Bonding apparatus and bonding method

Abstract

To achieve both high productivity and high-load bonding. [Solution] The bonding apparatus 1A includes a bonding head 4H that holds a semiconductor chip 91 and presses the held semiconductor chip 91 against a semiconductor substrate 92 with a first load along the line of action of the load, and an additional load unit 8A that overlaps with the bonding head 4H when viewed from the direction of the line of action of the load and applies a second load along the line of action of the load via the bonding head 4H. The bonding head 4H moves along the bonding head guide rail 40L. The additional load unit 8A moves along the additional load guide rail 80L.

Description

Technical Field

[0001] The present invention relates to a bonding apparatus and a bonding method.

Background Art

[0002] An electronic component includes a substrate and a semiconductor chip bonded onto the substrate. The demand for such electronic components is increasing year by year. Along with the increase in demand, an improvement in the productivity of the apparatus for manufacturing electronic components is required. Patent Documents 1 to 3 relate to a bonding apparatus which is an example of an apparatus for manufacturing electronic components. Patent Documents 1 to 3 disclose techniques for enhancing the productivity of the bonding apparatus.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] A bonding apparatus has a function of picking up a semiconductor chip, a function of moving the picked - up semiconductor chip onto a substrate, and a function of bonding the semiconductor chip to the substrate. These functions are achieved by a mechanism called a so - called bonding head.

[0005] Bonding equipment requires functional improvements that go beyond simply increasing productivity. For example, when bonding a semiconductor chip to a substrate, the semiconductor chip is sometimes pressed against the substrate with a predetermined load. In recent years, there has been a demand for the ability to press the semiconductor chip against the substrate with a higher load. However, attempting to increase the load exerted by the bonding head would inevitably lead to an increase in the weight of the bonding head. This increase in weight can hinder improvements in the movement speed of the bonding head. In other words, maintaining high productivity and increasing the load generated during bonding (high-load bonding) are contradictory, but a technology that can achieve both has been desired.

[0006] The present invention provides a bonding apparatus and bonding method that can achieve both high productivity and high-load bonding. [Means for solving the problem]

[0007] A bonding apparatus according to one embodiment of the present invention includes a bonding head that holds a first object and presses the held first object against a second object with a first load along the line of action of the load, and an additional load unit that overlaps with the bonding head when viewed from the direction of the line of action of the load and applies a second load along the line of action of the load via the bonding head, wherein the bonding head moves along a first guide rail and the additional load unit moves along a second guide rail.

[0008] This bonding apparatus comprises a bonding head that generates a first load and an additional load unit that generates a second load. With this configuration, when performing bonding that requires a high load, the desired load is generated by the two units. As a result, the increase in the weight of the bonding head can be suppressed compared to when high-load bonding is performed using only the bonding head that moves the first object. Consequently, the movement speed of the bonding head is not impaired, and high productivity can be maintained. Furthermore, high-load bonding can be performed using the additional load unit.

[0009] The bonding apparatus described above may further include a camera mounted on a second guide rail to image a second object. With this configuration, an image that can be used for alignment can be obtained.

[0010] The camera of the bonding apparatus described above may be movable along a second guide rail while maintaining its position relative to the additional load unit. This configuration allows the camera to be moved away from the second object and the additional load unit to be moved onto the second object simultaneously.

[0011] The camera of the bonding apparatus described above may be positioned between the second object and the additional load unit, and may be switchable between an imaging position that overlaps with the additional load unit when viewed from the direction of the load's line of action, and a non-imaging position that does not overlap with the additional load unit when viewed from the direction of the load's line of action. With this configuration, it is possible to image the second object with the camera while the additional load unit is placed on top of the second object. Furthermore, after imaging, the bonding head can be positioned between the additional load unit and the second object by retracting only the camera without moving the additional load unit.

[0012] The camera in the bonding apparatus described above may be incorporated into the bonding head such that, when viewed from the direction of the load's action, the camera's optical axis coincides with the load's action line. With this configuration, it is possible to image the second object with the camera while the additional load unit is placed on top of the second object. Furthermore, after imaging, the bonding head can be placed between the additional load unit and the second object without moving the additional load unit or the camera.

[0013] The camera of the bonding apparatus described above is fixed in a position that does not overlap with the additional load unit when viewed from the direction of the line of action of the load, and the additional load unit is fixed to the additional load unit so as to overlap with the line of action of the load when viewed from the direction of the line of action of the load, and may have an optical unit that guides light from a second object located in a position overlapping with the line of action of the load toward the camera. This configuration also allows the camera to image the second object while the additional load unit is placed on top of it. Furthermore, after imaging, the bonding head can be placed between the additional load unit and the second object without moving the additional load unit or the camera.

[0014] Another embodiment of the present invention is a bonding method comprising: a holding step of picking up a first object with a bonding head having a bonding tool that detachably holds the first object; a preparation step of aligning the first object, the second object, and an additional load unit that applies a second load along the line of action of the load via the bonding tool, so that they overlap the line of action of the load when viewed from the direction of the line of action of the load; and a pressing step of pressing the first object against the second object with the first load generated by the bonding head and the second load generated by the additional load unit.

[0015] In this bonding method, the first object is moved by the bonding head during the holding step. As a result, the first object can be moved without impairing the movement speed of the bonding head, thus maintaining high productivity. Furthermore, as a result of the preparation step, a state can be created in which bonding is performed using both the bonding head and the additional load unit. Therefore, high-load bonding can be performed.

[0016] The bonding method described above may further include an imaging step, prior to the preparation step, in which the second object is imaged using a camera for imaging the second object. This step allows for obtaining positional information about a second object that can be used for positioning control of the additional load unit and the bonding head.

[0017] The bonding method described above may further include a retraction step, which occurs after the imaging step but before the preparation step, in which the camera is moved to a position where it does not overlap with the line of action of the load when viewed from the direction of the line of action of the load. This step allows for the formation of a region between the additional load unit and the second object in which the bonding head is positioned.

[0018] In the bonding method described above, when it is an imaging step, the additional load unit does not overlap with the second object when viewed from the direction of the load's action line, and as a result of performing the retraction step, when viewed from the direction of the load's action line, the camera does not overlap with the second object, although the additional load unit may overlap with the second object. This step allows for the simultaneous removal of the camera from above the second object and the movement of the additional load unit onto the second object.

[0019] When the above bonding method is in the imaging step, as viewed from the direction of the line of action of the load, the additional load unit overlaps the second object. As a result of performing the retraction step, as viewed from the direction of the line of action of the load, the camera does not overlap the second object, and the additional load unit may maintain the state of overlapping the second object. According to this step, it is possible to image the second object with a camera while the additional load unit is disposed on the second object. Further, after imaging, the bonding head can be disposed between the additional load unit and the second object by retracting only the camera without moving the additional load unit.

[0020] When the above bonding method is in the imaging step, as viewed from the direction of the line of action of the load, the additional load unit and the camera overlap the second object. When it is the pressing step, as viewed from the direction of the line of action of the load, the additional load unit and the camera may maintain the state of overlapping the second object. According to this step, it is possible to image the second object with a camera while the additional load unit is disposed on the second object. Further, after imaging, the bonding head can be disposed between the additional load unit and the second object without moving the additional load unit and the camera.

[0021] When the above bonding method is in the imaging step, as viewed from the direction of the line of action of the load, the additional load unit overlaps the second object, the camera does not overlap the second object, and the additional load unit is fixed to overlap the line of action of the load as viewed from the direction of the line of action of the load. Imaging is performed through an optical unit that guides light from the second object located at a position overlapping the line of action of the load toward the camera. When it is the pressing step, as viewed from the direction of the line of action of the load, the additional load unit overlaps the second object, and the camera may not overlap the second object. Also by this step, with the additional load unit placed on the second object, it is possible to image the second object with a camera. Further, after imaging, without moving the additional load unit and the camera, a bonding head can be placed between the additional load unit and the second object.

Advantages of the Invention

[0022] According to the present invention, there are provided a bonding apparatus and a bonding method capable of achieving both high productivity and high-load bonding.

