided with through-holes into which terminals are inserted, and a through-hole forming portion provided with insulating through-holes and connected to the mounting portion, wherein terminals are inserted into the through-holes and joined, and the mounting portion and the through-hole forming portion are bent around the boundary between the mounting portion and the through-hole forming portion so that the through-holes and the through-holes are superimposed when viewed from the direction of penetration of the through-holes. [Effects of the Invention]

[0009] According to this disclosure, it is possible to stably apply the probe to the tip of the terminal inserted through the through-hole. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic cross-sectional view of the electronic circuit board of this disclosure. [Figure 2] This is a schematic plan view of a substrate before processing used in the manufacturing method of an electronic circuit board according to the present disclosure. [Figure 3] This is a cross-sectional view AA in Figure 2. [Figure 4] This is a schematic diagram illustrating the manufacturing method of the electronic circuit board disclosed herein. [Figure 5] This is a schematic diagram illustrating the manufacturing method of the electronic circuit board disclosed herein. [Figure 6] This is a schematic diagram illustrating the manufacturing method of the electronic circuit board disclosed herein. [Figure 7]This is a schematic cross-sectional view of the printed circuit board of this disclosure. [Modes for carrying out the invention]

[0011] Hereinafter, an embodiment of the printed circuit board, electronic circuit board, and method for manufacturing the electronic circuit board according to this disclosure will be described with reference to the drawings.

[0012] (First Embodiment) The electronic circuit board 1 of this embodiment is not limited to any particular application, but for example, it can be used in electronic equipment produced in small quantities. The electronic circuit board 1 of this embodiment can be used for operational verification and troubleshooting during development and mass production, for example, by manual probing performed by an operator. Probing involves applying a probe to terminals, which will be described later, and inspecting the electrical characteristics of electronic components having terminals.

[0013] As shown in Figure 1, the electronic circuit board 1 of this embodiment comprises a printed wiring board 2 and electronic components 3. The printed wiring board 2 is a substrate on which the electronic components 3 are mounted, and a wiring layer is provided on an insulating board. Note that the wiring layer is omitted in Figure 1. In this embodiment, the printed wiring board 2 has a mounting section 10 and a through-hole forming section 20.

[0014] The mounting section 10 is the area where the through-holes 11 are provided. The mounting section 10 is part of the printed circuit board 2 and is formed in a plate shape. One side of the mounting section 10 is the mounting surface on which the electronic components 3 are mounted. In the following description, the mounting surface of the mounting section 10 will be referred to as the front surface 10a. The side of the mounting section 10 opposite to the front surface 10a will be referred to as the back surface 10b.

[0015] The through-hole 11 is formed so as to penetrate the mounting portion 10 from the front surface 10a to the back surface 10b of the mounting portion 10. The through-hole 11 has the terminal 3a of the electronic component 3 inserted therein. A conductor layer 12 formed by plating or the like is provided on the inner wall surface of the through-hole 11. The terminal 3a inserted into the through-hole 11 is fixed to the mounting portion 10 using solder 30. By fixing the terminal 3a to the mounting portion 10 with the solder 30, the printed wiring board 2 and the conductor layer 12 are electrically connected, and furthermore, the printed wiring board 2 and the electronic component 3 are electrically connected.

[0016] For example, the electronic component 3 has a plurality of terminals 3a. The same number of through-holes 11 as the number of terminals 3a of the electronic component 3 are provided. That is, the mounting portion 10 may be provided with a plurality of through-holes 11. Also, the plurality of through-holes 11 are provided in an arrangement pattern that matches the arrangement pattern of the plurality of terminals 3a. For example, when the electronic component 3 has a D-sub connector and the terminals 3a are provided in the D-sub connector, the plurality of terminals 3a are arranged based on the specifications of the D-sub connector. Therefore, the through-holes 11 are also provided in a number and arrangement based on the specifications of the D-sub connector.

[0017] The through-hole forming portion 20 is a portion where a through-hole 21 is provided. The through-hole forming portion 20 is a part of the printed wiring board 2 and is formed in a plate shape. One side surface of the through-hole forming portion 20 is in surface contact with the back surface 10b of the mounting portion 10. In the following description, the one side surface of the through-hole forming portion 20 that contacts the back surface 10b of the mounting portion 10 is referred to as the back surface 20b. Also, the surface on the opposite side of the back surface 20b of the through-hole forming portion 20 is referred to as the front surface 20a.

