Wafer carrier with capture device

Abstract

The wafer carrier includes a wafer carrier housing having an interior space and a scavenging device having a scavenging compound in fluid communication with the interior space. The wafer carrier can be used as a microenvironment for a semiconductor wafer enclosed within the carrier as the semiconductor wafer moves through a manufacturing process step. According to a first aspect of the present invention, a wafer carrier is provided. The wafer carrier includes (a) a wafer carrier housing having an interior space and (b) a scavenging device having a scavenging compound in fluid communication with the interior space. In an embodiment, the scavenging compound includes an oxygen scavenging compound and / or a moisture scavenging compound.

Description

[Technical Field]

[0001] Priority claims This application claims priority to U.S. Provisional Patent Application No. 63 / 448,835, filed February 28, 2023, having Attorney Docket No. 1202302-US-F, No. 63 / 448,843, filed February 28, 2023, having Attorney Docket No. 1202303-US-F, and No. 63 / 596,452, filed November 6, 2023, having Attorney Docket No. 1202323-US-F, each of which is incorporated herein by reference in its entirety.

[0002] Technical Field The present disclosure relates generally to wafer carriers, and more particularly to wafer carriers for encapsulating semiconductor wafers in a microenvironment with oxygen and / or moisture scavenging capabilities as the semiconductor wafers move through one or more manufacturing process steps. [Background technology]

[0003] background As semiconductor manufacturing technology advances, with continued miniaturization of devices, there are more stringent requirements in the manufacturing environment, particularly in minimizing contamination of semiconductors.

[0004] The adverse effects of moisture and oxygen on semiconductor wafers typically depend on two parameters: contaminant concentration and exposure time. Existing solutions to this problem may focus on shortening exposure time. Alternatively, if this is uneconomical or technically not possible, steps may be taken to reduce contaminant concentration levels in any environment to which the wafers are exposed. Such reduction is typically achieved by purging the environment containing the wafers with extremely clean, dry air or a pure inert gas such as nitrogen.

[0005] Sealed containers such as FOUPs (Front Opening Integrated Pods), FOSBs (Front Opening Transfer Boxes) or SMIF (Standard Mechanical Interface) pods may be used as wafer containers or reticle pods. To address and / or solve contamination issues, means may be provided for flushing the interior volume of such containers containing wafers with nitrogen during use.

[0006] However, such flushing processes are unable to meet technical requirements as technology advances, and therefore the problem of maintaining a suitable environment for semiconductor wafers still needs to be addressed. Summary of the Invention [Means for solving the problem]

[0007] overview SUMMARY OF THE INVENTION Embodiments of the present disclosure address the above-mentioned problems.

[0008] According to a first aspect of the present invention, a wafer carrier is provided. The wafer carrier includes: (a) a wafer carrier housing having an interior space; and (b) a scavenging device having a scavenging compound in fluid communication with the interior space. In embodiments, the scavenging compound includes an oxygen scavenging compound and / or a moisture scavenging compound.

[0009] According to a second aspect of the present invention, there is provided a method for protecting semiconductor wafers from oxygen and / or moisture contamination, the method comprising the steps of (i) selecting a wafer carrier according to the first aspect, and (ii) placing the semiconductor wafers to be protected within the interior space of the wafer carrier.

[0010] According to a third aspect of the present invention there is provided the use of a wafer carrier according to the first aspect for protecting semiconductor wafers from contamination by oxygen and / or moisture.

[0011] According to a fourth aspect of the present invention, there is provided a novel capture device for cooperating with a wafer carrier housing, the capture device having any of the features of the capture device according to the first aspect. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view of a pouch during filling with a capture compound according to one or more embodiments shown and described herein.

[0013] [Figure 2] FIG. 2 is a perspective view of a closed pouch filled with a capture compound according to one or more embodiments shown and described herein.

[0014] [Figure 3] FIG. 3 is a horizontal cross-sectional view through a front-opening one-piece pod (FOUP) showing the two pouches of FIGS. 1-2 in place in the FOUP according to one or more embodiments shown and described herein.

[0015] [Figure 4] FIG. 4 is a perspective view of a refill unit for receiving a capture compound according to one or more embodiments shown and described herein.

[0016] [Figure 5] 5 is a rear view of a frame for holding the refill unit of FIG. 4 having a mounting structure according to one or more embodiments shown and described herein.

[0017] [Figure 6] FIG. 6 is a side view of the frame of FIG. 5 attached to a FOUP according to one or more embodiments shown and described herein.

[0018] [Figure 7]7 is a horizontal cross-sectional view through a FOUP showing the two frames of FIG. 5 holding the refill units of FIG. 4 in place in the FOUP according to one or more embodiments shown and described herein.

[0019] [Figure 8] 8 is a front view of the frame of FIG. 5 holding the refill unit of FIG. 4 according to one or more embodiments shown and described herein.

[0020] [Figure 9] FIG. 9 is a perspective view of a framework container for receiving a capture compound according to one or more embodiments shown and described herein.

[0021] [Figure 10] 10 is a perspective view of the partially assembled framework container of FIG. 9 during loading with a capture compound according to one or more embodiments shown and described herein.

[0022] [Figure 11] FIG. 11 is a perspective view of the framework container of FIGS. 9-10 after closure and filled with a capture compound according to one or more embodiments shown and described herein.

[0023] [Figure 12] FIG. 12 is a horizontal cross-sectional view through a FOUP showing the two framework containers of FIGS. 9-11 in place in the FOUP according to one or more embodiments shown and described herein.

[0024] [Figure 13] FIG. 13 is a perspective view of a frame in an open position for receiving a packet containing a capture compound according to one or more embodiments shown and described herein.

[0025] [Figure 14]14 is a perspective view of the packet of FIG. 13 received in the frame of FIG. 13 in an open position according to one or more embodiments shown and described herein.

[0026] [Figure 15] 15 is a perspective view of the packet of FIG. 13 received in the frame of FIG. 13 in a closed position according to one or more embodiments shown and described herein.

[0027] [Figure 16] 16 is a rear perspective view of the frame of FIG. 13 in a closed position according to one or more embodiments shown and described herein.

[0028] [Figure 17] FIG. 17 is an exploded perspective view of a FOUP incorporating a capture device according to one or more embodiments shown and described herein.

[0029] [Figure 18] FIG. 18 is a perspective view of an assembled FOUP incorporating the capture device of FIG. 17 according to one or more embodiments shown and described herein.

[0030] [Figure 19] FIG. 19 is an exploded perspective view of a FOUP incorporating a capture device according to one or more embodiments shown and described herein.

[0031] [Figure 20] FIG. 20 is an exploded perspective view of the opening at the back of a FOUP and components of a capture device according to one or more embodiments shown and described herein.

[0032] [Figure 21] FIG. 21 is a perspective view of the back of a FOUP incorporating a capture device according to one or more embodiments shown and described herein.

[0033] [Figure 22] FIG. 22 is a front view through an open door of a FOUP incorporating a pair of nitrogen diffusers combined with a capture device according to one or more embodiments shown and described herein.

[0034] [Figure 23] 23 is a perspective view of a pair of nitrogen diffusers combined with a capture device for incorporation into the FOUP of FIG. 22 according to one or more embodiments shown and described herein.

[0035] [Figure 24] FIG. 24 is a top view of the FOUP of FIG. 22 showing the location of a pair of nitrogen diffusers combined with a capture device according to one or more embodiments shown and described herein.

[0036] [Figure 25] FIG. 25 is a front view through an open door of a FOUP incorporating a pair of nitrogen diffusers combined with a capture device according to one or more embodiments shown and described herein.

[0037] [Figure 26] FIG. 26 is a perspective view of a pair of nitrogen diffusers combined with a capture device for incorporation into the FOUP of FIG.

[0038] [Figure 27] FIG. 27 is a top view of the FOUP of FIG. 26 showing the location of a pair of nitrogen diffusers combined with a capture device according to one or more embodiments shown and described herein. DETAILED DESCRIPTION OF THE INVENTION

[0039] Detailed Description Reference is made below to various embodiments of wafer carriers, methods for protecting semiconductor wafers from oxygen and / or moisture contamination, as well as other aspects of the present invention.

[0040] This disclosure should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the subject matter to those skilled in the art.

[0041] Any aspect of any invention described herein may be combined with any feature described in any other aspect of any invention or embodiment described herein, mutatis mutandis.

[0042] term

[0043] Unless expressly defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting.

[0044] Unless otherwise expressly stated, it is not intended that any of the methods disclosed herein be construed as requiring that its steps be performed in a particular order, or that any of the articles described herein be construed as requiring a particular order or orientation of its individual components.

[0045] Unless expressly stated otherwise, it is intended that any composition or mixture disclosed herein may comprise, consist essentially of, or consist of the disclosed components.

[0046] As used herein, the singular form of a term is intended to include the plural form of that term, unless the context clearly indicates otherwise.

[0047] As used herein, numerical values ​​are not strictly limited to the exact numerical value recited. Instead, unless expressly stated otherwise, each numerical value is intended to mean both the exact numerical value and "about" a numerical value encompassing a functionally equivalent range surrounding that numerical value, whereby either possibility is contemplated as an embodiment disclosed herein.

