Core components and sensor devices for sensor equipment

Abstract

The core component (100) is defined for a sensor device (1000) and comprises a circuit carrier (102) having an upper surface (102a) and a bottom surface (102b) opposite to the upper surface, a pressure sensor element (104), and a temperature sensor element (105), wherein the circuit carrier has a central region (113) and a peripheral region (114) surrounding the central region, the central region having a seal region (113a) adjacent to the peripheral region, the pressure sensor element and the temperature sensor element are mounted on the circuit carrier in the central region, at least the temperature sensor element is mounted on the bottom surface in the central region and electrically connected to a first connection point (101a) on the bottom surface, and the circuit carrier does not have an electrical feedthrough from the bottom surface of the central region to the upper surface of the central region. Furthermore, a sensor device comprising the core component is defined.

Description

Technical Field

[0001] Core components for sensor devices, in particular core components having at least one sensor element, and sensor devices are provided.

Background Art

[0002] For example, in many applications in industrial engineering and automotive engineering, such as heat engines, filters, cooling circuits, and air conditioning systems, it is necessary to simultaneously measure the pressure and temperature of a fluid based on its position. The sensors used for this purpose may be exposed to high pressure loads of up to, for example, 100 bar, as well as high temperatures of up to, for example, 180°C, and extremely low temperatures of up to, for example, -40°C. The sensors used are preferably spatially combined, for example, within a common housing. In order to prevent the leakage of environmentally harmful media such as refrigerants during the lifetime of the sensor and ensure fault-free operation, special requirements are imposed particularly on the airtightness at the signal feed-through.

Summary of the Invention

[0003] At least one object of certain embodiments is to identify a core component for a sensor device. At least one further object of certain embodiments is to identify a sensor device.

[0004] These objects are solved by the subject matter according to the independent patent claims. Advantageous embodiments and further developments regarding the subject matter are shown in the dependent claims and are also apparent from the following description and the drawings.

[0005] According to at least one embodiment, a core component is defined, which may in particular be a core component for a sensor device. According to at least one further embodiment, a sensor device comprising the core component is defined. The sensor device may be intended and configured in particular to measure the properties of a fluid, for example, the temperature and / or pressure of a fluid. The term “fluid” is used here and below to refer to liquid and gaseous media. For example, a fluid may be, for example, a heat transfer medium or refrigerant in a heat engine, cooling circuit or air conditioning system, a fuel or oil, or may include such a medium. The following description applies equally to the core component and the sensor device.

[0006] In further embodiments, the core component comprises at least one sensor element. The at least one sensor element may preferably include a pressure sensor element or a temperature sensor element, or it may be a pressure sensor element or a temperature sensor element. The core component particularly preferably comprises at least two sensor elements. The at least two sensor elements may particularly preferably include a pressure sensor element and a temperature sensor element, or it may be a pressure sensor element and a temperature sensor element. The subsequent description relating to at least one sensor element may apply equally to at least two sensor elements.

[0007] According to further embodiments, the core component comprises a circuit carrier. At least one sensor element can be mounted on the circuit carrier. "Mounted" here and below may mean that at least one sensor element is mechanically and electrically connected to the circuit carrier. The electrical and mechanical connections can be made together, for example, using SMD technology (SMD: "Surface Mount Device"). Furthermore, the electrical and mechanical connections can also be separated from each other, for example, by mechanical soldering or adhesive connections, and in combination with electrical connections via wire connections such as coupling wires.

[0008] In a further embodiment, the circuit carrier has a top surface and a bottom surface opposite to the top surface. The top and bottom surfaces can be formed by opposing surfaces of the circuit carrier connected to each other, particularly by their sides. The distance from the top surface to the bottom surface can define the thickness direction in which the thickness of the circuit carrier is measured. The thickness of the circuit carrier is preferably less than the total dimension of the circuit carrier perpendicular to the thickness direction. The circuit carrier is particularly preferably plate-shaped, and the surfaces of the top and bottom surfaces may also have ridges and recesses. Hereinafter, and in part below, purely as an example, it is assumed that the circuit carrier is positioned in the sensor device such that the bottom surface faces the fluid to be measured, for example, temperature and pressure, and a portion of the bottom surface may also be exposed to the fluid. The top surface is accordingly set away from the fluid and therefore preferably does not come into contact with the fluid when the sensor device is used as intended.

