SYSTEM AND METHOD FOR MONITORING BATTERIES IN USER DEVICES - Patent application

Abstract

A system and method for monitoring a battery in a user device is disclosed. The user device, in examples, includes a mobile phone and a laptop. The system includes a microelectromechanical system (MEMS) ultrasonic source, a MEMS ultrasonic sensor, a signal drive and acquisition module (SDM), and a processor. The MEMS source and sensor are included in the user device and positioned relative to the battery. The SDM configures the MEMS ultrasonic source to transmit ultrasonic pulses to the battery, and the MEMS ultrasonic sensor detects the ultrasonic waves reflected by or transmitted through the battery. The SDM collects the detected pulses, and the processor analyzes the detected pulses to determine the battery's status, including its state of health, state of charge, and instantaneous battery thickness measurements. For example, the SDM and processor may be included in the user device, and / or the SDM and signal processor may be incorporated into an integrated circuit.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of and priority under 35 U.S.C. § 119(e) to U.S. Provisional Application No. 63 / 437,350, filed January 5, 2023, entitled "System and Method for Monitoring Batteries in User Devices," which is incorporated herein by reference in its entirety.

[0002] (Technical field) The present disclosure relates generally to non-invasive monitoring of energy storage devices installed in user devices, and more particularly to monitoring of electrolyte-based batteries (e.g., lithium-ion batteries) installed or installable in user devices such as, but not limited to, computer laptops, smartphones, and tablets. [Background technology]

[0003] User devices are increasingly equipped with powerful electrolyte-based rechargeable batteries, such as lithium-ion batteries. These batteries are long-lasting and can withstand hundreds of charge-discharge cycles. However, the batteries are also typically installed by the user device manufacturer and are not accessible to the user. Summary of the Invention [Problem to be solved by the invention]

[0004] User devices that include rechargeable batteries have limited capabilities to monitor and detect battery problems and take action in response to the detection of a problem. Existing battery monitoring systems contained within or communicating with the user device typically rely on periodic voltage and / or current measurements of the battery for this purpose. While existing monitoring systems can determine if the battery capacity has fallen below a recommended operational threshold level (e.g., 80% of the original capacity) and alert the user, the systems typically cannot detect battery failure or provide early warning of failure.

[0005] Furthermore, even though a rise in battery temperature can be an early indicator of battery failure, most user devices include temperature sensors on their central processing unit (CPU) and / or hard drive, but not on the battery. While the user device may send a warning message to the user when the user device's temperature exceeds a threshold, the user must act by shutting down the system, and the user receives no indication that a faulty battery may be the cause of the temperature rise. This can be particularly dangerous because once a rechargeable battery begins to fail, it can rapidly progress to a catastrophic failure state in a matter of minutes (e.g., 10–15 minutes). In this catastrophic failure state, the battery's electrolyte can breach the battery's housing or protective packaging, potentially causing fires and other damage within the user device. [Means for solving the problem]

[0006] Embodiments of the disclosed subject matter may, among other things, address one or more of the problems and shortcomings set forth above.

[0007] Embodiments of the disclosed subject matter provide systems, methods, and devices for continuous (or semi-continuous) monitoring of batteries in user devices. Some embodiments can check and predict battery performance, detect and predict early indicators of battery failure, alert one or more users regarding any performance or failure issues, and / or provide one or more users with early indicators of failure. In this way, embodiments of the disclosed subject matter can protect users and / or user devices from damage (or at least from catastrophic or irreparable damage).

[0008] In some embodiments, the instantaneous state of the battery under test can be determined by ultrasonic testing. The battery can be installed in a user device (e.g., a mobile or smartphone, laptop, e-reader, computer workstation, game console, tablet computing device, etc.). The state of the battery can be based on ultrasonic signals transmitted by the system at one or more spatially separated locations on the battery and then collected by the system. The system analyzes the collected signals to obtain the state of the battery. In some embodiments, at least one microelectromechanical system (MEMS) ultrasonic source and at least one MEMS ultrasonic sensor can be included within the user device. In some embodiments, one, some, or all of the at least one MEMS ultrasonic source and the MEMS ultrasonic sensor can be positioned relative to the battery.

[0009] In some embodiments, in one operating mode of the system (also known as "echo mode"), the MEMS ultrasonic source and the MEMS ultrasonic sensor may be included in a single transducer device positioned relative to the same surface of the battery. The MEMS ultrasonic sensor may be configured to transmit ultrasonic pulses into the battery, and the MEMS ultrasonic sensor may be configured to detect ultrasonic pulses reflected from the interior of the battery. In some embodiments, in another operating mode of the system (also known as "through-transmission mode"), at least one MEMS ultrasonic source and at least one MEMS ultrasonic sensor may be positioned relative to opposing surfaces of the battery, where the MEMS ultrasonic sensor can detect ultrasonic pulses transmitted through the battery by the MEMS ultrasonic source. Whether the system is configured in echo mode or through-transmission mode, the system can collect the detected ultrasonic pulses and analyze the detected pulses and information extracted or otherwise calculated from the pulses to determine the state of the battery.

[0010] In some embodiments, the system may include several components in addition to, for example, a MEMS ultrasonic source and a MEMS ultrasonic sensor. Such components may include, but are not limited to, a signal drive and acquisition module (SDM) and a processor (also known as a signal processor). In some embodiments, the SDM may include a controller, a memory, an excitation module, and a receiver module.

[0011] In some embodiments, the system can operate as follows: The excitation module can be configured by the controller to send an excitation signal to the MEMS ultrasonic source, which can transmit ultrasonic pulses to the battery in response to the excitation signal. The MEMS ultrasonic sensor can be configured by the controller to detect ultrasonic pulses from the battery and generate a response signal related to the detected ultrasonic waves. The receiver module can receive the response signal generated from the MEMS ultrasonic sensor. The signal processor can access the receiver module, analyze the response signal, and determine different states of the battery in response to the analysis. The different states of the battery can include, for example, a state of health (SOH), a state of charge (SOC), a temperature, an instantaneous thickness of the battery, and a thickness of the battery determined over time (e.g., a life thickness).

[0012] In some embodiments, the system (or one or more components thereof) may be integrated into a user device, for example, during manufacture of the user device and / or during manufacture of the battery. In some embodiments, the SDM and signal processor may be included within the user device along with the MEMS ultrasonic source and MEMS ultrasonic sensor. For example, the SDM and signal processor may be integrated into the same integrated circuit, such as an application specific integrated circuit (ASIC) or a combination of discrete electronic components.

[0013] In some embodiments, the system may include a battery management system (BMS). Alternatively, the system may be in communication with a BMS. In some embodiments, when the system identifies or predicts battery performance and / or failure, the system may be configured to send a warning message to the BMS. In some embodiments, in response to receiving the message, the BMS may be configured to send one or more signals to the user device or components thereof to, for example, cut off power to the user device and / or disable battery charging as a safety precaution.

[0014] In one or more embodiments, a system can monitor a battery in a user device. To this end, the system can include a MEMS ultrasonic source and a MEMS ultrasonic sensor, an SDM, and a processor. The MEMS ultrasonic source and sensor can each be included in the user device and positioned relative to the battery. The SDM can include a controller, a memory, an excitation module, and a receiver module.

[0015] In some embodiments, the excitation module may be configured (e.g., by a controller) to transmit an excitation signal to the MEMS ultrasonic source. In response to the excitation signal, the MEMS ultrasonic source may be configured to transmit an ultrasonic pulse to the battery. The MEMS ultrasonic sensor may be configured (e.g., by a controller) to detect the ultrasonic pulse from the battery and generate a response signal related to the detected ultrasonic wave, which may be received by the receiver module. A processor may be configured to access the receiver module, analyze the response signal, and determine different states of the battery in response to the analysis.

[0016] In some embodiments, the MEMS ultrasonic source and the MEMS ultrasonic sensor can be positioned against the same surface of the battery, with the MEMS ultrasonic sensor detecting ultrasonic pulses reflected from the interior of the battery. Alternatively or additionally, in some embodiments, the MEMS ultrasonic source can be positioned against a first surface of the battery and the MEMS ultrasonic sensor can be positioned against a second surface of the battery opposite the first surface, with the MEMS ultrasonic sensor detecting ultrasonic waves transmitted through the battery. In some embodiments, one or both of the MEMS ultrasonic source and the MEMS ultrasonic sensor can be a capacitive micromachined ultrasonic transducer (CMUT) or a piezoelectric micromachined ultrasonic transducer (PMUT).

[0017] In some embodiments, the SDM and processor may be included within a user device, for example, the SDM and processor may be integrated into the same integrated circuit.

[0018] In some embodiments, the status determined by the system can include the state of charge (SOC), state of health (SOH), and temperature of the battery. In some embodiments, the status can also include, but is not limited to, an instantaneous thickness measurement of the battery and a lifetime thickness measurement of the battery. For example, a lifetime thickness measurement can be determined from one or more instantaneous thickness measurements of the battery taken over time and stored in memory. In some embodiments, the status can be determined when the battery is discharged or fully charged. Alternatively or additionally, in some embodiments, the status can be determined while the battery is charging or discharging.

[0019] In some embodiments, the memory may include a set of feature rules that define, for example, one or more features for the processor to extract from the response signal during analysis of the response signal.

[0020] In one or more embodiments, a method for monitoring a battery in a user device can include transmitting an excitation signal to a MEMS ultrasonic source such that the MEMS ultrasonic source transmits ultrasonic pulses into the battery in response to the excitation signal. The method can further include detecting ultrasonic pulses from the battery via a MEMS ultrasonic sensor and generating a response signal related to the detected ultrasonic waves. The method can also include receiving the response signal from the MEMS ultrasonic sensor and analyzing the response signal. The method can further include determining different states of the battery in response to the analysis. In some embodiments, the method can also include positioning the MEMS ultrasonic source and the MEMS ultrasonic sensor relative to a battery, the battery being included in the user device.

[0021] Any of the various innovations of the present disclosure can be used in combination or separately. This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. The foregoing and other objects, features, and advantages of the disclosed technology will become more apparent from the following Detailed Description, which proceeds with reference to the accompanying drawings. [Brief explanation of the drawings]

[0022] Embodiments will now be described with reference to the accompanying drawings, which are not necessarily drawn to scale. Where applicable, some elements may be simplified or otherwise not shown to help illustrate and explain underlying features. Like reference numbers refer to like elements throughout the drawings. [Figure 1]FIG. 1 is a schematic diagram of an in-situ battery assessment and monitoring system in accordance with one or more embodiments of the disclosed subject matter, the system being configured to assess one or more conditions of a battery contained within a user device using a MEMS ultrasonic source and a sensor operating in through-transmission mode, the entire system being contained within the user device. [Figure 2] FIG. 2 is a schematic diagram of a system similar to FIG. 1, in accordance with one or more embodiments of the disclosed subject matter, configured instead to use a MEMS ultrasonic transducer operating in echo mode. [Figure 3] FIG. 3 is a schematic diagram of a system similar to FIG. 2, in which some components of the system are located external to the user device, in accordance with one or more embodiments of the disclosed subject matter. [Figure 4-6] Figures 4, 5, and 6 are more detailed schematic diagrams of systems similar to Figure 2 in accordance with one or more embodiments of the disclosed subject matter, showing, respectively, a single ultrasonic transducer positioned relative to a single battery, multiple batteries with a single ultrasonic transducer positioned relative to each battery, and a single battery with an array of ultrasonic transducers positioned relative to the battery. [Figure 7] FIG. 7 is an image of a semiconductor wafer containing, in one example, thousands of separate "chips," each incorporating nearly all of the components of the system of FIG. [Figure 8] FIG. 8 is an image showing individual elements of a MEMS transducer in the left portion of the image and an exemplary grouping of individual MEMS transducer elements connected in a grid in the right portion of the image. [Figure 9] FIG. 9 is a schematic diagram showing the layout of semiconductor layers of a piezoelectric micromachined ultrasonic transducer (PMUT) MEMS transducer. [Figure 10] FIG. 10 is an image of a semiconductor wafer containing over 100 capacitive micromachined ultrasonic transducer (CMUT) transducers. [Figure 11]FIG. 11 is a flowchart illustrating a method of operation of a field battery assessment and monitoring system installed in a user device in accordance with one or more embodiments of the disclosed subject matter. [Figure 12] FIG. 12 is a block diagram of a computing environment in which the described innovations may be implemented. DETAILED DESCRIPTION OF THE INVENTION

[0023] General Considerations For purposes of this specification, certain aspects, advantages, and novel features of the disclosed embodiments are described herein. The disclosed methods and systems should not be construed as limiting in any way. Instead, the present disclosure covers all novel and non-obvious features and aspects of the various disclosed embodiments, alone and in various combinations and subcombinations with each other. The methods and systems are not limited to any particular aspect, feature, or combination thereof, and the disclosed embodiments do not require that any one or more particular advantages be present or problems be solved. Techniques from any embodiment or example can be combined with techniques described in any one or more of the other embodiments or examples. Given the many possible embodiments to which the principles of the disclosed technology may be applied, it should be recognized that the illustrated embodiments are illustrative only and should not be construed as limiting the scope of the disclosed technology.

[0024] Although some operations of the disclosed methods are described in a particular order for convenient presentation, it should be understood that this manner of description encompasses reordering unless a specific ordering is required by specific language described below. For example, operations described sequentially may in some cases be reordered or performed simultaneously. Moreover, for simplicity, the accompanying drawings may not show the various ways in which the disclosed methods may be used in conjunction with other methods. Furthermore, the description may use terms such as "provide" or "achieve" to describe the disclosed methods. These terms are high-level abstractions of the actual operations that are performed. The actual operations corresponding to these terms may vary depending on the particular implementation and are readily discernible by those skilled in the art.

[0025] The disclosure of numerical ranges should be understood to refer to each discrete point within the range, including the endpoints, unless otherwise specified. Unless otherwise indicated, all numbers expressing amounts of ingredients, molecular weights, percentages, temperatures, times, etc. used in this specification or claims should be understood to be modified by the term "about." Thus, unless otherwise implicitly or explicitly indicated, or unless the context would be understood by one of ordinary skill in the art to have a clearer configuration, the numerical parameters described are approximations that may depend on the desired properties sought and / or the limits of detection under standard testing conditions / methods, as known to those skilled in the art. When directly and explicitly distinguishing an embodiment from the discussed prior art, an embodiment number is not an approximation unless the words "about," "substantially," or "approximately" are recited. Whenever "substantially," "approximately," "about," or similar language is expressly used in conjunction with a particular value, a variation of up to 10% of that value is intended, unless expressly stated otherwise.

[0026] Directions and other relative references may be used to facilitate explanation of the figures and principles herein but are not intended to be limiting. For example, specific terms such as "inside," "outside," "up," "down," "top," "bottom," "internal," "external," "left," "right," "front," "rear," "rear side," etc. may be used. Such terms are used, where applicable, to provide some clarity when dealing with relative relationships, particularly with respect to the illustrated embodiments. However, such terms are not intended to imply absolute relationships, positions, and / or orientations. For example, with respect to an object, a "top" can become a "bottom" simply by flipping the object over. Nevertheless, it is still the same part, and the object remains the same.

[0027] As used herein, "comprising" includes "including," and the singular forms "a" or "an" or "the" include plural references unless the context clearly dictates otherwise. The term "or" refers to a single element or a combination of two or more elements of the mentioned alternative elements unless the context clearly dictates otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. The terms "includes," "comprises," "has," "including," "having," and / or "comprising," as used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude one or more other features, integers, steps, operations, elements. Furthermore, when an element, including a component or subsystem, is referred to and / or shown as being connected or coupled to another element, it is understood that unless expressly stated otherwise, it may be directly connected or coupled to the other element or there may be intervening elements.

[0028] Although there are alternatives for the various components, parameters, operating conditions, etc. described herein, these alternatives are not necessarily equivalent and / or perform equally well. Nor is it intended to imply that the alternatives are listed in order of preference unless otherwise specified. Unless otherwise specified, any of the groups defined below may be substituted or unsubstituted.

[0029] Unless otherwise explained, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of this disclosure, suitable methods and materials are described below. The materials, methods, and examples are illustrative only and are not intended to be limiting. Features of the subject matter of this disclosure will become apparent from the following detailed description and the appended claims.

[0030] Terminology Overview The following is provided to facilitate a description of various aspects of the disclosed subject matter and to guide those of ordinary skill in the art in practicing the disclosed subject matter. TIFF2026502488000002.tif64170

[0031] Reference Code List The following reference numbers are used throughout this description and the accompanying drawings unless otherwise noted: TIFF2026502488000003.tif246170TIFF2026502488000004.tif125170

[0032] Introduction Embodiments of the disclosed subject matter will now be described more fully hereinafter with reference to the accompanying drawings, in which illustrative embodiments are shown.

[0033] Lithium-ion batteries typically contain one or more battery cells immersed in an electrolyte. The battery cells can be arranged in layers within the battery. For example, in a prismatic battery, the layers are arranged horizontally along the length of the battery. Each cell contains the following layers / components: a cathode electrode (cathode), a separator, and an anode electrode (anode). The separator is formed from an electrically insulating material. Additional cell separators are added between each adjacent battery cell.

[0034] Ultrasonic "through transmission" mode FIG. 1 is a schematic diagram of a battery monitoring system 1000 configured for ultrasonic interrogation of a test battery 1035 using a through transmission method. The battery 1035 is installed in a user device 200, and the entire system 1000 is contained within the user device 200. The system 1000 may also include a battery management system (BMS) 1199. In the illustrated example, the battery 1035 is a rectangular element having a first surface 1040 and an opposing second surface 1045 separated by a thickness dimension 1042. The surfaces 1040, 1045 are substantially flat, parallel to each other, and extend along the length 1060 of the battery 1035. The thickness dimension 1042 is substantially perpendicular to the length 1060. Other battery shapes and configurations can be interrogated via transmitted ultrasound without departing from the concepts of the present disclosure.

[0035] System 1000 includes various components. These components include one or more MEMS ultrasonic sources and one or more MEMS ultrasonic sensors. Three MEMS ultrasonic sources 1005, 1010, and 1015 and three MEMS ultrasonic sensors 1030, 1025, and 1020 are shown. However, any number of sources and / or sensors is possible according to one or more contemplated embodiments. System 1000 also includes a signal drive and acquisition module (SDM) 1090, a signal processor 1110, a power sensor 1145, and a temperature sensor 1135.

[0036] The SDM 1090 includes a controller 1070, a memory module 1080, a communication interface 1085, an excitation module 1100, an ultrasound receiver module 1105, and a controller interface 1095. The memory module 1080 interfaces with the controller 1070, the communication interface 1085, and the controller interface 1095. The memory module 1080 contains various rules and instructions for the signal processor 1110 to load and execute, such as a set of feature rules 1081 and a set of action rules 1082. In an example, the controller 1070 may be a processor or a microcontroller. The controller 1070 may further include multiple digital data processors and memories interfaced therewith.

[0037] The components of the system 1000 are configured as follows: Each MEMS ultrasonic source 1005, 1010, 1015 is positioned relative to a first surface 1040 of the battery 1035 and is configured by the SDM 1090 to emit ultrasonic waves toward and through the first surface 1040. Each ultrasonic sensor 1020, 1025, 1030 is positioned relative to the second surface 1045 and is configured by the SDM 1090 to sense / detect ultrasonic waves exiting the battery 1035 through the second surface 1045. In the illustrated example, both the power sensor 1145 and the temperature sensor 1135 are positioned relative to the second surface 1045 of the battery 1035.

[0038] In some embodiments, the MEMS ultrasonic sources and MEMS ultrasonic sensors are acoustically coupled to the corresponding surfaces of the battery 1035 by a couplant 1050 material. The couplant 1050 is disposed between the surface of the battery and the surface of the corresponding ultrasonic source or sensor. In the illustrated example, a separate instance of the couplant 1050 is disposed between each MEMS ultrasonic source 1005, 1010, 1015 and the first surface 1040 of the battery 1035. Alternatively or additionally, in some embodiments, a separate instance of the couplant 1050 is disposed between each MEMS ultrasonic sensor 1030, 1025, 1020 and the second surface 1045 of the battery 1035. The contact material is selected to reduce acoustic resistance, for example, by removing air between the corresponding surface of the battery and the surfaces of the ultrasonic sources and sensors. The acoustic couplant material may include a liquid, gel, or solid material. In examples, the couplant may be attached to the battery 1035 via adhesive or may be bonded directly onto the battery, for example, to ensure that it is permanently positioned thereon.

[0039] The MEMS ultrasonic sources and sensors may be capacitive micromachined ultrasonic transducers (CMUTs) or piezoelectric micromachined ultrasonic transducers (PMUTs). In some embodiments, all of the MEMS ultrasonic sources and sensors are either CMUTs or PMUTs. Both types of MEMS devices are typically silicon-based and fabricated using established integrated circuit batch fabrication processes commonly used in the semiconductor industry. The resulting MEMS devices are small and thin (e.g., ≦0.5 mm thick), while volumetric fabrication enables very low-cost devices.

[0040] In some embodiments, each ultrasonic source is paired with a corresponding ultrasonic sensor, for example, when the MEMS ultrasonic source 1005 is paired with the MEMS ultrasonic sensor 1030 along a common transmission axis 1055. In the illustrated example, three MEMS ultrasonic sources 1005, 1010, and 1015 are each paired with a different MEMS ultrasonic sensor 1030, 1025, and 1020, with each paired ultrasonic source and ultrasonic sensor positioned to interrogate a different region within the battery 1035. A through-transmission configuration can include one or more ultrasonic sources positioned to direct ultrasonic waves into the battery along the transmission axis 1055. The ultrasonic source can be positioned to direct ultrasonic waves through any surface of the battery and to its paired ultrasonic sensor, and is positioned to receive ultrasonic waves exiting the battery through any other surface of the battery when the ultrasonic sensor and ultrasonic source are coaxially aligned along the transmission axis 1055. Thus, ultrasonic interrogation of the battery 1035 by through transmission involves detecting ultrasound waves received along the transmission axis 1055 after passing once through the thickness of the battery, e.g., dimension 1042 shown in FIG. 1 .

[0041] 1, the ultrasonic axis 1055 is substantially perpendicular to the surfaces 1040, 1045 of the battery 1035. Because the battery cells within the battery 1035 are "stacked" on top of each other along their length 1060, the planes of the battery cells are also substantially perpendicular to the ultrasonic axis 1055. Thus, the thickness 1042 of the battery 1035 is at least the sum of the thicknesses of its individual battery cells.

[0042] The signal processor 1110 communicates with the SDM 1090 via a communication channel 1130, which is established between the signal processor 1110 and a communication interface 1085 of the SDM 1090. The controller 1070 communicates with the excitation module 1100 and the receiver module 1105 via an internal communication channel 1115 established between the controller 1070 and a controller interface 1095.

[0043] The excitation module 1100 connects to the MEMS ultrasonic sources 1005, 1010, and 1015 via a power channel 1120. The power channel 1120 supports a communication protocol that allows the excitation module 1100 to transmit excitation signals to one or more MEMS ultrasonic sources at a time. The receiver module 1105 connects to the MEMS ultrasonic sensors 1030, 1025, and 1020 via a signal channel 1125. The signal channel 1125 also supports a communication protocol that allows the receiver module 1105 to receive response signals from one or more MEMS ultrasonic sensors at a time. In some embodiments, the communication protocol can also support metadata, for example, so that a response signal can identify which of the one or more MEMS ultrasonic sensors transmitted the response signal.

[0044] The power sensor 1145 connects to the communication interface 1085 via a power signal channel 1150 and the temperature sensor 1135 (eg, a thermistor) connects to the communication interface via a temperature signal channel 1140 .

[0045] The BMS 1199 communicates with other components of the system 1000 via the communication interface 1085. In the illustrated example, the BMS 1199 is included within the user device 200 and receives voltage, temperature, and current measurements from the temperature sensor 1135 and the power sensor 1145 via the communication interface 1085. The BMS 1199 may also receive other signals sent from the controller 1070 and / or the signal processor 1110, such as, in example, shutdown signals and signals to activate cooling fans within the user device 200. Additionally or alternatively, the BMS 1199 may be located outside or external to the user device 200 and receive time-stamped temperature, current, and voltage measurements of each battery 1035 or other signal information via the communication interface 1085 or other interface, connector, etc.

[0046] System 1000 optionally includes additional sensors positioned to measure one or more characteristics of the battery while the battery is being ultrasonically interrogated (or before, after, or during the ultrasonic interrogation), such as a power storage characteristic, a mechanical deformation characteristic, an internal pressure characteristic, or other instantaneous physical, electrical, or optical characteristic of battery 1035. The various signal communication channels may, in examples, be configured as wired communication channels, as wireless communication channels, as digital or analog communication channels, or as optical communication channels.

[0047] In some embodiments, system 1000 may operate as follows: At system startup, signal processor 1110 loads various information stored in memory module 1080 for the configuration and operation of system 1000. This information, in examples, includes the operating mode, processing instructions and algorithms of SDM 1090, as well as a set of feature rules 1081 and a set of action rules 1082. Excitation module 1100 and receiver module 1105 are operated according to one or more operating modes stored in memory module 1080 and implemented by controller 1070.

[0048] In the through-transmission mode of operation, as shown, the SDM 1090 is configured by the controller 1070 to generate and deliver an electrical excitation signal to each MEMS ultrasonic source via a power channel 1120. More specifically, each MEMS ultrasonic source 1005, 1010, and 1015 is configured to generate ultrasonic waves in response to the electrical excitation signal received thereby from the excitation module 1100 via the power channel 1120. The generated ultrasonic waves emitted from each ultrasonic source are directed toward and pass through the battery along a corresponding transmission axis 1055. The transmission axis 1055 in this example is perpendicular to each of the first and second faces 1040 and 1045.

[0049] Each MEMS ultrasonic sensor 1030, 1025, and 1020 is then configured to sense ultrasonic waves passing through second surface 1045 along transmission axis 1055 and generate a response signal corresponding to the sensed ultrasonic waves. The response signal corresponding to each ultrasonic sensor is transmitted via signal channel 1125 to receiver module 1105. The response signal corresponding to each MEMS ultrasonic sensor can be represented by an A-scan including detected ultrasonic wave amplitude versus time-of-flight, where time-of-flight is a measure of the time interval between the ultrasonic waves being emitted from the ultrasonic source and the ultrasonic waves being detected by the ultrasonic sensor.

[0050] The generated ultrasonic waves emitted from each ultrasonic source generate longitudinal wave vibrations that propagate through the battery along a corresponding transmission axis 1055. The longitudinal wave vibrations propagate energy and waveforms into the battery along a transmission axis. A portion of the energy and waveforms exits the battery 1035 as the energy and waveforms pass through the exterior surface of the battery 1035. In some embodiments, with the system 1000 configured in a through-transmission mode, each MEMS ultrasonic source is positioned, opposed, and / or paired with an associated MEMS ultrasonic sensor.

[0051] The ultrasonic waveform frequencies used for nondestructive testing by the system 1000 range from 20 kHz to 15 MHz, with the selection of ultrasonic interrogation frequencies for each test device depending on the material and dimensions of the battery 1035. Lower frequency ultrasonic waves penetrate deeper into the battery than higher frequency ultrasonic waves. Therefore, low frequency ultrasonic waves may be desirable for interrogating batteries with a longer transmission axis 1055. Higher frequency ultrasonic waves provide greater resolution, allowing for the detection of smaller defects or more information about the battery's internal characteristics. However, higher frequency ultrasonic waves typically carry less energy, and when transmitted to the battery 1035, the ultrasonic signal decays more quickly compared to lower frequency ultrasonic signals. One manifestation of this is a lower signal amplitude.

[0052] The ultrasonic waveform characteristics generated by the ultrasonic source depend on the characteristics of the electrical excitation signal, the characteristics of the ultrasonic emitter, and environmental characteristics (e.g., temperature). The ultrasonic waveform can be tailored to the test device / battery 1035. For example, in some embodiments, the frequency of the ultrasound is selected to excite / interrogate the battery at its resonant frequency. When the battery 1035 is excited at its resonant frequency, the ultrasonic input energy efficiently propagates, is absorbed, and re-emitted by structures within the battery to the ultrasonic sensor. Thus, the ultrasonic sensor typically receives re-emitted ultrasonic energy with a higher ultrasonic energy amplitude than would be received if the ultrasonic frequency did not match the battery's resonant frequency.

[0053] The battery 1035 can have multiple resonant frequencies. Thus, there are multiple ultrasonic frequencies that can be selected to resonate the battery to absorb ultrasonic energy and re-emit it for detection by the ultrasonic sensor. In a non-limiting exemplary embodiment, the wavelength of the ultrasonic waves is less than the battery thickness dimension 1042. Also, within the battery 1035, a near-field boundary occurs that separates the Fresnel and Fraunhofer regions of ultrasonic waves.

[0054] It is also important to note that using ultrasound to excite the battery 1035 at its resonant frequency is not an absolute requirement. Exciting a material (such as a battery) at its resonant frequency improves the efficiency of sound re-radiation, but exciting the battery at its resonant frequency is not a limiting condition for ultrasonic interrogation of the material. In one example, an ultrasonic transducer located at a particular location on the battery (such as near its edge) may not be configured to transmit ultrasound at or near the battery's resonant frequency. This is because, at these locations, the behavior of ultrasound having frequencies at or near the battery's resonant frequency, at least in the frequency domain, may not be representative of the entire battery. As a result, echo-mode or through-transmission-mode ultrasonic pulses directed at these locations may be transmitted at frequencies other than the battery's resonant frequency and may be partially or completely attenuated to approach the noise floor.

[0055] The differences in the characteristics of the ultrasound waves transmitted by each MEMS ultrasonic source to the battery 1035 and the characteristics of the ultrasound waves detected by each ultrasonic sensor are evaluated by the signal processor 1110. The signal processor 1110 can use the differences in the characteristics to determine, for example, the overall condition of the battery 1035 and / or to determine variations in the condition of the battery in different regions within the battery 1035.

[0056] The SDM 1090 and controller 1070 then receive a response signal from each of the MEMS ultrasonic sensors 1030, 1025, 1020 via signal channel 1125. Each response signal is responsive to ultrasonic waves detected by at least one ultrasonic sensor, which were transmitted into the battery 1035 by at least one ultrasonic source.

[0057] The signal processor 1110 is configured to analyze the response signal received by the receiver module 1105 along with the temperature signal received at the communication interface 1085 from the temperature sensor 1135 and the current and voltage signals received from the power sensor 1145.

[0058] The signal processor 1110 analyzes the response signal in a manner to characterize the battery 1035 into different states, for example, to identify defects, characterize homogeneity, monitor physical, electrical, or compositional changes within the battery, etc. Analysis of the response signal by the signal processor 1110 may include analyzing the response signal in different domains, e.g., the time domain, the frequency domain, the spatial domain, etc. Analysis of the response signal by the signal processor 1110 may further include identifying features of the response signal and comparing the identified features of the response data to feature templates stored in the memory module 1080 to determine a characteristic of the battery 1035 based on the feature matching.

[0059] In some embodiments, during operation of the system 1000, the SDM 1090 may be configured to operate in a “round-robin” manner when transmitting and receiving signals to and from the MEMS ultrasonic source and sensor, respectively. The power channel 1120 may support a communication protocol that enables the excitation module 1100 to address the MEMS ultrasonic source, and the signal channel 1125 may support a communication protocol that enables communication between the MEMS ultrasonic sensor and the receiver module 1105. For example, the excitation module 1100 may be instructed by the controller 1070 to transmit an excitation signal to a first MEMS ultrasonic source over the power channel 1120. The SDM 1090 waits to receive a response signal from the MEMS ultrasonic sensor paired with the first MEMS ultrasonic source, after which the SDM transmits the excitation signal to the next MEMS ultrasonic source over the power channel 1120.

[0060] The SDM 1090 buffers the response signals from each MEMS ultrasonic sensor. After the SDM 1090 receives the response signals from all of the MEMS ultrasonic sensors, the SDM 1090 sends a "ready" signal to the signal processor 1110 to access and analyze the response signals in the buffer. In some embodiments, the SDM 1090 can send a ready signal to the signal processor to access and analyze the response signals in the buffer along with the temperature signal and the current and voltage signals.

[0061] The signal processor 1110 determines different states 1480 of the battery 1035 based on / in response to analyzing the response signals, and the SDM 1090 provides the states 1480 as outputs of the system 1000. These states 1480 can include an instantaneous thickness measurement of the battery 1481, a lifetime battery thickness measurement 1482, a battery temperature 1483, a battery state of charge (SOC) 1484, and a battery state of health (SOH) 1485. In one example, the lifetime battery thickness measurement 1482 is determined by averaging instantaneous thickness measurements 1481 taken over time and stored in the memory module 1080 over time.

[0062] The set of feature rules 1081 defines one or more features for the signal processor 1110 to extract from the response signal and analyze during analysis of the response signal. The set of action rules 1082 may include, for example, logic (e.g., business logic) for determining whether the state 1480 is within a safe / normal range compared to stored states of a reference battery of the same type as the test battery 1035. The signal processor 1110 may also create and send a warning message based on the analysis of the response signal, such as when the set of action rules 1082 indicates that one or more of the output states 1480, and / or information inferred from the states 1480, individually and / or in combination, are not within safe / normal ranges and thresholds.

[0063] In some embodiments, the system 1000 can receive its power source from the user device 200. In some embodiments, the system 1000 can have low power consumption, but the system 1000 can only operate when the battery 1035 of the user device 200 is charging. In some embodiments, the system 1000 can be designed to operate independently of the processing and memory resources of the user device 200.

[0064] Via the communication interface 1085, the BMS 1199 can also receive one or more of the output states 1480 from the SDM 1090. In response to receiving one or more of the output states 1480, the BMS 1199 can, in one example, send a signal or message to the controller 1070 via the communication interface 1085, instructing the controller 1070 to disable and / or stop charging of the battery 1035. Alternatively or additionally, in some embodiments, based on the states 1480 or information the signal processor 1110 can determine from the states, the signal processor 1110 can prepare a message predicting a shorter-than-expected battery life. The signal processor 1110 can send this information to the BMS 1199, and in response, the BMS 1199 can, for example, adjust charging parameters (e.g., reduce the current applied to the battery during charging) to extend battery life.

[0065] Using the set of action rules 1082, the signal processor 1110 can also create alert messages based on the output state 1480. The alert messages can use standard communication protocols (e.g., Internet-based protocols, cellular-based messages such as Short Message Service (SMS) and Multimedia Messaging Service (MMS)), or proprietary protocols. In another example, the alert messages can be in the form of pre-encoded numbers / message codes associated with different types of specific alerts and failures that can be sent as signals without the need for communication software and protocol stacks. The operator's BMS 1199 and user devices of the system 1000 can be configured as recipient / destination addresses for the alert messages.

[0066] Batteries, such as lithium-ion batteries, swell over time for a variety of reasons and have different swelling types. These types include normal reversible swelling, normal irreversible swelling, and abnormal irreversible swelling. System 1400 (and other embodiments of systems in this disclosure) uses ultrasound to detect different types of battery swelling and then provides a measurement or level of swelling as an output / status of the battery. These swelling states, in examples, include instantaneous thickness measurement 1481 and lifetime battery thickness measurement 1482.

[0067] For example, a new battery that has never been charged has an initial, substantially uniform thickness and expands (changes in thickness) when charged. During charging, chemical reactions within the battery change its density and stiffness, generate heat, and increase the battery's thickness. The chemical reactions that occur during charging can also change the battery's sound velocity as a differential characteristic. When discharged, the battery returns to substantially its initial thickness. This type of battery expansion is known as normal reversible expansion.

[0068] Over the life of a battery, materials within the battery can decompose and accumulate within the battery, which also causes the battery to swell. This type of battery swelling is known as normal irreversible swelling. Materials that decompose include parts of the battery terminals and the solid electrolyte interphase (SEI) layer. Materials accumulate within the electrolyte of lithium-ion batteries. The net effect of the accumulation of these materials is to increase the battery's thickness over time, which can reduce the battery's charge capacity. This swelling is irreversible, but it is normal as the battery ages and / or the number of charge / discharge cycles increases.

[0069] Abnormal battery swelling may also occur. This type of abnormal swelling occurs when excessive heat and / or gas buildup occurs within the battery. Causes include, for example, manufacturing defects, battery damage, or a threshold number of charge / discharge cycles. This type of abnormal swelling is an early indicator of catastrophic, irreversible battery failure, which may result in material damage to the user device 200, release of harmful chemicals, and / or fire. Such abnormal swelling should generally be avoided.

[0070] In some embodiments, the set of action rules 1082 can also define absolute and relative thresholds (or threshold ranges) for each of the states 1480. These thresholds are experimentally derived using multiple batteries of the same type as each battery 1035 in the user device 200. In one example, the absolute threshold value for the instantaneous battery thickness measurement 1481 may be a thickness measurement associated with a battery exhibiting normal irreversible swelling. However, this value is large enough to be on the cusp of a value associated with an abnormal thickness measurement (e.g., the thickness of a failed battery). When the value of the instantaneous battery thickness measurement 1481 meets or exceeds the absolute threshold value, the rule 1082 can specify that the signal processor 1110 create a warning message with a “medium” severity and include in the message information that led to the creation of the warning. The BMS 1199 can receive the warning message and, in response, can send a signal to the controller 1070 to charge the battery more slowly to extend battery life.

[0071] In another example, when the instantaneous battery thickness measurement 1481 meets or exceeds a thickness measurement associated with a battery indicating abnormal swelling, the signal processor 1110 can send a “high” severity message to the controller 1070 or BMS 1199 to disable and / or stop charging of the battery 1035 and notify the user to service the user device 200. Alternatively or additionally, in some embodiments, the system can send a signal to the user device 200 itself (e.g., via the signal processor 1110) to notify the user (e.g., via a display of the user device, via a wired or wireless communication system of the user device, etc.) and / or to a remote device or system (e.g., a network through which the user device communicates).

[0072] In another example, the set of messaging rules 1082 may include logic (e.g., business logic) that compares the instantaneous battery thickness measurement 1481 to relative threshold values ​​for the same metric for a reference battery of the same type as the test battery 1035. For example, the threshold values ​​may be relative in that there are different thickness threshold values ​​stored for different SOCs of the reference battery and / or different threshold values ​​stored for different numbers of charge / discharge cycles of the reference battery. To this end, the signal processor 1110 may access the number of charge-discharge cycles of the test battery 1035 and perform a lookup (e.g., in the memory module 1080) of this value for the reference battery to obtain threshold values ​​(e.g., minimum and maximum expected instantaneous battery thickness measurements) for substantially the same number of charge-discharge cycles. The signal processor 1110 may then compare the actual thickness measurement 1481 to the reference threshold values.

[0073] It will also be appreciated that the functionality of the temperature sensor 1135 and / or the power sensor 1145 may be provided by an external BMS 1199 in communication with the user device 200, or an internal BMS 1199 incorporated into the user device 200 as shown. In some embodiments, since the system 1000 is contained entirely within the user device 200, the processing and analysis of the response signals may therefore be performed entirely within the user device 200.

[0074] Ultrasound "Echo" Mode Figure 2 is a schematic diagram of a battery monitoring system 1200 configured for ultrasonic interrogation of a battery 1035 using an echo transmission method. System 1200 includes substantially similar components to system 1000 of Figure 1, with some differences. Like system 1000 of Figure 1, system 1200 can be included entirely within user device 200.

[0075] 2, system 1200 includes one or more MEMS ultrasonic sources and one or more MEMS ultrasonic sensors positioned relative to the same surface of battery 1035. Three MEMS ultrasonic sources 1210, 1215, 1220 and three MEMS ultrasonic sensors 1225, 1230, 1235 are shown positioned relative to a second surface 1045 of battery 1035. However, any number of MEMS ultrasonic sources and sensors is possible, according to one or more contemplated embodiments. System 1200 also includes signal processor 1110, SDM 1090, temperature sensor 1135, and power sensor 1145, which are substantially similar to and operate substantially similarly to the corresponding components in system 1000 of FIG. 1.

[0076] Each MEMS ultrasonic source 1210, 1215, 1220 is positioned to direct ultrasonic waves generated thereby at and through the battery 1035, e.g., at and through the second surface 1045 of the battery 1035. Each MEMS ultrasonic sensor 1225, 1230, 1235 is positioned to sense ultrasonic waves emanating from the battery 1035, e.g., to sense ultrasonic echoes emanating from the interior of the battery through the second surface 1045.

[0077] In some embodiments, the MEMS ultrasonic sources and MEMS ultrasonic sensors are paired with each other, for example, each ultrasonic source is paired with one ultrasonic sensor. Each pair of MEMS ultrasonic source and ultrasonic sensor combination is positioned at a different location on the second surface 1045 to be interrogated. In some embodiments, the paired MEMS ultrasonic source and sensor are each acoustically coupled to the second surface of the battery by the material of a couplant 1050. The couplant is positioned between the second surface of the battery and the surface of each ultrasonic source and ultrasonic sensor.

[0078] 2, each pair of MEMS ultrasonic source and MEMS ultrasonic sensor is housed within the same MEMS transducer 1270. MEMS transducers 1270-1, 1270-2, and 1270-3 are shown and include the following MEMS ultrasonic source / MEMS ultrasonic sensor pairs, 1210 / 1225, 1215 / 1230, and 1220 / 1235, respectively.

[0079] Alternatively, in some embodiments, each MEMS transducer 1270 is constructed to operate as both an ultrasonic source and a sensor. During operation of the system 1200, each transducer is alternately configured (e.g., by the controller 1070 and / or the excitation module 1100) to operate as an ultrasonic source and then configured (e.g., by the controller 1070 and / or the receiver module 1105) to operate as an ultrasonic sensor.

[0080] In the illustrated example, each MEMS ultrasonic source 1210, 1215, 1220 is paired with one MEMS ultrasonic sensor 1225, 1230, 1235, e.g., shown schematically in contact with one another. Each MEMS ultrasonic source emits ultrasonic waves to the battery 1035 in response to an electrical excitation signal received from the excitation module 1100 via the power channel 1120, as described herein above with respect to the ultrasonic transmission mode. The emitted ultrasonic waves are directed toward the second surface 1045 of the battery 1035, pass through the contact surface 1050 and the second surface 1045, and enter the battery toward the first surface 1040. The emitted ultrasonic waves are directed along a transmission axis 1255.

[0081] When the emitted ultrasonic waves reach the first surface 1040 of the battery 1035, the ultrasonic waves are reflected / "echoed" from the first surface 1040 as an ultrasonic echo. The ultrasonic echo then travels back along the transmission axis 1255 toward the second surface 1045. The ultrasonic echo then passes through the second surface 1045 and the couplant 1050 and is sensed by an ultrasonic sensor paired with the ultrasonic source. In response to sensing the ultrasonic echo, the ultrasonic sensor generates a response signal based thereon and transmits the response signal to the signal receiver module 1105 via the signal channel 1125.

[0082] In some embodiments, the battery 1035 may be suitable for ultrasonic interrogation by an echo transmission method because the battery 1035 has parallel, opposing first and second surfaces. However, embodiments of the disclosed subject matter are not limited thereto. Rather, the echo mode transmission modes and methods described herein may be used to interrogate any battery by receiving ultrasonic echoes from inside the battery, according to one or more contemplated embodiments.

[0083] In some embodiments, the SDM 1090 can be configured to operate in a "round robin" manner (e.g., as described above for the system 1000 of FIG. 1 ), storing the response signals from each of the MEMS ultrasonic sensors in a buffer. After the SDM 1090 has received the response signals from all of the MEMS ultrasonic sensors, the SDM 1090 sends a "ready" signal to the signal processor 1110 to access the response signals in the buffer and analyze them, for example, in conjunction with temperature, current, and voltage signals. In some embodiments, the system 1200 is contained entirely within the user device 200, and therefore, the processing and analysis of the response signals can be performed entirely within the user device 200.

[0084] Figures 3-6 show details of an echo mode system similar to Figure 2. In Figures 3-6, the battery 1035 is positioned so that its length 1060 is substantially perpendicular to the page and its transmission axis 1055, 1255 (not shown) is substantially perpendicular to the plane of the paper.

[0085] Figure 3 is a schematic diagram of yet another battery monitoring system 1300 constructed in accordance with the principles of the present invention. In the example shown in Figure 3, the system 1300 is configured as an echo mode system similar to that of Figure 2, with the difference that the SDM 1090, BMS 1199, and signal processor 1110 are located external to the user device 200.

[0086] FIG. 4 illustrates another echo-mode battery monitoring system 1400. The system 1400 is included within a user device 200 designed to interrogate a single battery 1035. To this end, the system 1400 includes a single MEMS transducer 1270. The MEMS transducer 1270 is positioned relative to a surface of the battery 1035. Terminals 1242 of the battery 1035 are also shown and are connected to a power bus (not shown) of the user device 200. The battery can provide power to various components of the user device 200 via its terminals 1242 and the power bus; the user device can, in example, discharge the battery 1035 and receive power via the power bus to charge the battery 1035. Compared to the conventional systems 1000, 1200, and 1300, the system 1400 provides greater detail regarding the components within the SDM 1090.

[0087] System 1400 includes substantially similar components and can operate in a substantially similar manner as systems 1000, 1200, and 1300. However, there are differences. The signal processor 1110 is included within the SDM 1090, which is included within the user device 200, and the signal processor 1110 and SDM 1090 are incorporated into or otherwise constructed in an integrated circuit form factor, such as an application specific integrated circuit (ASIC). The power sensor 1145 is connected to the battery 1035 rather than being a separate component disposed relative to the battery 1035. As in system 1300, the BMS 1199 of system 1400 is external to the user device 200 and communicates with the system 1400 via the communication interface 1085.

[0088] The ASIC form factor for the SDM 1090 and signal processor 1110 has advantages, such as minimal thickness so that it can be included within a user device 200 as small as a cell phone, and in some cases even smaller, and its tight, compact integrated package provides short, efficient signal paths.

[0089] 4, the excitation module 1100 includes pulse shaping instructions 1097 and a pulser 1401. The controller 1070 includes and controls a single transmit / receive switch (“T / R switch”) 1402. The receiver module 1105 includes a linear amplifier 1403 and an analog-to-digital converter (“A / D converter”) 1404.

[0090] The power sensor 1145 includes a separate current sensor 1146 and a voltage sensor 1147 that each connect to the battery 1035. The current sensor 1146 and the voltage sensor 1147 are also connected to and in communication with the communication interface 1085.

[0091] The components of the system 1400 can be configured and arranged to operate as follows: The T / R switch 1402 of the controller 1070 has the following communication path to the MEMS ultrasonic transducer 1270: the T / R switch 1402 connects to the internal communication channel 1115, which in turn connects to the signal channel 1225 via the controller interface 1095. The T / R switch 1402 is normally open, during which the pulser 1401 of the excitation module 1100 can send an excitation signal via the controller interface 1095 to the MEMS ultrasonic transducer 1270 over the power channel 1120.

[0092] When the MEMS ultrasonic transducer 1270 sends its response signal back to the controller 1070 via the controller interface 1095 over the signal channel 1225, the controller 1070 closes the T / R switch 1402 and the response signal is sent to the receiver module 1105. In the receiver module 1105, the response signal is amplified by a linear amplifier 1403 and then converted to digital form by an A / D converter 1404 to become the digitized response signal 1086.

[0093] At the same time, temperature sensor 1135 periodically transmits its temperature signal via temperature signal channel 1140 to communication interface 1085. A / D converter 1404 receives the temperature signal via communication interface 1085 and converts it into a digitized temperature signal 1087. Also, current sensor 1146 and voltage sensor 1147 of power sensor 1145 periodically transmit current and voltage measurements of battery 1035, respectively, to A / D converter 1404 via communication interface 1085. A / D converter 1404 converts these signals into a digitized current signal 1088 and a digitized voltage signal 1089, respectively, and sends these signals to signal processor 1110. Digitized signals 1086, 1087, 1088, and 1089 will be listed hereinafter without the term "digitized" in their names.

[0094] The signal processor 1110 connects with the A / D converter 1404, the memory module 1080 and the communication interface 1085. The signal processor 1110 accesses the buffered signals 1086, 1087, 1088, 1089 in the receiver module 1105. Using a set of feature rules 1081 in the memory module 1080, the signal processor 1110 analyzes the response signal 1086, possibly in conjunction with temperature, current, and voltage signals 1087, 1088, and 1089, to determine different states 1480 of the battery 1035.

[0095] Catastrophic battery failure can occur within 10-15 minutes (or sometimes less) after abnormal battery swelling is detected. System 1400 (and other embodiments disclosed herein) can detect and report the level of swelling of a battery installed in user device 200, in examples, via instantaneous thickness measurements 1481 and lifetime battery thickness measurements 1482.

[0096] In one implementation, the BMS 1199 monitors these outputs / statuses 1480, and the signal processor 1110 can transmit a warning message when it determines that the thickness measurements 1481, 1482 meet or exceed one or more thresholds (e.g., stored in the memory module 1080). The warning message can be transmitted to a software application running on the user device 200 or to another user device carried or otherwise accessed by one or more individuals (e.g., an active user of the user device, a potential user of the user device, a manager of the user device, a maintenance person for the user device, etc.). In this way, one or more individuals can be alerted to potential problems with the user device 200 before they occur and can avoid catastrophic events, such as abnormal swelling of the battery 1035. Additionally and / or alternatively, the signal processor 1110 can also transmit a warning message.

[0097] The ability of the system 1400 to predict and detect early signs of abnormal swelling of the battery 1035 in the user device 200 has additional benefits beyond user safety, potentially preventing damage to the user device 200. Manufacturers of the user device 200 can also save on repair costs and warranty claims, and can also benefit from the increased brand recognition that a user device 200 including the system 1400 can provide.

[0098] In some embodiments, the system 1400 can periodically (e.g., once per minute) analyze the battery 1035 to determine thickness measurements 1481, 1482 and other states 1483-1485. The states 1480 can be time-stamped and stored locally in the memory module 1080. Additionally or alternatively, the SDM 1090 can include the time-stamped states 1480 obtained during each measurement and / or polling iteration in a message and can send the message to an external data repository (not shown). In the data repository, the information in the message can be stored in an individual record for each battery 1035 in each user device 200.

[0099] 5 illustrates yet another echo-mode battery monitoring system 1500 included within a user device 200. The system 1500 is designed to interrogate multiple batteries 1035-1, ..., 1035-N within the same user device 200. To this end, the system 1500 includes multiple MEMS transducers 1270, with a separate MEMS ultrasonic transducer positioned relative to the surface of each battery 1035. A separate temperature sensor 1135 is also provided, for example, positioned relative to the surface of each of the batteries 1035. Additionally, the system 1500 includes multiple power sensors 1145, with a separate current sensor 1146 and voltage sensor 1147 within each power sensor 1145 connected to the terminals of each battery 1035 to measure the current and voltage of each battery 1035, respectively. Due to space limitations in the figure, the terminals of the batteries 1035 are not shown, and only the connections from the power sensors 1145-N to their associated batteries 1035-N are shown. Similar to systems 1300 and 1400, the BMS 1199 of system 1500 is external to the user device 200 and communicates with system 1500 via communication interface 1085.

[0100] System 1500 includes additional components. Controller 1070 includes a plurality of T / R switches 1402-1 through 1402-N, where N is the number of cells 1035 to interrogate, and includes a first sequence controller 1406 for selecting a MEMS transducer 1270 associated with each individual cell 1035. Receiver module 1105 includes a second sequence controller 1407 configured to select temperature measurements from individual cells of the N cells 1035. SDM 1090 also includes a third sequence controller 1408 that selects one power sensor 1145 from the plurality of power sensors.

[0101] It may also be appreciated that the power sensor 1145 capability may be provided by an internal or external BMS 1199 connected to each of the N batteries, rather than by separate physical power sensors 1145-1 to 1145-N as shown.

[0102] 5, the controller 1070 uses a first sequence controller 1406 to select one T / R switch 1402 of the N T / R switches at a time. Each T / R switch 1401-1, 1402-2, ..., 1402-N is connected to a corresponding MEMS transducer 1270-1, 1270-2, ..., 1270-N located relative to each battery 1035-1, 1035-2, ..., 1035-N. Via the first sequence controller 1406, the controller 1070 can select and operate the T / R switch 1402 of each MEMS transducer 1270 to send an excitation signal to the MEMS transducer or receive a response signal 1086 from the MEMS transducer.

[0103] In a similar vein, the receiver module 1105 uses a second sequence controller 1407 to select temperature measurements obtained by and transmitted from temperature sensors 1135-1, ..., 1135-N associated with each of the batteries 1035-1, ..., 1035-N. The receiver module 1105 also uses a third sequence controller 1408 to select current and voltage measurements provided by power sensors 1145-1 through 1145-N for each battery (or a separate BMS connection for each battery). To this end, the power sensor 1145-N includes an associated instance of a current sensor 1146-N and an associated instance of a voltage sensor 1147-N, each of which is connected to a battery 1035-N.

[0104] A unique number (e.g., a transducer number) is assigned to each of the MEMS ultrasonic transducers 1270, and the memory module 1080 includes a map that associates each MEMS transducer number with its battery 1035. Using the map, the controller 1070 and / or SDM 1090 can route signals and / or messages between components. The excitation signals and response signals 1086 can also, in one example, include the transducer number in the metadata to identify the associated MEMS transducer 1270. The signal processor 1110 and / or controller 1070 can then access the map to identify, for each excitation signal and response signal 1086, the associated MEMS transducer 1270 and battery 1035.

[0105] For each battery cell 1035-1 through 1035-N, the signal processor 1110 then accesses the response signal 1086, temperature signal 1087, current signal 1088, and voltage signal 1089 buffered in the receiver module 1105. Using a set of feature rules 1081 in memory 1080, the signal processor 1110 analyzes the signals 1086 through 1089 associated with each battery cell to determine different states 1480 of each battery cell 1035-1 through 1035-N.

[0106] FIG. 6 illustrates yet another echo-mode system 1600 included within the user device 200. In the system 1600, multiple MEMS transducers 1270 are each disposed on the surface of a single battery 1035 at different locations on the surface. The MEMS transducers 1270 are arranged in N rows and M columns, abbreviated as "row" and "column" in the figure, with each individual transducer indicated by 1270(N, M). To this end, in one example, the N×M transducers 1270 may be substantially equidistant / regularly spaced from one another on the battery surface 1040, 1045 and may be somewhat spaced from the edges of the surfaces 1040, 1045. In another example, for the same number of N×M transducers 1270, the transducers 1270 may be more sparsely spaced on the surfaces 1040, 1045 and extend to the edges of the surfaces 1040, 1045.

[0107] A single temperature sensor 1335 is also positioned relative to the surface of the battery 1035, and a single instance of a power sensor 1145 measures the current and voltage from the battery 1035. Similar to systems 1300, 1400, and 1500, the BMS 1199 of system 1600 is external to the user device 200 and communicates with the system 1600 via a communication interface 1085.

[0108] 5, the controller 1070 of the system 1600 includes a plurality of T / R switches 1402 and a first sequence controller 1406. Because a separate T / R switch is associated with a particular MEMS ultrasonic transducer, each T / R switch 1402 is designated by 1402(N,M). In the example shown in FIG. 6, the controller 1070 configures the T / R switches 1402(N,M) and the first sequence controller 1406 to receive and transmit information from each of the MEMS transducers 1270(N,M).

[0109] In some embodiments, a unique number (e.g., a transducer number) is assigned to each of the MEMS transducers 1270, and an x-y coordinate system having an origin 1602 is also assigned to each surface 1040, 1045 on which the MEMS transducer is disposed. Alternatively or additionally, in some embodiments, row-column addresses are used. The memory module 1080 can include a map that associates the number of each MEMS transducer 1270 with its battery location relative to the origin 1602. In this manner, the excitation signal and response signal can include a transducer number to identify the MEMS transducer 1270. The controller 1070, other components of the SDM 1090, and / or the signal processor 1110 can then access the map to identify the associated MEMS transducer / battery location for each excitation signal and response signal 1086.

[0110] 6 , the controller 1070 uses a first sequence controller 1406 to select one T / R switch 1402 from a plurality of N T / R switches. Each T / R switch 1401-1, 1402-2, ... 1402-N is connected to a respective corresponding MEMS transducer 1270-1, 1270-2, ... 1270-N positioned relative to the surface of the battery 1035. Via the first sequence controller 1406, the controller 1070 can select and operate the T / R switch 1402 for each MEMS transducer 1270 to send an excitation signal to the MEMS transducer 1270 or receive a response signal 1086 from the MEMS transducer 1270.

[0111] The signal processor 1110 then accesses the buffered signals 1086-1089 in the receiver module 1105. Using the set of feature rules 1081 in the memory 1080, the signal processor 1110 analyzes the response signal 1086 to determine different states 1480 of the battery 1035. As described herein above with respect to systems 1000, 1200, 1300, 1400, and 1500, the signal processor 1110 of system 1600 can also analyze the response signal 1086 along with the temperature, current, and voltage signals 1087, 1088, and 1089 to determine different states 1480 of the battery 1035.

[0112] The memory module 1080 can also include one or more machine learning models that can be accessed and loaded by the signal processor 1110. The models can be pre-trained or not. In one example, the signal processor 1110 can determine an initial set 1480 of states and then pass the initial set of states as inputs to one or more machine learning models, the result of which is a predicted version 1480 of states. Over time, multiple sets of output states 1480 can then be fed back as inputs to the model to generate additional predicted output states.

[0113] 4-6 illustrate echo mode systems 1400, 1500, and 1600 in greater detail, it will be understood that aspects of these systems are also applicable to the through-transmission mode system 1000 of FIG. 1. To this end, one or more MEMS ultrasonic source / sensor pairs may be positioned against opposing sides 1040, 1045 of each of the batteries 1035, if applicable. Correspondingly, an appropriate number and configuration of T / R switches 1402 may connect each of the MEMS ultrasonic source / sensor pairs to the controller 1070. In this manner, the controller 1070 may instruct the excitation module 1100 to transmit an excitation signal to the MEMS ultrasonic source of each source / sensor pair and the receiver module 1105 to receive a response signal 1086 from the MEMS ultrasonic sensor of each source / sensor pair. Similarly, an appropriate number and configuration of sequence controllers 1406-1408 can connect a temperature sensor 1135 and a power sensor 1145 to each of the batteries 1035, allowing the signal processor 1110 to receive a response signal 1086, a temperature signal 1087, a current signal 1088, and a voltage signal 1089.

[0114] In some embodiments, the MEMS ultrasonic sources and sensors may be arranged in an array, with a single array positioned against one side of each battery cell 1035, as shown, for example, in FIG. 6 . To this end, the array may include multiple MEMS ultrasonic transducers 1270, each of which may be configured as a MEMS ultrasonic source or sensor (e.g., by the controller 1070) at different times, e.g., based on the testing objectives. Alternatively or additionally, in some embodiments, two arrays of MEMS transducers are arranged against each battery cell 1035, with a first array positioned on a first side of each battery cell and a second array positioned on a second side of each battery cell 1035 opposite the first side. Additionally or alternatively, multiple individual MEMS transducers, which may be configured as MEMS ultrasonic sources or sensors, may be arranged against one or more sides of each battery cell 1035 according to the echo mode and / or through transmission mode configuration of the system 1600.

[0115] It may also be appreciated that each of systems 1000, 1200, 1300, 1400, 1500, and 1600 may be configured to transmit multiple excitation pulses to each MEMS ultrasonic source and / or MEMS transducer 1270 per test run and perform multiple test runs. For example, in some embodiments, a set of excitation pulses including as many as 16 excitation pulses in a sequence may be transmitted to each MEMS ultrasonic sensor and / or MEMS transducer 1270 per test run. For example, signal processor 1110 waits to receive all response signals 1086 for the associated MEMS ultrasonic sensor and / or MEMS transducer 1270 before transmitting a set of excitation pulses to the next MEMS ultrasonic source and / or MEMS transducer 1270, if applicable.

[0116] Within each test run, the excitation pulses within the set of excitation pulses may be the same or different. The excitation pulses may differ in one or more of frequency / wavelength, amplitude, phase, pulse width, number of cycles, pulse repetition frequency, and waveform type, in examples. Waveform types may include square waves (unipolar or bipolar) and sine waves, in examples. For example, the waveform of each excitation pulse may be programmed so that the wavelength of the ultrasound emitted from the MEMS ultrasonic source and / or MEMS ultrasonic transducer 1270 is smaller than the battery thickness dimension 1042.

[0117] Ultrasonic monitoring device 7 is an image of a semiconductor wafer 1710 containing thousands of separate "chips" in an array 1720. Each chip on the wafer is an ASIC and is typically designed and manufactured to have identical structure and functionality. Each chip contains nearly all of the components of one of the battery monitoring systems 1000, 1200, 1300, 1400, 1500, and 1600. Typically, a separate wafer 1710 is designed and manufactured for each of the systems.

[0118] In one implementation, each chip on wafer 1710 incorporates substantially all of the components of echo mode system 1400 of FIG. 4 , except for external BMS 1199 and power sensor 1145. For example, each chip / system 1400 is designed for use within a separate user device 200. In some embodiments, the chip is glued or otherwise bonded to the surface of a single battery 1035 during the manufacturing and assembly stages of user device 200, thereby positioning MEMS transducer 1270 and temperature sensor 1135 of chip / device 1400 relative to the battery surface. In some embodiments, an adhesive or bonding agent can also function as couplant 1050. Alternatively, in some embodiments, a separate couplant can be provided in addition to an adhesive or bonding agent.

[0119] In some embodiments, the MEMS transducer is a CMUT device, for example, having a thickness of about 0.6 mm. Alternatively, in some embodiments, the MEMS transducer 1270 is a CMUT device having a thickness of 0.4 mm or less.

[0120] A power sensor 1145 is then connected to the interface 1085 of the SDM 1090 and to the battery 1035. The chip may also be connected to the battery terminals 1242 so that the chip, and therefore the system 1400 formed by the chip, is powered and operates only when the battery 1035 is charging. Alternatively, the power sensor 1145 may be included on the chip.

[0121] In some embodiments, each chip includes at least the signal processor 1110 and SDM 1090 for one of the systems 1000, 1200, 1300, 1400, 1500, or 1600, but does not include the MEMS transducer 1270. During manufacture / assembly of the user device 200, a micro-sized CMUT or PMUT device as the MEMS transducer 1270 may be bonded to one or more surfaces 1040, 1045 of each of the batteries 1035 in the user device 200. A single chip including at least the signal processor 1110 and the SDM 1090 is included in the user device 200, with wires connecting each of the MEMS transducers 1270 to the SDM 1090 and / or the signal processor 1110 according to the connections described herein above for each of the systems 1000, 1200, 1300, 1400, 1500, or 1600. Power to the chip, connection to power sensor 1145, and other interfaces are then provided as described above for the "system on a chip" / chip forming system 1400.

[0122] FIG. 8 is an image showing individual elements 1802 of a MEMS transducer 1270 in the left portion of the image and an exemplary grouping of nine individual MEMS transducer elements 1802 connected in a grid pattern in the right portion of the image. In some embodiments, the interconnected MEMS transducer elements can operate collectively to provide the functionality of the MEMS transducer 1270. MEMS transducer elements operating as a single transducer can have advantages over a standard single piezoelectric transducer. For example, if the system of FIGS. 1-6 is configured to explicitly control each of the subelements 1802 that make up the MEMS transducer 1270, the ultrasound waves emitted by the MEMS transducer will have fewer side lobes. Alternatively or additionally, the MEMS transducer may have an improved response, for example, because the individual elements 1802 contribute much less undesired vibration than a single conventional ultrasound transducer. Additionally, MEMS transducers can have low unit costs, can have sub-millimeter thicknesses that allow the transducer to fit within the smallest user devices 200, and can have high bandwidths.

[0123] 10 is an image of a semiconductor wafer containing over 100 CMUT devices 1270. The devices 1270 may be cut from the wafer individually or in groups and bonded to surfaces 1040, 1045 of the cell 1035 in the user device 200. The device 1270 may include any number of individual "drums" / elements 1802 connected together to form the CMUT device 1270.

[0124] In some embodiments, a PMUT MEMS transducer can be used instead of or in addition to a CMUT element. Figure 9 is a schematic diagram showing the arrangement of semiconductor layers of a PMUT MEMS transducer. The PMUT is constructed as multiple layers stacked sequentially on a non-conductive substrate 1902. The substrate 1902 is mounted on the surface of a battery 1035 or other test object, with a couplant 1050 (not shown) positioned between the substrate and the surface of the battery 1035.

[0125] More details about an exemplary arrangement of layers in a PMUT are as follows: A bottom non-conductive layer having a vacuum well 1906 is fabricated on top of a substrate 1902. A silicon dioxide insulator layer 1908 is fabricated on top of the vacuum well 1906 and the bottom layer 1904. A first metal electrode layer 1910 is then fabricated on top of the insulator layer 1908. A piezoelectric layer 1912 is then fabricated on top of the first electrode layer 1910, followed by a second electrode layer 1914 fabricated on top of the piezoelectric layer 1912. In this way, the piezoelectric layer 1912 is sandwiched between the bottom first electrode layer 1910 and the top second electrode layer 1914.

[0126] In some embodiments, the PMUT can operate as follows: When the PMUT operates as an ultrasound source, an AC voltage 1920 in the form of an excitation signal is applied across the first and second electrode layers 1910, 1914. The excitation signal causes the transducer to vibrate, resulting in ultrasound waves emitting downward, through the couplant 1050, and into the battery 1035. When the PMUT operates as an ultrasound sensor, an AC voltage 1920 representative of the vibrations sensed by the PMUT is measured across the first and second electrode layers 1910, 1914.

[0127] System Operation In some embodiments, the system of any of FIGS. 1-6 may operate only when the battery 1035 is charging. This has benefits including preserving battery life by not draining the battery, as charging the battery 1035 is a mode that carries a higher risk of battery failure than discharging. In some embodiments, via the SOC state 1484 and SOH state 1485, any of the battery monitoring systems 1000, 1200, 1300, 1400, 1500, and 1600 can estimate capacity changes to the battery 1035 and, in some cases, adjust charging parameters to extend battery life. If the system determines indicators of abnormal expansion via the instantaneous thickness measurement state 1481 and / or lifetime thickness measurement state 1482, the system can be configured to send one or more shutdown signals to the internal or external BMS 1199 (e.g., to shut down charging of the battery 1035) and / or send a notification message to an individual (e.g., the user of the user device). Alternatively or additionally, the battery temperature status 1483 can be used to gauge possible battery failure and the internal or external BMS 1199 can stop charging the battery 1035 and / or send a notification message to an individual.

[0128] As discussed above in the description of Figures 1-6, the signal processor 1110 can analyze the time-stamped response signal 1086 in conjunction with the time-stamped temperature, current, and voltage signals 1087, 1088, and 1089, respectively, to determine the state 1480 of the battery 1035.

[0129] Additionally or alternatively, in some embodiments, the system (e.g., any of FIGS. 1-6) can operate on a stack of batteries 1035. For example, as few as two or three thin "pouch" style batteries can be glued together to form a stack, and the systems 1000, 1200, 1300, 1400, 1500, and 1600 can operate to determine various states of the battery stack.

[0130] In some embodiments, the system (e.g., any of FIGS. 1-6) may be included and / or configured to operate within devices other than user devices. For example, these devices may include consumer devices, including electronic toys, consumer televisions, cable set-top boxes and modems, Internet access points, communications equipment, military devices and systems, battery packs such as electric vehicle (EV) packs, and battery storage systems.

[0131] In some embodiments, a system (e.g., any of FIGS. 1-6) may be configured to adjust charging parameters of a battery 1035 in response to a set of outputs 1480 generated by the respective system. For example, if the battery temperature 1483 exceeds a first threshold and / or the instantaneous battery thickness 1481 exceeds a second threshold, the system may send a message via the communications interface 1085 to the internal or external BMS 1199 (e.g., via the signal processor 1110) to charge the battery more slowly to extend battery life. In some embodiments, the second threshold may be a typical thickness measurement of a battery of the same type and with approximately the same number of charge / discharge cycles as the battery under test.

[0132] In some embodiments, the state 1480 can be determined when the battery 1035 is fully discharged or fully charged. Alternatively or additionally, the state 1480 can be determined (or at least the data for determining the state 1480 obtained) while the battery 1035 is discharging or charging. In some embodiments, it can be useful to determine the instantaneous thickness measurement 1481 and the lifetime thickness 1482 state when the battery is charging, because most battery failures occur during charging and abnormal expansion leading to catastrophic battery failure and / or fire can occur in minutes (e.g., ≦10-15 minutes).

[0133] Ultrasonic monitoring method 11 is a flowchart illustrating a method of operation of a battery monitoring system in accordance with one or more embodiments of the disclosed subject matter. In some embodiments, the method of FIG. 11 can describe the operation of any of battery monitoring systems 1000, 1100, 1200, 1300, 1400, 1500, and 1600.

[0134] The method may begin at process step 902, where a MEMS ultrasonic source and a MEMS ultrasonic sensor may be positioned relative to a battery included in a user device. In process step 904, an excitation module may transmit an excitation signal to the MEMS ultrasonic source. The MEMS ultrasonic source may receive the excitation signal and, in response to receiving the excitation signal, may transmit an ultrasonic pulse to the battery.

[0135] In process step 906, the system can detect ultrasonic pulses from the battery (e.g., via the MEMS ultrasonic sensor) and can generate a response signal (e.g., by the MEMS ultrasonic sensor) related to the detected ultrasonic waves. In process step 908, the system can receive a response signal (e.g., from the MEMS ultrasonic sensor) (e.g., via receiver module 1105). Then, in process step 910, the response signal can be analyzed (e.g., via signal processor 1110), and different states of the battery can be determined (e.g., by signal processor 1110) in response to the analysis.

[0136] While some of steps 902-910 of the method of FIG. 11 have been described as being performed once, in some embodiments, multiple iterations of a particular processing step may be used before proceeding to the next decision or processing step. Additionally, while steps 902-910 of the method of FIG. 11 are illustrated and described separately, in some embodiments, the processing steps may be combined and performed together (concurrently or sequentially). Furthermore, while FIG. 11 illustrates a particular order for steps 902-910, embodiments of the disclosed subject matter are not limited thereto. Indeed, in certain embodiments, steps may occur in a different order than illustrated or simultaneously with other steps. In some embodiments, the method may include steps or other aspects not specifically illustrated in FIG. 11. Alternatively or additionally, in some embodiments, the method may comprise only some of steps 902-910 of FIG. 11.

[0137] Computer implementation Figure 12 depicts a generalized example of a suitable computing environment 531 in which the described innovations may be implemented, such as, but not limited to, the BMS 1199, the SDM 1090, and / or the method of Figure 11. The computing environment 531 is not intended to suggest any limitation as to scope of use or functionality, as the innovations may be implemented in a variety of general-purpose or special-purpose computing systems. For example, the computing environment 531 may be any of a variety of computing devices (e.g., a desktop computer, a laptop computer, a server computer, a tablet computer, etc.).

[0138] Referring to FIG. 12, computing environment 531 includes one or more processing units 535, 537 and memory 539, 541. This basic configuration 551 is included within the dashed line. The processing units 535, 537 execute computer-executable instructions. A processing unit may be a central processing unit (CPU), a processor in an application-specific integrated circuit (ASIC), a microcontroller, or any other type of processor (e.g., a hardware processor, a graphics processing unit (GPU), a virtual processor, etc.). In a multi-processing system, multiple processing units execute computer-executable instructions to increase processing power. For example, FIG. 12 shows a central processing unit 535 and a graphics processing unit or co-processing unit 537. The tangible memory 539, 541 may be volatile memory (e.g., registers, cache, RAM), non-volatile memory (e.g., ROM, EEPROM, flash memory, etc.), or some combination of the two accessible by the processing units. The memories 539, 541 store software 533 in the form of computer-executable instructions suitable for execution by a processing unit(s) that implements one or more innovations described herein.

[0139] A computing system may have additional features. For example, computing environment 531 includes storage 561, one or more input devices 571, one or more output devices 581, and one or more communication connections 591. An interconnection mechanism (not shown), such as a bus, controller, or network, interconnects the components of computing environment 531. Typically, operating system software (not shown) provides an operating environment for software executing in computing environment 531, such as software 533, and coordinates the activities of the components of computing environment 531.

[0140] Tangible storage 561 may be removable or non-removable and includes magnetic disks, magnetic tapes or cassettes, CD-ROMs, DVDs, or any other medium that can be used to store information in a non-transitory manner and that can be accessed within computing environment 531. Storage 561 may store instructions for software 533 that implements one or more innovations described herein.

[0141] The input device(s) 571 may be a touch input device such as a keyboard, mouse, pen, or trackball, a voice input device, a scanning device, or another device that provides input to the computing environment 531. The output device(s) 581 may be a display, printer, speakers, CD-writer, or another device that provides output from the computing environment 531.

[0142] The communication connection(s) 591 enable communication over a communication medium to another computing entity. The communication medium conveys information such as computer-executable instructions, audio or video input or output, or other data in a modulated data signal. A modulated data signal is a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, the communication medium may be electrical, optical, radio frequency (RF), or another carrier.

[0143] Any of the disclosed modes or methods may be implemented as computer-executable instructions stored on one or more computer-readable storage media (e.g., one or more optical media disks, volatile memory components (such as DRAM or SRAM), or non-volatile memory components (such as flash memory or a hard drive)) and executed on a computer (e.g., any commercially available computer, including a smartphone or other mobile device that includes computing hardware). The term computer-readable storage medium does not include communication connections such as signals and carrier waves. Any computer-executable instructions for carrying out the disclosed technology, as well as any data created or used during the practice of the disclosed embodiments, may be stored on one or more computer-readable storage media. The computer-executable instructions may be, for example, a dedicated software application or part of a software application accessed or downloaded via a web browser or other software application (e.g., a remote computing application). Such software may be executed, for example, on a single local computer (e.g., any suitable commercially available computer) or in a networked environment using one or more networked computers (e.g., via the Internet, a wide area network, a local area network, a client-server network (e.g., a cloud computing network), or any other such network).

[0144] For clarity, only selected aspects of software-based implementations are described. Other details well known in the art are omitted. For example, it should be understood that the disclosed technology is not limited to any particular computer language or program. For example, aspects of the disclosed technology can be implemented by software written in C++, Java™, Python™, and / or any other suitable computer language. Likewise, the disclosed technology is not limited to any particular computer or hardware type. Specific details of suitable computers and hardware are well known and need not be described in detail in this disclosure.

[0145] It should also be appreciated that any functionality described herein may be performed, at least in part, by one or more hardware logic components instead of software. For example, without limitation, exemplary types of hardware logic components that may be used include field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on a chip (SOCs), complex programmable logic devices (CPLDs), etc.

[0146] Additionally, any of the software-based embodiments (e.g., including computer-executable instructions for causing a computer to perform any of the disclosed methods) can be uploaded, downloaded, or remotely accessed via appropriate communications means. Such suitable communications means include, for example, the Internet, the World Wide Web, an intranet, a software application, cable (including fiber optic cable), magnetic communication, electromagnetic communication (including radio frequency, microwave, and infrared communication), electronic communication, or other such communications means. In any of the above examples and embodiments, the provision of requests (e.g., data requests), instructions (e.g., data signals), commands (e.g., control signals), or any other communications between systems, components, devices, etc. can be through the generation and transmission of appropriate electrical signals via wired or wireless connections.

[0147] The techniques described in this disclosure may be implemented, at least in part, in hardware, software, firmware, or any combination thereof. For example, various aspects of the described techniques may be implemented within one or more processors, including one or more microprocessors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or any other equivalent integrated or discrete logic circuitry, as well as any combination of such components. The terms "processor" or "processing circuitry" may generally refer to any of the foregoing logic circuits, alone or in combination with other logic circuits or any other equivalent circuitry. A control unit comprising hardware may also perform one or more of the techniques of this disclosure.

[0148] Such hardware, software, and firmware may be implemented within the same device or within separate devices to support the various operations and functions described in this disclosure. Additionally, any of the described units, modules, or components may be implemented together or separately as discrete but interoperable logical devices. The depiction of different features as modules or units is intended to emphasize different functional aspects and does not necessarily imply that such modules or units must be realized by separate hardware or software components. Rather, functionality associated with one or more modules or units may be performed by separate hardware or software components or integrated within common or separate hardware or software components.

[0149] The techniques described in this disclosure may also be embodied in or encoded in a computer-readable medium, such as a computer-readable storage medium containing instructions. Instructions embedded in or encoded on the computer-readable medium may, for example, cause a programmable processor or other processor to perform a method when executed. Computer-readable media may include non-transitory computer-readable storage media and transitory communication media. Tangible, non-transitory computer-readable storage media may include random access memory (RAM), read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electronically erasable programmable read-only memory (EEPROM), flash memory, hard disks, CD-ROMs, floppy disks, cassettes, magnetic media, optical media, or other computer-readable storage media. It should be understood that the term “computer-readable storage medium” refers to a physical storage medium, and not to a signal, carrier wave, or other transitory medium.

[0150] Further Examples of the Disclosed Technology In view of the above-described implementations of the disclosed subject matter, the present application discloses additional examples in the clauses listed below. It should be noted that further examples of one feature of a clause alone, or two or more features of a clause taken in combination, and optionally combined with one or more features of one or more additional clauses, are also included within the scope of the present application disclosure.

[0151] Appendix 1. a microelectromechanical system (MEMS) ultrasonic source within the user device, the MEMS ultrasonic source positioned relative to the battery of the user device, the MEMS ultrasonic source configured to generate ultrasonic pulses; a MEMS ultrasonic sensor in the user device positioned relative to a battery of the user device, the MEMS ultrasonic sensor configured to detect ultrasonic waves from the battery and generate a response signal based on the detected ultrasonic waves; a control system operably coupled to the MEMS ultrasonic source and the MEMS ultrasonic sensor, the control system transmitting an excitation signal to the MEMS ultrasonic source such that the MEMS ultrasonic source transmits ultrasonic pulses to the battery in response to receiving the excitation signal, receiving a response signal from the MEMS ultrasonic sensor, and analyzing the response signal to determine at least two different states of the battery; Including, the system.

[0152] Appendix 2. The system of any section or example herein, particularly appendix 1, wherein the control system comprises: a signal drive and acquisition module (SDM) including a controller, a memory, an excitation module, and a receiver module, wherein the excitation module is configured by the controller to transmit an excitation signal to a MEMS ultrasonic source, the MEMS ultrasonic source is configured to transmit ultrasonic pulses to the battery in response to receiving the excitation signal, and the MEMS ultrasonic sensor is configured by the controller to detect the ultrasonic pulses from the battery and generate a response signal related to the detected ultrasonic waves that is received by the receiver module; a processor configured to access the receiver module, analyze the response signal, and determine different states of the battery in response to the analysis.

[0153] Appendix 3. A system as described in any section or example herein, particularly in Appendix 2, wherein the SDM and processor are included within a user device.

[0154] Appendix 4. The system of any section or example herein, particularly any one of appendices 2-3, wherein the SDM and processor are part of a common integrated circuit.

[0155] Appendix 5. A system of any section or example herein, in particular any one of appendices 1 to 4, wherein the control system is formed as part of or included within a user device.

[0156] Appendix 6. The system of any section or example herein, particularly the system of any one of Appendices 1 to 4, wherein the control system is formed as part of or coupled to the battery.

[0157] Appendix 7. The system of any section or example herein, particularly the system of any one of appendices 1 to 6, wherein the user device is a laptop computer, a tablet computer, a smartphone, or a mobile phone.

[0158] Appendix 8. The system of any section or example herein, particularly any one of Appendices 1-7, wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are positioned relative to the same surface of the battery, and the MEMS ultrasonic sensor detects ultrasonic pulses reflected from the interior of the battery.

[0159] Appendix 9. The system of any section or example of this specification, particularly appendices 1 to 7, wherein the MEMS ultrasonic source is positioned against a first surface of the battery, and the MEMS ultrasonic sensor is positioned against a second surface of the battery opposite the first surface, and the MEMS ultrasonic sensor detects ultrasonic waves transmitted through the battery.

[0160] Appendix 10. The system of any section or example herein, particularly appendices 1 to 9, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a capacitive micromachined ultrasonic transducer (CMUT).

