Manufacturing method of the structure

Abstract

This disclosure relates to a method for manufacturing a structure (1) having a metal-containing layer (11) bonded to a first carbon allotrope layer (12). [Solution] This method includes the steps of: providing a substrate (13); coating the substrate (13) with a polymer to obtain a polymer layer (14); depositing a metal-containing material on the polymer layer (14) to obtain a metal-containing layer (11); bonding a first carbon allotrope layer (12) to the metal-containing layer (11); and dissolving the polymer layer (14) using a solvent (2) to remove the substrate (13) from the metal-containing layer (11).

Description

Technical Field

[0001] The present disclosure relates to a structure having a carbon allomorph layer, and more specifically, to a method for manufacturing a structure having a metal-containing layer bonded to a first carbon allomorph layer.

Background Art

[0002] Optical filters are essential elements in photonics technology and imaging technology, and are designed to selectively transmit or block light of a specific wavelength. These filters play a very important role in applications such as spectroscopy, telecommunications, biomedical imaging, and photography. By manipulating the spectral composition of light, optical filters enhance the accuracy of the system, optimize the ratio of signal to noise, and enable the separation of desired optical properties.

[0003] Optical filters are usually classified into types such as bandpass filters, long-pass filters, short-pass filters, and neutral density filters, and are each adjusted for specific wavelength control. Their performance is determined by the materials and coating techniques used, ranging from dielectric multilayers to metal films, including the spectral region, durability, and heat resistance.

[0004] In an imaging system, an optical filter improves accuracy and contrast by removing unwanted wavelengths, thereby reducing chromatic aberration or glare. For example, narrowband filters in fluorescence microscopes ensure the accurate excitation and detection of specific fluorescent dye molecules, enabling high-resolution imaging of biological samples. In telecommunications, optical filters ensure efficient wavelength multiplexing and demultiplexing, supporting high-bandwidth data transmission.

Summary of the Invention

Problems to be Solved by the Invention

[0005] A metal layer combined with a carbon nanotube (CNT) film as a support can be used as an optical filter. The problem in obtaining such a filter is that the surface roughness inherent to the CNT film is too high, and when the filter is obtained by directly depositing the metal layer on the CNT film, the optical performance of the filter deteriorates and scattering of radiation passing through the filter occurs.

[0006] One solution to overcome this problem is to flatten the surface of the CNT film before depositing metal onto it, thereby reducing the surface roughness of the CNT film. However, the problem with planarizing CNT films is that in mass production of filters, each CNT film must be planarized individually, which is time-consuming and costly.

[0007] Brief explanation of disclosure The object of this disclosure is to provide a method for manufacturing a structure having a metal-containing layer bonded to a first carbon allotrope layer. [Means for solving the problem]

[0008] The object of this disclosure is achieved by a method as described in the independent claim. Preferred embodiments of this disclosure are disclosed in the dependent claims.

[0009] This disclosure is based on the idea of ​​providing a method for producing a structure having a metal-containing layer bonded to a first carbon allotrope layer, and the method is as follows: • A process of providing a substrate having a flat surface (plane), • A process of coating (or covering) the flat surface of a substrate with a polymer to obtain a polymer layer bonded to the flat surface of the substrate. • A process of depositing a metal-containing material onto a polymer layer to obtain a metal-containing layer bonded to the polymer layer. • A step of providing a first carbon allotrope layer, • A step of bonding the first carbon allotrope layer to the metal-containing layer. The process involves bonding the first carbon allotrope layer to the metal-containing layer, then dissolving the polymer layer using a solvent to release the substrate from the metal-containing layer, thereby obtaining a structure having a metal-containing layer bonded to the first carbon allotrope layer. Includes. [Effects of the Invention]

[0010] An advantage of this disclosure is that this method makes it possible to provide a smooth metal-containing layer on a carbon allotrope layer despite the inherent surface roughness of the carbon allotrope layer.

[0011] Another advantage of this disclosure is that the surface smoothness of the metal-containing layer can be controlled by controlling the smoothness of the substrate. In other words, the optical performance of the structure can be controlled by this method.

[0012] Another advantage of this disclosure is that the base material can be reused in the mass production of the structure, thereby reducing production costs.

[0013] Another advantage of this disclosure is that the resulting structure has lower porosity than structures obtained by directly depositing a metal-containing layer onto a carbon allotrope layer.

