Heat dissipation material application machine, heat dissipation material supply method, and heat dissipation material application method
Patent Information
- Application Number
- JP2026021711
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-17
- Filing Date
- 2026-02-13
- Publication Date
- 2026-08-27
Smart Images
Figure 2026137661000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to semiconductor packaging technology, and more particularly, to a heat dissipation material pasting machine, a heat dissipation material supply method, and a heat dissipation material pasting method.
Background Art
[0002] In the field of semiconductor packaging, generally, a single supply module is arranged in a heat dissipation material pasting machine. Therefore, during operation, the heat dissipation material pasting machine can only perform the heat dissipation material pasting process for products of a single dimension.
[0003] However, in the heat dissipation material pasting process, there are pasting needs for different dimensions, and the conventional heat dissipation material pasting machine equipment cannot continuously perform the pasting operations for heat dissipation materials of different dimensions. When it is necessary to continuously paste heat dissipation materials of different dimensions on a product, in order to complete the pasting of heat dissipation materials of different dimensions, it is necessary to use two or more devices having different supply modules.
[0004] Also, in such a supply mode, after completing the pasting of the heat dissipation material of the first dimension for the entire product batch on the first device, it is necessary to perform the pasting of the heat dissipation material of the second dimension on the second device. The above method not only does not simplify the operation, but also takes extra waiting time, and requires a larger number and more space of devices.
Summary of the Invention
Problems to be Solved by the Invention
[0005] Therefore, an object of the present disclosure is to provide a heat dissipation material pasting machine, a heat dissipation material supply method, and a heat dissipation material pasting method that can meet various heat dissipation material pasting needs in the heat dissipation material pasting process. Therefore, the work flow can be simplified and the waiting time of the work can be saved.
Means for Solving the Problems
[0006] To the purposes of the present disclosure, a heat dissipation material application machine comprising: a platform including a first supply area and a second supply area, the first supply area and the second supply area each having a first and second accommodating groove recessed in the platform; at least one first supply module removably installed in the first or second accommodating groove and configured to supply a plurality of first heat dissipation materials; and at least one second supply module removably installed in the first or second accommodating groove and configured to supply a plurality of second heat dissipation materials, wherein the first supply module differs from the second supply module in that it supplies the first heat dissipation material The present invention provides a heat dissipation material application machine comprising: at least one second supply module whose dimensions differ from those of the second heat dissipation material; a first pick-and-place module that is movably installed on the platform along the X, Y, and Z axes and configured to pick up, transport, and apply the first or second heat dissipation material from the first supply area; and a second pick-and-place module that is movably installed on the platform along the X, Y, and Z axes and configured to pick up, transport, and apply the first or second heat dissipation material from the second supply area.
[0007] According to one embodiment of the present disclosure, the first supply module is a tray supply module, and the second supply module is a feeder supply module.
[0008] According to one embodiment of the present disclosure, the tray supply module includes a tray configured to support a first heat dissipation material, and two support bases provided on opposite sides of a first or second housing groove, respectively, for supporting and securing the tray, and the feeder supply module includes an adapter module provided in the first or second housing groove, at least one feeder provided in the adapter module, and at least one discharge tape reel provided in the feeder.
[0009] According to one embodiment of the present disclosure, the number of at least one feeder and at least one discharge tape reel is two, and each feeder is equipped with corresponding discharge tape reels.
[0010] According to one embodiment of the present disclosure, one of the discharge tape reels is configured to be fitted with a second heat dissipation material, and the second of the discharge tape reels is configured to be fitted with a plurality of third heat dissipation materials, wherein the dimensions of these third heat dissipation materials differ from the dimensions of the second heat dissipation material.
[0011] According to one embodiment of the present disclosure, the platform further includes a first work area and a second work area, the heat dissipation material application machine further includes a conveying device installed extending within the first and second work areas and configured to transport a plurality of substrates along one direction, the first pick-and-place module configured to apply a first heat dissipation material or a second heat dissipation material to a substrate in the first work area, and the second pick-and-place module configured to apply a first heat dissipation material or a second heat dissipation material to a substrate in the second work area.
