Methods, systems, and apparatus for monitoring the radiant output of lamps.

Abstract

Embodiments of the present disclosure relate to methods, systems, and apparatus for monitoring the radiant output of lamps in a processing chamber. In some embodiments, the system includes a plurality of lamps coupled to a chamber and one or more radiation sensors. Each lamp is associated with one or more zones, the radiation sensors are coupled to the chamber, and each radiation sensor is adjacent to at least one lamp. The controller includes commands to cause the radiation sensors to transmit information to the controller relating to the radiation emitted by the lamps, which, when executed, includes analyzing the information, which includes determining a function of radiation over time for each zone and monitoring a function of the lamps relating to their aging, and to cause the controller to perform at least one of the following based on the analysis of the information: changing the input power delivered to the lamps and generating a warning.

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure relate to a method, system, and apparatus for monitoring the radiant output of lamps in a substrate processing chamber. In one aspect, the lamps are monitored to determine whether one or more lamps need to be replaced.

Background Art

[0002]

[0002] Lamps used for heating as part of a substrate processing step may change over time, deteriorate, or malfunction, resulting in increased machine downtime and reduced product throughput. Changes over time, deterioration, and / or malfunction of the lamps may also interfere with the performance of the device. Depending on the process, the rate of change over time of the lamps may vary. For example, lamps located in different area zones of the processing chamber may change over time in various ways. As a result, even when the same input power is supplied to different area zones, the radiant output from the lamps in each zone may be different. Some lamp monitoring operations (e.g., lamp filament resistance detection) lack accuracy, so a shift in lamp resistance can only be detected when the resistance of a large number of lamps has shifted. The change over time of a particular lamp can only be detected by the results of a wafer process such as a thickness profile.

[0003]

[0003] Therefore, there is a need for an improved lamp monitoring method, system, and apparatus that enable predicting the change over time of lamps in order to facilitate shortening machine downtime, accurately monitoring the change over time of lamps, improving throughput, and improving device performance.

Summary of the Invention

[0004]

[0004] Embodiments of the present disclosure relate to a method, system, and apparatus for monitoring the radiant output of lamps in a substrate processing chamber. In one aspect, the lamps are monitored to determine whether one or more lamps need to be replaced.

[0005]

[0005] In one or more embodiments, the substrate processing system includes a processing chamber including a processing area, a plurality of lamps coupled to the processing chamber, each lamp associated with one or more zones, a plurality of radiation sensors coupled to the processing chamber, each radiation sensor being adjacent to at least one lamp, and a controller which, when executed by a processor, causes one or more radiation sensors to transmit information to the controller relating to radiation emitted by the plurality of lamps, and causes the controller to analyze the information, which includes determining a function of radiation over time for each zone and monitoring the function for a first condition relating to the aging of the lamps, and causes the controller to perform at least one of the actions of changing the input power delivered to at least one of the lamps and generating a warning based on the analysis of the information.

[0006]

[0006] In another embodiment, a method for monitoring multiple lamps in a processing chamber includes identifying each lamp in one or more zones, collecting radiation emitted by the multiple lamps, generating information about the collected radiation for each zone, and analyzing the information, wherein the analysis includes determining a function of radiation over time for each zone and monitoring a function for a first condition related to the aging of the lamps, and performing at least one of an action to change the input power delivered to at least one of the lamps and an action to generate a warning based on the analysis of the information.

[0007]

[0007] In some embodiments, the system includes a non-transient computer-readable storage medium storing computer-executable instructions that, when executed by a processor, cause the processor to perform a method of monitoring a plurality of lamps in a processing chamber, the method comprising: identifying each lamp in one or more zones; collecting radiation emitted by the plurality of lamps; generating information about the collected radiation for each zone; and analyzing the information, the analysis of which includes determining a function of radiation over time for each zone and monitoring a function for a first condition relating to the aging of the lamps; and performing at least one of an action to change the input power delivered to at least one of the lamps and an action to generate a warning based on the analysis of the information.

[0008]

[0008] In one or more embodiments, a radiation sensor for a processing chamber for processing a substrate includes a sensor unit capable of detecting radiation in a wavelength range of about 300 nm to about 5000 nm, a sensor camp covering the sensor unit, comprising a sensor cap including silicon carbide-coated graphite, and a shielding base capable of thermally isolating the sensor unit from its support structure, wherein the radiation sensor is configured to detect radiation emitted by one or more of a plurality of lamps in the processing chamber, each of which lamps is associated with one or more zones in the processing chamber, and the radiation sensor is configured to generate information about the radiation detected for one of the zones.

[0009]

[0009] In order to provide a detailed understanding of the features of the present disclosure described above, the present disclosure summarized above will be described more specifically with reference to embodiments illustrated in part in the accompanying drawings. However, it should be noted that the accompanying drawings are merely illustrative embodiments and should not be considered to limit the scope of the present disclosure, and other equally valid embodiments are also permissible. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic side cross-sectional view of a processing chamber according to one or more embodiments. [Figure 2] This is a schematic side cross-sectional view of the lamp and lamp output radiation sensor of the processing chamber shown in Figure 1, according to one or more embodiments. [Figure 3] This is a schematic block diagram of a control system for use in the processing chamber shown in Figure 1, according to one or more embodiments. [Figure 4] This is a schematic block diagram of a control feedback loop for use in the processing chamber shown in Figure 1, according to one or more embodiments. [Figure 5] This is a block diagram of a method for monitoring multiple lamps in a processing chamber according to one or more embodiments. [Modes for carrying out the invention]

[0011]

[0015] For ease of understanding, the same reference numerals are used to indicate identical elements common to the drawings whenever possible. Elements and features of one embodiment are considered to be usefully incorporated into other embodiments without further detail.

