Pickup device

Abstract

The semiconductor chip is picked up without damaging it. [Solution] The pickup unit 3 comprises a pickup head body 62, a collet 61 that detachably holds a semiconductor chip 91, a collet motor 64 that generates a load along an axis defining the reciprocating movement of the collet 61, a reaction force generating unit 652 that generates a reaction force caused by the load, and a contact detection unit 65 that detects, based on the reaction force, whether the collet 61 has come into contact with the semiconductor chip 91 or the collet 61 has come into contact with the bonding stage 41 via the semiconductor chip 91.

Description

Technical Field

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[0005]

[0001] The present invention relates to a pickup device.

Background Art

[0002] Semiconductor chips obtained by singulating a semiconductor wafer are components that constitute electronic devices. In the manufacturing steps of electronic devices, there is an operation of picking up semiconductor chips attached to a wafer sheet from the wafer sheet and placing them on a circuit board. For example, Patent Document 1 discloses a device for picking up semiconductor chips held by an adhesive sheet. Patent Document 2 discloses a bonding device for thermocompression bonding an electronic component to a substrate. Patent Document 3 discloses a technique related to a focusing function of an image recognition camera used for positioning a chip and a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] The pickup device has a collet, which is a chip holding component that holds the semiconductor chip detachably. The pickup operation includes a contact operation of bringing the collet, which is not in contact with the semiconductor chip, into contact with the semiconductor chip. In this operation, it is desired to bring the collet into contact with the semiconductor chip without damaging the semiconductor chip.

[0005] The present invention provides a pickup device capable of picking up a semiconductor chip without damaging the semiconductor chip. [Means for solving the problem]

[0006] A pickup device according to one embodiment of the present invention comprises a pickup head body, a collet that is capable of reciprocating relative to the pickup head body and detachably holds a semiconductor chip, a load generating unit that generates a load along an axis defining the reciprocating movement of the collet, a reaction force generating unit that generates a reaction force caused by the load relative to the load generating unit, and a contact detection unit that detects, based on the reaction force, that the collet has come into contact with a semiconductor chip or that the collet has come into contact with an object other than the semiconductor chip via the semiconductor chip.

[0007] In this pickup device, a reaction force is generated by a reaction force generation unit in response to a load generated by a load generation unit. The contact detection unit then detects, based on this reaction force, that the collet has come into contact with the semiconductor chip or that the collet has come into contact with an object other than the semiconductor chip via the semiconductor chip. Since the change in force caused by contact can be detected before the change in shape caused by contact, it is possible to quickly detect that the semiconductor chip has come into contact with the collet. Therefore, the transition from a non-contact state to a contact state can be performed without damaging the semiconductor chip. As a result, the pickup device can pick up the semiconductor chip without damaging it.

[0008] In the above-described pickup device, the portion of the load generating portion that contacts the reaction force generating portion may be structured to be spaced apart from the reaction force generating portion. The portion of the load-generating section that contacts the reaction force-generating section is structured to be separated from the reaction force-generating section. When a load greater than a predetermined value is applied to the semiconductor chip, this gap allows the load-generating section to move, thus enabling the setting of an upper limit on the load applied to the semiconductor chip. Therefore, the pickup device can pick up the semiconductor chip without damaging it.

[0009] In the above-described pickup device, the collet, reaction force generating unit, and load generating unit may be arranged on the axis of the axial line. This configuration makes it possible to miniaturize a device that can pick up semiconductor chips without damaging them.

[0010] In the above-described pickup device, the load generating unit includes a first load generating element provided on the pickup head body and a second load generating element that generates a load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet. The contact detection unit may include a reaction force generating unit that generates a reaction force to the load and a load sensor that detects changes in the internal load based on the load and the reaction force. This configuration allows for the implementation of both a load-generating function and a function to detect changes in internal load using a simple design.

[0011] In the above-described pickup device, the load generating section may include a first load generating element provided on the pickup head body, and a second load generating element that generates a load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet. The second load generating element may include a portion that contacts the reaction force generating section. With this configuration, the second load-generating element can transmit the force generated by the load-generating part to the pickup head body.

[0012] In the pickup device described above, the load generating section may have a collet shaft that connects the collet to a second load generating element. The second load generating element may be a second portion that is spaced apart from the pickup head body in the direction of the load. The collet shaft may be provided with a shaft engagement portion, which is a first portion that is in contact with the pickup head body in the direction of the load. With this configuration, the force generated by the load-generating element can be transmitted to the pickup head body at a location separate from the second load-generating element.

[0013] In the pickup device described above, the load generating section may have a collet shaft that connects the collet to the second load generating element. The line of action of the load may overlap with the axis of the collet shaft. This configuration also allows for a smaller pickup device.

[0014] In the pickup device described above, the load generating unit has a collet shaft that connects the collet to a second load generating element, the reaction force generating unit includes a load acting unit on which the load is applied and a load detection unit equipped with a load sensor, the contact detection unit has a load sensor that detects when the internal load based on the load and reaction force has changed, and the distance from the axis of the collet shaft to the load acting unit may be shorter than the distance from the collet shaft to the load detection unit. With these configurations, changes in the reaction force generated at the load application point can be accurately detected by the load detection unit.

[0015] In the above-described pickup device, the load generating unit generates a load through the interaction between a first load generating element provided on the pickup head body and the first load generating element, and may be able to reciprocate relative to the pickup head body together with the collet. These configurations also enable the load detection unit to accurately detect changes in the reaction force generated at the load application point.

[0016] In the pickup device described above, the load generating unit may be a voice coil motor. The first load generating element may be a coil. The second load generating element may be a magnet. The load sensor may be a piezoelectric element. [Effects of the Invention]

[0017] According to the present invention, a pickup device is provided that can pick up semiconductor chips without damaging them. [Brief explanation of the drawing]

[0018] [Figure 1]FIG. 1 is a diagram showing a bonding apparatus according to an embodiment. [Figure 2] FIG. 2 is a functional block diagram of a controller unit included in the bonding apparatus. [Figure 3] FIG. 3 is a diagram showing a pickup unit. [Figure 4] FIG. 4(a) is a diagram showing a bonding head provided with a contact detection unit as a first example. FIGS. 4(b) and 4(c) are diagrams visualizing the loads acting on the coil body and the head body in the contact detection unit as the first example. [Figure 5] FIG. 5(a) is a diagram showing a bonding head provided with a contact detection unit as a second example. FIG. 5(b) is a diagram visualizing the load acting on the coil body and the head body in the contact detection unit as the second example. [Figure 6] FIG. 6 is a flowchart showing a method of manufacturing a semiconductor device according to an embodiment. [Figure 7] FIGS. 7(a), 7(b) and 7(c) are diagrams for explaining a pickup operation. [Figure 8] FIGS. 8(a) and (b) are diagrams for further explaining the pickup operation following FIG. 7. [Figure 9] FIGS. 9(a), 9(b), 9(c) and 9(d) are diagrams for explaining a bonding operation. [Figure 10] FIG. 10 is a flowchart showing a calibration method of a pickup unit according to an embodiment. [Figure 11] FIGS. 11(a) and 11(b) are diagrams for explaining an operation of generating an initial load in the calibration method of the pickup unit. [Figure 12] FIGS. 12(a) and 12(b) are diagrams for explaining an operation of detecting contact of a block in the calibration method of the pickup unit. [Figure 13]Figures 13(a) and 13(b) illustrate the case where the support block's thrust height matches the actual thrust height. Figures 13(c) and 13(d) illustrate the case where the support block's thrust height matches the actual thrust height. [Figure 14] Figure 14 is a perspective view showing a bonding apparatus according to the second embodiment. [Figure 15] Figure 15(a) is a plan view of the bonding apparatus shown in Figure 14. Figure 15(b) is a side view of the bonding apparatus shown in Figure 14. [Figure 16] Figure 16 is a flowchart showing the bonding operation using the bonding apparatus of the second embodiment. [Figure 17] Figures 17(a) and 17(b) show one step of the bonding operation shown in Figure 16. [Figure 18] Figures 18(a) and 18(b) are diagrams showing one step of the bonding operation shown in Figure 16, following Figure 17. [Figure 19] Figures 19(a) and 19(b) are diagrams showing one step of the bonding operation shown in Figure 16, following Figure 18. [Figure 20] Figures 20(a) and 20(b) are diagrams showing one step of the bonding operation shown in Figure 16, following Figure 19. [Figure 21] Figure 21, following Figure 20, shows one step of the bonding operation shown in Figure 16. [Modes for carrying out the invention]

[0019] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the attached drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant explanations are omitted.

[0020] Each figure shows the XYZ Cartesian coordinate system as needed. In the following description, the normal direction of the stage mounting surface 52a of the wafer stage 52, which will be described later, is defined as the Z-axis direction, and the plane directions along the stage mounting surface 52a are defined as the X-axis direction and the Y-axis direction. In addition, in the following, the positive direction of the Z-axis direction may be referred to as "up," and the negative direction of the Z-axis direction may be referred to as "down."

