Real-time PCBA monitoring and warning system

Abstract

The system is for real-time monitoring of a PCBA assembly line comprising multiple assembly stations. The system comprises at least one imaging system for each of the multiple assembly stations, wherein the assembly station includes an imaging system operable to acquire an assembly station image of a PCBA being assembled at the assembly station, and at least one processing system configured to process the assembly station image acquired for the PCBA to generate a real-time product quality (QoP) feature vector, QoP-FV, wherein the processing system has at least one real-time component that provides a real-time display of the quality of the features of the PCBA at substantially the same time that the PCBA is at the assembly station.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims the benefit of U.S. Provisional Application 63 / 447,774, filed Feb. 23, 2023, under 35 U.S.C. 119(e), the disclosure of which is incorporated herein by reference.

[0002] Embodiments of the present invention relate to providing product quality (QoP) metrics (measures) for printed circuit board assemblies (PCBA), using the QoP metrics to monitor and control equipment within a PCBA assembly line, and providing improved traceability data for PCBA assembled by the assembly line.

Background Art

[0003] Quality management and traceability are, for example, the bedrock partner technologies that underlie the safe and reliable operation of complex devices and systems that color, if not determine, almost all aspects of modern human activity, including, by way of example, modern forms of play, communication, transportation, governance, biotechnology, and medicine.

[0004] In the electronics industry, which produces, constructs, and assembles the ever - present electronic circuits that provide, support, and format the devices and systems that support modern activity, quality management can be provided by automatic or manual visual inspection of circuits and circuit assemblies. Traceability can be provided by storing data in a logistical log in response to inspection.

[0005] In surface mounted technology (SMT), a highly automated mainstream technology for manufacturing electronic circuits, electronic components are assembled onto printed circuit boards (PCBs) by pick-and-place robots (P&P) located at various assembly stations on the PCB circuit assembly line. Components are supplied in packaging units (PUs), generally in the form of reels, trays, stick magazines, or bulk, configured to be mounted to or accessed by P&P robots. The robots remove the components from the PUs and carefully position them at designated locations on the conductive PCB traces formed on the PCB, ensuring that the conductive leads of the components make contact with the traces. Following the positioning of the components on the traces, the components are fixed to the traces and electrically connected by a soldering process, such as a reflow soldering process. The completed electronic circuit is traditionally referred to as a PCB assembly, typically abbreviated as PCBA.

[0006] Quality control and traceability data for PCBAs generated by PCBA assembly lines are acquired by automated imaging systems included in the assembly line. These systems image the placement of electronic components on the PCB and read the labeling and / or associated logistics data for the components and PUs. Data acquisition and management are complex and constantly challenged by the increasing demand for faster production and development of new types of PCBAs. [Overview of the project]

[0007] Aspects of the embodiments of this disclosure relate to providing a method and device for providing a real-time dynamic self-adjusting system, optionally referred to as a Dynamic QoP (Quality of Product) system or simply Dynamic QoP, for monitoring a PCBA assembly line and acquiring high-resolution QoP data of PCBAs assembled by the assembly line. The QoP data provides a real-time measure of the quality of the PCBAs in assembly. In one embodiment, the QoP data is used to control the Dynamic QoP and / or hardware and / or software components of the PCBA assembly line in real time to improve the quality of the data acquired by Dynamic QoP and / or the operation of the PCBA assembly line. In one embodiment, the QoP data is stored to provide traceability data and may optionally be used in real time to alert a user to quality problems related to the operation of the PCBAs and / or the PCBA assembly line.

[0008] Dynamic QoP is configured to acquire at least one image, also called an assembly station image, of the PCBA being assembled by the PCBA assembly line at each of several different assembly stations included in the assembly line during the assembly of the PCBA. An image of the PCBA being assembled at an assembly station refers to an image of at least one part (component) of the PCBA while the PCBA is located at the assembly station, or an image of at least one part of the PCBA acquired after the PCBA has left the assembly station, so that an image of the PCBA while it was located at the assembly station can be inferred from that assembly station. In one embodiment, the at least one assembly station image may be acquired using any of various imaging modalities, such as 2D imaging, 3D imaging, IR imaging, and / or X-ray imaging. Dynamic QoP processes the at least one assembly station image to optionally generate PCBA QoP data in real time, which is associated with the assembly state of the PCBA at the assembly station and thereby with quality.

