Inspection equipment and inspection method for semiconductor devices

Abstract

To provide an inspection device that enables more accurate inspection of semiconductor equipment. [Solution] The inspection apparatus of the embodiment inspects a semiconductor device 1. The semiconductor device 1 is housed in a rectangular pocket 5 on a carrier tape 4. The inspection apparatus includes an acquisition unit 15A that acquires an inspection image of the semiconductor device 1 captured by an imaging device 12, a detection unit 15C that performs edge detection using the inspection image and determines the contour 31 of the pocket 5, a generation unit 15D that generates a mask 32 corresponding to an area up to a specified width inside the determined contour 31, and an inspection unit 15E that performs inspection of the semiconductor device 1 with the mask 32 set on the inspection image.

Description

Technical Field

[0001] Embodiments of the present invention relate to an inspection apparatus and a method for inspecting a semiconductor device.

Background Art

[0002] Semiconductor devices are shipped as products while being housed in pockets of a carrier tape. When automatically inspecting a semiconductor device, the semiconductor device is imaged by a camera installed directly above the semiconductor device, and using the captured image, the pitch (interval) of leads and the deviation of the length of leads are measured.

[0003] In such an inspection, an image of the lead tip may be reflected on the side surface of the pocket. Particularly when the lead tip is approaching the side surface of the pocket, a virtual image in which the lead appears longer than it actually is is generated because the lead tip and its reflection appear to be connected. In this case, false detection of the lead occurs and automatic inspection cannot be performed accurately.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem to be solved by the present invention is to provide an inspection apparatus and a method for inspecting a semiconductor device that can perform the inspection of the semiconductor device more accurately.

Means for Solving the Problems

[0006] The inspection apparatus according to the embodiment is an inspection apparatus for inspecting a semiconductor device, wherein the semiconductor device is housed in a rectangular pocket of a carrier tape, and the inspection apparatus comprises: an acquisition unit that acquires an inspection image of the semiconductor device captured by an imaging device; a detection unit that performs edge detection using the inspection image and determines the contour of the pocket; a generation unit that generates a mask corresponding to an area up to a specified width inside the determined contour; and an inspection unit that performs inspection of the semiconductor device with the mask set on the inspection image. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a plan view of a semiconductor device according to the first embodiment. [Figure 2] Figure 2 is a cross-sectional view of the semiconductor device along line AA' shown in Figure 1. [Figure 3] Figure 3 is a block diagram of the inspection apparatus according to the first embodiment. [Figure 4] Figure 4 is a block diagram showing an example of the hardware configuration of the inspection device. [Figure 5] Figure 5 illustrates an example of an image captured by a camera on a semiconductor device. [Figure 6] Figure 6 illustrates another example of an image captured by a camera on a semiconductor device. [Figure 7] Figure 7 is a flowchart illustrating the inspection operation of the inspection device according to the first embodiment. [Figure 8] Figure 8 is a diagram illustrating the inspection process using an inspection device. [Figure 9] Figure 9 is a diagram illustrating the inspection process using an inspection device. [Figure 10] Figure 10 is a diagram illustrating the inspection process using an inspection device. [Figure 11] Figure 11 illustrates the inspection process using an inspection device related to a modified example. [Figure 12] Figure 12 is a flowchart illustrating the inspection operation of the inspection device according to the second embodiment. [Figure 13]Figure 13 is a diagram illustrating the inspection process using an inspection device. [Figure 14] Figure 14 is a diagram illustrating the inspection process using an inspection device. [Figure 15] Figure 15 is a diagram illustrating the inspection process using an inspection device related to a modified example. [Modes for carrying out the invention]

[0008] Embodiments will be described below with reference to the drawings. The embodiments shown below are illustrative examples of devices and methods for realizing the technical concept of the present invention, and the technical concept of the present invention is not defined by the shape, structure, arrangement, etc. of the components. Each functional block can be realized as hardware, software, or a combination of both. It is not essential that each functional block is distinguished as in the following example. For example, some functions may be performed by functional blocks other than the illustrative functional blocks. Furthermore, the illustrative functional blocks may be further divided into finer functional subblocks. In the following description, elements having the same function and configuration are denoted by the same reference numerals, and redundant descriptions are omitted.