[0012]

[0016] Embodiments of the present disclosure relate to methods, systems, and apparatus for monitoring the radiant output of lamps in a substrate processing chamber. In one embodiment, the lamps are monitored to determine whether one or more lamps need to be replaced.

[0013]

[0017] Embodiments of the present disclosure may provide improved lamp monitoring methods, systems, and apparatus that enable prediction of lamp changes over time to facilitate reduced machine downtime, accurate monitoring, increased throughput, and improved device performance. For example, embodiments of the present disclosure may provide improved systems and methods for monitoring and / or controlling lamps, such as infrared lamps, used in processing chambers, such as epitaxial deposition chambers. As a result, embodiments of the present disclosure can improve the accuracy of lamp monitoring compared to the accuracy of conventional systems. Embodiments of the present disclosure may enable beneficial control of one or more lamps based at least in part on the radiant output detected from one or more lamps. For example, one or more lamps may be assigned to regional zones within a processing chamber, and the radiant output may be analyzed according to the zone from which it is emitted, and each control command may be applicable to a lamp in a single zone. One or more lamps may be advantageously controlled to compensate for differences in lamp changes over time, such as filament slack, filament breakage, short circuits between filament turns, and / or deposition on the lamp envelope. As a result, embodiments of the present disclosure can provide independently operating monitoring and / or control of processing chamber lamps without requiring other hardware (e.g., external hardware) or user intervention (e.g., visual inspection of lamps, manual adjustment of input power). Embodiments of the present disclosure may include systems and methods for automating the control of lamp power input. Lamp control based at least in part on the radiated output detected from the lamps avoids technical problems associated with manual inspection and / or visual inspection of lamps, such as lack of accuracy and inefficiency. Improved accuracy of lamp control improves the accuracy of chamber temperature control, thereby providing more predictable deposition results and substrate processing. Improved monitoring and / or control of lamps, as provided by embodiments disclosed herein, can reduce machine downtime, increase product throughput, and provide higher accuracy and / or efficiency to device performance.

[0014]

[0018] Figure 1 is a schematic side cross-sectional view of a processing chamber 100 according to one or more embodiments. The processing chamber 100 is a deposition chamber. In one or more embodiments, which can be combined with other embodiments, the processing chamber 100 is an epitaxial deposition chamber. The processing chamber 100 is used to grow an epitaxial film on a substrate 102. The processing chamber 100 forms a crossflow of precursor across the upper surface 150 of the substrate 102.

[0015]

[0019] The processing chamber 100 includes an upper body 158, a lower body 148 positioned below the upper body 158, and a flow module 112 positioned between the upper body 158 and the lower body 148. The upper body 158, the flow module 112, and the lower body 148 form the chamber body. Distributed within the chamber body are a substrate support 106 (e.g., a susceptor), an upper window 108 (e.g., an upper dome), a lower window 110 (e.g., a lower dome), and a plurality of lamps (e.g., incandescent lamps). The plurality of lamps may be adapted to emit radiation (e.g., infrared radiation, optical radiation) toward the substrate 102 and raise its temperature (e.g., to a desired processing temperature). For example, the lamps may be adapted to emit radiation in the wavelength range of about 300 nm to about 5000 nm, and / or infrared (IR) radiation. In some embodiments, the lamps may be adapted to emit a peak filament output at wavelengths of about 950 nm or greater. The lamps may be arranged symmetrically (for example, in a roughly ring shape) around the central axis of the processing chamber 100. The lamps may be arranged in one or more regional zones (e.g., a zone with a common input power, a zone providing common susceptor region heating). As illustrated, the lamps may be identified by four regional zones, such as the lamp 141 in the upper outer zone, the lamp 142 in the upper inner zone, the lamp 143 in the lower outer zone, and the lamp 144 in the lower inner zone. Each zone may have one or more lamps (e.g., from one to about 50 or more lamps). In some embodiments, the number of lamps in each zone may be the same, but in other embodiments, each zone may have a different number of lamps (e.g., 12 lamps in the upper outer zone 141, 20 lamps in the upper inner zone 142, 32 lamps in the lower outer zone 143, and 12 lamps in the lower inner zone 144). In some embodiments that can be combined with other embodiments, it is assumed that multiple lamps may be arranged according to different shape dimensions and / or orientations (e.g., vertical). As shown in the diagram, the controller 120 is connected to the processing chamber 100 and is used to control processes and methods such as steps of the method described herein.The controller 120 may be adapted to monitor, set, adjust, and / or change the input power (e.g., measured by voltage) delivered to lamps in different zones, thereby controlling the radial distribution of radiated energy. For example, the controller 120 may send control signals to the input power supply, which specify input power levels based on the lamp zone and / or operating process state. Similarly, the controller 120 may modify the set value of the input power delivered to the lamps. The controller 120 may be adapted to generate warnings based on data collected by various components of the processing chamber 100.

