Semiconductor device and method for manufacturing a semiconductor device

Abstract

This invention provides a high-performance, high-quality semiconductor device comprising a semiconductor module mounted on a support via a heat transfer medium. [Solution] The semiconductor device 1A comprises a support 10, a semiconductor module 20, a heat transfer medium 30, and a first frame member 40. The semiconductor module 20 has a semiconductor chip and a resin member that encloses it, and is mounted on the support 10 via the heat transfer medium 30. The first frame member 40 is placed on the semiconductor module 20 and has a first frame portion 41 that covers the edge portion 21a of the upper surface 20a of the semiconductor module 20 (its resin member), and a first opening 42 provided inside the first frame portion 41 that communicates with the semiconductor module 20 (its resin member). The first frame member 40 is fixed to the support 10 with screws 50. Fixing using the first frame member 40 allows for the relaxation and distribution of stress generated in the semiconductor module 20, and suppresses a deterioration in its performance and quality.

Description

Technical Field

[0005] , ,

[0006]

[0001] The present invention relates to a semiconductor device and a method for manufacturing the semiconductor device.

Background Art

[0002] There is known a technique in which a power semiconductor device having a case and a base plate in which a semiconductor element mounted on a substrate is incorporated is provided with mounting holes at four locations near the corners of the base plate and at four locations near the center between the corners, screws are inserted into the mounting holes, and the power semiconductor device is fixed to a heat sink via grease (Patent Document 1).

[0003] Also, there is known a technique in which a semiconductor package of a semiconductor module, a metal plate, and a spring in which through holes overlapping in a plan view are formed via grease are sequentially provided on a cooler in which a recess is formed, and the semiconductor module is tightened and fixed to the cooler by screws of a fixture inserted into the recess of the cooler through the through hole group from above the spring (Patent Document 2).

[0004] Also, there is known a technique in which a heat dissipation fin to which a ceramic substrate on which a semiconductor component is mounted is fixed is covered with a cap made of a metal or resin having a hat-shaped cross section, and the cap is attached to a housing by screws using mounting holes of a flange portion extended in the longitudinal direction thereof (Patent Document 3). Further, there is known a technique in which a protrusion for adhering to the heat dissipation fin is provided inside the cap via an elastic adhesive (Patent Document 3).

[0005] <O000018>(Note: There seems to be a typo in the original Japanese text as it's "O000018", assuming it should be " ". If not, this needs to be adjusted according to the correct content.) Also, there is known a technique in which a mounting device for a semiconductor package has a structure including a cavity for accommodating the semiconductor package and a hole for receiving connection pins of the semiconductor package, and a technique for fixing the mounting device accommodating the semiconductor package to a heat dissipation structure (Patent Document 4). Further, there is known a technique in which a protrusion for fixing the semiconductor package is provided in the cavity of the mounting device, and a technique in which an opening for arranging a structure-mounted temperature sensor thermally coupled to the semiconductor package is provided in the mounting device (Patent Document 4).

[0006] Furthermore, a technique is known in which a case surrounding the outer periphery of a circuit board, on which a semiconductor element is mounted on one main surface and which is fixed to a heat sink via silicone grease or the like, is provided with through holes, and the case is fixed to the heat sink by inserting screws into the through holes (Patent Document 5). In addition, a technique is known in which the case is provided with a retaining portion that holds down the peripheral edge of the circuit board when it is fixed to the heat sink, and a protrusion is provided approximately in the center of the circuit board that applies force toward the heat sink when it is fixed to the heat sink (Patent Document 5).

[0007] Furthermore, a technique is known in which a case with an opening formed at the bottom is placed on a work stage, a package is placed on the work stage at the opening of the case, and a first terminal of the case, one end of which is exposed at the bottom of the case and the other end of which is pulled out to the outside of the case, is joined to a second terminal of the package that extends along the bottom of the case using a joining material (Patent Document 6). In addition, a technique is known in which a partition wall is provided in the middle of the depth direction inside the case, a first terminal is provided so as to be exposed on the lower surface of the partition wall, a package is placed on the work stage with a joining material applied to the upper surface of its second terminal, a case is placed on top of it, and the first terminal is joined to the second terminal via the joining material (Patent Document 6).

[0008] Furthermore, a technique is known in which, instead of forming holes or notches in the sealing resin that seals the semiconductor element and the lead frame on which it is fixed, stepped grooves are formed in the sealing resin, and one end of a clamp that engages with the groove is engaged with the groove, and the other end is fixed to the heat dissipation fin, thereby pressing and fixing the sealing resin to the heat dissipation fin (Patent Document 7).

[0009] Furthermore, a technique is known in which a reinforcing beam is provided on the upper surface of a semiconductor module in which a semiconductor element is resin-encapsulated and has through holes, via a plate-shaped spring. The semiconductor module is then fixed to a heat sink provided on its lower surface by inserting a screw of a fixing device into the through holes of the semiconductor module from the reinforcing beam side via the reinforcing beam and the plate-shaped spring, and a frame portion surrounding the outer periphery of the semiconductor module is provided on the heat sink (Patent Document 8). In addition, a technique for fixing the reinforcing beam to the frame portion is known (Patent Document 9).

[0010] Furthermore, a technique is known in which a semiconductor module having a heat-dissipating metal on its back surface is placed on a metal plate bonded to a recess in a heat sink, with heat-dissipating grease between the heat-dissipating metal and the metal plate, a spring retaining bracket is placed on top of the semiconductor module via a leaf spring, and the spring retaining bracket is fastened to the heat sink with screws (Patent Document 10).

[0011] Furthermore, a technique is known in which a power semiconductor module containing a encapsulated semiconductor device is mounted on the mounting surface of a heat dissipation device via a heat conductive resin layer, with a frame acting as a guide member. A drive circuit is then mounted on the power semiconductor module via an insulating sheet, a retaining plate, and a heat dissipation sheet in that order, and these are all fixed together to the frame with fasteners such as screws (Patent Document 11).

[0012] Furthermore, in a semiconductor device having a stacked structure in the order of a support member, a cooling plate, a semiconductor module, a metal plate, and a control board, a technique is known in which the cooling plate and the metal plate are fastened together to the support member with fastening screws, and the control board is fixed to the metal plate (Patent Document 12). [Prior art documents] [Patent Documents]

[0013] [Patent Document 1] Japanese Patent Publication No. 2008-172146 [Patent Document 2] International Publication No. 2021 / 028965 Brochure [Patent Document 3] Japanese Patent Application Publication No. 5-315487 [Patent Document 4] Japanese Patent Publication No. 2020-145420 [Patent Document 5] Japanese Patent Publication No. 2015-122453 [Patent Document 6] International Publication No. 2013 / 171946 Pamphlet [Patent Document 7] Japanese Patent Application Publication No. 9-199645 [Patent Document 8] Japanese Patent Publication No. 2008-258241 [Patent Document 9] Japanese Patent Publication No. 2009-43863 [Patent Document 10] Japanese Patent Publication No. 2014-225571 [Patent Document 11] Japanese Patent Publication No. 2017-212286 [Patent Document 12] Japanese Patent Publication No. 2021-118657 [Overview of the Initiative] [Problems that the invention aims to solve]

[0014] Incidentally, a semiconductor module, which has a semiconductor chip and resin components such as sealing resin and resin cases that enclose it, is attached to a support such as a heat sink, heat dissipation grease, etc., via a heat transfer medium. One method for attaching a semiconductor module to a support is known to directly fix or fasten the semiconductor module to the support with screws by making holes or notches in the resin component of the semiconductor module and screwing screws inserted through them into the support.

[0015] However, in the method of directly fixing the semiconductor module to the support with screws, if the semiconductor module has warpage generated during its manufacturing or the like, when it is fixed to the support with screws, the semiconductor module may be fixed to the support while being tilted. If the semiconductor module is fixed while being tilted, there is a risk of problems occurring in the wiring connection between the semiconductor module and other components. Also, in the method of directly fixing the semiconductor module to the support with screws, due to thermal deformation during the operation of the semiconductor module, breakage of the resin member may occur, or the heat dissipation performance may decrease due to pump-out of the heat dissipation grease interposed between the semiconductor module and the support, resulting in failures.

[0016] In the method of directly fixing the semiconductor module to the support with screws, for a semiconductor device including a semiconductor module mounted on the support via a heat transfer medium, sufficient performance and quality may not be obtained. Note that the same may occur with other conventional methods, and other conventional methods may further lead to an increase in size, weight, cost, etc.