Brief Description of the Drawings

[0023] [Figure 1] FIG. 1 is a schematic diagram showing a bonding apparatus according to the first embodiment. [Figure 2] FIG. 2(a) is a diagram showing a bonding head provided with a contact detection unit as a first example. FIGS. 2(b) and 2(c) are diagrams visualizing the load related to the contact detection unit as the first example. [Figure 3] FIG. 3(a) is a diagram showing a bonding head provided with a contact detection unit as a second example. FIGS. 3(b) and 3(c) are diagrams visualizing the load related to the contact detection unit as the second example. [Figure 4] FIG. 4 is a perspective view showing a main part of the bonding apparatus according to the first embodiment. [Figure 5] FIG. 5(a) is a plan view of the bonding apparatus shown in FIG. 4. FIG. 5(b) is a side view of the bonding apparatus shown in FIG. 4. [Figure 6] FIG. 6 is a flowchart showing a bonding method executed by the bonding apparatus shown in FIG. 1. [Figure 7] FIGS. 7(a) and 7(b) are diagrams for explaining the main steps of the flowchart shown in FIG. 6. [Figure 8] FIGS. 8(a) and 8(b) are diagrams for explaining the main steps of the flowchart shown in FIG. 6 following FIG. 7. [Figure 9] Figures 9(a) and 9(b), following Figure 8, are diagrams illustrating the main steps of the flowchart shown in Figure 6. [Figure 10] Figures 10(a) and 10(b), following Figure 9, are diagrams illustrating the main steps of the flowchart shown in Figure 6. [Figure 11] Figure 11 is a perspective view showing a modified example of the bonding apparatus of the first embodiment. [Figure 12] Figure 12 is a perspective view showing the main parts of the bonding apparatus of the second embodiment. [Figure 13] Figure 13(a) is a plan view of the bonding apparatus shown in Figure 12. Figure 13(b) is a side view of the bonding apparatus shown in Figure 12. [Figure 14] Figure 14 is a flowchart showing the bonding method performed by the bonding apparatus shown in Figure 12. [Figure 15] Figures 15(a) and 15(b) are diagrams illustrating the main steps of the flowchart shown in Figure 14. [Figure 16] Figures 16(a) and 16(b) are a continuation of Figure 14 and illustrate the main steps in the flowchart shown in Figure 14. [Figure 17] Figures 17(a) and 17(b), following Figure 15, are diagrams illustrating the main steps of the flowchart shown in Figure 14. [Figure 18] Figures 18(a) and 18(b), following Figure 16, are diagrams illustrating the main steps of the flowchart shown in Figure 14. [Figure 19] Figure 19 is a perspective view showing the main components of the bonding apparatus according to the third embodiment. [Figure 20] Figure 20(a) is a plan view of the bonding apparatus shown in Figure 19. Figure 20(b) is a side view of the bonding apparatus shown in Figure 19. [Figure 21] Figure 21 is a flowchart showing the bonding method performed by the bonding apparatus shown in Figure 19. [Figure 22]Figures 22(a) and 22(b) are diagrams illustrating the main steps in the flowchart shown in Figure 21. [Figure 23] Figures 23(a) and 23(b), following Figure 22, are diagrams illustrating the main steps of the flowchart shown in Figure 14. [Figure 24] Figures 24(a) and 24(b), following Figure 23, are diagrams illustrating the main steps of the flowchart shown in Figure 14. [Figure 25] Figures 25(a) and 25(b), following Figure 24, are diagrams illustrating the main steps of the flowchart shown in Figure 14. [Figure 26] Figure 26 is a perspective view showing the main parts of the bonding apparatus of the fourth embodiment. [Figure 27] Figure 27(a) is a plan view of the bonding apparatus shown in Figure 26. Figure 27(b) is a side view of the bonding apparatus shown in Figure 26. [Figure 28] Figure 28 is a flowchart showing the bonding method performed by the bonding apparatus shown in Figure 26. [Figure 29] Figures 29(a) and 29(b) are diagrams illustrating the main steps of the flowchart shown in Figure 28. [Figure 30] Figures 30(a) and 30(b), following Figure 29, are diagrams illustrating the main steps of the flowchart shown in Figure 28. [Figure 31] Figures 31(a) and 31(b), following Figure 30, are diagrams illustrating the main steps of the flowchart shown in Figure 28. [Figure 32] Figures 32(a) and 32(b), following Figure 31, are diagrams illustrating the main steps of the flowchart shown in Figure 28. [Modes for carrying out the invention]

[0024] <First Embodiment> Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the attached drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant explanations are omitted.

[0025] Each figure shows the XYZ Cartesian coordinate system as needed. In the following description, the normal direction of the stage mounting surface 52a of the wafer stage 52, which will be described later, is defined as the Z-axis direction, and the plane direction along the stage mounting surface 52a is defined as the X-axis direction (first movement axis, second movement axis) and the Y-axis direction. In addition, in the following, the positive direction in the Z-axis direction may be referred to as "up," and the negative direction in the Z-axis direction may be referred to as "down."

[0026] The bonding apparatus 1A shown in Figure 1 mounts a semiconductor chip 91 (first object), which is an example of a chip component, onto a semiconductor substrate 92 (second object). The semiconductor chip 91 and the semiconductor substrate 92 together are referred to as a semiconductor device 93. Multiple semiconductor chips 91 are attached to a dicing sheet 94 via a viscoelastic film. The thickness of the semiconductor chip 91 is, for example, about 20 μm. The thickness of the dicing sheet 94 is, for example, about 100 μm. The bonding apparatus 1A peels the semiconductor chips 91 attached to the dicing sheet 94 off the dicing sheet 94 along with the viscoelastic film. Then, the bonding apparatus 1A fixes the peeled semiconductor chips 91 to the semiconductor substrate 92. The operation of fixing the semiconductor chips 91 to the semiconductor substrate 92 is called die bonding.

[0027] The bonding apparatus 1A includes a controller unit 2, a pickup unit 3 (pickup device), and a bonding unit 4.

[0028] The controller unit 2 controls the operation of the bonding unit 4 and the pickup unit 3. The controller unit 2 outputs control signals to the bonding unit 4 and the pickup unit 3. The controller unit 2 is, for example, a computer including a CPU, memory units such as ROM and RAM, an input / output unit, and a driver. The controller unit 2 operates the input / output unit according to the control of the CPU. Furthermore, the controller unit 2 reads and writes data to the memory units. These operations generate control signals that are provided to the bonding unit 4 and the pickup unit 3. Based on these control signals, the bonding unit 4 and the pickup unit 3 perform their respective operations, such as bonding and pickup operations.

[0029] The functions of the controller unit 2 are not limited to those exemplified. For example, the controller unit 2 has the function of controlling the position of the pickup unit 3, the function of causing the pickup unit 3 to hold the semiconductor chip 91, and the function of releasing the semiconductor chip 91 from the pickup unit 3. The controller unit 2 also has the function of controlling the position of the bonding unit 4 and the function of controlling the bonding operation by the bonding unit 4.

[0030] <Pickup Unit> The pickup unit 3 picks up the semiconductor chip 91. Picking up the semiconductor chip 91 includes peeling the semiconductor chip 91 from the dicing sheet 94 and holding the peeled semiconductor chip 91 in the pickup unit 3. The semiconductor chip 91 is attracted to the pickup unit 3. The pickup unit 3 places the picked-up semiconductor chip 91 on the intermediate stage 96. The pickup unit 3 may also be configured to transfer the semiconductor chip 91 to the bonding unit 4 by a so-called flip-chip operation. The pickup unit 3 will be described in detail later. Bonding may also be performed by the pickup unit without the intermediate stage 96.

[0031] The pickup unit 3 includes a push-up module 5 and a pickup head module 6.

[0032] <Push-up module> The push-up module 5 assists in the pickup operation. The push-up module 5 includes, for example, a wafer holder 51, a wafer stage 52, and a push-up mechanism 53. The wafer holder 51 holds the dicing sheet 94. While the wafer holder 51 is holding the dicing sheet 94, tension acts on the dicing sheet 94 from the center outwards. This tension stretches the dicing sheet 94.

[0033] The wafer stage 52 adjusts the relative position between the wafer holder 51 and the push-up mechanism 53. The wafer stage 52 may, for example, translate the wafer holder 51 in the X-axis direction. The wafer stage 52 may also rotate the wafer holder 51 around the Z-axis. This movement causes the wafer stage 52 to move the semiconductor chip 91 to be picked up onto the push-up mechanism 53.

