Brazing improvements to lamp housings for semiconductor rapid thermal processing (RTP) chambers.
A copper-containing brazing alloy with 3D printing techniques addresses the expense and seam integrity issues of conventional lamp assemblies, providing a cost-effective and reliable lamp housing for RTP chambers.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-08
- Publication Date
- 2026-03-06
AI Technical Summary
Conventional lamp assemblies for RTP chambers are expensive due to costly brazing materials and prone to voids and cracks in brazing seams.
A lamp housing design using a copper-containing brazing alloy without gold, combined with 3D printing techniques, to create a more cost-effective and robust brazed joint for lamp assemblies in RTP chambers.
Reduces costs and enhances the integrity of brazed seams by minimizing voids and cracks, ensuring reliable thermal processing in RTP chambers.
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Figure 2026507939000001_ABST
Abstract
Description
[Technical Field]
[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to substrate processing equipment. [Background technology]
[0002] During rapid thermal processing (RTP) of a substrate, thermal radiation is typically used to rapidly heat the substrate in a controlled environment to a maximum temperature of up to about 1350°C. This maximum temperature is maintained for a specific period of time ranging from less than a second to several minutes depending on the particular process. The substrate is then cooled to room temperature for further processing.
[0003] Lamps are commonly used as thermal radiation sources in RTP chambers. Current lamp assembly designs include a lamp body, a bulb, and a base coupled to the lamp body. Lamp assemblies are typically made of components brazed together. However, conventional brazing materials for lamp assemblies are expensive. In addition, the brazing seams of conventional lamp assemblies can be prone to voids and cracks.
[0004] Accordingly, the present inventors have described herein an improved lamp design having reduced cost and improved brazed seams. Summary of the Invention
[0005]
[0003] Embodiments of a lamp housing for a process chamber are described herein. In some embodiments, the lamp housing for a process chamber includes: a first plate having a plurality of first openings, a copper plate having a plurality of second openings, a plurality of tubes, the plurality of tubes being brazed to the first plate at first ends of the plurality of tubes with a brazing alloy and brazed to the copper plate at second ends of the plurality of tubes with a brazing alloy, the plurality of tubes having a central opening aligned with the plurality of first openings and the plurality of second openings, the brazing alloy comprising a nickel-containing alloy or a copper-containing alloy, and the copper-containing alloy not comprising gold; and an annular jacket circumscribing the plurality of tubes and brazed to the first plate with a brazing alloy.
[0006] In some embodiments, a lamp housing for a process chamber includes: a first plate made of a first material having a plurality of first openings; a copper plate having a plurality of second openings; a plurality of tubes, the plurality of tubes being brazed to the first plate at first ends of the plurality of tubes with a brazing alloy and brazed to the copper plate at second ends of the plurality of tubes with a brazing alloy, the plurality of tubes having a central opening aligned with the plurality of first openings and the plurality of second openings, the brazing alloy comprising a copper-containing alloy and no gold; and an annular jacket made of the first material circumscribing the plurality of tubes, the annular jacket being brazed to the first plate with a brazing alloy and bonded to the copper plate.
[0007] In some embodiments, a method of forming a lamp housing for a process chamber includes depositing a brazing alloy at a plurality of first interfaces disposed between a first plate of the lamp housing and a plurality of hollow tubes of the lamp housing, at a plurality of second interfaces disposed between a copper plate of the lamp housing and the plurality of hollow tubes, and at a third interface disposed between an annular jacket of the lamp housing disposed around the plurality of hollow tubes and the first plate, wherein the brazing alloy includes a copper-containing alloy, and the copper-containing alloy does not include gold; and heating the brazing alloy to join the plurality of hollow tubes to the first plate, to join the plurality of hollow tubes to the copper plate, and to join the annular jacket to the first plate.
[0008] Other and additional embodiments of the present disclosure are described below.
