Decomposition apparatus, method for operating the decomposition apparatus, method for regenerating the decomposition apparatus, and method for producing hydrocarbon compounds
By designing a reactor that includes lower and upper components, a packing layer, and a heating device, and utilizing oxygen-containing gas to remove reaction residues, the problem of reaction residue accumulation in fixed-bed reactors is solved, enabling long-term continuous operation and efficient production.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2024-12-23
- Publication Date
- 2026-07-03
AI Technical Summary
Existing fixed-bed reactors are prone to producing carbide byproducts when processing plastics, especially PET and polyvinyl chloride, for extended periods of continuous processing. This leads to the accumulation of reaction residues in the bed, making long-term continuous operation impossible.
A reactor design is adopted, including lower and upper components, a packing layer, a heating device, and a gap structure. The packing layer is heated externally or internally, and after heating is stopped, oxygen-containing gas is used to discharge reaction residues through the gaps. The design of the packing layer, combined with the design of openable and closable gas channels, prevents accumulation.
This enables long-term continuous operation of the reactor, avoids the accumulation of reaction residues, and improves the operational stability and efficiency of the equipment.
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Figure 2026111443000001_ABST
Abstract
Description
[Technical Field]
[0001] This disclosure relates to a decomposition apparatus, a method for operating a decomposition apparatus, a method for regenerating a decomposition apparatus, and a method for producing hydrocarbon compounds. [Background technology]
[0002] One method of recycling waste plastics is chemical recycling, which involves decomposing waste plastics, monomerizing and gasifying them, or using them as blast furnace reducing agents or coke oven raw materials. For example, a fluidized bed reactor is generally used in continuous reactors that use mixed plastics containing polyolefins as raw materials to obtain basic chemicals in a single stage without going through intermediate products such as pyrolysis oils.
[0003] Patent Document 1 discloses that a plastic powder, which is a mixture of polyolefins, polystyrene, polyethylene terephthalate (PET), etc., is supplied to a fluidized bed reactor and decomposed to obtain olefins from C2 to C4, the heating medium in the fluidized bed is a mixture of used FCC catalyst and ZSM-5, and these catalysts may contain binder materials such as alumina or silica.
[0004] As a reactor with a simpler structure than a fluidized bed reactor, it is also known that fixed-bed reactors can be used to perform the thermal decomposition of plastics. Patent document 2 discloses examples of decomposing small amounts of plastics such as polyethylene, polypropylene, PET, and polystyrene in a batch-type fixed-bed reactor. However, with conventional fixed-bed reactors, when continuously heat-treating raw materials, especially plastics such as PET and polyvinyl chloride that tend to produce carbides as by-products, or waste plastics containing inorganic solids, reaction residue accumulates on the fixed bed as the operating time increases, making long-term continuous operation impossible. [Prior art documents] [Patent Documents]
[0005] [Patent Document 1] Special Publication No. 2016-513147 [Patent Document 2] Japanese Patent Publication No. 2024-138201 [Overview of the project] [Problems that the invention aims to solve]
[0006] The purpose of this disclosure is to provide a decomposition apparatus that can operate for a long period of time without the accumulation of reaction residue inside the reactor. [Means for solving the problem]
[0007] The means to solve the aforementioned problem are as follows: <1> A reactor having a lower member and an upper member having a supply section for supplying a material to be processed inside, A filler layer placed inside the reactor, A heating section, which is located outside or inside the reactor, heats the filler layer, A through hole located at the bottom of the lower member of the reactor, The gap formed between the lower member and the upper member, It is a disassembly device equipped with [a specific feature]. <2> The lower member and the upper member are cylindrical in shape, <1> This is the disassembly device described in [the document]. <3> The area of the region defining the interior of the upper member on the bottom surface of the upper member is greater than the area of the region defining the outer shape of the lower member on the top surface of the lower member. <1> or the above <2> This is the disassembly device described in [the document]. <4> The upper member has an inert gas supply unit that supplies an inert gas, <1> From the above <3> It is a disassembly device as described in any one of the items. <5> The upper member comprises a disperser having a through-hole through which the inert gas flows, and an openable / closable shutter that can open and close the through-hole of the disperser, <4> This is the disassembly device described in [the document]. <6> The filler layer is a fixed floor, <1> From the above <5> It is a disassembly device as described in any one of the items. <7> The heating unit is located outside the reactor, <1> From the above <6> It is a disassembly device as described in any one of the items. <8> The upper surface of the upper member has the processing material supply unit and the inert gas supply unit, <4> This is the disassembly device described in [the document]. <9> The through hole is connected to a tank containing oxygen-containing gas. <1> From the above <8> It is a disassembly device as described in any one of the items. <10> The upper surface of the upper member has the inert gas supply unit, The supply unit is located on the side surface of the upper member that connects the upper surface of the upper member and the bottom surface of the upper member, <4> This is the disassembly device described in [the document]. <11> The process involves supplying the material to be processed from the supply unit into the interior of a reactor having a lower member and an upper member having a supply unit for supplying the material to be processed inside, The filler layer, which is placed inside the reactor, is brought into contact with the object to be processed, while the filler layer is heated in a heating unit located outside or inside the reactor. A gas containing oxygen is supplied to the inside of the reactor, where heating has been stopped, from the through-hole of the oxygen supply unit having a through-hole located at the bottom of the lower member of the reactor, The reaction residue generated from the material to be processed inside the reactor is discharged from the reactor after heating has been stopped, using an oxygen-containing gas, through the gap formed between the lower member and the upper member. This is a method for operating a disassembly apparatus, including [specific details omitted]. <12> The aforementioned <11> Including the operating method of the disassembly apparatus described above, This is a method for regenerating a disassembly device. <13> The process involves supplying the material to be processed from the supply unit into the interior of a reactor having a lower member and an upper member having a supply unit for supplying the material to be processed inside, The filler layer, which is placed inside the reactor, is brought into contact with the object to be processed, while the filler layer is heated in a heating unit located outside or inside the reactor. Discharging reaction residues generated from the object to be processed inside the reactor from inside the reactor where the heating has been stopped using a gas containing oxygen from the gap formed between the lower member and the upper member; Contacting the object to be processed with the heated filler layer inside the reactor to produce hydrocarbon compounds; A method for producing hydrocarbon compounds including this. <14>The method for producing hydrocarbon compounds according to <13>, wherein the hydrocarbon compound is a hydrocarbon compound having 1 to 10 carbon atoms.