[0009] In one embodiment, real-time refers to the time following an event in a PCBA assembly line, elapsed at a time shorter than the time it takes for the PCBA being assembled on the assembly line to traverse the assembly line from the first assembly station to the last assembly station. Real-time data is valid event data in the PCBA assembly line that is accessible within the time elapsed from the event, which is shorter than the time it takes for the PCBA to traverse the assembly line from the first assembly station to the last assembly station. Optionally, the elapsed time is shorter than the time it takes for the PCB to travel from a given assembly station to the next subsequent assembly station in the assembly line.

[0010] In one embodiment, the QoP data includes a set called a QoP feature vector (QoP-FV), which includes a plurality of component QoPs that provide respective real-time displays of quality for different features of the PCBA. q (1 < q < Q). The symbol QoP-FV = {QoP q |1 < q < Q}. The dynamic QoP can operate to determine a first feature vector (QoP-FV) for the PCBA in the first assembly station in response to a second feature vector QoP-FV determined for the PCBA in the second assembly station.

[0011] In one embodiment, determining the first QoP-FV in response to the second QoP-FV may include the following. It includes 1) modifying the dynamic QoP and / or the assembly line equipment in the first assembly station in response to the second QoP-FV to obtain a first assembly station image of the PCBA in the first assembly station, 2) changing an algorithm for processing the first assembly station image of the PCBA obtained in the first assembly station in response to the second QoP-FV, and / or 3) using the same algorithm used to process the second assembly station image to process the first assembly station image in response to the second QoP-FV.

[0012] For example, modifying dynamic QoP equipment may include modifying intrinsic or extrinsic parameters of the camera system that acquires assembly station images of the PCBA. Modifying assembly line equipment may include changing the speed at which P&P removes electronic components from PU and PCBA places components on the PCB being assembled. Modifying an algorithm may include adjusting the hyperparameters of the algorithm. Furthermore, a process using the same algorithm may include using data from a second QoP-FV as input data to the algorithm that processes assembly station images from a first assembly line station.

[0013] Determining the first QoP-FV in response to a second QoP-FV may work to improve the quality and resolution of the first QoP-FV for use in detecting and identifying defective features that may damage or limit the function and / or lifespan of the PCBA. Defective features may include, for example, corrosion or physical damage to leads of electronic components of the PCBA mounted on conductive traces of the PCB contained in the PCBA, defective PCB traces, and / or abnormal deviations in the orientation of electronic components placed on the traces.

[0014] In one embodiment, the dynamic QoP is configured to generate control signals in response to a QoP-FV determined by the dynamic QoP to control equipment included in a PCBA assembly line that works together to assemble a PCBA. Controlling PCBA assembly line equipment may include controlling the operation of a P&P robot, the intrinsic and extrinsic parameters of an automated optical inspection (AOI) camera, and the temperature of a reflow oven in the assembly line.

[0015] Dynamic QoP may have and / or access to processing and storage hardware, as well as data and / or executable instructions and any preferred configuration thereof, for processing assembly station images to generate the QoP data and support functions provided by Dynamic QoP. The data and / or executable instructions, hereafter referred to as software, as well as the hardware configuration, may be at least partially cloud-based.

[0016] This summary is provided to introduce in a simplified form the selection of concepts further described below in modes for carrying out the invention. This summary is not intended to identify any important or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. [Brief explanation of the drawing]

[0017] Non-limiting embodiments of the embodiments of this disclosure are described below with reference to the drawings accompanying this specification, which are enumerated in this paragraph. Identical features appearing in multiple figures are generally marked with the same symbols in all figures in which they appear. Labels that label icons representing given features in the figures of embodiments of this disclosure may be used to refer to given features. Dimensions of features shown in the drawings have been selected for convenience and clarity of presentation and are not necessarily shown to scale.