[0034] <Pickup head module> The pickup head module 6 includes, for example, a collet 61 and a pickup head body 62. The pickup head module 6 may also include a contact detection unit 605 for performing the contact detection function provided by the bonding head 4H.

[0035] The collet 61 is positioned at the tip of the pickup head module 6. The collet 61 reciprocates in the Z-axis direction relative to the pickup head module 6. The collet 61 includes a collet holding surface that detachably holds the semiconductor chip 91.

[0036] The collet 61 detachably holds the semiconductor chip 91 that has been pushed up by the push-up mechanism 53. In other words, the collet 61 picks up the semiconductor chip 91. The collet 61 holds the semiconductor chip 91, for example, by vacuum suction. The collet 61 places the picked-up semiconductor chip 91 onto the intermediate stage 96.

[0037] <Bonding Unit> The bonding unit 4 picks up the semiconductor chip 91 placed on the intermediate stage 96 and bonds the picked-up semiconductor chip 91 to the semiconductor substrate 92. The bonding unit 4 includes, for example, a bonding stage 4S and a bonding head 4H.

[0038] The bonding stage 4S is on which the semiconductor substrate 92 is placed. The bonding stage 4S is for mounting the semiconductor chip 91 onto the semiconductor substrate 92. The bonding stage 4S may also have a function for adsorbing the semiconductor substrate 92.

[0039] The bonding head 4H includes a bonding tool 401, a bonding head body 402, a bonding shaft 402s, a bonding motor 402m, and a contact detection unit 405.

[0040] The bonding tool 401 detachably holds the semiconductor chip 91 on the intermediate stage 96. For example, the bonding tool 401 has a vacuum suction mechanism for the attachment and detachment function. The bonding tool 401 is connected to a bonding shaft 402s that can reciprocate along the Z-axis. Through this operation, the bonding tool 401 bonds the semiconductor chip 91 to the semiconductor substrate 92. For example, the bonding tool 401 may have a heater or the like to provide heat to the semiconductor chip 91.

[0041] The bonding head body 402 is connected to the bonding head guide rail 40L (first guide rail) via the bonding head support 409. The bonding head body 402 reciprocates along the bonding head guide rail 40L via the bonding head support 409. This bonding head guide rail 40L extends, for example, from the intermediate stage 96 to the bonding stage 4S, which is the area where bonding work is performed.

[0042] As shown in Figure 2, the bonding head body 402 incorporates a bonding motor 402m for driving the bonding tool 401. An example of a bonding motor 402m is a voice coil motor (VCM). The bonding motor 402m includes a motor movable element 441 (second load generating element) and a motor stator 442 (first load generating element). One of the motor movable element 441 and the motor stator 442 is a magnet, and the other is a coil. For example, a configuration in which the motor movable element 441 is a magnet and the motor stator 442 is a coil is called a moving magnet type. For example, a configuration in which the motor movable element 441 is a coil and the motor stator 442 is a magnet is called a moving coil type. The motor movable element 441 is connected to the bonding tool 401 via a bonding shaft 402s. The motor movable element 441 is capable of reciprocating relative to the bonding head body 402. The motor stator 442 is provided on the bonding head body 402.

[0043] The bonding motor 402m applies a generated load F44a (see Figure 2(b)) along the Z-axis direction to the bonding tool 401 via the bonding shaft 402s, in response to the bonding motor signal received from the controller unit 2. The line of action A44 of this generated load F44a coincides with the axis A43 of the bonding shaft 402s.

[0044] The contact detection unit 405 detects when an object comes into contact with the tool holding surface 41a. The contact detection unit 405 includes a piezoelectric element, such as a piezo element, as a component. The contact detection unit 405 outputs a voltage corresponding to the force as load sensor data. The load sensor data is provided to the controller unit 2.

[0045] Below are two specific examples of the contact detection unit 405.

[0046] <Example 1: Contact detection unit 405> Figure 2(a) shows a contact detection unit 405, which is a first example. The contact detection unit 405 is located below the head housing space 42s. More specifically, the contact detection unit 405 includes two load sensors 451 and a reaction force generating unit 452. The reaction force generating unit 452 is the head bottom 42f, which defines the bottom of the head housing space 42s. The upper surface of the head bottom 42f is the bottom upper surface 42f1, which faces the head housing space 42s. The lower surface of the head bottom 42f is the bottom lower surface 42f2, which faces the bonding tool 401. The thickness from the bottom upper surface 42f1 to the bottom lower surface 42f2 is relatively thin, so that the effect of the load received when an object contacts the tool holding surface 41a becomes apparent through changes in internal load and shape. In the example shown in Figure 2(a), a bottom through-hole 42g is provided in the bottom surface 42f2 through which the bonding shaft 402s passes. The axis of the bottom through-hole 42g coincides with the axis A43 of the bonding shaft 402s. Furthermore, a pair of load sensors 451 are attached to the bottom surface 42f2. The load sensors 451 are mounted at a predetermined distance from the axis A43 of the bonding shaft 402s.

[0047] The reaction force generating section 452 is a load detection section 452a (see Figure 2(b)) where the area close to the outer surface 42h of the bonding head body 402 is integrated with the bonding head body 402. A load sensor 451 is provided on this load detection section 452a. The load detection section 452a is the location where the maximum stress (strain) occurs when the generated load F44a acts on the load application section 452b. The reaction force generating section 452 is also a load application section 452b (see Figure 2(b)) where the area around the bottom through-hole 42g through which the bonding shaft 402s is inserted is deformable in the vertical direction. The generated load F44a acts on this load application section 452b. Using the axis A43 of the bonding shaft 402s as a reference, the distance from axis A43 to the load application section 452b is shorter than the distance from axis A43 to the load detection section 452a. This configuration allows for a larger lever ratio, thereby increasing detection sensitivity.

[0048] The applied load F44 (see Figure 2(b)) that the motor movable element 441 imparts to the bonding head body 402 can be considered to have the axis A43 of the bonding shaft 402s as its line of action. In other words, the line of action of the applied load F44 that the motor movable element 441 imparts to the bonding head body 402 coincides with the line of action of the load that the bonding shaft 402s receives due to contact with the object.

[0049] Figure 2(b) visualizes the forces acting on the motor movable element 441. The area around the bottom through-hole 42g, which is the free end through which the bonding shaft 402s passes, receives a load F44 from the motor movable element 441. The motor movable element 441 is subjected to the applied load F44 and a reaction force F42 to the applied load F44. These applied loads F44 and F42 have the same magnitude but opposite directions.

[0050] Here, the applied load F44 is defined as the resultant force of the generated load F44a generated by the bonding motor 402m and the contact load F43a acting on the bonding shaft 402s. For example, as shown in Figure 2(b), when the bonding tool 401 is not in contact with an object, the contact load F43a acting on the bonding shaft 402s is zero. Therefore, the applied load F44 is equal to the generated load F44a generated by the bonding motor 402m. On the other hand, as shown in Figure 2(c), when the bonding tool 401 is in contact with an object, the contact load F43a acting on the bonding shaft 402s has a predetermined value. Therefore, the applied load F44 is the resultant force of the generated load F44a generated by the bonding motor 402m and the contact load F43a acting on the bonding shaft 402s. More specifically, since the direction of the generated load F44a and the direction of the contact load F43a are opposite to each other, the applied load F44 is the generated load F44a minus the contact load F43a.

[0051] Changes in the applied load F44 are detected by a load sensor 451 located at a predetermined distance from the axis A43 of the bonding shaft 402s. The line of action of the applied load F44 may be considered to coincide with the axis A43 of the bonding shaft 402s. The position where the change in the applied load F44 is detected is shifted in a direction perpendicular to the axis A43 of the bonding shaft 402s. In other words, the position where the change in the applied load F44 is detected does not lie on the line of action of the applied load F44. For example, if the load sensor 451 is capable of detecting changes in state values ​​in response to bending moment, the bending moment increases with distance, so changes in load due to contact can be detected with greater accuracy.