[0012] To the purposes of the present disclosure, a heat dissipation material application machine comprising: a platform including a first supply area and a second supply area, the first supply area and the second supply area each having a first and second accommodating groove recessed in the platform; at least one first supply module removably installed in the first or second accommodating groove and configured to supply a plurality of first heat dissipation materials; and at least one second supply module removably installed in the first or second accommodating groove and configured to supply a plurality of second heat dissipation materials, wherein the first supply module is identical to or different from the second supply module, and the first heat dissipation material The present invention provides a heat dissipation material application machine comprising: at least one second supply module whose dimensions are correspondingly the same as or different from those of the second heat dissipation material; a first pick-and-place module installed on the platform so as to be movable along the X, Y, and Z axes and configured to pick up, transport, and apply the first or second heat dissipation material from the first supply area; and a second pick-and-place module installed on the platform so as to be movable along the X, Y, and Z axes and configured to pick up, transport, and apply the first or second heat dissipation material from the second supply area.
[0013] According to one embodiment of the present disclosure, the first supply module is a tray supply module, and the second supply module is a feeder supply module.
[0014] According to one embodiment of the present disclosure, the tray supply module includes a tray configured to support a first heat dissipation material, and two support bases provided on opposite sides of a first or second housing groove, respectively, for supporting and securing the tray, and the feeder supply module includes an adapter module provided in the first or second housing groove, at least one feeder provided in the adapter module, and at least one discharge tape reel provided in the feeder.
[0015] To the purposes of the present disclosure, a method for supplying heat dissipation material is provided, comprising the steps of: installing a first supply module and a second supply module in a first supply area and a second supply area of a heat dissipation material application machine platform, respectively; the first supply module and the second supply module being different steps; and then, using the first supply module and the second supply module simultaneously, supplying a plurality of first heat dissipation materials to a first pick-and-place module of a heat dissipation material application machine, and supplying a plurality of second heat dissipation materials to a second pick-and-place module of a heat dissipation material application machine, wherein the dimensions of the first heat dissipation materials are different from the dimensions of the second heat dissipation materials.
[0016] According to one embodiment of the present disclosure, the first supply module is a tray supply module, and the second supply module is a feeder supply module.
[0017] According to one embodiment of the present disclosure, the feeder supply module includes an adapter module provided in a platform, two feeders provided spaced apart from each other in the adapter module, and two discharge tape reels provided on each of the plurality of feeders, the first of which is used to place a second heat dissipation material, and the second of which is used to place a plurality of third heat dissipation materials, wherein the dimensions of the third heat dissipation materials differ from those of the first heat dissipation material and the second heat dissipation material, and the step of performing the supply operation in the heat dissipation material supply method further includes supplying the plurality of third heat dissipation materials by simultaneously using the second supply module.
[0018] To the purposes of the present disclosure, a method for attaching heat dissipation material is provided, comprising the steps of: performing a supply operation on the platform of a heat dissipation material attaching machine in order to supply a plurality of first heat dissipation materials using a first supply module and a plurality of second heat dissipation materials using a second supply module, wherein the dimensions of the first heat dissipation materials differ from those of the second heat dissipation materials, and the platform includes a first work area and a second work area; performing a pick-and-place operation in order to pick up the first heat dissipation material from the first supply module and the second heat dissipation material from the second supply module, respectively, using a first pick-and-place module and a second pick-and-place module of a heat dissipation material attaching machine; and performing an attachment operation in order to attach the first heat dissipation material to the first work area and the second heat dissipation material to the second work area, respectively, using the first pick-and-place module and the second pick-and-place module.
[0019] According to one embodiment of the present disclosure, the bonding operation further includes transporting a plurality of substrates to a first work area using a transport device of a heat dissipation material bonding machine, bonding the first heat dissipation material to each of these substrates using a first pick-and-place module, transporting the substrates from the first work area to a second work area using a transport device, and bonding the second heat dissipation material to each of the substrates using a second pick-and-place module.
[0020] According to one embodiment of the present disclosure, the pasting operation further includes transporting a plurality of first substrates and a plurality of second substrates to a first work area and a second work area, respectively, using a transport device of a heat dissipation material pasting machine, and simultaneously using a first pick-and-place module and a second pick-and-place module to paste the first heat dissipation material onto the first substrate and paste the second heat dissipation material onto the second substrate, respectively.
