electronic machinery

Abstract

To provide a novel electronic device, or to provide an electronic device having a novel form. [Solution] The ring portion and the display portion are made flexible, and the display portion has an upper surface It has a first side surface that is in contact with at least one side of the upper surface, and the first side surface has a curved surface. Furthermore, a first display area is provided on the top surface, and a second display area is provided on the first side surface, and the An electronic device in which a display area 1 and a second display area are provided in a continuous manner. The electronic device is a phosphor It is attached to the user's fingers, making contact with the glove portion.

Description

[Technical Field]

[0001] One aspect of the present invention relates to electronic devices, display devices, light-emitting devices, energy storage devices, methods for driving them, and This relates to the manufacturing methods for those products.

[0002] In this specification, "electronic equipment" refers to all devices that operate by being supplied with electricity. electronic devices having a power source, electronic devices having, for example, a storage battery as a power source, and electro-optical devices. All information terminal devices and the like that have a storage battery are electronic devices. Furthermore, one aspect of the present invention is as follows: The technical fields are not limited to those described herein. The technical fields of one aspect of the invention disclosed herein include materials and methods. The present invention relates to a law or a method of manufacture. Alternatively, one aspect of the present invention relates to a process, machine relating to manufacturing, production, or composition of matter. Therefore, more specifically, the technical field of one aspect of the present invention disclosed herein is semiconductor devices, display devices, liquid crystal display devices, light-emitting devices, lighting devices, energy storage devices, memory devices, cameras Image devices, their driving methods, or their manufacturing methods can be cited as examples. ru. [Background technology]

[0003] In recent years, display devices that are worn on the human body, such as head-mounted display devices (glasses type), have been developed. These are called head-mounted displays or wearable displays. Additionally, there are wearable devices in the form of watches (also called wristbands), which can be used in conjunction with tablet devices. It is being used in response to the situation.

[0004] Furthermore, notebook personal computers have input devices such as keyboards and mice connected to them. It is being used. Because it is more portable than a notebook personal computer, tablets Tablet devices are becoming widespread. With tablet devices that allow touch input, you can touch the screen. This allows for input operations and other functions to be performed.

[0005] Furthermore, e-book readers equipped with flexible display devices are described in Patent Documents 1 and 2. It is disclosed to [the relevant authority]. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2010-282181 [Patent Document 2] Japanese Patent Publication No. 2010-282183 [Overview of the project] [Problems that the invention aims to solve]

[0007] To ensure a comfortable fit for the user, the display device, which is worn on the human body, is designed to be lightweight. Furthermore, there is a demand for miniaturization, and the weight of the entire electronic device, including the drive unit and power supply of the display device, is also important. A transformation is required.

[0008] One aspect of the present invention aims to provide a novel electronic device. One aspect of this invention aims to provide an electronic device having a novel form.

[0009] Alternatively, one aspect of the present invention aims to provide a novel display device. One aspect of the present invention aims to provide a display device having a novel form.

[0010] Alternatively, one aspect of the present invention aims to provide a novel input device. One aspect of the present invention aims to provide an input device having a novel form.

[0011] Alternatively, one aspect of the present invention aims to provide an electronic device that is worn on the fingers of the hand. Let's consider it one.

[0012] Alternatively, one aspect of the present invention aims to provide an energy storage device that is worn on the fingers of the hand. It shall be one of them.

[0013] Furthermore, the description of these problems does not preclude the existence of other problems. One approach does not require that all of these issues be resolved. The title will become clear from the description in the specification, drawings, claims, etc. It is possible to extract other issues from the descriptions in the drawings, claims, etc. [Means for solving the problem]

[0014] One aspect of the present invention has a ring portion and a display portion fixed to the ring portion, wherein the display portion is It has a top surface and a first side surface that is in contact with at least one side of the top surface, and the first side surface is a curved surface It has a first display area on its top surface and a second display area on its first side surface. The first display area and the second display area are provided in a continuous manner in this electronic device.

[0015] Furthermore, in the above configuration, the first side surface includes a part of the side surface of a cylinder or an elliptical cylinder. The shape of the first side may be a part of the shape of the side of a cylinder or an elliptical cylinder.

[0016] Furthermore, in the above configuration, the ring portion has a band-shaped region, and the width of the band-shaped region of the ring portion is It is smaller than the width of the display area.

[0017] Furthermore, in the above configuration, the ring portion includes a secondary battery, and the secondary battery is electrically connected to the display portion. Connected.

[0018] Furthermore, in the above configuration, the electronic device is attached to the user's finger in contact with the ring portion. This is preferable. Furthermore, it is not limited to fingers and toes, but also applies to the limbs of robots, the limbs of pet animals, and the limbs of pet animals. It may also be an electronic device that is attached to a collar. Furthermore, it is not limited to pets, but also applies to zoos. It can also be attached to animals kept in captivity, such as in aquariums.

[0019] To achieve lighter and smaller information terminals, we will provide a ring-type information terminal. For example, The display unit and power supply are mounted on the ring portion containing precious metal. Alternatively, the ring portion containing precious metal is fixed to the ring portion. The display unit and power supply are mounted on a designated base. When the power supply is mounted on the base, a small electronic device is used. Therefore, the capacity of the built-in secondary battery is limited. Therefore, the ring part containing precious metal (width Instead of a ring less than 5mm wide, it is designed as a wide, band-shaped ring (5mm or wider) that fits snugly against the skin of one finger. The battery capacity is secured by arranging one or more secondary batteries in a way that surrounds the main battery.

[0020] Furthermore, if the material that comes into contact with your fingers contains lead or other metals, it may cause a metal allergy. Gold, silver, aluminum, plastic, silicone rubber, etc., are used as materials for the ring portion. Because rechargeable batteries can generate heat, to ensure that your finger doesn't feel the heat when wearing them, use a ring. The materials used in the part include titanium, platinum, plastic, and silicone rubber, which have low thermal conductivity. Yes, they are.

[0021] Multiple small rechargeable batteries can be placed around the finger, or they can be arranged in a curved shape. A thin secondary battery having a specific shape may be provided.

[0022] Furthermore, the thickness of a person's fingers is easily affected, for example, the size can change slightly between morning and night. The ring part is made of a more flexible material than precious metal (silicone rubber, polyethylene). It is best to form it with refractate, polyethylene, leather, etc. Even in that case, the ring It is preferable that the internal secondary battery etc. be deformable. Using batteries can make the device more comfortable for the user.

[0023] One aspect of the invention disclosed herein comprises a ring portion and a display portion fixed to the ring portion. The ring portion has a strip-shaped area, and the ring portion contains a secondary battery inside, and the secondary battery is The display unit is electrically connected, the ring part uses a flexible material, and the secondary battery is the positive electrode. It is an electronic device in which the negative electrode is surrounded by a film.

[0024] In the above configuration, the display unit has a top surface and a first side surface that is in contact with at least one side of the top surface. , has, the first side surface has a curved surface, the upper surface is provided with a first display area, the first side A second display area is provided, and the first display area and the second display area are provided in a continuous manner. It is possible to expand the display area by providing a display area on the side as well.

[0025] Furthermore, the cross-sectional shape of the finger is elliptical, the thickness of the finger is not uniform, and the joints are thicker. Therefore, to fit on a finger, it is preferable to choose a size that passes over the widest part of the finger. If the circumference is between 47mm and 60mm, the inner diameter of the ring-shaped frame, that is, approximately the circumference of the finger. It can be said that the diameter is between 15mm and 19mm.

[0026] Furthermore, it is preferable that the display section of a ring-type information terminal has a curved surface. When a touch input section is provided for operation input, the display section of the ring-type information terminal is small. However, the display area is limited. Therefore, if the display unit is only flat, it can be operated with a fingertip. It is difficult to manufacture. Therefore, a display unit with a curved surface, for example, a display with a curved side If it is a separate unit, the screen scrolling operation is performed using the touch input area on the side, which is part of the display unit. By performing the confirmation input on the touch input area on the top surface, which is part of the display, various types of operation input become possible. For example, a ring-type information terminal is worn on the left finger, and the side of the display is touched with the right thumb. By doing so, the number displayed on the top of the display unit can be scrolled using the side to display the number By changing the position and touching the top surface with the index finger of the right hand, the desired number can be selected and entered. Phone numbers and other information can also be entered manually.

[0027] In a small information terminal designed to be worn on the fingers, where size is limited, a curved surface is incorporated into a portion of the display. Allowing users to hold the device and perform complex touch inputs with their fingertips is beneficial for them.

[0028] Furthermore, the structure of the ring-type information terminal consists of a ring part, a base fixed to the ring part, and a base The display unit is not limited to being fixed to the ring. For example, the display unit may be mounted directly on the ring. Furthermore, a removable attachment is provided on the base, allowing for compact storage even when the attachment is removed. It may also function as an information terminal. Furthermore, a rotating mechanism may be provided between the base and the ring section, and the display section The orientation can also be changed according to the direction of the user's finger, and the side of the display unit can be touched. If you want to improve performance, for example, right-handed and left-handed users can choose their preferred display orientation and input operation. It can be created.

[0029] If a ring-type information terminal is designed to be separable into a ring part and a display part, the display part can be removed. Making it removable would make charging and maintenance such as repairs easier. In addition to having a secondary battery built into the main unit, the display unit also has a secondary battery built in, allowing it to power other devices as well. If configured to supply power, it can also function as a backup battery for other information terminals. It is possible. Because it is a small electronic device, the capacity of the built-in secondary battery is limited. Therefore, By replacing the entire ring-shaped rechargeable battery in the seat, it is possible to extend the usage time.

[0030] Furthermore, if the ring and display parts can be separated, the speaker can be placed in the ring-type information terminal. If an attachment part that is worn on the ear is provided, the microphone can be placed on the ring part and the ring By bringing the finger wearing the device close to your mouth while talking, it can also be used as a telephone.

[0031] Furthermore, since the capacity of the built-in rechargeable battery is limited, if the battery capacity becomes insufficient... To address this, a connector is needed to connect a power supply cord from another information terminal, Alternatively, an antenna capable of wireless charging may be provided on the ring-type information terminal.

[0032] Furthermore, the ring-type information terminal is not limited to being used independently, but can be used in combination with other electronic devices. They can also be used together. For example, when using a head-mounted display device, the user To perform input operations, wear a ring-type information terminal on one or both hands and illuminate the information. The display unit of the terminal is sensed by an optical sensor installed on a head-mounted display device. The system recognizes the position of the hand being held and uses the hand's movements to perform input operations.

[0033] Among head-mounted display devices, the field of view is limited by covering the field of view of both eyes and its surroundings. In the case of a type that displays images, the device is operated using operation buttons or voice commands. As a result, the cover prevents you from seeing your surroundings while you are operating it. However, a ring-type information terminal is worn on one or both hands, and the display part of the illuminated information terminal is... It's also possible to sense the hand's position and overlay it on the video display.

[0034] The ring-type information terminal is a flexible display device equipped with a touch input area (achieving low power consumption). An active-matrix display device having organic light-emitting elements that can be bent By combining it with a thin secondary battery, it has been achieved for the first time, resulting in a lightweight and compact design. It is now possible to do so. [Effects of the Invention]

[0035] According to one aspect of the present invention, a novel electronic device can be provided. Or, according to one aspect of the present invention This allows us to provide electronic devices with novel forms.

[0036] Alternatively, according to one aspect of the present invention, a novel display device can be provided. One aspect of the invention can provide a display device having a novel form.

[0037] Alternatively, according to one aspect of the present invention, a novel input device can be provided. One aspect of the invention can provide an input device having a novel form.

[0038] Alternatively, according to one aspect of the present invention, an electronic device can be provided that is worn on the fingers of the hand. Cut.

[0039] Alternatively, according to one aspect of the present invention, a power storage device that is worn on the fingers of the hand may be provided. can.

[0040] Furthermore, the description of these effects does not preclude the existence of other effects. One embodiment does not necessarily have to possess all of these effects. Furthermore, other effects may be considered. This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings It is possible to extract effects other than those mentioned above from the descriptions in the surfaces, claims, etc. [Brief explanation of the drawing]

[0041] [Figure 1] A perspective view, a top view, and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 2] A perspective view, a top view, and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 3] A perspective view, a top view, and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 4] A perspective view, a top view, and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 5] A cross-sectional view showing a method for manufacturing an electronic device according to one embodiment of the present invention. [Figure 6] A top view and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 7] A perspective view showing an electronic device according to one embodiment of the present invention, and a diagram showing how it is mounted. [Figure 8] A perspective view showing an electronic device according to one embodiment of the present invention. [Figure 9] A figure illustrating one aspect of the present invention. [Figure 10] A perspective view, a top view, and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 11] A schematic diagram showing an application example when multiple electronic devices according to one embodiment of the present invention are mounted. [Figure 12] A perspective view showing one aspect of the present invention. [Figure 13]A top view and a cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 14] A diagram showing an example of a display unit according to one embodiment of the present invention. [Figure 15] An example of the configuration of a display panel according to an embodiment. [Figure 16] An example of the configuration of a display panel according to an embodiment. [Figure 17] A diagram showing an example of a display panel according to an embodiment. [Figure 18] A diagram showing an example of a display panel according to an embodiment. [Figure 19] A diagram showing the external appearance of a storage battery according to one embodiment of the present invention. [Figure 20] A cross-sectional view of a storage battery according to one embodiment of the present invention. [Figure 21] A diagram illustrating the radius of curvature of a surface. [Figure 22] A diagram illustrating the radius of curvature of film. [Figure 23] A perspective view and a top view showing an electronic device according to one embodiment of the present invention. [Figure 24] A perspective view and a top view showing an electronic device according to one embodiment of the present invention. [Figure 25] A perspective view and a top view showing an electronic device according to one embodiment of the present invention. [Figure 26] A cross-sectional view showing an electronic device according to one embodiment of the present invention. [Figure 27] A perspective view showing an electronic device according to one embodiment of the present invention. [Figure 28] A block diagram illustrating one aspect of the present invention. [Figure 29] A conceptual diagram illustrating one aspect of the present invention. [Figure 30] A circuit diagram illustrating one aspect of the present invention. [Figure 31] A circuit diagram illustrating one aspect of the present invention. [Figure 32] A conceptual diagram illustrating one aspect of the present invention. [Figure 33] A block diagram illustrating one aspect of the present invention. [Figure 34] A flowchart illustrating one aspect of the present invention. [Modes for carrying out the invention]

[0042] The embodiments of the present invention will be described in detail below with reference to the drawings. However, the present invention is... Not limited to the following description, the form and details can be modified in various ways, as any person skilled in the art would know. This is easily understood. Furthermore, the present invention shall be interpreted as being limited to the contents of the embodiments described below. It's not something that can be done.

[0043] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0044] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. stomach.

[0045] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0046] Furthermore, the words "membrane" and "layer" can be used interchangeably depending on the context or situation. Accordingly, they can be interchanged. For example, the term "conductive layer" can be replaced with "conductive layer". In some cases, the term can be changed to "film." Or, for example, "insulating film." In some cases, it may be possible to change the term to "insulating layer."

[0047] In this specification, "parallel" means that two lines are positioned at an angle of -10° or more and 10° or less. This refers to a state in which it is in a certain condition. Therefore, it also includes cases where the angle is between -5° and 5°. Also, "abbreviated "Parallel" refers to a state where two straight lines are positioned at an angle between -30° and 30°. Furthermore, "perpendicular" refers to a state where two straight lines are positioned at an angle between 80° and 100°. This refers to the case where the angle is between 85° and 95°. Furthermore, "approximately perpendicular" means This refers to a state where two straight lines are positioned at an angle between 60° and 120°.

[0048] In this specification, a connector, for example, FPC (F) is used for the display panel (display device). (lexible printed circuit) or TCP (Tape Car A module with a rier package attached, and a printed circuit board at the end of the TCP. A module equipped with COG (Chip On) or a substrate on which display elements are formed. Modules in which ICs (integrated circuits) are directly mounted using the glass method include a display device. There are cases where this is the case.

[0049] (Embodiment 1) This embodiment shows an example of an electronic device 100 according to one aspect of the present invention. The electronic device 100 is For example, it can be worn on the fingers.

[0050] Figure 1(A) is a perspective view of the electronic device 100. The electronic device 100 includes a display unit 102 and It has a ring portion 125. The electronic device 100 may also have a housing 126. As shown in 1(C) and (D), the display unit 102 is provided, for example, in contact with the outside of the housing 126. It can be done. Also, if the display unit 102 is provided in contact with the outside of the housing 126, it can be further displayed. A second housing may be provided adjacent to the outside of the display unit 102. Alternatively, a protective housing may be provided on the display unit 102. You may also provide bars or similar structures.

[0051] The display unit 102 has a display area on a flexible film. The display area contains light-emitting elements. A child is provided. In addition, the display unit 102 is made of one or more flexible films. It may have a drive circuit.

[0052] Figure 1(B) is a top view of the electronic device 100. Figure 1(C) is a point shown in Figure 1(B). Figure 1(D) shows the cross-section of the dashed line A-B, and Figure 1(B) shows the cross-section of the dashed line C-D, respectively. As shown below, in Figure 1(B), the dashed line A-B and the dashed line C-D are approximately perpendicular to each other. ru.

[0053] As shown in Figures 1(A) and 1(C), the display unit 102 has an upper surface and at least the upper surface It has a first side surface that is in contact with one side. The connection part with the ring is used as a base, The top surface is defined as the outermost surface of the display unit that overlaps the seat. Furthermore, the first side surface is curved. Furthermore, the display unit 102 has a curved surface and a second side that is substantially opposite to the first side. It is also possible that the display unit 102 has a back surface that faces a part of the top surface.

[0054] The first and second sides have the shape of a part of the side of a cylinder or elliptical cylinder, for example. This is also acceptable. Furthermore, the first and second sides are, for example, curved surfaces whose radius of curvature changes continuously. It may have the following characteristics. Also, the shape of the first side and the second side may be such that the top surface is visible from the side or the side It is preferable to have a curved surface such that the slope of the tangent line changes continuously from the bottom surface. The first side and the second side have corners between them, for example, the top surface and the side, or between the side and the bottom surface. Furthermore, it is preferable that these surfaces are continuous.

[0055] Furthermore, the shapes of the first and second sides are obtained by deforming the plane without stretching or compressing it. It is preferable that it has a developable surface.

[0056] Here, we have described an example in which the display unit 102 of the electronic device 100 has two sides, The display unit 102 may have three or more sides.

[0057] Furthermore, in Figure 1(A), the protrusion on the first side surface of the display unit 102 is the ring unit 12 The convex portion of the curved surface of 5 has a different direction of curvature, for example. Also, in Figure 1(C), The first and second sides are, for example, the curvature of the ring portion 125 along the dashed line A-B. It includes the part that is roughly perpendicular to the direction.

[0058] Furthermore, as shown in Figure 1(C), the electronic device 100 includes a circuit board 106 and a circuit board 107 It is preferable that the following are present. Circuit boards 106 and 107 are located inside the housing 126. It is preferable that it be located in the section.

