Joining device, method for determining whether or not joining is possible, and sheet

Abstract

This invention provides a new determination technology that enables accurate determination of whether or not a joint is formed each time a joint is made. [Solution] The bonding device comprises a sheet holding section, a pressing mechanism, a sound collecting section, and a control section. The sheet holding section is the part that holds the peripheral edge of the sheet to which the first object to be bonded is attached. The pressing mechanism is a mechanism that enables the first object to be bonded to be pressed against the second object to be bonded while elastically deforming the sheet by pressing the first object to be bonded from the back side of the sheet. The sound collecting section is the part that acquires sound generated on or around the sheet. As a determination process for determining the success or failure of bonding the first object to the second object to be bonded, the control section determines, based on the sound acquired by the sound collecting section, whether the sheet has peeled off from the first object to be bonded during the process in which the sheet returns to its original state by releasing the pressure on the first object to be bonded by the pressing mechanism, and thereby determines the success or failure of the bond.

Description

Technical Field

[0001] The present invention relates to a technique for determining whether bonding is successful or not for chips and substrates.

Background Art

[0002] Patent Document 1 discloses a technique in which chips (such as LSIs and ICs) and substrates (such as wafers) are bonding targets, their bonding surfaces are activated by plasma, and then the chips are pressed against the substrate surface for bonding.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When bonding a plurality of chips one by one to the substrate surface using the bonding technique disclosed in Patent Document 1, conventionally, the determination of whether bonding is successful or not (success or failure of bonding) for each chip is performed by inspecting the appearance of the bonding location on the substrate surface after a series of processes for the plurality of chips (multiple bonding operations corresponding to the number of chips) are all completed. Also, for locations where bonding failed, they were left in the failed state and treated as defective locations in subsequent processes, which was a cause of reducing the yield.

[0005] Therefore, an object of the present invention is to provide a new determination technique that enables accurate determination of whether bonding is successful or not every time bonding is performed.

Means for Solving the Problems

[0006] The bonding device according to the present invention has the following configuration (Aspect 1). The bonding device comprises a sheet holding part, a pressing mechanism, a sound collecting part, and a control unit. The sheet holding part is a part that holds the peripheral edge of a sheet to which the first object to be bonded is attached. The pressing mechanism is a mechanism that enables pressing the first object to be bonded against the second object to be bonded while elastically deforming the sheet by pressing the first object to be bonded from the back side of the sheet. The sound collecting part is a part that acquires sound generated on or around the sheet. As a determination process for determining the success or failure of bonding the first object to the second object to be bonded, the control unit determines, based on the sound acquired by the sound collecting part, whether the sheet has peeled off from the first object to be bonded in the process of the sheet returning to its original state by releasing the pressure on the first object to be bonded by the pressing mechanism, and thereby determines the success or failure of the bond.

[0007] According to the above embodiment 1, by utilizing the sound generated in or around the sheet, the success or failure of each individual joint of the first joint target can be determined in real time. As a result, the success or failure of each joint can be determined immediately without stopping the process midway. Furthermore, failures in joining can be detected early. Therefore, for example, if successive failures in joining are detected, the operation of the joining device can be stopped (processing is interrupted) to check the cause of the failure. This improves the yield compared to the conventional method where the success or failure of joining could not be determined until a series of processes were completed.

[0008] The bonding device according to Embodiment 1 described above may have the following configuration (Embodiment 2). In the determination process, the control unit extracts sounds with the same frequency as the delamination sound produced when the first bonding target peels off the sheet, or one or more of those frequencies, from the sound acquired by the sound collection unit as specific sounds, and then determines whether the magnitude of the specific sounds has exceeded a predetermined value, and if it is determined that it has exceeded the predetermined value, it determines that the sheet has peeled off from the first bonding target, and based on that determination, it may determine that the bonding was successful.

[0009] According to the above embodiment 2, by extracting specific sounds (sounds with the same frequency as the frequencies included in the peeling sound, or one or more of those frequencies) from the sound acquired by the sound collection unit, it becomes possible to accurately determine whether or not peeling sound occurred on or around the sheet.

[0010] In the joining device according to the above embodiment 1 or 2, if the control unit determines in the determination process that joining has failed, it may retry joining to the second joining target at the same position using a first joining target different from the first joining target that failed to join (embodiment 3).

