Apparatus, systems, and methods using a transfer chamber

Abstract

Embodiments of the present disclosure relate to apparatus, systems, and methods for using a transfer chamber. In one or more embodiments, gaseous impurities in the transfer chamber are reduced. In one embodiment, the method includes receiving a user input via a user interface instructing a substrate processing system to perform a service recovery process according to a set of parameters, the service recovery process including, for each cycle of a certain number of exhaust-purge cycles, operating a vacuum pump according to a reference pressure to reduce the amount of gas in the transfer chamber, and then introducing purge gas into the transfer chamber according to a reverse filling pressure. The method also includes, after the completion of the above cycle, introducing purge gas into the transfer chamber until a threshold pressure is met, and providing an indication via the user interface that the above operation has been completed.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to an apparatus, a system, and a method using a transfer chamber. In one or more embodiments, for example, gaseous impurities (such as moisture and oxygen) are reduced or removed from the transfer chamber during preparation for substrate processing after the transfer chamber has been exposed to ambient air (such as environmental air like atmosphere).

Background Art

[0002] Epitaxial deposition is a deposition process that can be used to grow a layer on the crystalline surface of a substrate. A transfer chamber can be used to transfer a substrate between one or more other chambers for processing. The interior of the transfer chamber may sometimes be exposed to ambient air. For example, it may be desirable or necessary to open the transfer chamber to ambient air while accessing components inside the transfer chamber during preventive or corrective maintenance. As another example, there may be an ingress of gaseous impurities into the transfer chamber, or a contaminated substrate may be introduced into or present in the chamber. In addition, insufficient evacuation time may be used for other chambers connected to the transfer chamber, such as a load lock chamber, and as a result, gaseous impurities may be introduced into the transfer chamber. Further, opening the doors of various chambers or components may allow gas to flow into the transfer chamber. In selective epitaxial growth of an epitaxial layer, including under atmospheric pressure, the presence of gaseous impurities such as moisture or oxygen can cause defects in the substrate and structures formed on or within the substrate.

[0003] Therefore, there is a need for an improved method, apparatus, and system that uses a transfer chamber (e.g., with respect to atmospheric pressure epitaxial deposition) to facilitate the reduction or removal of gaseous impurities from the transfer chamber (e.g., during preparation for substrate processing after the transfer chamber has been exposed to ambient air).

Summary of the Invention

[0004] Embodiments of the present disclosure relate to apparatus, systems, and methods for using a transfer chamber. In one or more embodiments, gaseous impurities (e.g., moisture and oxygen) are reduced within or removed from the transfer chamber in preparation for substrate processing, for example, after the transfer chamber has been exposed to ambient air (e.g., ambient air).

[0005] In one embodiment, a method for processing a substrate includes receiving user input via a user interface instructing a substrate processing system to perform a service recovery process for a transfer chamber according to a set of parameters including a reference pressure and a backfill pressure. The method also includes, for each cycle of a certain number of exhaust-purge cycles, operating a vacuum pump according to the reference pressure in the transfer chamber to reduce the amount of gas in the transfer chamber. The method also includes, for each cycle of a certain number of exhaust-purge cycles and after operating the vacuum pump, introducing purge gas into the transfer chamber according to the backfill pressure. The method also includes, after a certain number of cycles have been completed, introducing purge gas into the transfer chamber until a threshold pressure is met. The method also includes displaying an indication via the user interface that the service recovery process for the transfer chamber is complete.

[0006] In one embodiment, the substrate processing system includes a transfer chamber, one or more load lock chambers, a vacuum pump fluidically connected to one or more load lock chambers, a user interface, and a controller connected to the user interface and the vacuum pump. The controller is configured to receive user input via the user interface instructing the substrate processing system to perform a service recovery process for the transfer chamber according to a set of parameters including a reference pressure and a backfill pressure. The controller is also configured to operate the vacuum pump according to the reference pressure in the transfer chamber to reduce the amount of gas in the transfer chamber for each cycle of a certain number of exhaust-purge cycles. The controller is also configured to guide the purge gas into the transfer chamber according to the backfill pressure for each cycle of a certain number of exhaust-purge cycles and after the vacuum pump has been operated. The controller is also configured to guide the purge gas into the transfer chamber until a threshold pressure is met after a certain number of cycles have been completed. The controller is also configured to display an indication via the user interface that the service recovery process for the transfer chamber has been completed.

[0007] In one embodiment, a non-transient computer-readable medium for performing a service recovery process for a transfer chamber of a substrate processing system includes a command, which, when executed, causes a plurality of actions to be performed. The plurality of actions include receiving user input via a user interface instructing the substrate processing system to perform a service recovery process for the transfer chamber according to a set of parameters including a reference pressure and a backfill pressure. The plurality of actions also include, for each cycle of a certain number of exhaust-purge cycles, operating a vacuum pump according to the reference pressure in the transfer chamber to reduce the amount of gas in the transfer chamber. The plurality of actions also include, for each cycle of a certain number of exhaust-purge cycles and after operating the vacuum pump, introducing purge gas into the transfer chamber according to the backfill pressure. The plurality of actions also include, after a certain number of cycles have been completed, introducing purge gas into the transfer chamber until a threshold pressure is met. The plurality of actions also include displaying an indication via the user interface that the service recovery process for the transfer chamber has been completed.

