Structure for a light-emitting diode package with multiple light-emitting diode chips

Abstract

Disclosed are solid-state lighting devices including light-emitting diodes (LEDs), more specifically, structures for LED packages having multiple LED chips. The LED package structure includes an arrangement of one or more of the following: a body structure having multiple cavities for the LED chips; a encapsulant having lenses resisted in the multiple cavities; and a lead frame structure within at least a portion of the body structure. Disclosed are cavities and / or corresponding lenses of the body structure having a specific asymmetry configured to direct the highest intensity LED chip emission in a direction offset from the cavity center. Disclosed are body structures having one or more continuously flat surfaces, thereby improving the flexibility of the encapsulant and / or lead frame structure and improving resistance to moisture ingress. One or more combinations of asymmetry of the cavities and / or lenses may be implemented in combination with one or more continuous flat body surfaces.

Description

Technical Field

[0001]

[0001] This disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs), and more particularly, to a structure for an LED package including a plurality of LED chips.

Background Art

[0002]

[0002] Solid-state lighting devices such as light-emitting diodes (LEDs) are being used more and more in both consumer and commercial applications. Advancements in LED technology have enabled highly efficient, mechanically robust, and long-lasting light sources. Thus, modern LEDs are enabling a variety of new display applications and are increasingly being used for general lighting applications, often replacing incandescent and fluorescent light sources.

[0003]

[0003] An LED is a solid device that converts electrical energy into light and generally includes one or more active layers (or active regions) of semiconductor material disposed between oppositely doped n-type and p-type layers. When a bias is applied across the doped layers, holes and electrons are injected into one or more active layers where they recombine to produce light emission such as visible or ultraviolet light. An LED chip typically includes an active region that may be fabricated from, for example, silicon carbide, gallium nitride, gallium phosphide, aluminum nitride, gallium arsenide-based materials, and / or organic semiconductor materials. An LED package is a solid device that incorporates one or more LED chips into a packaged device. The LED chips may be encapsulated within a component package to provide environmental and / or mechanical protection, light focusing, etc.

[0004]

[0004] Currently, LEDs are used in large and small displays. Large, i.e., giant screen, LED displays are becoming more common in many indoor and outdoor locations, such as sports events, concerts, large public areas, etc. Depending on size, many of these displays can include thousands of "pixels" mounted on a flat surface to generate an image, and each pixel contains multiple LEDs. Since these pixels can use high-efficiency and high-brightness LEDs, the display can be viewed relatively far away even during the day when sunlight is hitting it. The pixels have only three or four LEDs (one red, one green, one blue), and the pixels can emit many different colors of light from combinations of red, green, and blue light. In the largest screens, pixel modules may be arranged together to form the display, and each pixel module can have three or more LEDs, and in some cases, dozens of LEDs. Some large LED displays are arranged for wide-angle or wide-pitch emission to achieve a wide lateral range of viewing angle. The pixels of conventional LED displays can be formed by individually packaged and assembled individual LED chips close to each other, or each pixel can also be formed by an LED package containing multiple LED chips.

Summary of the Invention

Problems to be Solved by the Invention

[0005]

[0005] In the art, there is a need for improved LEDs and solid-state lighting devices that can provide desirable lighting characteristics, improving light output and luminous efficiency without compromising the manufacturability and reliability of such devices, and at the same time overcoming the problems associated with conventional lighting devices.

Means for Solving the Problems

[0006]

[0006] This disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs), and more specifically to structures for LED packages having a plurality of LED chips. The LED package structure includes an arrangement of one or more of a body structure having a plurality of cavities for LED chips, an encapsulant having lenses registered with the plurality of cavities, and a lead frame structure within at least a portion of the body structure. Disclosed are cavities and / or corresponding lenses of the body structure having a specific asymmetry configured to direct the highest intensity LED chip emission in a direction offset from the cavity center. Disclosed are body structures having one or more continuously planar surfaces, thereby improving the flexibility of the encapsulant and / or lead frame structure and improving resistance to moisture ingress. One or more combinations of asymmetry of the cavities and / or lenses may be implemented in combination with one or more continuously planar body surfaces.

[0007]

[0007] In one embodiment, the LED package comprises a body having a plurality of cavities on its top surface, the top surface being continuously flat between the opposite sides of the body surrounding the top surface; a lead frame structure having a separate pair of leads disposed within each of the plurality of cavities, each lead extending from one of the opposite sides so as to be accessible to the outside of the body; at least one LED chip electrically coupled to the lead frame structure within each of the plurality of cavities; and a encapsulant having a plurality of lenses on the top surface of the body. In a particular embodiment, the encapsulant has a flash portion extending between adjacent lenses of the plurality of lenses. In a particular embodiment, the flash portion extends on the top surface to a position within 1 millimeter (mm) of at least one of the sides of the body. In a particular embodiment, the thickness of the flash portion relative to the top surface is in the range of 0.1 mm to 0.5 mm. In a particular embodiment, the lens shape of each of the plurality of lenses is configured to direct the light emission of maximum intensity in a direction offset from the center of each cavity. In certain embodiments, the lens shape has only one line of symmetry. In certain embodiments, each cavity of a plurality of cavities comprises a cavity floor and a side wall extending between the top surface of the body and the cavity floor, the angle of the side wall relative to the cavity floor varying around at least one LED chip (perimeter). In certain embodiments, the angle of the side wall ranges from 5 to 25 degrees on one side of at least one LED chip and from 25 to 50 degrees on the opposite side of at least one LED chip. In certain embodiments, one or more sides of the body are continuously flat between the top surface and the bottom surface of the body. In certain embodiments, one or more sides are angled inward from the bottom surface towards the top surface.

[0008]

[0008] In another embodiment, the LED package comprises a body having a top surface, a bottom surface, and one or more sides bordering the top surface and the bottom surface, the body having a plurality of cavities formed on the top surface and one or more sides being continuously flat between the top surface and the bottom surface; a plurality of LED chips, each of the plurality of cavities comprising at least one LED chip from the plurality of LED chips; a plurality of leads electrically coupled to the plurality of LED chips, the plurality of leads extending outward from one or more sides of the body; and a sealing material forming a plurality of lenses on the top surface of the body. In a particular embodiment, some of the plurality of leads extending outward from one or more sides of the body are coplanar with the bottom surface of the body. In a particular embodiment, one or more sides are inclined inward from the bottom surface toward the top surface. In a particular embodiment, a separate lens from the plurality of lenses is resisted in a separate cavity from the plurality of cavities. In certain embodiments, the lens shape of each distinct lens of the plurality of lenses is configured to direct the emission of maximum intensity in a direction offset from the center of each cavity. In certain embodiments, the lens shape has only one line of symmetry. In certain embodiments, the sealant includes a flash portion extending between adjacent lenses of the plurality of lenses. In certain embodiments, the top surface is continuously flat between the opposite sides of the body surrounding the top surface, and the flash portion extends on the top surface to a position within 1 mm of the opposite side of the body. In certain embodiments, each cavity of the plurality of cavities includes a cavity floor and a side wall extending between the top surface of the body and the cavity floor, and the angle of the side wall relative to each cavity floor varies around each cavity. In certain embodiments, the body forms a rectangle with long and short sides, the plurality of cavities are arranged linearly in the direction corresponding to the long side, and each cavity of the plurality of cavities has a single line of symmetry directed parallel to the long side.

[0009]

[0009] In other embodiments, further advantages can be obtained by combining any of the embodiments described herein individually or together, and / or by combining various distinct embodiments and features described herein. Any of the various features and elements disclosed herein may be combined with one or more other disclosed features and elements unless otherwise indicated herein.

[0010]

[0010] Those skilled in the art will understand the scope of the present disclosure and realize additional embodiments after reading the following detailed description of preferred embodiments in conjunction with the attached drawings.