[0016]

[0020] The substrate support 106 is positioned between the upper window 108 and the lower window 110. The substrate support 106 includes a support surface 123 for supporting the substrate 102. In some embodiments, the substrate support is formed of a material such as silicon carbide coated graphite. Multiple upper outer zone lamps 141 and multiple upper inner zone lamps 142 are positioned between the upper window 108 and the lid 154. The lid 154 may include multiple sensors (e.g., a pyrometer; not shown) positioned inside it to measure the temperature inside the processing chamber 100. Multiple lower outer zone lamps 143 and multiple lower inner zone lamps 144 are positioned between the lower window 110 and the floor 152. The upper window 108 is an upper dome and is formed of an energy-transferring material such as quartz. The lower window 110 is a lower dome and is formed of an energy-transferring material such as quartz.

[0017]

[0021] A process area 136 and a purge area 138 are formed between the upper window 108 and the lower window 110. The process area 136 and the purge area 138 are part of an internal area at least partially defined by the upper window 108, the lower window 110, and one or more liners 163.

[0018]

[0022] A substrate support 106 is positioned within the internal region. The substrate support 106 is attached to a shaft 118. The shaft 118 is connected to a motion assembly 121. The motion assembly 121 includes one or more actuators and / or adjusters that provide movement and / or adjustment of the shaft 118 and / or the substrate support 106 within the processing region 136.

[0019]

[0023] The substrate support 106 may include a lift pin hole 107 located therein. The lift pin hole 107 is sized to accommodate a lift pin 132 for lifting the substrate 102 from the substrate support 106 either before or after the deposition process is performed. The lift pin 132 may rest on a lift pin stopper 134 when the substrate support 106 is lowered from the process position to the transfer position.

[0020]

[0024] The flow module 112 includes a plurality of gas inlets 114, a plurality of purge gas inlets 164, and one or more gas exhaust outlets 116. The plurality of gas inlets 114 and the plurality of purge gas inlets 164 are located on the opposite side of the flow module 112 from the one or more gas exhaust outlets 116. One or more flow guides 117a, 117b are located below the plurality of gas inlets 114 and the one or more gas exhaust outlets 116. One or more flow guides 117a, 117b are located above the purge gas inlets 164. One or more liners 163 are located on the inner surface of the flow module 112 to protect the flow module 112 from reactive gases used during the deposition and / or cleaning processes. The gas inlets 114 and purge gas inlets 164 are each positioned to direct gas flow parallel to the upper surface 150 of the substrate 102 located within the process area 136. The gas inlet(s) 114 are fluidically connected to one or more process gas sources 151 and one or more cleaning gas sources 153. The purge gas inlet(s) 164 are fluidically connected to one or more purge gas sources 162. One or more gas exhaust outlets 116 are fluidically connected to an exhaust pump 157. The one or more process gases supplied using one or more process gas sources 151 may include one or more reactive gases (such as one or more of silicon (Si), phosphorus (P), and / or germanium (Ge)) and / or one or more carrier gases (such as one or more of nitrogen (N2) and / or hydrogen (H2)). The one or more purge gases supplied using one or more purge gas sources 162 may include one or more inert gases (such as one or more of argon (Ar), helium (He), and / or nitrogen (N2)). One or more cleaning gases supplied using one or more cleaning gas sources 153 may include one or more of hydrogen (H) and / or chlorine (Cl). In one or more embodiments that can be combined with other embodiments, one or more process gases include silicon phosphide (SiP) and / or phosphine (PH3), and one or more cleaning gases include hydrochloric acid (HCl).

[0021]

[0025] One or more gas exhaust outlets 116 are further connected to, or include, an exhaust system 178. The exhaust system 178 fluidly connects the one or more gas exhaust outlets 116 and an exhaust pump 157. The exhaust system 178 may assist in the controlled deposition of layers on the substrate 102. The exhaust system 178 is disposed on the opposite side of the processing chamber 100 from the flow module 112.

[0022]

[0026] FIG. 2 is an enlarged view of one of the aforementioned lamps, such as the upper outer zone lamp 141, the upper inner zone lamp 142, the lower outer zone lamp 143, and / or the lower inner zone lamp 144. As shown, the lamp 240 is coupled to a wall 268 (e.g., the inner wall of the upper body 158 or the lower body 148, e.g., an internal reflector or deflector). The coupling can provide both structural support and input power to the lamp 240. The coupling can also transmit sensor readings and / or control signals between the lamp 240 and other components of the processing chamber 100, such as the controller 120. In some embodiments, the surface 269 of the wall 268 (e.g., the proximal lamp 240) is adapted to direct (e.g., reflect) light radiation towards the substrate 102, providing more efficient heating of the substrate 102.

[0023]

[0027] Figure 2 also illustrates a radiation sensor 270. The radiation sensor 270 can be positioned near the lamp 240 (for example, coupled to the wall 268 and / or another inner wall of the upper body 158 or lower body 148). The radiation sensor 270 may be adapted to preferentially detect the type of radiation emitted by the lamp 240 (e.g., radiation in the wavelength range of approximately 300 nm to approximately 5000 nm and / or infrared (IR) radiation). To minimize impact on the processing environment, the physical size and / or thermal mass of the radiation sensor 270 may be small (e.g., less than 10% of the lamp 240). The radiation sensor 270 may include a sensor unit 271, a low thermal mass sensor cap 272, and a shielding base 273. For example, the sensor unit 271 may be a resistance temperature detector (RTD), a thermocouple (TC), a pyrometer, and / or other type of radiation detector. The sensor unit 271 may have a sensor cap 272 made of a material similar to the substrate support 106 (e.g., silicon carbide coated graphite). Currently, it is believed that similar materials provide similar thermal absorption spectra to both the radiation sensor 270 and the substrate support 106. Furthermore, the sensor cap 272 can protect the sensor unit 271 from exposure to materials and gases in the processing chamber 100. A shielding base 273 can thermally isolate the radiation sensor 270 from the support structure (e.g., wall 268). In some embodiments, the shielding base 273 may include opaque quartz. In some embodiments, a single radiation sensor 270 is positioned near a plurality of lamps 240. For example, each of the aforementioned zones may have a single associated radiation sensor. In other words, each radiation sensor 270 is associated with a single zone, and each zone is associated with a single radiation sensor. In some embodiments, one or more radiation sensors 270 may be associated with one or more lamps 240 (for example, radiation from one or more lamps 240 can be detected), and each associated lamp 240 is located in a single zone of the aforementioned zones. In other words, each radiation sensor 270 is associated with a single zone, but at least one zone is associated with more than one radiation sensor 270.In some embodiments, the radiation sensor 270 can be adapted to detect only radiation from a single zone, for example, using an opaque deflector positioned between the radiation sensor and a non - relevant zone.