[0011] According to embodiment 3 described above, the joining device according to embodiment 1 or 2 can determine the success or failure of joining in real time, so if joining fails, this can be detected immediately. Therefore, even if joining fails, as in embodiment 3 described above, it is possible to retry joining at the same location using a different first joining target immediately after the failure. This reduces the number of areas that are left in a failed state, and as a result, the yield can be improved.

[0012] The determination method according to the present invention is a method for determining whether or not a bond has been formed, and comprises the following configuration (Aspect 4). This determination method includes a bonding process and a determination process. In the bonding process, the first object to be bonded is pressed against the second object to be bonded by pressing the first object to be bonded from the back side of the sheet to which the first object to be bonded is attached, thereby causing the sheet to elastically deform, and thereby bonding the first object to the second object to be bonded. In the determination process, a sound is obtained during the process in which the sheet returns from an elastically deformed state to its original state, and based on that sound, it is determined whether or not the sheet has peeled off from the first object to be bonded. [Effects of the Invention]

[0013] According to the present invention, it becomes possible to accurately determine whether or not a joint is formed each time a joint is made. [Brief explanation of the drawing]

[0014] [Figure 1]This is a conceptual diagram showing a joining device according to an embodiment. [Figure 2] This is a conceptual diagram showing the changes in the state of the joining device that occur when the joining process is performed, in the order of (A) and (B). [Figure 3] This is a conceptual diagram showing the further state changes of the joining device that occur as a result of the joining process, in the order of (A) and (B). [Figure 4] This is a conceptual diagram showing the final state of the joining device resulting from the execution of the joining process, with (A) the state when the joining is successful and (B) the state when the joining fails. [Figure 5] This is a conceptual diagram showing the waveform of a specific sound obtained when the connection is successful. [Modes for carrying out the invention]

[0015] [1] Embodiment [1-1]Joining device Figure 1 is a conceptual diagram showing a bonding apparatus according to an embodiment. This bonding apparatus is a device that bonds a chip (such as an LSI or IC; hereinafter referred to as "first bonding target W1") to the surface of a substrate (such as a wafer; hereinafter referred to as "second bonding target W2") by pressing it, and comprises a holding mechanism 1, a pressing mechanism 2, an alignment mechanism 3, a detection sensor 4A, a sound collection unit 4B, and a control device 5.

[0016] The holding mechanism 1 comprises a sheet holding section 11, a table 12, and a drive section 13.

[0017] The sheet holding portion 11 is a part that holds the peripheral edge of an elastically deformable sheet Sw (such as a dicing tape) while applying tension to the sheet Sw. In this embodiment, such a sheet Sw is prepared with multiple first bonding targets W1 attached to one side, and is held in the sheet holding portion 11 with that side facing downwards. Details of the sheet Sw will be described later.

[0018] Table 12 is a part that holds the second bonding target W2 at a position below the sheet Sw held by the sheet holding portion 11, and is equipped with a chuck function (such as vacuum suction or electrostatic chuck) for fixing the second bonding target W2. Here, a circuit is formed on the second bonding target W2, and on the surface of the second bonding target W2, a bonding position Pt of the first bonding target W1 is set at a predetermined position corresponding to the circuit (specifically, a predetermined position where connection to the circuit is possible). Therefore, on the table 12, the second bonding target W2 is held in a state where the bonding surface with the first bonding target W1 (the surface where the bonding position Pt of the first bonding target W1 is provided) faces upward.

[0019] The drive unit 13 is a mechanism that enables the vertical movement of the table 12 and the position adjustment of the table 12 within a horizontal plane, and is composed of, for example, a ball screw and a motor. According to such a position adjustment of the table 12, when joining one target (hereinafter referred to as "execution target Wt") selected from a plurality of first bonding targets W1 attached to the sheet Sw to the corresponding bonding position Pt, position adjustment can be performed to oppose the bonding position Pt to the execution target Wt. And after such position adjustment, the final alignment of the execution target Wt with respect to the bonding position Pt is performed by the alignment mechanism 3 described later.

[0020] In the present embodiment, the bonding device is configured to be able to press and bond a plurality of first bonding targets W1 attached to the sheet Sw one by one to the surface of the second bonding target W2. Specifically, it is as follows.