[0011] The accompanying drawings incorporated herein and forming part thereof illustrate several aspects of this disclosure and, together with the description, are useful in illustrating the principles of this disclosure. [Brief explanation of the drawing]

[0011] [Figure 1A]

[0012] This is a top perspective view of a light-emitting diode (LED) package according to an embodiment disclosed herein. [Figure 1B]

[0013] Figure 1A is a top perspective view of the LED package with added encapsulant. [Figure 1C]

[0014] Figure 1A is a top view of the LED package with LED chips added to each cavity. [Figure 1D]

[0015] This is a top view of a portion of the LED package in Figure 1C, including the cavity. [Figure 1E]

[0016] Figure 1D is a partial cross-sectional view of an LED package illustrating the difference in side wall angles. [Figure 1F]

[0017] Figure 1C is a side view of the LED package with the encapsulant and lens added. [Figure 2]

[0018] This is a top view of an LED package similar to the LED package in Figure 1C, except that the LED chips in each cavity are positioned closer to the first sidewall than to the second sidewall. [Figure 3]

[0019] This is a top view of an LED package similar to the LED package in Figure 2, except that the LED chips in each cavity are positioned closer to the second sidewall than to the first sidewall. [Figure 4]

[0020] This is a top view of an LED package similar to the LED package in Figure 2, except that the LED chips in each cavity are variably positioned relative to the second sidewall rather than the first sidewall. [Figure 5]

[0021] This is a top view of an LED package similar to the LED package in Figure 1C, but with a modified lead arrangement. [Figure 6A]

[0022] This is a top perspective view of an LED package similar to the LED package in Figure 1A, but without the main mesa shown in Figure 1A. [Figure 6B]

[0023] Figure 6A is a top view of the LED package with LED chips added to each cavity. [Figure 6C]

[0024] Figure 6B is a bottom view of the LED package. [Figure 6D]

[0025] Figure 6B shows the end view of the LED package, aligned with the shorter side, or width, of the LED package. [Figure 6E]

[0026] Figure 6B is a side view of the LED package, aligned with the longer side, or length, of the LED package. [Figure 7]

[0027] Figure 6A is a top perspective view of an LED package with sealing material added along the top surface of the main body. [Figure 8]

[0028] This is a top perspective view of an LED package similar to the LED package in Figure 7, with a reduced thickness in the flash portion of the encapsulating material. [Figure 9]

[0029] This is a top perspective view of an LED package similar to the LED package in Figure 8, except that the flash portion is omitted. [Figure 10]

[0030] This is a top perspective view of an LED package similar to the LED package in Figure 7, having a lens shape similar to the LED packages in Figures 1B and 1F. [Figure 11]

[0031] This is a top perspective view of an LED package similar to the LED package in Figure 10, having a flash portion similar to the LED package in Figure 8. [Figure 12]

[0032] This is a top perspective view of an LED package similar to the LED package in Figure 11, but with the flash portion omitted, similar to the LED package in Figure 9. [Figure 13A]

[0033] This is a top perspective view of an LED package similar to the LED package in Figure 6A, in an embodiment where the side surface is continuously flat from the top surface to the bottom surface of the main body. [Figure 13B]

[0034] Figure 13A is a top view of the LED package with LED chips added to each cavity. [Figure 13C]

[0035] Figure 13B is a bottom view of the LED package. [Figure 13D]

[0036] Figure 13B is an end view of the LED package, aligned with the shorter side, or width, of the LED package. [Figure 13E]

[0037] This is an end view of the LED package shown in Figure 13B, similar to Figure 13D, where the main body is represented as semi-transparent. [Figure 13F]

[0038] Figure 13B is a side view of the LED package, aligned with the longer side, or length, of the LED package. [Figure 14]

[0039] Figure 13A is a top perspective view of an LED package with sealing material added along the top surface of the main body. [Figure 15]

[0040] This is a top perspective view of an LED package similar to the LED package in Figure 14, with a reduced thickness in the flash portion of the encapsulating material. [Figure 16]

[0041] This is a top perspective view of an LED package similar to the LED package in Figure 15, except that the flash portion is omitted. [Figure 17]

[0042] This is a top perspective view of an LED package similar to the LED package in Figure 14, having a lens shape similar to the LED package in Figure 10. [Figure 18]

[0043] This is a top perspective view of an LED package similar to the LED package in Figure 17, which has a flash portion similar to the LED package in Figure 15. [Figure 19]

[0044] This is a top perspective view of an LED package similar to the LED package in Figure 18, except that the flash portion is omitted. [Figure 20A]

[0045] This is similar to the LED packages in Figures 13A to 13F, and is a top perspective view of the LED package, which further includes the main mesa of the LED package in Figures 1A to 1F. [Figure 20B]

[0046] Figure 20A is a top view of the LED package with LED chips added to each cavity. [Figure 20C]

[0047] Figure 20B is a bottom view of the LED package. [Figure 20D]

[0048] Figure 20B is an end view of the LED package, aligned with the shorter side, or width, of the LED package. [Figure 20E]

[0049] Figure 20B is an end view of the LED package, similar to Figure 20D, where the main body is shown in a semi-transparent form. [Modes for carrying out the invention]

[0012]

[0050] The embodiments described below provide the information necessary to enable those skilled in the art to realize the embodiments and illustrate the best mode for realizing the embodiments. By reading the following description with reference to the accompanying drawings, those skilled in the art will understand the concepts of this disclosure and recognize applications of these concepts not specifically addressed herein. It should be understood that these concepts and applications are included within the scope of this disclosure and the accompanying claims.

[0013]

[0051] In this specification, terms such as "first," "second," etc., may be used to describe various elements, but it will be understood that these elements should not be limited by these terms. These terms are used solely to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be called a second element, and similarly, a second element may be called a first element. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant list items.

[0014]

[0052] When an element such as a layer, region, or substrate is described as being "on top of" another element, or extending "upwards" of another element, it will be understood that the element may be directly on top of the other element, or may extend directly onto the other element, or there may be an intervening element. In contrast, when an element is described as being "directly on top of" another element, or extending "directly upwards" of another element, there is no intervening element. Similarly, when an element such as a layer, region, or substrate is described as being "above" another element, or extending "upwards," it will be understood that the element may be directly above another element, or may extend directly onto the other element, or there may be an intervening element. In contrast, when an element is described as being "immediately above" another element, or extending "immediately above" another element, there is no intervening element. Furthermore, when an element is said to be “connected” or “joined” to another element, it will be understood that the element may be directly connected or joined to the other element, or there may be an intermediary element. In contrast, when an element is said to be “directly connected” or “directly joined” to another element, there is no intermediary element.

[0015]

[0053] In this specification, relative terms such as “downward,” “upward,” “upper side,” “lower side,” “horizontal,” or “vertical” may be used to describe the relationship between one element, layer, or region and another, as illustrated in the figures. It is understood that these terms and the terms discussed above are intended to encompass various orientations of the device, in addition to the orientations shown in the figures.

[0016]

[0054] The terms used herein are for the sole purpose of describing specific embodiments and are not intended to limit the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural form unless the context clearly indicates otherwise. Furthermore, the terms “equipped,” “equipped,” “contains,” and / or “contains” as used herein identify the presence of a described feature, complete, step, action, element, and / or component, but are not intended to exclude the presence or addition of one or more other features, complete, step, action, element, component, and / or group thereof.