[0017] On one aspect, an object of the present invention is to realize a high-performance and high-quality semiconductor device including a semiconductor module mounted on a support via a heat transfer medium.

Means for Solving the Problem

[0018] In one aspect, a semiconductor device is provided that includes a support, a semiconductor module mounted on the support and having a semiconductor chip and a resin member that seals the semiconductor chip, a heat transfer medium disposed between the support and the semiconductor module, a first frame portion disposed on the semiconductor module and covering the upper surface and the side surface continuous from the upper surface at the edge portion on the upper surface side of the resin member and contacting the upper surface and the side surface, and a first opening provided inside the first frame portion and leading to the resin member, and a first frame member fixed to the support.

[0019] In one aspect, a semiconductor module includes a semiconductor chip and a resin member that encapsulates the semiconductor chip. A mounting step of mounting the semiconductor module on a support via a heat transfer medium, and a first frame member includes a first frame portion that covers an upper surface and a side surface continuous from the upper surface at an edge portion on the upper surface side of the resin member and contacts the upper surface and the side surface, and a first opening provided inside the first frame portion and leading to the resin member. A first placing step of placing the first frame member on the semiconductor module, and a fixing step of fixing the first frame member to the support are provided. A manufacturing method of a semiconductor device is provided.

Effects of the Invention

[0020] On one side, it becomes possible to realize a high-performance and high-quality semiconductor device including a semiconductor module mounted on a support via a heat transfer medium.

Brief Description of the Drawings

[0021] [Figure 1] It is a diagram for explaining an example of a semiconductor device according to the first embodiment. [Figure 2] It is a diagram for explaining an example of a semiconductor module. [Figure 3] It is a diagram for explaining a configuration example of a semiconductor module used in the semiconductor device according to the first embodiment. <00001​​​​​​​​​​​​​​​This is a diagram (part 2) illustrating an example of the configuration of a semiconductor device according to the second embodiment. [Figure 10] This figure illustrates an example of a semiconductor device according to the third embodiment. [Figure 11] This figure illustrates an example of the configuration of a semiconductor device according to the third embodiment. [Figure 12] This is a diagram (part 1) illustrating an example configuration of a semiconductor device according to the fourth embodiment. [Figure 13] This is a diagram (part 2) illustrating an example of the configuration of a semiconductor device according to the fourth embodiment. [Figure 14] This figure illustrates an example of the configuration of a semiconductor device according to the fifth embodiment. [Figure 15] This figure illustrates an example of connecting an external connection terminal to a terminal block of a semiconductor device according to the fifth embodiment. [Figure 16] This figure illustrates an example of a method for manufacturing a semiconductor device according to the sixth embodiment. [Modes for carrying out the invention]

[0022] [First Embodiment] Figure 1 illustrates an example of a semiconductor device according to the first embodiment. Figure 1(A) schematically shows a plan view of the main part of the example semiconductor device. Figure 1(B) schematically shows a cross-sectional view from Ia-Ia in Figure 1(A). Figure 1(C) schematically shows a cross-sectional view from Ib-Ib in Figure 1(A).

[0023] The semiconductor device 1A shown in Figures 1(A) to 1(C) comprises a support 10, a semiconductor module 20, a heat transfer medium 30, a first frame member 40, and screws 50.

[0024] The support 10 can be a heat sink, heat dissipator, cooler, housing, etc. The support 10 is made of a material with good thermal conductivity. The support 10 has a predetermined number of screw holes 11 at predetermined locations; in this example, four screw holes 11 are located outside the mounting area of ​​the semiconductor module 20.

[0025] The semiconductor module 20 is mounted on the support 10. The semiconductor module 20 has a semiconductor chip and a resin member that encapsulates it. An example of the configuration of the semiconductor module 20 will be described later (Figure 2). The screw holes 11 of the support 10 are provided so as to be located on the outside of the semiconductor module 20 mounted on the support 10.

[0026] The heat transfer medium 30 is placed between the support 10 and the semiconductor module 20. The heat transfer medium 30 is made of a material with good thermal conductivity, such as a heat dissipation grease or a heat dissipation sheet. When the semiconductor device 1A is in operation, the heat generated in the semiconductor module 20 (its semiconductor chip) is transferred to the support 10, for example, via the heat transfer medium 30, and dissipated. However, the heat dissipation path for the heat generated in the semiconductor module 20 is not limited to this.

[0027] The first frame member 40 is placed on the semiconductor module 20 and fixed to the support 10. The first frame member 40 is made of a material having a certain rigidity, which is a combination of one or more of the following: metal, ceramics, resin, etc. The first frame member 40 has a first frame portion 41 and a first opening 42 provided inside the first frame portion 41. The first frame portion 41 has a frame-like shape that covers the edge portion 21a of the upper surface 20a of the semiconductor module 20. The first opening 42 leads to the upper surface 20a of the semiconductor module 20. The first frame member 40 further has a first insertion hole 43 in the portion connected to the first frame portion 41. The first insertion hole 43 is provided at a position opposite to the screw hole 11 of the support 10.

[0028] Screws 50 can be screws, bolts, or the like. The screw 50 is inserted into the first insertion hole 43 of the first frame member 40 from above (opposite side from the support 10), and its tip is screwed into the screw hole 11 of the support 10. The head of the screw 50 screwed into the screw hole 11 presses against the outer edge of the first insertion hole 43, thereby fixing the first frame member 40 to the support 10.

[0029] In semiconductor device 1A, the edge 21a of the upper surface 20a of the semiconductor module 20 is pressed towards the support 10 by the first frame portion 41 of the first frame member 40, which is fixed to the support 10 by screws 50 on the outside of the semiconductor module 20. As a result, the semiconductor module 20 is fixed to the support 10 via the heat transfer medium 30 provided on its lower surface 20b.

[0030] Here, Figure 2 illustrates an example of a semiconductor module. Figure 2(A) schematically shows a cross-sectional view of the main part of the first example of a semiconductor module. Figure 2(B) schematically shows a cross-sectional view of the main part of the second example of a semiconductor module.

[0031] The semiconductor module 20 shown in Figure 2(A) comprises an insulating circuit board 22, a semiconductor chip 23, and a sealing resin 24 (resin member). The insulating circuit board 22 includes an insulating substrate 22a such as a ceramic substrate, and a first conductive layer 22b and a second conductive layer 22c made of copper or the like, provided on both main surfaces thereof. Of the first conductive layer 22b and the second conductive layer 22c, the first conductive layer 22b is formed to have a predetermined pattern shape. For example, DCB (Direct Copper Bonding) substrates and AMB (Active Metal Brazed) substrates can be used for the insulating circuit board 22.

[0032] The semiconductor chip 23 is mounted on the first conductive layer 22b of the insulating circuit board 22. The semiconductor chip 23 may be an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal Oxide Semiconductor Field Effect Transistor). The semiconductor chip 23 is electrically connected to the first conductive layer 22b of the insulating circuit board 22 using bonding materials 25 such as solder or sintered material, wires 26, etc.

[0033] A sealing resin 24 is provided to seal the insulating circuit board 22, the semiconductor chip 23 mounted thereon, and the bonding material 25 and wires 26, etc. In the semiconductor module 20 shown in Figure 2(A), the second conductive layer 22c of the insulating circuit board 22, which is opposite to the first conductive layer 22b on which the semiconductor chip 23 is mounted, is exposed from the sealing resin 24. Although not shown here, the semiconductor module 20 shown in Figure 2(A) is provided with external connection terminals such as positive terminals, negative terminals, output terminals, and control terminals that are electrically connected to the semiconductor chip 23 and insulating circuit board 22 inside the sealing resin 24, so as to extend to the outside of the sealing resin 24. The encapsulating resin 24 of the semiconductor module 20 shown in Figure 2(A) is an example of a resin component used to encapsulate a semiconductor chip 23, etc.

[0034] Furthermore, the semiconductor module 20 shown in Figure 2(B) includes a heat sink 27, a heat transfer medium 28, an insulating circuit board 22, a semiconductor chip 23, a sealing resin 24 (resin material), and a resin case 29 (resin material).

[0035] A metal plate such as copper is used for the heat sink 27. An insulating circuit board 22 on which a semiconductor chip 23 is mounted is placed on the heat sink 27 via a heat transfer medium 28 such as thermal grease or a heat transfer sheet. The semiconductor chip 23 is electrically connected to the first conductive layer 22b of the insulating circuit board 22 using a bonding material 25, wires 26, etc. The second conductive layer 22c of the insulating circuit board 22, on the side opposite to the first conductive layer 22b on which the semiconductor chip 23 is mounted, is connected to the heat sink 27 via the heat transfer medium 28.