[0048] As used herein, the term "formed from" (including related terms such as "formed"), with respect to an article (or component of an article) and a thermoplastic material, refers to the article (or component of an article) being extruded, molded, shaped, pressed, or otherwise made in whole or in part from a thermoplastic material under sufficient heat to permit such forming. Thus, the term "formed from" (including related terms such as "formed") means that in some embodiments, the article (or component of an article) can comprise, consist essentially of, or consist of the material, and in other embodiments, the article (or component of an article) consists of the material because the article (or component of an article) is made by, for example, an extrusion or molding process.

[0049] Wafer Carrier

[0050] According to one aspect of the present invention, a wafer carrier includes (a) a wafer carrier housing having an interior space, and (b) a scavenging device having a scavenging compound in fluid communication with the interior space. In embodiments, the scavenging compound can be an oxygen scavenging compound and / or a moisture scavenging compound.

[0051] The wafer carrier may be for enclosing a wafer, such as a semiconductor wafer, and, in use, houses the wafer within an interior space.

[0052] The scavenging compound, eg, an oxygen scavenging compound and / or a moisture scavenging compound, is suitably positioned to be in fluid communication with a potential source of contamination, eg, a potential source of oxygen contamination and / or a source of moisture contamination.

[0053] Thus, in embodiments, the wafer carrier can provide an oxygen and / or moisture controlled microenvironment for the semiconductor wafers enclosed within the carrier as the semiconductor wafers move through one or more manufacturing process steps.

[0054] For example, the wafer carriers disclosed herein may be FOUP (Front Opening Integrated Pod) or SMIF (Standard Mechanical Interface) pods. SMIF pods may be arranged to store multiple wafers horizontally when in use. The bottom of the SMIF pod may include an opening door that is suitably pivotable between an open position and a closed position.

[0055] A wafer carrier according to the present disclosure can include any one or more features of a commercially available FOUP or SMIF pod to the extent that such features do not negate or contradict any essential aspect of the present disclosure. The FOUP can be a standard FOUP or a nitrogen-purged FOUP.

[0056] wafer

[0057] In an embodiment, one or more semiconductor wafers reside within the interior space.

[0058] The semiconductor wafer may have a diameter of at least 100 mm, and in embodiments at least 150 mm. For example, the semiconductor wafer may have a diameter in the range of 100 mm to 1000 mm, or in embodiments, in the range of 150 mm to 600 mm, or in embodiments, in the range of 150 mm to 500 mm.

[0059] For example, the wafer diameter accommodated in a SMIF pod may be 150 mm or 200 mm, while a FOUP may accommodate larger diameter wafers, for example, 300 mm or 450 mm.

[0060] The container can hold at least 10 semiconductor wafers, for example, 10 to 50 or 10 to 25 wafers.

[0061] Wafer Carrier Housing

[0062] The wafer carrier disclosed herein includes a wafer carrier housing having an interior space.

[0063] The wafer carrier housing has an interior space adapted to store one or more semiconductor wafers. The housing may include a door for providing access to the interior space. The door may include a door housing and a latch mechanism operably attached to the door housing for securing the door closed. The door may be openable, e.g., pivotable or removable, to access the interior space and, during use, to access a plurality of wafers that may be stored in the interior space. The door may define an interior side facing the interior space. The door may be a front-opening door.

[0064] The wafer carrier, e.g., its interior space, can include support means for supporting a plurality of wafers. The wafer carrier, e.g., its interior space, can be configured to house at least 10 silicon wafers. In use, when filled with silicon wafers, the wafer carrier can have a weight of at least 1 kg or at least 5 kg.

[0065] The wafer carrier may have a maximum external width of at least 30 cm, or in embodiments at least 40 cm, and in embodiments less than 80 cm or less than 60 cm. The wafer carrier may have a maximum external depth of at least 20 cm, or in embodiments at least 30 cm, and in embodiments less than 60 cm or less than 45 cm. The wafer carrier may have a maximum external height of at least 20 cm, or in embodiments at least 30 cm, and in embodiments less than 60 cm or less than 45 cm. The wafer carrier may have a maximum external height of at least 20,000 cm. 3 , or in embodiments at least 40,000 cm 3 and in embodiments, the external volume is 100,000 cm 3 It may be less than.

[0066] The wafer carrier may be made from any suitable material or combination of materials. The wafer carrier housing of the wafer carrier may include a barrier material, e.g., a thermoplastic material. In embodiments, the wafer carrier, e.g., the housing, may include an ESD (electrostatic discharge) material. The thermoplastic may be selected from polycarbonate, cyclic olefin polymer (COC), and cyclic olefin copolymer (COP). In one embodiment, the housing may include a carbon-filled thermoplastic polymer, e.g., a polycarbonate carbon-filled material.

[0067] In embodiments, the wafer carrier enclosure may be a standard FOUP or a nitrogen purged FOUP.

[0068] In embodiments, the wafer carrier preferably includes wafer supports and / or wafer contact areas. Such supports and / or areas may include the same materials as described for the housing, or may include alternative materials. For example, an alternative material may be polyaryletherketone, such as PEEK.

[0069] Capture Device

[0070] The wafer carrier disclosed herein includes a capture device having a capture compound in fluid communication with an interior space.

[0071] In embodiments, the capture device may include a retention component that holds the capture compound within a predetermined volume. The retention component is appropriately positioned to restrict and / or prevent the passage of any capture compound outside the capture device. For example, the retention component may confine the capture compound to remain within the capture device and / or may prevent the capture compound from passing into the interior space of the housing in situations where the capture compound is free to move within the interior space, e.g., without being constrained by the capture device.

[0072] Thus, the retention component may help prevent contamination of the interior space and / or wafers therein by the capture compound. For example, in some embodiments, the capture device may include a capture compound that includes a metal. The capture device is appropriately positioned so that the metal in the capture compound cannot contaminate wafers that may be carried by the wafer carrier.

[0073] In embodiments, the retention component may include a barrier positioned between the interior space and the capture compound and arranged to restrict and / or prevent passage of the capture compound into the interior space, however the barrier is preferably permeable to oxygen and / or moisture such that oxygen and / or moisture can pass from the interior space through the barrier to the capture compound.

[0074] In embodiments, the barrier may include pores having a diameter of at least 1 μm, or at least 5 μm, or at least 9 μm, e.g., at least 10 μm, and preferably less than the smallest diameter of the capture compound that can be contained within a given volume of the capture device. For example, as described elsewhere herein, the capture compound may be in the form of particles having a particle size of at least 2 μm, e.g., in the range of 2 to 1000 μm. In some cases, the capture compound may be in the form of pellets or granules having a largest dimension of at least 1 mm, e.g., in the range of 1 to 10 mm.

[0075] In embodiments, the retention component may include a receptacle capable of housing the capture compound, and the receptacle may contain a mass of particles of the capture compound. The receptacle may be flexible, semi-rigid, or rigid. Alternatively and / or additionally, the retention component may be comprised of a polymeric material, and the capture compound may be embedded in the polymeric material such that the polymeric material and the capture compound form a solid mass, and preferably the capture compound is immobile within the solid mass.

[0076] In embodiments, a capture device may include both a retention component that includes a barrier and a polymeric material in which the capture compound is embedded.

[0077] In embodiments, the capture device may include at least one component in which the capture compound is held or embedded, the at least one component being releasably secured to the wafer carrier housing.

[0078] Thus, the capture compound can be conveniently removed from the wafer carrier and / or wafer carrier housing, at least when, for example, it becomes depleted or needs to be replenished for other reasons. In embodiments in which the capture device includes a holding component that includes a receptacle in which the capture compound can be stored, it is preferred that the receptacle be releasably secured to the wafer carrier housing. For example, in embodiments, the capture device may be releasably secured to a door of the wafer carrier housing.

[0079] In some embodiments, as further described elsewhere herein, the capture devices may be positioned either within the interior space or outside the interior space, hi other embodiments, a first capture device having a first capture compound may be positioned within the interior space and a second capture device having a second capture compound may be positioned outside the interior space.

[0080] In the interior space

[0081] In an embodiment, the capture device may be positioned within the interior space of the wafer carrier housing.

[0082] When the capture device is within the interior space, the capture device may include a retention component that retains the capture compound within the predetermined volume, as described. The capture device may include a first fixation element arranged to be releasably secured in position within the housing. In one embodiment, the first fixation element may be arranged to cooperate with a second fixation element arranged within the housing, e.g., its interior space. The first and second fixation elements are preferably arranged to cooperate to releasably secure the capture device within the interior space. For example, the first and second fixation elements may include cooperable male and female elements (e.g., hooks within the housing are arranged to engage openings in the capture device) or may be releasably engageable with each other in other ways. Alternatively, the first fixation element may include a surface arranged to releasably engage with an area within the housing to releasably secure the capture device in position. The surface may include an adhesive, e.g., an adhesive pad, arranged to contact an area within the housing to releasably secure the capture device in position.

[0083] Examples of configurations in which the capture compound is within the interior space are described below as embodiments AD and H.

[0084] In embodiment A, the capture device may include a flexible receptacle, e.g., a pouch. The flexible receptacle preferably acts as a retention component that holds the capture compound within a predetermined volume and provides a barrier that limits and / or prevents the capture compound from passing into the interior space. The flexible receptacle preferably includes, or more preferably consists essentially of, a porous material, which may be a polymeric material, e.g., a polyolefin such as polyethylene or polypropylene, particularly HDPE. The polymeric material may be heat-sealed to define the receptacle. The receptacle may include a first fixing element, e.g., an opening, for cooperating with a second fixing element within the housing to releasably secure the capture device in place. Preferably, the capture compound is disposed within the pouch. The capture compound may include particles arranged to be trapped within the receptacle. The particles of the capture compound may be as described above.