[0017]

[0055] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art to the extent of this disclosure. Furthermore, terms used herein should be interpreted as having meanings consistent with their meanings in the context of this specification and related art, and it will be understood that they should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0018]

[0056] In this specification, embodiments are described with reference to schematic drawings of embodiments of the present disclosure. Therefore, the actual dimensions of layers and elements may differ, and variations from the schematic shapes are expected, for example, as a result of manufacturing techniques and / or tolerances. For example, areas illustrated or described as squares or rectangles may have rounded or curved features, and areas illustrated as straight lines may have irregularities. Thus, areas illustrated in the drawings are schematic, and their shapes are not intended to illustrate the exact shapes of areas in the device, nor are they intended to limit the scope of the disclosure. In addition, the size of structures or areas may be exaggerated for illustrative purposes compared to other structures or areas, and are therefore provided to illustrate general structures of the subject matter, and may or may not be drawn to scale. Elements common to both drawings may be illustrated herein with common element numbers and may not be described again later.

[0019]

[0057] The present invention relates to solid-state lighting devices including light-emitting diodes (LEDs), and more particularly to structures for LED packages having a lead frame. The LED package includes a lead frame structure at least partially enclosed by a body structure or housing. Arrangements for LED packages are disclosed that improve photoforming for desired light emission directions and enhance reliability for various lighting applications, including outdoor LED displays and general lighting. In certain embodiments, the LED package includes the arrangement of LED chips within a cavity of the body structure and a corresponding lens. Structures of cavities, lenses, or combinations thereof that provide improved photoforming are disclosed. Further arrangements of the body structure relative to the lead frame structure are disclosed, thereby enhancing adhesion with sealing materials and optional potting materials and improving moisture barrier protection.

[0020]

[0058] LED chips typically comprise an active LED structure or region, which can have numerous different semiconductor layers arranged in different ways. The manufacturing and operation of LEDs and their active structures are generally known in the art and will be discussed only briefly herein. The layers of an active LED structure can be manufactured using known processes, with appropriate processes such as metal-organic chemical vapor deposition. The layers of an active LED structure can comprise many different layers, and generally comprise an active layer sandwiched between oppositely doped n-type and p-type epitaxial layers, all of which are formed continuously on a growth substrate. It is understood that an active LED structure may also include, but is not limited to, additional layers and elements, including buffer layers, nucleation layers, superlattice structures, undoped layers, cladding layers, contact layers, and current-spreading layers and photoextraction layers and elements. The active layer may comprise a single quantum well, multiple quantum wells, a double heterostructure, or a superlattice structure.

[0021]

[0059] Active LED structures can be manufactured from different material systems, some of which are Group III nitride-based. Group III nitrides are semiconductor compounds formed from nitrogen (N) and elements of Group III of the periodic table, typically aluminum (Al), gallium (Ga), and indium (In). Gallium nitride (GaN) is a common binary compound. Group III nitrides also refer to ternary and quaternary compounds such as aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), and aluminum indium gallium nitride (AlInGaN). In the case of Group III nitrides, silicon (Si) is a common n-type dopant, and magnesium (Mg) is a common p-type dopant. Therefore, in the case of material systems based on Group III nitrides, the active layer, n-type layer, and p-type layer may include one or more layers of undoped or Si or Mg-doped GaN, AlGaN, InGaN, and AlInGaN. Other material systems include silicon carbide (SiC), organic semiconductor materials, and other Group III-V systems such as gallium phosphide (GaP) and gallium arsenide (GaAs), and related compounds.

[0022]

[0060] Different embodiments of the active LED structure can emit light of different wavelengths depending on the configuration of the active layer, n-type layer, and p-type layer. In certain embodiments, the active LED structure emits blue light with a peak wavelength range of approximately 430 nanometers (nm) to 480 nm. In other embodiments, the active LED structure emits green light with a peak wavelength range of 500 nm to 570 nm. In other embodiments, the active LED structure emits red light with a peak wavelength range of 600 nm to 650 nm. In certain embodiments, a multi-chip LED package used as a pixel in a display may include at least one blue-emitting LED chip, at least one green-emitting LED chip, and at least one red-emitting LED chip.

[0023]

[0061] The LED chip in the package may be covered with one or more lumiphoric or other conversion materials such as phosphors, so that at least a portion of the light from the LED chip is absorbed by one or more phosphors and converted into one or more different wavelength spectra according to the characteristic emission from one or more phosphors. For example, a combination of a blue-emitting LED chip and one or more phosphors may be configured to generally provide a combination of white light. One or more phosphors may be yellow (e.g., YAG:Ce), green (e.g., LuAg:Ce), and red (e.g., Ca i-x-y Sr x EU y This may include luminescent phosphors (AlSiN) and combinations thereof. The luminescent materials described herein may be one or more of the following: phosphors, scintillators, luminescent inks, quantum dot materials, day glow tapes, etc., or may include these. The luminescent materials may be provided by any suitable means, such as direct coating on one or more surfaces of LEDs, dispersion in a sealing material configured to cover one or more LEDs, and / or coating on one or more optical elements or support elements (e.g., by powder coating, inkjet printing, etc.).

[0024]

[0062] The light emitted from the active layer or region of an LED chip is typically omnidirectional. For directional applications, internal mirrors or external reflective surfaces can be applied to the LED package to redirect as much light as possible in the desired emission direction. As used herein, a layer or region of an LED is considered “reflective” or to embody a “mirror” or “reflector” if at least 80% of the emitted radiation that falls on that layer or region is reflected. In some embodiments, the emitted radiation comprises visible light, such as blue and / or green LEDs, with or without the emitting material. In other embodiments, the emitted radiation may comprise invisible light. For example, in the context of GaN-based blue and / or green LEDs, silver (Ag) may be considered a reflective material (e.g., reflecting at least 80%). For ultraviolet (UV) LEDs, appropriate materials may be selected to achieve desired, depending on the embodiment, high reflectivity and / or, depending on the embodiment, low absorptivity.

[0025]

[0063] The present invention can be used for LED chips having various shapes, such as vertical or horizontal. Vertical LED chips typically have anode and cathode connections on opposite sides or faces of the LED chip. Horizontal LED chips typically have both anode and cathode connections on the same side of the LED chip, opposite to the substrate, such as a growth substrate. In certain embodiments, one or more wire bonds may be used to provide electrical connections between the anode and cathode connections and the lead frame structure of the LED package. In other arrangements, some LED chips may be flip-chip mounted and electrically coupled to the lead frame structure without the use of wire bonds.

[0026]

[0064] This disclosure relates to various embodiments of surface-mount device (SMD) LED packages and LED displays using such packages. Each LED package may be arranged to be used as a single pixel, instead of multiple LED packages being used to form each pixel in a conventional LED display. This simplifies the manufacturing of LED displays, reduces costs, improves the reliability of LED displays, and, in some cases, increases the number of pixels in a given display area, enabling higher density or higher resolution displays. In certain embodiments, the LED package according to this disclosure may have one or more circular or elliptical cavities. The cavities may have corresponding circular or elliptical lenses formed in them to form or adjust the overall light emission of the LED package. The elliptical lenses may provide wide-angle or wide-pitch light emission along the axis or centerline of the LED package or elliptical lens. This enables LED displays configured for wider viewing angles. In certain embodiments, certain LED packages may have a combination of elliptical and circular cavities and corresponding elliptical and circular lenses.

[0027]

[0065] In addition to the advantages described above, the LED package according to this disclosure can be handled more easily than conventional LED lamps used to form pixels in LED displays, and assembly into LED displays can be made easier. The LED package and the resulting LED display can have improved luminescence characteristics, as well as increased reliability and a longer lifespan.