[0036] A resin case 29 is positioned on the heat sink 27, surrounding an insulating circuit board 22 on which a semiconductor chip 23 is mounted. The resin case 29 is fixed to the heat sink 27 using adhesives, screws, etc. (not shown). A sealing resin 24 is provided in the internal space enclosed by the resin case 29. The insulating circuit board 22 and the semiconductor chip 23 mounted on it, as well as the bonding material 25, wires 26, and heat transfer medium 28, etc., are sealed by the resin case 29 and the sealing resin 24 provided in its internal space. Although not shown here, the semiconductor module 20 shown in Figure 2(B) has external connection terminals such as positive terminals, negative terminals, output terminals, and control terminals that are electrically connected to the semiconductor chip 23 and insulating circuit board 22 inside the sealing resin 24, and these terminals extend to the outside of the sealing resin 24 and the resin case 29. The sealing resin 24 and resin case 29 of the semiconductor module 20 shown in Figure 2(B) are examples of resin components that seal semiconductor chips 23 and the like.

[0037] For example, a semiconductor module 20, such as the one shown in Figure 2(A) or Figure 2(B), is fixed between the support 10 and the first frame member 40, which is secured to the support 10 with screws 50, as is the case with the semiconductor device 1A shown in Figures 1(A) to 1(C).

[0038] In this case, for example, when a semiconductor module 20 as shown in Figure 2(A) is used in the semiconductor device 1A (Figure 1), the semiconductor module 20 is fixed with the second conductive layer 22c of the insulating circuit board 22 exposed from the sealing resin 24 facing the support 10, and a heat transfer medium 30 interposed between the second conductive layer 22c and the support 10. The first frame member 40 is positioned such that its first frame portion 41 covers the edge portion 21a of the upper surface 20a of the semiconductor module 20, which is the edge portion 21a of the upper surface 20a of the sealing resin 24, which is a resin material. The first opening 42 of the first frame member 40 is connected to the sealing resin 24 inside the first frame portion 41. The first frame member 40 and the semiconductor module 20 are positioned such that the first insertion hole 43 of the first frame member 40, which covers the edge portion of the upper surface 24 of the sealing resin 24, is located opposite the screw hole 11 of the support 10. A screw 50 is inserted through the first insertion hole 43 of the first frame member 40, and the tip of the screw 50 is screwed into the screw hole 11 of the support 10, thereby fixing the first frame member 40 to the support 10, and thereby fixing the semiconductor module 20 to the support 10 via the heat transfer medium 30.

[0039] Furthermore, for example, when a semiconductor module 20 as shown in Figure 2(B) is used in a semiconductor device 1A (Figure 1), the semiconductor module 20 is fixed with a heat sink 27, which is provided with a sealing resin 24 and a resin case 29, facing towards the support 10, and a heat transfer medium 30 interposed between the heat sink 27 and the support 10. The first frame member 40 is positioned such that its first frame portion 41 serves as the edge portion 21a of the upper surface 20a of the semiconductor module 20, covering the edge of the upper surface of the sealing resin 24, which is a resin member, and the upper surface of the resin case 29 or the upper surface of the resin case 29 or its edge. The first opening 42 of the first frame member 40 is connected to the sealing resin 24 inside the first frame portion 41 or to the resin case 29. The first frame member 40 and the semiconductor module 20 are arranged such that the first insertion hole 43 of the first frame member 40, which covers the edge of the upper surface of the sealing resin 24 and the upper surface of the resin case 29 or the upper surface of the resin case 29 or its edge, is positioned opposite the screw hole 11 of the support 10. The first frame member 40 is fixed to the support 10 by inserting a screw 50 through the first insertion hole 43 of the first frame member 40 and screwing the tip of the screw 50 into the screw hole 11 of the support 10, thereby fixing the first frame member 40 to the support 10, and thereby fixing the semiconductor module 20 to the support 10 via the heat transfer medium 30.

[0040] As described above, in the semiconductor device 1A shown in Figures 1(A) to 1(C), the semiconductor module 20 is fixed to the support 10 using a first frame member 40 having a first frame portion 41 that covers the edge portion 21a of its upper surface 20a. The first frame member 40 is fixed to the support 10 using screws 50 that are inserted through first insertion holes 43 provided therein, and the semiconductor module 20 is fixed by the first frame portion 41 of the first frame member 40 pressing the edge portion 21a of its upper surface 20a toward the support 10.

[0041] With the semiconductor device 1A having such a configuration, the first frame portion 41 of the first frame member 40 holds down the edge portion 21a of the upper surface 20a of the semiconductor module 20. Compared to the conventional method, which involves providing holes or notches in the resin component of the semiconductor module and screwing screws through them into the support to directly fix the semiconductor module to the support with screws, it becomes possible to alleviate and disperse the stress generated in the semiconductor module 20. Therefore, it becomes possible to alleviate and disperse the stress associated with thermal deformation of the semiconductor module 20 that may occur due to temperature changes during assembly of the semiconductor device 1A, temperature changes during operation, and temperature changes in the external environment, thereby suppressing the destruction of the semiconductor module 20.

[0042] Furthermore, in conventional methods of directly fixing a semiconductor module to a support with screws, if the semiconductor module has warped during manufacturing or other processes, when it is fixed to the support with screws, the semiconductor module may be fixed at an angle to the support, potentially causing problems with wiring connections to other components. However, according to the semiconductor device 1A that uses the method of fixing the semiconductor module 20 using the first frame member 40 as described above, the first frame portion 41 of the first frame member 40 holds down the edge portion 21a of the upper surface 20a of the semiconductor module 20, thus making it possible to prevent the semiconductor module 20 from being fixed at an angle and to suppress the occurrence of wiring connection problems as a result.

[0043] Furthermore, with semiconductor device 1A, compared to the conventional method of directly fixing the semiconductor module to the support with screws, torque loss in the semiconductor module 20, which is fixed to the support 10 via a heat transfer medium 30 such as thermal grease, is suppressed. Therefore, it is possible to suppress pump-out of the heat transfer medium 30 interposed between the semiconductor module 20 and the support 10, the resulting decrease in heat dissipation performance, and failure of the semiconductor module 20 due to overheating.

[0044] Furthermore, since semiconductor device 1A does not require the semiconductor module 20 to have screw holes or notches, the manufacturing cost of the semiconductor module 20 and the manufacturing cost of semiconductor device 1A using the semiconductor module 20 can be reduced. In semiconductor device 1A, since semiconductor device 1A does not require the semiconductor module 20 to have screw holes or notches, instead of increasing the strength of such holes or notches, the strength of the first frame member 40 and its first insertion hole 43 can be increased, thereby strengthening the fixation of the first frame member 40 to the support 10 and the fixation of the semiconductor module 20. According to the first embodiment, a high-performance and high-quality semiconductor device 1A is realized, which includes a semiconductor module 20 mounted on a support 10 via a heat transfer medium 30.

[0045] Next, a more specific configuration example of the semiconductor device 1A described above will be explained with reference to Figures 3 to 5. Figure 3 illustrates an example of the configuration of a semiconductor module used in a semiconductor device according to the first embodiment. Figure 3(A) schematically shows a perspective view of the main part of an example semiconductor module as seen from one side. Figure 3(B) schematically shows a perspective view of the main part of an example semiconductor module as seen from the other side.

[0046] Figures 4 and 5 illustrate a first configuration example of a semiconductor device according to the first embodiment. Figure 4(A) schematically shows an exploded perspective view of the main parts of an example of a semiconductor device. Figure 4(B) schematically shows an exploded perspective view of the main parts of an example of a semiconductor device. Figure 5(A) schematically shows the Va-Va cross-section of Figure 4(B). Figure 5(B) schematically shows the Vb-Vb cross-section of Figure 4(B).

[0047] Figures 3(A) and 3(B) show an example of a semiconductor module 120. The semiconductor module 120 has a resin member 124, and a positive terminal 125, a negative terminal 126, an output terminal 127, and a control terminal 128 extending to the outside of the resin member 124.

[0048] The resin member 124 of the semiconductor module 120 contains an insulating circuit board (not shown) and a semiconductor chip such as an IGBT mounted thereon. The insulating circuit board and the semiconductor chip are sealed by the resin member 124 such that a conductive layer 122c, provided on the main surface of the insulating circuit board opposite to the main surface on which the semiconductor chip is mounted, is exposed from the resin member 124.