[0021] The pressing mechanism 2 includes a pressing portion 21, a peripheral holding portion 22, and drive units 23 and 24.

[0022] The pressing portion 21 is the part that presses the object to be worked on Wt, which is attached to the sheet Sw, against the surface of the second object to be joined W2. Specifically, the pressing portion 21 has a suction surface 21p at its tip (lower end). In this embodiment, this suction surface 21p is configured to adhere to the back surface of the sheet Sw by vacuum suction. The pressing portion 21 is also configured to move up and down by the power of the drive unit 23. More specifically, the pressing portion 21 is configured to move up and down independently of the peripheral holding portion 22, which will be described later.

[0023] With this pressing section 21, the back surface of the area of ​​the sheet Sw to which the object to be worked on Wt is attached is adsorbed to the adsorption surface 21p, thereby holding the object to be worked on Wt via the sheet Sw to the adsorption surface 21p (see Figure 2(B)). Furthermore, while the object to be worked on Wt is held by the adsorption surface 21p of the pressing section 21 in this state, the pressing section 21 is lowered to bring the adsorption surface 21p closer to the surface of the second object to be joined W2, thereby pressing the object to be worked on the surface of the second object to be joined W2 while elastically deforming the sheet Sw (see Figure 3(B)). In other words, the object to be worked on Wt can be pressed from the back side of the sheet Sw, thereby pressing it onto the surface of the second object to be joined W2 while elastically deforming the sheet Sw.

[0024] The peripheral holding portion 22 is the part that holds the area surrounding the region on the sheet Sw to which the target Wt is attached when the target Wt is pressed. Specifically, the peripheral holding portion 22 has a suction surface 22p at its tip (lower end). In this embodiment, this suction surface 22p is configured to adhere to the back surface of the sheet Sw by vacuum suction. Furthermore, the peripheral holding portion 22 is configured to move up and down by the power of the drive unit 24.

[0025] With this peripheral holding portion 22, when the pressing portion 21 presses the target Wt, the peripheral region of the sheet Sw to which the target Wt is attached can be held by the suction surface 22p and kept in the same position (see Figure 3(B)). As a result, when the target Wt is pressed, the sheet Sw can be elastically deformed and appropriately bent inside the suction surface 22p, and as a result, it becomes easier to cause the target Wt to ​​peel off from the sheet Sw.

[0026] The alignment mechanism 3 is a mechanism that enables position adjustment of the pressing mechanism 2, and is composed of, for example, a ball screw and a motor. Specifically, when this alignment mechanism 3 performs position adjustment of the pressing mechanism 2 as follows when aligning the target Wt with respect to the joining position Pt provided on the surface of the second target W2 to be joined (the final position adjustment described above).

[0027] The alignment mechanism 3 moves the pressing mechanism 2 to a position where the object to be worked on Wt can be held from the rear side (in other words, a position above the corresponding joining position Pt). After the object to be worked on Wt is held by the suction surface 21p of the pressing part 21 via the sheet Sw, the alignment mechanism 3 aligns the object to be worked on Wt with respect to the joining position Pt. Here, since the sheet Sw is elastically deformable, even after the object to be worked on Wt is held by the suction surface 21p via the sheet Sw, the alignment mechanism 3 can adjust the position of the pressing mechanism 2 (i.e., align the object to be worked on Wt with respect to the joining position Pt) while elastically deforming the sheet Sw. Thus, in the joining device of this embodiment, the alignment of the object to be worked on Wt with respect to the joining position Pt can be performed without being affected by the sheet Sw.

[0028] The detection sensor 4A is a sensor that detects alignment marks formed on the first bonding target W1 and the second bonding target W2. Specifically, the detection sensor 4A is an image sensor that acquires an image including the image or shadow of the alignment marks by detecting light from a light source that creates the image or shadow of the alignment marks.

[0029] With such a detection sensor 4A, it becomes possible to align (correct misalignment of) two corresponding alignment marks while observing the two alignment marks.

[0030] The sound collection unit 4B is composed of a sound collection device such as a microphone and is positioned to acquire sound generated in or around the sheet Sw held by the sheet holding unit 11. The sound obtained by the sound collection unit 4B is transmitted to the control device 5 and used for determining whether or not to combine the sound, as described later.