[0052] The operation of detecting contact will be explained in detail by the first example. As shown in Figure 2(b), the bonding motor 402m presses the motor movable element 441 against the reaction force generating unit 452. At this time, the lower surface 441b (first part) of the motor movable element 441 is in contact with the bottom upper surface 42f1. On the other hand, the upper surface 441a (second part) of the motor movable element 441 is not in contact with the ceiling back surface 42t1. It is assumed that no object is in contact with the bonding tool 401. The motor movable element 441 is then pressed against the bottom upper surface 42f1 with an applied load F44. As mentioned above, since no object is in contact with the bonding tool 401 at this point, the applied load F44 is equal to the generated load F44a generated by the bonding motor 402m. In that case, the reaction force generating unit 452 generates a reaction force F42 that is the same magnitude as the applied load F44 but in the opposite direction. The applied load F44 and the reaction force F42 balance each other, causing the motor movable element 441 to come to rest. The change in the reaction force F42 occurring in the reaction force generating unit 452 is detected as an internal load by the load sensor 451.

[0053] Then, as shown in Figure 2(c), when an object comes into contact with the bonding tool 401, the bonding shaft 402s receives an upward contact load F43a. At this time, the bonding motor 402m continues to generate the generated load F44a, but receives an upward contact load F43a from the bonding shaft 402s. Consequently, the applied load F44 received by the reaction force generating unit 452 is the resultant of the generated load F44a and the contact load F43a. Since the generated load F44a and the contact load F43a are in opposite directions, the applied load F44 received by the reaction force generating unit 452 appears to have decreased from the generated load F44a. Consequently, the reaction force F42 generated by the reaction force generating unit 452 also decreases. The decrease in reaction force F42 can be detected by the load sensor 451. Therefore, the change in the value of the load sensor 451 can be used to detect when an object comes into contact with the bonding tool 401.

[0054] In other words, according to the first example, contact of an object with the bonding tool 401 is detected based on the change in the internal load (reaction force F42) generated in the bonding head body 402. Other contact detection methods may utilize the movement or deformation of parts caused by the contact of an object. However, the movement of parts begins when the load caused by contact becomes greater than the initial load. In other words, from the time an object makes contact until the load caused by contact becomes greater than the initial load, the contact may not be detected even though the object is in contact.

[0055] On the other hand, changes in internal load do not involve the movement of such parts. When the state of the internal load, which is caused by the initial load, changes due to another load resulting from contact with an object, it can be detected immediately. Therefore, contact detection based on internal load can capture the timing of contact with greater accuracy than contact detection based on the movement of parts.

[0056] In short, in the first example, the motor movable element 441 includes a movable element lower surface 441b, which is a contact surface that abuts the bottom upper surface 42f1 of the bonding head body 402, and a movable element upper surface 441a, which is a separated surface that is separated from the ceiling surface 42t1 of the bonding head body 402. With this configuration, the motor movable element 441 can transmit the force generated by the bonding motor 402m to the bonding head body 402.

[0057] <Second example: Contact detection unit 405> Figure 3(a) shows a contact detection unit 405, which is a second example. In the second example, the point where a load is applied to the bonding head body 402 is located in a different place from the motor movable element 441. In other words, the second example differs from the first example in that the motor movable element 441 is not in contact with the bonding head body 402. In the second example, the shaft engagement portion 454 provided on the bonding shaft 402s corresponds to the first part, and the motor movable element 441 corresponds to the second part.

[0058] As shown in Figure 3(a), the contact detection unit 405 includes a load sensor 451, a reaction force generating unit 453, and an axial engagement unit 454. The axial engagement unit 454 is provided on the bonding shaft 402s. The axial engagement unit 454 is a member having a width greater than the outer shape of the bonding shaft 402s. The axial engagement unit 454 may be a rod-shaped member extending radially to the bonding shaft 402s, or it may be a disc-shaped member in plan view. The axial engagement unit 454 is fixed to the bonding shaft 402s. The reaction force generating unit 453 has an upper surface 453a and a lower surface 453b. Neither the upper surface 453a nor the lower surface 453b of the reaction force generating unit are in contact with any other part of the bonding head body 402. In other words, the reaction force generating unit 453 can be deformed vertically along the axis A43 of the bonding shaft 402s. The reaction force generating section 453 is provided with a through hole 453h through which the bonding shaft 402s is inserted.

[0059] As shown in Figure 3(b), with such a shaft engagement portion 454, the generated load F44a generated by the bonding motor 402m is transmitted from the shaft engagement portion 454 to the reaction force generating portion 453 as an applied load F44 via the bonding shaft 402s. As a result, the area around the through hole 453h in the reaction force generating portion 453 receives an applied load F44 that pushes downward, causing a change in the internal load in the reaction force generating portion 453. This change in internal load can be detected by two load sensors 451. The load sensors 451 are generally the same as those in the first example, so a detailed explanation is omitted.

[0060] The operation for detecting contact in the second example is, in principle, the same as in the first example. That is, the generated load F44a produced by the bonding motor 402m is applied as a load F44 from the shaft engagement part 454 to the bonding head body 402. When an upward contact load F43a caused by contact with an object acts on the bonding shaft 402s, the applied load F44 received by the reaction force generating part 453 appears to decrease. This phenomenon can be detected by the load sensor 451. Therefore, contact with an object on the bonding tool 401 can be detected by the change in the value of the load sensor 451.

[0061] In short, the second example includes a movable lower surface 441b spaced apart from the bottom upper surface 42f1 of the bonding head body 402, and a movable upper surface 441a spaced apart from the top surface 42t1 of the bonding head body 402. That is, in the second example, the bonding head body 402 is a second part that does not come into contact with the bonding head body 402. And in the second example, the shaft engagement portion 454 provided on the bonding shaft 402s is the first part that comes into contact with the bonding head body 402. With this configuration, the force generated by the bonding motor 402m can be transmitted to the bonding head body 402 at the shaft engagement portion 454 of the bonding shaft 402s, which is a different location from the motor movable element 441.

[0062] The bonding apparatus 1A of the first embodiment achieves both high-speed bonding and high-load bonding. As shown in Figure 4, the bonding apparatus 1A is equipped with an additional load unit 8A for high-load bonding. For example, when the bonding unit 4 alone can exert a load of 15 Newtons, the additional load unit 8A can add an additional load of 50 Newtons. In other words, by providing a unit that generates a high load separately from the unit that bonds the semiconductor chip 91, both high-speed bonding and high-load bonding are achieved.

[0063] Figure 4 is a perspective view showing the main components of bonding apparatus 1A. Bonding apparatus 1A includes a bonding unit 4 and an additional load unit 8A.

[0064] The additional load unit 8A includes an additional load motor 811 and a motor support 819. The additional load motor 811 has a motor body 811m and a motor shaft 811s, and the motor shaft 811s is moved back and forth along the Z axis. The lower end of the motor shaft 811s contacts the upper end of the bonding shaft 402s. With the lower end of the motor shaft 811s in contact with the upper end of the bonding shaft 402s, the additional load motor 811 generates a downward force in the Z axis direction. As a result, an additional load can be applied. The additional load motor 811 is attached to the additional load guide rail 80L (second guide rail) via the motor support 819. The additional load motor 811 can move back and forth along the additional load guide rail 80L by means of the motor support 819.

[0065] As shown in Figure 5(a), the additional load guide rail 80L is positioned above the bonding stage 4S. In a plan view, the additional load guide rail 80L is parallel to the bonding head guide rail 40L. Also, as shown in Figure 5(b), in a side view from the Y-axis direction, the additional load guide rail 80L is positioned above the bonding head guide rail 40L.

[0066] A camera 711 is also attached to the motor support 819. Therefore, the camera 711 can also move back and forth in the X-axis direction. In this case, the additional load unit 8A and the camera 711 are attached to the same motor support 819. Therefore, when moving in the X-axis direction, the relative positions of the additional load unit 8A and the camera 711 are maintained. The camera 711 is attached to the motor support 819 so that it is on the side of the bonding stage 4S relative to the additional load unit 8A. The camera 711 can image the area on the bonding stage 4S where the semiconductor substrate 92 to be bonded is located. The area where the semiconductor substrate 92 is located can also be said to be the location of the bonding target. The captured image is transmitted to the controller unit 2. The controller unit 2 uses the received image data to determine the position of the semiconductor substrate 92. Then, using the information of the determined position, the controller unit 2 performs positioning control to move the bonding head 4H onto the semiconductor chip 91.

[0067] <Manufacturing method for semiconductor devices> Next, a method for manufacturing a semiconductor device performed by the bonding apparatus 1A of the first embodiment will be described with reference to the flowchart in Figure 6 and Figures 7 to 10.

[0068] First, the pickup head module 6 picks up the semiconductor chip 91. Then, the pickup head module 6 moves the picked-up semiconductor chip 91 to the intermediate stage 96 (S1).

