Light energy excitation device

Abstract

Embodiments of this specification relate to combinations for use in photoenergy excitation. The photoenergy may, for example, be directed to a detector surface capable of supporting a biological or chemical sample.

Description

Technical Field

[0001] Cross - reference to Related Applications This application claims priority to U.S. Patent Application No. 63 / 381,225, titled "Light Energy Exciter," filed on October 27, 2022, the content of which is hereby incorporated by reference in its entirety.

Background Art

[0002] Embodiments of this specification relate to light energy, and particularly to combinations for use in light energy excitation.

[0003] Various protocols in biological or chemical research involve performing controlled reactions. Then, the specified reaction can be observed or detected, and subsequent analysis can assist in identifying or elucidating the properties of the chemical substances involved in the reaction.

[0004] In some multiplex assays, an unknown analyte having an identifiable label (e.g., a fluorescent label) can be exposed to thousands of known probes under controlled conditions. Each known probe can be deposited into a corresponding well of a microplate. Observing any chemical reaction that occurs between the known probe and the unknown analyte in the well can assist in identifying or elucidating the properties of the analyte. Other examples of such protocols include known DNA sequencing processes such as sequencing - by - synthesis (SBS) or circular array sequencing.

[0005] In some fluorescence detection protocols, an optical system is used to direct excitation light onto a fluorophore, e.g., a fluorescently labeled analyte, and also to detect the fluorescence emission signal light that can be obtained from the analyte to which the fluorophore is attached. However, such optical systems can be relatively expensive and may involve a large benchtop footprint. For example, an optical system can include the arrangement of lenses, filters, and light sources.

[0006] In other proposed detection systems, the controlled reaction within the flow cell is defined by a solid-state photosensor array (e.g., a complementary metal oxide semiconductor (CMOS) detector or a charge-coupled device (CCD) detector). These systems do not require a large optical assembly to detect fluorescence emission. [Overview of the project]

[0007] Embodiments of this specification relate to combinations for use in photoenergy excitation. The photoenergy can, for example, be directed to a detector surface that can support a biological or chemical sample.

[0008] This specification describes a photoenergy excitation device which may include one or more light sources. The photoenergy excitation device may emit excitation light directed to a detector surface that can support a biological or chemical sample.

[0009] This specification describes a light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes and directs excitation rays from one of the plurality of light sources, and has an incident light surface for receiving excitation rays from the light sources; a second optical pipe that homogenizes and directs excitation rays from a second of the plurality of light sources, and has an incident light surface for receiving excitation rays from the second light source; a detector comprising a detector surface for supporting a biological or chemical sample and a sensor array comprising a photosensor spaced apart from the detector surface, and the detector receiving excitation light and emission signal light from the light energy excitation device; and a mounting assembly for mounting the optical pipe and the second optical pipe, aligning the optical pipe with the light source and aligning the second optical pipe with the second light source.

[0010] This specification describes a light energy excitation device comprising a light source bank that emits excitation rays, and an optical pipe that homogenizes the excitation rays and directs them toward the distal end of the light energy excitation device, wherein the optical pipe has an incident light surface and a emitted light surface, and the optical pipe receives excitation rays from the light source bank.

[0011] This specification provides for a light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes and directs excitation rays from one of the plurality of light sources, and has an incident light surface for receiving excitation rays from the light sources; a second optical pipe that homogenizes and directs excitation rays from a second light source, and has an incident light surface for receiving excitation rays from the second light source; a third optical pipe that homogenizes and directs excitation rays from a third light source, and has an incident light surface for receiving excitation rays from the third light source; and a fourth optical pipe among the plurality of light sources. A system is described comprising: a fourth optical pipe that homogenizes the excitation rays from a light source and directs the excitation rays from a fourth light source, and which has an incident light surface for receiving the excitation rays from the fourth light source; a lens that receives excitation rays from the optical pipe and the second optical pipe and images the light output surfaces of the optical pipe and the second optical pipe onto the detector surface of the detector and the second detector surface of the second detector, respectively; and a lens that receives excitation rays from the third optical pipe and the fourth optical pipe and images the light output surfaces of the third optical pipe and the fourth optical pipe onto the third detector surface of the third detector and the fourth detector surface of the fourth detector, respectively.

[0012] This specification describes a method comprising: emitting excitation light using a photoenergy excitation device, the photoenergy excitation device comprising a set of light sources and a second set of light sources, the set of light sources emitting excitation rays in a first wavelength emission band and the second set of light sources emitting excitation rays in a second wavelength emission band; receiving excitation light and emission signal light resulting from excitation using a detector, the detector comprising a detector surface for supporting a biological or chemical sample and a sensor array separated from the detector surface, the detector blocking the excitation light and allowing emission signal light to propagate toward the photosensors of the sensor array; and transmitting a data signal using the detector's circuitry in response to photons detected by the photosensors of the sensor array.

[0013] This specification describes a light energy excitation device comprising: an optical pipe that homogenizes and directs excitation rays from a light source bank, and has an incident light surface for receiving excitation rays from a light source bank; a second optical pipe that homogenizes and directs excitation rays from a second light source bank, and has an incident light surface for receiving excitation rays from a second light source bank; and a detector comprising a detector surface for supporting a biological or chemical sample, and a sensor array comprising a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from the light energy excitation device.

[0014] This specification provides for an optical energy excitation device comprising: an optical pipe that homogenizes and directs excitation rays from a light source bank, and having an incident light surface for receiving excitation rays from a light source bank; and a second optical pipe that homogenizes and directs excitation rays from a second light source bank, and having an incident light surface for receiving excitation rays from a second light source bank, wherein the light source bank is mounted on a region of a printed circuit board, the second light source bank is mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are characterized by surface modifications characterized by one or more layers of the printed circuit board to be removed. A system is described comprising: a light energy excitation device having a surface-modified region of a printed circuit board; a detector having a detector surface for supporting a biological or chemical sample; and a sensor array having a photosensor separated from the detector surface, wherein the detector receives excitation light and emission signal light from the light energy excitation device, and the emitted rays from an optical pipe and a second optical pipe are commonly received by a lens that shapes the emitted rays so as to project an optical pattern and a second optical pattern onto a camera integrated circuit having the detector and a second detector, the optical pattern being projected by the lens onto the detector surface of the detector and the second optical pattern being projected by the lens onto the second detector surface of the second detector.

[0015] This specification describes a mounting assembly comprising an optical pipe mount for mounting an optical pipe to a light source, and a second optical pipe mount for mounting a second optical pipe to a second light source.

[0016] This specification describes a mounting assembly comprising a structural member for supporting an optical pipe and a second structural member for supporting a second optical pipe.

[0017] It should be understood that all combinations of the aforementioned concepts and further concepts, which will be discussed in more detail below, are intended to be part of the subject matter of the invention disclosed herein (provided that such concepts do not contradict each other). Specifically, all combinations of the claimed subject matter appearing at the end of this disclosure are intended to be part of the subject matter of the invention disclosed herein. [Brief explanation of the drawing]

[0018] These and other features, aspects, benefits, and advantages described herein will be better understood by reading the following detailed description with reference to the accompanying drawings, where similar features are represented in similar parts across the drawings. [Figure 1A] This is a schematic side view block diagram of a system for performing biological or chemical tests, the system comprising, for example, a light energy excitation device and a detector assembly having a detector. [Figure 1B] This is a schematic top view of the detector shown in Figure 1A, as an example. [Figure 1C] This is a schematic side view of a detector having multiple optical sensor arrays, as an example. [Figure 1D] This is a schematic top view of the detector shown in Figure 1C, as an example. [Figure 2] This is a cross-sectional side view of an example of a light energy excitation device. [Figure 3] This is a ray trace diagram illustrating ray propagation in the optical energy excitation device shown in Figure 2, as an example. [Figure 4] An example of a light source bank is depicted, including a light source provided by multiple LEDs arranged on a printed circuit board. [Figure 5A] This is a side view of a light source provided by multiple LEDs surface-coupled on the light incident surface of an optical pipe, as an example. [Figure 5B] An example illustrating parallel-connected light sources. [Figure 5C] An example of a series-connected light source is shown. [Figure 5D]A schematic side view of an LED having an anode connected to a metal core layer of a printed circuit board, according to one example. [Figure 5E] A schematic side view of a flip-chip LED connected to a printed circuit board, according to one example. [Figure 5F] A top view of an LED mounted on a printed circuit board, according to one example. [Figure 5G] A schematic top view of a flip-chip LED mounted on a printed circuit board. [Figure 5H] A side top view and a side bottom view of an LED, according to one example. [Figure 5I] A top view and a bottom view of an LED, according to one example. [Figure 5J] A heat sink diagram of a vertical LED, according to one example. [Figure 5K] A heat sink diagram of a flip-chip LED, according to one example. [Figure 5L] Draw a light source bank attached to an optical pipe, according to one example. [Figure 6] A perspective schematic view of an optical energy excitation device, according to one example. [Figure 7] A schematic view of an optical energy excitation device, according to one example. [Figure 8A] An assembly diagram of an optical energy excitation device, according to one example. [Figure 8B] An assembly diagram of an optical energy excitation device, according to one example. [Figure 8C] An assembly diagram of an optical energy excitation device, according to one example. [Figure 8D] An assembly diagram of an optical energy excitation device, according to one example. [Figure 8E] An assembly diagram of an optical energy excitation device, according to one example. [Figure 8F] An assembly diagram of an optical energy excitation device, according to one example. [Figure 8G] An assembly diagram of an optical energy excitation device, according to one example. [Figure 8H]This is an assembly diagram of a photoenergy excitation device, as an example. [Figure 8I] This is a ray trace diagram illustrating the operation of a photoenergy excitation device having first and second optical pipes, as an example. [Figure 9A] This is an assembly diagram of an optical pipe mounting device, as an example. [Figure 9B] This is an assembly diagram of an optical pipe mounting device, as an example. [Figure 9C] This is an assembly diagram of an optical pipe mounting device, as an example. [Figure 9D] This is an assembly diagram of an optical pipe mounting device, as an example. [Figure 9E] This is an assembly diagram of an optical pipe mounting device, as an example. [Figure 9F] This is an assembly diagram of an optical pipe mounting device, as an example. [Figure 9G] This is an assembly diagram of an optical pipe mounting device, as an example. [Figure 9H] This is an assembly diagram of an optical pipe mounting assembly, as an example. [Figure 9I] This is an assembly diagram of an optical pipe mounting assembly, as an example. [Figure 9J] This is an assembly diagram of an optical pipe mounting assembly, as an example. [Figure 9K] This is an assembly diagram of an optical pipe mounting assembly, as an example. [Figure 10] This is a perspective view of an assembly of a flow cell frame that houses a flow cell, as an example. [Figure 11] This is an internal view of a detector assembly cartridge, defining an alignment feature for aligning a photoenergy excitation device that can be coupled and aligned to the top, as an example. [Figure 12] This is a top view of a flow cell defined for a detector provided by an integrated circuit, as an example. [Figure 13] This is a cross-sectional side view of a portion of a detector provided by an integrated circuit having an optical sensor array and an aligned optical guide array, as an example. [Figure 14]This is a cross-sectional side view of a portion of a detector provided by an integrated circuit having an optical sensor and aligned optical guides, as an example. [Figure 15] This is a schematic diagram of a process control system, as an example. [Figure 16] This is a spectral characteristics diagram illustrating, as an example, the spectral profiles of multiple light energy excitation sources and multiple fluorophores that can be excited by using these excitation sources. [Figure 17] This flowchart illustrates a process that can be used to support the DNA sequencing process for DNA sequence reconstruction, as an example. [Figure 18] This is a timing diagram illustrating the timing between light source banks, as an example. [Figure 19] This is a timing diagram illustrating heat removal from an LED as an example. [Figure 20] This flowchart illustrates a method that can be used to support the DNA sequencing process for DNA sequence reconstruction, as an example. [Modes for carrying out the invention]

[0019] Figure 1A shows a system 100 for use in analysis such as biological or chemical analysis. The system 100 may include a light energy excitation device 10 and a detector assembly 20.

[0020] The detector assembly 20, sometimes referred to as a flow cell, may include a detector 200 and a flow channel 282, the flow channel 282 may be at least partially bounded by the detector 200. The detector 200 may include a plurality of light sensors 202, which may be provided by sensing photodiodes, and the detector surface 206 is for supporting a sample 502, such as a biological or chemical sample to be tested. The detector 200, having side walls 284 and a flow cover 288, as well as the detector surface 206, may define and boundary the flow channel 282. The detector surface 206 may have an associated detector surface plane 130.

[0021] The detector 200 may include a plurality of optical guides 214 that receive excitation light and emit signal light resulting from excitation by the excitation light from the detector surface 206. The optical guides 214 can guide light from the detector surface 206. The optical guides 214 extend toward each of the optical sensors 202 and may include a filter material that substantially blocks the excitation light and substantially allows the emitted signal light to propagate toward each of the optical sensors.

[0022] The photoenergy excitation device 10 may be operated to emit excitation light 101 to excite a fluorophore attached to the sample 502. When excited by the excitation light 101, the fluorophore attached to the sample 502 may fluoresce and emit emission signal light 501 at wavelengths different from the wavelength range of the excitation light 101, for example, in a wavelength range having wavelengths longer than the wavelength range of the excitation light 101. The presence or absence of emission signal light 501 may indicate the characteristics of the sample 502. An example optical guide 214 may filter out light within the wavelength range of the excitation light 101 transmitted by the photoenergy excitation device 10 so that the photosensor 202 does not detect the excitation light 101 to the extent that it can be recognized as emission signal light 501.

[0023] Examples herein describe improving the irradiance (radiant flux received by the surface per unit area) of a detector surface 206 under various configurations of a light energy excitation device 10. In one example, the light energy excitation device 10 may feature parallel-connected light sources, the anodes of which are commonly connected to a metal core layer of a printed circuit board. Such an example may feature improved heat removal due to the reduced thermal resistance of the printed circuit board. Examples herein recognize that the light sources may be overdriven for improved irradiance, i.e., driven with a current exceeding the rated maximum current of the light sources, to the extent that heat can be removed from the light sources.

[0024] In another example, the light energy excitation device 10 may feature series-connected light sources. When light sources are connected in series, they are energized by a common current, resulting in improved uniformity of irradiance. In one example, the light energy excitation device 10 may feature flip-chip LEDs. Flip-chip LEDs can reduce light loss by facilitating surface coupling of the optical pipe to the LED. In some examples, the use of flip-chips can facilitate an improvement in LED density per unit area. In a flip-chip LED configuration, thermal resistance can be reduced by using ceramic insulators, thereby improving the ability to overdrive the LEDs for improved irradiance.

[0025] Features for improved irradiance may include features for improved alignment of optical components. In one example, a mounting assembly for mounting optical pipes may be provided. The mounting assembly may facilitate independent mounting of a first optical pipe and a second optical pipe. The mounting assembly may feature removable mounting of the first optical pipe and the second optical pipe. The mounting assembly may feature a standoff distance between the light source bank and the optical pipes, thereby allowing their alignment to be independent of manufacturing tolerances for the height of the light source. The mounting assembly may feature reduced contact points with the optical pipes to reduce optical loss. In one example, the mounting assembly contacts the optical pipes on only one side, and possibly only at a single contact point on that single side.

[0026] Features for improved irradiance may include features for heat removal using timing adjustments between light sources. For example, common wavelength light sources in different light source banks may have distinct on-times.

[0027] For example, the detector 200 may be provided by a solid-state integrated circuit detector such as a complementary metal oxide semiconductor (CMOS) integrated circuit detector or a charge-coupled device (CCD) integrated circuit detector.

[0028] For example, each optical sensor 202 may be aligned with the respective optical guide 214 and the respective reaction recess 210 such that its longitudinal axis 268 extends through the cross-sectional geometric center of the optical sensor 202, the optical guide 214, and the reaction recess 210. The flow channel 282 may be defined by the detector surface 206, the side wall 284, and the flow cover 288. The flow cover 288 may be a light-transmitting cover that transmits the excitation light provided by the optical energy excitation device 10.

[0029] In another embodiment, the detector 200 may include a dielectric laminated area 218 in the middle of the optical guide 214. The dielectric laminated area 218 may contain circuits for, for example, reading, digitizing, storing, and / or processing signals from the optical sensor 202.

[0030] The system 100 may include an inlet portal 289 through which fluid can enter the flow channel 282, and an outlet portal 290 through which fluid can exit the flow channel 282. The inlet portal 289 and the outlet portal 290 may be defined by a flow cover 288.

[0031] For example, system 100 may be used to perform biological or chemical tests using fluorophores. For instance, a fluid having one or more fluorophores can be allowed to flow into and out of the flow channel 282 through the inlet port using the inlet portal 289 and the outlet portal 290. Fluorophores can be attracted to various samples 502, and therefore, by detection, the fluorophores can act as markers for the sample 502, for example, biological or chemical analytes attracted by the sample.

[0032] To detect the presence of a fluorophore in the flow channel 282, the photoenergy exciter 10 can be energized so that excitation light 101 in the excitation wavelength range is emitted by the photoenergy exciter 10. Upon receiving the excitation light, the fluorophore attached to the sample 502 may emit emission signal light 501, which is the signal to be detected by the photosensor 202. The emission signal light 501 due to the fluorescence of the fluorophore attached to the sample 502 may have a wavelength range that is red-shifted with respect to the wavelength range of the excitation light 101.

[0033] The system 100 within the test support system area 300 may include a process control system 310, a fluid control system 320, a fluid storage system 330, and a user interface 340 that allows an operator to input for control of system 100. In one example, the process control system 310 may be provided by a processor-based system. The process control system 310 may perform various biological or chemical processes, such as DNA sequence rearrangement processes. For example, to perform a biological or chemical process, the process control system 310 may send a controlled control signal to, for example, a photoenergy excitation device 10, a detector 200, and / or a fluid control system 320. The fluid storage system 330 may store fluid flowing through the flow channel 282.

[0034] For example, the light energy excitation device 10 may include one or more light sources. For example, the light energy excitation device 10 may include one or more optical shaping elements. The light energy excitation device 10 may include one or more optical components for shaping light emission that directs light emitted from one or more light sources. One or more optical components may include, for example, one or more optical pipes, lenses, wedges, prisms, reflectors, filters, gratings, collimators, or any combination of the above.

[0035] Figure 2 illustrates an example of a light energy excitation device 10. The light energy excitation device 10 may include a light source bank 1002 having one or more light sources, for example, light sources 102A to 102Z, and various optical elements for directing light along the optical axis 106, which is the bending axis in the illustrated example.

[0036] The optical energy excitation device 10 may include an optical pipe 110 and a lens 114 for shaping the excitation light rays transmitted through the optical pipe 110. The optical pipe 110 and the lens 114 may have a cross-sectional geometric center centered on the optical axis 106.

[0037] The optical pipe 110 may include an incident light surface 109 and an outgoing light surface 111. Excitation light 101 emitted from the light source bank 1002 may be incident on the incident light surface 109 of the optical pipe 110 and may be emitted from the outgoing light surface 111. By having a refractive index selected to provide internal reflection, the optical pipe 110 can reflect the received light rays from the light source bank 1002 in various directions, homogenizing the light so that the outgoing light rays transmitted through the optical pipe 110 are homogeneous. Therefore, even if the light sources of the light source bank 1002 may have "hot spots," be asymmetrically positioned with respect to the optical pipe 110, or have other irregularities, homogeneous light can be generated at the outgoing light surface 111 of the optical pipe 110.

[0038] The optical pipe 110, by having a refractive index selected to provide internal reflection, can confine the excitation rays it receives and transmits to a volume area demarcated by the side wall surfaces defining the optical pipe 110. The optical pipe 110 may be formed from a homogeneous light-transmitting material, such as polycarbonate or silica glass.

[0039] For example, the optical pipe 110 may have a tapered structure defined by an increase in diameter along its entire length from the light incident surface 109 to the light output surface 111. For example, the optical pipe 110 may have a tapered structure defined by a linear increase in diameter along its entire length from the light incident surface 109 to the light output surface 111.

[0040] For example, the light energy excitation device 10 may be configured such that a lens 114 images the light-emitting surface 111 of the light pipe 110 onto an image plane 130, and for example, the system 100 may be configured such that the image plane 130 coincides with a detector surface 206 which can be configured to support a sample 502 such as a DNA fragment. By imaging the object plane onto the image plane, the lens 114 can project an image of the homogenized light present on the light-emitting surface 111 of the light pipe 110 onto the sample-supporting detector surface 206 of the detector 200 (Figure 1A).

[0041] The examples herein recognize that the light source bank 1002 may be selected such that the excitation rays emitted from the light source bank 1002 do not include fluorescence range rays, but nevertheless, fluorescence range rays may be emitted within the photoenergy excitation device 10 as a result of autofluorescence. In another embodiment, the photoenergy excitation device 10 may include a short-pass filter 122 for filtering fluorescence range wavelengths emitted from, for example, the lens 114, the optical pipe 110, and the reflector 118, as well as from other surfaces of the photoenergy excitation device 10, as a result of autofluorescence from within the photoenergy excitation device 10.

[0042] The optical energy excitation device 10 may include an optical reflector 118 for bending the optical axis 106 such that the optical axis 106 changes direction from a first direction in which the optical axis 106 extends parallel to the illustrated reference Y-axis to a second direction in which the optical axis 106 extends parallel to the illustrated reference Z-axis. The optical energy excitation device 10 may include a window 126 having a cross-sectional center centered on the optical axis 106, a housing 134, and other support components for supporting various optical components in specific spatial relationships, such as the specific spatial relationships depicted in Figure 1A.

[0043] A ray trace diagram of the optical energy excitation device 10 in the example of Figure 2 is shown in Figure 3. Referring to the ray trace diagram in Figure 3, the lens 114 can image an object plane 112, which can be defined at the light-emitting surface 111 of the optical pipe 110, onto an image plane 130, which can be positioned on a detector surface 206 that can be adapted to support a biological or chemical sample. As can be seen from the ray trace diagram in Figure 3, the rays emitting from the light-emitting surface 111 of the optical pipe 110 can be divergent rays diverging at a sufficiently limited divergence angle, such that the majority of the rays emitting from the light-emitting surface 111 of the optical pipe 110 are received by the light-incident surface of the lens 114. The examples herein recognize that while the optical pipe is useful for the purpose of homogenizing light, it can transmit emitting rays with a large maximum divergence angle, for example, an angle close to 90°.

[0044] The examples herein recognize that, for example, if the optical pipe 110 is alternatively configured to have a uniform diameter, i.e., a non-tapered diameter, a significant proportion of the emitted rays exiting the optical pipe 110 may exit the light-emitting surface 111 at a sufficiently large divergence angle that the light-entering surface 113 of the lens 114 cannot focus the emitted rays. The examples herein recognize that providing an optical pipe 110 with a tapered structure that tapers along its length, has a geometric cross-sectional center centered on the optical axis 106, and includes an appropriate refractive index, provides reflection within the optical pipe 110, and as a result, the light emitted from rays exiting the light-emitting surface 111 of the optical pipe 110 exits the light-emitting surface 111 of the optical pipe 110 at an angle reduced from the 90° angle of maximum divergence.

[0045] In the example described with reference to Figures 2 and 3, the emitted rays from the light-emitting surface 111 of the optical pipe 110 can define a diverging cone 1100 having rays that diverge at an angle ranging from 0 degrees to the maximum divergence angle with respect to a reference ray extending from the light-emitting surface in a direction parallel to the optical axis 106. The defined diverging cone 1100 can diverge at the maximum divergence angle with respect to the optical axis 106. In one example, the maximum divergence angle is a divergence angle designed so that the majority of the emitted rays from the light-emitting surface 111 are focused by the light-incident surface of the lens 114. In one example, the optical energy excitation device 10 is configured such that the optical excitation rays emitted from the light-emitting surface 111 diverge at the maximum divergence angle in a direction parallel to the optical axis 106 that is small enough to ensure focus by the light-incident surface 113 of the lens 114 with respect to a reference ray extending from the light-emitting surface.

[0046] For example, the light energy excitation device 10 may be configured to define a diverging cone 1100 in which the emitted light rays emitted from the light emission surface 111 of the optical pipe 110 diverge at an angle ranging from 0 degrees to the maximum divergence angle with respect to a reference ray extending from the light emission surface in a direction parallel to the optical axis 106, and the optical pipe 110 is configured such that the maximum divergence angle is approximately 60 degrees or less. For example, the light energy excitation device 10 may be configured to define a diverging cone 1100 in which the emitted light rays emitted from the light emission surface 111 of the optical pipe 110 diverge at an angle ranging from 0 degrees to the maximum divergence angle with respect to a reference ray extending from the light emission surface in a direction parallel to the optical axis 106, and the optical pipe 110 is configured such that the maximum divergence angle is approximately 50 degrees or less. In one example, the light energy excitation device 10 is configured to define a diverging cone 1100 in which the emitted light rays from the light emission surface 111 of the light pipe 110 diverge at an angle ranging from 0 degrees to the maximum divergence angle with respect to a reference light ray extending from the light emission surface in a direction parallel to the optical axis 106, and the light pipe 110 is configured such that the maximum divergence angle is approximately 40 degrees or less. In another example, the light energy excitation device 10 is configured to define a diverging cone 1100 in which the emitted light rays from the light emission surface 111 of the light pipe 110 diverge at an angle ranging from 0 degrees to the maximum divergence angle with respect to a reference light ray extending from the light emission surface in a direction parallel to the optical axis 106, and the light pipe 110 is configured such that the maximum divergence angle is approximately 35 degrees or less. For example, the light energy excitation device 10 is configured such that the emitted light rays from the light emission surface 111 of the optical pipe 110 define a light diverging cone 1100 having rays that diverge at an angle ranging from 0 degrees to the maximum divergence angle with respect to a reference ray extending from the light emission surface in a direction parallel to the optical axis 106, and the optical pipe 110 is configured such that the maximum divergence angle is approximately 30 degrees or less.