[0031] The control device 5 comprises a control unit 51 and a storage unit 52. The control unit 51 is responsible for executing the processes performed by the control device 5. Specifically, the control unit 51 is composed of processing devices such as a CPU or MPU, and by executing control programs installed in the control device 5, it implements the processes it is responsible for (such as the joining process and the joining / combination determination process described below) using software. The storage unit 52 is composed of storage devices such as RAM or ROM, and stores information necessary for the processes performed by the control device 5 (including installed control programs).

[0032] Furthermore, the control program described above may be stored in a readable state on a portable storage medium (e.g., flash memory) before installation in the bonding device, or it may be stored in a downloadable state on another server. In addition, the processing performed by the control device 5 is not limited to being implemented in software by executing a program, but may also be implemented in hardware by processing circuits built within the control device 5.

[0033] [1-2] Processing performed by the control unit [1-2-1] Joining process Figures 2(A) to 4(A) are conceptual diagrams that sequentially show the changes in the state of the joining device that occur when the joining process is performed.

[0034] When the joining process begins, the control device 5 first controls the alignment mechanism 3 to move the pressing mechanism 2 to a position where it can hold the object to be joined Wt from the back side (in other words, a position above the corresponding joining position Pt) in order to align the object to be joined Wt with respect to the joining position Pt provided on the surface of the second object to be joined W2 (step S101; see Figure 2(A)). At this time, the control device 5 observes the alignment marks provided on both the object to be joined Wt and the joining position Pt with the detection sensor 4A and controls the drive unit 13 to adjust the position of the table 12 that holds the second object to be joined W2, thereby also adjusting the position so that the joining position Pt faces the object to be joined Wt.

[0035] After step S101, the control device 5 controls the drive units 23 and 24 of the pressing mechanism 2 to lower the pressing unit 21 and the peripheral holding unit 22, thereby causing the back surface of the area of ​​the sheet Sw to which the target Wt is attached to be attracted to the suction surface 21p of the pressing unit 21, and the back surface of the surrounding area to be attracted to the suction surface 22p of the peripheral holding unit 22 (step S102; see Figure 2(B)). As a result, the target Wt is held by the suction surface 21p of the pressing unit 21 via the sheet Sw, and the surrounding area of ​​the sheet Sw to which the target Wt is attached is held by the suction surface 22p of the peripheral holding unit 22.

[0036] After step S102, the control device 5 adjusts the position of the pressing mechanism 2 by controlling the alignment mechanism 3 (step S103; see Figure 3(A)). Specifically, the control device 5 observes the alignment marks provided on both the target Wt and the joining position Pt with the detection sensor 4A, and adjusts the position of the target Wt so that the two corresponding alignment marks overlap precisely. This ensures that the target Wt is aligned with respect to the joining position Pt (the final alignment described above) with high accuracy.

[0037] After step S103, the control device 5 controls the drive unit 23 of the pressing mechanism 2 to lower the pressing unit 21, thereby pressing the object to be executed Wt onto the surface of the second object to be joined W2 (step S104; see Figure 3(B)).

[0038] Furthermore, in step S104, when the control device 5 lowers the pressing unit 21, it keeps the peripheral holding unit 22 in the same position. This makes it possible to elastically deform the sheet Sw on the inside of the suction surface 22p and allow it to bend appropriately when the target Wt is pressed, and as a result it becomes easier to cause the target Wt to ​​peel off from the sheet Sw.

[0039] After step S104, the control device 5 controls the drive unit 23 of the pressing mechanism 2 to raise the pressing unit 21, thereby releasing the pressure on the target Wt by the pressing unit 21 (step S105; see Figure 4(A)). As a result, the sheet Sw returns from its elastically deformed state to its original state. Then, as shown in Figure 4(A), if the joining of the target Wt is successful (if the target Wt is firmly adhered to the surface of the second joining target W2 by pressing), the sheet Sw will peel off from the target Wt during the process of returning to its original state.

[0040] The control device 5 performs these joining processes (steps S101 to S105) one by one for each of the multiple first joining targets W1 attached to the sheet Sw.

