Combined stimulation devices for pain management and physical therapy

Abstract

A combined stimulation device for pain management and physical therapy according to an embodiment of the present invention includes: a first electrode having a predetermined surface area exposed to the outside to form a stimulation surface; a thermoelectric element that absorbs / excites heat on one side when an applied current is applied, causing the other side to heat / absorb heat, and one side of the element is in contact with the back of the electrode to supply cool or hot air; a block-shaped first heat sink having a predetermined thickness and in contact with the other side of the thermoelectric element; a second heat sink coupled to the first heat sink, on which a pin array is formed that constitutes a surface area for releasing heat into the atmosphere; a fan that generates airflow on the second heat sink; and a control board with a circuit configuration that controls the thermoelectric element or the first electrode to control medium-frequency stimulation by the first electrode or heat absorption / excitement of the thermoelectric element to form a cool or warm stimulation on the stimulation surface, wherein the second heat sink is arranged such that the pins of the pin array protrude toward the rear of the device when the stimulation surface faces the front of the device.

Description

Technical Field

[0001] The present invention relates to a composite stimulation device for pain management and physical therapy. In particular, it provides a portable handpiece that can treat medical cold stimulation, heat stimulation, and medium-frequency composite stimulation, and relates to a composite stimulation device that can be used for various indications.

Background Art

[0002] Generally, heat and inflammation occurring in a lesion (treatment site) destroy cells and delay the treatment process. Conventionally, as medical equipment used for treatment management of lesions and treatment equipment, there are cold stimulators and heat stimulators. A cold stimulator constricts blood vessels in a restricted part and temporarily reduces the size of blood cells, but such a vasoconstriction effect reduces the amount of blood flowing to the wound site. Cold stimulation temporarily suppresses nerve transmission, relieves pain, minimizes cell destruction at the wound site, and can relieve edema and inflammation.

[0003] In addition, cold stimulation has the advantage of facilitating drug absorption. The fact that cold stimulation is more effective than electrical stimulation in drug absorption is disclosed in the 2002 paper "FARMACOTERAPIA A LOCALIZZAZIONE MIRATA MEDIANTE 「CRIOELETTROFORESI」 NELLE PATOLOGIE ARTICOLARI E MUSCOLARI" by A. Aloisi, M. Matera, and R. Potenza. According to the paper, it can be seen that when maintaining the temperature at -5°C to 0°C using ice or the like, drug absorption is the smoothest. Indications for cryotherapy by cold stimulation include acute contusions, muscle spasms, muscle rigidity, tachycardia, functional cardiac arrhythmia, myofasciitis, fascial disorders, sprains, muscle pain, pain relief, and reduction of bleeding.

[0004] On the other hand, thermal stimulators treat abnormal areas by applying thermal stimulation. Thermal stimulators can provide a compress effect by applying thermal stimulation to mild pain such as muscle pain and joint pain, and may help improve blood circulation. Indications for thermal compress therapy using thermal stimulation include increased blood flow, muscle relaxation, increased metabolism, pain relief, and increased tissue viscoelasticity. Hot and cold stimulation can be used not only for medical purposes but also for cosmetic skin care. Hot and cold stimulation enhances stimulation by supplying warm or cold air to the skin, providing balance to the body and relieving fatigue, which is useful for maintaining clear and elastic skin. Thermoelectric elements are used as components in such cold and heat stimulation generating devices. One type of thermoelectric element is the Peltier element, which utilizes the Peltier effect, a phenomenon in which heat is absorbed or generated by electric current. Traditionally, water cooling was used to lower the temperature of the electrodes below freezing point using Peltier elements. While water cooling offers high cooling efficiency, it has the disadvantage of requiring a separate component to cool the water, making the device complex and increasing manufacturing costs. It also has the inconvenience of requiring separate management of the cooling water and carries the risk of leakage or frostbite. Furthermore, water-cooled devices using Peltier elements have the disadvantage of requiring a large volume for the stimulation device product to achieve high efficiency.