[0024]

[0028] The radiation sensor 270 is adapted to detect radiation emitted by the associated lamp(s) 240 and communicate information regarding the detected radiation to the controller 120. For example, the information may be in the form of an energy spectrum and / or a temperature measurement. The information may be specific to a narrow wavelength band, one or more wavelength bands, and / or a broad - band energy spectrum. The radiation sensor 270 transmits the information to the controller 120 in the form of data. The controller 120 receives data from each radiation sensor 270. The controller 120 analyzes the data to detect relative changes in the detected radiation. For example, for each zone, the controller can monitor the input power to the lamp and the associated radiation output. The input power and the associated radiation output can be compared over time for a single zone, between different zones, and / or any combination thereof. For example, a function of the radiation over time can be weighted by the input power. In some embodiments, the controller can generate a warning when a condition related to the lamp's change over time is identified by the monitoring. For example, the monitoring can identify a substantial difference (e.g., more than 3%) in the radiation output weighted by the input power in a comparison over time and / or in a comparison with other zones. In some embodiments, the warning indicates an instruction to replace each lamp 240. The warning can indicate that each lamp 240 may fail within a particular time frame, for example, within a specific number of weeks or months from the start of operation. Additionally, or alternatively, the warning can instruct the operator to replace each lamp 240. The warning can be displayed on a user interface.

[0025]

[0029] In some embodiments (not shown), one or more cameras can be used in conjunction with the radiation sensor 270 to monitor the lamp 240. For example, one or more cameras can optically monitor the lamp 240 and transmit the resulting images and / or information to the controller 120. In some embodiments, each camera can capture an image of the light emitted from the lamp. In some embodiments, each camera may be associated with a single zone. In some embodiments, the images can be analyzed to detect conditions related to changes in the lamp over time (e.g., changes in the position of the lamp filament, filament slack, filament breakage, short circuits between filament turns, and / or deposits on the lamp envelope). For example, the controller 120 can analyze the images to detect changes in the lamp over time. In some embodiments, the controller may be triggered to analyze the images to detect changes in the lamp over time based on the aforementioned detected changes in radiation from the radiation sensor. In some embodiments, warnings triggered by monitoring radiation from the radiation sensor may be enhanced by image analysis. For example, monitoring radiation from a specific zone can generate a warning, triggering a controller to analyze images from that zone, thereby enhancing the warning and identifying the temporal changes in one or more specific lamps within that zone. Suitable cameras and methods of using them can be disclosed, for example, in Patent No. 11,562,915, the contents of which are incorporated herein by reference.

[0026]

[0030] Figure 3 is a schematic block diagram of a control system 300 for use with the processing chamber 100 shown in Figure 1 according to one or more embodiments. The controller 120 is configured to receive data or input as sensor readings 302 from a plurality of sensors. The sensors may include, for example, sensors for monitoring the growth of one or more layers on the substrate 102, and / or sensors for monitoring growth or residue on the inner surfaces of chamber components of the processing chamber 100 (such as the inner surfaces of the upper window 108 and one or more liners 163). The sensors may also include a camera for monitoring a radiation sensor 270 and / or a lamp 240. The controller 120 comprises or communicates with a system model 306 of the processing chamber 100. The system model 306 includes a heating model, a rotational position model, a gas flow model, and a lamp aging model (e.g., a shift in lamp resistance from a new lamp to an aged lamp). System model 306 is a program configured to estimate parameters within the processing chamber 100 (such as gas flow rate, gas pressure, rotational position of components, and heating profile) during the deposition and / or washing processes. The controller 120 is further configured to store the readings and calculated values ​​304.

[0027]

[0031] The readings and calculated values ​​304 include previous sensor readings 302, such as any previous sensor readings within the processing chamber 100. The readings and calculated values ​​304 further include calculated values ​​stored after the sensor readings 302 have been measured by the controller 120 and performed via the system model 306. Thus, the controller 120 is configured to both read the stored readings and calculated values ​​304 and save them for future use. By maintaining previous readings and calculated values, the controller 120 can adjust the system model 306 over time to reflect a more accurate version of the processing chamber 100. For example, energy spectrum and / or temperature measurements taken during the calibration or setup phase may be stored as "fingerprints" of one or more lamps. This fingerprint information can later be compared with subsequent information from the radiation sensors to detect the radiation drift of the lamps. In some embodiments, the controller can adjust the input power to the lamps to maintain the radiation (output and / or wavelength) emitted during a particular process and / or process state. For example, the controller 120 can send a control signal to the input power supply, which specifies an input power level based on a stored fingerprint, radiation drift, ramp zone, and / or process state. The controller 120 can analyze the readings and calculated values ​​304 depending on the zone from which it was transmitted. This allows the controller 120 to adjust the input power to the ramp in a particular zone and maintain the radiation emitted from that zone during a particular process and / or process state.