Advantages of the Invention
[0008] According to an embodiment of the present disclosure, it is possible to provide a decomposition device in which reaction residues do not accumulate in the reactor and can be operated for a long time.
Brief Description of the Drawings
[0009] [Figure 1A] FIG. 1A is a schematic cross-sectional view showing an example of a decomposition device according to a first embodiment of the present disclosure. [Figure 1B] FIG. 1B is a block diagram showing an example of a control unit of the decomposition device according to the first embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an example of a decomposition device according to a second embodiment of the present disclosure. [Figure 3] FIG. 3 is an example of a flowchart of an operation method of a decomposition device according to an embodiment of the present disclosure. [Figure 4] FIG. 4 is an example of a flowchart of a method for producing hydrocarbon compounds according to an embodiment of the present disclosure.
Modes for Carrying Out the Invention
[0010] The disassembly apparatus and disassembly method according to the embodiments of this disclosure will be described in detail with reference to the drawings. However, the embodiments described below are illustrative examples of disassembly apparatus and disassembly method for realizing the technical concept of this disclosure and are not limited to those described below, and can be modified as appropriate without departing from the gist of this disclosure.
[0011] Furthermore, the dimensions, materials, shapes, numbers, and relative arrangements of the components described in the embodiments are merely illustrative examples and not intended to limit the scope of this disclosure unless otherwise specified. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for clarity. Also, in the following description, the same name and reference numeral indicate the same or identical components, and detailed explanations are omitted as appropriate. To avoid overly complex drawings, schematic diagrams may be used with some elements omitted, or end views showing only the cross-section may be used as cross-sectional views.
[0012] Furthermore, in this disclosure, the term "polygon" refers to polygons such as rectangles, triangles, and quadrilaterals, including shapes where the corners of the polygon have been rounded, chamfered, or otherwise modified. Similarly, shapes where modifications have been made not only to the corners (ends of the sides) but also to the middle parts of the sides will also be referred to as polygons. In other words, shapes that retain the shape of a polygon but have been partially modified are included in the interpretation of "polygon" as described in this disclosure.
[0013] Furthermore, the same applies not only to polygons, but also to terms describing specific shapes such as cylinders, rectangular prisms, trapezoids, circles, and tapered shapes. The same also applies when dealing with each side that forms such a shape. In other words, even if a side has been processed at a corner or in the middle, the interpretation of "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."
[0014] Furthermore, the following description uses terms to indicate specific directions or positions as needed (e.g., "up," "down," "side," "top surface," "bottom surface," "side," "X," "Y," "Z," and other terms including these terms). However, the use of these terms is solely to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the invention. For example, if "top surface" is mentioned, the invention must not always be used in a way that it faces upwards.
[0015] Furthermore, in this specification, the "~" symbol indicating a numerical range means that the values before and after it are included as the lower and upper limits, respectively, unless otherwise specified.
[0016] (disassembly equipment) <First Embodiment> A disassembly apparatus according to the first embodiment of this disclosure comprises a reactor having a lower member and an upper member having a material supply unit for supplying a material to be processed to the inside; a filler layer disposed inside the reactor; a heating unit disposed outside or inside the reactor for heating the filler layer; a through hole disposed at the bottom of the lower member of the reactor; and a gap formed between the lower member and the upper member. The disassembly apparatus according to one embodiment may further comprise other members as needed.
[0017] Figure 1A is a schematic cross-sectional view showing an example of a decomposition apparatus according to the first embodiment of the present disclosure. The decomposition apparatus 100 comprises a reactor 1, a heating section 2, a filler layer 3, a gap 4, a material to be processed supply section 5, and a through hole 6.
[0018] The direction in which the filler in filler layer 3 accumulates due to its own weight is defined as the Y-axis direction, the direction approximately perpendicular to the Y-axis direction is defined as the X-axis direction, and the direction approximately perpendicular to both the X-axis and Y-axis directions is defined as the Z-axis direction. The X-axis, Y-axis, and Z-axis are mutually orthogonal.
[0019] In this disclosure, "approximately orthogonal" is not limited to 90°, but allows for a difference of 90° ± 5°.
[0020] <<Reactor 1>> The reactor 1 is configured to accommodate a filler layer 3 and a material to be processed 11, and comprises a lower member 1A and an upper member 1B having a supply section for supplying the material to be processed. The lower member 1A is a member that contains at least a filler layer inside, and the upper member 1B is a member having a supply section for supplying the material to be processed inside.
[0021] There are no particular restrictions on the shapes of the lower member 1A and the upper member 1B, and they can be appropriately selected according to the purpose, for example, cylindrical or polygonal shapes. The shape refers to the shape of the cross-section of the reactor 1 in the plane formed in the X-axis and Z-axis directions of the reactor 1.
[0022] The area of the region defining the interior of the upper member 1B on the bottom surface of the upper member 1B is larger than the area of the region defining the outer shape of the lower member 1A on the top surface of the lower member 1A.
[0023] The upper member 1B includes a disperser 41 having through-holes through which inert gas 31 flows, and an openable / closable shutter 8 that can open and close the through-holes of the disperser 41. When the decomposition device 100 is in operation, the openable / closable shutter 8 is open, supplying the material to be processed 11 and inert gas 31 into the reactor 1. When the decomposition device 100 is stopped, the openable / closable shutter 8 is closed, preventing fillers and reaction residues from flowing back into the inert gas supply unit 7 when oxygen-containing gas 40 is circulated from the tank 9 into the reactor 1.
[0024] In the decomposition apparatus 100 according to the first embodiment, the upper member 1B has an inert gas supply unit 7 and a material to be processed supply unit 5 on its upper surface.
[0025] The material of the reactor 1 is not particularly limited, as long as it is stable in terms of surface temperature and atmosphere on the inside of the reactor 1, that is, on the side where the material to be processed 11 is contained.