[0069] Next, bonding is performed (S10). First, the bonding head 4H picks up the semiconductor chip 91 (see Figure 7(a), S11). In this operation (S11), the contact detection unit 405 of the bonding head 4H may detect when the bonding tool 401 has come into contact with the semiconductor chip 91.

[0070] Next, the semiconductor substrate 92 is imaged using the camera 711 (see Figure 7(b), S12). The controller unit 2 moves the camera 711 so that its optical axis A711 overlaps with the semiconductor substrate 92. Here, the optical axis A711 of the camera 711 is offset from the line of action A811 of the additional load unit 8A. As a result, when the optical axis A711 of the camera 711 overlaps with the semiconductor substrate 92, the line of action A811 of the additional load unit 8A does not overlap with the semiconductor substrate 92. The captured image data is sent to the controller unit 2.

[0071] Next, the additional load unit 8A and the camera 711 are moved (see Figure 8(a), S13). As a result of this operation, the camera 711, which was overlapping the semiconductor substrate 92 when viewed from the Z-axis direction, moves to a position where it does not overlap the semiconductor substrate 92. Moving the camera 711 from above the semiconductor substrate 92, which is the target of bonding, to another location is defined as "retraction". Therefore, this operation (S13) corresponds to the retraction step. Furthermore, as a result of this operation (S13), the additional load unit 8A, which was not overlapping the semiconductor substrate 92 when viewed from the Z-axis direction, moves to a position where it overlaps the semiconductor substrate 92. During this operation (S13), the controller unit 2 uses the image data acquired in the imaging operation (S12) to perform positioning control of the additional load unit 8A relative to the semiconductor substrate 92.

[0072] Next, the bonding head 4H is moved onto the semiconductor substrate 92 (see Figure 8(b), S14). In the example in Figure 8(b), the semiconductor substrate 92 is placed on the substrate frame 97. Also, in Figure 8(b) and other figures, only one semiconductor substrate 92 to be bonded is shown, and the other semiconductor substrates 92 are not shown. In this operation (S14), the controller unit 2 uses the image data acquired in operation (S12) to perform positioning control of the bonding head 4H relative to the semiconductor substrate 92.

[0073] Next, the semiconductor chip 91 is brought into contact with the semiconductor substrate 92 (see Figure 9(a), S15). During this operation (S15), the contact detection function of the bonding head 4H may be used. Next, the bonding head 4H applies a first load F4S to the semiconductor chip 91 (see Figure 9(b), S16). As a result of this operation (S16), the semiconductor chip 91 is temporarily bonded to the semiconductor substrate 92.

[0074] Next, the additional load unit 8A applies a second load F8S, which is an additional load, to the semiconductor chip 91 (see Figure 10(a), S17). Then, after a predetermined time has elapsed, the application of the second load F8S is released, and then the application of the first load F4S is released.

[0075] Then, the semiconductor chip 91 is released from the bonding tool 401 (see Figure 10(b), S18). High-load bonding is performed by executing the above steps S11 to S18.

[0076] <Effects of the bonding apparatus 1A of the first embodiment> The bonding apparatus 1A includes a bonding head 4H that generates a first load F4S and an additional load motor 811 of an additional load unit 8A that generates a second load F8S. With this configuration, when performing bonding that requires a high load, the desired load is generated by the two units. As a result, compared to performing high-load bonding with only the bonding head 4H that moves the semiconductor chip 91, the increase in the weight of the bonding head 4H can be suppressed. Consequently, the movement speed of the bonding head 4H is not impaired, and high productivity can be maintained. Furthermore, high-load bonding can be performed by the additional load motor 811 of the additional load unit 8A.

[0077] The bonding apparatus 1A further includes a camera 711 mounted on an additional load guide rail 80L for imaging the semiconductor substrate 92. The camera 711 is movable along the additional load guide rail 80L while maintaining its position relative to the additional load motor 811 of the additional load unit 8A.

[0078] The optical axis A711 of the camera 711 of the bonding apparatus 1A described above is offset along the X-axis direction with respect to the load action line A811 of the additional load motor 811 of the additional load unit 8A. The camera 711 and the additional load motor 811 of the additional load unit 8A move along the X-axis direction while maintaining the state in which the optical axis A711 of the camera 711 is offset with respect to the load action line A811. This configuration allows for the simultaneous retraction of the camera 711 from the semiconductor substrate 92 and the simultaneous movement of the additional load motor 811 of the additional load unit 8A onto the semiconductor substrate 92.

[0079] The bonding method includes a holding step S11 in which a semiconductor chip 91 is picked up by a bonding head 4H having a bonding tool that detachably holds the semiconductor chip 91; a preparation step S14 in which, when viewed from the direction of the load line of action A811, the semiconductor chip 91, the semiconductor substrate 92, and the additional load motor 811 of the additional load unit 8A that applies a second load F8S along the load line of action A811 via the bonding tool are all in a state that overlaps with the load line of action A811; and pressing steps S16 and S17 in which the semiconductor chip 91 is pressed against the semiconductor substrate 92 by the first load F4S generated by the bonding head 4H and the second load F8S generated by the additional load motor 811 of the additional load unit 8A.

[0080] In the bonding method, the semiconductor chip 91 is moved by the bonding head 4H in the holding step S11. As a result, the semiconductor chip 91 can be moved without impairing the movement speed of the bonding head 4H, thus maintaining high productivity. Then, as a result of the preparation step S14, a state is created in which bonding can be performed using both the bonding head 4H and the additional load motor 811 of the additional load unit 8A. Therefore, high-load bonding can be performed.

[0081] The bonding method further includes an imaging step S13, prior to the preparation step S14, in which the semiconductor substrate 92 is imaged by a camera 711 for imaging the semiconductor substrate 92. This step makes it possible to obtain positional information for the semiconductor substrate 92, which can be used for positional control of the additional load motor 811 of the additional load unit 8A and the bonding head 4H.

[0082] The bonding method further includes a retraction step S13, which occurs after the imaging step S13 and before the preparation step S14, in which the camera 711 is moved to a position that does not overlap with the load line A811 when viewed from the direction of the load line A811. According to this step, a region for positioning the bonding head 4H can be formed between the additional load motor 811 of the additional load unit 8A and the semiconductor substrate 92.

[0083] In the bonding method described above, when it is imaging step S13, the additional load motor 811 of the additional load unit 8A does not overlap with the semiconductor substrate 92 when viewed from the direction of the load line of action A811. As a result of performing the retraction step S13, when viewed from the direction of the load line of action A811, the camera 711 does not overlap with the semiconductor substrate 92, and the additional load motor 811 of the additional load unit 8A overlaps with the semiconductor substrate 92. This step allows for the simultaneous removal of the camera 711 from the semiconductor substrate 92 and the simultaneous movement of the additional load motor 811 of the additional load unit 8A onto the semiconductor substrate 92.

[0084] <Modified form of the first embodiment> In the above embodiment, the additional load motor 811 and the camera 711 were mounted on a common motor support 819. This configuration allows the additional load motor 811 and the camera 711 to be moved by a single drive source. For example, as in the bonding apparatus 1Aa, a modified example in Figure 11, the camera 711 may be mounted on the additional load guide rail 80L via a separate camera support 719 from the motor support 819. In this case, the additional load motor 811 and the camera 711 can each be set to any position on the additional load guide rail 80L.

[0085] <Second Embodiment> Figure 12 is a perspective view showing the main components of the bonding apparatus 1B. Figure 13(a) is a plan view of the bonding apparatus 1B shown in Figure 12. Figure 13(b) is a side view of the bonding apparatus 1B shown in Figure 12. The bonding apparatus 1B includes a bonding head 4H and an additional load unit 8B. Although the bonding apparatus 1B also includes a controller unit 2 and a pickup unit 3, their illustration is omitted in Figure 12 and other figures.

[0086] The additional load unit 8B includes an additional load motor 821, a motor support 829, a camera 721, a camera beam 722, and a camera column 723. The additional load motor 821 consists of a motor body 821m and a motor shaft 821s, and its detailed configuration is the same as that of the additional load motor 811 in the first embodiment, so a detailed explanation is omitted. Similarly, the motor support 829 is the same as the motor support 819 in the first embodiment, so a detailed explanation is omitted.