[0085] Embodiment A may be as described below with reference to Figures 1-3.

[0086] In embodiment B, the capture device may include, for example, a semi-rigid receptacle including a rigid frame arranged to releasably engage with a permeable refill. The refill may include a retention component that holds the capture compound within a predetermined volume, providing a barrier that limits and / or prevents the capture compound from passing into the interior space. The refill preferably includes a porous material, which may be a polymer material, for example, a polyolefin such as polyethylene or polypropylene, particularly HDPE. The capture device may include a fixation element for fixing the device in place within the interior space. The capture compound may include particles arranged to be trapped within the refill. The capture compound particles may be as described above.

[0087] Embodiment B may be as described below with reference to FIGS.

[0088] In embodiment C, the capture device may be substantially rigid. The capture device may include a rigid framework. Permeable regions may be defined between elements of the framework by a porous material, which may be, for example, a polymeric material, e.g., a polyolefin such as polyethylene or polypropylene, particularly HDPE. The framework may include cooperable panels that include the permeable regions. The cooperable panels may be rotatable relative to one another to define a hollow, rigid receptacle within which the capture compound may be placed. The capture compound may include particles arranged to be trapped within the receptacle. The particles of the capture compound may be as described above. The capture device may include one or more fixation elements for cooperating with one or more fixation elements within the housing to releasably secure the capture device in place.

[0089] Embodiment C may be as described below with reference to Figures 9-12.

[0090] In embodiment D, the capture device may include a first fixing element that may be substantially planar and / or may include a surface arranged to be fixed in place by surface contact with a surface within the interior space of the wafer carrier housing and / or a surface defined by the inner surface of the wafer carrier housing. The first fixing element may be fixed in place by adhesive means. Preferably, the first fixing element includes an adhesive, for example part of an adhesive film or pad (or the like), that is arranged to be releasably fixed by adhesion to a surface within the interior space of the wafer carrier housing.

[0091] The capture device of embodiment D may include a capture agent housing containing a capture compound and / or capture agent composition. The capture agent housing may include a first immobilization element, for example, attached to a substantially flat surface of the housing. The capture compound may be releasably immobilized within the housing so that the compound and / or composition can be replaced and / or replenished as desired during use. The capture compound may be within a flexible receptacle, such as a pouch. The flexible receptacle preferably retains the capture compound within a predetermined volume and acts as a retention component providing a barrier that restricts and / or prevents passage of the capture compound into the interior space. The flexible receptacle preferably comprises, or more preferably consists essentially of, a porous material, which may be a polymeric material, for example, a polyolefin such as polyethylene or polypropylene, particularly HDPE. The polymeric material may be heat-sealed to define the receptacle. Preferably, the capture compound is disposed within the flexible receptacle. The capture compound may include particles arranged to be trapped within the receptacle. The particles of capture compound can be as described above.

[0092] The scavenger housing of embodiment D may be positioned to hold the flexible receptacle in place and allow oxygen and / or moisture to pass into the receptacle. The housing preferably includes one or more openings for allowing oxygen and / or moisture to pass therethrough, as described above. The opening(s) may be defined in a surface of the housing, and the surface may include at least 50%, or at least 75%, of its area defined by the one or more openings, with the remainder of the surface preferably being comprised of the solid material of the scavenger housing.

[0093] The capture agent housing of embodiment D may include a first member that may include a first fixation element and a second member that may include one or more openings for the passage of oxygen and / or moisture as described above, wherein the first member and second member are movable, preferably rotatable, relative to one another to releasably fix in place a body, e.g., a flexible receptacle, that contains the capture compound and / or composition.

[0094] The capture agent housing of embodiment D may have a thickness A when in a configuration that secures the body, e.g., flexible receptacle, in place, and a maximum dimension B, where the ratio of dimension B divided by thickness A is at least 5, preferably at least 7, and more preferably at least 10. This ratio may be less than 100 or less than 50. Thus, the housing is suitably in the form of a layer or sheet.

[0095] Embodiment D may be as described with reference to Figures 13-16.

[0096] In embodiment H, the capture device may be attached to a nitrogen diffuser of the wafer carrier. For example, the nitrogen diffuser may be positioned inside the wafer carrier housing and may include a chamber disposed in fluid communication with a source of nitrogen and disposed to deliver nitrogen into the interior space of the wafer carrier housing.

[0097] The capture device may include a chamber in which the capture compound is disposed. The capture device may include a solid body containing the capture compound. For example, the solid body may be at least 1 cm 3 , e.g., at least 2 cm 3 , at least 5 cm 3 , at least 10 cm 3 , or at least 20 cm 3 The volume is 45 cm 3 The chamber may be less than 1 / 2 inch thick. Alternatively, the chamber may include a flexible or rigid receptacle for restricting and / or preventing passage of the capture compound into the interior space, but is preferably permeable to oxygen and / or moisture. Preferably, the chamber of the capture device is in fluid communication with the interior space of the wafer carrier housing. In use, oxygen and / or moisture can be captured from the interior space of the wafer carrier housing by passing from the interior space to the chamber of the capture device.

[0098] The trapping device may be releasably secured, e.g., directly, to the nitrogen diffuser, e.g., by one or more straps. Alternatively, the trapping device and the nitrogen diffuser may be integrally molded components. The respective chambers of the trapping device and the nitrogen diffuser may be integrally molded separate and / or independent parts.

[0099] Embodiment H may be as described below with reference to Figures 22-27.

[0100] Outside the interior space

[0101] In some embodiments, the capture device may be positioned outside the interior space, for example, on the outside of an outward-facing wall of the wafer carrier housing.

[0102] If the capture device is at least partially, eg substantially completely, outside the housing, it is preferred that the capture compound is at least partially, eg substantially completely, outside the interior space of the wafer carrier housing.

[0103] Examples of arrangements in which the scavenger compound is located outside the interior space are described below as embodiments E to G.

[0104] In embodiment E, the capture device may include a rigid scavenger housing arranged to be releasably secured to the exterior of the wafer carrier housing. The scavenger housing preferably contains a capture compound that is free-flowing within the housing but may suitably contain a mass of particles that is restricted, or preferably substantially prevented, from passing from the housing into the interior space.

[0105] The scavenger housing may be arranged to cooperate with a fixed opening in the wafer carrier housing, for example, in its sidewall. Preferably, a permeable membrane is arranged between the interior space of the wafer carrier housing and the interior space of the scavenger housing, and the permeable membrane is preferably arranged so as to be permeable to oxygen and / or moisture but impermeable to the capture compounds contained in the scavenger housing. The scavenger housing may be releasably fixed to the fixed opening. The wafer carrier housing may include two fixed openings appropriately defined in opposite sidewalls of the wafer carrier housing. Preferably, a single scavenger housing is arranged to engage both fixed openings. For example, the scavenger housing may include spaced-apart openings arranged to cooperate with the two fixed openings so that oxygen and / or moisture can pass from the interior space of the wafer carrier housing through both openings into the scavenger housing and preferably contact the capture compounds contained in the scavenger housing.

[0106] A portion of the scavenger housing may be positioned to be in surface contact with an exterior area of ​​the wafer carrier housing and / or to extend across an outwardly facing area of ​​a wall of the wafer carrier housing.

[0107] Embodiment E may be as described below with reference to FIGS.

[0108] In embodiment F, the capture device comprises a solid body that may suitably contain the capture compound.

[0109] The solid body is preferably positioned outside the interior space of the wafer carrier housing. The solid body may be releasably secured to an outer wall of the wafer carrier housing. The body may be disposed within an opening in the outer wall. A porous member may be positioned between the interior space of the wafer carrier housing and the solid body. Fixing means may be provided for releasably securing the solid body in place. The fixing device may include a closure, preferably substantially impermeable to oxygen and / or moisture, preferably positioned outside the solid body and / or disposed between the wafer carrier housing and the closure. The closure may be arranged for threaded engagement with another part, for example a part fixed to the wafer carrier housing, to releasably secure the closure in place.

[0110] The solid body may have a thickness C and a maximum dimension D, the ratio of dimension D divided by thickness C being at least 5, preferably at least 7, more preferably at least 10. This ratio may be less than 100 or less than 50. The solid body is therefore suitably in the form of a layer or thin plate. The solid body may comprise a disk.

[0111] The wafer carrier housing may include openings in its outer walls, preferably in opposing outer walls, and a respective solid body may be attached to each opening, each solid body preferably secured in place by a securing device, such as a respective closure as described.

[0112] Embodiment F may be as described below with reference to FIG.

[0113] In embodiment G, the capture device may be releasably secured within an opening in a wall of the wafer carrier housing. The capture device may include a solid body that may include a capture compound.

[0114] The solid body may be a component of a capture assembly, which may include first and second housing parts between which the solid body is positioned. The solid body is preferably substantially covered and / or enclosed, for example, by the cooperating first and second housing parts. The first and second housing parts may cooperate to releasably secure the solid body in place. For example, the first housing part may be disposed on the side of an opening in a wall of the wafer carrier housing that is within (or defines the interior wall of) the interior space of the wafer carrier housing, and the second housing part may be located outside the interior space. The first housing part may be permeable to oxygen and / or moisture, thereby allowing the foregoing to pass from the interior space through the first housing part and the opening in the wall into the solid body where capture can occur. The first housing part limits and / or prevents the passage of the capture compound into the interior space. The second housing part may be substantially impermeable.