[0047] To provide an imaging function, the lens 114 can focus the received excitation rays transmitted through the optical pipe 110. In the example described with reference to Figures 2 and 3, the emitted rays from the optical output surface 115 of the lens 114 can define a converging cone of light 1400 having rays that converge at an angle ranging from 0 degrees to the maximum convergence angle with respect to a reference ray extending from the optical output surface in a direction parallel to the optical axis 106, and the lens 114 is configured such that the maximum convergence angle is about 60 degrees or less. The defined converging cone of light 1400 can converge at the maximum convergence angle with respect to the optical axis 106. In the example described with reference to Figures 2 and 3, the emitted light rays from the light-emitting surface 115 of the lens 114 can define a converging cone 1400 of light having rays that converge at an angle ranging from 0 degrees to the maximum convergence angle with respect to a reference ray extending from the light-emitting surface in a direction parallel to the optical axis 106, and the lens 114 is configured such that the maximum convergence angle is approximately 50 degrees or less. In the example described with reference to Figures 2 and 3, the emitted light rays from the light-emitting surface 115 of the lens 114 can define a converging cone 1400 of light having rays that converge at an angle ranging from 0 degrees to the maximum convergence angle with respect to a reference ray extending from the light-emitting surface in a direction parallel to the optical axis 106, and the lens 114 is configured such that the maximum convergence angle is approximately 40 degrees or less. In the example described with reference to Figures 2 and 3, the emitted light rays from the light-emitting surface 115 of the lens 114 can define a converging cone 1400 of light having rays that converge at an angle ranging from 0 degrees to the maximum convergence angle with respect to a reference ray extending from the light-emitting surface in a direction parallel to the optical axis 106, and the lens 114 is configured such that the maximum convergence angle is approximately 35 degrees or less. In the example described with reference to Figures 2 and 3, the emitted light rays from the light-emitting surface 115 of the lens 114 can define a converging cone 1400 of light having rays that converge at an angle ranging from 0 degrees to the maximum convergence angle with respect to a reference ray extending from the light-emitting surface in a direction parallel to the optical axis 106, and the lens 114 is configured such that the maximum convergence angle is approximately 30 degrees or less.

[0048] Figure 4 illustrates an example of a light source bank 1002. The light source bank 1002 may include one or more light sources. For example, one or more light sources may be provided by one or more electroluminescent-based light sources, such as light-emitting diodes, electroluminescent cells, electroluminescent wires, or lasers, or any combination thereof. In the example described in Figure 4, the light source bank 1002 may include multiple light sources 102A to 102J provided by multiple light-emitting diodes (LEDs). In the example described, light sources 102A to 102G may be green LEDs emitting excitation rays in the green wavelength band, and light sources 102H to 102J may be blue LEDs emitting excitation rays in the blue wavelength band. For example, the light sources 102A to 102J provided by LEDs may be arranged on a printed circuit board 1020. In the operation of system 100, the process control system 310 can control the energization of the light sources 102A-102J provided by the LEDs so that one or more LEDs in a particular emission band are selectively activated at a particular time. For example, the light sources 102A-102J may be provided by surface-emitting LEDs. LEDs such as surface-emitting LEDs may have an emission pattern in which the ray angle correlates with the light intensity. The LED emission pattern may be a function of parameters such as die shape, die window, and refractive index of the photoforming material. The emission pattern may be Lambertian, for example, by specifying that the intensity is proportional to the cosine of the emission angle with respect to the normal. The printed circuit board 1020 may extend in a plane as shown throughout the figure.

[0049] The process control system 310 may, for example, energize only the light sources 102A-102G provided by green LEDs during a first exposure period of the detector 200 to which the photosensor 202 is exposed, and energize only the light sources 102H-102J provided by blue LEDs during a second exposure period of the detector 200 to which the photosensor 202 is exposed. Providing a light source bank 1002 that emits at two independently selectable peak wavelengths facilitates dye chemistry processes that can use both green (532 nm) and blue (470 nm) excitation. For example, the light source bank 1002 may include a light source, for example, a red LED disposed on a printed circuit board 1020 that emits at a red band center wavelength (e.g., red: 630 nm). Providing red illumination facilitates additional testing and calibration procedures, for example.

[0050] Referring to Figure 4, it can be seen that the light sources defining the light source bank 1002 do not need to be arranged symmetrically and uniformly, or according to any ordered configuration. For example, according to a particular configuration shown in Figure 4, where light sources 102A-102G provided by green LEDs are selectively energized and light sources 102H-102J provided by blue LEDs are kept de-energized, a larger proportion of the excitation rays enter the optical pipe 110 through the left side of the light incident surface 109 of the optical pipe 110. Conversely, when light sources 102H-102J provided by blue LEDs are selectively energized and the green LEDs are kept de-energized, a larger proportion of the excitation rays enter the optical pipe 110 through the right side of the light incident surface 109 of the optical pipe 110. Nevertheless, due to its light reflection characteristics, the optical pipe 110 homogenizes the unbalanced incoming light to produce homogenized light at the light output surface 111 of the optical pipe 110, regardless of the arrangement of the light sources in the light source bank 1002. The refractive index of the optical pipe 110 can be selected such that the light rays from the light source bank 1002 undergo total internal reflection (TIR) ​​within the optical pipe 110, achieving homogeneous illumination at the light-emitting surface 111 of the optical pipe 110.

[0051] As shown in Figure 5A, the light source bank 1002 may be coupled to the optical pipe 110 in a manner that ensures reduced light loss. The arrangement depicted in Figure 5A includes a side view of the LEDs as they are arranged on the printed circuit board 1020 in Figure 4. In the side view depicted in Figure 5A, the light sources 102A, 102C, and 102E provided by the LEDs are shown to correspond to the light sources 102A, 102C, and 102E as depicted in Figure 4. The light sources 102A-102J may be provided by LEDs having flat planar light-emitting surfaces as depicted in Figure 5A. Referring to Figure 5A, the flat planar light-emitting surfaces of the light sources 102A-102J provided by the LEDs (of which light sources 102A, 102C, and 102E are shown in the side view) are surface-coupled (butt-coupled) onto the light incident surface 109 of the optical pipe 110. The light incident surface 109, such as the emission surface of the light sources 102A-102J provided by the LEDs, can be flat and planar so as to ensure low light loss when the light sources 102A-102J provided by the LEDs are surface-coupled onto the light incident surface 109. The use of surface coupling as depicted in Figure 5A can achieve a coupling efficiency that defines the transmittance of LED light through the optical pipe 110 of 90 percent or more, and, in one example, can achieve 98 percent or more, which is favorably comparable to the coupling efficiency of light sources to a lens, where the coupling efficiency depends on the number of apertures in the lens.

[0052] Furthermore, referring to Figure 5A, it can be seen that the entire front surface of each of the light sources 102A to 102J provided by the LEDs is faced by the light incident surface 109 of the optical pipe 110, and therefore, the majority of the excitation rays emitted by the light sources 102A to 102J provided by the LEDs are reliably received by the light incident surface 109 of the optical pipe 110.

[0053] The light source bank 1002 can be connected in various configurations. Figure 5B illustrates a light source bank 1002 connected in a parallel electrical connection configuration, and Figure 5C illustrates a light source bank 1002 connected in a series electrical connection configuration. In Figure 5B, the light sources defining the light source bank 1002 are collectively labeled as light source 102. In Figure 5C, the light sources defining the light source bank 1002 are also collectively labeled as light source 102. The light source 102 in Figures 5B and 5C may be provided by LEDs.

[0054] In the parallel electrical connection configuration of Figure 5B, the anode of each light source 102 may be connected to the positive terminal voltage of the power supply 1210, and the cathode of each light source 102 may be connected to the negative terminal voltage of the power supply 1210. The power supply 1210 may be configured as a current regulator. In the series connection configuration of Figure 5C, the anode of the first light source 102 defining the series connection of the light sources may be connected to the positive terminal voltage of the power supply 1210, and the cathode of the last series-connected light source 102 may be connected to the negative terminal voltage of the power supply 1210. The power supply 1210 may be configured as a current regulator. When the power supply 1210 drives LEDs, the power supply 1210 may be considered an LED driver.

[0055] Each of the series electrical connection configurations in Figure 5C and the parallel electrical connection configuration in Figure 5B may offer various advantages, and each may be preferred depending on the specific application and design objectives.

[0056] In one embodiment, the examples herein recognize that the printed circuit board 1020 may be provided by a metal core printed circuit board (MCPCB) using the parallel electrical connection configuration shown in Figure 5B. An MCPCB is a printed circuit board that includes a metal core as the primary support substrate. The core may be configured to direct heat outward from heat-generating circuit components.

[0057] The examples herein recognize that, for improved heat dissipation, the printed circuit board 1020 may be provided by a metal core printed circuit board (MCPCB) having a core substrate provided by a metal core layer 1022, an insulating layer 1024, and a conductive metal wiring layer 1026, as shown in Figure 5D. In the example of Figure 5D, the metal core layer 1022 may be provided by a copper substrate. In the example of Figure 5D, the metal core layer 1022 may be connected to the positive terminal of a power supply 1210 (Figure 5B), and the conductive metal wiring layer 1026 may be connected to the negative terminal of the power supply 1210, as shown in Figure 5B.

[0058] The examples herein recognize that the use of parallel electrical connections for a light source bank can facilitate the common connection of the anodes A102 of each LED defining the light source bank 1002. For example, a metal core layer 1022 may be connected to the positive voltage terminal of a power supply 1210 (Figure 5B), and the anodes A102 of each LED may be commonly connected to the metal core layer 1022 defining the positive voltage terminal of the power supply 1210. In the example of Figure 5D, the anodes A102 of each light source 102 provided by the LEDs may be commonly connected to the metal core layer 1022, and the cathodes C102, which may be defined on the upper surface of each light source 102 provided by the LEDs, may be connected to a conductive metal wiring layer 1026 via bond wires 1030, as shown in Figure 5D (this conductive metal wiring layer 1026 may be connected to the negative voltage terminal power supply 1210 in Figure 5B). Connecting all light sources 102 provided by the LEDs defining the light source bank 1002 to the metal core layer 1022 in common can reduce thermal resistance and, in some examples, improve heat dissipation compared to alternative configurations in which the light sources 102 are not commonly connected to the metal core layer 1022.

[0059] The conductive metal wiring layer 1026 may be connected to the negative voltage terminal of the power supply 1210 (Figure 5B) by bond wires which can be connected to the conductive metal wiring layer 1026 by the use of solder joints 1032, as shown in Figure 5D. Bond wires 1034 may be connected to a surface mount termination (SMT) connector 1036 which can be connected to the negative voltage terminal of the power supply 1210, as shown in Figure 5B. By directly connecting anode A102 to the metal core layer 1022, the arrangement shown in Figure 5D may provide reduced thermal resistance (RTH) compared to an alternative configuration in which anode A102 is not connected to the metal core layer 1022. Each anode A102 of the light source 102 provided by the LED may be connected to the metal core layer 1022 by a conductive material forming part 1028 which may be provided by a sintered paste connection, as in one example. Further referring to the example in Figure 5D, anode A102 may be manufactured as shown in accordance with the example in Figure 5D. The anode A102 may be formed on the first side of each light source 102 provided by the LED, and the cathode C102 may be formed on the second side of each LED.

[0060] Another example of an LED arrangement for a light source bank 1002 defined by light source 102 is shown in Figure 5E. In the example in Figure 5E, the light source 102 provided by LEDs may be connected in series as shown in Figure 5C and may be provided by flip chips.

[0061] In this specification, a flip chip may refer to a semiconductor device having solder bumps deposited on a chip pad. Solder bumps may be deposited on the upper chip pad of a wafer during the wafer processing stage to facilitate mounting the semiconductor device onto an external circuit, such as a circuit board, such as a printed circuit board 1020. The semiconductor device may be flipped over so that its upper side faces downward, as shown in Figure 5E, and aligned with a pad on an external circuit, such as a light source printed circuit board 1020.

[0062] Referring to Figure 5E, the anode A102 and cathode C102 may be defined by contact pads or contact pads combined with solder bumps, depending on the patterning of the conductive metal wiring layer 1026. The light source bank 1002 described with reference to Figure 5E may define a parallel connection of LEDs as shown in Figure 5B, or a series connection of LEDs as shown in Figure 5C. Referring to Figure 5E, the anode A102 and cathode C102 of each light source 102 may be connected to the conductive metal wiring layer 1026 by a conductive material forming section 1028, which may be provided by SAC die attach, for example.

[0063] In the parallel connection shown in Figure 5B, the anode A102 of each light source 102 provided by the LEDs may be connected in common to the positive voltage terminal power supply 1210, as shown in Figure 5B, and the cathode C102 of each light source 102 may be connected in common to the negative voltage terminal power supply 1210, as shown in Figure 5B. The light source bank 1002 shown in Figure 5E may also be connected in series, as shown in Figure 5C. In the series connection as shown in Figure 5C, segments of the conductive metal wiring layer 1026 between each LED may define a conductor connecting the cathode of the first light source 102 to the anode of the second light source 102, as shown in Figure 5C.

[0064] Referring again to the arrangement of the light source bank 1002 as shown in Figure 5D, the conductive metal wiring layer 1026 may include intermediate sections such as the intermediate section at "A" between the first and second light sources 102, and LEDs to the right and left of the intermediate section at "A". The insulating layer 1024 and the conductive metal wiring layer 1026 may have intermediate sections at "A". Referring to Figure 5D, each cathode C102 may be electrically connected to the intermediate section of the conductive metal wiring layer 1026 at "A". The arrangement of the light source bank 1002 as shown in Figure 5D facilitates the connection of the light sources 102 in parallel, as shown in Figure 5B. The arrangement as shown in Figure 5D may also be configured to support a series connection of the light sources 102, as shown in Figure 5C, by appropriate patterning of the metal core layer 1022.

[0065] Referring to Figure 5E, the flip-chip LEDs defining the light source bank 1002 may be mounted such that the anode A102 and cathode C102 of each respective light source 102 are connected to a section of the conductive metal wiring layer 1026 by the conductive material forming section 1028. The arrangement shown in Figure 5E avoids the use of intermediate sections, such as the intermediate section in "A" in the example of Figure 5D, and the intermediate section in "A" in Figure 5D, which is defined by the intermediate section of the insulating layer 1024 within the intermediate section of the conductive metal wiring layer 1026, may not exist. Since the intermediate section in "A" may not exist in the example of Figure 5E, the light sources 102 provided by the LEDs in Figure 5E may be placed closer to each other.

[0066] In the example of FIG. 5D, the spacing distance between the light sources 102 provided by the LEDs can be the spacing distance D1, but in the example of FIG. 5E, the spacing distance between the light sources 102 can be the spacing distance D2, where D2 < D1. As shown in FIG. 5D, by using flip chips and removing the intermediate section at "A" between the light sources 102, the reduction of the spacing distance can be facilitated. The intermediate section "A" is defined by the intermediate section of the conductive metal wiring layer 1026 and the intermediate section of the insulator layer 1024. In the example of FIG. 5E, since the light sources 102 can be spaced closer to each other, more light sources 102 can be arranged per unit area on the surface of the printed circuit board 1020.

[0067] The arrangement as shown in FIG. 5E facilitates the arrangement of additional light sources 102 per unit area on the surface of the printed circuit board 1020 and provides additional exemplary advantages. In the example of FIG. 5E, the anode A102 and the cathode C102 can be directly soldered to the conductive metal wiring layer 1026, so the electrodes (anode or cathode) do not have to be wire-bonded to the conductive metal wiring layer 1026 as shown in FIG. 5D. Thus, an implementation with wires 1030 as shown in FIG. 5D may be recognized as possibly restricting the spacing between the light source 102 provided by the LED and the surface of the light pipe 110 as shown throughout the figure.

[0068] However, in the examples of this specification, it is recognized that the arrangement of FIG. 5E may not require the wires 1030 that define the upper surface of the arrangement as shown in FIG. 5D. The light source 102 provided by the flip-chip LED as shown in FIG. 5E, which can have an anode A102 and a cathode C102 directly soldered to the conductive metal wiring layer 1026 and may not require the upper surface extension wires 1030, is spaced closer to the light incident surface of the light pipe 110 and thus can facilitate the surface coupling (butting coupling) of the light source 102 provided by the LED to the light pipe 110.

[0069] Figure 5F illustrates an alternative example of the arrangement shown in Figure 5D. In the example of Figure 5F, the use of the intermediate section in "A" of Figure 5D can be avoided by using the elongated wire bond 1030 as shown in "B" of Figure 5F. However, it can be observed that the elongated wire bond 1030 in "B" may limit the density at which the light sources 102 provided by the LEDs can be packed per unit area on the surface of the printed circuit board 1020. The use of flip-chip LEDs can facilitate high-density packing of the light sources 102 provided by the LEDs, as shown in Figure 5G, where the light sources 102 are packed in a 4x3 matrix.

[0070] In the example of Figure 5G, which includes a light source 102 provided by a flip-chip LED, 12 LEDs can be packed into the same two-dimensional area where only 10 LEDs exist in the example of Figure 5F. While the arrangement shown in Figure 5G, with wire bonds 1030 as shown in Figure 5F, is feasible and advantageous in some examples, in "B" of Figure 5F, it may include elongated wire bonds 1030 for the central LED to "jump over" the outer LEDs in order to limit the excitation rays of the outer LEDs. The flip-chip layout of Figure 5G may feature a JxK array of LEDs arranged in equally spaced rows and columns of LEDs.

[0071] Figure 5H illustrates side, top, and bottom views of a light source 102 provided by a blue light-emitting LED. Figure 5I illustrates top and bottom views of a light source 102 provided by a green light-emitting LED. As shown in Figures 5H and 5G, the light source 102 may, in one example, have top dimensions of approximately 1 mm × 1 mm. The contact pad defining the anode A 102 and cathode C 102 may have an area dimension of approximately 1 mm × 450 microns and a separation distance of approximately 200 microns.

[0072] Figures 5J and 5K are heat sink diagrams illustrating the heat sink performance in the configurations shown in Figures 5D and 5E, respectively. Figure 5J illustrates the heat sink performance in the configuration of Figure 5D, and Figure 5K illustrates the heat sink performance in the example of Figure 5E. The examples herein recognize that heat sink performance can be expressed as a function of various heat sink parameter values. The examples herein recognize that heat sink performance can be expressed as a function of R1, R2, and R3, with reference to the thermal heat sink diagrams of Figures 5H and 5I, where R1 is the thermal resistance "from J to the pad", R2 is the thermal resistance "from the thermal interface material (TIM) to the substrate", and R3 is the thermal resistance "from the substrate to the heat sink".

[0073] With respect to R1, the thermal resistance "from J to the pad" may depend on the point where the diode connects to the base, i.e., the junction temperature. The thermal resistance of R1, "from J to the pad," may be substantially the same for both the flip-chip configuration shown in Figure 5K and the vertical configuration shown in Figure 5J.

[0074] Here, we refer to R2 in the examples of Figure 5J (vertical type) and Figure 5k (flip-chip LED). With respect to Figure 5J (example of a vertical type LED), the light source 102 may be directly connected to the metal core layer 1022 by the use of Ag sintered paste, whereas in the flip-chip configuration illustrated in Figure 5K, the light source 102 may be connected to the conductive metal wiring layer 1026 by, for example, the use of SAC die attach. In one embodiment, R2 may be significantly smaller in the case of the vertical type LED shown in Figure 5J. The examples herein recognize that Ag sintered paste may have a thermal conductivity about twice that of SAC die attach. SAC as herein refers to a solder paste alloy which may be about 96.5% Sn, about 3.0% Ag, and about 0.5% Cu.

[0075] Regarding R3, R3 can be the thermal resistance from the PCB to the heatsink 702. The parameter value R3 can be significantly smaller in the case of Figure 5J (vertical LED) compared to Figure 5K (flip-chip LED). In the case of Figure 5J (vertical LED), the light source 102 can be directly mounted to the metal core layer 1022 of the printed circuit board 1020. In the flip-chip design of Figure 5K, there are two additional PCB layers between the light source 102 and the heatsink 702, namely an insulating layer 1024, which can be provided by a dielectric and conductive metal wiring layer 1026, which can be provided by a copper layer. The thermal resistance parameter R3 can refer to the thermal resistance provided by the printed circuit board 1020. In the case of the arrangement of Figure 5J (vertical), the thermal resistance provided by the printed circuit board 1020 can be provided by the metal core layer 1022 alone. However, in the example of Figure 5K, the thermal resistance R3 provided by the printed circuit board 1020 may include a laminated layer of a metal core layer 1022, an insulating layer 1024, and a conductive metal wiring layer 1026.

[0076] Regarding the thermal resistances of the J2 pads, R1 can be approximately the same for both the vertical LED configuration in Figure J and the flip-chip configuration in Figure 5K. With respect to the thermal resistance R2, i.e., the thermal resistance "from TIM to substrate", R2 can be larger in the flip-chip design in Figure 5K than in the vertical LED configuration shown in Figure 5J, where the light source 102 provided by the LED can be connected to the metal core layer 1022 by Ag sintered die attach, whereas in the flip-chip LED design in Figure 5K, the light source 102 provided by the LED can be connected to the conductive metal wiring layer 1026 by, for example, SAC die attach.

[0077] With respect to thermal resistance R3, the light source 102 provided by an LED (vertical LED) as shown in Figure 5J may be directly mounted to the metal core layer 1022, but in the flip-chip design of Figure 5K, the insulating layer 1024 of the printed circuit board 1020 may be included in the thermal path defined by the printed circuit board 1020.

[0078] As illustrated with reference to the thermal heatsink diagram in Figure 5K (flip-chip design), thermal removal in the implementation configuration of Figure 5K may be limited by the presence of an insulating layer 1024 that forms a thermal heat removal path in the examples of Figures 5C, 5E, and 5K (flip-chip design with series connection). The examples herein recognize that thermal removal in the examples of Figures 5C, 5E, and 5K (flip-chip design with series connection) can be improved by the selection of the material for the insulating layer 1024. In one example, the insulating layer 1024 may be provided by a ceramic material.

[0079] Improvements in heat conduction are illustrated with reference to Table A, which shows the thermal resistance of various arrangements for supporting the light source bank 1002 as described with reference to Table A.

[0080] Table A TIFF2026510146000002.tif28123

[0081] The flip-chip series connection designs (flip-chip designs with series connections) in Figures 5C, 5E, and 5K may exhibit a thermal resistance of approximately 23.9 C / W. The vertical LED designs (vertical LED designs with parallel connections) in Figures 5B, 5D, and 5J may exhibit a thermal resistance of approximately 3.75 C / W. An example of a flip-chip (flip-chip design with series connections) according to Figures 5C, 5E, and 5K, in which the insulating layer 1024 is provided by a ceramic material, may feature a thermal resistance of approximately 7.22 C / W, which is comparable to the design in Figures 5B, 5D, and 5J (vertical LED design with parallel connections in which the light source 102 is directly connected to the metal core layer 1022 of the printed circuit board 1020). In one example, when the insulating layer 1024 is provided by a ceramic material, the ceramic material may be beryllium oxide (BeO). In one example, if the insulating layer 1024 is provided by a ceramic material, the ceramic material may be aluminum nitride.

[0082] Referring to Figure 5L, the optical pipe 110 can be connected to and mounted on a printed circuit board 1020 using a material forming section 1202. In one example, the material forming section 1202 may be provided by a gel forming section, and in another example, the material forming section 1202 may be provided by a silicone gel forming section. The material forming section 1202 may be optically transparent and may have a refractive index that matches the refractive index of the material defining the optical pipe 110.

[0083] Providing a material forming section 1202 that includes a refractive index matching the refractive index of the optical pipe 110 can improve the irradiance of the detector surface resulting from the energization of the optical energy excitation device 10. In one embodiment, the material forming section 1202 may include a refractive index greater than that of air for improved optical coupling and increased irradiance of the detector surface resulting from the energization of the optical energy excitation device 10. In one example, the use of the material forming section 1202 as shown in Figure 5J can improve the detector surface irradiance by about 15% to about 20%. In the example of Figure 5L, the light source 102 provided by the LED can be separated from the optical pipe 110 by a gap distance G. In some examples, the light source 102 provided by the LED can be surface coupled (butt coupled) to the light incident surface of the optical pipe 110.