[0087] The camera 721 can be switched between an imaging position (see Figure 12, etc.) and a retracted position (see Figure 16(a), etc.). When in the imaging position, the optical axis A721 of the camera 721 overlaps with the line of action A821 of the additional load motor 821. When in the imaging position, the camera 721 is located between the additional load motor 821 and the semiconductor substrate 92. When in the imaging position, the camera 721 may also be located between the bonding head guide rail 40L and the semiconductor substrate 92. Furthermore, when in the imaging position, the camera 721 may also be located between the bonding head guide rail 40L and the additional load motor 821.

[0088] The first end of the camera beam 722 is fixed to the top surface of the camera 721. The camera beam 722 extends in a direction perpendicular to the optical axis A721 of the camera 721. The lower end of the camera column 723 is attached to the second end of the camera beam 722. The upper end of the camera column 723 is attached to the motor support 829. The camera column 723 rotates the camera beam 722 around the Z axis. This movement allows switching between the imaging position and the retracted position as described above. When in the imaging position, the camera beam 722 is parallel to the Y axis. When in the retracted position, the camera beam 722 may be parallel to the X axis. Note that in the retracted position, it is sufficient to form a space 4K between the additional load motor 821 and the semiconductor substrate 92 in which the bonding head 4H can be placed; therefore, when in the retracted position, the camera beam 722 does not necessarily need to be parallel to the X axis.

[0089] In short, in the bonding apparatus 1B of the second embodiment, the camera 721 is located between the semiconductor substrate 92 and the additional load motor 821 of the additional load unit 8B, and can be switched between an imaging position that overlaps with the additional load motor 821 of the additional load unit 8B when viewed from the direction of the load action line A821, and a non-imaging position that does not overlap with the additional load motor 821 of the additional load unit 8B when viewed from the direction of the load action line A821. With this configuration, the additional load motor 821 of the additional load unit 8B is positioned on the semiconductor substrate 92, and the semiconductor substrate 92 can be imaged by the camera 721. Furthermore, after imaging, the bonding head 4H can be positioned between the additional load motor 821 of the additional load unit 8B and the semiconductor substrate 92 by retracting only the camera 721 without moving the additional load motor 821 of the additional load unit 8B.

[0090] <Method of manufacturing a semiconductor device performed by the bonding apparatus of the second embodiment> Next, a method for manufacturing a semiconductor device performed by the bonding apparatus 1B of the second embodiment will be described with reference to the flowchart in Figure 14 and Figures 15 to 18.

[0091] First, the pickup head module 6 picks up the semiconductor chip 91. Then, the pickup head module 6 moves the picked-up semiconductor chip 91 to the intermediate stage 96 (S1).

[0092] Next, bonding is performed (S20). First, the bonding head 4H picks up the semiconductor chip 91 (see Figure 15(a), S21). In this operation (S21), the contact detection unit 405 of the bonding head 4H may detect that the bonding tool 401 has come into contact with the semiconductor chip 91.

[0093] Next, the semiconductor substrate 92 is imaged using the camera 721 (see Figure 15(b), S22). The controller unit 2 controls the motor support 829 and the camera column 723 to move the camera 721 to a position where the semiconductor substrate 92 is within the camera's field of view. As a result of this movement, the camera 721 is positioned between the semiconductor substrate 92 and the additional load motor 821. For example, as a result of moving the camera 721, the optical axis A721 of the camera 721 may overlap with the load action line A821 of the additional load unit 8B. In this case, the load action line A821 of the additional load unit 8B may overlap with the semiconductor substrate 92. In this state, the camera 721 captures an image including the semiconductor substrate 92. The captured image data is sent to the controller unit 2. Note that the bonding head 4H cannot be placed between the additional load motor 821 and the semiconductor substrate 92.

[0094] Next, the camera 721 is retracted (see Figure 16(a), S23). Specifically, the controller unit 2 rotates the camera column 723 90 degrees clockwise or counterclockwise around the Z-axis. As a result of this operation, the camera 721, which was overlapping the semiconductor substrate 92 when viewed from the Z-axis direction, moves to a position where it does not overlap the semiconductor substrate 92. In the second embodiment, the "retraction" of the camera 721 is defined as revolving the camera beam 722 and the camera 721 around the central axis A723 of the camera column 723. Therefore, this operation (S23) corresponds to the retraction step. Furthermore, as a result of this operation (S23), the additional load motor 821, which was overlapping the semiconductor substrate 92 when viewed from the Z-axis direction but was not directly facing the semiconductor substrate 92, now faces the semiconductor substrate 92 directly. In other words, a space 4K for positioning the bonding head 4H is formed between the additional load motor 821 and the semiconductor substrate 92.

[0095] Next, the bonding head 4H is moved onto the semiconductor substrate 92 (see Figure 16(b), S24). In this operation (S24), the controller unit 2 uses the image data acquired in operation (S22) to perform positioning control of the bonding head 4H relative to the semiconductor substrate 92.

[0096] Next, the semiconductor chip 91 is brought into contact with the semiconductor substrate 92 (see Figure 17(a), S25). During this operation (S25), the contact detection function of the bonding apparatus 1B may be used. Next, the bonding head 4H applies a first load F4S to the semiconductor chip 91 (see Figure 17(b), S26). As a result of this operation (S26), the semiconductor chip 91 is temporarily bonded to the semiconductor substrate 92.

[0097] Next, the additional load unit 8B applies a second load F8S, which is an additional load, to the semiconductor chip 91 (see Figure 18(a), S27). Then, after a predetermined time has elapsed, the application of the second load F8S is released. Finally, the application of the first load F4S is released.

[0098] Then, the semiconductor chip 91 is released from the bonding tool 401 (see Figure 18(b), S28). High-load bonding is performed by executing the above steps S21 to S28.

[0099] In short, in the manufacturing method of the semiconductor device 93 performed by the bonding apparatus 1B of the second embodiment, when it is the imaging step S22, the additional load motor 821 of the additional load unit 8B overlaps with the semiconductor substrate 92 when viewed from the direction of the load line of action A821, and as a result of performing the retraction step S23, the camera 721 does not overlap with the semiconductor substrate 92 when viewed from the direction of the load line of action A821, and the additional load motor 821 of the additional load unit 8B maintains the state of overlapping with the semiconductor substrate 92. According to this step, with the additional load motor 821 of the additional load unit 8B positioned on the semiconductor substrate 92, it is possible to image the semiconductor substrate 92 with the camera 721. Furthermore, after imaging, by retracting only the camera 721 without moving the additional load motor 821 of the additional load unit 8B, the bonding head 4H can be positioned between the additional load motor 821 of the additional load unit 8B and the semiconductor substrate 92.

[0100] <Third Embodiment> Figure 19 is a perspective view showing the main components of the bonding apparatus 1C. Figure 20(a) is a plan view of the bonding apparatus 1C shown in Figure 19. Figure 20(b) is a side view of the bonding apparatus 1C shown in Figure 19. The bonding apparatus 1C includes a bonding head 4H and an additional load unit 8C. Although the bonding apparatus 1C also includes a controller unit 2 and a pickup unit 3, their illustration is omitted in Figure 19 and other figures.

[0101] The additional load unit 8C includes an additional load motor 831, a motor support 839, and a camera 731. The additional load motor 831 has a cylindrical motor fixed-side case 831a and a cylindrical motor movable-side case 831b. The motor fixed-side case 831a is the outer shell of the additional load motor 831 and is attached to the motor support 839. A motor stator 831r is provided on the inner circumferential surface of the motor fixed-side case 831a. The motor stator 831r is either a coil or a magnet.

[0102] The motor movable side case 831b is a component corresponding to the motor shaft 811s in the first embodiment. The upper end of the motor movable side case 831b is housed in the motor fixed side case 831a. The lower end of the motor movable side case 831b protrudes from the motor fixed side case 831a. A motor movable element 831m is provided on the outer circumferential surface of the motor movable side case 831b. If the motor stator 831r is a coil, then the motor movable element 831m is a magnet. If the motor stator 831r is a magnet, then the motor movable element 831m is a coil. The motor movable side case 831b has a pressing surface 831s provided with a case opening 831p. This pressing surface 831s is pressed against the head plate 403 of the bonding head 4H.

