Device with an improved hold-down device

Abstract

The apparatus (100, 101, 102) is for processing a substrate (300) in a processing chamber (400), and the apparatus (100, 101, 102) includes a hold-down device (500, 501, 502) configured to apply a hold-down force to at least a portion of the substrate (300) when in use. The processing chamber is provided with a hold-down opening (270) for receiving an actuator member (520) of the hold-down device, thereby allowing the hold-down force to be applied directly from outside the processing chamber (400) when in use.

Description

Technical Field

[0001] The present invention relates to an apparatus for processing substrates such as lead frames. The present invention further relates to an apparatus for applying solder onto a substrate. Furthermore, the present invention relates to an apparatus for dispensing solder onto a substrate. The present invention also relates to an apparatus for joining components to a substrate.

Background Art

[0002] From the background art, various apparatuses for processing substrates are known.

[0003] DE102014116939A1 discloses a hold-down device comprising a plate with at least one central recess accessible to a bonding die and further recesses arranged adjacent to both sides of the central recess, a hold-down plate with recesses, a hold-down web, first and second pneumatic drive devices, and a pressure line for supplying compressed gas to the pressure chambers of the pneumatic drive devices. Each pneumatic drive device comprises a cylinder and a drive element with a pressure chamber formed therebetween. The cylinder of the first pneumatic drive device is further fixed onto one recess and the cylinder of the second pneumatic drive device is further fixed onto another recess.

[0004] US5878939A describes manufacturing solid solder in the form of a wire or rod guided through a longitudinal hole in a guide tube, separate from the measured portion of liquid solder. The region including the end of the tube is heated above the melting point of the solder to melt it. In contrast, the adjacent region of the guide tube is cooled, maintaining a positionally stable temperature change within the tube. This controls the amount of molten solder present above the narrowed outlet. A drive mechanism advances the solder in stages so that the solid solder acts like a piston, ejecting a portion of the liquid solder from the outlet. A suitable apparatus for applying solder to a substrate can be raised and lowered. The base of the apparatus has a mold connected to the outlet, which can be mounted on the substrate, with a molding cavity opening on the underside. This defines and limits the area on the substrate that is wetted by the liquid solder. The primary application is joining semiconductor chips (components) by soft soldering.

[0005] CH704991A1 describes a method for mounting semiconductor chips (components) onto a substrate surface, such as a lead frame. It also describes a method for lowering a pin into the soldered area until the pin contacts the substrate surface, and then applying a predetermined force to the pin to press it against the substrate. Ultrasound is applied to the pin, generating ultrasonic waves within the pin in a direction perpendicular or at an angle to the substrate surface. The pin moves along a predetermined path parallel to the substrate surface. The pin rises until it is cut from the soldered area. A method for mounting semiconductor chips (components) onto the substrate is also described.

[0006] Generally, for reliable, repeatable, and reproducible processing of substrates, it is preferable to perform one or more operations in a controlled processing environment. Conventional apparatuses can provide this by sealing the processing position during processing. Hold-down devices (or down holders) can also be used to hold the substrate against a support for at least part of the processing steps. However, if the various components of the hold-down device are heated unevenly, especially when processed at temperatures much higher than the ambient temperature of the apparatus, inaccuracies and damage can occur.

[0007] Therefore, part of the hold-down device is typically integrated into the upper wall of the chamber for the process environment. If this upper wall is designed to be opened for offline access, for example by having one or more lids or hatches, the hold-down force during use is substantially determined or influenced by the force required to close one or more lids and / or the closing force of one or more lids is greater than the hold-down force. [Overview of the Initiative]

[0008] The object of the present invention is to provide an apparatus suitable for processing substrates having an improved hold-down device that can regulate the hold-down force during operation.

[0009] To solve this problem, a technical apparatus according to an independent claim is provided. Technically advantageous embodiments are the subject of the dependent claims, this specification, and the drawings.

[0010] According to one embodiment, this problem is solved by providing an apparatus for processing substrates.

[0011] Such devices include, for example, chip processing devices or devices for processing semiconductor dies. Generally, such devices provide a processing environment suitable for processing substrates within a processing chamber, and the substrates are configured to be processed within this processing environment.

[0012] Within the scope of this disclosure, “processing” means any action that can be performed on or using a substrate. In the context of the present invention, “processing” includes individual processing steps, the entire process, or sequences such as measurement or inspection, solder application, solder supply, solder formation, solder pre-pressure, component bonding, component inspection, substrate inspection, bonded semiconductor wafer inspection, holder inspection, pre-processing step inspection, or post-processing step inspection.

[0013] According to the present invention, successive individual processing steps, processes, or sequences are performed at the same processing location, different processing locations within the same apparatus, processing locations within different apparatuses, or any combination thereof.

[0014] The processing chamber of the apparatus includes an upper chamber wall that extends along a first axis and along a second axis that is perpendicular to the first axis.

[0015] The substrate is configured to be processed at a first processing location during use.

[0016] Suitable substrates for processing are generally any object having at least one processing surface. Examples of suitable substrates for processing include metal substrates, also known as lead frames, where components are soldered onto chip islands, preferably arranged front-to-back and adjacent to one another. However, the present invention is not limited to lead frames, and one or more substrates are any object having preferably at least one bondable surface. One or more substrates can also be described as one or more media.

[0017] A component is any object having at least one bondable surface, such as a semiconductor wafer, chip, integrated circuit, or substrate. A component can be any shape, such as rectangular, square, or circular.

[0018] The apparatus includes a hold-down device that, during use, applies a hold-down force to at least a portion of the substrate along a third axis perpendicular to the first and second axes, to a mount on which the substrate is held in a first processing position, or to a support on which the substrate is placed in the first processing position.

[0019] This has the advantage that during processing, the substrate is firmly pressed against a suitable support configured to hold or provide the substrate during processing in order to receive the substrate before processing, preferably for suitable mounting.

[0020] In embodiments of the apparatus, the mount or support is substantially either a fixed mount or fixed support, or a movable mount or movable support, and in either case, is preferably designed as a detachable or replaceable mount or support. Preferably, these mounts or supports can be exposed to a vacuum, and preferably the support is formed as a so-called substrate chuck.

[0021] This has the advantage of making the circuit board safer against slippage.

[0022] The device embodiment firmly holds the substrate when in contact with the mount. Preferably, the processing apparatus includes a mount in the form of a carrier arm, preferably with a fork-shaped medium carrier, configured to transport the substrate to the processing position.

[0023] Embodiments of the apparatus for processing substrates are preferably suited for bonding components to the substrate.

[0024] The upper wall of the processing chamber is provided with a hold-down opening for receiving at least one actuator element of a hold-down device. The actuator member is configured such that, during use, the hold-down force received directly from outside the processing chamber is applied to at least a portion of the substrate (300), thereby additionally ensuring the substrate is safe from slippage.

[0025] Preferably, a portion of the upper wall of the chamber is configured to be openable, allowing access to at least a portion of the interior of the processing chamber.

[0026] By providing a hold-down opening in the wall of the processing chamber of a device for processing substrates, and providing an actuator member extending from the outside of the processing chamber to the hold-down device, technical advantages can be obtained, such as independently determining and / or precisely regulating the hold-down force applied within the device in comparison to other mechanical forces within the device.

[0027] Preferably, this can also provide a high degree of thermal isolation for temperature-sensitive components such as actuator drive devices.

[0028] Preferably, a part of the upper wall of the chamber is configured to be able to open so as to provide access to at least a part of the interior of the processing chamber. When at least a part of the chamber wall is configured as a lid or hatch that can be opened, for example, to physically access the processing environment, the hold-down force is largely independent of the force required to close this lid.