[0084] The photoenergy excitation device 10 may excite a fluorophore by emitting excitation light 101 (Figure 1A) in a first lower wavelength range, for example, less than about 560 nm, and the fluorophore will fluoresce in response to the excitation light, emitting a second wavelength range of emission signal light 501, including longer wavelengths, for example, longer than about 560 nm. The detector 200 may be configured so that the emission of these wavelength ranges at the longer wavelengths is detected by the photosensor 202. The detector 200 may include an optical guide 214 which may be formed from a filter material that blocks light within the wavelength range of the excitation light 101, so that the emission signal light 501 resulting from the fluorescent fluorophore is selectively received by the photosensor 202.

[0085] The examples herein recognize that if the photoenergy excitation device 10 emits light within the fluorescence emission band (fluorescence range), such emitted light may, undesirably, be detected by the photosensor 202 as emission signal light. The examples herein include features that reduce the emission of fluorescence range wavelengths by the photoenergy excitation device 10.

[0086] As described above, the photoenergy excitation device 10 may include a short-pass filter 122. The short-pass filter 122 allows the transmission of excitation rays in the emission energy band of the light source bank 1002, but blocks light in the fluorescence range within the flow channel 282 due to autofluorescence components within the photoenergy excitation device 10. The short-pass filter 122 may be positioned at the distal end of the photoenergy excitation device 10 so that it can reject autofluorescence range wavelengths due to autofluorescence materials within the photoenergy excitation device 10. To facilitate filtering of autofluorescence range radiation emitted from the lens 114 and from components positioned in front of the lens 114 in the direction of light propagation, the short-pass filter 122 may be positioned at the distal end of the photoenergy excitation device 10, after the lens 114 in the direction of light propagation. An example of the short-pass filter 122 may include a substrate on which alternating layers of materials having higher and lower refractive indices are deposited. Materials with a higher refractive index may include, for example, titanium dioxide (TiO2) or tantalum pentoxide (Ta2O5), while materials with a lower refractive index may include, for example, silicon dioxide (SiO2). The material layer may be hard coated, for example, using ion beam sputtering.

[0087] To further reduce the light in the fluorescence range, the material of the light energy excitation device 10 may be selected for reduced autofluorescence. The examples herein recognize that silicate glass exhibits less autofluorescence than polycarbonate materials commonly used in optical systems. For example, one or more optical components of the light energy excitation device 10 may be selected to be formed from silicate glass. The examples herein recognize that silicate glass may produce reduced autofluorescence compared to alternative materials for optical components, and therefore, for example, one or more of the optical pipe 110, lens 114, short-pass filter 122 (its substrate), and window 126 may be selected to be formed from silicate glass for reduced autofluorescence. For example, one or more of the optical pipe 110, lens 114, short-pass filter 122 (its substrate), and window 126 may be selected to be formed from homogeneous silicate glass for reduced autofluorescence. In one example, the optical pipe 110, lens 114, short-pass filter 122 (its substrate), and window 126 are each selected to be formed from homogeneous silicate glass to reduce autofluorescence. In one example, the short-pass filter 122 may be positioned at position "L" between the first and second lens pairs defining the lens 114, as shown in Figure 2. Positioning the short-pass filter 122 at position "L" between the depicted lens pairs defining the lens 114 can be facilitated in one example by using silicate glass for the lens 114.

[0088] Figure 6 shows a three-dimensional schematic diagram of the light energy excitation device 10. As shown in Figure 6, the object plane 112 can be imaged onto the image plane 130 by the lens 114. As described herein, the object plane 112 may be defined on the light-emitting surface 111 of the optical pipe 110, and as a result, the image of light on the light-emitting surface 111 is projected onto the image plane 130, which may be positioned on the detector surface 206 (Figure 1A) of the detector 200 for supporting the sample, as described above. Since the lens 114 can image the light-emitting surface 111 of the optical pipe 110, it will be understood that the shape of the light-emitting surface 111 can be imaged onto the image plane 130 and projected onto the image plane 130 accordingly. For example, the shape of the light-emitting surface 111 is selected to correspond to the shape and size of the detector surface 206, and the light energy excitation device 10 is configured to image the shape of the light-emitting surface 111 onto the image plane 130 such that the lens 114 projects an illumination pattern 107 (Figure 3) onto the detector surface 206 that matches the shape and size of the detector surface 206.

[0089] Configuring the light energy excitation device 10 to project a light pattern 107 (Figure 3) onto the detector surface 206 that matches the shape and size of the detector surface 206 offers several advantages. This configuration ensures that the projected illumination pattern does not illuminate areas outside the outer periphery of the detector 200, which would otherwise waste light energy, nor does it result in under-illumination of the area of ​​interest.

[0090] In the example described with reference to Figure 6, both the light-emitting surface 111 and the detector surface 206 for supporting the sample may have a linear shape. As seen in Figure 6, the optical pipe 110 may have a linear cross section (taken along 6-6 traversing the optical axis 106) along its entire length. Furthermore, as mentioned above, the optical pipe 110 may have a tapering structure and a diameter that increases along its entire length from the light-entering surface 109 to the light-emitting surface 111. If the optical pipe 110 has a linear cross section, it will be understood that the divergent cone 1100 of light defined by the excitation ray emitted from the light-emitting surface 111 of the optical pipe 110 may have a linear cross section with softer angles and greater diffusion in the direction of light propagation toward the light-entering surface 113 of the lens 114.

[0091] For example, the light energy excitation device 10 may be configured such that the optical pipe 110 has a linear light emission surface 111, and its image may be projected onto the detector surface 206 by a lens 114 to support a sample which may have a linear outer circumference corresponding to the shape of the light emission surface 111.

[0092] The specifications of the components of an example light energy excitation device 10 are shown in Figure 7, which illustrates various optical parameter values ​​of the example light energy excitation device 10. In the example illustrated in Figure 7, the lens 114 has a magnification of 1:1 such that the size of the projected image in the image plane 130 is the same as the size of the object (light emitting surface 111) in the object plane 112. The example light energy excitation device 10 can produce a green illumination intensity of approximately 5 W / cm² with a drive current of 2 A per LED die, and a blue illumination intensity of approximately 7 W / cm² with a drive current of 2 A per LED die. Illumination uniformity of approximately >75% can be achieved within the entire illumination area. The materials to be used in the light energy excitation device 10 are shown in Table B below.

[0093] Table B TIFF2026510146000003.tif143170

[0094] In another example, the optical pipe 110 may be shaped such that the light-emitting surface 111 of the optical pipe 110 has a shape other than a linear shape, for example, by having a circular cross section along 6-6 that crosses the optical axis 106. Such an example may be advantageous when the sample support detector surface 206 has a shape other than a linear shape and has an outer circumference corresponding to the shape of the light-emitting surface 111.

[0095] The design of the light energy excitation device 10 can be easily modified to optimize it for use with different detectors, according to the detector 200 having different detector surfaces 206 having different shapes. For example, a first detector by detector 200 may have a rectangular detector surface 206 (from a top view along the Z-axis), a second detector by detector 200 may have a square detector surface 206, and a third detector by detector 200 may have a circular detector surface 206. Since the lens 114 is configured to image an object plane 112, which coincides with the light emission surface 111, onto the detector surface 206, the light energy excitation device 10 can be optimized for use with any of the different shaped detectors simply by changing the configuration of the optical pipe 110. For example, the optical energy excitation device 10 may have a modular structure having removable and replaceable optical pipe modules 133, as shown by the dashed line 132 in Figure 2 indicating a holder for holding replaceable modules, and the optical energy excitation device 10 may be provided with a plurality of such optical pipe blocks or modules, each having one or more optical pipes 110 configured differently. Optimizing the optical energy excitation device 10 for use with detectors 200 of different shapes having detector surfaces 206 of different shapes may involve simply replacing the currently installed first optical pipe module 133, which has a first optical pipe 110 and a first optical pipe light-emitting surface 111 of a first shape, with a second optical pipe module 133, which has a second optical pipe 110 and an optical pipe light-emitting surface 111 of a second shape that matches the shape of the detector 200 of different shapes having detector surfaces 206 of different shapes. The light energy excitation device 10 can be configured such that when different modules are installed in the holder of the housing 134 as indicated by the dashed line 132, the light emission surface 111 of the light pipe 110 of the newly installed module 133 is positioned on the object plane 112, and the light emission surface 111 of the light pipe 110 can be imaged onto the image plane located on the detector surface 206.

[0096] In one example, as shown in Figure 8A, the light energy excitation device 10 may include a plurality of light source banks 1002, for example, light source bank 1002, light source bank 1002B, light source bank 1002C, and light source bank 1002D. The various light source banks 1002, 1002B, 1002C, and 1002D may be spaced apart as shown and mounted on separate, spaced light source bank supporting regions 1050 of the printed circuit board 1020. Specifically, the light source defining light source bank 1002 may be mounted on the first light source bank supporting region 1050, the light source defining the second light source bank 1002B may be mounted on the second light source bank supporting region 1050 as shown in the figure, the light source defining the third light source bank 1002C may be mounted on the third light source bank supporting region 1050 as shown in the figure, and the light source defining the fourth light source bank 1002D may be mounted on the fourth light source bank supporting region 1050 as shown in the figure. Different light source bank supporting regions 1050 that can be separated from each other may be in thermal communication with the heat sink 702. In one example, each of the separated light source bank supporting regions 1050 of the printed circuit board 1020 for supporting the respective light source banks 1002, 1002B, 1002C, and 1002D can be directly connected to the heat sink 702, or connected to the heat sink 702 using a thermal interface material. The light source banks 1002, 1002B, 1002C, and 1002D can be mounted on the printed circuit board 1020 such that the thermal resistance between each light source bank 1002, 1002B, 1002C, and 1002D and the heat sink 702 is less than the thermal resistance between the light source banks 1002, 1002B, 1002C, and 1002D. The described configuration, in which the thermal resistance between each light source bank 1002, 1002B, 1002C, 1002D and the heat sink 702 is smaller than the thermal resistance between each light source bank 1002, 1002B, 1002C, 1002D, can improve heat removal from each of the respective light source banks 1002, 1002B, 1002C, 1002D and reduce heat transfer between each of the respective light source banks 1002, 1002B, 1002C, 1002D. In one example, the printed circuit board 1020 may include a plurality of screw holes 1052 distributed throughout the area of ​​the printed circuit board. The screw holes 1052 may include a central screw.To connect and mount the printed circuit board 1020 to the heat sink 702, screws can be passed through the described screw holes 1052 and screwed into the corresponding screw holes of the heat sink 702, thereby increasing the compressive force to improve thermal conductivity by tightening the described screws.

[0097] The described light source bank-supporting region 1050 of the printed circuit board 1020 may be defined by the surface area region of the printed circuit board 1020. In one example, the described light source bank-supporting region 1050 may be defined by a surface-modified surface area region of the printed circuit board 1020. In one example, the surface-modified surface area region of the printed circuit board 1020 may be a region of the printed circuit board 1020 characterized as described in relation to Figure 5D, from which one or more layers of the printed circuit board 1020, such as the insulating layer 1024 and the conductive metal wiring layer 1026, have been removed to facilitate direct connection of the light source 102 to the metal core layer 1022, as described in relation to Figure 5D. In one example, the light source 102 depicted in Figure 5D may be connected in a parallel electrical connection configuration as depicted in Figure 5B. The light source bank-supporting region 1050 is also depicted in Figures 5F and 5G. In one embodiment, as shown in various figures, the printed circuit board 1020 may include a plurality of separated light source bank supporting regions 1050, each of which, as depicted in Figure 5D, is characterized by the removal of an insulating layer 1024 and a conductive metal wiring layer 1026 to facilitate direct mounting of the light source 102 to the metal core layer 1022.

[0098] Different light source banks 1002 to 1002D may have different optical pipes associated with them. In the example in Figure 8A, optical pipe 110 can collect and homogenize light from light source bank 1002, optical pipe 110B can collect and homogenize light from light source bank 1002B, optical pipe 110C can collect and homogenize light from light source bank 1002C, and optical pipe 110D can collect and homogenize light from light source bank 1002D. Optical pipes 110 and 110B can project excitation light into lens 114, and optical pipes 110C and 110D can project excitation light into lens 114B. Therefore, optical pipes 110 and 110B can share a common lens 114, and optical pipes 110C and 110D can share a common lens 114B.

[0099] In the example shown in Figure 8D, system 100 may include first, second, third, and fourth detectors 200, 200B, 200C, and 200D. Each of these detectors may include an array of photosensors 202 (photosensor array 201). The sample support structure 260 may include a first detector surface 206, a second detector surface 206B, a third detector surface 206C, and a fourth detector surface 206D.

[0100] In the example of the optical energy excitation device 10 referenced in Figure 8D, lens 114 can image the light-emitting surfaces of optical pipe 110 and optical pipe 110B onto detector surface 206 and detector surface 206B, respectively. The optical energy excitation device 10 can project a first illumination pattern matching the size and shape of the first detector surface 206, a second illumination pattern matching the size and shape of the second detector surface 206B, a third illumination pattern matching the size and shape of the third detector surface 206C, and a fourth illumination pattern matching the size and shape of the detector surface 206D, through the operation of lenses 114 and 114B that image the planar object images of the light-emitting surfaces of optical pipes 110, 110B, 110C, and 110D.

[0101] The lens 114 may be configured to image the object plane 112 defined on the light-emitting surfaces 111 of the optical pipe 110 and the second optical pipe 110B onto an image plane 130 that can be defined on the detector surfaces 206, 206B, 206C, and 206D. By imaging the light-emitting surfaces 111 of the optical pipes 110, 110B, 110C, and 110D, the lenses 114 and 114B can project illumination patterns that match the respective sizes and shapes of the first detector surface 206, the second detector surface 206B, the third detector surface 206C, and the fourth detector surface 206D.

[0102] Referring to Figure 8C, the optical pipes 110, 110B, 110C, and 110D can be mounted in a specific mounting configuration such that the central axes 1106, 1106B, 1106C, and 1106D of each optical pipe 110, 110B, 110C, and 110D extend from their respective light source banks, with their axes arranged parallel to each other and perpendicular to the light source circuit board of each light source bank. Referring to Figure 8D, the detector 200 may include first and second camera integrated circuit chips 205 and 205B. The first camera integrated circuit chip 205 may include a detector surface 206 of detector 200 and a detector surface 206B of detector 200B. The second camera integrated circuit chip 205B may include a detector 200C having a detector surface 206C and a detector 200D having a detector surface 206D. A gap of approximately 500 μm may exist between the detector surface 206 and the detector surface 206B of the camera integrated circuit chip 205. A gap of approximately 500 μm may exist between the detector surface 206C and the detector surface 206D of the camera integrated circuit chip 205B. System 100 as shown in Figure 8D may be configured according to system 100 as shown in Figures 8C and 8D, including a camera integrated circuit chip 205 having first and second detectors, and a second integrated circuit chip 205B having first and second detectors.

[0103] Each of the detector surfaces 206, 206B, 206C, and 206D can be aligned with an array of optical sensors 202 (optical sensor array 201). In one embodiment of the detector surfaces 206, 206B, 206C, and 206D aligned with an array of optical sensors 202, a longitudinal axis 268 extending vertically through the center of the optical sensor 202 defining the optical sensor array of each detector 200 (Figure 1C) can extend through each of the detector surfaces 206A, 206B, 206C, and 206D.

[0104] The detector and detector surface are illustrated in Figures 1A to 1D. As shown in Figures 1A and 1B, the detector 200 may include an array of photosensors 202 (photosensor array 201) and a detector surface 206. The detector surface 206 of the detector 200 may be associated with the array of photosensors 202 by aligning with the array of photosensors 202 of the detector 200. In one embodiment of the alignment, the detector surface 206 may define an area intersected by a longitudinal axis 268 extending vertically through the photosensors that define the array of photosensors 202 of the detector.

[0105] Referring to Figure 1B, Figure 1B is a top-down view of the detector 200 as shown in Figure 1A, taken along the height of the photosensors 202 that define the sensor array of the detector 200. The array of photosensors 202 (photosensor array 201) can define a two-dimensional array of photosensors laid out in a grid pattern, and it can be seen that defined pixel positions A1 to E4 exist, as shown in Figure 1B. The illustrated pixel positions define the pixel positions of the detector 200 relative to the detector structure above the height of the drawn array of photosensors 202. Optical guides 214 aligned with each photosensor 202 may share their respective pixel positions A1 to E4 with the photosensors 202 to which they are aligned. For example, reaction sites provided by reaction recesses (nanowells) 210 aligned with each photosensor 202 may share their respective pixel positions A1 to E4 with the photosensors 202 to which they are aligned. The light sensor 202, the light guide 214, and the reaction recess 210 may, for example, be aligned by sharing a common longitudinal axis 268. All detectors 200-200D herein may include detector structures having pixel positions as described with reference to pixel positions A1-F4.

[0106] The system 100 shown in Figures 1C and 1D includes a plurality of detectors 200, 200B, 200C, and 200D. In the system 100 of Figures 1C and 1D, first, second, third, and fourth detectors 200, 200B, 200C, and 200D are provided, defined by each array of optical sensors 201 (optical sensor array 202). As shown in Figures 1C and 1D, the first and second detectors 200 and 200B may be integrated on a first camera image sensor chip 205, and the second and third detectors 200C and 200D, defined by each array of optical sensors 202 (optical sensor array 201), may be integrated on a second camera image sensor chip 205B. As best seen in Figures 1C and 1D, the first and second detectors 200, 200B of the first camera image sensor chip 205 and the second and third detectors 200C, 200D of the second camera image sensor chip 205B can be separated by a gap region 2185 where no light sensor is present. Furthermore, the second and third detectors 200B and 200C can be separated by a gap region 2186.

[0107] In a further embodiment, as best seen in Figure 1D, the sample support structure 260 may define first, second, third, and fourth detector surfaces 206, 206B, 206C, and 206D. Each of the first, second, third, and fourth detector surfaces 206, 206B, 206C, and 206D may be associated with and aligned with each array of the photosensor 202 (photosensor array 201). In the described examples in Figures 1C and 1D, the first, second, third, and fourth detectors 200, 200B, 200C, and 200D defined by each array of the photosensor 202 may operate independently. The independent operation of different detectors having different arrays of the photosensor 202 (photosensor array 201) as described herein may be characterized by the different detectors having independent exposure periods and / or independent readout periods. As shown in Figures 1B and 1D, an array of optical sensors 202 may include a two-dimensional M×N array of optical sensors 202. In one example, an M×N array of optical sensors may include 1M or more optical sensors. In one example, an M×N array of optical sensors may include 10M or more optical sensors. In one example, an M×N array of optical sensors may include 25M or more optical sensors. In an example shown in Figures 1C and 1D, four optical sensor arrays 201 may be provided, each having 25M or more optical sensors 202.

[0108] Each of the different detector arrays of the photosensor 202 may be exposed separately for separately controlled exposure periods, and the image signals from each of the different detector arrays defined by the array of photosensors 202 may be read out independently. Different detector surfaces 206, 206B, 206C, and 206D may be associated with and aligned to each different detector array defined by the array of photosensors 202 (photosensor array 201). According to one embodiment of alignment, each detector surface 206, 206B, 206C, and 206D may define a two-dimensional area (shown by a dashed line to indicate the foreground) in Figure 1D, which intersects with a vertically extending longitudinal axis 268 that extends through the center of each array of photosensors defining the respective first, second, third, and fourth photosensor arrays 201 shown in Figure 1D. As described above, the system 100 shown in Figures 8A to 8H may include multiple detector surfaces and may be provided according to the example in Figures 1C to 1D.

[0109] In the examples shown in Figures 8A to 8H, multiple optical pipes can project excitation rays onto a shared lens. For example, optical pipes 110 and 110B can project excitation rays onto a lens 114 in common, and the lens 114 can receive excitation rays emitted from the respective light-emitting surfaces 111 of optical pipes 110 and 110B, thereby imaging the object plane defined on the light-emitting surfaces 111 of optical pipes 110 and 110B onto the image plane defined on the sample support structure 260. As a result, the image of the light-emitting surface 111 of optical pipe 110 is projected onto the detector surface 206 of detector 200, and further, the image of the light-emitting surface 111 of optical pipe 110B is projected onto the detector surface 206B of detector 200B (as best seen in Figure 8D).

[0110] The examples herein recognize that if the optical energy excitation device 10 includes a plurality of optical pipes 110, 110B, 110C, and / or 110D, the optical energy excitation device 10 can particularly benefit from a precision alignment feature. The precision alignment feature herein facilitates the precision alignment of the first and second optical pipes 110, 110B, their respective light source banks 1002, 1002B, their commonly shared lens 114, and one another. The precision alignment feature herein can facilitate the separate and independent mounting of the first and second optical pipes 110, 110B to their respective light source banks 1002, 1002B.

[0111] Separate, independent mountings can facilitate alignment with improved precision. The precision alignment features of this specification feature removable mountings. For example, removable mountings with removable mechanical screws can facilitate the remounting of the optical pipe if it is observed that the optical energy excitation device 10 benefits from remounting. In one example, the precision alignment features of this specification may feature a gap distance G (standoff distance) between the optical pipe and the light source bank. Such an arrangement can reduce the influence of manufacturing tolerances of the light source on the object to be aligned. While providing a standoff distance may be advantageous, surface mounting of the optical pipe to the light source may be preferred in various applications. In another embodiment, the precision alignment features of this specification can provide limited mechanical contact, for example, through contact with one side and / or at a contact point with the optical pipe. In this way, the radiant flux generated on the detector surface 206 of the detector 200 can be improved.

[0112] Figures 9A to 9K depict mounting assemblies for mounting the first and second optical pipes 110 and 110B to the first and second light source banks 1002 and 1002B, respectively. The mounting assemblies depicted in Figures 9A to 9K may include a support structure 1502 and an optical pipe mount 1602 (shown in detail in Figures 9A to 9D). As best seen in Figures 9H and 9I and Figures 8B and 8C, the support structure 1502 may be mounted such that it has structural members fixed forward from (or otherwise fixed to) the light source banks 1002 and 1002B. In one example, the support structure 1502 may have an integrated, i.e., single-piece structure. In one example, the support structure 1502 may have a multi-piece structure. In one example, as shown throughout the figures, the support structure 1502 may be mounted on a printed circuit board 1020. In one example, the support structure 1502 may be defined by a printed circuit board 1020.

[0113] The depicted mounting assembly can facilitate alignment between the optical pipe, for example, optical pipe 110, and the light source 102. In one example of an optical pipe, for example, optical pipe 110 aligned with the light source 102, the central axis X102 of the light source 102, which extends perpendicularly through the front of the light source 102, may extend through the light incident surface 109 of the optical pipe 110, as depicted in Figures 4 and 5G. The depicted mounting assembly can facilitate alignment between the optical pipe, for example, optical pipe 110, and the light source 102. The depicted mounting assembly can facilitate alignment between the optical pipe (e.g., optical pipe 110) and the light source bank (e.g., light source bank 1002). In one example of an optical pipe, for example, optical pipe 110 aligned with the light source bank 1002, the central axis 1106 of the optical pipe 110 may extend through the light source bank supporting region 1050 of the printed circuit board 1020. The depicted mounting assembly can facilitate alignment between the optical pipe (e.g., optical pipe 110) and the light source bank (e.g., light source bank 1002). In one example of an optical pipe, for example, an optical pipe 110 aligned to a light source bank 1020, the central axis 1106 of the optical pipe 110 can extend through the light source bank supporting region 1050 of the printed circuit board 1020 and can extend perpendicularly through the printed circuit board 1020. In one example of an optical pipe, for example, an optical pipe 110 aligned to a light source bank 1002, as depicted in Figures 4 and 5D, a horizontal forward-extending plane 1054 that intersects the outer edge of the outermost horizontally positioned light source 102 defining the light source bank 1002 and intersects perpendicularly with the printed circuit board 1020 can substantially intersect the horizontally extending periphery of the light incident surface 109 of the optical pipe 110. In an example of an optical pipe, such as an optical pipe 110 aligned with a light source bank 1002, as shown in Figures 4 and 5D, a vertical forward-extending plane 1056 that intersects the outer edge of the outermost vertically positioned light source 102 defining the light source bank 1002 and intersects the printed circuit board 1020 at a right angle may substantially intersect the periphery of the optical pipe 110 that extends vertically from the light incident surface 109.

[0114] As shown in Figure 8C, the support structure 1502 may be mounted on the circuit board 1020, on which various light source banks 1002, 1002B, 1002C, and 1002D in the respective light source bank supporting regions 1050 of the printed circuit board 1020 can be mounted. As shown in Figures 9H and 9I, the support structure 1502 may include, for example, side wall structural members and one or more front planar structural members, as shown, defining the cavity 1504. One or more front planar structural members defining the cavity 1504 may be planar and may extend within a plane that extends parallel to the plane of the printed circuit board 1020 of the light source banks 1002, 1002B, 1002C, and 1002D.

[0115] In one embodiment, as described with reference to Figure 9F, a mounting assembly comprising a support structure 1502 and an optical pipe mount 1602 can facilitate the independent mounting of optical pipes 110 and 110B that project excitation rays from their respective associated light source banks 1002 and 1002B in common onto a common lens 114 supported by the optical pipe mount 1602 on the support structure 1502, as well as the separate and independent mounting of a second optical pipe 110B supported by the optical pipe mount 1602 on the support structure 1502.