[0008] To provide a more detailed understanding of the features of this disclosure described above, a more specific description of this disclosure, which has been briefly summarized above, can be provided by reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that this disclosure may also permit other equally valid embodiments, and therefore the accompanying drawings only illustrate common embodiments of this disclosure and should not be considered to limit the scope of this disclosure. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram of a system for processing substrates according to one embodiment. [Figure 2] This is a schematic diagram of a method using a transfer chamber in a substrate processing system according to one embodiment. [Figure 3] This is a schematic diagram of a substrate processing system according to one embodiment. [Figure 4] This is a schematic diagram of a substrate processing system according to one embodiment. Forms for carrying out the invention

[0010] For ease of understanding, the same reference numerals have been used to indicate identical elements common to the figures where possible. Elements disclosed in one embodiment are intended to be usefully utilized in other embodiments, even without specific description.

[0011] Embodiments of the present disclosure relate to apparatus, systems, and methods for using a transfer chamber (for example, with respect to an atmospheric pressure epitaxial deposition chamber). In one or more embodiments, for example, during preparation for substrate processing after the transfer chamber has been exposed to ambient air, gaseous impurities (e.g., moisture and oxygen) are reduced within or removed from the transfer chamber. In one or more embodiments, the transfer chamber is exposed to one or more atmospheric conditions for at least a portion of the time.

[0012] Under atmospheric pressure processing chamber conditions, reducing or eliminating the amount of gaseous impurities (e.g., oxygen or moisture) present during the deposition process is beneficial to facilitate the production of superior epitaxial layers on substrates such as silicon substrates. Therefore, reducing or eliminating traces of oxygen or moisture from the substrate processing system (such as a system including an epitaxial processing chamber) is advantageous. Possible ways in which oxygen or moisture may enter the deposition chamber include, for example, leakage within the chamber itself, contaminated substrates, very short pump-out times (e.g., insufficient time to reduce oxygen levels, moisture, or both) into the transfer chamber (sometimes referred to as the "inert" part of the machine), and the presence of oxygen within the inert region of the machine. Opening the door of the system can also result in oxygen or moisture flowing into the transfer chamber.

[0013] A transfer chamber used for atmospheric pressure epitaxial deposition can be continuously or periodically purged with a predetermined or set amount (e.g., 45 liters per minute) of purge gas (e.g., nitrogen, hydrogen, and / or argon) to maintain the inert state of the transfer chamber. The transfer chamber does not need to be directly connected to a vacuum pump and can be configured as an atmospheric pressure component of an atmospheric pressure epitaxial (substrate) processing system. For example, a vacuum pump may be fluidly connected to a load lock chamber which is part of the system.

[0014] For preventative and corrective maintenance work, the lid of the transfer chamber may be opened frequently to access internal components, such as the transfer robot or slit valve. When the lid of the transfer chamber is opened, ambient air may enter the transfer chamber.

[0015] When maintenance work is completed, the transfer chamber lid is closed again, and it is possible to check for leaks. However, certain operations (even using 45 liters per minute of purge gas such as nitrogen) may not be sufficient to create an oxygen-free or substantially oxygen-free environment (e.g., below-threshold oxygen levels) inside the transfer chamber after the lid is opened and closed again. In such cases, if substrate processing is started immediately after or shortly after the maintenance work on the transfer chamber is completed, oxygen contamination problems may occur as a result. Such operations can result in processing delays and reduced throughput. These effects include high defect levels in the substrates and contaminants inside the epitaxial deposition chamber (e.g., so-called "spider webs"). "Spider webs" are small threads of quartz SiO2 that can form on the upper surface of the processing chamber, for example, from the upper window of the processing chamber and hang down from there.

[0016] Furthermore, the transfer chamber may not be able to be vented, or the method of dealing with impurities may be complex, time-consuming, and / or have a high rate of errors or failures. For example, the user may forget to close certain components (such as doors or valves) that affect impurities in the transfer chamber. For instance, ambient air, dust, and / or moisture may enter the transfer chamber. Another example is when the user opens and closes components very quickly and / or very slowly, which can cause leakage within the transfer chamber and / or affect the impurities inside.

[0017] A service recovery process (also referred to as a service recovery macro) for the transfer chamber of a substrate processing system operating for atmospheric pressure epitaxial deposition can more quickly, safely, and reliably restore the transfer chamber to a serviceable state after it has been exposed to ambient air. The service recovery process may be performed according to a set of parameters, including a reference pressure and a reverse filling pressure.

[0018] To use the transfer chamber, the substrate processing system may receive user input instructing it to perform a service recovery process for the transfer chamber according to a set of parameters including a reference pressure and a reverse filling pressure. The service recovery process includes, for each cycle of a certain number of exhaust-purge cycles, operating a vacuum pump according to the reference pressure to reduce the amount of gas in the transfer chamber. The service recovery process also includes, for each cycle of a certain number of exhaust-purge cycles and after operating the vacuum pump, introducing purge gas into the transfer chamber according to the reverse filling pressure. The service recovery process also includes, after a certain number of cycles have been completed, introducing purge gas into the transfer chamber until a threshold pressure is met. After the service recovery process, an indication that the service recovery process for the transfer chamber is complete may be displayed via the user interface.

[0019] The set of parameters may include one or more of the following: switching point pressure, base time, load lock chamber selection, or the number of pump-purge cycles within the scope of the service recovery process. The switching point pressure may derive from the operation of the vacuum pump according to the low-speed rough pump-high-speed rough pump for the load lock chamber. The base time duration may be the time at which the vacuum pump operates once the base pressure is reached. Load lock chamber selection may indicate which load lock chamber to use to pump the transfer chamber when multiple load lock chambers are present. The quantity of pump-purge cycles may be the number of repetitions (cycles) of a particular operation within the scope of the service recovery process. For example, the service recovery process may include applying the vacuum pump (directly or indirectly) to the transfer chamber, and then in a subsequent operation, introducing a purge gas (e.g., N2 or H2) into the transfer chamber to increase the pressure inside the transfer chamber. The two operations described above can be part of a single cycle, and the operations of that single cycle can be repeated (cycled) according to the number of pump-purge cycles.