[0029] The part of the chamber wall that can be opened is preferably configured to be able to open without human intervention and / or automatically.

[0030] The possibility of applying a large force to the substrate is advantageous for holding larger and heavier substrates, such as those used in high-performance and electrified applications, in a predetermined position. Such a large and heavy substrate, when a larger force is applied, the resulting force will be in a direction opposite to the closing direction of the lid, so it is not practical with conventional hold-down devices. Additionally, when at least a part of the chamber wall is configured as a lid, the lid can be opened without removing a part of the hold-down device.

[0031] Embodiments of the device include one or more processing heads functionally configured similarly to grippers, the one or more processing heads are configured to move in the positive and negative directions along a third axis, and the processing aperture is configured to accommodate the one or more processing heads.

[0032] Embodiments of the device include a processing head for applying solder onto a substrate for soldering.

[0033] This has the advantage that the processing head is functionally similar to a solder dispenser for applying solder to components for soldering.

[0034] The apparatus embodiment includes a processing head for forming solder on a substrate for soldering.

[0035] The embodiment of the apparatus further comprises a processing head that is detachably attached to a component and configured to be positioned together with the component at a first processing position.

[0036] Embodiments of the apparatus further include processing heads for performing substrate inspection, component inspection, mount or support inspection, post-processing inspection, and / or pre-processing inspection.

[0037] In embodiments of the apparatus, the upper wall of the chamber is provided with a processing opening for capturing one, several, or all of the processing heads, the processing opening being configured to accommodate at least one processing head, and the processing opening being configured to allow at least one processing head to move along a third axis toward and / or away from a first processing position, the third axis being perpendicular to the first axis and perpendicular to the second axis.

[0038] In the embodiment of the apparatus, the processing opening and the hold-down opening are separate openings in the upper wall of the chamber.

[0039] In the embodiment of the apparatus, the hold-down device comprises one or more hold-down protrusions attached to the actuator element, and the one or more hold-down protrusions are configured to directly apply the hold-down force received from the actuator element to at least a portion of the substrate during use.

[0040] In one embodiment of the apparatus, the hold-down device includes a hold-down drive unit configured outside the processing chamber to apply a hold-down force to an actuator element.

[0041] By positioning the hold-down drive unit outside the processing chamber, a high degree of thermal isolation is provided between the hold-down drive unit and the processing chamber. The hold-down device is configured to apply a hold-down force to at least a portion of an additional substrate along a third axis at a second processing position during use, and this additional hold-down force is applied directly to at least a portion of one or more additional substrates from outside the processing chamber using an actuator element during use.

[0042] In embodiments of the apparatus, the hold-down device comprises a hold-down member extending outward from the processing chamber along a second axis and configured to apply a hold-down force to an actuator member. Preferably, the first end of the hold-down member comprises a drive attachment for mounting to a hold-down drive unit located outside the processing chamber, and the second end of the hold-down member comprises a pivot point configured to convert at least a portion of the movement of the hold-down member by the operation of the hold-down drive unit into a rotational amount around the first axis during use, and the hold-down member is fixed to the actuator member so that, during use, at least a portion of the rotational amount around the first axis is converted into a movement of the actuator member toward the substrate at a first processing position along a third axis, thereby applying a hold-down force to the actuator member.

[0043] In embodiments of the apparatus, the processing chamber is configured to provide one or more processing environments during use. Preferably, the processing opening is configured to provide one or more gas curtains that allow predetermined and / or controlled flow for the inflow and / or outflow of gas into and out of one or more processing environments during use. Preferably, the hold-down opening is configured to provide one or more gas curtains that allow predetermined and / or controlled flow for the inflow and / or outflow of gas into and out of one or more processing environments during use.

[0044] In embodiments of the apparatus, the processing chamber comprises a lower chamber wall extending along a first axis and a second axis. Preferably, the lower chamber wall and the support are integrally formed or fixed to each other by morphological and force fitting.

[0045] In the embodiment of the apparatus, the apparatus comprises one or more heaters and / or one or more heating elements configured to raise the temperature of at least a portion of one or more surfaces of the substrate to be processed.

[0046] Preferably, one or more heaters and / or one or more heating elements are attached to the processing head. Preferably, one or more heaters or one or more heating elements are housed in or attached to the processing chamber.

[0047] In one embodiment of the apparatus, the processing chamber is configured to receive components, and the substrate is configured to receive and hold components during processing.

[0048] In embodiments of the apparatus, the components are semiconductor wafers, semiconductor packages, chips, integrated circuits, substrates, or any combination thereof.

[0049] In embodiments of the apparatus, the apparatus includes a medium carrier configured to move along a first axis to position a substrate at a first processing location. Preferably, the medium carrier and the support are connected integrally or by morphological and force fittings.

[0050] In embodiments of the apparatus comprising a media carrier, the media carrier is preferably integrally connected to a support or connected to a support by shape and force, and is configured to move along a first axis to position a substrate at a first processing position, and the media carrier is preferably configured to move the substrate along the first axis to position the substrate at one or more further positions for substrate loading, solder application to at least a portion of the substrate processing position, solder distribution in at least a portion of the substrate processing position, substrate processing, and / or substrate removal.

[0051] In embodiments of the apparatus comprising a media carrier, the media carrier is preferably integrally connected to a support or connected to a support by shape and force, and is configured to move along a first axis to position a substrate at a first processing position, the media carrier is preferably configured to move the substrate along the first axis to position the substrate at one or more further positions for substrate loading, solder application to at least a portion of the substrate processing position, solder distribution to at least a portion of the substrate processing position, substrate processing, and / or substrate removal, the apparatus comprises a further processing head for detachably fixing to a further component, which is preferably configured to be positioned at a second processing position together with the further component, and the media carrier is configured to move along the first axis and / or a second axis to position the further substrate at the second processing position.

[0052] In embodiments of the apparatus comprising a media carrier, the media carrier is preferably integrally connected to a support or connected to a support by shape and force, and is configured to move along a first axis to position the substrate at a first processing position, and the media carrier is preferably configured to move the substrate along the first axis to position the substrate at one or more further positions for substrate loading, solder application to at least a portion of the substrate processing position, solder distribution to at least a portion of the substrate processing position, substrate processing, and / or substrate removal.

[0053] In embodiments of the apparatus comprising a media carrier, the media carrier is preferably integrally connected to a support or connected to a support by shape fitting and force fitting, and is configured to move along a first axis to position a substrate at a first processing position, and the media carrier is preferably configured to move the substrate along the first axis to position the substrate at one or more further positions for substrate loading, solder application to at least a portion of the substrate processing position, solder distribution to at least a portion of the substrate processing position, substrate processing, and / or substrate removal. Embodiments of such apparatus also preferably include a further processing head for detachably fixing to a further component, the further processing head being configured to be positioned at a second processing position together with the further component, and the media carrier being configured to move along the first axis and / or a second axis to position a further substrate at a second processing position. [Brief explanation of the drawing]

[0054] The advantages and features of the present invention will become clear from the following drawings.