[0049] The positive terminal 125, negative terminal 126, output terminal 127, and control terminal 128 are provided to be electrically connected to an insulating circuit board and a semiconductor chip provided within the resin member 124. The positive terminal 125, negative terminal 126, and output terminal 127 are provided to be drawn outward from a side surface 120c connecting the opposing upper surface 120a (the upper surface side of the resin member 124) and lower surface 120b (the surface on the conductive layer 122c side exposed from the resin member 124) of the semiconductor module 120, and to extend toward the side of the semiconductor module 120. The control terminal 128 is provided to be drawn out laterally from a side surface 120c of the semiconductor module 120, and to be bent and extend toward the upward of the semiconductor module 120.

[0050] For example, the semiconductor module 120 can be a so-called 2-in-1 type IGBT module that includes a group of semiconductor chips that constitute the upper and lower arms of the power conversion device.

[0051] As shown in Figures 3(A) and 3(B), a semiconductor module 120 is mounted on a support 110 such that its lower surface 120b faces the support 110, as shown in Figure 4(A). A heat transfer medium 130 (Figure 5), such as thermal grease, is interposed between the semiconductor module 120 and the support 110. The support 110 is provided with screw holes 111 located on the outside of the resin member 124 of the mounted semiconductor module 120. Further on the semiconductor module 120 mounted on the support 110, a first frame member 140 is arranged, as shown in Figure 4(A). The first frame member 140 is made of a material with a certain degree of rigidity, such as metal. The first frame member 140 has a first frame portion 141 that covers the edge portion 121a on the upper surface 120a side of the semiconductor module 120, a first opening 142 inside the first frame portion 141, and a first fastening portion 144 with a first insertion hole 143. The first insertion hole 143 of the first frame member 140 is provided in a position opposite to the screw hole 111 of the support 110. As shown in Figure 4(A), the screw 150 is inserted through the first insertion hole 143 from above the first frame member 140 and screwed into the screw hole 111 of the support 110. This results in a semiconductor device 100A as shown in Figure 4(B), in which the first frame member 140 is fixed to the support 110, and the semiconductor module 120 is fixed to the support 110 by the first frame member 140.

[0052] As shown in Figures 4(A) and 4(B), and Figures 5(A) and 5(B), in the semiconductor device 100A, the first frame portion 141 of the first frame member 140 that covers the edge portion 121a of the semiconductor module 120 has a shape that partially covers the upper surface 120a (also referred to as the upper surface 120a of the resin member 124) and the side surface 120c (also referred to as the side surface 120c of the resin member 124) of the semiconductor module 120.

[0053] Furthermore, as shown in Figures 4(A) and 4(B), in the semiconductor device 100A, the first fastening portion 144 of the first frame member 140, which is provided with the first insertion hole 143, has a shape such that, for example, the upper end 144a protrudes above the first frame portion 141 and the lower end 144b protrudes below the first frame portion 141.

[0054] Furthermore, when the screw 150 is screwed into the screw hole 111 through the first insertion hole 143, the first frame member 140 is in a state where the first frame portion 141 is not in contact with the positive terminal 125, negative terminal 126, output terminal 127, and control terminal 128 that are drawn out from the side surface 120c of the semiconductor module 120 (as shown in Figures 4 and 5), and the lower end 144b of the first fastening portion 144 abuts against the support 110. Even when a conductive material such as metal is used for the first frame member 140, electrical connection between the first frame member 140 and the positive terminal 125, negative terminal 126, output terminal 127, and control terminal 128 is avoided when the first frame member 140 is fixed to the support 110 with the screw 150.

[0055] Furthermore, the first frame portion 141 of the first frame member 140 may be shaped to completely cover the side surface 120c of the semiconductor module 120, excluding the outlets for the positive terminal 125, negative terminal 126, output terminal 127, and control terminal 128, thereby avoiding electrical connection between the first frame member 140 and the positive terminal 125, negative terminal 126, output terminal 127, and control terminal 128.

[0056] As shown in Figures 4(B) and 5(A) and 5(B), the semiconductor module 120 is fixed to the support 110 via a heat transfer medium 130 by a first frame member 140 which is fixed to the support 110 with screws 150. The screws 150 that fix the first frame member 140 to the support 110 are inserted into a first insertion hole 143, for example, so as not to protrude from the upper end 144a of the first fastening portion 144 of the first frame member 140. The screws 150 are screwed into the screw holes 111 of the support 110, pressing the first fastening portion 144 of the first frame member 140 toward the support 110 and fixing the first frame member 140 to the support 110.

[0057] In semiconductor device 100A, as described above for semiconductor device 1A, compared to the conventional method of directly fixing the semiconductor module to the support with screws, it is possible to alleviate and disperse the stress generated in the semiconductor module 120 due to heat, etc., and suppress its failure. In addition, it is possible to suppress the fixing of the semiconductor module 120 in a tilted state and the occurrence of wiring connection problems caused by this. Furthermore, it is possible to suppress torque loss, pump-out of the heat transfer medium 30, a decrease in heat dissipation performance, and overheating of the semiconductor module 20 when the semiconductor module 120 is fixed to the support 110 via a heat transfer medium 130 such as thermal grease.

[0058] Furthermore, in the semiconductor device 100A, the first frame portion 141 of the first frame member 140 is shaped to cover the upper surface 120a and side surface 120c of the resin member 124 at the edge 121a of the semiconductor module 120, thereby effectively suppressing upward and lateral displacement of the semiconductor module 120. The first frame member 140, which covers the upper surface 120a and side surface 120c of the resin member 124 at the edge 121a of the semiconductor module 120, is positioned such that its first insertion hole 143 faces the screw hole 111 of the support 110, thereby defining the positions of the semiconductor module 120 and the first frame member 140 relative to the support 110.

[0059] Furthermore, as described above for semiconductor device 1A, since it is not necessary to provide screw insertion holes or notches in the semiconductor module 120, the manufacturing costs of the semiconductor module 120 and the semiconductor device 100A using it can be reduced. In semiconductor device 100A, by using a highly rigid material such as metal for the first frame member 140 and increasing the strength of the first frame member 140 and its first fastening portion 144, it becomes possible to strengthen the fixing of the first frame member 140 to the support 110 and the fixing of the semiconductor module 120.

[0060] Figure 6 is a diagram illustrating a second configuration example of the semiconductor device according to the first embodiment. Figure 6(A) schematically shows a perspective view of the main part of an example of a semiconductor device. Figure 6(B) schematically shows a side view of the main part of an example of a semiconductor device.

[0061] The semiconductor device 100Aa shown in Figures 6(A) and 6(B) differs from the semiconductor device 100A (Figures 4 and 5) in that it has a configuration in which a circuit board 180 is arranged on a first frame member 140.

[0062] The circuit board 180 can be any type of circuit board, such as a printed circuit board, which has a predetermined wiring pattern on one or both sides. Although not shown in the diagram, the circuit board 180 may have various electronic components, such as semiconductor chips, capacitors, resistors, inductors, etc., that are electrically connected to the wiring pattern provided therein.

[0063] As shown in Figures 6(A) and 6(B), the circuit board 180, which is positioned on the first frame member 140 (on the opposite side from the support 110), abuts against the upper end 144a of the first fastening portion 144 of the first frame member 140. By ensuring that the screws 150 that fix the first frame member 140 to the support 110 do not protrude from the upper end 144a of the first fastening portion 144, the circuit board 180 comes into contact with the upper end 144a of the first fastening portion 144. By making the upper end 144a of the first fastening portion 144 protrude above the first frame portion 141, a predetermined gap is secured between the circuit board 180, which abuts against the upper end 144a of the first fastening portion 144, and the first frame portion 141. The circuit board 180 is fixed to the first frame member 140, for example, using screws (not shown).

[0064] The circuit board 180 has a through-hole 181 through which the control terminal 128 of the semiconductor module 120 can be inserted, at a position corresponding to the control terminal 128 of the semiconductor module 120. The circuit board 180 is placed on the first frame member 140 such that the control terminal 128 of the semiconductor module 120 is inserted through the through-hole 181 and abuts against the upper end 144a of the first fastening portion 144 of the first frame member 140, and is fixed to the first frame member 140 using screws or the like. The control terminal 128 inserted through the through-hole 181 of the circuit board 180 is electrically connected to the wiring pattern of the circuit board 180. A control signal is supplied to the semiconductor module 120 from the circuit board 180 through the control terminal 128.