[0014] Another advantage of this disclosure is that, in this method, the production of the carbon allotrope material and the metal-containing layer are separated, and each process can be optimized individually. [Brief explanation of the drawing]

[0015] This disclosure will be described in detail with reference to the attached drawings. [Figure 1] Schematic cross-sectional views of the structures during each step (1-1 to 1-7) of the method according to several embodiments are shown. [Figure 2] Schematic cross-sectional views of the structure during each step (2-1 to 2-7) of the method according to several embodiments are shown. [Figure 3a] Schematic cross-sectional views of the structures during each step (3-1 to 3-9) of the method according to several embodiments are shown. [Figure 3b] Schematic cross-sectional views of the structure in each step (3-1 to 3-9) of the method according to some embodiments are shown. **DETAILED DESCRIPTION OF THE INVENTION**

[0016] The present disclosure relates to a method for manufacturing a structure 1 having a metal-containing layer 11 bonded to a first carbon allotrope layer 12. For example, the structure 1 can be used as an optical filter for blocking other wavelengths of electromagnetic radiation such as visible light.

[0017] Providing a substrate The method includes providing a substrate 13 having a flat surface 131, as shown in FIG. 1, step 1-1, FIG. 2, step 2-1, and FIG. 3, step 3-1. In other words, at least one surface of the substrate 13 has a flat shape. For example, the substrate 13 is silicon such as a silicon wafer, quartz, glass, sapphire, a polymer (such as polyethylene terephthalate (PET), poly(methyl methacrylate) (PMMA), polycarbonate (PC) or polyimide (PI), etc.), silicon dioxide (SiO2), a metal (such as gold, silver, aluminum or copper, etc.), or a substrate coated with a dielectric (such as by TiO2, Al2O2, ZnO or HfO2, etc.), mica or polymethylsiloxane (PDMS).

[0018] The flat surface 131 has a small surface roughness. According to some embodiments, the flat surface 131 of the substrate 13 has a surface roughness of at most 20 nm, preferably at most 5 nm, for example 0.01 to 1 nm, and the surface roughness is determined as the arithmetic mean value of the filtered roughness profile determined from the deviation of the center line within the evaluation length.

[0019] Coating the substrate with a polymer As shown in FIG. 1, step 1-2, FIG. 2, step 2-2, and FIG. 3, step 3-2, this method includes the step of coating the flat surface 131 of the substrate 13 with a polymer to obtain a polymer layer 14 bonded to the flat surface 131 of the substrate 13. Preferably, the polymer layer 14 has a uniform thickness. Since the surface roughness of the flat surface 131 of the substrate 13 is small, the surface roughness of the polymer layer 14 is also small. This is because the surface structure of the flat surface 131 is replicated by the polymer layer 14. The polymer layer 14 is intended to function as a smooth and removable base for forming the metal-containing layer 11.

[0020] Preferably, the polymer is an easily soluble polymer. The polymer is preferably suitable for dip coating or spin coating or vapor deposition methods. According to some embodiments, the polymer is selected from the group consisting of polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), cycloolefin polymer (COP), cycloolefin copolymer (COC), polydimethylsiloxane (PDMS), polycarbonate (PC), polyethylene terephthalate (PET), polystyrene (PS), fluoropolymer, polyether ether ketone (PEEK), polyimide (PI), polyethylene glycol (PEG), polyvinylidene fluoride (PVDF), poly(3-hexylthiophene) (P3HT), poly(ethylene oxide) (PEO), polylactic acid (PLA), poly(4-vinylphenol) (PVP), and SU-8.

[0021] According to some embodiments, the flat surface 131 of the substrate 13 is coated with a polymer using dip coating or spin coating. This is to make the thickness of the polymer layer 14 uniform. In dip coating, the substrate 13 is immersed in the liquid polymer and cured. In spin coating, the liquid polymer is applied onto the flat surface 131 of the substrate 13, and the substrate 13 is rotated around an axis perpendicular to the flat surface 131 to spread the polymer uniformly over the flat surface 131 and cure it.

[0022] Preferably, the polymer is amorphous (or non-crystalline). In other words, the polymer has a low degree of crystallinity. Due to its low degree of crystallinity, the polymer dissolves more easily in the solvent than polymers with a high degree of crystallinity.

[0023] Preferably, the thickness of the polymer layer 14 is 0.1 to 5 μm, for example, 0.5 to 2 μm.