[0009] Embodiments of the present disclosure, briefly outlined above and discussed in more detail below, can be understood by reference to exemplary embodiments of the present disclosure illustrated in the accompanying drawings. However, the accompanying drawings depict only typical embodiments of the present disclosure and, therefore, should not be considered limiting in scope, as the present disclosure may embrace other embodiments that are equally effective. [Brief explanation of the drawings]
[0010] [Figure 1] 1 is a schematic cross-sectional side view of a rapid thermal processing (RTP) chamber according to at least some embodiments of the present disclosure. [Figure 2] FIG. 1 is a partial cross-sectional isometric top view of a lamp housing according to at least some embodiments of the present disclosure. [Figure 3] 1 is a cross-sectional side view of a portion of a lamp housing according to at least some embodiments of the present disclosure. [Figure 4] 1 is a cross-sectional side view of a portion of a lamp housing according to at least some embodiments of the present disclosure. [Figure 5]1 is a cross-sectional side view of a portion of a lamp housing according to at least some embodiments of the present disclosure. [Figure 6] FIG. 10 is a cross-sectional side view of an interface between a jacket of a lamp housing and a copper plate of the lamp housing according to at least some embodiments of the present disclosure. [Figure 7] 1 is a flow diagram of a method of forming a lamp housing for a process chamber in accordance with at least some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION
[0011] To facilitate understanding, the same reference numerals have been used, where possible, to designate identical elements common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without additional description.
[0012] Described herein are embodiments of a lamp housing for a process chamber. The process chamber may be a rapid thermal processing (RTP) chamber. The lamp housing generally includes a plurality of tubes brazed to one or more plates with a brazing alloy and an annular jacket surrounding the plurality of tubes, the annular jacket also brazed to the one or more plates with the brazing alloy. The one or more plates include copper plates. The plurality of tubes are made of a first material. The brazing alloy is generally made of a material that is resistant to corrosion when combined with copper and has a liquidus temperature lower than the melting temperature of copper. This brazing alloy is advantageously more cost-effective than conventional brazing alloys used with lamp housings for RTP chambers. The one or more plates may advantageously include features such as grooves, slots, or chamfers to improve the integrity of the brazed joint. The brazing alloy is generally made of a material that is resistant to corrosion when combined with copper and has a liquidus temperature lower than the melting temperature of copper. The brazing alloy may be in the form of a wire or a flat shim, or a combination of these forms. In some embodiments, the braze alloy is formed using 3D printing or additive manufacturing techniques.
[0013] FIG. 1 shows a schematic cross-sectional side view of an RTP chamber according to at least some embodiments of the present disclosure. As shown in FIG. 1, the RTP chamber 100 generally includes a chamber body having a sidewall 14 and a bottom wall 15 to define an interior volume 13 therein. The sidewall 14 and bottom wall 15 are made of a metal, such as stainless steel. The top of the sidewall 14 is sealed to a window assembly 17 by an "O" ring 16. A lamp housing 18 is disposed above and coupled to the window assembly 17. The lamp housing 18 contains a plurality of lamps 19, e.g., tungsten halogen lamps, each mounted within a plurality of tubes 21, which may be stainless steel, brass, aluminum, or other metal.
[0014] Within the interior volume 13, a substrate 61, e.g., a wafer, is supported along its edge by a substrate support 62 made of a ceramic material such as silicon carbide. The substrate support 62 is mounted on a rotatable quartz cylinder 63. Rotating the quartz cylinder 63 rotates the substrate support 62 and the substrate 61. Additional ceramic adapter rings can be used to allow for processing of substrates of different diameters (e.g., 150 mm and 200 mm). The outer edge of the substrate support 62 preferably does not extend more than 2 inches beyond the outer diameter of the substrate 61. In some embodiments, the interior volume 13 has a volume of approximately 2 liters.