[0115] Embodiment G may be as described below with reference to FIGS.

[0116] capture compound

[0117] The wafer carrier disclosed herein includes a capture device having a capture compound in fluid communication with an interior space.

[0118] In embodiments, the scavenging compound may be a moisture scavenging compound and / or an oxygen scavenging compound.

[0119] In embodiments, the described scavenging devices may include both a moisture scavenging compound and an oxygen scavenging compound. For example, if a wafer carrier includes both an oxygen scavenging compound and a moisture scavenging compound, a mass including the oxygen scavenging compound may be mixed with a mass including the moisture scavenging compound. For example, in embodiments including a scavenging device including pellets or powders, the pellets or powders may include pellets or powders including the oxygen scavenging compound and pellets or powders including the moisture scavenging compound, preferably in intimate contact with each other and / or mixed together.

[0120] In embodiments, the scavenging compound may be a component of a scavenging composition (i.e., the scavenging composition may include the scavenging compound and, optionally, one or more other components). Thus, as used herein, the term "scavenging compound" contemplates the possibility that the scavenging compound may be a component of a scavenging composition, and when the term "scavenging compound" is used herein, it may also be understood to refer to a scavenging composition that includes a scavenging compound. Thus, the scavenging compound may be a moisture scavenging compound and / or a component of a moisture scavenging composition. Similarly, the scavenging compound may be an oxygen scavenging compound and / or a component of an oxygen scavenging composition.

[0121] In embodiments, the capture compound and / or capture composition may be particulate. In this case, the particles are preferably sized so that they cannot substantially pass through the openings, e.g., pores, defined in the barrier. The particles of the capture compound and / or capture composition may be at least 2 μm, e.g., in the range of 2 to 1000 μm. In some cases, the capture compound and / or capture composition may be in the form of pellets or granules having a maximum dimension of at least 1 mm, e.g., in the range of 1 to 10 mm. Preferably, as described, substantially none of the capture compound or capture composition can pass through the barrier defined by the retention component.

[0122] moisture scavenging compounds

[0123] In embodiments, the scavenging compound may be a moisture scavenging compound.

[0124] Suitable moisture scavenging compounds can include conventional or commercially available moisture scavenging compounds. One type of moisture scavenging compound can be used alone or in combination with one or more other types of moisture scavenging compounds.

[0125] In embodiments, the moisture scavenging compound may be inorganic or organic, and / or may be polymeric or non-polymeric, and / or may include one or more petroleum-based polymeric materials, inorganic materials, or bio-based materials.

[0126] In embodiment I, the moisture-trapping compound may be configured to generate molecular hydrogen upon reaction with moisture, and thus, in this case, moisture is trapped by a chemical reaction involving the moisture and the moisture-trapping compound.

[0127] Further, in embodiment I, the moisture scavenging compound may comprise a matrix having associated therewith, e.g., embedded therein, or preferably dispersed therein, an active material arranged to generate molecular hydrogen upon reaction with moisture.

[0128] Suitable polymer matrix materials can be selected based on the solubility of water in the bulk polymer. Suitable polymer matrix materials include, but are not limited to, polyolefins, low-density polyethylene, high-density polyethylene, polypropylene, styrene-ethylene-butylene (SEBS) copolymer, nylon 6, styrene, styrene-acrylate copolymer, and ethylene vinyl acetate. The matrix may be a polymer matrix, and the active material may be dispersed therein.

[0129] In embodiments, the polymer matrix may comprise at least 1 wt%, preferably at least 2 wt%, of the active material. The polymer matrix may comprise less than 70 wt% of the active material. Suitably, the polymer matrix comprises 1-50 wt%, preferably 2-40 wt%, of the active material. The remainder of the material in the polymer matrix may comprise primarily polymeric material.

[0130] In embodiments, the active material may include a metal and / or a hydride. The metal may be one or more of sodium, lithium, potassium, magnesium, zinc, and aluminum. The hydride may be inorganic, such as a metal hydride or borohydride, or may be organic.

[0131] For example, suitable active materials that release molecular hydrogen upon contact with water include, but are not limited to, sodium metal, lithium metal, potassium metal, calcium metal, sodium hydride, lithium hydride, potassium hydride, calcium hydride, magnesium hydride, sodium borohydride, and lithium borohydride.

[0132] Non-limiting examples of other active substances include organic hydrides such as tetramethyldisiloxane and trimethyltin hydride, and metals such as magnesium, zinc, or aluminum.If the reaction rate between the active material and water is too slow, it is expressly contemplated to add a hydrolysis catalyst and / or agent.For example, the hydrolysis rate of silicon hydride can be improved by using hydroxide or fluoride ions, transition metal salts, or noble metal catalysts.

[0133] In embodiments, the active material may also be a polymer matrix. For example, a polymeric silicon hydride such as poly(methylhydro)siloxane provides both a polymer matrix and an active substance that can release molecular hydrogen when in contact with moisture. In embodiments, the active material may be a polymer-bound material such as a polymer-bound borohydride.

[0134] In an embodiment, the moisture scavenging compound and / or active material comprises calcium hydride.

[0135] In embodiment II, the moisture-trapping compound may be inorganic and may be a porous inorganic material suitably arranged to absorb water into pores defined in the material and retain the absorbed water therein. Such moisture-trapping compounds may include one or more of metal silicates (e.g., molecular sieves, magnesium aluminum silicate, or zeolites), fumed silica, amorphous silica (e.g., silica gel), activated alumina, activated carbon, silicon dioxide, mesoporous silica, clay, or bentonite.

[0136] In embodiment III, the moisture scavenging compound may be inorganic and may be an oxide, which may be a Group I or II metal oxide (e.g., sodium oxide or calcium oxide), a mixed metal oxide (e.g., soda lime), or a phosphorus-containing oxide (e.g., phosphorus pentoxide).

[0137] In embodiment IV, the moisture scavenging compound may be inorganic and may be a salt, which may be a salt of a Group I or II metal whose counterion is sulfate (e.g., sodium sulfate or calcium sulfate) or carbonate (e.g., potassium carbonate or magnesium carbonate).

[0138] In embodiment V, the moisture scavenging compound may be inorganic and may be a hydroxide. It may be a Group I or Group II hydroxide (e.g., potassium hydroxide or magnesium hydroxide).

[0139] In embodiment VI, the moisture scavenging compound may be inorganic and may be a halide (eg, calcium chloride or lithium bromide).

[0140] In embodiment VII, the moisture scavenging compound may be a polymeric material, preferably a hygroscopic material, which may include one or more of alcohol- or acrylate-functionalized polymers such as polyvinyl alcohol, ethylene vinyl alcohol, and polyacrylates.

[0141] In embodiment VIII, the moisture scavenging compound may be a hygroscopic bio-based material, which may include, for example, one or more of polycaprolactone (PCL), starch (e.g., corn starch or rice starch), sugar, fiber (e.g., cotton fiber, water hyacinth fiber, sisal fiber, hemp fiber, and agave fiber).

[0142] In embodiments, the moisture scavenging compound may be selected from one or more of anhydrous calcium chloride, soda lime, silicon dioxide, mesoporous silica, magnesium aluminum silicate, molecular sieves, silica gel, and clay.

[0143] In embodiments, the moisture scavenging compound may be selected from one or more of polycaprolactone (PCL), starch, cotton fiber, and water hyacinth fiber.

[0144] If the moisture scavenging compound is particulate, the size of the particles of the compound can be selected to optimize scavenging.

[0145] In embodiments, the compound is preferably in the form of particles.The particle of the compound can have a d50 of less than 50 μm, preferably less than 25 μm, more preferably less than 10 μm, particularly 5 μm or less.In some embodiments, the particle can have a d50 of less than 2 μm.The d50 of the particle can be greater than 10 nm, for example, greater than 20 nm.The d50 can be measured by laser diffraction, for example, using a Beckman Coulter LS230 Laser Diffraction Particle Size Analyzer.

[0146] In embodiments, less than 5 vol%, less than 3 vol%, or less than 1 vol% of the particles have a particle size greater than 100 μm, or greater than 5 μm, as measured by laser diffraction as described herein. Suitably, less than 5 vol% of the particles have a particle size greater than 5 μm. Suitably, more than 5 vol%, preferably more than 25 vol%, more preferably more than 50 vol%, especially more than 75 vol% of the particles have a particle size greater than 20 nm.

[0147] The particle size distribution can be expressed in terms of "span (S)", where S is calculated by the following formula:

[0148] S=(d90-d10) / d50

[0149] Here, d90 represents the particle size where 90% of the volume is made up of particles with a diameter smaller than the stated d90, d10 represents the particle size where 10% of the volume is made up of particles with a diameter smaller than the stated d10, and d50 represents the particle size where 50% of the volume is made up of particles with a diameter larger than the stated d50 value and 50% of the volume is made up of particles with a diameter smaller than the stated d50 value. A particle size distribution of particles with a span (S) of, for example, 0.01 to 10, or 0.01 to 5, or 0.1 to 3 may be preferred.

[0150] moisture scavenging composition

[0151] In embodiments, the moisture scavenging compound may be a component of a moisture scavenging composition.

[0152] Preferably, a moisture scavenging composition including a moisture scavenging compound is provided within the wafer carrier in fluid communication with the interior space.

[0153] The moisture scavenging composition preferably comprises a moisture scavenging compound.