[0024] Deposition of metal-containing materials This method includes the step of depositing a metal-containing material onto a polymer layer 14 to obtain a metal-containing layer 11 bonded to the polymer layer 14, as shown in Figure 1, step 1-3, Figure 2, step 2-3, and Figure 3, step 3-3. In other words, the metal-containing layer 11 is deposited on the side of the polymer layer 14 opposite to the side bonded to the substrate 13. The metal-containing layer 11 is intended to function as a functional layer of the structure. For example, the metal-containing layer 11 functions as a filter element in the optical filter described above.

[0025] By depositing a metal-containing material on top of the polymer layer 14, a structure is obtained in which the metal-containing layer 11, the polymer layer 14, and the substrate 13 are stacked in that order.

[0026] According to some embodiments, the metal-containing material is a metal selected from the group consisting of molybdenum (Mo), niobium (Nb), zirconium (Zr), aluminum (Al), silver (Ag), gold (Au), copper (Cu), titanium (Ti), nickel (Ni), and chromium (Cr), or the metal-containing material is molybdenum silicide, niobium silicide, zirconium silicide, aluminum silicide, silver silicide, gold silicide, copper silicide, titanium silicide, nickel silicide, cobalt silicide, platinum silicide, tungsten silicide The silicide is selected from the group consisting of silicides and chromium silicides, or the metal-containing material is selected from the group consisting of indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), titanium dioxide (TiO2), zinc oxide (ZnO), titanium nitride (TiN), tantalum nitride (TaN), magnesium fluoride (MgF2), calcium fluoride (CaF2), lithium fluoride (LiF), zinc sulfide (ZnS), zinc selenide (ZnSe), cadmium sulfide (CdS), and lead sulfide (PbS).

[0027] According to some embodiments, the metal-containing material is deposited by physical vapor deposition (PVD) methods such as electron beam physical vapor deposition (EBPVD) or thermal vapor deposition, atomic layer deposition (ALD), electrodeposition, or dip coating or spin coating.

[0028] The thickness of the metal-containing layer 11 is determined according to the desired properties of the metal-containing layer 11. Preferably, the thickness of the metal-containing layer 11 is 10 to 50 nm.

[0029] Provision of the first carbon allotrope layer This method includes the step of providing a first carbon allotrope layer 12. The first carbon allotrope layer 12 is a film containing at least one allotrope of carbon. The purpose of the first carbon allotrope layer 12 is to provide mechanical stability to the structure 1.

[0030] Preferably, the first carbon allotrope layer 12 is a layer containing a carbon allotrope selected from carbon nanotubes and graphene.

[0031] Carbon nanotubes (CNTs) are tubes made of carbon with diameters in the nanometer range. In the context of this disclosure, the term "carbon nanotube" includes both single-walled carbon nanotubes (SWCNTs) and multi-walled carbon nanotubes (MWCNTs). Graphene is a carbon allotrope consisting of a single layer of atoms arranged in a honeycomb-like, flat nanostructure.

[0032] Preferably, the first carbon allotrope layer 12 contains at least 50% by weight, preferably at least 75% by weight, more preferably at least 90% by weight, and most preferably at least 99% by weight of carbon allotropes. For example, the first carbon allotrope layer 12 consists of carbon allotropes.

[0033] International Publication No. 2023 / 209271 discloses a method for producing a carbon allotrope film that can be used as the first carbon allotrope layer 12.

[0034] According to some embodiments, the first carbon allotrope layer 12 is coupled to a frame 15 for supporting the first carbon allotrope layer 12, as shown in Figure 2. In other words, the first carbon allotrope layer 12 is coupled to and supplied to the frame 15. The purpose of the frame 15 is to support the first carbon allotrope layer 12. For example, the frame 15 is an annular metal frame 15.

[0035] According to some embodiments, the step of supplying the first carbon allotrope layer 12 includes the step of bonding the first carbon allotrope layer 12 to the frame 15.

[0036] Bonding of the first carbon allotrope layer This method includes a step of bonding the first carbon allotrope layer 12 to the metal-containing layer 11, as shown in Figure 1, step 1-4, Figure 2, step 2-4, and Figure 3, step 3-4. For example, the first carbon allotrope layer 12 is bonded to the metal-containing layer 11 by bringing it into contact with the metal-containing layer 11. Preferably, the first carbon allotrope layer 12 is brought into contact with the metal-containing layer 11 in an environment containing a liquid medium, such as isopropyl alcohol (IPA) or acetone. The liquid medium is intended to promote the bonding of the first carbon allotrope layer 12 to the metal-containing layer 11.

