Detachable connectors for co-packaging optical elements

Abstract

Systems, devices, and methods are described for a detachable fiber connector (FC) for optical coupling based on coarse and fine alignment. A photonic plug can be inserted horizontally into a receptacle and coarsely aligned with a photonic integrated circuit (PIC). The photonic plug can be moved vertically toward the PIC. First fine alignment features of the photonic plug can engage second fine alignment features associated with the PIC, aligning the photonic plug and the PIC. Systems, mechanisms, and methods for retaining and releasing the detachable connector are also described.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of and priority to U.S. Provisional Patent Application No. 63 / 488,336, filed March 3, 2023, and U.S. Provisional Patent Application No. 63 / 491,756, filed March 23, 2023, the entire contents of which are incorporated herein by reference in their entirety. [Background technology]

[0002] In optical coupling, optical components optically coupled to a photonic integrated circuit (PIC) (e.g., a silicon photonic (SiPh) chip) are often connected to the PIC via a permanent attachment method, such as via bonding (e.g., via adhesive or epoxy). However, directly bonding optical components to the PIC can be associated with various drawbacks. Summary of the Invention

[0003] The following summary presents a simplified overview of certain features. This summary is not an extensive overview and is not intended to identify key or critical elements.

[0004] Systems, devices, and methods for a detachable fiber connector (FC) for optical coupling to a chip are described. The detachable FC can be based on, for example, coarse and fine alignment. The disclosed technology can utilize lateral (e.g., horizontal) insertion of the FC, vertical movement for FC engagement with a photonic integrated circuit (PIC), and then a retention (e.g., pressing, holding, engaging, etc.) mechanism to secure or release the FC from the chip. By using a detachable optical connection, advantages can be achieved, such as easy assembly / disassembly, replacement, expansion, and / or maintenance, as well as maintaining a relatively thin form factor and maintaining connection alignment for integration with a chip package.

[0005] These and other features and advantages are described in more detail below. [Brief explanation of the drawings]

[0006] [Figure 1] 1 illustrates an exemplary photonic integrated circuit (PIC) connected to a package substrate and a main board, in accordance with one or more aspects of the present disclosure. [Figure 2A] 1 shows an exemplary PIC connected to a package substrate. [Figure 2B] 2B illustrates the example PIC of FIG. 2A and a bottom-side optical coupler receptacle attached to a package substrate, in accordance with one or more embodiments of the present disclosure. [Figure 2C] 1 illustrates an alternative configuration of an exemplary bottom side optical coupler receptacle, according to one or more aspects of the present disclosure. [Figure 3] 1 illustrates a cross-sectional view of a detachable connector 300 according to one or more embodiments of the present disclosure. [Figure 4] 1 illustrates an exemplary uninstalled removable connector according to one or more aspects of the present disclosure. [Figure 5A] 1A-1D illustrate different views of an exemplary plug assembly according to one or more aspects of the present disclosure. [Figure 5B] 1A-1D illustrate different views of an exemplary plug assembly according to one or more aspects of the present disclosure. [Figure 6A] 1A-1D illustrate various views of an exemplary receptacle, according to one or more aspects of the present disclosure. [Figure 6B] 1A-1D illustrate various views of an exemplary receptacle, according to one or more aspects of the present disclosure. [Figure 6C] 1A-1D illustrate various views of an exemplary receptacle, according to one or more aspects of the present disclosure. [Figure 7] 1 illustrates an exemplary detachable connector in a seated configuration, according to one or more aspects of the present disclosure. [Figure 8A] 10 illustrates an exemplary alternative plug assembly retention feature, according to one or more aspects of the present disclosure. [Figure 8B] 10 illustrates an exemplary alternative plug assembly retention feature, according to one or more aspects of the present disclosure. [Figure 8C] 10 illustrates an exemplary alternative plug assembly retention feature, according to one or more aspects of the present disclosure. [Figure 8D] 10 illustrates an exemplary alternative plug assembly retention feature, according to one or more aspects of the present disclosure. [Figure 8E] 10 illustrates an exemplary alternative plug assembly retention feature, according to one or more aspects of the present disclosure. [Figure 9A] 1 illustrates an exemplary PIC, package substrate, and mainboard arrangement in accordance with one or more aspects of the present disclosure. [Figure 9B] 1 illustrates an exemplary PIC, package substrate, and mainboard arrangement in accordance with one or more aspects of the present disclosure. [Figure 9C] 1 illustrates an exemplary PIC, package substrate, and mainboard arrangement in accordance with one or more aspects of the present disclosure. [Figure 9D] 1 illustrates an exemplary PIC, package substrate, and mainboard arrangement in accordance with one or more aspects of the present disclosure. [Figure 9E] 1 illustrates an exemplary PIC, package substrate, and mainboard arrangement in accordance with one or more aspects of the present disclosure. [Figure 9F] 1 illustrates an exemplary PIC, package substrate, and mainboard arrangement in accordance with one or more aspects of the present disclosure. [Figure 9G] 1 illustrates an exemplary PIC, package substrate, and mainboard arrangement in accordance with one or more aspects of the present disclosure. [Figure 10] 1 illustrates a top view of an exemplary receptacle, underlying PIC, and package substrate, in accordance with one or more aspects of the present disclosure. [Figure 11] 1 illustrates a perspective view of an exemplary receptacle, underlying PIC, and uninstalled plug assembly, in accordance with one or more aspects of the present disclosure. [Figure 12] 1 illustrates a top view of an exemplary receptacle and underlying PIC and package substrate, according to one or more aspects of the present disclosure. [Figure 13] 1 illustrates an exemplary receptacle and uninstalled plug assembly according to one or more aspects of the present disclosure. [Figure 14A] 1 illustrates an exemplary take-away plug assembly according to one or more aspects of the present disclosure. [Figure 14B] 1 illustrates an exemplary photonic plug and an exemplary plug cover with fine alignment features. [Figure 15A] 1 illustrates an exemplary plug assembly and an exemplary receptacle in an exemplary closed and installed state, according to one or more aspects of the present disclosure. [Figure 15B] 1 illustrates an exemplary plug assembly and an exemplary receptacle in an exemplary closed and installed state, according to one or more aspects of the present disclosure. [Figure 16] 1 illustrates an exemplary plug assembly according to one or more aspects of the present disclosure. [Figure 17] 1 illustrates an exemplary open receptacle without a plug assembly, according to one or more aspects of the present disclosure. [Figure 18] 1 illustrates an alternative configuration of a detachable connector according to one or more aspects of the present disclosure. [Figure 19A] 1A-1D illustrate various views of an exemplary alternatively configured plug assembly according to one or more aspects of the present disclosure. [Figure 19B] 1A-1D illustrate various views of an exemplary alternatively configured plug assembly according to one or more aspects of the present disclosure. [Figure 19C] 1A-1D illustrate various views of an exemplary alternatively configured plug assembly according to one or more aspects of the present disclosure. [Figure 20] 1 illustrates a perspective view of an exemplary receptacle and plug assembly according to one or more aspects of the present disclosure. [Figure 21] 1 illustrates a coarse alignment feature between a receptacle and a plug, according to one or more embodiments of the present disclosure. [Figure 22] 1 illustrates a plug installed in a receptacle according to one or more embodiments of the present disclosure. [Figure 23A] 1 illustrates an example of a fine alignment feature, according to one or more aspects of the present disclosure. [Figure 23B]1 illustrates an example of a fine alignment feature, according to one or more aspects of the present disclosure. [Figure 24] FIG. 1 illustrates a bottom view of an exemplary photonic plug having three v-grooves, according to one or more embodiments of the present disclosure. [Figure 25] 1 illustrates a receptacle and a plug in a mated position according to one or more aspects of the present disclosure. [Figure 26] 1 illustrates a receptacle with an adjustable pin according to one or more embodiments of the present disclosure. [Figure 27A] 1A-1D show various views of a locking mechanism according to one or more aspects of the present disclosure. [Figure 27B] 1A-1D show various views of a locking mechanism according to one or more aspects of the present disclosure. [Figure 27C] 1A-1D show various views of a locking mechanism according to one or more aspects of the present disclosure. [Figure 27D] 1A-1D show various views of a locking mechanism according to one or more aspects of the present disclosure. [Figure 28A] 10 illustrates an alternative exemplary retention mechanism according to one or more aspects of the present disclosure. [Figure 28B] 10 illustrates an alternative exemplary retention mechanism according to one or more aspects of the present disclosure. [Figure 29A] 1A-1D illustrate top and bottom views of an exemplary leaf spring retention mechanism, according to one or more aspects of the present disclosure. [Figure 29B] 1A-1D illustrate top and bottom views of an exemplary leaf spring retention mechanism, according to one or more aspects of the present disclosure. [Figure 30A] 1 illustrates an exemplary self-aligning mechanism according to one or more aspects of the present disclosure. [Figure 30B] 1 illustrates an exemplary self-aligning mechanism according to one or more aspects of the present disclosure. [Figure 31] 1 illustrates an exemplary detachable connector according to one or more aspects of the present disclosure. [Figure 32] 1 illustrates a microaligner on a PIC, according to one or more embodiments of the present disclosure. [Figure 33] 1 illustrates a receptacle over a PIC and a microaligner, according to one or more embodiments of the present disclosure. [Figure 34] 1 illustrates a plug assembly and a receptacle in a sliding position according to one or more aspects of the present disclosure. [Figure 35] 1 illustrates a plug and socket in a mated position according to one or more aspects of the present disclosure. [Figure 36] 1 illustrates a bottom view of an exemplary plug assembly according to one or more aspects of the present disclosure. [Figure 37] 1 illustrates a bottom view of an exemplary plug assembly according to one or more aspects of the present disclosure. [Figure 38] 1 illustrates an example of a removable plug assembly in a receptacle according to one or more aspects of the present disclosure. [Figure 39] 1 illustrates a removable plug during extraction, according to one or more embodiments of the present disclosure. [Figure 40] 1 illustrates an exemplary optical scheme according to one or more embodiments of the present disclosure. [Figure 41] 1 illustrates an exemplary method for achieving a detachable optical connection between one or more optical fibers and a PIC, according to one or more aspects of the present disclosure. [Figure 42] 1 illustrates an exemplary method for disconnecting a detachable photonic plug from a receptacle and a PIC, according to one or more aspects of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0007] The accompanying drawings, which form a part of this specification, illustrate embodiments of the present disclosure. It should be understood that the embodiments illustrated in the drawings and / or described herein are non-exclusive and that there are other embodiments of how the present disclosure may be practiced.

[0008] FIG. 1 illustrates an exemplary photonic integrated circuit (PIC) 102 connected to a package substrate 104 (e.g., an organic substrate, a printed circuit board (PCB), other substrate, etc.) and a main board 106 in accordance with one or more aspects of the present disclosure. The PIC 102 may be in one or more electrical and / or optical connections with the package substrate 104 and / or the main board 106. Such electrical and / or optical connections may be facilitated by active and / or passive electrical and / or optical elements. For example, electrical and / or optical connections between components may be facilitated by electrical and / or optical vias, solder bumps, electrical traces, etc. Additionally or alternatively, the package may include an electrical interposer (see, e.g., electrical interposer 902 in FIG. 9B ) substrate disposed between the PIC 102 and the package substrate 104. The electrical interposer 902 may additionally host one or more electronic integrated circuits (EICs) (see, e.g., EIC 904 in FIG. 9B ). The electrical interposer 902 may facilitate electrical connections between the PIC 102 and the package substrate 104. The electrical interposer 902 may additionally facilitate electrical connections between any combination of the PIC 102, the package substrate 104, and one or more EICs 904 hosted on the electrical interposer.

[0009] The mainboard 106 may comprise, for example, an electronic integrated circuit (EIC) (e.g., an application specific integrated circuit (ASIC)), an interposer, a multi-chip module (MCM), a printed circuit board (PCB), or any other optical and / or electronic interconnection medium and / or substrate.

[0010] Optical components may be optically coupled to the PIC 102. Examples of optical components may include, but are not limited to, optical waveguides, optical fibers (e.g., single mode fiber, multimode fiber, few mode fiber, SiPh chips, other PICs, etc.), lasers, grating couplers, etc. Optical components may be optically coupled to the PIC 102 via optical couplers. Examples of optical couplers may be found in commonly assigned U.S. patent application Ser. No. 17 / 989,303 and U.S. patent application Ser. No. 17 / 512,200, the contents of both applications of which are incorporated herein by reference in their entireties.

[0011] 1 , depending on packaging concerns and configuration, it may be advantageous to connect optical components to the bottom side of the PIC 102 (e.g., the side closest to the package substrate 104 and / or main board 106). Such bottom-side connections may reduce the overall package footprint. For example, the PIC 102 may be suspended above the package substrate 104 and / or main board 106. Optical components (e.g., optical fibers) may be connected to the bottom side of the PIC 102 (e.g., via photonic plugs 108).

[0012] 2A shows an example PIC 102 connected to a package substrate 104. Referring to FIG. 2A, the PIC 102 may have one or more termination components 206. The PIC termination components may be referred to as, for example, transceivers, transmitters / receivers, and / or PIC input / output components. The PIC termination component 206 may include, for example, a waveguide, a grating coupler, a reflective element (e.g., a turning mirror, a turning curved mirror (TCM), a laser, etc. Referring to FIG. 2A, the PIC termination component 206 may be located on the underside of the PIC 102. Alternatively, the mating surface of the PIC 102 (e.g., for mating with the mating surface of the photonic plug 108) may be on the underside of the PIC 102, but the PIC termination component 206 may be elsewhere on or on the PIC 102. (In an alternative configuration, the mating surface of the PIC 102 may be on its top side, as shown and described with respect to FIGS. 13-17, for example.) (Additionally, those skilled in the art will recognize that the bottom side, underside, etc. may be located on the underside of the PIC 102.) It will be appreciated that the terms side, top side, and top surface (and the like) are used for descriptive purposes only and should not be understood as limiting. FIG. 2B illustrates a bottom-side optical coupler receptacle 202 attached to the example PIC 102 and package substrate 104 of FIG. 2A in accordance with one or more aspects of the present disclosure. With reference to FIG. 2B, the receptacle 202 may be attached (e.g., bonded) to the top side of the PIC 102 (which in FIG. 2B is hidden between the receptacle 202 and the package substrate 104). Additionally or alternatively, the receptacle 202 may contact the PIC 102 but may not be bonded to the PIC 102.

[0013] FIG. 2C illustrates an alternative configuration of an exemplary bottom-side optical coupler receptacle 202. Referring to FIG. 2C, the receptacle 202 may not cover the PIC 102. According to such a configuration, the receptacle may be attached to one or more sides of the package substrate 104 and / or main board (not shown) and / or the PIC 102. The receptacle 202 may include a cutout to accommodate the PIC 102. The receptacle may include one or more sockets 204 to facilitate removable connection of optical components (e.g., attached photonic plugs and / or plug assemblies), as described below. The sockets 204 may include horizontal rails 210 and vertical rails 212. The horizontal rails 210 and vertical rails 212 may aid in installation of photonic plugs and / or plug assemblies into the sockets 204, as described below.

[0014] The receptacle 202 may be affixed to the main board 106, the package substrate 104, and / or the PIC 102, for example, via one or more of adhesive, solder bumps, or mechanical anchoring. The receptacle 202 may be precisely positioned relative to the PIC 102 (e.g., a SiPh chip). The precise placement may be achieved, for example, via pick-and-place techniques. Such techniques may use alignment marks and / or the PIC 102 die edge to assist in precisely placing the receptacle 202. Referring to FIG. 2B , the receptacle 202 may include one or more receptacle sight / mounting holes 208. The receptacle sight / mounting holes 208 may be used, for example, to ensure proper alignment of the receptacle 202 relative to the underlying PIC 102, the package substrate 104, and / or the main board 106. Additionally, after placement of the receptacle 202 (and, for example, positioning the receptacle to finely align it with the underlying substrate), adhesive and / or epoxy may be flowed into the receptacle viewing / mounting hole 208 to bond the receptacle 202 in place.