[0028]

[0066] Different embodiments of this disclosure may have cavities of different shapes and sizes, some cavities having curved surfaces, while others may have angled sidewalls and planar bases. Depending on the desired direction of light emission, the LED chips may be mounted near the center of the cavity floor or offset from the center. Lenses may be provided on each cavity. In certain embodiments, lens shapes are disclosed that, in combination with various cavity shapes, are configured to direct light in a desired direction. For example, embodiments disclosed herein may be particularly suitable for increasing the downward emission of LED packages in high-visibility LED displays such as stadiums, arenas, roads, billboards, or building side displays. In certain embodiments, the LED chips in the package may emit multiple colors, such as red, green, and blue, and the LED chips may be individually controllable to emit different color combinations and light intensities. The LED chips are arranged in close proximity to each other within the corresponding LED package, approximating a point light source, which can enhance color mixing and uniformity in the far-field emission pattern.

[0029]

[0067] Certain embodiments relate to LED packages with various structures to enhance operational reliability. Disclosed are arrangements of body structures with various features that enhance the formation and / or adhesion of the upper lens. Furthermore, the arrangement of the body structures includes the function of improving adhesion with potting material used with the mounting of the LED package, and / or the function of reducing moisture ingress. In yet another embodiment, one or more combinations of cavity structures, lens structures, and body structures may be used together to provide an LED package with improved luminescence characteristics and improved reliability.

[0030]

[0068] Although the present disclosure is described herein with reference to particular embodiments, it is to be understood that the disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. In particular, in addition to what is described herein, many different LED reflector cups and lead frame arrangements can be provided, and the encapsulant can provide additional functionality for changing the direction of light emission from the LED package and from LED displays utilizing the LED package. The different embodiments of the LED package discussed below are targeted for use in LED displays, but they can be used in many other applications either individually or in combination with other LED packages having the same or different peak emission tilts.

[0031]

[0069] FIG. 1A is a top perspective view of an LED package 10 according to an embodiment disclosed herein. The LED package 10 includes a body 12 or body structure disposed at least partially around a lead frame structure including leads 14-1 to 14-6. In certain embodiments, the body 12 includes an insulating material formed around and between portions of the leads 14-1 to 14-6, providing mechanical stability and electrical insulation. The body 12 can comprise, among other things, a molded plastic material or a ceramic material. As illustrated, the upper surface 12' of the body 12 forms a part of the main light emitting surface 10 of the LED package 10 and a part of the mounting face 10 of the LED package 10 that faces the main light emitting surface 10. The main light emitting surface 10 and the mounting face 10 are bounded by the side surface 12 of the body 12. E of the LED package 10 and a part of the mounting face 10[[ID=ID=8]] E of the LED package 10 that faces the main light emitting surface 10 M of the LED package 10. The main light emitting surface 10 E and the mounting face 10 M are bounded by the side surface 12 of the body SThe surrounding area is bounded by [a specific element]. Leads 14-1 to 14-6 are structures typically formed of a conductive metal such as copper, a copper alloy, or another conductive metal. Leads 14-1 to 14-6 may initially be part of a larger lead frame structure that is separated during manufacturing to form individual LED packages. During manufacturing, separate bodies 12 can be formed in each region of the lead frame structure that is formed after the individual LED packages are separated.

[0032]

[0070] In the LED package 10, leads 14-1 to 14-6 are on the side 12 S One or more of the above, or side 12 S They are arranged to extend from the main body 12 along the side 12. In certain embodiments, leads 14-1 to 14-6 are located on the side 12 S It curves along the mounting surface 10 M They are positioned to bend along the edge. In this way, some of the leads 14-1 to 14-6 are positioned on the mounting surface 10 for electrical connection with an external power supply during installation. M It is positioned on top. For example, the LED package 10 can be mounted on a printed circuit board using electrical traces corresponding to leads 14-1 to 14-6. The body 12 further has a main light-emitting surface 10 E The main body mesa 12 formed M It may include the following: as illustrated, the main mesa 12 M The main light-emitting surface 10 E It is positioned as a projection of the main body 12 in a particular embodiment. M The side 12 of the main body 12 S It is inset from and forms a stepped structure along the perimeter of the top of the main body 12. Main body mesa 12 M The main light-emitting surface 10 E Includes side walls protruding along the body mesa 12 M The main light-emitting surface 10 EMultiple cavities 16-1 to 16-3 are formed within the LED package 10. These multiple cavities 16-1 to 16-3 form cups or recesses into which LED chips are mounted. Thus, cavities 16-1 to 16-3 form openings within the body that provide access to different pairs of lead frames, for example, leads 14-1 and 14-4 in the case of cavity 16-1, leads 14-2 and 14-5 in the case of cavity 16-2, and leads 14-3 and 14-6 in the case of cavity 16-3.

[0033]

[0071] Figure 1B is a top perspective view of the LED package 10 of Figure 1A with the encapsulant 18 added. The encapsulant 18 may comprise a material such as silicone or epoxy, arranged to fill and seal each cavity (e.g., 16-1 to 16-3 in Figure 1B) and the LED chip mounted therein. In certain embodiments, the encapsulant 18 may be light-transmitting or light-transparent to light emitted by the LED chip. In certain embodiments, the encapsulant 18 may comprise a conversion or scattering material arranged throughout the encapsulant 18 or at different locations within the encapsulant 18. As illustrated, the encapsulant 18 forms a plurality of lenses 20-1 to 20-3, thereby each separate lens 20-1 to 20-3 resisting one of the separate cavities 16-1 to 16-3. Thus, the plurality of lenses 20-1 to 20-3 are configured to focus, modify, or otherwise adjust the light emission pattern of the light produced by each LED chip. In certain embodiments, lenses 20-1 to 20-3 form a circular shape, but other shapes are also possible depending on the desired emission pattern. Some examples of alternative shapes include elliptical, ellipsoidal, planar, hexagonal, and square. As will be described in detail later, lenses 20-1 to 20-3 may be formed with their focal points offset from the centers of cavities 16-1 to 16-3 in order to direct the light in the desired emission direction. The sealant 18 and lenses 20-1 to 20-3 may be formed on the body 12 using different molding processes known. In certain embodiments, the sealant 18 may be formed to extend along the upper surface 12' of the body 12, thereby the sealant 18 is located on the body mesa 12 M It extends beyond the peripheral boundary. In this way, the adhesion between the sealant 18 and the body 12 may be strengthened. In certain embodiments, the sealant 18 is continuous along a portion of the upper surface 12' between each lens 20-1 to 20-3. Between lenses 20-1 to 20-3, the body mesa 12 M Such portions of the sealant 18 extending along and along the upper surface 12' may be referred to as the flush portion 18' of the sealant 18.

[0034]

[0072] Figure 1C is a top view of the LED package 10 of Figure 1A with LED chips 22 added in each cavity 16-1 to 16-3. For illustrative purposes, each LED chip 22 is represented in a vertical chip structure, with one side of the LED chip 22 mounted and electrically connected to one lead (e.g., 14-1 in the case of cavity 16-1) and electrically connected to the other lead (e.g., 14-4 in the case of cavity 16-1) via a wire bond. In other embodiments, the electrical connection to each lead frame pair may be made by wire bonding. In yet another embodiment, one or more of the LED chips 22 may be flip-chip mounted to the corresponding lead frame pair without the use of wire bonding. In any case, the electrical connection between leads 14-1 to 14-6 and the LED chips 22 may be configured so that each LED chip 22 is individually addressable and can be electrically activated independently. This makes it possible to incorporate an array of LED packages 10 into an LED display, with each LED package 10 providing a pixel for the LED display. As further illustrated in Figure 1C, cavities 16-1 to 16-3 may be arranged linearly within the body 12 to facilitate uniform spacing and placement of LED chips 22 across multiple LED packages 10 when placed in a display. The linear arrangement improves color mixing and visibility at various viewing angles, as described below.