[0021] The bonding apparatus 1 shown in Figure 1 mounts a semiconductor chip 91, which is an example of a chip component, onto a semiconductor substrate 92. The semiconductor chip 91 and the semiconductor substrate 92 together are referred to as a semiconductor device 93. Multiple semiconductor chips 91 are attached to a dicing sheet 94 via a viscoelastic film 95 (see Figure 3). The thickness of the semiconductor chip 91 is, for example, about 20 μm. The thickness of the dicing sheet 94 is, for example, about 100 μm. The bonding apparatus 1 peels the semiconductor chips 91 attached to the dicing sheet 94 together with the viscoelastic film 95. Then, the bonding apparatus 1 fixes the peeled semiconductor chips 91 to the semiconductor substrate 92. The operation of fixing the semiconductor chips 91 to the semiconductor substrate 92 is called die bonding.

[0022] The bonding apparatus 1 comprises a controller unit 2, a pickup unit 3 (pickup device), and a bonding unit 4.

[0023] The controller unit 2 controls the operation of the bonding unit 4 and the pickup unit 3. The controller unit 2 outputs control signals to the bonding unit 4 and the pickup unit 3. The controller unit 2 is a computer that includes, for example, a CPU (processor 21 shown in Figure 2), a storage unit such as ROM and RAM (memory 22 shown in Figure 2), an input / output unit (input / output interface 23 shown in Figure 2), and a driver. The controller unit 2 operates the input / output unit according to the control of the CPU. Furthermore, the controller unit 2 reads and writes data to the storage unit. These operations generate control signals that are provided to the bonding unit 4 and the pickup unit 3. Based on these control signals, the bonding unit 4 and the pickup unit 3 perform their respective operations, such as bonding and pickup operations.

[0024] Figure 2 is a functional block diagram of the controller unit 2. The calibration method for the pickup unit 3 is performed by the controller unit 2. The controller unit 2 has a processor 21, a memory 22, and an input / output interface 23 as its physical components.

[0025] The processor 21 executes the calibration program for the pickup unit 3 stored in memory 22. As a result, the processor 21 functions as several functional components for the calibration method of the pickup unit 3. The processor 21 functions as a load data determination unit 211, a correction value calculation unit 212, a block motor signal unit 213, a collet motor signal unit 214, and a head drive signal unit 215.

[0026] Memory 22 stores the calibration program described above. Memory 22 also stores several data necessary for performing the calibration method of the pickup unit 3. For example, memory 22 stores the load sensor data D651 passed from the input / output interface 23. Memory 22 passes data and signals requested by the processor 21 to the processor 21. For example, memory 22 passes the load sensor data D651, the block motor signal C532, and the target push-up height TH to the processor 21. Furthermore, memory 22 stores data and signals passed from the processor 21. For example, memory 22 stores the block motor correction value R532.

[0027] The input / output interface 23 accepts data and signals from the outside. The input / output interface 23 passes the data and signals received from the outside to the memory 22. For example, the input / output interface 23 accepts load sensor data D651 and passes it to the memory 22. The input / output interface 23 outputs signals received from the memory 22 and the processor 21 to the outside. For example, the input / output interface 23 passes the collet motor signal C64 to the collet motor 64. The input / output interface 23 passes the block motor signal C532 or the correction block motor signal B532 to the block motor 532.

[0028] The functions of the controller unit 2 are not limited to those exemplified. For example, the controller unit 2 has the function of controlling the position of the pickup unit 3, the function of causing the pickup unit 3 to hold the semiconductor chip 91, and the function of releasing the semiconductor chip 91 from the pickup unit 3. The controller unit 2 also has the function of controlling the position of the bonding unit 4 and the function of controlling the bonding operation by the bonding unit 4.

[0029] Refer to Figure 1 again. The pickup unit 3 picks up the semiconductor chip 91. Picking up the semiconductor chip 91 includes peeling the semiconductor chip 91 from the dicing sheet 94 and holding the peeled semiconductor chip 91 in the pickup unit 3. The semiconductor chip 91 is attracted to the pickup unit 3. The pickup unit 3 places the picked-up semiconductor chip 91 on the intermediate stage 96. The pickup unit 3 may also be configured to transfer the semiconductor chip 91 to the bonding unit 4 by a so-called flip-chip operation. The pickup unit 3 will be described in detail later. Bonding may also be performed by the pickup unit without the intermediate stage 96.

[0030] The bonding unit 4 picks up the semiconductor chip 91 placed on the intermediate stage 96 and bonds the picked-up semiconductor chip 91 to the semiconductor substrate 92. The bonding unit 4 includes, for example, a bonding stage 41 and a bonding head 42.

[0031] The bonding stage 41 is a stage on which the semiconductor substrate 92 is placed. The bonding stage 41 is for mounting the semiconductor chip 91 onto the semiconductor substrate 92. The bonding stage 41 may also have a function for adsorbing the semiconductor substrate 92.

[0032] The bonding head 42 includes a bonding head body 421 and a bonding tool 422. The bonding head body 421 is connected to a bonding guide rail 423 via a bonding head support 424. The bonding head body 421 reciprocates along the bonding guide rail 423. This bonding guide rail 423 extends, for example, from the pickup unit 3 to the area where bonding is performed. The bonding head body 421 includes a motor for driving the bonding tool 422. The bonding tool 422 detachably holds a semiconductor chip 91 on an intermediate stage 96. For example, the bonding tool 422 has a vacuum suction mechanism for the detachment function. The bonding tool 422 is connected to a bonding head shaft 425 that reciprocates in the Z-axis direction by the motor of the bonding head body 421, and bonds the semiconductor chip 91 to the semiconductor substrate 92. For example, the bonding tool 422 may have a heater or the like to provide heat to the semiconductor chip 91.

[0033] <Pickup Unit> Figure 3 shows the pickup unit 3. The pickup unit 3 includes a push-up module 5 (second module) and a pickup head module 6 (first module).

[0034] <Push-up module> The push-up module 5 assists in the pickup operation. The push-up module 5 includes, for example, a wafer holder 51, a wafer stage 52, and a push-up mechanism 53. The wafer holder 51 holds the dicing sheet 94. While the wafer holder 51 is holding the dicing sheet 94, tension acts on the dicing sheet 94 from the center outwards. This tension stretches the dicing sheet 94.

[0035] <Wafer Stage> The wafer stage 52 adjusts the relative position between the wafer holder 51 and the push-up mechanism 53. The wafer stage 52 may, for example, translate the wafer holder 51 in the X-axis direction. The wafer stage 52 may also rotate the wafer holder 51 around the Z-axis. This movement causes the wafer stage 52 to move the semiconductor chip 91 to be picked up onto the push-up mechanism 53.

[0036] More specifically, the wafer stage 52 shown in Figure 3 has, for example, a cylindrical shape extending in the Z-axis direction. The upper end of the wafer stage 52 in the Z-axis direction is the stage mounting surface 52a on which the dicing sheet 94 is placed. The normal direction of the stage mounting surface 52a is along the Z-axis direction. A stage opening 52h communicating with the interior of the wafer stage 52 is formed in the center of the stage mounting surface 52a. The stage opening 52h has a rectangular shape that is slightly larger than the semiconductor chip 91. Inside the stage opening 52h, a block set 530 is arranged to protrude upward from the stage mounting surface 52a and push up the dicing sheet 94.

[0037] Furthermore, the stage mounting surface 52a is provided with a stage adsorption groove 52g for adsorbing and holding the dicing sheet 94. The stage adsorption groove 52g is provided, for example, so as to surround the stage opening 52h. Adsorption holes connected to a vacuum pump are in communication with the stage adsorption groove 52g. When air is sucked out of the stage adsorption groove 52g through the adsorption holes, the dicing sheet 94 around the semiconductor chip 91 is adsorbed onto the stage adsorption groove 52g.

[0038] <Push mechanism> The push-up mechanism 53 includes a block set 530. When the block set 530 is in the reference position (reference height), it does not contact the dicing sheet 94. When the block set 530 is in the push-up position, it contacts the dicing sheet 94. In the push-up position, the block set 530 protrudes above the stage mounting surface 52a. As a result, the block set 530 presses against the dicing sheet 94, causing the semiconductor chip 91 to be pushed upward (in the positive direction of the Z-axis).

[0039] The block set 530 includes a plurality of blocks 531 (upper blocks). Each of the plurality of blocks 531 has, for example, a rectangular cylindrical shape extending along the Z-axis. Each of the plurality of blocks 531 has a block up-pull surface 531a.

[0040] Each of the multiple blocks 531 is capable of independently reciprocating along the Z-axis. The multiple blocks 531 are arranged concentrically with respect to a central axis along the Z-axis. The central axis may be, for example, an axis passing through the center of the rectangular stage opening 52h when viewed from the Z-axis direction. A gap 52p is formed between the inner surface of the stage opening 52h and the outer surface of the outermost block 531.