[0059] As the circuit board 106, for example, wiring is provided on a flexible resin film, F PC (Flexible Printed Circuit Board) t) can be used. The circuit board 106 provides electrical power to, for example, the drive circuit of the display unit. It is preferable to connect to it.

[0060] The circuit board 107, for example, when the electronic device 100 has a storage battery, connects the storage battery to the electrical It is preferable to connect to a battery. Also, the circuit board 107 is for power supply from a battery, for example. It is preferable that a converter circuit be provided.

[0061] The display unit 102 has a display panel. The display unit 102 also has a touch sensor on its surface. It is preferable to have a s.

[0062] The display panel has a display area on a flexible film. The display area has a light-emitting element. A is provided. In addition, the display panel is mounted on a flexible film and has one or more drive elements. It may have a circuit.

[0063] Furthermore, the touch sensor in the display unit 102 may be, for example, a sheet-shaped capacitive type. The touch sensor can be mounted on top of the display panel. As for the capacitive method, There are various types of capacitance, including surface capacitance and projected capacitance.

[0064] Projected capacitance systems are classified into self-capacitance and mutual-capacitance types, mainly based on differences in their driving methods. There are several advantages. Using a mutual capacitance method is preferable because it enables simultaneous multi-point detection.

[0065] Alternatively, the display panel itself may have a touch sensor function, so to speak. An in-cell type touch panel may be used. As an in-cell touch panel, electrostatic capacitors may be used. A quantitative touch sensor may be used, or an optical touch sensor using a photoelectric conversion element may be used. The following may be applied: It may be mounted on 100. Also, the electronic device 100 may have other sensors in addition to the touch sensor. (Pulse sensor, temperature sensor, location detection sensor (GPS, etc.), accelerometer, and angle sensor) It may have a speed sensor.

[0066] As shown in Figure 1(D), the display unit 102 and the housing 126 are mounted on the ring portion 125. It is preferable that this be done.

[0067] The electronic device 100 can be used, for example, by being worn on the fingers. (Figure 1(A) and ( As shown in D), the ring portion 125 of the electronic device 100 is, for example, shaped to conform to the fingers. It is preferable to do so.

[0068] Furthermore, the ring portion 125 preferably has a rounded surface. 25 preferably has a shape that follows the side of an elliptical cylinder, for example. Also, for example, a ring The shape of part 125 is not limited to a ring shape, but can also be an arch shape or a shape resembling the letter "C". It may have an eel shape, an oval shape, or a shape resembling a partially cut-off oval.

[0069] Furthermore, it is preferable that the ring portion 125 is flexible. This makes it easier to attach and detach the ring portion 125 from the fingers, for example. When attaching or detaching the sub-device 100, most of the cross-sectional area has a large radius of curvature. It is preferable that the shape does not deform, but rather has a shape that bends at the ends.

[0070] The housing 126 may, for example, be flexible. The display unit 102 can be bent in the direction of CD, for example, as shown in Figure 1. By bending 102, the display part 102 may be damaged, for example when attaching or detaching it from the fingers. This may make it less likely to occur, which is preferable.

[0071] For the housing 126, for example, glass, quartz, plastic, flexible plate, or resin can be used. Examples include laminated films, paper containing fibrous materials, or base films. An example is glass. Examples include barium borosilicate glass, aluminoborosilicate glass, or soda-lime glass. Examples include lath, etc. Flexible substrates, laminated films, and base films are examples of The following are examples: For example, polyethylene terephthalate (PET), polyethylene Lennaphthalate (PEN), polyethersulfone (PES), polytetrafluoroethylene There are plastics such as ethylene (PTFE). Or, as an example, acrylic. Examples include synthetic resins such as polypropylene, polyester, and poly Examples include vinyl fluoride or polyvinyl chloride. Alternatively, as an example, polyamide, Examples include liimide, aramid, epoxy, or inorganic vapor-deposited films. Also, metals and stainless steel are used. Stainless steel, stainless steel foil plate, tungsten, tungsten... A foil-containing plate, paper, or semiconductor (e.g., single crystal or silicon) may be used.

[0072] Materials that can be used for the ring portion 125 include gold, silver, aluminum, and plastic. Materials such as silicone rubber, polyethylene terephthalate, polyethylene, and leather are used. Because rechargeable batteries can generate heat, to ensure that your finger doesn't feel the heat when wearing them, use a ring. The material of part 125 is titanium, platinum, plastic, silicone rubber, etc., which have low thermal conductivity. Use "do".

[0073] The secondary battery is installed inside the casing or inside the ring portion 125. The secondary battery is placed around the finger. Multiple small rechargeable batteries may be used as the battery, or a thin rechargeable battery with a curved shape may be used. A pond may be constructed.

[0074] Furthermore, the thickness of a person's fingers is easily affected, for example, the size can change slightly between morning and night. The material of the ring part 125 is a more flexible material than precious metal (silicone rubber, polyethylene) It is best to form it with lenterephthalate, polyethylene, leather, etc. It is preferable that the secondary battery or the like provided inside the ring portion 125 is deformable. And, as a secondary battery provided inside the ring portion 125, a bendable secondary battery is provided. Using it can make the wearer's experience more comfortable.

[0075] Furthermore, alloy materials with high elasticity may be used, for example, zirconium, copper, and nickel. An amorphous alloy containing titanium (also called metallic glass) is used. This amorphous alloy is heated at room temperature. It is an amorphous alloy having a glass transition region, and is also called a bulk solidified amorphous alloy. It is an alloy with a substantially amorphous atomic structure. By solidification casting, at least some of the housings The alloy material is cast into the mold and solidified to form a portion of the housing from bulk solidified amorphous alloy. Amorphous alloys include not only zirconium, copper, nickel, and titanium, but also beryllium and silicon. Niobium, boron, gallium, molybdenum, tungsten, manganese, iron, cobalt, i It may also contain vitrium, vanadium, phosphorus, carbon, etc. Note that an alloy is a single solid. The alloy includes both a complete solid solution alloy having a phase structure and a partial solution having two or more phases. By using an amorphous alloy for the ring portion 125, a housing with high elasticity can be realized. By using an amorphous alloy, a flexible yet high-strength ring portion 125 can be realized. It can be used. Furthermore, amorphous alloys can also be used for the housing 126.

[0076] Furthermore, as a material that can be used for the ring portion 125, it can also be used for the housing 126. You may use a description of the material, and if the same material is used for the housing 126 and the ring portion 125, the joint The design is inconspicuous and prevents uneven wear on the contact surface.

[0077] A modified example of the cross-section shown in Figure 1(C) is shown in Figure 26. In Figure 1(C), the cross-section of the side of the display unit is In contrast to the semi-circular shape, Figure 26(A) shows a cross-section of the side of the display unit that follows a quarter-circle shape. An example having the above is shown. Also, as shown in Figures 26(B) and (C), one side of the display unit One side may be a plane, and the other a curved surface. In Figure 26(B), the side with the curved surface is a semicircle. It has a cross-section that follows a curve, and in Figure 26(C), the curved side surface has a cross-section that follows a quarter circle.

[0078] Figure 2(A) is a perspective view of the electronic device 100. Figure 2(B) is a top view of the electronic device 100. Figure 2(C) shows a cross-section along the dashed line A-B shown in Figure 2(B), and Figure 2(D) shows Figure 2 The cross-sections along the dashed lines C-D shown in (B) are shown. The electronic device 100 shown in Figure 2(A) It has a display unit 102, a housing 126, and a ring unit 125. The display unit 102 is curved It has a first side surface which has a surface. The display section 102 also has a curved surface which is roughly opposite to the first side surface. It may have a second aspect that is compatible with it. Compared with the electronic device 100 shown in Figure 1(A), In 2(A), the orientation of the display unit 102, as viewed from above, is different by, for example, 90°. Also, in Figure 2(D) In this case, for example, the first side and the second side have surfaces that are approximately perpendicular to the dashed line C-D. .

[0079] As shown in Figures 1(A) and 2(A), the display unit 102 has, for example, a roughly quadrilateral top surface, It has a first side surface and a second side surface that are in contact with two opposite sides of the top surface.

[0080] Here, the top surface is display area 151, the first side surface is display area 152, and the second side surface is display area 1 It is preferable to set it to 53 and provide multiple display areas.

[0081] Furthermore, the display area 152 has a first side surface and the upper surface of the display unit 102 adjacent to the first side surface. It may be provided across two surfaces, including the bottom surface. Also, the display area 153 is on the second side surface and It may also be provided across two surfaces: the second side, adjacent to the lower surface, and facing the upper surface. stomach.

[0082] With this configuration, the display is only shown on the top surface of the display unit 102, unlike conventional electronic devices. Instead, it becomes possible to display information on the sides as well. In particular, two or more of the display units 102 Providing a display area along the sides is preferable because it increases the versatility of the display.

[0083] A display area 151 is provided on the upper surface of the display unit 102, and each display area is arranged along the side. Each area may be used as an independent display area to display different images, etc., or either one of them A single image or the like may be displayed across two or more display areas. For example, the display unit 102 The image to be displayed in the display area 151 provided on the top surface is provided along the side surface of the display unit 102. The display area 152 may be displayed continuously.

[0084] Furthermore, in the display unit 102 of the electronic device, the first side surface and the second side surface have curved surfaces. When a display area is provided, the display area is provided only on the upper surface of the display unit 102. In comparison, the area of ​​the display region of the display unit 102 can be increased.

[0085] Modified cross-sections shown in Figures 1(B) and (C) are shown in Figures 13(A-1) and (B-1). As shown in Figures 13(A-1) and (B-1), the width 201 of the display unit 102 is a ring. It is wider than the width 202 of section 125. Also, the width 203 of the top surface of the display section 102 is wider than the width of the ring section 12 It is narrower than the width of 202 for a 5.

[0086] Another modified example of the cross-section shown in Figures 1(B) and (C) is shown in Figures 13(A-2) and (B-2) As shown in Figure 13(A-2) and (B-2), the width 201 of the display unit 102 is The width of the ring section 125 is wider than the width 202. Also, the width 203 of the top surface of the display section 102 is wider than the width of the ring section The width of 125 is wider than the width of 202. Here, the width of the top surface of the display unit 102 is 203, which is wider than the width of the ring unit 125. If the width is made wider than the width of the fingers, for example, when worn on the fingers, it may be more likely to come into contact with a part of the finger. Yes, even in such cases, the side surface of the display unit 102 is curved and rounded. Therefore, it can achieve a high level of wearability.

[0087] Figure 8 shows an example of the usage state of the display unit 102 of the electronic device 100 shown in Figures 1 and 2. This is shown. In Figure 8(A), the display area 151 provided on the upper surface of the display unit 102 displays image information. Report 167, text information 162, and multiple icons associated with applications, etc. It displays 161, etc. The display area 152 provided on the side of the display unit 102 displays app It displays icons 161 associated with applications, etc. Also, display area 1 Buttons 52 and 100 for power control of electronic devices, and buttons for locking and turning on the screen. It is preferable to provide buttons or similar controls. These buttons should be operable by touch sensors. This is preferable. By using buttons that can be operated by touch sensors, mechanical buttons Compared to the case where a physical button is provided, the button part and the connection to the button The volume occupied by the surrounding part can be made smaller. Therefore, the electronic device 100 This is preferable because it allows for a thinner thickness. By making the electronic device 100 thinner... For example, it can improve wearability on fingers, etc. Also, the electronic device 100 has touch controls. It may have both sensor-operable buttons and mechanical buttons.

[0088] Furthermore, for example, when a phone call is received or an email is received, not only the display area 151 but also the display area In the display area provided along the sides of area 152, etc., caller information (for example, the caller's name, The configuration may also display phone numbers, email addresses, etc. In Figure 8(A), email This example shows a case where the caller information is displayed in the display area 152 upon receipt. ru.

[0089] Furthermore, as shown in Figure 8(B), image information is continuously displayed in display areas 151 to 153. Report 167 and icon 161 may be displayed. Display areas 151 to 153 are linked. By using it as a continuous display area, a wider display area can be used. For example, compared to the case where only the display area 151 is used to display image information 167, etc. Furthermore, the display area can be viewed from a wider angle, improving visibility.

[0090] Furthermore, a circular or elliptical display area may be used as the display area of ​​the display unit 102. Figure 25(A) shows a top view of the display unit 102 before it is installed in the housing 126. Figure 25(B) Figures (F) through (F) indicate an electronic device 100 equipped with a display unit 102 having a circular display area. Of 25(B) through (F), Figure 25(D) has three circular display areas (display area An example is shown with area 151, display area 152, and display area 153), and other figures are circular. The display area shown has two display areas (display area 151 and display area 152). Display areas 152 and 153 have curved surfaces. In Figure 25(B), the top surface and the top surface In Figure 25(C), the side surface has a curved surface tangent to the right-hand side, and the top surface and the curved surface tangent to the left-hand side of the top surface are The side surface has, in Figure 25(D), a curved surface that is tangent to the top surface and the left and right edges of the top surface. In Figure 25(E), the upper surface and the side surface having a curved surface tangent to the lower edge of the upper surface, and in Figure 25(F), This example shows a display area provided on the top surface and on the side surface which has a curved surface in contact with the top edge of the top surface.

[0091] Furthermore, during standby time when electronic devices are not in use, it is provided along the upper surface of the display unit 102. The display area 151 is turned off (for example, black display), and the display area provided along the side Information may be displayed only in areas such as 152. By preventing the display of "1," power consumption during standby can be reduced.

[0092] Furthermore, the electronic device 100 does not necessarily need to have a display area 153.

[0093] Furthermore, the electronic device 100 may have buttons. Figure 23(A) shows the electronic device shown in Figure 1(A). Figure 23(B) shows an example in which the sub-device 100 has a button 128. A top view of the sub-device 100 is shown. Also, Figures 23(C) and (D) are shown in Figures 23(A) and (B). Enlarged views of the areas enclosed by dashed lines are shown. Figures 23(A) through (D) show button 128. The image shows an example of a button called a crown, but the shape and function of the button are not limited to this example.

[0094] Figure 24(A) shows an example in which the electronic device 100 shown in Figure 2(A) has a button 128. Figure 24(B) shows a top view of the electronic device 100 shown in Figure 24(A). Furthermore, the electronic device 100 may have a button 128 on its side. For example, the button 128 could be... The aforementioned mechanical buttons may also be used.

[0095] Furthermore, a modified example of the electronic device 100 shown in Figure 2(A) is shown in Figure 27. In Figure 27, a curved surface A notch is provided in a portion of the first side having the upper half, and a button 1 is placed in that area. An example of setting up 28 is shown.

[0096] Figure 9(A) shows an example of the electronic device 100 being worn on the index finger of the left hand. Also, Figure 9(B) Figure 9(A) shows an enlarged view of the area enclosed by the dashed line of the electronic device 100.

[0097] For example, by displaying the sender information, etc., when receiving an email in the display area 152, It's easy to see.

[0098] Alternatively, the display area 153 may be used as illumination, for example, as shown in Figure 9(B).

[0099] The display unit 102 of the electronic device 100 shown in Figures 1 and 2 is located on the outside of the housing 126. Here, we show an example where there is no contact, or at least some contact. Here, as shown in Figure 3, the display unit 102 is connected to the housing 126 It may be installed inside the housing 126. If the display unit 102 is installed inside the housing 126, It is preferable that it is translucent.

[0100] Figure 3(A) is a perspective view of the electronic device 100. Figure 3(B) is a top view of the electronic device 100. Figure 3(C) shows a cross-section of the dashed line A-B shown in Figure 3(B), and Figure 3(D) shows Figure 3 The cross-sections of the dashed line CD shown in (B) are shown. The electronic device 100 has a display unit 102 and It has a housing 126, a circuit board 106, and a circuit board 107. The display unit 102 is curved It has a first side surface which has a surface. The display section 102 also has a curved surface which is roughly opposite to the first side surface. It may have a second aspect that complements it. As shown in Figures 3(C) and (D), the display unit 1 02 is located at least partially inside the housing 126. Also, the circuit board 106 and The circuit board 107 is preferably located inside the housing 126. It is preferable to electrically connect this to the display unit 102.

[0101] By placing the display unit 102 inside the housing 126, a robust structure can be achieved, and it can withstand impacts. The display unit 102 may be less likely to break if it comes into contact with another object due to downward movement or collision.

[0102] Figure 4(A) is a perspective view of the electronic device 100. Figure 4(B) is a perspective view of the electronic device 100. This is a top view. Figure 4(C) shows the cross-section along the dashed line A-B shown in Figure 4(B), and Figure 4(D) These show the cross-sections along the dashed line C-D in Figure 4(B). In Figure 4(A), The indicator part 102 has a roughly quadrilateral top surface, and the first side to the fourth side are in contact with the four sides of the top surface. It has four sides. The first to fourth sides have curved surfaces. Also, the first side and The second side has a plane that is approximately perpendicular to the dashed line A-B, as shown in Figure 4(C), The third and fourth sides are roughly perpendicular to the dashed line C-D, as shown in Figure 4(D), for example. It may have a straight surface. Display areas are provided on the top surface and the first to fourth side surfaces. This is preferable because it increases the diversity of the display.

[0103] Character information 164 and the like are displayed across multiple display areas of the electronic device 100 (movement It can also be displayed in a moving manner. In this way, the display unit 102 can be displayed across two or more surfaces. By displaying information, users can see the information regardless of the orientation of the electronic device, for example, when receiving an incoming call. This can prevent you from missing out.

[0104] Here, as shown in the example in Figure 6, in the electronic device 100, the end of the ring portion 125 is the housing They may be positioned facing each other with the body 126 in between. Figure 6(A) shows the top view of the electronic device 100. Figures are shown, and Figures 6(B) and (C) are shown in Figure 6(A) by dashed lines AB and CD. This is a cross-section. Figure 6(D) shows a top view of the electronic device 100, and Figures 6(E) and (F) show a top view of the electronic device 100. ) is a cross-section shown by the dashed lines AB and CD in Figure 6(D). Figures 6(A) to (C Figure 6 shows an example in which the ring portion 125 is provided in contact with the lower surface of the housing 126. D) to (F) show examples in which the ring portion 125 is provided in contact with the side surface of the housing 126.

[0105] Figure 7(B) shows an example of a ring-shaped electronic device 101 being worn on a finger.

[0106] Electronic device 101 is an example of a device with a slightly different configuration from electronic device 100, as shown in Figure 7(A). The display unit 109 has a curved surface, and the electronic device 101 has a cylindrical housing 105 at its end. It is a device. The cylindrical housing 105 can also be called the ring part. The housing 105 is made of silicone rubber. Flexible materials such as lum are used, and the display section 109 uses a plastic film. A passive-matrix or active-matrix display device using electroluminescent elements is used. It is. Also, the display unit 109 is flexible and overlaps with at least a portion of the display unit 109. Furthermore, a thin secondary battery is provided between the display unit 109 and the fingers 116. The secondary battery is A lithium-ion rechargeable battery sealed with a laminate film is used.