[0009] [1] First Embodiment [1-1] Configuration of semiconductor device 1 Figure 1 is a plan view of a semiconductor device 1 according to the first embodiment. Figure 2 is a cross-sectional view of the semiconductor device 1 along line AA' shown in Figure 1. In Figure 1, the X direction is the direction along any one side of the semiconductor device 1, and the Y direction is the direction perpendicular to the X direction. Figure 1 shows two semiconductor devices 1 as an example.

[0010] The semiconductor device 1 comprises a resin part 2 and a plurality of leads 3. Figure 1 shows an example configuration in which the semiconductor device 1 has four leads 3. The number of leads 3 can be set arbitrarily.

[0011] The resin part 2 has, for example, a quadrangular shape. The resin part 2 includes a semiconductor element and a resin member that seals the semiconductor element.

[0012] On one side of the resin part 2 in the Y direction, for example, two leads 3 are connected, and on the other side of the resin part 2 in the Y direction, for example, two leads 3 are connected. The plurality of leads 3 are electrically connected to the semiconductor element within the resin part 2. The semiconductor device 1 may be provided with a plurality of leads 3 on each of the four sides. Each lead 3 extends in one direction and has a bent cross-sectional shape (having approximately a Z shape).

[0013] The plurality of semiconductor devices 1 are accommodated in a carrier tape 4 extending in the X direction. As the material of the carrier tape 4, for example, a resin containing carbon black or the like is used. The material of the carrier tape 4 may be a transparent resin.

[0014] The carrier tape 4 has a plurality of pockets 5 arranged at equal intervals in the X direction. The contour of the pocket 5 has approximately a quadrangular shape. The quadrangle mentioned here includes a quadrangle with rounded corners. The pocket 5 is composed of a quadrangular bottom surface 6 and four side surfaces 7. The four side surfaces 7 are inclined surfaces inclined with respect to the vertical direction. That is, the pocket 5 has a tapered shape. The pocket 5 is configured such that the area increases from the bottom surface 6 toward the upper part. The area of the bottom surface 6 of the pocket 5 is set slightly larger than the outer shape of the semiconductor device 1. The semiconductor device 1 is placed on the bottom surface 6 of the pocket 5.

[0015] Note that the orientation in which the semiconductor device 1 is arranged in the pocket 5 can be arbitrarily set. The carrier tape 4 and the pocket 5 may be configured such that the lead 3 faces in the X direction.

[0016] In the states of FIGS. 1 and 2, the appearance inspection of the semiconductor device 1 is performed by an inspection device 10 described later. Finally, a protective tape (not shown) is adhered to the upper part of the carrier tape 4, and the semiconductor device 1 is sealed in the pocket 5 by the protective tape.

[0017] [1-2] Configuration of the inspection device 10 Figure 3 is a block diagram of the inspection device 10 according to the first embodiment. The inspection device 10 is a device for inspecting semiconductor devices 1 housed on a carrier tape 4. Specifically, the inspection device 10 measures the dimensions of multiple leads provided by the semiconductor device 1 and the spacing between the leads, and determines whether a product is defective based on the measurement results. The inspection device 10 includes an illumination device 11, an imaging device (camera) 12, an input unit 13, a display unit 14, a control unit 15, and a storage unit 16.

[0018] The illumination device 11 irradiates light onto the semiconductor device 1 to be inspected. The illumination device 11 is configured to illuminate the semiconductor device 1 from multiple angles. For example, the illumination device 11 is configured to illuminate the semiconductor device 1 from directly above and also to illuminate the semiconductor device 1 from an oblique angle.

[0019] Camera 12 is positioned directly above the semiconductor device 1 to be inspected. Camera 12 images the semiconductor device 1 housed in the pocket 5 of the carrier tape 4. Camera 12 also sequentially images multiple semiconductor devices 1 housed in the transported carrier tape 4.

[0020] The input unit 13 has a function for the user to input information. The input unit 13 includes a keyboard and a mouse, etc.

[0021] The display unit 14 displays information generated by the control unit 15. The display unit 14 includes a display device, etc.

[0022] The storage unit 16 stores various data necessary for the operation of the control unit 15. The storage unit 16 includes non-volatile memory and volatile memory. The storage unit 16 is configured to include a program storage unit 21 and a data storage unit 22, which will be described later.