[0041] The block set 530 is housed in the block housing 530H. The block set 530 and the block housing 530H constitute a variety component 53S. The variety component 53S is used to pick up a specific type of semiconductor chip 91. For example, if the type of semiconductor chip 91 to be picked up changes, the variety component 53S is also replaced accordingly.

[0042] The push-up mechanism 53 has a block drive mechanism 53U that independently moves each block set 530 back and forth in the Z-axis direction. The block drive mechanism 53U further includes a block motor 532 (drive unit) that provides driving force to the block set 530. The block motor 532 receives a block motor signal C532 provided by the controller unit 2 and moves the block 531 along the Z-axis direction. As described above, the variety parts 53S are replaced depending on the type of semiconductor chip 91 to be picked up, so the variety parts 53S are detachable from the block motor 532.

[0043] <Pickup head module> The pickup head module 6 includes, for example, a collet 61, a pickup head body 62, a collet shaft 63, a collet motor 64, a contact detection unit 65, and a head drive module 66.

[0044] The collet 61 is positioned at the tip of the pickup head module 6. The collet 61 reciprocates in the Z-axis direction relative to the pickup head module 6. The collet 61 includes a collet holding surface 61a (contact surface) that detachably holds the semiconductor chip 91.

[0045] The collet 61 detachably holds the semiconductor chip 91 that has been pushed up by the push-up mechanism 53. In other words, the collet 61 picks up the semiconductor chip 91. The collet 61 holds the semiconductor chip 91, for example, by vacuum suction. The collet 61 places the picked-up semiconductor chip 91 onto the intermediate stage 96.

[0046] The pickup head body 62 includes a lower head body surface 62b, an upper head body surface 62t, a lower head body groove 62c, and an upper head body groove 62d. The pickup head body 62 is provided with a collet motor 64 (load generating section), a collet shaft 63, and a contact detection section 65.

[0047] An example of a collet motor 64 is a voice coil motor (VCM). The collet motor 64 includes a motor movable element 641 (second load generating element) and a motor stator 642 (first load generating element). One of the motor movable element 641 and the motor stator 642 is a magnet, and the other is a coil. For example, a configuration in which the motor movable element 641 is a magnet and the motor stator 642 is a coil is called a moving magnet type. For example, a configuration in which the motor movable element 641 is a coil and the motor stator 642 is a magnet is called a moving coil type. The motor movable element 641 is connected to the collet 61 via a collet shaft 63. The motor movable element 641 is capable of reciprocating relative to the pickup head body 62. The motor stator 642 is provided on the pickup head body 62.

[0048] The collet motor 64 applies a generated load F64a along the Z-axis direction to the collet 61 via the collet shaft 63 in response to the collet motor signal C64 received from the controller unit 2. The line of action A64 of this generated load F64a coincides with the axis A63 of the collet shaft 63.

[0049] The contact detection unit 65 detects when an object comes into contact with the collet holding surface 61a. The contact detection unit 65 includes a piezoelectric element, such as a piezo element, as a component. The contact detection unit 65 outputs a voltage corresponding to the force as load sensor data D651. The load sensor data D651 is provided to the controller unit 2.

[0050] The head drive module 66 reciprocates a module, which integrates a collet 61, a pickup head body 62, a collet shaft 63, a collet motor 64, and a contact detection unit 65, in the Z-axis direction. The head drive module 66 includes a ball screw mechanism. The head drive module 66 raises or lowers the collet 61 and the pickup head body 62 as a single unit in response to a head drive signal C66 provided by the controller unit 2.

[0051] Below are two specific examples of the contact detection unit 65.

[0052] <Example 1: Contact detection unit 65A> Figure 4(a) shows a contact detection unit 65A, which is a first example. The contact detection unit 65A is located below the head housing space 62s. More specifically, the contact detection unit 65A includes two load sensors 651 and a reaction force generating unit 652. The reaction force generating unit 652 is the head bottom 62f, which defines the bottom of the head housing space 62s. The upper surface of the head bottom 62f is the bottom upper surface 62f1, which faces the head housing space 62s. The lower surface of the head bottom 62f is the bottom lower surface 62f2, which faces the collet 61 side. The thickness from the bottom upper surface 62f1 to the bottom lower surface 62f2 is relatively thin, so that the effect of the load received when an object contacts the collet holding surface 61a becomes apparent through changes in internal load and shape. In the example shown in Figure 4(a), a bottom through-hole 62g is provided on the bottom surface 62f2 through which the collet shaft 63 passes. The axis of the bottom through-hole 62g coincides with the axis A63 of the collet shaft 63. Furthermore, a pair of load sensors 651 are attached to the bottom surface 62f2. The load sensors 651 are mounted at a predetermined distance from the axis 622A of the collet shaft 63.

[0053] The reaction force generating section 652 is a load detection section 652a (see Figure 4(b)) where the area close to the outer surface 62h of the pickup head body 62 is integrated with the pickup head body 62. A load sensor 651 is provided on this load detection section 652a. The load detection section 652a is the point where the maximum stress (strain) occurs when the generated load F64a acts on the load application section 652b. The reaction force generating section 652 is also a load application section 652b (see Figure 4(b)) where the area around the bottom through-hole 62g through which the collet shaft 63 is inserted is deformable in the vertical direction. The generated load F64a acts on this load application section 652b. Using the axis A63 of the collet shaft 63 as a reference, the distance from axis A63 to the load application section 652b is shorter than the distance from axis A63 to the load detection section 652a. With this configuration, the so-called lever ratio can be increased, and thus the detection sensitivity can be improved.

[0054] The applied load F64 (see Figure 4(b)) that the motor movable element 641 exerts on the pickup head body 62 can be considered to have the axis A63 of the collet shaft 63 as its line of action. In other words, the line of action of the applied load F64 that the motor movable element 641 exerts on the pickup head body 62 coincides with the line of action of the load that the collet shaft 63 receives due to contact with the object.

[0055] Figure 4(b) visualizes the forces acting on the motor movable element 641. The area around the bottom through-hole 62g, which is the free end through which the collet shaft 63 passes, receives an applied load F64 from the motor movable element 641. The motor movable element 641 is subjected to the applied load F64 and a reaction force F62 to the applied load F64. These applied load F64 and reaction force F62 are of the same magnitude but opposite in direction.

[0056] Here, the applied load F64 is defined as the resultant force of the generated load F64a generated by the collet motor 64 and the contact load F63a acting on the collet shaft 63. For example, as shown in Figure 4(b), when the collet 61 is not in contact with an object, the contact load F63a acting on the collet shaft 63 is zero. Therefore, the applied load F64 is equal to the generated load F64a generated by the collet motor 64. On the other hand, as shown in Figure 4(c), when the collet 61 is in contact with an object, the contact load F63a acting on the collet shaft 63 has a predetermined value. Therefore, the applied load F64 is the resultant force of the generated load F64a generated by the collet motor 64 and the contact load F63a acting on the collet shaft 63. More specifically, since the direction of the generated load F64a and the direction of the contact load F63a are opposite to each other, the applied load F64 is the generated load F64a minus the contact load F63a.

[0057] A change in the applied load F64 is detected by a load sensor 651 located at a predetermined distance from the axis A63 of the collet shaft 63. The line of action of the applied load F64 may be considered to coincide with the axis A63 of the collet shaft 63. The position where the change in the applied load F64 is detected is shifted in a direction perpendicular to the axis A63 of the collet shaft 63. In other words, the position where the change in the applied load F64 is detected does not lie on the line of action of the applied load F64. For example, if the load sensor 651 is capable of detecting changes in state values ​​in response to bending moment, the bending moment increases with distance, so a change in load due to contact can be detected with greater accuracy.

[0058] The operation of detecting contact will be explained in detail by the first example. As shown in Figure 4(b), the collet motor 64 presses the motor movable element 641 against the reaction force generating unit 652. At this time, the lower surface 641b (first part) of the motor movable element 641 is in contact with the bottom upper surface 62f1. On the other hand, the upper surface 641a (second part) of the motor movable element 641 is not in contact with the ceiling back surface 62t1. Assume that no object is in contact with the collet 61. The motor movable element 641 is then pressed against the bottom upper surface 62f1 with an applied load F64. As mentioned above, since no object is in contact with the collet 61 at this point, the applied load F64 is equal to the generated load F64a generated by the collet motor 64. Consequently, the reaction force generating unit 652 generates a reaction force F62 that is the same magnitude as the applied load F64 but in the opposite direction. The applied load F64 and the reaction force F62 balance each other, causing the motor movable element 641 to come to rest. The reaction force F62 generated in the reaction force generating unit 652 is then detected as a change in internal load by the load sensor 651.