[0018] [Figure 1A] Figure 1A schematically shows a dynamic QoP for monitoring an SMT assembly line that assembles PCBAs, according to an embodiment of the present disclosure. [Figure 1B] Figure 1B schematically shows a dynamic QoP for monitoring an SMT assembly line that assembles PCBAs, according to an embodiment of the present disclosure. [Modes for carrying out the invention]

[0019] In the discussion, unless otherwise stated, adjectives such as “substantially” and “about” that modify the condition or relational characteristics of one or more features of the embodiments of the Disclosure are understood to mean that the condition or characteristic is defined within the permissible range permitted for the operation of the embodiments in the intended use. Wherever a general term in the Disclosure is indicated by reference to an exemplary instance or a list of exemplary instances, the instance(s) referenced are instances of the general term by non-exclusive example, and the general term is not intended to be limited to the specific exemplary instance(s) referenced. The phrase “in one embodiment” is used to introduce, for consideration, an exemplary but not necessarily required configuration of possible embodiments of the Disclosure, whether associated with permissibles such as “possibly,” “optionally,” or “as an example.” Each of the verbs “comprise,” “include,” and “have,” and their conjugations, is used to indicate that the object(s) of the verbs are not necessarily a complete enumeration of parts, elements, or portions of the subject(s) of the verbs. Unless otherwise indicated, the term “or” in the description and claims shall be deemed to be an inclusive, not exclusive, “or” indicating at least one or any combination of the items to which it is joined.

[0020] Figures 1A and 1B show a very schematic diagram of an SMT PCBA assembly line 20 that assembles a PCBA 100 (shown in Figure 1B) according to an embodiment of the present disclosure, and a dynamic QoP system 200 that monitors the SMT assembly line and determines and uses the PCBA's QoP data to facilitate the assembly line's operation.

[0021] The SMT assembly line 20 optionally includes, for example, four assembly stations. It includes a solder screen printing assembly station 30 schematically shown in FIG. 1A, P&P assembly stations 50 and 70 schematically shown in FIGS. 1A and 1B respectively, and a reflow soldering assembly station 90 which is the last assembly station of the SMT assembly line 20 schematically shown in FIG. 1B.

[0022] The screen printing assembly station 30 optionally includes a PCB line loader 31 shown with a stack 32 of PCBs 33 printed with a pattern of conductive traces (not shown), a conveyor belt 34, and a screen printer represented by a squeegee 37. The conveyor belt 34 receives the PCB 33 from the line loader 31, moves the received PCB 33 through the screen printer 37, and the screen printer 37 prints a pattern of solder (not shown) that matches and overlaps the pattern of conductive traces printed on the PCB. After screen printing, the conveyor 34 moves the screen printed PCB 33 through the field of view (FOV) of an automatic optical inspection (AOI) camera 38, where it is imaged by the camera for quality control inspection and then moved to the P&P assembly station 50. A station controller 39 controls the loader, conveyor belt, and screen printer.

[0023] FIG. 1A schematically shows the assembly station 30 that screen prints and inspects a particular PCB 33* on which the electronic components of the PCBA 100 are assembled at the P&P assembly stations 50 and 70. The fully assembled PCBA 100 is shown at the last assembly station 90.

[0024] The P&P assembly station 50 is assumed to include a P&P robot 51 configured to receive electronic components from component reels for positioning on a PCB. The P&P robot is shown in a state where it is loaded with a plurality of component reels 60 that carry various electronic components 62 to be assembled on the screen printed PCB 33 received by the assembly station 50 from the assembly station 30. The P&P robot 51 includes a P&P robot arm 52 for removing the component 62 from the reel 60 and placing the component on the screen printed PCB substrate 33 received from the assembly station 30, and an operation camera 53 for assisting and monitoring the operation of the P&P robot. The operation camera 53 is configured and arranged to acquire an image of the bottom of the component 62 that the P&P robot 52 removes from the reel 60 and places on the PCB 33. The P&P robot 51 uses the image to properly position the component so that the component's lead wires (not shown) contact the trace(s) on the PCB where the component is intended to make electrical contact.

[0025] Following the positioning of the components that the assembly station 50 is tasked with assembling on the PCB 33, the assembled PCB is moved through the FOV of the AOI camera 55 and imaged for quality control inspection by the camera. As an example, the assembly station 50 is tasked with assembling only a portion of the set (complement) of electronic components required by the fully assembled PCBA on the PCB, and following imaging by the AOI 55, the PCB 33 and its partial complement of electronic components are assumed to be moved to a P&P assembly station 70 for positioning additional electronic components on the PCB. The station controller 56 controls the P&P robot 51 and a conveyor belt (not shown) that moves the PCB 33 through the assembly.