[0035]

[0073] Figure 1D is a top view of a portion of the LED package 10 of Figure 1C, including cavity 16-1. The shape of cavity 16-1 described below may also be implemented in one or more of the cavities 16-2 to 16-3 of Figure 1D. In yet another embodiment, one or more of the cavities 16-1 to 16-3 of Figure 1D may have the shape described below, while the other cavities 16-1 to 16-3 may have a generally symmetrical shape.

[0036]

[0074] As illustrated in Figure 1D, the cavity 16-1 is generally asymmetrical, directing the increased light emission in an offset manner, in this case downward relative to the LED package 10. For example, the superimposed dashed lines in Figure 1D illustrate the vertical centerline 26 and the horizontal centerline 28 of the cavity 16-1 perpendicular to the vertical centerline 26. As illustrated, the cavity 16-1 is located on the cavity floor 16 F and may include at least one side wall 30 and form a generally asymmetrical cavity shape having only one line of symmetry with respect to the opening formed by the cavity 16-1 in the body 12. For example, the opening of the cavity 16-1 on the top surface 12' of the body 12 may have symmetry only with respect to the vertical center line 26 such that no other lines of symmetry exist. Having a single line of symmetry along the vertical center line 26 may uniformize the light emission of the package from generally left and right observation positions while maintaining the downward light emission shift resulting from the remaining asymmetry of the cavity 16-1. The cavity 16-1 is located on the cavity floor 16 in which the LED chip 22 is mounted. F This includes at least one side wall 30 extending between the cavity 16-1 and the surface of the main body 12 located outside the cavity 16-1. The side wall 30 is located on the cavity floor 16 F It may extend in a continuous curve around the cavity floor 16. F One or more portions of leads 14-1 and 14-4 form a mounting surface for the LED chip 22 that is accessible to the body 12. The first sidewall portion 30' generally coincides with a portion of the sidewall 30 that may be located above the second sidewall portion 30'' when the LED package 10 is oriented as illustrated in Figure 1C. Thus, the first sidewall portion 30' and the second sidewall portion 30'' are located on the opposite side of the LED chip 22. From the top view in Figure 1D, the second sidewall portion 30'' has a larger surface area of ​​cavity 16-1 than the first sidewall portion 30'. This is because the second sidewall portion 30'' is located above the cavity floor 16 F This is partly due to the fact that the angle between the first side wall portion 30' and the main body 12 is greater than the corresponding angle of the first side wall portion 30'.

[0037]

[0075] If the LED package 10 is positioned vertically and the second sidewall portion 30'' is located below the first sidewall portion 30', the light from the LED chip 22 may be increased, causing it to emit light downward from the cavity 16-1. In the context of Figure 1C, if cavities 16-1 to 16-3 having such shapes are arranged linearly within the LED package 10, then each of the second sidewall portions 30'' of cavities 16-1 to 16-3 is oriented in the same downward direction. As further illustrated in Figure 1C, the LED package 10 and body 12 have an overall rectangular shape, thereby arranging cavities 16-1 to 16-3 linearly in the direction corresponding to the long side of the rectangle, i.e., the length, and the second sidewall portions 30'' are positioned to increase downward light emission toward the short side of the rectangle, i.e., the width. Thus, the vertical centerline 26 in Figure 1D, which may represent the only line of symmetry of cavity 16-1, may be oriented parallel to the longer side of the rectangle of body 12 in Figure 1C.

[0038]

[0076] Figure 1E is a partial cross-sectional view of the LED package 10 of Figure 1D illustrating the difference in sidewall angles. For illustrative purposes, a dashed line is provided superimposed in relation to cavity 16-1. However, it will be understood that one or both of the other cavities 16-2, 16-3 may also have the same sidewall angle. As illustrated, the first angle α1 is the cavity floor 16 F The first side wall portion 30' is formed from the perpendicular from the cavity floor 16, and the second angle α2 is formed from the first side wall portion 30', and the second angle α2 is formed from the cavity floor 16 F The second side wall portion 30'' is formed relative to the perpendicular from the first angle α1. F The second angle α2 with respect to the perpendicular from is smaller than the first side wall portion 30', indicating that the incline of the first side wall portion 30' is steeper. Thus, the light from the LED chip 22 increases and is angled toward the second side wall portion 30'', thereby causing the highest intensity light emission 32 from the LED chip 22 to reach the cavity floor 16 F It is offset from the perpendicular to the cavity floor 16. FThe side wall angles of cavities 16-1 to 16-3 relative to the LED chip 22 may vary. In certain embodiments, particularly for high-visibility LED display applications, the first angle α1 is provided in the range of 5 to 25 degrees, or 10 to 20 degrees, and the second angle α2 is provided in the range of 25 to 50 degrees, or 30 to 40 degrees.

[0039]

[0077] Figure 1F is a side view of the LED package 10 of Figure 1C with the encapsulant 18 and lenses 20-1 to 20-3 added. In certain embodiments, lenses 20-1 to 20-3 have a downward-sloping shape to further increase downward light emission. For illustrative purposes, superimposed dashed arrows are provided to illustrate the direction of the highest intensity light emission 32 emanating from each lens 20-1 to 20-3. In the case of a conventional hemispherical lens, the highest intensity light emission is typically directed towards the mounting surface 10 of the LED package 10. M It is generated at a 90-degree angle to the surface. By tilting lenses 20-1 to 20-3, the emission of the highest intensity emission pattern may be angled in an offset manner, such as downward, in the case of a high-visibility LED display. The inclined lenses 20-1 to 20-3 may be used in combination with the shapes of the cavities 16-1 to 16-3 described above in Figures 1D and 1E to further enhance the downward emission. In certain embodiments, each of the inclined lenses 20-1 to 20-3 may have a shape corresponding to the shape of the respective cavity 16-1 to 16-3 below it. In this regard, one or more of the lenses 20-1 to 20-3 may be formed with a lens shape having only one line of symmetry.

[0040]

[0078] In addition to the descriptions of the cavities and lenses provided above with respect to Figures 1A to 1F, the positions of the LED chips 22 within cavities 16-1 to 16-3 may further be arranged to adjust the light emission pattern of the LED package. In Figure 1D, the LED chip 22 is located in the cavity floor 16 FIt is positioned at the center, i.e., at the intersection of the vertical center line 26 and the horizontal center line 28. Figures 2 to 4 show top views of LED packages similar to the LED package 10 in Figures 1A to 1F, with various arrangements of LED chips 22 to further adjust the light emission pattern.

[0041]

[0079] Figure 2 is a top view of an LED package 34 similar to the LED package 10 in Figure 1C, except that the LED chips 22 in each cavity are positioned closer to the first sidewall portion 30' than to the second sidewall portion 30''. In this respect, the light from the LED chips 22 travels a shorter distance through the first sidewall portion 30' before being redirected along the downward light emission direction. With such a configuration, the LED package 34 can direct the highest intensity light more downward compared to the same LED package in which the LED chip 22 is positioned in the center. Thus, the LED package 34 may be suitable for LED displays positioned considerably above the observer's eye level. The offset position of the LED chips 22 relative to the center point of the cavity may be implemented in combination with the cavity shape and lens shape described above with respect to Figures 1A to 1F.

[0042]

[0080] Figure 3 is a top view of an LED package 36 similar to the LED package 34 in Figure 2, except that the LED chips 22 in each cavity are positioned closer to the second sidewall portion 30'' than to the first sidewall portion 30'. Such an arrangement may be provided to adjust the downward light emission without modifying other parts of the LED package 36. For example, the LED package 34 in Figure 2 may have a greater downward light emission than the LED package 36. The LED package 36 may still be configured to provide the highest intensity light downward, but by bringing the LED chips 22 closer to the second sidewall portion 30'', the relative portion of the light emission pattern perpendicular to the LED chips 22, or even upward, can be increased. Such an arrangement may be implemented for LED displays that are still above the observer's eye level, but not necessarily as high as the application of the LED package 34 in Figure 2. The positions of the LED chips 22 in cavities 16-1 to 16-3 may be implemented in combination with the cavity and lens shapes described above for Figures 1A to 1F.