[0015] Detachable connectors, systems for detachable connections, and methods for detachable connections are described herein. FIG. 3 illustrates a cross-sectional view of a detachable connector 300 according to one or more aspects of the present disclosure. The PIC 102 may have a first side (e.g., a front side). The receptacle 202 may have a first side. The first side of the receptacle 202 may abut the first side of the PIC 102. In this manner, the receptacle 202 and its components (e.g., socket 204) may be aligned (e.g., roughly aligned) with the PIC termination component 209. The receptacle 202 may receive, for example, one or more plug assemblies 306 (described in further detail below) within the socket 204.

[0016] FIG. 4 illustrates an exemplary uninstalled, removable connector according to one or more aspects of the present disclosure. Referring to FIG. 4 , receptacle 202 may include one or more sockets 204. Socket 204 may be configured to receive an optical component (e.g., via plug assembly 306). For example, the optical component may be connected to plug assembly 306. Plug assembly 306 may mate with and / or connect to socket 204. Socket 204 may receive plug assembly 306 and / or an optical component (not shown in FIG. 4 , but see FIG. 5A showing optical fiber 502). Socket 204 may be further configured to align the optical component connected to plug assembly 306 with PIC termination component 206 to facilitate an optical connection between PIC 102 and the optical component. While FIG. 4 illustrates a single socket receptacle 202, receptacle 202 may include any number of sockets 204 for receiving any number of plug assemblies 306.

[0017] The receptacle 202 may be connected to the PIC102, the package substrate 104, and / or the main board 106 in any number of ways. For example, the receptacle 202 may be bonded to the PIC102. The receptacle 202 may be bonded to the PIC102, for example, via one or more structural adhesives (e.g., epoxy, paste, etc.). The receptacle 202 may be connected to the PIC102 in any number of other ways. For example, the receptacle 202 may be clipped to the PIC102 (e.g., using mechanically complementary components), clamped to the PIC102, soldered to the PIC102, magnetized in place relative to the PIC102, etc., or made from the same material as the PIC102, for example. Additionally or alternatively, the receptacle 202 may be secured to the PIC102, for example, via an intermediate substrate. For example, the intermediate substrate may be soldered and / or otherwise attached on a first side to the PIC 102, and the intermediate substrate may be soldered or otherwise attached on a second side to the receptacle 202. Although the receptacle 202 is described above as being connected to the PIC 102, the receptacle 202 may additionally or alternatively be connected to the package substrate 104 and / or the main board 106.

[0018] The receptacle 202 may be configured to aid in heat dissipation from the PIC 102 (e.g., as a heat sink). Accordingly, the receptacle 202 may include features to improve its heat sinking capabilities (e.g., heat sink fins of any nature). Additionally, the portion of the receptacle 202 attached to the PIC 102 may include a material with a relatively high thermal conductivity (e.g., copper, aluminum, other metals, etc.). Thermal paste may be used between the receptacle 202 and the PIC 102 to further improve the heat sinking aspects of the receptacle 202. Thermal paste may be used alone and / or in conjunction with an adhesive. The receptacle 202 may include one or more materials (e.g., metal or metal and plastic). For example, the portion covering the PIC 102 may include one material (e.g., metal), while the portion including the socket 204 may include a second material (e.g., plastic). Accordingly, the receptacle 202 may be manufactured via one or more manufacturing methods. For example, in the case of a fully or partially metal receptacle 202, the metal portion may be CNC machined, stamped, molded, 3D printed, etc. In the case of a fully or partially polymeric receptacle 202, the polymer portion may be, for example, molded, 3D printed, etc.

[0019] 5A and 5B show different views of an exemplary plug assembly 306 in accordance with one or more embodiments of the present disclosure. The plug assembly 306 may include a photonic plug 108. One or more optical components (e.g., optical fiber 502) may be connected to the photonic plug 108. The exemplary photonic plug 108 and additional features are described in more detail in incorporated U.S. Patent Application No. 17 / 989,303. The plug assembly 306 may further include a plug cover 526. The photonic plug 108 may be connected to the plug cover 526. For example, the photonic plug 108 may be glued, clipped, clamped, screwed, press-fit, or otherwise connected to the plug cover 526. The plug cover 526 may include a cavity in which the photonic plug 108 may be maintained. The cavity in the plug cover 526 may include features to aid in retaining and aligning the photonic plug 108 within the plug cover 526. Although the plug assembly 306 is described in detail herein as comprising multiple components, it should be understood that the plug may similarly comprise a single component. The single component may comprise all of the features of the plug assembly 306 described herein. The plug assembly 306 may, for example, comprise a single, integral photonic plug 108 having all of the features of the plug assembly 306. Additionally, the components described may be subdivided into additional components.

[0020] The plug cover 526 may be made from any number of materials. For example, the plug cover 526 may be made from metal. In such a configuration, the plug cover 526 may be CNC machined, molded, 3D printed, or optionally manufactured using any other metal manufacturing method known to those of skill in the art. Additionally or alternatively, the plug cover 526 may be made from a polymer (e.g., plastic, nylon, etc.). In such a configuration, the plug cover 526 may be manufactured using any polymer manufacturing method known to those of skill in the art. Additionally or alternatively, the plug may be made from other materials, such as silicone or epoxy.

[0021] The plug cover 526 may additionally include coarse (e.g., rough) alignment features for aligning the plug assembly 306 within the receptacle socket 204. The alignment features may aid in aligning the plug during installation and / or upon final installation (e.g., when the plug assembly 306 is placed into the receptacle 202). For example, the coarse alignment features may aid in alignment during installation (e.g., sliding in and out of the socket 204) and upon final installation (e.g., sliding up and down the socket 204). For example, the plug cover 526 may include one or more bonded ball bearings 508. Additionally or alternatively, the plug cover 526 may include additional or alternative features (e.g., one or more alignment protrusions 510). The bonded ball bearings 508 and / or alignment protrusions 510 (e.g., vertical protrusions) may assist in sliding (and / or guiding) the receptacle 202 onto the corresponding horizontal rails 210 and / or vertical rails 212 (as described below). Additionally, the plug cover 526 may include features to assist in aligning and retaining the plug assembly 306 when the plug assembly 306 is fully installed (e.g., seated) within the receptacle 202. For example, the plug cover 526 may include one or more alignment protrusions 510. The alignment protrusions 510 may slide within the corresponding horizontal rails 210 and / or vertical rails 212 of the receptacle 202. Although particular alignment and mating features have been described, other alignment and mating features may be utilized, as will be understood by those skilled in the art. Additionally, the receptacle 202 may include alignment and retention features complementary to the alignment and retention features of the plug cover 526. The plug cover 526 may include additional retention features on one or more of its sides, as will be described in more detail.

[0022] The plug assembly 306 may include additional features. For example, the plug assembly 306 may include coarse and / or fine alignment features (e.g., coarse and fine alignment features described elsewhere herein) to align the photonic plug 108 within the plug cover 526. For example, the plug cover 526 may be configured (e.g., shaped) to facilitate coarse alignment of the photonic plug 108 within the plug cover 526. For example, the plug cover 526 may include a recess shaped substantially complementary to the photonic plug 108. Additionally or alternatively, the plug cover may include a sphere or hemisphere, and the photonic plug may include a corresponding v-groove that may mate with the sphere or hemisphere to facilitate fine alignment of the photonic plug 108 within the plug cover 526 (see, e.g., FIG. 14B and associated discussion). The plug cover 526 may additionally include one or more viewing / mounting holes 516 in one or more of its surfaces. The viewing / mounting holes 516 may aid in the placement of the photonic plug 108 within the plug cover 526. For example, the viewing / mounting holes 516 may be used to check and / or adjust the alignment of the photonic plug 108 within the plug cover 526. Additionally or alternatively, after placement (and, e.g., fine-tuning) of the photonic plug 108 within the plug cover 526, adhesive and / or epoxy may be flowed into the holes to hold the photonic plug 108 in place.

[0023] Additionally, as described herein, the photonic plug 108 may be connected to an optical component, such as an optical fiber 502 (and / or, for example, an optical fiber ribbon). As described in more detail in U.S. Patent Application No. 17 / 989,303, incorporated herein, the photonic plug 108 may include various features. For example, the photonic plug 108 may include optical elements (e.g., one or more tilting mirrors and / or one or more optical focusing elements (e.g., curved mirrors)) to assist in self-aligning optical systems with the connected PIC 102. Additionally, the photonic plug 108 may include one or more trenches 514 (e.g., v-grooves). The trenches 514 may receive and assist in the alignment of the optical fiber 502. The optical fiber 502 may be held within the trenches via, for example, a bonding agent (e.g., adhesive, epoxy, etc.).

[0024] The plug assembly 306 may be mechanically configured to accommodate the optical fiber 502. For example, the plug cover 526 may include a recess 512 for accommodating the routed optical fiber 520. Additionally, the plug assembly 306 may further include one or more strain relief features. For example, the plug assembly 306 may further include a rubber grommet that may be placed around the optical fiber 502 attached to the photonic plug 108 (see, e.g., FIG. 16 and associated description). The rubber grommet may provide strain relief for the optical fiber 502, holding the optical fiber 502 in place and resisting movement of the optical fiber (and components attached thereto, e.g., the photonic plug 108) within the plug assembly 306. Additionally or alternatively, other strain relief materials and / or configurations may be used. For example, adhesive, epoxy, and / or other materials may be deposited and / or disposed within the recess 512 to provide retention and / or strain relief for the optical fiber 502 after installation of the optical fiber (e.g., to reduce mechanical pressure on the optical fiber 502 in the region of connection with the photonic plug 108).

[0025] Referring again to FIG. 4 , plug assembly 306 may be installed within receptacle 202. The plug assembly may be slid into socket 204 of receptacle 202. Coarse alignment features of plug assembly 306, e.g., bonded ball bearing 508 and / or alignment protrusion 510, may slide into corresponding structures of socket 204, e.g., horizontal rail 210. When fully inserted into socket 204, plug assembly 306 may be pushed or pulled upward (as described in more detail herein) to its final seated position. Coarse alignment features (e.g., bonded ball bearing 508 and / or alignment protrusion 510) of plug assembly 306, e.g., bonded ball bearing 508 and / or alignment protrusion 510, may slide (e.g., upward) and be guided into corresponding structures of receptacle 202, e.g., vertical rail 212.

[0026] 6A-6C show various views of an example receptacle 202 according to one or more embodiments of the present disclosure. Referring to FIG. 6A, the receptacle 202 may include one or more plug assembly 306 retention features to help securely hold the plug assembly 306 within the socket 204. The plug assembly 306 retention features may additionally or alternatively aid in the optical alignment of the optical elements of the photonic plug 108 and the PIC 102.

[0027] Many different plug assembly 306 retention features are contemplated. For example, the receptacle 202 may include a pre-loaded leaf spring 602 for each socket 204 and / or multiple sockets 204. The leaf springs 602 may be disposed within a cavity in the bottom portion of the receptacle 202. The leaf springs 602 may be within the path of the plug assembly 306. When the plug assembly 306 is inserted into the socket 204, the plug assembly 306 may displace the leaf springs 602, which may return toward their starting position once the plug is fully seated within the socket 204. In this manner, the leaf springs 602 may retain the plug assembly 306 within the socket 204.

[0028] A wire 604 may be connected to the leaf spring 602. The wire 604 may be metal (e.g., steel) or another material capable of accepting sufficient tension. The wire 604 may be routed from the leaf spring 602 to the front side of the receptacle 202. At the front side of the receptacle 202, the wire 604 may be connected to a lever 606. When the lever 606 is displaced (e.g., by being pushed forward or backward), the lever 606 may apply a pulling force to the wire 604, which may in turn apply a pulling force to the spring 602. The pulling force on the spring 602 may displace the spring 602 from the path of the plug assembly 306. While a lever 606 is shown, any method of applying a pulling force to the spring 602 (e.g., a knob) may be used.

[0029] Referring again to FIG. 3 , when plug assembly 306 is installed into socket 204, if plug assembly 306 reaches the area of ​​leaf spring 602 during sliding, plug assembly 306 may push leaf spring 602 out of its path. Alternatively, lever 606 may be pressed (or pulled) to remove leaf spring 602 from the path of sliding plug assembly 306. Upon reaching the end of travel, leaf spring 602 may return (and / or be returned) to its rest position, which may help hold plug assembly 306 in place (e.g., in its seated position). Alternatively, lever 606 may be released to allow leaf spring 602 to return toward its rest position. To this end, plug assembly 306 may include a spring receiving feature. For example, the spring receiving feature may be configured to be mechanically complementary to the surface of leaf spring 602. For example, when the leaf spring 602 is pressed against the spring receiving feature, the leaf spring 602 may help retain the plug assembly 306 in its seated position.

[0030] Additionally, the photonic plug 108, the receptacle 202, and / or the PIC 102 may include fine alignment features. For example, the photonic plug 108 may include one or more v-grooves 302, for example, on its top side. While the v-grooves 302 are described as being disposed on the photonic plug 108, the v-grooves 302 may be disposed on one or more of any surfaces of the plug assembly 306. While the v-grooves 302 are shown as two-dimensional v-grooves 302, they may similarly include three-dimensional v-grooves 302 (e.g., pyramidal shapes). The v-grooves 302 may be precisely fabricated on the photonic plug 108 die, for example, via wafer-level processes (e.g., wafer-level fabrication and / or placement processes). Such processes may simply ensure highly accurate placement of the v-grooves 302 (e.g., fine alignment features) relative to the rest of the photonic plug 108. Although the microscopic alignment features on the side of the photonic plug 108 are described herein as v-grooves 302, they are not so limited. For example, the microscopic alignment features on the side of the photonic plug 108 (e.g., described herein as v-grooves 302) may be shaped and / or configured in other manners. For example, the microscopic alignment features on the side of the photonic plug 108 may be, for example, cup-shaped, u-groove-shaped, trenches of any shape, etc. (e.g., instead of and / or in addition to v-grooves 302).

[0031] In relation to the v-groove 302, the PIC mating surface 308 (e.g., the mating surface of the PIC) to which the photonic plug mating surface 310 (e.g., the mating surface of the photonic plug) may mate may include a sphere 304 and / or a hemisphere. The sphere 304 on the side of the PIC may align with the v-groove 302 on the side of the plug. In the seated position, the plug assembly 306 (and the photonic plug 108 therein) may be pushed and / or pulled toward the mating surface of the PIC 102. For example, the leaf spring 602 may engage with the underside of the plug assembly 306, pushing the plug assembly 306 toward the PIC 102. The v-groove 302 of the plug assembly 306 may engage with the sphere 304 of the PIC 102. The engagement of the sphere 304 with the v-groove 302 may aid in and / or achieve fine alignment between the photonic plug 108 and the PIC 102. Although the sphere 304 is shown as being disposed on the PIC 102, the sphere 304 can be disposed elsewhere (e.g., on the surface of the receptacle 202). The fine alignment features can be configured differently. For example, rod-shaped alignment features can be used instead of or in addition to the sphere 304. While the v-groove 302 is described as being disposed on the side of the photonic plug 108 and the sphere 304 is described as being disposed on the side of the PIC 102, it will be understood that either of the features can be disposed on both sides. Other complementary fine alignment features between the PIC 102 and the plug assembly 306 are contemplated herein. The sphere 304 can be fabricated on the PIC 102 (e.g., a SiPh chip) via wafer-level processes (e.g., wafer-level fabrication and / or placement processes). Such processes can ensure highly accurate placement of the sphere 304 (e.g., fine alignment features) relative to the rest of the PIC (e.g., termination components).