[0154] In embodiments, the moisture-scavenging composition can include a moisture-scavenging compound (e.g., particles thereof) associated with (e.g., dispersed within) a polymer matrix. Examples of polymer matrices include, but are not limited to, polyethylene, low-density polyethylene, linear low-density polyethylene, polypropylene, polyolefin copolymers, polystyrene, polystyrene copolymers, polyacrylate, polymethacrylate, polyester, polyvinyl chloride, fluoropolymers, polyamide, polyetherimide, polyphenylene sulfide, polysulfone, polyacetal, polycarbonate, polyphenylene oxide, polyurethane, thermoplastic elastomer, epoxy, alkyd, melamine, phenolic resin, urea, vinyl ester, liquid crystal polymer, cellulose, thermoplastic starch, polyhydroalkane, polylactic acid, or combinations thereof.

[0155] In particular, particles of the moisture-scavenging compounds of embodiments I-VI may be associated with, eg, dispersed within, a polymer matrix to form at least a portion of a moisture-scavenging composition.

[0156] In addition to the moisture scavenging compound, an oxygen scavenging compound may also be in fluid communication with the interior space.

[0157] Oxygen Scavenging Compounds

[0158] In embodiments, the scavenging compound may be an oxygen scavenging compound.

[0159] Suitable oxygen scavenging compounds can include conventional or commercially available oxygen scavenging compounds. One type of oxygen scavenging compound can be used alone or in combination with one or more other types of oxygen scavenging compounds.

[0160] In embodiments, the oxygen-scavenging compound comprises an oxygen-scavenging segment. For example, the oxygen-scavenging compound can be an oxidizable organic compound. As a further example, the oxygen-scavenging compound can be an oxygen-scavenging polymer or copolymer.

[0161] In embodiment A1, the oxygen-scavenging compound may be an ethylenically unsaturated compound, an amide-containing compound, such as an aliphatic or at least partially aromatic polyamide, and / or a polyester modified by the inclusion of an ether moiety, such as, for example, a polyether-polyester.

[0162] When the oxygen scavenging compound is an ethylenically unsaturated compound, the compound may contain at least two double bonds. For example, it is a poly(ethylenically unsaturated). In embodiments, it is a polymer. For example, it is a polymer comprising repeating units of Formula I:

[0163] -[CH2-CR 1 =CR 2 -CH2-] n (I)

[0164] where R 1 and R 2 represents an optional substituent, which may independently be a hydrogen atom or an optionally substituted alkyl group. In embodiments, n may be greater than 0, greater than 1, greater than 2, greater than 10, greater than 100, or greater than 1000.

[0165] In embodiments, the double bonds in the compounds may be conjugated.

[0166] In embodiment A1, the oxygen scavenging compound may be a polybutadiene-based polymer, a farnesene-based polymer, or a polyisoprene-based polymer. Such polymers, such as polybutadiene-based polymers, may contain terminal -OH, -COOH, or -NH moieties, or may be essentially free of terminal functionality. For example, the polybutadiene-based polymer may include hydroxyl-terminated polybutadiene (PBD-OH) or elastomeric polybutadiene (E-PBD), the latter of which may be essentially free of terminal functionality.

[0167] In embodiment A2, the oxygen-scavenging compound may be a copolymer, in which case it is an oxygen-scavenging copolymer that may include segments of the oxygen-scavenging moiety referred to as "oxygen-scavenging moiety segments" or OSM segments.

[0168] For example, the copolymer may comprise polycondensate segments (and in embodiments, the copolymer comprises predominantly polycondensate segments) and OSM segments (and in embodiments, the copolymer comprises a lower wt% of OSM segments compared to the wt% of the polycondensate segments).

[0169] The OSM segment may be present in any amount necessary to impart the degree of oxygen scavenging capacity required for a particular application. In embodiments, the OSM segment may consist of a polyolefin oligomer segment incorporated into the oxygen scavenging copolymer. However, other oxygen scavenging moiety segments, such as polypropylene oxide oligomers and methyl-pendant aromatic compounds, may also be included in the oxygen scavenging copolymer.

[0170] The OSM segment of the oxygen-scavenging copolymer can be produced by reacting an OSM segment precursor with a polymer (referred to as "polymer X1"), e.g., a polyester. The OSM segment precursor can be at least monofunctionally terminated with a group capable of participating in polycondensation polymerization and / or reacting with a previously formed portion of polymer X1 to form a new covalent bond. Alternatively, the OSM segment precursor can react with a polymer end group to provide a copolymer structure. A functionally terminated OSM segment precursor can be represented by Formula II:

[0171] X-(OSM)-Y (II)

[0172] Although bifunctionality is shown in Formula II as one possibility, the OSM segment precursor may be monofunctionally terminated or functionalized to greater than two degrees. Those skilled in the art will recognize that functionally terminated OSM segment precursors are commercially available, obviating the need for such additional functionalization. The OSM segment precursor of Formula II is preferably selected to be readily oxidizable at ambient temperatures so that its autoxidation does not produce significant volatile or extractable by-products. In embodiments, the OSM segment precursor may comprise a polyolefin oligomer, a polypropylene oxide oligomer, or a methyl-pendant aromatic compound having a molecular weight of 100 to 10,000.

[0173] In embodiments, the OSM segment precursor may include a polybutadiene moiety. When incorporated as a segment into an oxygen-scavenging copolymer, the polybutadiene moiety can advantageously provide suitable oxygen scavenging. For example, such an OSM segment may be derived from an unhydrogenated polybutadiene oligomer having a molecular weight of 1,000 to 3,000. In Formula II, X and Y are typically the same and may be any species capable of participating in polycondensation and / or transesterification with polymer X1. Non-limiting examples of species that may be represented by X or Y include -OH, -COOH, -NH2, epoxides, and substituted derivatives thereof capable of participating in step-growth, condensation, and / or transesterification reactions with polymer X1, for example.

[0174] In one example of embodiment A2, the oxygen-scavenging copolymer may comprise an OSM segment derived from a polyolefin oligomer and / or comprising a polyolefin oligomer chain. In another example, the oxygen-scavenging copolymer may comprise an OSM segment derived from a polybutadiene oligomer and / or comprising a polybutadiene oligomer chain. The OSM segment is preferably covalently bonded to a polyester polymer X1, e.g., a PET segment, of the oxygen-scavenging copolymer.

[0175] In embodiments, the oxygen-scavenging copolymer may contain at least 60 wt%, or at least 75 wt%, polyester segments (e.g., polyethylene terephthalate segments), based on the weight of the oxygen-scavenging copolymer. In embodiments, the oxygen-scavenging copolymer may contain up to 25 wt% OSM segments, e.g., polyolefin oligomer segments, which may be derived from polybutadiene polymers and / or contain polybutadiene oligomer chains. The oxygen-scavenging copolymer suitably contains 75 to 99.5 wt%, or 75 to 85 wt%, or 77 to 82 wt% polyester segments (e.g., polyethylene terephthalate segments), and 0.5 to 25 wt%, or 15 to 25 wt%, or 18 to 23 wt% polyolefin oligomer segments (e.g., derived from polybutadiene polymers and / or containing polybutadiene oligomer chains).

[0176] In embodiment A2, when the oxygen scavenging compound is, for example, a described copolymer comprising copolymerization of an OSM segment into polymer X1, the compound may further comprise a chain extender moiety derived from, for example, an anhydride, for example, an anhydride comprising more than one reactive moiety, such as pyromellitic dianhydride (PMDA) or maleic anhydride. The described chain extenders may facilitate compatibilization of the oxygen scavenger moiety.

[0177] Oxygen Scavenging Composition

[0178] In embodiments, the oxygen scavenging compound may be a component of an oxygen scavenging composition.

[0179] Preferably, an oxygen-scavenging composition including an oxygen-scavenging compound is provided within the wafer carrier in fluid communication with the interior space.

[0180] The oxygen scavenging composition may suitably comprise an oxygen scavenging compound and a catalyst, e.g., a transition metal catalyst, suitable for catalyzing the oxygen scavenging reaction between the oxygen scavenging compound and oxygen that may be present in the wafer carrier during use.

[0181] The catalyst may be in the form of a salt, and the transition metal may be selected from the first, second, or third transition series of the periodic table. Suitable metals and their oxidation states include, but are not limited to, manganese II or III, cobalt II or III, nickel II or III, copper I or II, rhodium II, III, or IV, and ruthenium. Preferably, the catalyst is iron-free. The oxidation state of the metal upon introduction does not necessarily have to be in its active form. The metal may be nickel, manganese, cobalt, or copper, more preferably manganese or cobalt, and even more preferably cobalt. Suitable counterions for the metal include, but are not limited to, chloride, acetate, propionate, oleate, stearate, palmitate, 2-ethylhexanoate, neodecanoate, or naphthenate.

[0182] The transition metal catalyst may be selected from cobalt stearate, cobalt oleate, cobalt linoleate, cobalt acetylacetonate, cobalt neodecanoate, manganese stearate, manganese oleate, manganese linoleate, and manganese acetylacetonate.

[0183] In embodiments, the oxygen scavenging composition may include a transition metal catalyst that is a cobalt catalyst. The catalyst may include an organic counterion. The catalyst may be selected from cobalt stearate, cobalt oleate, cobalt linoleate, and cobalt acetylacetonate.

[0184] The oxygen scavenging composition may contain at least 0.009 wt.%, or at least 0.09 wt.%, of a transition metal catalyst. The composition preferably contains less than 1.50 wt.%, or less than 1.00 wt.%, of a transition metal catalyst. The foregoing amounts preferably refer to the amount of transition metal excluding any counterions, etc.