[0023] The control unit 15 controls the operation of the entire inspection device 10. The control unit 15 comprises an image acquisition unit 15A, a detection area setting unit 15B, an edge detection unit 15C, a mask generation unit 15D, and an inspection unit 15E. The image acquisition unit 15A is also referred to as the acquisition unit. The detection area setting unit 15B is also referred to as the setting unit. The edge detection unit 15C is also referred to as the detection unit. The mask generation unit 15D is also referred to as the generation unit.

[0024] The image acquisition unit 15A acquires the image (referred to as the inspection image) captured by the camera 12.

[0025] The detection area setting unit 15B sets the detection area 30 in the inspection image. The detection area 30 is set to an area larger than the outline of the pocket 5.

[0026] The edge detection unit 15C performs edge detection processing in a direction perpendicular to each of the four edges of the detection area 30. The edge detection unit 15C determines the contour of the pocket 5.

[0027] The mask generation unit 15D generates a mask 32 using the contour of the pocket 5. The mask 32 is image data that masks the area around the semiconductor device 1, which is the object to be inspected, from the inspection image.

[0028] The inspection unit 15E performs a visual inspection of the semiconductor device 1 with a mask 32 applied to the inspection image. This visual inspection includes measuring and inspecting multiple leads 3.

[0029] (Hardware configuration of inspection device 10) Figure 4 is a block diagram showing an example of the hardware configuration of the inspection device 10.

[0030] The inspection device 10 can be configured using a computer. The inspection device 10 comprises a processor 20, a data storage unit 22, a program storage unit 21, a communication interface unit (communication I / F unit) 23, an input / output interface unit (input / output I / F unit) 24, an input unit 13, and a display unit 14. The data storage unit 22, the program storage unit 21, the communication interface unit 23, and the input / output interface unit 24 are connected to the processor 20 via a bus 25.

[0031] The processor 20 consists of a CPU (Central Processing Unit), an MPU (Micro Processing Unit), and the like. The processor 20 performs the operations of the control unit 15 described above.

[0032] The program storage unit 21 includes, for example, a non-volatile memory that can be written to and read at any time, such as an HDD (Hard Disk Drive) or SSD (Solid State Drive), and a non-volatile memory such as a ROM (Read Only Memory). The program storage unit 21 stores the programs necessary for the processor 20 to perform various processes according to this embodiment. That is, the image acquisition unit 15A, detection area setting unit 15B, edge detection unit 15C, mask generation unit 15D, and inspection unit 15E described above are realized by having the processor 20 execute the programs stored in the program storage unit 21.

[0033] The data storage unit 22 includes, for example, non-volatile memory such as an HDD or SSD, and volatile memory such as RAM (Random Access Memory). The data storage unit 22 is used as a workspace for the processor 20. The data storage unit 22 temporarily stores various data acquired and created during the process of the processor 20 executing various processes.

[0034] The communication interface unit 23 includes a wired communication module and / or a wireless communication module. The wireless communication module includes a wireless LAN (Local Area Network). The communication interface unit 23 performs interface processing with an external device according to a predetermined communication standard. The communication interface unit 23 is capable of receiving information from an external device and transmitting information to an external device.

[0035] The input / output interface unit 24 is connected to the input unit 13 and the display unit 14. The input / output interface unit 24 performs interface processing with the input unit 13 and the display unit 14 according to a predetermined communication standard.

[0036] Furthermore, the input / output interface unit 24 or the communication interface unit 23 receives image data from the camera 12.

[0037] [1-3] Operation The operation of the inspection device 10 configured as described above will now be explained. The inspection device 10 performs inspection using inspection images captured by the camera 12 on the semiconductor device 1.

[0038] First, let's explain the reflection of the lead tip. Figure 5 is an example of an image of the semiconductor device 1 captured by the camera 12. In Figure 5, the semiconductor device 1 is positioned offset to the upper side of the pocket 5 from the center. The dashed arrow in Figure 5 indicates the shift in the position of the semiconductor device 1. In this case, the light reflected by the lead 3 is shone on the side surface 7 of the pocket 5, and a reflection 8 of the lead 3 is created on the side surface 7 of the pocket 5. The reflection 8 has approximately the same brightness as the lead 3. When inspection is performed using the image in Figure 5, the lead tip and the reflection are perceived as being attached, and the lead is perceived as having become longer. This false detection may prevent accurate visual inspection of the semiconductor device 1.