[0041] Here, the inventors have found that when the bonding of the target Wt is successful, a peeling sound is generated when the sheet Sw peels off from the target Wt during the process of the sheet Sw returning to its original state in step S105. The inventors have also found that when the bonding of the target Wt fails, no peeling sound is generated during the process of the sheet Sw returning to its original state. Specifically, as shown in Figure 4(B), when the bonding of the target Wt fails (when the target Wt does not adhere to the surface of the second bonding target W2 even with pressure), the inventors have found that when the sheet Sw returns to its original state, the target Wt returns to its original position together with the sheet Sw, remaining attached to the sheet Sw without peeling off. Therefore, it has been found that when the bonding of the target Wt fails, the sheet Sw returns to its original state without generating a peeling sound. In this embodiment, the presence or absence of a peeling sound depending on whether bonding is successful or not is used to determine whether bonding is successful or not. This will be explained in detail below.

[0042] [1-2-2] Determination process for whether or not to combine The joining failure determination process determines whether the joining of the first joining target W1 to the second joining target W2 is successful, and is executed each time the joining process described above is performed for one first joining target W1 (execution target Wt).

[0043] Specifically, the control device 5 determines whether the sheet Sw has detached from the execution target Wt in step S105 of the joining process based on the sound obtained by the sound collection unit 4B during a predetermined period (at least the period including step S105; however, this is not particularly limited, for example, the period from the start of step S103 to the completion of S105) while performing the joining process on one first joining target W1 (execution target Wt), and thereby determines whether the joining is successful or not. More specifically, it is as follows.

[0044] First, the control device 5 extracts from the sound acquired by the sound collection unit 4B only sounds with the same frequency as the separated sound described above, or one or more of those frequencies, through a filtering process (step S201). Hereafter, the sounds extracted in step S201 will be referred to as "specific sounds".

[0045] Figure 5 is a conceptual diagram showing the waveform of the specific sound obtained in step S201 when the joining is successful. In Figure 5, the horizontal axis represents elapsed time, and the vertical axis represents the magnitude Iv of the specific sound. As shown in this figure, when the joining is successful, a sharp peak occurs in the waveform of the specific sound at the time the delamination sound occurs. Therefore, after extracting the specific sound in step S201, by determining whether or not a peak occurs in its waveform, it is possible to accurately determine whether or not a delamination sound occurred on or around sheet Sw.

[0046] Therefore, in order to determine whether the above-mentioned peak has occurred, the control device 5 determines whether the loudness Iv of the specific sound extracted in step S201 became greater than or equal to a predetermined value Iv0 at some point within a predetermined period (step S202). Specifically, the control device 5 determines whether there is a point in the waveform of the specific sound extracted in step S201 where the loudness Iv becomes greater than or equal to a predetermined value Iv0.

[0047] Then, if the control device 5 determines in step S202 that "the predetermined value Iv0 or higher (Yes)", it determines that the sheet Sw has detached from the first joining target W1 (execution target Wt), and based on that determination, it determines that the joining was successful. On the other hand, if the control device 5 determines in step S202 that "the predetermined value Iv0 or higher (Yes)", it determines that the sheet Sw has not detached from the first joining target W1 (execution target Wt), and based on that determination, it determines that the joining was unsuccessful.

[0048] This type of judgment process allows for real-time determination of the success or failure of each individual joint for the first joint target W1 by utilizing the sound generated on or around the sheet Sw. As a result, the success or failure of each joint can be determined immediately without interrupting the process. Furthermore, failures in joints can be detected early. Therefore, for example, if successive joint failures are detected, the operation of the jointing device can be stopped (processing interrupted) to check the cause of the failure. This improves the yield compared to the conventional method where the success or failure of a joint could not be determined until a series of processes were completed.

[0049] [1-3] Sheet The sheet Sw according to this embodiment may consist of one layer or multiple layers. In this embodiment, in order to reliably hold the first bonding target W1, the sheet Sw preferably has a substrate and an adhesive layer. Furthermore, it is preferable that the adhesive layer is formed on at least one main surface of the substrate. In order to facilitate the optical detection of the alignment marks described above through the sheet Sw, it is preferable that the sheet Sw is highly transparent.

[0050] [1-3-1] Base material The base material is a film-like component that provides rigidity to the sheet Sw. The base material should be made of a material that enables it to hold the first object to be joined W1 before, during, and after the joining process. The sheet Sw may also serve as a tape used in the dicing or backgrinding process, which is performed before or after the joining process. That is, the sheet Sw may be a dicing tape or a backgrinding tape, etc.