[0018] The through-hole 21 is formed so as to penetrate the through-hole forming portion 20 from the front surface 20a to the back surface 20b of the through-hole forming portion 20. The through-hole 21 is arranged so as to overlap the through-hole 11 when viewed from the through direction of the through-hole 11 (the normal direction between the front surface 10a and the back surface 10b). The same number of through-holes 21 as the through-holes 11 are provided. That is, when a plurality of through-holes 11 are provided, a plurality of through-holes 21 are also provided. When viewed from the through direction of the through-hole 11, one through-hole 21 overlaps one through-hole 11.

[0019] In the present embodiment, when viewed from the through direction of the through-hole 11, the central axis of the through-hole 21 coincides with the central axis of the through-hole 11. That is, in the present embodiment, the through-hole 21 is provided coaxially with the through-hole 11. However, when viewed from the through direction of the through-hole 11, the central axis of the through-hole 21 may not coincide with the central axis of the through-hole 11.

[0020] The through-hole 21 has insulation. That is, the wiring layer of the printed wiring board 2 is not exposed on the inner wall surface of the through-hole 21. Also, regarding the front surface 20a and the back surface 20b of the through-hole forming portion 20, at least around the through-hole 21, the wiring layer is not exposed. For example, the entire through-hole forming portion 20 may not include a wiring layer.

[0021] When viewed from the through direction of the through-hole 21, the inner wall surface of the through-hole 21 surrounds the tip portion 3b of the terminal 3a protruding from the through-hole 11. A gap 40 is provided between the inner wall surface of the through-hole 21 and the tip portion 3b of the terminal 3a, thereby forming a recess. The edge portion of the recess formed by this gap 40 can catch the tip of a probe P (see FIG. 6) that contacts the terminal 3a.

[0022] Also, the inner diameter d2 of the through-hole 21 is larger than the inner diameter d1 of the through-hole 11. For example, the through-hole 21 is formed with an inner diameter d2 such that the through-hole forming portion 20 does not interfere with the solder 30. By making the inner diameter d2 of the through-hole 21 larger than the inner diameter d1 of the through-hole 11 in this way, it becomes possible to form a larger gap 40.

[0023] Furthermore, a portion of the edge 22 of the through-hole forming portion 20 is positioned to overlap with a portion of the edge 13 of the mounting portion 10 when viewed from the direction of penetration of the through-hole 11. Hereinafter, a portion of the edge 22 of the through-hole forming portion 20 that is positioned to overlap with a portion of the edge 13 of the mounting portion 10 will be referred to as the overlapping edge 23. Also, a portion of the edge 13 of the mounting portion 10 that is positioned to overlap with the overlapping edge 23 of the through-hole forming portion 20 will be referred to as the overlapping edge 14. In other words, as shown in Figure 1, the mounting portion 10 and the through-hole forming portion 20 are positioned such that the overlapping edge 14 of the mounting portion 10 and the overlapping edge 23 of the through-hole forming portion 20 overlap when viewed from the direction of penetration of the through-hole 11.

[0024] The mounting section 10 and the through-hole forming section 20 are formed by bending the pre-processed substrate 50, as described later, and have the same thickness as the pre-processed substrate 50. In other words, the thickness of the mounting section 10 (dimension from the front surface 10a to the back surface 10b) and the thickness of the through-hole forming section 20 (dimension from the front surface 20a to the back surface 20b) are the same. However, the thickness of the mounting section 10 and the thickness of the through-hole forming section 20 may be different.

[0025] The overlapping edge portion 14 of the mounting portion 10 and the overlapping edge portion 23 of the through-hole forming portion 20 may be at least partially connected. In other words, when the substrate 50 before processing is bent, the overlapping edge portion 14 of the mounting portion 10 and the overlapping edge portion 23 of the through-hole forming portion 20 may not separate, and may remain partially or completely connected. However, the overlapping edge portion 14 of the mounting portion 10 and the overlapping edge portion 23 of the through-hole forming portion 20 may be completely separated.

[0026] For example, the mounting portion 10 and the through-hole forming portion 20 are bonded together by an adhesive layer (not shown) provided between the mounting portion 10 and the through-hole forming portion 20. In other words, in this case, the back surface 10b of the mounting portion 10 and the back surface 20b of the through-hole forming portion 20 are bonded together. However, the fixing of the mounting portion 10 and the through-hole forming portion 20 is not limited to adhesive bonding. For example, the mounting portion 10 and the through-hole forming portion 20 may be fixed together using fastening members or the like.