[0055] [Figure 1A-1B] This is a cross-sectional view of a part of the equipment suitable for processing. [Figure 2A-2B] This is a cross-sectional view of a part of the equipment suitable for processing. [Figure 3A-3B] This is a cross-sectional view of a part of the equipment suitable for processing. [Figure 4] This is a perspective view of a hold-down device. [Figure 5] This is a perspective view of some of the equipment suitable for processing. [Figure 6] This is a perspective view of some of the equipment suitable for processing. [Figure 7A] This is a cross-sectional view of a part of a device suitable for processing when the hold-down device is not applying hold-down force to the substrate. [Figure 7B] This is a cross-sectional view of a part of a device suitable for processing when a hold-down device is applying a hold-down force to a substrate. [Figure 8]This is a cross-sectional view of a part of a processing apparatus where the lid portion of the upper wall of the chamber is configured as a lid or hatch and is opened to access the processing environment. [Modes for carrying out the invention]

[0056] The drawing shows a first axis 910, a second axis 920, and a third axis 930. The first axis 910 is substantially perpendicular to the second axis 920, and the third axis 930 is substantially perpendicular to both the first axis 910 and the second axis 920.

[0057] It is convenient to have the first axis 910 in the X direction, the second axis 920 in the Y direction, and the third axis 930 in the Z direction.

[0058] During use, the first axis 910 and the second axis 920 are substantially horizontal, and the third axis 930 is substantially vertical. In the drawings, the parts are illustrated in these conventional orientations to clarify the description of the different components. Furthermore, relative expressions such as up and down, left and right, and base are also used in accordance with this convention. However, the apparatus described herein may also be configured by those skilled in the art to operate with deviations from these conventional orientations and nominal coordinate axes.

[0059] Figures 1A and 1B are simplified schematic cross-sectional views of a part of the first embodiment (or first embodiment 100) of the processing apparatus 100.

[0060] Figure 1A shows a longitudinal section in a plan view, including a first axis 910 nominally representing the positive direction from left to right, and a third axis 930 nominally representing the positive direction from bottom to top. The second axis 920 is nominally represented as the positive direction in the depth direction of the drawing. The longitudinal section passes through the first processing position 800.

[0061] Figure 1B shows a planar cross-sectional view including a second axis 920, nominally shown as the positive direction from left to right, and a third axis 930, nominally shown as the positive direction from bottom to top. The first axis 910 is nominally shown as the positive direction in the depth direction of the drawing. The longitudinal section passes through the first processing position 800.

[0062] The first embodiment 100 includes an arbitrary processing head 150 that is detachably attached to the component 600 and configured to be positioned together with the component 600 at the first processing position 800.

[0063] Figures 1A and 1B illustrate a component 600 released from the processing head 150 at a first processing position 800. Prior to these figures, the component 600 is selected (or loaded) by the processing head 150 at a selected (or loaded) position (not shown), moved to the first processing position 800, and released from the processing head 150. For example, the component 600 may be arbitrarily selected from a component handling system such as a wafer or tape. Similarly, prior to this operation, the substrate 300 may be arbitrarily moved to the first processing position 800 using a suitable media carrier (not shown).

[0064] Figures 1A and 1B illustrate the first embodiment 100 during processing at a first processing position 800. Figure 1A is a simplified schematic cross-sectional view of a portion of the first embodiment 100 at the first processing position 800, indicated by the line 1A-1A shown in Figure 1B. Figure 1B is a simplified schematic cross-sectional view of a portion of the first embodiment 100 at the first processing position 800, indicated by the line 1B-1B shown in Figure 1A. As shown, the component 600 is in contact with the substrate 300 and can perform one or more processing operations on at least a portion of one or more processing surfaces (not shown) of the substrate 300. The processing head 150 may move in the positive and negative directions along the third axis 930 toward or away from the substrate 300, respectively. Optionally, the processing head 150 is configured to rotate about the third axis 930 (not shown).

[0065] The first embodiment 100 comprises a processing chamber 400 configured to receive a component 600. The processing chamber 400 comprises an upper chamber wall 410 extending along a first axis 910 and a second axis 920, and a lower chamber wall 420 extending along the first axis 910 and the second axis 920. Optionally, the processing chamber 400 is configured to reduce the degree of oxidation of at least a portion of the substrate 300. Optionally, the processing chamber 400 is configured to reduce the amount of oxide on the processing surface of the substrate 300 by filling the processing chamber with an inert gas. Optionally, the first embodiment 100 comprises one or more processing gas inlets (not shown) for introducing an inert gas (not shown) into a processing environment 700 (processing environment 700) inside the processing chamber 400 during use, the processing environment 700 being predetermined and / or controlled to be suitable for the type of processing to be performed. The inert gas is any suitable inert gas such as nitrogen, carbon dioxide, helium, neon, argon, krypton, or any combination thereof. One or more inert gases are optionally mixed with one or more less inert gases. Typical combinations include a 5% hydrogen / 95% nitrogen ratio or a 10% hydrogen / 90% nitrogen ratio. Optionally, the first embodiment 100 is configured to replace oxygen from the processing environment 700, thereby creating a relatively low-oxygen processing environment for processing with relatively low inert gas consumption. This is particularly advantageous when the process includes one or more thermocompression bonding (or TC) steps.

[0066] As shown in Figures 1A and 1B, the upper chamber wall 410 includes a processing opening 250 configured to receive the processing head 150 as it moves along the third axis 930 toward the substrate 300 at the first processing position 800. Generally, the processing opening 250 is sized larger than the external dimensions of the processing head 150. Optionally, if the processing head is functionally configured similarly to a gripper and the external dimensions of component 600 are larger than those of the processing head 150, the processing opening 250 is sized larger than the external dimensions of component 600. Optionally, the processing opening 250 is configured to provide one or more gas curtains that allow a predetermined and / or controlled flow of inert gas to the outside of the processing environment 700. In the example shown in Figures 1A and 1B, the processing opening 250 extends around the processing head 150. Optionally, it may be advantageous to reduce the average spacing of at least a portion of the processing openings 250 by attaching sealing lips to the upper chamber wall 410 and / or the processing head 150. Optionally, it may be advantageous to reduce gas consumption by pre-determining and / or controlling the dimensions of the processing environment and any openings so that the required processing environment has a relatively small volume. Optionally, a portion of the upper chamber wall is configured to be openable and closable to allow access to at least a portion of the interior of the processing chamber. Optionally, the processing openings 250 are covered by a processing opening cover connected to the processing head 150 and moving together with the processing head along a first axis 910 and / or a second axis 920. The cover is designed to cover at least a portion of the processing openings 250.

[0067] The first embodiment 100 includes a hold-down device 500 (or a first modification 500 of the hold-down device) configured to apply a hold-down force to at least a portion of the substrate 300 along a third axis 930 relative to a support 320 at a first processing position 800 during use. The upper chamber wall 410 includes a hold-down opening 270 that at least receives an actuator member 520 of the hold-down device 500, allowing the actuator member 520 of the hold-down device 500 to directly apply a hold-down force to at least a portion of the substrate 300 from outside the processing chamber 400 during use. The hold-down force generates a force acting against the upper chamber wall in conventional solutions. However, due to the configuration of the apparatus 100, particularly the configuration of the hold-down device 500 and the pivot point of the upper chamber wall 410, the effect of the hold-down force on the upper chamber wall 410 is less than 10%, less than 5%, or less than 1%. Optionally, the hold-down opening 270 may be configured to provide one or more gas curtains that allow a predetermined and / or controlled flow of gas to the outside of the processing environment 700 when in use.