[0059] Then, as shown in Figure 4(c), when an object comes into contact with the collet 61, the collet shaft 63 receives an upward contact load F63a. At this time, the collet motor 64 continues to generate the generated load F64a, but receives an upward contact load F63a from the collet shaft 63. Consequently, the applied load F64 received by the reaction force generating unit 652 is the resultant of the generated load F64a and the contact load F63a. Since the generated load F64a and the contact load F63a are in opposite directions, the applied load F64 received by the reaction force generating unit 652 appears to have decreased from the generated load F64a. Consequently, the reaction force F62 generated by the reaction force generating unit 652 also decreases. The decrease in reaction force F62 can be detected by the load sensor 651. Therefore, the change in the value of the load sensor 651 can be used to detect when an object comes into contact with the collet 61.

[0060] In other words, according to the first example, contact of an object with the collet 61 is detected based on a change in the internal load (reaction force F62) generated in the pickup head body 62. Other contact detection methods may utilize the movement or deformation of parts caused by the contact of an object. However, the movement of parts begins when the load caused by contact becomes greater than the initial load. In other words, from the time an object makes contact until the load caused by contact becomes greater than the initial load, the contact may not be detected even though the object is in contact.

[0061] On the other hand, changes in internal load do not involve the movement of such parts. When the state of the internal load, which is caused by the initial load, changes due to another load resulting from contact with an object, it can be detected immediately. Therefore, contact detection based on internal load can capture the timing of contact with greater accuracy than contact detection based on the movement of parts.

[0062] In short, in the first example, the motor movable element 641 includes a movable element lower surface 641b, which is a contact surface that abuts the bottom upper surface 62f1 of the pickup head body 62, and a movable element upper surface 641a, which is a separated surface that is separated from the top surface 62t1 of the pickup head body 62. With this configuration, the motor movable element 641 can transmit the force generated by the collet motor 64 to the pickup head body 62.

[0063] <Second example: Contact detection unit 65B> Figure 5(a) shows a contact detection unit 65B, which is a second example. In the second example, the point where a load is applied to the pickup head body 62 is located in a different place from the motor movable element 641. In other words, the second example differs from the first example in that the motor movable element 641 is not in contact with the pickup head body 62. In the second example, the shaft engagement portion 654 provided on the collet shaft 63 corresponds to the first part, and the motor movable element 641 corresponds to the second part.

[0064] As shown in Figure 5(a), the contact detection unit 65B includes a load sensor 651, a reaction force generating unit 653, and a shaft engagement unit 654. The shaft engagement unit 654 is provided on the collet shaft 63. The shaft engagement unit 654 is a member having a width greater than the outer shape of the collet shaft 63. The shaft engagement unit 654 may be a rod-shaped member extending radially to the collet shaft 63, or it may be a disc-shaped member in plan view. The shaft engagement unit 654 is fixed to the collet shaft 63. The reaction force generating unit 653 has an upper surface 653a and a lower surface 653b. Neither the upper surface 653a nor the lower surface 653b of the reaction force generating unit are in contact with any other part of the pickup head body 62. In other words, the reaction force generating unit 653 can be deformed vertically along the axis A63 of the collet shaft 63. The reaction force generating section 653 is provided with a through hole 653h through which the collet shaft 63 is inserted.

[0065] As shown in Figure 5(b), with such a shaft engagement portion 654, the generated load F64a generated by the collet motor 64 is transmitted from the shaft engagement portion 654 to the reaction force generating portion 653 as an applied load F64 via the collet shaft 63. As a result, the area around the through hole 653h in the reaction force generating portion 653 receives an applied load F64 that pushes downward, and as a result, a change in the internal load can be caused in the reaction force generating portion 653. This change in internal load can be detected by two load sensors 651. The load sensors 651 are generally the same as those in the first example, so a detailed explanation is omitted.

[0066] The operation for detecting contact in the second example is, in principle, the same as in the first example. That is, the generated load F64a produced by the collet motor 64 is applied as a load F64 from the shaft engagement part 654 to the pickup head body 62. When an upward contact load F63a caused by contact with an object acts on the collet shaft 63, the applied load F64 received by the reaction force generating part 653 appears to decrease. This phenomenon can be detected by the load sensor 651. Therefore, contact with the collet 61 can be detected by the change in the value of the load sensor 651.

[0067] In short, the second example includes a movable element lower surface 641b spaced apart from the bottom upper surface 62f1 of the pickup head body 62, and a movable element upper surface 641a spaced apart from the top surface 62t1 of the pickup head body 62. That is, in the second example, the pickup head body 62 is a second part that does not come into contact with the pickup head body 62. And in the second example, the shaft engagement portion 654 provided on the collet shaft 63 is the first part that comes into contact with the pickup head body 62. With this configuration, the force generated by the collet motor 64 can be transmitted to the pickup head body 62 at the shaft engagement portion 654 of the collet shaft 63, which is a different location from the motor movable element 641.

[0068] <Manufacturing method for semiconductor devices> Figure 6 is a flowchart of the manufacturing method for the semiconductor device 93 using the calibration method for the pickup unit 3. The manufacturing method for the semiconductor device 93 involves manufacturing a semiconductor device 93 in which a semiconductor chip 91 is mounted on a semiconductor substrate 92.

[0069] First, the type of component 53S is attached (S1). First, the type of semiconductor chip 91 to be mounted is identified. Next, the type of component 53S corresponding to the type of semiconductor chip 91 is identified. Then, the identified type of component 53S is attached to the block motor 532.

[0070] Next, the block motor correction value R532 is obtained (S2). This block motor correction value R532 is used to match the result of the thrusting motion to the target of the thrusting motion. The block motor correction value R532 may also be used to correct the voltage or current supplied to the block motor 532. In this case, the block motor correction value R532 is a corrected voltage value or a corrected current value. Obtaining the block motor correction value R532 (S2) is the calibration method for the pickup unit 3 in this embodiment. Therefore, the details of this step S2 will be described later.

[0071] Next, the corrected block motor signal B532 (corrected drive signal) is obtained (S3). The controller unit 2 corrects the block motor signal C532 using the block motor correction value R532. As a result, the corrected block motor signal B532 can be obtained.

[0072] Next, bonding is performed (S4). The controller unit 2 bonds the semiconductor chip 91 to the semiconductor substrate 92 by providing control signals to the pickup unit 3 and the bonding unit 4, respectively. This step S4 includes a pickup operation (S41) and a bonding operation (S42).

[0073] The bonding apparatus 1 can suppress the discrepancy between the target of the thrusting motion and the result of the thrusting motion when performing the pickup operation (S41). This function is achieved by performing calibration to correct the discrepancy between the target of the thrusting motion and the result of the thrusting motion. In order to obtain a correction value that further reduces the discrepancy between the target of the thrusting motion and the result of the thrusting motion, it is necessary to accurately detect when multiple blocks 531 have come into contact with the collet 61 during calibration. In the following description, the function that accurately detects when an object has come into contact with the collet 61 will be referred to as the "contact detection function".

[0074] Furthermore, the bonding apparatus 1 can accurately detect when the semiconductor chip 91 comes into contact with the semiconductor substrate 92 during the bonding operation (S42). This function is also achieved by the aforementioned "contact detection function." Details of the contact detection function will be described later.

[0075] <Load limiting function> Furthermore, the bonding device 1 prevents excessive load from being applied to the object when performing the pickup operation (S41). For the sake of explanation, this function will be referred to as the "load limiting function". In this embodiment, the bonding device 1 employs an ultrasonic motor, which is a collet motor 64, to drive the collet 61, and furthermore, the upper surface 641a of the movable element of the collet motor 64 is spaced apart from the ceiling surface 62t1.

[0076] If the upper surface 641a of the movable element of the collet motor 64 is in contact with the ceiling surface 62t1, then the contact load F63a acting on the collet 61 or the semiconductor chip 91 held by the collet 61 is supported by the load F64a generated by the collet motor 64 and the reaction force from the ceiling surface 62t1. In this case, the contact load F63a can be greater than the generated load F64a in proportion to the contribution of the reaction force from the ceiling surface 62t1.

[0077] On the other hand, in the embodiment where the upper surface 641a of the movable element of the collet motor 64 is not in contact with the ceiling surface 62t1, the only load that counteracts the contact load F63a received by the collet 61 or the semiconductor chip 91 held by the collet 61 is the load F64a generated by the collet motor 64. In this case, the contact load F63a cannot be greater than the generated load F64a because there is no contribution from the reaction force of the ceiling surface 62t1. In other words, the magnitude of the contact load F63a is limited to the magnitude of the generated load F64a. In this case, the load F64a generated by the collet motor 64 can also be considered as a setting load that sets the magnitude of the contact load F63a.