[0005] To address this, the applicant disclosed an air-cooled cold / heat stimulation generating device in the prior application, Patent Document 1. In the aforementioned prior patent, the applicant disclosed a stimulation device that is air-cooled and capable of both cold and hot stimulation, comprising a heat exchanger including a thermoelectric element, a heat block, a heat pipe, and a heat pin. However, the aforementioned prior patent technology of the present applicant had limitations in that, due to the characteristics of the air-cooled heat exchanger, the heat pins had to be formed sufficiently in the longitudinal direction, resulting in a somewhat large volume in the head portion of the product and a poor center of gravity, which made it less user-friendly. In addition, because the heat exchanger occupied a large volume, it was not easy to mount a separate battery and charging module on the handpiece, and it was inconvenient to use it while connected to a power cable.

[0006] On the other hand, in addition to temperature-based treatments using cold and warm stimulation, medium-frequency electrical stimulation is primarily used as a physical therapy method to stimulate and relax muscles. Medium-frequency stimulation works by transmitting medium-frequency current to the muscles via electrodes, resulting in muscle stimulation and relaxation. By physically stimulating the muscles, medium-frequency stimulation can promote blood circulation within the muscles and reduce inflammation. Indications for medium-frequency therapy include pain regulation, muscle contraction / relaxation, increased blood flow, absorption of edema / hematoma, inflammation relief, accelerated wound healing, and increased urination.

[0007] As mentioned above, the indications and effects of thermal stimulation can create synergy with those of medium-frequency therapy. Combined thermal and medium-frequency stimulation can significantly improve muscle pain relief and recovery speed, and may be particularly effective for pain relief and physical therapy for athletes.

[0008] The applicant has devised a composite stimulation device that can be realized as a rechargeable handpiece with a built-in battery, by improving the air-cooled cooling structure to ensure sufficient heat conduction performance while minimizing the volume of the product, adding a medium-frequency electrode structure to the stimulation part, and minimizing the space occupied by the heat block and substrate. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Korean Registered Patent No. 1193935 [Overview of the project] [Problems that the invention aims to solve]

[0010] The present invention aims to provide a combined stimulation device that generates cold and thermal stimulation using an air-cooling method and can simultaneously apply cold and thermal stimulation and medium-frequency stimulation. [Means for solving the problem]

[0011] A combined stimulation device for pain management and physical therapy according to an embodiment of the present invention includes: a first electrode having a predetermined surface area exposed to the outside to form a stimulation surface; a thermoelectric element that absorbs / excites heat on one side when an applied current is applied, causing the other side to heat / absorb heat, and one side of the element is in contact with the back of the electrode to supply cool or hot air; a block-shaped first heat sink having a predetermined thickness and in contact with the other side of the thermoelectric element; a second heat sink coupled to the first heat sink, on which a pin array is formed that constitutes a surface area for releasing heat into the atmosphere; a fan that generates airflow on the second heat sink; and a control board with a circuit configuration that controls the thermoelectric element or the first electrode to control medium-frequency stimulation by the first electrode or heat absorption / excitement of the thermoelectric element to form a cool or warm stimulation on the stimulation surface, wherein the second heat sink is arranged such that the pins of the pin array protrude toward the rear of the device when the stimulation surface faces the front of the device.

[0012] According to one embodiment, when the stimulating surface faces the front, the first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan may be arranged in that order and on the same axis as the stimulating surface.

[0013] According to one embodiment, a compound layer may be formed on the contact surface where the first heat sink and the second heat sink are joined together.

[0014] According to one embodiment, a compound layer may be formed on the contact surface where the first electrode and the thermoelectric element are bonded.

[0015] According to one embodiment, the compound layer is a layer to which a viscous liquid phase is applied, and may include thermal grease, thermal conductive paste, thermal conductive silicone, or thermal conductive composite.

[0016] According to one embodiment, the first electrode further includes a second electrode formed at a distance from the outer circumferential surface of the first electrode, the second electrode being in contact with the skin of a human body and functioning as a ground electrode, and the stimulation surface can be formed by including the first electrode and the second electrode.