[0032] The plug assembly 306 can be released and removed from the receptacle 202. The steps for removing the plug assembly 306 from the receptacle 202 can be substantially the reverse of the steps for installing the plug assembly 306. For example, the lever 606 can be depressed or pulled, which can cause a pulling force on the wire 604. The pulling force on the wire 604 can cause a pulling force on the leaf spring 602. The leaf spring 602 can be pulled away from the plug assembly 306. The plug assembly 306 can be displaced (e.g., dropped) from its seated position. Fine alignment features on the side of the PIC 102 (e.g., ball 304) and the side of the plug assembly 306 (e.g., v-groove 302) can disengage. The plug assembly 306 can be removed (e.g., slid out) from the receptacle 202.

[0033] Those skilled in the art will appreciate that the stiffness of the leaf spring 602 can be adjusted to optimize various parameters. For example, the stiffness of the leaf spring 602 can be adjusted to account for the force applied to the bottom of the plug assembly 306 and, in turn, the force applied between the mating surfaces (e.g., mating surfaces 308 and 310) of the photonic plug 108 and the PIC 102 and / or the fine alignment features. Accordingly, it may be desirable to configure the leaf spring 602 to apply sufficient force to the plug assembly 306 to engage the fine alignment features (e.g., the v-groove 302 and the sphere 304) without damaging the fine alignment features and / or the mating surfaces. Still further, the stiffness of the leaf spring 602 can be adjusted to account for material deformation under the spring force. Accordingly, the materials used in the plug assembly 306 and / or the receptacle 202 can be considered when designing the stiffness of the leaf spring 602. Additionally, the stiffness can be adjusted to account for the force required to displace the lever 606 (and, in turn, the leaf spring 602). The size of the lever arm may also be adjusted to account for these forces (eg, the lever arm may be elongated to reduce the input force required on the lever 606 to displace the leaf spring 602).

[0034] FIG. 7 illustrates an exemplary detachable connector in a seated configuration according to one or more embodiments of the present disclosure.

[0035] 8A-8C illustrate retention features of an exemplary alternative plug assembly 306 according to one or more embodiments of the present disclosure. Referring to FIG. 8A, a magnet may be used to retain the plug assembly 306 in its seated position within the receptacle 202. The receptacle 202 may include one or more first magnets 802 (and / or magnetically attracted elements). The first magnets 802 may be disposed within a first magnet assembly 804. The first magnet assembly 804 may be rotationally mated to the receptacle 202 (e.g., via a hinge, etc.). The first magnet assembly 804 may rotate toward and away from the plug assembly 306. Alternatively, the first magnet assembly 804 may be slidably mated to the receptacle 202 and may be slid toward and away from the plug assembly 306. Alternatively, the first magnet 802 may be fixed (e.g., as shown in FIGS. 8D and 8E), and one or more second magnets 806 (and / or magnetically attracted elements) may be disposed within and / or on the plug assembly 306.

[0036] As described above, the plug assembly 306 can be slid into the socket 204 of the receptacle 202. The first magnet 802 (e.g., of the first magnet assembly 804) can be moved (e.g., rotated, slid) toward the plug assembly 306. The first magnet 802 can be attracted to the second magnet 806 (e.g., the second magnet 806) of the plug assembly 306. An attractive magnetic force can apply a force to the plug assembly 306 toward the first magnet 802. Additionally, the attractive magnetic force can apply a force to the plug assembly 306 toward the PIC 102. The attractive force can aid in fine alignment of the plug assembly 306 (e.g., the photonic plug 108) with the PIC 102 (e.g., the PIC termination component 206). For example, as described above, a pulling force may move the plug assembly 306 toward the PIC 102 (e.g., toward a seated configuration), and fine alignment features on the side of the PIC 102 (e.g., ball 304) and the side of the plug assembly 306 (e.g., v-groove 302) may engage.

[0037] 8B and 8C , other retention features are contemplated. For example, the plug assembly 306 may include a plug spring assembly 808, which may include a plug spring 810. The plug spring 810 may be disposed above (and / or below) the photonic plug 108 and / or a portion of the plug assembly 306. When the plug assembly 306 is installed in the socket 204 of the receptacle 202, the plug spring assembly 808 may contact a surface of the receptacle 202. The plug spring 810 may deform and apply a force to the surface of the receptacle 202. Thus, a force applied to the surface of the receptacle 202 may pull (or push) the plug assembly 306 toward the PIC 102. Similar to the alternative retention features, a force applied to the plug assembly 306 in the direction of the PIC 102 can aid in fine alignment of the photonic plug 108 (e.g., the v-groove 302) and the PIC 102 (e.g., the corresponding sphere 304 and / or hemisphere). The surface of the receptacle 202 that contacts the plug spring 810 can further include features that mate with the plug spring 810. For example, the surface of the receptacle 202 can include a recess into which the spring 810 can mate (e.g., fit) to further aid in retaining the plug assembly 306 within the receptacle socket 204.

[0038] Those skilled in the art will appreciate that the stiffness of the plug spring 810 can be adjusted to optimize various parameters. For example, the stiffness of the spring 810 can be adjusted to account for the force applied to the bottom of the plug assembly 306 and the force in turn applied between the mating surface of the photonic plug 108 and the PIC 102 (e.g., micro-alignment features). Thus, it may be desirable to configure the spring 810 to apply sufficient force to the plug assembly 306 to engage the micro-alignment features without damaging the micro-alignment features and / or the mating surface. Still further, the stiffness of the spring 810 can be adjusted to account for material deformation under the spring force.

[0039] FIG. 8D illustrates an alternative configuration of the detachable optical coupler 300 according to one or more embodiments of the present disclosure. Referring to FIG. 8D , the first magnet 802 and / or the second magnet 806 may be fixed. The first magnet 802 may be disposed within the receptacle 202. The first magnet may be disposed above the socket 204 and the plug assembly 306. The second magnet 806 may be installed within the plug assembly 306. When the plug assembly 306 is installed within the socket 204, the first magnet 802 and the second magnet 806 may be aligned. The first magnet 802 and the second magnet 806 may be positioned to attract each other (e.g., opposing poles of the aligned magnets). The attractive magnetic force between the first magnet 802 and the second magnet 806 may cause the plug assembly to move (e.g., slide) toward the PIC 102 (e.g., guided by coarse alignment features of the plug assembly and vertical rail 212). The v-groove 302 of the photonic plug 108 may engage the ball 304 of the PIC 102, finely aligning the PIC 102 and photonic plug 108 components in the seated position. An attractive magnetic force may act to hold the plug assembly 306 in the seated position. While both the first magnet 802 and the second magnet 806 are described as magnets themselves, it should be understood that one of the first magnet 802 or the second magnet 806 may be replaced by a magnetically attractive material (e.g., ferrous metal). While the first magnet 802 is described as being in a fixed relationship with the receptacle 202, the first magnet 802 may be movably (e.g., slidably and / or rotatably) mated with the receptacle 202. Similarly, although the second magnet 806 is described as being in a fixed relationship with the plug assembly 306, the second magnet 806 may be movably (e.g., slidably and / or rotatably) mated with the plug assembly 306.

[0040] FIG. 8E illustrates an alternative configuration of the detachable optical coupler 300 according to one or more embodiments of the present disclosure. FIG. 8E illustrates an exemplary configuration in which the magnets 802 and 806 are arranged such that an attractive force between the first magnet 802 and the second magnet 806 acts to hold the plug assembly 306 in a seated position. Referring to FIG. 8E, the magnets 802 and 806 may alternatively be configured such that a repulsive force between the first magnet 802 and the second magnet 806 may act to move and / or hold (e.g., push) the plug assembly in a seated position. The first magnet 802 may be positioned (e.g., in a fixed or movable manner) within the receptacle 202 below the socket 204 and plug assembly 306. The second magnet 806 may be positioned within the plug assembly 306. The first magnet 802 and the second magnet 806 may be arranged to repel each other (e.g., like poles of aligned magnets). When the plug assembly 306 is installed in the socket 204, the first magnet 802 and the second magnet 806 may align and repel one another. The repulsive force of the first magnet 802 and the second magnet 806 may push the plug assembly toward the PIC 102 (e.g., guided by the vertical rail 212). The ball 304 on the side of the PIC 102 may engage with the v-groove 302 on the side of the photonic plug 108 to finely align the PIC 102 and the photonic plug 108. The repulsive force of the first magnet 802 with the second magnet 806 may act to hold the plug assembly in this seated position. Although the first magnet 802 is described as being in a fixed relationship with the receptacle 202, the first magnet 802 may be movably (e.g., slidably and / or rotatably) mated with the receptacle 202. Similarly, although the second magnet 806 is described as being in a fixed relationship with the plug assembly 306, the second magnet 806 may be movably (e.g., slidably and / or rotatably) mated with the plug assembly 306.

[0041] Similar to the stiffness of the leaf springs discussed above, those skilled in the art will understand that the attractive and / or repulsive forces between the first magnet 802 and the second magnet 806 (e.g., of FIGS. 8D and 8E ) can be adjusted to optimize various parameters. For example, the attractive and / or repulsive forces between the first magnet 802 and the second magnet 806 can be adjusted to account for the force applied to the mating surfaces (e.g., mating surfaces 308 and 310) and / or micro-alignment features of the photonic plug 108 and the PIC 102. Accordingly, it may be desirable to configure the first magnet 802 and the second magnet 806 to apply sufficient force to the plug assembly 306 to engage the micro-alignment features (e.g., v-groove 302 and sphere 304) without damaging the micro-alignment features and / or mating surfaces. Still further, the attractive and / or repulsive forces between the first magnet 802 and the second magnet 806 can be adjusted to account for material deformation under magnetic force. Therefore, the materials used in the plug assembly 306 and / or receptacle 202 may be considered when designing the attractive and / or repulsive forces.

[0042] 9A-9F illustrate an exemplary PIC 102, package substrate 104, and main board 106 arrangement in accordance with one or more aspects of the present disclosure. As described, one or more package substrates 104 may be connected (e.g., electrically and / or optically) to the main board 106. One or more SiPh chips (e.g., including a PIC 102) may be connected (e.g., electrically and / or optically) to each package substrate 104. Multiple package substrates 104 and / or PICs 102 may be mounted to the main board 106, for example, as shown in FIGS. 9E and 9F. With reference to FIGS. 9A and 9B, the PIC 102 may overhang either or both the package substrate 104 and / or main board 106. PIC termination components 206 (e.g., transceivers, PIC input / output components) may be located below the PIC 102 within the overhang area. The receptacle 202 may assist the photonic plug 108 in mating with the underside of the PIC 102, as described herein.

[0043] 9B-9G, the PIC 102 may overhang the package substrate 104 and / or the electrical interposer 902, but not the main board 106. Accordingly, the plug assembly 306 may be located between the PIC 102 and the main board 106. As described herein, the photonic plug 108 may connect to the underside of the PIC 102 (e.g., in the area overhanging the package substrate 104). Referring to FIG. 9D, in configurations in which the PIC 102 overhangs the package substrate 104 but does not overhang the main board 106, the main board 106 may advantageously include an opening 902 (e.g., a window) in an area facing the PIC 102 and / or the termination component 206 of the PIC 102. This opening 902 may be advantageous for gaining access to the PIC 102 and / or the optical components of the plug assembly 306 (e.g., for cleaning purposes, alignment purposes, maintenance purposes, etc.). 9E, multiple PICs 102 may be optically and / or electrically connected to a single package substrate 104. With reference to FIG. 9G, a detachable optical coupler 300, and components of the present disclosure, may be configured to connect to the top side of the PICs 102.

[0044] Figure 10 shows a top view of an exemplary receptacle, underlying PIC, and package substrate according to one or more embodiments of the present disclosure. Figure 11 shows a perspective view of an exemplary receptacle, underlying PIC, and uninstalled plug assembly 306 according to one or more embodiments of the present disclosure. Figure 12 shows a top view of an exemplary receptacle, underlying PIC, and package substrate according to one or more embodiments of the present disclosure.

[0045] Other arrangements and configurations of the removable connector 300 are contemplated and disclosed herein. FIG. 13 illustrates an exemplary receptacle 202 and uninstalled plug assembly 306 according to one or more embodiments of the present disclosure. FIG. 14A illustrates an exemplary disassembled plug assembly 306 according to one or more embodiments of the present disclosure. FIG. 14B illustrates an exemplary plug cover having fine alignment features and an exemplary photonic plug 108. Referring to FIGS. 14A and 14B, the plug assembly 306 may include the photonic plug 108. The plug assembly 306 may house the photonic plug 108. The plug assembly 306 may aid in coarse and fine alignment of the photonic plug 108 and its attached optical components (e.g., optical fiber 502) with the optical components of the PIC 102.

[0046] 14B , the plug assembly 306 may further include a plug cover 526. The photonic plug 108 may be connected to and / or housed in the plug cover 526. The photonic plug 108 may be connected to the plug cover 526 in one or more of several ways. For example, the photonic plug 108 may be clamped in place with the aid of a plug base 1402 (described below). Additionally or alternatively, the plug cover 526 may be overmolded (e.g., onto the photonic plug 108) in a low-temperature compound (e.g., polyamide). An optical component (e.g., the optical fiber 502) may be attached to the photonic plug 108 before attaching the photonic plug 108 to the plug cover 526 or after attaching the photonic plug 108 to the plug cover 526. Additionally or alternatively, the photonic plug 108 may be bonded to the plug cover 526 via, for example, adhesive and / or epoxy. The plug cover 526 may include coarse and / or fine alignment features (e.g., similar to alignment features elsewhere herein). For example, the plug cover 526 may include a plug cover sphere 1408 (e.g., the plug cover sphere 1408 may be substantially similar to the sphere 304 described herein), and the photonic plug 108 may include a plug cover mating v-groove 1410 (e.g., the plug cover mating v-groove may be substantially similar to the v-groove 302 described herein). Engagement of the plug cover sphere 1408 and the plug cover mating v-groove 1410 may facilitate fine alignment of the photonic plug 108 within the plug cover 526. The fine alignment features of the plug cover 526 and the photonic plug 108 may be fabricated during manufacturing of the underlying components to ensure accurate placement of the fine alignment features. Additionally, the plug cover 526 may include a void for receiving the photonic plug 108. The gap may be shaped to provide coarse alignment of the plug cover 526 and the photonic plug 108 within the plug assembly 306 .

[0047] 14A , one or more sides of the plug cover 526 may include one or more viewing / mounting holes 516 (e.g., above and / or on a portion of a side of the photonic plug 108 and / or one or more edges of the photonic plug 108). The one or more viewing / mounting holes 516 may provide certain advantages. For example, after installing the photonic plug 108 in the plug assembly 306 and / or plug cover 526, the viewing / mounting holes 516 may be used to confirm proper alignment of the photonic plug 108 within the plug assembly 306 and / or plug cover 526. Fine alignment may also be checked, adjusted, and / or performed via the viewing / mounting holes 516. Additionally, the viewing / mounting holes 516 may be used for viewing and alignment after installation of the plug assembly 306 in the socket 204. Following placement and alignment of the photonic plug 108 within the plug cover 526 , adhesive and / or epoxy may be flowed into the viewing / mounting holes 516 to hold the photonic plug 108 within the plug cover 526 .

[0048] The plug assembly 306 may further comprise a plug base 1402. The plug base 1402 may aid in retaining the photonic plug 108 within the plug assembly 306 (e.g., within the plug cover 526). The plug base 1402 may comprise coarse and / or fine alignment features to aid in aligning the photonic plug 108 and / or optical components (e.g., optical fiber 502) attached to the photonic plug 108 within the plug assembly 306. The plug base 1402 may be permanently or removably connected to the plug cover 526. For example, the plug cover 526 (and / or the plug base 1402) may comprise a latch protrusion 1404. The plug base 1402 (and / or the plug cover) may comprise a complementary latch 1406. When the plug base 1402 and the plug cover 526 are installed together, the latch 1406 may deform around the latch protrusion 1404 during installation. The latch 1406 may include a notch for receiving the latch protrusion 1404. Upon installation, the notch may receive the latch protrusion 1404, and the latch 1406 may snap back toward its undeformed state. The latch 1406 and latch protrusion 1404 may thereby hold the plug base 1402 and plug cover 526 in place. Other methods of attachment of the plug base 1402 and plug cover 526 are contemplated. For example, the plug base 1402 and plug cover 526 may be magnetized together, clamped together, screwed together, glued together (e.g., via adhesive or other bonding agent), etc. Alternatively, the plug base 1402 and plug cover 526 may comprise a unitary piece.