[0107] Furthermore, Figure 7(C) shows a ring-shaped electronic device 101 worn on the finger, along with another device 117. For example, this shows an example of a watch or a watch-type information terminal worn on the wrist. A wireless signal is transmitted from device 117. By sending a message, the electronic device 10 can change the display of the ring-shaped electronic device 101. A transmitting and receiving circuit may be provided in 1. Also, if the capacity of either secondary battery decreases, Power may be supplied wirelessly to one side, or by connecting with a power cord or similar device.

[0108] Figure 10(A) shows an example of a perspective view of the electronic device 100. Figure 10(B) is a comparison of Figure 10(A). Figure 10(C) shows a top view of the electronic device 100. Figure 10(C) is shown in Figure 10(B) with a dashed line AB. Figure 10(D) shows a cross-section of the area enclosed by the dashed line in Figure 10(B). In the example shown in Figure 10(B), the cross-section of the electronic device 100 is annular. Display unit 10 2 is a display area 151 having an arched cross-section, and is located adjacent to the display area 151, The display area 152 has a curved surface extending from the side to the back of the display section 102.

[0109] Note that in Figure 10, the display area is provided only on the side of the display unit 102, but on both sides A display area may be provided. For example, adjacent to display area 151 and facing display area 152 A third display area may be provided.

[0110] Furthermore, as shown in Figure 10(D), the ring portion 125 of the electronic device 100 contains a display unit. FPC104 electrically connected to 102, and circuit board 1 electrically connected to FPC104. It is preferable to have 07 and a storage battery 108 that is electrically connected to the circuit board 107.

[0111] Here, as the storage battery 108, for example, a thin storage battery using a laminate film for the outer casing. A pond can be used. By using a flexible laminate film for the exterior, This allows for a flexible storage battery 108. Furthermore, as a storage battery 108, Button-type (or button-type), rectangular, cylindrical, etc. batteries can be used. Figure 10(D) shows an example in which a flexible, thin storage battery is used as the storage battery 108. They are doing it.

[0112] Furthermore, in the example of the electronic device 100 shown in Figures 1 to 6 and Figure 9, the electronic device 10 0 preferably has a storage battery. For the storage battery, refer to the description of storage battery 108. This is sufficient. Here, by using a flexible, thin storage battery as the storage battery 108, Here, by using a flexible, thin storage battery 108, The battery can be positioned to conform to the curved surfaces of the display unit 102 and the housing 126. Because the battery 108 is flexible, it is easily deformed. Other components, such as circuits, can be easily deformed. After placing circuit boards 106 and 107, etc., it deforms to fit the remaining space and stores energy. A pond 108 can be placed. Therefore, the thickness of the electronic device 100 can be reduced. This may be the case, which is preferable.

[0113] Next, an example of a method for manufacturing the electronic device 100 will be explained using Figure 5. Figure 5(A-1) (A-3) shows the cross-section of the electronic device 100 shown in FIG. 1(C), and FIGS. 5(B-1) to (B-3) show a method of fabricating the cross-section of the electronic device 100 shown in FIG. 1(D).

[0114] First, as shown in FIGS. 5(A-1) and (B-1), a display unit 102 and a housing 126 are prepared. Here, an example where the housing 126 has an opening is shown, but the housing 126 may not have an opening . The housing 126 has a rounded portion 136 in the cross-section shown in FIG. 5(A-1). A circuit board 106 is connected to the display unit 102. Also, the display unit 102 has flexibility . The method of fabricating the flexible display unit 102 will be described later

[0115] Next, as shown in FIG. 5(A-2), the display unit 102 is provided so as to be wound around the outside of the housing 126 along the A-B direction . Here, for example, an adhesive layer may be provided between the housing 126 and the display unit 102, and the display unit 102 may be adhered to the outside of the housing 126 . By providing the display unit 102 so as to contact the outside of the housing 126 having the rounded portion 136, a display unit 102 having a curved surface on the side surface can be formed .

[0116] Next, as shown in FIGS. 5(A-3) and (B-3), the display unit 102 provided outside the housing 126 is provided on the ring portion 125 . Here, for example, an adhesive layer may be provided between the display unit 102 and the ring portion 125, and the display unit 102 and the ring portion 125 may be adhered .

[0117] By the steps shown above, the electronic device 100 shown in FIGS. 1 to 4 can be fabricated

[0118] Also, regarding the case where the display unit 102 is provided in the electronic device 100 shown in FIG. 10(A), FIG. 14 Further explanation will be provided using the following. Figure 14(A) is a top view of the display unit 102. The display unit 102 is, It is preferable to have a display area 151 and a display area 152. A display area having a curved surface When providing 152, prepare a housing 126 having curved sides, and along the sides of housing 126 The display unit 102 can be modified as shown. Also, for example, in the display unit 102, Figure 14( As shown in B), a cut 135 may be provided in the area where the display area 152 is provided. By providing 135, wrinkles and other defects may be less likely to occur in the display area 152, which is preferable. It seems so.

[0119] Next, Figure 11(A) shows an example in which electronic devices are attached to each of the five fingers 116 of the left hand. The display unit 109 can illuminate to display an image, and the position of the illumination of this display unit 109 The movement of the fingers 116 is acquired as data by sensing them using an image sensor or the like. This is possible. In particular, the display unit 109 can be illuminated even in dark places, so imaging Location can be determined by means of a device.

[0120] Furthermore, in Figure 11(B), the electronic device attached to the fingers is connected to another device 118, for example. When placed on the display unit 119 of the tablet information terminal, the light sensor built into the display unit 119 This shows an example of determining the position by sensing the light emitted from the display unit 109. In this case, it is also possible to perform input operations on a tablet information terminal without physical contact. .

[0121] Furthermore, in Figure 11(C), the image sensor 121 of the glasses-type electronic device 122 is used to... This shows an example of inputting data into a bullet information terminal. It also shows an electronic device worn on the fingers. It is placed on top of the device 118, for example, the display unit 119 of a tablet information terminal. This indicates that the image is captured so that it overlaps with the image sensor 121, and when worn on the finger... Even if the distance between the electronic device and the display unit 119 of the tablet information terminal is large, the image sensor 12 This example shows how device 1 determines its position by sensing the light emitted from the display unit 109. In this case as well, it is possible to perform input operations on the tablet information terminal without physical contact. It is possible. Also, although an example using a tablet information terminal was shown here, it is possible to use a projector, etc. Even if it's a display shown on a screen, it's the same as the display on an electronic device worn on the fingers. The position of part 109 can be associated with its position on the screen. Also, one person This is not limited to input operations using multiple ring-shaped information terminals, but also includes input operations performed by multiple people. It is also possible for multiple people to wear multiple electronic devices on their fingers and move their hands, You can also enjoy games and other content on a shared display screen.

[0122] The screen size when a display unit 102 is provided on the electronic device 100 will be explained. Since it is between 47mm and 60mm, the screen size (X x Y) is at most X = 47mm, which is the circumference of the finger. The dimensions are between 60mm and 20mm, and Y = 30mm or more. Note that the screen size referred to here is... The size refers to the size of a flat screen, not the size when the surface is curved. Furthermore, multiple display units may be provided in a single electronic device, for example, one smaller than the first display unit. It may also be an electronic device having a second display unit.

[0123] Furthermore, the thinnest part of the electronic device 100 on which the display unit 102 is provided shall be 5 mm or less. This is possible. Also, the thickest part of the electronic device 100 is the connection part between the display unit 102 and the circuit board 106 but can be less than 1 cm.

[0124] Also, the total weight of the electronic device 100 can be less than 100 g.

[0125] [Configuration Example of Display Panel] Next, a configuration example of the display panel included in the display unit 102 will be described with reference to the drawings.

[0126] FIG. 15(A) is a schematic top view of a display panel 110 exemplified below. The display panel 1 10 includes a flexible substrate 120 and has a plurality of pixels formed on the substrate 120 . The display panel 110 has a first display area 111, a second display area 112, a third display area 113, and a fourth display area 114. Here, for clarity, the hatching patterns of each display area are shown with different patterns.

[0127] The first display area 111 has a quadrilateral shape for its contour. The second display area 112 is provided adjacent to one side (the first side 131) of the four sides forming the contour of the first display area 111 . It is preferable that the widths in the direction parallel to the first side of each of the first display area 111 and the second display area 112 match. The third display area 113 is provided adjacent to a second side 132 that contacts the above-mentioned first side 131. The widths in the direction parallel to the second side 132 of each of the first display area 11 1 and the third display area 113 preferably match. Also, at the angle (the first angle) formed by the first side 131 and the second side 132, one corner of the second display area 112 and one corner of the third display area 113 preferably coincide respectively .

[0128] <00D0999>

[0129]

[0130]

[0131] <000102

[0128] Also, as shown in Figure 15(A), the first side formed by the first side 131 and the second side 132 In the region opposite the first display area 111 across the corner, the substrate 120 has a notch 138 It has a notch 138 in this way, and It becomes possible to curve the third display area 113 in different directions.

[0129] Also, in Figure 15(A), the fourth edge is tangent to the third edge 133 which is opposite the first edge 131. This shows a configuration that provides a display area 114. One of the corners of the fourth display area 114 is the second It is preferable that it coincides with the second angle formed by side 132 and the third side 133. In the region opposite the first display area 111, the substrate 120 has the above-mentioned notch 1 It has a notch similar to 38. With this configuration, the fourth display area 114 The third display area 113 can be curved in a different direction.

[0130] Furthermore, a portion of the substrate 120 is equipped with an FPC 10 that supplies signals and power for driving pixels. It includes 3. In Figure 15(A), IC12 is mounted on FPC103 by the COF method. The configuration shown includes 3, but IC123 does not need to be included if it is not needed, and board 1 Alternatively, IC123 can be directly implemented on 20 using the COF method. Here, FP It is preferable that the width of C103 is smaller than the width of the first display area 111. In particular, the second table The display area 112 and the fourth display area 114 are curved, and the first display area 111 is made flat. When used in this manner, the joint between the FPC 103 and the substrate 120 does not bend, and the FPC This can prevent 103 from peeling off.

[0131] Figure 15(B) is a top schematic view of an enlarged area A in Figure 15(A).

[0132] In the configuration shown in Figure 15(B), the first display area 111 and the second display area 112 are Then, a first drive circuit 141 that outputs a signal for driving the pixels included therein, It has a second drive circuit 142 that outputs a similar signal to the third display area 113. The drive circuit 141 is provided along the side of the second display area 112 opposite the first side 131. It is being driven. Also, the second drive circuit 142 is the first side 131 of the third display area 113 It is provided along the side in the direction of extension. Also, the first drive circuit 141 and the second drive circuit 142 is electrically connected by wiring 145, and input from FPC103 via wiring 145. The powered signal can be supplied to the second drive circuit 142.

[0133] Furthermore, Figure 15(C) shows a configuration different from the one shown in Figure 15(B). Figure 1 In the configuration shown in 5(C), the first drive circuit 141 is replaced with a drive circuit 143. The drive circuit 143 controls the pixels included in the first display area 111 and the second display area 112. It outputs a signal for driving and drives the pixels included in the third display area 113. It can output a signal for that purpose. The signal output from the drive circuit 143 is connected to wiring 14 The output is then sent to the wiring that is electrically connected to each pixel in the third display area 113 via 6. It is possible.

[0134] The first drive circuit 141, the second drive circuit 142, and the drive circuit 143 are, for example, gates A circuit that functions as either a drive circuit or a source drive circuit can be used. Therefore, it is preferable to apply a gate drive circuit. In that case, IC123 is a source drive circuit and It is preferable that it has the function of being.

[0135] In this case, the display panel is a so-called driver-integrated type, with the drive circuit mounted on the circuit board 120. Although the above configuration is shown, a configuration without a drive circuit is also acceptable.

[0136] Thus, the third output outputs a signal for driving the pixels included in the third display area 113. The second drive circuit 142, or the wiring 146 that supplies a signal for driving the pixel, By providing it along one side of the display area 113 of 3, the area of ​​the notch 138 can be increased. This makes it possible to reduce the area of ​​the non-display portion relative to the surface area of ​​the display panel 110. It is possible. Also, when the third display area 113 is curved in a direction parallel to the second side 132, Figure As shown in 15(C), it is preferable to have a configuration in which no drive circuit is provided in the curved section. Consequently, the electrical characteristics of semiconductor elements such as transistors in the drive circuit change due to that stress. Because there is a risk of this happening, this configuration ensures that the output signal from the drive circuit is reliable. This can prevent the situation from becoming fixed.

[0137] Note that Figure 15 shows a configuration that includes the first to fourth display areas, but the first to fourth The configuration may include 3 display areas, or a fifth display area 115. This is possible. Figure 16(A) shows a schematic top view of the case where there is a fifth display area 115. The wiring and drive circuit configuration between the fifth display area 115 and the second display area 112 is as follows. Alternatively, the same configuration as in Figure 15(B) or Figure 15(C) may be used.

[0138] Figure 16(B) also shows an example of a configuration that includes FPC103a. For example, it has the function of supplying signals and power to each of the drive circuits exemplified above. If the panel does not have a drive circuit, the IC is mounted on the FPC103a using a COF method or similar. That's good too.

[0139] Here, the pixels provided in each display area of ​​the display panel 110 and the driving circuits used in each are It is preferable to apply oxide semiconductors to semiconductor devices such as transistors. It is preferable to use an oxide semiconductor with a larger band gap than silicon. If a semiconductor material with a wider band gap and lower carrier density than CON is used, This is preferable because it reduces the current when the transistor is off.

[0140] For example, the above oxide semiconductor may contain at least indium (In) or Preferably, it contains zinc (Zn). More preferably, an In-M-Zn oxide (where M is A) is used. (Denoted by metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) Contains oxides.

[0141] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. , or oriented perpendicular to the upper surface of the semiconductor layer, and without grain boundaries between adjacent crystal portions. It is preferable to use an oxide semiconductor film.

[0142] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitable for use in flexible, curved display panels and the like. It is possible to be there.

[0143] By using such materials as semiconductor layers, fluctuations in electrical properties are suppressed, and reliability is improved. High-quality transistors can be achieved.

[0144] Furthermore, its low off-current allows the charge stored in the capacitor via the transistor to be released over a long period of time. It is possible to hold it over time. By applying such transistors to pixels, each It also becomes possible to stop the drive circuit while maintaining the gradation of the image displayed in the display area. As a result, it is possible to create electronic devices with extremely reduced power consumption.

[0145] Furthermore, regarding preferred forms of oxide semiconductors applicable to semiconductor layers and methods for forming them, This will be explained in detail in a later embodiment.

[0146] Furthermore, in addition to the display device, the electronic device according to one aspect of the present invention includes other semiconductor circuits, such as overcharge Control circuits to prevent this, as well as sensors such as image sensors, gyro sensors, and accelerometers. It may also be equipped with a touch panel, etc. Furthermore, it may contact a part of the human body to measure pulse and surface temperature. The device may be equipped with sensors to measure temperature, blood oxygen concentration, etc. For example, in addition to a display device. By equipping it with an image sensor, the captured image can be displayed on a display device. By incorporating sensors such as gyroscopic sensors and accelerometers, finger-worn electronic devices can be developed. It can save power by switching between on and off states depending on the orientation and movement. By incorporating a touch panel, electronic devices can be operated by touching the desired location on the touch panel. It is possible to operate the device and input information. In addition, in the above configuration, in addition to the display device, By incorporating memory and a CPU, it's possible to create a wearable computer.

[0147] Furthermore, an electronic device according to one aspect of the present invention is used as a display unit for a finger-worn electronic device, and conventional portable By using both the display unit of the information terminal and the electronic device according to one aspect of the present invention, a subdisplay It can also function as a tool.

[0148] Furthermore, in the display section of the ring-type information terminal, the user is included in the ring-type information terminal. It can display light or images of a desired color selected from video data in memory. .

[0149] In this embodiment, we have shown an example of a ring-type information terminal worn on one finger of a person, but in particular The display unit is placed on a frame with multiple rings that can be worn on two or more fingers. This is also acceptable. In this case, the width of the display area can be greater than two or more fingers.

[0150] In this embodiment, an example of a ring-type information terminal worn on a human finger was shown, but in particular It is not limited to this, and may also be a ring-type information terminal worn on the fingers of a robot. In that case, The fingers and toes of robots can sometimes be larger than those of humans. Also, the hands and feet of pet animals... It may also be an information terminal that is attached to the collar of a pet animal. It can store information such as identification details, contact information, and location of lost pets. It is preferable that it has memory. Furthermore, it is not limited to pet animals, but also to animals kept in zoos, etc. It can also be attached to animals that are being kept in zoos, etc. Therefore, because some individuals are difficult to identify, small information terminals are attached to the wrists or ankles of the animals. Making identification easier is useful. In that case, the wrists and ankles of animals are more sensitive than the fingers of humans. It can also be quite large.

[0151] (Embodiment 2) This embodiment describes a specific example of a display panel in an electronic device according to one aspect of the present invention. I will reveal it.

[0152] [Specific example] Figure 17(A) shows a plan view of the display panel, and the dashed line A1-A2 in Figure 17(A) An example of a cross-sectional view is shown in Figure 17(C). The display panel shown in Specific Example 1 is a color filter. This is a top-emission type display panel using a method. In this embodiment, the display panel A color matrix, for example, uses three subpixels of red (R), green (G), and blue (B) to represent one color. R (red), G (green), B (blue), W (white), or R (red), G (green), B (blue) A configuration can be applied in which one color is represented by four subpixels of color Y (yellow). There are no limitations; colors other than RGBW may be used, for example, yellow, cyan, magenta It may consist of the following:

[0153] The display panel shown in Figure 17(A) consists of a light-emitting unit 804, a drive circuit unit 806, and an FPC (Fle It has a luminescent part 804 and a drive unit 804. The light-emitting elements and transistors included in the circuit section 806 are located on substrate 801, substrate 803, and the sealing layer. It is sealed by 823.

[0154] The display panel shown in Figure 17(C) consists of a substrate 801, an adhesive layer 811, an insulating layer 813, and multiple Transistor, conductive layer 857, insulating layer 815, insulating layer 817, multiple light-emitting elements, insulating layer 8 21, sealing layer 823, overcoat 849, coloring layer 845, light-shielding layer 847, insulating layer 84 3. It has an adhesive layer 841 and a substrate 803. Sealing layer 823, overcoat 849, and insulation The edge layer 843, the adhesive layer 841, and the substrate 803 transmit visible light.

[0155] The light-emitting part 804 is connected to the substrate 801 via an adhesive layer 811 and an insulating layer 813, and a transistor It has 820 and a light-emitting element 830. The light-emitting element 830 is located on the lower electrode 83 on the insulating layer 817. It comprises 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. Continued. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 is visible It is preferable that it reflects light. The upper electrode 835 transmits visible light.

[0156] Furthermore, the light-emitting section 804 has a colored layer 845 that overlaps with the light-emitting element 830 and an insulating layer 821 that overlaps with the light-emitting element 830. It has a light-shielding layer 847 and a colored layer 845 and a light-shielding layer 847. It is covered. The space between the light-emitting element 830 and the overcoat 849 is filled with a sealing layer 823. Yes, they are.