[0068] In the example shown in Figures 1A and 1B, the hold-down device 500 includes a first member 510 extending along a second axis 920 outside the processing chamber 400 and configured to directly apply a hold-down force to the actuator member 520 of the hold-down device 500. The actuator member 520 of the hold-down device 500 is any element or component that can be configured to directly apply a hold-down force to at least a portion of the substrate 300 from outside the processing chamber 400. The actuator member 520 of the hold-down device 500 includes one or more sub-members that are firmly attached to each other. The illustrated hold-down device 500 includes one or more hold-down protrusions 541, 542 attached to the actuator member 520 of the hold-down device 500, and the one or more hold-down protrusions 541, 542 are configured to directly apply the hold-down force transmitted by the actuator member 520 of the hold-down device 500 to at least a portion of the component 600 when in use. More specifically, in the illustrated example, one or more hold-down projections 541, 542 are each two extending projections configured to be positioned along the first axis 910 near the edge of the component 600.

[0069] In the non-limiting examples shown in Figures 1A and 1B, the actuator member 520 extends along a third axis 930 and along a second axis 920. The actuator member 520 is attached to one or more hold-down protrusions 541, 542 and is configured to transmit the hold-down force received by the actuator member 520 to one or more hold-down protrusions 541, 542. In some configurations, it is advantageous for the actuator member 520 to have multiple hold-down sub-members that are firmly attached to one another in order to enable efficient force transmission. If an optional first hold-down member 510 is provided, the first hold-down member 510 is attached to the actuator member 520 and is configured to transmit the hold-down force received by the first hold-down member 510 to the actuator member 520.

[0070] By providing a hold-down opening 270 in the upper chamber wall 410 of the processing chamber 400, and an actuator member 520 extending from the outside of the processing chamber 400 to at least a portion of the component 600, the applied hold-down force can be predetermined and / or controlled to a high degree independently of other mechanical forces within the apparatus. For example, the hold-down force thus generated is highly independent of other forces generated using one or more walls of the processing chamber 400. Optionally, a portion of the upper chamber wall is configured to open and close to allow access to at least a portion of the interior of the processing chamber. For example, even if at least a portion of the upper chamber wall 410 is configured as a lid (or hatch) that can be opened for physical access to the processing environment 700, the hold-down force applied via the actuator member 520 is highly independent of the force required to close this lid. In other words, the hold-down device 500 is highly mechanically isolated by providing one or more gaps between the wall of the hold-down opening 270 and the portion of the actuator member 520 that passes through the hold-down opening 270. For example, the maximum hold-down force applied to the substrate 300 at the first processing position 800 is 75 Newtons (N). The ability to apply greater forces is advantageous for securely holding larger and heavier components, such as those used in current high-power and electrified applications. These larger and heavier substrates present a problem for conventional hold-down devices because applying greater forces results in a force that is in the opposite direction to closing the lid.

[0071] Additionally or alternatively, advanced thermal isolation is provided. For example, temperature-sensitive components of a hold-down device 500, such as a drive unit, are located outside the processing environment 700, and such temperature-sensitive components can be highly thermally isolated, especially when the processing chamber is heated to a temperature of 250-500°C, as determined by the material being processed. Preferably, advanced thermal isolation is provided using one or more air gaps between the walls of the processing chamber 400 and the temperature-sensitive components.

[0072] Preferably, a portion of the upper wall of the chamber is configured to be openable and closable to allow access to at least a portion of the interior of the processing chamber. If at least a portion of the upper wall of the chamber 410 is configured as a lid that can be opened for physical access, it is advantageous to configure the components of the hold-down device 500 on the outside of the processing chamber 400 so that they can be easily removed or moved so as not to interfere with the lid.

[0073] Preferably, the first embodiment 100 includes one or more heaters and / or one or more heating elements (not shown) configured to heat or warm at least a portion of one or more surfaces of the substrate 300 to be processed during use. Preferably, one or more heaters or one or more heating elements are included in the processing head 150. Additionally or alternatively, one or more heaters and / or one or more heating elements are included in the processing chamber (400). One or more heaters and / or one or more heating elements may supply heat to one or more workable surfaces using conduction, convection, radiation, or any combination thereof. When the first embodiment 100 is used in a processing process that includes one or more heating operations, such as thermocompression bonding (TC) operations, the use of one or more heaters is advantageous. For example, it is required to heat at least a portion of one or more work surfaces to a temperature of 250 to 500°C, which depends on the material to be processed. For this purpose, one or more heaters and / or one or more heating elements with a heating capacity of 500°C or higher are included in the processing head 150. Additionally or alternatively, one or more heaters and / or heating elements with a heating capacity of 550 to 600°C are included within the lower wall 420 of the chamber.

[0074] It is also advantageous to generate and / or maintain the necessary processing environment while heating one or more component processing surfaces. Preferably, the first embodiment 100 is configured to apply bonding pressure to at least a portion of one or more processing surfaces of the substrate 300 during use. For example, a bonding force of up to 500 N (Newtons) is applied to generate such bonding pressure.

[0075] As shown in Figures 1A and 1B, the processing opening 250 and the hold-down opening 270 may be arranged to overlap at least partially. In other words, the processing opening 250 and the hold-down opening 270 are continuous (or combined) openings in the upper wall 410 of the chamber.

[0076] Figures 2A and 2B are simplified schematic cross-sectional views of a part of the second embodiment (or second embodiment 101) of the processing apparatus 101. The second embodiment 101 has the same functions as the first embodiment 100 described above, and may have any of the functions and features described above. The second embodiment 101 has the same features as the first embodiment 100 described above, except for the following differences A01 to A03.

[0077] A01: The processing opening 250 and the hold-down opening 270 are separate openings in the upper wall 410 of the chamber. In the example shown in Figures 2A and 2B, the processing opening 250 and the hold-down opening 270 are separated along a first axis 910. Additionally or alternatively, the processing opening 250 and the hold-down opening 270 are separated along a second axis 920.

[0078] ·A02: The second embodiment 101 comprises a second modification 501 (or second modification 501) of the hold-down device 501. The second modification 501 is similar to the first modification 500, except that the actuator member 520 extends substantially further in the negative direction along the first axis 910, and the hold-down force received from the first hold-down member 510 is transmitted to one or more hold-down protrusions 541, 542. This may be advantageous for thermal separation because it allows for a reduction in the number and size of openings in the upper wall 410 of the chamber, which is located directly above the first processing position 800.

[0079] ·A03: Figure 2A is a simplified schematic cross-sectional view of a portion of the second embodiment 101 at the first processing position 800, as shown by line 2A-2A in Figure 2B. Figure 2B is a simplified schematic cross-sectional view of a portion of the second embodiment 101 at the first processing position 800, as shown by line 2B-2B in Figure 2A.

[0080] Figures 3A and 3B are simplified schematic cross-sectional views of a third embodiment (or third embodiment 102) of the processing apparatus 102. The third embodiment 102 has the same functions as the first embodiment 100 and the second embodiment 101 described above, and may similarly have any of the above-described functions and features. The third embodiment 101 has the same features as the second embodiment 102 described above, except for the following differences B01 to B07.

[0081] ·B01: The third embodiment 102 includes a second processing position 805. In the illustrated example, the second processing position 805 is separated from the first processing position 800 along the first axis 910, and the functions and features provided at the second processing position 805 are similar to those provided at the first processing position 800. Additionally or alternatively, the first processing position 800 and the second processing position 805 are separated along the second axis 920. The processing provided at the second processing position 805 is identical, similar, analogous, or different from the processing provided at the first processing position 800.

[0082] ·B02: In the illustrated example, the processing of the third embodiment 102 includes an additional processing head 1150. The functions and features provided by the additional processing head 1150 are similar to those provided by the processing head 150. Additionally or alternatively, the third embodiment 102 is configured to move the processing head 150 between a first processing position 800 and a second processing position 805, so that the same processing head 150 can be used at one or more processing positions 800, 805.