[0185] In embodiments, the oxygen scavenging composition may contain at least 0.009 wt%, or at least 0.09 wt%, of a cobalt fraction. The composition suitably contains less than 1.50 wt%, or less than 1.00 wt%, of a cobalt fraction.

[0186] In embodiments, the oxygen scavenging composition may contain at least 0.09 wt%, or at least 0.9 wt%, of a transition metal catalyst compound, such as cobalt stearate. The composition suitably contains less than 15.0 wt%, or less than 10.0 wt%, of a transition metal catalyst compound, such as cobalt stearate.

[0187] In embodiments, the oxygen-scavenging composition may comprise a total of at least 50 wt. %, or at least 75 wt. %, or at least 90 wt. % thermoplastic polymer. For example, the thermoplastic polymer may be the oxygen-scavenging compound of embodiments A1 and A2, as well as any of the thermoplastic polymers TP described herein. The composition suitably comprises a total of less than 99 wt. %, or less than 98 wt. % thermoplastic polymer.

[0188] The oxygen-scavenging composition may comprise a thermoplastic polymer TP or a residue of a thermoplastic polymer TP. The thermoplastic polymer TP may differ from the oxygen-scavenging compound in that the thermoplastic polymer TP is not covalently bonded to the oxygen-scavenging compound, or in some embodiments, at least a portion of the oxygen-scavenging polymer may be covalently bonded to the thermoplastic polymer TP, such that, for example, a copolymer is formed between at least a portion of the oxygen-scavenging polymer and the thermoplastic polymer TP (in which case the copolymer may comprise a residue of the thermoplastic polymer TP and a residue of the oxygen-scavenging polymer).

[0189] If the oxygen-scavenging composition is as described in embodiment A1 and includes an oxygen-scavenging compound that does not contain the relevant terminal functionality (e.g., does not contain the described terminal -OH, -COOH, or -NH moieties), the oxygen-scavenging compound may not be covalently bonded to the thermoplastic polymer TP. However, the oxygen-scavenging composition may be made using an oxygen-scavenging compound that does contain the relevant terminal functionality (e.g., the described terminal -OH, -COOH, or -NH moieties), in which case the oxygen-scavenging polymer can be covalently bonded to the thermoplastic polymer TP. In this latter case, the oxygen-scavenging compound may be a copolymer as described in embodiment A2.

[0190] In embodiments, the thermoplastic polymer TP can be polar. For example, the thermoplastic polymer TP can have polar functionality. For example, the thermoplastic polymer TP can include a carbonyl-containing group (e.g., an ester or ketone) or a hydroxyl-containing group (e.g., an alcohol). In embodiments, the thermoplastic polymer TP is thermoplastic. Hansen solubility parameters can be used to select a suitable thermoplastic polymer TP. These parameters are a set of three parameters that numerically describe the ability of a material to dissolve in a selected solvent: the "dispersion" parameter (δ d ) describes the dispersion forces of the material, and the "polarity" parameter (δ p ) describes the polarity of the material, and the "hydrogen bonding" parameter (δ h ) describe the ability of a material to form hydrogen bonds. These parameters provide a quantitative way to distinguish between "polar / non-polar" or "hydrophilic / hydrophobic" materials. If a thermoplastic polymer TP is non-polar or lacks hydrogen bonds (δ p =0 and δ h If the thermoplastic polymer TP is polar or contains hydrogen bonds, relatively high levels of oxygen scavenging may occur.

[0191] In an embodiment, the thermoplastic polymer TP has a molecular weight of δ p >0 and / or δ h>0.

[0192] In embodiments, the thermoplastic polymer TP may be selected from polylactic acid, polyester, polyethylene terephthalate, polycarbonate, polyolefins functionalized with carbonyl / carboxyl groups, In further embodiments, the thermoplastic polymer TP may be selected from polylactic acid and / or polyester, such as polyethylene terephthalate.

[0193] In embodiments, the addition of certain oils to the oxygen scavenging composition can enhance the oxygen scavenging capacity (eg, scavenging rate).

[0194] In embodiments, the oil may be selected from:

[0195] (a) olive oil,

[0196] (b) macadamia oil,

[0197] (c) avocado oil,

[0198] (d) Butaua oil,

[0199] (e) hazelnut seed oil,

[0200] (f) Oil PQ containing:

[0201] (i) less than 25% linoleic acid, and / or

[0202] (ii) less than 10% linolenic acid, and / or

[0203] (iii) greater than 40% oleic acid, and / or

[0204] (iv) more than 40% monounsaturated fatty acids, and / or

[0205] (v) less than 40% polyunsaturated fatty acids, and / or

[0206] (vi) at least 0.1% squalene;

[0207] References herein to "ppm" or "parts per million" (or similar expressions) refer to parts per million of a specified material by weight.

[0208] The percentage of a component in an oil, for example, an oil, can be assessed by GC-HRMS. The analysis can be, for example, as described in "Column Selection for the Analysis of Fatty Acid Methyl Esters; Authors: Frank David, Pat Sandra, Allen K Vickers. Agilent Technologies 5989-3760EN and citations therein. This method involves derivatization of fatty acids to methyl esters, followed by analysis of the fatty acid methyl esters (FAMEs), as described in W.W. Christie, "Gas Chromatography and Lipids, A Practical Guide," (1989), The Oily Press, Ayr, Scotland (ISBN 0-9514171-OX).

[0209] In an embodiment, the oil PQ may have the following characteristics:

[0210] - less than 25% linoleic acid,

[0211] - Less than 10% linolenic acid, and

[0212] - More than 40% oleic acid.

[0213] In an embodiment, the oil PQ may have the following characteristics:

[0214] 1 to 15%, preferably 2 to 10% of linoleic acid,

[0215] 0.1 to 10%, preferably 0.1 to 5%, of linolenic acid, and

[0216] - 40-80%, preferably 45-70% oleic acid.

[0217] In an embodiment, the oil PQ may have the following characteristics:

[0218] - more than 40% monounsaturated fatty acids,

[0219] - less than 40% polyunsaturated fatty acids, and

[0220] - At least 0.1% squalene.

[0221] In an embodiment, the oil PQ may have the following characteristics:

[0222] - 40 to 80%, preferably 45 to 75%, of monounsaturated fatty acids,

[0223] - 3 to 30%, preferably 4 to 15%, of polyunsaturated fatty acids, and

[0224] - 0.1 to 5.0%, preferably 0.1 to 4.0% squalene.

[0225] In embodiments, the oxygen scavenging composition may be in the form of a powder, compressed powder, film, pellet, compressed pellet, or foam, preferably in the form of a powder, compressed powder, or compressed pellet.

[0226] The oxygen scavenging composition (Composition I) may include:

[0227] (i) one or more thermoplastic polymers, wherein the total wt% of the thermoplastic polymers in the composition is in the range of 50 to 99 wt%, or in the range of 80 to 99 wt%, and

[0228] (ii) 0.009 wt% to 1.00 wt%, or 0.09 wt% to 1.00 wt% of a transition metal catalyst.

[0229] Unless otherwise indicated, the balance of the oxygen scavenging composition may include other polymers or additives (eg, oils as described) and / or counterions for the transition metal catalyst.

[0230] The one or more thermoplastic polymers may include one or more oxygen-scavenging compounds, which may include a polymer or copolymer described in embodiment A1 or A2. The oxygen-scavenging composition (composition II) may include:

[0231] (i) one or more oxygen-scavenging compounds, wherein the total wt% of the oxygen-scavenging compounds in the composition is in the range of 50 to 99 wt%, or in the range of 80 to 99 wt%, and

[0232] (ii) 0.009 wt% to 1.00 wt%, or 0.09 wt% to 1.00 wt% of a transition metal catalyst.

[0233] The one or more oxygen-scavenging compounds may include, for example, an ethylenically unsaturated compound that may be included in a polymer or copolymer described in embodiment A1 or A2. In this case, the oxygen-scavenging composition (composition III) may include:

[0234] (i) one or more oxygen-scavenging compounds comprising ethylenically unsaturated compounds, wherein the total wt% of the ethylenically unsaturated compounds in the composition is in the range of 50 to 99 wt%, preferably in the range of 80 to 99 wt%, and

[0235] (ii) 0.009 wt% to 1.00 wt%, preferably 0.09 wt% to 1.00 wt%, of a transition metal catalyst.

[0236] The one or more oxygen-scavenging compounds may comprise polybutadiene or residues of polybutadiene (collectively referred to herein as "polybutadiene-based compounds"), which may be included in a copolymer, for example, as described in embodiment A1 or A2. In this case, the oxygen-scavenging composition (composition IV) may comprise:

[0237] (i) one or more polybutadiene-based compounds, wherein the total wt% of the polybutadiene-based compounds in the composition is in the range of 50 to 99 wt%, preferably in the range of 80 to 99 wt%, and

[0238] (ii) 0.009 wt% to 1.00 wt%, preferably 0.09 wt% to 1.00 wt%, of a transition metal catalyst.

[0239] Each of the foregoing compositions I-IV may contain 0.09 to 15.0 wt %, for example 0.90 to 10.0 wt %, of a transition metal catalyst compound, for example a cobalt compound such as cobalt stearate.