[0017] According to one embodiment, the first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan are provided on the stimulating part that constitutes the head of the housing, the control board is provided on the handle part of the housing, and the handle part may include a rechargeable battery that supplies power to the control board.

[0018] According to one embodiment, the handle portion is divided into a first area and a second area, the control board is provided in the first area, and the battery is provided in the second area.

[0019] According to one embodiment, the control board may be provided in the first area in a stacked structure in which a first control board and a second control board are stacked. [Effects of the Invention]

[0020] According to the present invention, a heat dissipation module is composed of a block-shaped first heat sink capable of effectively absorbing and storing heat applied to a thermoelectric element, and a second heat sink on which a pin array for heat dissipation is formed. The first heat sink is made of a metal material formed to a predetermined thickness while minimizing the surface area, resulting in a high heat capacity, and can transfer and store heat from the thermoelectric element so that heat does not accumulate in the thin-volume thermoelectric element. The second heat sink is configured to transfer the heat stored in the first heat sink to the air and release it, and has a structure with a large surface area. The present invention combines the two types of heat sinks to improve the air-cooled cooling efficiency of the thermoelectric element, and the improved cooling efficiency minimizes the volume of the second heat sink, so that the stimulation part of the housing does not become long, and a composite stimulation device can be realized with a small handpiece.

[0021] Furthermore, the present invention improves the efficiency of heat conduction by forming a compound layer on the bonding surface where two types of heat sinks are joined. When fastening two types of metal heat sinks using screws or the like, it is theoretically impossible for the two metal surfaces to be joined to be in complete contact. The compound layer is a viscous liquid phase that improves heat conduction, and by forming a layer on the bonding surface, it causes the effect of completely bonding the first heat sink and the second heat sink, which can significantly improve the heat conduction efficiency from the first heat sink to the second heat sink.

[0022] In addition, in the present invention, the first electrode and the second electrode are both configured on the stimulation surface, and the ground electrode is in contact with the skin together, so that the leakage current is minimized during medium-frequency stimulation, the stimulation efficiency is improved, and the usability of the product for the user can be ensured.

Brief Description of the Drawings

[0023] [Figure 1] It is a perspective view of a composite stimulation device according to an embodiment of the present invention. [Figure 2] It is an exploded view of the stimulation part of the composite stimulation device. [Figure 3] It is a heat sink according to an embodiment of the present invention. [Figure 4] It is an exploded view of a handle part according to an embodiment of the present invention. [Figure 5] It is an item configuration for an experiment of a heat sink according to an embodiment of the present invention. [Figure 6] It is a diagram showing the structure of the heat sink of the item according to the experimental example of FIG. 5. [Figure 7] It is a diagram showing the measurement state of the experimental example of FIG. 5.

Modes for Carrying Out the Invention

[0024] The various embodiments described in this document are exemplified for the purpose of clearly explaining the present invention and the disclosed technical idea, and are not intended to limit it to a specific embodiment. The technical idea of the present invention and the disclosure includes various modifications, equivalents, alternatives of each embodiment described in this document, and embodiments selectively combined from all or part of each embodiment. Also, the scope of rights of the technical idea of the present invention and the disclosure is not limited to the embodiments presented below and the specific explanations related thereto.

[0025] Including technical or scientific terms, the terms used in this document may have a meaning generally understood by those with ordinary knowledge in the technical field to which the present invention and the disclosure belong, unless otherwise defined. Expressions such as "includes," "may include," "equip," "may possess," and "may possess" used in this document mean that the feature in question is a function, operation, or component, and do not exclude the existence of other additional features. In other words, such expressions should be understood as open-ended terms that imply the possibility of including other embodiments.

[0026] The singular expressions used in this document may imply plural meanings unless otherwise specified in the context, and this also applies to the singular expressions used in the claims.