[0083] ·B03: In the illustrated example, the second processing location 805 is configured to process an additional substrate 1300 by being firmly held by an additional support 1320. Additionally or alternatively, the second processing location 805 is configured to process an additional component 1600 in parallel with the processing performed at the first processing location 800.

[0084] ·B04: The third embodiment 102 includes a further processing opening 1250 in the chamber wall 410, separate from the processing opening 250 and the hold-down opening 270. In the illustrated example, the further processing opening 1250 and the processing opening 250 are separated along the first axis 910. Additionally or alternatively, the further processing opening 1250 and the processing opening 250 are separated along the second axis 920.

[0085] ·B05: The third embodiment 102 comprises a third modification (or third modification 502) of the hold-down device 502. The actuator member 520 is substantially further extended along the positive direction of the first axis 910, and the hold-down force received from the first hold-down member 510 is transmitted to one or more additional hold-down protrusions 1541, 1542 provided at the second processing position 805, except that the actuator member 520 is substantially further extended in the negative direction along the first axis 910, and the hold-down force received from the first hold-down member 510 is also transmitted to one or more hold-down protrusions 541, 542 provided at the first processing position 800, except that the actuator member 520 is substantially further extended along the negative direction of the first axis 910, and the hold-down force received from the first hold-down member 510 is also transmitted to one or more hold-down protrusions 541, 542 provided at the first processing position 800, for example, the maximum hold-down force applied to the substrates 300, 1600 at each processing position 800, 805 is 75 Newtons (N).

[0086] ·B06: A further processing environment 1700 is provided between a further substrate 1300 and a further processing head 1150 at a second processing position 805 inside the processing chamber 400. The further processing environment 1700 is predetermined and / or controlled to be suitable for processing. Optionally, a processing environment 1700 is provided that is identical, similar, analogous, or different from the processing environment 700 at the first processing position 800.

[0087] ·B07: Figure 3A is a simplified schematic cross-sectional view of a portion of the third embodiment 102 at the first processing position 800 and the second processing position 805, as shown by the line 3A-3A in Figure 3B. Figure 3B is a simplified schematic cross-sectional view of a portion of the third embodiment 102 at the second processing position 805, as shown by the line 3B-3B in Figure 3A.

[0088] Figure 4 is a perspective view of the third modified example 502 and an enlarged perspective view of the actuator member 520 and the hold-down protrusions 541, 542. In a non-limiting example, the actuator member 520 extends in the negative direction along the third axis 930 and extends in both the positive and negative directions along the second axis 920.

[0089] A third modification 502 includes a first hold-down member 510 that extends along the second axis 920 and is configured to directly apply a hold-down force to the actuator member 520. The first hold-down member 510 is configured to extend outside the processing chamber (not shown in Figure 4). The following embodiments C01 to C04 are shown in Figure 4 and are not shown or not fully shown in Figure 3A or Figure 3B.

[0090] ·C01: The illustrated example shows the configuration of the first hold-down member 510 in more detail. The first hold-down member 510 includes a first end with a drive attachment 550 for mounting to a hold-down drive device (not shown). The first hold-down member 510 includes a second end with a pivot point 570 configured to convert at least a portion of the movement of the first hold-down member 510 by the operation of the hold-down drive device 560 into a rotational amount around the first axis 910 when in use.

[0091] ·C02: The illustrated example shows the configuration of the actuator member 520 in more detail. The attachment of the first hold-down member 510 to the actuator member 520 is configured such that, during use, at least a portion of the amount of rotation around the first axis 910 is converted into the amount of movement of the actuator member 520 along the third axis 930 toward the support (not shown) at the first processing position 800, thereby transmitting the hold-down force received by the hold-down member 510 to the actuator member 520.

[0092] • C03: In the illustrated example, possible configurations of hold-down protrusions 541, 542 attached to the actuator member 520 are illustrated in more detail. These hold-down protrusions 541, 542 are two extended finger-shaped hold-down protrusions 541, 542, each extending in the negative direction along the first axis 910, and are positioned near the edge of a component (not shown).

[0093] ·C04: In this example, the third embodiment 502 also includes additional hold-down protrusions 1541, 1542 attached to the actuator member 520. These hold-down protrusions 1541, 1542 are hidden behind the first member 510 and are therefore not shown in the viewpoint shown in Figure 4. The additional hold-down protrusions 1541, 1542 are two extended finger-like projections that extend in the positive direction along the first axis 910, similar to the hold-down protrusions 541, 542, and each is configured to be positioned near the edge of a component (not shown).

[0094] Figure 5 is a further perspective view of a portion of the processing chamber 400 included in the third embodiment 102 (or third embodiment 102) of the joining device. The third embodiment 102 comprises a third modification (or third modification 502) of the hold-down device 502 described with respect to Figure 4. However, Figure 5 shows the third modification 502 after assembly and after the processing chamber 400 has been closed. In other words, the third embodiment 102 is shown in a state ready for processing. The following embodiments D01 to D09 are illustrated in Figure 5 and are not illustrated or not fully illustrated in Figure 3A or Figure 3B.

[0095] ·D01: The third embodiment 102 includes a hold-down drive device 560 configured to be located outside the processing chamber 400. The hold-down drive device 560 is connected to a drive attachment 550 of the first hold-down member 510, and the hold-down drive device 560 applies a hold-down force to the first end of the first hold-down member 510, which in use generates a rotational amount around the first shaft 910, specifically, a rotational amount around a pivot point 570 provided at the second end of the first hold-down member 510.

[0096] ·D02: In the illustrated example, the first hold-down member 510 extends outward from the processing chamber 400 along the second axis 920 and is configured to apply a hold-down force to an actuator member (not shown). The actuator member is hidden behind the upper wall 410 of the chamber and behind the first hold-down member 510 and is therefore not shown in Figure 5. The first end of the first hold-down member 510 is provided with a drive attachment 550, shown attached to the hold-down drive unit 560, so that the third embodiment 102 is ready for component processing. The second end of the first hold-down member 510 is provided with a pivot point 570 attached to the third embodiment 102 so as to convert at least a portion of the movement of the first hold-down member 510 by the operation of the hold-down drive unit 560 into a rotational amount around the first axis 910 when in use.

[0097] ·D03: The first hold-down member 510 extends along the outer surface of the upper chamber wall 410 between the pivot point 570 and the drive attachment 550. The first hold-down member 510 is positioned above the hold-down opening 270 and is attached to an actuator member (not shown) and is configured to transmit the hold-down force received by the first hold-down member 510 to the actuator member (not shown) via the hold-down opening 270. In the illustrated example of Figure 5, the hold-down opening 270 is separate from the processing opening 250 and also separate from the further processing opening 1250.

[0098] ·D04: In Figure 5, the processing head and further processing heads are not shown. The upper chamber wall 410 includes a processing opening 250 configured to receive a processing head (not shown) as the processing head (not shown) moves along a third axis 930 toward a support (not shown). Similarly, the upper chamber wall 410 includes another further processing opening 1250 configured to receive a further processing head (not shown) as the further processing head (not shown) moves along a third axis 930 toward a further support (not shown). Additionally or alternatively, as described above, the further processing opening 1250 is configured to receive a processing head (not shown). In the illustrated example in Figure 5, the openings 250, 270, and 1250 in the upper chamber wall 410 are shown to have a substantially rectangular cross-section. However, any convenient cross-sectional shape may be used.