[0009] Electrical connection points may be formed on the bottom and top surfaces, particularly in the form of adhesive pads, bonding pads, and / or solder pads, on which electrical components such as sensor elements and semiconductor components, as well as other interconnecting elements such as resistors, capacitors, diodes, and other passive or active elements, can be mounted, i.e., mechanically and electrically connected. This means that electrical components can be mounted on the top and bottom surfaces. Conductive structures may be formed inside the circuit carrier, for example in the form of conductor tracks and / or electrical vias, through which electrical connection points on one side, i.e., the top or bottom surface, can be interconnected with electrical connection points on the other side or the same side. In particular, the circuit carrier may have electrical feedthroughs, i.e., conductive structures that electrically connect connection points on the bottom surface to connection points on the top surface. Such feedthroughs may also be called signal feedthroughs.

[0010] The circuit carrier may have, for example, a ceramic material selected from oxides and / or nitrides having aluminum and / or silicon, or a substrate made from a ceramic material, and / or a plastic material such as FR4, or a substrate made from a plastic material, and may be formed with or without a metal core. Preferably, connection points are formed on the substrate, which may have a top and bottom surface of the circuit carrier, and the connection points may be connected to each other by a conductive structure inside the circuit carrier. For example, the circuit carrier may consist of a ceramic substrate having a conductive structure, a printed circuit board (PCB), a printed circuit board having a metal core, or a molded interconnect device (MID), or these themselves. Furthermore, multilayer ceramics, i.e., multilayer sintered ceramics such as LTCC (low-temperature fired ceramic) and HTCC (high-temperature fired ceramic), are also possible.

[0011] In a further embodiment, the circuit carrier, and by extension the core component, has a central region and a peripheral region surrounding the central region. The central and peripheral regions are preferably adjacent to each other laterally, and the lateral direction is defined in particular as the direction along the top surface and the direction along the bottom surface, and therefore perpendicular to the thickness direction of the circuit carrier. At least a portion of the central region may be a region of the circuit carrier that is located in a pressure-holding region within the sensor device and therefore exposed to fluid pressure. The peripheral region may be a region that is not located in a pressure-holding region. The central region may have a sealing region adjacent to the peripheral region, and the sealing region may have a sealing surface on the bottom surface, on which sealing elements such as a sealing ring may be disposed. At the bottom surface, the peripheral region of the circuit carrier may be separated from the pressure-holding region by the sealing elements.

[0012] In a further embodiment, the circuit carrier does not have an electrical feedthrough extending from the bottom surface to the top surface of the central region. This ensures that no leakage occurs in the circuit carrier through an electrical feedthrough extending from the bottom surface to the top surface of the circuit carrier in the central region, which is the pressure holding region of the sensor device. Therefore, it is particularly preferable that there is no direct signal feedthrough between the top and bottom surfaces passing through the central region, i.e., the pressure transport region of the circuit carrier.

[0013] In a further embodiment, at least one sensor element is mounted in the central region of the circuit carrier. In particular, at least one sensor element may be mounted on the bottom surface of the central region. It is especially preferable that both the pressure sensor element and the temperature sensor element are mounted in the central region of the circuit carrier. This may mean, in particular, that at least the temperature sensor element is mounted on the bottom surface in the central region and thus electrically connectable to a first connection point on the bottom surface in the central region. In particular, the temperature sensor element can be mounted using SMD technology so that the first connection point functions for mechanical and electrical connection. It is preferable that the first connection point is connected to a conductive structure that extends into the circuit carrier and from the central region to the peripheral region. Furthermore, the conductive structure can be connected to a second connection point on the top surface in the peripheral region. For the temperature sensor element, a signal feedthrough can thus be provided in the circuit carrier, and the signal feedthrough extends from the bottom surface of the central region to the top surface of the peripheral region, in particular by bridging or tunneling into the sealing region by a conductive structure extending within the circuit carrier. The second connection point allows for direct reading of electrical signals from the temperature sensor element, such as analog signals, which can then be further processed by external signal processing. Furthermore, at least one additional electrical component, such as a semiconductor chip for signal processing or as part of the signal processing circuit of the core component, can be connected to the second connection point, thereby allowing the core component itself to process the electrical signals from the temperature sensor element. This makes it possible, for example, to convert the analog signals from the temperature sensor element into digital signals, which can then be further processed by external signal processing. Because the second connection point is located outside the central region, the signals from the temperature sensor element can be made available on the upper surface of the circuit carrier without electrical feedthrough in the central region from the bottom to the top.