[0157] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that makes up the transistor. In addition, the insulating layer 817 has a planarization function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having [a certain characteristic].

[0158] The drive circuit section 806 transitions onto the substrate 801 via the adhesive layer 811 and the insulating layer 813. It has multiple transistors. In Figure 17(C), among the transistors in the drive circuit section 806, This shows one transistor.

[0159] The insulating layer 813 and the substrate 801 are bonded together by the adhesive layer 811. 843 and substrate 803 are bonded together by adhesive layer 841. Insulating layer 813 and insulating layer If a film with low water permeability is used for 843, impurities such as water will enter the light-emitting element 830 and transistor 820. This is preferable because it can prevent objects from entering and improve the reliability of the display panel.

[0160] The conductive layer 857 receives external signals (video signals, clock signals, etc.) from the drive circuit section 806. It is electrically connected to an external input terminal that transmits a start signal or reset signal, or an electric potential. This example shows the use of an FPC808 as an external input terminal. This prevents an increase in the number of processes. Therefore, the conductive layer 857 is made of the same material as the electrodes and wiring used in the light-emitting section and the drive circuit section. It is preferable to manufacture it in a process. Here, the conductive layer 857 constitutes the transistor 820. An example of an electrode fabricated using the same material and process as the electrode shown is presented.

[0161] In the display panel shown in Figure 17(C), the connector 825 is located on the substrate 803. 825 is the substrate 803, adhesive layer 841, insulating layer 843, sealing layer 823, insulating layer 817, and It is connected to the conductive layer 857 through an opening provided in the insulating layer 815. Also, the connecting body 8 25 is connected to FPC808. Connecting to FPC808 and conductive layer 857 via connector 825. They are electrically connected. When the conductive layer 857 and the substrate 803 overlap, an opening is made in the substrate 803. By doing so (or by using a substrate having an opening), the conductive layer 857, the connector 825, and F The PC808 can be electrically connected.

[0162] In specific example 1, an insulating layer 813, a transistor 820, and a light-emitting element are fabricated on a heat-resistant substrate. Substrate 830 is fabricated, the fabricated substrate is peeled off, and an insulating layer 8 is applied to the substrate 801 using the adhesive layer 811. This shows a display panel that can be fabricated by transposing elements 13, transistor 820, and light-emitting element 830. In addition, in specific example 1, an insulating layer 843 and a colored layer 845 are used on a heat-resistant fabricated substrate. A light-shielding layer 847 is then fabricated, the fabricated substrate is peeled off, and the adhesive layer 841 is used to apply the material to the substrate 803. A display panel can be manufactured by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It is showing.

[0163] When using materials with low heat resistance (such as resin) for the substrate, high temperatures are applied to the substrate during the manufacturing process. Because this is difficult, there are limitations on the conditions under which transistors and insulating layers can be fabricated on the substrate. When using a highly permeable material (such as resin) for the substrate, high temperature is applied to create a film with low water permeability. It is preferable to form it. In the manufacturing method of this embodiment, the tra Because it can fabricate transistors and other components, it can be used to create highly reliable transistors and ensure sufficient water permeability by applying high temperatures. A low-quality film can be formed. Then, these are transferred to substrate 801 or substrate 803. This makes it possible to manufacture a highly reliable display panel. Thus, in one aspect of the present invention, This enables the creation of lightweight, thin, and highly reliable display panels. Details of the manufacturing method will be described later. do.

[0164] [Specific Example 2] Figure 17(B) shows a plan view of the display panel, and the dashed line A3-A4 in Figure 17(B) An example of a cross-sectional view is shown in Figure 17(D). The display panel shown in Specific Example 2 is different from that in Specific Example 1. This is a top-emission type display panel that uses a color filter method. Only the differences from Specific Example 1 will be described in detail, and the points that are common to Specific Example 1 will be omitted from the explanation.

[0165] The display panel shown in Figure 17(D) differs from the display panel shown in Figure 17(C) in the following respects. .

[0166] The display panel shown in Figure 17(D) has a spacer 827 on the insulating layer 821. By providing the 827, the distance between substrate 801 and substrate 803 can be adjusted.

[0167] Furthermore, the display panel shown in Figure 17(D) has different sizes for circuit board 801 and circuit board 803. The connector 825 is located on the insulating layer 843 and does not overlap with the substrate 803. Through openings provided in the edge layer 843, sealing layer 823, insulating layer 817, and insulating layer 815 It is connected to the conductive layer 857. Since there is no need to make an opening in the substrate 803, the substrate 803 There are no restrictions on the materials used.

[0168] [Specific Example 3] Figure 18(A) shows a plan view of the display panel, and the dashed line A5-A6 in Figure 18(A) An example of a cross-sectional view is shown in Figure 18(C). The display panel shown in Specific Example 3 uses a color-coding method. This is a top-emission type display panel used.

[0169] The display panel shown in Figure 18(A) consists of a light-emitting unit 804, a drive circuit unit 806, and an FPC 808. It has. The light-emitting elements and transistors included in the light-emitting section 804 and the drive circuit section 806 are on the substrate 8 01, is sealed by a substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

[0170] The display panel shown in Figure 18(C) consists of a substrate 801, an adhesive layer 811, an insulating layer 813, and multiple Transistor, conductive layer 857, insulating layer 815, insulating layer 817, multiple light-emitting elements, insulating layer 8 21, it has a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. Sealing layer 823 and Substrate 803 transmits visible light.

[0171] The frame-shaped sealing layer 824 is preferably a layer with higher gas barrier properties than the sealing layer 823. This prevents moisture and oxygen from entering the display panel from the outside. This makes it possible to create a highly reliable display panel.

[0172] In specific example 3, the light emitted from the light-emitting element 830 is extracted from the display panel via the sealing layer 823. Therefore, it is preferable that the sealing layer 823 has higher light transmittance than the frame-shaped sealing layer 824. Furthermore, it is preferable that the sealing layer 823 has a higher refractive index than the frame-shaped sealing layer 824. Furthermore, the sealing layer 823 exhibits less volume shrinkage during curing compared to the frame-shaped sealing layer 824. This is preferable.

[0173] The light-emitting part 804 is connected to the substrate 801 via an adhesive layer 811 and an insulating layer 813, and a transistor It has 820 and a light-emitting element 830. The light-emitting element 830 is located on the lower electrode 83 on the insulating layer 817. It comprises 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. Continued. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 is visible It is preferable that it reflects light. The upper electrode 835 transmits visible light.

[0174] The drive circuit section 806 transitions onto the substrate 801 via the adhesive layer 811 and the insulating layer 813. It has multiple transistors. In Figure 18(C), among the transistors in the drive circuit section 806, This shows one transistor.

[0175] The insulating layer 813 and the substrate 801 are bonded together by the adhesive layer 811. If a film with low water permeability is used, impurities such as water may penetrate the light-emitting element 830 and the transistor 820. This is preferable because it can suppress input and improve the reliability of the display panel.

[0176] The conductive layer 857 has an external input terminal that transmits external signals and potentials to the drive circuit section 806. Connect electrically. Here, we show an example where an FPC808 is provided as an external input terminal. Furthermore, here, the conductive layer 857 is made of the same material as the electrodes that make up the transistor 820. An example of a product manufactured using the same process is shown.

[0177] In the display panel shown in Figure 18(C), the connector 825 is located on the substrate 803. 825 is an opening provided in the substrate 803, sealing layer 823, insulating layer 817, and insulating layer 815. It is connected to the conductive layer 857 via the opening. Also, the connector 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0178] In specific example 3, an insulating layer 813, a transistor 820, and a light-emitting element are fabricated on a heat-resistant substrate. Substrate 830 is fabricated, the fabricated substrate is peeled off, and an insulating layer 8 is applied to the substrate 801 using the adhesive layer 811. This shows a display panel that can be fabricated by transposing elements 13, transistor 820, and light-emitting element 830. It is possible to fabricate transistors and other components on a highly heat-resistant fabrication substrate, thus reducing the need for high temperatures. This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the circuit board 801, a highly reliable display panel can be manufactured. In one aspect of the present invention, a lightweight or thin and highly reliable display panel can be realized. Cut.

[0179] [Specific Example 4] Figure 18(B) shows a plan view of the display panel, and the dashed line A7-A8 in Figure 18(B) An example of a cross-sectional view is shown in Figure 18(D). The display panel shown in Specific Example 4 is a color filter. This is a bottom-emission type display panel that uses a specific method.

[0180] The display panel shown in Figure 18(D) consists of a substrate 801, an adhesive layer 811, an insulating layer 813, and multiple Transistor, conductive layer 857, insulating layer 815, colored layer 845, insulating layer 817a, insulating layer 8 17b, conductive layer 816, multiple light-emitting elements, insulating layer 821, sealing layer 823, and substrate 803 It has a substrate 801, adhesive layer 811, insulating layer 813, insulating layer 815, insulating layer 817a, The insulating layer 817b transmits visible light.

[0181] The light-emitting part 804 is connected to the substrate 801 via an adhesive layer 811 and an insulating layer 813, and a transistor It has 820, a transistor 822, and a light-emitting element 830. The light-emitting element 830 has an insulating layer The lower electrode 831 on 817b, the EL layer 833 on the lower electrode 831, and the EL layer 833 It has an upper electrode 835 and a lower electrode 831 which is the source electrode of transistor 820 or It is electrically connected to the drain electrode. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 transmits visible light. The position in which the colored layer 845 overlaps the light-emitting element 830 is provided is not particularly limited, for example, It is provided between insulating layer 817a and insulating layer 817b, or between insulating layer 815 and insulating layer 817a, etc. Yes.

[0182] The drive circuit section 806 transitions onto the substrate 801 via the adhesive layer 811 and the insulating layer 813. It has multiple transistors. In Figure 18(D), among the transistors in the drive circuit section 806, This shows two transistors.

[0183] The insulating layer 813 and the substrate 801 are bonded together by the adhesive layer 811. If a film with low water permeability is used, water and other insoluble particles will enter the light-emitting element 830 and transistors 820 and 822. This is preferable because it can suppress the intrusion of pure substances and improve the reliability of the display panel.

[0184] The conductive layer 857 has an external input terminal that transmits external signals and potentials to the drive circuit section 806. Connect electrically. Here, we show an example where an FPC808 is provided as an external input terminal. Furthermore, in this case, the conductive layer 857 was fabricated using the same material and process as the conductive layer 816. Here is an example.

[0185] In specific example 4, an insulating layer 813, a transistor 820, and a light-emitting element are fabricated on a heat-resistant substrate. Sub-substrates 830 etc. are fabricated, the fabricated substrate is peeled off, and an insulating layer is placed on the substrate 801 using the adhesive layer 811. A display panel that can be fabricated by transposing components such as 813, transistor 820, and light-emitting element 830. This indicates that transistors and other components can be fabricated on a highly heat-resistant substrate, thus enabling high-temperature fabrication. This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these components onto substrate 801, a highly reliable display panel can be manufactured. Therefore, in one aspect of the present invention, a lightweight or thin and highly reliable display panel is realized. It can be expressed.

[0186] [Specific Example 5] Figure 18(E) shows an example of a display panel different from Specific Examples 1 to 4.

[0187] The display panel shown in Figure 18(E) consists of a substrate 801, an adhesive layer 811, an insulating layer 813, and a conductive layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, sealing layer 82 It has 3 and a substrate 803.

[0188] The conductive layers 857a and 857b function as external connection electrodes for the display panel. It can be electrically connected to FPCs, etc.

[0189] The light-emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the electrode 831 is covered with an insulating layer 821. The light-emitting element 830 is bottom emitter It is either a top-emission type, a dual-emission type, or a single-type. The electrodes, substrate, insulating layer, etc., are all transparent to visible light. The conductive layer 814 is connected to the lower electrode 831. It is electrically connected to it.

[0190] The substrate that extracts light consists of a hemispherical lens and a microlens array as its light extraction structure. The film may have an uneven surface, such as a light-diffusing film. For example, a resin base The above-mentioned lens or film is placed on a plate, with a refractive index similar to that of the substrate or the lens or film. A light extraction structure can be formed by bonding using an adhesive or the like.

[0191] The conductive layer 814 is not necessarily required, but the voltage drop due to the resistance of the lower electrode 831 It is preferable to provide it because it can suppress downward movement. Also, for the same purpose, the upper electrode 835 and the A conductive layer that is electrically connected is placed on the insulating layer 821, the EL layer 833, or the upper electrode 835, etc. It may be established.

[0192] The conductive layer 814 is made of copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium Materials selected from aluminum, scandium, nickel, and aluminum, or materials with these as the main components. It can be formed using alloy materials, etc., either as a single layer or in layers. The thickness of the conductive layer 814 is For example, it can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0 It is 0.5 μm or less.

[0193] A paste (such as silver paste) is used as the material for the conductive layer that electrically connects to the upper electrode 835. As a result, the metal constituting the conductive layer aggregates into granular form. Therefore, the surface of the conductive layer becomes rough. This configuration has many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and the upper electrode This makes it easier to establish an electrical connection between the conductive layer and the material, which is preferable.

[0194] In specific example 5, an insulating layer 813 and a light-emitting element 830, etc., are fabricated on a heat-resistant substrate. The fabricated substrate is peeled off, and an insulating layer 813 and a light-emitting element 83 are placed on the substrate 801 using the adhesive layer 811. This shows a display panel that can be fabricated by transposing zeros, etc. On a heat-resistant fabrication substrate, By applying high temperature to form a film with sufficiently low water permeability and then transferring it to the substrate 801, reliability High-performance display panels can be manufactured. As a result, in one aspect of the present invention, lightweight or thin and Furthermore, it enables the creation of a highly reliable display panel.

[0195] Although an example using a light-emitting element as the display element is shown here, the present invention is also described in detail below. The embodiments are not limited to these.

[0196] For example, in this specification, etc., display element, display device having a display element, light emission It is a device having elements and light-emitting elements. The light-emitting device may use various forms or It can have various elements. For example, a display element, display device, light-emitting element, or light-emitting device may have different elements. EL (electroluminescent) elements (EL elements including organic and inorganic materials, organic EL) Elements (inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.) ), transistor (a transistor that emits light in response to current), electron emission element, liquid crystal element, electric Ink cartridges, electrophoretic elements, grating light bulbs (GLVs), plasma displays (i) Display using PDP (Photographic Display Panel) and MEMS (Micro-Electro-Mechanical Systems) Elements, digital micromirror devices (DMDs), DMS (digital micromirror devices) (Tatter), MIRASOL (registered trademark), IMOD (Interference Modulation) MEMS display elements (shutter type), MEMS display elements (optical interference type), Using lectrowetting elements, piezoelectric ceramic displays, and carbon nanotubes It has at least one of the following: an electrical or magnetic display element. It has a display medium whose contrast, brightness, reflectance, transmittance, etc., change as a result of the action. This is also good. An example of a display device using EL elements is an EL display. An example of a display device using emission elements is a field emission display (FE D) or SED type flat display (SED: Surface-conductivity Examples include (n Electron-emitter Display), which uses liquid crystal elements. Examples of such display devices include liquid crystal displays (transmissive liquid crystal displays, semi-transmissive liquid crystal displays). Display, reflective liquid crystal display, direct-view liquid crystal display, projection liquid crystal display Examples include (Ray). These include electronic ink, electronic powder fluid (registered trademark), or electrophoretic elements. Examples of display devices include electronic paper. Furthermore, semi-transmissive liquid crystal displays and reverse-transmissive displays are also examples. In realizing a light-emitting liquid crystal display, some or all of the pixel electrodes are reflective electrodes. It should be made to have the function of a. For example, part or all of the pixel electrodes are It is sufficient to have luminium, silver, etc. Furthermore, in that case, below the reflecting electrode, It is also possible to incorporate memory circuits such as SRAM. This further reduces power consumption. It can be reduced. Furthermore, when using LEDs, beneath the LED electrodes and nitride semiconductor, Graphene or graphite may be placed. Graphene or graphite can be arranged in multiple layers. They can be layered to form a multilayer film. In this way, by providing graphene or graphite... Furthermore, a nitride semiconductor, such as an n-type GaN semiconductor layer having crystals, can be easily formed on top of it. A film can be formed. Furthermore, a p-type GaN semiconductor layer having crystals can be provided on top of it. LEDs can be constructed using graphene and graphite, and crystalline n An AlN layer may be provided between the GaN semiconductor layer and the LED. The body layer may be deposited by MOCVD. However, by providing graphene, LED The GaN semiconductor layer present in this material can also be deposited using the sputtering method.

[0197] [Example of materials] Next, we will describe the materials that can be used for the light-emitting panel. The structure described may be omitted in some cases.

[0198] Materials such as glass, quartz, organic resin, metal, and alloy can be used for the substrate. The substrate on the side that extracts light from the optical element is made of a material that is transparent to the light.

[0199] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a material having a degree of flexibility. Glass, metal, and alloys of varying thicknesses can be used.

[0200] Because organic resins have a lower specific gravity than glass, when organic resins are used as flexible substrates, This method allows for a lighter light-emitting panel compared to using glass, which is preferable.

[0201] It is preferable to use a material with high toughness for the substrate. This provides excellent impact resistance and breakage. This makes it possible to create light-emitting panels that are less prone to damage. For example, even organic resin substrates or thin metal substrates can be used. By using an alloy substrate, it is lighter and less prone to breakage compared to using a glass substrate. This makes it possible to create a low-powered light-emitting panel.

[0202] Metallic and alloy materials have high thermal conductivity and can easily conduct heat throughout the substrate, so light-emitting particles This is preferable as it can suppress the localized temperature rise of the flannel. The substrate thickness is preferably 10 μm to 200 μm, and 20 μm to 50 μm. It is preferable to do so.

[0203] There are no particular limitations on the materials that make up the metal substrate or alloy substrate, but for example, aluminum Metals such as copper, iron, titanium, nickel, or one or more metals selected from these metals. Alloys containing the material can be used. Examples of alloys include aluminum alloy or ste Stainless steel and the like can be suitably used.

[0204] Furthermore, using a material with high thermal emissivity for the substrate can increase the surface temperature of the light-emitting panel. This can suppress damage to the light-emitting panel and reduce its reliability. For example, when the substrate is heated to a metal substrate. Laminated structure of a layer with high emissivity (for example, metal oxides or ceramic materials can be used) It can also be called "construction."

[0205] Examples of materials that are flexible and translucent include polyethylene terephthalate (PE). T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Polyresin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Fat, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Listyrene resin, polyamide-imide resin, polyvinyl chloride resin, polytetrafluoroethylene Examples include PTFE. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamide-imide resin, polyimide resin, PET, etc. can be suitably used. Furthermore, substrates (also called prepregs) made by impregnating fibrous material with resin, and inorganic fillers made of organic resin, are also used. It is also possible to use substrates that have been mixed with fat to reduce their coefficient of thermal expansion.