[0027] As described above, the electronic component 3 is equipped with terminals 3a. In Figure 1, only a portion of terminals 3a is shown, and other parts are omitted. Terminals 3a are, for example, terminals of a D subconnector as described above, and multiple terminals are provided on the electronic component 3. Terminals 3a are inserted from the surface 10a side of the mounting portion 10, and their tip portions 3b are positioned to protrude from the back surface 10b towards the through-hole forming portion 20 side. Furthermore, the tip portion 3b of terminal 3a is also inserted through the through-hole 21 of the through-hole forming portion 20 and protrudes towards the surface 20a side of the through-hole forming portion 20. In other words, in this embodiment, the tip portion 3b of terminal 3a inserted through the through-hole 11 protrudes from the through-hole 21. In this way, the tip portion 3b of terminal 3a protrudes from the through-hole 21, making it possible to easily apply the probe P described later to terminal 3a. However, the tip portion 3b of terminal 3a does not necessarily have to protrude from the through-hole 21.

[0028] Next, the manufacturing method of the electronic circuit board 1 of this embodiment will be described. As shown in Figure 2, a pre-processing substrate 50 is prepared. The pre-processing substrate 50 is a flat substrate before bending, and has a mounting section 10 and a through-hole forming section 20. In the pre-processing substrate 50, the surface 10a of the mounting section 10 and the surface 20a of the through-hole forming section 20 are oriented in the same direction and are located in the same plane. Also, in the pre-processing substrate 50, the back surface 10b of the mounting section 10 and the back surface 20b of the through-hole forming section 20 are oriented in the same direction opposite to the surface 10a and surface 20a, and are located in the same plane.

[0029] The mounting section 10 and the through-hole forming section 20 are connected via a boundary line L (boundary). In other words, the boundary line L is the boundary between the mounting section 10 and the through-hole forming section 20. The substrate 50 before processing has grooves 51, which will be described later, along the boundary line L. However, the grooves 51 are omitted in Figure 2. As shown in Figure 2, in the substrate 50 before processing, the through-holes 11 of the mounting section 10 and the through-holes 21 of the through-hole forming section 20 are arranged symmetrically with respect to the boundary line L.

[0030] As shown in Figure 3, the substrate 50 before processing has a groove 51 along the boundary line L. The groove 51 is provided between the surface 10a of the mounting area and the surface 20a of the through-hole forming area 20. The groove 51 is formed such that its width decreases as it moves from the surface 10a of the mounting area to the back surface 10b (i.e., from the surface 20a of the through-hole forming area 20 to the back surface 20b). In other words, the groove 51 is formed in a shape that narrows as it goes deeper.

[0031] Next, as shown in Figure 4, the terminal 3a is inserted through the through-hole 11 and the terminal 3a is joined with solder 30. Furthermore, as shown in Figure 5, the unprocessed substrate 50 is bent around the boundary line L. Specifically, the unprocessed substrate 50 is bent so that the back surface 20b of the through-hole forming portion 20 is brought closer to the back surface 10b of the mounting portion 10. As a result, each through-hole 11 and through-hole 21 overlap when viewed from the direction of penetration of the through-hole 11. Also, overlapping edges 14 and 23 are formed that overlap when viewed from the direction of penetration of the through-hole 11.

[0032] As the through-hole 11 and the through-hole 21 overlap, the tip 3b of the terminal 3a is accommodated in the through-hole 21. A gap 40 is formed between the terminal 3a and the inner wall surface of the through-hole 21, creating a recess.

[0033] When probing the electronic circuit board 1 of this embodiment manufactured in this manner, as shown in Figure 6, the probe P is brought into contact with terminal 3a such that the edge of the recess formed by the gap 40 contacts the tip of the probe P. At this time, the tip of the probe P catches on the edge of the recess, which makes the probe P more stable than when the probe P is brought into contact with terminal 3a by frictional force alone.

[0034] The printed circuit board 2 in this embodiment, as described above, has a mounting section 10 and a through-hole forming section 20. The mounting section 10 is formed in a plate shape and is provided with through-holes 11 into which terminals 3a are inserted. The through-hole forming section 20 is formed in a plate shape and is provided with insulating through-holes 21. In addition, in the printed circuit board 2 in this embodiment, when viewed from the direction of penetration of the through-holes 11, the overlapping edge 14, which is part of the edge of the mounting section 10, and the overlapping edge 23, which is part of the edge of the through-hole forming section 20, overlap. Also, in the printed circuit board 2 in this embodiment, when viewed from the direction of penetration of the through-holes 11, the through-holes 11 and the through-holes 21 overlap.