[0116] The mounting of the optical pipes 110, which are aligned in front of the light source bank 1002, may include attaching the optical pipes 110 to an optical pipe mounting fixture 1602, and then attaching the optical pipe mounting fixture 1602 with the optical pipes attached to it to a support structure 1502.

[0117] An example of attaching the optical pipe 110 to the optical pipe mounting fixture 1602 is described with reference to Figures 9A to 9G, and Figures 9E to 9G depict alternative examples to those in Figures 9A to 9D. Mounting the optical pipe 110 to the optical pipe mount 1602 may include (a) attaching a replaceable mirror (not shown) to the distal planar surface 1606F of the optical pipe mount 1602; (b) placing a removable pin 1616 in a drawn pinhole 1665 of the optical pipe mount 1602; (c) placing the optical pipe 110 in the optical pipe mount 1602 and securely attaching the optical pipe to the pin 1616; (d) turning on an autocollimator (not shown) aligned to the central axis 1106 of the optical pipe 110; (e) moving the optical pipe 110 while observing the output of the autocollimator; (f) bonding the optical pipe 110 to the alignment mount with a suitable adhesive when the output of the autocollimator indicates that alignment has been achieved (the selected adhesive may have a refractive index that mimics air to match a predetermined optical pipe outer boundary refractive index); and (g) removing the removable mirror and removable pin. Steps (a) to (g) can be repeated for each optical pipe, for example, optical pipes 110, 110B, 110C, and 110D.

[0118] The optical pipe mount 1602, as shown in Figures 9A to 9G, may include a base 1604 and an extension section 1606, the extension section 1606 of which may extend forward from the base 1604. The base 1604 may include a mounting surface 1604M extending into a plane 1612, as shown. In another embodiment, the central axis 1608 of the extension section 1606 may extend perpendicular to the plane 1612. In another embodiment, the extension section 1606 may include an optical pipe mount section surface 1610, which may be configured to receive an optical pipe 110 for mounting on top. The surface 1610 may be a plane established at an angle matching the angle of the optical pipe 110, thereby aligning the optical pipe 110 such that the axis 106 of the optical pipe 110 extends perpendicular to the light source supporting the circuit board 1020.

[0119] The base 1604 may include a top surface 1605, and the extension section 1606 may include a top surface 1610 defined as a planar surface. To mount the optical pipe 110 onto the optical pipe mount 1602, the optical pipe 110 can be placed on the optical pipe mount 1602. In particular, the optical pipe 110 can be placed on the optical pipe mount 1602 by bringing a first section of the optical pipe 110 on the base surface 1605 into contact with a second section of the optical pipe 110 on the planar surface 1610 of the extension section 1606. The first section of the optical pipe 110 may be a specific outer surface of the optical pipe 110, approximately midway along its length. The second section of the optical pipe 110 may be a specific outer surface of the optical pipe 110, adjacent to the light-emitting surface 111 of the optical pipe 110. The first section of the optical pipe 110 may contact the base 1604 along a line 1605L defined by the upper surface 1605 of the base 1604. In one embodiment, the extension section 1606 may include, and may be configured such that, the optical pipe mounting surface 1610 of the extension section 1606 is a plane angled with respect to the central axis 1608 of the optical pipe 110 at a specific angle that coincides with the angle of the drawn side surface of the optical pipe 110. Thus, when arranged as described, the optical pipe 110 may be held at a certain angle such that, when placed on the optical pipe mount 1602, the central axis 1106 of the optical pipe mount 1602 extends parallel to the central axis 1608 of the extension section 1606 of the optical pipe mount 1602, and further, when the optical pipe is mounted so as to be aligned with the light source bank 1002, the central axis 1106 of the optical pipe 110 extends perpendicular to the printed circuit board 1020.

[0120] To secure the optical pipe 110 onto the optical pipe mount 1602, a suitable adhesive can be applied to the surface 1610 of the extension section 1606 before the optical pipe 110 is placed on the surface 1610, and the adhesive is applied as described above. The selected adhesive may have a refractive index that mimics air to match the refractive index of the predetermined optical pipe outer boundary. The optical pipe 110 can be firmly attached to the optical pipe mount 1602 when the optical pipe 110 is placed on the optical pipe mount 1602, by the output of the autocollimator described, which indicates that the optical pipe is aligned with the optical pipe mount 1602. When positioned as described, there is limited mechanical contact between the optical pipe mount 1602 and the optical pipe 110. In the described configuration, where the optical pipe 110 may include six planar sides, the described optical pipe mount 1602 may contact the optical pipe 110 on only one of its sides.

[0121] By attaching the feature portion, limiting the contact points with the optical pipe 110 can improve the irradiance on the detector surface 206 resulting from the energization of the optical energy excitation device 10. In one embodiment, limiting the contact points with the optical pipe 110 can reduce light scattering resulting from mismatches in the composition of the optical pipe's external boundary (a predetermined air in the described example). In another embodiment, limiting contact with the optical pipe 110 can reduce deformation of the optical pipe 110 resulting from mechanical forces.

[0122] In one embodiment, the cavity 1504 of the support structure 1502 may have a diameter larger than the diameter of the optical pipe 110. In this way, the optical pipe 110 can be housed within the cavity 1504 without contacting the sidewalls of the support structure 1502 that define the cavity 1504, thereby reducing the number of contact points with the optical pipe 110. The cavity 1504 may have a 360-degree sidewall circumference defined, as shown in the figure. In some examples, the cavity 1504 may have a sidewall circumference of less than 360 degrees.

[0123] The examples herein recognize that, in order to maximize the irradiance resulting from the operation of the optical energy excitation device 10, the central axis 1106 of the optical pipe 110 may be aligned perpendicular to the plane of the printed circuit board 1020, and may also be aligned parallel to the central axis 1060 of the lens 114, as shown in Figure 8I. To achieve the described alignments, the optical pipe mount 1602 may include an angled planar surface 1610 such that when the optical pipe 110 is placed on the planar surface 1610, the central axis 1106 of the optical pipe 110 extends parallel to the central axis 1608 of the extension section 1606. The angled planar surface 1610 may be provided to coincide with the angle of the optical pipe 110 such that when the optical pipe 110 is placed on the angled planar surface, the central axis 1106 of the optical pipe 110 extends parallel to the central axis 1608 of the extension section 1606.

[0124] Mounting the optical pipe 110 so as to be aligned with the light source bank 1002 may include (i) detachably mounting the optical pipe mount 1602 using the optical pipe 110 mounted on the support structure 1502. Detachable mounting can be performed by using threaded screws, as shown in Figures 9H to 9K. For mounting the optical pipe mount 1602, the optical pipe 110 may be fitted into a cavity 1504 defined by the support structure 1502, and the surface 1604M of the base 1604 may be firmly mounted on a planar structural member of the support structure 1502 that defines the cavity 1504. With the optical pipe 110 fitted into the cavity 1504 and the optical pipe mount 1602 firmly mounted on the planar surface of the support structure 1502, the illustrated screws can be tightened. All optical pipes 110, 110B, 110C, and 110D may be mounted in a similar manner.

[0125] With the optical pipe mount 1602 attached to the support structure 1502, a gap distance G, as shown in Figure 5J, can be defined between the upper surface of the light source 102 and the light incident surface of the optical pipe 110. The gap distance G between the light source 102 and the light incident surface of the optical pipe can be filled using a refractive index matching gel. The gap distance G can be about 10 microns to about 1000 microns, and in one example, it can be about 15 microns.

[0126] The gap between the light source 102 and the optical pipe 110 may be filled with a material formation 1202 provided by a refractive index matching gel that can match the refractive index of the optical pipe 110. The examples herein recognize that designing the optical pipes 110-110D to define a gap of gap distance G when mounted on a support structure 1502 may offer alignment advantages, as alignment may be less dependent on manufacturing tolerances, including the height of the light source. In some examples, surface bonding of the optical pipe 110 to the light source 102 may be advantageous.

[0127] With one or more of the optical pipes 110 to 110D attached to the support structure 1502, mounting the optical pipes may include (ii) completing the mounting of additional elements of the optical energy excitation device 10, including the lens 114, and orienting the optical energy excitation device 10 to project illumination patterns that match each of the detector surfaces 206 to 206D (Figure 8D). With the additional elements of the optical energy excitation device 10 attached, mounting the optical pipes 110 to 110D may include (iii) reading signals from the array of photosensors 202 having detector surfaces 206 to 206D (photosensor array 201) to verify whether the signals indicate that the various illumination patterns meet thresholds that satisfy illuminance, thresholds that satisfy uniformity, and thresholds that satisfy consistency between illumination patterns. If the signal check in (iii) indicates that the illumination pattern results in insufficient irradiance on the detector surfaces 206-206D, or is not sufficiently uniform or consistent between them, the mounting of the optical pipes 110-110D may include (iv) disassembling and reassembling one or more optical pipes and repeating steps (ii)-(iii). Disassembly of the optical pipes can be facilitated, for example, by the use of mechanical screws, as described herein, by the support structure 1502 and the optical pipe mounts 1602 which are removable and attachable.

[0128] The examples herein recognize that, in order to facilitate the precise alignment of optical pipes 110 and 110B, the described mounting assemblies may provide independent mounting of optical pipes 110 and 110B. Providing independent mounting of optical pipes 110 and 110B may facilitate the precise alignment of each optical pipe 110, 110B, their respective light source banks 1002, 1002B, the lens 114 shared by optical pipes 110, 110B, and one another.

[0129] The examples herein recognize that various manufacturing constraints and tolerances may present challenges to the alignment of the optical pipes 110 and 110B. The examples herein recognize that when the optical pipes 110 and 110B are surface-coupled to the light source 102 as herein, manufacturing tolerances may present challenges. For example, due to manufacturing tolerances, the first light source bank 1002 may extend slightly longer than the light source bank 1002B, and if each light source forming the light source banks 1002 and 1002B is surface-coupled to its respective optical pipe 110, 110B, the different heights of the light sources between light source banks 1002 and 1002B may result in a mismatch between the mounting arrangements of the two optical pipes. Thus, in one embodiment, the described mounting assemblies with pipes 110 and 110B may each be mounted with a gap distance G between the optical pipe incident surface and the light source bank, as shown in Figure 5J. Therefore, alignment is not limited by manufacturing tolerances, for example, arising from one light source bank extending further forward than another. While providing the optical pipes separated from the light source banks may offer advantages, in some applications, surface coupling of the optical pipes 110-110D to the light sources of each light source bank may be advantageous.

[0130] In one embodiment, the mounting assembly shown in Figures 9A to 9K facilitates the independent mounting of the first optical pipe 110 and the second optical pipe 110B. For example, the mounting assembly described in Figures 9A to 9K mounts the optical pipe 110 such that its incident surface 110 is separated from the light source of the light source bank 1002 by a gap distance G, and mounts the second optical pipe 110B such that its incident surface is separated from the light source of the second light source bank 1002B by a gap distance G.

[0131] In one embodiment where the components are mounted independently, a first optical pipe 110, as shown in Figures 9H and 9I, attached to an optical pipe mounting device 1602, may be mounted to a support structure 1502, and then a second optical pipe 110B, attached to the optical pipe mounting device 1602, may be mounted to the support structure 1502 as shown in Figure 9I.

[0132] The optical pipe mounts 1602 that support the respective optical pipes 110 and 110B can be detachably attached to the support structure 1502. That is, each optical pipe mount 1602 that supports the optical pipes 110 and 110B can be attached in a detachable manner. The detachable attachment of the optical pipe mounts 1602 to the support structure 1502 can be performed using mechanical screws as shown in Figures 9H and 9I. Therefore, if the optical pipes 110 and / or 110B are determined to be misaligned, the optical pipe mounts 1602 can be easily removed, and the first optical pipes 110 and / or the second optical pipes 110B can be accurately re-mounted to the respective light source banks 1002 and 1002B.

[0133] A mounting assembly for mounting the optical pipes 110 to 110D to each light source bank may include a support structure 1502 which may include at least one section member extending forward from the light source bank, and an optical pipe mount 1602 as shown in the detailed drawings in Figures 9A to 9G. Generally, to mount the first and second optical pipes to their respective light source banks, the first optical pipe 110, attached to the optical pipe mount 1602, may be mounted to the support structure 1502, and then the second optical pipe 110B, attached to the optical pipe mount 1602, may be mounted independently to the support structure 1502. To mount the optical pipes 110 and 110B to the support structure 1502, the mounting may be performed without the optical pipes 110 and 110B coming into contact with the support structure 1502. Rather, in order to attach the optical pipes 110 and 110B to the support structure 1502, contact can be made between the optical pipe mounting device 1602, which carries the optical pipes 110 and 110B, and the support structure 1502, without the optical pipes 110 and 110B coming into contact with the support structure 1502.

[0134] The independent mounting of the first and second optical pipes 110 and 110B to the support structure 1502 can offer various advantages. For example, this arrangement facilitates the alignment of the first and second optical pipes 110 and 110B to the lens 114, and also facilitates the precise alignment of the first optical pipe 110 to the second optical pipe 110B, which in turn facilitates adjustment of the precise alignment after the initial mounting. For example, if, after the initial alignment and mounting, it is discovered that the first and second optical pipes 110, 100B are misaligned with respect to either or their respective light source banks 1002, 1002B, or lens 114 (e.g., by observing signals read from one or more of the detectors 200-200D), the described mounting assembly facilitates readjustment of the optical pipe positioning. Readjustment can be facilitated by an independent mounting arrangement in which the first optical pipe 110 is mounted independently to the second optical pipe 110B. The examples herein recognize that if the optical energy excitation device 10 includes multiple optical pipes 110, 110B, the performance of the optical energy excitation device 10 may be adversely affected by misalignment of the optical pipes 110, 110B relative to each other. For example, a slight misalignment between optical pipes 110, 110B may cause a mismatch in irradiance between the first detector surface 206 and the second detector surface 206B, leading to misreading (the system 100 may not be able to detect emissions from the detector surface if the irradiance of the detector surface is below a threshold).

[0135] Precise readjustment of the alignment of one or more optical pipes 110-110D can also be facilitated by mounting fixtures provided to be removable. In one embodiment, the optical pipe mounting fixture 1602 may be provided to be removablely mounted on a support structure 1502. Thus, if misalignment is observed after the initial mounting of the optical pipe mounting fixture 1602 carrying the optical pipe 110, the mounting can be reversed and then redone by the removable replacement feature described. Removable replacement of the optical pipe mounting fixture 1602 may be achieved, in one example, by the use of threaded mechanical screws that can be loosened to facilitate readjustment of the optical pipe mounting fixture 1602 after its initial mounting. Readjustment may include removing the same optical pipe and reattaching it to the same optical pipe mounting fixture, reattaching a different individual of the optical pipe to the optical pipe mounting fixture, or providing a different mounting fixture 1602 and a replacement mounting fixture 1602 having different individuals of the optical pipe that provide the readjusted optical pipe, e.g., optical pipe 110 and / or optical pipe 110B.

[0136] The mounting assemblies described in Figures 9A to 9K may include various alignment features for improved alignment of the optical pipes 110 and 110B when the optical pipes 110 and 110B, supported by their respective optical pipe mounts 1602, are mounted on the support structure 1502. As shown in Figures 9A to 9K, the support structure 1502 and the optical pipe mount 1602 may have complementary vertically extending sidewalls 1502Z and 1602Z that engage with each other, and complementary horizontally extending sidewalls 1502X and 1602X that engage with each other. The vertically extending sidewalls 1502Z and 1602Z may extend in the drawn ZY plane, and the horizontally extending sidewalls 1502X and 1602X may extend in the drawn XY plane. When the optical pipe mount 1602 is mounted on the support structure 1502, the vertically extending side wall 1602Z engages with the vertically extending side wall 1502Z, and simultaneously, the horizontally extending side wall 1602X engages with the horizontally extending side wall 1502X of the support structure 1502. The described side wall engagements can restrict the mounted optical pipes 110, 110B from rotating about their central axis 1106 after mounting. In another embodiment, as best seen in Figures 9J and 9K, the horizontally extending side wall 1502X may include a gap 1502V at its end that joins the vertically extending side wall 1502Z. The gap 1502V allows the optical pipe mount 1602 to be gripped by precision instruments for mounting and / or removal.

[0137] In a further embodiment, as best seen in Figures 9J and 9K, the optical pipe mount 1602 (left side) may be mounted on the support structure 1502 at a first location on the support structure 1502, and the second optical pipe mount 1602 may be mounted on the support structure 1502 at a second location on the support structure 1502. The first location may be on the first side (e.g., the bottom side) of the support structure 1502 with respect to the horizontal axis 1506 extending through the optical pipes 110, 100B at the height of the support structure 1502. The second location may be on the second opposite side (e.g., the top side) of the support structure 1502 with respect to the horizontal axis 1506 extending through the optical pipes 110, 100B at the height of the support structure 1502. In the arrangements described in Figures 9J and 9K, the mounting fixture 1602 supporting the optical pipe 110 contacts the optical pipe 110 on its first side (bottom), and the mounting fixture 1602 supporting the optical pipe 110B contacts the optical pipe 110B on its second opposite side (top). The arrangements shown and described in Figures 9J and 9K can improve the positional stability and alignment of the optical pipes 110 and 110B, at least, because the arrangements allow for an increase in the width (X direction) of the mounting fixtures 1602 for the optical pipe 110 and the mounting fixtures 1602 for the optical pipe 110B, as depicted in Figure 9K, compared to the case where the mounting fixtures 1602 are mounted on the common side of the support structure 1502 with respect to the horizontal axis 1506. The arrangements shown and described in Figures 9J and 9K may also improve the accessibility of the mounting fixture 1602, making it easier to mount the optical pipe mounting fixture 1602, and to remove it when removal and remounting are beneficial as described herein. The arrangements shown and described in Figures 9J and 9K may also facilitate a more uniform distribution of retaining force for holding the optical pipes 110, 110B (e.g., a uniform distribution of retaining force between the left and right sides of the optical pipes).

[0138] In the example of Figure 8I, the light energy excitation device 10 may include an optical pipe 110 and a second optical pipe 110B as described herein. The optical pipe 110 may be surface-coupled to a first light source 102A, provided, for example, by an LED, and the optical pipe 110B may be surface-coupled to a second light source 102B, provided, for example, by a second LED. The light sources 102A and 102B may be configured to emit light in the same wavelength band or different wavelength bands. The lens 114 may be configured to image an object plane 112 defined on the light-emitting surfaces 111 of the optical pipe 110 and the second optical pipe 110B onto an image plane 130, which may be defined on the detector surface 206. Thus, the light energy excitation device 10 may project first and second separate illumination patterns 107 and 107B onto the detector surface 206, which may be advantageous if a biological or chemical test designer wants to isolate the detector surface 206 into separate test areas. For example, the test designer may specify that the test is performed using a first detector by detector 200 and a second detector by detector 200, and the system 100 may be configured such that the light energy excitation device 10 projects illumination areas 107 and 107B (patterns) onto separate detector surfaces 206 of the first and second different detectors 200, respectively.

[0139] This specification describes a light energy excitation device 10 having a light source 102A and a second light source 102B, wherein an optical pipe 110 receives excitation light from the light source 102A, and the excitation device comprises a second optical pipe 110B housed in a common housing 134 with the optical pipe 110, the second optical pipe 110B receives excitation light from the second light source 102B, the optical pipe 110 and the second optical pipe 110B propagate the excitation light emitted from the first light source 102A and the second light source 102B, respectively, and the light energy excitation device 10 shapes the excitation light propagating through the optical pipe 110 and the second optical pipe 110B, respectively, to define first and second separate illumination areas 107 and 107B (patterns).

[0140] The configuration shown in Figure 8I can define an optical axis 106 and a second optical axis 106B. In a single-channel system as described in Figures 2 to 7, the optical axis 106 can be positioned at the same location as the central axis 1060 of the lens 114. In the example of Figure 8I, each of the optical axis 106 and optical axis 106B may be offset and parallel to the central axis 1060 of the lens 114. The optical pipes 110 and 110B can define diverging cones 1100 and 1100B, respectively, having the divergence angle characteristics of the diverging cone 1100 described with reference to the ray trace diagram (single-channel system) described with reference to Figure 3. The lens 114 can define converging cones 1400 and 1400B, respectively, having the converging angle characteristics of the converging cone 1400 described with reference to the ray trace diagram (single-channel system) described with reference to Figure 3. In the examples shown in Figures 8A to 8H (see Figures 8A to 8B), the optical axes 106, 106B, 106C, and 106D can be defined by the optical pipes 110, 110B, 110C, and 110D aligned with their respective light source banks 1002, 1002B, 1002C, and 1002D. The central axes 1106, 1106B, 1106C, and 1106D of the optical pipes 110, 110B, 110C, and 110D can define their respective optical axes 106, 106B, 106C, and 106D, and can be positioned at the same location as their respective optical axes 106, 106B, 106C, and 106D.

[0141] In the examples of Figures 8A to 8H, the optical energy excitation device 10 may include an optical pipe 110 and a second optical pipe 110B as described herein. The optical pipe 110 may be coupled to a first light source bank 1002, the optical pipe 110B may be coupled to a second light source bank 1002B, the optical pipe 110C may be coupled to a third light source bank 1002C, and the optical pipe 110D may be coupled to a fourth light source bank 1002D. The lens 114 may be configured to image the object planes defined on the light-emitting surface 111 of the optical pipe 110 and the light-emitting surface 111 of the second optical pipe 110B onto an image plane 130 that can be defined on the detector surface 206 and the detector surface 206B, respectively. Lens 114B can be configured to image the object plane 112 defined on the light emission surface 111 of optical pipe 110C and the light emission surface 111 of optical pipe 110D onto an image plane that can be defined on the detector surface 206C and the detector surface 206D, respectively. Thus, the light energy excitation device 10 can project first, second, third, and fourth separate illumination patterns, configured as shown by illumination patterns 107 and 107B (Figure 8I), onto the detector surface 206, detector surface 206B, detector surface 206C, and detector surface 206D, respectively. In the example of the optical energy excitation device 10 shown in Figures 8A to 8I, the optical system defined by the optical pipes 110 and 110B combined with the lens 114 may be characterized by ray tracing using the optical system in Figure 8I, and the optical system defined by the optical pipes 110C and 110D combined with the lens 114B may be characterized by ray tracing using the optical system in Figure 8I.

[0142] For example, optical pipes 110 and 110B for defining the first and second illumination channels may be included in a set of interchangeable modules 133, as described herein, which can be interchangeably installed in a defined holder of the housing 134 of the optical energy exciter 10, indicated by the dashed line 132 as described in relation to Figure 2. As shown through several figures, the optical energy exciter 10 may be mounted on a heat sink 702 to dissipate heat from the optical energy exciter 10 in order to improve the performance of the optical energy exciter 10. The heat sink 702 may include a suitable metal, such as copper or aluminum, and may have fins as shown throughout the figures. The system 100 may include a fan (not shown) that blows air onto the illustrated fins for heat dissipation.

[0143] The flow channel 282 may be defined by the flow cell frame 902, as illustrated in Figure 10, which illustrates a perspective assembly physical configuration of the flow cell frame 902 defining the flow channel 282. The flow cell frame 902 may include side walls 284 and a flow cover 288, for example, as depicted in the schematic diagram of Figure 1A.

[0144] Figure 11 illustrates structural details illustrating the internal components of the cartridge 802 of the detector assembly 20. The cartridge 802, as shown in Figure 11, may be configured to include a physical alignment feature 806 that helps align the photoenergy excitation device 10 with the detector 200. As shown in Figures 10 and 11, the detector 200 is shown to be positioned in a location established by the detector 200 and the flow cell frame 902 having the flow channel 282. The physical alignment feature 806 may be provided to capture the corresponding feature of the photoenergy excitation device 10 defined by the distal end portion of the housing 134 of the photoenergy excitation device 10. To couple the photoenergy excitation device 10 to the detector assembly 20 and the detector 200, the distal end portion of the housing 134 (Figure 2) of the photoenergy excitation device 10 is inserted into the receiving portion of the cartridge 802 of the detector assembly 20, and the distal end portion of the housing 134 of the photoenergy excitation device 10 may be positioned to align with the corresponding alignment feature portion 806 as shown in Figure 11, so that the photoenergy excitation device 10 is properly aligned with the flow channel 282 and the detector 200 as shown in Figure 1A.

[0145] Figure 12 illustrates a top view of a flow channel 282 positioned above a detector 200. In one example as shown in Figure 12, the flow channel 282 may include sidewalls 283 that shape the flow channel 282 so that the biological or chemical reaction to be detected occurs on fewer photosensors than all of the photosensors 202 combined. In one example, the detector 200 may include an array of 14M photosensors that can be considered as pixels, and the flow channel 282 may be composed of flow cell sidewalls 283 so that approximately 8M photosensors 202 are used during the biological or chemical test.

[0146] Figures 13 and 14 illustrate further details of a detector assembly 20 and detector 200 in an example that may be used with the photoenergy excitation device 10.