[0021] According to an embodiment of the present disclosure, the first supply module is a tray supply module, the second supply module is a feeder supply module, the feeder supply module includes two feeders and two discharge tape reels provided on the feeders respectively, the first one of the discharge tape reels places the second heat dissipation material, the second one of the discharge tape reels places a plurality of third heat dissipation materials, the dimension of the third heat dissipation material is different from the dimensions of the first heat dissipation material and the second heat dissipation material, and the steps of performing the pasting operation further include using the first pick-and-place head and the second pick-and-place head of the second pick-and-place module to adsorb the second heat dissipation material and the third heat dissipation material respectively, and using the first pick-and-place head and the second pick-and-place head to paste the second heat dissipation material and the third heat dissipation material onto the substrate in the second working area.
Brief Description of the Drawings
[0022] As can be better understood from the following detailed description described with reference to the drawings. Note that, in accordance with the standard practices in the industry, each feature is not drawn to scale. In fact, for the sake of clarity in the description, the dimensions of each feature can be arbitrarily enlarged or reduced. [[ID=,9]] [Figure 1] It is a schematic plan view showing the configuration of a heat dissipation material pasting machine according to the first embodiment of the present disclosure. [Figure 2] It is a schematic perspective view showing the heat dissipation material pasting machine according to the first embodiment of the present disclosure. [Figure 3] It is a schematic plan view showing the configuration of a heat dissipation material pasting machine according to the second embodiment of the present disclosure.. [Figure 4] It is a schematic plan view showing the configuration of a heat dissipation material pasting machine according to the third embodiment of the present disclosure. [Figure 5] It is a flowchart showing a method for supplying a heat dissipation material according to an embodiment of the present disclosure. [Figure 6] It is a flowchart showing a method for pasting a heat dissipation material according to an embodiment of the present disclosure.
Modes for Carrying Out the Invention
[0023] Hereinafter, embodiments of the present disclosure will be described in detail. However, as can be understood, the embodiments provide many applicable concepts that can be implemented in various specific situations. The embodiments discussed and disclosed herein are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although all embodiments of the present disclosure disclose many different features, these features can be implemented independently or in combination as needed.
[0024] Also, as used herein, "first", "second", etc. do not specifically refer to an order or rank, and are only used to distinguish elements or operations described by the same technical term.
[0025] The spatial relationship between two elements described in the present disclosure is not only applicable to the orientation shown in the drawings, but also applicable to orientations not shown in the drawings, such as an inverted orientation. Also, the "connection", "electrical connection", or similar terms of two members described in the present disclosure are not limited to a direct connection or electrical connection between the two members, and may include an indirect connection or electrical connection as needed.
[0026] FIG. 1 and FIG. 2 are respectively a plan schematic view and a perspective schematic view showing the configuration of a heat dissipation material pasting machine 100 according to a first embodiment of the present disclosure. The pasting machine 100 may mainly include a platform 200, at least one first supply module 300, at least one second supply module 400, a first pick-and-place module 500, and a second pick-and-place module 600.
[0027] The platform 200 may be a box structure and may be used to mount at least one first supply module 300, at least one second supply module 400, a first pick-and-place module 500, and a second pick-and-place module 600. The platform 200 includes a first supply area 210 and a second supply area 220. The first supply area 210 and the second supply area 220 are spaced apart from each other and may be provided parallel to one side of the platform 200, for example. As shown in Figure 2, the first supply area 210 and the second supply area 220 each have a first accommodating groove 212 and a second accommodating groove 222. Both the first accommodating groove 212 and the second accommodating groove 222 are recessed in the platform 200 and each has a recessed groove space capable of accommodating the first supply module 300 or the second supply module 400. In other words, the first accommodating groove 212 can accommodate the first supply module 300 or the second supply module 400, and the second accommodating groove 222 can accommodate the first supply module 300 or the second supply module 400.
[0028] In some embodiments, the platform 200 further includes a first work area 230 and a second work area 240. The first work area 230 and the second work area 240 may be, for example, elongated in shape. The first work area 230 and the second work area 240 may be adjacent to each other. In some embodiments, the first work area 230 and the second work area 240 are located adjacent to each other in the center of the platform 200, straddling the platform 200 parallel to direction X, and perpendicular to the first supply area 210 and the second supply area 220. The first work area 230 and the second work area 240 may be located on the platform 200 in different orientations, and the disclosure is not limited thereto.
[0029] The first supply module 300 is removably installed in the first or second housing groove 212 to supply the first heat dissipation material. In this embodiment, the first supply module 300 is a tray supply module and includes a tray 310 and two support bases 320. The tray 310 may have an array-like grid structure and can hold a plurality of first heat dissipation materials. The two support bases 320 are elongated in shape. In the embodiment shown in Figure 2, the first supply module 300 is provided in the first housing groove 212, and the two support bases 320 are installed parallel to each other on opposite sides of the first housing groove 212 to support and secure the tray 310. Specifically, the tray 310 is installed and secured on the two support bases 320. The first supply module 300 is secured in the first housing groove 212 via the two support bases 320.