[0037] Preferably, when the first carbon allotrope layer 12 is bonded to the frame 15, the side of the first carbon allotrope layer 12 opposite to the side bonded to the frame 15 is bonded to the metal-containing layer 11. As a result, the metal-containing layer 11 and the frame 15 are connected to the opposing side of the first carbon allotrope layer 12.

[0038] When the first carbon allotrope layer 12 is bonded to the metal-containing layer 11, a structure (laminated structure) is obtained in which the frame 15, the first carbon allotrope layer 12, the metal-containing layer 11, the polymer layer 14, and the substrate 13 are stacked in this order, as needed.

[0039] Pre-processing before joining According to some embodiments, the method involves pre-treating the metal-containing layer 11 before bonding the first carbon allotrope layer 12 to the metal-containing layer 11 to improve adhesion of the first carbon allotrope layer 12 to the metal-containing layer 11. The purpose of the pre-treatment is to control the surface termination and hydrophobicity of the metal-containing layer 11.

[0040] For example, pretreatment may involve chemical treatments such as plasma treatment, heat treatment, acid treatment, or thiol treatment.

[0041] Dissolution of the polymer layer As shown in Figure 1, steps 1-5 and 1-6; Figure 2, steps 2-5 and 2-6; and Figure 3, steps 3-5 and 3-6, this method includes the step of dissolving the polymer layer 14 using solvent 2 after bonding the first carbon allotrope layer 12 to the metal-containing layer 11. As a result, as shown in Figure 1, step 1-7; and Figure 2, step 2-7, the substrate 13 is removed (or released) from the metal-containing layer 11, and a structure 1 having the metal-containing layer 11 bonded to the first carbon allotrope layer 12 is obtained.

[0042] Solvent 2 contains solvent components capable of dissolving the polymer. In other words, solvent 2 is determined by the polymer used. Solvent 2 may consist of a single solvent component or a mixture of multiple solvent components. For example, the solvent components are selected from the group consisting of water, acetone, chloroform, toluene, dichloromethane (DCM), ethyl acetate, cyclohexane, xylene, phenol, dichlorobenzene, trifluoroacetic acid, dimethylacetamide (DMAc), n-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), hexane, tetrahydrofuran, water, ethanol, methanol, propylene glycol methyl ether acetate (PGMEA), and perfluorotributylamine.

[0043] According to some embodiments, the dissolution of the polymer layer 14 includes a step of heating the solvent 2 to increase the dissolution of the polymer. For example, the solvent 2 is heated to a temperature of 40°C to 80°C.

[0044] For example, the dissolution of the polymer layer 14 is performed by placing the laminated structure, which includes the frame 15, the first carbon allotrope layer 12, the metal-containing layer 11, the polymer layer 14, and the substrate 13, as used as necessary, in a container 3 containing the solvent 2, so that at least a portion of the laminated structure is immersed in the solvent 2, and dissolving the polymer layer 14 in the solvent 2, as shown in Figure 2, steps 2-5 and 2-6.

[0045] Enclosure (or encapsulation) of a metal-containing layer According to some embodiments, the method includes the step of supplying a laminate 16 having a second carbon allotrope layer 161 bonded to a metal mesh 162, as shown in Figure 3, step 3-7.

[0046] The second carbon allotrope layer 161 is a layer containing at least one carbon allotrope. The purpose of the second carbon allotrope layer 161 is to enclose the metal-containing layer 11 between the first carbon allotrope layer 12 and the second carbon allotrope layer 161.

[0047] Preferably, the second carbon allotrope layer 161 is a layer containing a carbon allotrope selected from carbon nanotubes and graphene.

[0048] Preferably, the second carbon allotrope layer 161 contains at least 50% by weight, preferably at least 75% by weight, more preferably at least 90% by weight, and most preferably at least 99% by weight of carbon allotropes. For example, the second carbon allotrope layer 161 consists of carbon allotropes.

[0049] For example, metal mesh 162 is made of stainless steel, Si3N4, molybdenum, carbon nanotubes, SiO2, indium tin oxide (ITO), poly(methyl methacrylate), or polyethylene terephthalate (PET).

[0050] For example, the metal mesh 162 is made of stainless steel with a thickness of 50 μm.

[0051] For example, the metal mesh 162 has a tortoiseshell pattern (hexagonal pattern) in which each hexagon has a width of approximately 1 to 2 mm.