[0049] FIG. 16 illustrates an exemplary plug assembly 306 according to one or more embodiments of the present disclosure. Referring to FIG. 16 , the plug base 1402 and / or the plug cover 526 may include optical component retention features. For example, the optical component connected to the photonic plug 108 may include the optical fiber 502. The plug base 1402 and / or the plug cover 526 may include a rubber grommet 1412. Upon installation of the plug base 1402 with the plug cover 526, the rubber grommet 1412 may pinch the optical fiber 502. Such a feature may provide strain relief for the optical fiber 502 and may help retain the optical fiber 502 such that movement of the optical fiber 502 is minimized after installation. This may be advantageous to ensure that fine alignment of the photonic plug 108 within the photonic cover (e.g., via a sphere / hemisphere, as described below) is not disturbed by forces on the optical fiber 502 (e.g., when the optical fiber is bumped).

[0050] 14A, while the plug assembly 306 has been described as comprising three components, each of the described components may be further subdivided. Additionally or alternatively, multiple described components may be joined together. For example, the plug cover 526 and the photonic plug 108 may additionally or alternatively comprise a single component (e.g., a silicon die, a metal substrate, etc.), and the plug assembly 306 may comprise a single, unified component.

[0051] 13, the receptacle 202 may be attached (e.g., bonded) to the top side of the PIC 102. Additionally or alternatively, the receptacle 202 may be attached to the package substrate 104 and / or the main board 106 (e.g., as described herein above with reference to FIGS. 2A-2C).

[0052] The receptacle 202 may include a socket 204. The socket 204 may be configured to receive and / or align one or more plug assemblies mounted (e.g., seated) therein. The socket 204 may be connected to the PIC 102. Additionally or alternatively, the socket 204 may be connected to the PIC 102, the package substrate 104, and / or the main board 106 (e.g., to which the PIC 102 may be connected, or to which the package substrate (to which the PIC 102 may be connected) may be connected). The socket 204 may be further configured to align optical components connected to the plug assembly 306 with the PIC termination component 209 to facilitate optical connections between the PIC 102 and the optical components (e.g., optical fibers 502). The socket 204 may be further configured to provide coarse and / or fine alignment of the plug assembly 306 and / or optical components mounted thereto with the termination component 209 of the PIC 102. Although FIG. 13 shows the receptacle 202 with a single socket 204, the receptacle 202 may include any number of sockets 204 for receiving any number of plug assemblies 306 (see, for example, FIG. 18).

[0053] The receptacle 202 may be connected to the PIC 102 and / or the main board below the PIC (e.g., to which the PIC is also connected) in any number of ways. For example, the socket 204 may be bonded to the main board. The socket 204 may be bonded to the main board via, for example, one or more structural adhesives (e.g., epoxy, paste, etc.). The receptacle 202 may be connected to the main board in any number of other ways. For example, the receptacle 202 may be clipped to the main board (e.g., using mechanically complementary components), clamped to the main board, soldered to the main board, magnetized in place relative to the main board, etc. The receptacle 202 may include one or more viewing / mounting holes 208 through which adhesive may be applied once the receptacle 202 is placed and positioned on the main board, the PIC 102, and / or the package substrate 104. Thus, fine alignment of the receptacle 202 with the PIC termination components 209 may be achieved. After fine alignment (and, e.g., adjustment), the receptacle 202 can be held in place and adhesive can be applied to the viewing / mounting holes 208 of the receptacle 202. The receptacle 202 can be connected to any or all of the main board, the PIC, and / or the package substrate. The method of connection of the receptacle to the underlying substrate can be any of the connection methods described herein.

[0054] The receptacle 202 may be configured to aid in heat dissipation from the PIC 102, the package substrate, and / or the main board (e.g., as a heat sink). Accordingly, the receptacle 202 may include features to improve its heat sinking capabilities (e.g., heat sink fins of any nature). Additionally, the portion of the receptacle 202 attached to the main board (e.g., the socket 204) may include a material with a relatively high thermal conductivity (e.g., copper, aluminum, other metals, etc.). Thermal paste may be used between the receptacle 202 and the PIC 102 and / or between the receptacle 202 and the main board and / or package substrate 104 to further improve the heat sinking characteristics of the receptacle 202. Thermal paste may be used alone and / or in conjunction with an adhesive. The receptacle 202 may include one or more materials (e.g., metal or metal and plastic). For example, the portion adjacent the PIC may comprise one material (e.g., metal), while the clip portion (described below) may comprise another material. Accordingly, the receptacle 202 may be manufactured via one or more manufacturing methods. For example, in the case of a fully or partially metal receptacle 202, the metal portion may be CNC machined, stamped, molded, 3D printed, etc. In the case of a fully or partially polymeric receptacle 202, the polymer portion may be injection molded, 3D printed, etc. The receptacle 202 may include a notch for receiving the PIC 102. The notch may be configured to align the PIC 102 with respect to the receptacle 202 and with respect to the ultimately installed plug assembly 306.

[0055] The socket 204 may include coarse alignment components. According to some configurations, the coarse alignment may be approximately + / - 100 micrometers. According to alternative configurations, the coarse alignment may be substantially greater than or less than 100 micrometers. The socket 204 may include one or more plug guides 1302. The plug guides 1302 may be configured to guide the plug assembly 306 as it is installed (e.g., lowered into) the socket 204. Additionally, the plug guides 1302 may be configured to reduce movement (e.g., lateral and / or longitudinal movement) of the plug assembly 306 when it is installed in the receptacle 202. Similar to the latch protrusions 1404 of the plug cover 526, the receptacle protrusions 1304 may retain the socket cover 1306 (as described below).

[0056] The receptacle 202 may further include a socket cover 1306. The socket cover 1306 may be rotatably mated to the socket 204 (e.g., via a hinge 1312). Additionally or alternatively, the socket cover 1306 may be slidably mated to the socket 204. Thus, when the plug assembly 306 is seated in the socket 204, the socket cover 1306 may move toward and away from the plug assembly. The socket cover 1306 moving toward the socket 204 may close and secure the plug assembly 306 within the socket 204. The socket cover 1306 may be held in a closed state (e.g., held to and / or relative to the socket 204) (in various manners).

[0057] 15A and 15B show an example plug assembly 306 and an example receptacle 202 in an example closed state and an example installed state according to one or more aspects of the present disclosure. Referring to FIGS. 15A and 15B , the receptacle 202 may include one or more latch protrusions 1304. The socket cover 1306 may include one or more latch features 1308 that may correspond to the latch protrusions 1304. The latch protrusions 1404 may be located anywhere on the receptacle 202. For example, the latch protrusions 1404 may be integrated into one or more of the plug guides 1302. The latch protrusions 1304 may be on any side of the plug guides 1302. When the socket cover 1306 is closed onto the socket 204, the latch protrusions 1304 may deform the socket cover latch feature 1308, for example, pushing the socket cover latch feature 1308 from its natural resting position. As the socket cover 1306 is further installed, the socket cover latch features 1308 may clear the latch protrusions 1304. Upon clearing the latch protrusions 1304, the socket cover latch features 1308 may return toward their natural state, thereby engaging the latch features 1308 and the latch protrusions 1304 to hold the socket cover 1306 in place. To open the socket cover 1306, the socket cover latch features 1308 may be pulled (or pushed apart, depending on the configuration) from their resting position to clear the latch protrusions 1304 of the plug guide 1302, thereby allowing the socket cover 1306 to be opened.

[0058] Similar to the viewing / locating holes 516 described above with respect to the cover of the plug assembly 306, the socket cover 1306 may additionally include one or more socket cover viewing / locating holes 1502. The socket cover viewing / locating holes 1502 may include strategically placed cutouts and / or voids in the socket cover 1306. The socket cover viewing / locating holes 1502 may be used to verify and / or adjust the alignment of the plug assembly 306 (and the photonic plug 108, e.g., through the viewing / locating holes 516 in the plug cover 526) after the plug assembly 306 is installed in the socket 204.

[0059] Referring again to FIG. 13 , the socket cover 1306 may further include a latch cover spring 1310. The latch cover spring 1310 may be configured such that the latch cover spring 1310 may apply a force to the plug assembly 306 upon installation of the plug assembly 306 and closing of the socket cover 1306. The force may urge the plug assembly 306 toward the PIC 102. The latch cover spring 1310 may cooperate with the socket cover latch features 1308 (and latch protrusions 1304) to provide a down force to the plug assembly 306. The force of the latch cover spring 1310 may be adjusted as desired. Those skilled in the art will understand that the stiffness of the latch cover spring 1310 may be adjusted to provide a desired down force to the plug assembly 306. The stiffness of the latch cover spring 1310 can be further adjusted to enable it to hold the plug assembly 306 in place while ensuring that the mating surfaces (e.g., the mating surfaces of the PIC 308 and / or the mating surfaces of the photonic plug 310) and alignment features (e.g., the ball 304 and v-groove 302) are not damaged by the force. Exemplary forces exerted by the latch cover spring 1310 can include, for example, less than 5 N, about 5 N, about 10 N, or more. One skilled in the art would be able to determine the optimal latch cover spring 1310 force according to the materials used in the plug assembly, receptacle 202, photonic plug 108, and PIC 102. Additionally, the stiffness of the latch cover spring 1310 can be adjusted to firmly hold the latch features 1308 in place (e.g., to reduce play in the socket cover 1306). Thus, the stiffness of the latch cover spring 1310 and the structure of the surrounding receptacle 202 can be balanced to apply a desired force to the plug and reduce play in the socket cover 1306 by applying a desired force.

[0060] As described above, the PIC side (e.g., PIC 102) and / or the plug assembly side (e.g., photonic plug 108) may further include fine alignment features. For example, the PIC 102 may include a fine alignment ball 304, and the photonic plug 108 may include a v-groove (e.g., v-groove 302). The ball 304 on the PIC side may align with the v-groove 302 on the plug side. In the installed and seated position, the latch cover spring 1310 may engage a surface of the plug assembly 306 and urge the plug assembly 306 toward the PIC 102. The v-groove 302 on the plug assembly 306 may engage with the ball 304 on the PIC 102 to assist in fine alignment between the plug assembly 306 and the PIC 102. Although the spheres 304 are shown as being disposed on the PIC 102, the spheres 304 can be disposed elsewhere, for example, on the surface of the receptacle 202 (e.g., on the surface of the socket 204). The fine alignment features can be configured differently, for example, rod-like alignment features can be used instead of or in addition to the spheres. Other complementary fine alignment features between the PIC 102 and the plug assembly 306 are contemplated herein.

[0061] When the plug assembly 306 is installed in the receptacle 202, the force of the latch cover spring 1310 of the socket cover 1306 may push the plug assembly 306, engaging the fine alignment features of the PIC and the photonic plug 108 and resulting in fine alignment of the optical components of the plug assembly 306 with the optical components of the PIC.

[0062] The plug assembly 306 may additionally or alternatively be retained within the receptacle 202. For example, the underside of the plug assembly 306 may include a magnet and / or a magnetically attractive material. Similarly, the top side of the socket 204 may include a magnet and / or a magnetically attractive material. Thus, when the plug assembly 306 is installed within the receptacle 202, the magnetic force between the plug assembly 306 and the receptacle 202 may be operable to retain the plug assembly 306 within the socket 204. Additionally, the magnetic features may be configured to provide sufficient force to engage fine alignment features of the photonic plug 108 and the PIC 102, as described above.

[0063] FIG. 17 illustrates an exemplary open receptacle 202 without a plug assembly, according to one or more embodiments of the present disclosure.

[0064] FIG. 18 illustrates an alternative configuration of a detachable connector according to one or more aspects of the present disclosure. FIGS. 13 and 17 illustrate a receptacle 202 of a single socket 204 (e.g., a receptacle configured to receive a single plug assembly 306). The receptacle 202 may be configured to receive any number of plug assemblies 306. Referring to FIG. 18 , each receptacle may be configured to receive and mate with one or more PICs 102, multiple plug assemblies 306. The multiple plug assemblies 306 may be retained via one or more socket covers 1306. The one or more socket covers 1306 may include one or more socket cover springs 1310. For example, the receptacle 202 may include a dedicated socket cover spring 1310 for each plug assembly 306. Alternatively, the receptacle 202 may include socket cover springs 1310 for groupings of plug assemblies 306 (eg, one socket cover spring 1310 for two plug assemblies).

[0065] 19A-19C show various views of an exemplary alternatively configured plug assembly 306 according to one or more embodiments of the present disclosure. The plug assembly 306 can be of various shapes. Referring to FIG. 19B, the alignment protrusion 510 can be on the bottom surface of the plug assembly 306 (e.g., in addition to or as opposed to the side surface). According to such a configuration, the receptacle 202 can include one or more protrusion-receiving sockets. The protrusion 510 can be plugged into the protrusion-receiving socket of the receptacle 202. The plug assembly 306 can thereby be roughly aligned within the receptacle 202.

[0066] FIG. 20 shows a perspective view of an exemplary receptacle and plug assembly according to one or more embodiments of the present disclosure. The photonic plug 108 may mate with the receptacle 202 for optical coupling. The coarse and fine alignment features described herein may help ensure accurate alignment between the photonic plug 108 and the receptacle 202. Coarse alignment may be provided by mechanical elements such as guide rails 2012 established during horizontal (e.g., lateral) insertion of the photonic plug 108 inside the socket 204 (e.g., within the guide rails 2012). Fine alignment may be provided by incorporating features into either or both the photonic plug 108 and the PIC 102, as described further herein. The photonic plug 108 may include one or more bars 2016 (e.g., pins, protrusions, etc.) protruding from its bottom side. The one or more bars 2016 may be configured to fit into one or more corresponding holes 2014 in the receptacle 202. The one or more bars 2016 may be various shapes, such as, for example, cylindrical, cubic, etc. The one or more holes 2014 may have a shape corresponding to the one or more bars 2016. The ribbon 502 may be coupled to the photonic plug 108. The receptacle 202 may be coupled to the PIC 102 and / or the package substrate 104. Additionally or alternatively, the PIC 102 may be connected to the package substrate 104. The receptacle 202 may include a socket 204, a sphere 304, guide rails 2012, holes 2014, and / or a bump-on-carrier (BoC) / glass die 2018. The BoC may include photonic bumps on a carrier substrate, examples of which may be found in commonly assigned U.S. patent application Ser. No. 17 / 989,303, the contents of which are incorporated herein by reference in their entirety. For example, the photonic bumps may include one or more curved mirrors, rotating curved mirrors, etc. to facilitate optical fiber connection to the PIC 102. The photonic bumps may be fabricated on the carrier. The BoC may also be referred to as a photonic bump. Additionally or alternatively, one or more features of the BoC described herein may be directly incorporated into the PIC 102 (e.g., fabricated on and / or with the PIC 102).

[0067] The glass die 2018 on the PIC 102 with fine alignment features can be a transparent optical medium with fine alignment mechanical functions. Alternatively, the glass die 2018 on the PIC 102 can be BoC. Additionally, the glass die 2018 can include electrical bumps on pads. The electrical bumps can function as an electrical interposer in addition to optical and mechanical functions. The glass die 2018 on the PIC 102 can be added based on a die-to-wafer or die-to-die process. The die-to-wafer and / or die-to-die process can provide high precision. The glass die 2018 can be manufactured to withstand the reflow process of a chip packaging method. Attaching the glass die 2018 to the PIC 102 can be performed via a pick-and-place tool based on alignment marks to support placement accuracy of submicrons to several microns. The number of fine alignment features is at least three or more. The fine alignment features can support both height control and tilt control.