[0206] As a flexible substrate, the layer using the above material protects the surface of the device from scratches and other damage. Coating layers (e.g., silicon nitride layers) or layers of materials that can distribute pressure (e.g., rough It may be constructed by laminating with a mid-resin layer, etc.

[0207] Flexible substrates can also be used by stacking multiple layers. In particular, a configuration having a glass layer. Therefore, improving barrier properties against water and oxygen will result in a more reliable light-emitting panel. can.

[0208] For example, a flexible group having a glass layer, an adhesive layer, and an organic resin layer laminated from the side closest to the light-emitting element. A plate can be used. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness should be between 25 μm and 100 μm. Glass layers of this thickness are not susceptible to water and oxygen. It can simultaneously achieve high barrier properties and flexibility. Also, the thickness of the organic resin layer is 1 The particle size should be 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By placing the resin layer outside the glass layer, cracks and fractures in the glass layer are suppressed. This can improve mechanical strength. Composite materials of such glass materials and organic resins By applying it to a substrate, it is possible to create an extremely reliable and flexible light-emitting panel. can.

[0209] The adhesive layer and sealing layer can be a photocuring adhesive such as UV-curing type, a reaction-curing adhesive, or a thermosetting type. Various types of curing adhesives, such as adhesives and anaerobic adhesives, can be used. For example, epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples include EVA (ethylene vinyl acetate) resin, etc. In particular, epoxy resins and other permeable materials. Materials with low moisture content are preferred. A two-component resin may also be used. Adhesive sheets are also available. You may also use the following:

[0210] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (acid Using substances that adsorb moisture by chemical adsorption, such as calcium carbonate or barium oxide. It is possible to remove moisture through physical adsorption, such as with zeolite or silica gel. Adsorbent substances may be used. If a desiccant is included, impurities such as moisture may be absorbed into the functional element. This is preferable because it can suppress intrusion and improve the reliability of the light-emitting panel.

[0211] Furthermore, by mixing fillers or light-scattering materials with a high refractive index into the above resin, a light-emitting element can be created. The light extraction efficiency from these can be improved. For example, titanium dioxide, barium oxide, Zeolite, zirconium, etc., can be used.

[0212] The structure of the transistors in the light-emitting panel is not particularly limited. For example, staggered transistors It can be used as a transistor, or as an inverse staggered transistor. Also, a top gate... Either a bottom-gate or bottom-gate transistor structure may be used. The semiconductor material is not particularly limited; for example, silicon, germanium, silicon carbide, and zinc nitride. Examples include indium, galvanic acid, and galvanic acid. Alternatively, indium, galvanic acid, and galvanic acid are examples of in-Ga-Zn metal oxides. An oxide semiconductor containing at least one of lium and zinc may also be used.

[0213] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0214] Here, transistors used in pixels, driving circuits, and touch sensors (described later) For any semiconductor device, it is preferable to use an oxide semiconductor. In particular, it is preferable to use a silicon It is preferable to use oxide semiconductors with a large band gap than silicon. Using semiconductor materials with a wide hop and low carrier density allows for the transistor's off state. This is preferable because it allows for a reduction in current.

[0215] For example, the above oxide semiconductor may contain at least indium (In) or Preferably, it contains zinc (Zn). More preferably, an In-M-Zn oxide (where M is A) is used. (Denoted by metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) Contains oxides.

[0216] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. , or oriented perpendicular to the upper surface of the semiconductor layer, and without grain boundaries between adjacent crystal portions. It is preferable to use an oxide semiconductor film.

[0217] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitable for use in flexible, curved display panels and the like. It is possible to be there.

[0218] By using such materials as semiconductor layers, fluctuations in electrical properties are suppressed, and reliability is improved. High-quality transistors can be achieved.

[0219] Furthermore, its low off-current allows the charge stored in the capacitor via the transistor to be released over a long period of time. It is possible to hold it over time. By applying such transistors to pixels, each It also becomes possible to stop the drive circuit while maintaining the gradation of the image displayed in the display area. As a result, it is possible to create electronic devices with extremely reduced power consumption.

[0220] It is preferable to provide an undercoat to stabilize the characteristics of the transistor. Silicon oxide film, silicon nitride film, silicon oxide nitride film, silicon nitride oxide film, etc. It can be fabricated using an insulating film, either as a single layer or in a multilayer configuration. The undercoat is fabricated by sputtering. CVD (Chemical Vapor Deposition) method (Plasma CVD) Methods such as thermal CVD, MOCVD (Metal Organic CVD), and ALD Using methods such as (Atomic Layer Deposition), coating, and printing, the shape is formed. This can be achieved. Note that the undercoat does not need to be provided if it is not necessary. In each of the above configuration examples, insulation Layer 813 can also serve as the underlayer for the transistor.

[0221] As the light-emitting element, a self-emitting element can be used, and it will light up when current or voltage is applied. This category includes elements whose degree of control is managed. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc., can be used.

[0222] Light-emitting devices include top-emission type, bottom-emission type, and dual-emission type. Either of the above is acceptable. The electrode that extracts light uses a conductive film that transmits visible light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. stomach.

[0223] Examples of conductive films that transmit visible light include indium oxide and indium tin oxide (ITO). Indium zinc oxide, zinc oxide, and gallium are added. It can be formed using zinc oxide with added components, etc. Also, gold, silver, platinum, magnesium Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Examples include metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials. For example, titanium nitride can also be used by forming it thinly enough to be translucent. Furthermore, the laminated film of the above materials can be used as a conductive layer. For example, silver and magnesium Using a laminated film of an alloy of ITO is preferable because it can improve conductivity. Alternatively, graphene or other materials may be used.

[0224] Conductive films that reflect visible light include, for example, aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, the above metal materials and alloys can be treated with ran It may also contain tannins, neodymium, or germanium. Aluminum alloys such as tan alloys, aluminum-nickel alloys, aluminum-neodymium alloys, etc. Alloys containing nium (aluminum alloys), alloys of silver and copper, alloys of silver, palladium and copper, It can be formed using silver-containing alloys such as silver-magnesium alloys. It can also contain silver and copper. Alloys are preferred because they have high heat resistance. Furthermore, a metal film or gold in contact with the aluminum alloy film is also preferable. By laminating an oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metallic material may be laminated together. For example, silver and ITO Multilayer films of silver and magnesium alloys and ITO can be used.

[0225] The electrodes can be formed using methods such as vapor deposition or sputtering. Shapes are formed using ejection methods such as inkjet, printing methods such as screen printing, or plating methods. It is possible.

[0226] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835. Then, holes are injected into the EL layer 833 from the anode side and electrons are injected from the cathode side. The electrons and holes recombine in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It shines.

[0227] The EL layer 833 has at least an emissive layer. The EL layer 833 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential Substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have a layer containing substances such as [materials].

[0228] The EL layer 833 can use either low-molecular-weight compounds or high-molecular-weight compounds, It may contain chemical compounds. The layers constituting the EL layer 833 are each deposited by a vapor deposition method (vacuum vapor deposition). It can be formed by methods such as (including adhesive application), transfer, printing, inkjet, and coating. Cut.

[0229] When a white light-emitting element is used as the light-emitting element 830, two types of EL layer 833 are used. It is preferable to have a configuration that includes two or more types of light-emitting materials. For example, each of two or more light-emitting materials By selecting light-emitting materials such that the light is in a complementary color relationship, white light emission can be obtained. For example, they emit light in the following colors: R (red), G (green), B (blue), Y (yellow), O (orange), etc. A light-emitting substance, or a light-emitting substance that exhibits emission containing two or more spectral components of R, G, and B. It is preferable that the substance contains two or more of the substances. Also, the spectrum of light emitted from the light-emitting element 830 The light exhibits two or more peaks within the wavelength range of the visible light region (e.g., 350 nm to 750 nm). It is preferable to apply a light-emitting element having a peak in the yellow wavelength region. The emission spectrum of this material also contains spectral components in the green and red wavelength regions. It is preferable.

[0230] Preferably, the EL layer 833 includes an emissive layer containing an emissive material that emits one color, and another color It is preferable to have a structure in which a light-emitting layer containing a light-emitting material is laminated with E. Multiple light-emitting layers in the L layer 833 may be stacked in contact with each other, or they may be separated by a separation layer. They may be stacked in this manner. For example, a configuration in which a separation layer is provided between the fluorescent emitting layer and the phosphorescent emitting layer. It can be considered a success.

[0231] The separation layer, for example, is formed in the phosphorescent layer, and the excited state of phosphorescent materials, etc., is transmitted to the fluorescent layer. To prevent energy transfer (especially triplet energy transfer) to optical materials via the Dexter mechanism. It can be provided for this purpose. The separation layer only needs to be about a few nanometers thick. Specifically, 0. 1nm to 20nm, or 1nm to 10nm, or 1nm to 5nm The following applies: The separation layer is made of a single material (preferably a bipolar material) or multiple materials. (Preferably includes hole-transporting materials and electron-transporting materials.)

[0232] The separation layer may be formed using the material contained in the light-emitting layer that is in contact with the separation layer. This makes it easier to fabricate light-emitting devices and reduces the driving voltage. For example, if the phosphorescent layer is In the case where the separation layer consists of a host material, an assist material, and a phosphorescent material (guest material), the separation layer is the It may be formed from a host material and an assist material. In other words, the above configuration is a phosphorescent separation layer. The phosphorescent layer has regions that do not contain material, and the phosphorescent layer has regions that contain phosphorescent material. It becomes possible to deposit the separation layer and the phosphorescent layer with or without the phosphorescent material. This configuration makes it possible to deposit the separation layer and the phosphorescent layer in the same chamber. This allows for a reduction in manufacturing costs.

[0233] Furthermore, the light-emitting element 830 may be a single element having one EL layer, or multiple elements. The EL layer may be a tandem element with a charge generation layer in between.

[0234] The light-emitting element is preferably placed between a pair of insulating films with low water permeability. This further suppresses the intrusion of impurities such as water into the light-emitting element, thereby preventing a decrease in the reliability of the light-emitting device. It can be controlled.

[0235] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Silicon oxide films, silicon oxide nitride films, aluminum oxide films, etc., may also be used.

[0236] For example, the amount of water vapor transmitted through a low-permeability insulating film is 1 × 10⁻⁶ -5 [g / (m2 ·day )] Preferably 1 × 10 -6 [g / (m 2 ·day)] Below, more preferably 1× 10 -7 [g / (m 2 (day) More preferably 1 x 10 -8 [g / (m 2 · (Day) and below.

[0237] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0238] Examples of insulating layer 815 include silicon oxide film, silicon oxide nitride film, and aluminum oxide film. Inorganic insulating films such as um film can be used. Also, insulating layer 817, insulating layer 817a, For example, the insulating layer 817b can be polyimide, acrylic, polyamide, or polyimide. Organic materials such as amides and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials), etc., can be used. Furthermore, multiple insulating films can be stacked. Each insulating layer may be formed by doing so.

[0239] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. Examples include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. A resin such as phenolic resin can be used. In particular, a photosensitive resin material can be used. It is preferable to form the side walls of the opening into inclined surfaces with a continuous curvature. It seems so.

[0240] The method for forming the insulating layer 821 is not particularly limited, but may include photolithography or sputtering. , vapor deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) You can use a printer or similar tool.

[0241] Spacer 827 can be formed using inorganic insulating materials, organic insulating materials, metal materials, etc. Yes, it is possible. For example, inorganic insulating materials and organic insulating materials can be used in the insulating layer mentioned above. Various materials can be used. Examples of metallic materials include titanium and aluminum. Yes, it is possible. A configuration in which a spacer 827 containing a conductive material and an upper electrode 835 are electrically connected. This suppresses the potential drop caused by the resistance of the upper electrode 835. Also, spacer 8 27 may have a forward taper shape or a reverse taper shape.

[0242] In a light-emitting panel, which functions as electrodes or wiring for transistors, or as auxiliary electrodes for light-emitting elements, The conductive layer used can be, for example, molybdenum, titanium, chromium, tantalum, tungsten, aluminum. Metallic materials such as aluminum, copper, neodymium, scandium, or alloy materials containing these elements It can be formed as a single layer or in layers. The conductive layer is made of conductive metal oxide. It may also be formed using materials. Examples of conductive metal oxides include indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I (e.g., n2O3-ZnO) or materials containing silicon oxide are used. It is possible.

[0243] A colored layer is a colored layer that transmits light in a specific wavelength range. For example, light in the red wavelength range... A color filter that transmits red (R) light, and a color filter that transmits green (G) light in the green wavelength range. - By using filters, such as a blue (B) color filter that transmits light in the blue wavelength range. This can be done. Each colored layer can be created using various materials, printing methods, inkjet methods, and photolithography. These are formed at the desired locations using etching methods such as the graphic method.

[0244] The light-shielding layer is placed between adjacent colored layers. The light-shielding layer blocks light from adjacent light-emitting elements. This shields the light and suppresses color mixing between adjacent light-emitting elements. Here, the edges of the colored layer are shielded from light. By providing it so as to overlap with the layers, light leakage can be suppressed. The light-shielding layer is: Materials that block light emission from light-emitting elements can be used, such as metallic materials, pigments, or dyes. A black matrix can be formed using a resin material. The light-shielding layer is the drive circuit section. By placing it in areas other than the light-emitting part, it is possible to suppress unintended light leakage caused by guided light, etc. It is preferable.

[0245] Furthermore, an overcoat may be provided to cover the colored layer and the light-shielding layer. This prevents impurities contained in the colored layer from diffusing into the light-emitting element. The overcoat is made of a material that transmits light from the light-emitting element, such as silicon nitride. Using inorganic insulating films such as films and silicon oxide films, or organic insulating films such as acrylic films and polyimide films This can be done, and a laminated structure of an organic insulating film and an inorganic insulating film may also be used.

[0246] Furthermore, when the sealing layer material is applied on the colored layer and light-shielding layer, the material of the overcoat is used. Therefore, it is preferable to use a material with high wettability for the sealing layer material. For example, overco Examples of materials include oxide conductive films such as ITO films, and metals such as Ag films that are thin enough to be translucent. It is preferable to use a membrane.

[0247] The connecting body is a paste or sheet made by mixing metal particles with a thermosetting resin. By thermocompression bonding, materials exhibiting anisotropic conductivity can be used. As for metal particles, For example, particles made of two or more metals in a layered structure, such as nickel particles coated with gold. It is preferable to have this feature. Alternatively, it is preferable to use a material in which the surface of granular resin is coated with metal. It seems so.

[0248] This embodiment can be freely combined with other embodiments.

[0249] (Embodiment 3) In this embodiment, an example is shown in which the energy storage device is charged by wireless power transfer. Wireless power transmission can utilize electric fields, magnetic fields, electromagnetic waves, etc.

[0250] An electronic device according to one aspect of the present invention receives electric fields, magnetic fields, electromagnetic waves, etc., from an antenna, coil, etc. It is preferable to have a device. Furthermore, an electronic device according to one aspect of the present invention may have a capacitor for charging. It is preferable to have a sensor.

[0251] By using coupling coils and coupling capacitors, it becomes possible to charge energy storage devices without contact. Furthermore, the coupling coil can be changed into an antenna. Here, a secondary battery is used as an energy storage device. An example of its use is shown. The primary coil of the charger and the secondary coil of the electronic device are magnetically coupled. By using an electromagnetic induction method that generates a voltage in the secondary coil using an alternating magnetic field generated from the first coil, Charging is performed by a mechanism in which power is transmitted to the secondary coil side without contact. (Curved surface of the structure) Since it is preferable to provide the coil in contact with the film, the coil of the electronic device also has a flexible film. It is preferable to install it in the m. Here, a coil installed in an electronic device is used as an antenna. That's fine.

[0252] When an antenna is provided on the secondary battery of a finger-worn electronic device having a display module, It is not limited to charging secondary batteries by touch, but also incorporates memory to send and receive electronic data. It can be used to obtain location information and GPS time, and display location and time. You may also install an antenna that can do things like that.

[0253] For safety reasons, the input and output terminals for charging or discharging the secondary battery are not exposed, as it will come into contact with a part of the human body. It is preferable not to allow it to be exposed. If the input / output terminals are exposed, water such as rain can damage the input / output terminals. There is a risk of short circuits or electric shock if the input / output terminals come into contact with the human body. If such a device is present, the input / output terminals can be configured not to be exposed on the surface of the electronic device.

[0254] Except for the inclusion of an antenna, coil, and wireless power supply converter, the same applies to Embodiment 1. Since it is identical to [the previous explanation], further detailed explanations will be omitted here.

[0255] According to Embodiment 1, an energy storage device, in this case a secondary battery, is fixed on a board, and a surface is placed on the secondary battery. Attach the indicator module. The secondary battery preferably has a curved shape. Also, The secondary battery is preferably flexible. A wireless power supply unit is electrically connected to the secondary battery. Install the converter and antenna. Also, ensure that the wireless power supply converter and part of the display unit overlap. Secure it.

[0256] The wireless power converter and antenna weigh less than 10g, and the total weight is almost the same as in Embodiment 1. It can be made to have almost the same weight.

[0257] Figure 12 shows a schematic diagram of an electronic device 400 having an antenna (not shown) and a charger 401. As shown, if the electronic device 400 is placed on the charger 401, power will be supplied from the antenna of the charger 401. This can be supplied to the electronic device 400 to charge the secondary battery of the electronic device 400.

[0258] Furthermore, information such as the remaining battery level and the time remaining until full charge is displayed on the display unit of the electronic device 300. It is possible to display it.

[0259] This embodiment can be freely combined with other embodiments.

[0260] (Embodiment 4) In this embodiment, a flexible storage battery 10 that can be used in one aspect of the present invention Let's explain point 8.

[0261] In this embodiment, a flexible storage battery 108 is provided with an outer casing made of film. An example using a thin secondary battery is shown. Figure 19 shows the external view of the thin secondary battery. The cross-sections cut along the dashed lines A1-A2 and B1-B2 in Figure 19 are shown in Figure 20(A) and Figure 20(A) respectively. This is shown in Figure 20(B).

[0262] The thin rechargeable battery consists of a sheet-shaped positive electrode 1203, a sheet-shaped negative electrode 1206, and a separate... The components consist of 1207, electrolyte 1208, an outer casing 1209 made of film, and a positive lead electrode. It has 1510 and a negative lead electrode 1511. The positive electrode is provided inside the outer casing 1209. A separator 1207 is installed between 1203 and the negative electrode 1206. Also, the outer casing 1 Inside 209, electrolyte 1208 is injected. The positive electrode 1203 is connected to the positive electrode current collector 1201. The negative electrode 1206 has a negative electrode current collector 1204 and a negative electrode active material layer 1202. It has a material layer 1205.