[0035] In this embodiment of the printed circuit board 2, the terminal 3a is housed in the through-hole 21, and an insulating barrier is formed around the terminal 3a by the through-hole forming portion 20. Therefore, the probe P can be applied to the through-hole forming portion 20 in addition to the terminal 3a, and the probe P can be made more stable than when the probe P is applied only to the terminal 3a. Thus, the printed circuit board 2 in this embodiment makes it possible to stably apply the probe P to the tip portion 3b of the terminal 3a inserted through the through-hole 11.

[0036] When probing is performed manually by an operator, if the probe P is not stable, even a slight error in the amount of force applied can cause the probe P to slip, impairing the efficiency of the inspection. Furthermore, if the slipping probe P comes into contact with multiple terminals 3a simultaneously, the terminals 3a will short-circuit. In contrast, with the printed circuit board 2 of this embodiment, the probe P can be stably applied to the tip 3b of the terminal 3a, thereby improving the efficiency of the probing and preventing short circuits between terminals 3a.

[0037] Furthermore, in the printed circuit board 2 of this embodiment, the through-hole 11 and the through-hole 21 are arranged coaxially when viewed from the direction of penetration of the through-hole 11. Also, the inner diameter d2 of the through-hole 21 is larger than the inner diameter d1 of the through-hole 11. With the printed circuit board 2 of this embodiment, the gap 40 between the terminal 3a and the inner wall surface of the through-hole 21 can be made larger. As a result, the probe P can be stably fitted into the gap 40, and the stability of the probe P can be improved.

[0038] Furthermore, in the printed circuit board 2 of this embodiment, multiple through-holes 11 are provided in the mounting section 10. In addition, the same number of through-holes 21 as the through-holes 11 are provided in the through-hole forming section 20. Moreover, when viewed from the direction of penetration of the through-holes 11, one through-hole 21 overlaps with one through-hole 11. With the printed circuit board 2 of this embodiment, it is possible to stably apply the probe P to all terminals 3a inserted through the through-holes 11.

[0039] Furthermore, in the printed circuit board 2 of this embodiment, the overlapping edge portion 14 of the mounting portion 10 and the overlapping edge portion 23 of the edge of the through-hole forming portion 20, when viewed from the direction of penetration of the through-hole 11, may be at least partially connected. By connecting the overlapping edge portion 14 of the mounting portion 10 and the overlapping edge portion 23 of the edge of the through-hole forming portion 20, the through-hole forming portion 20 can be positioned more accurately relative to the mounting portion 10.

[0040] Furthermore, in the printed circuit board 2 of this embodiment, the overlapping edge portion 14 of the mounting portion 10 and the overlapping edge portion 23 of the edge of the through-hole forming portion 20, when viewed from the direction of penetration of the through-hole 11, may be separated. If the overlapping edge portion 14 of the mounting portion 10 and the overlapping edge portion 23 of the edge of the through-hole forming portion 20 are separated, the through-hole forming portion 20 can be moved relative to the mounting portion 10, and the terminal 3a can be more reliably accommodated in the through-hole 21 even if there is an error in the position of the through-hole 21.

[0041] Furthermore, the electronic circuit board 1 of this embodiment comprises an electronic component 3 having terminals 3a and the printed wiring board 2 described above. Therefore, the electronic circuit board 1 of this embodiment makes it possible to stably apply the probe P to the tip 3b of terminals 3a that are inserted through the through-hole 11.

[0042] Furthermore, the electronic circuit board 1 of this embodiment has a gap 40 between the terminal 3a and the inner wall surface of the through hole 21. Therefore, the probe P can be fitted into the gap 40 and then applied to the terminal 3a. Accordingly, the electronic circuit board 1 of this embodiment makes it possible to apply the probe P to the tip 3b of the terminal 3a inserted through the through hole 11 more stably.

[0043] Furthermore, in the electronic circuit board 1 of this embodiment, the tip 3b of the terminal 3a inserted through the through-hole 11 protrudes from the through-hole 21. Therefore, according to the electronic circuit board 1 of this embodiment, it is easy to apply the probe P to the terminal 3a.