[0078] <Pickup operation (S41): Inverse multi-stage method> Next, we will briefly explain the inverse multi-stage method, which is an example of the pickup operation performed by the bonding apparatus 1. Figure 7(a) shows the initial state of the pickup unit 3. In the initial state, the wafer stage 52 places the semiconductor chip 91 to be picked up on the block set 530 (S411). At this time, the block push-up surface 531a is below the stage mounting surface 52a. In other words, there is a gap 52q between the block push-up surface 531a and the dicing sheet 94. Furthermore, the dicing sheet 94 is held in place by the wafer stage 52. Therefore, the dicing sheet 94 does not move relative to the wafer stage 52.

[0079] Next, the block set 530 is pushed up (see Figure 7(b), S412). The block set 530 is pushed up in response to the block motor signal C532 from the controller unit 2, which indicates the target of the pushing-up operation. Since this pushing-up operation is performed using the correction block motor signal B532, the discrepancy between the target of the pushing-up operation and the result of the pushing-up operation is small, and can be considered to be virtually zero. Therefore, defects in the pickup operation caused by the discrepancy between the target of the pushing-up operation and the result of the pushing-up operation can be suppressed.

[0080] When the block set 530 is pushed up, the block push-up surface 531a is above the stage mounting surface 52a. In other words, the block set 530 is in contact with the dicing sheet 94. Also, the dicing sheet 94 on the wafer stage 52 is held in place by suction and does not move even when the block push-up surface 531a is pushed up. The semiconductor chip 91 is then held in place by the collet holding surface 61a. The dicing sheet 94 in the gap 52p between the wafer stage 52 and the block set 530 is further held in place (see Figure 7(c), S413). At this point, the semiconductor chip 91 has not yet been detached from the dicing sheet 94.

[0081] Next, the blocks are moved downward in order, starting with the outermost block 531 (see Figure 8(a), S414). At this time, each of the multiple blocks 531 performs an action to attract the dicing sheet 94. As each of the multiple blocks 531 that have attracted the dicing sheet 94 moves downward in order, the dicing sheet 94 is peeled off the semiconductor chip 91 from the outside in. When all the blocks 531 have been moved downward, the semiconductor chip 91 is peeled off the dicing sheet 94 (see Figure 8(b), S415). The pickup unit 3 then places the picked-up semiconductor chip 91 on the intermediate stage 96 (S416).

[0082] <Bonding operation (S42)> Next, the semiconductor chip 91 placed on the intermediate stage 96 is bonded to the semiconductor substrate 92 (S42). First, the bonding head 42 picks up the semiconductor chip 91 placed on the intermediate stage 96. Although a detailed explanation is omitted, the bonding head 42, like the pickup head module 6, may also be equipped with a contact detection mechanism 420 that detects when the object comes into contact with the bonding tool 422.

[0083] Then, the bonding head 42, which has picked up the semiconductor chip 91, moves onto the semiconductor substrate 92 (see Figure 9(a): S421). Next, the semiconductor chip 91 held by the bonding tool 422 is lowered toward the semiconductor substrate 92. Then, the semiconductor chip 91 is brought into contact with the semiconductor substrate 92 (see Figure 9(b), S422). At this time, the bonding head 42 may accurately detect that the semiconductor chip 91 has come into contact with the semiconductor substrate 92 using the aforementioned "contact detection function". As a result, it is possible to prevent excessive load from being applied to the semiconductor chip 91 and the semiconductor substrate 92 when bringing the semiconductor chip 91 into contact with the semiconductor substrate 92.

[0084] After bringing the semiconductor chip 91 into contact with the semiconductor substrate 92, a predetermined process (see Figure 9(c), S423) may be performed to fix the semiconductor chip 91 to the semiconductor substrate 92. For example, the semiconductor chip 91 may be heated by a heater embedded in the bonding head 42. Alternatively, the semiconductor chip 91 may be pressed toward the semiconductor substrate 92 with a predetermined force. During these processes, unintended loads may be applied to the semiconductor chip 91 and the semiconductor substrate 92. In response to the occurrence of such unintended loads, the bonding tool 422 may prevent loads greater than a predetermined limit load from being applied to the semiconductor chip 91 and the semiconductor substrate 92 by the aforementioned "load limiting function". As a result, damage to the semiconductor chip 91 and the semiconductor substrate 92 due to unintended loads can be prevented.

[0085] Next, the suction operation of the semiconductor chip 91 to the bonding tool 422 is released. Then, the bonding head 42, including the bonding tool 422, is raised (see Figure 9(d), S424). With these operations, the bonding of the semiconductor chip 91 to the semiconductor substrate 92 is completed.

[0086] Next, it is determined whether the bonding is complete or not (S5). The controller unit 2 determines whether the bonding of all semiconductor chips 91 identified in step S1 is complete or not. If the bonding of all semiconductor chips 91 is not complete (S5: NO), the controller unit 2 performs bonding again (S4). If the bonding of all semiconductor chips 91 is complete (S5: YES), the controller unit 2 terminates the bonding. Then, it identifies the type of the next semiconductor chip 91 to be bonded (S1).

[0087] By performing the above steps S1 to S5, the semiconductor device 93 can be obtained. As described above, each time the type of component 53S is replaced due to a change in the type of semiconductor chip 91 to be bonded, the block motor correction value R532 is obtained (S2) and the corrected block motor signal B532 is obtained (S3). Therefore, even if the type of semiconductor chip 91 to be bonded changes, good pickup operation can be performed.

[0088] <Calibration using contact detection function> For example, in the case of an upward thrusting motion of block set 530, Figure 7(b) illustrates that the thrusting heights of the block set 530 are the same for all of them. For instance, if the target thrusting height of block set 530 is "10", the controller unit 2 instructs a thrusting height of "10". The result is that each block set 530 moves by "10".

[0089] However, this is an ideal state. The target of the thrusting motion and the result of the thrusting motion can differ due to various factors. When each of the block set 530 is in its initial state, the heights of the block thrusting surfaces 531a may not match. Also, if the driving force of the block motor 532 does not match the instruction of the controller unit 2, the target of the thrusting motion and the result of the thrusting motion may differ. As these examples show, there are mechanical and electrical error factors between the target of the thrusting motion and the result of the thrusting motion. The discrepancy between the target of the thrusting motion and the result of the thrusting motion can cause defects in the operation of picking up the semiconductor chip 91.

[0090] The calibration method for the pickup unit 3 involves determining the discrepancy (block motor correction value) between the instruction from the controller unit 2 to move by the target upward height and the result of the upward movement of the block set 530 before executing the pickup operation of the semiconductor chip 91. Then, based on this discrepancy, the voltage and / or voltage supplied to the block motor 532, which is a signal generated based on the instruction from the controller unit 2, is corrected. This allows the voltage and current supplied to the block motor 532, which are generated from the block motor signal C532 generated by the controller unit 2 based on the target value of the upward movement, to be corrected. As a result, the result of the upward movement can be made to match the target of the upward movement.

[0091] Next, the calibration method for the pickup unit 3 will be described. The calibration method for the pickup unit 3 corresponds to step S2 above, which is used to obtain the block motor correction value R532. In this embodiment, calibration may be defined as obtaining the block motor correction value R532. Alternatively, calibration may be defined as including obtaining the block motor correction value R532 and obtaining a corrected block motor signal B532 using the block motor correction value R532.

[0092] The calibration method for the pickup unit 3 will be described in detail below. Figure 10 is a flowchart of the calibration method for the pickup unit 3. In the following explanation, we will assume the pickup unit 3 equipped with the contact detection unit 65A, which is the first example shown in Figure 4.

[0093] First, the acquisition of load sensor data D651 is initiated (S20). The controller unit 2 receives the load sensor data D651 output by the load sensor 651. Specifically, the input / output interface 23 receives the load sensor data D651. The input / output interface 23 then passes the received load sensor data D651 to the memory 22.

[0094] Next, the collet motor 64 generates a first generated load F64a (see S21, Figure 11(a)). The controller unit 2 presses the motor movable element 641 against the reaction force generating unit 652 by supplying a collet motor signal C64 to the collet motor 64. As a result, the first generated load F64a is generated (see Figure 4(b)). This first generated load F64a is detected by the load sensor 651.

[0095] Next, the head drive module 66 positions the collet 61 in a predetermined position (S22). The controller unit 2 positions the collet 61 directly above the block set 530 and the wafer stage 52. Specifically, the controller unit 2 provides the head drive module 66 with a head drive signal C66 to position the collet 61 such that the collet holding surface 61a and the stage mounting surface 52a are within the movable range along the Z-axis direction of the collet 61. With this positioning, when the collet 61 is moved downward in the Z-axis direction, the collet holding surface 61a can abut against the stage mounting surface 52a. At this time, the collet holding surface 61a is separated from the stage mounting surface 52a.