[0263] As for the materials of the positive electrode current collector 1201 and the negative electrode current collector 1204, significant changes within the energy storage device There are no special restrictions as long as it exhibits high conductivity without causing chemical changes. For example, gold, platinum, Metals such as zinc, iron, nickel, copper, aluminum, titanium, and tantalum, and their alloys. (Stainless steel, etc.) or alloys of these metals with other metals can be used. Furthermore, it improves the heat resistance of materials such as silicon, titanium, neodymium, scandium, and molybdenum. Aluminum alloys with added elements can be used. Also, they react with silicon to form silicon. It may be formed with a metallic element that forms a silicide. It reacts with silicon to form a silicide. Examples of metallic elements include zirconium, titanium, hafnium, vanadium, niobium, and tantalum. Examples include chromium, molybdenum, tungsten, cobalt, nickel, etc. Positive electrode current collector 12 01, and the negative electrode current collector 1204 can be foil-shaped, plate-shaped (sheet-shaped), mesh-shaped, cylindrical, coil-shaped, Shapes such as perforated metal or expanded metal can be used as appropriate. Positive electrode cluster The current collector 1201 and the negative electrode current collector 1204 shall have a thickness of 5 μm or more and 30 μm or less. It would be good to do so.

[0264] The positive electrode active material layer 1202 is a material that allows carrier ions to be inserted and removed. It can be used, for example, olivine-type crystal structure, layered rock salt-type crystal structure, or s Examples include lithium-containing materials with a Pinel-type crystal structure. For example, alkali metals (such as lithium, sodium, and potassium), alkaline earth elements Metals (e.g., calcium, strontium, barium, etc.), beryllium, magnesium etc. can be used.

[0265] When lithium is used as the carrier ion, as the positive electrode active material, for example, LiFe O2, LiCoO2, LiNiO2, LiMn2O4, V2O5, Cr2O5, MnO2 and other compounds can be used.

[0266] Or a lithium-containing composite phosphate (general formula LiMPO4 (M is one or more of Fe(II), Mn( II), Co(II), Ni(II))) can be used. Representative examples of the general formula LiM PO4 include LiFePO4, LiNiPO4, LiCoPO4, LiMn PO4, LiFe a Ni b PO4, LiFe a Co b PO4, LiFe a Mn b PO4, LiNi a Co b PO4, LiNi a Mn b PO4 (a + b is 1 or less, 0 < a < 1, 0 < b < 1), LiFe c Ni d Co e PO4, LiFe c Ni d Mn e PO4, LiNi c Co d Mn e PO4 (c + d + e is 1 or less, 0 < c < 1, 0 < d < 1, 0 < e < 1), L iFe f Ni g Co[[ID=6⑨]] h Mn i PO4 (f + g + h + i is 1 or less, 0 < f < 1, 0 < g < 1 , 0 < h < 1, 0 < i < 1), etc.

[0267] In particular, LiFePO4 offers safety, stability, high capacity density, high potential, and initial oxidation (charging) It satisfies the requirements for a positive electrode active material in a balanced way, including the presence of extractable lithium ions. Therefore, it is preferable.

[0268] Examples of lithium-containing materials having a layered rock salt-type crystal structure include lithium cobalt oxide. LiCoO2, LiNiO2, LiMnO2, and Li2MnO3 can be used. Also, LiNi 0.8 Co 0.2 NiCo-based compounds such as O2 (the general formula is LiNi x CO1 -x O2(0 <x<1))、LiNi 0.5 Mn 0.5 NiMn-based materials such as O2 (the general formula is, LiRing x Mn 1-x O2(0 <x<1))、LiNi 1 / 3 Mn 1 / 3 Co 1 / 3 O2 NiMnCo-based (also called NMC; the general formula is LiNi) x Mn y Co 1-x-y O2 (x>0, y>0, x+y<1)) can be used. Also, Li(Ni 0.8 Co 0.15 Al 0.05 )O2, Li2MnO3-LiMO2 (M=Co, Ni, Mn), etc. You can use it.

[0269] Examples of lithium-containing materials having a spinel-type crystal structure include LiMn2O4, Li 1+x Mn 2-x O4(0 <x<2)、LiMn 2-x Al x O4(0 <x<2)、 LiMn 1.5 Ni 0.5 O4 is one example.

[0270] Lithium-containing materials having a spinel-type crystal structure containing manganese, such as LiMn2O4 , small amounts of lithium nickelate (LiNiO2 or LiNi 1-x MO2(M=Co, Al, etc.) Mixing )) has advantages such as suppressing manganese elution and suppressing the decomposition of the electrolyte. preferable.

[0271] Furthermore, as the positive electrode active material, Li (2-j) MSiO4 (where M is Fe(II), M Lithium-containing materials such as n(II), Co(II), Ni(II), one or more (0 ≤ j ≤ 2) The following can be used: General formula Li (2-j) A typical example of MSiO4 is Li (2- j) FeSiO4, Li (2-j) NiSiO4, Li (2-j) CoSiO4, Li ( 2-j) MnSiO4, Li (2-j) Fe k Ni l SiO4, Li (2-j) Fe k C o l SiO4, Li (2-j) Fe k Mn l SiO4, Li (2-j) Ni k Co l Si O4, Li (2-j) Ni k Mn l SiO4(k+l is 1 or less, 0 <k<1、0<l<1 ), Li (2-j) Fe m Ni n Co q SiO4, Li (2-j) Fe m Ni n Mn q S iO4, Li (2-j)Ni m Co n Mn q SiO4 (where m + n + q is 1 or less, 0 < m < 1 , 0 < n < 1, 0 < q < 1), Li (2-j) Fe r Ni s Co t Mn u SiO4 (where r + s + t + u is 1 or less, 0 < r < 1, 0 < s < 1, 0 < t < 1, 0 < u < 1), etc. Lithium compounds can be used as materials.

[0272] Also, as the positive electrode active material, A x M2(XO4)3 (A = Li, Na, Mg, M = Fe, Mn, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si) represented by the general formula NASICON-type compounds can be used. NASICON-type compounds include Fe2(MnO4 )3, Fe2(SO4)3, Li3Fe2(PO4)3, etc. Also, as the positive electrode active material represented by the general formula of Li2MPO4F, Li2MP2O7, Li5MO4 (M = Fe, Mn) compounds, perovskite-type fluorides such as NaF3, FeF3, metal chalcogenides (sulfides, selenides, tellurides) such as TiS2, MoS 2, materials having a reverse spinel-type crystal structure such as LiMVO4, vanadium oxide-based (V2O5, V6O , LiV 13 , 3O8, etc.), manganese oxides, organic sulfur compounds, etc. can be used. 3O8, etc.), manganese oxides, organic sulfur compounds, etc. can be used.

[0273] Also, in the positive electrode active material layer 1202, in addition to the above-mentioned positive electrode active material, a binder for enhancing the adhesion of the active material , a conductive aid for enhancing the conductivity of the positive electrode active material layer 1202, etc. may be included.

[0274] ​As the negative electrode active material layer 1205, dissolution and deposition of metals that become carrier ions, or carrier Materials that allow ions to be inserted and removed can be used. For example, lithium gold Metallic materials, carbon materials, metallic materials, non-metallic materials, etc., can be used.

[0275] Lithium metal has a low oxidation-reduction potential (-3.045V compared to a standard hydrogen electrode) and is heavy And they have a high specific capacity per unit volume (3860mAh / g and 2062mAh / cm³, respectively). 3 Therefore, it is preferable.

[0276] Carbon materials include graphite, easily graphitizable carbon (soft carbon), and poorly graphitizable carbon (hard carbon). Examples include carbon dioxide, carbon nanotubes, graphene, and carbon black.

[0277] Graphite includes mesocarbon microbeads (MCMB), coke-based artificial graphite, and pip There are artificial graphites such as cyanide-based artificial graphite and natural graphites such as spheroidized natural graphite.

[0278] Graphite is formed when lithium ions are inserted into graphite (during the formation of lithium-graphite intercalation compounds). It exhibits a potential as low as lithium metal (below 0.3V vs. Li / Li + ).this This allows lithium-ion secondary batteries to exhibit a high operating voltage. Furthermore, graphite, It has a relatively high capacity per unit volume, low volume expansion, is inexpensive, and is comparable to lithium metal. They are preferable because they have advantages such as high safety.

[0279] Furthermore, as a negative electrode active material, the dissolution and deposition of metals that become carrier ions, or carrier ions A material can be used that allows the ion to be inserted and removed. If it is an ion, for example, Mg, Ca, Al, Si, Ge, Sn, Pb, Sb, As, A material containing at least one of Bi, Ag, Au, Zn, Cd, Hg, and In, etc. It can be used. Such elements have a large capacity compared to carbon, and silicon in particular is theoretical. The capacity is dramatically high at 4200mAh / g. Therefore, silicon is used as the negative electrode active material. This is preferable. Also, the dissolution and deposition of metals that become carrier ions, or the insertion of carrier ions Examples of materials that can be added and removed include SiO, Mg2Si, Mg2Ge, and Sn. O, SnO2, Mg2Sn, SnS2, V2Sn3, FeSn2, CoSn2, Ni3S n2, Cu6Sn5, Ag3Sn, Ag3Sb, Ni2MnSb, CeSb3, LaSn 3. La3Co2Sn7, CoSb3, InSb, SbSn, etc. can be used.

[0280] Furthermore, titanium dioxide (TiO2) and lithium titanium oxide (Li4) are used as negative electrode active materials. Ti5O 12 ), lithium-graphite intercalation compound (Li x C6), niobium pentoxide (Nb2O5) ), use oxides such as tungsten oxide (WO2) and molybdenum oxide (MoO2). It is possible.

[0281] Furthermore, as the negative electrode active material, a Li3N type structure, which is a lithium and transition metal binitride, is also used. TsuLi 3-x M x N (M = Co, Ni, Cu) can be used. For example, Li 2. 6Co 0.4 The N3 has a large charge / discharge capacity (900mAh / g, 1890mAh / cm²). 3 )of This is preferable.

[0282] When using a lithium-transition metal binitride, lithium ions are included in the negative electrode active material. In combination with materials such as V2O5 and Cr3O8 that do not contain lithium ions as the positive electrode active material. It is preferable that this be done. Furthermore, when using a material containing lithium ions as the positive electrode active material, Also, by pre-desorbing the lithium ions contained in the positive electrode active material, the negative electrode active material A lithium-transition metal composite can be used as the composite material.

[0283] Furthermore, materials that undergo a conversion reaction can also be used as the negative electrode active material. For example For example, lithium, such as cobalt oxide (CoO), nickel oxide (NiO), and iron oxide (FeO). Transition metal oxides that do not undergo alloying reactions with chromium may be used as the negative electrode active material. The materials that can react are also Fe2O3, CuO, Cu2O, RuO2, and Cr2 Oxides such as O3, CoS 0.89 , sulfides such as NiS and CuS, Zn3N2, Cu3N, Nitrides such as Ge3N4, phosphides such as NiP2, FeP2, CoP3, FeF3, BiF This also occurs with fluorides of grade 3. Furthermore, because the potential of the above fluorides is high, they are not used as positive electrode active materials. It's okay to be there.

[0284] Furthermore, the negative electrode active material layer 1205 contains, in addition to the negative electrode active material mentioned above, a material that enhances the adhesion of the active material. A binder, a conductive additive to enhance the conductivity of the negative electrode active material layer 1205, etc. You may have it.

[0285] As an electrolyte, electrolyte 1208 is capable of transporting carrier ions. Furthermore, a material having carrier ions can be used. When ON, typical examples of electrolytes include LiPF6, LiClO4, and Li(FS). O2)2N, LiAsF6, LiBF4, LiCF3SO3, Li(CF3SO2)2N Lithium salts such as Li(C2F5SO2)2N exist. These electrolytes are used individually. It may be used as is, or two or more may be used in any combination and ratio. Also, reaction product To make the material more stable, a small amount (1 wt%) of vinylene carbonate (VC) is added to the electrolyte. Additionally, the decomposition of the electrolyte may be further reduced.

[0286] Furthermore, a material that allows for the movement of carrier ions is used as the solvent for electrolyte 1208. A non-protic organic solvent is preferred as the solvent for the electrolyte. Representative non-protic organic solvents Examples include ethylene carbonate (EC), propylene carbonate, and dimethyl carbonate. Diethyl carbonate (DEC), γ-butyrolactone, acetonitrile, dimethyl carbonate Examples include toxyethane and tetrahydrofuran, and one or more of these can be used. It can be done. In addition, by using a polymer material that gels as the solvent for the electrolyte, leakage can be prevented. This increases safety. Furthermore, it enables thinner and lighter batteries. The high-molecular-weight components that are gelled... Typical examples of these materials include silicone gel, acrylic gel, acrylonitrile gel, and poly Ethylene oxide gels, polypropylene oxide gels, fluorine polymer gels These include, among others. Furthermore, as the solvent for the electrolyte, a flame-retardant and non-volatile ionic liquid (molten at room temperature) is used. By using one or more salts, the internal temperature of the battery can be reduced due to internal short circuits or overcharging. Even if the temperature rises, it can prevent the battery from rupturing or catching fire.

[0287] For example, an insulator can be used as the separator 1207. For example, cellulose (paper), polypropylene or polyethylene with voids, etc. can be used. It is possible.

[0288] The rechargeable battery has a thin, flexible film (e.g., laminate film) as its outer casing. It is used as follows. Laminate film is a laminated film made of a base film and an adhesive synthetic resin film. This refers to a film, or a laminated film made of two or more types of films. Examples of base films include PET and PB. Polyesters such as T, polyamides such as nylon 6 and nylon 66, and inorganic vapor-deposited films. Alternatively, paper can be used. Also, adhesive synthetic resin films such as PE and PP can be used. Polyolefins, acrylic synthetic resins, epoxy synthetic resins, etc., can be used. The film is laminated to the object to be processed by heat and pressure using a laminating device. It is preferable to apply an anchor coating agent as a pretreatment before the lamination process. The adhesion between the coating film and the object to be treated can be made stronger. For this purpose, isocyanate-based compounds should be used.

[0289] In the above configuration, the casing 1209 of the secondary battery has a radius of curvature of 30 mm or more, preferably curved. It can be deformed within a range of a radius of 10 mm or more. The film that forms the outer casing of the secondary battery is It consists of one or two layers, and in the case of a rechargeable battery with a stacked structure, the curved battery The cross-sectional structure consists of two curved sections of the outer film.

[0290] The radius of curvature of a surface will be explained using Figure 21. In Figure 21(A), the curved surface 170 In the plane 1701 that cuts through 0, a portion of the curve 1702 contained in the curved surface 1700 is a circle Approximating it as an arc, let the radius of the circle be the radius of curvature 1703, and the center of the circle be the center of curvature 1704. Figure 21(B) shows a top view of the curved surface 1700. Figure 21(C) shows the curved surface on plane 1701. The cross-sectional view of 1700 is shown. When a curved surface is cut by a plane, the angle of the plane relative to the curved surface... The radius of curvature of the curve appearing in the cross-section will differ depending on the cutting position, but this specification In such cases, the smallest radius of curvature is taken as the radius of curvature of the surface.

[0291] A curved secondary battery was constructed using two films as an outer casing, sandwiching the electrodes, electrolyte, and other components of the 1805 battery. In this case, the radius of curvature 1802 of the film 1801 on the side closer to the center of curvature 1800 of the secondary battery. This is smaller than the radius of curvature 1804 of film 1803 on the side farther from the center of curvature 1800. Figure 22(A)). When the secondary battery is curved to make the cross-section arc-shaped, the center of curvature is close to 1800. Compressive stress is applied to the surface of the film, and tension is present on the surface of the film far from the center of curvature of 1800. Tension stress is applied (Figure 22(B)). Patterns are formed on the surface of the exterior body by recesses or protrusions. Once formed, even if compressive or tensile stresses are applied, the effects of strain remain. This can be kept within an acceptable range. Therefore, the secondary battery has an outer casing that is closer to the center of curvature. It can be deformed within a range where the radius of curvature is 30 mm or more, preferably 10 mm or more.

[0292] Furthermore, the cross-sectional shape of a secondary battery is not limited to a simple arc shape, but can also have a shape in which part of it is an arc. It is possible to create shapes such as the one shown in Figure 22(C), or wavy (Figure 22(D)), or S-shaped. It is also possible to do so. If the curved surface of the secondary battery has a shape with multiple centers of curvature, Among the radii of curvature at each of the number of curvature centers, in the surface with the smallest radius of curvature, 2 The radius of curvature of the outer casing closest to the center of curvature of each outer casing is 30 mm or more, preferably 10 mm. The secondary battery can be deformed within the range described above.

[0293] This embodiment can be freely combined with other embodiments.

[0294] (Embodiment 5) When multiple battery cells are used in the ring-shaped electronic device described in the above embodiment, multiple batteries Battery control unit (Battery Manager) that can be used in combination with cells. A suitable transistor for the circuit constituting the battery control unit (BMU) and the battery control unit. The inverter will be described with reference to Figures 28 to 34. In this embodiment, in particular, it is connected in series. This document describes a battery control unit for an energy storage device having battery cells connected to it.

[0295] When multiple battery cells connected in series are repeatedly charged and discharged, the characteristics between the battery cells change. The capacity (output voltage) will vary depending on the variation. The total discharge capacity depends on the smallest battery cell. If there is variation in capacity, the discharge... The charging capacity will decrease. Also, if charging is performed using a battery cell with a smaller capacity as the baseline, charging will be slower. There is a risk of insufficient capacity. Also, if charging is performed based on a larger capacity battery cell, overcharging may occur. There is a risk that this will happen.

[0296] Therefore, the battery control unit of an energy storage device having battery cells connected in series will be in a state of insufficient charge. It also has a function to equalize the capacity variations between battery cells, which can cause overcharging. Circuit configurations to equalize the capacitance variations between them include resistor methods, capacitor methods, or industrial There are various methods such as the Kuta method, but here we will use a transistor with a small off-current to compensate for the variation in capacitance. I will explain by giving an example of a circuit configuration that can be assembled.

[0297] As a transistor with a low off-current, a transistor having an oxide semiconductor in the channel formation region is an example. A transistor (OS transistor) is preferred. An OS transistor with a small off-current is used in the energy storage device. By using it in the circuit configuration of the battery control unit, the amount of charge leaking from the battery is reduced, and This can suppress the decrease in capacity over time.

[0298] The oxide semiconductor used in the channel formation region is In-M-Zn oxide (where M is Ga, Sn, Y, Zr, La, Ce, or Nd are used. They are used to form oxide semiconductor films. In the target, if the atomic ratio of the metal elements is In:M:Zn=x1:y1:z1, 、 x1 / y1 is between 1 / 3 and 6, and moreover, between 1 and 6, and z1 / y1 is 1 It is preferable that z1 / y1 is between 3 and 6, and more preferably between 1 and 6. By setting the upper limit to 6 or lower, the CAAC-OS film is more easily formed as an oxide semiconductor film.

[0299] Now, let's discuss the CAAC-OS membrane.

[0300] CAAC-OS film is an oxide semiconductor film having multiple c-axis oriented crystalline regions.