[0052] In these embodiments, after the dissolution of the polymer layer 14, the method includes a step of bonding the second carbon allotrope layer 161 to the metal-containing layer 11, as shown in Figure 3, step 3-8. In other words, the side of the second carbon allotrope layer 161 opposite to the side bonded to the metal mesh 162 is bonded to the metal-containing layer 11. To put it another way, the second carbon allotrope layer 161 is bonded to the side of the metal-containing layer opposite to the side bonded to the first carbon allotrope layer 12. For example, the second carbon allotrope layer 161 is bonded to the metal-containing layer 11 by bringing the second carbon allotrope layer 161 into contact with the metal-containing layer 11. Preferably, the second carbon allotrope layer 161 is brought into contact with the metal-containing layer 11 in an environment containing a liquid medium, such as isopropyl alcohol (IPA) or acetone. The purpose of the liquid medium is to promote the bonding of the second carbon allotrope layer 161 to the metal-containing layer 11.

[0053] As a result, as shown in Figure 3, step 3-9, a structure 1 is obtained that includes a first carbon allotrope layer 12, a metal-containing layer 11, a second carbon allotrope layer 161, and a metal mesh 162 in that order. In other words, a structure 1 is obtained that has a metal-containing layer 11 sandwiched between or surrounded by the first carbon allotrope layer 12 and the second carbon allotrope layer 161, on top of the metal mesh 162.

[0054] For example, a laminate 16 containing a second carbon allotrope layer 161 bonded to a metal mesh 162 is provided in a container 3 containing a solvent 2, and the second carbon allotrope layer 161 is brought into contact with the metal-containing layer 11 in the container 3, thereby bonding the second carbon allotrope layer 161 to the metal-containing layer 11. [Examples]

[0055] A silicon wafer substrate was coated with PMMA by immersing it in a 2% molar weight solution of polymethyl methacrylate (PMMA) dissolved in methyl isobutyl ketone (MIBK) and acetic acid (MIBK:acetic acid = 3:1) at a dip-in / dip-out rate of 25 / 25 mm / min. The coated substrate was then baked in a ventilated oven at 100°C for 15 minutes.

[0056] A gold-palladium layer with a thickness of 30 nm was deposited onto a coated substrate using physical vapor deposition (PVD) (Quorum, Aalto Univ., SEM lab).

[0057] A carbon nanotube film bonded to a palladium layer was immersed in isopropyl alcohol (IPA) at room temperature, and the carbon nanotube film was transferred to a palladium layer and dried, thereby bonding the carbon nanotube film to the palladium layer.

[0058] The PMMA layer was dissolved by immersing the laminated structure in a container containing acetone at room temperature until the substrate was freed from the rest of the laminated structure.

[0059] As a result, a structure having a gold-palladium layer on a carbon nanotube film was obtained. [Examples]

[0060] A silicon wafer substrate was coated with PMMA by immersing it in a 2% molar weight solution of polymethyl methacrylate (PMMA) dissolved in methyl isobutyl ketone (MIBK) and acetic acid (MIBK:acetic acid = 3:1) at a dip-in / dip-out rate of 25 / 25 mm / min. The coated substrate was then baked in a ventilated oven at 100°C for 15 minutes.

[0061] A molybdenum layer with a thickness of 30 nm was deposited onto a coated substrate using physical vapor deposition (PVD) (Angstrom, Aalto University, Thin Film Lab).

[0062] The molybdenum layer was treated with H2 plasma at an output of 40W and a flow rate of 20 SCCM for 3 minutes.

[0063] The first carbon nanotube film was bonded to the molybdenum layer by immersing it in isopropyl alcohol (IPA) at room temperature, transferring the carbon nanotube film onto molybdenum, and drying it.

[0064] By placing the laminated structure in a container containing acetone at standard room temperature, the PMMA layer was dissolved until the substrate was removed from the rest of the laminated structure, resulting in the laminated structure floating on the surface of the acetone solution. A few drops of IPA were added to the acetone to lower the surface tension of the acetone solution and promote the floating of the laminated structure.

[0065] A second carbon nanotube film bonded to a metal mesh was immersed in an acetone solution at an angle that minimized bubble formation. The second carbon nanotube film bonded to the metal mesh was slowly lifted out of the acetone solution, bringing it into contact with the molybdenum layer of the remaining part of the structure. The floating laminated structure was then bonded to the surface of the second carbon nanotubes to obtain the final structure. The final structure was removed from the container and heated to 80°C on a hot plate to bond the second carbon nanotube film to the molybdenum layer.

