Method for manufacturing a stretchable device and stretchable device

Abstract

The present invention provides a method for manufacturing a stretchable device that can suppress damage to the detection substrate during manufacturing. [Solution] A method for manufacturing a stretchable device includes: a preparation step of preparing a glass plate having a first surface facing a first stacking direction; a detection substrate formation step of forming a detection substrate having a plurality of through holes formed on the first surface of the glass plate; an ultraviolet absorption layer formation step of forming an ultraviolet absorption layer on the portion of the first surface of the glass plate that is exposed from the through holes and the portion that is exposed around the detection substrate; a stretchable resin stacking step of stacking a stretchable resin on the detection substrate from the first stacking direction and pressing the stretchable resin from the first stacking direction to make it adhere to the detection substrate; an ultraviolet irradiation step of irradiating the ultraviolet absorption layer with ultraviolet light from a second stacking direction opposite to the first stacking direction to modify it into a carbonized layer; and a peeling step of peeling the stretchable resin and the detection substrate from the glass plate.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a stretchable device and a stretchable device.

Background Art

[0002] A stretchable device is a device formed in a plate shape and having excellent stretchability and flexibility. The stretchable device includes a detection substrate and two stretchable resins sandwiching the detection substrate. As shown in, for example, Patent Document 1, the detection substrate is provided with a plurality of through holes. The plurality of through holes are arranged in a matrix. Therefore, the detection substrate has a plurality of hinge portions extending between the through holes and a plurality of body portions connecting the ends of the hinge portions. Further, the shape of the hinge portion is a meandering meander shape.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the manufacturing process of a conventional stretchable device, a stretchable resin is overlapped on a detection substrate arranged on a glass plate, and the detection substrate and the stretchable resin are adhered. Then, the detection substrate and the stretchable resin are peeled off from the glass plate. Next, another stretchable resin is overlapped on the surface of both sides of the detection substrate where the stretchable resin is not adhered.

[0005] When a stretchable resin is layered on a detection substrate on a glass plate, the stretchable resin adheres to the glass plate by passing through holes in the detection substrate. It also adheres to the portion of the glass plate exposed around the detection substrate. Therefore, when one end of the stretchable resin is lifted and peeled away from the glass plate, a tensile load acts between the lifted end and the portion adhering to the glass plate, causing the resin to stretch. This can result in excessive tensile load being applied to the detection substrate, potentially causing it to break. Therefore, it is desirable to suppress damage to the detection substrate during the manufacturing of stretchable devices.

[0006] The present invention aims to provide a method for manufacturing a stretchable device that can suppress damage to the detection substrate during manufacturing, and to provide a stretchable device. [Means for solving the problem]

[0007] A method for manufacturing a stretchable device according to a first aspect of the present disclosure includes: a preparation step of preparing a glass plate having a first surface facing a first stacking direction; a detection substrate forming step of forming a detection substrate having a plurality of through holes on the first surface of the glass plate; an ultraviolet absorption layer forming step of forming an ultraviolet absorption layer on the portion of the first surface of the glass plate that is exposed from the through holes and the portion that is exposed from around the detection substrate; a stretchable resin lamination step of laminating a stretchable resin onto the detection substrate from the first stacking direction and pressing the stretchable resin from the first stacking direction to make it adhere to the detection substrate; an ultraviolet irradiation step of irradiating the ultraviolet absorption layer with ultraviolet light from a second stacking direction opposite to the first stacking direction to modify it into a carbonized layer; and a peeling step of peeling the stretchable resin and the detection substrate from the glass plate.