[0020] In one or more embodiments, a user can give a single instruction for a service recovery process to be performed, for example, by clicking once to start and perform a service recovery process. In one or more embodiments, values ​​for one or more parameters of a set of parameters, for example, predetermined or preset values, may be presented to the user via a user interface. The user may then instruct the service recovery process to proceed according to the above values. The user may select an alternative value, update the parameter value accordingly, and then instruct the service recovery process to proceed using the updated value. For example, the value associated with one of the parameters in the set of parameters may be updated, while the values ​​for the remaining parameters may remain at preset values.

[0021] Figure 1 is a schematic diagram of a system 100 for processing a substrate according to one embodiment. The system 100 includes a cluster tool 101. The cluster tool 101 of the system 100 includes one or more processing chambers, for example, an epitaxy chamber 102 and / or an etching chamber 103 (multiple processing chambers are shown) coupled to at least one transfer chamber 104.

[0022] A transfer chamber 104 is coupled to one or more epitaxy chambers 102. The transfer chamber 104 has a centrally located transfer robot 115 for transferring substrates between the epitaxy chambers 102, the etching chamber 103, and the load lock chamber 112. A factory interface 120 is connected to the transfer chamber 104 by the load lock chamber 112. On the side opposite the load lock chamber 112, the factory interface 120 is coupled to one or more pods 130. The pods 130 are typically front-opening unified pods (FOUPs) accessible from the cleanroom where the cluster tool 101 is located.

[0023] During operation, the substrate is transferred to one or more epitaxy chambers 102, where an epitaxial layer is selectively grown on the substrate. The substrate is then transferred to one or more etching chambers 103, where it is exposed to atomic hydrogen radicals to etch the substrate and remove nodules. The system 100 may include one or more annealing chambers, where the epitaxial layer formed on the substrate is annealed to an annealing temperature.

[0024] As described below, during operation, the transfer chamber 104 can be continuously or periodically purged with a purge gas (e.g., nitrogen, hydrogen, and / or argon), so that the transfer robot 115 can transfer substrates between all the processing chambers, the load lock chamber 112, the plurality of pass-through stations (if used), and / or their doors (e.g., slit valves) under an atmosphere of nitrogen, hydrogen, and / or argon. Transferring substrates under an atmosphere of nitrogen, hydrogen, and / or argon can reduce the possibility of contamination and promote improvement in the quality of the epitaxial film to be deposited. The present disclosure also contemplates that one or more of the chambers shown in the system 100 are not incorporated into the cluster tool 101. For example, one or both of the etching chambers 103 in the system 100 can be independent (not incorporated) from the cluster tool 101 having the epitaxy chamber 102.

[0025] In the embodiment shown in FIG. 1, the epitaxy chamber 102 and the etching chamber 103 are separate from each other. In one embodiment that can be combined with other embodiments, each processing chamber of the processing chambers such as the epitaxy chamber 102 and the etching chamber 103 is a single processing chamber. In such an embodiment, the epitaxy chamber 102 is two single processing chambers, and the etching chamber 103 is two single processing chambers.

[0026] System 100 includes a controller 150 configured to control the operation of the cluster tool 101. The controller 150 is connected to and controls the operation of the pod 130, the factory interface 120, the load lock chamber 112, the epitaxy chamber 102, the transfer chamber 104, the transfer robot 115, and the etching chamber 103. The controller 150 may be, for example, similar to the controller 301 described below. The controller 150 includes commands, which, when executed, cause the cluster tool 101 to perform one or more operations, as described with reference to Figure 1. In one embodiment, which can be combined with other embodiments, the controller 150 is a controller that includes commands for receiving user input via a user interface, which instructs the substrate processing system to perform a service recovery process of the transfer chamber according to a set of parameters. The set of parameters includes a reference pressure and a backfill pressure. The controller further includes commands for operating a vacuum pump according to the reference pressure of the transfer chamber to reduce the amount of gas in the transfer chamber for each cycle of a certain number of exhaust-purge cycles. The controller further includes commands for each cycle of a certain number of exhaust-purge cycles and after the vacuum pump has been activated to direct the purge gas into the transfer chamber according to the backfill pressure. The controller further includes commands for directing the purge gas into the transfer chamber after a certain number of cycles have been completed until a threshold pressure is met. The controller further includes commands to display an indication via the user interface that the service recovery process for the transfer chamber has been completed. System 100 includes one or more vacuum pumps 151 (or more vacuum pumps, etc.), one or more vacuum pumps 151 are fluidically connected to each load lock chamber 112 via their respective slow rough valves 154a, 154b and their respective fast rough valves 155a, 155b. System 100 includes one or more purge gas sources 153, one or more purge gas sources 153 are fluidically connected to each load lock chamber 112 via their respective purge valves 152a, 152b.

[0027] The above system includes one or more transfer pump valves 156 (which may or may not be fluidly connected to the same one or more vacuum pumps 151) and one or more transfer purge valves 157 (which may or may not be fluidly connected to the same one or more purge gas sources 153). The present disclosure contemplates that one or more transfer pump valves 156 and / or one or more transfer purge valves 157 may be omitted. The vacuum pump 151 shown in FIG. 1 can be incorporated into a single vacuum pump, and / or the purge gas source 153 shown in FIG. 1 can be incorporated into a single purge gas source.