[0068] The socket 204 may be made from one or more of a variety of materials, such as, for example, metal, plastic, glass, or silicon. The socket 204 may be manufactured, for example, by CNC or plastic molding / injection techniques. The material of the socket 204 may be configured to sustain and / or be compatible with photonic and electronic packaging processes, including reflow temperatures. In some configurations, the socket 204 may be positioned and / or aligned to within a few microns to tens of microns relative to the PIC 102. Pick-and-place die assembly techniques may be used for socket placement and attachment. Alignment and / or attachment may be established based on passive assembly, for example, via alignment marks located on the socket 204 and / or the PIC 102. Additionally or alternatively, alignment and / or attachment may be established by using the PIC die edge to achieve the required placement accuracy. The alignment marks may be located based on a wafer process. Additionally or alternatively, alignment and / or attachment of the socket 204 to the PIC 102 may be established and / or facilitated by mechanical alignment features, such as correspondingly configured mating features (e.g., protrusions and corresponding holes). Coupling and / or retention of the socket 204 to the receptacle 202 may be provided and / or facilitated by adhesive or solder. The socket 204 may be disposed on and / or adhered to one or more of the PIC 102, a board (e.g., the main board 106), and a packaging substrate 104. The packaging substrate 104 may interface between the PIC 102 and the board and / or components connecting and / or communicating with the board. The socket 204 may also, or alternatively, be disposed on and / or secured to one or more of the PIC 102, the board, the packaging substrate 104, and other interfaces between the PIC 102 and the board. Holes or other mechanical devices may be used to provide the socket 204 with additional mechanical support, stability, and alignment (e.g., with the PIC 102).

[0069] FIG. 21 illustrates coarse alignment features between a receptacle and a plug according to one or more embodiments of the present disclosure. The detachable optical couplers described herein may use coarse alignment and fine alignment (as further described herein) to facilitate connection of one or more various components. For example, with reference to FIG. 21 , coarse alignment may be achieved by mating various elements and / or features of the plug 108 and one or more elements and / or features of the socket 204. The coarse alignment features may facilitate and / or enable horizontal movement (e.g., sliding), e.g., guided horizontal movement, of the plug 108 relative to the receptacle 202. Also, or alternatively, the coarse alignment features may facilitate and / or enable vertical movement (e.g., dropping or downward shifting) of the plug 108 relative to the receptacle. In some configurations, vertical movement may be enabled after horizontal movement. For example, the plug 108 may be inserted horizontally into the socket 204 via guide rails 2012. The plug 108 can be pushed and / or slid into and / or pulled and / or slid out of the guide rail 2012. When the plug 108 is slid into the guide rail 2012 (e.g., slid completely or substantially completely into the guide rail 2012), the plug 108 can move (e.g., drop and / or be dropped) vertically (e.g., downward) toward the PIC 102. The plug 108 can be moved vertically to a coarser alignment by different mechanisms, as described herein. For example, the plug 108 can be moved vertically to a coarser alignment via, for example, gravity, a spring, a magnetic force, a clip, and / or other mechanisms for vertical movement, alignment, and / or retention (e.g., a press mechanism). For example, the cylindrical bar 2016 can be moved (e.g., dropped) into the cylindrical hole 2014. Sliding the plug 108 horizontally into the guide rails 2012 and dropping the cylindrical bar vertically into the cylindrical hole 2014 may approximately align the plug (e.g., attached optical component and / or mating surface (e.g., photonic plug mating surface 310)) with the PIC 102 (e.g., PIC mating surface (e.g., PIC mating surface 308)). In some configurations and embodiments, the coarse alignment may be in the range of about tens of microns to about 200 μm.As shown in FIG. 22, the plug 108 mates with a socket 204 .

[0070] 22 shows plug 108 installed in receptacle 202. Following coarse (e.g., rough) alignment of plug 108 and PIC 102, plug 108 and PIC 102 may be precisely aligned (e.g., via fine alignment features substantially similar to those described with respect to FIG. 3).

[0071] 23A and 23B illustrate examples of fine alignment features. FIGS. 23A and 23B may be substantially similar to the fine alignment features described elsewhere herein (e.g., FIGS. 3, 5A, 5B, 8D, 13, 17, and 19C). The fine alignment features may include spheres (or hemispheres) 304 and v-grooves 302. The fine alignment features may be constructed on geometric shapes on the mating photonic plug 108 and / or PIC 102. These features may be fabricated in a manner that aids, for example, in placement accuracy and leveling (e.g., tilt, rotation, x-axis alignment, y-axis alignment, z-axis alignment) of the plug 108 (and / or the plug's interface features) with the PIC 102 (and / or PIC interface features). The fine alignment features may be fabricated on the plug 108 and / or PIC 102. The fine alignment features may be fabricated, for example, via wafer-level processing. Such processes may facilitate precise placement of features and therefore precise placement and leveling of components (e.g., tilt, rotation, x-axis alignment, y-axis alignment, z-axis alignment). Wafer-level processes may include, for example, CMOS processes, wafer-level optics, imprint techniques, lithography processes (e.g., grayscale lithography), or a combination thereof. The shapes of these features may also vary. For example, sphere 304 may be replaced with, for example, a substantially rod-shaped or cone-shaped structure. Also, or alternatively, v-groove 302 may be replaced by a substantially hemispherical, pyramidal, or rod-shaped void.

[0072] A trench structure (e.g., v-groove 302) on the photonic plug 108 may mate with a sphere 304 on the PIC 102. Additionally or alternatively, the sphere 304 may be fabricated on the photonic plug 108 and mated with a v-groove on the PIC 102. As discussed herein, other mechanisms and configurations may also be used. The sphere 304 and / or v-groove 302 may be disposed directly on the plug 108, the PIC 102, or a die (e.g., a glass substrate, a silicon substrate, a semiconductor substrate, etc.). The sphere 304 and / or v-groove 302 may also, or alternatively, be attached to the plug 108 or the PIC 102. Additionally, or alternatively, fine alignment features may be attached and / or fabricated on the plug 108 or the PIC 102. Attachment may be established, for example, by adhesive, solder bump technology, or the like.

[0073] As shown in FIGS. 23A and 23B, the spheres 304 and v-grooves can be configured in various ways and locations. FIG. 22A shows spheres 304 located (e.g., disposed) on BoC 2305 and v-grooves 302 located on plug 108. All degrees of freedom (DOF) can be defined by three v-grooves 302 and three corresponding spheres 304. While the example has three spheres 304 and three corresponding v-grooves 302, different examples and configurations can use more (e.g., four, five, six, etc.) or fewer (e.g., two) spheres 304 and corresponding v-grooves 302. The v-grooves can be etched on the plug 108. Alternatively, the v-grooves 302 can be deposited on the plug 108. Each of the spheres 304 can be located (e.g., disposed) within a void (e.g., via a hole) in BoC 2305. For glass BoC2305 embodiments, the spheres 304 may be assembled and / or fabricated, for example, by substrate conformal imprint lithography (SCIL) or other glass fabrication techniques. The features of the spheres 304 and v-grooves 302 may be similar to the pin and hole features described above. To improve friction between the spheres 304 (e.g., glass spheres) and the v-grooves 302, a surface finish (e.g., a low-friction coating) may be applied to one or more of the spheres 304 and / or v-grooves 302. In other embodiments or configurations, the spheres 304 and / or v-grooves may comprise other materials. For example, the spheres 304 and / or v-grooves may be fabricated from metal instead of glass. Such a configuration may improve friction between the sphere surface and the v-groove surface.

[0074] 23A shows a sphere 304 incorporated into the BoC and a v-groove 302 incorporated into the plug 108, the surfaces may be reversed. For example, referring to FIG. 23B, the sphere 304 may be incorporated with the plug 108 (e.g., disposed on, fabricated in, and / or fabricated on the plug 108), and the v-groove 302 may be incorporated with the BoC 2305 (e.g., disposed on, fabricated in, and / or fabricated on the plug 108). The sphere 304 and the v-groove 302 may be fabricated and / or disposed on the plug 108 and the BoC 2305, respectively, using methods substantially as described above. Additionally, or alternatively, the v-groove 302 may be laser cut in the BoC 2305 (e.g., when the BoC is glass). The sphere 304 may be located on (e.g., disposed on) a hole in the plug 108, for example. Also, or alternatively, the sphere may be located on (e.g., disposed on, fabricated on) a glass cover on the plug 108. While the v-groove 302 and sphere 304 are disclosed in FIGS. 23A and 23B as being located on the BoC 2 305, other configurations and embodiments may not include the BoC 2 305. In such embodiments, the fine alignment features (e.g., sphere 304 and / or v-groove 302) may be located on (e.g., disposed on, fabricated in, or fabricated on) the PIC 102.

[0075] Optical coupling between the plug 108 and the PIC 102 can be established between an optical fiber (e.g., a fiber in the ribbon 502) and a PIC transceiver (e.g., a laser, a waveguide, a waveguide and mirror, a grating coupler, etc.). The coupling structure can support a PIC 102 with a grating coupler element as well as a PIC with broadband surface-coupled optics. Coupling can be implemented between the plug 108 and the PIC 102 through different interfaces. Such interfaces can include glass, air, silicon, or a combination thereof. Different optical designs can maintain optical transmission through different optical media. Additionally or alternatively, coatings (e.g., anti-reflective coatings) on one or more different interface surfaces can be used to maintain, for example, a desired refractive index between the media interfaces. As an example, an air gap can be maintained between the plug 108 and a BoC / glass die (e.g., BoC / glass die 2018 in FIG. 20) disposed on the PIC 102. The air gap can be beneficial for achieving separability. Additionally or alternatively, the air gap may be filled with liquid, e.g., for cooling purposes, in a configuration where the chip package or system is submerged in liquid. The air gap or liquid gap may be maintained at a defined height from the PIC 102, e.g., at which a beam (e.g., an optical beam, a signal beam) is expanded (e.g., to about tens of microns). Such a configuration may also or alternatively be used, e.g., to reduce beam-coupling dust contamination that may be present in the environment (e.g., a data center environment). Coupling / mating of the plug 108 and PIC 102 may also be utilized, e.g., for PIC 102s having downward and / or upward overhanging profiles, as well as coupling through the backside of the PIC 102 (e.g., as described in commonly assigned U.S. patent application Ser. No. 17 / 989,303, the contents of which are incorporated herein by reference in their entirety).

[0076] 24 shows a bottom view of an exemplary photonic plug 108 having three v-grooves 302, in accordance with one or more embodiments of the present disclosure. The photonic plug 108 may have three v-grooves 302 coupled to a surface of the plug 108. The v-grooves 302 may receive, engage with, and / or fit around a sphere 304 (as described elsewhere herein), for example, in FIGS. 23A and 23B.

[0077] As described herein, mechanisms and / or forces may be incorporated to push and / or force the plug 108 (e.g., down or up depending on orientation) toward the PIC 102 to effect vertical movement or to support mating engagement (e.g., fine alignment features). For example, magnets, springs, locking and release mechanisms, etc. may be used to secure the mated position between the plug 108 and the PIC 102 and release upon removal. Such mechanisms and forces are described in more detail herein.

[0078] FIG. 25 illustrates a receptacle 202 and a plug 108 in a mated position, according to one or more aspects of the present disclosure. The plug 108 may be housed within a plug cover (e.g., substantially similar to the plug cover 526 described herein), and together may comprise a plug assembly 2506. Additionally, or alternatively, the plug cover and plug 108 may be combined into a single plug (e.g., a plug 108 that also incorporates the described features of the plug cover). The plug assembly 2506 may comprise a bar / pin 2016 (e.g., substantially similar to the bar 2016 of FIG. 20). The receptacle 202 may comprise a hole 2014 (e.g., substantially similar to the hole 2014 of FIG. 20). The plug 108 and / or plug assembly 2506 may be mated to the receptacle 202, for example, via the bar 2016 that fits into a corresponding and configured hole 2014. Such a configuration may allow the coupling to be maintained (e.g., locked) in place. The Z-axis coordinate, pitch (Θ) coordinate, and roll (φ) coordinate may be defined by the ball 304 on the plug 108 (and / or BoC2305 or PIC102) engaging with the v-groove 302 on the PIC102 or BoC2305 (or plug 108). The X-axis coordinate, Y-axis coordinate, and yaw (ψ) coordinate may be defined by coarse (e.g., rough) alignment mechanical features (e.g., bars 2014 and holes 2014) on the plug 108 (and / or plug cover) and receptacle 202. These mechanical features may benefit from good lead-in angles, low friction, and sufficient clamping force. Therefore, such factors may be considered when designing such features. For example, a pin in hole configuration may, in some embodiments, have a positioning accuracy of about + / - 25 μm in X, Y, and about 0.1 degrees in ψ. This may be due to the socket 204 being positioned above the PIC 102. The holes 2014 in the receptacle 202 may be aligned during the assembly process, for example, using a master gib. Using such techniques, the positioning accuracy may be reduced to approximately + / - 7 to 10 μm in some embodiments.

[0079] FIG. 26 illustrates a receptacle having adjustable pins according to one or more aspects of the present disclosure. FIG. 26 illustrates an example of some of the features described in connection with FIG. 25. The receptacle 202 may include adjustable pins 2620 (e.g., similar to bars 2016 unless otherwise noted herein). While FIG. 26 illustrates an example including two adjustable pins 2620, the receptacle 202 may include any number of adjustable pins 2620. The plug assembly 2506 may include holes 2650. The adjustable pins 2620 may be inserted into the holes 2650, for example, after the plug assembly 2506 is inserted into the socket 204. The receptacle 202 may be assembled on the PIC 102 using, for example, a pick-and-place method (including pick-and-place precision). Additionally or alternatively, the assembly (e.g., the PIC 102 and receptacle 202) can be placed through a reflow process. After reflow, the adjustable pins 2620 can be placed in place, aligned, and mated. Alignment and mating can be performed, for example, by active alignment with the PIC 102, or by passive alignment with the plug 108. The plug assembly 2506 can be slid horizontally into the receptacle 202. After horizontal insertion, the plug assembly 2506 can be moved vertically toward the PIC 102, for example, to engage the adjustable pins 2620 and holes 2650. The sliding of the plug assembly 2506 into the receptacle 202 and the engagement of the pins 2620 and holes 2650 can include and / or achieve coarse alignment of the PIC 102 and plug 108, as described herein. Additionally, vertical movement of plug 108 toward PIC 102 can cause v-groove 302 to engage with fine alignment features on PIC 102 (e.g., spheres as described herein) (not shown), resulting in fine alignment as described herein.

[0080] 27A-27D show various views of a locking mechanism according to one or more embodiments of the present disclosure. FIG. 27A shows a bottom view of a plug assembly 2706 and a receptacle 2702 during insertion. The plug assembly 2706 may include a notch 2720. The notch may be configured to engage with snap arms 2710 of the receptacle 2720 after insertion. FIG. 27B shows a bottom view of the plug assembly 2706 inserted into the receptacle 2702. With reference to FIGS. 27A and 27B, during insertion of the plug assembly 2706 into the receptacle 2702, the lips of the notch 2720 may be angled to deform the snap arms 2710 from their resting position. After further insertion of the plug assembly 2706 into the receptacle 2702, the plug assembly may be slid further such that the snap arm 2710 clears the lip of the notch 2720 and aligns with the notch 2720. When the snap arm 2710 aligns with the notch 2720, the snap arm 2710 may move toward its rest position. The snap arm protrusion 2710 may be configured to engage and / or mate with the notch 2720. Thus, the notch 2720 may hold (e.g., lock) the snap arm 2710 in place, as shown in FIG. 27B . The engagement of the notch 2720 with the locking arm 2710 may cause resistance to relative horizontal (e.g., sliding) movement of the plug assembly 2706 with respect to the receptacle 2702.