[0147] In the illustrated example shown in Figure 13, the flow channel 282 is defined by the detector surface 206, the sidewall 284, and the flow cover 288 supported by the sidewall 284 and other sidewalls (not shown). The sidewall may be bonded to the detector surface 206 and may extend between the flow cover 288 and the detector surface 206. In some examples, the sidewall is formed from a curable adhesive layer that bonds the flow cover 288 to the detector 200.

[0148] The flow channel 282 may include a height H1. As just one example, the height H1 may be about 50 μm to about 400 μm, or more specifically, about 80 μm to about 200 μm. The flow cover 288 may include a material that is light-transmitting to excitation light 101 propagating from outside the detector assembly 20 into the flow channel 282.

[0149] As shown in the figure, the flow cover 288 may also define an inlet portal 289 and an outlet portal 290 configured to fluidly engage with other ports (not shown). For example, the other portals may be from a cartridge (not shown) or a workstation (not shown).

[0150] The detector 200 may include an optical sensor array 201 of optical sensors 202, a guide array 213 of optical guides 214, and a reaction array 209 of reaction recesses 210. The aligned structural components of the detector 200 may share common pixel locations, as described with reference to Figure 1B. In certain examples, the components are arranged so that each optical sensor 202 aligns with a single optical guide 214 and a single reaction recess 210. However, in other examples, a single optical sensor 202 may receive photons through two or more optical guides 214. In some examples, two or more optical guides and / or reaction recesses may be provided for each optical sensor in the optical sensor array.

[0151] In some examples, two or more optical guides and / or optical sensors aligned in the reaction recesses of the reaction recess array may be provided. The term “array” does not necessarily include each and all of the specific types of items that the detector 200 may have. For example, the optical sensor array 201 of optical sensors 202 may not include each and all of the optical sensors of the detector 200. In another example, the guide array 213 may not include all of the optical guides 214 of the detector 200. In yet another example, the reaction array 209 may not include all of the reaction recesses 210 of the detector 200. Thus, unless explicitly stated otherwise, the term “array” may or may not include all such items of the detector 200.

[0152] The detector 200 has a detector surface 206 that can be functionalized (for example, chemically or physically modified in a manner suitable for initiating a desired reaction). For example, the detector surface 206 may be functionalized and may contain a plurality of reaction sites on which one or more biomolecules are immobilized. The detector surface 206 may have a reaction array 209 of reaction recesses 210. Each of the reaction recesses 210 may contain one or more reaction sites. The reaction recesses 210 may be defined, for example, by depressions or by a change in depth along the detector surface 206. In other examples, the detector surface 206 may be substantially planar.

[0153] Figure 14 is an enlarged cross-sectional view of the detector 200 showing various feature parts in more detail. More specifically, Figure 14 shows a single photosensor 202, a single optical guide 214 for directing emitted signal light 501 to the photosensor 202, and associated circuitry 246 for transmitting a signal based on the emitted signal light 501 (e.g., photons) detected by the photosensor 202. It is understood that the other photosensors 202 and associated components of the photosensor array 201 (Figure 13) may be constructed in the same or similar manner. However, it is also understood that the detector 200 does not need to be manufactured identically or uniformly throughout. Instead, one or more photosensors 202 and / or associated components may be manufactured differently or have different relationships to one another.

[0154] Circuit 246 may include interconnected conductive elements (e.g., conductors, traces, vias, interconnects, etc.) capable of conducting electric current, such as transmitting data signals based on detected photons. Detector 200 comprises an integrated circuit having a planar optical sensor array of optical sensors 202. Circuit 246 formed within detector 200 may be configured for at least one of the following: readout signals from optical sensors 202, signal amplification, digitization, storage, and processing, depending on the emitted signal light 501 received by optical sensors 202 and exposed during an exposure period (integration period) in which charge accumulates on optical sensors 202. Circuit 246 may collect and analyze the detected emitted signal light 501 and generate data signals for communicating the detection data to a bioassay system. Circuit 246 may also perform additional analog and / or digital signal processing in detector 200. Optical sensors 202 may be electrically coupled to circuit 246 through gates 241-243.

[0155] An example detector 200 may be provided by a solid-state integrated circuit detector such as a CMOS integrated circuit detector or a CCD integrated circuit detector. An example detector 200 may be an integrated circuit chip manufactured using an integrated circuit manufacturing process such as a complementary metal-oxide-semiconductor (CMOS) manufacturing process.

[0156] The resolution of the light sensor array 201 defined by the light sensor 202 can be greater than approximately 0.5 megapixels (M pixels). In a more specific example, the resolution can be greater than approximately 5 megapixels, and more specifically, greater than approximately 14 megapixels.

[0157] The detector 200 may include a plurality of stacked layers 231-237, each containing a sensor layer 231, where the sensor layer 231 may be a silicon layer. The stacked layers may include a plurality of dielectric layers 232-237. In the illustrated example, each of the dielectric layers 232-237 contains a metallic element (e.g., W (tungsten), Cu (copper), or Al (aluminum)) and a dielectric material, such as SiO2. Various metallic elements and dielectric materials may be used, such as those suitable for integrated circuit manufacturing. However, in other examples, one or more of the dielectric layers 232-237 may contain only a dielectric material, such as one or more layers of SiO2.

[0158] In a particular example of Figure 17, the dielectric layers 232-237 may include metallized layers labeled as layers M1-M5 in Figure 17. As shown, the metallized layers M1-M5 may be configured to form at least a portion of the circuit 246.

[0159] In some examples, the detector 200 may include a shielding structure 250 having one or more layers extending over the entire area above the metallized layer M5. In the illustrated example, the shielding structure 250 may include a material configured to block the optical signal propagating from the flow channel 282. The optical signal may be excitation light 101 and / or emission signal light 501. As just one example, the shielding structure 250 may include tungsten (W). As a mere example, the excitation light may have a peak wavelength of about 523 nm (green light) or 456 nm (blue light), and the emission signal light 501 may include wavelengths of about 570 nm or greater (Figure 4).

[0160] As shown in Figure 14, the shield structure 250 may include openings 252 through it. The shield structure 250 may include an array of such openings 252. The openings 252 can be sized to allow signal-emitting light to propagate to the optical guide 214. The detector 200 may also include a passivation layer 256 extending across the openings 252 along the shield structure 250. The detector 200 may also include a passivation layer 256 including a detector surface 206 extending across the openings 252 along the passivation layer 258. The shield structure 250 may extend over the openings 252, thereby directly or indirectly covering the openings 252. The passivation layers 256 and 258 may be configured to protect the lower-height layers and the shield structure 250 from the fluid environment of the flow channel 282. For example, the passivation layer 256 is formed from or contains SiN or the same. For example, the passivation layer 258 is formed from or contains tantalum pentoxide (Ta2O5) or the same. A sample support structure 260 having the passivation layers 256 and 258 can define a detector surface 206 having reaction recesses 210. The sample support structure 260 defining the detector surface 206 may have any number of layers, such as 1 to N layers.

[0161] The sample support structure 260 may define a solid surface (i.e., detector surface 206) on which biomolecules or other analytes can be immobilized. For example, each of the reaction sites in the reaction recess 210 may contain clusters of biomolecules immobilized on the detector surface 206 of the passivation layer 258. Thus, the passivation layer 258 may be formed from a material that allows the reaction sites of the reaction recess 210 to be immobilized thereon. The passivation layer 258 may also contain a material that is at least transparent to the desired fluorescence. The passivation layer 258 may be physically or chemically modified to facilitate the immobilization of biomolecules and / or to facilitate the detection of the emitted signal light 501.

[0162] In the illustrated example, a portion of the passivation layer 256 extends along the shield structure 250, and a portion of the passivation layer 256 extends directly along the filter material defining the optical guide 214. The reaction recess 210 may be aligned with the optical guide 214 and formed directly on it. In one example, each of the reaction recess 210 and the optical guide 214 may have a cross-sectional geometric center centered on the longitudinal axis 268. The filter material may be deposited in a cavity defined by a side wall 254 formed within a dielectric laminate having stacked layers 232-237.

[0163] The optical guide 214 can be configured relative to the surrounding material of a dielectric stack defined by dielectric layers 231-237 to form an optical guide structure. For example, the optical guide 214 may have a refractive index of at least about 1.6 such that, according to one example, the light energy propagating through the optical guide 214 is substantially reflected at the interface in the sidewall 254 between the optical guide 214 and the surrounding dielectric stack defined by dielectric layers 231-237. In a particular example, the optical guide 214 may be configured such that the optical density (OD) or absorbance of the excitation light is at least about 4 OD. More specifically, the filter material may be selected to achieve at least 4 OD and the optical guide 214 may be sized accordingly. In a more particular example, the optical guide 214 may be configured to achieve at least about 5 OD or at least about 6 OD. In a more particular example, the optical guide 214 may be configured to achieve at least about 7 OD or at least about 8 OD. Other features of the detector 200 may be configured to reduce electrical and optical crosstalk.

[0164] Further details of the process control system 310 will be described with reference to Figure 15. The process control system 310 may, for example, include one or more processors 3101, a memory 3102, and one or more input / output interfaces 3103. The one or more processors 3101, the memory 3102, and the one or more input / output interfaces may be connected via a system bus 3104. For example, the process control system 310 may be provided by a computer system as shown in Figure 15. The memory 3102 may include a combination of system memory and storage memory. The memory 3102 may, for example, store one or more programs for facilitating the processes described herein. One or more processors 3101 may execute one or more programs stored in the memory 3102 to facilitate the processes described herein. The memory 3102 may define a computer-readable medium.

[0165] The DNA sequencing process facilitated by the photoenergy excitation device 10 will be described with reference to Figures 16 and 17. Referring to Figure 16, a spectral profile correspondence diagram illustrating an example of the operation of system 100 is shown. For example, the light source bank 1002 may include light sources that emit light at first and second different wavelengths. Including light sources that emit excitation light in first and second different wavelength ranges in the light source bank 1002 facilitates a dye chemical DNA sequencing reconstruction process in which first and second dyes can be placed in the fluid within the flow channel 282.

[0166] Spectral profile 1702 shown in Figure 16 exemplifies the excitation wavelength emission band of a green light source in a photoenergy excitation device 10, such as light source 102A shown in Figure 4. Spectral profile 1712 is the wavelength emission band of a blue light source in a photoenergy excitation device 10, such as light source 102H shown in Figure 4. Spectral profile 1704 is the absorption band spectral profile of a first fluorophore sensitive to green light that can be disposed together with the fluid in the flow channel 282. Spectral profile 1714 is the absorption band spectral profile of a second fluorophore sensitive to blue light that can be disposed together with the fluid in the flow channel 282. Spectral profile 1707 is the absorption band spectral profile of a third fluorophore sensitive to both green and blue light that can be disposed together with the fluid in the flow channel 282.

[0167] Spectral profile 1706 is a partial spectral profile of the emission signal light 501 caused by a first fluorophore that fluoresces when excited by green light having spectral profile 1702. Spectral profile 1716 is a partial spectral profile of the emission signal light 501 caused by a second fluorophore that fluoresces when excited by blue light having spectral profile 1712. Spectral profile 1708 is a partial spectral profile of the emission signal light 501 caused by a third fluorophore that fluoresces when excited by green light having spectral profile 1702. Spectral profile 1709 is a partial spectral profile of the emission signal light 501 caused by a third fluorophore that fluoresces when excited by blue light having spectral profile 1712.

[0168] Spectral profile 1730 is a transmission spectral profile of 202 that defines the detection bandwidth of the optical sensor array 201 and indicates the detection bandwidth of the optical sensor array 201.

[0169] The examples herein recognize that, with reference to the spectral profile correspondence diagram in Figure 16, the process control system 310 may be configured to determine that (a) a first fluorophore is attached to sample 502 based on fluorescence detected by the photosensor 202 under excitation limited to excitation by one or more green light sources and fluorescence not detected by the photosensor 202 under excitation limited to excitation by one or more blue light sources; (b) a second fluorophore is attached to sample 502 based on fluorescence detected by the photosensor 202 under excitation limited to excitation by one or more blue light sources and fluorescence not detected by the photocell sensor 202 under excitation limited to excitation by one or more green light sources; and (c) a third fluorophore is attached to sample 502 based on fluorescence detected by the photosensor 202 under excitation limited to excitation by one or more green light sources and fluorescence also detected by the photosensor 202 under excitation limited to excitation by one or more blue light sources. The process control system 310 can, for example, identify which fluorophore is attached to the sample using a decision logic data structure shown in the decision logic table of Table C, which maps the presence of fluorophore to nucleotide type, and can determine the nucleotide types present in the DNA strand fragment providing sample 502, e.g., A, C, T, and G, where the identified nucleotides are nucleotides of nucleotide types A, C, T, and G (specific mapping is based on test setting parameters).

[0170] Table C TIFF2026510146000004.tif62170

[0171] The process control system 310 can perform processes supporting DNA sequence rearrangement in multiple cycles. In each cycle, different portions of the DNA fragment can be subjected to sequencing to determine the nucleotide type associated with the fragment, e.g., A, C, T, or G, using a determination data structure, such as the determination data structure described in Table C. A set of processes that can be performed by the process control system 310 for use when performing DNA sequence rearrangement using the photoenergy excitation device 10 is shown in the flowchart of Figure 17.

[0172] In block 1802, the process control system 310 can clear the flow channel 282, which means that the process control system 310 can remove fluid from the flow channel 282 that was used during the previous cycle. In block 1804, the process control system 310 can introduce a fluid having multiple fluorophores, for example, a first and a second fluorophore, or a first, second, and a third fluorophore, into the flow channel 282. The first and second fluorophores may include absorption characteristics described with reference to absorption band spectral profile 1704 and absorption band spectral profile 1714, respectively, as illustrated with reference to the spectral profile diagram in Figure 16. The first, second, and third fluorophores may include absorption characteristics described with reference to absorption band spectral profile 1704, absorption band spectral profile 1714, and absorption band spectral profile 1707, respectively, as illustrated with reference to the spectral profile diagram in Figure 16.

[0173] In block 1806, the process control system 310 may read a signal from the photosensor 202 that has been exposed to active excitation in a first wavelength range. In block 1806, the process control system 310 may control the photoenergy excitation device 10 so that it emits excitation light limited to excitation by one or more green light sources during the exposure period of the photosensor 202. In block 1806, the process control system 310 may energize one or more green light sources in the light source bank 1002, for example, light sources 102A to 102G shown in Figure 4, while keeping one or more blue light sources in the light bank (for example, light sources 102H to 102J shown in Figure 4) de-energized during the exposure period of the photosensor 202. When the light source bank 1002 is controlled as described above so that the green light source is turned on and the blue light source is turned off during the exposure period of the photosensor 202, the process control system 310 may, in block 1806, read a first signal from the photosensor 202 that has been exposed to excitation limited to excitation by one or more green light sources, as described herein.

[0174] In block 1808, the process control system 310 can read a signal from the pixel sensor 202 that has been exposed to active excitation in a second wavelength range. In block 1808, the process control system 310 can control the photoenergy excitation device 10 so that during the exposure period of the sensor 202, the photoenergy excitation device 10 emits excitation light limited to excitation by one or more blue light sources of the photoenergy excitation device 10. In block 1808, the process control system 310 can energize one or more blue light sources in the light source bank 1002 (e.g., light sources 102H to 102J shown in Figure 4) while keeping one or more green light sources in the light bank (e.g., light sources 102A to 102G shown in Figure 4) de-energized. If the light source bank 1002 is controlled as described above so that the green light source is turned on and the blue light source is turned off during the exposure period of the photosensor 202, the process control system 310 may, in block 1808, read a second signal from the photosensor 202 that has been exposed to excitation limited to excitation by one or more blue light sources, as described herein.

[0175] In block 1810, the process control system 310 for the current cycle processes the first signal read in block 1806 and the second signal read in block 1808 to determine the nucleotide type of the DNA fragment being tested during the current cycle, for example, using a decision data structure as shown in Table C. The process control system 310 may perform the described nucleotide identification process, as described with reference to the flowchart in Figure 17, for each cycle of the DNA sequencing process until nucleotide identification is performed for each cycle in which it is scheduled.

[0176] The process control system 310 can be configured to perform a wide range of tests to test the operation of system 100. The process control system 310 can perform calibration tests in which the operation of the photoenergy excitation device 10 and the detector 200 is tested. In such an example, the process control system 310 may be configured to selectively energize different light sources during exposure periods of the photosensor array 201 and to inspect signals read from the photosensor array 201 during the exposure periods. The method may include selectively energizing the first light source (e.g., green emission) during a first exposure period of the photosensor with the second (blue emission) light source and the third (e.g., red emission) light source remaining de-energized; selectively energizing the second light source during a second exposure period of the photosensor with the first and third light sources remaining de-energized; and selectively energizing the third light source during a third exposure period of the photosensor with the first and second light sources remaining de-energized.

[0177] A timing diagram illustrating the control of the LEDs defining the light source bank 1002 is shown with reference to Figure 18. The timing diagram in Figure 18 illustrates the correspondence between illumination control and camera detector control during a continuous cycle for array reconstruction. Referring to the timing diagram in Figure 18, control signal 2202 is a control signal illustrating the control of the green LED of the light source bank 1002. Referring to control signal 2202, the power supply 1210 (Figures 5B and 5C) can be controlled to vary the current level for driving the green LED between a 0 current level and a high current level H.

[0178] The green LED can be turned on when the current level is high and off when the current level is zero. Control signal 2212 illustrates the control of current across the blue LED of light source bank 1002 over time, with a control voltage level that varies between zero and a high current level H. The indicated time T1 illustrates the on time of the LEDs of light source bank 1002 within a continuous cycle. In some examples, chemical processes may be performed during intermediate periods of the depicted cycle. In some examples, chemical processes may be performed during periods within the depicted cycle.

[0179] The timing diagram in Figure 18 shows cycles N, N+1, N+2, and N+3. Control signal 2226 in the timing diagram in Figure 18 illustrates the camera detector control timing. The detector 200 defining one or more photosensor arrays 201 (cameras) defined by the array of photosensors 202 can be controlled using exposure control signals and readout control signals.

[0180] Referring to the control signals 2202, 2212, and 2226 shown in the timing diagram of Figure 18, each cycle may include approximately 20 seconds. The illumination on time T1 may include approximately 20% of each cycle. Each cycle may include the illumination on period T1 followed by a processing period characterized by the processing of frame image data read from the detector 200 that defines the camera.

[0181] Control signal 2226 is a control signal for a detector 200 (referred to as camera 1) having a detector surface 206. In one example, the detector 200 may be configured such that the rising edge of control signal 2226 initiates the exposure period for camera 1, and the falling edge of the pulse defining control signal 2226 initiates the readout of signals from camera 1. Referring to control signals 2202, 2212, and 2226, the detector 200 may be controlled to have first and second exposure and readout times for each cycle, as shown by blocks 1806 and 1808 of the flowchart in Figure 18. Referring to the exposure and readout control drawn by control signal 2226, the first exposure period for each signal may be the exposure period for the first frame resulting from excitation by a green light LED in the second exposure period for each cycle, or the exposure period for the first frame resulting from excitation by a blue light LED to expose the photosensor of the detector 200 to emitted light 501. Therefore, the first pulse of each cycle may define the first exposure period of the cycle, and the second pulse of each cycle may define the second exposure period of each cycle. Referring to timeline 2228, timeline 2228 shows a processing period F for processing the data read frame. G The timeline 2229 depicts the processing period F, which is represented by the emission signal light 501 generated from excitation by a green light LED and the timeline 2229. B This is a processing period for processing frames of image data read from the detector 200. When exposed to emitted light 501 resulting from excitation by the blue light LEDs of the light source bank 1002, control signal 2203 indicates alternative control of the green light LEDs of the light source bank 1002, and control signal 2213 indicates alternative control energization of the blue light LEDs of the light source bank 1002. For example, the LEDs defining the light source bank 1002 may be overdriven beyond their maximum current rating.

[0182] The examples herein recognize that the LEDs defining the light source bank 1002 may be favorably driven beyond their factory rated maximum current rating. Control signal 2203 illustrates the over-driving of a green LED, and control signal 2213 depicts the over-driving of a blue LED. According to control signals 2203 and 2213, over-driving may include over-driving a set of LEDs by applying a current twice the LED's rated maximum current load. However, over-driving may include any current value at which the LEDs will be over-driven, e.g., 3M, 4M, where M is the maximum rated current. The examples herein recognize that the LEDs defining the light source bank 1002 may be favorably over-driven to increase the irradiance on the detector surface 206-206D if the LEDs are controlled to be cooled to safely avoid the maximum LED temperature. Control signals 2203 and 2213 depict LED control, where the set of LEDs has on-times and off-times. The examples herein recognize that the presence of off-times may facilitate the cooling of the LEDs.

[0183] Control signals 2232, 2242, and 2256 illustrate the control of the green LED of light source bank 1002B, the blue LED of light source bank 1002B, and the detector 200B (camera 2) having a detector surface 206B associated with light source bank 1002B.

[0184] Control signals 2262, 2272, and 2286 illustrate the control of the green LED of light source bank 1002C, the blue LED of light source bank 1002C, and the optical sensor array 201 (camera 3) of detector 200C having detector surface 206C, respectively.

[0185] Control signals 2292, 2302, and 2316 illustrate the control of the green LED of the light source bank at D, the blue LED of the light source bank at D, and the detector 200D (camera 4) having the detector surface 206D, respectively.

[0186] The timing diagram in Figure 18 may include timings adjusted so that LEDs in different light source banks 1002, 1002B, 1002C, and 1002D (banks 1, 2, 3, and 4 in Figure 18) can avoid overlapping illumination on times. For example, one example illustrates that LEDs in a common wavelength band between different light source banks may be energized asynchronously. While providing asynchronous timing as shown in Figure 18 may be advantageous for thermal management, other embodiments may feature illumination correspondence such that illumination on times between light source banks 1002, 1002B, 1002C, and 1002D overlap, and in some cases, are synchronized to completely overlap. In one example, all green LEDs from all light source banks 1002, 1002B, 1002C, and 1002D may be controlled to turn on simultaneously during the described cycle, and all blue LEDs from all light source banks 1002, 1002B, 1002C, and 1002D may be controlled to turn on simultaneously during the described cycle. In another example, all green LEDs from light source banks 1002 and 1002B may be selectively controlled to turn on simultaneously during the described cycle, and all selected blue LEDs from light source banks 1002 and 1002B may be controlled to turn on simultaneously during the described cycle. In yet another example, all green LEDs from light source banks 1002C and 1002D may be selectively controlled to turn on simultaneously during the described cycle, and all selected blue LEDs from light source banks 1002C and 1002D may be controlled to turn on simultaneously during the described cycle.

[0187] Referring again to Figure 8A, the different light source banks 1002, 1002B, 1002C, and 1002D can each be mounted on different, spaced light source bank-carrying regions 1050 of the printed circuit board 1020. In one example, the printed circuit board 1020 may carry power supplies 1210 (LED drivers) according to Figure 5B and / or Figure 5C for each of the different light source banks 1002, 1002B, 1002C, and 1002D. The printed circuit board 1020 may also carry a first power supply 1210 (LED driver) for driving light source bank 1002, a second power supply 1210 (LED driver) for driving light source bank 1002B, a third power supply 1210 (LED driver) for driving light source bank 1002C, and a fourth power supply 1210 (LED driver) for driving light source bank 1002D. The light energy excitation device 10 may use a multiplexing circuit on the printed circuit board 1020 that can reduce the number of LED drivers. In one example, the light energy excitation device 10 may include fewer power supplies 1210 (LED drivers) than the number of light source banks 1002 to 1002D, and multiplexing may be used so that the same driver can drive LEDs on different printed circuit boards on spaced-apart printed circuit boards 1020 at different times. In one example shown in Figure 18, the light energy excitation device 10 may include a single power supply 1210 (LED driver). In the first part of each cycle drawn, the driver may be multiplexed to power the LEDs of light source bank 1002. In the second part of each cycle drawn, the driver may be multiplexed to power the LEDs of light source bank 1002B. In the third part of each cycle drawn, the driver may be multiplexed to power the LEDs of light source bank 1002C. In the fourth part of each cycle drawn, the driver may be multiplexed to power the LEDs of light source bank 1002D.

[0188] In one example, all green LEDs from light source banks 1002 and 1002B may be selectively controlled to turn on simultaneously during the described cycle, all blue LEDs from light source banks 1002 and 1002B may be selectively controlled to turn on simultaneously during the described cycle, and furthermore, all green LEDs from light source banks 1002C and 1002D may be selectively controlled to turn on simultaneously during the described cycle, and all selected blue LEDs from light source banks 1002C and 1002D may be controlled to turn on simultaneously during the described cycle. In the described example, the photoenergy excitation device 10 may include first and second power sources (LED drivers). In the first part of each cycle, the first and second drivers may be multiplexed to control all green LEDs in light source banks 1002 and 100B to turn on simultaneously. In the second part of each cycle, the first and second drivers may be multiplexed to control all blue LEDs in light source banks 1002 and 100B to turn on simultaneously. In the third part of each cycle, the first and second drivers may be multiplexed to control all green LEDs in light source bank 1002C and light source bank 100D to be turned on simultaneously. In the fourth part of each cycle, the first and second drivers may be multiplexed to control all blue LEDs in light source bank 1002C and light source bank 100D to be turned on simultaneously.