[0008] Furthermore, a stretchable device according to a second aspect of the present disclosure comprises: a first stretchable resin having opposing surfaces facing a first stacking direction; a detection substrate having a plurality of through holes and stacked on the opposing surfaces; a carbonized layer stacked on the portion of the opposing surfaces exposed from the through holes and the portion exposed from around the detection substrate; and a second stretchable resin stacked on the detection substrate from the first stacking direction, with a portion of it adhering to the carbonized layer. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a perspective view of the stretchable device according to Embodiment 1. [Figure 2] Figure 2 is a schematic diagram showing a cross-section of the stretchable device according to Embodiment 1, and more specifically, it is a cross-sectional view taken along the line II-II in Figure 3. [Figure 3] Figure 3 is a plan view of the detection substrate laminated on the first stretchable resin of Embodiment 1, as seen from the first lamination direction. [Figure 4] Figure 4 is an enlarged view of the vertical hinge portion of Embodiment 1. [Figure 5] Figure 5 is an enlarged view of the case where the vertical hinge portion of Embodiment 1 is extended in the first direction. [Figure 6] Figure 6 is a flowchart showing the first half of the manufacturing method for the stretchable device according to Embodiment 1. [Figure 7] Figure 7 is a flowchart showing an intermediate step in the manufacturing method of the stretchable device according to Embodiment 1. [Figure 8] Figure 8 is a flowchart showing the latter half of the manufacturing method for the stretchable device according to Embodiment 1. [Figure 9] Figure 9 is a schematic diagram showing the ultraviolet absorption layer formation process of modified example 1. [Figure 10] Figure 10 is a schematic diagram showing a cross-section of a stretchable device manufactured by the manufacturing method of Modification Example 1. [Modes for carrying out the invention]

[0010] Embodiments for implementing this disclosure will be described in detail with reference to the drawings. The invention of this disclosure is not limited by the contents described in the following embodiments. Furthermore, the components described below include those that can be easily conceived by a person skilled in the art, and those that are substantially the same. Moreover, the components described below can be combined as appropriate. It should be noted that the disclosure is merely an example, and any modifications that can be easily conceived by a person skilled in the art while maintaining the spirit of the invention are naturally included within the scope of the present invention. In order to make the explanation clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and each drawing, components similar to those described above with respect to previously shown drawings are denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.

[0011] Furthermore, in this specification and the claims, when describing a manner in which one structure is placed on top of another structure, unless otherwise specified, the term "on top of" includes both cases: when one structure is placed directly on top of another structure so as to be in contact with it, and when another structure is placed above another structure via yet another structure.

[0012] (Embodiment 1) Figure 1 is a perspective view of a stretchable device according to Embodiment 1. As shown in Figure 1, the stretchable device 100 is formed in a flat plate shape. The stretchable device 100 has a front surface 1 and a back surface 2 (not shown in Figure 1; see Figure 2) facing opposite directions. Hereinafter, the direction parallel to each of the front surface 1 and back surface 2 will be referred to as the planar direction.

[0013] FIG. 2 is a diagram schematically showing a cross-section of the stretchable device according to Embodiment 1, and more specifically, is a cross-sectional view taken along the line II-II in FIG. 3. As shown in FIG. 2, the stretchable device 100 has a first stretchable resin 40, a detection substrate 10, and a second stretchable resin 50 that are sequentially laminated. Hereinafter, the direction in which the first stretchable resin 40, the detection substrate 10, and the second stretchable resin 50 are arranged is referred to as the lamination direction. Therefore, the detection substrate 10 is sandwiched between two stretchable resins (the first stretchable resin 40 and the second stretchable resin 50) from both sides in the lamination direction.

[0014] Hereinafter, regarding the lamination direction, the direction in which the second stretchable resin 50 is arranged when viewed from the first stretchable resin 40 is referred to as the first lamination direction Z1, and the opposite direction of the first lamination direction Z1 is referred to as the second lamination direction Z2. Further, viewing the stretchable device 100 from the first lamination direction Z1 is referred to as a plan view.

[0015] As shown in FIG. 1, the stretchable device 100 is formed in a rectangular (quadrilateral) shape in plan view. Therefore, the surface 1 of the stretchable device 100 has a pair of long sides 3 and a pair of short sides 4. Hereinafter, the direction parallel to the plane direction and parallel to the long side 3 is referred to as the first direction X, and the direction parallel to the short side 4 is referred to as the second direction Y.

[0016] FIG. 3 is a plan view of the detection substrate laminated on the first stretchable resin of Embodiment 1 viewed from the first lamination direction. As shown in FIG. 3, the detection substrate 10 has a plurality of body portions 11 arranged at intervals in the first direction X and the second direction Y, and a plurality of hinge portions 12 extending in the plane direction while meandering. And in the range surrounded by the four hinge portions 12, there is a through hole 19 penetrating the detection substrate 10 in the lamination direction.