[0066] As a result, a structure was obtained having a molybdenum layer sandwiched between two carbon nanotube films on a metal mesh.

Claims

1. A method for manufacturing a structure (1) having a metal-containing layer (11) bonded to a first carbon allotrope layer (12), - A step of providing a substrate (13) having a flat surface (131), - A step of coating the flat surface (131) of the substrate (13) with a polymer to obtain a polymer layer (14) bonded to the flat surface (131) of the substrate (13), - A step of depositing a metal-containing material on a polymer layer (14) to obtain a metal-containing layer (11) bonded to the polymer layer (14), - A step of providing the first carbon allotrope layer (12), - A step of bonding the first carbon allotrope layer (12) to the metal-containing layer (11), and - A process to bond the first carbon allotrope layer (12) to the metal-containing layer (11), then dissolve the polymer layer (14) using a solvent (2), and release the substrate (13) from the metal-containing layer (11) to obtain a structure (1) having the metal-containing layer (11) bonded to the first carbon allotrope layer (12). A method characterized by including the following.

2. The method according to claim 1, characterized in that the first carbon allotrope layer (12) is a layer containing a carbon allotrope selected from carbon nanotubes and graphene.

3. The method according to claim 1 or 2, wherein the flat surface (131) of the substrate (13) has a surface roughness of up to 20 nm, preferably up to 5 nm, for example, 0.01 to 1 nm, wherein the surface roughness is determined as the arithmetic mean of filtered roughness profiles obtained from the centerline deviation within the evaluation length.

4. The method according to any one of claims 1 to 3, characterized in that the polymer is selected from the group consisting of poly(methyl methacrylate) (PMMA), polyvinyl alcohol (PVA), cycloolefin polymer (COP), cycloolefin copolymer (COC), polydimethylsiloxane (PDMS), polycarbonate (PC), polyethylene terephthalate (PET), polystyrene (PS), fluoropolymer, polyether ether ketone (PEEK), polyimide (PI), and SU-8.

5. The method according to any one of claims 1 to 4, characterized in that a flat surface (131) of a substrate (13) is coated with a polymer using a dip-coating method or a spin-coating method.

6. The metal-containing material is a metal selected from the group consisting of molybdenum (Mo), niobium (Nb), zirconium (Zr), aluminum (Al), silver (Ag), gold (Au), copper (Cu), titanium (Ti), nickel (Ni), and chromium (Cr), or the metal-containing material is a silicide selected from the group consisting of molybdenum silicide, niobium silicide, zirconium silicide, aluminum silicide, silver silicide, gold silicide, copper silicide, titanium silicide, nickel silicide, and chromium silicide, or the metal-containing material is indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), titanium dioxide (TiO2). ２ ), zinc oxide (ZnO), titanium nitride (TiN), tantalum nitride (TaN), magnesium fluoride (MgF ２ ), calcium fluoride (CaF ２ The method according to any one of claims 1 to 5, characterized in that it is selected from the group consisting of ), lithium fluoride (LiF), zinc sulfide (ZnS), zinc selenide (ZnSe), cadmium sulfide (CdS), and lead sulfide (PbS).

7. The method according to any one of claims 1 to 6, characterized in that a metal-containing material is deposited by a physical vapor deposition (PVD) method such as electron beam physical vapor deposition (EBPVD) or thermal vapor deposition, by atomic layer deposition (ALD), by electrodeposition, or by dip coating or spin coating.

8. The method according to any one of claims 1 to 7, further comprising the step of pre-treating the metal-containing layer (11) before bonding the first carbon allotrope layer (12) onto the metal-containing layer (11), wherein the pre-treatment is selected from plasma treatment, heat treatment and chemical treatment.

9. The method according to any one of claims 1 to 8, characterized in that the first carbon allotrope layer (12) is bonded to the frame (15) and supports the first carbon allotrope layer (12).

10. A method according to any one of claims 1 to 9, - A step of providing a laminate (16) having a second carbon allotrope layer (161) bonded to a metal mesh (162), and - A process to obtain a structure (1) having a first carbon allotrope layer (12), a metal-containing layer (11), a second carbon allotrope layer (161), and a metal mesh (162) by dissolving the polymer layer (14) and then bonding the second carbon allotrope layer (161) to the metal-containing layer (11). A method characterized by including the following.

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