[0301] Transmission Electron Microscope (TEM) A composite analysis image of the CAAC-OS film's bright-field image and diffraction pattern (using a scope) Also known as a high-resolution TEM image, multiple crystalline regions can be identified by observing it. On the other hand, high-resolution TEM images also clearly show the boundaries between crystalline parts, i.e., grain boundaries. Also called boundary.) It is not possible to confirm. Therefore, the CAAC-OS membrane is This means that a decrease in electron mobility due to grain boundaries is less likely to occur.

[0302] When observing a high-resolution TEM image of the cross-section of the CAAC-OS film from a direction approximately parallel to the sample surface, In the crystalline region, it can be confirmed that the metal atoms are arranged in layers. Each layer of metal atoms is: The surface (also called the film-forming surface) or the top surface of the CAAC-OS film reflects the unevenness of the surface on which the film is formed. It has a specific shape and is arranged parallel to the surface or top surface of the CAAC-OS film to be formed.

[0303] On the other hand, a high-resolution TEM image of the CAAC-OS film plane was observed from a direction approximately perpendicular to the sample surface. This confirms that in the crystalline region, the metal atoms are arranged in a triangular or hexagonal shape. However, no regularity is observed in the arrangement of metal atoms between different crystalline regions.

[0304] X-ray diffraction (XRD) applied to the CAAC-OS film. When structural analysis is performed using this method, for example, a CAAC-OS film having InGaZnO4 crystals is found. In the out-of-plane analysis, the diffraction angle (2θ) shows a peak near 31°. This peak may appear. This peak is attributed to the (009) plane of the InGaZnO4 crystal. Therefore, the crystals of the CAAC-OS film have c-axis orientation, and the c-axis is approximately aligned with the surface to be formed or the upper surface. It can be confirmed that it is facing vertically.

[0305] Furthermore, the out-of-plane method for CAAC-OS films containing InGaZnO4 crystals. Analysis revealed that in addition to a peak near 2θ = 31°, a peak also appeared near 2θ = 36°. In some cases, this may occur. Peaks near 36° 2θ indicate c-axis orientation in a portion of the CAAC-OS film. This indicates that it contains crystals that do not have [the specified characteristic]. The CAAC-OS film has 2θ near 31°. It is preferable that a peak is observed, and that no peak is observed near 36° for 2θ.

[0306] CAAC-OS films are oxide semiconductor films with low impurity concentrations. The impurities include hydrogen, carbon, These are elements other than silicon and transition metal elements, which are the main components of oxide semiconductor films. In particular, silicon Elements such as ions, which have a stronger bonding force with oxygen than the metal elements that make up oxide semiconductor films, By removing oxygen from the material semiconductor film, the atomic arrangement of the oxide semiconductor film is disrupted, reducing its crystallinity. This is a contributing factor. Also, heavy metals such as iron and nickel, argon, and carbon dioxide have a certain atomic radius. Because of its large molecular radius, when it is contained within an oxide semiconductor film, the oxide semiconductor film This disrupts the atomic arrangement and reduces crystallinity. Furthermore, these impurities are present in oxide semiconductor films. Objects can sometimes act as carrier traps or carrier sources.

[0307] Furthermore, CAAC-OS films are oxide semiconductor films with a low defect level density. For example, oxide Oxygen vacancies in semiconductor films can act as carrier traps or capture hydrogen. It can be a source of carrier activity.

[0308] A low impurity concentration and low defect level density (few oxygen vacancies) is referred to as high-purity intrinsic or This is essentially called high-purity intrinsic. High-purity intrinsic or substantially high-purity intrinsic oxide semiconductor film Because there are fewer carrier sources, the carrier density can be kept low. Therefore, The transistor using this oxide semiconductor film exhibits an electrical characteristic in which the threshold voltage becomes negative. Also called normally-on.) It rarely becomes high-purity intrinsic or substantially high-purity. Highly intrinsic oxide semiconductor films have few carrier traps. Transistors using body membranes exhibit less variation in electrical characteristics and are highly reliable. Furthermore, the charge trapped in the carrier trap of the oxide semiconductor film requires time to be released. It can remain dormant for a long time, behaving almost like a fixed charge. Therefore, the impurity concentration Transistors using oxide semiconductor films with high defect level density have unstable electrical properties. It can happen.

[0309] Furthermore, transistors using CAAC-OS films exhibit electrical characteristics under irradiation with visible light and ultraviolet light. The fluctuations are small.

[0310] OS transistors are transistors that have silicon in the channel formation region (SiT Because it has a larger band gap compared to a transistor, dielectric breakdown occurs when a high voltage is applied. It is difficult. When battery cells are connected in series, a voltage of several hundred volts is generated, but The circuit configuration of the battery control unit of an energy storage device applied to battery cells like the one described above includes the OS It is suitable to construct it using transistors.

[0311] Figure 28 shows an example of a block diagram of an energy storage device. The energy storage device BT00 shown in Figure 28 is terminal Child pair BT01, terminal pair BT02, switching control circuit BT03, switching circuit BT0 4, the switching circuit BT05, the transformer control circuit BT06, the transformer circuit BT07, and in series It has a battery section BT08 which includes a plurality of connected battery cells BT09.

[0312] Furthermore, in the energy storage device BT00 shown in Figure 28, terminal pair BT01 and terminal pair BT02 are connected. Switching control circuit BT03, switching circuit BT04, switching circuit BT05, and transformer control The section consisting of circuit BT06 and transformer circuit BT07 is called the battery control unit. It is possible.

[0313] The switching control circuit BT03 controls the operation of switching circuits BT04 and BT05. Control. Specifically, the switching control circuit BT03 measures each battery cell BT09. Based on the voltage, the battery cells to be discharged (discharge battery cell group) and the battery cells to be charged (charge battery cell group) are selected. Determine the group of cells in the pond.

[0314] Furthermore, the switching control circuit BT03 controls the determined group of discharge battery cells and the recharge battery cells. Based on the group, control signals S1 and S2 are output. Control signal S1 is output when switching. The signal is output to path BT04. This control signal S1 connects terminal pair BT01 and the group of discharge battery cells. This is a signal that controls the switching circuit BT04 to keep it running. Also, the control signal S2 is for switching The signal is output to the replacement circuit BT05. This control signal S2 is connected to the terminal pair BT02 and the rechargeable battery cell. This is a signal that controls the switching circuit BT05 to connect the group.

[0315] Furthermore, the switching control circuit BT03 is connected to the switching circuit BT04, the switching circuit BT05, and Based on the configuration of the transformer circuit BT07, the terminal pair between BT01 and the group of discharge battery cells, or terminal Control the connection between the BT02 child unit and the rechargeable battery cell group so that terminals with the same polarity are connected to each other. Signal S1 and control signal S2 are generated.

[0316] This section describes the operation of the switching control circuit BT03 in detail.

[0317] First, the switching control circuit BT03 measures the voltage of each of the multiple battery cells BT09. The switching control circuit BT03 then, for example, switches battery cells BT09 with a voltage above a predetermined threshold. High-voltage battery cells (high-voltage cells), battery cells BT09 with a voltage below a predetermined threshold, low-voltage It is identified as a battery cell (low-voltage cell).

[0318] Furthermore, various methods can be used to determine whether a cell is high-voltage or low-voltage. Yes, it is possible. For example, the switching control circuit BT03 selects the most powered battery cell among the multiple battery cells BT09. Using the voltage of the battery cell BT09 with the highest or lowest voltage as a reference, each battery cell BT0 You may also need to determine whether 9 is a high-voltage cell or a low-voltage cell. In this case, the switching control circuit BT03 This determines whether the voltage of each battery cell BT09 is above a predetermined percentage of the reference voltage. By doing so, it is possible to determine whether each battery cell BT09 is a high-voltage cell or a low-voltage cell. Based on this determination, the switching control circuit BT03 then determines the discharge battery cell group and the charging battery Determine the group of cells in the pond.

[0319] Furthermore, within multiple BT09 battery cells, high-voltage and low-voltage cells are mixed together in various states. To obtain. For example, the switching control circuit BT03 is used in a situation where high-voltage cells and low-voltage cells are mixed together. The section where the most high-voltage cells are connected in series is designated as the discharge battery cell group. The replacement control circuit BT03 charges the section where the most low-voltage cells are connected in series. This is a group of battery cells. Furthermore, the switching control circuit BT03 is used when the battery cells are close to being overcharged or over-discharged. Even if you preferentially select BT09 as either a discharge battery cell group or a recharge battery cell group good.

[0320] Here, an example of the operation of the switching control circuit BT03 in this embodiment will be explained using Figure 29. Figure 29 is a diagram illustrating an example of the operation of the switching control circuit BT03. For the sake of explanation, Figure 29 uses the example of four BT09 battery cells connected in series. I will reveal it.

[0321] First, in the example in Figure 29(A), if the voltages of battery cells a to d are voltages Va to Vd, This shows the case where Va=Vb=Vc>Vd. In other words, three consecutive high-voltage Voltage cells a through c and one low-voltage cell d are connected in series. In this case, switching The control circuit BT03 determines that three consecutive high-voltage cells a to c are a group of discharge battery cells. Furthermore, the switching control circuit BT03 determines the low-voltage cell d as the rechargeable battery cell group. .

[0322] Next, the example in Figure 29(B) shows the case where Vc > Va = Vb >> Vd. In other words, two consecutive low-voltage cells a and b, one high-voltage cell c, and one over-discharge cell. The nearby low-voltage cell d is connected in series. In this case, the switching control circuit BT03 is The high-voltage cell c is determined to be the discharge battery cell group. Also, the switching control circuit BT03 is low Because voltage cell d is close to over-discharge, instead of using the two consecutive low-voltage cells a and b, The voltage cell d is given priority as the group of rechargeable battery cells.

[0323] Finally, the example in Figure 29(C) shows the case where Va > Vb = Vc = Vd. In other words, one high-voltage cell a is connected in series with three consecutive low-voltage cells b through d. In this case, the switching control circuit BT03 determines that high-voltage cell a is the same as the discharge battery cell group. The switching control circuit BT03 charges three consecutive low-voltage cells b through d. This will be determined as a group of battery cells.

[0324] The switching control circuit BT03 is determined as shown in the examples in Figures 29(A) to (C) above. Based on this, information indicating the group of discharge battery cells to which the switching circuit BT04 is connected is set. The control signal S1 and information indicating the group of rechargeable battery cells to which the switching circuit BT05 is connected are provided. The specified control signal S2 is sent to switching circuits BT04 and BT05. Output each of them.

[0325] The above is a detailed explanation of the operation of the switching control circuit BT03.

[0326] The switching circuit BT04 responds to the control signal S1 output from the switching control circuit BT03. The connection destination of terminal pair BT01 is determined by the switching control circuit BT03 to the discharge battery. Set to group L.

[0327] Terminal pair BT01 consists of a pair of terminals A1 and A2. Switching circuit BT04 This involves connecting either terminal A1 or A2 to the upstream (high current) terminal within the group of discharge battery cells. Connect to the positive terminal of battery cell BT09 located on the (position) side, and the other side to the most discharged battery cell group. By connecting to the negative terminal of battery cell BT09 located downstream (low potential side), the terminal Set the connection destination for BT01. Note that the switching circuit BT04 is set to control signal S1. The location of the discharge battery cells can be recognized using the collected information.

[0328] The switching circuit BT05 responds to the control signal S2 output from the switching control circuit BT03. The connection destination of the terminal pair BT02 is determined by the switching control circuit BT03 to the rechargeable battery. Set to group L.

[0329] Terminal pair BT02 consists of the paired terminals B1 and B2. Switching circuit BT05 This involves connecting either terminal B1 or B2 to the upstream (high current) terminal within the rechargeable battery cell group. Connect to the positive terminal of battery cell BT09 located on the (position) side, and the other side to the most in the group of rechargeable battery cells. By connecting to the negative terminal of battery cell BT09 located downstream (low potential side), the terminal Set the connection destination for BT02. Note that the switching circuit BT05 is set to control signal S2. The location of the battery cell group can be recognized using the collected information.

[0330] Figures 30 and 3 show circuit diagrams illustrating example configurations of switching circuits BT04 and BT05. As shown in 1.

[0331] In Figure 30, the switching circuit BT04 consists of multiple transistors BT10 and bus BT11 and It has bus BT12. Bus BT11 is connected to terminal A1. Also, bus BT1 2 is connected to terminal A2. The source or drain of multiple transistors BT10 One side is connected to buses BT11 and BT12 alternately, one at a time. The source or drain of each of the multiple transistors BT10 is connected to two adjacent It is connected between the BT09 battery cells.

[0332] Of the multiple transistors BT10, the transistor BT10 located at the very top The other end of the drain is the positive electrode of battery cell BT09, which is located at the uppermost part of battery section BT08. It is connected to the terminal. Also, among the multiple transistors BT10, the one located furthest downstream is... The source or drain of the transistor BT10 is located at the downstream end of the battery unit BT08. It is connected to the negative terminal of battery cell BT09.

[0333] The switching circuit BT04 provides a control signal S1 to the gates of multiple transistors BT10. Accordingly, one of the multiple transistors BT10 connected to bus BT11 and bus B Connect one of the multiple transistors BT10 connected to T12 to make it conductive. This connects the discharge battery cell group to the terminal pair BT01. The positive terminal of battery cell BT09, which is located in the uppermost part of the group, is terminal A1 or A of the terminal pair. It is connected to either of the two. Also, the battery cell located at the downstream end of the discharge battery cell group. The negative terminal of the BT09 is either terminal A1 or A2 of the terminal pair, i.e., the other terminal, i.e., the positive terminal. It connects to the terminal that is not connected to the other terminal.

[0334] It is preferable to use an OS transistor for transistor BT10. Because the off-current is small, it reduces the amount of charge leakage from battery cells that do not belong to the discharge battery cell group. Furthermore, the decrease in capacitance over time can be suppressed. Also, OS transistors are high Dielectric breakdown is less likely to occur when voltage is applied. Therefore, the output voltage of the discharge battery cell group is large. Even if the transistor BT10, which is in a non-conductive state, is connected to the battery cell BT09 and terminals It is possible to isolate BT01 from the other device.

[0335] Furthermore, in Figure 30, the switching circuit BT05 consists of multiple transistors BT13 and current control It has a switch BT14, a bus BT15, and a bus BT16. Buses BT15 and BT 16 is positioned between the multiple transistors BT13 and the current control switch BT14. The source or drain of multiple transistors BT13 alternately on the bus. It is connected to BT15 and BT16. Also, multiple transistors BT13 are source or The other end of the drain is connected between two adjacent battery cells BT09.

[0336] Of the multiple transistors BT13, the transistor BT13 located at the very top The other end of the drain is the positive electrode of battery cell BT09, which is located at the uppermost part of battery section BT08. It is connected to the terminal. Also, among the multiple transistors BT13, the one located furthest downstream is... The source or drain of the transistor BT13 is located at the downstream end of the battery unit BT08. It is connected to the negative terminal of battery cell BT09.

[0337] Transistor BT13 uses an OS transistor, similar to transistor BT10. This is preferable. OS transistors do not belong to the rechargeable battery cell group because they have a small off-current. This reduces the amount of charge leaking from the battery cell and suppresses the decrease in capacity over time. It can. Furthermore, OS transistors are less prone to dielectric breakdown when high voltage is applied. Therefore, Even if the voltage for charging the battery cells is high, the transistor BT remains in a non-conductive state. 13 can be used to insulate the battery cell BT09 to which it is connected from the terminal pair BT02.

[0338] The current control switch BT14 has switch pair BT17 and switch pair BT18. Switch to BT17 and Switch to BT18 are two switches connected in parallel. It has a switch. One end of each of the two switches included in the switch pair BT17 is connected to terminal B1 It is connected to the BT17 switch. Also, the other end of one switch included in the switch pair is connected to bus B Connected to T15, the other end of the switch included in the switch pair BT17 is on bus BT16 It is connected to the BT18. One end of each of the two switches included in the switch pair is connected to the end It is connected to child B2. Also, the other end of one switch included in switch pair BT18 is One end of the switch is connected to bus BT15, and the other end of the switch is connected to bus BT16.

[0339] The switches in switch pair BT17 and switch pair BT18 are transistor BT10 And, similar to transistor BT13, it is preferable to use an OS transistor.

[0340] The switching circuit BT05 controls the transistor BT13 and current control according to the control signal S2. By controlling the on / off state combination of switch BT14, the rechargeable battery cell group Connect the terminal to BT02.

[0341] The switching circuit BT05, as an example, connects the rechargeable battery cell group and terminal pair BT0 as follows. Connect to 2.

[0342] The switching circuit BT05 provides a control signal S2 to the gates of multiple transistors BT13. Accordingly, it is connected to the positive terminal of battery cell BT09, which is located in the upstream position among the rechargeable battery cell group. The transistor BT13 is made conductive. Also, the switching circuit BT05 has multiple In accordance with the control signal S2 applied to the gate of transistor BT13, in the group of rechargeable battery cells Transistor BT13 is connected to the negative terminal of battery cell BT09, which is located furthest downstream. To make it conductive.

[0343] The polarity of the voltage applied to terminal pair BT02 corresponds to the group of discharge battery cells connected to terminal pair BT01. This may vary depending on the configuration of the transformer circuit BT07. Also, the method for charging the battery cell group To allow current to flow in one direction, the same polarity terminals must be connected between the BT02 terminal pair and the group of rechargeable battery cells. It is necessary to connect the wire. Therefore, the current control switch BT14 is controlled by the control signal S2, Depending on the polarity of the voltage applied to terminal pair BT02, switch pair BT17 and switch pair BT The system is controlled to switch between each of the 18 connection destinations.

[0344] As an example, a voltage is applied to the terminal pair BT02 such that terminal B1 is the positive terminal and terminal B2 is the negative terminal. Let's explain by listing the conditions in which this is happening. At this time, the battery cell BT09 at the downstream end of the battery unit BT08 If it is a group of rechargeable battery cells, the switch to BT17 will, by the control signal S2, control the battery cells It is controlled to connect to the positive terminal of BT09. That is, the switch to BT17 The switch connected to bus BT16 is turned ON, and the switch is connected to bus BT17. The switch connected to 5 is turned off. Meanwhile, the switch to BT18 receives the control signal S2 This controls the connection to the negative terminal of the battery cell BT09. The switch connected to bus BT15 for switch to BT18 is turned ON, and switch to B The switch connected to bus BT16 of T18 is turned off. In this way, the terminal pair Terminals with the same polarity are connected between the BT02 and the rechargeable battery cell group. The direction of the current flowing from the BT02 is controlled to charge the battery cells. It will be done.

[0345] Furthermore, the current control switch BT14 is not the switching circuit BT05, but the switching circuit BT It may be included in 04. In this case, the operation of the current control switch BT14, control signal S1 Accordingly, by controlling the polarity of the voltage applied to terminal pair BT01, terminal pair BT0 The polarity of the voltage applied to terminal 2 is controlled. The current control switch BT14 controls terminal pair B T02 controls the direction of the current flowing from the rechargeable battery cell group.

[0346] Figure 31 shows an example configuration of switching circuits BT04 and BT05, which differs from that shown in Figure 30. This is a circuit diagram showing the circuit.