[0017] FIG. 4 is an enlarged view of the vertical hinge portion of Embodiment 1. As shown in FIG. 4, the body portion 11 has an octagonal shape in plan view. The plurality of body portions 11 are arranged in the first direction X and the second direction Y and are separated from each other. Note that the present disclosure is not limited to the octagonal shape of the body portion 11 in plan view, and may be a circular shape or other polygonal shapes.

[0018] As shown in FIG. 3, the hinge portion 12 connects adjacent body portions 11. The hinge portion 12 includes two types: a vertical hinge portion 12A extending in the first direction X and a horizontal hinge portion 12B extending in the second direction Y. In a plan view, when the vertical hinge portion 12A is rotated 90°, it has the same shape as the horizontal hinge portion 12B. In the following description of the hinge portion 12, the vertical hinge portion 12A will be described as a representative example, and the description of the horizontal hinge portion 12B will be omitted.

[0019] As shown in FIG. 4, the vertical hinge portion 12A has four bent portions 13 and extends in the first direction X while meandering. Each bent portion 13 of the present embodiment forms an arc shape. Note that the bent portion of the present disclosure may not be arc-shaped but may be formed in an angular shape. Also, the number of bent portions is not limited to four.

[0020] The four bent portions 13 are a first arc portion 14, a second arc portion 15, a third arc portion 16, and a fourth arc portion 17 that are arranged in order in the first direction X. The first arc portion 14 and the fourth arc portion 17 form a quarter circle and are bent at 90 degrees. The second arc portion 15 and the third arc portion 16 form a semi-arc shape and are bent at 180 degrees.

[0021] FIG. 5 is an enlarged view when the vertical hinge portion of Embodiment 1 extends in the first direction. As shown in FIG. 5, when a tensile load in the first direction X (see the arrow F in FIG. 5) acts on the vertical hinge portion 12A, the first arc portion 14, the second arc portion 15, the third arc portion 16, and the fourth arc portion 17 are each deformed so that the curvature becomes smaller. As a result, the distance from one end to the other end of the vertical hinge portion 12A increases, and the body portions 11 are separated from each other. Also, although not particularly shown, when a compressive load in the first direction X acts on the vertical hinge portion 12A, the first arc portion 14, the second arc portion 15, the third arc portion 16, and the fourth arc portion 17 are each deformed so that the curvature becomes larger. As a result, the distance from one end to the other end of the vertical hinge portion 12A decreases, and the body portions 11 approach each other.

[0022] As shown in Figure 3, the area surrounded by the four hinge portions 12 arranged in an annular (square) shape is a through-hole 19 that penetrates the detection substrate 10 in the stacking direction. In other words, the detection substrate 10 is provided with multiple through-holes 19.

[0023] As shown in Figure 2, the detection substrate 10 has a resin substrate 20 and an array layer 21. The resin substrate 20 is a substrate for manufacturing the array layer 21 and has elasticity, flexibility, and insulation properties. The resin substrate 20 is manufactured from a resin material such as polyimide.

[0024] The array layer 21 comprises a plurality of insulating layers (not shown) stacked in the stacking direction, and an electrical circuit whose insulation from the outside is ensured by the plurality of insulating layers. Examples of electrical circuits include load detection circuits that detect the expansion and contraction of the stretchable device 100 in the planar direction and the deflection of the stretchable device 100. In addition, this disclosure may include pressure detection circuits that detect loads applied to the surface 1, or detection circuits that detect light incident on the surface 1, and is not particularly limited.

[0025] As shown in Figure 2, the first stretchable resin 40 and the second stretchable resin 50 have insulating properties, stretchability, and flexibility. Examples of resins used as the first stretchable resin 40 and the second stretchable resin 50 include acrylic elastomers. However, the first stretchable resin 40 and the second stretchable resin 50 in this disclosure are not limited to acrylic elastomers, and may be acrylic resins, epoxy resins, urethane resins, etc., and are not particularly limited.