[0099] ·D05: In the example shown in Figure 5, one of the hold-down protrusions 542 is illustrated, but it is shown as being visible through the processing opening 250. In this perspective view, the second hold-down protrusion is hidden. Similarly, in Figure 5, one of the further hold-down protrusions 1541 is shown through the further processing opening 1250. In this perspective view, the second further hold-down protrusion is hidden.

[0100] ·D06: The pivot point 570 is firmly mounted such that, when in use, at least a portion of the movement of the first hold-down member 510 is converted into a rotational amount around the first axis 910. Optionally, as illustrated in Figure 5, the mechanical attachment 580 of the pivot point 570 is firmly mounted to the outer surface of the processing chamber 400. Optionally, as illustrated in Figure 5, the mechanical attachment 580 is firmly mounted to a suitable portion of the lower wall 420 of the chamber. Optionally, it is advantageous to firmly mount the pivot point 570 to a component that is highly mechanically separated from the processing chamber 400, thereby providing a high degree of mechanical separation between the third modification 502 of the hold-down device and the processing chamber 400. Optionally, the high degree of mechanical separation is provided by using one or more gaps between the processing chamber 400 and the component to which the pivot point 570 is firmly mounted.

[0101] ·D07: The hold-down drive unit 560 is firmly mounted such that a hold-down force is generated at the first end of the first hold-down member 510 when in use. Optionally, the hold-down drive unit 560 is firmly mounted to the outer surface of the processing chamber 400. Optionally, the hold-down drive unit 560 is firmly mounted to a suitable portion of the upper wall 410 of the chamber. Optionally, as illustrated in Figure 5, the hold-down drive unit 560 is firmly mounted to a component that is highly mechanically separated from the processing chamber 400, thereby providing a high degree of mechanical separation between the third modification 502 of the hold-down device and the processing chamber 400. Additionally or alternatively, a high degree of thermal separation between the third modification 502 and the processing chamber 400 is provided. Optionally, a high degree of thermal and / or mechanical separation is provided using one or more gaps between the wall of the processing chamber 400 and the temperature-sensing hold-down drive unit 560. The hold-down drive device 560 may generate and provide the hold-down force by any appropriate means, such as mechanical, electrical, magnetic, sensitive, pneumatic, hydraulic, or any combination thereof.

[0102] ·D08: The third embodiment 102 includes an optional further processing position 810. In the illustrated example, the further processing position 810 is located away from the first processing position 800 along the first axis 910 and also away from the second processing position 805 along the first axis 910. Additionally or alternatively, the further processing position 800 and the second processing position 805 are separated along the second axis 920. In the illustrated example, since the processing chamber 400 does not extend to the further processing position, the functions and features provided at the further processing position 805 are different from those provided at the first processing position 800 and also different from those provided at the second processing position 810. The processing provided at the further processing position 810 is similar to or different from the processing provided at the second processing position 805 and also similar to or different from the processing provided at the first processing position 800. In the illustrated example, the second processing position 805 is located between the first processing position 800 and the further processing position 810. For example, a solder application process is provided at a first processing position 800, a solder pre-pressurization process is provided at a second processing position 805, a joining process is provided at a further processing position 810, a third modification of the hold-down device 502 is configured to firmly hold a component (not shown) during solder application and solder pre-pressurization, and a third embodiment 102 of the processing apparatus is configured to move the soldered component to a further processing position 810 for joining.

[0103] ·D09: Optionally, a component drive (not shown) is provided at least partially within the processing chamber 400 to move one or more components between separate processing positions. For example, a media carrier or substrate handler is provided to move one or more components. For example, one or more components are moved using index pins (not shown), which are configured to be received in holes corresponding to one or more components, and one or more components move within the processing chamber between processing positions 800, 805, and 810.

[0104] Figure 6 is a further perspective view of a portion of the processing chamber 400 included in the third embodiment 102 (or third embodiment 102) of the bonding apparatus. The third embodiment 102 comprises a third modification (or third modification 502) of the hold-down device 502 described with respect to Figure 4. However, Figure 6 shows the third modification 502 during assembly or maintenance and before closing the processing chamber 400 for use, and a portion of the chamber upper wall 410 is optionally configured to open as a lid for access to the inside of the processing chamber 400. In other words, the third embodiment 102 shows the third embodiment 102 when it is not being used for processing. For example, opening the lid portion of the chamber upper wall 410 may allow physical access to the processing environment, supports, components, or modules or devices contained within the processing chamber 400. The following embodiments E01 to E03 are illustrated in Figure 6 and are not illustrated or not fully illustrated in Figure 3A or Figure 3B.

[0105] ·E01: In the illustrated example, the hold-down drive device 560 and drive attachment 550 of the first hold-down member 510 are detached from each other, and the first hold-down member 510 can rotate around the first shaft 910 at a pivot point (not shown). Optionally, as in the illustrated example of Figure 6, a mechanical attachment 580 at the pivot point (not shown) is firmly attached to a suitable portion of the lower chamber wall 420, allowing the first hold-down member 510 to rotate around the first shaft 910 together with the lid of the upper chamber wall 410. Optionally, the hold-down drive device 560 and / or drive attachment 550 are configured to allow for quick removal and / or quick installation.

[0106] ·E02: In the illustrated example, the hold-down drive unit 560 is firmly attached to a component that is mechanically highly separated from the processing chamber 400. Optionally, the high degree of mechanical separation is provided by one or more gaps between the processing chamber 400 and the component to which the hold-down drive unit 560 is firmly attached. In the illustrated example, the hold-down drive unit 560 is not firmly attached to the upper wall 410 of the chamber, and the lid of the upper wall 410 of the chamber is rotatable around the first shaft 910.

[0107] ·E03: Optionally, the lid of the upper chamber wall 410 is provided with one or more hinges (not shown) configured to allow rotation around a first axis 910 for opening and closing. Optionally, it is advantageous to position a pivot point (not shown) on substantially the same axis of rotation as one or more hinges (not shown).

[0108] Figures 7A and 7B are simplified schematic cross-sectional views of a portion of the processing chamber included in the third embodiment (or third embodiment 102) of the bonding apparatus 102. The third embodiment 102 includes a third modification (or third modification 502) of the hold-down device 502 described with respect to Figure 4. However, Figures 7A and 7B show the third modification 502 after assembly and after the processing chamber has been closed. The third embodiment 102 shows two timings during processing, with Figure 7A showing the third modification 502 of the hold-down device before a hold-down force is applied to the substrate 300, and Figure 7B showing the third modification 502 of the hold-down device with a hold-down force applied to the substrate 300. The following embodiments F01 to F07 are illustrated in Figures 7A and 7B, but are not illustrated or not fully illustrated in Figure 3A or Figure 3B.

[0109] ·F01: The third embodiment 102 includes a hold-down drive device 560 located outside the processing chamber. The hold-down drive device 560 is connected to a drive attachment 550 of the first hold-down member 510, and the hold-down drive device 560 can apply a hold-down force to the first end of the first hold-down member 510. In the illustrated example, the hold-down drive device 560 is arranged to drive along a hold-down drive shaft 960 that is not parallel to the third shaft 930.

[0110] F02: The first hold-down member 510 extends outward from the processing chamber and is oriented along the first hold-down member axis 923. The first hold-down member 510 is configured to rotate around the pivot point 570 so that a hold-down force is applied to the actuator member 520.

[0111] ·F03: The first hold-down member 510 is attached to the actuator member 520 via the actuator member pivot point 571 and is configured to transmit the hold-down force received by the first hold-down member 510 through the hold-down opening 270.