[0028] Prior to the exhaust-purge cycle, the system 100 closes the transfer pump valve 156 (if used) and the transfer purge valve 157 (if used), and / or confirms that the transfer pump valve 156 (if used) and the transfer purge valve 157 (if used) are already closed. During the exhaust-purge cycle, gas is exhausted from the transfer chamber 104 through one or more load lock chambers 112, and purge gas is supplied into the transfer chamber 104 through one or more load lock chambers 112.

[0029] FIG. 2 is a schematic diagram of a method 200 of using a transfer chamber of a substrate processing system according to an embodiment. In one or more embodiments, the transfer chamber is the transfer chamber 104, and the substrate processing system may be the system 100 and / or the cluster tool 101, or may include the system 100 and / or the cluster tool 101.

[0030] Step 205 of Method 200 includes receiving user input instructing the substrate processing system to perform a service recovery process according to a set of parameters. The set of parameters may include a reference pressure and a backfill pressure. In one or more embodiments, the backfill pressure is a set of values ​​in the range of about 500 Torr to about 770 Torr, for example, a set of values ​​in the range of about 500 Torr to about 750 Torr. In one or more embodiments, the backfill pressure is about 760 Torr. In one or more embodiments, the backfill pressure is equal to atmospheric pressure or within a range of less than 20 Torr from atmospheric pressure. The reference pressure can be achieved in a transfer chamber, for example, using a vacuum pump. In one or more embodiments, the set of parameters may further include one or more of the following: an instruction for the number of exhaust-purge cycles, a switching point pressure for the vacuum pump, a reference period, or a load lock chamber selection (e.g., a selection of a load lock chamber through which exhaust is performed).

[0031] User input may be received via a user interface, as further described herein with reference to, for example, Figure 3 or Figure 4. In one or more embodiments, recommended values ​​for one or more parameters of a set of parameters for service recovery processing may be displayed via the user interface. In this case, the board processing system can receive instructions for user-selected values ​​for each of the one or more parameters via the user interface.

[0032] In one or more embodiments, user input is an instruction that the service recovery process of the transport chamber proceed according to a set of parameters pre-configured for the service recovery process (e.g., pre-configured by the system or pre-selected by the user). The user interface may display pre-configured values ​​for the set of parameters to the user, and the user may approve the pre-configured values ​​by instructing the service recovery process to proceed. In one or more embodiments, the user may be permitted to change the pre-configured values ​​for one or more (e.g., all) of the parameters in the parameter set. In one or more embodiments, the user interface may display the above values, but may not permit changes to one or more of the pre-configured values ​​or all of those values. In one or more embodiments, the user interface may not display the pre-configured values, and the user may choose to proceed, but may not select or validate the pre-configured values. The pre-configured values ​​may also be changed or updated by other mechanisms, for example, by the manufacturer of the substrate processing system, through local or remote software or firmware updates.

[0033] In one or more embodiments, the service recovery process may include a check to verify that the load lock chamber is in a suitable state to provide or give exhaust functionality in accordance with the service recovery process. If the substrate processing system includes two or more load lock chambers, the above check can verify that one or more, or all, of the load lock chambers, including the load lock chamber that provides exhaust functionality, are in a suitable state. In one or more embodiments, the set of parameters may further include load lock chamber selection. In such embodiments, method 200 may further include the step of selecting to open a first slow rough valve from a first slow rough valve and a second slow rough valve, depending on the load lock chamber selection, the first slow rough valve fluidly connects a vacuum pump to a first load lock chamber fluidly connected to a transfer chamber, and the second slow rough valve fluidly connects a vacuum pump to a second load lock chamber fluidly connected to a transfer chamber. The step of selecting to open a slow rough valve may be performed before step 210. The step of selecting to open the low-speed rough valve can also be performed once and may be separate from the repeated operation for each exhaust-purge cycle according to step 220. In one or more embodiments, a value for load lock chamber selection may be obtained from the user via a user interface. In other embodiments, the value for load lock chamber selection may be preset.

[0034] In one or more embodiments, the service recovery process may further include opening a slit valve in a load lock chamber, which includes a load lock chamber that provides an exhaust function, closing any open purge or exhaust valves in a transfer chamber, or ensuring that all purge and exhaust valves are closed. The method then further includes opening a slow-speed rough valve in a load lock chamber, the slow-speed rough valve providing a fluid connection between the vacuum pump and the load lock chamber.

[0035] Step 210 of Method 200 includes operating a vacuum pump to reduce the amount of gas in the transfer chamber according to a reference pressure (specified as described in Step 205). The reference pressure is a target pressure, which is the target pressure to which the transfer chamber should be evacuated during the service recovery process to drop. The reference pressure may be a maximum pressure, which is the maximum pressure below which the transfer chamber should be maintained for a certain period (e.g., a pump reference period) as part of the evacuation-purge cycle. In one or more embodiments, the reference pressure may be set to a value of about 0.1 Torr to about 200 Torr, for example, from about 5 Torr to about 30 Torr.