[0065] It is also possible to obtain a semiconductor device 100Aa as shown in Figures 6(A) and 6(B), that is, a semiconductor device 100Aa in which a circuit board 180 having a wiring pattern electrically connected to the control terminal 128 of the semiconductor module 120 is arranged on the first frame member 140. Furthermore, the same effects as those described for the semiconductor device 100A (Figures 4 and 5) can be obtained with such a semiconductor device 100Aa.

[0066] In this example, the first frame member 140 is fixed to the support 110 with screws 150. Alternatively, the first frame member 140 can also be fixed to the support 110 using methods such as welding or adhesive bonding.

[0067] [Second Embodiment] Figure 7 illustrates an example of a semiconductor device according to the second embodiment. Figure 7(A) schematically shows a plan view of the main part of the example semiconductor device. Figure 7(B) schematically shows the VIIa-VIIa cross-sectional view of Figure 7(A). Figure 7(C) schematically shows the VIIb-VIIb cross-sectional view of Figure 7(A).

[0068] The semiconductor device 1B shown in Figures 7(A) to 7(C) differs from the semiconductor device 1A (Figure 1) described in the first embodiment above in that it has a configuration in which a second frame member 60 is arranged between the support 10 and the semiconductor module 20.

[0069] The second frame member 60 is made of one or more materials selected from metals, ceramics, resins, etc., or a combination of two or more such materials. The semiconductor module 20 is provided with external connection terminals (positive terminal, negative terminal, output terminal, control terminal, etc.) extending to the outside (not shown). In order to avoid electrical connection between such external connection terminals and the second frame member 60, it is preferable to use an insulating material for the second frame member 60.

[0070] The second frame member 60 has a second frame portion 61 on which the semiconductor module 20 is placed, and a second opening 62 provided inside the second frame portion 61. The edge portion 21b of the lower surface 20b of the semiconductor module 20, opposite to the upper surface 20a, is placed on the second frame portion 61. A heat transfer medium 30 interposed between the support 10 and the semiconductor module 20 is placed in the second opening 62. The second frame member 60 further has a second insertion hole 63 in the portion connected to the second frame portion 61. The second insertion hole 63 is provided in a position opposite to the screw hole 11 of the support 10 and the first insertion hole 43 of the first frame member 40.

[0071] A semiconductor module 20 is placed on the support 10 via a second frame member 60 and a heat transfer medium 30, and a first frame member 40 is placed on top of it. Then, a screw 50 is inserted through the first insertion hole 43 of the first frame member 40 and the second insertion hole 63 of the second frame member 60 and screwed into the screw hole 11 of the support 10. The head of the screw 50 screwed into the screw hole 11 presses against the outer edge of the first insertion hole 43, thereby fixing the first frame member 40 to the support 10.

[0072] In semiconductor device 1B, the edge 21a of the upper surface 20a of the semiconductor module 20 is pressed toward the support 10 by the first frame portion 41 of the first frame member 40, which is fixed to the support 10 by screws 50 on the outside of the semiconductor module 20. As a result, the semiconductor module 20 is fixed to the support 10 via the second frame member 60 and the heat transfer medium 30.

[0073] With this semiconductor device 1B, it is possible to obtain the same effects as the semiconductor device 1A described in the first embodiment above. In semiconductor device 1B, a second frame member 60 having a second opening 62 that leads to the semiconductor module 20 is further arranged between the support 10 and the semiconductor module 20, and a heat transfer medium 30 is placed in the second opening 62. As a result, a certain gap corresponding to the thickness of the second frame member 60 is secured between the support 10 and the semiconductor module 20, and the heat transfer medium 30 is placed there, surrounded by a second frame portion 61. By fixing the semiconductor module 20 using such a second frame member 60 and the first frame member 40 as described above, it is possible to effectively suppress deformation of the semiconductor module 20 caused by heat, etc., and the resulting pump-out of the heat transfer medium 30. According to the second embodiment, a high-performance and high-quality semiconductor device 1B is realized, which includes a semiconductor module 20 mounted on a support 10 via a heat transfer medium 30.

[0074] Next, a more specific configuration example of the semiconductor device 1B described above will be explained with reference to Figures 8 and 9. Figures 8 and 9 illustrate an example of the configuration of a semiconductor device according to the second embodiment. Figure 8(A) schematically shows an exploded perspective view of the main parts of an example of a semiconductor device. Figure 8(B) schematically shows an exploded perspective view of the main parts of an example of a semiconductor device. Figure 9(A) schematically shows the IXa-IXa cross-section of Figure 8(B). Figure 9(B) schematically shows the IXb-IXb cross-section of Figure 8(B).

[0075] The semiconductor device 100B shown in Figures 8(A) and 8(B) differs from the semiconductor device 100A (Figures 4 and 5) described in the first embodiment above in that it has a configuration comprising a second frame member 160 disposed between the support 110 and the semiconductor module 120, and a first frame member 140 fitted thereto.

[0076] The semiconductor module 120 includes an insulating circuit board (not shown) and a resin member 124 that encloses a semiconductor chip such as an IGBT mounted thereon, as well as a positive terminal 125, a negative terminal 126, an output terminal 127, and a control terminal 128 that are electrically connected to the insulating circuit board and semiconductor chip inside the resin member 124 and extend to the outside of the resin member 124.

[0077] The support 110 is provided with screw holes 111 located on the outside of the resin member 124 of the semiconductor module 120 to be mounted. A heat transfer medium 130 (Figure 9), such as thermal grease, and a second frame member 160 are placed between the support 110 and the semiconductor module 120 mounted on it. The second frame member 160 is made of an insulating material such as resin or ceramics. The second frame member 160 has a second frame portion 161 on which the edge portion 121b on the lower surface 120b side of the semiconductor module 120 is placed, a second opening 162 inside the second frame portion 161, and a second fastening portion 164 with a second insertion hole 163. The second frame portion 161 is provided with a recess 165 that accommodates a part of the lower surface 120b side of the semiconductor module 120 to be mounted, i.e., the lower part of the semiconductor module 120. The second insertion hole 163 of the second frame member 160 is provided in a position opposite to the screw hole 111 of the support 110.

[0078] A first frame member 140, made of a material with a certain degree of rigidity such as metal, is positioned on a semiconductor module 120 mounted on a support 110 via a second frame member 160. The first frame member 140 has a first frame portion 141 that covers the edge portion 121a on the upper surface 120a side of the semiconductor module 120, a first opening 142 inside the first frame portion 141, and a first fastening portion 144 with a first insertion hole 143. The first insertion hole 143 of the first frame member 140 is provided at a position opposite to the screw hole 111 of the support 110. A protrusion 145 (Figure 8) is provided on the outer edge of the first insertion hole 143 on the lower end 144b side of the first fastening portion 144 of the first frame member 140, which protrudes toward the second frame member 160 and fits into the second insertion hole 163. The second insertion hole 163 is an example of a recess into which the protrusion 145 is fitted.

[0079] As shown in Figures 8(A) and 8(B), a semiconductor module 120 is placed on a support 110 via a second frame member 160 (and a heat transfer medium 130 shown in Figure 9), and a first frame member 140 is placed on top of it. The first frame member 140 is placed on the semiconductor module 120 by fitting the protrusion 145 of its first fastening portion 144 into the second insertion hole 163, which is a recess in the second frame member 160. Then, a screw 150 is inserted from above into the first insertion hole 143 of the first frame member 140, then into the second insertion hole 163 of the second frame member 160, and screwed into the screw hole 111 of the support 110. This results in a semiconductor device 100B as shown in Figure 8(B), in which the first frame member 140 is fixed to the support 110 via the second frame member 160 (and the heat transfer medium 130 shown in Figure 9), and the semiconductor module 120 is fixed to the support 110 by the first frame member 140.

[0080] As shown in Figures 8(A) and 8(B), and Figures 9(A) and 9(B), in the semiconductor device 100B, the first frame portion 141 of the first frame member 140, which covers the edge portion 121a of the semiconductor module 120, is shaped to partially cover the upper surface 120a and side surface 120c of the semiconductor module 120 (its resin member 124). The second frame portion 161 of the second frame member 160, on which the semiconductor module 120 is placed, is shaped to partially cover the lower surface 120b and side surface 120c of the edge portion 121b of the semiconductor module 120. The position of the semiconductor module 120 relative to the second frame member 160 is defined by partially housing it in the recess 165 of the second frame member 160.