[0026] Figure 1A shows the P&P assembly station 50 after receiving the PCB 33* from the assembly station 30, and the robotic arm 52 for positioning the electronic components 62 on the PCB 33*. As described above, the assembly station 50 is expected to be tasked with assembling only a portion of the electronic components required by the PCBA 100, so the PCB 33* is shown being imaged by the AOI camera 55 before being released by the P&P robot 51 with only a portion of the set of electronic components included by the PCBA 100 and subsequently transferred to the P&P assembly station 70 shown in Figure 1B.

[0027] The P&P assembly station 70 is similar to the assembly station 50 and optionally includes a P&P robot 71 with a robotic arm 72, a motion camera 73, an AOI camera 75, and a station controller 76. The P&P assembly station 70 is loaded with an electronic component reel 80 having electronic components 82 that are positioned on a partially completed PCB 33 received from the assembly station 50 to complete the electronic component complements required for the PCBA manufactured by the SMT assembly line 20.

[0028] In Figure 1B, the P&P robot arm 72 is shown positioning component 82 on PCB 33*, which has been received from assembly station 50, to complete the set of electronic components required by PCBA 100. PCB 33*, having the complete set of electronic components 62 and 82, is shown to assembly station 70 after leaving the P&P robot 71 to be imaged for quality control by AOI camera 75 before being transported to reflow assembly station 90.

[0029] The reflow assembly station 90 includes a reflow oven 91 that heats a PCB 33 fully complemented with electronic components, solders the component leads onto a solder pattern screen printed on the PCB at the assembly station 30, and completes the manufacturing of the PCBA, including the PCB. Following reflow soldering in the reflow oven 91, the fully assembled and completed PCBA is imaged by an AOI camera 92 for quality control. A station controller 95 controls the reflow oven and, optionally, the AOI camera 92.

[0030] Figure 1B schematically shows the assembly station 90, which processes PCB 33* received from the P&P assembly station 70, transports the PCB 33* through the reflow oven 91, solders components on the PCB 33* to the screen-printed solder patterns on the PCB 33*, and completes the manufacturing of PCBA 100. PCBA 100 is shown as being imaged by the AOI camera 92.

[0031] In one embodiment, the dynamic QoP200 includes at least one imaging system at each SMT20 assembly station 30, 50, 70, and 90, which is capable of acquiring assembly station images of the PCBA at the assembly station during PCBA assembly. The dynamic QoP200 also includes at least one optionally cloud-based processing system capable of communicating with the at least one imaging system to receive and process the assembly station images of the PCBA acquired by the at least one imaging system. In Figures 1A and 1B, the at least one processing system is schematically represented by processors 230, 250, 270, and 290. However, while Figure 1 shows the dynamic QoP200 with different processors for each assembly station, it should be noted that the dynamic QoP according to one embodiment may have a single processing system that provides all of the various functions provided by processors 230, 250, 270, and 290 described below. Optionally, at least one imaging system at each assembly station comprises at least one camera and / or other imaging system typically used to facilitate and provide conventional quality control of the processes performed by the assembly station. For example, at least one imaging system included in the dynamic QoP200 for assembly station 30 includes an AOI 38. And at least one imaging system included in the dynamic QoP200 for assembly station 50 includes a motion camera 53 and an AOI camera 55.

[0032] Processors 230, 250, 270, and 290 are operative to receive and process assembly station images respectively acquired for assembly stations 30, 50, 70, and 90 included in the PCBA assembly line 20. Each processor processes at least one assembly station image received from the assembly station for a PCBA undergoing an assembly procedure at the assembly station, optionally to generate a Quality of Process feature vector (QoP-FV). The QoP-FV provides at least one metric responsive to the quality of component and PCBA assembly, and / or the operation of the assembly station for the time the PCBA is substantially at the assembly station. The QoP-FV provides a plurality of feature vector quality components QoP indicating the quality of different features of the PCBA in the assembly station and / or the operation of the assembly station. q may comprise (1 < q < Q).

[0033] QoP of PCBA feature functions q For example, may indicate the degree of nature of features such as the physical integrity and / or corrosion of conductive traces on the PCB of the PCBA, the nature of the physical integrity of each of the plurality of electronic components of the PCBA, the accuracy of the position where the electronic component is positioned on the conductive trace, the nature of the reflow soldering of the electronic component, and / or the quality of the assembly station image. Correspondingly, the QoP-FV is generated. QoP of feature functions indicating the operation of the assembly station q is a key performance indicator KPI indicating the status and / or quality of the performance of the assembly station when executing tasks configured for the assembly station to perform. q can be. For example, KPI q may indicate the ambient temperature of the station, the amplitude or frequency of vibration of components of the station, the FOV and resolution of the AOI or operation camera of the station, and / or the speed of the P&P operation of the station.

[0034] Optionally, processors 230, 250, 270, and / or 290 generate control signals for controlling equipment included in the PCBA assembly line in response to the QoP-FV generated by the processor.

[0035] In one embodiment, processors 230, 250, 270, and / or 290 transmit the QoP-FV feature vectors and / or control signals they generate for the PCBA to the respective station controllers 39, 56, 76, or 95 of the assembly stations 30, 50, 70, and 90 to which the processor is associated. Optionally, the processor transmits the QoP-FV feature vectors and / or control signals it generates to a processor associated with another assembly station that operates to assemble the PCBA with the SMT 20. In one embodiment, processors 230, 250, 270, and / or 290 generate QoP-FV feature vectors and / or control signals that respond not only to station images received by the processor from its associated assembly station, but also to QoP-FV feature vectors received from another processor. Optionally, processors 230, 250, 270, and / or 290 transmit station images received from their associated assembly stations to processors 230, 250, 270, and / or 290 at other assembly stations. In one embodiment, processors 230, 250, 270, and / or 290 generate QoP-FV feature vectors and / or control signals in response to station images they receive from other processors.

[0036] In Figures 1A and 1B, the feature vector QoP-FV and / or control signals are represented by ellipses labeled QoP-FV(30), QoP-FV(50), QoP-FV(70), and QoP-FV(90). These feature vector QoP-FV and / or control signals are generated by processors 230, 250, 270, and 290 in response to assembly station images of PCBAs being assembled at assembly stations 30, 50, 70, and 90, respectively. The ellipses are associated with arrows indicating which controller and next assembly station the processors, at their discretion, will send the feature vectors to.

[0037] In one embodiment, station controllers 39, 56, 76, or 95 of assembly stations 30, 50, 70, or 90, which receive QoP-FV feature vectors and / or control signals from their respective associated processors 230, 250, 270, or 290, or from another processor, can control the equipment in the assembly station in response to the QoP-FV feature vectors and / or control signals to constitute the operation of the assembly station. In one embodiment, the dynamic QoP 200 can draw the user's attention to take action to intervene in the operation of the PCBA assembly line 20 in response to the KPI or QoP values ​​contained in the QoP-FV generated by processors 230, 250, 270, or 290. Such action may include, for example, correcting a malfunction or performing maintenance tasks for assembly stations 30, 50, 70, or 90.

[0038] Optionally, the dynamic QoP200 processes the QoP-FV feature vectors generated by processors 230, 250, 270, or 290 for PCBAs generated by the PCBA assembly line 20 to provide a global product quality (GQoP) that grades the quality of each of the multiple PCBAs. The grade may, for example, indicate the service life and / or failure probability of the PCBA.

[0039] In one embodiment, processors 230, 250, 270, or 290 process incoming assembly station images using any of various types of artificial intelligence (AI), such as machine learning (ML) systems, neural networks, and / or natural language processors, to generate QoP-FV feature vectors and / or control signals.

[0040] Accordingly, an embodiment of the present disclosure provides a system for real-time monitoring of a PCBA assembly line comprising a plurality of assembly stations. The system comprises at least one imaging system for each of the plurality of assembly stations, wherein the assembly station includes an imaging system operable to acquire an assembly station image of a PCBA being assembled at the assembly station during assembly of the PCBA by the PCBA assembly line, and at least one processing system configured to process the assembly station image acquired for the PCBA to generate a real-time product quality (QoP) feature vector, the QoP-FV, wherein the processing system has at least one real-time component that provides a real-time display of the quality of the features of the PCBA at substantially the same time that the PCBA is at the assembly station. Optionally, the QoP-FV feature vector has at least one real-time key performance indicator (KPI) that provides an indication of the status and / or performance quality of the assembly station.

[0041] In addition, or alternatively, at least one processing system may optionally include instructions that generate a QoP-FV in response to an assembly station image generated for another assembly station among a plurality of assembly stations. Optionally, the assembly station images generated for one of the plurality of assembly stations are generated for the same PCBA. Optionally, the assembly station images generated for one of the plurality of assembly stations are generated for different PCBAs.

[0042] In one embodiment, at least one processing system includes an executable instruction to generate a QoP-FV in response to an assembly station image generated for another PCBA assembled at the same assembly station.

[0043] In one embodiment, at least one processing system includes an executable instruction to generate a QoP-FV in response to a QoP-FV generated for another assembly station among a plurality of assembly stations. Optionally, a QoP-FV generated for another of the plurality of assembly stations is generated for the same PCBA. Optionally, a QoP-FV generated for another of the plurality of assembly stations is generated for a different PCBA.

[0044] In one embodiment, at least one processing system includes an executable instruction to generate a QoP-FV in response to a QoP-FV generated for the same assembly station for different PCBAs.

[0045] In one embodiment, at least one processing system includes executable instructions to modify an instruction to generate a QoP-FV for an assembly station in response to at least one or any combination thereof of QoP-FVs, different QoP-FVs generated for an assembly station, and / or QoP-FVs generated for another assembly station among a plurality of assembly stations.

[0046] In one embodiment, at least one processing system includes executable instructions to modify the instructions to generate a QoP-FV for an assembly station in response to at least one or any combination of two or more of the following: an assembly station image, different assembly station images acquired for the assembly station, and / or an assembly station image acquired for another assembly station among a plurality of assembly stations.

[0047] In one embodiment, at least one processing system includes executable instructions to generate a control signal to cause a modification of at least one assembly line instrument contained within an assembly line station in response to at least one or more arbitrary combinations of an assembly station image, a QoP-FV, an image of another assembly station among a plurality of assembly stations, and / or a QoP-FV generated by the processing system for another assembly station among a plurality of assembly stations. Optionally, the modification includes a change in intrinsic or extrinsic parameters of the imaging system of the assembly station among the plurality of assembly stations. Optionally, the plurality of assembly stations include a pick-and-place (P&P) assembly station, and the modification includes a change in the speed of the pick-and-place operation of the P&P assembly station of the plurality of assembly stations. Optionally, the plurality of assembly stations include a reflow oven, and the modification includes a change in the operating temperature of the oven.

[0048] In one embodiment, the PCBA assembly line includes a controller configured to use real-time control signals to achieve modifications, and the controller and at least one processing system are configured to communicate and transmit the control signals from the at least one processing system to the controller. Optionally, at least one processing system and the controller are configured to generate and use control signals to achieve modifications before the PCBA moves along the assembly line and reaches at least one assembly line device.

[0049] In one embodiment, the real-time display provided by the real-time component is accessible within a time elapsed from the time of acquisition of the assembly station image, which is processed to determine a display value shorter than the time it takes for the PCBA assembled by the assembly line to traverse the assembly line from the first assembly station to the last assembly station.

[0050] In one embodiment, the time elapsed is shorter than the time it takes for the PCBA to traverse from a second assembly station to a first assembly station, the second assembly station receiving the PCBA from the first assembly station, and at least one of the first and second assembly stations is neither the first nor the last assembly station in the PCBA assembly line. Optionally, the time elapsed is shorter than the time it takes to traverse between assembly stations among multiple assembly stations. Optionally, the time elapsed is shorter than the time it takes for a pick-and-place (P&P) robot in the PCBA assembly line to pick up an electronic component from a packaging unit (PU) and place the component on the PCBA. Optionally, the time elapsed is less than 5 milliseconds.

[0051] The descriptions of embodiments of the present invention in this application are provided as examples and are not intended to limit the scope of the invention. The embodiments described have different features, and not all of them are required in all embodiments of the invention. Some embodiments utilize only some of the features, or possible combinations of the features. Modifications of the embodiments of the invention described, and embodiments of the invention including different combinations of the features described in the embodiments described, will be conjured up by those skilled in the art. The scope of the invention is limited only by the claims.

Claims

1. A system for real-time monitoring of a PCBA assembly line comprising multiple assembly stations, wherein the system is: An imaging system for each of the plurality of assembly stations, wherein the assembly station is operable to acquire an assembly station image of the PCBA being assembled at the assembly station during the assembly of the PCBA by the PCBA assembly line, A system comprising: at least one processing system configured to process the assembly station images acquired for the PCBA to generate a real-time product quality (QoP) feature vector, the processing system having at least one real-time component that provides a real-time display of the quality of the features of the PCBA at substantially the same time that the PCBA is at the assembly station.