[0039] Figure 6 illustrates another example of an image of the semiconductor device 1 captured by the camera 12. In Figure 6, the semiconductor device 1 is positioned further upward than in Figure 5. The dashed arrows in Figure 6 indicate the shift in the position of the semiconductor device 1. In this case as well, the reflection 8 of the lead 3 occurs on the side 7 of the pocket 5. This false detection may prevent accurate visual inspection of the semiconductor device 1.

[0040] In this embodiment, even if the reflection 8 of the lead 3 occurs on the side surface 7 of the pocket 5, the inspection device 10 can perform a more accurate visual inspection of the semiconductor device 1.

[0041] The details of the inspection operation according to this embodiment will be described below. Figure 7 is a flowchart illustrating the inspection operation of the inspection device 10.

[0042] During the inspection of the semiconductor device 1, the carrier tape 4 is transported in one direction. Furthermore, the multiple semiconductor devices 1 contained on the carrier tape 4 are sequentially transported directly below the camera 12.

[0043] The inspection device 10 uses the camera 12 to image the semiconductor device 1 to be inspected (step S100). During imaging, the inspection device 10 uses the illumination device 11 to irradiate the semiconductor device 1 with light. An inspection image is captured for each individual semiconductor device 1 to be inspected. The inspection image is captured so that it includes the entire pocket 5 shown in Figure 1.

[0044] Next, the image acquisition unit 15A acquires the inspection image captured in step S100 (step S101). The inspection image acquired in step S101 is stored in the storage unit 16.

[0045] Next, the detection area setting unit 15B sets the detection area 30 in the inspection image (step S102). Figure 8 is a diagram illustrating the inspection process by the inspection device 10. Figure 8 shows an inspection image taken of one semiconductor device 1 that is the object of inspection. The detection area 30 is defined, for example, by a rectangular frame. The detection area 30 is set to an area larger than the contour of the pocket 5. The contour of the pocket 5 is the outer shape of the side surface 7 of the pocket 5 when the pocket 5 is viewed in a planar view. The detection area 30 is set in advance based on the size of the semiconductor device 1 and the size of the pocket 5 formed to match the semiconductor device 1.

[0046] Next, the edge detection unit 15C determines the contour 31 of the pocket 5 based on the inspection setting conditions (step S103). In this specification, the process of determining the contour is also called edge detection. In image processing, an edge means a position where the brightness changes abruptly. Figure 8 shows the edge detection process with multiple arrows. The edge detection unit 15C performs edge detection processing in a direction perpendicular to the edge for each of the four sides of the detection area 30. For example, the edge detection process includes (1) a process of calculating the brightness gradient (brightness profile) in the X and Y directions of the image (composed of multiple pixels), (2) a process of smoothing the brightness profile (noise reduction), (3) a process of taking the first derivative of the smoothed waveform, and (4) a process of taking the second derivative of the first derivative waveform. The inspection setting conditions in step S103 include the color to be detected, the detection direction, the number of lines, the line width, the density threshold, and the number of consecutive pixels before and after the edge in the edge detection process.

[0047] When light is shone onto the semiconductor device 1 from above, the bottom surface 6 of pocket 5 and the periphery of pocket 5 have high brightness (close to white), while the side surface 7 of pocket 5 has low brightness (close to black). The edge detection unit 15C performs edge detection along multiple pixel lines perpendicular to each side of the detection area 30 and directed toward the semiconductor device 1. The multiple pixel lines are schematically shown by the multiple arrows in Figure 8. The spacing between the multiple pixel lines set on each side can be arbitrarily set.