[0103] A camera 731 is housed in a through-hole in the motor-movable case 831b. The lower surface of the camera 731 is located inside the motor-movable case 831b. The optical axis A731 of the camera 731 overlaps with the case opening 831p. The optical axis A731 of the camera 731 also overlaps with the load action line A831 of the additional load motor 831. The camera 731 can move up and down relative to the motor-movable case 831b along the load action line A831 (Z-axis direction). The camera 731 images the semiconductor substrate 92 through the case opening 831p.

[0104] In short, in the bonding apparatus 1C of the third embodiment, the camera 731 is incorporated into the bonding head 4H such that the optical axis A731 of the camera 731 overlaps with the load line A831 when viewed from the direction of the load line A831. With this configuration, the additional load motor 831 of the additional load unit 8C can be placed on the semiconductor substrate 92, and the semiconductor substrate 92 can be imaged by the camera 731. Furthermore, after imaging, the bonding head 4H can be placed between the additional load motor 831 of the additional load unit 8C and the semiconductor substrate 92 without moving the additional load motor 831 of the additional load unit 8C or the camera 731.

[0105] <Method of manufacturing a semiconductor device performed by the bonding apparatus of the third embodiment> Next, a method for manufacturing a semiconductor device performed by the bonding apparatus 1C of the third embodiment will be described with reference to the flowchart in Figure 21 and Figures 22 to 25.

[0106] First, the pickup head module 6 picks up the semiconductor chip 91. Then, the pickup head module 6 moves the picked-up semiconductor chip 91 to the intermediate stage 96 (S1).

[0107] Next, bonding is performed (S30). First, the bonding head 4H picks up the semiconductor chip 91 (see Figure 22(a), S31). In this operation (S31), the contact detection unit 405 of the bonding head 4H may detect that the bonding tool 401 has come into contact with the semiconductor chip 91.

[0108] Next, the semiconductor substrate 92 is imaged using the camera 731 (see Figure 22(b), S32). The controller unit 2 controls the motor support 839 to move the camera 731 to a position where the semiconductor substrate 92 is within the camera's field of view. The optical axis A731 of the camera 731 overlaps with the load action line A831 of the additional load unit 8C. In other words, the load action line A831 of the additional load unit 8C overlaps with the semiconductor substrate 92. In this state, the camera 731 captures an image including the semiconductor substrate 92. The captured image data is sent to the controller unit 2. Even in the operation state (S32), a space 4K is secured between the additional load motor 831 and the semiconductor substrate 92, so it is possible to place the bonding head 4H.

[0109] Furthermore, in the third embodiment, the camera 731 is built into the additional load motor 831. Therefore, the operation to retract the camera 731 (S13, S23) that was performed in the first and second embodiments is unnecessary.

[0110] Next, move the bonding head 4H (see Figure 23, S33).

[0111] Next, the semiconductor chip 91 is brought into contact with the semiconductor substrate 92 (see Figure 24(a), S34). During this operation (S34), the contact detection function of the bonding apparatus 1C may be used. Next, the bonding head 4H applies a first load F4S to the semiconductor chip 91 (see Figure 24(b), S35). As a result of this operation (S35), the semiconductor chip 91 is temporarily bonded to the semiconductor substrate 92.

[0112] Next, the additional load unit 8C applies a second load F8S, which is an additional load, to the semiconductor chip 91 (see Figure 25(a), S36). In the third embodiment, the pressing surface 831s of the motor movable side case 831b presses against the pressing receiving plate 404 of the bonding head 4H. In other words, the motor movable side case 831b in the third embodiment has the same function as the motor shaft 811s in the first embodiment. Next, after a predetermined time has elapsed, the application of the second load F8S is released. Then, the application of the first load F4S is released.

[0113] Then, the semiconductor chip 91 is released from the bonding tool 401 (see Figure 25(b), S37). High-load bonding is performed by executing the above steps S31 to S37.

[0114] In short, in the manufacturing method of the semiconductor device 93 performed by the bonding apparatus 1C of the third embodiment, when it is the imaging step S32, the additional load motor 831 and camera 731 of the additional load unit 8C overlap the semiconductor substrate 92 when viewed from the direction of the load line of action A831, and when it is the pressing steps S35 and S36, the additional load motor 831 and camera 731 of the additional load unit 8C overlap the semiconductor substrate 92 when viewed from the direction of the load line of action A831. According to this step, with the additional load motor 831 of the additional load unit 8C positioned on the semiconductor substrate 92, it is possible to image the semiconductor substrate 92 with the camera 731. Furthermore, after imaging, the bonding head 4H can be positioned between the additional load motor 831 of the additional load unit 8C and the semiconductor substrate 92 without moving the additional load motor 831 of the additional load unit 8C or the camera 731.

[0115] <Fourth Embodiment> Figure 26 is a perspective view showing the main components of the bonding apparatus 1D. Figure 27(a) is a plan view of the bonding apparatus 1D shown in Figure 26. Figure 27(b) is a side view of the bonding apparatus 1D shown in Figure 26. The bonding apparatus 1D includes a bonding head 4H and an additional load unit 8D. Although the bonding apparatus 1D also includes a controller unit 2 and a pickup unit 3, their illustration is omitted in Figure 26 and other figures.

[0116] The additional load unit 8D includes an additional load motor 841, an optical functional component 842 (optical part), a motor support 849, and a camera 741. The additional load motor 841 consists of a motor body 841m and a motor shaft 841s, and its detailed configuration is the same as that of the additional load motor 811 in the first embodiment, so a detailed explanation is omitted. Also, the motor support 849 is the same as the motor support 819 in the first embodiment, so a detailed explanation is omitted.

[0117] The optical functional component 842 guides light coming from the semiconductor substrate 92 to the camera 741. The optical functional component 842 is fixed to the lower end of the motor shaft 841s. Therefore, the optical functional component 842 can move along with the movement of the motor shaft 841s. In other words, the load generated by the additional load motor 841 is transmitted to the bonding head 4H via the optical functional component 842.

[0118] The optical functional component 842 comprises a housing 842h and a mirror 842m. The shape of the housing 842h is a rectangular parallelepiped or a cube. The shape of the housing 842h may also be cylindrical. The inside of the housing 842h is hollow, and the mirror 842m is housed in this hollow. The mirror 842m intersects with the load action line A841 of the additional load motor 841. Furthermore, the mirror 842m is inclined, for example, 45 degrees with respect to the load action line A841.

[0119] The reflective surfaces of the mirror 842m face the bottom and side surfaces of the housing 842h, with a bottom opening 842a and a side opening 842b provided on each of these surfaces. The bottom surface faces the semiconductor substrate 92. The side surface faces the camera 741. With this configuration, light from the bottom opening 842a is reflected by the mirror 842m and supplied to the camera 741 through the side opening 842b.

[0120] The lower surface 842s of the housing 842h is pressed against the head plate 403 of the bonding head 4H. Thus, the lower surface of the housing 842h has the function of receiving light and directing it to the mirror 842m, and the function of transmitting the load generated by the additional load motor 841 to the bonding head 4H.

[0121] The camera 741 is mounted to the motor support 849 via the camera frame 742. The optical axis A741 of the camera 741 is oriented in the X-axis direction. In other words, the optical axis A741 of the camera 741 does not directly overlap with the semiconductor substrate 92. To put it another way, the camera 741 is not located on the imaginary line connecting the additional load motor 841 and the semiconductor substrate 92. Therefore, a space 4K is formed between the additional load motor 841 and the semiconductor substrate 92 in which the bonding head 4H can be placed.

[0122] The camera frame 742 is L-shaped when viewed from the X-axis direction. The camera 741 is fixed to the first end of the camera frame 742. The second end of the camera frame 742 is fixed to the motor support 849. Therefore, when the motor support 849 moves, the camera 741 moves together with the additional load motor 841.

[0123] In short, the camera 741 of the bonding apparatus 1D in the fourth embodiment is fixed in a position that does not overlap with the additional load motor 841 of the additional load unit 8D when viewed from the direction of the load action line A841. The additional load motor 841 of the additional load unit 8D is fixed to the additional load motor 841 of the additional load unit 8D so as to overlap with the load action line A841 when viewed from the direction of the load action line A841, and has an optical functional component 842 that guides light from the semiconductor substrate 92 located in a position overlapping with the load action line A841 toward the camera 741. With this configuration, it is possible to image the semiconductor substrate 92 with the camera 741 while the additional load motor 841 of the additional load unit 8D is positioned on the semiconductor substrate 92. Furthermore, after imaging, the bonding head 4H can be positioned between the additional load motor 841 of the additional load unit 8D and the semiconductor substrate 92 without moving the additional load motor 841 of the additional load unit 8D or the camera 741.