2. The system according to claim 1, wherein the QoP-FV has at least one real-time key performance indicator (KPI) that provides an indication of the status and / or performance quality of the assembly station.

3. The system according to claim 1, wherein the at least one processing system includes an instruction executable to generate the QoP-FV in response to an assembly station image generated for another assembly station among the plurality of assembly stations.

4. The system according to claim 3, wherein the assembly station image generated for the other of the plurality of assembly stations is generated for the same PCBA.

5. The system according to claim 3, wherein the assembly station image generated for the other of the plurality of assembly stations is generated for a different PCBA.

6. The system according to claim 1, wherein the at least one processing system includes an instruction executable to generate the QoP-FV in response to an assembly station image generated for another PCBA assembled at the same assembly station.

7. The system according to claim 1, wherein the at least one processing system includes an instruction executable to generate a QoP-FV in response to a QoP-FV generated for another assembly station among the plurality of assembly stations.

8. The system according to claim 7, wherein the QoP-FV generated for the other of the plurality of assembly stations is generated for the same PCBA.

9. The system according to claim 7, wherein the QoP-FV generated for the other of the plurality of assembly stations is generated for a different PCBA.

10. The system according to claim 1, wherein the at least one processing system includes instructions executable to generate a QoP-FV in response to the QoP-FV generated for the same assembly station for different PCBAs.

11. The system according to claim 1, wherein the at least one processing system includes an executable instruction to modify the instruction to generate the QoP-FV for the assembly station in response to at least one or any combination thereof of the QoP-FV, different QoP-FVs generated for the assembly station, and / or QoP-FVs generated for another assembly station among the plurality of assembly stations.

12. The system according to claim 1, wherein the at least one processing system includes an executable instruction to modify the instruction to generate the QoP-FV for the assembly station in response to at least one or any combination of two or more of the assembly station image, different assembly station images acquired for the assembly station, and / or assembly station images acquired for another assembly station among the plurality of assembly stations.

13. The system according to claim 1, wherein the at least one processing system includes an instruction executable to generate a control signal for causing a modification of at least one assembly line device contained within an assembly line station in response to at least one or more arbitrary combinations of the assembly station image, the QoP-FV, an image of another assembly station among the plurality of assembly stations, and / or a QoP-FV generated by the processing system for another assembly station among the plurality of assembly stations.

14. The system according to claim 13, wherein the modification includes a change in the intrinsic or extrinsic parameters of the imaging system of one of the assembly stations.

15. The system according to claim 13, wherein the plurality of assembly stations comprises pick-and-place (P&P) assembly stations, and the modification includes changing the speed of the pick-and-place operation of the P&P assembly stations of the plurality of assembly stations.

16. The system according to claim 13, wherein the plurality of assembly stations include a reflow oven, and the modification includes changing the operating temperature of the oven.

17. The system according to claim 13, wherein the PCBA assembly line includes a controller configured to use real-time control signals to achieve the modifications, and the controller and the at least one processing system are configured to communicate and transmit the control signals from the at least one processing system to the controller.

18. The system according to claim 17, wherein the at least one processing system and the controller are each configured to generate and use the control signals to achieve the modification before the PCBA moves along the assembly line and reaches the at least one assembly line device.

19. The system according to claim 1, wherein the real-time display provided by the real-time component is accessible within a time elapsed from the time of acquisition of the assembly station image, which is processed to determine a value of the display that is shorter than the time it takes for the PCBA assembled by the assembly line to traverse the assembly line from the first assembly station to the last assembly station.

20. The system according to claim 1, wherein the time elapsed is shorter than the time it takes for the PCBA to traverse from the first assembly station to the second assembly station, the first assembly station receives the PCBA from the second assembly station, and at least one of the first and second assembly stations is neither the first nor the last assembly station of the PCBA assembly line.

21. The system according to claim 20, wherein the time elapsed is shorter than the time required to traverse the assembly stations among the plurality of assembly stations.

22. The system according to claim 20, wherein the time elapsed is shorter than the time it takes for a pick-and-place (P&P) robot in the PCBA assembly line to pick up an electronic component from a packaging unit (PU) and place the component on the PCBA.

23. The system according to claim 20, wherein the elapsed time is less than 5 milliseconds.

Images