[0027] Expressions used in this document such as “A, B, and C,” “A, B, or C,” “A, B, and / or C,” or “at least one of A, B, and C,” “at least one of A, B, or C,” “at least one of A, B, and / or C,” “at least one selected from A, B, and C,” “at least one selected from A, B, or C,” and “at least one selected from A, B, and / or C” can mean each listed item or all possible combinations of the listed items. For example, “at least one of A and B” could mean (1) A, (2) at least one of A, (3) B, (4) at least one of B, (5) at least one of A and at least one of B, (6) at least one of A and B, (7) at least one of B and A, or (8) A and B.

[0028] As used in this document, the expression "based on" is used to describe one or more factors that influence the act or action of decision, judgment, or action described in the phrase or sentence containing the expression, and this expression does not exclude any additional factors that may influence the act or action of decision, judgment, or action.

[0029] In this document, the expression that one component (e.g., component 1) is “connected” or “linked” to another component (e.g., component 2) may mean not only that component 1 is directly connected or linked to the other component, but also that it is connected or linked through a new other component (e.g., component 3).

[0030] The expression "configured to" as used in this document can mean, depending on its component, "to be set up to do something," "to have the ability to do something," "to be modified to do something," "to be made to do something," or "to be able to do something," and is distinct from the meaning of "consist."

[0031] Various embodiments of this disclosure will be described below with reference to the attached drawings. In the attached drawings and the descriptions to which the drawings are attached, identical or substantially equivalent components may be given the same reference numerals. In addition, in the descriptions of the various embodiments below, identical or corresponding components may be omitted from the description, but this does not mean that the component is not included in that embodiment.

[0032] Figure 1 is a perspective view of a composite stimulation device 1 according to an embodiment of the present invention.

[0033] Referring to Figure 1, the combined stimulation device 1 may be provided as a housing for a handpiece, and the housing may consist of a stimulation section 10 in which the first electrode 11 and the second electrode 12 are exposed, and a handle section 30. The combined stimulation device 1 may include, as an internal component, the first electrode 11, the second electrode 13, a thermoelectric element 20, a first heat sink 31, a second heat sink 33, a fan 70, and a control board 60.

[0034] The stimulator 10 is provided with a first electrode 11, a second electrode 13, a thermoelectric element 20, a first heat sink 31, a second heat sink 33, and a fan 70, and can constitute the head of the housing. The stimulator 10 can perform medium frequency, cold stimulation, and warm stimulation with the configuration described below. The stimulator 10 is air-cooled, with the fan 70 cooling the heat sinks 31 and 33 to cool the thermoelectric element 20. The stimulator 10 has a ventilation opening 101 formed in the housing where the heat sinks 31 and 33 are located, to quickly discharge the hot air generated from the heat sinks 31 and 33 to the outside.

[0035] In this embodiment, the thermoelectric element 20 may be a thermistor, which is an element that utilizes the temperature change of electrical resistance; an element that utilizes the Seebeck effect, which is a phenomenon in which an electromotive force is generated by a temperature difference; or a Peltier element that utilizes the Peltier effect, in which heat is absorbed or generated by an electric current.

[0036] The first electrode 11 can form a stimulation surface by exposing a predetermined surface area to the outside. The second electrode 13 can be formed at a distance from the outer circumferential surface of the first electrode 11. The second electrode 13 is in contact with the skin of the human body and functions as a ground electrode, and a stimulation surface can be formed including the first electrode 11 and the second electrode 13. In this embodiment, the first electrode 11 is disc-shaped and can form a stimulation surface with a predetermined polarity in the center, causing the central part to bulge. The second electrode 13 is circular and band-shaped, and is provided outside the first electrode 11, separated from it so as not to conduct electricity with the first electrode 11. An insulating material can be inserted into the space separated from the first electrode 11 and the second electrode 13. The stimulation surface formed by the first electrode 11 and the second electrode 13 is designed so that the first electrode 11 and the second electrode 13 make contact simultaneously when they come into contact with the user's skin, due to the polarity of the first electrode 11. The second electrode 13 is in contact with the skin and grounded, forming a voltage difference with the first electrode 11, and a medium-frequency stimulus is applied to the skin surface in contact with it. Furthermore, the temperature of the first electrode 11 can be varied by the thermoelectric element 20 on the rear surface, which will be described later, and can simultaneously transmit cold or warm stimuli to the skin.