[0081] The position of the second frame member 160 and the semiconductor module 120 relative to the support 110 is defined by arranging the second frame member 160, which covers the lower surface 120b and side surface 120c of the resin member 124 at the edge 121b of the semiconductor module 120, such that its second insertion hole 163 faces the screw hole 111 of the support 110. The position of the first frame member 140 relative to the support 110, the second frame member 160 and the semiconductor module 120 is defined by arranging the first frame member 140, which covers the upper surface 120a and side surface 120c of the resin member 124 at the edge 121a of the semiconductor module 120, such that its first insertion hole 143 faces the screw hole 111 of the support 110 and the second insertion hole 163 of the second frame member 160.

[0082] When the screw 150 is screwed into the screw hole 111 through the first insertion hole 143 and the second insertion hole 163, the first frame member 140 is in a state where the first frame portion 141 is not in contact with the positive terminal 125, negative terminal 126, output terminal 127, and control terminal 128 that are drawn out from the side surface 120c of the semiconductor module 120 (Figures 8 and 9), and the first fastening portion 144 abuts against the second fastening portion 164 of the second frame member 160. If an insulating material is used for the second frame member 160, the second frame portion 161 may be in contact with the positive terminal 125, negative terminal 126, output terminal 127, and control terminal 128 of the semiconductor module 120.

[0083] In semiconductor device 100B, similar to that described for semiconductor device 1B, a second frame member 160 having a second opening 162 leading to the semiconductor module 120 is provided between the support 110 and the semiconductor module 120, and the heat transfer medium 30 is placed within the second opening 162. By fixing the semiconductor module 120 using such a second frame member 160 and the first frame member 140 as described above, it becomes possible to effectively suppress deformation of the semiconductor module 120 caused by heat, etc., and the resulting pump-out of the heat transfer medium 130.

[0084] In semiconductor device 100B, fixing using the first frame member 140 and the second frame member 160 makes it possible to alleviate and disperse stress generated in the semiconductor module 120 due to heat, etc., thereby suppressing its failure. In addition, it makes it possible to fix the semiconductor module 120 in a tilted state and suppress the occurrence of wiring connection problems caused by this. Furthermore, in semiconductor device 100B, displacement of the semiconductor module 120 fixed on the support 110 via a heat transfer medium 130 such as thermal grease and the second frame member 160, torque loss on the semiconductor module 120, and pump-out of the heat transfer medium 130 are suppressed, thereby suppressing a decrease in heat dissipation performance and overheating of the semiconductor module 120.

[0085] Furthermore, the semiconductor device 100B makes it possible to reduce the manufacturing costs of the semiconductor module 120 and the semiconductor device 100B using it. In the semiconductor device 100B, by using a highly rigid material such as metal for the first frame member 140 and increasing the strength of the first frame member 140 and its first fastening part 144, it becomes possible to strengthen the fixing of the first frame member 140 to the support 110 and the fixing of the semiconductor module 120.

[0086] In this example, a protrusion 145 is provided on the outer edge of the first insertion hole 143 of the first fastening portion 144 in the first frame member 140, and the second insertion hole 163 of the second fastening portion 164 in the second frame member 160 is used as a recess into which the protrusion 145 is fitted. Alternatively, a protrusion can be provided on the outer edge of the second insertion hole 163 of the second fastening portion 164 in the second frame member 160 that protrudes toward the first frame member 140, and the first insertion hole 143 of the first fastening portion 144 in the first frame member 140 can be used as a recess into which the protrusion is fitted.

[0087] Furthermore, the first frame member 140 and the second frame member 160 may also be provided with a protrusion and a recess into which it fits at a predetermined location different from the first fastening portion 144 and the second fastening portion 164. That is, one of the first frame member 140 and the second frame member 160 may be provided with a protrusion at a predetermined location, and the other may be provided with a recess into which the protrusion fits.

[0088] Furthermore, this example shows how the first frame member 140 and the second frame member 160 are fixed to the support 110 with screws 150. In addition, the first frame member 140 can be fixed to the second frame member 160 using methods such as welding or adhesive bonding, and the second frame member 160 can be fixed to the support 110 using methods such as welding or adhesive bonding.

[0089] Furthermore, a circuit board 180 may be placed on the first frame member 140 of the semiconductor device 100B, in accordance with the example of the semiconductor device 100Aa (Figure 6) described in the first embodiment, through which the control terminals 128 of the semiconductor module 120 are inserted and electrically connected.

[0090] [Third Embodiment] Figure 10 illustrates an example of a semiconductor device according to a third embodiment. Figure 10(A) schematically shows a plan view of the main part of the example semiconductor device. Figure 10(B) schematically shows a cross-sectional view from Xa-Xa in Figure 10(A). Figure 10(C) schematically shows a cross-sectional view from Xb-Xb in Figure 10(A).

[0091] The semiconductor device 1C shown in Figures 10(A) to 10(C) differs from the semiconductor device 1B (Figure 7) described in the second embodiment above in that it has a configuration in which a first frame member 40 and a second frame member 60 are arranged with multiple semiconductor modules 20, in this example three, in between.

[0092] The semiconductor modules 20 are mounted on the support 10, for example, aligned in one direction. A second frame member 60 is placed between the support 10 and the semiconductor modules 20, and a first frame member 40 is placed on top of the semiconductor modules 20.

[0093] The second frame member 60 of the semiconductor device 1C has a second frame portion 61 on which the edges 21b of the lower surface 20b of each semiconductor module 20 are placed, a second opening 62 located inside the second frame portion 61 and communicating with the lower surface 20b of each semiconductor module 20, and a second insertion hole 63 through which screws 50 are inserted. A heat transfer medium 30, such as heat dissipation grease, is placed inside the second opening 62 of the second frame member 60. The first frame member 40 of the semiconductor device 1C has a first frame portion 41 that covers the edges 21a of the upper surface 20a of each semiconductor module 20, a first opening 42 located inside the first frame portion 41 and communicating with the upper surface 20a of each semiconductor module 20, and a first insertion hole 43 through which screws 50 are inserted. The second insertion hole 63 of the second frame member 60 and the first insertion hole 43 of the first frame member 40 are provided at positions opposite to the screw holes 11 of the support 10.

[0094] A semiconductor module 20 is placed on the support 10 via a second frame member 60 and a heat transfer medium 30, and a first frame member 40 is placed on top of it. Then, a screw 50 is inserted through the first insertion hole 43 of the first frame member 40 and the second insertion hole 63 of the second frame member 60 and screwed into the screw hole 11 of the support 10. This results in a semiconductor device 1C as shown in Figures 10(A) to 10(C).

[0095] As in this semiconductor device 1C, a first frame member 40 and a second frame member 60 having shapes corresponding to multiple semiconductor modules 20 can be used to fix the group of semiconductor modules 20 to the support 10. Alternatively, the semiconductor modules 20 can be fixed to the support 10 using only the first frame member 40 having shapes corresponding to multiple semiconductor modules 20.

[0096] Next, a more specific configuration example of the semiconductor device 1C described above will be explained with reference to Figure 11. Figure 11 illustrates an example of the configuration of a semiconductor device according to the third embodiment. Figure 11 schematically shows an exploded perspective view of the main parts of an example of a semiconductor device.

[0097] The semiconductor device 100C shown in Figure 11 differs from the semiconductor device 100B (Figures 8 and 9) described in the second embodiment above in that it has a configuration in which a first frame member 140 and a second frame member 160 are arranged with three semiconductor modules 120 in between.

[0098] For example, each of the three semiconductor modules 120 can be a so-called 2-in-1 type IGBT module, which includes a group of semiconductor chips that constitute the upper and lower arms of the power converter. The semiconductor device 100C is an example of a so-called three-phase inverter, which includes three semiconductor modules 120 for the U-phase, V-phase, and W-phase.

[0099] The second frame member 160 has a second frame portion 161 on which the edge portion 121b on the lower surface 120b side of each semiconductor module 120 is placed, a second opening 162 located inside the second frame portion 161 and communicating with the lower surface 120b of each semiconductor module 120, and a second fastening portion 164 provided with a second insertion hole 163. The second frame portion 161 is provided with a recess 165 that accommodates a part of the lower surface 120b side of each semiconductor module 120 that is placed on it. The second insertion hole 163 of the second frame member 160 is provided at a position opposite to the screw hole 111 of the support 110.

[0100] The first frame member 140 is positioned on a group of semiconductor modules 120 mounted on a support 110 via a second frame member 160 (and a heat transfer medium (corresponding to the heat transfer medium 130 in Figure 13, described later)). The first frame member 140 has a first frame portion 141 that covers the edge portion 121a on the upper surface 120a side of each semiconductor module 120, a first opening 142 located inside the first frame portion 141 that leads to the upper surface 120a of each semiconductor module 120, and a first fastening portion 144 provided with a first insertion hole 143. The first insertion hole 143 of the first frame member 140 is provided at a position opposite to the screw hole 111 of the support 110. The outer edge of the first insertion hole 143 on the lower end 144b side of the first fastening portion 144 of the first frame member 140 is provided with a protrusion 145 that fits into the second insertion hole 163 (recess) of the second frame member 160.