[0043]

[0081] Figure 4 is a top view of an LED package 38 similar to the LED package 34 in Figure 2, except that the LED chips 22 in each cavity are variably positioned relative to the second side wall portion 30'' more than to the first side wall portion 30'. For example, the LED chips 22 in cavities 16-1 and 16-3 are positioned closer to the first side wall portion 30' than to the second side wall portion 30'', while the LED chips 22 in cavity 16-2 are positioned closer to the cavity floor 16 F It is positioned at the center point.

[0044]

[0082] Figure 5 is a top view of an LED package 34 similar to the LED package 10 in Figure 1C, with a modified arrangement of leads 14-1 to 14-6. In certain embodiments, the shape of leads 14-1 to 14-6 may be modified to accommodate the asymmetry of cavities 16-1 to 16-3. As illustrated, each cavity 16-1 to 16-3 is located on the cavity floor 16 FThis includes, in which different pairs of leads 14-1 to 14-6 are accessible for LED chip connection. Within cavity 16-1, lead 14-1 is formed in a shape that protrudes near the center of cavity 16-1, and lead 14-4 has a shape that is bent along the protrusion of lead 14-1. Thus, the gap between lead 14-1 and lead 14-4 may extend non-linearly from the first sidewall portion 30' to the second sidewall portion 30''. Such an arrangement may allow for various LED chip positions, as illustrated in any of Figures 1C to 1D and Figures 2 to 4. In addition, such an arrangement may also strengthen the adhesion between the body 12 and leads 14-1 to 14-6 while adjusting the LED chip position for the asymmetry of the cavities 16-1 to 16-3 described above.

[0045]

[0083] LED packages disclosed herein may further include further arrangements of a body, lead frame structure, sealant and / or lens, and combinations thereof, that provide enhanced mechanical and / or optical properties. The shape of the body structure relative to the lead frame structure and / or sealant layer may improve manufacturability and environmental protection by making it more difficult for water to penetrate. The arrangement of additional body and lead frame structures may reduce the amount of potting material required when such LED packages are mounted for use. The arrangements of body, lead frame structure, sealant and / or lens, and combinations thereof, described below with respect to Figures 6A to 20E, may be used alone or in combination with the cavity shapes, lenses, lead frames and / or LED chip positions within the cavity described above with respect to Figures 1A to 5.

[0046]

[0084] Figure 6A shows the main mesa 12 of Figure 1A. M This is a top perspective view of an LED package 42 similar to the LED package 10 in Figure 1A, in an embodiment that does not include the top surface 12' and / or light-emitting surface 42. EIf there is no such body mesa, the body 12 is substantially flat over most of the top surface 12'. In certain embodiments, the body 12 has a long side, i.e., the opposite side 12 of the body 12 that defines the length of the body 12. S It is continuously flat in between. In addition, the body 12 has a short side, i.e., the width of the body 12, on the opposite side 12 S It is continuously flat in between. As illustrated, along the length and width of the body 12, the various boundaries of the body 12 are side surfaces 12 S The top surface 12' may have curved corners surrounding it, which is continuously flat. As will be described in more detail below, the substantially flat top surface 12' may allow for flexibility in the shape of the sealant and / or other package elements such as lenses.

[0047]

[0085] Figure 6B is a top view of the LED package 42 of Figure 6A with LED chips 22 added in each cavity 16-1 to 16-3. For illustrative purposes, each LED chip 22 is represented in a vertical chip structure, with one side of the LED chip 22 mounted and electrically coupled to one lead (e.g., 14-1 in the case of cavity 16-1) and electrically coupled to the other lead (e.g., 14-4 in the case of cavity 16-1) via a wire bond. In other embodiments, the electrical connection to each lead frame pair may be made by wire bonding. In yet another embodiment, one or more of the LED chips 22 may be flip-chip mounted to the corresponding lead frame pair without the use of wire bonding. In any case, the electrical connection between leads 14-1 to 14-6 and the LED chips 22 may be configured so that each LED chip 22 is individually addressable and can be electrically activated independently. For illustrative purposes, each cavity 16-1 to 16-3 is illustrated as being substantially elliptical, but as described above for Figures 1A to 1F, it is understood that cavities 16-1 to 16-3 may have an asymmetrical shape formed by side walls of a variable angle. In addition, the LED chip 22 may be placed within cavities 16-1 to 16-3, as described above for Figures 1D to 1F and Figures 2 to 4. In certain embodiments, the body 12 has notches 12 indicating the proper mounting orientation and / or polarity information of the LED package 42. N It may be formed in its corner.

[0048]

[0086] Figure 6C is a bottom view of the LED package 42 of Figure 6B. As illustrated, each lead 14-1 to 14-2 is on the opposite side 12 S It extends from the main body 12 along the mounting surface 42 of the LED package 42. M They are positioned to be accessible from. Figure 6D is an end view of the LED package 42 along the short side, i.e., width, of the LED package 42 in Figure 6B. As illustrated, leads 14-1 and 14-4 are on opposite side 12 S It extends from the main body or extends out of the main body. Leads 14-1 and 14-4 are further on side 12S The side step can be bent along the bottom surface 12'' of the main body, and the overall mounting surface 42 of the LED package 42 M It becomes accessible from. Figure 6E is a side view of the LED package 42 along the long side, i.e., the length, of the LED package 42 in Figure 6B. From this figure, leads 14-1 to 14-3 are on the same side 12 S It can be seen extending from there.

[0049]

[0087] Figure 7 is a top perspective view of the LED package 42 of Figure 6A with a sealant 18 added along the top surface 12' of the main body 12. As previously mentioned, the sealant 18 may fill and seal each cavity (e.g., 16-1 to 16-3 in Figure 6B) and the LED chip mounted therein. The sealant 18 forms a plurality of lenses 20-1 to 20-3, so that each separate lens 20-1 to 20-3 is resisted into one of the separate cavities 16-1 to 16-3. In this way, the plurality of lenses 20-1 to 20-3 are configured to focus, modify, or otherwise adjust the light emission pattern of the light produced by each LED chip. In certain embodiments, the lenses 20-1 to 20-3 form a circle, but other shapes are also possible depending on the desired light emission pattern. Some examples of alternative shapes include ellipse, elliptic bullet, plane, hexagon, and square. In a particular embodiment, the sealing material 18 forms a continuous flash portion 18' between each lens 20-1 to 20-3. The upper surface 12' is opposite the side surface 12 S By continuously flattening between them, the flexibility of the shape of the sealant 18, lenses 20-1 to 20-3, and flash portion is improved. In Figure 7, the thickness of the flash portion 18' is in the range of 0.1 millimeters (mm) to 0.5 mm or more. In such embodiments, the thickness of the flash portion 18' may be used to adjust the light emission pattern by raising the lenses 20-1 to 20-3 by a desired distance from the underlying LED chip. In certain embodiments, the flash portion 18' is on the side 12 of the body. SOne or more of these may extend along the top surface 12' to within 1 mm. This configuration increases the distance that harmful moisture can travel before reaching the LED chip and / or lead frame within the cavity.

[0050]

[0088] Figure 8 is a top perspective view of an LED package 44 similar to the LED package 42 in Figure 7, in which the thickness of the flash portion 18' of the encapsulant 18 has been reduced. As illustrated, the flash portion 18' is thinner than in the example in Figure 7. In certain embodiments, the thickness of the flash portion 18' ranges from 0.1 mm to about 0.5 mm, but is still smaller than the arrangement illustrated in Figure 7. Such a thickness reduction is due to the top surface 12' of the body 12 being thinner than the opposite side surface 12 S This is made possible by being continuously flat in between. In a particular embodiment, the flash portion 18' is on the side 12 of the body. S One or more of these may extend along the top surface 12' to within 1 mm. In this way, harmful moisture has a longer travel distance to reach the LED chip and / or lead frame in the cavity.