[0037] Figure 2 is an exploded view of the stimulation unit 10 of the combined stimulation device 1. Referring to Figure 2, in this embodiment, when the stimulation surface faces forward, the combined stimulation device 1 can be arranged in the following order: first electrode 11, thermoelectric element 20, first heat sink 31, second heat sink 33, and fan 70, and can be arranged on the same axis as the stimulation surface.

[0038] When an applied current is generated, one side of the thermoelectric element 20 absorbs / excites heat, while the other side emits / absorbs heat, and one side can come into contact with the back surface of the first electrode 11, supplying cool or hot air.

[0039] Of note is that, in this embodiment, the configuration of the air-cooled heat exchanger is such that the first electrode 11 is in contact with the front of the thermoelectric element 20, and the first heat sink 31 and the second heat sink 33 are sequentially connected to the rear. For example, if the thermoelectric element 20 is a Peltier element, the rear of the thermoelectric element 20 absorbs heat when the front of the thermoelectric element 20 generates heat, and the rear generates heat when the front of the thermoelectric element 20 absorbs heat. Generally, since both sides of the thermoelectric element 20 generate heat, heat dissipation structures are usually placed on both the front and rear. However, in this embodiment, the front of the thermoelectric element 20 is in direct contact with the user's skin and transmits cold and warm air due to heat absorption or generation, so the heat dissipation structure is limited to being placed on the rear of the thermoelectric element 20. More specifically, in order for the heat absorption function to be exerted on the rear of the thermoelectric element 20, it is important to rapidly cool the rear of the thermoelectric element 20 when it generates heat. This is because, when the thermoelectric element 20 is changed from a thermal stimulus to a cold stimulus, the cooled rear surface of the thermoelectric element 20 can generate heat again, allowing the heat absorption operation to proceed smoothly at the front surface.

[0040] Therefore, unlike the heat exchanger structure of a typical thermoelectric element 20, the thermoelectric element 20 in this embodiment has a design constraint that prevents the placement of heat dissipation structures on both the front and rear surfaces of the thermoelectric element 20, and that the heat dissipation structure should only be formed on one of the surfaces, the rear surface. Consequently, the performance of air cooling on the rear surface determines whether or not a product capable of simultaneously providing both cold and warm stimulation can be realized.

[0041] The heat dissipation structure according to this embodiment will be described in detail below. The first electrode 11 may have a bonding portion 110 formed on its rear surface. The bonding portion 110 is a groove that accommodates the thermoelectric element 20, and is configured so that the thermoelectric element 20 is inserted and bonded. In this case, it is preferable that the bonding portion 110 is a groove with partition walls formed so that it can contact not only the front surface but also the side surface of the thermoelectric element 20. The thermoelectric element 20 is contact-bonded to the first electrode 11 via the bonding portion 110, and a compound layer 5 may be formed on the front surface of the thermoelectric element 20 that is inserted and bonded to the first electrode 11. In this embodiment, in order to improve the cooling efficiency of the heat sinks configured in one direction, the first heat sink 31 and the second heat sink 33 may have a compound layer 5 formed on the contact surfaces where they are bonded. Also, the first electrode 11 and the thermoelectric element 20 may have a compound layer 5 formed on the contact surfaces where they are bonded.

[0042] In this embodiment, the compound layer 5 is a layer to which a viscous liquid phase is applied, and may include thermal grease, thermal conductive paste, thermal conductive silicone, or thermal conductive composite.

[0043] The compound layer 5 increases the thermal conductivity due to the characteristics of the element, but what is noteworthy here is that the compound is applied in a viscous liquid phase. This is because the compound layer 5 fills the fine non-contact voids at the metal-to-metal bonding surface, further improving the thermal conductivity from metal to metal.