[0028]

[0032] The controller 120 includes a central processing unit (CPU), memory containing instructions, and CPU support circuits. The controller 120 controls various items directly or via other computers and / or controllers. In one or more embodiments, the controller 120 is communicably coupled to a dedicated controller, and the controller 120 functions as a central controller.

[0029]

[0033] The controller 120 is any form of general-purpose computer processor used in an industrial environment to control various board processing chambers and equipment, as well as subprocessors on or within them. The memory, or non-transient computer-readable medium, is one or more of readily available memories such as random access memory (RAM), dynamic random access memory (DRAM), static RAM (SRAM), and synchronous dynamic RAM (SDRAM (e.g., DDR1, DDR2, DDR3, DDR3L, LPDDR3, DDR4, LPDDR4, etc.)), read-only memory (ROM), floppy disks, hard disks, flash drives, or any other form of local or remote digital storage. The support circuits of the controller 120 are coupled to the CPU (processor) to support the CPU. The support circuits include cache, power supply, clock circuit, input / output circuit and subsystems, etc. Process parameters (process gas pressure, process gas flow rate, and / or rotational position of the process kit) and processes are stored in memory as software routines that are executed or activated to control the operation of the various chambers / modules described herein, by converting the controller 120 into a controller for a specific purpose. The controller 120 is configured to perform any of the processes described herein. When the instructions stored in memory are executed, they cause one or more of the processes of Method 500 (described later) to be performed.

[0030]

[0034] The various processes described herein (such as the process of Method 500) can be performed automatically using the controller 120, or can be performed automatically or manually using specific operations performed by the user.

[0031]

[0035] In one or more embodiments, the controller 120 includes a mass storage device, an input control unit, and a display unit (not shown). The controller 120 monitors the flow of process gas and purge gas. In one or more embodiments, the controller 120 includes multiple controllers 120, and the stored readings and calculated values ​​304 and the system model 306 are stored in a controller separate from the controller 120 that operates the processing chamber 100. In one or more embodiments, the system model 306 and all of the stored readings and calculated values ​​304 are stored within the controller 120.

[0032]

[0036] The controller 120 is configured to control the rotational position, heating, and gas flow through the processing chamber 100 by supplying output to the control devices 308 for the ramps, gas flow, and motion assembly 121. The control devices 308 include control devices for the upper outer zone ramp 141, upper inner zone ramp 142, lower outer zone ramp 143, lower inner zone ramp 144, process gas source 151, purge gas source 162, motion assembly 121, and exhaust pump 157.

[0033]

[0037] The controller 120 is configured to adjust the output to the control device 308 based on sensor readings 302, system model 306, and stored readings and calculated values ​​304. For example, the controller 120 can send a control signal to the input power supply, which specifies the input power level based on sensor readings 302, system model 306, and / or stored readings and calculated values ​​304. The controller 120 can send individual control signals to the input power supply of each zone. The controller 120 includes embedded software and a correction algorithm for calibrating the measured values. The controller 120 may include one or more machine learning algorithms and / or artificial intelligence algorithms for estimating optimized parameters for the deposition process and / or washing process. One or more machine learning algorithms and / or artificial intelligence algorithms may use, for example, regression models (such as linear regression models) or clustering techniques to estimate the optimized parameters. The algorithms may be unsupervised or supervised.

[0034]

[0038] In one or more embodiments, the controller 120 is configured to maintain the input power of one or more lamps within 3% of the target radiant output by (a) transmitting a control signal to the input power supply to adjust the input power to one or more lamps 240 (e.g., lamps in a particular zone), (b) repeatedly acquiring radiation measurements from one or more radiation sensors 270 (e.g., radiation sensors in a particular zone), (c) comparing the acquired radiation measurements with a target radiant output, and (d) transmitting a control signal to the device to selectively adjust the input power of one or more lamps (e.g., lamps in a particular zone).

[0035]

[0039] Figure 4 is a schematic block diagram of a control feedback loop 400 for use in the processing chamber shown in Figure 1 according to one or more embodiments. The control feedback loop 400 can be used to monitor, set, and / or change the amount of input power delivered to one or more of the lamps 240. For example, a control system 300 can operate the control feedback loop 400 to monitor and / or control the lamps 240. In some embodiments, each of the aforementioned zones uses a separate control feedback loop 400. For example, for a given zone (e.g., the upper outer zone), an initial setting temperature 421 is identified. The set setting temperature may be based on desired operating conditions within the processing chamber 100. The set setting temperature 421 may be associated with one or more specific locations within the processing chamber 100, such as the axial center of the upper surface 150 of the substrate 102. The set setting temperature 421 may be initially input to a component of the control system 300. As shown in Figure 4, the set setting temperature is initially input to a PID control device 422 adapted to adjust the power supply to each zone based on temperature readings. In this way, the power set value is obtained as a result of the initial input of the set value temperature 421 to the PID control device 422.

[0036]

[0040] The power setpoint of the PID control unit 422 is supplied to the PID control unit 423, which is adapted to adjust the voltage supply to each zone based on the power setpoint and information about the radiation emitted from each lamp (indicated here as lamp 440).