[0096] Next, the head drive module 66 generates a predetermined initial load (second applied load F641, see Figure 11(b)) (S23). The controller unit 2 provides a head drive signal C66 to the head drive module 66. Specifically, the head drive signal unit 215 provides the head drive signal C66 to the head drive module 66 via the input / output interface 23. As a result, the head drive module 66 moves the collet 61 and the pickup head body 62 downward in the Z-axis direction. Initially, the collet 61 is not in contact with the wafer stage 52, so the load sensor data D651 shows the first generated load F64a (see Figure 11(a)). Next, the collet 61 comes into contact with the wafer stage 52. Furthermore, the head drive module 66 presses the collet 61 toward the wafer stage 52. As a result, the collet 61 receives a predetermined stage contact load F2 (e.g., 10N) from the wafer stage 52 (see Figure 11(b)). Therefore, the load sensor 651 detects the value obtained by subtracting the stage contact load F2 from the first generated load F64a as the second applied load F641. In this way, it is possible to detect that the collet holding surface 61a has come into contact with the stage mounting surface 52a, provided that the first generated load F64a has been reduced by the stage contact load F2. This mechanism allows for the detection of contact between the collet holding surface 61a and an object such as the stage mounting surface 52a, and this function is called the "contact detection function".

[0097] At this time, each of the block sets 530 is separated downward along the Z-axis direction from the stage mounting surface 52a. Therefore, a predetermined gap is created between the collet 61 and the block 531.

[0098] Next, the block motor signal C532 is output (S24). The controller unit 2 provides the block motor signal C532 to the block motor 532. The block motor signal C532 is the voltage or current supplied to the block motor 532. In other words, the block motor signal unit 213 receives data indicating the target upward thrust height of the block 531 and obtains the voltage or current required to operate the block motor 532 by that target upward thrust height based on that data. The block motor signal unit 213 provides the block motor signal C532 to the block motor 532 via the input / output interface 23 to thrust the block 531 upward along the Z-axis. As a result, the block 531 gradually begins to move upward along the Z-axis.

[0099] Here, the position of block 531 immediately before step S24 begins is defined as the reference position P531. Similarly, the position of the block thrust surface 531a immediately before step S24 begins is defined as the reference height H531. As shown in Figure 11(b), etc., the reference height H531 is at least below the stage mounting surface 52a. For example, the reference height can also be defined as the distance from the stage mounting surface 52a to the block thrust surface 531a.

[0100] Furthermore, regarding the block motor signal unit 213, in addition to data indicating the target thrust height, the block motor signal unit 213 may receive a block motor correction value R532, correct the data indicating the target thrust height using the block motor correction value R532, and obtain a voltage or current to operate the block motor 532 by the corrected value. The function of converting the data indicating the target thrust height and the corrected data into voltage or current may be a function of the block motor signal unit 213 as described above. Alternatively, the function of converting the data indicating the target thrust height and the corrected data into voltage or current may be a function of the input / output interface 23.

[0101] At this time, controller unit 2 continues to output the collet motor signal C64. Similarly, controller unit 2 continues to acquire load sensor data D651.

[0102] Next, it is determined whether or not a change has occurred in the load sensor data D651 (S25). The controller unit 2 determines whether or not a change has occurred in the load sensor data D651. Specifically, the load data determination unit 211 receives the load sensor data D651 via the memory 22. The load data determination unit 211 determines whether or not a significant change has occurred in the load sensor data D651, which indicated the second applied load F641. A significant change may be defined as a change in the load sensor data D651 that exceeds the load threshold LT for the second applied load F641 (see Figure 12(b)).

[0103] When block 531 is not in contact with collet 61 (see Figure 12(a)), collet 61 is pressing the wafer stage 52 with a second applied load F641, so the load sensor data D651 indicates the second applied load F641. In other words, as long as the load sensor data D651 indicates the second applied load F641, it can be seen that block 531 is not in contact with collet 61.

[0104] As block 531 continues its upward thrusting motion, block 531 comes into contact with collet 61. In this paragraph, "come into contact" refers to a state where block 531 is merely touching collet 61. Therefore, when block 531 is in contact with collet 61, no load acts on block 531 that would cause it to thrust upward. Even when block 531 is in contact with collet 61, the load sensor data D651 shows the second applied load F641.

[0105] Furthermore, block 531 continues its upward thrusting motion. If the upward thrusting motion continues from a state where block 531 is already in contact with collet 61, block 531 will not move upward in the Z-axis direction. On the other hand, block 531 presses collet 61 with a predetermined block load F3 (see Figure 12(b)). In other words, block 531 applies a block load F3 to collet 61 that pushes it upward. From the perspective of collet 61, while it was pressing the stage mounting surface 52a with a second applied load F641, it receives a block load F3 from block 531 that is in the opposite direction to the second applied load F641. As a result, the second applied load F641 that collet 61 presses against the wafer stage 52 becomes a third applied load F642, which is the second applied load F641 minus the magnitude of the block load F3 received from block 531. Therefore, as the block load F3, which causes block 531 to push up against collet 61, increases, the load value indicated by load sensor data D651 gradually decreases. When load sensor data D651 falls below the load threshold LT, it can be determined that block 531 is in contact with collet 61.

[0106] When it is determined that no change has occurred in the load sensor data D651 (S25: NO), the controller unit 2 continues to output the block motor signal C532 (S24). Specifically, the block motor signal unit 213 continues to output the block motor signal C532 so that the upward height of the block 531 increases over time. Then, it determines again whether or not a change has occurred in the load sensor data D651 (S25). In other words, the controller unit 2 repeats the process of outputting the block motor signal C532 and determining whether or not a change has occurred in the load sensor data D651 until it is determined that a change has occurred in the load sensor data D651.

[0107] When the controller unit 2 determines that a change has occurred in the load sensor data D651 (S25: YES), it stops outputting the block motor signal C532 (S26). As a result, the block motor 532 stops pushing the block 531 upward in the Z-axis direction. Then, the block motor signal section 213 of the controller unit 2 provides the block motor 532 with a block motor signal C532 to return the block 531 to its initial position. As a result, the block 531 moves downward along the Z-axis direction and returns to its initial position.

[0108] Furthermore, the controller unit 2 stores the block motor signal C532, which was output when it was determined that a change had occurred in the load sensor data D651, in the memory 22.

[0109] Next, the difference EH between the indicative upward height CH indicated by the block motor signal C532 and the target upward height TH is obtained (S27). The difference EH between the indicative upward height CH indicated by the block motor signal C532 and the target upward height TH is the block motor correction value R532.

[0110] Here, the target push-up height TH is the distance along the Z-axis from the block push-up surface 531a to the stage mounting surface 52a when the block set 530 is in its initial position. In other words, the target push-up height TH is the height from the block push-up surface 531a to the collet holding surface 61a before the push-up operation of the block 531 begins.

[0111] Specifically, the correction value calculation unit 212 receives the block motor signal C532, which was output when it was determined that a change had occurred in the load sensor data D651, and the target thrust height TH from the memory 22. The correction value calculation unit 212 obtains the instructed thrust height CH from the received block motor signal C532. As mentioned above, the timing at which it is determined that a change has occurred in the load sensor data D651 does not strictly coincide with the timing at which the block 531 contacts the collet 61. The timing at which it is determined that a change has occurred in the load sensor data D651 is delayed from the timing at which the block 531 contacts the collet 61. This delay is due to the load threshold LT. Therefore, in the calculation to obtain the instructed thrust height CH from the received block motor signal C532, the instructed thrust height CH may be corrected using the load threshold LT or the speed of the thrusting motion. Then, the correction value calculation unit 212 subtracts the instructed thrust height CH from the target thrust height TH.

[0112] If the upward thrusting motion of block 531 does not contain any error elements, the indicated upward thrusting height CH (see Figure 13(a)) indicated by the block motor signal C532 will match the target upward thrusting height TH (see Figure 13(b)). In other words, the result of subtracting the indicated upward thrusting height CH from the target upward thrusting height TH is zero.

[0113] If the upward movement of block 531 includes error elements, the indicated upward height CH will not match the target upward height TH (see Figure 13(c)). For example, the actual upward height RH may reach the target upward height TH before the indicated upward height CH reaches the target upward height TH. Conversely, when the indicated upward height CH reaches the target upward height TH, the actual upward height RH may not reach the target upward height TH.

[0114] As illustrated in Figures 13(c) and 13(d), when the actual thrust height RH reaches the target thrust height TH (see point P2 in Figure 13(d)), the indicated thrust height CH shown by the block motor signal C532 output at that time has not reached the target thrust height TH (see point P1 in Figure 13(c)). The difference EH between the indicated thrust height CH shown by the block motor signal C532 and the target thrust height TH is treated as the block motor correction value R532. In the example in Figure 13(c), the difference EH is a negative value. Depending on the error factors, the difference EH may also be a positive value.

[0115] By performing the above steps S20 to S27, the block motor correction value R532 for the first block 531 can be obtained. Then, the controller unit 2 obtains the block motor correction value R532 for all blocks 531 by performing steps S20 to S27 again.