[0015] The bottom wall 15 of the RTP chamber 100 includes a reflective surface 11 for reflecting energy to the backside of the substrate 61. In some embodiments, the reflective surface 11 is a gold-coated top surface. Additionally, the RTP chamber 100 may include multiple fiber optic probes 70 positioned through the bottom wall 15 of the RTP chamber 100 to detect the temperature of the substrate 61 at multiple locations across the bottom surface of the substrate 61. The reflection between the backside of the substrate 61 and the reflective surface 11 creates a blackbody cavity. The blackbody cavity makes the temperature measurement independent of the emissivity of the substrate backside, thereby providing accurate temperature measurement capabilities.
[0016] To enable various processing steps to be performed within the RTP chamber 100, the RTP chamber 100 includes a gas inlet 69 formed through the sidewall 14 for injecting process gases into the interior volume 13. A gas source, such as a tank of an oxygen-containing gas such as O or a tank of a hydrogen-containing gas such as H, is coupled to the gas inlet 69. A gas outlet 68 is disposed on the sidewall 14 opposite the gas inlet 69. The gas outlet 68 is coupled to a vacuum source, such as a pump, to evacuate the process gases from the interior volume 13 and to reduce the pressure within the interior volume 13. During processing, the vacuum source maintains a desired pressure while the RTP chamber 100 is constantly supplied with process gases.
[0017] The plurality of lamps 19 may generally include a filament wound as a coil with its axis parallel to the axis of the lamp envelope. A majority of the light is emitted perpendicular to this axis, toward the sidewalls of the surrounding ones of the plurality of tubes 21. The substrate support 62 may be a support ring. The length of the plurality of tubes 21 is selected to be at least as long as the associated lamp. However, the length of the plurality of tubes 21 may be longer than the associated lamp, so long as the power reaching the substrate 61 is not substantially attenuated by increased reflections. In some embodiments, the plurality of tubes 21 includes 100 or more tubes. In some embodiments, the plurality of tubes 21 includes 300 or more tubes. In some embodiments, the plurality of tubes 21 is arranged in a hexagonal array or "honeycomb," as shown, for example, in FIG. 2.
[0018] The lamps 19 are positioned to sufficiently cover the entire surface area of the substrate 61 and substrate support 62. In some embodiments, the tubes 21 are grouped into zones that can be controlled independently to provide highly uniform heating of the substrate 61. The tubes 21 can be cooled by flowing a coolant, such as water, between the various tubes. The lamp housing 18 with the tubes 21 and associated lamps 19 allows for the use of thin quartz windows to provide light ports for heating the substrate 61 within the RTP chamber 100.
[0019] In some embodiments, the lamp housing 18 includes a copper plate 44 having a plurality of second openings 41. In some embodiments, the copper plate 44 is made of oxygen-free copper. The plurality of second openings 41 are generally aligned with and brazed to the plurality of tubes 21. In some embodiments, the lamp housing 18 includes one or more quartz plates. For example, the lamp housing 18 may include a quartz plate 48 bonded to the copper plate 44. In some embodiments, the lamp housing 18 includes a quartz plate 47 disposed between the copper plate 44 and the plurality of tubes 21. In some embodiments, the quartz plates 47, 48 may be sealed by "O" rings 49 and 51 near the copper plate 44 and / or the sidewall 14. In some embodiments, a vacuum can be created in the plurality of second openings 41 by pumping through a tube 53.
[0020] The RTP chamber 100 is typically a single-substrate reaction chamber capable of increasing the temperature of the substrate 61 at a rate of 25-100°C / sec. The RTP chamber 100 is referred to as a "cold-wall" reaction chamber because the temperature of the substrate 61 during the oxidation process is at least 400°C higher than the temperature of the chamber sidewalls 14. Heating / cooling fluids can be circulated through the sidewalls 14 and / or bottom wall 15 to maintain the walls at a desired temperature. In some embodiments, the RTP chamber 100 is configured as part of a "cluster tool" that includes a load lock and a transfer chamber with a robotic arm. In some embodiments, the RTP chamber 100 is configured as a stand-alone tool.