[0026] For example, if the inside of the reactor 1 is a nitrogen gas atmosphere and the inner surface temperature of the reactor 1 is 400°C or less, the material of the reactor 1 can be metals such as iron (Fe) and titanium (Ti); inorganic compounds such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), and mullite (3Al2O3·2SiO2) or ceramics thereof; or alloys such as stainless steel, Inconel (INCONEL®), and Hastelloy (HASTELLOY®). These may be used individually or in combination of two or more. Among these, when the inside of the reactor 1 is a nitrogen gas atmosphere and the inner surface temperature of the reactor 1 is 400°C or less, from the viewpoint of material cost, iron (Fe) and general stainless steels such as SUS304, SUS304L, SUS316, and SUS316L are preferred as the material of the reactor 1.
[0027] For example, if the inside of reactor 1 is a nitrogen gas atmosphere and the inner surface temperature of reactor 1 is between 400°C and 700°C, the material of reactor 1 may be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as stainless steel (e.g., SUS316L, SUS310S, etc.), Inconel (INCONEL®), Hastelloy (HASTELLOY®).
[0028] For example, if the inside of reactor 1 is a nitrogen gas atmosphere and the inner surface temperature of reactor 1 is between 700°C and 950°C, the material of reactor 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as SUS310S (INCONEL®) or Hastelloy (HASTELLOY®).
[0029] For example, if the inside of the reactor 1 is a steam atmosphere and the inner surface temperature of the reactor 1 is 700°C or less, the material of the reactor 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as stainless steel (e.g., SUS316, SUS316L, SUS310S, etc.), Inconel®, Hastelloy®, etc.
[0030] For example, if the inside of reactor 1 is a steam atmosphere and the inner surface temperature of reactor 1 is between 700°C and 950°C, the material of reactor 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as Inconel® or Hastelloy®.
[0031] The shape, structure, and size of the reactor 1 are not particularly limited, as long as they are capable of accommodating the filler layer 3 and the material to be processed 11.
[0032] Examples of the shape of reactor 1 include cylindrical, rectangular, conical, and frustoconical shapes.
[0033] The size of the reactor 1 is not particularly limited, as long as it has a length and inner diameter that can accommodate the filler layer 3 and the material to be processed 11.
[0034] <<Heating section 2>> The heating section 2 is a component that heats the filler layer 3. The structure, shape, material, and size of the heating section 2 are not particularly limited as long as they can heat the reactor 1, and can be appropriately selected according to the purpose.
[0035] There are no particular restrictions on the heating method of the heating unit 2. The heating unit 2 may be located outside the reactor and the reactor 1 may be heated by external heat transfer, or the heating unit 2 may be located inside the reactor and the reactor 1 itself may be heated. For example, a known electric furnace can be used as the heating unit 2 in the external heating method. For example, a resistance heating method can be used in which two electrodes are attached to a resistor placed inside the reactor 1 in contact with the filler layer 3, and heat is generated by applying a voltage between the electrodes. Alternatively, if the filler layer 3 is a fixed bed, the filler layer 3 itself can be made into a resistor by using a conductive material as the filler constituting the filler layer 3.
[0036] The temperature of reactor 1 can be measured by inserting a thermocouple into the center of reactor 1.
[0037] <<Filler layer 3>> The filler layer 3 is formed by filling the reactor 1 with filler. In the first embodiment, the filler layer 3 is a fixed bed.
[0038] The filler layer 3 preferably has a certain amount of voids to ensure a flow path for the material to be treated 20 and the inert gas when the material to be treated 20 is thermally decomposed. There are no particular restrictions on the void ratio φ of the filler layer 3, and it can be set appropriately depending on the properties of the material to be treated 20 used, the conditions for thermal decomposition of the material to be treated 20, etc. However, from the viewpoint of ensuring a sufficient flow path for the material to be treated 20 and the inert gas and ensuring sufficient contact between the filler and the material to be treated 20, a void ratio of 20% to 80% is preferred, 30% to 70% is more preferred, and 40% to 60% is even more preferred.
[0039] In this disclosure, "porosity φ" is the proportion of voids in the filler layer 3, and is determined based on the following formulas 1 and 2. [Formula 1] Porosity φ(%)=(1-Vs / V)×100 (In Equation 1, "Vs" is the volume of the filler (cm³) calculated in Equation 2 below.) 3 ) indicates that "V" is the volume of the filler layer (cm³). 3 This shows the volume of the filler layer 3, which is the volume of the filler-filled section in the reactor 1. [Formula 2] Vs = Wf / TD (In Equation 2, "Wf" represents the mass (g) of the filler packed into filler layer 3, and "TD" represents the true density (g / cm³) of the filler.) 3 ) indicates. )
[0040] There are no particular restrictions on the shape and structure of the filler layer 3, and they can be appropriately selected according to the purpose. However, from the viewpoint of allowing the material to be processed 20 and the generated chemicals to flow smoothly and ensuring sufficient contact time between the material to be processed 20 and the filler, it is preferable that the flow direction of the material to be processed 20 is perpendicular to the flow direction, i.e., longer than the inner diameter of the reactor.
[0041] -Filler- The filler is used to maintain a constant temperature in the reaction system during the thermal decomposition of the material to be processed 20.
[0042] There are no particular restrictions on the filler, and it can be appropriately selected according to the purpose. However, it is preferable that the filler is a material that is stable in the thermal decomposition temperature range when the material to be treated 20 is thermally decomposed, is not reduced by by-products such as carbon and hydrogen generated by the thermal decomposition of the material to be treated 20, and does not react with inert gas. Furthermore, it is preferable that the filler is a material that is stable when "supplying an oxygen-containing gas S103" is performed, as described later.
[0043] Specific examples of fillers include zirconium oxide, yttria-stabilized zirconium oxide, calcia-stabilized zirconium oxide, magnesium oxide, calcium oxide, silicon carbide, silicon nitride, silicon oxide, aluminum oxide, tantalum oxide, niobium oxide, beryllium oxide, lanthanum oxide, manganese(II) oxide, chromium(III) oxide, gallium oxide, silica sand, forstenite, and cordierite. Furthermore, the filler may be a surface-treated version of the above materials for purposes such as surface deactivation or improvement of the fluidity of the object to be treated 20. These may be used individually or in combination of two or more. Among these, it is preferable to use one or more of silicon carbide, aluminum oxide, silicon oxide, or surface-treated versions thereof as fillers. More preferably, one or more selected from the group consisting of silicon carbide and aluminum oxide is used, having an inert surface that does not catalyze the oxidative decomposition reaction between water vapor and hydrocarbons and the carbon deposition reaction, and possessing good thermal conductivity.