[0036] In one or more embodiments, the set of parameters may further include a switching point pressure. The method may optionally include ordering the opening of a slow-speed rough valve, then operating a vacuum pump through the slow-speed rough valve to remove gas from the transfer chamber, and then ordering the opening of a fast-speed rough valve after confirming that the switching point pressure is met. The vacuum pump may operate to pump down the transfer chamber (directly or indirectly through one or more other chambers of the substrate processing system) through two or more stages, including through the slow-speed rough valve and the fast-speed rough valve. The switching point may be the pressure at which the vacuum pump switches from pumping the transfer chamber through the slow-speed rough valve to pumping the transfer chamber through the fast-speed rough valve, or pumping the transfer chamber through both the slow-speed and fast-speed rough valves. In one or more examples, the switching point may be a value set in the range of about 150 Torr to 250 Torr, for example, in the range of 180 Torr to 220 Torr. In one or more examples, the switching point may be about 200 Torr. In one or more examples, the reference pressure is lower than the switching point.

[0037] In one or more embodiments, the set of parameters may include a reference period. Step 210 may include operating the vacuum pump according to a reference pressure for at least a reference period (which may be referred to as the "pump at base time"). The reference period may correspond to the time during which the vacuum pump is operated during the service recovery process after the reference pressure has been reached. In this case, the method may include ordering the purge valve to be opened after the reference period to allow the purge gas into the transfer chamber. In one or more embodiments, the reference period is at least 5 seconds. In one or more embodiments, the base period is longer than 5 seconds, for example, in minutes, such as 1 minute or longer.

[0038] Step 215 of Method 200 includes introducing a purge gas into the transfer chamber according to the backfill pressure. In one or more embodiments, after exhaustion at a reference pressure for a reference time has been completed (after the reference period has been completed), step 215 includes opening the purge valve of the transfer chamber and backfilling the transfer chamber and load lock chamber with the purge gas until the backfill pressure (backfill pressure setpoint) of the set of parameters described above is reached. The purge gas may be, for example, nitrogen, hydrogen, and / or argon. In one or more embodiments, the purge gas is at least 99.9% nitrogen, at least 99.9% hydrogen, or at least 99.9% argon by atomic percentage. In one or more embodiments, the purge gas is at least 99.9999% nitrogen, at least 99.9999% hydrogen, or at least 99.9999% argon by atomic percentage.

[0039] Step 220 optionally includes returning a step for each cycle of a certain number of exhaust-purge cycles, each cycle including, for example, steps 210 and 215. The exhaust-purge cycle routine (including, for example, steps 210 and 215) can be restarted by the user via the user interface (which may also be referred to as the service screen) a number of times selected for the number of exhaust-purge cycles (for example, displayed as "Number of Cycles" on the service screen of the user interface). The number of exhaust-purge cycles may be one or more and may also be referred to as a set of cycles. In embodiments where the number of exhaust-purge cycles is one, method 200 may proceed directly from step 215 to step 225. In one or more embodiments, steps 210, 215 are performed and / or repeated until the impurity level of impurities (such as oxygen) in the transfer chamber drops to less than 0.1 ppm. In one or more embodiments, steps 210, 215 are performed at least twice.

[0040] Step 225 of Method 200 includes introducing purge gas into the transfer chamber until a threshold pressure is met. Step 225 may be performed following step 215. Optionally, step 225 may be performed after the completion of a certain number of cycles according to step 220. Once the last cycle is complete, backfilling of the transfer chamber continues until the current atmospheric pressure exceeds the threshold pressure, after which the atmospheric exhaust valve of the transfer chamber is opened and the introduction of purge gas into the transfer chamber continues (the supply of purge gas remains on). In one or more embodiments, the threshold pressure is approximately 5 Torr to approximately 20 Torr, e.g., 10 Torr, or at least 5 Torr. As further described herein, the purge gas may be nitrogen, hydrogen, and / or argon.

[0041] The purge gas supply remains on, a service recovery process (service routine) is executed, and the slit valve between the transfer chamber and the load lock chamber is closed.

[0042] Step 230 of Method 200 includes displaying an indication that the service recovery process for the transfer chamber is complete. The indication that the service recovery process is complete may be displayed via a user interface.

[0043] In one or more embodiments, method 200 may include receiving a signal from an oxygen sensor indicating the impurity level (e.g., oxygen level) in the transfer chamber. In one or more embodiments, an oxygen sensor (e.g., oxygen sensor 105) may be mounted in the transfer chamber to directly measure the oxygen level in the internal space within the transfer chamber. In one or more embodiments, the oxygen sensor may be mounted in different chambers of the substrate processing system, for example, in one of the epitaxy chamber 102, the etching chamber 103, and / or the load lock chamber 112. The number of exhaust-purge cycles may be based on the signal indicating the impurity level in the transfer chamber. For example, an impurity level threshold may be set, and when the oxygen level threshold is met according to the signal from the oxygen sensor, the exhaust-purge cycle cycling can be completed, thereby the number of exhaust-purge cycles corresponding to the number of exhaust-purge cycles performed for the oxygen level to reach the oxygen level threshold.

[0044] In one embodiment, which can be combined with other embodiments, a non-transient computer-readable medium includes instructions, which, when executed, cause the system to perform one or more steps of method 200, e.g., 205, 210, 215, 220, 225, and / or 230. In one embodiment, which can be combined with other embodiments, the non-transient computer-readable medium is part of a controller.

[0045] Figure 3 is a schematic diagram of a substrate processing system 300 having a transfer chamber according to one embodiment. The substrate processing system 300 may include one or more components of the system 100, including a cluster tool 101 which includes a transfer chamber 104 including an optional oxygen sensor 105 and at least one load lock chamber 112. The substrate processing system 300 may also include one or more vacuum pumps 151 fluidly connected to the cluster tool 101. In one or more embodiments, one or more vacuum pumps 151 are fluidly connected to at least one load lock chamber 112 of the cluster tool 101. The components of the substrate processing system 300 can communicate with and be controlled by a controller 301.