[0081] FIG. 27C shows a top view of an example plug assembly 2706 and receptacle 2702 during insertion. The plug assembly 2706 may include a wire spring 2750. The receptacle may include one or more angled surfaces 2722 (e.g., ramps). FIG. 27D shows a top view of an example plug 2706 being inserted into the receptacle 2702. Referring to FIG. 27D, as the plug assembly slides into the receptacle 2702, the one or more angled surfaces 2722 may be configured to engage with the wire spring 2750. Engagement of the wire spring 2750 with the one or more angled surfaces 2722 may draw the plug assembly 2706 (and in turn the plug 108) toward the PIC 102 as the plug assembly 2706 slides further into the receptacle. The one or more angled surfaces 2722 may terminate in grooves 2760 (e.g., at the ends of the one or more angled surfaces 2722) configured to engage and retain the wire spring 2750. For example, upon substantially full insertion of the plug assembly 2706 into the receptacle 2702, the wire spring 2750 may snap into the grooves 2760. When the wire spring 2750 is engaged with the grooves 2760, it may be positioned and held (e.g., locked) in place. For example, engagement of the wire spring 2750 with the grooves may hold the plug assembly 2706 in a desired vertical position relative to the PIC 102. Furthermore, the wire spring 2750, which holds the plug assembly 2706 in a vertical relationship relative to the PIC 102, may maintain engagement of fine alignment features (e.g., balls and v-grooves) of the plug 108 and PIC (and / or BoC), as described herein. Additionally or alternatively, the engagement of the wire spring 2750 with the groove 2760 may further withstand relative horizontal movement of the plug assembly 2706 and the receptacle 2702 .

[0082] 28A and 28B illustrate alternative exemplary retention mechanisms according to one or more aspects of the present disclosure. FIG. 28A illustrates a plug assembly 2706 and a receptacle 2802 in an engaged position. Similar to the features described with respect to FIGS. 27C and 27D, the receptacle 2802 may include one or more ramps 2822 (e.g., for drawing and retaining the plug assembly toward the PIC 102, as described in connection with FIGS. 27C and 27D). The one or more ramps in FIGS. 27C and 27D are shown as fixed. However, as shown in FIGS. 28A and 28B, the one or more ramps 2822 may be movable (e.g., deflectable, rotatable, pivotable, slidable, etc.). Additionally, or alternatively, the ramps 2822 (e.g., ramps) may be spring-loaded (e.g., biased toward a natural resting position). For example, one or more of the ramped surfaces may be movable to allow for improved engagement (e.g., installation, placement, etc.) and removal (e.g., extraction) of the plug assembly 2706 and receptacle 2702 (e.g., reducing the chance of damaging features (e.g., fine alignment features) of the plug and / or PIC 102). For example, FIG. 28B shows the plug assembly 2706 and receptacle 2802 in an extraction position. In FIG. 28A, the ramped surface 2822 may be pre-loaded (and / or biased toward its rest position) to hold (e.g., lock) the wire spring 2750 in place (e.g., substantially as described with respect to FIGS. 27A and 27B). With reference to FIG. 28B, the ramped surface 2822 may be moved (e.g., pulled back, slid, rotated, etc.) from its rest position to release the wire spring 2750. Thus, when the wire spring 2750 is released, the plug assembly can move (e.g., drop) vertically from its installed position and the fine alignment features (and / or coarse alignment features) can disengage. Furthermore, the plug assembly can be removed (e.g., slid) horizontally from the receptacle 2802 with increased ease and reduced likelihood of damaging the mating surfaces.Similarly, the ramp 2822 may move from its rest position during installation to also improve ease of installation and reduce the possibility of stress and / or damage to the mating surfaces during installation. The ramp 2822 may be capable of deforming to return to its rest position after insertion of the plug assembly into the receptacle 2802, for example, so that the plug assembly is drawn toward and held against the PIC 102. The ramp 2822 may be connected to a lever arm 2723. Force against the lever arm may be transferred to the ramp 2822, causing it to move (e.g., deflect, slide, pivot, etc.) from its rest position (e.g., its rest spring-loaded position). In an alternative embodiment, the ramp 2822 may be pushed forward (instead of pulled) to release the wire spring 2750.

[0083] 29A and 29B show top and bottom views of an exemplary leaf spring retention mechanism according to one or more embodiments of the present disclosure. FIG. 29A shows a bottom view of a receptacle 2902 including a leaf spring 2910 retention mechanism. The leaf spring 2910 may include legs 2924 (e.g., folded legs) and a leaf 2925. The legs may be used to support the leaf spring 2910 on an underlying substrate (e.g., PCB). The leaf 2925 may be configured to push the plug upward when the plug is installed into the receptacle 2902. FIG. 29B shows a top view of the plug assembly 2906 and receptacle 2902 in an engaged position. The leaf spring 2910 may be attached to the receptacle 2902. The leaf spring 2910 may be used to apply a clamping force to the plug assembly 2906 in the inserted position. Engagement of the leaf spring 2910 may require pushing the plug assembly 2906 horizontally forward within the receptacle 2902. For example, pushing the plug assembly 2906 horizontally forward within the receptacle may allow the leaf spring to apply a force to the plug assembly 2906 toward the PIC 102 such that the plug assembly 2906 (and plug 108 (not shown)) and the PIC 102 are aligned (e.g., via micro-alignment features described herein). Additionally, the clamping force may cause, facilitate, and / or maintain engagement of the micro-alignment features (e.g., ball and v-groove described herein). Removal of the plug assembly from the receptacle 2902 may require pulling on the leaf spring 2910 to reduce the pressure (and / or force) on the plug assembly 2906. The reduction in pressure (and / or force) may allow the plug to drop (eg, move away from the PIC 102) and return (eg, move horizontally) from its installed position.

[0084] 30A and 30B illustrate an exemplary self-alignment mechanism according to one or more embodiments of the present disclosure. FIG. 30A illustrates a front view of the mating of the plug 108 and the PIC 102. FIG. 30B illustrates a rear view of the mating of the exemplary plug 108 and the PIC. The plug 108 may have spheres 304. The spheres 304 may be positioned to define a substantially right-angled corner, for example, as shown in FIG. 30A. All DOFs may be defined by three spheres 304. In such a configuration, the Z, Θ, and φ coordinates may be defined by pressing the spheres against the PIC 102 (e.g., the v-groove of the PIC 102). The X, Y, and ψ coordinates may be defined by sliding the plug 108 in a plane relative to the BoC corner 3030. The glass 3010 may be used to slide the plug into place by guiding the glass 3010 over the BoC corner 3030. In such a configuration, the BoC thickness may be configured to be at least half the diameter of the spheres 304. The Z clamping force may be located within a triangle defined by the spheres 304. Additionally or alternatively, a fourth (or more) spheres 304 may be added. In such a case, one of the spheres 304 may be lifted from the PIC.

[0085] FIG. 31 illustrates an exemplary detachable connector 3100 according to one or more embodiments of the present disclosure. The detachable connector 3100 may include a plug assembly 3106 and a receptacle 3104 (which together may be part of a detachable connector system). The plug assembly 3106 may include a plug cover 3126 (e.g., similar to plug cover 526 unless otherwise noted). The plug cover 3126 may house a photonic plug (e.g., as shown in FIGS. 36 and 37 ) substantially as described herein (e.g., with respect to FIGS. 5A and 5B , 14A and 14B , and 16 ). The photonic plug (shown in FIG. 36 ) may be attached to the fiber ribbon 502. The plug cover 3126 may include a notch 2720. The plug assembly 3106 may include an extraction mechanism (e.g., an extraction system) including a plug separation surface 3110 and a movable grip 3120. The plug separation surface 3110 may be located on the end of one or more extensions extending from the movable grip 3120.

[0086] The detachable connector 3100 (e.g., system) may further comprise a receptacle 3104. The receptacle 3104 may comprise guide rails 3112 to assist (e.g., roughly align) the plug assembly 3106 during insertion. The receptacle 3104 may further comprise a receptacle separation surface 3130. The receptacle separation surface 3130 may act in series with the plug separation surface 3110 (as described in more detail herein) to assist the plug separation surface 3110 in disengaging and removing the plug assembly 3106 from the receptacle 3104. The receptacle 3104 may further comprise a spring 3160, for example, as a retention mechanism to urge and retain the plug assembly 3106 toward the PIC 102 and maintain engagement of fine alignment features between the photonic plug (not shown) and the PIC 102, as described in more detail herein. The receptacle 3104 may be coupled to the PIC 102 and / or the underlying substrate. The plug assembly 3106 may be inserted (e.g., horizontally) into the receptacle 3104. The shape of the plug cover 3126 and corresponding guide rails 3112 may be configured as coarse alignment features. For example, the plug cover 3126 may be shaped (e.g., including a thickness) to mechanically match the guide rails 3112 so that the photonic plug is coarsely aligned with the PIC 102. When the plug assembly 3106 is inserted into the receptacle 3104, the notch 2720 may mate with a cylinder (not shown) in the receptacle 3104. The movable grip 3120 may be movable (e.g., slidable) (as described in more detail herein) and may be coupled to the plug separation surface 3110 to move the plug separation surface 3110 to assist in the insertion and removal of the plug assembly 3106. The plug separation surface 3110 may be positioned about the center of gravity.

[0087] FIG. 32 illustrates a microaligner 3210 on the PIC 102 in accordance with one or more aspects of the present disclosure. The microaligner 3210 may be coupled to the PIC 102. The microaligner 3210 may further comprise a sphere 304 that mates with a v-groove of the photonic plug for fine alignment. The microaligner 3210 may be an example of a BoC, such as the BoC 2018 described above with reference to FIG. 20. Additionally, or alternatively, the microaligner 3210 may or may not include optical features (e.g., mirrors, lenses, etc.), depending on the configuration. For example, in some configurations, the photonic plug may be optically coupled to an existing optical feature on the PIC 102 (e.g., a lensed mirror of the PIC 102) without the aid of additional optical components (e.g., from the BoC). In such a configuration, the microaligner 3120 may simply comprise mechanical microalignment features (e.g., spheres 304, v-grooves, etc.) for aligning the photonic plug with existing optical features of the PIC 102. The microaligner 3210 may be positioned on top of the PIC 102 using a pick-and-place machine. Once positioned, the microaligner 3210 may be bonded to the PIC 102. The microaligner 3210 may also comprise fine alignment features such as spheres 304.

[0088] FIG. 33 shows a receptacle 3104 on top of a PIC102 and a microaligner 3210 in accordance with one or more aspects of the present disclosure. FIG. 33 shows the receptacle 3104 coupled to one or more of the microaligner 3210 and the PIC102. The receptacle 3104 may include guide rails 3012 and a receptacle separation surface 3130 (as further described herein). The receptacle 3104 may be positioned and aligned on the PIC102 using a pick-and-place machine. After positioning and placement, the receptacle 3104 may be bonded to one or more of the PIC102, the microaligner 3210, and / or the underlying substrate (e.g., PCB). The receptacle 3104 and the microaligner 3210 may be designed to withstand any reflow process to which the PIC102 and / or the underlying package may be subjected.

[0089] 34 shows the plug assembly 3106 and receptacle 3104 in a sliding position in accordance with one or more embodiments of the present disclosure. The plug assembly 3106 can be inserted into the guide rail 3112 for rough horizontal alignment. Thus, the shape of the plug cover 3126 and the corresponding guide rail 3112 can be configured together as a horizontal rough alignment feature. The separation surface 3110 can assist in secure positioning of the plug assembly 3106, as described in more detail herein. After insertion (e.g., horizontally) of the plug assembly 3106, vertical movement (e.g., dropping) can further secure the mated position between the plug assembly 3106 and the receptacle 3104. The mating process can include features as discussed herein.

[0090] FIG. 35 illustrates a plug and socket in a mated position according to one or more aspects of the present disclosure. The plug assembly 3126 may mate with the receptacle 3104 using fine and coarse alignment features, as discussed herein. Referring to FIG. 35, when the plug assembly 3106 is inserted into the receptacle 3104, the plug assembly 3106 may exert a force on the spring 3160, biasing the spring (e.g., upward) from its rest position. Thus, when the plug assembly 3106 is inserted into the receptacle 3104, the spring may provide a force to the plug assembly 3106, for example, in a direction toward the PIC 102. The guide rails 3112 and a portion of the plug assembly 3106 (e.g., the plug cover 3126) may be configured to maintain the plug assembly 3106 elevated a short distance (e.g., spaced apart) from the PIC 102 while inserted into the receptacle (e.g., resist substantial vertical movement of the plug assembly 3106 relative to the PIC 102 and / or receptacle 3104). Furthermore, the receptacle 3104 and plug assembly 3106 may be configured to allow vertical movement of the plug assembly 3106 after substantially full horizontal insertion of the plug assembly 3106 into the receptacle 3104. Additionally, the notch 2720 may mate with a cylinder / bar (not shown) in the receptacle 3104 for additional coarse alignment.

[0091] 36 and 37 show bottom views of an exemplary plug assembly 3106 according to one or more embodiments of the present disclosure. The plug assembly 3106 may comprise, house, and / or be connected to the photonic plug 108. An optical fiber, such as a fiber ribbon 502, may be connected to the photonic plug 108. The optical fiber of the fiber ribbon 502 may be spliced ​​to the photonic plug 108 to provide strain relief. Similar to those described elsewhere herein, the photonic plug 108 may comprise fine alignment features. In the example of FIGS. 36 and 37, the photonic plug comprises a v-groove 302 fine alignment feature. As described herein, the v-grooves 302 may mate with corresponding mechanical micro-alignment features (e.g., spheres or hemispheres) (e.g., on a PIC, on a BoC, on a micro-aligner) to micro-align the photonic plug and connected optical fiber with the PIC, for example, to facilitate optical connection (e.g., coupling) of the optical fiber to the PIC (e.g., a transceiver in the PIC). Different configurations may include different numbers of micro-alignment features, e.g., v-grooves 302. For example, the exemplary photonic plug 108 of FIG. 36 includes four v-grooves 302 for micro-alignment, while the embodiment of FIG. 37 includes three v-grooves 302. Other embodiments may include different numbers and configurations of micro-alignment features.

[0092] FIG. 38 illustrates an example of a removable plug assembly 3106 within a receptacle 3104, in accordance with one or more aspects of the present disclosure. While FIG. 38 illustrates an arrow indicating removal of the plug assembly 3106, installation of the plug assembly 3106 will be described first. Continued insertion of the plug assembly 3106 into the receptacle 3104 may cause the plug assembly 3106 (e.g., its coarse alignment features) to clear the guide rails 3112 and receptacle separator, allowing it to move vertically (e.g., toward the PIC 102). Thus, the force of the spring 3160 on the plug assembly 3106 (e.g., horizontally (e.g., downward)) may cause the plug to move vertically (e.g., downward), e.g., toward the PIC 102. As the plug assembly moves vertically, the notch 2720 may engage and mate with the cylinder 3880. The engagement of the notch 2720 with the cylinder 3880 may provide several benefits, including assisting in coarse alignment of the plug assembly 3160 (and photonic plug 108) and resisting horizontal movement of the plug assembly 3160 relative to the receptacle 3104 and PIC 102. Continued vertical movement of the plug assembly 3106 (e.g., toward the PIC 102) (e.g., as assisted by the spring 3160) may cause fine alignment features of the photonic plug 108 to engage with fine alignment features of the PIC 102 (and / or BoC or microaligner 3210). For example, continued vertical movement of the plug assembly 3106 toward the PIC 102 may cause the v-grooves 302 of the photonic plug 108 to engage with the spheres 304 of the micro-aligner 3210 such that an optical component (e.g., an optical fiber) connected to the photonic plug 108 may be finely aligned, and in this installed position, optical elements (e.g., a transceiver, lensed mirror, grating coupler, laser) of the PIC 102 may enable optical communication between the optical component attached to the photonic plug 108 and the PIC 102. A force from a spring 3160 on the plug assembly 3106 may maintain the plug assembly 3106 in the above-described installed position, maintaining the engagement of the coarse and fine alignment features.