[0048] The edge detection unit 15C detects points (called change points) where the brightness changes abruptly from a low-brightness area to a high-brightness area. Furthermore, the edge detection unit 15C determines that the line connecting multiple change points is the contour 31 of the pocket 5. When determining the contour 31, the edge detection unit 15C also determines the continuity of the change points so that each side of the contour 31 is a straight line. The edge detection unit 15C forms the contour 31 from the four intersection points of the four approximate straight lines obtained by approximating the four sides under certain conditions from each change point. Figure 9 is a diagram illustrating the inspection process by the inspection device 10. In Figure 9, the edge detection unit 15C performs edge detection from the detection area 30 inward and determines the contour 31 of the rectangle.

[0049] Next, the mask generation unit 15D generates a mask 32 using the contour 31 determined in step S103 (step S104). The mask 32 is image data for partially masking the inspection image. Specifically, as shown in Figure 9, the mask generation unit 15D sets a specified width D from the contour 31 inward (towards the semiconductor device 1). The specified width D is set to the width of the side surface 7 of the pocket 5 when the semiconductor device 1 is viewed from above. The specified width D is set in advance based on the shape of the carrier tape 4.

[0050] Furthermore, the mask generation unit 15D generates a mask 32 corresponding to the area from the contour 31 to the specified width D. Figure 10 is a diagram illustrating the inspection process by the inspection device 10. In Figure 10, the mask 32 is shown with hatching. The mask 32 has a rectangular frame shape and is generated so as to overlap with the side surface 7 of the pocket 5.

[0051] When the mask 32 is applied to Figures 5 and 6 mentioned above, the reflection 8 visible on the side 7 of the pocket 5 is masked. This enables more accurate visual inspection of the semiconductor device 1.

[0052] Next, the inspection unit 15E performs a visual inspection of the semiconductor device 1 with the mask 32 set on the inspection image (step S105). Specifically, the inspection unit 15E measures the dimensions of each of the multiple leads 3 and measures the deviation in the length of the leads 3. The inspection unit 15E also measures the spacing and / or pitch of each of the multiple leads 3. Then, the inspection unit 15E determines whether a product is defective based on the measurement results.

[0053] [1-4] Variant Next, a modified version of the process for determining the contour 31 of pocket 5 will be described. The detection area 30 may be set to be smaller than the contour of pocket 5, and edge detection may be performed from the detection area 30 outwards.

[0054] Figure 11 is a diagram illustrating the inspection process by the inspection device 10 according to a modified example. The detection area setting unit 15B sets the detection area 30 in the inspection image (step S102). The detection area 30 is set to an area smaller than the contour of the pocket 5. The edge detection unit 15C performs edge detection outward from the detection area 30 and determines the contour of the rectangle 31. Figure 11 shows the edge detection process with multiple arrows. When light is shone on the semiconductor device 1 from above, the bottom surface 6 of the pocket 5 and the periphery of the pocket 5 have high brightness (close to white), and the side surface 7 of the pocket 5 has low brightness (close to black). The edge detection unit 15C detects a change point where the brightness changes abruptly from a low-brightness area to a high-brightness area. The subsequent steps are the same as those of the first embodiment described above.

[0055] [1-5] Effects of the first embodiment According to the first embodiment, in the inspection image captured of the semiconductor device 1, masks 32 can be set on the four sides of the pocket 5 of the carrier tape 4. This prevents the reflection 8 of the lead 3 from being recognized as part of the lead 3, even if it occurs on the side of the pocket 5. Then, with the masks 32 set in the inspection image, the appearance inspection of the semiconductor device 1 can be performed.

[0056] Furthermore, it becomes possible to detect the leads 3 without being affected by positional variations when the semiconductor device 1 is housed in the pockets 5 of the carrier tape 4. As a result, it becomes possible to inspect the semiconductor device 1 more accurately.

[0057] [2] Second embodiment The second embodiment is another example of the edge detection method, in which edge detection is performed from the inside to the outside of pocket 5.

[0058] [2-1] Operation The configuration of the inspection device 10 is the same as in the first embodiment. Figure 12 is a flowchart illustrating the inspection operation of the inspection device 10 according to the second embodiment. The operation of steps S200 to S201 in Figure 12 is the same as the operation of steps S100 to S101 in Figure 7.