[0044] Furthermore, in the manufacturing method of the electronic circuit board 1 of this embodiment, terminals 3a are inserted into the through-holes 11 of the substrate 50 before processing and joined. In addition, in the manufacturing method of the electronic circuit board 1 of this embodiment, the mounting portion 10 and the through-hole forming portion 20 are bent around the boundary between the mounting portion 10 and the through-hole forming portion 20 so that the through-holes 11 and the through-holes 21 are overlapped when viewed from the direction of penetration of the through-holes 11.

[0045] In this embodiment of the manufacturing method for the electronic circuit board 1, the terminal 3a is housed in the through-hole 21, and an insulating barrier is formed around the terminal 3a by the through-hole forming portion 20. Therefore, the probe P can be applied to the through-hole forming portion 20 in addition to the terminal 3a, and the probe P can be made more stable than when the probe P is applied only to the terminal 3a. Thus, the manufacturing method for the electronic circuit board 1 in this embodiment makes it possible to stably apply the probe P to the tip portion 3b of the terminal 3a inserted through the through-hole 11.

[0046] Furthermore, in the manufacturing method of the electronic circuit board 1 of this embodiment, the substrate 50 before processing has a groove 51 at the boundary line L. According to this manufacturing method of the electronic circuit board 1 of this embodiment, the substrate 50 before processing can be easily bent.

[0047] (Second Embodiment) Next, a second embodiment of the present invention will be described.

[0048] The printed circuit board 100 of this embodiment has a mounting section 101 and a through-hole forming section 102. The mounting section 101 is formed in a plate shape and is provided with a through-hole 101a into which terminals 200 are inserted. The through-hole forming section 102 is formed in a plate shape and is provided with an insulating through-hole 102a. In addition, in the printed circuit board 100 of this embodiment, when viewed from the direction of penetration of the through-hole 101a, a part of the edge of the mounting section 101 and a part of the edge of the through-hole forming section 102 overlap. In addition, in the printed circuit board 2 of this embodiment, when viewed from the direction of penetration of the through-hole 101a, the through-hole 101a and the through-hole 102a overlap.

[0049] In this embodiment of the printed circuit board 100, the terminal 200 is housed in the through-hole 102a, and an insulating barrier is formed around the terminal 200 by the through-hole forming portion 102. Therefore, the probe P can be applied to the through-hole forming portion 102 in addition to the terminal 200, and the probe P can be made more stable than when the probe P is applied only to the terminal 200. Thus, the printed circuit board 100 in this embodiment makes it possible to stably apply the probe P to the tip of the terminal 200 inserted through the through-hole 101a.

[0050] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications to the structure and details of the present disclosure are possible, as can be understood by those skilled in the art within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0051] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0052] (Note 1) A plate-shaped mounting section provided with through-holes into which terminals are inserted, A plate-shaped through-hole forming part provided with insulating through-holes, It has, When viewed from the direction of penetration of the through-hole, a portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion overlap, and the through-hole and the through-hole overlap. Printed circuit board.

[0053] (Note 2) Viewed from the aforementioned through-direction, the through-hole and the through-hole are arranged coaxially. The inner diameter of the through hole is larger than the inner diameter of the through-hole. Printed circuit board as described in Appendix 1.

[0054] (Note 3) Multiple through-holes are provided in the aforementioned mounting portion. The through-hole forming portion is provided with the same number of through-holes as the through-holes, When viewed from the aforementioned through-direction, one through-hole overlaps with one of the through-holes. Printed circuit board as described in Appendix 1 or 2.

[0055] (Note 4) A portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion that overlap when viewed from the direction of penetration of the through-hole are at least partially connected. A printed circuit board as described in one of the appendices 1 to 3.

[0056] (Note 5) A portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion that overlap when viewed from the direction of penetration of the through-hole are separated. A printed circuit board as described in one of the appendices 1 to 3.

[0057] (Note 6) An electronic component having the aforementioned terminals, A printed circuit board described in any one of the appendices 1 to 5, Equipped with, Electronic circuit board.

[0058] (Note 7) A gap is provided between the terminal and the inner wall surface of the through hole. The electronic circuit board described in Appendix 6.

[0059] (Note 8) The tip of the terminal inserted through the through-hole protrudes from the through-hole. The electronic circuit board described in Appendix 6 or 7.

[0060] (Note 9) The substrate before processing comprises a mounting section with through-holes into which terminals are inserted, and a through-hole forming section with insulating through-holes connected to the mounting section. Insert the terminal into the through-hole and join it, The mounting portion and the through-hole forming portion are bent around the boundary between the mounting portion and the through-hole forming portion so that the through-hole and the through-hole overlap when viewed from the direction of penetration of the through-hole. A method for manufacturing electronic circuit boards.