[0021] FIG. 2 illustrates a partial cross-sectional isometric top view of a lamp housing 18 according to at least some embodiments of the present disclosure. The lamp housing 18 includes a top plate 206, such as a first plate, made of a first material. The top plate 206 includes a plurality of first openings 212. The lamp housing 18 includes a plurality of tubes 21, which are brazed to the top plate 206 at upper ends 216, such as first ends, of the plurality of tubes 21 with a brazing alloy. Lower ends 224, such as second ends, of the plurality of tubes 21 are brazed to a copper plate 44 with a brazing alloy. The copper plate 44 includes a plurality of second openings 41. The plurality of tubes 21 have a central opening 210 aligned with the plurality of first openings 212 in the top plate 206 and the plurality of second openings 41 in the copper plate 44. In some embodiments, the plurality of tubes 21 are made of the first material. In some embodiments, the first material does not include copper. In some embodiments, the first material is stainless steel.
[0022] The lamp housing 18 includes an annular jacket 220 that circumscribes the plurality of tubes 21 and is brazed to the top plate 206 with a brazing alloy. In some embodiments, the annular jacket 220 is made of a first material. The annular jacket 220 facilitates the flow of coolant within the annular jacket 220 and between the various tubes of the plurality of tubes 21 for cooling the tubes. In some embodiments, the annular jacket 220 includes an annular ring 226 and a bottom flange 228. The bottom flange 228 is disposed around and bonded to the copper plate 44. The bottom flange 228 facilitates bonding the lamp housing 18, for example, bonding the lamp housing 18 to the sidewall 14. In some embodiments, an upper surface 232 of the bottom flange 228 includes an annular recess 230. A top ring 234 may be disposed within the annular recess 230 to cover an opening in the annular recess 230 that is configured to allow bonding of the bottom flange 228 to the sidewall 14.
[0023] In use, when heated, the brazing alloy liquefies to fill the desired joint between multiple components, and then joins the multiple components when the liquefied brazing alloy cools. In some embodiments, the brazing alloy comprises a nickel-containing alloy or a copper-containing alloy, and the copper-containing alloy does not include gold. In some embodiments, the brazing alloy comprises one of a titanium-nickel alloy, a silver-copper-tin-titanium alloy, a silver-copper-indium-titanium alloy, a copper-manganese-nickel alloy, a copper-germanium-nickel alloy, a silver-copper-lead alloy, or a gold-nickel alloy. Gold-nickel alloys are more expensive than the remaining brazing alloy materials mentioned above, but have beneficial wetting and flow properties that reduce delamination and voids in the brazing joint.
[0024] In some embodiments, the brazing alloy comprises a gold-free copper alloy. In some embodiments, the brazing alloy does not contain materials such as iron, carbon, zinc, lead, or aluminum that cause corrosion when combined with copper. In some embodiments, the brazing alloy is a copper-germanium alloy. For example, the brazing alloy may be a copper-germanium-nickel alloy having about 60 to about 90% by weight copper, about 5 to about 40% by weight germanium, and about 0.1 to about 0.5% by weight nickel. In some embodiments, the brazing alloy is a silver-copper-tin-titanium alloy having about 50 to about 70% by weight silver, about 25 to about 45% by weight copper, about 0.5 to about 2% by weight tin, and about 1 to about 3% by weight titanium. In some embodiments, the brazing alloy is a silver-copper-indium-titanium alloy having about 50 to about 70 weight percent silver, about 20 to about 40 weight percent copper, about 10 to about 15 weight percent indium, and about 0.5 to about 3 weight percent titanium.
[0025] In some embodiments, the top plate 206 includes an annular groove 238 for accommodating an upper lip 242 of the annular jacket 220. In some embodiments, the upper surface of the copper plate 44 includes an annular groove 214 for accommodating an inner lip 248 of the bottom flange 228. In some embodiments, the top plate 206 includes openings 218 disposed about the periphery of the top plate 206 to facilitate coupling the top plate 206 to other components of the RTP chamber 100.