[0044] There are no particular restrictions on the surface-treated filler, and it can be appropriately selected according to the purpose. Examples include fillers having an oxide film on the surface and fillers having a carbon film on the surface. Among these, fillers having a carbon film on the surface are preferred as surface-treated fillers because they are less likely to generate active sites due to surface treatment and can prevent side reactions.
[0045] There are no particular restrictions on the method for surface-treating the filler, and any known method can be appropriately selected.
[0046] For example, when preparing a filler having an oxide film on its surface, one method is to form an oxide film on the surface of the filler by oxidation.
[0047] Furthermore, when producing a filler having a carbon film on its surface, one method involves attaching an organic compound to the surface of the filler, followed by firing in the presence of an inert gas to form the carbon film. When producing a filler having a carbon film on its surface, it is preferable to use organic compounds such as hydroxycarboxylic acid, sucrose, hydroxypropyl cellulose, or carboxymethyl cellulose, from the viewpoint of easily forming a uniform and homogeneous carbon film.
[0048] There are no particular restrictions on the hydroxycarboxylic acid, and it can be appropriately selected depending on the purpose. Examples include malic acid, citric acid, tartaric acid, gallic acid, and salicylic acid. These may be used individually or in combination of two or more.
[0049] The structure of surface-treated fillers can be confirmed, for example, by observation using a scanning electron microscope (SEM), a transmission electron microscope (TEM), X-ray photoelectron spectroscopy (XPS), or micro-Raman spectroscopy.
[0050] In a filler having a carbon film on its surface, there are no particular restrictions on the coverage rate of the filler by the carbon film, and it can be appropriately selected according to the purpose. However, the mass ratio [carbon / filler] of carbon forming the carbon film to the filler is preferably 0.0001 or more and 0.5 or less, more preferably 0.001 or more and 0.1 or less, even more preferably 0.001 or more and 0.1 or less, and particularly preferably 0.002 or more and 0.08 or less. When the mass ratio [carbon / filler] is 0.0001 or more and 0.5 or less, the material to be treated 20 can be efficiently thermally decomposed in the thermal decomposition temperature range when the material to be treated 20 is thermally decomposed while effectively assisting contact between the fillers. The mass ratio [carbon / filler] is calculated from the mass of the organic compound that serves as the carbon source in a filler having a carbon film on its surface and the mass of the filler. Therefore, the coverage of the filler by the carbon film may be complete coverage or partial coverage. Therefore, the carbon film includes not only layered structures but also those that appear as sea-island-like structures when observed on the surface.
[0051] In fillers having a carbon film on their surface, the coverage rate of the filler by the carbon film can be determined by methods such as calculating it from the amount of material used, or by analyzing the weight change of the carbon film based on weight changes using thermogravimetric differential thermal analysis (TG-DTA).
[0052] There are no particular restrictions on the size of the filler, and it can be appropriately selected according to the purpose, but a nominal mesh opening of 90 μm to 125 mm is preferred, and 125 μm to 90 mm is more preferred. The size of the filler should be measured in accordance with JIS Z 8801-1:2019.
[0053] There are no particular restrictions on the shape and structure of the filler, and it can be appropriately selected according to the purpose. However, the shape of the filler is preferably such that the molten material of the object to be processed 20 does not easily accumulate on the filler, and a spherical shape is preferred, with a perfectly spherical shape being more preferred.
[0054] <Gap 4> The gap 4 is formed between the lower member 1A and the upper member 1B in the reactor 1, and discharges the reaction residue after the material to be processed 11 has reacted. After the decomposition device 100 is stopped, oxygen-containing gas 40 is circulated from the tank 9 into the reactor 1 through the through hole 6, allowing the reaction residue accumulated on the filler layer 3 to be discharged through the gap 4.
[0055] The width W1 of the gap 4 is not particularly limited as long as it can discharge the reaction residue, and can be appropriately selected according to the purpose, but it is preferable that it be less than or equal to the minimum value of the particle size distribution of the filler.
[0056] <<Processing Material Supply Unit 5>> The material to be processed supply unit 5 is connected to the reactor 1 and supplies the material to be processed 11 to the reactor 1. The inert gas supply unit 7 is located on the upper surface of the upper member 1B.
[0057] In this disclosure, "connection" of the material to be processed supply unit 5 to the reactor 1 means that the inside of the material to be processed supply unit 5 and the inside of the reactor 1 are in communication so that the material to be processed 11 can pass through them.
[0058] There are no particular restrictions on the material of the material supply unit 5 to be processed; for example, it can be appropriately selected from the same materials as those used for the reactor 1, depending on the purpose.
[0059] The shape, structure, and size of the material supply unit 5 are not particularly limited as long as it can be connected to the reactor 1 and supply the material to be processed 11 to the reactor 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the reactor 1 has an opening, this opening can be used as the material supply unit 5. The material to be processed 11 is not particularly limited as long as it is plastic, but it is preferably an industrially discarded waste plastic composition.
[0060] <Through hole 6> The through-hole 6 is located at the bottom of the lower member 1A of the reactor 1 and is connected to a tank 9 containing oxygen-containing gas 40. After the decomposition device 100 is stopped, the oxygen-containing gas 40 is circulated from the tank 9 into the reactor 1 through the through-hole 6, allowing the reaction residue accumulated on the filler layer 3 to be discharged through the gap 4. In addition, circulating the oxygen-containing gas 40 can promote the combustion of the reaction residue.
[0061] The inner diameter of the through-hole 6 is not particularly limited as long as oxygen-containing gas 40 can be passed through it, and can be appropriately selected according to the purpose. However, from the viewpoint of preventing the filler from falling out of the filler layer 3, it is preferable that the inner diameter is less than or equal to the minimum value of the particle size distribution of the filler.
[0062] The shape, structure, and size of the tank 9 are not particularly limited as long as it can be connected to the reactor 1 via the through-hole 6 and supply oxygen-containing gas to the reactor 1. They can be appropriately selected according to the purpose, for example, cylindrical or rectangular.
[0063] -Oxygen-containing gas 40- The oxygen content of the oxygen-containing gas 40 is not particularly limited as long as it contains oxygen, and can be appropriately selected according to the purpose, but it is preferably 1 volume% or more, more preferably 5 volume% or more, and particularly preferably 20 volume% or more.
[0064] <Inert gas supply unit 7> The inert gas supply unit 7 is connected to the reactor 1 and supplies inert gas 31 to the reactor 1. The inert gas supply unit 7 is located on the upper surface of the upper member 1B.
[0065] In this disclosure, "connection" of the inert gas supply unit 7 to the reactor 1 means that the inside of the inert gas supply unit 7 and the inside of the reactor 1 are in communication so that the inert gas 31 can pass through them.
[0066] There are no particular restrictions on the material of the inert gas supply unit 7; for example, it can be appropriately selected from the same materials as those used for the reactor 1, depending on the purpose.
[0067] The shape, structure, and size of the inert gas supply unit 7 are not particularly limited as long as it can be connected to the reactor 1 and supply inert gas 31 to the reactor 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Furthermore, if a part of the reactor 1 has an opening, this opening can also be used as the inert gas supply unit 7.
[0068] The location of the inert gas supply unit 7 is not particularly restricted as long as it can be connected to the reactor 1, and can be appropriately selected depending on the type of material to be processed 11.
[0069] Note that the material to be processed supply unit 5 and the inert gas supply unit 7 may be the same. That is, a single component located at the same position may be both the material to be processed supply unit 5, which supplies the material to be processed 11 to the reactor 1, and the inert gas supply unit 7, which supplies the inert gas 31 to the reactor 1. In this case, both the material to be processed supply rate adjustment unit 14 and the inert gas supply rate adjustment unit 15, which will be described later, are a single component located at the same position.
[0070] -Inert gas 31- There are no particular restrictions on the type of inert gas used; it can be appropriately selected according to the purpose. Examples include noble gases such as argon, nitrogen gas, and water vapor. These may be used individually or in combination of two or more.
[0071] <<Other components>> Other components are not particularly limited as long as they do not impair the effectiveness of the decomposition apparatus according to the first embodiment of this disclosure. Examples include a temperature sensor 13, a processing material supply rate adjustment unit 14, an inert gas supply rate adjustment unit 15, a processing material supply rate sensor 16, an inert gas supply rate sensor 17, and a control unit 200.
[0072] -Temperature sensor 13- The temperature sensor 13 measures the temperature of the filler layer 3. The temperature detection signal from the temperature sensor 13 is preferably transmitted to the first temperature controller 206a of the control unit 200. The decomposition apparatus 100 is preferable because it has a temperature sensor 13, which allows the first temperature controller 206a to provide feedback control over the temperature of the filler layer 3.
[0073] There are no particular restrictions on the temperature sensor 13, as long as it can accurately measure the temperature of the filler layer 3. Although the diagram here illustrates a configuration in which the temperature sensor 13 measures the temperature by contacting the filler layer 3, it is not limited to this configuration, and the temperature sensor 13 may measure the temperature without contacting the filler layer 3.
[0074] If the temperature sensor 13 measures temperature by contacting the filler layer 3, examples include thermocouples and platinum thermometers.
[0075] If the temperature sensor 13 measures temperature without contact with the filler layer 3, examples include a radiation thermometer and an infrared thermography camera.
[0076] - Processing object supply speed adjustment unit 14 - The material to be processed supply rate adjustment unit 14 adjusts the supply rate at which the material to be processed supply unit 5 supplies the material to be processed 11 to the reactor 1, or stops the material to be processed supply unit 5 from supplying the material to be processed 11 to the reactor 1.
[0077] For example, a known pump, cock, screw feeder, etc., can be used as the material supply speed adjustment unit 14.
[0078] The rate at which the material to be processed 11 is supplied to the reactor 1 by the material to be processed supply rate adjustment unit 14 can be adjusted by the material to be processed supply rate controller 206b of the control unit 200, which will be described later.
[0079] -Processing material supply speed sensor 16- The processing material supply speed sensor 16 measures the supply speed of the processing material 11 by the processing material supply speed adjustment unit 14. The processing material supply speed sensor 16 is not particularly limited as long as it can accurately measure the supply speed of the processing material 11 by the processing material supply speed adjustment unit 14; for example, a known flow sensor for solids or liquids can be used.
[0080] The supply speed detection signal from the material supply speed sensor 16 is suitably transmitted to the material supply speed controller 206b of the control unit 200. The decomposition apparatus 100 is preferable because it has a material supply speed sensor 16, which improves the yield of the product 12 and minimizes the power consumption of the filler layer 3, and the material supply speed controller 206b can provide feedback control of the supply speed of the material supply unit 5.
[0081] -Inert gas supply rate adjustment unit 15- The inert gas supply rate adjustment unit 15 adjusts the supply rate at which the inert gas supply unit 7 supplies inert gas 31 to the reactor 1, or stops the supply of inert gas 31 to the reactor 1 by the inert gas supply unit 7.
[0082] For example, a known pump, a cock, etc., can be used as the inert gas supply rate adjustment unit 15.
[0083] The rate at which the inert gas 31 is supplied to the reactor 1 by the inert gas supply rate adjustment unit 15 can be adjusted by the controller 206 of the control unit 200 using the inert gas supply rate controller 206c.
[0084] -Inert gas supply rate sensor 17- The inert gas supply rate sensor 17 measures the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 15. The inert gas supply rate sensor 17 is not particularly limited as long as it can accurately measure the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 15; for example, a known flow sensor for liquids or gases can be used.
[0085] -Control Unit 200- Figure 1B is a block diagram showing an example of a control unit for a disassembly apparatus according to the first embodiment of this disclosure.
[0086] The control unit 200 appropriately controls each component of the decomposition apparatus 100. For example, depending on the type of material to be processed 11, it controls each component based on processing recipe data 208, which consists of processing conditions such as the temperature of the heating unit 2, the temperature of the filler layer 3, and the rate at which the material to be processed 11 is supplied to the reactor 1 by the material supply rate adjustment unit 14.
[0087] The control unit 200 includes, for example, a CPU (Central Processing Unit) 201, a memory 202, a display unit 203, an input / output unit 204, a communication unit 205, various controllers 206, and a storage unit 207.
[0088] --CPU201-- The CPU 201 reads various programs and data necessary for program execution from the storage unit 207 as needed and uses them.
[0089] --Memory 202-- Memory 202 is used for various processes performed by CPU 201.
[0090] --Display section 203-- The display unit 203 is a liquid crystal display that displays the operation screen, selection screen, etc., of the disassembly device 100.
[0091] --Input / output section 204-- The input / output unit 204 consists of an operation panel, keyboard, and other components for the operator to perform various operations, such as inputting various types of data and outputting various types of data to a predetermined storage medium.
[0092] --Communications Department 205-- The communications unit 205 handles data exchange via networks and other means.
[0093] --Controller 206-- The various controllers 206 control various parts of the decomposition apparatus 100. Examples of the various controllers 206 include a first temperature controller 206a, a material supply rate controller 206b, an inert gas supply rate controller 206c, and an open / close shutter controller 206d.
[0094] ---First temperature controller 206a--- The first temperature controller 206a controls the temperature of the filler layer 3 in the reactor 1 by controlling the temperature of the heating section 2. The first temperature controller 206a can use semiconductor-based phase control, semiconductor-based PWM (Pulse Width Modulation) control, etc. Furthermore, the first temperature controller 206a can take in the temperature detection signal from the temperature sensor 13 of the filler layer 3 in the reactor 1 and feedback control the temperature of the heating section 2 using PID (Proportional-Integral-Differential) control or on-off control. Among these, PID control is preferred for the first temperature controller 206a from the viewpoint of suppressing temperature overshoot in the filler layer 3 in the reactor 1 and suppressing side reactions at high temperatures.
[0095] ---Processing Object Supply Speed Controller 206b--- The material supply rate controller 206b controls the supply rate of the material to be processed 11 to the reactor 1 by the material supply rate adjustment unit 14. The material supply rate controller 206b receives the supply rate detection signal from the material supply rate sensor 16 and can feedback control the supply rate of the material to be processed 11 using PID control or on-off control.
[0096] ---Inert gas supply rate controller 206c--- The inert gas supply rate controller 206c controls the supply rate of the inert gas 31 by the inert gas supply rate adjustment unit 15. The inert gas supply rate controller 206c receives the inert gas supply rate detection signal from the inert gas supply rate sensor 17 and can feedback control the amount of inert gas 31 supplied by PID control or on-off control.
[0097] ---Open / Close Shutter Controller 206d--- The open / close shutter controller 206d controls the timing of the removal of the filler layer 3 from the reactor 1 by the open / close shutter 8.
[0098] --Storage section 207-- The memory unit 207 consists of a hard disk drive (HDD) and other components that store various programs executed by the CPU 201 and data necessary for program execution.
[0099] [Example of operation of the disassembly apparatus 100 according to the first embodiment] Next, a specific example of the operation of the decomposition apparatus 100 according to the first embodiment will be described. First, the material to be processed 11 is supplied from the material to be processed supply unit 5 into the reactor 1. At this time, the material to be processed supply rate adjustment unit 14 adjusts the supply rate of the material to be processed 11 into the reactor 1. The supply rate of the material to be processed 11 is measured by the material to be processed supply rate sensor 16, and the supply rate detection signal is transmitted to the material to be processed supply rate controller 206b of the control unit 200, where it is controlled.
[0100] The material to be processed 11 supplied into the reactor 1 comes into contact with the filler layer 3 and is heated. At this time, the temperature of the filler layer 3 is measured by a temperature sensor 13. The temperature detection signal from the temperature sensor 13 is suitably transmitted to the first temperature controller 206a of the control unit 200. Inside the reactor 1, the material to be processed 11 is heated, and a product 12 and reaction residue 42 are generated. The reaction residue 42 accumulates on top of the filler layer 3.
[0101] If the temperature of the filler layer 3 is not constant, the temperature of the heating unit 2 is adjusted by feedback control from the first temperature controller 206a of the control unit 200 so that the temperature of the filler layer 3 becomes constant. Also, if the temperature of the filler layer 3 is to be lowered or raised, the operator changes the input value to the input / output unit 204 so that the temperature of the heating unit 2 is adjusted to the desired temperature. In addition, inert gas 31 is supplied into the reactor 1 from the inert gas supply unit 7. At this time, the supply rate of the inert gas 31 into the reactor 1 is adjusted by the inert gas supply rate adjustment unit 15. The supply rate of the inert gas 31 is measured by the inert gas supply rate sensor 17, and the supply rate detection signal is transmitted to the inert gas supply rate controller 206c of the control unit 200 for control.
[0102] After a desired amount of time has elapsed since the supply of the material to be processed 11, a signal is transmitted to the open / close shutter controller 206d. At this time, the open / close shutter 8 is controlled to be in a closed state. Oxygen-containing gas 40 is also supplied from the containment tank 9 into the reactor 1, burning the reaction residue 42 accumulated on the filler layer 3, and discharging the reaction residue 42 from the gap 4 to the outside of the decomposition device 100. At this time, the open / close shutter 8 is controlled to be in a closed state by the control unit 200. This prevents the filler and reaction residue from flowing back into the inert gas supply unit 7.
[0103] These operations can be stored in the memory unit 207, and the desired reaction conditions can be read from the memory unit 207 and used as appropriate.
[0104] In this way, the decomposition apparatus 100 according to the first embodiment can efficiently discharge the reaction residue 42.
[0105] <Second Embodiment> Figure 2 is a schematic cross-sectional view showing an example of a disassembly apparatus according to the second embodiment of this disclosure. The disassembly apparatus according to the second embodiment of this disclosure differs from the disassembly apparatus according to the first embodiment in that the upper member 1B has an inert gas supply unit 7 on its upper surface and a material to be processed supply unit 5 on the side surface of the upper member 1B that connects the upper surface and the bottom surface of the upper member 1B. Furthermore, the disassembly apparatus according to the second embodiment of this disclosure may further include other members.
[0106] (Operation method of the disassembly device and regeneration method of the disassembly device) A method for operating a disassembly apparatus according to one embodiment of this disclosure involves heat-treating an object to be processed using the disassembly apparatus of this disclosure. A method for regenerating a disassembly apparatus according to one embodiment of this disclosure includes a method for operating a disassembly apparatus according to one embodiment of this disclosure.