[0026] The first stretchable resin 40 and the second stretchable resin 50 are formed in a plate shape and extend in a planar direction. The surface of the first stretchable resin 40 in the second stacking direction Z2 constitutes the back surface 2 of the stretchable device 100. The first stretchable resin 40 has a facing surface 41 that faces the first stacking direction Z1 and faces the detection substrate 10.

[0027] The surface of the second stretchable resin 50 in the first lamination direction Z1 constitutes the surface 1 of the stretchable device 100. The second stretchable resin 50 has a facing surface 51 that faces the detection substrate 10 and is oriented in the second lamination direction Z2.

[0028] Regarding the size in the planar direction, the first stretchable resin 40 and the second stretchable resin 50 are larger than the detection substrate 10. Hereinafter, when viewed from above, the portion of the first stretchable resin 40 that does not overlap with the detection substrate 10 and is located around (outside) the detection substrate 10 will be referred to as the edge portion 42. Similarly, when viewed from above, the portion of the second stretchable resin 50 that does not overlap with the detection substrate 10 and is located around (outside) the detection substrate 10 will be referred to as the edge portion 52.

[0029] The edge 52 of the second stretchable resin 50 is extruded in the second stacking direction Z2 beyond the surface 10b of the detection substrate 10 in the first stacking direction Z1. Therefore, the edge 52 of the second stretchable resin 50 constitutes a frame surrounding the detection substrate 10. A portion of the second stretchable resin 50 is extruded into the through hole 19, filling the through hole 19. Hereinafter, the portion of the second stretchable resin 50 that has entered the through hole 19 will be referred to as the protrusion 55. Hereinafter, the portion of the opposing surface 41 of the first stretchable resin 40 that is located at the edge 42 will be referred to as the outer frame surface 44, and the portion that overlaps with the through hole 19 in the stacking direction will be referred to as the bottom surface 45.

[0030] As shown in Figure 2, the carbonized layer 30 is laminated on the outer frame surface 44 and the bottom surface 45 of the opposing surfaces 41 of the first stretchable resin 40, and adheres to the first stretchable resin 40. The carbonized layer 30 located on the outer frame surface 44 covers the entire outer frame surface 44. Therefore, the edge portion 52 of the second stretchable resin 50 adheres to the carbonized layer 30 located on the outer frame surface 44, but does not adhere to the edge portion 42 (outer frame surface 44) of the first stretchable resin 40. Furthermore, the carbonized layer 30 located on the bottom surface 45 extends in the planar direction and blocks the through hole 19. Therefore, the protrusion 55 located in the through hole 19 adheres to the carbonized layer 30, but does not adhere to the bottom surface 45 of the first stretchable resin 40. From the above, the first stretchable resin 40 and the second stretchable resin 50 are integrated via the carbonized layer 30.

[0031] In addition, an ultraviolet absorbing layer 130 is formed on the side surface 10a of the through hole 19 of the detection substrate 10 and on the surface 10b of the detection substrate 10 in the first stacking direction Z1. The side surface 10a and the surface 10b are sometimes collectively referred to as the surface of the detection substrate 10. Next, the manufacturing method of the stretchable device 100 of Embodiment 1 will be described.

[0032] Figure 6 is a flowchart showing the first half of the manufacturing method for the stretchable device according to Embodiment 1. Figure 7 is a flowchart showing the middle of the manufacturing method for the stretchable device according to Embodiment 1. Figure 8 is a flowchart showing the second half of the manufacturing method for the stretchable device according to Embodiment 1.

[0033] As shown in Figures 6 to 8, the manufacturing method of the stretchable device 100 includes a preparation step S1, a resin substrate formation step S3, an array layer formation step S5, an ultraviolet absorption layer formation step S7, an ultraviolet irradiation step S9, a second stretchable resin lamination step (stretchable resin lamination step) S11, a peeling step S13, and a first stretchable resin lamination step S15.

[0034] As shown in Figure 6, preparation step S1 is the step of preparing the glass plate 120. The glass plate 120 has a first surface 121 facing the first stacking direction Z1 and a second surface 122 facing the second stacking direction Z2.