[0030] The second supply module 400 is removably installed in the first or second housing groove 212 to supply the second heat dissipation material. In this embodiment, the second supply module 400 is installed in the second housing groove 222. The second supply module 400 and the first supply module 300 are different supply modules, and the dimensions of the second heat dissipation material are different from those of the first heat dissipation material. The dimensions of the first heat dissipation material may be larger than, equal to, or smaller than those of the second heat dissipation material. In some embodiments, the second supply module 400 is a feeder supply module and includes an adapter module 410, at least one feeder 420, and at least one discharge tape reel 430. In the embodiment shown in Figure 2, the adapter module 410 is located in the second housing groove 222. The feeder 420 is located in the adapter module 410. The discharge tape reels 430 are provided on the feeder 420, and the number of discharge tape reels 430 may correspond to the number of feeders 420.
[0031] Generally, tray supply modules can accommodate larger heat dissipation materials compared to feeder supply modules. Therefore, in an embodiment where the first supply module 300 is a tray supply module and the second supply module 400 is a feeder supply module, the dimensions of the first heat dissipation material are usually larger than those of the second heat dissipation material.
[0032] In some embodiments, there are two feeders 420 and two discharge tape reels 430. Each feeder 420 is equipped with corresponding discharge tape reels 430. In such embodiments, if one discharge tape reel 430 is fitted with a second heat dissipation material, the other discharge tape reel 430 may be fitted with a third heat dissipation material. The dimensions of the third heat dissipation material differ from those of the second heat dissipation material. However, the two discharge tape reels 430 may also be fitted with the same heat dissipation material.
[0033] In some embodiments, the heat dissipation material application machine 100 further includes a transport device 110. This transport device 110 is installed extending within a first work area 230 and a second work area 240 and can transport multiple substrates in one direction along the first work area 230 and the second work area 240. In embodiments where the first work area 230 and the second work area 240 are parallel to direction X, the transport device 110 transports the substrates parallel to direction X, for example, transporting the substrates from left to right in direction X in Figure 2, but is not limited thereto.
[0034] The first pick-and-place module 500 may be installed on the platform 200 so as to be movable along directions X, Y, and Z, where directions X, Y, and Z are perpendicular to each other. The first pick-and-place module 500 can pick up, transport, and attach the first heat dissipation material or the second heat dissipation material from the first supply area 210. Specifically, the first pick-and-place module 500 can first move along directions X and Y to the first supply area 210, then move along direction Z to pick up the first heat dissipation material supplied from the first supply area 210, and then move along directions X and Y to transport the first heat dissipation material from the first supply area 210 to the first work area 230, and further attach the first heat dissipation material to the substrate transported to the first work area 230 by the transport device 110.
[0035] The second pick-and-place module 600 may similarly be installed on the platform 200 so as to be movable along directions X, Y, and Z. The second pick-and-place module 600 and the first pick-and-place module 500 may be spaced apart from each other and provided symmetrically on the platform 200. The second pick-and-place module 600 can pick up, transport, and attach the first or second heat dissipation material from the second supply area 220. The second pick-and-place module 600 can first move along directions X and Y to the second supply area 220, then move along direction Z to pick up the second heat dissipation material supplied from the second supply area 220, and then transport the second heat dissipation material to the second work area 240, and then the second pick-and-place module 600 attaches the second heat dissipation material to the substrate transported to the second work area 240 by the transport device 110.
[0036] Figure 3 is a schematic plan view showing the configuration of a heat dissipation material application machine 100a according to the second embodiment of this disclosure. The application machine 100a has substantially the same configuration as the application machine 100 of the above embodiment, and the difference between the application machine 100a and the application machine 100a is that the application machine 100a is equipped with two first supply modules 300. These two first supply modules 300 are provided in the first housing groove 212 and the second housing groove 222, respectively. In this case, the heat dissipation material placed in the first supply area 210 and the second supply area 220 is the first heat dissipation material.