[0026] 3 shows a cross-sectional side view of a portion of lamp housing 18 according to at least some embodiments of the present disclosure. In some embodiments, lower surface 302 of top plate 206 includes a chamfer 310 adjacent an interface 312 between annular jacket 220 and top plate 206. In some embodiments, braze alloy 316 is disposed between annular jacket 220 and top plate 206. In some embodiments, braze alloy 316 is part of an outer sidewall 318 of upper lip 242, a top surface 320 of upper lip 242, and an inner sidewall 322 of upper lip 242.
[0027] In use, when heated, the braze alloy 316 liquefies and fills the joint between the upper lip 242 and the annular groove 238 in the top plate 206, subsequently bonding the upper lip 242 to the top plate 206 when the liquefied braze alloy 316 cools. The chamfer 310 may advantageously promote capillary action when the braze alloy 316 is heated, which may enhance the integrity of the brazed joint and reduce voids. A braze alloy 346 may be disposed around each of the plurality of tubes 21 to couple the plurality of tubes 21 to the top plate 206. In some embodiments, the braze alloy 346 is at least partially disposed within an annular slot 342 formed adjacent the upper surface 306 of the top plate 206 for each of the plurality of tubes 21.
[0028] 3, the braze alloy 316 may be a 3D printed part based on the actual dimensions of the gap between the upper lip 242 and the annular groove 238. For example, the 3D printed braze alloy 316 may have sidewalls of varying wall thicknesses to accommodate different dimensions of the gap between the inner sidewall 322 of the upper lip 242 and the opposite sidewall of the annular groove 238. In some embodiments, as shown in FIG. 5, the braze alloy 316 may take the form of a wire or flat shim having substantially uniform dimensions along its length.
[0029] 4 illustrates a cross-sectional side view of a portion of lamp housing 18 according to at least some embodiments of the present disclosure. In some embodiments, a brazing alloy 410 may be disposed adjacent to a top surface 414 of copper plate 44 around one or more of the plurality of tubes 21. In some embodiments, the plurality of tubes 21 may be bonded to copper plate 44 at a location vertically below top surface 414. For example, in some embodiments, copper plate 44 includes an annular groove 426 in a sidewall 406 of each of the plurality of second openings 41 to accommodate brazing alloy 428. In some embodiments, the plurality of tubes 21 are bonded to copper plate 44 by both brazing alloy 410 and brazing alloy 428 for added strength.
[0030] In some embodiments, brazing alloy 410 is in the form of a wire. In some embodiments, brazing alloy 410 is 3D printed based on the actual outer diameter of each tube of plurality of tubes 21 to advantageously ensure a good brazed joint. In some embodiments, brazing alloy 428 is in the form of a wire. In some embodiments, brazing alloy 428 is 3D printed based on the actual dimensions of each annular groove of annular groove 426 to advantageously ensure a good brazed joint. In some embodiments, brazing alloy 432 may be disposed within annular groove 214 of copper plate 44 to accommodate bonding of annular jacket 220 to copper plate 44. In some embodiments, brazing alloy 432 is disposed on a lower surface 440 of the annular groove. In some embodiments, brazing alloy 432 is in the form of a wire, a flat shim, or a 3D printed part.
[0031] FIG. 6 shows a cross-sectional side view of an interface 610 between the annular jacket 220 of the lamp housing 18 and the copper plate 44 of the lamp housing 18 according to at least some embodiments of the present disclosure. In some embodiments, the annular jacket 220 is brazed to the copper plate 44 by a braze alloy 432 disposed in the annular groove 214. In some embodiments, the braze alloy 432 is disposed along the inner surface 606 of the annular groove 214, the outer surface 612 of the annular groove 214, and the lower surface 440 of the annular groove 214. In some embodiments, the copper plate 44 includes a second annular groove 608 disposed in the annular groove 214, for example, a second annular groove 608 disposed within the annular groove 214 along the inner surface 606 or the outer surface 612 (along the outer surface 612 as shown in FIG. 6 ). The braze alloy 432 may be disposed in the second annular groove 608. In some embodiments, the braze alloy 432 takes the form of a wire or a flat shim. In some embodiments, the braze alloy 432 is 3D printed.