[0061] (Note 10) The substrate is provided with a groove at its boundary. The method for manufacturing an electronic circuit board as described in Appendix 9.

[0062] (Note 11) After bending the mounting portion and the through-hole forming portion, Viewed from the aforementioned through-direction, the through-hole and the through-hole are arranged coaxially. The inner diameter of the through hole is larger than the inner diameter of the through-hole. A method for manufacturing an electronic circuit board as described in Appendix 9 or 10.

[0063] (Note 12) Multiple through-holes are provided in the aforementioned mounting portion. The through-hole forming portion is provided with the same number of through-holes as the through-holes, After bending the mounting portion and the through-hole forming portion, when viewed from the through-direction, one through-hole overlaps with one of the through-holes. A method for manufacturing an electronic circuit board as described in any of the appendices 9 to 11.

[0064] (Note 13) After the mounting portion and the through-hole forming portion are bent, a portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion that overlap when viewed from the direction of penetration of the through-hole are at least partially connected. A method for manufacturing an electronic circuit board as described in any one of the appendices 9 to 12.

[0065] (Note 14) After the mounting portion and the through-hole forming portion are bent, a portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion that overlap when viewed from the direction of penetration of the through-hole are separated. A method for manufacturing an electronic circuit board as described in any one of the appendices 9 to 12.

[0066] (Note 15) A gap is provided between the terminal and the inner wall surface of the through hole. A method for manufacturing an electronic circuit board as described in any of the appendices 9 to 14.

[0067] (Note 16) After the mounting portion and the through-hole forming portion are bent, the tip of the terminal inserted through the through-hole protrudes from the through-hole. A method for manufacturing an electronic circuit board as described in any of the appendices 9 to 15. [Explanation of Symbols]

[0068] 1. Electronic circuit board 2 Printed circuit board 3 Electronic Components 3a terminal 3b Tip 10 Implementation Section 10a surface 10b back side 11 Through Holes 12 Conductor Layers 13 Edge 14. Overlapping edges 20 Through hole forming part 20a surface 20b back side 21 Through hole 22 Edge 23 Overlapping edges 30 solder 40 gaps 50 Unprocessed circuit board (circuit board) 51 Groove 100 Printed Wiring Boards 101 Implementation Section 101a Through-hole 102 Through hole forming part 102a Through hole 200 terminals L boundary line P Probe: The ○○ device described in Appendix 1.

Claims

1. A plate-shaped mounting section provided with through-holes into which terminals are inserted, A plate-shaped through-hole forming part provided with insulating through-holes, It has, When viewed from the direction of penetration of the through-hole, a portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion overlap, and the through-hole and the through-hole overlap. Printed circuit board.

2. Viewed from the aforementioned through-direction, the through-hole and the through-hole are arranged coaxially. The inner diameter of the through hole is larger than the inner diameter of the through-hole. The printed circuit board according to claim 1.

3. Multiple through-holes are provided in the aforementioned mounting portion. The through-hole forming portion is provided with the same number of through-holes as the through-holes, When viewed from the aforementioned through-direction, one through-hole overlaps with one of the through-holes. A printed circuit board according to claim 1 or 2.

4. A portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion that overlap when viewed from the direction of penetration of the through-hole are at least partially connected. A printed circuit board according to claim 1 or 2.

5. A portion of the edge of the mounting portion and a portion of the edge of the through-hole forming portion that overlap when viewed from the direction of penetration of the through-hole are separated. A printed circuit board according to claim 1 or 2.

6. An electronic component having the aforementioned terminals, A printed circuit board according to claim 1 or 2, Equipped with, Electronic circuit board.

7. A gap is provided between the terminal and the inner wall surface of the through hole. The electronic circuit board according to claim 6.

8. The tip of the terminal inserted through the through-hole protrudes from the through-hole. The electronic circuit board according to claim 6.

9. The substrate before processing comprises a mounting section with through-holes into which terminals are inserted, and a through-hole forming section with insulating through-holes connected to the mounting section. Insert the terminal into the through-hole and join it, The mounting portion and the through-hole forming portion are bent around the boundary between the mounting portion and the through-hole forming portion so that the through-hole and the through-hole overlap when viewed from the direction of penetration of the through-hole. A method for manufacturing electronic circuit boards.

10. The substrate is provided with a groove at its boundary. A method for manufacturing an electronic circuit board according to claim 9.

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