[0059] Next, the detection area setting unit 15B sets the detection area 30 in the inspection image (step S202). Figure 13 is a diagram illustrating the inspection process by the inspection device 10. Figure 13 shows an inspection image taken of one semiconductor device 1 that is the object of inspection. The detection area 30 is defined, for example, by a rectangular frame. The detection area 30 is set to an area smaller than the area of ​​the bottom surface 6 of the pocket 5. The detection area 30 is set in advance based on the size of the semiconductor device 1 and the size of the pocket 5 formed to fit the semiconductor device 1.

[0060] Next, the edge detection unit 15C determines the contour 31 of the bottom surface 6 of the pocket 5 based on the inspection setting conditions (step S203). Figure 13 shows the edge detection process with multiple arrows. The edge detection unit 15C performs edge detection processing in a direction perpendicular to the edge for each of the four sides of the detection area 30.

[0061] When light is shone onto the semiconductor device 1 from above, the bottom surface 6 of pocket 5 and the surrounding area of ​​pocket 5 have high brightness (close to white), while the side surface 7 of pocket 5 has low brightness (close to black). The edge detection unit 15C detects change points where the brightness changes abruptly from a high-brightness area to a low-brightness area. Furthermore, the edge detection unit 15C determines that the line connecting multiple change points is the contour 31 of the bottom surface of pocket 5. Figure 14 is a diagram illustrating the inspection process by the inspection device 10. In Figure 14, the edge detection unit 15C performs edge detection from the detection area 30 outward and determines the rectangular contour 31. The contour 31 corresponds to the contour of the bottom surface 6 of pocket 5.

[0062] Next, the mask generation unit 15D generates a mask 32 using the contour 31 determined in step S203 (step S204). Specifically, as shown in Figure 14, the mask generation unit 15D sets a specified width D from the contour 31 outward (towards the contour side of the pocket 5). The specified width D is set to the width of the side surface 7 of the pocket 5 when the semiconductor device 1 is viewed from above. The specified width D is set in advance based on the shape of the carrier tape 4.

[0063] Furthermore, similar to Figure 10 mentioned above, the mask generation unit 15D generates a mask 32 corresponding to the area from the contour 31 to the specified width D. The mask 32 has a rectangular frame shape and is generated so as to overlap with the side surface 7 of the pocket 5.

[0064] Subsequently, similar to the first embodiment, the inspection unit 15E performs a visual inspection of the semiconductor device 1 with the mask 32 set on the inspection image (step S205).

[0065] [2-2] Variations Next, a modified example of the process for determining the contour 31 of the bottom surface 6 of pocket 5 will be described. The detection area 30 may be set to be larger than the contour of the bottom surface 6 of pocket 5, and edge detection may be performed from the detection area 30 inward.

[0066] Figure 15 is a diagram illustrating the inspection process by the inspection device 10 according to a modified example. The detection area setting unit 15B sets the detection area 30 in the inspection image (step S202). The detection area 30 is set to an area larger than the contour of the bottom surface 6 of the pocket 5. The edge detection unit 15C performs edge detection from the detection area 30 inward and determines the contour 31 of the rectangle. Figure 15 shows the edge detection process with multiple arrows. When light is shone on the semiconductor device 1 from above, the bottom surface 6 of the pocket 5 and the surrounding area of ​​the pocket 5 have high brightness (close to white), and the side surface 7 of the pocket 5 has low brightness (close to black). The edge detection unit 15C detects a change point where the brightness changes abruptly from a low-brightness area to a high-brightness area. The subsequent steps are the same as in the second embodiment described above.

[0067] [2-3] Effects of the second embodiment According to the second embodiment, the contour 31 of the bottom surface 6 of the pocket 5 can be determined in the edge detection process. Then, a mask 32 can be generated that masks the four sides of the pocket 5 using the determined contour 31. Other effects are the same as in the first embodiment.

[0068] [3] Variant The embodiments described above illustrate examples of inspecting a semiconductor device 1 equipped with multiple leads 3. However, the invention is not limited to these embodiments and can be applied to semiconductor devices 1 with other configurations. For example, it can be applied to semiconductor devices 1 that do not have leads.

[0069] Each process according to the above-described embodiment can be stored as a program (software means) that can be executed by a computer, for example, on a storage medium such as a magnetic disk, optical disk, or semiconductor memory, or transmitted and distributed via a communication medium. The storage medium includes a storage medium provided in a computer or a storage medium provided in a device connected via a network. The computer can then read the program stored in the storage medium and execute the above-described process by having its operation controlled by the read program.