[0037] Figure 4 is a schematic plan view showing the configuration of a heat dissipation material application machine 100b according to a third embodiment of the present disclosure. The application machine 100b is substantially the same as the application machine 100 of the above embodiment, the difference being that the application machine 100b has two second supply modules 400. These two second supply modules 400 are provided in a first housing groove 212 and a second housing groove 222, respectively. In some embodiments, the heat dissipation material supplied from the first supply area 210 and the second supply area 220 is the second heat dissipation material. In some other embodiments, the first supply area 210 and the second supply area 220 can supply heat dissipation material of different dimensions, so that the second supply modules 400 can be fitted with heat dissipation material of various different dimensions.
[0038] Figure 5 is a flowchart illustrating a method for supplying heat dissipation material according to one embodiment of the present disclosure. When performing the method for supplying heat dissipation material, step S100 can be performed first to install the supply modules in the supply area. In the embodiment shown in Figure 2, the first supply module 300 and the second supply module 400 are installed in the first housing groove 212 of the first supply area 210 and the second housing groove 222 of the second supply area 220 of the platform 200 of the heat dissipation material application machine 100, respectively. In other embodiments, the first supply module 300 and the second supply module 400 are interchangeable and can be installed in the second housing groove 222 and the first housing groove 212, respectively.
[0039] In the embodiment shown in Figure 3, in step S100, two first supply modules 300 are installed in the first housing groove 212 of the first supply area 210 and the second housing groove 222 of the second supply area 220, respectively. In the embodiment shown in Figure 4, in step S100, two second supply modules 400 are installed in the first housing groove 212 of the first supply area 210 and the second housing groove 222 of the second supply area 220.
[0040] After installing the supply module in the supply area, step S110 can be performed to use the supply module to carry out the supply work. In the embodiment shown in Figure 1, in step S110, the first supply module 300 and the second supply module 400 are used simultaneously to supply the first heat dissipation material to the first pick-and-place module 500 of the heat dissipation material application machine 100, and the second heat dissipation material to the second pick-and-place module 600, respectively. Specifically, the first pick-and-place module 500 and the second pick-and-place module 600 move above the first supply module 300 and the second supply module 400 along directions X and Y, respectively, and then move along direction Z to pick up the first and second heat dissipation materials, respectively.
[0041] In an embodiment in which the second supply module 400 includes two feeders 420 and two discharge tape reels 430, if one discharge tape reel 430 is fitted with a second heat dissipation material and the other discharge tape reel 430 is fitted with a third heat dissipation material, the step of performing the supply operation further includes simultaneously supplying the second heat dissipation material and the third heat dissipation material using the second supply module 400.
[0042] In the embodiment shown in Figure 3, in step S110, the first heat dissipation material is supplied to the first pick-and-place module 500 and the second pick-and-place module 600 of the heat dissipation material application machine 100a, respectively, using two first supply modules 300. Specifically, the first pick-and-place module 500 and the second pick-and-place module 600 move above the first supply area 210 and the second supply area 220, respectively, and pick up the first heat dissipation material supplied from the first supply module 300 in the first supply area 210 and the second supply area 220, respectively, along direction Z.
[0043] In the embodiment shown in Figure 4, in step S110, the supply operation is performed using two second supply modules 400. The first pick-and-place module 500 and the second pick-and-place module 600 move along directions X and Y to above the first supply area 210 and the second supply area 220, respectively, and then pick up the second heat dissipation material supplied from the second supply modules 400 in the first supply area 210 and the second supply area 220, respectively, along direction Z. In some embodiments, the second supply module 400 can be fitted with heat dissipation materials of different dimensions, for example, a second heat dissipation material and a third heat dissipation material. Thus, in such embodiments, the second supply module 400 can supply the second heat dissipation material and the third heat dissipation material simultaneously.
[0044] Referring to Figures 1 and 6, Figure 6 is a flowchart showing a method for attaching a heat dissipation material according to one embodiment of the present disclosure. When performing the method for attaching a heat dissipation material, step S200 can be performed first, which involves simultaneously using the first supply module 300 and the second supply module 400 on the platform 200 of the heat dissipation material attaching machine 100 to perform the supply work, thereby supplying the first and second heat dissipation materials of different dimensions.
[0045] After the supply operation is completed, step S210 can be performed to carry out the retrieval operation using the first pick-and-place module 500 and the second pick-and-place module 600. Specifically, in the embodiment shown in Figure 1, the first pick-and-place module 500 and the second pick-and-place module 600 are moved along directions X and Y, respectively, to above the first supply module 300 and the second supply module 400, and then the first pick-and-place module 500 and the second pick-and-place module 600 are moved along direction Z, picking up the first heat dissipation material from the first supply module 300 and the second heat dissipation material from the second supply module 400, respectively.