[0051]

[0089] Figure 9 is a top perspective view of an LED package 46 similar to the LED package 44 in Figure 8, except that the flash portion 18' of Figure 8 is omitted. In this way, the encapsulant 18 forms individual lenses 20-1 to 20-3 separated by a portion of the top surface 12' of the body 12. The lenses 20-1 to 20-3 may completely cover the cavity beneath them, so that a portion of each lens 20-1 to 20-3 extends along a portion of the top surface 12' outside the cavity. In certain embodiments, removing the flash portion 18' of Figure 8 may eliminate corners or other sharp surfaces of the encapsulant 18 that could affect light emission in undesired directions. Thus, omitting the flash portion 18' may result in a substantially curved boundary of the encapsulant 18 along the top surface 12'. In addition, omitting the flash portion 18' may improve the contrast of the LED package 46, as a larger surface area of ​​the top surface 12' remains uncovered, particularly in embodiments where the body 12 is formed from dark or even black material.

[0052]

[0090] Figure 10 is a top perspective view of an LED package 48 similar to the LED package 42 in Figure 7, having a lens shape similar to the LED package 10 illustrated in Figures 1B and 1F. For example, one or more of the lenses 20-1 to 20-3 may have a lens shape that has only one line of symmetry when viewed from an angle perpendicular to the top surface 12'. Thus, one or more of the lenses 20-1 to 20-3 are formed such that the focal points of the lenses 20-1 to 20-3 are offset from the center of the cavity below (e.g., 16-1 to 16-3 in Figure 1C) in order to direct the light in the desired emission direction. For example, if the LED package 48 is positioned for use in an orientation where the lenses 20-1 to 20-3 are vertically aligned, the lens shapes may be positioned so that the light of maximum intensity is directed downward. In yet another embodiment, the underlying cavities (for example, 16-1 to 16-3 in Figure 1C) may be provided in the cavity shape described above for Figures 1C to 1E. In yet another embodiment, the LED chip positions of the LED package 48 may be arranged as described above for any of Figures 1C to 1D and Figures 2 to 4.

[0053]

[0091] Figure 11 is a top perspective view of an LED package 50 similar to the LED package 48 in Figure 10, having a flash portion 18' similar to the LED package 44 in Figure 8. Thus, the lens shape may be implemented in combination with the thinner flash portion 18' described above. As with other embodiments, the underlying cavity (e.g., 16-1 to 16-3 in Figure 1C) may be provided in the cavity shape described above for Figures 1C to 1E, and / or the LED chip position of the LED package 50 may be arranged as described above for any of Figures 1C to 1D and Figures 2 to 4.

[0054]

[0092] Figure 12 is a top perspective view of an LED package 52 similar to the LED package 50 in Figure 11, with the flash portion 18' omitted, similar to the LED package 46 in Figure 9. Thus, the lens shape may be implemented as a separate shape along the top surface 12' of the body 12, as described above. As with other embodiments, the lower cavity (e.g., 16-1 to 16-3 in Figure 1C) may be provided with the cavity shape described above for Figures 1C to 1E, and / or the LED chip position of the LED package 50 may be arranged as described above for any of Figures 1C to 1D and Figures 2 to 4.

[0055]

[0093] Figure 13A shows side view 12 S Figure 13B is a top perspective view of an LED package 54 similar to the LED package 42 in Figure 6A, in an embodiment where the body 12 is continuously flat from the top surface 12' to the bottom surface 12''. Figure 13B is a top view of the LED package 54 of Figure 13A with LED chips 22 added in each cavity 16-1 to 16-3. Figure 13C is a bottom view of the LED package 54 of Figure 13B. Figure 13D is an end view of the LED package 54 along the short side, i.e., width, of the LED package 54 of Figure 13B. In certain embodiments, side 12 S The bottom surface 12'' may be inclined inward from the top surface 12'' to the top surface 12'' to provide space for potting material when placed in close proximity to other LED packages. Figure 13E is an end view of the LED package 54 of Figure 13B, similar to Figure 13D, where the body 12 is represented as translucent. In this way, the leads 14-1 and 14-4 and the cavity 16-1 become visible. As illustrated, portions of leads 14-1 and 14-4 are located in the cavity floor 16 F While accessible via the above, the other parts of leads 14-1 and 14-4 bend twice within the body 12 before reaching the mounting surface 54. M Side 12 S Out of the body 12. In a particular embodiment, the bottom surfaces of leads 14-1 and 14-4 that extend from the body 12 are coplanar with the bottom surface 12''. Leads 14-1 and 14-4 are mounted on the mounting surface 54 MBy positioning it so that it exits the package near the cavity 16-1, resistance to moisture ingress can be increased. For example, moisture that may travel along leads 14-1 and 14-4 from the outside exposure of the body 12 will bend at least twice and travel a long distance within the body 12 before reaching the cavity 16-1.

[0056]

[0094] Figure 13F is a side view of the LED package 54 along the long side, i.e., the length, of the LED package 54 in Figure 13B. As illustrated, the side view 12 of the LED package 54 in Figures 13A to 13E S The LED package 42 in Figures 6A to 6F does not have the side steps described above, which accept the bending of leads 14-1 to 14-6. The side 12 is continuously flat from the top surface 12' to the bottom surface 12''. S By having, leads 14-1 to 14-6 are positioned on the side 12 S They can be positioned to extend or protrude from the portion closest to the bottom surface 12''. As best illustrated in Figures 13D and 13E, the bottom surfaces of leads 14-1 to 14-6 may be coplanar with the bottom surface 12'' of the body 12. The protruding portions of leads 14-1 to 14-6 are positioned on the side 12 away from the cavities 16-1 to 16-3. S By arranging along these sides, harmful moisture has a longer distance to travel before it reaches the LED chip 22 and adversely affects the operation of the LED package 54. Therefore, the reliability of the LED package 54 may be improved. In addition, the continuously flat sides 12 S Therefore, less potting material is needed to cover the LED package when it is mounted for operation, thus saving on manufacturing costs.

[0057]

[0095] Figures 14 to 19 are top perspective views of an LED package similar to the LED package 54 in Figures 13A to 13E, having the same arrangement of sealant and lens as the embodiments illustrated in Figures 7 to 12. With respect to Figures 7 to 12, the description of the sealant 18, lenses 20-1 to 20-3, and flash portion 18' provided above is that the side surface 12' is continuously flat from the top surface 12' to the bottom surface 12''.S In the context of an LED package having the above, the following may apply to Figures 14 to 19, respectively. In any embodiment described below with respect to Figures 14 to 19, the underlying cavities (for example, 16-1 to 16-3 in Figure 1C) may be provided in the cavity shape described above with respect to Figures 1C to 1E, and / or the LED chip positions of the LED package 50 may be arranged as described above with respect to Figures 1C to 1D and Figures 2 to 4.

[0058]

[0096] Figure 14 is a top perspective view of the LED package 54 of Figure 13A with a sealant 18 added along the top surface 12' of the main body 12. In Figure 14, the thickness of the flash portion 18' of the sealant 18 is within the range described above for Figure 7, thereby positioning the lenses 20-1 to 20-3 at a desired distance above the LED chips beneath them to adjust their light emission pattern. Such an arrangement is possible along the continuously flat side 12 S This may be implemented in combination with other methods.