[0046] In one embodiment, the controller 301 includes a central processing unit (CPU) 315, a memory 320, and a support circuit 310, which may be connected for communication. The memory 320 is a non-transient computer-readable medium, such as a controller 150 (shown in Figure 1), which may be connected for communication. The non-transient computer-readable medium may contain instructions for performing a method using the transfer chamber of the substrate processing system, as further described herein with reference to method 200 in Figure 2, for example. The memory 320 may contain instructions, which may be executed by the CPU 315. The substrate processing system 300 also includes a controller 150 (shown in Figure 1) connected to the substrate processing system 300 to control the operation of the substrate processing system 300.

[0047] The controller 301 may be communicatively connected to a user interface 302. The user interface 302 may allow the user to give instructions that the service recovery process of the transport chamber 104 proceed according to a set of parameters for said service recovery process. This disclosure assumes that the user interface 302 may be part of the controller 301. As described above and below, the set of parameters may be pre-configured or specified by the user.

[0048] In one or more embodiments, the user interface 302 may provide an interface for obtaining user input via the execution element 325 (buttons, interfaces, commands) that instructs the transfer chamber service recovery process to proceed according to a set of parameters pre-configured for the service recovery process. As further described herein, the set of parameters may include one or more of the following: reference pressure, reverse filling pressure, number of exhaust-purge cycles, switching point pressure, reference period, and / or load lock chamber selection.

[0049] The user interface can display pre-configured values ​​for a set of parameters to the user, and the user can approve the pre-configured values ​​by instructing the service recovery process to proceed. In one or more embodiments, the user can instruct the service recovery process to proceed by selecting the execution element 325, in which case the service recovery process may proceed as described herein, for example, according to method 200 described with reference to Figure 2. Once the service recovery process is completed, the completion element 330 can display an indication that the process is complete via the user interface 302.

[0050] In one or more embodiments, the user interface may display to the user pre-set values ​​for a set of parameters, and the pre-set values ​​for one or more parameters in the set of parameters may be changeable by the user. In one or more embodiments, the user interface may display the above values, but may not allow changes to one or more of the pre-set values ​​or all of them. In one or more embodiments, the user interface may not display the pre-set values, and the user may choose to proceed, but may not select or verify the pre-set values. The pre-set values ​​may also be changed or updated by other mechanisms, for example, by the manufacturer of the substrate processing system, through local or remote software or firmware updates.

[0051] Figure 4 shows a schematic diagram of a substrate processing system 400 having a transfer chamber according to one embodiment. The substrate processing system 400 may include one or more components of a system 100 including a transfer chamber 104 including an optional oxygen sensor 105 and a cluster tool 101 including at least one load lock chamber 112, a substrate processing system 300 including one or more vacuum pumps 151, a CPU 315, a memory 320, a support circuit 310, and a user interface 402.

[0052] In one or more embodiments, the substrate processing system 400 may provide a user interface 402 for obtaining user input and displaying information to the user in connection with the service recovery process of the transfer chamber. In one or more embodiments, the user interface 402 includes a start element 324 (button, interface, command) and an execution element 325 that instructs to proceed with the service recovery process of the transfer chamber. In one or more embodiments, a window 410 is displayed in response to the user selecting the start element 324. After the user selects one or more parameter elements 425-450 in the window 410 and / or the user selects an execution element 325, the system automatically executes method 200 according to one or more parameters. In one or more embodiments, each parameter element 425-450 includes an fillable box and / or a drop-down menu, and the user can specify the parameter by filling in the respective fillable box or selecting a certain option from the respective drop-down menu.

[0053] Once the service recovery process is completed, the completion element 330 can display an indication via the user interface 402 that the process is complete. As further described herein, the set of parameters may include one or more of the following: reference pressure, reverse filling pressure, number of exhaust-purge cycles, switching point pressure, reference period, or load lock chamber selection.

[0054] The start element 324 may be displayed before the window 410 and the execution element 325 are displayed. The execution element 325 may be displayed while the window 410 is displayed, after the window 410 is displayed, and / or may be displayed on the user interface as part of the window 410. The completion element 330 may be displayed on the user interface after the window 410 and / or the execution element 325 have been displayed, and / or after the window 410 and / or the execution element 325 have been closed from the user interface.

[0055] In one or more embodiments, the user interface 402 may display to the user preset values, default values, or recommended values ​​for a set of parameters. In one or more embodiments, the user interface 402 may include one or more of the following: a reference pressure element 425, an exhaust reference time element 430, a load lock selection element 435, an exhaust-purge cycle count element 440, a reverse filling pressure element 445, or a switching point element 450, which may display the reference pressure value, exhaust reference time, load lock selection, exhaust-purge cycle count, reverse filling pressure, or switching point, respectively. In one or more embodiments, values ​​for one or more parameters of the set of parameters may be displayed to the user but may not be changeable by the user via the user interface.

[0056] In other embodiments, the values ​​for one or more parameters of a set of parameters may be changeable by the user. Default or recommended values ​​may be displayed to the user, and the user interface may allow the user to change the values. In one or more embodiments, preset values ​​may be changeable by the user, for example, by filling in an fillable box or selecting an option from a drop-down menu. For example, the reference pressure may be displayed as 1 Torr, and the user may change it to another value via the reference pressure element 425 of the user interface. As another example, the switching point may be displayed as approximately 200 Torr, and the user may change it to another value via the switching point element 450 of the user interface.