[0046] After the suction operation is completed, step S220 can be performed to perform the attachment operation on the platform 200 of the heat dissipation material attachment machine 100 using the first pick-and-place module 500 and the second pick-and-place module 600. In some embodiments, when performing the attachment operation, first, the transport device 110 is used to transport multiple substrates to the first work area 230. Next, the first pick-and-place module 500 is moved from the first supply module 300 to the first work area 230, and the first pick-and-place module 500 is used to attach the first heat dissipation material to each of these substrates. Subsequently, the transport device 110 is used again to transport the substrates from the first work area 230 to the second work area 240. After that, the second pick-and-place module 600 is moved from the second supply module 400 to the second work area 240, and the second pick-and-place module 600 is used to attach the second heat dissipation material to each of these substrates to which the first heat dissipation material has been attached.
[0047] In some embodiments, when performing the bonding operation, multiple first substrates and multiple second substrates to be bonded with heat dissipation material are already present in the first work area 230 and the second work area 240, respectively. In some other embodiments, when performing the bonding operation, a transport device 110 is used to transport these first substrates and second substrates to the first work area 230 and the second work area 240, respectively. When performing the bonding operation, the first pick-and-place module 500 moves from the first supply module 300 to the first work area 230 and bonds the picked-up first heat dissipation material to the first substrate in the first work area 230. The second pick-and-place module 600 moves from the second supply module 400 to the second work area 240 and bonds the picked-up second heat dissipation material to the second substrate in the second work area 240.
[0048] Of particular note is that, when performing the attachment work described in this embodiment, the operation of the first pick-and-place module 500 to attach the first heat dissipation material to the first substrate and the operation of the second pick-and-place module 600 to attach the second heat dissipation material to the second substrate may be performed simultaneously or with a time delay. In other words, the heat dissipation material attachment work in the first work area 230 and the heat dissipation material attachment work in the second work area 240 may be performed simultaneously or with a time delay as required in practice, and must be completed in order, for example, according to the needs of the mechanism or space, but is not limited thereto.
[0049] In an embodiment in which the second supply module 400 simultaneously supplies the second heat dissipation material and the third heat dissipation material, the second pick-and-place module 600 may include a first pick-and-place head 610 and a second pick-and-place head 620. The first pick-and-place head 610 and the second pick-and-place head 620 of the second pick-and-place module 600 correspond to adsorbing the second heat dissipation material and the third heat dissipation material, respectively. In this embodiment, the first pick-and-place head 610 and the second pick-and-place head 620 move from the second supply area 220 to the second work area 240 and attach the adsorbed second heat dissipation material and the third heat dissipation material to the second substrate in the second work area 240, respectively.
[0050] As can be seen from the above embodiments, the heat dissipation material application machine according to the present disclosure can provide the supply and continuous application of heat dissipation materials of different dimensions in response to the need for heat dissipation materials of different dimensions. If there is a need to apply heat dissipation materials of different dimensions in the heat dissipation material application work, the heat dissipation material application machine according to the present disclosure can directly perform the supply and continuous application work simultaneously. Therefore, there is no need to separately install another application machine, nor is there a need to wait for the application of the next size of heat dissipation material until the application of the first size of heat dissipation material is completed. Thus, the work flow can be simplified and waiting time for the work can be saved.
[0051] Another advantage of this disclosure is that the heat dissipation material application machine according to this disclosure can supply heat dissipation materials of different dimensions and perform continuous application work. Therefore, compared to conventional application machines, the number of required devices and the space required for the devices can be reduced.