[0059]

[0097] Figure 15 is a top perspective view of an LED package 56 similar to the LED package 54 in Figure 14, in which the thickness of the flash portion 18' of the encapsulant 18 has been reduced. In this regard, the flash portion 18' of the LED package 56 has a continuously flat side surface 12 S In combination with this, it may be formed with a thin thickness, similar to the flash portion 18' of the LED package 44 in Figure 8.

[0060]

[0098] Figure 16 is a top perspective view of an LED package 58 similar to the LED package 56 in Figure 15, except that the flash portion 18' of Figure 15 has been omitted. In this regard, the arrangement of the encapsulant 18 and the individual lenses 20-1 to 20-3 is continuous flat side surface 12 S Combined with the above, it is provided in a manner similar to the LED package 46 in Figure 9. Similar to Figure 9, the lenses 20-1 to 20-3 in Figure 16 may completely cover the cavity beneath them, so that a portion of each lens 20-1 to 20-3 extends along a portion of the outer upper surface 12' of the cavity.

[0061]

[0099] Figure 17 is a top perspective view of an LED package 60 similar to the LED package 54 in Figure 14, having a lens shape similar to the LED package 48 in Figure 10. For example, one or more of the lenses 20-1 to 20-3 may have a lens shape that has only one line of symmetry when viewed from an angle perpendicular to the top surface 12'. Thus, one or more of the lenses 20-1 to 20-3 may be formed such that the focal point of the lenses 20-1 to 20-3 is offset from the center of the cavity below (e.g., 16-1 to 16-3 in Figure 1C), and light with maximum luminous intensity may be directed in a desired emission direction offset from the center. Such an arrangement is possible on a continuously flat side 12 S This may be implemented in combination with other methods.

[0062]

[0100] Figure 18 is a top perspective view of an LED package 62 similar to the LED package 60 in Figure 17, having a flash portion 18' similar to the LED package 56 in Figure 15. As previously mentioned, the lens shape for offsetting the highest intensity light emission may be implemented in a thinner flash portion 18' along the top surface 12' of the body 12. Thus, the thinner flash portion 18' and lenses 20-1 to 20-3 in Figure 18 are continuously flat side surface 12 S This may be implemented in combination with other methods.

[0063]

[0101] Figure 19 is a top perspective view of an LED package 64 similar to the LED package 62 in Figure 18, except that the flash portion 18' of Figure 18 has been omitted. In this regard, the arrangement of the encapsulant 18 and the individual lenses 20-1 to 20-3 is as shown in the continuously flat side surface 12 of Figure 19. S Combined with the above, it is provided in a manner similar to the LED package 46 in Figure 9. Similar to Figure 9, the lenses 20-1 to 20-3 in Figure 19 may completely cover the cavity beneath them, so that a portion of each lens 20-1 to 20-3 extends along a portion of the outer upper surface 12' of the cavity.

[0064]

[0102] Figure 20A is similar to the LED package 54 in Figures 13A to 13F, and the main mesa 12 of the LED package 10 in Figures 1A to 1F M Figure 20B is a top perspective view of the LED package 66, which further includes the main body mesa 12. M The description corresponds to the description provided in the context of the LED package 10 in Figures 1A to 1F. In addition, the LED package 66 may further include the encapsulant 18 and lenses 20-1 to 20-3 described above in any of Figures 1B, 1F, 14, 16, 17, or 19. Body mesa 12 M The presence of may increase the surface area for bonding with the aforementioned sealant 18 and / or lengthen the penetration distance of moisture traveling along the upper surface 12' before reaching the cavities 16-1 to 16-3.

[0065]

[0103] Any of the embodiments described herein, and / or any of the various distinct embodiments and features described herein, may be combined for further advantages. Any of the various embodiments disclosed herein may be combined with one or more other disclosed embodiments unless otherwise indicated herein.

[0066]

[0104] Those skilled in the art will recognize improvements and modifications to preferred embodiments of this disclosure. All such improvements and modifications are deemed to fall within the scope of the concepts disclosed herein and the following claims.

Claims

1. Light-emitting diode (LED) package, A body having a plurality of cavities on its upper surface, wherein the upper surface is continuously flat between the side surfaces of the body opposite to the upper surface, A lead frame structure comprising a separate pair of leads arranged within each of the plurality of cavities, wherein each lead extends from one of the opposite sides so as to be accessible from the outside of the body, Each of the plurality of cavities contains at least one LED chip electrically coupled to the lead frame structure, A sealing material that forms a plurality of lenses on the upper surface of the main body An LED package equipped with [specific features / features].

2. The LED package according to claim 1, wherein the sealing material comprises a flash portion extending between adjacent lenses of the plurality of lenses.

3. The LED package according to claim 2, wherein the flash portion extends on the upper surface to a position within 1 millimeter (mm) from at least one of the sides of the main body.

4. The LED package according to claim 2, wherein the thickness of the flash portion relative to the upper surface is in the range of 0.1 mm to 0.5 mm.

5. The LED package according to claim 1, wherein the lens shape of each of the plurality of lenses is configured to direct the light emission of maximum intensity in a direction offset from the center of each cavity.

6. The LED package according to claim 5, wherein the lens shape has only one line of symmetry.

7. The LED package according to claim 1, wherein each of the plurality of cavities comprises a cavity floor and a side wall extending between the upper surface of the body and the cavity floor, and the angle of the side wall with respect to the cavity floor varies around the at least one LED chip.

8. The LED package according to claim 7, wherein the angle of the side wall is in the range of 5 to 25 degrees on one side of the at least one LED chip and in the range of 25 to 50 degrees on the opposite side of the at least one LED chip.

9. The LED package according to claim 1, wherein one or more of the sides of the main body are continuously flat between the top surface and the bottom surface of the main body.

10. The LED package according to claim 9, wherein one or more of the sides are inclined inward from the bottom surface toward the top surface.

11. Light-emitting diode (LED) package, A body having a top surface, a bottom surface, and one or more side surfaces that define the top surface and the bottom surface, wherein the body has a plurality of cavities formed on the top surface of the body, and the one or more side surfaces are continuously flat between the top surface and the bottom surface, A plurality of LED chips, wherein each cavity of the plurality of cavities comprises at least one LED chip from the plurality of LED chips, A plurality of leads electrically coupled to the plurality of LED chips, wherein the plurality of leads extend from one or more sides to the outside of the main body, A sealing material that forms a plurality of lenses on the upper surface of the main body An LED package equipped with [specific features / features].

12. The LED package according to claim 11, wherein a portion of the plurality of leads extending outward from one or more sides of the main body is coplanar with the bottom surface of the main body.

13. The LED package according to claim 11, wherein one or more of the sides are inclined inward from the bottom surface toward the top surface.

14. The LED package according to claim 11, wherein a separate lens among the plurality of lenses is resisted in a separate cavity among the plurality of cavities.

15. The LED package according to claim 14, wherein the lens shape of each separate lens of the plurality of lenses is configured to direct the light emission of maximum intensity in a direction offset from the center of each cavity.

16. The LED package according to claim 15, wherein the lens shape has only one line of symmetry.

17. The LED package according to claim 14, wherein the sealing material comprises a flash portion extending between adjacent lenses of the plurality of lenses.

18. The LED package according to claim 17, wherein the upper surface is continuously flat between the opposite sides of the main body surrounding the upper surface, and the flash portion extends on the upper surface to a position within 1 mm from the opposite side of the main body.

19. The LED package according to claim 11, wherein each of the plurality of cavities comprises a cavity floor and a side wall extending between the upper surface of the main body and the cavity floor, and the angle of the side wall with respect to each cavity floor varies around each cavity.

20. The main body has a rectangular shape with a long side and a short side, The plurality of cavities are arranged linearly in the direction corresponding to the long side, The LED package according to claim 11, wherein each of the plurality of cavities has a single line of symmetry oriented parallel to the long side.

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