[0035] In the resin substrate formation process S3, first a solid resin layer is formed on the first surface 121 of the glass plate 120. Next, a mask is placed in the first stacking direction Z1 of the resin layer and etching is performed. This forms first through holes 19a in the resin layer, and the resin substrate 20 is formed.

[0036] In the array layer formation step S5, an array layer 21 is formed in the first stacking direction Z1 of the resin substrate 20. A second through-hole 19b is formed in the array layer 21, which is continuous with the first through-hole 19a. As a result, the resin substrate 20 and the array layer 21 are integrated to form the detection substrate 10. Furthermore, the first through-hole 19a and the second through-hole 19b are continuous to form a through-hole 19.

[0037] The resin substrate formation process S3 and the array layer formation process S5 are sometimes collectively referred to as the detection substrate formation process, which forms the detection substrate 10. Furthermore, after the detection substrate formation process (after the array layer formation process S5), a portion of the first surface 121 of the glass plate 120 is not covered by the detection substrate 10 and is exposed in the first stacking direction Z1. Specifically, the outer frame portion 124, which is located around (outside) the detection substrate 10, and the bottom portion 125, which overlaps with the through hole 19 in the stacking direction and becomes the bottom surface of the through hole 19, are exposed.

[0038] As shown in Figure 7, the ultraviolet absorption layer formation step S7 is a step of forming an ultraviolet absorption layer 130 on the first surface 121 of the glass plate 120. Note that the detection substrate 10 is already formed on the first surface 121 of the glass plate 120. Therefore, the area in which the ultraviolet absorption layer 130 is formed is the bottom portion 125 exposed from the through hole 19 and the outer frame portion 124 exposed from around the detection substrate 10 on the first surface 121. In addition, in this embodiment, the detection substrate 10 is not masked. Therefore, the ultraviolet absorption layer 130 is also formed on the surface (side 10a and surface 10b) of the detection substrate 10.

[0039] The ultraviolet absorption layer 130 is formed from a material capable of absorbing ultraviolet light. Examples of materials capable of absorbing lasers (ultraviolet light) with wavelengths of 400 nm or less include organic compounds having structures such as benzofinone derivatives, salicylic acid ester derivatives, triazole derivatives, and acrylonitrile derivatives, or inorganic compounds such as GaN. The method for forming the ultraviolet absorption layer 130 can be sputtering, vapor deposition, or plasma CVD, but this disclosure is not particularly limited.

[0040] In the second stretchable resin lamination step S9, first, the second stretchable resin 50 is layered onto the detection substrate 10 from the first lamination direction Z1. Next, the second stretchable resin 50 is pressed from the first lamination direction Z1. Note that a jig such as a roller may be used for pressing from the first lamination direction Z1. This causes the second stretchable resin 50 to adhere to the detection substrate 10.

[0041] Furthermore, due to the pressure from the first lamination direction Z1, a portion of the second stretchable resin 50 is pushed out into the through hole 19, forming a protrusion 55. This protrusion 55 then adheres to the ultraviolet absorbing layer 130 inside the through hole 19. Additionally, the edge portion 52 of the second stretchable resin 50 moves in the second lamination direction Z2 due to the pressure and adheres to the ultraviolet absorbing layer 130 laminated on the outer frame portion 124. Therefore, the portion of the second stretchable resin 50 that moves in the second lamination direction Z2 due to the pressure does not adhere to the glass plate 120.

[0042] In the ultraviolet irradiation step S11, a laser with a wavelength of 400 nm or less is irradiated from the second stacking direction Z2 of the glass plate 120 toward the second surface 122. The laser is also irradiated onto the ultraviolet absorption layer 130 formed on the first surface 121 of the glass plate 120. In other words, the laser is irradiated onto the ultraviolet absorption layer 130 formed on the outer frame portion 124 and the bottom portion 125. As a result, the ultraviolet absorption layer 130 is carbonized (modified) and becomes a carbonized layer 30. During this modification, the bond between the carbonized layer 30 and the glass plate 120 is broken, and it can be easily peeled off from the glass plate 120.