[0347] In Figure 31, the switching circuit BT04 consists of multiple transistor pairs BT21 and bus BT24 It also has bus BT25. Bus BT24 is connected to terminal A1. BT25 is connected to terminal A2. One end of the multiple transistor pair BT21 is connected to it. These are branched by transistors BT22 and BT23. Either the source or drain of BT22 is connected to bus BT24. Either the source or drain of the BT23 is connected to the BT25 bus. The other ends of each pair of transistors are connected between two adjacent battery cells BT09. It is stated that among the multiple transistor pairs BT21, the transistor located at the very top of the group is the one located upstream. The other end of BT21 is connected to the positive terminal of battery cell BT09, which is located at the uppermost part of the battery section BT08. They are connected. Also, among the multiple transistor pairs in BT21, the downstream transistor is... The other end of the ZISTA pair BT21 is the negative electrode of battery cell BT09, which is located at the downstream end of the battery section BT08. It is connected to the terminal.

[0348] The switching circuit BT04 switches transistor BT22 and transistor according to the control signal S1. By switching the conduction / non-conduction state of BT23, the contact between the transistor and BT21 is Switch the destination to either terminal A1 or terminal A2. For details, see transistor B If T22 is conducting, transistor BT23 will be non-conducting, and its connection point will be the terminal. It becomes child A1. On the other hand, if transistor BT23 is conducting, then transistor BT22 It becomes non-conductive, and its connection point is terminal A2. Transistor BT22 and Trans Which of the BT23 terminals becomes conductive is determined by the control signal S1.

[0349] Two transistor pairs, BT21, are used to connect terminal pair BT01 to the group of discharge battery cells. It can be. In detail, based on the control signal S1, the connection destination of the two transistors to BT21 Once these are determined, the group of discharge battery cells and the terminal pair BT01 are connected. The connections of the two transistor pairs BT21 are such that one is terminal A1 and the other is terminal The system is controlled by control signal S1 to achieve A2.

[0350] The switching circuit BT05 consists of multiple transistor pairs BT31, bus BT34 and bus BT It has 35. Bus BT34 is connected to terminal B1. Bus BT35 is It is connected to terminal B2. One end of each of the multiple transistor pairs BT31 is connected to the transistor It is branched by transistor BT32 and transistor BT33. Transistor BT32 One of the branching ends is connected to bus BT34. Also, transistor BT33 One branching end is connected to bus BT35. Additionally, multiple transistors are paired with BT31. The other end is connected between two adjacent battery cells BT09. Of the transistor pairs BT31, the other end of the transistor pair BT31 located at the uppermost position is It is connected to the positive terminal of battery cell BT09, which is located at the uppermost part of the battery section BT08. Among the multiple transistor pairs BT31, the other transistor pair BT31 located at the furthest downstream The end is connected to the negative terminal of battery cell BT09, which is located at the downstream end of battery section BT08. .

[0351] The switching circuit BT05 switches transistor BT32 and transistor in response to the control signal S2. By switching the conduction / non-conduction state of BT33, the contact between the transistor and BT31 is Switch the destination to either terminal B1 or terminal B2. For details, see transistor B If T32 is conducting, transistor BT33 will be non-conducting, and its connection point will be the terminal. It becomes child B1. Conversely, if transistor BT33 is conducting, then transistor BT32 It becomes non-conductive, and its connection point is terminal B2. Transistor BT32 and Trans Which of the BT33 terminals becomes conductive is determined by the control signal S2.

[0352] To connect the terminal pair BT02 to the battery cell group, two transistor pairs BT31 are used. It can be. In detail, based on the control signal S2, the connection destination of the two transistors to BT31 Once these are determined, the rechargeable battery cell group and the terminal pair BT02 are connected. The connections of each pair of transistors in BT31 are such that one is to terminal B1 and the other is to terminal It is controlled by the control signal S2 so that it becomes B2.

[0353] Furthermore, the connections of the two transistor pairs BT31 are applied to the terminal pair BT02. This is determined by the polarity of the voltage. Specifically, terminal B1 is the positive terminal and terminal B2 is the negative terminal. When such a voltage is applied to terminal pair BT02, the upstream transistor pair BT31 is Transistor BT32 becomes conductive, and transistor BT33 becomes non-conductive. It is controlled by the control signal S2. On the other hand, the downstream transistor pair BT31 is Control the transistor BT33 to be in a conductive state and the transistor BT32 to be in a non-conductive state. It is controlled by signal S2. Also, the voltage such that terminal B1 is the negative terminal and terminal B2 is the positive terminal. If the signal is applied to terminal pair BT02, the upstream transistor pair BT31 is The control is set such that transistor BT33 becomes conductive and transistor BT32 becomes non-conductive. It is controlled by signal S2. On the other hand, the downstream transistor pair BT31 is Control signal S2 such that transistor BT32 is in a conducting state and transistor BT33 is in a non-conducting state. It is controlled by this. In this way, the same Terminals with polarity are connected to each other. Then, the direction of the current flowing from terminal to terminal BT02 is... The system is controlled to charge the battery cells.

[0354] The transformer control circuit BT06 controls the operation of the transformer circuit BT07. The number of BT09 battery cells included in the discharge battery cell group, and the number of batteries included in the recharge battery cell group. Based on the number of cells BT09, a transform signal S3 is generated to control the operation of the transformer circuit BT07. The output is then sent to the transformer circuit BT07.

[0355] Note that the number of BT09 battery cells included in the discharge battery cell group is the same as the number of BT09 battery cells included in the recharge battery cell group. If the number of battery cells exceeds the number of BT09 cells, the charging voltage will be excessively high for the battery cell group. It is necessary to prevent the application of the voltage. Therefore, the transformer control circuit BT06 is designed to prevent the rechargeable battery The transformer circuit BT07 is designed to reduce the discharge voltage (Vdis) to a level that allows the cell group to be charged. It outputs the control transform signal S3.

[0356] Furthermore, the number of BT09 battery cells included in the discharge battery cell group is the same as the number of BT09 battery cells included in the recharge battery cell group. If the number of battery cells is less than or equal to the number of BT09 cells, the charge required to charge the battery cell group will be charged. It is necessary to ensure sufficient voltage. Therefore, the BT06 transformer control circuit is designed to supply excess power to the battery cell group. The transformer circuit BT is designed to increase the discharge voltage (Vdis) within the range where no charging voltage is applied. It outputs a transformer signal S3 to control 07.

[0357] The voltage value that constitutes an excessive charging voltage is the BT09 battery cell used in the BT08 battery unit. The specifications can be determined in consideration of the product specifications, etc. Furthermore, the BT07 transformer circuit can be used for both step-up and step-down. The applied voltage is then applied to the terminal pair BT02 as the charging voltage (Vcha).

[0358] Here, an example of the operation of the transformer control circuit BT06 in this embodiment is shown in Figures 32(A) to (C). This will be explained using the following. Figures 32(A) to (C) show the discharge explained in Figures 29(A) to (C). This section describes an example of the operation of the BT06 transformer control circuit, corresponding to a battery cell group and a rechargeable battery cell group. This is a conceptual diagram for that purpose. Figures 32(A) to (C) illustrate the battery control unit BT41. The battery control unit BT41 has terminal pair BT01 and terminal pair B as described above. T02, switching control circuit BT03, switching circuit BT04, and switching circuit BT0 It consists of 5, the transformer control circuit BT06, and the transformer circuit BT07.

[0359] In the example shown in Figure 32(A), as explained in Figure 29(A), three consecutive high voltages Cells a through c are connected in series with one low-voltage cell d. In this case, see Figure 29(A As explained using ), the switching control circuit BT03 discharges high-voltage cells a to c. The battery cell group is determined, and the low-voltage cell d is determined as the rechargeable battery cell group. Then, the transformer Circuit BT06 is based on the number of battery cells BT09 included in the discharge battery cell group. Based on the ratio of the number of BT09 battery cells included in the rechargeable battery cell group, the discharge voltage (Vdi The conversion ratio N from s to charging voltage (Vcha) is calculated.

[0360] Note that the number of BT09 battery cells included in the discharge battery cell group is equal to the number of BT09 battery cells included in the recharge battery cell group. If the number of batteries exceeds the number of BT09 cells, the discharge voltage is not transformed and is supplied directly to the BT02 terminal pair. When applied, the battery cell BT09 included in the rechargeable battery cell group is transmitted via the terminal pair BT02. An excessive voltage may be applied. Therefore, in the case shown in Figure 32(A) This sets the charging voltage (Vcha) applied to the terminal pair BT02 to be greater than the discharge voltage (Vdis). The voltage needs to be reduced. Furthermore, in order to charge the battery cells, the charging voltage is... The total voltage of the BT09 battery cells included in the battery cell group must be greater than the sum of the voltages of the BT09 battery cells. The pressure control circuit BT06 is based on the number of battery cells BT09 included in the discharge battery cell group. The conversion ratio N is larger than the ratio of the number of BT09 battery cells included in the rechargeable battery cell group at that time. Set it.

[0361] The voltage transformer control circuit BT06 is based on the number of battery cells BT09 included in the discharge battery cell group. When the number of BT09 battery cells included in the rechargeable battery cell group is set to 1, the conversion ratio N is set to 1 It is preferable to increase it by about 10%. At this time, the charging voltage should be greater than the voltage of the battery cell group. Although it also increases, in reality the charging voltage is equal to the voltage of the battery cell group. However, the voltage transforms The control circuit BT06 adjusts the voltage of the battery cell group to be equal to the charging voltage according to the conversion ratio N. This will supply current to charge the battery cells. This current is supplied to the BT06 transformer control circuit. The set value will be used.

[0362] In the example shown in Figure 32(A), the number of battery cells BT09 included in the discharge battery cell group is 3 Since the number of BT09 battery cells included in the rechargeable battery cell group is 1, the transformer control circuit BT06 calculates the conversion ratio N as a value slightly larger than 1 / 3. Then, the transformer control circuit... BT06 converts the discharge voltage down according to the conversion ratio N and generates a transform signal S3 that converts it into a charging voltage. This is output to the transformer circuit BT07. Then, the transformer circuit BT07 changes the voltage according to the transformer signal S3. The applied charging voltage is then applied to terminal pair BT02. The BT09 battery cell included in the rechargeable battery cell group is charged by the charging voltage.

[0363] Furthermore, in the examples shown in Figures 32(B) and 32(C), the conversion ratio N is the same as in Figure 32(A). This is calculated. In the examples shown in Figures 32(B) and 32(C), the discharge battery cell group is included The number of BT09 battery cells is less than or equal to the number of BT09 battery cells included in the rechargeable battery cell group. Therefore, the conversion ratio N is 1 or greater. Thus, in this case, the transformer control circuit BT06 is discharged It outputs a transform signal S3 that boosts the voltage and converts it to the charging voltage.

[0364] The transformer circuit BT07, based on the transformer signal S3, applies a discharge voltage to the terminal pair BT01. It converts to a charging voltage. Then, the transformer circuit BT07 converts the charging voltage to terminal pair BT0 Apply to 2. Here, the transformer circuit BT07 connects terminal pair BT01 and terminal pair BT02 It is electrically isolated. As a result, the transformer circuit BT07 is at the bottom of the group of discharge battery cells. The absolute voltage of the negative terminal of battery cell BT09 located in the flow, and the lowest-level cell in the rechargeable battery cell group. This prevents short circuits caused by the difference in absolute voltage between the negative terminal of battery cell BT09 located at [location] and [location]. As described above, the transformer circuit BT07 adjusts the combination of the discharge battery cell group based on the transformer signal S3. The discharge voltage, which is the metering voltage, is converted into the charging voltage.

[0365] Furthermore, the BT07 transformer circuit is, for example, an isolated DC (Direct Current)-DC transformer. Converters and the like can be used. In this case, the voltage transformer control circuit BT06 is an isolated DC- The signal that controls the on / off ratio (duty cycle) of the DC converter is the transform signal S3. By outputting, it controls the charging voltage converted by the BT07 transformer circuit.

[0366] Furthermore, isolated DC-DC converters include flyback type, forward type, and RCC ( Ringing Choke Converter system, push-pull system, half-bulb Ridge type and full bridge type exist, but the desired output voltage level depends on the specific design. The appropriate method will be selected.

[0367] Figure 33 shows the configuration of the BT07 transformer circuit using an isolated DC-DC converter. The C-DC converter BT51 includes a switch section BT52 and a transformer section BT53. The BT52 switch unit switches the operation of the isolated DC-DC converter on and off. It is a switch, for example, MOSFET (Metal-Oxide-Semiconduct (Tor Field-Effect Transistor) and bipolar transistors This is achieved using a t-type component. Furthermore, the switch unit BT52 receives an output from the transformer control circuit BT06. Based on the transform signal S3 that controls the on / off ratio, an isolated DC-DC converter is generated. The ON and OFF states of BT51 are periodically switched. Note that the switch unit BT52 is used Various configurations are possible depending on the type of isolated DC-DC converter used. Transformer section BT53 converts the discharge voltage applied from the terminal pair BT01 into a charging voltage. For details, The transformer section BT53 operates in conjunction with the on / off state of the switch section BT52, and its The discharge voltage is converted to a charging voltage according to the on / off ratio. This charging voltage is controlled by the switch unit BT5 In the switching cycle of 2, the longer the time spent in the ON state, the larger the value. On the other hand, charging The voltage is such that the time the switch unit BT52 is ON is shorter during the switching cycle. It becomes much smaller. Note that when using an isolated DC-DC converter, the transformer section BT53 Internally, terminal pair BT01 and terminal pair BT02 can be isolated from each other.

[0368] The processing flow of the energy storage device BT00 in this embodiment will be explained using Figure 34. Figure 34 This is a flowchart showing the processing flow of the BT00 energy storage device.

[0369] First, the energy storage device BT00 acquires the voltage measured for each of the multiple battery cells BT09 ( Step S001). Then, the energy storage device BT00 equalizes the voltage of multiple battery cells BT09. It is determined whether the start condition for the operation is met (step S002). This start condition is, for example, For example, the difference between the maximum and minimum voltage measured for each of the multiple battery cells BT09 is predetermined This can be determined by whether or not it is above a threshold, etc. If this starting condition is not met, (step S0 02:NO), Since the voltage of each battery cell BT09 is balanced, energy storage Device BT00 will not perform the subsequent processing. On the other hand, if the start condition is met (step S 002:YES), the energy storage device BT00 performs the process of equalizing the voltage of each battery cell BT09. In this process, the energy storage device BT00 calculates each cell based on the measured voltage of each cell. It is determined whether battery cell BT09 is a high-voltage cell or a low-voltage cell (step S003). Based on the determination result, the BT00 energy storage device determines the discharge battery cell group and the recharge battery cell group. (Step S004). Furthermore, the energy storage device BT00 uses the determined group of discharge battery cells. The control signal S1 to be set as the connection destination for terminal pair BT01, and the determined group of rechargeable battery cells to terminal A control signal S2 is generated to be set as the connection destination for BT02 (step S005). Energy storage device BT00 receives the generated control signals S1 and S2 from the switching circuit BT04 and the switch The output is sent to the switching circuit BT05. Then, the switching circuit BT04 switches the terminal pairs BT01 and the group of discharge battery cells are connected, and the switching circuit BT05 switches the terminals to BT02 The discharge battery cell group is connected (step S006). Also, the energy storage device BT00 discharges The number of BT09 battery cells included in the battery cell group, and the number of battery cells included in the rechargeable battery cell group Based on the number of BT09s, a transform signal S3 is generated (step S007). Then, The energy storage device BT00, based on the voltage transformation signal S3, determines the discharge voltage applied to the terminal pair BT01. The voltage is converted to a charging voltage and applied to the terminal pair BT02 (step S008). This discharges the voltage. Charge is transferred from the battery cell group to the rechargeable battery cell group.

[0370] Also, although the flowchart in Figure 34 shows multiple steps in order, each step The execution order of the commands is not limited to the order in which they are listed.

[0371] As described above, according to this embodiment, when transferring charge from a group of discharged battery cells to a group of rechargeable battery cells, Similar to the capacitor method, charge is temporarily stored from the group of discharge battery cells, and then the charge is stored in the rechargeable battery cells. It does not require a configuration that releases into a group. This improves the charge transfer efficiency per unit time. This can improve the performance. Also, the switching circuits BT04 and BT05 Furthermore, among the discharge battery cell group and the rechargeable battery cell group, the battery cells connected to the transformer circuit are individually selected. It can be switched to.

[0372] Furthermore, the transformer circuit BT07 determines the number of battery cells BT09 included in the discharge battery cell group and Based on the number of battery cells in the BT09 group included in the rechargeable battery cell group, markings are made on the terminal pair BT01. The applied discharge voltage is converted into a charging voltage and applied to the terminal pair BT02. Regardless of how the BT09 battery cells on the charging and discharging sides are selected, charge transfer is performed without any problems. It can be expressed.

[0373] Furthermore, OS transistors are used for transistors BT10 and BT13. As a result, leakage occurs from battery cell BT09, which does not belong to the rechargeable battery cell group or the dischargeable battery cell group. The amount of charge can be reduced. This allows the BT09 battery cell, which does not contribute to charging and discharging, to function. This can suppress the decrease in capacitance. Also, OS transistors are different from Si transistors. In comparison, the variation in thermal properties is smaller. As a result, the temperature of the BT09 battery cell rises. Also, normal operation such as switching between conductive and non-conductive states according to control signals S1 and S2. It can be made to do that.

[0374] This embodiment can be freely combined with other embodiments. [Explanation of Symbols]

[0375] 100 Electronic equipment 101 Electronic equipment 102 Display section 103 FPC 103a FPC 104 IC 105 cabinets 106 Circuit board 107 Circuit board 108 Storage Battery 109 Display section 110 Display Panel 111 Display area 112 Display area 113 Display area 114 Display area 115 Display area 116 fingers 117 devices 118 devices 119 Display section 120 circuit boards 121 Image sensor 122 Electronic equipment 125 Ring section 126 cabinets 131 sides 132 sides 133 sides 135 cuts 138 copies 141 Drive Circuit 142 Drive Circuit 143 Drive Circuit 145 Wiring 146 Wiring 151 Display area 152 Display area 153 Display area 161 icons 162 characters 164 characters of information 167 Image Information 300 Electronic equipment 400 Electronic equipment 1201 Positive electrode current collector 1202 Cathode active material layer 1203 Positive electrode 1204 Negative electrode current collector 1205 Negative electrode active material layer 1206 negative electrode 1207 Separator 1208 Electrolyte 1209 Exterior

Claims

1. The ring part, The ring portion and the fixed display portion are included. The display unit has an upper surface and a first side surface that is in contact with at least one side of the upper surface. The first side surface has a curved surface, A first display area is provided on the upper surface. A second display area is provided on the first side surface. The first display area and the second display area are provided in a continuous manner in an electronic device.

2. The electronic device according to claim 1, wherein the first side surface includes a portion of the side surface of a cylinder or an elliptical cylinder.

Images