[0037]

[0041] The voltage supplied by the PID control device 423 is supplied to the SCR 424, which is adapted to adjust the equipment power to the voltage output for each zone based on the voltage supplied by the PID control device 423.

[0038]

[0042] The voltage output from the SCR424 supplies input power to the lamps 440 in each zone. This input power allows the energy emitted from the lamps in the form of heat and radiation to be set, adjusted, and / or modified.

[0039]

[0043] The feedback loop 400 provides two feedback mechanisms. Heat from the lamps 440 can be detected by a pyrometer 480 for each zone. Thus, temperature feedback can be supplied from the pyrometer 480 to the PID control unit 422. Similarly, radiation from the lamps 440 can be detected by a radiation sensor 470 for each zone. Thus, radiation feedback can be supplied from the radiation sensor 470 to the PID control unit 423. Combining these, the two feedback mechanisms of the control feedback loop 400 can be used to monitor, set, and / or change the amount of input power supplied to one or more lamps. For example, the control system 300 can send a control signal to the PID control unit 423, which specifies the current power setpoint and / or the input power level based on the radiation feedback from the radiation sensor 470. In some embodiments, one or both of the feedback mechanisms can be repeated multiple times. For example, the feedback loop 400 can connect the controller 120 to radiation measuring means (e.g., radiation sensor 270) to repeatedly measure the radiation output of one or more lamps 240. In some embodiments, the control signals may be specific to one zone of the processing chamber.

[0040]

[0044] The control system 300 may include one or more machine learning algorithms and / or artificial intelligence algorithms that can implement, adjust, and / or improve the one or more algorithms, inputs, outputs, or variables described above. In addition or alternatively, one or more machine learning algorithms and / or artificial intelligence algorithms may rank or prioritize certain aspects of the adjustment of the feedback loop 400 over other aspects of the feedback loop 400. One or more machine learning algorithms and / or artificial intelligence algorithms may take into account other changes in the processing system, such as hardware replacement and / or degradation. In another example, one or more machine learning algorithms and / or artificial intelligence algorithms may take into account upstream or downstream changes that may occur in the processing system as a result of a change in a variable of the feedback loop 400. For example, if variable "A" is adjusted to cause a change in process aspect "B", and such adjustment unintentionally causes a change in process aspect "C", one or more machine learning algorithms and / or artificial intelligence algorithms may take into account such a change in aspect "C". In such an example, one or more machine learning algorithms and / or artificial intelligence algorithms embody predictive aspects related to the implementation of the feedback loop 400. Predictive approaches can be used to proactively mitigate unintended changes within the processing system. One or more machine learning algorithms and / or artificial intelligence algorithms can estimate optimized parameters, for example, using regression models (such as linear regression models) or clustering techniques. The algorithms may be unsupervised or supervised.

[0041]

[0045] Figure 5 is a block diagram of a method 500 for monitoring multiple lamps in a processing chamber according to one or more embodiments. Method 500 begins in step 510, which includes identifying each lamp in one or more zones. Method 500 proceeds to step 520, which includes collecting radiation emitted by the lamps. For example, a radiation sensor may monitor the radiation emitted by the lamps. The radiation sensor may measure the radiation emitted by the lamps continuously and / or intermittently. In some embodiments, the radiation sensor may collect data according to an automated schedule, which may be adjusted by a controller as process parameters change over time. Method 500 proceeds to step 530, which includes generating information about the radiation for each zone. For example, this information may include an absorption spectrum. In some embodiments, the information may be specified and / or subdivided by zone of the processing chamber. Method 500 proceeds to step 540, which includes analyzing the information.

[0042]

[0046] Method 500 proceeds to either (or both) step 551 or step 552 based on the analysis of step 540. Step 551 includes varying the input power delivered to at least one of the lamps. For example, the input power can be varied based, in particular, on one or more of the aforementioned fingerprints of the lamps. The controller can automatically vary the input power according to an automated schedule, which can be adjusted by the controller as process parameters change over time. In some embodiments, the controller can adjust the input power differently for different zones. Step 552 includes generating a warning. For example, the warning may indicate a replacement instruction for each lamp. In some embodiments, which can be combined with other embodiments, the replacement instruction instructs the operator to replace each lamp (e.g., on a user interface display). The operator can replace each individual lamp without necessarily replacing any of the other lamps, thereby reducing machine downtime, lowering cost and resource expenditure, and improving substrate throughput by the processing chamber. Each individual lamp can be replaced before the lamp actually fails. In some embodiments, which can be combined with other embodiments, the replacement instruction provides the operator with an estimated remaining lifespan, such as the remaining service life of each lamp. Using such estimated remaining lifespan for each lamp, the operator can plan and execute appropriate maintenance activities to reduce machine downtime, lower cost and resource expenditures, and improve substrate throughput through the processing chamber.

[0043]

[0047] Furthermore, embodiments of the present disclosure (such as intermediate plate embodiments) are modular and can be used across various processing (e.g., deposition) and / or cleaning processes involving various process parameters. Moreover, one or more embodiments, features, components, operation and / or characteristics of the various process kits (such as intermediate plates) described herein can be selected, combined and / or modified depending on the processing parameters (such as flow rate, temperature, pressure and / or gas composition) used in the processing and / or cleaning processes.

[0044]

[0048] It is assumed that one or more embodiments disclosed herein are combinable. For example, one or more embodiments, features, components, operations, and / or characteristics of the processing chamber 100, controller 120, lamp 240, radiation sensor 270, control system 300, control feedback loop 400, and / or method 500 can be combined. Furthermore, it is assumed that one or more embodiments disclosed herein may include some or all of the aforementioned advantages.