[0189] Figure 19 illustrates the cooling of the light source bank 1002. Figure 19 illustrates that the entire cycle can consume approximately 20 seconds with the corresponding illumination on time drawn as T1, such that time T1 in Figure 18 may include approximately 20% of the time of each cycle. Figure 18 illustrates that during the illumination time of the light source bank 1002, the LEDs may be able to cool from their maximum temperature. Figure 19 illustrates that during the first few cycles, the maximum temperature of the set of LEDs may be relatively low, and then after a few cycles, the maximum LED temperature may rise to a new maximum value. For example, as shown in Figure 19, the initial maximum LED temperature may be approximately 83°C, while after cycle 4, the maximum LED temperature may rise to approximately 90°C. Then, as shown in Figure 19, after cycle 4, the maximum LED temperature may remain relatively constant for each consecutive cycle, and the LED temperature drops significantly in the middle of the illumination on time.

[0190] Referring to the timing diagram and control signals 2202 and 2212 in Figure 18, it can be seen that the off-time of the LEDs in the first narrowband wavelength (green light in Figure 18) light source bank 1002 set can begin at the same time as the on-time of the LEDs in the second narrowband wavelength (blue light in Figure 18) light source bank 1002 set begins. In one example, control signals 2202 and 2212 may be configured to establish the on-time ordering between the first and second narrowband wavelength LEDs in a manner that depends on which LED (the LED of the first or alternatively the LED of the second) generates lower total heat as a result of being energized. In one example, the method may include identifying which of the first or second set of narrowband LEDs (e.g., green or blue) in the light source bank 1002 generates the lowest total heat as a result of being energized over a period of time specified in Figure 18; selecting the determined lowest total heat-generating set of narrowband LEDs as the LEDs for initial energization; and controlling the energization order between the first and second sets of narrowband LEDs so that the determined lower total heat-generating set of narrowband LEDs is energized before the remaining sets of the first or second set of narrowband LEDs. The LED control may be performed so that the off-time of the selected first energized set of narrowband LEDs (e.g., blue or green) begins at the start of the on-time of the secondarily energized set of narrowband LEDs. The examples herein recognize that, in ordering the sets of LEDs, energizing the set of narrowband LEDs that generates lower total heat first can improve overall heat removal from the printed circuit board 1020 supporting the light source bank 1002. Due to improved heat dissipation, the LEDs in light source bank 1002 can be driven with a higher current for improved irradiance of the detector surface.Determining which of the first or second set of narrowband LEDs generates lower total heat may include: checking the data output from one or more temperature sensors disposed on the printed circuit board according to the printed circuit board 1020 when the first set of narrowband LEDs (e.g., green or blue) is driven independently; and checking the data output from temperature sensors disposed on a test printed circuit board according to the printed circuit board 1020 when the remaining second set of narrowband LEDs (e.g., green or blue) is driven independently. The printed circuit board according to the printed circuit board 1020 on which one or more temperature sensors may be disposed may be provided, for example, by a physical laboratory board designed according to the printed circuit board 1020, a simulated circuit board, or the actual printed circuit board 1020.

[0191] This specification describes a method with reference to Figure 20, the method comprising emitting excitation light 101 (e.g., Figure 1A) in block 1910 using a photoenergy excitation device 10, the photoenergy excitation device comprising a first set of light sources and a second set of light sources (e.g., Figure 4), the first set of light sources emitting excitation rays in a first wavelength emission band, and the second set of light sources emitting excitation rays in a second wavelength emission band, and in block 1920 using a detector 200 to detect the excitation light 101 and the emission resulting from excitation by the excitation light 10 The method includes receiving Gunal light 501, wherein the detector 200 comprises a detector surface 206 for supporting a biological or chemical sample 502 and a sensor array 201 separated from the detector surface 206, the detector 200 blocking excitation light 101 and allowing emission signal light 501 to propagate toward the photosensors 202 of the sensor array 201, and transmitting a detector data signal using a circuit (e.g., Figure 14) in response to a photon detected by the photosensors 202 of the sensor array 201 in block 1930. The method may also be performed, which includes determining which of a first set of light sources or a second set of light sources generates less total heat when energized, and, in accordance with the determination, selecting an order for energizing the first set of light sources and the second set of light sources. The method may also be performed, wherein a first set of light sources and a second set of light sources are supported by a printed circuit board, and the method includes inspecting thermal data of the printed circuit board and selecting an order for energizing the first set of light sources and the second set of light sources in accordance with the inspection. Inspecting thermal data of the printed circuit board may include inspecting the thermal attributes of the printed circuit board 1020 or the printed circuit board as described herein by the printed circuit board 1020. The method may also be performed, which includes energizing the first set of light sources and the second set of light sources in order such that the set of light sources that generates less total heat when energized is energized first in the order.

[0192] A small sample of the combinations described herein includes A1 below: A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes and directs excitation rays from one of the plurality of light sources and has an incident light surface for receiving excitation rays from the light sources; a second optical pipe that homogenizes and directs excitation rays from a second of the plurality of light sources and has an incident light surface for receiving excitation rays from the second light source; a detector comprising: a detector surface for supporting a biological or chemical sample; a sensor array comprising a photosensor separated from the detector surface and the detector receiving excitation light and emission signal light from the light energy excitation device; and a mounting assembly for mounting the optical pipe and the second optical pipe, aligning the optical pipe with the light source and aligning the second optical pipe with the second light source. A2. The system according to A1, wherein the mounting assembly comprises a support structure having a member defining a cavity and an optical pipe mount to which an optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity. A3. The system according to A1, wherein the mounting assembly comprises a support structure having a member defining a cavity and an optical pipe mount to which an optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity without contacting the support structure. A4. The system according to any one of A1 to A3, wherein the mounting assembly mounts an optical pipe such that the optical incident surface of the optical pipe is separated from the light source, and the mounting assembly mounts a second optical pipe such that the optical incident surface of the second optical pipe is separated from the second light source. A5. The system according to any one of A1 to A4, wherein the mounting assembly mounts an optical pipe such that the outer boundary of the optical pipe is provided by air, and the mounting assembly is attached to the optical pipe with an adhesive having a refractive index matching the refractive index of air. A6. The mounting assembly is a system described in any one of A1 to A5, which mounts the optical pipe such that the outer boundary of the optical pipe is provided by air.A7. The system according to any one of A1 to A6, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe. A8. The system according to any one of A1 to A6, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe. A9. The system according to any one of A1 to A3, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe, and the single contact position includes an adhesive that matches the refractive index of air. A10. The system according to any one of A1 to A9, wherein the mounting assembly includes a support structure extending forward from a light source and a second light source; an optical pipe mount for carrying an optical pipe, which is detachably mounted to the support structure; and a second optical pipe mount for carrying a second optical pipe, which is detachably mounted to the support structure. A11. The system according to any one of A1 to A10, wherein the detector comprises a circuit that transmits a data signal in response to a photon detected by a photosensor in a sensor array, and the detector blocks excitation light, allowing emitted signal light to propagate toward the photosensor. A12. The system according to any one of A1 to A11, wherein the optical energy excitation device comprises a lens that focuses an object plane defined by the light emission surface of an optical pipe onto an image plane defined by the detector surface. A13. The system according to any one of A1 to A12, wherein the multiple light sources comprise light-emitting diodes surface-coupled to the light incident surface of an optical pipe, the optical pipe comprises glass, the optical pipe has a tapered structure, and includes a diameter that increases along the entire length of the optical pipe in the direction from the light incident surface to the light exit surface of the optical pipe, the optical pipe reflects excitation light such that the optical pipe exit ray emitted from the light exit surface of the optical pipe defines a diverging cone of light that diverges with respect to the optical axis of the optical energy exciter, the optical energy exciter comprises a lens, the lens receives excitation light from the optical pipe and shapes the excitation ray such that the optical pipe exit ray emitted from the lens defines a converging cone of light that converges with respect to the optical axis of the optical energy exciter, and the optical energy exciter comprises one or more filters that filter out light at wavelengths longer than the cumulative emission band of the wavelengths of the multiple light sources.B1. A light energy excitation device comprising a light source bank that emits excitation rays, and an optical pipe that homogenizes the excitation rays and directs the excitation rays toward the distal end of the light energy excitation device, wherein the optical pipe has an incident light surface and an outgoing light surface, and the optical pipe receives excitation rays from the light source bank. B2. The light energy excitation device according to B1, wherein the light source bank comprises parallel-connected light sources. B3. The light energy excitation device according to B1, wherein the light source bank comprises series-connected light sources. B4. The light energy excitation device according to B1, wherein the light source bank comprises parallel-connected light sources provided by vertical LEDs. B5. The light energy excitation device according to B1, wherein the light source bank comprises series-connected light sources provided by flip-chip LEDs. B6. The light energy excitation device according to B1, wherein the light source bank comprises parallel-connected light sources, and the anodes of the light sources defining the light source bank are commonly connected to a metal core layer of a printed circuit board. B7. The photoenergy excitation device according to B1, wherein the light source bank comprises parallel-connected vertical LEDs, and the anodes of the vertical LEDs defining the light source bank are commonly connected to the metal core layer of a printed circuit board. B8. The photoenergy excitation device according to B1 or B2, wherein the light sources defining the light source bank are commonly connected to the metal core layer of a printed circuit board. B9. The photoenergy excitation device according to B1, wherein the light source bank comprises parallel-connected light sources, and the parallel-connected light sources are provided by flip-chip LEDs. B10. The photoenergy excitation device according to B1, wherein the light source bank comprises series-connected light sources, and the series-connected light sources are provided by vertical LEDs. B11. The photoenergy excitation device according to any one of claims B1 to B3, wherein the light source bank comprises vertical LEDs. B12. The photoenergy excitation device according to any one of claims B1 to B3, wherein the light source bank comprises flip-chip LEDs. B13. The photoenergy excitation device according to any one of B1 to B3, wherein the light source bank comprises flip-chip LEDs arranged in an array having equally spaced rows and columns of flip-chip LEDs.B14. The light energy excitation device according to B1, wherein the light source bank comprises series-connected LEDs, the series-connected LEDs are mounted on a printed circuit board, and the printed circuit board has a ceramic insulator. B15. The light energy excitation device according to B1, wherein the light source bank comprises series-connected LEDs, the series-connected LEDs are mounted on a printed circuit board, and the printed circuit board has a ceramic insulator provided by the LEDs. B16. The light energy excitation device according to any one of B1 to B15, wherein when the distal end of the light energy excitation device is coupled to a detector assembly, the light energy excitation device comprises a lens that images an object plane defined by the light emission surface onto an image plane defined by the detector surface of the detector. C1. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes the excitation rays from one of the plurality of light sources and directs the excitation rays from the light sources, and having an incident light surface for receiving the excitation rays from the light sources; a second optical pipe that homogenizes the excitation rays from a second light source among the plurality of light sources and directs the excitation rays from the second light source, and having an incident light surface for receiving the excitation rays from the second light source; a third optical pipe that homogenizes the excitation rays from a third light source among the plurality of light sources and directs the excitation rays from the second light source, and having an incident light surface for receiving the excitation rays from the third light source; and a third optical pipe that homogenizes the excitation rays from a third light source among the plurality of light sources and directs the excitation rays from the second light source. A light energy excitation device comprising: a fourth optical pipe that homogenizes the excitation rays from a fourth light source and directs the excitation rays from a fourth light source, and the fourth optical pipe having an incident light surface for receiving the excitation rays from the fourth light source; a lens that receives excitation rays from the optical pipe and the second optical pipe and images the light output surfaces of the optical pipe and the second optical pipe onto the detector surface of the detector and the second detector surface of the second detector, respectively; and a lens that receives excitation rays from the third optical pipe and the fourth optical pipe and images the light output surfaces of the third optical pipe and the fourth optical pipe onto the third detector surface of the third detector and the fourth detector surface of the fourth detector, respectively.C2. The system according to C1, wherein a light source is arranged in a light source bank, a second light source is arranged in a second light source bank, a third light source is arranged in a third light source bank, and a fourth light source is arranged in a fourth light source bank. D1. A method comprising: emitting excitation light using a photoenergy excitation device, the photoenergy excitation device comprising a set of light sources and a second set of light sources, the set of light sources emitting excitation rays in a first wavelength emission band and the second set of light sources emitting excitation rays in a second wavelength emission band; receiving excitation light and emission signal light resulting from excitation using a detector, the detector comprising a detector surface for supporting a biological or chemical sample and a sensor array separated from the detector surface, the detector blocking the excitation light and allowing emission signal light to propagate toward the photosensors of the sensor array; and transmitting a data signal using a circuit of the detector in response to photons detected by the photosensors of the sensor array. D2. The method according to D1, wherein the method comprises determining which of the set of light sources or the second set of light sources generates less total heat when energized, and selecting an order for energizing the set of light sources and the second set of light sources in accordance with the determination. D3. The method according to D1 or D2, wherein the set of light sources and the second set of light sources are supported by a printed circuit board, and the method comprises inspecting thermal data of the printed circuit board and selecting an order for energizing the set of light sources and the second set of light sources in accordance with the inspection. D4. The method according to any one of D1 to D3, wherein the method comprises energizing the set of light sources and the second set of light sources in accordance with an order such that the set of light sources that generates less total heat when energized is energized first in the order.E1. A light energy excitation device comprising: an optical pipe that homogenizes and directs excitation rays from a light source bank, and has an incident light surface for receiving excitation rays from a light source bank; a second optical pipe that homogenizes and directs excitation rays from a second light source bank, and has an incident light surface for receiving excitation rays from a second light source bank; and a detector comprising: a detector surface for supporting a biological or chemical sample; and a sensor array comprising a photosensor separated from the detector surface, wherein the detector receives excitation light and emission signal light from the light energy excitation device. E2. The system according to E1, wherein the light source bank is mounted on a region of a printed circuit board, and the second light source bank is mounted on a second region of the printed circuit board, and the second region is separated from the region. E3. A light source bank is mounted in a region of the printed circuit board, and a second light source bank is mounted in a second region of the printed circuit board, and the second region is separated from the region, and the thermal resistance between each of the light source bank and the second light source bank and the heat sink is... E1. The system according to E1, wherein the thermal resistance between the light source bank and the second light source bank is smaller than the thermal resistance between the light source bank and the second light source bank. E4. The system according to E1, wherein the light source bank is mounted on a region of a printed circuit board, the second light source bank is mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a metal wiring layer to be removed. E5. The system according to any one of E1 to E4, wherein the emitted rays from the optical pipe and the second optical pipe are commonly received by a lens that shapes the emitted rays to project an optical pattern and a second optical pattern onto a camera integrated circuit having a detector and a second detector, the optical pattern is projected by the lens onto the detector surface of the detector, and the second optical pattern is projected by the lens onto the second detector surface of the second detector.F1. A light energy excitation device comprising: an optical pipe that homogenizes and directs excitation rays from a light source bank, and has an incident light surface for receiving excitation rays from a light source bank; and a second optical pipe that homogenizes and directs excitation rays from a second light source bank, and has an incident light surface for receiving excitation rays from a second light source bank, wherein the light source bank is mounted on a region of a printed circuit board, the second light source bank is mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are characterized by one or more layers of the printed circuit board to be removed. A system comprising: a photoenergy excitation device which is a surface-modified region of a printed circuit board having a surface modification; a detector surface for supporting a biological or chemical sample; and a detector sensor array comprising a photosensor separated from the detector surface, wherein the detector receives excitation light and emission signal light from the photoenergy excitation device, and the emitted rays of an optical pipe and a second optical pipe are commonly received by a lens that shapes the emitted rays so as to project an optical pattern and a second optical pattern onto a camera integrated circuit having the detector and the second detector, the optical pattern being projected by the lens onto the detector surface of the detector and the second optical pattern being projected by the lens onto the second detector surface of the second detector. G1. A mounting assembly comprising: an optical pipe mounter for mounting an optical pipe to a light source; and a second optical pipe mounter for mounting a second optical pipe to a second light source. G2. The mounting assembly according to G1, wherein the mounting assembly is configured to facilitate mounting of a second optical pipe independently of mounting of an optical pipe. G3. The mounting assembly according to G1 or G2, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe. G4. The mounting assembly according to G1 or G2, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe.G5. A mounting assembly according to any one of G1 to G4, wherein the mounting assembly includes a support structure, an optical pipe mount is mounted on the support structure, and a second optical pipe mount is mounted on the support structure. G6. A mounting assembly according to any one of G1 to G4, wherein the mounting assembly includes a support structure, an optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and a second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe. G7. A mounting assembly according to any one of G1 to G4, wherein the mounting assembly includes a support structure, an optical pipe mount contacts the optical pipe on a first side of the optical pipe, and a second optical pipe mount contacts the second optical pipe on a second side of the second optical pipe opposite to its first side. G8. A mounting assembly according to any one of G1 to G4, wherein the mounting assembly includes a support structure, an optical pipe mount is removably mounted to the support structure, and a second optical pipe mount is removably mounted to the support structure. G9. A mounting assembly according to any one of G1 to G4, wherein the mounting assembly includes a support structure, an optical pipe mount is removably screw-mounted to the support structure, and a second optical pipe mount is removably screw-mounted to the support structure. G10. A mounting assembly according to any one of G1 to G4, wherein the mounting assembly includes a support structure, an optical pipe mount is mounted to a support structure having a cavity, and a second optical pipe mount is mounted to the support structure, and the mounting assembly is configured such that when the optical pipe mount is mounted to the support structure, the optical pipe extends through the cavity. G11. A mounting assembly according to any one of G1 to G4, wherein the mounting assembly includes a support structure, an optical pipe mount is mounted on the support structure having a cavity, a second optical pipe mount is mounted on the support structure, and the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, and the cavity has a diameter greater than the diameter of the optical pipe such that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity.G12. A mounting assembly according to any one of G1 to G11, wherein a light source is disposed in a light source bank, and a second light source is disposed in a second light source bank separated from the light source bank. G13. A mounting assembly according to any one of G1 to G11, wherein when an optical pipe mount is mounted to a light source, a standoff distance exists between the optical pipe and the light source, and further, when a second optical pipe mount is mounted to a second light source, a defined standoff distance exists between the second optical pipe and the second light source. G14. A mounting assembly according to any one of G1 to G13, wherein a light source is mounted in a region of a printed circuit board, and a second light source is mounted in a second region of the printed circuit board, and the second region is separated from the region. G15. A mounting assembly according to any one of G1 to G13, wherein a light source is mounted in a region of a printed circuit board, a second light source is mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed. G16. A mounting assembly according to any one of G1 to G13, wherein a light source is included in a light source bank mounted in a region of a printed circuit board, a second light source is included in a second light source bank mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a conductive metal wiring layer to be removed. H1. A mounting assembly comprising a structural member for supporting an optical pipe and a second structural member for supporting a second optical pipe. H2. The mounting assembly according to H1, wherein the structural member and the second structural member are separate discontinuous material pieces. H3. The mounting assembly according to H1 or H2, wherein the mounting assembly is configured to facilitate the mounting of a second optical pipe independently of the mounting of the optical pipe. H4. The mounting assembly according to any one of H1 to H3, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe.H5. A mounting assembly according to any one of H1 to H3, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe. H6. A mounting assembly according to any one of H1 to H5, wherein the mounting assembly is configured such that a standoff distance exists between the optical pipe and the light source when the optical pipe mount is mounted to the light source, and further, when the second optical pipe mount is mounted to the second light source, a defined standoff distance exists between the second optical pipe and the second light source. H7. A mounting assembly according to any one of H1 to H6, wherein the optical pipe is aligned to the light source, and the second optical pipe is aligned to the second light source. H8. A mounting assembly according to any one of H1 to H6, wherein the optical pipe is aligned to the light source of the light source bank, and the second optical pipe is aligned to the second light source of the second light source bank. H9. A mounting assembly according to any one of H1 to H8, wherein an optical pipe is aligned with a light source mounted on a region of a printed circuit board, and a second optical pipe is aligned with a second light source mounted on a second region of the printed circuit board, the second region being separated from the region, and the second region and the region being a surface-modified region of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed. I1. A mounting assembly comprising an optical pipe mounter for mounting an optical pipe to a light source and a second optical pipe mounter for mounting a second optical pipe to a second light source. I2. The mounting assembly according to I1, wherein the mounting assembly is configured to facilitate the mounting of a second optical pipe independently of the mounting of an optical pipe. I3. The mounting assembly according to I1 or I2, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe. I4. The mounting assembly according to I1 or I2, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe. I5. The mounting assembly according to I1 or I2, wherein the mounting assembly includes a support structure, an optical pipe mount is mounted on the support structure, and a second optical pipe mount is mounted on the support structure.I6. The mounting assembly according to I1, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, and the second optical pipe mount is mounted on the support structure. I7. The mounting assembly according to any one of I1 to I4, wherein the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe. I8. The mounting assembly according to I1, wherein the mounting assembly is configured to facilitate the mounting of a second optical pipe independently of the mounting of an optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe. I9. The mounting assembly according to any one of I1 to I8, wherein the optical pipe mount contacts the optical pipe on a first side of the optical pipe, and the second optical pipe mount contacts the second optical pipe on a second side of the second optical pipe opposite to its first side. I10. A mounting assembly according to any one of I5 to I8, wherein an optical pipe mount is removably mounted to a support structure, and a second optical pipe mount is removably mounted to a support structure. I11. A mounting assembly according to I10, wherein an optical pipe mount is removably screw-mounted to a support structure, and a second optical pipe mount is removably screw-mounted to a support structure. I12. A mounting assembly that contacts an optical pipe at a single contact point of the optical pipe, and the mounting assembly includes a support structure, wherein an optical pipe mount is removably screw-mounted to the support structure, and a second optical pipe mount is removably screw-mounted to the support structure, and the mounting assembly includes a support structure. Mounting assembly of I11, wherein an optical pipe mount is removably screwed to a support structure below a horizontal axis extending through the optical pipe and a second optical pipe, and a second optical pipe mount is removably screwed to a support structure above a horizontal axis extending through the optical pipe and a second optical pipe. I13. Mounting assembly according to any one of I1 to I12, wherein the mounting assembly includes a support structure having a cavity, an optical pipe mount is mounted to the support structure having the cavity, and a second optical pipe mount is mounted to the support structure, and the mounting assembly is configured such that when the optical pipe mount is mounted to the support structure, the optical pipe extends through the cavity. I14. Mounting assembly according to I13, wherein the cavity has a diameter greater than the diameter of the optical pipe such that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity. I15. The mounting assembly according to I1, wherein the mounting assembly includes a support structure having a cavity, an optical pipe mount is mounted on the support structure having a cavity, a second optical pipe mount is mounted on the support structure, the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, and the cavity has a diameter greater than the diameter of the optical pipe such that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity. I16. The mounting assembly according to any one of I1 to I15, wherein a light source is disposed in a light source bank, and a second light source is disposed in a second light source bank separated from the light source bank. I17. A mounting assembly according to I1, wherein a light source is disposed in a light source bank, and a second light source is disposed in a second light source bank separated from the light source bank, and the light source bank is characterized by one or more selected from the group consisting of: the light source banks comprising light sources connected in parallel; the light source banks comprising light sources connected in series; the light sources defining the light source banks being commonly connected to the metal core layer of the printed circuit board; the light source bank comprising vertical LEDs; and the light source bank comprising flip-chip LEDs. I18. A mounting assembly,A mounting assembly according to any one of I1 to I17, wherein when an optical pipe mount is mounted to a light source, a standoff distance exists between the optical pipe and the light source, and further, when a second optical pipe mount is mounted to a second light source, a defined standoff distance exists between the second optical pipe and the second light source. I19. The mounting assembly is configured to facilitate the mounting of a second optical pipe independently of the mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure, the second optical pipe mount is removably screwed to the support structure, and the mounting assembly is The mounting assembly according to I1, comprising a support structure having a cavity, wherein an optical pipe mount is mounted on the support structure having the cavity, and a second optical pipe mount is mounted on the support structure, and the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, and the cavity has a diameter larger than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity, and the mounting assembly is configured such that when the optical pipe mount is mounted on the light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted on the second light source, a defined standoff distance exists between the second optical pipe and the second light source. I20. A light source is mounted on a region of a printed circuit board, and a second light source is mounted on a second region of the printed circuit board, and the second region is separated from the region,A mounting assembly according to any one of I1 to I19. I21. The mounting assembly according to I21, wherein the second region and region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed. I22. The mounting assembly according to any one of I1 to I21, wherein a light source is included in a light source bank mounted on a region of the printed circuit board, and a second light source is included in a second light source bank mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a conductive metal wiring layer to be removed. I23. The mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure, the second optical pipe mount is removably screwed to the support structure, the mounting assembly includes a support structure having a cavity, and the optical pipe A first optical pipe mount is mounted on a support structure having a cavity, and a second optical pipe mount is mounted on the support structure, and the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, and the cavity has a diameter larger than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity, and the mounting assembly is configured such that when the optical pipe mount is mounted on a light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted on a second light source, a defined standoff distance exists between the second optical pipe and the second light source, and the light source is,The mounting assembly according to I1, wherein the mounting assembly comprises a light source bank mounted on a region of a printed circuit board, the second light source comprising a second light source bank mounted on a second region of the printed circuit board, the second region being separated from the region, and the second region and the region being a surface-modified region of the printed circuit board having surface modifications characterized by an insulating layer and a conductive metal wiring layer to be removed, and the light source bank is characterized by one or more selected from the group consisting of: the light source bank comprising light sources connected in parallel, the light source bank comprising light sources connected in series, the light sources defining the light source bank being commonly connected to a metal core layer of the printed circuit board, the light source bank comprising vertical LEDs, and the light source bank comprising flip-chip LEDs. I24. The mounting assembly according to I1, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe, and the single contact position comprises an adhesive matching the refractive index of air. J1. A mounting assembly comprising: an optical pipe mount for mounting an optical pipe to a light source; and a second optical pipe mount for mounting a second optical pipe to a second light source, wherein the mounting assembly includes a support structure having a cavity, the optical pipe mount is mounted on the support structure having the cavity, and the second optical pipe mount is mounted on the support structure, and the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, and the cavity has a diameter greater than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity. K1. A mounting assembly comprising an optical pipe mount for mounting an optical pipe to a light source, and a second optical pipe mount for mounting a second optical pipe to a second light source, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and the second optical pipe mount isMounted on a support structure above a horizontal axis extending through an optical pipe and a second optical pipe, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure, the second optical pipe mount is removably screwed to the support structure, the mounting assembly includes a support structure having a cavity, the optical pipe mount is mounted on the support structure having the cavity, the second optical pipe mount is mounted on the support structure, the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, the cavity has a diameter larger than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity, the mounting assembly is configured such that when the optical pipe mount is mounted on a light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted on a second light source, a defined standoff distance exists between the second optical pipe and the second light source. K2. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes and directs excitation rays from one of the plurality of light sources, and has an incident light surface for receiving excitation rays from the light sources; a second optical pipe that homogenizes and directs excitation rays from a second light source, and has an incident light surface for receiving excitation rays from the second light source; a detector comprising: a detector surface for supporting a biological or chemical sample; a sensor array comprising a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from the light energy excitation device; and a mounting assembly for mounting the optical pipe and the second optical pipe according to K1, which aligns the optical pipe with the light source and aligns the second optical pipe with the second light source. L1. A mounting assembly comprising an optical pipe mounting device for mounting an optical pipe to a light source, and a second optical pipe mounting device for mounting a second optical pipe to a second light source, wherein the mounting assemblyThe mounting assembly is configured to facilitate the mounting of a second optical pipe independently of the mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, and the optical pipe mount extends through the optical pipe and the second optical pipe below the support structure along a horizontal axis. The mounting assembly includes a support structure, the The mounting assembly is configured such that when an optical pipe mount is mounted to a light source, a standoff distance exists between the optical pipe and the light source, and further, when a second optical pipe mount is mounted to a second light source, a defined standoff distance exists between the second optical pipe and the second light source, wherein the light source is included in a light source bank mounted in a region of a printed circuit board, the second light source is included in a second light source bank mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a conductive metal wiring layer to be removed, and the mounting assembly contacts the optical pipe at a single contact position of the optical pipe, the single contact position includes an adhesive that matches the refractive index of air. M1. A mounting assembly comprising a structural member for supporting an optical pipe and a second structural member for supporting a second optical pipe. M2. The mounting assembly according to M1, wherein the structural member and the second structural member are separate discontinuous material pieces. M3. The mounting assembly according to M1 or M2, wherein the mounting assembly is configured to facilitate the mounting of a second optical pipe independently of the mounting of the optical pipe. M4. The mounting assembly according to any one of M1 to M3, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe.M5. A mounting assembly according to any one of M1 to M4, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe. M6. A mounting assembly according to M1, wherein the structural member and the second structural member are separate discontinuous material pieces, and the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe, and the mounting assembly contacts the optical pipe at a single contact point of the optical pipe. M7. A mounting assembly according to any one of M1 to M6, wherein the mounting assembly is configured such that a standoff distance exists between the optical pipe and the light source when the optical pipe mount is mounted to the light source, and further, a defined standoff distance exists between the second optical pipe and the second light source when the second optical pipe mount is mounted to the second light source. M8. A mounting assembly according to any one of M1 to M7, wherein the optical pipe is aligned to the light source, and the second optical pipe is aligned to the second light source. M9. A mounting assembly according to any one of M1 to M8, wherein an optical pipe is aligned to a light source in a light source bank, and a second optical pipe is aligned to a second light source in a second light source bank. M10. A mounting assembly according to any one of M1 to M9, wherein an optical pipe is aligned to a light source mounted in a region of a printed circuit board, and a second optical pipe is aligned to a second light source mounted in a second region of a printed circuit board, the second region being separated from the region, and the second region and the region being a surface-modified region of a printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed.M11. The mounting assembly according to M1, wherein the structural member and the second structural member are separate discontinuous material pieces, the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly is configured such that a standoff distance exists between the optical pipe and the light source when the optical pipe mount is mounted to the light source, and further, when the second optical pipe mount is mounted to the second light source, a defined standoff distance exists between the second optical pipe and the second light source, the optical pipe is aligned with the light source mounted on a region of the printed circuit board, the second optical pipe is aligned with the second light source mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed. M12. The mounting assembly according to M1, wherein the mounting assembly contacts the optical pipe at a single contact position on the optical pipe, and the single contact position contains an adhesive that matches the refractive index of air. N1. A mounting assembly comprising a structural member for supporting an optical pipe and a second structural member for supporting a second optical pipe, wherein the structural member and the second structural member are separate discontinuous material pieces, the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly is configured such that a standoff distance exists between the optical pipe and the light source when the optical pipe mount is mounted to the light source, and further, a defined standoff distance exists between the second optical pipe and the second light source when the second optical pipe mount is mounted to the second light source, the optical pipe is aligned with the light source mounted on a region of a printed circuit board, the second optical pipe is aligned with the second light source mounted on a second region of a printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of a printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed.O1. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes and directs excitation rays from one of the plurality of light sources, and has an incident light surface for receiving excitation rays from the light sources; a second optical pipe that homogenizes and directs excitation rays from a second light source, and has an incident light surface for receiving excitation rays from the second light source; a detector comprising: a detector surface for supporting a biological or chemical sample; a sensor array comprising a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from the light energy excitation device; and a mounting assembly for mounting the optical pipe and the second optical pipe, which aligns the optical pipe with the light source and aligns the second optical pipe with the second light source. O2. The system according to O1, wherein the mounting assembly comprises a support structure having a member defining a cavity and an optical pipe mount to which an optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity. O3. The system according to O1, wherein the mounting assembly comprises a support structure having a member defining a cavity and an optical pipe mount to which an optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity without contacting the support structure. O4. The system according to any one of O1 to O3, wherein the mounting assembly mounts an optical pipe such that the optical incident surface of the optical pipe is separated from the light source, and the mounting assembly mounts a second optical pipe such that the optical incident surface of the second optical pipe is separated from the second light source. O5. The system according to any one of O1 to O4, wherein the mounting assembly mounts an optical pipe such that the outer boundary of the optical pipe is provided by air, and the mounting assembly is attached to the optical pipe with an adhesive having a refractive index matching the refractive index of air. O6. The mounting assembly mounts the optical pipe such that the outer boundary of the optical pipe is provided by air, and the mounting assembly is attached to the optical pipe with an adhesive having a refractive index that matches the refractive index of air, according to the system described in O1.O7. The system according to any one of O1 to O6, wherein the mounting assembly mounts the optical pipe such that the outer boundary of the optical pipe is provided by air. O8. The system according to any one of O1 to O7, wherein the mounting assembly contacts the optical pipe on a single side of the optical pipe. O9. The system according to any one of O1 to O8, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe. O10. The system according to any one of O1 to O9, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe, and the single contact position includes an adhesive that matches the refractive index of air. O11. The system according to any one of O1 to O10, wherein the mounting assembly includes a support structure extending forward from a light source and a second light source, an optical pipe mount for carrying an optical pipe, which is detachably mounted to the support structure, and a second optical pipe mount for carrying a second optical pipe, which is detachably mounted to the support structure. O12. The mounting assembly includes a support structure having a member defining a cavity, and an optical pipe mount to which an optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity without contacting the support structure, the mounting assembly mounting the optical pipe such that the outer boundary of the optical pipe is provided by air, the mounting assembly being attached to the optical pipe with an adhesive having a refractive index matching the refractive index of air, the mounting assembly includes a support structure extending forward from a light source and a second light source, and an optical pipe mount carrying an optical pipe, which is detachably attached to the support structure The system according to O1, comprising: an optical pipe mount; a second optical pipe mount for carrying a second optical pipe, which is detachably mounted to a support structure, wherein the mount assembly mounts the optical pipe such that the optical incident surface of the optical pipe is separated from the light source; the mount assembly mounts the second optical pipe such that the optical incident surface of the second optical pipe is separated from the second light source; and the system operates to determine which of the set of light sources or the second set of light sources generates less total heat when energized, and in accordance with the determination, select an order for energizing the set of light sources and the second set of light sources.O13. The system according to any one of O1 to O12, wherein the detector comprises a circuit that transmits a data signal in response to photons detected by the optical sensors of the sensor array, and the detector blocks excitation light, allowing emitted signal light to propagate toward the optical sensors. O14. The system according to any one of O1 to O13, wherein the optical energy excitation device comprises a lens that focuses an object plane defined by the light emission surface of an optical pipe onto an image plane defined by the detector surface. O15. Multiple light sources are provided, each comprising light-emitting diodes surface-coupled to the light-incident surface of an optical pipe, the optical pipe comprising glass, the optical pipe having a tapered structure, and including a diameter that increases along the entire length of the optical pipe in the direction from the light-incident surface to the light-exit surface of the optical pipe, the optical pipe reflecting the excitation light such that the light rays emitted from the light-exit surface of the optical pipe define a diverging cone of light that diverges with respect to the optical axis of the optical energy excitation device, the optical energy excitation device comprising a lens, the lens receiving the excitation light from the optical pipe and shaping the excitation light rays such that the light rays emitted from the lens define a converging cone of light that converges with respect to the optical axis of the optical energy excitation device, and the optical energy excitation device. The system according to any one of O1 to O14, wherein the energy excitation device comprises one or more filters that filter out light at wavelengths longer than the cumulative emission band of the wavelengths of the multiple light sources. O16. The system according to O1, wherein the system determines which of the set of light sources or the second set of light sources generates less total heat when energized, and in accordance with the determination, selects an order for energizing the set of light sources and the second set of light sources.P1. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes and directs excitation rays from one of the plurality of light sources, and has an incident light surface for receiving excitation rays from the light sources; a second optical pipe that homogenizes and directs excitation rays from a second light source, and has an incident light surface for receiving excitation rays from the second light source; a detector comprising a detector surface for supporting a biological or chemical sample; a sensor array comprising a photosensor separated from the detector surface, wherein the detector receives excitation light and emission signal light from the light energy excitation device; a mounting assembly for mounting the optical pipe and the second optical pipe, wherein the mounting assembly aligns the optical pipe with the light source and the second optical pipe with the second light source; and the mounting assembly comprises a support structure having a member for defining a cavity; and an optical pipe mount to which the optical pipe is attached. A system comprising: an optical pipe mount attached to a support structure such that the optical pipe extends through a cavity without contacting the support structure, the mount assembly mounts the optical pipe such that the outer boundary of the optical pipe is provided by air, the mount assembly is attached to the optical pipe with an adhesive having a refractive index matching the refractive index of air, the mount assembly comprises a support structure extending forward from a light source and a second light source, an optical pipe mount carrying an optical pipe which is detachably attached to the support structure, and a second optical pipe mount carrying a second optical pipe which is detachably attached to the support structure, the mount assembly mounts the optical pipe such that the light incident surface of the optical pipe is separated from the light source, the mount assembly mounts the second optical pipe such that the light incident surface of the second optical pipe is separated from the second light source, and the optical energy excitation device comprises a lens that focuses an object plane defined by the light emission surface of the optical pipe onto an image plane defined by the detector surface.Q1. A light energy excitation device comprising a light source bank that emits excitation rays, and an optical pipe that homogenizes the excitation rays and directs the excitation rays toward the distal end of the light energy excitation device, wherein the optical pipe has an incident light surface and an outgoing light surface, and the optical pipe receives excitation rays from the light source bank. Q2. The light energy excitation device according to Q1, wherein the light source bank comprises parallel-connected light sources. Q3. The light energy excitation device according to Q1, wherein the light source bank comprises series-connected light sources. Q4. The light energy excitation device according to Q1, wherein the light source bank comprises parallel-connected light sources provided by vertical LEDs. Q5. The light energy excitation device according to Q1, wherein the light source bank comprises series-connected light sources provided by flip-chip LEDs. Q6. The light energy excitation device according to Q1, wherein the light source bank comprises parallel-connected light sources, and the anodes of the light sources defining the light source bank are commonly connected to a metal core layer of a printed circuit board. Q7. The photoenergy excitation device according to Q1, wherein the light source bank comprises parallel-connected vertical LEDs, and the anodes of the vertical LEDs defining the light source bank are commonly connected to the metal core layer of a printed circuit board. Q8. The photoenergy excitation device according to Q1 or Q2, wherein the light sources defining the light source bank are commonly connected to the metal core layer of a printed circuit board. Q9. The photoenergy excitation device according to Q1, wherein the light source bank comprises parallel-connected light sources, and the parallel-connected light sources are provided by flip-chip LEDs. Q10. The photoenergy excitation device according to Q1, wherein the light source bank comprises series-connected light sources, and the series-connected light sources are provided by vertical LEDs. Q11. The photoenergy excitation device according to any one of claims Q1 to Q3, wherein the light source bank comprises vertical LEDs. Q12. The photoenergy excitation device according to any one of claims Q1 to Q3, wherein the light source bank comprises flip-chip LEDs. Q13. The photoenergy excitation device according to any one of Q1 to Q3, wherein the light source bank comprises flip-chip LEDs arranged in an array having equally spaced rows and columns of flip-chip LEDs.Q14. The light energy excitation device according to Q1, wherein the light source bank comprises series-connected LEDs, the series-connected LEDs are mounted on a printed circuit board, and the printed circuit board has a ceramic insulator. Q15. The light energy excitation device according to Q1, wherein the light source bank comprises series-connected LEDs, the series-connected LEDs are mounted on a printed circuit board, and the printed circuit board has a ceramic insulator provided by the LEDs. Q16. The light energy excitation device according to any one of Q1 to Q15, wherein when the distal end of the light energy excitation device is coupled to a detector assembly, the light energy excitation device comprises a lens that images an object plane defined by the light emission surface onto an image plane defined by the detector surface of the detector. R1. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes the excitation rays from one of the plurality of light sources and directs the excitation rays from the light sources, and having an incident light surface for receiving the excitation rays from the light sources; a second optical pipe that homogenizes the excitation rays from a second light source among the plurality of light sources and directs the excitation rays from the second light source, and having an incident light surface for receiving the excitation rays from the second light source; a third optical pipe that homogenizes the excitation rays from a third light source among the plurality of light sources and directs the excitation rays from the second light source, and having an incident light surface for receiving the excitation rays from the third light source; and a third optical pipe that homogenizes the excitation rays from a third light source among the plurality of light sources and directs the excitation rays from the second light source. A light energy excitation device comprising: a fourth optical pipe that homogenizes the excitation rays from a fourth light source and directs the excitation rays from a fourth light source, and the fourth optical pipe having an incident light surface for receiving the excitation rays from the fourth light source; a lens that receives excitation rays from the optical pipe and the second optical pipe and images the light output surfaces of the optical pipe and the second optical pipe onto the detector surface of the detector and the second detector surface of the second detector, respectively; and a lens that receives excitation rays from the third optical pipe and the fourth optical pipe and images the light output surfaces of the third optical pipe and the fourth optical pipe onto the third detector surface of the third detector and the fourth detector surface of the fourth detector, respectively.R2. The system according to R1, wherein a light source is arranged in a light source bank, a second light source is arranged in a second light source bank, a third light source is arranged in a third light source bank, and a fourth light source is arranged in a fourth light source bank. S1. A method comprising: emitting excitation light using a photoenergy excitation device, the photoenergy excitation device comprising a set of light sources and a second set of light sources, the set of light sources emitting excitation rays in a first wavelength emission band and the second set of light sources emitting excitation rays in a second wavelength emission band; receiving excitation light and emission signal light resulting from excitation using a detector, the detector comprising a detector surface for supporting a biological or chemical sample and a sensor array separated from the detector surface, the detector blocking the excitation light and allowing emission signal light to propagate toward the photosensors of the sensor array; and transmitting a data signal using a circuit of the detector in response to photons detected by the photosensors of the sensor array. S2. The method according to S1, wherein the method comprises determining which of the set of light sources or the second set of light sources generates less total heat when energized, and selecting an order for energizing the set of light sources and the second set of light sources according to the determination. S3. The method according to S1 or S2, wherein the set of light sources and the second set of light sources are supported by a printed circuit board, and the method comprises inspecting thermal data of the printed circuit board and selecting an order for energizing the set of light sources and the second set of light sources according to the inspection. S4. The method according to any one of S1 to S3, wherein the method comprises energizing the set of light sources and the second set of light sources according to an order such that the set of light sources that generates less total heat when energized is energized first in the order.T1. A light energy excitation device comprising: an optical pipe that homogenizes and directs excitation rays from a light source bank, and has an incident light surface for receiving excitation rays from a light source bank; a second optical pipe that homogenizes and directs excitation rays from a second light source bank, and has an incident light surface for receiving excitation rays from a second light source bank; and a detector comprising: a detector surface for supporting a biological or chemical sample; and a sensor array comprising a photosensor separated from the detector surface, wherein the detector receives excitation light and emission signal light from the light energy excitation device. T2. The system according to T1, wherein the light source bank is mounted on a region of a printed circuit board, and the second light source bank is mounted on a second region of the printed circuit board, and the second region is separated from the region. T3. The system according to T1, wherein a light source bank is mounted in a region of a printed circuit board, a second light source bank is mounted in a second region of the printed circuit board, the second region is separated from the region, and the thermal resistance between each of the light source bank and the second light source bank and the heat sink is less than the thermal resistance between the light source bank and the second light source bank. T4. The system according to T1, wherein a light source bank is mounted in a region of a printed circuit board, a second light source bank is mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a metal wiring layer to be removed. T5. The system according to any one of T1 to T4, wherein the light rays emitted from the optical pipe and the second optical pipe are commonly received by a lens that shapes the emitted light rays so as to project an optical pattern and a second optical pattern onto a camera integrated circuit having a detector and a second detector, the optical pattern being projected by the lens onto the detector surface of the detector and the second optical pattern being projected by the lens onto the second detector surface of the second detector.U1. A light energy excitation device comprising: an optical pipe for homogenizing and directing excitation rays from a light source bank, having an incident light surface for receiving excitation rays from a light source bank; a second optical pipe for homogenizing and directing excitation rays from a second light source bank, having an incident light surface for receiving excitation rays from a second light source bank; wherein the light source bank is mounted on a region of a printed circuit board, the second light source bank is mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed; and a detector comprising a detector surface for supporting a biological or chemical sample, and a sensor array comprising a photosensor separated from the detector surface, wherein the detector receives excitation from the light energy excitation device. A system comprising: a detector that receives light and emitted signal light, and the emitted rays from an optical pipe and a second optical pipe are commonly received by a lens that shapes the emitted rays so as to project an optical pattern and a second optical pattern onto a camera integrated circuit having a detector and a second detector, the optical pattern being projected onto the detector surface of the detector by the lens, and the second optical pattern being projected onto the second detector surface of the second detector by the lens.