[0124] <Method of manufacturing a semiconductor device performed by the bonding apparatus of the fourth embodiment> Next, a method for manufacturing a semiconductor device performed by the bonding apparatus 1D of the fourth embodiment will be described with reference to the flowchart in Figure 28 and Figures 29 to 32.

[0125] First, the pickup head module 6 picks up the semiconductor chip 91. Then, the pickup head module 6 moves the picked-up semiconductor chip 91 to the intermediate stage 96 (S1).

[0126] Next, bonding is performed (S40). First, the bonding head 4H picks up the semiconductor chip 91 (see Figure 29(a), S41). In this operation (S41), the contact detection unit 405 of the bonding head 4H may detect that the bonding tool 401 has come into contact with the semiconductor chip 91.

[0127] Next, the semiconductor substrate 92 is imaged using the camera 741 (see Figure 29(b), S42). The controller unit 2 controls the motor support 849 to move the camera 741 to a position where the semiconductor substrate 92 is within the camera's field of view. In this state, the camera 741 captures an image including the semiconductor substrate 92 via the optical functional component 842. The captured image data is sent to the controller unit 2. Even in the operation state (S42), a space of 4K is maintained between the additional load motor 841 and the semiconductor substrate 92.

[0128] Furthermore, in the fourth embodiment, the camera 741 is positioned away from the space between the additional load motor 841 and the semiconductor substrate 92, with the load action line A841 overlapping the semiconductor substrate 92. In other words, a space 4K is formed between the additional load motor 841 and the semiconductor substrate 92, in which the bonding head 4H can be placed. Therefore, as with the third embodiment, the operation to retract the camera 741 (S13, S23) performed in the first and second embodiments is unnecessary in the fourth embodiment as well.

[0129] Next, move the bonding head 4H (see Figure 30, S44).

[0130] Next, the semiconductor chip 91 is brought into contact with the semiconductor substrate 92 (see Figure 31(a), S45). During this operation (S45), the contact detection function of the bonding apparatus 1D may be used. Next, the bonding head 4H applies a first load F4S to the semiconductor chip 91 (see Figure 31(b), S46). As a result of this operation (S45), the semiconductor chip 91 is temporarily bonded to the semiconductor substrate 92.

[0131] Next, the additional load unit 8D applies a second load F8S, which is an additional load, to the semiconductor chip 91 (see Figure 32(a), S47). In the fourth embodiment, the housing 842h of the optical functional component 842 presses against the pressing plate 404 of the bonding head 4H. In other words, the optical functional component 842 (more specifically, the housing 842h) in the fourth embodiment has the same function as the motor shaft 811s in the first embodiment. Next, after a predetermined time has elapsed, the application of the second load F8S is released. Then, the application of the first load F4S is released.

[0132] Then, the semiconductor chip 91 is released from the bonding tool 401 (see Figure 32(b), S48). High-load bonding is performed by executing the above steps S41 to S48.

[0133] In short, the method for manufacturing a semiconductor device 93 performed by the bonding apparatus 1D of the fourth embodiment is as follows: When it is the imaging step S42, when viewed from the direction of the load line of action A841, the additional load motor 841 of the additional load unit 8D overlaps with the second object, and the camera 741 does not overlap with the semiconductor substrate 92; when viewed from the direction of the load line of action A842, imaging is performed via an optical functional component 842 that is fixed to the additional load motor 841 of the additional load unit 8D so as to overlap with the load line of action A842, and guides light from the semiconductor substrate 92, which is located in a position overlapping with the load line of action A842, toward the camera 741; and when it is the pressing steps S45 and S46, when viewed from the direction of the load line of action A842, the additional load motor 841 of the additional load unit 8D overlaps with the semiconductor substrate 92, and the camera 741 does not overlap with the semiconductor substrate 92. This step also makes it possible to image the semiconductor substrate 92 with the camera 741 while the additional load motor 841 of the additional load unit 8D is positioned on the semiconductor substrate 92. Furthermore, after imaging, the bonding head 4H can be positioned between the additional load motor 841 of the additional load unit 8D and the semiconductor substrate 92 without moving the additional load motor 841 of the additional load unit 8D or the camera 741.

[0134] <Variation> The present invention may be implemented in various forms, including the embodiments described above, with various modifications and improvements based on the knowledge of those skilled in the art. Furthermore, modified versions may be constructed by utilizing the technical matters described in the embodiments described above. [Explanation of symbols]

[0135] 1A, 1Aa, 1B, 1C, 1D... Bonding device, 4H... Bonding head, 8A, 8B, 8C, 8D... Additional load unit, 711, 721, 731, 741... Camera, A711, A721, A731, A741... Optical axis, A811, A821, A831, A841... Load action line.

Claims

1. A bonding head that holds a first object and presses the held first object against a second object with a first load along the line of action of the load, The system includes an additional load unit that overlaps the bonding head when viewed from the direction of the load action line and applies a second load along the load action line via the bonding head, A bonding apparatus in which the bonding head moves along a first guide rail and the additional load unit moves along a second guide rail.

2. The bonding apparatus according to claim 1, further comprising a camera provided on the second guide rail for imaging the second object.

3. The bonding apparatus according to claim 2, wherein the camera is movable along the second guide rail while maintaining its position relative to the additional load unit.

4. The aforementioned camera, Between the second object and the additional load unit, an imaging position that overlaps with the additional load unit when viewed from the direction of the load action line, The bonding apparatus according to claim 3, wherein it is possible to switch between a non-imaging position that does not overlap with the additional load unit when viewed from the direction of the load action line.

5. The bonding apparatus according to claim 3, wherein the camera is incorporated into the bonding head such that, when viewed from the direction of the load action line, the optical axis of the camera overlaps with the load action line.

6. The camera is fixed in a position that does not overlap with the additional load unit when viewed from the direction of the load action line. The bonding apparatus according to claim 3, wherein the additional load unit is fixed to the additional load unit so as to overlap with the line of action of the load when viewed from the direction of the line of action of the load, and has an optical unit that guides light from the second object located at a position overlapping with the line of action of the load toward the camera.

7. A holding step of picking up the first object with a bonding head that detachably holds the first object, A preparation step in which, when viewed from the direction of the line of action of the load, the first object, the second object, and the additional load unit that applies a second load along the line of action of the load via the bonding head, each overlap the line of action of the load, A bonding method comprising: a pressing step of pressing the first object against the second object by a first load generated by the bonding head and the second load generated by the additional load unit.

8. The bonding method according to claim 7, further comprising an imaging step of imaging the second object with a camera for imaging the second object before the preparation step.

9. The bonding method according to claim 8, further comprising a retraction step, after the imaging step and before the preparation step, of moving the camera to a position that does not overlap with the line of action of the load when viewed from the direction of the line of action of the load.

10. During the imaging step, the additional load unit does not overlap with the second object when viewed from the direction of the load action line. The bonding method according to claim 9, wherein, as a result of performing the retraction step, the camera does not overlap with the second object when viewed from the direction of the load action line, and the additional load unit overlaps with the second object.

11. During the imaging step, the additional load unit overlaps the second object when viewed from the direction of the load action line. The bonding method according to claim 9, wherein, as a result of performing the retraction step, the camera does not overlap with the second object when viewed from the direction of the load action line, and the additional load unit maintains a state of overlapping with the second object.

12. During the imaging step, when viewed from the direction of the load action line, the additional load unit and the camera overlap the second object. The bonding method according to claim 8, wherein, during the pressing step, the additional load unit and the camera maintain a state of overlapping with the second object when viewed from the direction of the line of action of the load.

13. During the imaging step, the additional load unit overlaps the second object when viewed from the direction of the load line of action, and the camera does not overlap the second object. The camera is fixed to the additional load unit so as to overlap the load line of action when viewed from the direction of the load line of action, and imaging is performed via an optical unit that guides light from the second object, which is located in a position overlapping the load line of action, toward the camera. The bonding method according to claim 8, wherein, in the pressing step, the additional load unit overlaps the second object and the camera does not overlap the second object when viewed from the direction of the line of action of the load.

Images