[0240] In an exemplary embodiment, the oxygen-scavenging composition may contain at least a portion of an ethylenically unsaturated compound, such as polybutadiene, that is not covalently bonded to another polymer (such as polymer X1 and / or any polyester) to form a copolymer. In this case, the oxygen-scavenging composition may contain at least 20 wt%, or at least 30 wt%, or at least 40 wt% of an ethylenically unsaturated compound, such as polybutadiene, that is not copolymerized with polymer X1 and / or any polyester. In some cases, the oxygen-scavenging composition may contain at least 70 wt%, or at least 80 wt%, or at least 90 wt% of an ethylenically unsaturated compound, such as polybutadiene, that is not copolymerized with polymer X1 and / or any polyester. The remainder of such an oxygen-scavenging composition may contain a polyester and / or a catalyst compound.

[0241] In embodiments, the oxygen scavenging composition may include 30-98 wt %, 40-98 wt %, 50-98 wt %, or 80-98 wt % of polybutadiene that is not covalently bonded to another polymer (such as polymer X1 and / or any polyester) to form a copolymer, 0.09-15.0 wt %, e.g., 0.90-10.0 wt %, of a transition metal catalyst compound as described, and 0-60 wt % of a polyester, e.g., PET.

[0242] The described oxygen scavenging compositions may be capable of relatively high oxygen uptake. For example, in the test referred to in Example 4 below, the oxygen uptake may be at least 1 cc per gram of composition. The uptake may be at least 5 or at least 10 cc per gram of composition.

[0243] Method for protecting wafers

[0244] According to one aspect of the present invention, there is provided a method for protecting one or more semiconductor wafers from oxygen and / or moisture contamination, the method comprising the steps of (i) selecting a wafer carrier as described in the first aspect, and (ii) placing the wafers to be protected within an interior space of a wafer carrier housing of the wafer carrier.

[0245] The method may include releasably securing a capture device described herein to a wafer carrier housing. The method may include detaching the capture device from attachment to the wafer carrier housing and / or removing the capture device from the wafer carrier, e.g., after a period of time after the capture capability of the capture device has fallen below a predetermined level. The capture device may then be refilled with a capture agent compound and / or a capture agent composition, and the capture device may be reassembled and / or re-engaged to the wafer carrier, or a new capture device may be engaged with the wafer carrier and, e.g., attached to the wafer carrier housing.

[0246] In embodiments, the method may extend to protecting one or more semiconductor wafers from moisture contamination and oxygen contamination.

[0247] Used to protect wafers

[0248] According to one aspect of the present invention there is provided a use of a wafer carrier as described according to the first aspect for protecting one or more semiconductor wafers from moisture contamination.

[0249] In embodiments, uses may extend to protecting one or more semiconductor wafers from moisture and oxygen contamination.

[0250] New Capture Device

[0251] According to one aspect of the present invention, there is provided a novel capture device for cooperating with a wafer carrier housing of a wafer carrier, the capture device having any of the features of the capture device according to the first aspect.

[0252] The capture device may have any feature or combination of features described for the capture device of the first aspect. A wafer carrier, for example a FOUP, may be arranged to cooperate with a capture device of the type described herein.

[0253] Exemplary embodiments of the present invention will now be described with reference to the accompanying drawings, Figures 1 to 27, in which the same or similar parts may be marked with the same reference numerals.

[0254] Exemplary Embodiment A

[0255] 1-3, capture device 2 includes pouch 4 that is filled with a loose charge of powder / pellets of capture material 6. After filling, as shown in FIG. 1, pouch 4 is sealed along top edge 8 that incorporates die-cut hole 10, through which the pouch can be suspended from a corresponding fastener located on the inside of door 12 of FOUP 14 (FIG. 3). FIG. 3 shows two capture devices 2 positioned on either side of door 12.

[0256] The pouch 4 is made from a permeable material, such as HDPE, and is positioned so that oxygen and / or moisture can pass through the walls of the pouch and thereby contact the capture material 6, which captures the oxygen and / or moisture.

[0257] As shown in FIG. 3, in a FOUP containing two capture devices, both devices 2 may be positioned to capture oxygen, or both devices 2 may be positioned to capture moisture, or both devices 2 may be positioned to capture both oxygen and moisture by mixing oxygen and moisture scavengers, or one device 2 may be positioned to capture oxygen and the other device 2 may be positioned to capture moisture.

[0258] After the acquisition capacity of the acquisition material 6 within the device 2 is exhausted, the complete device 2 may be replaced or the pouch 4 of the device may be refilled with active acquisition material 6.

[0259] Exemplary Embodiment B

[0260] 4-8, refill 24 includes a semi-permeable outer wall that encloses and retains powder / pellets of capture material 6. Refill 24 is positioned to allow oxygen and / or moisture to permeate through the refill and contact capture material 6, thereby capturing oxygen and / or moisture that may be present within FOUP 14. Molding frame 20 releasably engages refill 24 to provide complete device 22. Molding frame 20 includes lugs 26 for releasably securing complete device 22 to the interior surface of door 12 of FOUP 14.

[0261] Exemplary Embodiment C

[0262] 9-12, capture device 30 includes a molded polypropylene framework 32 supporting permeable mesh panels 34a-34d. Referring to FIG. 9, the framework includes a base panel 34b to which respective side panels 34a and 34d are pivotally attached. Panels 34a, 34b, and 34d are pivotally arranged to define a triangular section that can be closed by pivotable top and bottom panels (not shown), thereby defining the configuration of FIG. 11. Device 30 can be filled with loose fill capture material 6, as illustrated in FIG. 10, before top panel 34d is pivoted to its closed position. Two capture devices 30 can be attached to the inside of door 12 of a FOUP (FIG. 12).

[0263] The permeable mesh panel 34 of the device 30 may be made from HDPE, thereby allowing oxygen and / or moisture to pass through the panel and contact the capture material 6, which may be configured to capture oxygen and / or moisture as described herein.

[0264] Exemplary Embodiment D

[0265] 13-16, capture device 40 includes a polypropylene frame 42. Frame 42 includes a planar back surface 44 to which a closure 46 is pivotally mounted along a pivot 48. Closure 46 includes four openings 50. A capture packet 52 is positioned on base 44 and locked into place by moving closure 46 about pivot 48 to a closed position parallel to base 44, as shown in FIG.

[0266] The capture packet may be made from HDPE and define a receptacle within which the capture material is disposed, the receptacle being arranged to be permeable such that oxygen and / or moisture can pass through the receptacle to contact the capture material, allowing the capture material to capture the oxygen and / or moisture.

[0267] A rear planar surface 54 (FIG. 16) of frame 42 is provided with an adhesive backing 56 for securing device 40 to a planar area inside the door of a FOUP. Advantageously, device 40 can be secured to a conventional FOUP without having to modify the FOUP by incorporating fastening elements (or the like).

[0268] A FOUP may be provided with multiple capture devices 40 as described.

[0269] Exemplary Embodiment E

[0270] 17-18, the capture device includes a duct assembly 60 and a mounting device 62 arranged to cooperate with a modified FOUP 64.

[0271] FOUP 64 includes openings 66 on opposite sides of the FOUP (only the right side is shown in FIG. 17) that provide access to the interior space of the FOUP. Openings 66 are positioned to sealingly engage corresponding respective mounting rings 62. Each ring 62 includes a frame 67 that supports a membrane 68 that is permeable to oxygen and / or moisture.

[0272] Each frame 67 includes a circumferential stepped region positioned to releasably engage an inwardly facing recessed region 70 defined in a respective end of the duct assembly 60 .

[0273] Duct assembly 60 may be made from a semiconductor-grade, high-purity polymer such as polycarbonate, COP, PP, or PE (or any other material that may be used for a FOUP body). Duct assembly 60 is hollow and contains a capture material (not shown) that is in fluid communication with the outside through recessed area 70.

[0274] In use, the mounting devices 62 are engaged within their respective openings 66, and the duct assembly 60 is snapped into place around a portion of the wall 72 of the FOUP. So positioned, oxygen and / or moisture can migrate from the interior space of the FOUP through the openings 66, membrane 68, and recessed area 70 and into the duct assembly 60, where it can be captured by the capture material contained within the duct assembly 60. If the capture capacity of the capture material within the duct assembly 60 deteriorates, the duct assembly can be removed and replaced as needed.

[0275] Exemplary Embodiment F

[0276] 19 , a FOUP 80 includes a circular collar 82 in a sidewall having a grid of openings 84 defined therein to provide access to its interior space from outside the FOUP. A circular cross-sectional puck 86 containing capture material is positioned for engagement within the collar 82 and secured in place by an end cap 88 arranged for releasable threaded engagement with the collar. On the opposite side of the FOUP, a puck 90 and end cap 92 identical to the puck 86 and end cap 88 are provided and secured within a circular collar (not shown) identical to the collar 82 defined on the opposite side of the FOUP. The end caps 88, 92 may be made from a semiconductor-grade, high-purity polymer such as polycarbonate, COP, PP, or PE (or any other material that may be used for a FOUP body).

[0277] The packs 86, 90 may contain a composition including a scavenging material, or alternatively, the packs 86, 90 may include a flexible or rigid receptacle having a scavenging material to restrict and / or prevent passage of the scavenging compound into the interior space, but which is preferably permeable to oxygen and / or moisture.

[0278] Exemplary Embodiment G

[0279] 20 , a rear wall 100 of the FOUP includes a window 102 arranged to releasably engage a capture device that includes an outer molded housing part 104 and an inner molded housing part 106. The inner and outer housing parts 104, 106 are arranged to cooperate to enclose a capture slab 108 and releasably secure the capture device within the window 102.