[0093] After installation, it may be desirable to disconnect (e.g., unplug, uninstall, etc.) the plug assembly 3106 (e.g., for servicing) from the PIC 102 and receptacle 3104. Extraction features may not be described with continued reference to FIG. 38 and with reference to FIG. 39. It will be appreciated that simply pulling horizontally on the installed plug assembly 3106 may increase the likelihood of damaging one or more features (e.g., fine alignment features, mating surfaces, etc.). Accordingly, FIGS. 38 and 39 illustrate features and methods for removing (e.g., unplugging) the plug assembly 3106 from the receptacle with a reduced likelihood of such damage. In a first extraction step, the movable grip 3120 may be pulled (as shown by arrow A) to initiate vertical movement (e.g., upward) of the plug assembly 3106 (e.g., away from the PIC) for ejection. As will be explained, moving the movable grip 3120 can move the connected plug separation surface 3130 toward the corresponding receptacle separation surface 3130, causing engagement. The plug separation surface 3110 and the receptacle separation surface 3130 can be correspondingly configured such that forces on the surfaces in the horizontal direction translate to forces on the plug assembly 3106 and receptacle 3104 in the vertical direction (e.g., forces that vertically separate the plug assembly 3106 and receptacle 3104). Thus, an initial horizontal movement of the movable grip can cause vertical movement of the plug assembly 3126.

[0094] 39 shows a removable plug during extraction according to one or more embodiments of the present disclosure. Referring to FIG. 39, continued horizontal force and movement on the movable grip 3120 can cause the plug extraction surface 3110 and the receptacle extraction surface 3130 to continue to engage the plug assembly 3106 and apply a vertical force to the plug assembly 3106. Additionally, the horizontal force on the movable grip 3120 can apply a horizontal force to the remainder of the plug assembly 3106. These forces can cause the engagement of the plug extraction surface 3110 and the receptacle extraction surface 3130 to move the plug assembly vertically, pushing on the spring 3160 and lifting the plug assembly 3106, acting as a ramp that causes the fine alignment features (e.g., v-groove 302 and sphere 304) and the vertical disengagement of the notch 2720 and cylinder 3880. Vertical disengagement of the fine alignment features allows the plug assembly 3016 to be removed horizontally from the receptacle 3104 (e.g., in a manner substantially reverse to the installation described above). In this manner (e.g., vertical movement, then horizontal movement), the likelihood of damaging the fine alignment features and mating surfaces of the photonic plug 108 and PIC 102 may be reduced. In some configurations, all of the features described herein as features of the plug assembly (e.g., plug assembly 3016) and / or plug cover (e.g., plug cover 3126) may be incorporated into the photonic plug 108.

[0095] FIG. 40 shows an exemplary optical scheme in which the detachable connector of the present disclosure may be used. For example, the optical scheme may include a photonic plug 108 connected to one or more optical fibers (e.g., fiber ribbon 502). The photonic plug may further include a first mirror 4040. The first mirror may include a substantially flat mirror, such as a tilted substantially flat mirror, to direct a light beam 4042 into and out of the optical fiber. The light beam 4042 may be coupled to a first curved mirror 4044. Examples of BoCs described herein (e.g., BoC2018) may include a mirror substantially similar to the first curved mirror 4044. The first curved mirror may focus the light beam 4042 toward the first mirror 4040 and / or collimate the light beam 4042 toward a second curved mirror 4046 (e.g., photonic plug curved mirror 4046). The second curved mirror 4046 may interface with the light beam 4042 and may focus the light beam toward the PIC transceiver 4048 (e.g., a mirror, grating coupler, waveguide, laser, etc.) and / or collimate the light beam toward the first curved mirror 4044. The methods, systems, and apparatus described above may be used to removably couple the photonic plug of FIG. 40 from the PIC 102, as described.

[0096] Other optical schemes may also be used. For example, some exemplary configurations may omit the first curved mirror 4044 and / or the second curved mirror 4046. The first mirror 4040 may include a focusing mirror configured to either collimate or focus the optical beam. Furthermore, the first mirror 4040 may interface the optical beam directly with the PIC transceiver 4048, for example, instead of interfacing the optical beam 4042 with the first curved mirror 4044. Thus, the detachable connectors described herein may also be used, for example, to couple a directly collimated beam between the first mirror 4040 and a PIC and / or a directly focused beam between the first mirror 4040 and a PIC (e.g., a PIC that includes a lensed mirror in the transceiver 4048). The above-described optical schemes are not intended to limit the scope of the present disclosure but merely provide examples illustrating some of the optical schemes in which the detachable connectors may be used.

[0097] FIG. 41 illustrates an exemplary method 4100 for achieving a detachable optical connection between one or more optical fibers and a PIC according to one or more aspects of the present disclosure. In step 4110, method 4100 may include coarsely aligning the photonic plug with the PIC based on a first horizontal movement of the photonic plug relative to the receptacle. The PIC may comprise an optical transceiver. In step 4120, method 4100 may further include vertically moving the photonic plug toward the PIC. In step 4130, method 4100 may further include finely aligning the photonic plug with the PIC based on the vertical movement. The fine alignment may cause engagement of a first fine alignment feature of the photonic plug with a second corresponding fine alignment feature associated with the PIC. Finely aligning the photonic plug with the PIC may include aligning and substantially constraining the photonic plug relative to the PIC in one or more of the Z-axis, pitch-axis, and roll-axis. Finely aligning the photonic plug with the PIC may include aligning and substantially constraining the photonic plug relative to the PIC in one or more of the X-axis, Y-axis, and yaw-axis. At step 4140, method 4100 may further include retaining the photonic plug via a retention mechanism associated with the photonic plug and receptacle. The retention mechanism may apply a force to the photonic plug in the direction of the PIC.

[0098] FIG. 42 illustrates an example method for disconnecting a removable photonic plug from a receptacle and a PIC according to one or more aspects of the present disclosure. FIG. 42 illustrates an example method 4200 for disconnecting a removable photonic plug from a receptacle and a PIC. In step 4210, method 4200 may include horizontally moving a movable grip associated with the photonic plug, causing movement of a first separation surface associated with the photonic plug. In step 4220, method 4200 may further include, based on the horizontal movement, causing engagement of the first separation surface with a second separation surface of the receptacle. The first and second separation surfaces may include complementary sloped surfaces such that a horizontal force between the two surfaces can translate into a vertical force between the two surfaces. In step 4230, method 4200 may further include, based on engagement of the first and second separation surfaces, vertically moving the photonic plug away from the PIC. The vertical movement of the photonic plug may cause a disengagement of a first fine alignment feature of the photonic plug from a second fine alignment feature associated with the PIC. The vertical movement of the photonic plug may include disengaging one or more coarse alignment features between the photonic plug and the receptacle. In step 4240, method 4100 may further include horizontally extracting the photonic plug from the receptacle after vertical movement of the photonic plug. The horizontal extraction may include guiding the photonic plug horizontally relative to the receptacle via one or more first coarse alignment features of the photonic plug and one or more corresponding second coarse alignment features of the receptacle.

[0099] Various features will be highlighted below in a series of numbered sections or paragraphs. These features should not be construed as limiting the invention or inventive concept, but are provided merely as highlighting of some of the features as described herein, without implying any particular order of importance or relevance of such features.

[0100] Clause 1. A system comprising: a photonic integrated circuit (PIC) associated with one or more first fine alignment features; a photonic plug configured to be attached to one or more optical fibers, the photonic plug comprising one or more plug coarse alignment features and one or more second fine alignment features configured to engage with the one or more first fine alignment features and finely align the one or more optical fibers with the PIC; a receptacle configured to receive the plug and engage with the one or more plug coarse alignment features to coarsely align the one or more optical fibers with the PIC; and a retention mechanism configured to substantially retain the photonic plug in the receptacle relative to the PIC. Clause 2. The system of clause 1, wherein the PIC further comprises one or more transceivers. Clause 3. The system of clause 1 or 2, wherein the PIC further comprises one or more optical termination components. Clause 4. A system described in any one of clauses 1 to 3, wherein engagement of one or more first fine alignment features with one or more second fine alignment features maintains alignment of the PIC with one or more optical fibers such that the one or more transceivers are optically coupled to the one or more optical fibers. Clause 5. The system of any one of clauses 1-4, wherein one or more first fine alignment features are fabricated on a surface of the PIC. Clause 6. The system of any one of clauses 1 to 5, further comprising a carrier substrate connected to the PIC, the carrier substrate comprising a first fine alignment feature. Clause 7. The system of any one of clauses 1-6, wherein the carrier substrate further comprises photonic bumps, the photonic bumps comprising optical focusing elements. Clause 8. The system of any one of clauses 1-7, wherein the optical focusing element facilitates optical connection between one or more optical fibers and the PIC. Clause 9. The system of any one of clauses 1 to 8, wherein the one or more first fine alignment features comprise a sphere or hemisphere. Clause 10. The system of any one of clauses 1-9, wherein the one or more first fine alignment features include one or more trenches. Clause 11. The system of any one of clauses 1 to 10, wherein the one or more trenches comprise one or more v-grooves. Clause 12. A system described in any one of clauses 1 to 11, wherein the one or more second fine alignment features comprise a sphere or hemisphere. Clause 13. The system of any one of clauses 1-12, wherein the one or more second fine alignment features include trenches. Clause 14. The system of any one of clauses 1 to 13, wherein one or more trenches comprise a v-groove. Clause 15. A system described in any one of clauses 1 to 14, wherein the one or more first fine alignment features and the one or more second fine alignment features are configured to engage with each other and to mechanically correspond to achieve fine alignment of the PIC and one or more optical fibers. Clause 16. A system described in any one of clauses 1 to 15, wherein each of the one or more first fine alignment features corresponds to a second fine alignment feature of the one or more second fine alignment features. Clause 17. The system of any one of clauses 1 to 16, further comprising three each of the first fine alignment features and the second fine alignment features. Clause 18. The system of any one of clauses 1-17, further comprising four of each of the first fine alignment features and the second fine alignment features. Clause 19. A system described in any one of clauses 1 to 18, further comprising three each of first fine alignment features and second fine alignment features, the first fine alignment features and second fine alignment features being arranged on the PIC and photonic plug in an isosceles triangular arrangement. Clause 20. A system described in any one of clauses 1 to 19, further comprising three each of first fine alignment features and second fine alignment features, the first fine alignment features and second fine alignment features being arranged on the PIC and photonic plug in a right-angled triangular arrangement. Clause 21. A system described in any one of clauses 1 to 20, wherein fine alignment features maintain alignment between the PIC and the photonic plug in one or more of the Z axis, pitch axis, and roll axis. Clause 22. A system described in any one of clauses 1 to 21, wherein one or more coarse alignment features maintain alignment between the PIC and the photonic plug in one or more of the X-axis, Y-axis, and yaw-axis. Clause 23. A system described in any one of clauses 1 to 22, wherein the photonic plug and receptacle are configured to, first, coarsely align the photonic plug and PIC based on one or more of the one or more plug coarse alignment features and based on horizontal insertion of the photonic plug into the socket of the receptacle, and second, coarsely align the photonic plug and PIC based on one or more other coarse plug coarse alignment features and vertical movement of the plug relative to the PIC. Clause 24. The system of any one of clauses 1-23, wherein the receptacle further comprises one or more receptacle coarse alignment features. Clause 25. A system described in any one of clauses 1 to 24, wherein one or more plug coarse alignment features are configured to engage with one or more receptacle coarse alignment features to coarsely align one or more optical fibers and the PIC. Clause 26. A system described in any one of clauses 1 to 25, wherein the photonic plug and receptacle are configured to further coarsely align the photonic plug and PIC based on vertical movement of the photonic plug relative to the PIC and after horizontal insertion. Clause 27. The system of any one of clauses 1 to 26, wherein the retention mechanism includes a spring. Clause 28. A system described in any one of clauses 1 to 27, wherein a spring is connected to the photonic plug, the spring being configured to exert a force on the photonic plug to pull the photonic plug toward the PIC. Clause 29. The system of any one of clauses 1 to 28, wherein the spring comprises a leaf spring. Clause 30. A system described in any one of clauses 1 to 29, wherein a leaf spring is attached to the receptacle and configured to apply a force to the photonic plug in the direction of the PIC to further maintain engagement of the first one or more fine alignment features with the second one or more fine alignment features. Clause 31. A system described in any one of clauses 1 to 30, wherein a leaf spring is connected to a lever, and moving the lever causes the leaf spring to deform and at least partially relieve the force on the photonic plug. Clause 32. A system described in any one of clauses 1 to 31, wherein the retention mechanism includes one or more magnets. Clause 33. A system described in any one of clauses 1 to 32, wherein the one or more magnets include a first magnet associated with the photonic plug and a second magnet in the receptacle, the first magnet and the second magnet being configured to attract or repel the photonic plug toward the PIC. Clause 34. The system of any one of clauses 1 to 33, wherein the retention mechanism includes a wire spring associated with the photonic plug. Clause 35. A system described in any one of clauses 1 to 34, wherein the receptacle comprises an inclined surface such that insertion of the photonic plug into the receptacle causes engagement of the wire spring with the inclined surface, drawing the photonic plug towards the PIC. Clause 36. A system described in any one of clauses 1 to 35, wherein the ramp is connected to a lever arm configured to receive a force, deflect the ramp, and release the held photonic plug. Clause 37. The system of any one of clauses 1-36, wherein one or more plug coarse alignment features include a ball bearing. Clause 38. The system of any one of clauses 1-37, wherein the one or more plug coarse alignment features comprise bonded ball bearings bonded to a surface of the photonic plug. Clause 39. A system described in any one of clauses 1 to 38, wherein the receptacle configured to engage with one or more plug coarse alignment features further comprises vertical and horizontal rails configured to receive the joined ball bearing and guide the joined ball bearing vertically and horizontally within the receptacle. Clause 40. The system of any one of clauses 1-39, wherein the one or more plug coarse alignment features include one or more cylindrical protrusions. Clause 41. The system of any one of clauses 1-40, wherein one or more plug coarse alignment features include a bar. Clause 42. A system as described in any one of clauses 1 to 41, wherein the receptacle is configured to engage with a bar of a hole configured to be mechanically complementary to the bar. Clause 43. The system of any one of clauses 1-42, wherein one or more plug coarse alignment features include holes. Clause 44. A system described in any one of clauses 1 to 43, wherein the receptacle is configured to engage with the hole via a bar configured to be mechanically complementary to the hole. Clause 45. The system of any one of clauses 1-44, wherein the plug coarse alignment feature includes a shape of the photonic plug, and the receptacle is configured to receive the shape of the photonic plug and coarsely align the photonic plug with the PIC based on receiving the shape of the photonic plug. Clause 46. The system of any one of clauses 1-45, wherein the one or more plug coarse alignment features include a notch. Clause 47. A system described in any one of clauses 1 to 46, wherein the receptacle comprises a snap arm configured such that insertion of the photonic plug into the receptacle causes the snap arm to deform and snap into the notch. Clause 48. A system described in any one of clauses 1 to 47, wherein the retention mechanism comprises a notch in the photonic plug, and the receptacle comprises a snap arm configured such that inserting the photonic plug into the receptacle causes the snap arm to deform and snap into the notch. Clause 49. A system described in any one of clauses 1 to 48, wherein the receptacle comprises a cylinder configured to engage with the notch upon vertical movement of the photonic plug towards the PIC. Clause 50. The system of any one of clauses 1-49, wherein the photonic plug further comprises a photonic plug assembly connected to the photonic plug. Clause 51. The system of any one of clauses 1 to 50, wherein the photonic plug features include features of a photonic plug assembly. Clause 52. A system described in any one of clauses 1 to 51, wherein the photonic plug assembly comprises a photonic plug cover. Clause 53. A system according to any one of clauses 1 to 52, wherein the photonic plug is housed within and connected to the photonic plug assembly. Clause 54. A system described in any one of clauses 1 to 53, wherein the photonic plug is aligned with the photonic plug assembly via microscopic alignment features including v-grooves and mechanically compliant spheres. Clause 55. A system as described in any one of clauses 1 to 54, wherein the photonic plug assembly comprises a movable grip connected to the separation surface, and movement of the movable grip moves the separation surface into engagement with a corresponding surface of the receptacle such that the photonic plug assembly moves vertically away from the PIC. Clause 56. A system described in any one of clauses 1 to 55, wherein the photonic plug assembly comprises a movable grip connected to a separation surface, and horizontal movement of the movable grip is converted via the separation surface into a vertical force on the photonic plug assembly, causing vertical separation of the photonic plug and the PIC. Clause 57. A system described in any one of clauses 1 to 56, wherein the photonic plug assembly comprises a movable grip connected to a separation surface, and horizontal movement of the movable grip is translated via the separation surface into a vertical force on the photonic plug assembly, causing vertical separation of the photonic plug and PIC and disengagement of one or more first fine alignment features from the second fine alignment features. Clause 58. A device comprising the photonic plug according to any one of clauses 1 to 57. Clause 59. A device comprising a receptacle according to any one of clauses 1 to 57. Clause 60. A method, comprising: achieving a detachable optical connection between one or more optical fibers and a photonic integrated circuit (PIC) by coarsely aligning the photonic plug with the photonic integrated circuit (PIC) relative to a receptacle based on a first horizontal movement of the photonic plug, where the photonic plug is connected to one or more optical fibers; thereafter vertically moving the photonic plug toward the PIC; and finely aligning the photonic plug with the PIC based on the vertical movement. Clause 61. The method of clause 60, further comprising retaining the photonic plug via a retention mechanism associated with the photonic plug and the receptacle. Clause 62. The method of clause 60 or 61, wherein the retention mechanism applies a force to the photonic plug in the direction of the PIC. Clause 63. The method of any one of clauses 60-62, wherein the finely aligning further comprises causing engagement of a first fine alignment feature of the photonic plug with a second corresponding fine alignment feature associated with the PIC. Clause 64. A method according to any one of clauses 60 to 63, wherein the PIC comprises an optical transceiver. Clause 65. The method of any one of clauses 60-64, wherein finely aligning the photonic plug with the PIC includes aligning and substantially constraining the photonic plug relative to the PIC in one or more of the Z axis, pitch axis, and roll axis. Clause 66. The method of any one of clauses 60-65, wherein finely aligning the photonic plug with the PIC comprises aligning and substantially constraining the photonic plug relative to the PIC in one or more of the X-axis, Y-axis, and yaw-axis. Clause 67. A method, comprising: disconnecting a removable photonic plug from a receptacle and a photonic integrated circuit (PIC) by horizontally moving a movable grip associated with the photonic plug to move a first separation surface associated with the photonic plug, and based on the horizontal movement, the first separation surface engages with a second separation surface of the receptacle, and based on the engagement of the first separation surface with the second separation surface, vertically moving the photonic plug from the PIC. Clause 68. The method of clause 67, further comprising extracting the photonic plug horizontally from the receptacle after vertical movement of the photonic plug. Clause 69. The method of clause 67 or 68, wherein vertical movement of the photonic plug causes disengagement of a first fine alignment feature of the photonic plug from a second fine alignment feature associated with the PIC. Clause 70. A method according to any one of clauses 67 to 69, wherein the first separating surface and the second separating surface comprise complementary configured inclined surfaces such that a horizontal force between the two surfaces translates into a vertical force between the two surfaces. Clause 71. The method of any one of clauses 67-70, wherein vertical movement of the photonic plug further comprises disengaging one or more coarse alignment features between the photonic plug and the receptacle. Clause 72. The method of any one of clauses 67 to 71, wherein the horizontal extraction further comprises guiding the photonic plug horizontally relative to the receptacle via one or more first coarse alignment features of the photonic plug and one or more corresponding second coarse alignment features of the receptacle.