[0032] FIG. 7 illustrates a flow diagram of a method 700 for forming a lamp housing (e.g., lamp housing 18) for a process chamber (e.g., RTP chamber 100) according to at least some embodiments of the present disclosure. At 702, the method 700 includes depositing a braze alloy (e.g., braze alloy 346) at a plurality of first interfaces disposed between a top plate (e.g., top plate 206) of the lamp housing and a plurality of tubes (e.g., a plurality of tubes 21) of the lamp housing. At 702, the method 700 further includes depositing a braze alloy (e.g., braze alloy 410, braze alloy 428) at a plurality of second interfaces disposed between a copper plate (e.g., copper plate 44) of the lamp housing and a plurality of hollow tubes. At 702, the method 700 further includes depositing a braze alloy (e.g., braze alloy 432) at a third interface disposed between an annular jacket (e.g., annular jacket 220) of the lamp housing disposed around the plurality of hollow tubes and the top plate.
[0033] Brazing alloys are generally made of materials that are resistant to corrosion when combined with copper and have a liquidus temperature lower than the melting temperature of copper. For example, brazing alloys include nickel-containing alloys or copper-containing alloys, where the copper-containing alloy does not contain gold. In some embodiments, the brazing alloy is a copper-germanium-nickel alloy having about 60 to about 90 weight percent copper, about 5 to about 40 weight percent germanium, and about 0.1 to about 0.5 weight percent nickel.
[0034] In some embodiments, at least a portion of the brazing alloy is in the form of a wire. In some embodiments, the method 700 includes forming a plurality of 3D printed brazed parts including the brazing alloy based on dimensions of the plurality of first interfaces, the plurality of second interfaces, and the third interface, and depositing the brazing alloy includes depositing corresponding ones of the 3D printed brazed parts at corresponding interfaces of the plurality of first interfaces, the plurality of second interfaces, and the third interfaces. The dimensions of the plurality of first interfaces, the plurality of second interfaces, and the third interfaces may be obtained using any suitable technique.
[0035] In some embodiments, the plurality of second interfaces include respective annular grooves (e.g., annular groove 426) formed in the copper plates. In some embodiments, placing a braze alloy (e.g., braze alloy 428) at the plurality of second interfaces includes placing the braze alloy in the annular grooves to form a stronger bond therebetween. In some embodiments, the third interface includes an annular groove (e.g., second annular groove 608) formed in the copper plates. In some embodiments, a braze alloy (e.g., braze alloy 432) is disposed along two or more sides of or surrounds the portion of the annular jacket that extends into second annular groove 608 to form a better brazed seam with minimal or reduced voids and cracks formed in the brazed seam.
[0036] At 704, the method 700 includes heating a braze alloy to a suitable temperature to bond the plurality of hollow tubes to the top plate, to bond the plurality of hollow tubes to the copper plate, and to bond the annular jacket to the top plate, for example, heating the braze alloy to a temperature above the liquidus temperature of the braze alloy and below the melting temperature of copper.
[0037] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof.
Claims
1. 1. A lamp housing for a process chamber, comprising: a first plate having a plurality of first openings; a copper plate having a plurality of second openings; a plurality of tubes, the plurality of tubes being brazed at first ends of the plurality of tubes to the first plate with a brazing alloy and brazed at second ends of the plurality of tubes to the copper plate with the brazing alloy, the plurality of tubes having a central opening aligned with the plurality of first openings and the plurality of second openings, the brazing alloy comprising a nickel-containing alloy or a copper-containing alloy, and the copper-containing alloy not comprising gold; an annular jacket circumscribing the plurality of tubes, the annular jacket being brazed to the first plate by the brazing alloy; A lamp housing comprising:
2. 10. The lamp housing of claim 1, wherein the braze alloy comprises at least one of a wire form or a flat shim form.