[0057] In one or more embodiments, each value may be restricted to a range of values ​​selected by the user. For example, the reference pressure may be displayed as approximately 1 Torr and can be changed by the user via the reference pressure element 425 of the user interface to a value in the range of 0.1 Torr to approximately 200 Torr. As another example, the switching point may be displayed as 200 Torr and can be changed by the user via the switching point element 450 of the user interface to another value, i.e., can be changed by the user via the switching point component 450 of the user interface to a value in the range of 150 Torr to 250 Torr.

[0058] In one or more embodiments, machine learning or artificial intelligence may be used to determine values ​​for one or more parameters of a set of parameters. For example, the controller 301 may further include a machine learning model that is being trained or to be trained according to a set of training data. The input training data may include signaling from an oxygen sensor 105 corresponding to the oxygen level or content of the transport chamber, signaling from one or more pressure sensors of the cluster tool 101 (e.g., pressure sensors of the transport chamber 104), and values ​​for one or more parameters of a set of parameters. For example, one or more machine learning algorithms and / or one or more artificial intelligence algorithms may be used to optimize selected parameters and / or preset parameters. One or more machine learning algorithms and / or one or more artificial intelligence algorithms may use linear regression models and / or averaging schemes. Method 200 may be performed partially automatically (e.g., by user input) and / or fully automatically (e.g., without user input).

[0059] In one or more embodiments, a user can perform a service recovery cycle as part of the process of preparing the substrate processing system, including the transfer chamber, for use. While the service recovery cycle is being performed, oxygen levels, pressure, and associated time, as well as one or more parameter values, may be input to a machine learning model. The machine learning model may output values ​​for one or more parameters of the set of parameters, which may be used in subsequent service recovery processes. For example, the machine learning model may output a value for an exhaust reference time parameter, and the exhaust reference time element 430 of the controller 301 may then use this value during the service recovery process.

[0060] The benefits of this disclosure include eliminating or removing traces of oxygen or moisture from the substrate processing system, including the system's transfer chamber, within a reduced timeline. The benefits also further include reduced machine downtime, reduced processing time, improved throughput, reduced substrate defects, and reduced or elimination of errors and / or failures in impurity reduction.

[0061] It is intended that the subject matter of the various inventions disclosed herein may be combined. For example, one or more aspects, features, components, operations, and / or characteristics of System 100, Method 200, Substrate Processing System 300, and / or Substrate Processing System 400 may be combined. Furthermore, it is intended that the subject matter of the various inventions disclosed herein may include some or all of the aforementioned advantages.

[0062] While the descriptions in the prior specification cover embodiments of the present disclosure, other embodiments and further embodiments of the present disclosure can be devised without departing from the fundamental scope of the present disclosure. The present disclosure is also intended to allow one or more aspects of the embodiments described herein to be replaced by one or more other aspects described herein. The scope of the present disclosure is defined by the following claims.

Claims

1. A method using a transfer chamber of a substrate processing system, The substrate processing system receives user input via a user interface instructing it to perform a service recovery process for the transfer chamber according to a set of parameters including a reference pressure and a reverse filling pressure. For each cycle of a certain number of exhaust-purge cycles, in order to reduce the amount of gas in the transfer chamber, the vacuum pump is operated according to the reference pressure in the transfer chamber, For each cycle of the aforementioned number of exhaust-purge cycles, and after the vacuum pump has been activated, the purge gas is guided to the transfer chamber according to the reverse filling pressure. After a certain number of cycles have been completed, the purge gas is introduced into the transfer chamber until the threshold pressure is met. The user interface displays an instruction indicating that the service recovery process of the transfer chamber has been completed. Methods that include...

2. The user interface displays recommended values ​​for one or more parameters of the set of parameters for the service recovery process. The user interface receives instructions for user-selected values ​​for one or more parameters, The method according to claim 1, further comprising:

3. The method according to claim 1, wherein the user input includes an instruction that the service recovery process of the transport chamber proceeds according to the set of parameters pre-configured for the service recovery process.

4. The set of parameters further includes the switching point pressure, and the service recovery process is To instruct the low-speed rough valve to open, To remove gas from the transfer chamber, the vacuum pump is operated via the low-speed rough valve, and after confirming that the switching point pressure is met, the high-speed rough valve is ordered to be opened. The method according to claim 1, further comprising:

5. The set of parameters further includes a reference period, and the service recovery process is Operating the vacuum pump for at least the reference period, at least in part, based on operating the vacuum pump according to the reference pressure, After the aforementioned reference period, the purge valve is ordered to be opened to guide the purge gas into the transfer chamber, The method according to claim 1, further comprising:

6. The set of parameters further includes load lock chamber selection, and the service recovery process is In accordance with the selection of the load lock chamber, the selection is made to open the first low-speed rough valve from the first low-speed rough valve and the second low-speed rough valve, wherein the first low-speed rough valve fluidly connects the vacuum pump to the first load lock chamber coupled to the transfer chamber, and the second low-speed rough valve fluidly connects the vacuum pump to the second load lock chamber coupled to the transfer chamber. The method according to claim 1, further comprising:

7. Receiving a signal from an oxygen sensor indicating the oxygen level in the transfer chamber, wherein the number of times the exhaust-purge cycle is performed is at least partially based on the signal indicating the oxygen level in the transfer chamber. The method according to claim 1, further comprising:

8. The method according to claim 1, wherein the purge gas contains at least 99.9999% nitrogen by atomic percentage, and the threshold pressure is at least 5 Torr greater than atmospheric pressure.