[0043] Furthermore, this disclosure does not impose any particular restrictions on the thickness of the ultraviolet absorption layer 130. Also, if the thickness of the ultraviolet absorption layer 130 is 1 μm or less, the entire ultraviolet absorption layer 130 in the stacking direction will be carbonized in the ultraviolet irradiation step S9. On the other hand, if the thickness of the ultraviolet absorption layer 130 is greater than 1 μm, the portion of the ultraviolet absorption layer 130 closer to the second stacking direction Z2 becomes the carbonized layer 30, and the portion closer to the first stacking direction Z1 remains the ultraviolet absorption layer 130, resulting in a two-layer structure. Even with such a two-layer structure, the portion in contact with the glass plate 120 is the carbonized layer 30, making it easy to peel from the glass plate 120. Therefore, this disclosure may also be such a two-layer structure.

[0044] Furthermore, the ultraviolet absorption layer 130 formed on the surface 10b of the detection substrate 10 and the side surface 10a of the through hole 19 is not irradiated with a laser and therefore is not modified (carbonized). In addition, in this process, the laser may be irradiated onto the surface of the resin substrate 20 in the second lamination direction Z2. In this case, the surface of the resin substrate 20 in the second lamination direction Z2 is modified, and the bond with the glass plate 120 is severed.

[0045] As shown in Figure 8, the peeling step S13 is a step in which the second stretchable resin 50 and the detection substrate 10 are peeled off from the glass plate. The peeling method involves first lifting one end of the second stretchable resin 50 in the first stacking direction Z1 (see arrow A in Figure 8). This causes the carbonized layer 30 adhering to the edge 52 of the second stretchable resin 50 to peel off from the outer frame 124 of the glass plate 120.

[0046] Then, the amount by which one end of the second stretchable resin 50 is lifted is gradually increased. As a result, the detection substrate 10 that adheres to the second stretchable resin 50 also lifts in the first stacking direction Z1, and the resin substrate 20 peels off from the first surface 121 of the glass plate 120. In addition, the carbonized layer 30 that adheres to the protrusion 55 of the second stretchable resin 50 peels off from the bottom 125 of the glass plate 120. When the detection substrate 10 and the carbonized layer 30 have all separated from the glass plate 120, the peeling process is complete.

[0047] In the first stretchable resin lamination step S15, the second stretchable resin 50, which is integrated with the detection substrate 10, is layered on top of the first stretchable resin 40 from the first lamination direction Z1. Then, the first stretchable resin 40 and the second stretchable resin 50 are compressed in the lamination direction. As a result, the first stretchable resin 40 adheres to the detection substrate 10 and the carbonized layer 30, completing the stretchable device 100.

[0048] As described above, according to the embodiment, in the peeling step S13, the second stretchable resin 50 is not adhered to the glass plate 120. In other words, when one end of the second stretchable resin 50 is lifted, the second stretchable resin 50 does not stretch. Therefore, damage to the detection substrate 10 due to excessive tensile load is avoided.

[0049] Embodiment 1 has been described above. Incidentally, the rigidity of the carbonized layer 30 is low. Therefore, even with the presence of the carbonized layer 30, the stretchability of the first stretchable resin 40 on which the carbonized layer 30 is laminated and the nearby detection substrate 10 is not inhibited. On the other hand, if the film thickness of the ultraviolet absorption layer 130, which is the material for the carbonized layer 30, is greater than 1 μm, the ultraviolet absorption layer 130 remains in the first lamination direction Z1 of the carbonized layer 30. Here, if the ultraviolet absorption layer 130 is formed of a stretchable material, the ultraviolet absorption layer 130 laminated on the carbonized layer 30 does not inhibit the stretchability of the first stretchable resin 40 and the nearby detection substrate 10. On the other hand, if the ultraviolet absorption layer 130 is formed of a non-stretchable material, the ultraviolet absorption layer 130 laminated on the carbonized layer 30 may inhibit the stretchability of the first stretchable resin 40 and the nearby detection substrate 10. Therefore, when forming the ultraviolet absorption layer 130 with a non-stretchable material, it is preferable to make the film thickness of the ultraviolet absorption layer 130 1 μm or less.