[0051] Examples of materials for the substrate include various resin films. The substrate may consist of a single-layer film made of one resin film, or it may consist of a multi-layer film made of multiple resin films laminated together.

[0052] When sheet Sw is used as a dicing tape, polyolefin films and ethylene copolymer films are preferred as the resin film. Among polyolefin films, polyethylene films are preferred, and low-density polyethylene (LDPE) films are particularly preferred. Among ethylene copolymer films, ethylene-(meth)acrylic acid copolymer films are preferred. When sheet Sw is used as a backgrind tape, polyolefin films, polyurethane acrylate films, and polyester films are preferred as the resin film. These resin films make it easier to satisfy the above-mentioned physical properties and achieve suitability for each process. From the viewpoint of making it easier to restore the elastic deformation of sheet Sw, it is preferable that the resin film has low stress relaxation properties, and it is preferable to use polyolefin films, ethylene copolymer films, polyester films, or laminated films thereof as the resin film.

[0053] On the other hand, in this embodiment, polyvinyl chloride-based films such as polyvinyl chloride films and polyvinyl chloride copolymer films are undesirable. In particular, if a polyvinyl chloride-based film containing a plasticizer is included in the substrate, the plasticizer that migrates to the adhesive layer may contaminate the first bonding target W1. Therefore, it is preferable that the substrate does not contain a polyvinyl chloride-based film containing a plasticizer. Furthermore, polyvinyl chloride-based films are undesirable from the viewpoint that they have high stress relaxation properties, making it difficult for the elastic deformation of the sheet Sw to recover.

[0054] [1-3-2] Adhesive layer The adhesive layer is attached to the surface of the first object to be joined W1 and holds the first object to be joined W1. The composition of the adhesive layer should be determined so that it exhibits sufficient tackiness and re-peelability to be peeled off after holding the first object to be joined W1. In this embodiment, the adhesive layer is preferably composed of an adhesive formed using an adhesive composition. Examples of adhesives include acrylic adhesives, urethane adhesives, rubber adhesives, silicone adhesives, polyester adhesives, and polyvinyl ether adhesives. In this embodiment, the adhesive is preferably an acrylic adhesive.

[0055] In this embodiment, the adhesive is preferably energy-ray curable. Energy-ray curable adhesives lose their adhesive strength when irradiated with energy rays. Therefore, when peeling the workpiece processing sheet from the workpiece or workpiece, irradiating the adhesive layer with energy rays makes it possible to easily peel off the workpiece processing sheet. Here, "energy rays" refers to ultraviolet rays, electron beams, etc., and ultraviolet rays are preferred. Because energy-ray curable adhesives have high viscosity before being cured by energy rays, they tend to conform to the unevenness of the surface of the first bonding target W1 after application. Therefore, it is presumed that the sound during peeling tends to be louder.

[0056] In this embodiment, the energy-ray curable adhesive may be mainly composed of an energy-ray curable polymer, or it may be mainly composed of a mixture of an energy-ray curable polymer and an energy-ray curable polyfunctional monomer and / or oligomer. Furthermore, it may be mainly composed of a mixture of an energy-ray curable polymer and an energy-ray curable polyfunctional monomer and / or oligomer.

[0057] In this embodiment, the energy-ray curable adhesive is preferably an acrylic adhesive formed using an acrylic adhesive composition. The acrylic adhesive composition contains an acrylic polymer.

[0058] [2] Variant [2-1] First variation In the joining device described above, if the control device 5 determines in the judgment process that the joining has failed, it may retry joining to the second joining target W2 at the same position by performing the joining process again using a different first joining target W1 than the first joining target W1 that failed to join.

[0059] The joining device described above can determine the success or failure of a joint in real time, so if a joint fails, this can be detected immediately. Therefore, even if a joint fails, as in this modified example, it is possible to retry joining at the same location using a different first joining target W1 immediately after the failure. This reduces the number of areas that remain in a failed state, and as a result, the yield can be improved.

[0060] [2-2] Second variation The joining device described above may be modified as appropriate to perform the joining of the first joining target W1 and the second joining target W2 in a position where their joining surfaces are oriented laterally (horizontally).