9. A substrate processing system, Transfer chamber and One or more load lock chambers, A vacuum pump fluidly connected to one or more load lock chambers, User interface and A controller connected to the user interface and the vacuum pump, The substrate processing system receives user input via the user interface instructing it to perform a service recovery process for the transfer chamber according to a set of parameters including a reference pressure and a reverse filling pressure, For each cycle of a certain number of exhaust-purge cycles, the vacuum pump is operated according to the reference pressure in the transfer chamber in order to reduce the amount of gas in the transfer chamber. For each cycle of the aforementioned number of exhaust-purge cycles, and after the vacuum pump has been activated, the purge gas is guided to the transfer chamber according to the reverse filling pressure. After a certain number of cycles have been completed, the purge gas is introduced into the transfer chamber until the threshold pressure is met. The user interface displays an instruction indicating that the service recovery process of the transfer chamber has been completed. A controller configured to perform the following actions: A substrate processing system equipped with the following features.

10. The aforementioned controller The user interface displays recommended values ​​for one or more parameters of the set of parameters for the service recovery process. The user interface receives instructions for user-selected values ​​for one or more parameters, The substrate processing system according to claim 9, further configured to perform the following:

11. The substrate processing system according to claim 9, wherein the user input includes an instruction that the service recovery process of the transfer chamber proceeds according to the set of parameters pre-configured for the service recovery process.

12. The aforementioned set of parameters further includes the switching point pressure, The substrate processing system is A low-speed rough valve between the vacuum pump and one or more load lock chambers, A high-speed rough valve between the vacuum pump and one or more load lock chambers, Furthermore, The aforementioned controller, To instruct the opening of the aforementioned low-speed rough valve, To remove gas from the transfer chamber, the vacuum pump is operated via the low-speed rough valve, and after confirming that the switching point pressure is met, the high-speed rough valve is ordered to be opened. The substrate processing system according to claim 9, further configured to perform the following:

13. The aforementioned set of parameters further includes a reference period, The substrate processing system further comprises a purge valve that fluidly connects one or more load lock chambers to the purge gas supply source. The aforementioned controller, Operating the vacuum pump for at least the reference period, at least in part, based on operating the vacuum pump according to the reference pressure, After the aforementioned reference period, the purge valve is ordered to be opened in order to guide the purge gas from the source of the purge gas through one or more load lock chambers to the transfer chamber. The substrate processing system according to claim 9, further configured to perform the following:

14. The aforementioned set of parameters further includes load lock chamber selection, The one or more load lock chambers described above are A first load lock chamber coupled to the transfer chamber, A first low-speed rough valve fluidly connects the vacuum pump to the first load lock chamber, A second load lock chamber coupled to the transfer chamber, A second low-speed rough valve fluidly connects the vacuum pump to the first load lock chamber, Includes, The substrate processing system according to claim 9, wherein the controller is further configured to select from the first low-speed rough valve to open the second low-speed rough valve in response to the selection of the load lock chamber.

15. The substrate processing system further comprises an oxygen sensor connected to the transfer chamber, The aforementioned controller, The oxygen sensor receives a signal indicating the oxygen level in the transfer chamber, Determining a certain number of exhaust-purge cycles based at least partially on the oxygen level, The substrate processing system according to claim 9, further configured to perform the following:

16. A non-transient computer-readable medium for performing service recovery processing for a transfer chamber of a substrate processing system, comprising instructions, the instructions, when executed, causing a plurality of operations, The substrate processing system receives user input via a user interface instructing the system to perform the service recovery process for the transfer chamber according to a set of parameters including a reference pressure and a reverse filling pressure. For each cycle of a certain number of exhaust-purge cycles, in order to reduce the amount of gas in the transfer chamber, the vacuum pump is operated according to the reference pressure in the transfer chamber, For each cycle of the aforementioned number of exhaust-purge cycles, and after the vacuum pump has been activated, the purge gas is guided to the transfer chamber according to the reverse filling pressure. After a certain number of cycles have been completed, the purge gas is introduced into the transfer chamber until the threshold pressure is met. The user interface displays an instruction indicating that the service recovery process of the transfer chamber has been completed. Non-transient computer-readable media, including [specific examples of such media].

17. The aforementioned multiple operations are, The user interface displays recommended values ​​for one or more parameters of the set of parameters for the service recovery process. The user interface receives instructions for user-selected values ​​for one or more parameters, A non-transient computer-readable medium according to claim 16, further comprising:

18. The system according to claim 16, wherein the user input includes an instruction that the service recovery process of the transport chamber proceeds according to the set of parameters pre-configured for the service recovery process.

19. The set of parameters further includes the switching point pressure, and the plurality of operations are To instruct the low-speed rough valve to open, To remove gas from the transfer chamber, the vacuum pump is operated via the low-speed rough valve, and after confirming that the switching point pressure is met, the high-speed rough valve is ordered to be opened. A non-transient computer-readable medium according to claim 16, further comprising:

20. The set of parameters further includes a reference period, and the multiple operations are, Operating the vacuum pump for at least the reference period, at least in part, based on operating the vacuum pump according to the reference pressure, After the aforementioned reference period, the purge valve is ordered to be opened to allow the purge gas to pass through the load lock chamber to the transfer chamber, It further includes, The non-transient computer-readable medium according to claim 19, wherein the switching point pressure is 200 Torr, the reference pressure is less than 200 Torr, the reference period is at least 5 seconds, and the reverse filling pressure is in the range of 500 Torr to 770 Torr.

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