[0052] While the present disclosure provides examples as described above, these examples are not limiting, and those skilled in the art can make various modifications and alterations as long as they do not deviate from the spirit and scope of the present disclosure. Accordingly, the scope of protection of the present disclosure should be based on the content specified in the appended claims. [Explanation of Symbols]
[0053] 100 adhesive machine 100a adhesive machine 100b adhesive machine 110 Conveying device 200 platforms 210 First Supply Area 212 First storage groove 220 Second Supply Area 222 Second storage groove 230 First work area 240 Second work area 300 First Supply Module 310 Tray 320 Support base 400 Second Supply Module 410 Adapter Module 420 feeders 430 Discharge Tape Reel 500 1st Pick and Place Module 600 Second Pick and Place Module 610 First Pick and Place Head 620 Second Pick and Place Head S100 Step S110 Step S200 Step S210 Step S220 Step X direction Y direction Z direction
Claims
1. A heat dissipation material application machine, A platform including a first supply area and a second supply area, wherein the first supply area and the second supply area each have a first and second accommodating groove recessed in the platform, At least one first supply module, which is removably installed in the first or second housing groove and configured to supply a plurality of first heat dissipation materials, At least one second supply module, which is removably installed in the first or second housing groove and configured to supply a plurality of second heat dissipation materials, wherein the at least one first supply module differs from the at least one second supply module, and the dimensions of the plurality of first heat dissipation materials differ from the dimensions of the plurality of second heat dissipation materials, A first pick-and-place module is installed on the platform so as to be movable along the X, Y, and Z axes, and is configured to pick up, transport, and attach the plurality of first heat dissipation materials or the plurality of second heat dissipation materials from the first supply area. A second pick-and-place module is installed on the platform so as to be movable along the X, Y, and Z axes, and is configured to pick up, transport, and attach the plurality of first heat dissipation materials or the plurality of second heat dissipation materials from the second supply area. A heat dissipation material application machine equipped with [specific feature].
2. The heat dissipation material application machine according to claim 1, wherein each of the at least one first supply module is a tray supply module, and each of the at least one second supply module is a feeder supply module.
3. The tray supply module is A tray configured to support the plurality of first heat dissipation materials, Two support bases are provided to support and secure the tray, each being installed on either the opposing sides of the first storage groove or on either the opposing sides of the second storage groove. Includes, The aforementioned feeder supply module is An adapter module provided in the first or second housing groove, The adapter module is provided with at least one feeder, At least one discharge tape reel provided in the at least one feeder, A heat dissipation material application machine according to claim 2, including the features described above.
4. The heat dissipation material application machine according to claim 3, wherein the number of at least one feeder and at least one discharge tape reel is both two, and each of the multiple feeders corresponds to mounting a multiple of the multiple discharge tape reels.
5. The heat dissipation material attachment machine according to claim 4, wherein the first of the plurality of discharge tape reels is configured to be fitted with the plurality of second heat dissipation materials, and the second of the plurality of discharge tape reels is configured to be fitted with the plurality of third heat dissipation materials, and the dimensions of the plurality of third heat dissipation materials are different from the dimensions of the plurality of second heat dissipation materials.
6. The platform further includes a first work area and a second work area, The heat dissipation material application machine further includes a conveying device that extends within the first and second work areas and is configured to transport multiple substrates in one direction. The heat dissipation material attachment machine according to claim 1, wherein the first pick-and-place module is configured to attach the plurality of first heat dissipation materials or the plurality of second heat dissipation materials to the plurality of substrates in the first work area, and the second pick-and-place module is configured to attach the plurality of first heat dissipation materials or the plurality of second heat dissipation materials to the plurality of substrates in the second work area.
7. A heat dissipation material application machine, A platform including a first supply area and a second supply area, wherein the first supply area and the second supply area each have a first and second accommodating groove recessed in the platform, At least one first supply module, which is removably installed in the first or second housing groove and configured to supply a plurality of first heat dissipation materials, At least one second supply module, which is removably installed in the first or second housing groove and configured to supply a plurality of second heat dissipation materials, wherein the at least one first supply module is identical to or different from the at least one second supply module, and the plurality of first heat dissipation materials are correspondingly identical to or different in dimensions to the plurality of second heat dissipation materials, A first pick-and-place module is installed on the platform so as to be movable along the X, Y, and Z axes, and is configured to pick up, transport, and attach the plurality of first heat dissipation materials or the plurality of second heat dissipation materials from the first supply area. A second pick-and-place module is installed on the platform so as to be movable along the X, Y, and Z axes, and is configured to pick up, transport, and attach the plurality of first heat dissipation materials or the plurality of second heat dissipation materials from the second supply area. A heat dissipation material application machine equipped with [specific feature].
8. The heat dissipation material application machine according to claim 7, wherein each of the at least one first supply module is a tray supply module, and each of the at least one second supply module is a feeder supply module.