[0045]

[0049] Embodiments of this disclosure further relate to one or more of the following embodiments 1 to 21.

[0046]

[0050] 1. A substrate processing system comprising: a processing chamber including a processing area; a plurality of lamps coupled to the processing chamber, each lamp associated with one or more zones; one or more radiation sensors coupled to the processing chamber, each radiation sensor being adjacent to at least one lamp; and a controller, which, when executed by a processor, causes one or more radiation sensors to transmit information relating to the radiation emitted by the plurality of lamps to the controller; analyzes the information, the analysis including determining a function of radiation over time for each zone and monitoring a function for a first condition relating to the change in the lamps over time; and performs at least one of the actions of changing the input power delivered to at least one of the lamps and generating a warning based on the analysis of the information.

[0047]

[0051] 2.1 or more zones include an upper outer zone, an upper inner zone, a lower outer zone, and a lower inner zone, according to Embodiment 1.

[0048]

[0052] 3. The system according to Embodiment 1 or 2, wherein each radiation sensor is associated with a single zone among one or more zones.

[0049]

[0053] 4. The system according to any one of embodiments 1 to 3, wherein at least one zone is associated with more than one radiation sensor.

[0050]

[0054] 5.1 The system according to any one of embodiments 1 to 4, further comprising one or more cameras, the instruction which, when executed by the processor, causes one or more cameras to transmit a plurality of images of light emitted from a lamp to a controller, to analyze the images to detect a second state related to the aging of the lamp, and to enhance a warning based on the analysis of the images.

[0051]

[0055] 6.1 or the system according to any one of Embodiments 1 to 5, wherein each camera of a plurality of cameras is associated with a single zone among one or more zones.

[0052]

[0056] 7. The system according to any one of embodiments 1 to 6, wherein the warning indicates an instruction to replace at least one lamp in each zone.

[0053]

[0057] 8. A system according to any one embodiment 1 to 7, wherein the warning indicates the estimated remaining lifespan of at least one lamp in each zone.

[0054]

[0058] 9. A method for monitoring multiple lamps in a processing chamber, comprising: identifying each lamp in one or more zones; collecting radiation emitted by the multiple lamps; generating information about the collected radiation for each zone; and analyzing the information, wherein the analysis includes determining a function of radiation over time for each zone and monitoring a function for a first condition related to the aging of the lamps; and performing at least one of an action to change the input power delivered to at least one of the lamps and an action to generate a warning based on the analysis of the information.

[0055]

[0059] 10.1 The method according to Embodiment 9, wherein the zones include an upper outer zone, an upper inner zone, a lower outer zone, and a lower inner zone.

[0056]

[0060] 11. The method according to embodiment 9 or 10, wherein multiple radiation sensors are used to collect radiation.

[0057]

[0061] 12. The method according to embodiment 11, wherein each radiation sensor is associated with a single zone among one or more zones.

[0058]

[0062] 13. The method according to embodiment 11 or 12, wherein at least one zone is associated with more than one radiation sensor.

[0059]

[0063] 14. The method according to any one of embodiments 9 to 13, wherein the function includes an input power-weighted radiated output.

[0060]

[0064] 15. The method according to any one embodiment of 9 to 14, wherein the analysis of the information further includes comparing a function of radiation over time for one of the zones with a function of radiation over time for another of the zones.

[0061]

[0065] The method according to any one of embodiments 9 to 15, further comprising using 16.1 or multiple cameras to capture multiple images of light emitted from a lamp, analyzing the images to detect a second state related to the aging of the lamp, and enhancing a warning based on the image analysis.

[0062]

[0066] 17.1 or the method according to embodiment 16, wherein each camera of the multiple cameras is associated with a single zone among one or more zones.

[0063]

[0067] 18. The method according to any one embodiment 9 to 17, wherein the warning indicates an instruction to replace at least one lamp in each zone, and at least one estimated remaining lifespan of at least one lamp in each zone.

[0064]

[0068] 19. A method for monitoring multiple lamps in a processing chamber, and a method comprising the system described in any one of embodiments 1 to 8.

[0065]

[0069] 20. A non-transient computer-readable storage medium storing computer-executable instructions that, when executed by a processor, cause the processor to perform a method for monitoring multiple lamps in a processing chamber, wherein the method includes identifying each lamp in one or more zones, collecting radiation emitted by the multiple lamps, generating information about the collected radiation for each zone, and analyzing the information, the analysis of which includes determining a function of radiation over time for each zone and monitoring a function for a first condition related to the aging of the lamps, and performing at least one of an operation to change the input power delivered to at least one of the lamps and an operation to generate a warning based on the analysis of the information.

[0066]

[0070] 21. A radiation sensor for a processing chamber for processing a substrate, comprising: a sensor unit capable of detecting radiation in a wavelength range of approximately 300 nm to approximately 5000 nm; a sensor cap covering the sensor unit, comprising a sensor cap containing silicon carbide-coated graphite; and a shielding base capable of thermally isolating the sensor unit from its support structure, wherein the radiation sensor is configured to detect radiation emitted by one or more of a plurality of lamps in the processing chamber, each of the plurality of lamps being associated with one or more zones in the processing chamber, and the radiation sensor is configured to generate information regarding the radiation detected for one of the zones.