[0107] A method for operating a decomposition apparatus according to one embodiment of the present disclosure includes: supplying a material to be processed from a material to be processed to the inside of a reactor having a lower member and an upper member having a material to be processed supply unit for supplying a material to be processed to the inside of the reactor; heating a filler layer located inside the reactor with a heating unit located outside or inside the reactor while bringing the filler layer and the material to be processed into contact; supplying an oxygen-containing gas to the inside of the reactor from a through-hole in an oxygen-treated material supply unit having a through-hole located at the bottom of the lower member of the reactor; and discharging reaction residue generated from the material to be processed inside the reactor from the inside of the reactor, after heating has been stopped, using an oxygen-containing gas, through a gap formed between the lower member and the upper member. The decomposition method according to one embodiment of the present disclosure may further include other processes as necessary.
[0108] Figure 3 is an example of a flowchart showing the operation method of a disassembly apparatus according to one embodiment of the present disclosure.
[0109] <Supplying the material to be processed S101> S101, which involves supplying the material to be processed, involves supplying the material to be processed 11 from the material to be processed supply unit 5 to the reactor 1.
[0110] There are no particular restrictions on the supply rate of the filler layer 3 to the reactor 1, and it can be selected as appropriate for the purpose. There are no particular restrictions on the supply rate of the material to be processed 11 to the reactor 1, and it can be selected as appropriate for the type of material to be processed 11, etc.
[0111] <Heating in the heating section S102> Heating in the heating section S102 involves heating the filler layer 3 in the heating section 2 while bringing the filler layer 3 into contact with the object to be processed 11. Supplying the object to be processed S101 and heating in the heating section S102 may be performed separately or simultaneously.
[0112] There are no particular restrictions on the heating temperature in the heating section S102, and it can be appropriately selected according to the purpose, but 400°C or higher is preferred, 650°C to 950°C is more preferred, and 700°C to 900°C is even more preferred.
[0113] Furthermore, the heating temperature should be controlled so that the inner surface of the reactor 1 does not become so hot that the material cannot be used stably. The relationship between the heating temperature and the temperature of the inner surface of the reactor 1 varies depending on various conditions such as the distance between the inner surface of the reactor 1 and the filler layer 3, the type of inert gas 31, and the supply rate of the inert gas 31. For example, if the inert gas 31 is nitrogen gas or water vapor, and the distance between the inner surface of the reactor 1 and the filler layer 3 is 2 mm or more and 15 mm or less, a heating temperature of 750°C or less is preferable because the temperature of the inner surface of the reactor 1 does not rise too high, and SUS316 stainless steel or SUS316L stainless steel can be used.
[0114] When product 12 is at least one chemical selected from the group consisting of olefins having 1 to 10 carbon atoms and aromatic hydrocarbons, and heating in the heating section S102 is performed without a catalyst, the supply rate of the inert gas 31 v(m 3(in minutes) is preferably such that the numerical value calculated by the following formula 3 is 0.05 to 10, and more preferably 0.1 to 4. [Formula 3] 60×L R ×(A - B) / v However, in Formula 3, L R represents the length (m) of the filler layer 3, A represents the cross-sectional area (m 2 ) of the reactor 1, B represents the cross-sectional area (m 2 ) of the filler layer 3, and v v represents the supply rate v (m 3 / min) of the inert gas 31. <从含氧气体中供给气体S103>
[0115] <00供氧步骤S103> 供氧步骤S103是从具有贯通孔6的氧气供给部的贯通孔6,该贯通孔6配置在反应炉1的下部构件1A的底部,向停止加热的反应炉1的内部供给含氧气体。
[0116] <排出步骤S104> 排出步骤S104是从下部构件1A与上部构件1B之间形成的间隙4,将在反应炉1内部的被处理物11产生的反应残渣,从停止加热的反应炉1的内部,使用含氧气体排出。排出步骤S104在流程图300中与供氧步骤S103同时进行。
[0117] <其他处理> 其他处理没有特别限制,可以根据目的适当选择,例如,再生工序、惰性气体供给工序、塑料预处理工序、回收塑料分解得到的生成物12中的有用成分的工序、有用成分的分离工序等。
[0118] (Method for producing hydrocarbon compound) The method for producing a hydrocarbon compound according to an embodiment of the present disclosure heat-treats a processing target using the decomposition apparatus of the present disclosure.
[0119] A method for producing a hydrocarbon compound according to one embodiment of the present disclosure includes supplying a material to be processed from a material to be processed to the inside of a reactor having a lower member and an upper member having a material to be processed supply unit for supplying a material to be processed to the inside of the reactor; heating a filler layer located inside the reactor with a heating unit located outside or inside the reactor while bringing the filler layer and the material to be processed into contact; discharging reaction residue generated from the material to be processed inside the reactor from the inside of the reactor after heating has been stopped, using an oxygen-containing gas, through a gap formed between the lower member and the upper member; and producing a hydrocarbon compound by bringing the material to be processed and the heated filler layer into contact inside the reactor. The decomposition method according to one embodiment of the present disclosure may further include other processes as necessary.
[0120] Figure 4 is an example of a flowchart of a method for producing a hydrocarbon compound according to one embodiment of the present disclosure.
[0121] <Supplying the material to be processed S201> S201, which involves supplying the material to be processed, involves supplying the material to be processed 11 from the material to be processed supply unit 5 to the reactor 1.
[0122] There are no particular restrictions on the supply rate of the filler layer 3 to the reactor 1, and it can be selected as appropriate for the purpose. There are no particular restrictions on the supply rate of the material to be processed 11 to the reactor 1, and it can be selected as appropriate for the type of material to be processed 11, etc.
[0123] <Heating in the heating section S202> Heating in the heating section S202 involves heating the filler layer 3 in the heating section 2 while bringing the filler layer 3 into contact with the object to be processed 11. Supplying the object to be processed S201 and heating in the heating section S202 may be performed separately or simultaneously.
[0124] There are no particular restrictions on the heating temperature in the heating section S202, and it can be appropriately selected according to the purpose, but 400°C or higher is preferred, 650°C to 950°C is more preferred, and 700°C to 900°C is even more preferred.
[0125] Furthermore, the heating temperature should be controlled so that the inner surface of the reactor 1 does not become so hot that the material cannot be used stably. The relationship between the heating temperature and the temperature of the inner surface of the reactor 1 varies depending on various conditions such as the distance between the inner surface of the reactor 1 and the filler layer 3, the type of inert gas 31, and the supply rate of the inert gas 31. For example, if the inert gas 31 is nitrogen gas or water vapor, and the distance between the inner surface of the reactor 1 and the filler layer 3 is 2 mm or more and 15 mm or less, a heating temperature of 750°C or less is preferable because the temperature of the inner surface of the reactor 1 does not rise too high, and SUS316 stainless steel or SUS316L stainless steel can be used.