[0101] The system may include a photonic integrated circuit (PIC) associated with one or more first fine alignment features. The system may include a photonic plug configured to be attached to one or more optical fibers. The photonic plug may include one or more plug coarse alignment features. The photonic plug may include one or more second fine alignment features configured to engage with the one or more first fine alignment features and finely align the one or more optical fibers with the PIC. The system may include a receptacle configured to receive the plug and engage with the one or more plug coarse alignment features to coarsely align the one or more optical fibers with the PIC. The system may include a retention mechanism configured to substantially retain the photonic plug within the receptacle relative to the PIC. The PIC may include one or more transceivers. The PIC may include one or more optical termination components. Engagement of the one or more first fine alignment features with the one or more second fine alignment features may maintain alignment of the PIC with the one or more optical fibers such that the one or more transceivers may optically couple to the one or more optical fibers. The one or more first microscopic alignment features may be fabricated on a surface of the PIC. The system may include a carrier substrate connected to the PIC, the carrier substrate including the first microscopic alignment features. The carrier substrate may include photonic bumps, which may include optical focusing elements. The optical focusing elements may facilitate optical connection between the one or more optical fibers and the PIC. The one or more first microscopic alignment features may include spheres or hemispheres. The one or more first microscopic alignment features may include one or more trenches. The one or more trenches may include one or more v-grooves. The one or more second microscopic alignment features may include spheres or hemispheres. The one or more second microscopic alignment features may include trenches. The one or more trenches may include v-grooves. The one or more first microscopic alignment features and the one or more second microscopic alignment features may mechanically engage with each other to achieve microscopic alignment of the PIC and the one or more optical fibers. Each of the one or more first fine alignment features may correspond to a second fine alignment feature of the one or more second fine alignment features, and the system may include three each of the first fine alignment features and second fine alignment features.The system may include four of the first and second fine alignment features. The system may include three of the first and second fine alignment features, and the first and second fine alignment features may be arranged on the PIC and the photonic plug in an isosceles triangle configuration. The system may include three of the first and second fine alignment features, and the first and second fine alignment features may be arranged on the PIC and the photonic plug in a right-angled triangle configuration. The fine alignment features may maintain alignment between the PIC and the photonic plug in one or more of the Z-axis, pitch axis, and roll axis. One or more coarse alignment features may maintain alignment between the PIC and the photonic plug in one or more of the X-axis, Y-axis, and yaw axis. The photonic plug and receptacle may first coarsely align the photonic plug and the PIC based on one or more of the one or more plug coarse alignment features and based on horizontal insertion of the photonic plug into the receptacle socket, and second coarsely align the photonic plug and the PIC based on one or more other coarse plug coarse alignment features and vertical movement of the plug relative to the PIC. The receptacle may include one or more receptacle coarse alignment features. The one or more plug coarse alignment features may engage with one or more receptacle coarse alignment features to coarsely align the one or more optical fibers and the PIC. The photonic plug and receptacle may coarsely align the photonic plug and the PIC based on vertical movement of the photonic plug relative to the PIC and after horizontal insertion. The retention mechanism may include a spring. The spring may be connected to the photonic plug, and the spring may apply a force to the photonic plug to draw it toward the PIC. The spring may include a leaf spring. The leaf spring may be attached to the receptacle and may exert a force on the photonic plug toward the PIC to maintain engagement between the first one or more fine alignment features and the second one or more fine alignment features. The leaf spring may be connected to a lever, and moving the lever may deform the leaf spring and at least partially relieve the force on the photonic plug. The retention mechanism may include one or more magnets.The one or more magnets may include a first magnet associated with the photonic plug and a second magnet in the receptacle, where the first magnet and the second magnet may attract or repel the photonic plug toward the PIC. The retention mechanism may include a wire spring associated with the photonic plug. The receptacle may include an inclined surface such that insertion of the photonic plug into the receptacle may cause engagement of the wire spring with the inclined surface, attracting the photonic plug toward the PIC. The inclined surface may be connected to a lever arm. The lever arm may receive a force to deflect the inclined surface and release the retained photonic plug. The one or more plug coarse alignment features may include a ball bearing. The one or more plug coarse alignment features may include a bonded ball bearing bonded to a surface of the photonic plug. The receptacle may include vertical and horizontal rails configured to receive the bonded ball bearing and guide the bonded ball bearing vertically and horizontally within the receptacle. The one or more plug coarse alignment features may include one or more cylindrical protrusions. The one or more plug coarse alignment features may include bars. The receptacle may engage with bars of the hole configured to be mechanically complementary to the bars. The one or more plug coarse alignment features may include holes. The receptacle may engage with the hole via bars configured to be mechanically complementary to the holes. The plug coarse alignment features may include a shape of the photonic plug, and the receptacle may receive the shape of the photonic plug and coarsely align the photonic plug with the PIC based on receiving the shape of the photonic plug. The one or more plug coarse alignment features may include notches. The receptacle may include snap arms configured so that inserting the photonic plug into the receptacle causes the snap arms to deform and snap into the notches. The retention mechanism may include a notch in the photonic plug, and the receptacle may include a snap arm configured such that insertion of the photonic plug into the receptacle causes the snap arm to deform and snap into the notch. The receptacle may include a cylinder that may engage with the notch upon vertical movement of the photonic plug toward the PIC.The photonic plug may include a photonic plug assembly connected to the photonic plug. Features of the photonic plug may include features of the photonic plug assembly. The photonic plug assembly may include a photonic plug cover. The photonic plug may be housed within and connected to the photonic plug assembly. The photonic plug may be aligned with the photonic plug assembly via fine alignment features including a v-groove and a mechanically corresponding sphere. The photonic plug assembly may include a movable grip connected to a separation surface. Movement of the movable grip may engage the separation surface with a corresponding surface of the receptacle such that the photonic plug assembly may be moved vertically away from the PIC. The photonic plug assembly may include a movable grip connected to the separation surface. Horizontal movement of the movable grip may be translated, via the separation surface, into a vertical force on the photonic plug assembly, causing vertical separation of the photonic plug and the PIC. The photonic plug assembly may include a movable grip connected to the separation surface. Horizontal movement of the movable grip may be translated into a vertical force on the photonic plug assembly via the separation surface, causing vertical separation of the photonic plug and the PIC and disengaging one or more first and second fine alignment features. The device may include a photonic plug. The device may include a receptacle.

[0102] The method may include multiple operations. The method may achieve a detachable optical connection between one or more optical fibers and a photonic integrated circuit (PIC) by coarsely aligning the photonic plug with the photonic integrated circuit (PIC) relative to a receptacle based on a first horizontal movement of the photonic plug, where the photonic plug is connected to one or more optical fibers, followed by vertically moving the photonic plug toward the PIC and finely aligning the photonic plug with the PIC based on the vertical movement. The method may retain the photonic plug via a retention mechanism associated with the photonic plug and the receptacle. The retention mechanism may apply a force to the photonic plug in the direction of the PIC. The fine alignment may cause a first fine alignment feature of the photonic plug to engage a second corresponding fine alignment feature associated with the PIC. The PIC may include an optical transceiver. Finely aligning the photonic plug with the PIC may align and substantially constrain the photonic plug relative to the PIC in one or more of a Z axis, a pitch axis, and a roll axis. Finely aligning the photonic plug with the PIC may align and substantially constrain the photonic plug relative to the PIC in one or more of the X-axis, Y-axis, and yaw-axis.

[0103] The method may include multiple operations. The method may disconnect a removable photonic plug from a receptacle and a photonic integrated circuit (PIC). The disconnection may involve horizontally moving a movable grip associated with the photonic plug to move a first separation surface associated with the photonic plug, engaging the first separation surface with a second separation surface of the receptacle based on the horizontal movement, and vertically moving the photonic plug from the PIC based on the engagement of the first and second separation surfaces. The method may horizontally extract the photonic plug from the receptacle after vertical movement of the photonic plug. The vertical movement of the photonic plug may disengage a first fine alignment feature of the photonic plug from a second fine alignment feature associated with the PIC. The first and second separation surfaces may have complementary sloped surfaces such that a horizontal force between the two surfaces can translate into a vertical force between the two surfaces. Vertical movement of the photonic plug may disengage one or more coarse alignment features between the photonic plug and the receptacle, and horizontal extraction may guide the photonic plug horizontally relative to the receptacle via one or more first coarse alignment features of the photonic plug and one or more corresponding second coarse alignment features of the receptacle.

[0104] Features herein are described with reference terms such as "top," "bottom," "lower," "top side," "bottom side," and similar terms. Such terms are used for ease of description and understanding. However, such terms should not be construed as limiting. For example, while the photonic plug 108 may be described as mating with the underside of the PIC 102 in one configuration, it will be understood that the methods, systems, and apparatus described herein may similarly be configured to mate the photonic plug 108 with the top side of the PIC 102.

[0105] Although examples have been described above, features and / or steps of these examples may be combined, divided, omitted, rearranged, modified, and / or extended in any desired manner. Various changes, modifications, and improvements will readily occur to those skilled in the art. Such changes, modifications, and improvements, although not expressly set forth herein, are intended to be a part of this specification and are intended to be within the spirit and scope of the present disclosure. Accordingly, the foregoing description is by way of example only and not by way of limitation.

Claims

1. 1. A system comprising: a photonic integrated circuit (PIC) associated with the one or more first microscopic alignment features; 1. A photonic plug configured to be attached to one or more optical fibers, comprising: one or more plug coarse alignment features; and a photonic plug comprising one or more second fine alignment features configured to engage with the one or more first fine alignment features and finely align the one or more optical fibers with the PIC; a receptacle configured to receive the plug and engage the one or more plug coarse alignment features to coarsely align the one or more optical fibers and the PIC; a retention mechanism configured to substantially retain the photonic plug within the receptacle relative to the PIC.

2. 2. The system of claim 1, wherein the PIC further comprises one or more transceivers, and wherein the engagement of the one or more first fine alignment features with the one or more second fine alignment features maintains alignment of the PIC with the one or more optical fibers such that the one or more transceivers are optically coupled to the one or more optical fibers.

3. The system of claim 1 or 2, further comprising a carrier substrate connected to the PIC, the carrier substrate comprising the first fine alignment features.

4. The system of any one of claims 1 to 3, wherein the carrier substrate further comprises photonic bumps, the photonic bumps comprising optical focusing elements.

5. the one or more first fine alignment features: The system of any one of claims 1 to 4, comprising a sphere or hemisphere.

6. The system of any one of claims 1 to 5, wherein the one or more second fine alignment features comprise v-grooves.

7. 7. The system of claim 1, wherein the one or more first fine alignment features and the one or more second fine alignment features are configured to engage with each other and to mechanically correspond to achieve the fine alignment of the PIC and the one or more optical fibers.

8. The system of any one of claims 1 to 7, further comprising three of each of the first fine alignment features and the second fine alignment features, the first fine alignment features and the second fine alignment features being arranged on the PIC and the photonic plug in a substantially isosceles triangular arrangement.

9. The system of any one of claims 1 to 8, wherein the fine alignment features maintain alignment between the PIC and the photonic plug in one or more of the Z axis, pitch axis, and roll axis.

10. 10. The system of claim 1, wherein the retention mechanism includes a spring connected to the photonic plug, the spring configured to exert a force on the photonic plug to move the photonic plug toward the PIC.

11. 11. The system of claim 1, wherein the one or more plug coarse alignment features comprise a notch in the photonic plug, and the receptacle comprises a cylinder configured to engage the notch upon vertical movement of the photonic plug toward the PIC.

12. 12. The system of claim 1, wherein the photonic plug comprises a movable grip connected to a separation surface, and movement of the movable grip moves the separation surface into engagement with a corresponding surface of the receptacle such that the photonic plug moves vertically away from the PIC.

13. A device comprising the photonic plug according to any one of claims 1 to 12.

14. A device comprising a receptacle according to any one of claims 1 to 12.

15. 1. A method comprising: A removable optical connection between one or more optical fibers and a photonic integrated circuit (PIC), coarsely aligning the photonic plug with a photonic integrated circuit (PIC) relative to a receptacle based on a first horizontal movement of the photonic plug, wherein the photonic plug is connected to one or more optical fibers; thereafter, moving the photonic plug vertically toward the PIC; and finely aligning the photonic plug with the PIC based on the vertical movement.

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