[0061] [2-3] Third variation The bonding apparatus described above can be applied not only when bonding a chip (first bonding target W1) to a substrate (second bonding target W2), but also when bonding a chip (first bonding target W1) to another chip (second bonding target W2).

[0062] [2-4] Fourth variation If the sheet Sw has an adhesive layer that is curable by energy rays, it is preferable to irradiate the sheet Sw with energy rays beforehand in the bonding process described above. By irradiating the adhesive layer of the sheet Sw with energy rays before the bonding process, the tackiness of the sheet Sw can be reduced, and as a result, it becomes possible to easily peel the sheet Sw from the first bonding target W1 by restoring the elastic deformation of the sheet Sw. If the energy ray is ultraviolet light, the irradiation conditions are, for example, an illuminance of 230 mW / cm². 2 Total luminous intensity 190 mJ / cm² 2Furthermore, the aforementioned bonding apparatus may also be equipped with an energy source.

[0063] The above-described embodiments and modifications should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims, rather than by the above-described embodiments and modifications. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the claims.

[0064] Furthermore, from the above-described embodiments and modifications, a portion of the configuration of the joining device may be extracted as the subject of the invention, or a portion or all of the processes executed by the control device 5 (such as joining processes and processes for determining whether or not to join, including methods corresponding to those processes), or programs for executing them, may be extracted. [Explanation of Symbols]

[0065] 1 Retention mechanism 2. Pressing mechanism 3. Alignment Mechanism 4A detection sensor 4B Sound Collection Section 5 Control device 11 Sheet holding section 12 tables 13 Drive unit 21 Pressing part 21p suction surface 22 Peripheral holding part 22p suction surface 23, 24 Drive unit 51 Control Unit 52 Storage section IV size Pt joint position Sw Seat W1 First Joining Target W2 Second Joint Target Wt Execution Target Iv0 Predetermined value

Claims

1. The first object to be joined includes a sheet holding portion that holds the peripheral edge of a sheet attached to its surface, A pressing mechanism that can press the first object to be joined against the second object to be joined while elastically deforming the sheet by pressing the first object to be joined from the back side of the sheet, A sound collection unit that acquires sound generated on or around the aforementioned sheet, As a determination process for determining whether the joining of the first joining target to the second joining target is successful, the control unit determines, based on the sound acquired by the sound collection unit, whether the sheet has detached from the first joining target during the process in which the sheet returns to its original state by releasing the pressure on the first joining target by the pressing mechanism, and thereby determines whether the joining is successful or not. A joining device equipped with the following features.

2. In the determination process, the control unit, From the sound acquired by the sound collection unit, sounds with the same frequency as those included in the peeling sound generated when the first bonding target peels off the sheet, or one or more of those frequencies, are extracted as specific sounds. Then, a determination is made as to whether the loudness of the aforementioned specific sound exceeds a predetermined value. The joining apparatus according to claim 1, wherein if the judgment determines that the value is greater than or equal to a predetermined value, the apparatus determines that the sheet has peeled off from the first joining target, and based on that determination, the apparatus determines that the joining was successful.

3. The joining apparatus according to claim 1 or 2, wherein if the control unit determines in the determination process that the joining has failed, it retrys joining the second joining target at the same position using a first joining target different from the first joining target that failed to join.

4. A joining process in which the first object to be joined is pressed against the second object to be joined by pressing the first object to be joined from the back side of a sheet attached to the surface of the first object to be joined, thereby causing the sheet to elastically deform and pressing the first object to be joined against the second object to be joined, A determination process is performed to acquire the sound generated when the sheet returns from an elastically deformed state to its original state, to determine whether the sheet has detached from the first object to be joined based on that sound, and thereby determine whether the joining was successful or not. A method for determining whether or not to combine, including the method for determining whether or not to combine.

5. A sheet used in the method for determining whether or not to combine according to claim 4.

6. The sheet according to claim 5, comprising a base material and an adhesive layer.

7. The sheet according to claim 6, wherein the substrate does not contain a polyvinyl chloride film containing a plasticizer.

8. The sheet according to claim 6, wherein the adhesive layer is composed of an energy ray curable adhesive.

9. The sheet according to claim 6, wherein the adhesive layer is composed of an acrylic adhesive.

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