[0044] In this embodiment, the heat sinks 31 and 33 are composed of two pieces: a first heat sink 31 and a second heat sink 33. The thermoelectric element 20 is provided in the form of a relatively thin plate due to its characteristics. Therefore, the thermoelectric element 20 has a low heat capacity due to the characteristics of its material. In this embodiment, the reason why the heat sinks are provided in two pieces is, firstly, to accommodate the low heat capacity of the thermoelectric element 20, the first heat sink 31 is made of a block-shaped metal material to form a volume and have a high heat capacity, and secondly, to prevent the thermoelectric element 20 from becoming thick too quickly due to the high heat capacity, the first heat sink 31 is configured to contain the heat first, and then the second heat sink 33 is configured to have a high surface area to cool it.

[0045] In this process, it is noteworthy that a compound layer 5 is formed between the first heat sink 31 and the second heat sink 33. When the metal materials of the first heat sink 31 and the second heat sink 33 are joined, the compound layer 5 fills the fine irregularities and voids on the metal joining surfaces with a viscous liquid phase to ensure complete contact, thereby significantly improving the thermal conductivity between the metals.

[0046] Figure 3 shows heat sinks 31 and 33 according to an embodiment of the present invention.

[0047] Referring to Figure 3, the first heat sink 31 is in contact with the other side of the thermoelectric element 20 and may be provided in a block shape having a predetermined thickness. A compound layer 5 may be applied to the upper part of the first heat sink 31. Screw holes may also be formed in the upper part of the first heat sink 31 for coupling with the second heat sink 33.

[0048] The second heat sink 33 is coupled to the first heat sink 31, and a pin array can be formed that constitutes a surface area for releasing heat into the atmosphere. The pin array may be in the form of a large number of plate-shaped rods arranged in a row, with irregularities formed to create a high surface area. Screw holes may be formed in the second heat sink 33 for coupling with the first heat sink 31. Both the first heat sink 31 and the second heat sink 33 are made of a metallic material with high thermal conductivity, and thus they can be coupled using screws. In the assembly process, no matter how strongly the two metals are fastened using screws, it is not possible to achieve a state of complete contact between the contact surfaces of the first heat sink 31 and the second heat sink 33 due to the characteristics of metalworking. Furthermore, if the design involves forming a large number of screw holes in the first heat sink 31 and the second heat sink 33 to strengthen the fastening and further enhance contact, a sufficient pin array cannot be formed in the second heat sink 33, and cooling efficiency cannot be ensured. Therefore, the fastening of the first heat sink 31 and the second heat sink 33 is a major design consideration in order to ensure cooling efficiency, and in this embodiment, the compound layer 5 is formed in such a way that it increases thermal conductivity while achieving close contact between the two metals.

[0049] On the other hand, the second heat sink 33 can be positioned such that when the stimulation surface faces forward, the direction in which the pins of the pin array protrude is towards the rear. The fan 70 located at the rear of the head can generate airflow over the second heat sink 33. This is because, in the embodiment of the heat exchanger configuration described above, sufficient thermal conductivity and cooling efficiency are set, so even if the pin array of the second heat sink 33 is not secured in both the vertical and longitudinal directions relative to the product in Figure 1, the hot and cold stimulation can be realized. In short, the heat exchange configuration according to this embodiment can be configured such that the second heat sink 33 faces towards the rear relative to the product in Figure 1, and air cooling is performed directly from the fan 70 located at the rear, forming a desirable assembly structure in terms of cooling efficiency. Furthermore, by configuring the second heat sink 33 to face the rear, the stimulation part 10 is formed to be shorter in the front-to-back direction relative to the product in Figure 1, which can stabilize the pressure and improve the user's feel.

[0050] Figure 4 is an exploded view of the handle portion 30 according to an embodiment of the present invention.

[0051] A control board 60 is provided in the handle portion 30, and a rechargeable battery 40 may be included to supply power to the control board. The control board 60 has a circuit configuration that controls the thermoelectric element 20 or the first electrode 11, and can control the medium-frequency stimulation by the first electrode 11 or the heat absorption / heat generation of the thermoelectric element 20, thereby forming a cold or warm stimulation on the stimulation surface.

[0052] Referring to Figure 4, the handle portion 30 is divided into a first area 301 and a second area 303, with the control board 60 provided in the first area 301 and the battery 40 provided in the second area 303.