[0112] ·F04: In the illustrated example, the actuator member 520 extends substantially further in the negative direction along the first axis 910 and can transmit the hold-down force received from the first hold-down member 510 to one or more hold-down protrusions 541, 542. In the illustrated example, one or more hold-down protrusions 541, 542 are two extended protrusions extending along the first axis 910. In Figure 7A, the first hold-down member 510 is shown in a non-operating position, and one or more hold-down protrusions 541, 542 are not applying a large force to the substrate 300. In Figure 7B, the first hold-down member 510 is shown in an operating position, and one or more hold-down protrusions 541, 542 are applying a large force to the substrate 300.

[0113] ·F05: In the example shown in the figure, the hold-down drive unit 560 is firmly attached to the outer surface of the processing chamber. In other words, the hold-down drive unit 560 is not attached to the chamber front wall 430 of the processing chamber 400, and this gap provides a high degree of mechanical isolation from the processing chamber in a third modification 502. Additionally or alternatively, a high degree of thermal isolation is provided by a large air gap between the temperature-sensing hold-down drive unit 560 and the chamber front wall 430.

[0114] ·F06: In the illustrated example, the substrate 300 is positioned at the processing location, and one or more processing operations can be performed on at least a portion of one or more processing surfaces (not shown) of the substrate 300. One or more hold-down protrusions 541, 542 are configured to apply the hold-down force transmitted by the actuator member 520 directly to at least a portion of the substrate 300 when in use. In the illustrated example of Figure 7B, one or more hold-down protrusions 541, 542 are configured to be positioned along the first axis 910 in close proximity to the edge of the substrate 300.

[0115] ·F07: In Figure 7A, the hold-down drive device 560 is shown in the non-operating position, the actuator (not shown) of the hold-down drive device 560 is firmly attached to the drive attachment 550, and the first hold-down member shaft 923 is substantially parallel to the second shaft 920. In Figure 7B, the hold-down drive device 560 is shown in the operating position, the actuator (not shown) of the hold-down drive device 560 is firmly attached to the drive attachment 550, and the first hold-down member shaft 923 is not parallel to the second shaft 920. For example, the hold-down drive device 560 is configured to move the position of the actuator (not shown) between the non-operating position shown in Figure 7A and one or more operating positions shown in Figure 7B. For example, the hold-down drive device 560 is configured to move the position of the actuator (not shown) to one or more operating positions, such as the position shown in Figure 7B, and release the force applied by the hold-down drive device 560, thereby moving the actuator (not shown) to the non-pressing position shown in Figure 7A. Additionally or alternatively, the processing chamber may include one or more elastic elements, such as springs (not shown), to assist in moving or resisting an actuator (not shown) to one or more positions. Additionally or alternatively, the processing chamber may include one or more buffers, such as stoppers (not shown), to assist in or limit the range of movement of the actuator (not shown). It is advantageous that one or more elastic members (not shown) or one or more buffers (not shown) are positioned between the upper wall 410 of the chamber and the first hold-down member 510.

[0116] Figure 8 is a simplified schematic cross-sectional view of a portion of the processing chamber included in the third embodiment 102. The third embodiment 102 comprises a third modification of the hold-down device 502 described with respect to Figure 4. However, Figure 8 shows the third modification 502 during assembly or maintenance and before closing the processing chamber for use, and a portion of the upper wall 410 of the chamber is optionally configured to open as a lid for access to the inside of the processing chamber 400. In other words, the third embodiment 102 shows the third embodiment 102 when it is not in use for processing. The following embodiments G01 to G04 are illustrated in Figure 8 and are not illustrated or not fully illustrated in Figure 3A or Figure 3B.

[0117] ·G01: In the illustrated example, the hold-down drive unit 560 is arranged to drive along a hold-down drive shaft 960 that is not parallel to the third shaft 930. This is advantageous in that it reduces the actuation range of the hold-down drive unit, allowing the lid of the chamber upper wall 410 to be opened and closed. For example, the angle between the hold-down drive shaft 960 and the third shaft 930 is in the range of 5 to 20 degrees, or in the range of 5 to 15 degrees, or about 10 degrees. In the illustrated example, the mounting point of the actuator (not shown) of the hold-down drive unit 560 is inclined away from the chamber front wall 430 by this angle.

[0118] ·G02: In the illustrated example, the mechanical attachment 580 of the pivot point 570 is firmly attached to a suitable portion of the lower chamber wall 420. In the illustrated example, the drive attachment 550 and the actuator (not shown) of the hold-down drive unit 560 are detached from each other, allowing the first hold-down member 510 to rotate together with the cover of the upper chamber wall 410 around the first axis 910. The ability of the cover of the upper chamber wall 410 and the first hold-down member 510 to rotate arbitrarily around the same pivot point 570 is advantageous in reducing the complexity of the opening components.

[0119] ·G03: In this example, the hold-down drive unit 560 is shown beyond the non-operating position where the actuator (not shown) is detached from the drive attachment 550. Optionally, the hold-down drive unit 560 and / or the drive attachment 550 are configured to allow for rapid detachment. For example, the actuator (not shown) of the hold-down drive unit 560 is configured to automatically release from the drive attachment 550 when the actuator (not shown) is moved to the non-operating position or when the actuator (not shown) is moved beyond the non-operating position. For example, the distal end of the actuator (not shown) includes one or more blocking pins configured to hold the attachment to the drive attachment 550 in the operating position. However, when the distal end of the actuator (not shown) moves to a non-operating position along the hold-down drive shaft 930, the angle between the hold-down drive shaft 960 and the third shaft 930 causes the distal end of the actuator (not shown) to move away from the chamber front wall 430, and the drive attachment 550 is no longer prevented from rotating by one or more blocking pins (not shown), so that the first hold-down member 510 becomes rotatable around the first shaft 910. The movement of the distal end of the actuator (not shown) is driven by the hold-down drive device 560 or performed manually by the operator.

[0120] ·G04: Optionally, the hold-down drive unit 560 and / or the drive attachment 550 are configured to be quickly installed by reversing the procedure described in G03. In other words, the processing chamber is closed by rotating the first hold-down member 510 together with the lid of the upper wall 410 of the chamber around the first shaft 910. When the shaft 923 of the first hold-down member is substantially parallel to the second shaft 920, the distal end of an actuator (not shown) is moved to the working position, thereby holding the attachment to the drive attachment 550 by one or more blocking pins in the working position. The movement of the distal end of the actuator (not shown) is driven by the hold-down drive unit 560 or performed manually by the operator.

[0121] The embodiments described herein can be further modified to provide higher throughput, greater flexibility, greater accuracy, or any combination thereof.

[0122] In summary, hold-down devices are used in processing machines to press the substrate against a support for at least part of the heating process. However, inaccuracies arise due to uneven heating of the hold-down device and / or hold-down drive. Improved processing machines 100, 101, 102 for processing substrates include hold-down devices 500, 501, 502 configured to apply a hold-down force to at least part of the substrate during use. The processing chamber 400 includes a hold-down opening 270 that receives an actuator member 520 of the hold-down device, and the hold-down force is applied directly from outside the processing chamber 400 during use. This allows the applied hold-down force to be independently predetermined and / or controlled. Additionally, this provides a high degree of thermal and / or mechanical isolation and improves accuracy. This is particularly advantageous when part of the processing chamber 400 is configured to be openable and closable as a lid or hatch. [Explanation of Symbols]

[0123] 100: First embodiment of the apparatus 101: Second Embodiment of the Apparatus 102: Third Embodiment of the Apparatus 150: Processing head 250: Processing opening 270: Hold-down opening 300: Circuit board 320: Support 400: Processing Chamber 410: Upper wall of chamber 420: Lower wall 430: Front wall of the chamber 500: First variation of a hold-down device 501: Second variation of the hold-down device 502: A third variation of the hold-down device 510: First hold-down member 520: Actuator component 541, 542: Hold-down protrusions 550: Drive attachment 560: Hold-down drive mechanism 570: Pivot Point 571: Actuator component pivot point 580: Mechanical attachment for pivot point 600: Component 700: Processing environment 800: First processing position 805: Second processing position 810: Further processing location 910: First axis (X) 920: Second axis (Y) 923: First hold-down member shaft 930: Third axis (z) 933: Chamber front wall axis 960: Hold-down drive shaft 1250: Further processing opening 1150: Further processing heads 1300: Further substrates 1320: Further support 1541, 1542: Further hold-down protrusions 1600: Further components 1700: Further processing environment

Claims

1. An apparatus (100) for processing a substrate (300), The apparatus (100, 101, 102) is equipped with a processing chamber (400), The processing chamber (400) includes a chamber upper wall (410) that extends along a first axis (910) and along a second axis (920) that is perpendicular to the first axis (910). The substrate (300) is configured to be processed at a first processing position (800) when in use. The apparatus (100, 101, 102) further comprises hold-down devices (500, 501, 502) configured to apply a hold-down force to at least a portion of the substrate (300) along a third axis (930) relative to the support (320) at the first processing position (800) when in use. The upper wall of the chamber (410) is provided with a hold-down opening (270) for receiving at least the actuator members (520) of the hold-down devices (500, 501, 502), The actuator member (520) is configured such that, during use, the hold-down force received directly from outside the processing chamber (400) is applied to at least a portion of the substrate (300).

2. The apparatus according to claim 1, wherein a portion of the upper wall (410) of the chamber is configured to be openable and closable so as to be able to access at least a portion of the interior of the processing chamber (400).

3. The apparatus according to claim 1 or 2, further comprising a processing head (150) for applying solder onto a substrate (300) for soldering.

4. The apparatus according to claim 1 or 2, further comprising a processing head (150) for forming solder on a substrate (300) for soldering.

5. The apparatus according to claim 1 or 2, further comprising a processing head (150) detachably attached to a component (600) and configured to be positioned together with the component (600) at the first processing position (800).

6. Inspection of the substrate (300), Inspection of component (600), Inspection of the aforementioned support (320), Inspection after previous processing steps, and / or, The apparatus according to claim 1 or 2, further comprising a processing head (150) for inspection before a subsequent processing step.

7. The upper wall of the chamber (410) is provided with a processing opening (250) for receiving the processing head (150), The processing opening (250) is configured to allow the processing head (150) to move along the third axis (930) toward and / or away from the first processing position (800), The apparatus according to any one of claims 1 to 6, wherein the third axis (930) is perpendicular to the first axis (910) and perpendicular to the second axis (920).

8. The apparatus according to claim 7, wherein the processing opening (250) and the hold-down opening (270) are separate openings in the upper wall (410) of the chamber.

9. The hold-down device (500) comprises one or more hold-down protrusions (541, 542, 1541, 1542) attached to the actuator member (520), The apparatus according to any one of claims 1 to 8, wherein the one or more hold-down protrusions (541, 542, 1541, 1542) are configured to directly apply the hold-down force received from the actuator member (520) to at least a portion of the substrate (300) when in use.

10. The apparatus according to any one of claims 1 to 9, wherein the hold-down device (500, 501, 502) includes a hold-down drive device (560) configured outside the processing chamber (400) to apply a hold-down force to the actuator member (520).

11. The apparatus according to any one of claims 1 to 10, wherein the hold-down device (500, 501, 502) extends outward from the processing chamber (400) along the second axis (920) and comprises a first hold-down member (510) configured to apply a hold-down force to the actuator member (520).

12. The first end of the first hold-down member (510) is provided with a drive attachment (550) for attachment to a hold-down drive device (560) located outside the processing chamber (400), The second end of the first hold-down member (510) is provided with a pivot point (570) configured to convert at least a portion of the movement of the first hold-down member (510) caused by the operation of the hold-down drive device (560) into a rotational amount around the first axis (910) when in use. The apparatus according to claim 11, wherein the attachment of the first hold-down member (510) to the actuator member (520) is configured, during use, to convert at least a portion of the amount of rotation around the first axis (910) into the amount of movement of the actuator member (520) along the third axis (930) toward the substrate (300) at the first processing position (800), thereby applying a hold-down force to the actuator member (520).

13. The apparatus according to any one of claims 1 to 12, wherein the processing chamber (400) is configured to provide one or more processing environments (700, 1700) when in use.

14. The apparatus according to claim 13, wherein the processing openings (250, 1250) are configured to provide one or more gas curtains that, when in use, allow a predetermined and / or controlled flow of the gas into and / or out of one or more processing environments (700, 1700).

15. The apparatus according to claim 13 or 14, wherein the hold-down opening (270) is configured to provide one or more gas curtains that, when in use, allow a predetermined and / or controlled flow of the gas into and / or out of one or more processing environments (700, 1700).

16. The apparatus according to any one of claims 1 to 15, wherein the processing chamber (400) comprises a chamber lower wall (420) extending along the first axis (910) and along the second axis (920).

17. The apparatus according to claim 16, wherein the lower chamber wall (420) and the support (320) are integrally or securely formed and force-fitted with each other.

18. The apparatus according to any one of claims 1 to 17, wherein the apparatus (100, 101, 102) comprises one or more heaters and / or one or more heating elements configured to raise the temperature of at least a portion of one or more processing surfaces of the substrate (300).

19. The apparatus according to claim 18, wherein one or more heaters and / or one or more heating elements are attached to the processing head (150).

20. The apparatus according to claim 18 or 19, wherein the one or more heaters and / or one or more heating elements are housed in or attached to the processing chamber (400).

21. The apparatus according to any one of claims 1 to 20, wherein the processing chamber (400) is configured to receive a component (600), and the substrate (300) is configured to receive and support the component (600) during processing when in use.

22. The apparatus according to any one of claims 1 to 21, wherein the component is a die, a semiconductor package, a chip, an integrated circuit, a substrate, or any combination thereof.

23. The apparatus according to any one of claims 1 to 22, wherein the apparatus (100, 101, 102) comprises a medium carrier configured to move along the first axis (910) to position the substrate at the first processing position (800).

24. The apparatus according to claim 22, wherein the media carrier and the support (320) are integrally connected or morphologically and forcefully fitted to each other.

25. The aforementioned media carrier The substrate is moved along the first axis (910) to load the substrate. Applying solder to at least a portion of the processing location on the substrate, Distribution of solder to at least a portion of the processing location on the substrate, Processing of the said substrate, and / or The apparatus according to claim 23, configured to position the substrate at one or more further locations for removal of the substrate.

26. The apparatus (100, 101, 102) includes a further processing head (1150) which is detachably attached to the further component (1600) and configured to be positioned together with the further component (1600) at a second processing position (805), The apparatus according to claim 23 or 25, wherein the media carrier is configured to move along the first axis (910) and / or along the second axis (920) to position an additional substrate (1300) at the second processing position (805).

27. The hold-down devices (500, 501, 502) are configured to apply a hold-down force to at least a portion of the further substrate (1300) along the third axis (930) at the second processing position (805) when in use. The apparatus according to claim 26, wherein, during use, a further hold-down force is applied directly to at least a portion of the one or more further substrates (1300) from outside the processing chamber (400) using the actuator member (520).

Images