[0280] The slab 108 includes a composition that includes an acquisition material.

[0281] The outer housing part 104 is substantially impermeable, and the inner housing part 106 includes a permeable region arranged to allow oxygen and / or moisture to pass from the interior space of the FOUP towards and into a capture slab 108 where the oxygen and / or moisture may be captured.

[0282] Referring to FIG. 21 , a rear wall of a FOUP having a space 122 incorporating an outer molded housing part 104, an inner molded housing part 106, and a capture slab 108 arranged to allow fluid communication between the interior space of the FOUP and the capture material.

[0283] Exemplary Embodiment H-1

[0284] 22-24, FOUP 140 includes combined capture device and nitrogen diffuser pairs 142, 144. Each member of pair 142, 144 includes a nitrogen diffuser component 146 and a capture device component 148. Each nitrogen diffuser component 146 includes a chamber configured to cooperate with a nitrogen source arranged to be delivered to the interior space of the FOUP to purge unwanted fluids from the FOUP. Each capture device component 148 includes a chamber containing a capture material, arranged such that gaseous fluids (e.g., oxygen and / or moisture) can pass from the interior space of the FOUP into the capture material, where the gaseous fluids can be captured. The capture material may be a component of a composition including the capture material and may include a solid mass or puck as described for pucks 86, 90.

[0285] Each pair comprising a combined capture device and nitrogen diffuser may be fabricated as a single injection molded piece, with the combination including separate passages for the flow of nitrogen into the FOUP on the one hand and for the passage of oxygen and / or moisture from the FOUP to the capture material of component 148 on the other hand.

[0286] Exemplary Embodiment H-2

[0287] 25-27, FOUP 160 includes spaced apart nitrogen diffusers 162 to which respective capture devices 164 are attached by releasably securable straps 166. Each capture device includes a chamber containing a capture material, which may be provided in a solid mass or puck as described for pucks 86 and 90. The arrangement of the cooperating capture devices and nitrogen diffusers is preferably such that gaseous fluids (e.g., oxygen and / or moisture) can pass from the interior space of the FOUP into the chamber of the capture device, where the gaseous fluid can be captured. This arrangement allows capture devices 164 to be easily replaced or refilled with capture material when needed by removing straps 166. Nitrogen diffusers 162 can provide nitrogen as needed to purge the interior space of the FOUP.

[0288] Advantageously, in the arrangement of Figures 25-27, the capture device may be retrofitted to an existing nitrogen diffuser in a FOUP and can be easily replaced or refilled when necessary.

[0289] All documents cited herein are incorporated herein by reference in their entirety unless otherwise specified. The citation of any document should not be construed as an admission that it is prior art with respect to any invention disclosed or claimed herein. In the event that any meaning or definition of a term in this document conflicts with any meaning or definition of the same term in a document incorporated by reference, the meaning or definition assigned to that term in this document shall control.

[0290] The present invention is not limited to the details of the foregoing embodiments. It will be apparent that modifications and variations are possible without departing from the scope of the present disclosure, as defined in the appended claims. Although certain aspects of the present disclosure are identified herein as preferred or particularly advantageous, it is contemplated that the present disclosure is not necessarily limited to these aspects. The present invention extends to any novel one or any novel combination of features disclosed herein (including this specification and the appended claims, abstract, and drawings), or any novel one or any novel combination of steps of any method or process so disclosed.

Claims

1. (a) a wafer carrier housing having an interior space; and (b) a capture device having a capture compound in fluid communication with the interior space; a wafer carrier including:

2. The wafer carrier of claim 1 , wherein at least one semiconductor wafer resides within the interior space.

3. 3. The wafer carrier of claim 1 or claim 2, wherein the capture device includes a retention component that retains the capture compound within a predetermined volume, the retention component restricting and / or preventing the capture compound from passing outside the capture device.

4. A wafer carrier as described in any preceding claim, wherein the capture device includes a holding component that holds the capture compound within a predetermined volume, the holding component (a) including a receptacle that houses the capture compound, and / or (b) being constructed of a polymeric material, the capture compound being embedded in the polymeric material, and the capture compound forming a solid mass with the polymeric material.

5. The wafer carrier of claim 3 or claim 4, wherein the capture device and / or the holding component includes a barrier positioned between the interior space and the capture compound.

6. 6. The wafer carrier of claim 5, wherein the barrier (a) restricts and / or prevents the capture compound from passing out of the capture device and into the interior space, and (b) is permeable to oxygen and / or moisture such that oxygen and / or moisture pass from the interior space to the capture compound.

7. 10. A wafer carrier according to any preceding claim, wherein the capture compound is in the form of (a) particles having a particle size of at least 2 μm, for example in the range of 2 to 1000 μm, and / or (b) pellets or granules having a largest dimension of at least 1 mm, for example in the range of 1 to 10 mm.

8. 10. The wafer carrier of any preceding claim, wherein the capture device and / or the holding component are releasably secured to the wafer carrier housing.

9. 10. The wafer carrier of any preceding claim, wherein the capture device is positioned within the interior space.

10. the capture device includes a first fixation element for releasably fixing the capture device at a position within the interior space; (a) the first fixation element cooperates with a second fixation element positioned within the interior space to releasably fix the capture device in the position; or 10. The wafer carrier of claim 9, wherein (b) the first securing element has a surface, optionally including an adhesive area, for contacting an area within the interior space to releasably secure the capture device in the position.

11. 11. The wafer carrier of claim 9 or claim 10, wherein the capture device comprises a flexible receptacle, e.g., a pouch, that acts as the holding component and includes a barrier that restricts and / or prevents the capture compound from passing out of the capture device and into the interior space.

12. 11. The wafer carrier of claim 9 or claim 10, wherein the capture device comprises a frame arranged to releasably engage with a permeable refill unit that acts as the retention component and includes a barrier that restricts and / or prevents the capture compound from passing out of the capture device and into the interior space.

13. 11. A wafer carrier as described in claim 9 or claim 10, wherein the capture device includes a set of cooperable panels, each cooperable panel including a substantially rigid framework and at least one permeable region, the set of cooperable panels arranged to define a hollow receptacle, the receptacle acting as the retaining component and including a barrier that restricts and / or prevents the capture compound from passing out of the capture device and into the interior space.

14. 11. A wafer carrier as described in claim 9 or claim 10, wherein the capture device includes a capture agent housing arranged to releasably engage a flexible receptacle, e.g., a pouch, the flexible receptacle acting as the retention component and including a barrier that restricts and / or prevents the capture compound from passing out of the capture device and into the internal space.

15. The wafer carrier of claim 9 , wherein the wafer carrier includes a nitrogen diffuser, and the capture device is attached to the nitrogen diffuser.

16. 16. The wafer carrier of claim 15, wherein the nitrogen diffuser includes a nitrogen chamber positioned within the wafer carrier housing, in fluid communication with a source of nitrogen, and arranged to deliver the nitrogen to the interior space of the wafer carrier housing, and the capture device includes a capture chamber containing the capture compound and in fluid communication with the interior space of the wafer carrier housing.

17. 17. The wafer carrier of claim 16, wherein the wafer carrier includes a first passageway separate from a second passageway, the first passageway for the flow of nitrogen from the nitrogen source to the interior space, and the second passageway for the flow of oxygen and / or moisture from the interior space to the scavenging compound.

18. The wafer carrier of any one of claims 1 to 8, wherein the capture device is positioned outside the interior space.

19. 20. The wafer carrier of claim 18, wherein the capture device includes a capture agent housing positioned outside the wafer carrier housing, the capture compound being contained within the capture agent housing, and optionally the capture compound being in the form of particles, the particles flowing freely within the capture agent housing but restricted from passing from within the capture agent housing into the interior space.

20. 20. The wafer carrier of claim 18 or claim 19, wherein the capture device comprises a solid body containing the capture compound, the solid body positioned outside the interior space and releasably secured to an opening in a wall of the wafer carrier housing, a porous member positioned within the opening between the interior space and the solid body, and optionally the solid body having a thickness C and a maximum dimension D, wherein the ratio of dimension D divided by thickness C is at least 5 and less than 100 or less than 50.

21. 21. The wafer carrier of claim 18, wherein the capture device comprises a solid body releasably secured to an opening in a wall of the wafer carrier housing and containing the capture compound, the solid body being a component of a capture assembly comprising first and second housing parts arranged with the solid body positioned therebetween.

22. 10. The wafer carrier of claim 9, wherein the scavenging compound is a moisture scavenging compound and / or is a component of a moisture scavenging composition, and / or the scavenging compound is an oxygen scavenging compound and / or is a component of an oxygen scavenging composition.

23. 10. A method for protecting semiconductor wafers from contamination by oxygen and / or moisture, the method comprising the steps of: (i) providing a wafer carrier according to any preceding claim; and (ii) placing the semiconductor wafers within the interior space.

24. Use of a wafer carrier according to any one of claims 1 to 22 for protecting semiconductor wafers from contamination by oxygen and / or moisture.

25. 10. A capture device for cooperating with a wafer carrier, said capture device including one or more features disclosed herein.

26. The capture device comprises: (a) Figures 1 to 3; (b) Figures 4 to 8; (c) Figures 9 to 12; (d) Figures 13 to 16; (e) Figures 17-18; (f) FIG. 19, (g) Figures 20-21; (h) Figures 22-24, and / or (i) Figures 25 to 27 26. The capture device of claim 25, comprising one or more features set forth in any of the following:

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