3. The brazing alloy is Titanium-nickel alloy, silver-copper-tin-titanium alloy, silver-copper-indium-titanium alloy, copper-manganese-nickel alloy, copper-germanium-nickel alloy, silver-copper-lead alloy, or Gold-nickel alloy The lamp housing of claim 1 , comprising:
4. 10. The lamp housing of claim 1, wherein the lower surface of the first plate includes a chamfer adjacent the interface between the annular jacket and the first plate.
5. 2. The lamp housing of claim 1, wherein the copper plate includes an annular groove in a sidewall of each of the plurality of second openings for accommodating the brazing alloy.
6. The lamp housing according to any one of claims 1 to 5, wherein the copper plate includes an annular groove on an upper surface of the copper plate for accommodating the annular jacket.
7. 7. The lamp housing of claim 6, wherein the annular jacket is brazed to the copper plate by the brazing alloy disposed in the annular groove, the brazing alloy being disposed along the inner surface of the annular groove, the outer surface of the annular groove, and the lower surface of the annular groove.
8. 6. A lamp housing as described in any one of claims 1 to 5, wherein the first plate includes an annular groove for accommodating an upper lip of the annular jacket, and the brazing alloy disposed between the annular jacket and the first plate extends along an outer sidewall of the upper lip, a top surface of the upper lip, and an inner sidewall of the upper lip.
9. The lamp housing of any one of claims 1 to 5, further comprising a bottom flange disposed around the copper plate, the bottom flange being coupled to the copper plate.
10. 6. The lamp housing of claim 1, wherein the first plate is made of a first material, the annular jacket is made of the first material and is bonded to the copper plate, and the brazing alloy includes the copper-containing alloy.
11. 11. The lamp housing of claim 10, wherein the braze alloy is a copper-germanium-nickel alloy having about 60 to about 90 weight percent copper, about 5 to about 40 weight percent germanium, and about 0.1 to about 0.5 weight percent nickel.
12. 11. The lamp housing of claim 10, wherein the first material is copper-free.
13. 11. The lamp housing of claim 10, wherein the first material is stainless steel.
14. a chamber body defining an interior volume therein; a lamp housing according to claim 10 disposed in an upper portion of the interior volume; a plurality of lamps disposed within the lamp housing; a substrate support disposed within the interior volume, a quartz window disposed between the plurality of lamps and the substrate support. Rapid thermal processing chamber.
15. 1. A method of forming a lamp housing for a process chamber, comprising: disposing a brazing alloy at a plurality of first interfaces disposed between a first plate of a lamp housing and a plurality of hollow tubes of the lamp housing, at a plurality of second interfaces disposed between a copper plate of the lamp housing and the plurality of hollow tubes, and at a third interface disposed between an annular jacket of the lamp housing disposed around the plurality of hollow tubes and the first plate, the brazing alloy comprising a nickel-containing alloy or a copper-containing alloy, the copper-containing alloy not containing gold; heating the brazing alloy to bond the plurality of hollow tubes to the first plate, to bond the plurality of hollow tubes to the copper plate, and to bond the annular jacket to the first plate; A method comprising:
16. 16. The method of claim 15, further comprising forming a plurality of 3D printed brazed parts including the braze alloy based on dimensions of the plurality of first interfaces, the plurality of second interfaces, and the third interface, wherein depositing the braze alloy comprises depositing corresponding braze parts of the 3D printed plurality of brazed parts at corresponding interfaces of the plurality of first interfaces, the plurality of second interfaces, and the third interfaces.
17. The method of claim 15 wherein at least a portion of the braze alloy is in the form of a wire.
18. 18. The method of any one of claims 15 to 17, wherein the brazing alloy is a copper-germanium-nickel alloy having about 60 to about 90 weight percent copper, about 5 to about 40 weight percent germanium, and about 0.1 to about 0.5 weight percent nickel.
19. 18. The method of any one of claims 15 to 17, wherein the plurality of second interfaces comprises annular grooves formed in the copper plate, and wherein depositing the braze alloy at the plurality of second interfaces comprises depositing the braze alloy in the annular grooves.
20. The brazing alloy does not contain copper. The method according to any one of claims 15 to 17.
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