[0053] The control board 60 has a stacked structure in which a first control board 601 and a second control board 603 are stacked, and may be provided in the first area 310. For example, the first control board 601 may be equipped with a medium-frequency module, and the second control board 603 may be equipped with an electrode supply module for controlling the thermoelectric element 20. The first control board 601 and the second control board 603 may have a connecting portion 600 formed for stacked coupling. The connecting portion 600 may be provided as pins for supplying power, and the second control board 603 may share the power applied to the first control board 601 via the connecting portion 600.

[0054] <Example of a heat sink experiment - Performance experiment of a heat sink> The following describes performance experiments of the first heat sink 31 and the second heat sink 33 according to the embodiment of the present invention disclosed in Figure 3. The disclosed first heat sink 31 and the second heat sink 33 will be compared with the heat dissipation structure of the first-generation product described in Patent Document 1, which is the applicant's prior invention.

[0055] This experiment confirms that the thermal / cooling efficiency of the heat sink structure in this embodiment, which consists of two pieces, differs from that of the heat sink with and without a compound layer. This experiment is described in detail below.

[0056] Figure 5 shows the item configuration for the experiment of heat sinks 31 and 33 according to an embodiment of the present invention. Figure 6 shows the structure of the heat sink item according to the experimental example in Figure 5. Referring to Figures 5 and 6, Test item 1 and Test item 2 are items that use a two-piece heat dissipation module comprising a first heat sink 31 and a second heat sink 33 according to the embodiment in Figure 3 described above, and will be referred to as the "new type" below. Both Test item 1 and Test item 2 are equipped with a first heat sink 31 and a second heat sink 33, but Test item 1 uses a module that forms a compound layer 5, while Test item 2 is an item that does not form a compound layer 5, and the two are distinguished from each other.

[0057] Test specimens 3 and 4 are related products of the present applicant disclosed in Patent Document 1, and both use a heat dissipation module consisting of a single heat sink. Hereinafter, this will be referred to as the "old type." Although test specimens 3 and 4 are equipped with the same heat dissipation module, test specimen 3 uses a module with a compound layer 5 formed at its lower end, while test specimen 4 is an item without a compound layer 5, and the two are distinguished accordingly.

[0058] Figure 7 shows the measurement process in an experimental example.

[0059] The testing method is as follows: After checking the ambient temperature to confirm it is the same as the initial experimental environment, a thermometer chip is connected to the electrode lead of the test specimen. After checking the surface temperature of the electrode lead to activate the test specimen, the cooling mode and heating mode of the test specimen are activated. The change in the surface temperature of the electrode lead is measured in 10-second increments for a maximum of 2 minutes using a second clock. The cooling mode and heating mode were measured once each for each test specimen. The measurement conditions are shown in Table 1.

[0060] [Table 1]

[0061] The criteria for performance evaluation are as follows: The cooling mode was selected based on the fastest decrease in the electrode surface temperature time. The heating mode was selected based on the fastest increase in the electrode surface temperature time.

[0062] The experimental results are as follows: Table 2 shows the results of the cooling performance measurement experiment.

[0063] [Table 2]

[0064] Referring to Table 2, the cooling performance test results showed that the performance was evaluated in the order of Test 1 > Test 3 > Test 4 > Test 2. The experimental results confirm that the compound layer 5 has a greater impact on cooling performance than the two-piece structure of the heat sink. Next, it can be confirmed that without the compound layer 5, the heat dissipation module consisting of a two-piece first heat sink 31 and a second heat sink 33 has superior cooling performance.

[0065] When both compound layers 5 were present, test sample 1, consisting of the first heat sink 31 and the second heat sink 33, showed a temperature difference of 5.9°C in cooling performance compared to test sample 3, which consisted of a single heat sink.

[0066] Furthermore, test specimen 1, which has a compound layer 5 and consists of a first heat sink 31 and a second heat sink 33, showed a temperature difference of 6.9°C in cooling performance compared to test specimen 4 which has a conventional heat sink module.