[0067]

[0071] The above description applies to embodiments of this disclosure, but other embodiments and further embodiments can be devised without departing from their basic scope, the scope of which will be determined by the claims set forth below. All documents described herein, including any priority documents and / or test procedures, are incorporated herein by reference to the extent that they do not conflict with this specification. As is evident from the above summary and specific embodiments, the forms of this disclosure have been illustrated and described, but various modifications can be made without departing from the spirit and scope of this disclosure. Therefore, this disclosure is not limited thereto. Similarly, the terms “comprising” are to be considered synonymous with the terms “including” for the purposes of U.S. law. Similarly, whenever a composition, element, or group of elements is accompanied by the translation "comprising," it should be understood that the same composition or group of elements is assumed to be accompanied by the translation "consisting essentially of," "consisting of," "selected from the group of consisting of," or "is," and vice versa. The term "about" as used herein refers to a variation of ±10% from the nominal value. It should be understood that such variation may be included in any value provided herein.

[0068]

[0072] Specific embodiments and features have been described using a set of numerical upper limits and a set of numerical lower limits. It should be understood that any numerical range, unless otherwise indicated, includes both lower and upper limits. Unless otherwise indicated, it should be understood that ranges are assumed to include any combination of any two values, for example, any combination of any lower limit and any upper limit, any combination of any two lower limits, and / or any combination of any two upper limits. Specific lower limits, upper limits, and ranges are described in one or more of the following claims.

Claims

1. A substrate processing system, A processing chamber including a processing area, A plurality of lamps coupled to the processing chamber, each lamp associated with one or more zones, One or more radiation sensors coupled to the processing chamber, each radiation sensor being in close proximity to at least one lamp, A controller, when executed by the processor, The one or more radiation sensors are to transmit information related to the radiation emitted by the multiple lamps to the controller, The controller is to analyze the information, For each zone, Determining the function of radiation over time, Regarding the first condition related to the aging of the lamp, the function is monitored and The information, including the above, is to be analyzed. Based on the analysis of the information, the controller The input power delivered to at least one of the lamps is changed, and Generate a warning To perform at least one of the actions and A controller and A substrate processing system comprising the above.

2. The aforementioned one or more zones are Upper outer zone, Upper inner zone, Lower outer zone, Lower inner zone and The system according to claim 1, including the following:

3. The system according to claim 1, wherein each radiation sensor is associated with a single zone among the one or more zones.

4. The system according to claim 3, wherein at least one zone is associated with more than one radiation sensor.

5. Furthermore, the system includes one or more cameras, and when the instruction is executed by the processor, The camera(s) described above transmit multiple images of the light emitted from the lamp to the controller. The controller is instructed to analyze the image in order to detect a second state related to the aging of the lamp, The controller is configured to enhance the warning based on the analysis of the image. The system according to claim 1, further comprising the following:

6. The system according to claim 5, wherein each of the one or more cameras is associated with a single zone among the one or more zones.

7. The system according to claim 1, wherein the warning indicates an instruction to replace at least one lamp in each zone.

8. The system according to claim 1, wherein the warning indicates the estimated remaining lifespan of at least one lamp in each zone.

9. A method for monitoring multiple lamps in a processing chamber, Identifying each lamp in one or more zones, Collecting radiation emitted by the aforementioned multiple lamps, To generate information about the radiation collected in each zone, The analysis of the aforementioned information, the analysis of which means For each zone, Determining the function of radiation over time, Regarding the first condition related to the aging of the lamp, the function is monitored and This includes analyzing information, Based on the analysis of the aforementioned information, The input power delivered to at least one of the lamps is changed, and Generate a warning Perform at least one of the actions and A method that includes this.

10. The one or more of the aforementioned zones are Upper outer zone, Upper inner zone, Lower outer zone, Lower inner zone and The method according to claim 9, including the method described in claim 9.

11. The method according to claim 9, wherein multiple radiation sensors are used to collect radiation.

12. The method according to claim 11, wherein each radiation sensor is associated with a single zone among the one or more zones.

13. The method according to claim 12, wherein at least one zone is associated with more than one radiation sensor.

14. The method according to claim 9, wherein the function includes a radiated output weighted by the input power.

15. The method according to claim 9, wherein analyzing the information further includes comparing a function of radiation over time for one of the zones with a function of radiation over time for another of the zones.

16. Using one or more cameras, capture multiple images of the light emitted from the lamp, In order to detect a second condition related to the aging of the lamp, the image is analyzed, Based on the analysis of the aforementioned image, the warning will be augmented. The method according to claim 9, further comprising:

17. The method according to claim 16, wherein each of the one or more cameras is associated with a single zone among the one or more zones.

18. The method according to claim 9, wherein the warning indicates an instruction to replace at least one lamp in each zone.

19. The method according to claim 9, wherein the warning indicates the estimated remaining lifespan of at least one lamp in each zone.

20. A radiation sensor for a processing chamber for processing substrates, A sensor unit capable of detecting radiation in the wavelength range of approximately 300 nm to approximately 5000 nm, A sensor cap covering the aforementioned sensor unit, comprising a sensor cap containing graphite coated with silicon carbide, The sensor unit is provided with a shielding base that can thermally isolate the sensor unit from the support structure of the sensor unit, The radiation sensor is configured to detect radiation emitted from one or more of the lamps in the processing chamber. Each of the aforementioned lamps is associated with one or more zones of the processing chamber, The radiation sensor is configured to generate information about the radiation detected for one of the zones. Radiation sensor.

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