Manufacturing method of laminated film
Inductively coupled plasma treatment with controlled emission peaks and current density improves adhesion and stability in laminated film production, addressing the shortcomings of capacitive coupling methods.
JP2026111819APending Publication Date: 2026-07-06NITTO DENKO CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- NITTO DENKO CORP
- Filing Date
- 2024-12-24
- Publication Date
- 2026-07-06
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Figure 2026111819000001_ABST
Abstract
This invention provides a method for manufacturing laminated films that improves the adhesion between the base film and the inorganic layer, enabling the stable production of laminated films. [Solution] The method for manufacturing a laminated film according to the present disclosure includes a preparation step S1 of preparing a long base film 10 having a first surface 10a and a second surface 10b opposite to the first surface 10a; a plasma treatment step S2 of plasma treatment of the first surface 10a of the base film 10 in a reduced-pressure atmosphere in a chamber; and a film formation step S3 of forming an inorganic layer 20 on the first surface 10a in a reduced-pressure atmosphere following the plasma treatment step S2. In the plasma treatment step S2, the plasma treatment is performed by inductively coupled plasma of a rare gas and an oxygen-containing gas generated by applying high-frequency power to a low-inductance antenna.
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