[0101] As shown in Figure 11, a group of semiconductor modules 120 are arranged on a support 110 via a second frame member 160 (and a heat transfer medium), and a first frame member 140 is placed on top of them. The first frame member 140 is positioned on top of the group of semiconductor modules 120 with the protrusion 145 of its first fastening portion 144 fitted into the second insertion hole 163 of the second frame member 160. Then, a screw 150 is inserted from above into the first insertion hole 143 of the first frame member 140, then into the second insertion hole 163 of the second frame member 160, and screwed into the screw hole 111 of the support 110. This results in a semiconductor device 100C.

[0102] In the semiconductor device 100C, the first frame portion 141 of the first frame member 140, which covers the edge portion 121a of each semiconductor module 120, is shaped to partially cover the upper surface 120a and side surface 120c of each semiconductor module 120 (its resin member 124). The second frame portion 161 of the second frame member 160, on which each semiconductor module 120 is placed, is shaped to partially cover the lower surface 120b and side surface 120c of the edge portion 121b of each semiconductor module 120. Each semiconductor module 120 is partially housed in a recess 165 of the second frame member 160, thereby defining its position relative to the second frame member 160.

[0103] The positions of the semiconductor module group 120 and the second frame member 160 relative to the support 110 are defined by arranging the second frame member 160, which covers the lower surface 120b and side surface 120c of the resin member 124 at each edge 121b of the semiconductor module group 120, such that its second insertion hole 163 faces the screw hole 111 of the support 110. The positions of the first frame member 140 relative to the support 110, the second frame member 160 and the semiconductor module 120 are defined by arranging the first frame member 140, which covers the upper surface 120a and side surface 120c of the resin member 124 at each edge 121a of the semiconductor module group 120, such that its first insertion hole 143 faces the screw hole 111 of the support 110 and the second insertion hole 163 of the second frame member 160.

[0104] In semiconductor device 100C, by using a first frame member 140 and a second frame member 160 having shapes corresponding to multiple semiconductor modules 120, it becomes possible to mount the group of semiconductor modules 120 on the support 110 while suppressing positional displacement. Furthermore, in semiconductor device 100C, displacement of the group of semiconductor modules 120, torque loss on the group of semiconductor modules 120, and pump-out of the heat transfer medium interposed between each semiconductor module 120 and the support 110 are suppressed, thereby suppressing a decrease in heat dissipation performance and overheating of the group of semiconductor modules 120. In addition, the same effects as described for semiconductor device 100B can be obtained in semiconductor device 100C.

[0105] In this example, the first frame member 140 and the second frame member 160 are shown to be fixed to the support 110 with screws 150. Alternatively, the first frame member 140 can be fixed to the second frame member 160 using methods such as welding or adhesive bonding, and the second frame member 160 can be fixed to the support 110 using methods such as welding or adhesive bonding.

[0106] Furthermore, although this example shows how to fix the semiconductor module 120 to the support 110 using both the first frame member 140 and the second frame member 160, it is also possible to fix the semiconductor module 120 to the support 110 using only the first frame member 140.

[0107] Furthermore, a circuit board 180 may be placed on the first frame member 140 of the semiconductor device 100C, in accordance with the example of the semiconductor device 100Aa (Figure 6) described in the first embodiment, through which the control terminals 128 of the semiconductor module 120 are inserted and electrically connected.

[0108] [Fourth Embodiment] Figures 12 and 13 illustrate an example of the configuration of a semiconductor device according to the fourth embodiment. Figure 12 schematically shows a perspective view of the main part of an example of a semiconductor device. Figure 13 schematically shows a cross-sectional view of line XIII-XIII in Figure 12.

[0109] The semiconductor device 100D shown in Figures 12 and 13 differs from the semiconductor device 100C (Figure 11) described in the third embodiment above in that it has a configuration in which a beam member 170 is attached to a first frame member 140.

[0110] The first frame member 140 has engaging portions 146 on the opposing outer edges of the first frame portion 141. The beam member 170 has a shape formed by bending a strip of metal or the like with a certain rigidity at a predetermined position, and one end 171 and the other end 172 (both ends) are engaged with the engaging portions 146 of the first frame member 140 and fixed to the first frame member 140. The beam member 170 is arranged to traverse the three semiconductor modules 120 and is fixed to the first frame portion 141 with screws 174 at the position between adjacent semiconductor modules 120. In the intermediate portion 173 between the end 171 and end 172 of the beam member 170, a pressing structure 175 is provided at the position of each first opening 142 of the first frame member 140 to press the upper surface 120a of each semiconductor module 120 exposed therefrom. In the example shown in Figure 12, the pressing structure 175 is realized by bending the beam member 170 and functions as a leaf spring.

[0111] A first frame member 140 to which a beam member 170 is attached is placed on a group of semiconductor modules 120 and fixed to a support 110 via a second frame member 160 and a heat transfer medium 130 (Figure 13) using screws 150. Alternatively, the first frame member 140 is placed on a group of semiconductor modules 120 and fixed to the support 110 via a second frame member 160 and a heat transfer medium 130 (Figure 13) using screws 150, after which the beam member 170 is attached to the first frame member 140. As a result, the upper surface 120a of each semiconductor module 120 is pressed towards the support 110 by a pressing structure 175 of the beam member 170 that functions as a leaf spring. Consequently, the pressing force of each semiconductor module 120 toward the heat transfer medium 130 and the support 110 is increased, improving heat dissipation performance. Furthermore, the position of each semiconductor module 120 sandwiched between the first frame member 140 and the second frame member 160 is stabilized, their displacement is suppressed, and vibration resistance is improved.

[0112] In this example, a beam member 170 having a pressing structure 175 that presses against the upper surface 120a of each semiconductor module 120 is attached to a first frame member 140 having a shape corresponding to three semiconductor modules 120. In addition, a beam member 170 having a pressing structure 175 that presses against the upper surface 120a of a single semiconductor module 120 can also be attached to a first frame member 140 having a shape corresponding to one semiconductor module 120, that is, a first frame member 140 as described in the first and second embodiments above.

[0113] Furthermore, a circuit board 180 may be placed on the first frame member 140 of the semiconductor device 100D, in accordance with the example of the semiconductor device 100Aa (Figure 6) described in the first embodiment, through which the control terminals 128 of the semiconductor module 120 are inserted and electrically connected.

[0114] [Fifth Embodiment] Figure 14 illustrates an example of the configuration of a semiconductor device according to the fifth embodiment. Figure 14 schematically shows an exploded perspective view of the main parts of an example of a semiconductor device.

[0115] The semiconductor device 100E shown in Figure 14 differs from the semiconductor device 100C (Figure 11) described in the third embodiment above in that it has a configuration in which a second frame member 160 having a terminal block 166 is used.

[0116] The terminal block 166 of the second frame member 160 of the semiconductor device 100E is provided on the outside of the second frame portion 161, and integrally with the second frame portion 161. The terminal block 166 is shaped such that when the second frame member 160 is placed on the support 110, the upper surface 166a of the terminal block 166 is higher than the upper surface 161a of the second frame portion 161.

[0117] Each of the semiconductor modules 120 of the semiconductor device 100E has a positive terminal 125, a negative terminal 126, and an output terminal 127 that extend from the side surface 120c of the semiconductor module 120 to the outside of the second frame portion 161, bent upwards toward the semiconductor module 120, and then bent further toward the side of the semiconductor module 120 (crank shape). At this time, the positive terminal 125, the negative terminal 126, and the output terminal 127 are bent to match the shape of the terminal block 166. The positive terminal 125, the negative terminal 126, and the output terminal 127 are bent in advance so that when the semiconductor module 120 is placed on the second frame member 160, their respective tip portions 125a, 126a, and 127a are positioned on the upper surface 166a of the terminal block 166.

[0118] As shown in Figure 14, a group of semiconductor modules 120 are arranged on a support 110 via a second frame member 160, and a first frame member 140 is placed on top of them. The first frame member 140 is positioned on top of the group of semiconductor modules 120 with the protrusion 145 of its first fastening portion 144 fitted into the second insertion hole 163 (recess) of the second frame member 160. Then, a screw 150 is inserted from above into the first insertion hole 143 of the first frame member 140, then into the second insertion hole 163 of the second frame member 160, and screwed into the screw hole 111 of the support 110. This results in the semiconductor device 100E.