[0050] On the other hand, in Embodiment 1, an ultraviolet absorption layer 130 is formed on the surface (side 10a and surface 10b) of the detection substrate 10. The ultraviolet absorption layer 130 formed on the surface (side 10a and surface 10b) of the detection substrate 10 cannot be irradiated with a laser. Therefore, if the ultraviolet absorption layer 130 is formed with a material that does not have elasticity, the ultraviolet absorption layer 130 formed on the surface (side 10a and surface 10b) of the detection substrate 10 may hinder the elasticity of the detection substrate 10. In the following Modification 1, a stretchable device 100A in which an ultraviolet absorption layer 130 is not formed on the surface (side 10a and surface 10b) of the detection substrate 10 will be described.

[0051] (Variation 1) Figure 9 is a schematic diagram showing the ultraviolet absorption layer formation process of Modification 1. Figure 10 is a schematic diagram showing a cross-section of a stretchable device manufactured by the manufacturing method of Modification 1. As shown in Figure 9, the manufacturing method of the stretchable device 100A of Modification 1 differs from Embodiment 1 in that a mask 300 is used in the ultraviolet absorption layer formation process S7. Due to this mask 300, the ultraviolet absorption layer 130 is formed only on the outer frame portion 124 and the bottom portion 125 of the glass plate 120. As shown in Figure 10, in the stretchable device manufactured by the manufacturing method of such Modification 1, the ultraviolet absorption layer 130 is not formed on the surface (side surface 10a and surface 10b) of the detection substrate 10.

[0052] As described above, even with the manufacturing method of Modified Example 1, the carbonized layer 30 covers the outer frame portion 124 and the bottom portion 125 of the glass plate 120, and the second stretchable resin 50 does not adhere to the glass plate 120. Therefore, the second stretchable resin 50 does not stretch during the peeling process S13, preventing excessive tensile load from being applied to the detection substrate 10 and causing damage. Furthermore, even if a non-stretchable material is used for the ultraviolet absorption layer 130, the ultraviolet absorption layer 130 is not formed on the surface (side 10a and surface 10b) of the detection substrate 10. Therefore, the stretchability of the detection substrate 10 is ensured. [Explanation of Symbols]

[0053] 10 Detection board 10a Side view 10b side 11 Body section 12. Hinge section 13. Bending section 19 Through hole 20 Resin base material 21 Array Layers 30 Carbonized layer 40 1st elastic resin 42 Edge 50 Second elastic resin 52 Edge 55 Convex part 44 Outer frame surface 45 Bottom 100, 100A stretchable device 120 glass plates 121 Page 1 122 2nd page 124 Outer frame 125 Bottom 130 UV absorbing layer

Claims

1. A preparation step of preparing a glass plate having a first surface facing the first stacking direction, A detection substrate forming step, in which a detection substrate having a plurality of through holes formed on the first surface of the glass plate, A UV absorption layer formation step is performed on the portion of the first surface of the glass plate that is exposed from the through hole and the portion that is exposed around the detection substrate, A stretchable resin lamination step is performed by laminating the stretchable resin onto the detection substrate from the first lamination direction, and pressing the stretchable resin from the first lamination direction to cause it to adhere to the detection substrate, A UV irradiation step is performed to irradiate the UV absorption layer with ultraviolet light from a second stacking direction opposite to the first stacking direction to modify it into a carbonized layer, A peeling step of peeling the stretchable resin and the detection substrate from the glass plate, A method for manufacturing a stretchable device including [a specific component].

2. The UV absorption layer formation step also forms the UV absorption layer on the surface of the detection substrate. A method for manufacturing a stretchable device according to claim 1.

3. The ultraviolet absorption layer formation step involves forming the ultraviolet absorption layer by masking the surface of the detection substrate. A method for manufacturing a stretchable device according to claim 1.

4. A first stretchable resin having opposing surfaces facing the first lamination direction, Multiple through holes are formed, and a detection substrate is stacked on the opposing surface, A carbonized layer is laminated on the portion of the opposing surface that is exposed from the through hole and the portion that is exposed from around the detection substrate. A second stretchable resin is laminated on the detection substrate from the first lamination direction, and a portion of it is adhered to the carbonized layer, A stretchable device equipped with [a specific feature / feature].

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