[0193] It should be understood that all combinations of the aforementioned concepts and further concepts, which are described in more detail below (provided that such concepts are not contradictory), are considered to be part of the subject matter disclosed herein. Specifically, all combinations of the subject matter of the claims appearing at the end of this disclosure are conceivable to be part of the subject matter disclosed herein. It should also be understood that terms used expressly herein and that may appear in any disclosure incorporated by reference should be given meanings that most coincide with the specific concepts disclosed herein.

[0194] This written description, using examples, discloses the subject matter and enables any person skilled in the art to practice the subject matter, including by fabricating and using any device or system and by performing any incorporated method. The patentable scope of the subject matter is defined by the claims and may include other examples that a person skilled in the art could conceive. Such other embodiments are intended to be within the claims if they include structural elements that are no different from the literal words of the claims, or if they include equivalent structural elements that differ only slightly from the literal words of the claims.

[0195] It should be understood that the above description is illustrative and not restrictive. For example, the examples (and / or embodiments thereof) described above can be used in combination with one another. In addition, many modifications can be made to adapt specific situations or materials to the teachings of the various examples without departing from their scope. The dimensions and types of materials described herein are intended to define parameters for the various examples, but they are not restrictive and are merely examples. A number of other examples will become apparent to those skilled in the art upon consideration of the above description. Thus, the scope of the various examples should be determined by referring to the appended claims, along with the entire scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as plain English equivalents to “comprising” and “wherein,” respectively. Furthermore, in the following claims, terms such as “first,” “second,” and “third” are used merely as labels and are not intended to impose numerical requirements on those objects. The term “based on” in this specification encompasses relationships where the element is partially based, as well as relationships where the element is fully based. The term “defined” encompasses relationships where the element is partially defined, as well as relationships where the element is fully defined. Furthermore, the following limitation of claims is not written in means-plus-function form, and such limitation of claims is not intended to be interpreted under Section 112(f) of the U.S. Patent Act unless it explicitly uses the phrase “means for,” followed by a description of a function without further structure. It should be understood that not all such purposes or benefits described above can necessarily be achieved according to specific embodiments of the present invention.Therefore, for example, a person skilled in the art will recognize that the systems and techniques described herein can be embodied or implemented in a manner that achieves or optimizes one or a group of advantages taught herein, even if they do not necessarily achieve other purposes or advantages that may be taught or suggested herein.

[0196] The terms “substantially,” “approximately,” “about,” “relatively,” or other similar terms, which may be used throughout this disclosure including the claims, are used to describe and take into account small variations from a standard or parameter, such as those resulting from variations in processing. Such small variations include zero-point variations from the standard or parameter. For example, they may refer to ±10%, such as ±5%, ±2%, ±1%, ±0.5%, ±0.2%, ±0.1%, ±0.05%, etc. When used herein, “substantially,” “approximately,” “about,” “relatively,” or other similar terms may also refer to no variation, i.e., ±0%. Numerical values, and other values ​​enumerated herein, whether expressly stated or essentially derived by the discussions of this disclosure, are intended to be modified by the term “about.” Furthermore, any description of scope herein may encompass all sub-scopes.

[0197] The terms “connect,” “connected,” “contact,” and “coupled” are defined broadly herein to encompass a variety of different arrangement and assembly techniques. These arrangements and techniques include, but are not limited to, (1) directly joining one component to another without any intervening components between them (i.e., the components are in direct physical contact with each other), and (2) connecting one component to another with one or more components between them, provided that one component that is “connected,” “contacted,” or “coupled” to the other component is in some operational communication (e.g., electrical, fluid, physical, optical, etc.) with the other component (despite the presence of one or more additional components between them). It should be understood that some components that are in direct physical contact with each other may or may not be in electrical and / or fluid contact with each other. Furthermore, two electrically connected, electrically coupled, optically connected, optically coupled, fluidically connected, or fluidly coupled components may or may not be in direct physical contact, and one or more other components may be positioned between them.

[0198] Although the subject matter has been described in detail with respect to only a limited number of examples, it should be readily understood that the subject matter is not limited to such disclosed examples. Rather, the subject matter can be modified to incorporate any number of variations, alterations, substitutions, or equivalent arrangements that are not described but are appropriate to the spirit and scope of the subject matter. Additionally, although various examples of the subject matter have been described, it should be understood that the aspects of this disclosure may include only some of the examples described. Furthermore, although some examples have been described as having a certain number of elements, it will be understood that the subject matter can be practiced with fewer or more elements than that certain number. Therefore, the subject matter should not be considered limited by the above description, but only by the appended claims.

Claims

1. A mounting assembly, A light pipe mounting device for attaching a light pipe to a light source, A mounting assembly comprising a second optical pipe mounting device for mounting a second optical pipe to a second light source.

2. The mounting assembly according to claim 1, wherein the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe.

3. The mounting assembly according to claim 1 or 2, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe.

4. The mounting assembly according to claim 1 or 2, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe.

5. The mounting assembly according to claim 1 or 2, wherein the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, and the second optical pipe mount is mounted on the support structure.

6. The mounting assembly according to claim 1, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, and the second optical pipe mount is mounted on the support structure.

7. The mounting assembly according to any one of claims 1 to 4, wherein the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and the second optical pipe mount is mounted on the support structure above the horizontal axis extending through the optical pipe and the second optical pipe.

8. The mounting assembly according to claim 1, wherein the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe.

9. The mounting assembly according to any one of claims 1 to 8, wherein the optical pipe mounting device contacts the optical pipe on a first side of the optical pipe, and the second optical pipe mounting device contacts the second optical pipe on a second side opposite to the first side of the second optical pipe.