9. The tray supply module is A tray configured to support the plurality of first heat dissipation materials, Two support bases are provided to support and secure the tray, each being installed on either the opposing sides of the first storage groove or on either the opposing sides of the second storage groove. Includes, The aforementioned feeder supply module is An adapter module provided in the first or second housing groove, The adapter module is provided with at least one feeder, At least one discharge tape reel provided in the at least one feeder, A heat dissipation material application machine according to claim 8, including the feature described above.
10. A method for supplying heat dissipation material, The first supply module and the second supply module are installed in the first supply area and the second supply area of the heat dissipation material application machine platform, respectively, and the first supply module and the second supply module perform different steps, Using the first supply module and the second supply module simultaneously, a supply operation is performed to supply a plurality of first heat dissipation materials to the first pick-and-place module of the heat dissipation material application machine, and to supply a plurality of second heat dissipation materials to the second pick-and-place module of the heat dissipation material application machine, wherein the dimensions of the plurality of first heat dissipation materials differ from the dimensions of the plurality of second heat dissipation materials, A method for supplying heat dissipation material including [the specified element].
11. The method for supplying a heat dissipation material according to claim 10, wherein the first supply module is a tray supply module and the second supply module is a feeder supply module.
12. The aforementioned feeder supply module is An adapter module provided within the aforementioned platform, The adapter module includes two feeders spaced apart from each other, Each of the following is provided on multiple feeders, the first of which holds the plurality of second heat dissipation materials, the second of which holds the plurality of third heat dissipation materials, and the dimensions of the plurality of third heat dissipation materials are different from the dimensions of the plurality of first heat dissipation materials and the plurality of second heat dissipation materials, Includes, The method for supplying heat dissipation material according to claim 11, further comprising the step of performing the supply operation by simultaneously using the second supply module to supply the plurality of third heat dissipation materials.
13. A method for attaching heat dissipation material, In order to supply multiple first heat dissipation materials using a first supply module and simultaneously supply multiple second heat dissipation materials using a second supply module, the supply operation is performed on the platform of the heat dissipation material application machine, the dimensions of the multiple first heat dissipation materials differ from the dimensions of the multiple second heat dissipation materials, and the platform includes a first work area and a second work area, The process involves using the first pick-and-place module and the second pick-and-place module of the heat dissipation material application machine to pick up the plurality of first heat dissipation materials from the first supply module and the plurality of second heat dissipation materials from the second supply module, respectively, and performing a pick-up operation. The steps include: performing an attachment operation to attach the plurality of first heat dissipation materials to the first work area using the first pick-and-place module and the second pick-and-place module, respectively, and to attach the plurality of second heat dissipation materials to the second work area; A method for attaching heat dissipation material, including [specific component].
14. The step of performing the pasting operation is: Using the transport device of the heat dissipation material application machine, multiple substrates are transported to the first work area. Using the first pick-and-place module, the plurality of first heat dissipation materials are attached to the plurality of substrates, Using the transport device, the plurality of substrates are transported from the first work area to the second work area, Using the second pick-and-place module, the plurality of second heat dissipation materials are attached to the plurality of substrates, A method for attaching a heat dissipation material according to claim 13, further comprising:
15. The step of performing the pasting operation is: Using the transport device of the heat dissipation material application machine, multiple first substrates and multiple second substrates are transported to the first work area and the second work area, respectively. The first pick-and-place module and the second pick-and-place module are used simultaneously to attach the plurality of first heat dissipation materials to the plurality of first substrates, and the plurality of second heat dissipation materials to the plurality of second substrates, A method for attaching a heat dissipation material according to claim 13, further comprising:
16. The first supply module is a tray supply module, and the second supply module is a feeder supply module. The feeder supply module includes two feeders and two discharge tape reels provided on each of the plurality of feeders, wherein the first of the plurality of discharge tape reels is mounted on the plurality of second heat dissipation materials, the second of the plurality of discharge tape reels is mounted on the plurality of third heat dissipation materials, and the dimensions of the plurality of third heat dissipation materials differ from the dimensions of the plurality of first heat dissipation materials and the dimensions of the plurality of second heat dissipation materials. The steps of performing the aforementioned attachment work include using the first pick-and-place head and the second pick-and-place head of the second pick-and-place module to pick up the plurality of second heat dissipation materials and the plurality of third heat dissipation materials, respectively, and using the first pick-and-place head and the second pick-and-place head to attach at least one of the plurality of second heat dissipation materials and at least one of the plurality of third heat dissipation materials to each of the plurality of substrates in the second work area. A method for attaching a heat dissipation material according to claim 13, further comprising: