INTELLIGENT THERMAL BARRIER AND METHOD FOR MONITORING A BATTERY MODULE - Patent application

Abstract

Various disclosed aspects relate to a battery module with an intelligent thermal barrier. The present disclosure includes a battery module including a stack of battery cells, a thermal barrier between at least two cells in the stack of battery cells, and a module cover and housing surrounding the stack of battery cells. The thermal barrier may include a separation layer including at least an aerogel and at least one sensor.

Description

[Technical Field]

[0001] Priority claims This application claims the benefit of priority to U.S. Patent Application No. 63 / 426,644, filed November 18, 2022, which is incorporated herein by reference in its entirety.

[0002] Technical Field The present disclosure generally relates to materials, systems, and methods for preventing or mitigating thermal events, such as thermal runaway problems, in energy storage systems. In particular, the present disclosure provides thermal barrier materials. The present disclosure further relates to battery modules or packs having one or more battery cells that include the thermal barrier materials, as well as systems that include these battery modules or packs. The generally described embodiments may include aerogel materials. [Background technology]

[0003] Lithium-ion batteries (LIBs) are widely used in powering portable electronic devices such as mobile phones, tablets, laptops, power tools, and other high-current devices such as electric vehicles because of their high operating voltage, low memory effect, and high energy density compared to conventional batteries. However, safety concerns have arisen due to the susceptibility of LIBs to catastrophic failure under "abuse conditions," such as when rechargeable batteries are overcharged (charged beyond their design voltage), overdischarged, or operated or exposed to high temperatures and pressures.

[0004] Effective insulation and heat dissipation strategies are needed to address these and other technical challenges in LIBs to prevent the occurrence of cascading thermal runaway events. Summary of the Invention

[0005] In some embodiments, a battery module includes a stack of battery cells located within a module housing, a thermal barrier between at least two cells in the stack of battery cells, at least one sensor, and a module cover enclosing the stack of battery cells within the module housing. The thermal barrier may include at least a separation layer, such as an aerogel layer.

[0006] In some aspects, a thermal barrier for use in a battery module includes a separation layer comprising an aerogel, the separation layer configured to thermally isolate individual battery cells in the battery module, and a pressure sensor at least partially within the thermal barrier.

[0007] In some aspects, a battery module may include a stack of battery cells and a battery management system. The stack of battery cells is located within a module housing having a thermal barrier between at least two cells in the stack of battery cells. The thermal barrier may include at least a separation layer and a sensor embedded in the thermal barrier. The battery management system includes a controller configured to interface with the sensor embedded in the thermal barrier. The controller may include a processor and a memory including instructions that, when executed, cause the processor to receive a signal from the sensor, interpret the signal from the sensor to determine whether a predetermined condition is met, and provide an alert if the predetermined condition is met based on the interpreted sensor signal.

[0008] A method for monitoring a battery module may include receiving a signal from a sensor embedded in a thermal barrier located between at least two cells of the battery module, interpreting the signal from the sensor to determine whether a predetermined condition is met, and presenting an alert if the predetermined condition is met based on the interpreted sensor signal.

[0009] The drawings are not necessarily drawn to scale, and like numbers may describe like components in different figures. Like numbers with different letter suffixes may represent different instances of like components. The drawings illustrate generally, by way of example, but not by way of limitation, various aspects discussed in the present specification. [Brief explanation of the drawings]

[0010] [Figure 1A] FIG. 1A shows a battery module in one embodiment. [Figure 1B] FIG. 1B shows a battery module according to an embodiment. [Figure 1C] FIG. 1C shows a battery module according to an embodiment. [Figure 2A] FIG. 2A shows a thermal barrier with a pressure sensor in one embodiment. [Figure 2B] FIG. 2B shows a thermal barrier with a pressure sensor in one embodiment. [Figure 2C] FIG. 2C shows a thermal barrier with a pressure sensor in one embodiment. [Figure 3] FIG. 3 shows a thermal barrier with a wireless pressure sensor in one embodiment. [Figure 4] FIG. 4 shows a thermal barrier with pressure and temperature sensors in one embodiment. [Figure 5A-5B] 5A-5B show a thermal barrier with a sensor and a conductive layer according to one embodiment. [Figure 6] FIG. 6 shows a thermal barrier with a sheet sensor in one embodiment. [Figure 7A] FIG. 7A shows a thermal barrier with sheet sensors including moisture and gas sensors in one embodiment. [Figure 7B] FIG. 7B shows a thermal barrier with sheet sensors with moisture and gas sensors in one embodiment. [Figure 8] FIG. 8 shows a thermal barrier with a sheet sensor in one embodiment. [Figure 9]FIG. 9 shows a battery stack with a thermal barrier and embedded sensors according to one embodiment. [Figure 10] FIG. 10 illustrates a battery stack with a thermal barrier and embedded sensors according to one embodiment. [Figure 11] FIG. 11 illustrates a battery module having a battery stack including a thermal barrier with an embedded sensor according to one embodiment. [Figure 12] FIG. 12 illustrates a battery module management system according to an embodiment. [Figure 13] FIG. 13 illustrates a method of using a thermal runaway warning system in one embodiment. [Figure 14] FIG. 14 illustrates a method of using a thermal runaway warning system in one embodiment. [Figure 15] FIG. 15 is a block diagram of an exemplary general-purpose controller that can be programmed into a dedicated controller suitable for implementing one or more aspects of the thermal runaway warning system herein. DETAILED DESCRIPTION OF THE INVENTION

[0011] The following description and drawings sufficiently describe particular aspects to enable those skilled in the art to practice them. Other aspects may incorporate structural, logical, electrical, process, and other changes. Portions and features of some aspects may be included in, or substituted for, portions and features of other aspects. The claimed aspects encompass all available equivalents of those claims.

[0012] This disclosure describes, among other things, systems and methods relating to a thermal barrier for a battery module. The thermal barrier may be an aerogel-based thermal barrier, such as for within or around a battery module. The thermal barrier may be an intelligent thermal barrier that includes one or more sensors within the thermal barrier to monitor the barrier and surrounding cells within the module. The sensors, in one aspect, may include pressure and temperature sensors.

[0013] Thermal barriers, which may include thermal insulating layers and structures, can be used in battery modules to help regulate temperature and heat flow within such battery modules. In one aspect, lithium-ion batteries, which are often used in stacks of many battery cells, can benefit from thermal regulation to prevent thermal runaway, which can lead to potential fires, overheating, combustion, or other problems associated with high temperatures within such batteries. It is often desirable to monitor these battery cells. In one aspect, the temperature and pressure of these battery cells can be monitored to determine whether an undesirable event may be imminent. Similarly, moisture and gases on or around these battery cells can be monitored to help ascertain the health level of the battery cells.

[0014] Such information can be obtained, in one aspect, by the systems and methods discussed herein, which refer to an intelligent thermal barrier that includes one or more sensors. The intelligent thermal barrier protects the one or more sensors contained therein from heat, particle impact, mechanical damage, moisture, or other damage from undesirable conditions such as thermal runaway. Locating the one or more sensors at least partially within the intelligent thermal barrier also conserves space within the battery module housing for more efficient module design.

[0015] Such thermal barriers can be made from thermal isolation materials, as discussed in detail below. The isolation materials can be used as a single heat-resistant layer or in combination with other layers that provide additional functionality to the multi-layer construction, such as mechanical strength, compressibility, heat dissipation / conduction, etc. The isolation layers described herein are responsible for ensuring containment and control of heat flow from heat-generating components within small spaces, providing safety and fire prevention for such products in the fields of electronics, industrial, and automotive technology.

[0016] In many aspects of the present disclosure, the separation layer functions as a flame / fire deflection layer, either by itself or in combination with other materials that enhance its ability to contain and control heat flow. In one aspect, the separation layer itself is flame and / or hot gas resistant and may further include entrained particulate material that modifies or enhances heat containment and control.

[0017] One embodiment of a highly effective separation layer comprises aerogels. Aerogels are characterized by their structure: low density, open cell structure, and large surface area (often over 900 m²). 2 This paper describes a class of materials based on pore sizes on the sub-nanometer scale (e.g., pore sizes of 1000 sq. ft. / g or greater). The pores may be filled with a gas, such as air. Aerogels can be distinguished from other porous materials by their physical and structural properties. Aerogel materials are exemplary separation materials, but the invention is not limited thereto. Other thermal isolation material layers may also be used in embodiments of the present disclosure.

[0018] Selected aspects of aerogel formation and properties are described. In some aspects, precursor materials are gelled to form a network of solvent-filled pores. The solvent is then extracted, leaving a porous matrix. A variety of different aerogel compositions are known, and they may be inorganic, organic, and inorganic / organic hybrids. Inorganic aerogels are generally based on metal alkoxides and include materials such as silica, zirconia, alumina, and other oxides. Organic aerogels include, but are not limited to, urethane aerogels, resorcinol formaldehyde aerogels, and polyimide aerogels.

[0019] Inorganic aerogels can generally be formed from metal oxide or metal alkoxide materials. The metal oxide or metal alkoxide materials can be based on the oxide or alkoxide of any metal capable of forming an oxide. Such metals include, but are not limited to, silicon, aluminum, titanium, zirconium, hafnium, yttrium, vanadium, cerium, and the like. Inorganic silica aerogels are traditionally made via the hydrolysis and condensation of silica-based alkoxides (e.g., tetraethoxysilane) or via the gelation of silicic acid or water glass. Other relevant inorganic precursor materials for silica-based aerogel synthesis include, but are not limited to, metal silicates such as sodium silicate or potassium silicate, alkoxysilanes, partially hydrolyzed alkoxysilanes, tetraethoxysilane (TEOS), partially hydrolyzed TEOS, condensation polymers of TEOS, tetramethoxysilane (TMOS), partially hydrolyzed TMOS, condensation polymers of TMOS, tetra-n-propoxysilane, partially hydrolyzed and / or condensation polymers of tetra-n-propoxysilane, polyethylsilicate, partially hydrolyzed polyethylsilicate, monomeric alkylalkoxysilanes, bis-trialkoxyalkyl or arylsilanes, polyhedral silsesquioxanes, or combinations thereof.

[0020] In certain embodiments of the present disclosure, pre-hydrolyzed TEOS, such as Silbond H-5 (SBH5, Silbond Corp), which is hydrolyzed to a water / silica ratio of about 1.9 to 2, may be used as is or may be further hydrolyzed before being incorporated into the gelation process. Partially hydrolyzed TEOS or TMOS, such as polyethyl silicate (Silbond 40) or polymethyl silicate, may also be used as is or may be further hydrolyzed before being incorporated into the gelation process.

[0021] Inorganic aerogels can also include gel precursors containing at least one hydrophobic group, such as alkyl metal alkoxides, cycloalkyl metal alkoxides, and aryl metal alkoxides, which can impart or improve certain properties to the gel, such as stability and hydrophobicity. Inorganic silica aerogels, specifically, can include hydrophobic precursors such as alkyl silanes or aryl silanes. The hydrophobic gel precursor may be used as the primary precursor material to form the framework of the gel material. However, hydrophobic gel precursors are more commonly used as co-precursors in combination with simple metal alkoxides to form amalgam aerogels. Hydrophobic inorganic precursor materials for silica-based aerogel synthesis include, but are not limited to, trimethylmethoxysilane (TMS), dimethyldimethoxysilane (DMS), methyltrimethoxysilane (MTMS), trimethylethoxysilane, dimethyldiethoxysilane (DMDS), methyltriethoxysilane (MTES), ethyltriethoxysilane (ETES), diethyldiethoxysilane, dimethyldiethoxysilane (DMDES), ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane (PhTES), hexamethyldisilazane, and hexaethyldisilazane. Any derivatives of any of the above precursors may also be used, particularly certain polymers of other chemical groups may be added to or crosslinked with one or more of the above precursors.

[0022] Organic aerogels are generally formed from carbon-based polymer precursors. Such polymeric materials include, but are not limited to, resorcinol formaldehyde (RF), polyimides, polyacrylates, polymethyl methacrylates, acrylate oligomers, polyoxyalkylenes, polyurethanes, polyphenols, polybutadiene, trialkoxysilyl-terminated polydimethylsiloxanes, polystyrenes, polyacrylonitriles, polyfurfural, melamine-formaldehyde, cresol formaldehyde, phenol-furfural, polyethers, polyols, polyisocyanates, polyhydroxybenzenes, polyvinyl alcohol dialdehyde, polycyanurates, polyacrylamides, various epoxies, agar, agarose, chitosan, and combinations thereof. In one embodiment, organic RF aerogels are typically prepared from the sol-gel polymerization of resorcinol or melamine with formaldehyde under alkaline conditions.

[0023] Organic / inorganic hybrid aerogels are primarily composed of organically modified silica ("ormosil") aerogels. These ormosil materials contain organic components covalently bonded to the silica network. Ormosils are typically formed by the hydrolysis and condensation of an organically modified silane, R-Si(OX)3, with a conventional alkoxide precursor, Y(OX)4. In these formulas, X, in one aspect, can represent CH3, CH5, CH7, or CH9; Y, in one aspect, can represent Si, Ti, Zr, or Al; and R can be any organic fragment, such as methyl, ethyl, propyl, butyl, isopropyl, methacrylate, acrylate, vinyl, or epoxide. Additionally, the organic components in ormosil aerogels can be dispersed throughout the silica network or chemically bonded to it.

[0024] Aerogels can be formed from flexible gel precursors. Various flexible layers, including flexible fiber-reinforced aerogels, can be easily combined and shaped to obtain a preform that, when mechanically compressed along one or more axes, provides an object with high compressive strength along any of those axes.

[0025] One method of aerogel formation involves batch casting. Batch casting involves catalyzing an entire volume of sol to simultaneously induce gelation throughout that volume. Gel formation techniques involve adjusting the pH and / or temperature of a dilute metal oxide sol to a point where gelation occurs. Materials suitable for forming inorganic aerogels include oxides of most metals capable of forming oxides, such as silicon, aluminum, titanium, zirconium, hafnium, yttrium, and vanadium. Particularly preferred are gels formed primarily from alcoholic solutions of hydrolyzed silicate esters (alcogels) due to their ready availability and low cost. Organic aerogels can also be made from melamine formaldehyde, resorcinol formaldehyde, and the like.

[0026] In one aspect, the aerogel material may be monolithic or continuous throughout the structure or layer. In another aspect, the aerogel material may include a composite aerogel material having aerogel particles mixed with a binder. Other additives may be included in the composite aerogel material, including, but not limited to, surfactants to aid in the dispersion of the aerogel particles within the binder. The composite aerogel slurry may be applied to a support such as a mesh, felt, or web and then dried to form a composite aerogel structure.

[0027] The aerogel may be organic, inorganic, or a mixture thereof. In some embodiments, the aerogel comprises a silica-based aerogel. One or more layers within the thermal barrier may include a reinforcing material. The reinforcing material may be any material that provides resilience, compliance, or structural stability to the aerogel material. Embodiments of the reinforcing material include, but are not limited to, open-cell macroporous framework reinforcement materials, closed-cell macroporous framework reinforcement materials, open-cell membranes, honeycomb reinforcement materials, polymeric reinforcement materials, and fibrous reinforcement materials such as, for example, staple fibers, woven materials, nonwoven materials, needled nonwovens, battings, webs, mats, and felts.

[0028] The reinforcing material can be selected from organic polymer-based fibers, inorganic fibers, carbon-based fibers, or combinations thereof. The inorganic fibers are selected from glass fibers, rock fibers, metal fibers, boron fibers, ceramic fibers, basalt fibers, or combinations thereof. In some aspects, the reinforcing material can include reinforcement comprising multiple layers of materials.

[0029] Fiber reinforcement materials include polyester, polyolefin terephthalate, poly(ethylene) naphthalate, polycarbonate (e.g., rayon, nylon), cotton (e.g., Lycra manufactured by DuPont), carbon (e.g., graphite), polyacrylonitrile (PAN), oxidized PAN, pre-oxidized PAN, uncarbonized heat-treated PAN (e.g., manufactured by SGL Carbon), glass or glass fiber-based materials (e.g., S-glass, 901-glass, 902-glass, 475-glass, E-glass, etc.), silica-based fibers such as quartz (e.g., Quartz manufactured by Saint-Gobain), Q-felt (Johns Other fibers include polyamide fibers such as Manville (manufactured by Saffil), Durablanket (manufactured by Unifrax), Duraback (manufactured by Carborundum), Kevlar, Nomex, Sontera (all manufactured by DuPont), and Conex (manufactured by Taijin), polyolefins such as Tyvek (manufactured by DuPont), Dyneema (manufactured by DSM), and Spectra (manufactured by Honeywell), other polypropylene fibers such as Typar and Xavan (both manufactured by DuPont), fluoropolymers such as PTFE, which have trade names such as Teflon (manufactured by DuPont), Goretex (manufactured by WLGORE), and Nicalon (manufactured by COI). The range of materials may include, but are not limited to, silicon carbide fibers such as those manufactured by Epson Ceramics, ceramic fibers such as Nextel (manufactured by 3M), acrylic polymers, wool, silk, hemp, leather, suede fibers, PBO-Zylon fibers (manufactured by Tyobo), liquid crystal materials such as Vectan (manufactured by Hoechst), Cambrelle fibers (manufactured by DuPont), polyurethanes, polyamides, wood fibers, boron, aluminum, iron, stainless steel fibers, and other thermoplastics such as PEEK, PES, PEI, PEK, PPS, etc.

[0030] Glass or glass fiber-based fiber reinforced materials may be manufactured using one or more techniques. In certain embodiments, it is desirable to create them using a carding and cross-lapping or airlaid process. In exemplary embodiments, carded and cross-lapping glass or glass fiber-based fiber reinforced materials offer certain advantages over airlaid materials. In one embodiment, carded and cross-lapping glass or glass fiber-based fiber reinforced materials can provide a consistent material thickness for a given basis weight of the reinforced material. In certain additional embodiments, it is desirable to further needle the fiber reinforced material, which requires entanglement of the fibers in the z-direction to improve mechanical and other properties in the final aerogel composition.

[0031] In addition to the thermal insulating layer, a thermally conductive layer in combination with the thermal insulating layer is effective in directing unwanted heat to a desired external location, such as external heat dissipation fins, a heat dissipation enclosure, or other external structure for dissipating unwanted heat to the ambient air. In one embodiment, one or more thermally conductive layers help dissipate heat from localized heat loads within the battery module or pack. Examples of highly thermally conductive materials include carbon fiber, graphite, silicon carbide, metals including, but not limited to, copper, stainless steel, aluminum, etc., as well as combinations thereof.

[0032] To aid in heat distribution and removal, in at least one embodiment, the thermally conductive layer is coupled to a heat sink. There are various heat sink types and configurations, as well as different techniques for coupling the heat sink to the thermally conductive layer, and it is understood that the present disclosure is not limited to the use of any one type of heat sink / coupling technique. In one embodiment, at least one thermally conductive layer of the multilayer material disclosed herein may be in thermal communication with an element of a cooling system of a battery module or pack, such as a cold plate or cooling channel of the cooling system. In another embodiment, at least one thermally conductive layer of the multilayer material disclosed herein may be in thermal communication with other elements of the battery pack, battery module, or battery system that can function as a heat sink, such as a wall of the pack, module, or system, or with other elements of the multilayer material disposed between battery cells. Thermal communication between the thermally conductive layer of the multilayer material and a heat sink element in a battery system can allow excess heat to be removed from the cell(s) adjacent to the multilayer material to the heat sink, thereby reducing the impact, severity, or propagation of thermal events that may generate excess heat.

[0033] 1A-1C illustrate a battery module 100 in accordance with one embodiment. FIG. 1A illustrates one embodiment of the battery module 100. The module 100 includes a stack of battery cells 102. The battery cells 102 can be selected from different cell types, such as prismatic, cylindrical, pouch, other cell types, or combinations thereof. The battery cells 102 can be selected from different cell chemistries, such as lithium-ion, sodium-ion, other alkali-ion, nickel-manganese-cobalt, lithium-ion phosphate, anode-less, semi-solid, solid-state, other battery chemistries, or combinations thereof. In one embodiment, the stack of cells 102 includes lithium-ion cells 102. Several configurations of the lithium-ion cells 102 are possible. In one embodiment, the stack of lithium-ion cells 102 includes lithium-ion pouch cells, although the invention is not limited thereto. A heat sink 104 is shown located on the side of the module 100 and in thermal communication with the battery cells 102. 1A, the stack of battery cells 102 is located within a module housing 106. A module cover 108 is also shown enclosing the stack of battery cells 102 within the module housing 106.

[0034] A thermal barrier 110 is shown between at least two cells in the stack of battery cells 102. In the embodiment of FIG. 1A , a thermal barrier 110 is included between every two cells in the stack of battery cells 102, although the invention is not so limited. In one embodiment, groups of cells 102 are separated by the thermal barrier 110. The inclusion of the thermal barrier 110 provides an improved level of safety during a thermal runaway event in one or more of the cells 102. In the event of a thermal runaway event, the area affected by the destruction of a failed cell 102 is contained within the area between the thermal barrier 110 and / or the module housing 106. An improved thermal barrier 110 is desired to better isolate and protect adjacent areas within the battery module 100 during a thermal runaway event in one or more individual cells 102.

[0035] The heat sink 104 is shown in FIG. 1A. Embodiments of the heat sink 104 include, but are not limited to, passive heat sinks, such as metal plates, and active heat sinks, such as fluid recirculation systems that remove heat to a remote location. In the embodiment of FIG. 1A, the thermal barrier 110 mates with the heat sink within a slot or other recess. In one embodiment, the heat sink 104 is a separate component housed within the module housing 106. In one embodiment, the heat sink 104 is integrated into the bottom surface of the module housing 106.

[0036] FIG. 1B shows a cross-sectional view of the battery module 100 of FIG. 1A. A thermal barrier 110 is shown that includes a structural support plate 112. The thermal barrier 110 also includes a module cover contact 114 located at an upper end of the structural support plate 112. A thermal isolation layer 118 is shown coupled to one side of the structural support plate 112. The embodiment of FIG. 1B shows a second thermal isolation layer 120 coupled to the structural support plate 112 on the side opposite the thermal isolation layer 118.

[0037] 1B, at least some of the cells 102 are separated by thermal barriers 110. A space 130 above the cells 102 within the module housing 106 and module cover 108 is shown. During a thermal runaway event, gases may be vented into the space 130 above the cells 102. In one aspect, the cells 102 include a vent (not shown) that specifically directs gases into the space 130. In such an event, it is desirable to contain the hot gases and prevent them from affecting adjacent cells 102.

[0038] FIG. 1C illustrates another embodiment of a portion of a battery module 100. In the embodiment of FIG. 1C, several cells 102 are shown. This embodiment may include a heat sink. Several thermal barriers 110 are shown that selectively isolate one or more cells 102 within the stack of cells. One or more thermal isolation layers are shown coupled to the heat sink 104.

[0039] 1A, 1B, and 1C may, in one embodiment, include a thermal barrier having one or more sensors integrated therein. Such sensors may, in one embodiment, include pressure, temperature, gas, moisture, or other sensors. These sensors may be integrated into the thermal barrier in various configurations, as described below with reference to FIGS. 2A-8.

[0040] 2A-2C illustrate a thermal barrier 200 having a pressure sensor 210 in one embodiment. The thermal barrier 200 can be used in one embodiment in a battery module such as those described herein. The thermal barrier 200 can be used between cells in such a battery module for thermal regulation, such as to prevent thermal runaway. The thermal barrier 200 is an intelligent thermal barrier, and as a result, includes one or more sensors that help monitor and / or control the battery module in which the thermal barrier 200 resides. In some cases, multiple thermal barriers 200 can be used in a battery module.

[0041] Thermal barrier 200 may include isolation layer 220 and pressure sensor 210. Additionally, thermal barrier 200 may include signal cable 212 and temperature sensor 214 with signal cable 215.

[0042] The thermal barrier 200 can be a layer or material within the battery module between or adjacent to the battery cells or groups. The thermal barrier 200 can be made from an aerogel material as described above. The thermal barrier 200 can include a separation layer 220 made from an aerogel material to thermally isolate adjacent battery cells or groups.

[0043] The pressure sensor 210 can be a sensor configured to sense the pressure of a gas or liquid within the battery module and the thermal barrier 200. The pressure sensor 210 can also sense the compressive pressure of the separation layer 220 caused by volumetric changes of adjacent battery cells. The compressive pressure is an indicator of the health of the battery cell and the onset of a thermal runaway event. In one embodiment, the pressure sensor 210 can be used to monitor the pressure within the aerogel of the separation layer 220 or the pressure in the space between the separation layer 220 and other components of the battery module where the thermal barrier 200 resides. In one embodiment, the pressure sensor 210 can be an absolute pressure sensor, a gauge pressure sensor, a vacuum pressure sensor, a differential pressure sensor, or a hermetic pressure sensor.

[0044] In some cases, pressure sensor 210 may be adjacent to isolation layer 220, such as next to an aerogel, as shown in Figures 2A and 2B. In some cases, pressure sensor 210 may be fully or partially embedded in isolation layer 220, such as within an aerogel, as shown in Figure 2C. In some cases where pressure sensor 210 is partially embedded in isolation layer 220, a surface of pressure sensor 210 may be near a battery cell in a module to monitor pressure near or on the surface of the battery cell.

[0045] The pressure sensor 210 within the thermal barrier 200 can be wired using a signal cable 212 or the like. In some cases, multiple signal cables can be used to electrically couple the pressure sensor 210 to a controller circuit, such as a battery management system (BMS) circuit. The signal cable 212 can transmit pressure signals and power to the pressure sensor 210. The signal cable 212 can be embedded in an isolation layer 220. In one embodiment, the signal cable 212 can be one or more wires. The isolation layer 220 protects the signal cable 212 from thermal or mechanical damage during normal operation of the battery module or during extreme events such as thermal runaway.

[0046] In some cases, the thermal barrier 200 may include a structural component coupled to the aerogel of the separation layer, such as the structural support plate 112 of FIG. 1C. In one embodiment, a structural support such as a plate or scaffolding may be included. The pressure sensor 210 may be integrated into or onto the structural component.

[0047] In some cases, sensors in addition to or alternative to pressure sensor 210 may be included in thermal barrier 200. In other variations, thermal barrier 200 may include additional or alternative pressure, temperature, moisture, gas, or gas pressure sensors. Additional types of sensors are described further below.

[0048] FIG. 3 illustrates a thermal barrier 300 having a wireless pressure sensor 310 in one embodiment. In this case, the pressure sensor 310 may be embedded in or adjacent to the aerogel of the separation layer 320 without a signal cable or wire. In one embodiment, the pressure sensor 310 may be a Bluetooth-enabled or other type of wireless sensor. In some cases, the thermal barrier 300 may additionally include a temperature sensor 314, which may be either wired or wireless. The temperature sensor 314 may be in direct contact with the cooling plate 104 of FIGS. 1A-1C to detect the temperature of the cooling plate. In some embodiments, the temperature sensor 314 is located on a different surface of the separation layer 320. In one embodiment, the surface on which the pressure sensor 310 is attached is perpendicular to the surface on which the temperature sensor 314 is attached.

[0049] FIG. 4 illustrates a thermal barrier 400 having a pressure sensor 410, as well as a first temperature sensor 414, a second temperature sensor 415, and a third temperature sensor 416 in one embodiment. The temperature sensor 414 can be a temperature sensor on or near a cold plate within the battery module. The temperature sensor 415 can be a sensor embedded in the thermal barrier 400 to monitor the temperature of the aerogel in the separation layer. The temperature sensor 415 can also be attached to the surface of the thermal barrier 400 facing the battery cells, allowing the temperature sensor 415 to monitor the temperature of the adjacent battery cells. The temperature sensor 416 can face the space 130 above the cells 102 within the module housing, as shown in FIGS. 1A-1C. Thus, the temperature sensor 416 can detect the temperature in the space 130 in the event of thermal runaway.

[0050] The temperature sensors 414, 415, 416 may be electrically connected wirelessly or via signal cables. The temperature sensors 414, 415, 416 may, in one embodiment, be thermistors, thermocouples, resistance thermometers, silicon bandgap temperature sensors, or other suitable temperature sensors or thermometers.

[0051] The thermal barrier 400 may include a cold plate adjacent to the separation layer 420. The cold plate may be between the thermal barrier 400 and the battery cells to dissipate heat. Temperature sensors 414, 415, 416 may be embedded in or near the aerogel of the separation layer 420, such as near the cold plate. The temperature sensors 414, 415, 416 may be used to monitor the temperature in and around the cold plate of the thermal barrier 400. The cold plate may include carbon fiber, graphite, silicon carbide, metals including, but not limited to, copper, stainless steel, aluminum, etc., as well as combinations thereof. In one aspect, the thermally conductive layer may include cooling channels with coolant flow therethrough.

[0052] The thermal barrier 400 may further include a structural support plate that is structured in the same manner as the cooling plate, except that the structural support plate may not be thermally conductive. The structural support plate may be selected from mica board, mica paper, other forms of mica, felt, foamed polymer, solid polymer, composite material, other material that is more rigid than the separation layer 420, or combinations thereof.

[0053] In some cases, the temperature sensors 414, 415, 416 may be embedded in the thermal barrier 400 with surfaces exposed to adjacent battery cells. In some cases, the temperature sensors 414, 415, 416 may be partially embedded in the aerogel of the thermal barrier 400 such that the surfaces of the temperature sensors 414, 415, 416 face or contact one of the lithium-ion battery stacks. In some cases, the temperature sensors 414, 415, 416 may be partially embedded in the aerogel of the thermal barrier 400 such that the surface of the temperature sensor 414 faces away from one of the lithium-ion battery stacks. In some cases, the temperature sensors 414, 415, 416 and the pressure sensor 410 may be disposed on one or more surfaces of the separation layer 420. In one embodiment, the temperature sensors 414, 415, 416 and the pressure sensor 410 are disposed on four different surfaces of the separation layer 420 that are perpendicular to one another. In one embodiment, one or more of the temperature sensors 414, 415, 416 and pressure sensor 410 are located on the surface of the separation layer 420. The sensors in various locations are used to collect data for the controller to analyze the health of the battery module.

[0054] 5A-5B show a thermal barrier 500 having a pressure sensor 510, a temperature sensor 514, a signal cable 512, an isolation layer 520, and a conductive layer 530 in one embodiment. Here, the temperature sensor 514, the pressure sensor 510, or both, can be embedded in the aerogel of the isolation layer 520. In some cases, the sensor(s) can be partially embedded in the isolation layer 520 with a surface facing the conductive layer 530. The conductive layer 530 can be made of a thermally conductive material as described above. The signal cable 512 can be embedded in the isolation layer 520 to connect the temperature sensor 514 and / or the pressure sensor 510. The isolation layer 520 protects the pressure sensor 510, the temperature sensor 514, and the signal cable 512 from possible mechanical, corrosive, and thermal damage during a thermal runaway event.

[0055] 6 illustrates an embodiment of a thermal barrier 600 having a separation layer 620 and a sheet sensor 610. The sheet sensor 610 can include a pressure sensor 612, a temperature sensor 614, a moisture sensor 616, and a gas sensor 618.

[0056] Various sensors may be located on or integrated into the sheet sensor 610. The sheet sensor 610 may be sized and shaped for insertion next to a separator layer 620 within a battery module. The sheet sensor 610 may additionally include several channels 615 for wires or cables to electrically connect the various sensors to controller circuitry, such as for providing electricity and transmitting signals from the various sensors.

[0057] The moisture sensor 616 and the gas sensor 618, in one aspect, can be for monitoring moisture and gas within the thermal barrier 600 or between the thermal barrier 600 and one or more lithium-ion battery cells in the battery module. The moisture sensor 616 can be used to monitor water or other fluids present within the battery module. The gas sensor 618, in one aspect, can be an oxygen, carbon dioxide, or other type of gas sensor. In some cases, the gas sensor 618 can be an electrochemical sensor, an infrared sensor, an ultrasonic sensor, or other type of gas sensor, as appropriate.

[0058] One or more of the temperature sensor 614, pressure sensor 612, moisture sensor 616, and gas sensor 618 may be wireless. In some cases, the sensors may be integrated into a single sensor.

[0059] The sheet sensor 610 may be a printed circuit board. The sheet sensor 610 may, in some cases, be used as a map. In communication with the controller circuit, the sheet sensor 610 may be used to map temperature, pressure, moisture, gas, or other sensed attributes throughout the geography of the sheet sensor 610 and thermal barrier 600.

[0060] 7A-7B show a thermal barrier 700 having a sensor sheet 710 with a pressure sensor 712, a temperature sensor 715, a moisture sensor 716, and a gas sensor 718 connected by a channel 717 in one embodiment. The sensor sheet 710 can include at least one layer 719, such as an isolation layer, a conductive layer, a structural support layer, a stiffness layer, or an elastic layer, to provide various properties to the thermal barrier 700. A portion 725 of the sensor sheet 710 can extend beyond the isolation layer 720 and adjacent battery cells 722, 724. The moisture sensor 716 and the gas sensor 718 can be on the portion 725 such that the moisture sensor 716 and the gas sensor 718 are exposed to the air within the battery housing and can detect moisture and gas outside of the adjacent battery cells 722, 724. In one embodiment, the moisture sensor 716 and the gas sensor 718 can be used to detect smoke within the battery housing.

[0061] As shown in FIG. 7A, adjacent battery cells 722, 724 may further include one or more sensors 732, 742 adjacent the vent 730 and / or electrical terminal 740 of the battery cells 722, 724. The one or more sensors 732, 742 may be on an edge of the battery cells 722, 724 parallel to the length of the extension portion 725, as shown in FIG. 7A. Alternatively, the one or more sensors 732, 742 may be on an edge of the battery cells 722, 724 perpendicular to the length of the extension portion 725, as shown in FIG. 7B. In one aspect, the adjacent battery cells 722, 724 are prismatic battery cells (e.g., FIG. 7A) or pouch cells (FIG. 7B).

[0062] The one or more sensors 732, 742 may be any sensor, such as a temperature sensor, a pressure sensor, a gas pressure sensor, a gas sensor, and / or a combination thereof. The one or more sensors 732, 742 may be hardwired to the sensor sheet 710. Alternatively, the one or more sensors 732, 742 may be wirelessly connected to the sensor sheet 710 or the battery management system.

[0063] 8 shows an exploded view of a thermal barrier 800 having a sensor sheet 810, a separation layer 820, and a conductive layer 830 in one embodiment. The sensor sheet 810 can include multiple sensors and routing 825. The sensor sheet 810 can be, in one embodiment, a printed circuit with embedded sensors to create a map for mapping temperature, pressure, moisture, gas, gas composition, or other attributes within the battery enclosure.

[0064] 9 shows an exploded view of a battery stack 900 with a thermal barrier 905 and embedded sensors according to one embodiment. The battery stack 900 can include battery cells 922 and a thermal barrier 905. Various sensors, including a temperature sensor 914 and a pressure sensor 912, are located at various positions on each of the thermal barriers 905.

[0065] In some cases, the various sensors 912, 914 may be located in the center of the thermal barrier 905. In some cases, the various sensors 912, 914 may be located at different corners of the thermal barrier 905 within a battery module. In some cases, the various sensors 912, 914 may be located on different sides of the thermal barrier 905. The thermal barrier 905 is more compressible than the various sensors. Incorporating sensors into the thermal barrier 905 reduces the compressibility of the thermal barrier 905, especially at the locations where the sensors are located. This reduction in compressibility is more pronounced when multiple thermal barriers are used within battery modules aligned together. Locations with sensors within the thermal barrier are least compressible compared to locations without sensors. Sensors at different corners of the thermal barrier 905 (as shown in FIG. 9 ) can mitigate the reduction in compressibility by distributing the sensors at different corners of the thermal barrier.

[0066] FIG. 10 shows an exploded view of a battery stack 1000 with a thermal barrier 1005, and implantable sensors 1012, 1014, and a battery cell 1022, according to one embodiment.

[0067] In some cases, the various sensors 1012, 1014 may be in the center of the thermal barrier 1005. In some cases, the various sensors 1012, 1014 may be at different corners of the thermal barrier 1005. In some cases, the various sensors 1012, 1014 may be located on different edges of the thermal barrier 1005. In one aspect, the sensors 1014 are located on opposite edges of the thermal barrier 1005. Locating the sensors 1014 on different edges of adjacent thermal barriers 1005 can provide additional compressibility to the cell stack 1000.

[0068] FIG. 11 shows a battery module 1100 having a battery stack 1102 including battery cells 1122, a thermal barrier 1105 with a fill sensor, a cold plate 1130, a housing 1140, and a lid 1142 in one embodiment.

[0069] 12 illustrates an embodiment of a battery module management system 1200. The system may include a battery module 1210, a management system 1220, a controller 1230, and a user interface 1240.

[0070] The battery module 1210 may be coupled to a management system 1220, a controller 1230, and a user interface 1240. Sensors within the battery module 1210 may be coupled to the controller 1230 via one or more wires or wirelessly to provide, for example, sensor readings and signals therebetween.

[0071] The management system 1220 can be used to adjust parameters within the battery module 1210 based on the sensor signals. The management system 1220 can store historical sensor data and information. The management system 1220 can collect and calculate sensor test data and compare the collected and calculated sensor test data to historical sensor data and information. In one aspect, the management system 1220 can compare the collected sensor data to desired ranges or thresholds for the sensor data based on historical data or other database information.

[0072] The management system 1220 can determine if the detected sensor data rises to a warning level, such as outside a desired range or above a predetermined threshold. Such warnings can be communicated via the controller 1230 to the user interface 1240 to alert a user of the system. The battery module management system 1200 can additionally provide warning signals and feedback to mitigate thermal runaway, allowing the user to manually adjust the system accordingly or to help implement changes automatically with the controller 1230.

[0073] In one aspect, system 1200 includes a battery module including a stack of lithium-ion cells located within a module housing, a thermal barrier between at least two cells in the stack of lithium-ion cells, the thermal barrier including at least a separation layer and a sensor embedded in the thermal barrier, and a controller configured to interface with the sensor embedded in the thermal barrier.

[0074] The controller may include a processor and a memory containing instructions that, when executed, cause the processor to receive a signal from the sensor, interpret the signal from the sensor to determine whether a predetermined condition is met, and present an alert if the predetermined condition is met based on the interpreted sensor signal.

[0075] In some cases, the instructions may cause the processor to automatically perform an action based on the alert. In some cases, interpreting the signal may include comparing the signal to historical data. In some cases, the predetermined condition includes thermal runaway. In some cases, presenting the alert may include providing a warning to a user on a user interface.

[0076] In some cases, the battery module management system 1200 can be used to warn a user of thermal runaway, such as by method 1300 or method 1400 below. In one aspect, if the battery module and system 1200 are in a vehicle, a Level I warning can include "Emergency, Leave Vehicle." A Level II warning can include "Stop Driving. Maintenance Required Immediately." A Level III warning can include "Maintenance."

[0077] Figure 13 illustrates a method 1300 of using a thermal runaway warning system in accordance with an embodiment. Figure 14 illustrates an alternative method 1400 of using a thermal runaway warning system in accordance with an embodiment.

[0078] The method may include a method for monitoring a battery module, the method may include receiving a signal from a sensor embedded in a thermal barrier located between at least two cells of the battery module, interpreting the signal from the sensor to determine if a predetermined condition is met, and presenting an alert if the predetermined condition is met based on the interpreted sensor signal.

[0079] Specifically, method 1300 may include detecting a temperature (step 1310). The system may determine whether the temperature exceeds a preset temperature threshold. If the temperature does not exceed the threshold, no alert is issued. However, if the temperature exceeds the threshold, a Level I alert may be issued (step 1320). Alternatively, if the temperature reaches an intermediate range, pressure may be detected (step 1330) to further diagnose a potential problem. If the pressure is below a preset threshold, a Level III alert may be issued (step 1340). If the pressure exceeds a preset pressure threshold, a Level II alert may be issued (step 1350). In this case, a gas detector may be used to determine whether gas is vented (step 1360). If gas is vented, a Level I alert may be issued (step 1370). Otherwise, moisture may be detected. If moisture above a preset moisture threshold is detected, a Level II alert may be issued (step 1380).

[0080] Alternatively, method 1400 may include detecting an initial pressure (step 1410). An updated pressure may then be detected (step 1420). A pressure difference may be calculated (step 1430). If the calculated difference exceeds a desired threshold, a Level I alert may be issued (step 1440). Otherwise, a temperature may be detected (step 1450). If the temperature does not exceed a preset threshold, a Level III alert may be issued (step 1460). If the temperature exceeds a preset threshold, a Level II alert may be issued (step 1470). In this case, a gas sensor may be used to determine whether gas is vented. If so, a Level I alert may be issued (step 1480). Otherwise, moisture may be detected, and a Level II alert may be issued (step 1490). Other aspect methods may be used with various combinations of sensors.

[0081] 15 is a block diagram of a typical general-purpose computer 1500 that may be programmed into a special-purpose computer suitable for implementing one or more aspects disclosed herein. The management system described above can be implemented on any general-purpose processing component, such as a computer, having sufficient processing power, memory resources, and communication throughput capabilities to handle the required workload placed upon it. The computer 1500 includes a processor 1502 (which may be referred to as a central processing unit or CPU) in communication with memory devices including secondary storage 1504, read-only memory (ROM) 1506, random access memory (RAM) 1508, input / output (I / O) devices 1510, and network connectivity devices 1512. The processor 1502 may be implemented as one or more CPU chips or may be part of one or more application-specific integrated circuits (ASICs).

[0082] Secondary storage 1504 typically consists of one or more disk drives or tape drives and is used for non-volatile storage of data and as an overflow data storage device when RAM 1508 is not large enough to hold all working data. Secondary storage 1504 may be used to store programs that are loaded into RAM 1508 when such programs are selected for execution. ROM 1506 is used to store instructions and possibly data that is read during program execution. ROM 1506 is typically a non-volatile memory device having a small memory capacity relative to the larger memory capacity of secondary storage 1504. RAM 1508 is used to store volatile data and possibly instructions. Access to both ROM 1506 and RAM 1508 is typically faster than access to secondary storage 1504.

[0083] The devices described herein may be configured to include a computer-readable non-transitory medium storing computer-readable instructions and one or more processors coupled to memory, which, when executed, cause the computer 1500 to perform the method steps and operations described above. Computer-readable non-transitory media include all types of computer-readable media, including magnetic storage media, optical storage media, flash media, and solid-state storage media.

[0084] It should be further understood that software including one or more computer-executable instructions facilitating the processes and operations as described above with reference to any one or all of the steps of the present disclosure may be installed on and sold with one or more servers and / or one or more routers and / or one or more devices in a consumer and / or producer domain consistent with the present disclosure. Alternatively, the software may be obtained and loaded onto one or more servers and / or one or more routers and / or one or more devices in a consumer and / or producer domain consistent with the present disclosure, including, for example, in one aspect, obtaining the software via a physical medium or distribution system from a server owned by the software creator or from a server used but not owned by the software creator. The software may, in one aspect, be stored on a server for distribution via the Internet.

[0085] It is also to be understood that the present disclosure is not limited to the details of construction and the arrangement of components set forth in the description or illustrated in the drawings in the application. Aspects of the present specification may be other embodiments and may be practiced or carried out in various ways. It is also to be understood that the phraseology and terminology used herein are for purposes of description and should not be regarded as limiting. The use of "including," "comprising," or "having" and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof, as well as additional items. Unless otherwise limited, the terms "connected," "coupled," and "attached" and variations thereof are used broadly and encompass both direct and indirect connections, couplings, and attachments. Furthermore, the terms "connected" and "coupled," and variations thereof, are not limited to physical or mechanical connections or couplings. Furthermore, terms such as top, bottom, and upper are relative and are used to aid in description, but not to be limiting.

[0086] Components of the example devices, systems, and methods used in accordance with the illustrated aspects may be implemented at least partially in digital electronic circuitry, analog electronic circuitry, or computer hardware, firmware, software, or combinations thereof. These components may in one aspect be implemented as a computing program product, such as a computing program, program code, or computer instructions tangibly embodied in an information carrier or machine-readable storage device for execution by or control the operation of a data processing apparatus, such as a programmable processor, a computer, or multiple computers.

[0087] A computing program may be written in any form of programming language, including compiled or interpreted languages, and may be developed in any form, such as a stand-alone program or a module, component, subroutine, or other unit suitable for use in a computing environment. A computing program may be developed to run on one computer or on multiple computers located at one site or distributed across multiple sites and interconnected by a communication network. Furthermore, functional programs, codes, and code segments for achieving the techniques described herein may be readily interpreted by those skilled in the art as being within the scope of the present disclosure. Method steps associated with exemplary aspects may be performed by one or more programmable processors that execute computing programs, codes, or instructions to perform functions (e.g., by manipulating input data and / or generating output). Additionally, method steps may, in one aspect, be performed by, and an apparatus may be implemented as, special purpose logic circuitry, such as an FPGA (field programmable gate array) or an ASIC (application-specific integrated circuit).

[0088] The various illustrative logic blocks, modules, and circuits described in connection with aspects disclosed herein may be implemented or performed using a general-purpose processor, a digital signal processor (DSP), an ASIC, an FPGA, or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof intended to perform the functions described herein. A general-purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, such as, for example, a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.

[0089] Processors suitable for executing computing programs include, in embodiments, both general-purpose and special-purpose microprocessors, as well as one or more processors of any kind of digital computer. Generally, a processor receives instructions and data from a read-only memory, a random-access memory, or both. The essential elements of a computer are a processor for executing instructions and one or more memory devices for storing instructions and data. Generally, a computer also includes one or more mass storage devices, e.g., magnetic, magneto-optical, or optical disks, for storing data, or is operably coupled to receive data from or transfer data to these mass storage devices, or both. Information carriers suitable for embodying computing program instructions and data include, in embodiments, semiconductor memory devices, e.g., electrically programmable read-only memory or ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory devices, and all forms of non-volatile memory, including data storage disks (e.g., magnetic disks, internal hard disks, or removable disks, magneto-optical disks, and CD-ROM and DVD-ROM disks). The processor and the memory can be supplemented by, or incorporated in, special purpose logic circuitry.

[0090] Those skilled in the art will understand that information and signals may be represented using any of a variety of different technologies and techniques. In one aspect, the data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0091] Those skilled in the art will further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the aspects disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure. Software modules may reside in random access memory (RAM), flash memory, ROM, EPROM, EEPROM, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from and write information to the storage medium. Alternatively, the storage medium may be integral to the processor. In other words, the processor and the storage medium may reside within an integrated circuit or may be implemented as discrete components.

[0092] As used herein, “machine-readable medium” means a device capable of temporarily or permanently storing instructions and data, and may include, but is not limited to, random access memory (RAM), read-only memory (ROM), buffer memory, flash memory, optical media, magnetic media, cache memory, other types of storage (e.g., erasable programmable read-only memory (EEPROM)), and / or any suitable combination thereof. The term “machine-readable medium” should be interpreted to include a single medium or multiple media capable of storing processor instructions (e.g., a centralized or distributed database or associated caches and servers). The term “machine-readable medium” should also be interpreted to include any medium, or combination of multiple media, capable of storing instructions for execution by one or more processors, such that, when executed by one or more processors of a machine, the instructions cause the one or more processors to perform any one or more of the methodologies described herein. Thus, “machine-readable medium” refers to a single storage device or device, as well as a “cloud-based” storage system or storage network including multiple storage devices or devices. As used herein, the term “machine-readable medium” excludes the signal itself.

[0093] Various notes and aspects Aspect 1 is a battery module including: a stack of lithium-ion cells located within a module housing; a thermal barrier between at least two cells in the stack of lithium-ion cells, the thermal barrier including a separation layer comprising at least an aerogel; at least one sensor; and a module cover enclosing the stack of lithium-ion cells within the module housing.

[0094] In aspect 2, the subject matter of aspect 1 optionally includes wherein the at least one sensor includes a pressure sensor, a temperature sensor, a moisture sensor, a gas sensor, or a combination thereof.

[0095] In Example 3, the subject matter of any one or more of Examples 1-2 optionally includes wherein the at least one sensor is embedded in the separation layer.

[0096] In Example 4, the subject matter of any one or more of Examples 1-3 optionally includes the at least one sensor being adjacent to the separation layer.

[0097] In Example 5, the subject matter of any one or more of Examples 1-4 optionally includes wherein the thermal barrier further comprises a structural component coupled to the aerogel of the separation layer.

[0098] In aspect 6, the subject matter of aspect 5 optionally includes the at least one sensor being on the structural component.

[0099] In aspect 7, the subject matter of any one or more of aspects 1-6 optionally includes wherein the at least one sensor is a wireless sensor.

[0100] In Example 8, the subject matter of any one or more of Examples 1-7 optionally includes further including one or more wires extending from the at least one sensor outside the separation layer for conducting signals to and from the sensor.

[0101] In Example 9, the subject matter of Example 8 optionally includes wherein the one or more wires are embedded in the separation layer.

[0102] In Example 10, the subject matter of any one or more of Examples 1-9 optionally includes, wherein the at least one sensor is partially embedded within the thermal barrier, and the at least one sensor has a surface in contact with one of the stack of lithium-ion cells.

[0103] In Example 11, the subject matter of any one or more of Examples 1-10 optionally includes, wherein the at least one sensor is partially embedded within the thermal barrier, and the at least one sensor has a surface facing away from one of the stacks of lithium-ion cells.

[0104] In Example 12, the subject matter of any one or more of Examples 1-11 optionally further includes a cooling plate adjacent the separation layer.

[0105] In Aspect 13, the subject matter of Aspect 12 optionally includes wherein the at least one sensor is partially embedded within the thermal barrier and the at least one sensor has a surface in contact with the cooling plate.

[0106] In Example 14, the subject matter of any one or more of Examples 1-13 optionally includes wherein the thermal barrier further comprises a conductive layer.

[0107] In Example 15, the subject matter of Example 14 optionally includes wherein the at least one sensor is partially embedded within the separation layer, and the at least one sensor has a surface in contact with the conductive layer.

[0108] In Example 16, the subject matter of any one or more of Examples 14-15 optionally includes, wherein the conductive layer includes a thermally conductive material.

[0109] In embodiment 17, the subject matter of any one or more of embodiments 1-16 optionally includes wherein the at least one sensor includes a sensor sheet.

[0110] In Example 18, the subject matter of Example 17 optionally includes wherein the sensor sheet includes power channels connecting to the sensors.

[0111] In aspect 19, the subject matter of any one or more of aspects 17-18 optionally includes wherein the sensor sheet includes a plurality of sensors, and the sensor sheet is configured to enable mapping of one or more parameters across the entire surface of the sensor sheet.

[0112] In Example 20, the subject matter of any one or more of Examples 17-19 optionally includes wherein the sensor sheet includes at least a portion extending from the stack beyond the thermal barrier and adjacent lithium ion cell.

[0113] In Example 21, the subject matter of Example 20 optionally includes wherein the portion of the sensor sheet includes one or more moisture sensors, gas sensors, or a combination thereof.

[0114] In Example 22, the subject matter of any one or more of Examples 17-21 optionally includes that the sensor sheet includes a printed circuit board.

[0115] In Example 23, the subject matter of any one or more of Examples 17-22 optionally includes, wherein the sensor sheet includes at least one sensor at each corner of the sensor sheet.

[0116] In Example 24, the subject matter of any one or more of Examples 17-23 optionally includes, wherein the sensor sheet includes at least one sensor on each side of the sensor sheet.

[0117] Example 25 is a thermal barrier for use in a battery module, the thermal barrier including a separation layer comprising an aerogel, the separation layer configured to thermally isolate individual battery cells in the battery module, and a pressure sensor at least partially within the thermal barrier.

[0118] In Example 26, the subject matter of Example 25 optionally includes wherein the pressure sensor is embedded in the separation layer.

[0119] In embodiment 27, the subject matter of any one of embodiments 25-26 optionally includes a cooling plate coupled to the separation layer, and the pressure sensor is at least partially embedded in the separation layer adjacent to the cooling plate.

[0120] In embodiment 28, the subject matter of any one or more of embodiments 25-27 optionally includes a conductive layer coupled to the separation layer, wherein the pressure sensor is embedded within the thermal barrier between the conductive layer and the separation layer.

[0121] In embodiment 29, the subject matter of any one or more of embodiments 25-28 optionally includes, wherein the pressure sensor is wireless.

[0122] Aspect 30 is a battery management system comprising: a battery module including a stack of lithium ion cells located within a module housing and a thermal barrier between at least two cells in the stack of lithium ion cells, the thermal barrier including at least a separation layer and a sensor embedded in the thermal barrier; and a controller configured to interface with the sensor embedded in the thermal barrier, the controller including a processor and a memory including instructions that, when executed, cause the processor to receive a signal from the sensor, interpret the signal from the sensor to determine whether a predetermined condition is met, and present an alert if the predetermined condition is met based on the interpreted sensor signal.

[0123] In example 31, the subject matter of example 30 optionally includes the instructions further causing the processor to automatically perform an action based on the alert.

[0124] In example 32, the subject matter of any one or more of examples 30-31 optionally includes where interpreting the signal includes comparing the signal to historical data.

[0125] In Example 33, the subject matter of any one or more of Examples 30-32 optionally includes wherein the predetermined condition includes thermal runaway.