[0161] Appendix 11. The system of any section or example herein, particularly appendices 1 to 10, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a piezoelectric micromachined ultrasonic transducer (PMUT).

[0162] Appendix 12. The system of any section or example herein, particularly any one of Appendices 1-11, wherein the at least two different states include a battery state of charge (SOC), a battery state of health (SOH), a battery temperature, or any combination of the foregoing.

[0163] Appendix 13. The system of any section or example herein, particularly any one of Appendices 1-12, wherein the at least two distinct states include (a) an instantaneous thickness measurement of the battery, and / or (b) a lifetime thickness measurement of the battery, determined from one or more instantaneous thickness measurements of the battery taken over time.

[0164] Appendix 14. The system of any section or example herein, particularly the system of any one of Appendices 1 to 13, wherein the control system is configured to transmit the excitation signal and / or receive the response signal only when the battery is fully discharged or when the battery is fully charged.

[0165] Appendix 15. The system of any section or example herein, particularly the system of any one of Appendices 1-14, wherein the control system is configured to transmit an excitation signal and / or receive a response signal while the battery is actively charging or discharging.

[0166] Appendix 16. 16. The system of any section or example herein, particularly any one of Appendices 1-15, wherein the control system comprises one or more non-transitory computer-readable storage media that store computer-readable instructions for a set of feature rules that define one or more features to extract from the response signal during analysis of the response signal.

[0167] Appendix 17. The system of any section or example herein, in particular the system of any one of clauses 1 to 16, wherein the MEMS source and the MEMS sensor are part of a common MEMS transducer.

[0168] Appendix 18. The system of any section or example herein, particularly any one of appendices 1 to 17, wherein the MEMS source and / or MEMS sensor are disposed on respective surface portions of the battery via respective ultrasonic couplants or respective portions of a common ultrasonic couplant.

[0169] Appendix 19. The system of any section or example herein, particularly any one of Appendices 1 to 18, wherein the MEMS source and / or MEMS sensor are coupled to respective surface portions of the battery by an adhesive or bonding agent.

[0170] Appendix 20. The system of any section or example herein, particularly appendix 19, wherein the adhesive or bonding agent acts as an ultrasonic couplant.

[0171] Appendix 21. transmitting ultrasonic pulses to a battery of a user device via a MEMS ultrasonic source; detecting ultrasonic waves from the battery in response to the transmitted ultrasonic pulses via the MEMS ultrasonic sensor; determining at least two different states of the battery based at least in part on the detected ultrasound; The method wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are located within a user device.

[0172] Appendix 22. The method of any section or example herein, particularly of Appendix 21, further comprising positioning the MEMS ultrasonic source and the MEMS ultrasonic sensor relative to a battery in the user device.

[0173] Addendum 23. The method of any section or example herein, particularly any one of Addendums 21-22, wherein the transmitting includes transmitting an excitation signal to a MEMS ultrasonic source, and the MEMS ultrasonic source transmits ultrasonic pulses to the battery in response to receiving the excitation signal.

[0174] Appendix 24. The method of any section or example herein, particularly any one of Appendices 21-23, wherein the detecting includes generating, by a MEMS ultrasonic sensor, a response signal associated with the detected ultrasonic waves.

[0175] Appendix 25. Any method of any section or example herein, particularly Appendix 24, wherein determining comprises: receiving a response signal from the MEMS ultrasonic sensor; and analyzing the response signal to determine different states of the battery.

[0176] Appendix 26. The method of any section or example herein, particularly any one of appendices 21 to 25, wherein the determining is performed by a control system operably coupled to the MEMS ultrasonic source and the MEMS ultrasonic sensor, and the control system is located within the user device.

[0177] Appendix 27. The method of any section or example herein, particularly any one of Appendices 21-26, further comprising, prior to transmitting, positioning the MEMS ultrasonic source and the MEMS ultrasonic sensor against the same surface of the battery, wherein the MEMS ultrasonic sensor detects ultrasonic pulses reflected from inside the battery.

[0178] Appendix 28. The method of any section or example herein, particularly any one of Appendices 21-26, further comprising, prior to transmitting, positioning a MEMS ultrasonic source against a first surface of the battery and positioning a MEMS ultrasonic sensor against a second surface of the battery opposite the first surface, wherein the MEMS ultrasonic sensor detects the ultrasonic waves transmitted through the battery.

[0179] Appendix 29. The method of any section or example herein, particularly any one of appendices 21-28, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a capacitive micromachined ultrasonic transducer (CMUT).

[0180] Appendix 30. The method of any section or example herein, particularly any one of appendices 21 to 29, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a piezoelectric micromachined ultrasonic transducer (PMUT).

[0181] Appendix 31. The method of any section or example herein, particularly any one of appendices 21 to 30, wherein the determining is performed by a processor included in the user device.

[0182] Appendix 32. The method of any section or example herein, particularly any one of Appendices 21-31, wherein the at least two different states include a state of charge (SOC) of the battery, a state of health (SOH) of the battery, a temperature of the battery, or a combination of any of the foregoing.

[0183] Appendix 33. The method of any section or example herein, particularly any one of Appendices 21-32, wherein the at least two distinct states include (a) an instantaneous thickness measurement of the battery, and / or (b) a lifetime thickness measurement of the battery determined from one or more instantaneous thickness measurements of the battery obtained over time.

[0184] Appendix 34. The method described in any section or example herein, in particular any one of Appendices 21 to 33, wherein the ultrasonic pulses are transmitted and / or the ultrasonic waves from the battery are detected only when the battery is fully discharged and / or when the battery is fully charged.

[0185] Appendix 35. The method of any section or example herein, particularly any one of Appendices 21-34, wherein ultrasonic pulses are transmitted and / or ultrasonic waves from the battery are detected while the battery is actively charging and / or discharging.

[0186] Appendix 36. The method of any section or example herein, particularly any one of Appendices 21 to 35, comprising positioning a MEMS ultrasonic source and / or a MEMS ultrasonic sensor on respective surface portions of the battery through respective ultrasonic couplants or respective portions of a common ultrasonic couplant.

[0187] Appendix 37. The method of any section or example herein, particularly any one of Appendices 21-36, comprising bonding a MEMS ultrasonic source and / or a MEMS ultrasonic sensor to respective surface portions of the battery with an adhesive or bonding agent.

[0188] Appendix 38. The method of any section or example herein, particularly Appendix 37, wherein the adhesive or bonding agent acts as an ultrasound couplant.

[0189] Appendix 39. A method for operating a system according to any section or example herein, in particular any one of Appendices 1-20 and / or any one of Figures 1-12.

[0190] conclusion Although batteries, components, and configurations are shown in the drawings and discussed in detail herein, embodiments of the disclosed subject matter are not limited thereto. Indeed, those skilled in the art will readily understand that different batteries, components, or configurations may be selected and / or added to provide the same effect. In actual implementations, embodiments may include additional components or other variations beyond those shown. Thus, embodiments of the disclosed subject matter are not limited to the particular batteries, components, and configurations specifically shown and described herein.

[0191] For example, any of the features shown or described herein with respect to Figures 1-12 and Appendices 1-39 can be combined with any other feature shown or described herein with respect to Figures 1-12 and Appendices 1-39 to provide systems, devices, methods, and embodiments not otherwise shown or specifically described herein. All features described herein are independent of one another and, except where structurally impossible, can be used in combination with any other feature described herein.

[0192] In view of the many possible embodiments to which the principles of the disclosed technology may be applied, it should be recognized that the illustrated embodiments are examples only and should not be construed as limiting the scope of the disclosed technology. Rather, the scope is defined by the following claims. We therefore claim all that comes within the scope and spirit of those claims.

Claims

1. 1. A system for monitoring a battery in a user device, the system comprising: a microelectromechanical systems (MEMS) ultrasonic source and a MEMS ultrasonic sensor, each contained within the user device and positioned relative to the battery; a signal drive and acquisition module (SDM) including a controller, a memory, an excitation module, and a receiver module, the excitation module configured by the controller to send an excitation signal to the MEMS ultrasonic source, the MEMS ultrasonic source configured to send ultrasonic pulses to a battery in response to receiving the excitation signal, and a MEMS ultrasonic sensor configured by the controller to detect the ultrasonic pulses from the battery and generate a response signal related to the detected ultrasonic waves that is received by the receiver module; a processor configured to access the receiver module, analyze the response signal, and determine different states of the battery in response to the analysis; Including, the system.

2. The system of claim 1 , wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are positioned relative to the same surface of the battery, and the MEMS ultrasonic sensor detects ultrasonic pulses reflected from an interior of the battery.

3. the MEMS ultrasonic source is positioned against a first surface of the battery; the MEMS ultrasonic sensor is positioned against a second surface of the battery opposite the first surface; The system of claim 1 , wherein the MEMS ultrasonic sensor detects ultrasonic waves transmitted through the battery.

4. The system of claim 1 , wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are capacitive micromachined ultrasonic transducers (CMUTs).

5. The system of claim 1 , wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are piezoelectric micromachined ultrasonic transducers (PMUTs).

6. The system of claim 1 , wherein the SDM and the processor are included within the user device.

7. The system of claim 1 , wherein the SDM and the processor are integrated into the same integrated circuit.

8. The system of claim 1 , wherein the state includes a state of charge (SOC), a state of health (SOH), and a temperature of the battery.

9. The state is an instantaneous thickness measurement of the battery; and a lifetime thickness measurement of the battery determined from one or more of the instantaneous thickness measurements of the battery taken over time and stored in the memory; and The system of claim 1 , comprising:

10. The system of claim 1 , wherein the state is determined when the battery is discharged or when the battery is fully charged.

11. The system of claim 1 , wherein the state is determined when the battery is charging or when the battery is discharging.

12. The system of claim 1 , wherein the memory includes a set of feature rules defining one or more features for the processor to extract from the response signal during the analysis of the response signal.

13. 1. A method for monitoring a battery in a user device, the method comprising: positioning a microelectromechanical system (MEMS) ultrasonic source and a MEMS ultrasonic sensor relative to the battery, the battery being included in the user device; transmitting an excitation signal to the MEMS ultrasonic source, the MEMS ultrasonic source transmitting an ultrasonic pulse to a battery in response to receiving the excitation signal; the MEMS ultrasonic sensor detecting ultrasonic pulses from the battery and generating a response signal related to the detected ultrasonic waves; receiving the response signal from the MEMS ultrasonic sensor; analyzing the response signal and determining a state of the battery's output in response to the analysis; A method comprising:

14. 14. The method of claim 13, further comprising positioning the MEMS ultrasonic source and the MEMS ultrasonic sensor against the same surface of the battery, wherein the MEMS ultrasonic sensor detects ultrasonic pulses reflected from an interior of the battery.

15. 14. The method of claim 13, further comprising: positioning the MEMS ultrasonic source against a first surface of the battery; and positioning the MEMS ultrasonic sensor against a second surface of the battery opposite the first surface, the MEMS ultrasonic sensor detecting ultrasonic waves transmitted through the battery.

16. The method of claim 13 , wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are capacitive micromachined ultrasonic transducers (CMUTs).

17. The method of claim 13 , wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are piezoelectric micromachined ultrasonic transducers (PMUTs).

18. The method of claim 13 , wherein at least analyzing the response signal is performed by a processor included within the user device.

19. 14. The method of claim 13, further comprising the state comprising a state of charge (SOC), a state of health (SOH), and a temperature of the battery.

20. an instantaneous thickness measurement of the battery; and and a lifetime thickness measurement of the battery determined from one or more of the instantaneous thickness measurements of the battery obtained over time.

21. 14. The method of claim 13, further comprising determining the state when the battery is discharged or when the battery is fully charged.

22. 14. The method of claim 13, further comprising determining the state when the battery is discharging or when the battery is charging.

Images