[0070] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0071] 1...Semiconductor device, 2...Resin part, 3...Lead, 4...Carrier tape, 5...Pocket, 6...Bottom surface, 7...Side surface, 8...Reflection, 10...Inspection device, 11...Illumination device, 12...Imaging device, 13...Input unit, 14...Display unit, 15...Control unit, 15A...Image acquisition unit, 15B...Detection area setting unit, 15C...Edge detection unit, 15D...Mask generation unit, 15E...Inspection unit, 16...Storage unit, 20...Processor, 21...Program storage unit, 22...Data storage unit, 23...Communication interface unit, 24...Input / output interface unit, 25...Bus, 30...Detection area, 31...Contour, 32...Mask.

Claims

1. An inspection device for inspecting semiconductor devices, The semiconductor device is housed in a rectangular pocket on the carrier tape. The inspection device, An acquisition unit that acquires an inspection image captured by the semiconductor device using an imaging device, A detection unit that performs edge detection using the aforementioned inspection image and determines the contour of the pocket, A generation unit generates a mask corresponding to an area inward from the determined contour up to a specified width, An inspection unit that performs inspection of the semiconductor device with the mask set on the inspection image, An inspection device equipped with the following.

2. The inspection image is further provided with a setting unit that sets a rectangular detection area larger than the outline of the pocket, The detection unit performs edge detection from the detection area toward the inside of the pocket and determines the contour of the pocket. The inspection apparatus according to claim 1.

3. The inspection image further includes a setting unit for setting a rectangular detection area smaller than the outline of the pocket, The detection unit performs edge detection from the detection area toward the outside of the pocket and determines the contour of the pocket. The inspection apparatus according to claim 1.

4. An inspection device for inspecting semiconductor devices, The semiconductor device is housed in a rectangular pocket on the carrier tape. The inspection device, An acquisition unit that acquires an inspection image captured by the semiconductor device using an imaging device, A detection unit that performs edge detection using the aforementioned inspection image and determines the contour of the bottom surface of the pocket, A generation unit generates a mask corresponding to an area extending outward from the determined contour up to a specified width, An inspection unit that performs inspection of the semiconductor device with the mask set on the inspection image, An inspection device equipped with the following.

5. The inspection image is further provided with a setting unit that sets a rectangular detection area smaller than the bottom surface of the pocket. The detection unit performs edge detection from the detection area toward the outside of the pocket and determines the contour of the bottom surface of the pocket. The inspection apparatus according to claim 4.

6. The inspection image is further provided with a setting unit that sets a rectangular detection area larger than the bottom surface of the pocket, The detection unit performs edge detection from the detection area toward the inside of the pocket and determines the contour of the bottom surface of the pocket. The inspection apparatus according to claim 4.

7. The semiconductor device includes a resin portion and a plurality of leads connected to the resin portion. The inspection unit inspects the dimensions of the plurality of leads. The inspection apparatus according to claim 1 or 4.

8. The specified width is set based on the width of the side surface of the pocket when the pocket is viewed in plan. The inspection apparatus according to claim 1 or 4.

9. The detection unit performs edge detection in a direction perpendicular to each side of the detection area. The inspection apparatus according to claim 2, 3, 5, or 6.

10. A method for inspecting semiconductor devices, The semiconductor device is housed in a rectangular pocket on the carrier tape. The aforementioned inspection method is An inspection image of the semiconductor device is acquired by the imaging device. Edge detection is performed using the aforementioned inspection image to determine the contour of the pocket. A mask is generated that corresponds to the area inside the determined contour up to a specified width. The semiconductor device is inspected with the mask set on the inspection image. Methods for inspecting semiconductor devices.

11. A method for inspecting semiconductor devices, The semiconductor device is housed in a rectangular pocket on the carrier tape. The aforementioned inspection method is An inspection image of the semiconductor device is acquired by the imaging device. Using the aforementioned inspection image, edge detection is performed to determine the contour of the bottom surface of the pocket. A mask is generated that corresponds to the area extending outward from the determined contour up to a specified width. The semiconductor device is inspected with the mask set on the inspection image. Methods for inspecting semiconductor devices.

Images