[0067] Table 3 shows the results of the thermal performance measurement experiment.

[0068] [Table 3]

[0069] Referring to Table 3, the thermal performance test results showed only minor differences with little temperature variation. However, in this experiment, it was confirmed that the presence or absence of compound layer 5 produced a significant difference of approximately 5°C in the same two-piece heat sink structure.

[0070] While the technical concept of the present invention and its disclosure has been explained by the embodiments described herein, the technical concept of the present invention may include a variety of substitutions, modifications, and alterations that can be understood by a person with ordinary skill in the art to which the present invention pertains. Furthermore, such substitutions, modifications, and alterations may be understood to be included within the scope of the attached claims. [Industrial applicability]

[0071] This invention can significantly improve muscle pain relief and muscle expansion speed through a combination of cold and heat stimulation and medium-frequency stimulation, and can be effectively used in physical therapy. [Explanation of symbols]

[0072] 1: Complex stimulation device 5: Compound layer 10: Stimulation part 11: 1st electrode 13:Second electrode 20: Thermoelectric element 30: Handle section 31: 1st heat sink 33:Second heat sink 110: Binding part 101: Ventilation vent 301:First area 303:Second Area 40: Battery 60: Control board 600: Connection part 601: First control board 603: Second control board 70: Fan

Claims

1. A combined stimulation device for pain management and physical therapy, A first electrode having a predetermined surface area exposed to the outside to form a stimulating surface, A thermoelectric element in which one side absorbs / excites heat when an applied current is applied, causing the other side to heat / absorb heat, and one side of which is in contact with the back surface of the first electrode to supply cool air or hot air, A block-shaped first heat sink having a predetermined thickness is in contact with the other side of the thermoelectric element, A second heat sink is coupled to the first heat sink and has a pin array formed on it that constitutes a surface area for releasing heat into the atmosphere, A fan that generates airflow over the second heat sink, A circuit configuration for controlling the thermoelectric element or the first electrode includes a control substrate that controls the medium-frequency stimulation by the first electrode or the heat absorption / heat generation of the thermoelectric element to form a cold or warm stimulation on the stimulation surface, A combined stimulation device for pain management and physical therapy, characterized in that the second heat sink is arranged such that when the stimulating surface faces the front of the device, the pins of the pin array protrude toward the rear of the device.

2. A combined stimulation device for pain management and physical therapy according to claim 1, characterized in that when the stimulation surface faces the front, the first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan are arranged in that order and are on the same axis as the stimulation surface.

3. The combined stimulator for pain management and physical therapy according to claim 1, characterized in that a compound layer is formed on the contact surface where the first heat sink and the second heat sink are joined together.

4. The combined stimulation device for pain management and physical therapy according to claim 1, characterized in that a compound layer is formed on the contact surface where the first electrode and the thermoelectric element are bonded.

5. The aforementioned compound layer is A composite stimulator for pain management and physical therapy according to claim 3 or 4, characterized in that it is a layer coated with a viscous liquid phase, comprising thermal grease, thermal conductive paste, thermal conductive silicone, or thermal conductive composite.

6. The first electrode further includes a second electrode formed at intervals on the outer circumferential surface of the first electrode, The aforementioned second electrode is in contact with the skin of the human body and functions as a ground electrode. A combined stimulation device for pain management and physical therapy according to claim 1, characterized in that the stimulation surface is formed by including the first electrode and the second electrode.

7. The first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan are provided on the stimulating part that constitutes the head of the housing. The control board is provided on the handle portion of the housing. The combined stimulation device for pain management and physical therapy according to claim 1, characterized in that the handle portion includes a rechargeable battery that supplies power to the control board.

8. The aforementioned handle portion is, It is divided into two areas: Area 1 and Area 2. The control board is provided in the first area. The combined stimulation device for pain management and physical therapy according to claim 7, characterized in that the battery is provided in the second area.

9. The control board is A combined stimulation device for pain management and physical therapy according to claim 8, characterized in that it has a stacked structure in which a first control board and a second control board are stacked, and is provided in the first area.

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