[0119] Figure 15 illustrates an example of connecting an external connection terminal to a terminal block of a semiconductor device according to the fifth embodiment. Figures 15(A) to 15(C) schematically show cross-sectional views of the main parts of an example of a semiconductor device in which an external connection terminal and a terminal block are connected.

[0120] As shown in Figures 15(A) to 15(C), the external connection terminals 129 (positive terminal 125, negative terminal 126, or output terminal 127) of the semiconductor module 120 are pre-bent to match the shape of the terminal block 166 of the second frame member 160, so that when the semiconductor module 120 is placed on the second frame member 160, the tip portion 129a (tip portion 125a, tip portion 126a, or tip portion 127a) is positioned on the upper surface 166a of the terminal block 166.

[0121] For example, as shown in Figure 15(A), the tip 129a of the external connection terminal 129 of the semiconductor module 120 is placed on the upper surface 166a of the terminal block 166. Alternatively, as shown in Figure 15(B), the tip 129a of the external connection terminal 129 of the semiconductor module 120 may be fixed to the upper surface 166a of the terminal block 166a with a screw 167. Or, as shown in Figure 15(C), a conductive terminal portion 166b may be provided on the upper surface 166a of the terminal block 166a, and the tip 129a of the external connection terminal 129 of the semiconductor module 120 may be electrically connected to the terminal portion 166b. For example, the tip 129a can be joined to the terminal portion 166b using a bonding material such as solder, the tip 129a can be fastened to the terminal portion 166b using a screw, or the tip 129a can be welded to the terminal portion 166b by laser welding.

[0122] As in this semiconductor device 100E, a second frame member 160 having a terminal block 166 can be used to connect the tips 125a, 126a, and 127a (the tip 129a of the external connection terminal 129) of the positive terminal 125, negative terminal 126, and output terminal 127 of the semiconductor module 120, which has been bent into a predetermined shape, to the terminal block 166.

[0123] In this example, a terminal block 166 is provided on a second frame member 160 having a shape corresponding to three semiconductor modules 120, and the respective tip portions 125a, 126a, and 127a of the positive terminal 125, negative terminal 126, and output terminal 127 of each semiconductor module 120 are connected to the terminal block 166. In addition, a terminal block 166 can also be provided on the outside of the second frame member 161 of a second frame member 160 having a shape corresponding to one semiconductor module 120, i.e., a second frame member 160 as described in the first and second embodiments above, and the respective tip portions 125a, 126a, and 127a of the positive terminal 125, negative terminal 126, and output terminal 127 of that single semiconductor module 120 can be connected to the terminal block 166.

[0124] Furthermore, when using a second frame member 160 having such a terminal block 166, a beam member 170 can be attached to the first frame member 140 used in combination with it, in accordance with the example of the fourth embodiment described above, and the semiconductor module 120 can be pressed towards the support 110 by the pressing structure 175.

[0125] Furthermore, a circuit board 180 may be placed on the first frame member 140 of the semiconductor device 100E, in accordance with the example of the semiconductor device 100Aa (Figure 6) described in the first embodiment, through which the control terminals 128 of the semiconductor module 120 are inserted and electrically connected.

[0126] Next, an example of a semiconductor device manufacturing method will be described as a sixth embodiment. [Sixth Embodiment] Figure 16 illustrates an example of a method for manufacturing a semiconductor device according to the sixth embodiment.

[0127] For example, when manufacturing a semiconductor device 100A (Figures 4 and 5) as described in the first embodiment above, a mounting process is first performed in which the semiconductor module 120 is mounted on the support 110 via a heat transfer medium 130 (step S1). In this case, for example, a heat transfer medium 130 such as thermal grease is placed in a predetermined mounting area set inside the screw holes 111 of the support 110, and the semiconductor module 120 is mounted on it. Alternatively, a semiconductor module 120 with a heat transfer medium 130 placed on its lower surface 120b is mounted in a predetermined mounting area of ​​the support 110.

[0128] Next, a first mounting step is performed in which the first frame member 140 is placed on the semiconductor module 120 (step S2). In this step, for example, the first insertion hole 143 is positioned opposite the screw hole 111 of the support 110, and the edge portion 121a of the upper surface 120a of the semiconductor module 120 (its resin member 124) is covered by the first frame portion 141.

[0129] Next, a fixing process is performed to fix the first frame member 140 to the support 110 (step S3). In this process, for example, a screw 150 is inserted into the first insertion hole 143 of the first frame member 140, and its tip is screwed into the screw hole 111 of the support 110, thereby fixing the first frame member 140 to the support 110. The semiconductor device 100A is manufactured using this method.

[0130] In the case of manufacturing a semiconductor device 100B (Figure 7) further comprising a second frame member 160 as described in the second embodiment above, a second mounting step is performed in which the second frame member 160 is placed on the support 110 prior to the mounting step S1. After the second mounting step, the mounting step S1 and the first mounting step S2 are performed, and in the fixing step S3, the first frame member 140 is fixed to the support 110 via the second frame member 160.

[0131] Furthermore, when manufacturing a semiconductor device 100C (Figure 11) comprising a plurality of semiconductor modules 120 and a first frame member 140 or a second frame member 160 having a corresponding shape, as described in the third embodiment above, it can be manufactured using the same procedure as described above.

[0132] Furthermore, when manufacturing a semiconductor device 100D (Figures 12 and 13) equipped with a beam member 170 as described in the fourth embodiment above, for example, prior to the first mounting step in step S2, the beam member 170 is attached to the first frame member 140 which is mounted on the semiconductor module 120. Alternatively, after the fixing step in step S3, the beam member 170 is attached to the first frame member 140 which is fixed to the support 110.

[0133] Furthermore, when manufacturing a semiconductor device 100E (Figures 14 and 15) that includes a second frame member 160 having a terminal block 166, as described in the fifth embodiment above, a second mounting step is performed prior to the mounting step of step S1, in which the second frame member 160 having the terminal block 166 is placed on the support 110. Then, for example, after the fixing step of step S3, a connection step is performed in which the respective tip portions 125a, 126a, and 127a of the positive terminal 125, negative terminal 126, and output terminal 127, which are bent and extend from the semiconductor module 120, are connected to the terminal block 166.

[0134] The semiconductor devices 100A, 100B, 100C, 100D, and 100E are manufactured using the methods described above. Furthermore, when a circuit board 180 (Figure 6) as described in the first embodiment is placed on semiconductor devices 100A, 100B, 100C, 100D, and 100E, the circuit board 180 is placed on the first frame member 140 such that the control terminals 128 of the semiconductor module 120 are inserted through it, and the control terminals 128 and the circuit board 180 are electrically connected. [Explanation of symbols]

[0135] 1A, 1B, 1C, 100A, 100Aa, 100B, 100C, 100D, 100E Semiconductor equipment 10,110 Support 11,111 screw holes 20,120 semiconductor modules 20a,120a,161a,166a Top surface 20b,120b bottom surface 21a,21b,121a,121b Edge 22 Insulated Circuit Board 22a Insulating substrate 22b First conductive layer 22c Second conductive layer 23 Semiconductor chips 24 Sealing resin 25 Bonding material 26 wires 27 Heat sink 28,30,130 Heat transfer medium 29 Resin case 40,140 First frame member 41,141 Section 1 42,142 First opening 43,143 First insertion hole 50, 150, 167, 174 screws 60,160 Second frame member 61,161 Second Slot 62,162 Second opening 63,163 Second insertion hole 120c side 122c conductive layer 124 Resin components 125 Positive terminal 125a,126a,127a,129a Tip 126 Negative terminal 127 Output terminals 128 Control terminals 129 External connection terminals 144 1st fastening part 144a top end 144b Bottom end 145 Convex part 146 Engagement part 164 2nd fastening part 166 Terminal block 166b Terminal section 170 Beam members 171,172 End 173 Middle section 175 Pressing structure 180 Circuit Boards 181 Through hole

Claims

[Claim 1] Support and A semiconductor module comprising a semiconductor chip, a resin member that encloses the semiconductor chip, a conductive layer exposed from the resin member, a first terminal whose tip is placed on an external terminal and fixed by predetermined means, and a second terminal having an upwardly extending portion that is connected to a circuit board, wherein the lower surface on the side of the conductive layer is mounted on the support, A pressing member that presses the resin member on the upper surface of each of the at least three semiconductor modules toward the support, Semiconductor equipment including

Images