[0126] When product 12 is at least one chemical selected from the group consisting of olefins and aromatic hydrocarbons having 1 to 20 carbon atoms, and heating in the heating section S202 is performed without a catalyst, the supply rate of the inert gas 31 v(m 3 The value calculated by the following formula 4 for the ( / minute) is preferably between 0.05 and 20, and more preferably between 0.1 and 4. [Formula 4] 60 x L R ×(AB) / v However, in equation 4, L R A represents the length (m) of the filler layer 3, and A represents the cross-sectional area (m) of the reactor 1. 2 ) shows, and B is the cross-sectional area (m²) of the filler layer 3. 2 ) indicates that v is the supply rate of the inert gas 31 v(m 3 This indicates the time ( / minute).
[0127] <Supplying oxygen-containing gas S203> S203, which involves supplying oxygen-containing gas, involves supplying oxygen-containing gas into the interior of the reactor 1, where heating has been stopped, through the through-hole 6 of the oxygen supply unit, which has a through-hole 6 located at the bottom of the lower member 1A of the reactor 1.
[0128] <Generating hydrocarbon compounds S204> In generating hydrocarbon compounds (S204), the filler layer 3 and the material to be processed 11 are brought into contact inside the reactor 1 to generate hydrocarbon compounds.
[0129] The hydrocarbon compound is a hydrocarbon compound having 1 to 10 carbon atoms, and is, for example, at least one chemical selected from the group consisting of olefins and aromatic hydrocarbons.
[0130] <Other processing> Other processes are not particularly limited and can be selected as appropriate depending on the purpose, and can be performed in the same way as other processes in the operation method of the decomposition apparatus. Examples include a regeneration process, an inert gas supply process, a plastic pretreatment process, a process for recovering useful components from the product 12 obtained by decomposing the plastic, and a process for separating useful components.
[0131] As described above, this disclosure has been explained based on specific embodiments, but these embodiments are merely examples, and this disclosure is not limited to the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, additions, modifications, etc., are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]
[0132] 1… Reactor 1A... Lower member 1B...Top member 2...Heating part 3… Filler layer 4...Gap 5… Processing material supply unit 6…Through hole 7…Inert gas supply unit 8…Openable shutter 9... Tank 11...Objects to be processed 12...Product 13…Temperature sensor 14... Processing material supply speed adjustment unit 15...Inert gas supply rate adjustment unit 16… Processing object supply speed sensor 17…Inert gas supply rate sensor 31...Inert gas 40…Oxygen-containing gases 41...distributor 42…Reaction residue 100…Disassembly equipment 200... Control Unit 202...Memory 203...Display section 204…Input / output section 205... Communications Department 206... Various controllers 206a...First temperature controller 206b... Processing object supply speed controller 206c...Inert gas supply rate controller 206d... Open / close shutter controller 207...Storage section 208…Processing recipe data
Claims
1. A reactor having a lower member and an upper member having a material supply section for supplying materials to be processed, A filler layer placed inside the reactor, A heating section, which is located outside or inside the reactor, heats the filler layer, A through hole located at the bottom of the lower member of the reactor, The gap formed between the lower member and the upper member, A disassembly device equipped with the following features.
2. The disassembly device according to claim 1, wherein the shape of the lower member and the upper member is cylindrical.
3. The disassembly apparatus according to claim 1 or claim 2, wherein the area of the region defining the interior of the upper member on the bottom surface of the upper member is larger than the area of the region defining the outer shape of the lower member on the top surface of the lower member.
4. The decomposition apparatus according to claim 1 or claim 2, wherein the upper member has an inert gas supply unit for supplying an inert gas.
5. The decomposition apparatus according to claim 4, wherein the upper member comprises a disperser having a through-hole through which the inert gas flows, and an openable / closable shutter capable of opening and closing the through-hole of the disperser.
6. The disassembly apparatus according to claim 1 or claim 2, wherein the filler layer is a fixed bed.
7. The decomposition apparatus according to claim 1 or claim 2, wherein the heating unit is located outside the reactor.
8. The decomposition apparatus according to claim 4, wherein the upper surface of the upper member has the processing object supply unit and the inert gas supply unit.
9. The decomposition apparatus according to claim 1 or claim 2, wherein the through hole is connected to a tank containing oxygen-containing gas.
10. The upper surface of the upper member has the inert gas supply unit, The disassembly apparatus according to claim 4, wherein the processing object supply section is located on the side surface of the upper member that connects the upper surface and the bottom surface of the upper member.
11. The reactor has a lower member and an upper member having a material supply unit for supplying the material to be processed, and the material to be processed is supplied from the material supply unit into the reactor. The filler layer, which is placed inside the reactor, is brought into contact with the object to be processed, while the filler layer is heated in a heating unit located outside or inside the reactor. A gas containing oxygen is supplied to the inside of the reactor, where heating has been stopped, from the through-hole of the oxygen supply unit having a through-hole located at the bottom of the lower member of the reactor, The reaction residue generated from the material to be processed inside the reactor is discharged from the reactor after heating has been stopped, using an oxygen-containing gas, through the gap formed between the lower member and the upper member. A method for operating a disassembly apparatus, including the operation of the disassembly apparatus.
12. A method for operating the disassembly apparatus described in claim 11, How to refurbish a disassembly device.
13. The reactor has a lower member and an upper member having a material supply unit for supplying the material to be processed, and the material to be processed is supplied from the material supply unit into the reactor. The filler layer, which is placed inside the reactor, is brought into contact with the object to be processed, while the filler layer is heated in a heating unit located outside or inside the reactor. The reaction residue generated from the material to be processed inside the reactor is discharged from the reactor after heating has been stopped, using an oxygen-containing gas, through the gap formed between the lower member and the upper member. The process involves bringing the material to be processed into contact with the heated filler layer inside the reactor to generate a hydrocarbon compound, A method for producing hydrocarbon compounds containing [the compound].
14. The method for producing a hydrocarbon compound according to claim 13, wherein the hydrocarbon compound is a hydrocarbon compound having 1 to 10 carbon atoms.