10. The mounting assembly according to any one of claims 5 to 8, wherein the optical pipe mounting device is detachably mounted on the support structure, and the second optical pipe mounting device is detachably mounted on the support structure.

11. The mounting assembly according to claim 10, wherein the optical pipe mounting device is removably attached to the support structure by screws, and the second optical pipe mounting device is removably attached to the support structure by screws.

12. The mounting assembly according to claim 11, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure, the second optical pipe mount is removably screwed to the support structure, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and the second optical pipe mount is removably screwed to the support structure above the horizontal axis extending through the optical pipe and the second optical pipe.

13. The mounting assembly according to any one of claims 1 to 12, wherein the mounting assembly includes a support structure having a cavity, the optical pipe mount is mounted on the support structure having the cavity, the second optical pipe mount is mounted on the support structure, and the mounting assembly is configured such that the optical pipe extends through the cavity when the optical pipe mount is mounted on the support structure.

14. The mounting assembly according to claim 13, wherein the cavity has a diameter greater than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side wall defining the cavity.

15. The mounting assembly according to claim 1, wherein the mounting assembly includes a support structure having a cavity, the optical pipe mount is mounted on the support structure having the cavity, the second optical pipe mount is mounted on the support structure, the mounting assembly is configured such that the optical pipe extends through the cavity when the optical pipe mount is mounted on the support structure, and the cavity has a diameter greater than the diameter of the optical pipe such that the optical pipe does not come into contact with the side walls defining the cavity when the optical pipe extends through the cavity.

16. The mounting assembly according to any one of claims 1 to 15, wherein the light source is disposed in a light source bank, and the second light source is disposed in a second light source bank located away from the light source bank.

17. The mounting assembly according to claim 1, wherein the light source is disposed in a light source bank, the second light source is disposed in a second light source bank separated from the light source bank, and the light source bank is characterized by one or more selected from the group consisting of: the light source bank comprising light sources connected in parallel; the light source bank comprising light sources connected in series; the light sources defining the light source bank being commonly connected to the metal core layer of a printed circuit board; the light source bank comprising vertical LEDs; and the light source bank comprising flip-chip LEDs.

18. The mounting assembly according to any one of claims 1 to 17, wherein the mounting assembly is configured such that when the optical pipe mount is mounted to the light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted to the second light source, a defined standoff distance exists between the second optical pipe and the second light source.

19. The mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure, the second optical pipe mount is removably screwed to the support structure, and the mounting assembly is, A mounting assembly according to claim 1, comprising a support structure having a cavity, wherein an optical pipe mount is mounted on the support structure having the cavity, and a second optical pipe mount is mounted on the support structure, the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, the cavity has a diameter greater than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with a side wall defining the cavity, and the mounting assembly is configured such that when the optical pipe mount is mounted on the light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted on the second light source, a defined standoff distance exists between the second optical pipe and the second light source.

20. The mounting assembly according to any one of claims 1 to 19, wherein the light source is mounted in a region of a printed circuit board, the second light source is mounted in a second region of the printed circuit board, and the second region is separated from the region.

21. The mounting assembly according to claim 20, wherein the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed.

22. The mounting assembly according to any one of claims 1 to 21, wherein the light source is included in a light source bank mounted in a region of the printed circuit board, the second light source is included in a second light source bank mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a conductive metal wiring layer to be removed.

23. The mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, and the second optical pipe mount is supported above the horizontal axis extending through the optical pipe and the second optical pipe. The optical pipe mount is mounted on a structure, and the mounting assembly includes a support structure, and the optical pipe mount is removably screwed to the support structure, and the second optical pipe mount is removably screwed to the support structure, and the mounting assembly includes a support structure having a cavity, and the optical pipe mount is mounted on the support structure having the cavity, and the second optical pipe mount is mounted on the support structure, and the mounting assembly is such that when the optical pipe mount is mounted on the support structure, the optical pipe The optical pipe is configured to extend through the cavity, the cavity having a diameter larger than the diameter of the optical pipe so that the optical pipe does not come into contact with the sidewall defining the cavity when the optical pipe extends through the cavity, the mounting assembly is configured such that a standoff distance exists between the optical pipe and the light source when the optical pipe mount is mounted to the light source, and further, a defined standoff distance exists between the second optical pipe and the second light source when the second optical pipe mount is mounted to the second light source, the light source is included in a light source bank mounted in a region of a printed circuit board, the second light source is included in a second light source bank mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a conductive metal wiring layer to be removed, the light source bank comprises light sources connected in parallel, the light source banks are as follows:The mounting assembly according to claim 1, characterized by one or more of the following: the light source bank comprises light sources connected in series; the light sources defining the light source bank are commonly connected to the metal core layer of the printed circuit board; the light source bank comprises vertical LEDs; or the light source bank comprises flip-chip LEDs.

24. The mounting assembly according to claim 1, wherein the mounting assembly contacts the optical pipe at a single contact position on the optical pipe, and the single contact position includes an adhesive that matches the refractive index of air.

25. A mounting assembly, A light pipe mounting device for attaching a light pipe to a light source, A mounting assembly comprising: a second optical pipe mount for mounting a second optical pipe to a second light source, wherein the mounting assembly includes a support structure having a cavity, the optical pipe mount is mounted on the support structure having the cavity, the second optical pipe mount is mounted on the support structure, the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, and the cavity has a diameter greater than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity.

26. A mounting assembly, A light pipe mounting device for attaching a light pipe to a light source, The mounting assembly comprises a second optical pipe mount for mounting a second optical pipe to a second light source, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure, the second optical pipe mount is removably screwed to the support structure, and the mounting assembly is cavity A mounting assembly comprising a support structure having a cavity, wherein the optical pipe mount is mounted on the support structure having the cavity, the second optical pipe mount is mounted on the support structure, the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, the cavity has a diameter greater than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity, and the mounting assembly is configured such that when the optical pipe mount is mounted on the light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted on the second light source, a defined standoff distance exists between the second optical pipe and the second light source.

27. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes the excitation rays from one of the plurality of light sources and directs the excitation rays from the light sources, and having an incident light surface for receiving the excitation rays from the light sources; and a second optical pipe that homogenizes the excitation rays from a second light source among the plurality of light sources and directs the excitation rays from the second light source, and having an incident light surface for receiving the excitation rays from the second light source; A detector comprising a detector surface for supporting a biological or chemical sample, and a sensor array having a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from a photoenergy excitation device. A mounting assembly for mounting the optical pipe and the second optical pipe according to claim 26, comprising: a mounting assembly for aligning the optical pipe with the light source and aligning the second optical pipe with the second light source.

28. A mounting assembly, A light pipe mounting device for attaching a light pipe to a light source, The mounting assembly comprises a second optical pipe mount for mounting a second optical pipe to a second light source, wherein the mounting assembly is configured to facilitate mounting of the second optical pipe independently of mounting the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure, the second optical pipe mount is mounted on the support structure, the mounting assembly includes a support structure, the optical pipe mount is mounted on the support structure below a horizontal axis extending through the optical pipe and the second optical pipe, the second optical pipe mount is mounted on the support structure above a horizontal axis extending through the optical pipe and the second optical pipe, the mounting assembly includes a support structure, the optical pipe mount is removably screwed to the support structure, the second optical pipe mount is removably screwed to the support structure, the mounting assembly includes a support structure having a cavity, and the optical pipe mount is front The second optical pipe mount is mounted on the support structure having a cavity, and the mounting assembly is configured such that when the optical pipe mount is mounted on the support structure, the optical pipe extends through the cavity, the cavity has a diameter larger than the diameter of the optical pipe so that when the optical pipe extends through the cavity, the optical pipe does not come into contact with the side walls defining the cavity, and the mounting assembly is configured such that when the optical pipe mount is mounted on the light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted on the second light source, a defined standoff distance exists between the second optical pipe and the second light source, the light source is included in a light source bank mounted on a region of a printed circuit board, the second light source is included in a second light source bank mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are,A surface-modified region of the printed circuit board having a surface modification characterized by an insulating layer and a conductive metal wiring layer to be removed, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe, and the mounting assembly includes an adhesive that matches the refractive index of air.

29. A mounting assembly, A structural member that supports the optical pipe, A mounting assembly comprising a second structural member that supports a second optical pipe.

30. The mounting assembly according to claim 29, wherein the structural member and the second structural member are separate discontinuous material pieces.

31. The mounting assembly according to claim 29 or 30, wherein the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe.

32. The mounting assembly according to any one of claims 29 to 31, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe.

33. The mounting assembly according to any one of claims 29 to 32, wherein the mounting assembly contacts the optical pipe at a single contact point of the optical pipe.

34. The mounting assembly according to claim 29, wherein the structural member and the second structural member are separate discontinuous material pieces, the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe, and the mounting assembly contacts the optical pipe at a single contact point of the optical pipe.

35. The mounting assembly according to any one of claims 29 to 34, wherein the mounting assembly is configured such that when the optical pipe mount is mounted to the light source, a standoff distance exists between the optical pipe and the light source, and further, when the second optical pipe mount is mounted to the second light source, a defined standoff distance exists between the second optical pipe and the second light source.

36. The mounting assembly according to any one of claims 29 to 35, wherein the optical pipe is aligned with a light source, and the second optical pipe is aligned with a second light source.

37. The mounting assembly according to any one of claims 29 to 36, wherein the optical pipe is aligned with a light source of a light source bank, and the second optical pipe is aligned with a second light source of a second light source bank.

38. The mounting assembly according to any one of claims 29 to 37, wherein the optical pipe is aligned with a light source mounted on a region of the printed circuit board, the second optical pipe is aligned with a second light source mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed.

39. The mounting assembly according to claim 29, wherein the structural member and the second structural member are separate discontinuous material pieces, the mounting assembly is configured to facilitate the mounting of the second optical pipe independently of the mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly is configured such that a standoff distance exists between the optical pipe and the light source when the optical pipe mount is mounted to the light source, and further, a defined standoff distance exists between the second optical pipe and the second light source when the second optical pipe mount is mounted to the second light source, the optical pipe is aligned with a light source mounted in a region of the printed circuit board, the second optical pipe is aligned with a second light source mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed.

40. The mounting assembly according to claim 29, wherein the mounting assembly contacts the optical pipe at a single contact position on the optical pipe, and the single contact position includes an adhesive that matches the refractive index of air.

41. A mounting assembly, A structural member that supports the optical pipe, A mounting assembly comprising: a second structural member supporting a second optical pipe, wherein the structural member and the second structural member are separate discontinuous material pieces, the mounting assembly is configured to facilitate mounting of the second optical pipe independently of mounting of the optical pipe, the mounting assembly contacts the optical pipe at a single contact point of the optical pipe, the mounting assembly is configured such that a standoff distance exists between the optical pipe and the light source when the optical pipe mount is mounted to a light source, and further, a defined standoff distance exists between the second optical pipe and the second light source when the second optical pipe mount is mounted to a second light source, the optical pipe is aligned with a light source mounted in a region of a printed circuit board, the second optical pipe is aligned with a second light source mounted in a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed.

42. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes the excitation rays from one of the plurality of light sources and directs the excitation rays from the light sources, and having an incident light surface for receiving the excitation rays from the light sources; and a second optical pipe that homogenizes the excitation rays from a second light source among the plurality of light sources and directs the excitation rays from the second light source, and having an incident light surface for receiving the excitation rays from the second light source; A detector comprising a detector surface for supporting a biological or chemical sample, and a sensor array having a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from a photoenergy excitation device. A system comprising: a mounting assembly for mounting the aforementioned optical pipe and the second optical pipe, the mounting assembly for aligning the aforementioned optical pipe with the light source and aligning the second optical pipe with the second light source.

43. The system according to claim 42, wherein the mounting assembly includes a support structure having a member defining a cavity and an optical pipe mount to which the optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity.

44. The system according to claim 42, wherein the mounting assembly includes a support structure having a member defining a cavity and an optical pipe mount to which the optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity without contacting the support structure.

45. The system according to any one of claims 42 to 44, wherein the mounting assembly mounts the optical pipe such that the light incident surface of the optical pipe is separated from the light source, and the mounting assembly mounts the second optical pipe such that the light incident surface of the second optical pipe is separated from the second light source.

46. The system according to any one of claims 42 to 45, wherein the mounting assembly mounts the optical pipe such that the outer boundary of the optical pipe is provided by air, and the mounting assembly is attached to the optical pipe with an adhesive having a refractive index that matches the refractive index of air.

47. The system according to claim 42, wherein the mounting assembly mounts the optical pipe such that the outer boundary of the optical pipe is provided by air, and the mounting assembly is attached to the optical pipe with an adhesive having a refractive index that matches the refractive index of air.

48. The system according to any one of claims 42 to 47, wherein the mounting assembly mounts the optical pipe such that the outer boundary of the optical pipe is provided by air.

49. The system according to any one of claims 42 to 48, wherein the mounting assembly contacts the optical pipe on one side of the optical pipe.

50. The system according to any one of claims 42 to 49, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe.

51. The system according to any one of claims 42 to 50, wherein the mounting assembly contacts the optical pipe at a single contact position of the optical pipe, and the single contact position includes an adhesive that matches the refractive index of air.

52. The system according to any one of claims 42 to 52, wherein the mounting assembly includes a support structure extending forward from the light source and the second light source; an optical pipe mount for carrying the optical pipe, which is detachably attached to the support structure; and a second optical pipe mount for carrying the second optical pipe, which is detachably attached to the support structure.

53. The mounting assembly includes a support structure having a member defining a cavity, and an optical pipe mount to which the optical pipe is attached, wherein the optical pipe mount is attached to the support structure such that the optical pipe extends through the cavity without contacting the support structure, the mounting assembly mounts the optical pipe such that the outer boundary of the optical pipe is provided by air, the mounting assembly is attached to the optical pipe with an adhesive having a refractive index matching that of air, and the mounting assembly includes a support structure extending forward from the light source and the second light source, and an optical pipe mount for carrying the optical pipe, which is detachably attached to the support structure. The system according to claim 42, comprising: an optical pipe mount; a second optical pipe mount for carrying the second optical pipe, the second optical pipe mount being detachably attached to the support structure, wherein the mount assembly mounts the optical pipe such that the light incident surface of the optical pipe is separated from the light source; the mount assembly mounts the second optical pipe such that the light incident surface of the second optical pipe is separated from the second light source; the system determines which of the set of light sources or the second set of light sources generates less total heat when energized; and in accordance with the determination, selects an order for energizing the set of light sources and the second set of light sources.

54. The system according to any one of claims 42 to 53, wherein the detector comprises a circuit that transmits a data signal in response to a photon detected by the photosensor of the sensor array, and the detector blocks the excitation light, allowing the emitted signal light to propagate toward the photosensor.

55. The system according to any one of claims 42 to 54, wherein the light energy excitation device comprises a lens that focuses the object plane defined by the light emission surface of the light pipe onto the image plane defined by the detector surface.

56. The system according to any one of claims 42 to 55, wherein the plurality of light sources comprises light-emitting diodes surface-coupled to the light incident surface of the optical pipe, the optical pipe comprises glass, the optical pipe has a tapered structure, and includes a diameter that increases along the entire length of the optical pipe in the direction from the light incident surface of the optical pipe to the light output surface of the optical pipe, the optical pipe reflects excitation light such that the optical pipe-emitting rays emitted from the light output surface of the optical pipe define a diverging cone of light that diverges with respect to the optical axis of the optical energy excitation device, the optical energy excitation device comprises a lens, the lens receives the excitation light from the optical pipe and shapes the excitation light rays such that the optical pipe-emitting rays emitted from the lens define a converging cone of light that converges with respect to the optical axis of the optical energy excitation device, and the optical energy excitation device comprises one or more filters that filter out light at wavelengths longer than the cumulative emission band of the wavelengths of the plurality of light sources.

57. The system according to claim 42, wherein the system determines which of the set of light sources or the second set of light sources generates less total heat when energized, and operates to select an order for energizing the set of light sources and the second set of light sources in accordance with the determination.

58. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes the excitation rays from one of the plurality of light sources and directs the excitation rays from the light sources, and having an incident light surface for receiving the excitation rays from the light sources; and a second optical pipe that homogenizes the excitation rays from a second light source among the plurality of light sources and directs the excitation rays from the second light source, and having an incident light surface for receiving the excitation rays from the second light source; A detector comprising a detector surface for supporting a biological or chemical sample, and a sensor array having a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from a photoenergy excitation device. The mounting assembly comprises a mounting assembly for mounting the optical pipe and the second optical pipe, wherein the mounting assembly aligns the optical pipe to the light source and the second optical pipe to the second light source, and the mounting assembly comprises a support structure having a member defining a cavity and an optical pipe mount to which the optical pipe is attached, the optical pipe mount being attached to the support structure such that the optical pipe extends through the cavity without contacting the support structure, the mounting assembly mounting the optical pipe such that the outer boundary of the optical pipe is provided by air, the mounting assembly is attached to the optical pipe with an adhesive having a refractive index matching the refractive index of air, and the mounting assembly is attached to the light source and the A system comprising: a support structure extending forward from a second light source; an optical pipe mount for carrying the optical pipe, which is detachably attached to the support structure; and a second optical pipe mount for carrying the second optical pipe, which is detachably attached to the support structure, wherein the mounting assembly mounts the optical pipe such that the light incident surface of the optical pipe is separated from the light source; the mounting assembly mounts the second optical pipe such that the light incident surface of the second optical pipe is separated from the second light source; and the optical energy excitation device comprises a lens that focuses an object plane defined by the light emission surface of the optical pipe onto an image plane defined by the detector surface.

59. A light energy excitation device, A light source bank that emits excitation rays, A light pipe that homogenizes the excitation ray and directs the excitation ray toward the distal end of the light energy excitation device, wherein the light pipe comprises a light incident surface and a light emission surface, and the light pipe comprises a light pipe that receives the excitation ray from the light source bank.

60. The photoenergy excitation device according to claim 59, wherein the light source bank comprises light sources connected in parallel.

61. The photoenergy excitation device according to claim 59, wherein the light source bank comprises light sources connected in series.

62. The photoenergy excitation device according to claim 59, wherein the light source bank comprises parallel-connected light sources provided by vertical LEDs.

63. The photoenergy excitation device according to claim 59, wherein the light source bank comprises light sources connected in series by flip-chip LEDs.

64. The photoenergy excitation device according to claim 59, wherein the light source bank comprises light sources connected in parallel, and the anodes of the light sources defining the light source bank are commonly connected to the metal core layer of a printed circuit board.

65. The photoenergy excitation device according to claim 59, wherein the light source bank comprises vertically connected LEDs in parallel, and the anodes of the vertically connected LEDs defining the light source bank are commonly connected to the metal core layer of a printed circuit board.

66. The photoenergy excitation device according to claim 59 or 60, wherein the light source defining the light source bank is commonly connected to the metal core layer of the printed circuit board.

67. The photoenergy excitation device according to claim 59, wherein the light source bank comprises parallel-connected light sources, and the parallel-connected light sources are provided by flip-chip LEDs.

68. The light energy excitation device according to claim 59, wherein the light source bank comprises light sources connected in series, and the light sources connected in series are provided by vertical LEDs.

69. The photoenergy excitation device according to any one of claims 59 to 61, wherein the light source bank comprises vertical LEDs.

70. The photoenergy excitation device according to any one of claims 59 to 61, wherein the light source bank comprises a flip-chip LED.

71. The photoenergy excitation device according to any one of claims 59 to 61, wherein the light source bank comprises flip-chip LEDs arranged in an array having equally spaced rows and columns of flip-chip LEDs.

72. The photoenergy excitation device according to claim 59, wherein the light source bank comprises LEDs connected in series, the LEDs connected in series are mounted on a printed circuit board, and the printed circuit board has a ceramic insulator.

73. The photoenergy excitation device according to claim 59, wherein the light source bank comprises LEDs connected in series, the LEDs connected in series are mounted on a printed circuit board, and the printed circuit board has a ceramic insulator provided by the LEDs.

74. The light energy excitation device according to any one of claims 59 to 73, wherein when the distal end of the light energy excitation device is coupled to the detector assembly, the light energy excitation device comprises a lens that images an object plane defined by the light emission surface onto an image plane defined by the detector surface of the detector.

75. A light energy excitation device comprising: a plurality of light sources; an optical pipe that homogenizes and directs excitation rays from one of the plurality of light sources, and has an incident light surface for receiving the excitation rays from the light sources; a second optical pipe that homogenizes and directs excitation rays from a second light source among the plurality of light sources, and has an incident light surface for receiving the excitation rays from the second light source; a third optical pipe that homogenizes and directs excitation rays from a third light source among the plurality of light sources, and has an incident light surface for receiving the excitation rays from the third light source; and a fourth optical pipe that homogenizes and directs excitation rays from a fourth light source among the plurality of light sources, and has an incident light surface for receiving the excitation rays from the fourth light source; A lens that receives excitation rays from the optical pipe and the second optical pipe, and images the light-emitting surfaces of the optical pipe and the second optical pipe onto the detector surface of the detector and the second detector surface of the second detector, respectively. A system comprising: a lens that receives excitation rays from the third optical pipe and the fourth optical pipe, and images the light-emitting surfaces of the third optical pipe and the fourth optical pipe onto the third detector surface of the third detector and the fourth detector surface of the fourth detector, respectively.

76. The system according to claim 75, wherein the light source is arranged in a light source bank, the second light source is arranged in a second light source bank, the third light source is arranged in a third light source bank, and the fourth light source is arranged in a fourth light source bank.

77. It is a method, A light energy excitation device comprising a set of light sources and a second set of light sources, wherein the set of light sources emits excitation rays in a first wavelength emission band, and the second set of light sources emits excitation rays in a second wavelength emission band, wherein excitation light is emitted using the light energy excitation device. A detector comprising a detector surface for supporting a biological or chemical sample and a sensor array separated from the detector surface, wherein the detector blocks the excitation light and allows the emitted signal light to propagate toward the photosensors of the sensor array, and the detector receives the excitation light and the emitted signal light resulting from the excitation by the excitation light. A method comprising using the detector circuit to transmit a data signal in response to a photon detected by the optical sensor of the sensor array.

78. The method according to claim 77, comprising: determining which of the set of light sources or the second set of light sources generates less total heat when energized; and selecting an order for energizing the set of light sources and the second set of light sources in accordance with the determination.

79. The method according to claim 77 or 78, wherein the set of light sources and the second set of light sources are supported by a printed circuit board, and the method includes inspecting thermal data of the printed circuit board and selecting an order for energizing the set of light sources and the second set of light sources in accordance with the inspection.

80. The method according to any one of claims 77 to 79, further comprising energizing the set of light sources and a second set of light sources in order such that the set of light sources that generates a smaller total amount of heat when energized is energized first in the ordering.

81. A light energy excitation device comprising: an optical pipe that homogenizes and directs excitation rays from a light source bank, and has an incident light surface for receiving excitation rays from the light source bank; and a second optical pipe that homogenizes and directs excitation rays from a second light source bank, and has an incident light surface for receiving excitation rays from the second light source bank; A detector comprising a detector surface for supporting a biological or chemical sample, and a sensor array having a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from a photoenergy excitation device.

82. The system according to claim 81, wherein the light source bank is mounted on a region of a printed circuit board, the second light source bank is mounted on a second region of the printed circuit board, and the second region is separated from the region.

83. The system according to claim 81, wherein the light source bank is mounted in a region of a printed circuit board, the second light source bank is mounted in a second region of the printed circuit board, the second region is separated from the region, and the thermal resistance between each of the light source bank and the second light source bank and the heat sink is smaller than the thermal resistance between the light source bank and the second light source bank.

84. The system according to claim 81, wherein the light source bank is mounted on a region of a printed circuit board, the second light source bank is mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by an insulating layer and a metal wiring layer to be removed.

85. The system according to any one of claims 81 to 84, wherein the light rays emitted from the optical pipe and the second optical pipe are commonly received by a lens that shapes the emitted light rays so as to project an optical pattern and a second optical pattern onto a camera integrated circuit having a detector and a second detector, the optical pattern is projected by the lens onto the detector surface of the detector, and the second optical pattern is projected by the lens onto the second detector surface of the second detector.

86. A light energy excitation device comprising: an optical pipe that homogenizes and directs excitation rays from a light source bank, and has an incident light surface for receiving excitation rays from the light source bank; and a second optical pipe that homogenizes and directs excitation rays from a second light source bank, and has an incident light surface for receiving excitation rays from the second light source bank; wherein the light source bank is mounted on a region of a printed circuit board, the second light source bank is mounted on a second region of the printed circuit board, the second region is separated from the region, and the second region and the region are surface-modified regions of the printed circuit board having surface modifications characterized by one or more layers of the printed circuit board to be removed; A detector comprising: a detector surface for supporting a biological or chemical sample; a sensor array comprising a photosensor spaced apart from the detector surface, wherein the detector receives excitation light and emission signal light from a photoenergy excitation device; the emitted rays from the optical pipe and the second optical pipe are commonly received by a lens that shapes the emitted rays so as to project an optical pattern and a second optical pattern onto a camera integrated circuit having the detector and the second detector; the optical pattern is projected onto the detector surface of the detector by the lens; and the second optical pattern is projected onto the second detector surface of the second detector by the lens.

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