[0126] In aspect 34, the subject matter of any one or more of aspects 30-33 optionally includes where presenting the alert includes providing a warning to the user on a user interface.

[0127] Aspect 35 is a method for monitoring a battery module, the method including: receiving a signal from a sensor embedded in a thermal barrier located between at least two cells of the battery module; interpreting the signal from the sensor to determine whether a predetermined condition is met; and presenting an alert if the predetermined condition is met based on the interpreted sensor signal.

[0128] Each of these non-limiting aspects may stand on its own or may be combined with one or more of the other aspects in various permutations or combinations.

[0129] The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are also referred to herein as "embodiments." Such embodiments may include elements in addition to those shown or described. However, the inventors also contemplate embodiments in which only those elements shown or described are provided. Furthermore, the inventors also contemplate embodiments using any combination or permutation of the elements shown or described (or one or more aspects thereof), either with respect to the particular embodiment (or one or more aspects thereof) or with respect to any other embodiment (or one or more aspects thereof) shown or described herein.

[0130] In the event of inconsistent usage between this document and any document incorporated by reference, the usage in this document will control.

[0131] As used herein, the terms "a" or "an" are used, as is common in patent documents, to include one or more, regardless of any other instance or usage of "at least one" or "one or more." As used herein, the term "or" is used to refer to a non-exclusive or, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. As used herein, the terms "including" and "in which" are used as the plain-English equivalents of the respective terms "comprising" and "wherein." Also, in the following claims, the terms "including" and "comprising" are open-ended. That is, in the following claims, systems, devices, articles, compositions, formulations, or processes that include elements in addition to the elements listed after such terms are still deemed to be within the scope of the claims. Moreover, in the following claims, the terms "first," "second," and "third," etc., are used merely as labels and are not intended to impose numerical requirements on their objects.

[0132] Aspects of the methods described herein may be at least partially machine- or computer-implemented. Some aspects may include a computer-readable or machine-readable medium encoded with instructions operable to configure an electronic device to perform a method as described in the above aspects. Implementations of such methods may include code, such as microcode, assembly language code, high-level language code, etc. Such code may include computer-readable instructions for implementing various methods. The code may form part of a computer program product. Furthermore, in one aspect, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. These computer-readable medium aspects may include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), etc.

[0133] The above description is intended to be illustrative, not limiting. In one aspect, the above examples (or one or more aspects thereof) may be used in combination with each other. Other aspects may be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to enable the reader to quickly grasp the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be construed as intending that any unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter lies in less than all features of a particular disclosed embodiment. Accordingly, the following claims are incorporated into the Detailed Description herein as embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments can be combined with each other in various combinations or variations. The scope of the invention should be determined with reference to the appended claims, along with the full range of equivalents to which such claims are entitled.

Claims

1. A battery module, a stack of battery cells located within a module housing; a thermal barrier between at least two cells in the stack of battery cells, the thermal barrier including at least a separator layer; at least one sensor; a module cover enclosing the stack of battery cells within the module housing; The battery module.

2. The battery module of claim 1 , wherein the at least one sensor comprises a pressure sensor, a temperature sensor, a moisture sensor, a gas sensor, a gas pressure sensor, or a combination thereof.

3. The battery module of claim 1 , wherein the at least one sensor is embedded in the separation layer.

4. The battery module of claim 1 , wherein the at least one sensor is adjacent to the separation layer.

5. 10. The battery module of claim 1, wherein the thermal barrier further comprises a structural component bonded to the aerogel of the separation layer.

6. The battery module of claim 5 , wherein the at least one sensor is on the structural component.

7. The battery module of claim 1 , wherein the at least one sensor is a wireless sensor.

8. 10. The battery module of claim 1, further comprising one or more wires extending from the at least one sensor out of the separation layer for conducting signals to and from the sensor.

9. The battery module of claim 8 , wherein the one or more wires are embedded in the separation layer.

10. 2. The battery module of claim 1, wherein the at least one sensor is partially embedded within the thermal barrier, the at least one sensor having a surface in contact with one of the stack of battery cells.

11. 10. The battery module of claim 1, wherein the at least one sensor is partially embedded within the thermal barrier, the at least one sensor having a surface facing away from one of the stacks of battery cells.

12. The battery module of claim 1 , further comprising a cooling plate adjacent to the separator layer.

13. 13. The battery module of claim 12, wherein the at least one sensor is partially embedded within the thermal barrier, the at least one sensor having a surface in contact with the cold plate.

14. The battery module of claim 1 , wherein the thermal barrier further comprises a conductive layer.

15. 15. The battery module of claim 14, wherein the at least one sensor is partially embedded within the separation layer, the at least one sensor having a surface in contact with the conductive layer.

16. The battery module of claim 14 , wherein the conductive layer comprises a thermally conductive material.

17. The battery module of claim 1 , wherein the at least one sensor comprises a sensor sheet.

18. The battery module of claim 17 , wherein the sensor sheet includes power channels connecting to the sensors.

19. 20. The battery module of claim 17, wherein the sensor sheet includes a plurality of sensors, the sensor sheet configured to allow mapping of one or more parameters across a surface of the sensor sheet.

20. The battery module of claim 17 , wherein the sensor sheet includes at least a portion that extends from the stack beyond the thermal barrier and adjacent battery cells.

21. 21. The battery module of claim 20, wherein the portion of the sensor sheet includes one or more moisture sensors, gas sensors, gas pressure sensors, or combinations thereof.

22. The battery module of claim 17 , wherein the sensor sheet comprises a printed circuit board.

23. 20. The battery module of claim 17, wherein the sensor sheet includes at least one sensor at each corner of the sensor sheet.

24. 20. The battery module of claim 17, wherein the sensor sheet includes at least one sensor on each side of the sensor sheet.

25. 1. A thermal barrier for use in a battery module, comprising: a separation layer comprising an aerogel, the separation layer configured to thermally isolate individual battery cells within the battery module; a pressure sensor at least partially within the thermal barrier; The thermal barrier comprising:

26. 26. The thermal barrier of claim 25, wherein the pressure sensor is embedded in the isolation layer.

27. 26. The thermal barrier of claim 25, further comprising a cold plate coupled to the isolation layer, the pressure sensor being at least partially embedded in the isolation layer adjacent the cold plate.

28. 26. The thermal barrier of claim 25, further comprising a conductive layer coupled to the isolation layer, the pressure sensor being embedded within the thermal barrier between the conductive layer and the isolation layer.

29. 26. The thermal barrier of claim 25, wherein the pressure sensor is wireless.

30. A battery management system, a battery module including a stack of battery cells located within a module housing and a thermal barrier between at least two cells in the stack of battery cells, the thermal barrier including at least a separation layer and a sensor embedded in the thermal barrier; a controller configured to interface with the sensor embedded in the thermal barrier, the controller comprising: a processor; and a memory containing instructions that, when executed, cause the processor to: receiving a signal from the sensor; interpreting the signal from the sensor to determine whether a predetermined condition is met; the controller causing an alert to be presented if the predetermined condition is met based on the interpreted sensor signal; The battery management system.

31. 31. The system of claim 30, wherein the instructions further cause the processor to automatically perform an action based on the alert.

32. 31. The system of claim 30, wherein interpreting the signal comprises comparing the signal to historical data.

33. The system of claim 30 , wherein the predetermined condition comprises thermal runaway.

34. 31. The system of claim 30, wherein presenting the alert comprises providing a warning to a user on a user interface.

35. 1. A method for monitoring a battery module, comprising: receiving a signal from a sensor embedded in a thermal barrier located between at least two cells of the battery module; interpreting the signal from the sensor to determine if a predetermined condition is met; presenting an alert if the predetermined condition is met based on the interpreted sensor signal; and The method comprising:

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