[0116] <Effects of the First Embodiment> The pickup unit 3 comprises a pickup head body 62, a collet 61 that is capable of reciprocating relative to the pickup head body 62 and detachably holds a semiconductor chip 91, a collet motor 64 that generates a load along the axis defining the reciprocating movement of the collet 61, a reaction force generating unit 652 that generates a reaction force caused by the load, and a contact detection unit 65 for detecting, based on the reaction force, that the collet 61 has come into contact with the semiconductor chip 91 or that the collet 61 has come into contact with the bonding stage 41 via the semiconductor chip 91.

[0117] In this pickup unit 3, the reaction force generating unit 652 generates a reaction force due to the load generated by the collet motor 64. The contact detection unit 65 then detects, based on this reaction force, that the collet 61 has come into contact with the semiconductor chip 91 or that the collet 61 has come into contact with an object other than the semiconductor chip 91 via the semiconductor chip 91. Since the change in force due to contact can be detected before the change in shape due to contact, it is possible to quickly detect that the semiconductor chip 91 has come into contact with the collet 61. Therefore, it is possible to transition from a non-contact state to a contact state without damaging the semiconductor chip 91. As a result, the pickup unit 3 can pick up the semiconductor chip 91 without damaging it.

[0118] Of the collet motor 64, the lower movable surface 641b, which is the part that contacts the reaction force generating section 652, can be separated from the reaction force generating section 652. The collet motor 64 includes an upper movable surface 641a that separates from the pickup head body 62 along the direction of the load when the reaction force generating section 652 is generating a reaction force. When a load greater than a predetermined value is applied to the semiconductor chip 91, the motor movable surface 641 can move through this gap, thereby limiting the load applied to the semiconductor chip 91. Through these functions, the pickup unit 3 can bond the semiconductor chip 91 without damaging it.

[0119] The collet 61, the reaction force generating unit 652, and the collet motor 64 are arranged on the axis of axis A63. With this configuration, the pickup unit 3, which can pick up the semiconductor chip 91 without damaging the semiconductor chip 91, can be miniaturized.

[0120] The collet motor 64 includes a motor stator 642 provided on the pickup head body 62, and a motor movable element 641 that generates a load through interaction with the motor stator 642 and is capable of reciprocating relative to the pickup head body 62 together with the collet 61. The contact detection unit 65 includes a reaction force generating unit 652 that generates a reaction force to the load, and a load sensor 651 that detects changes in the internal load based on the load and the reaction force. With this configuration, the function of generating a load and the function of detecting changes in the internal load can be realized with a simple configuration.

[0121] The collet motor 64 includes a motor stator 642 provided on the pickup head body 62, and a motor movable element 641 that generates a load through interaction with the motor stator 642 and is capable of reciprocating relative to the pickup head body 62 together with the collet 61. The motor movable element 641 includes a movable element lower surface 641b, which is the part that contacts the reaction force generating section 652. With this configuration, the motor movable element 641 can transmit the force generated by the collet motor 64 to the pickup head body 62.

[0122] The collet motor 64 has a collet 61 shaft that connects the collet 61 to the motor movable element 641. The motor movable element 641 can be moved away from the pickup head body 62 in the direction of the load. The collet 61 shaft is provided with a shaft engagement portion, which is a first portion that contacts the pickup head body 62 in the direction of the load. With this configuration, the force generated by the collet motor 64 can be transmitted to the pickup head body 62 at a location other than the motor movable element 641.

[0123] The collet motor 64 has a collet 61 shaft that connects the collet 61 to the motor movable element 641. The line of action of the load overlaps with the axis A63 of the collet 61 shaft. This configuration also allows for miniaturization of the pickup device.

[0124] The collet motor 64 has a collet 61 shaft that connects the collet 61 to the motor movable element 641. The reaction force generating unit 652 includes a load acting unit 652b on which a load is applied, and a load detection unit 652a equipped with a load sensor 651. The contact detection unit 65 has a load sensor 651 that detects when the internal load based on the load and reaction force has changed. The distance from the axis A63 of the collet 61 shaft to the load acting unit 652b is shorter than the distance from the collet 61 shaft to the load detection unit. With these configurations, the load detection unit 652a can accurately detect changes in the reaction force generated in the load acting unit 652b.

[0125] The collet motor 64 generates a load through interaction with the motor stator 642 provided on the pickup head body 62, and together with the collet 61, it is able to reciprocate relative to the pickup head body 62. With these configurations, the load detection unit 652a can accurately detect changes in the reaction force generated in the load application unit 652b.

[0126] <Second Embodiment> In the step of bonding the semiconductor chip 91 (S42 in Figure 6), the semiconductor chip 91 is bonded to the semiconductor substrate 92 which is positioned in a predetermined location on the bonding stage 41. In this operation (S42), the bonding unit 4 is moved onto the semiconductor substrate 92 (see Figure 9(a): S421).

[0127] The bonding apparatus 1S of the second embodiment shown in Figure 14 is equipped with a mechanism that can suitably perform this operation (S421). Furthermore, the bonding apparatus 1S of the second embodiment is equipped with a mechanism that can perform so-called high-load bonding. The load when pressing the semiconductor chip 91 onto the semiconductor substrate 92 is determined by the load generated by the bonding head 42. To increase the load when pressing, it is necessary to increase the load generated by the bonding head 42. Increasing the load generated by the bonding head 42 involves increasing the size of the bonding head 42. As a result, the size and weight of the bonding head 42 increase. This limits the speed at which the bonding head 42 can be moved, thus hindering the acceleration of the bonding operation.

[0128] The bonding apparatus 1S of the second embodiment achieves both high-speed bonding and high-load bonding. The bonding apparatus 1S of the second embodiment is equipped with an additional load unit 8 for high-load bonding. For example, when the bonding unit 4 alone can exert a load of 15 Newtons, the additional load unit 8 can add an additional load of 50 Newtons. In other words, by providing a unit that generates a high load separately from the unit that bonds the semiconductor chip 91, both high-speed bonding and high-load bonding can be achieved.

[0129] Figure 14 is a perspective view showing the main components of the bonding apparatus 1S of the second embodiment. The bonding apparatus 1S includes a bonding unit 4 and an additional load unit 8. The bonding apparatus 1S also includes a controller unit and a pickup unit, similar to the bonding apparatus 1 of the first embodiment, but these are not shown in Figure 14.

[0130] The bonding head 42, which constitutes the bonding unit 4, may also be equipped with a mechanism that provides the same contact detection function as the pickup unit 3. In the following description, the bonding head 42 will be described as being equipped with a contact detection mechanism 420 (load generation section, reaction force generation section, contact detection section) for providing the contact detection function.

[0131] A camera unit 7 is attached to the bonding guide rail 423. The camera unit 7 includes a camera 71 and a camera support 79. Therefore, the camera unit 7 can also move back and forth along the X-axis. The camera unit 7 is attached to the bonding stage 41 side relative to the bonding head 42. The camera 71 can image the area on the bonding stage 41 where the semiconductor substrate 92 to be bonded is placed. The captured image is transmitted to the controller unit 2. The controller unit 2 uses the received image data to determine the position of the semiconductor substrate 92. Then, using the information of the determined position, the controller unit 2 performs positioning control to move the bonding head 42 onto the semiconductor chip 91.

[0132] The additional load unit 8 includes an additional load motor 81 and a motor support 89. The additional load motor 81 has a motor shaft 811, which is moved back and forth along its axis. The lower end of this motor shaft 811 contacts the upper end of the bonding head shaft 425. With the lower end of the motor shaft 811 in contact with the upper end of the bonding head shaft 425, a downward force is generated in the Z-axis direction. As a result, an additional load can be applied. The additional load motor 81 is attached to the additional load guide rail 80 via the motor support 89. The additional load motor 81 can move back and forth along the additional load guide rail 80 by means of the motor support 89.

[0133] As shown in Figure 15(a), the additional load guide rail 80 is positioned above the bonding stage 41. In a plan view, the additional load guide rail 80 is parallel to the bonding guide rail 423. Also, as shown in Figure 15(b), in a side view from the Y-axis direction, the additional load guide rail 80 is positioned above the bonding guide rail 423.

[0134] <Manufacturing method for semiconductor devices> Next, a method for manufacturing a semiconductor device performed by the bonding apparatus 1S of the second embodiment will be described with reference to the flowchart in Figure 16 and Figures 17 to 21. Steps S1, S2, S3, and S5 shown in the flowchart in Figure 16 are the same as those of the first embodiment, so a detailed explanation will be omitted. Below, the operation (S4) in which bonding is performed using a correction block motor signal will be described in detail.

[0135] First, the semiconductor chip 91 is picked up (see Figure 17(a), S421). In this operation (S421), the bonding head 42's contact detection mechanism 420 may detect that the bonding tool 422 has come into contact with the semiconductor chip 91. Next, the camera unit 7 is used to image the semiconductor substrate 92 (see Figure 17(b), S422). The captured image data is sent to the controller unit 2. Next, the camera 71 is moved to a safe place (see Figure 18(a), S423). "Moving to a safe place" here means moving the camera 71 from the semiconductor substrate 92 to another location. Moving the camera 71 makes it possible to position the bonding head 42 on the semiconductor substrate 92 to be bonded.

[0136] Next, the bonding head 42 is moved onto the semiconductor substrate 92 (see Figure 18(b), S424). In the example in Figure 18(b), the semiconductor substrate 92 is placed on the substrate frame 97. Also, in Figure 18(b), only one semiconductor substrate 92 to be bonded is shown, and the other semiconductor substrates 92 are not shown. In this operation (S424), the controller unit 2 uses the image data acquired in operation (S422) to perform positioning control of the bonding head 42 relative to the semiconductor substrate 92. Next, the additional load unit 8 is moved onto the semiconductor substrate 92 (see Figure 19(a), S425). In this operation (S425), the controller unit 2 also uses the image data acquired in operation (S422) to perform positioning control of the additional load unit 8 relative to the semiconductor substrate 92.

[0137] Next, the semiconductor chip 91 is brought into contact with the semiconductor substrate 92 (see Figure 19(b), S426). During this operation (S426), the contact detection function of the bonding apparatus 1S may be used. Next, the bonding head 42 applies a first load F42S to the semiconductor chip 91 (see Figure 20(a), S427). Next, the additional load unit 8 applies a second load F8S, which is an additional load, to the semiconductor chip 91 (see Figure 20(b), S428). After a predetermined time has elapsed, the application of the second load F8S is released, and then the application of the first load F42S is released.

[0138] Then, the semiconductor chip 91 is released from the bonding tool 422 (see Figure 21, S429). High-load bonding is performed by executing the above steps S421 to S429.

[0139] The bonding apparatus 1S of the second embodiment, like the bonding apparatus 1S of the first embodiment, can bond the semiconductor chip 91 without damaging the semiconductor chip 91. Furthermore, the bonding apparatus 1S of the second embodiment can achieve both high-speed bonding and high-load bonding by providing an additional load unit 8 that generates a high load separately from the bonding head 42 that bonds the semiconductor chip 91.

[0140] <Variation> The present invention may be implemented in various forms, including the embodiments described above, with various modifications and improvements based on the knowledge of those skilled in the art. Furthermore, modified versions may be constructed by utilizing the technical matters described in the embodiments described above.

[0141] In this embodiment, a piezoelectric element that detects changes in force is used as an example of a sensor constituting the contact detection unit. A bimorph element or a unimorph element can also be used as the sensor constituting the contact detection unit. Furthermore, if structurally feasible, a stacked piezoelectric element can also be used as the sensor. In addition, instead of a sensor that detects changes in force, for example, a proximity sensor that detects distance may be used as the contact detection unit.

[0142] <Note> This disclosure includes the following components:

[0143] This disclosure [1] includes "a pickup head body and A collet that allows relative reciprocal movement with respect to the pickup head body and detachably holds a semiconductor chip, A load generating unit that generates a load along the axis defining the reciprocating movement of the collet, A reaction force generating unit that generates a reaction force caused by the aforementioned load relative to the load generating unit, A pickup device comprising: a contact detection unit for detecting, based on the reaction force, that the collet has come into contact with the semiconductor chip or that the collet has come into contact with an object other than the semiconductor chip via the semiconductor chip.

[0144] This disclosure [2] is "the pickup device according to [1] above, wherein the portion of the load generating portion that contacts the reaction force generating portion is structured to be spaced apart from the reaction force generating portion."

[0145] This disclosure [3] is "the pickup device according to [1] or [2] above, wherein the collet, the reaction force generating unit and the load generating unit are arranged on the axis of the axis."

[0146] This disclosure [4] states that "the load generating part is, The first load generating element provided on the pickup head body, It comprises a second load generating element that generates the load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet, The aforementioned contact detection unit is The reaction force generating unit generates a reaction force against the load, A pickup device according to any one of the above [1] to [3], comprising a load sensor for detecting changes in internal load based on the load and the reaction force.

[0147] This disclosure [5] states that "the load generating part is, The first load generating element provided on the pickup head body, It comprises a second load generating element that generates the load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet, The pickup device described in [4] above, wherein the second load generating element includes a portion that contacts the reaction force generating portion.

[0148] This disclosure [6] states that "the load generating unit has a collet shaft that connects the collet to the second load generating element, The collet shaft is provided with a shaft engagement portion that contacts the pickup head body along the direction of the load when the reaction force generating portion is generating a reaction force. The pickup device according to [4] or [5] above, wherein the second load generating element is spaced apart from the pickup head body in the direction of the load when the reaction force generating part is generating a reaction force.

[0149] This disclosure [7] states that "the load generating unit has a collet shaft connecting the collet to the second load generating element, The pickup device described in any one of the above items [4] to [6], wherein the line of action of the load overlaps with the axis of the collet shaft.

[0150] This disclosure [8] states that "the load generating unit has a collet shaft connecting the collet to the second load generating element, The reaction force generating unit includes a load acting unit on which the load is applied, and a load detection unit on which the load sensor is provided. The contact detection unit has a load sensor that detects changes in internal load based on the load and the reaction force, The pickup device according to any one of the above [4] to [7], wherein the distance from the axis of the collet shaft to the load application part is shorter than the distance from the collet shaft to the load detection part.

[0151] This disclosure [9] states that "the load generating part is, The first load generating element provided on the pickup head body, The pickup device according to any one of the above [4] to [8], comprising: a second load generating element that generates the load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet.

[0152] This disclosure

[10] states that "the load generating unit is a voice coil motor, The aforementioned first load generating element is a coil, The pickup device described in [4] to [8] above, wherein the second load generating element is a magnet.

[0153] This disclosure

[10] is "a pickup device according to any one of the above [4] to [9], wherein the load sensor is a piezoelectric element." [Explanation of Symbols]

[0154] 1...Bonding device, 2...Controller unit, 3...Pickup unit (pickup device), 4...Bonding unit, 5...Push-up module (second module), 6...Pickup head module (first module), 53...Push-up mechanism, 61a...Collet holding surface (contact surface), 91...Semiconductor chip, 92...Semiconductor substrate, 93...Semiconductor device, 94...Dicing sheet (sheet), 531...Block, 532...Block motor (drive unit), 64...Collet motor (load generating unit), 651...Load sensor.

Claims

1. The pickup head body and A collet that allows relative reciprocal movement with respect to the pickup head body and detachably holds a semiconductor chip, A load generating unit that generates a load along the axis defining the reciprocating movement of the collet, A reaction force generating unit that generates a reaction force caused by the aforementioned load, A pickup device comprising: a contact detection unit for detecting, based on the reaction force, that the collet has come into contact with the semiconductor chip or that the collet has come into contact with an object other than the semiconductor chip via the semiconductor chip.

2. The pickup device according to claim 1, wherein the portion of the load generating portion that contacts the reaction force generating portion is structured to be spaced apart from the reaction force generating portion.

3. The pickup device according to claim 1, wherein the collet, the reaction force generating unit, and the load generating unit are arranged on the axis of the axis.

4. The aforementioned load generating section is The first load generating element provided on the pickup head body, It has a second load generating element that generates the load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet, The aforementioned contact detection unit is The reaction force generating unit generates a reaction force against the load, The pickup device according to claim 1, further comprising a load sensor for detecting changes in internal load based on the load and the reaction force.

5. The aforementioned load generating section is The first load generating element provided on the pickup head body, It has a second load generating element that generates the load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet, The pickup device according to claim 2, wherein the second load generating element includes a portion that contacts the reaction force generating portion.

6. The load generating unit has a collet shaft that connects the collet to the second load generating element, The collet shaft is provided with a shaft engagement portion that contacts the pickup head body along the direction of the load when the reaction force generating portion is generating a reaction force. The pickup device according to claim 4, wherein the second load generating element is separated from the pickup head body in the direction of the load when the reaction force generating unit is generating a reaction force.

7. The load generating unit has a collet shaft that connects the collet to the second load generating element, The pickup device according to claim 4, wherein the line of action of the load overlaps with the axis of the collet shaft.

8. The load generating unit has a collet shaft that connects the collet to the second load generating element, The reaction force generating unit includes a load acting unit on which the load is applied, and a load detection unit on which the load sensor is provided. The contact detection unit has a load sensor that detects changes in internal load based on the load and the reaction force, The pickup device according to claim 4, wherein the distance from the axis of the collet shaft to the load application part is shorter than the distance from the collet shaft to the load detection part.

9. The aforementioned load generating section is The first load generating element provided on the pickup head body, The pickup device according to claim 8, further comprising: a second load generating element that generates the load through interaction with the first load generating element and is capable of reciprocating relative to the pickup head body together with the collet.

10. The load generating unit is a voice coil motor, The first load generating element is a coil, The pickup device according to claim 4, wherein the second load generating element is a magnet.

11. The pickup device according to claim 4, wherein the load sensor is a piezoelectric element.

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