[0014] Furthermore, the pressure sensor element can be mounted on the bottom surface in the central region. Similar to the temperature sensor element, the pressure sensor element can be mounted on the bottom surface at a first connection point, or electrically connected to at least the first connection point, the first connection point being connected to a second connection point on the top surface in the peripheral region via an internal conductor structure within the circuit carrier.

[0015] The pressure sensor element is preferably mounted on the upper surface in the central region. In this case, the pressure sensor element can be mounted at a first connection point on the upper surface, or at least electrically connected to the first connection point, and can be connected to a second connection point on the upper surface, preferably in the peripheral region, via an internal conductor structure within the circuit carrier and / or via conductor tracks on the upper surface. In the case of a pressure sensor element mounted on the upper surface in the central region, the circuit carrier has a feedthrough extending from the bottom surface to the top surface of the central region, which is configured, for example, as a through hole, i.e., in the form of a through-hole. The feedthrough is configured in particular as a pressure feedthrough and functions to supply the fluid to be measured from the bottom surface of the circuit carrier to the pressure sensor element on the top surface of the circuit carrier. In particular, the pressure feedthrough can be the only feedthrough of the circuit carrier in the central region, extending from the bottom surface to the top surface of the central region.

[0016] In further embodiments, the pressure sensor element is a MEMS element ("micro-electromechanical system"), particularly a piezoresistive silicon MEMS element. Compared to other pressure sensor elements, such as ceramic pressure sensor elements, piezoresistive silicon MEMS elements are characterized by their smaller size and lower cost. For example, when using ceramic measuring cells, it is often difficult to detect low pressure ranges such as below 5 bar in the small installation space often required. In addition, when using ceramic measuring cells, only absolute pressure measurement is usually possible. Furthermore, the capacitive measurement principle or resistance measurement principle combined with thick-film technology of ceramic measuring cells increases the demands on signal processing and promotes electrical interference. By suitably using a piezoresistive silicon MEMS element as the pressure sensor element in the core component described herein, the effective area over which the fluid acts on the pressure sensor element can be made very small, thereby keeping the force acting on the core component low. This can also help reduce the required installation space and weight of the core component and, consequently, the sensor device. Pressure sensor elements, particularly piezoresistive silicon MEMS elements, can be sensitive in the pressure range of 50 millibars to 50 bar. Piezoresistive silicon MEMS elements can typically supply an output signal of up to 120 mV, or higher or lower. Therefore, compared to capacitive pressure sensors, piezoresistive silicon MEMS elements can cover a wider measurement range and generate a stronger output signal that is less susceptible to interference. Pressure sensor elements, particularly piezoresistive silicon MEMS elements, can be configured for absolute or relative pressure measurement. They can be used in temperatures ranging from -40°C to +180°C.

[0017] The temperature sensor element may preferably be an NTC thermistor. The temperature sensor element preferably has elongated leads, particularly contact lines in the form of contact legs, by which the temperature sensor element is mounted on the circuit carrier, and the contact lines protrude from the bottom surface of the circuit carrier. A sensor cell having the NTC element can be positioned at one end of the lead line opposite to the circuit carrier. Thus, the sensor cell can be positioned away from the circuit carrier in the fluid flow so that the temperature signal cannot be distorted by the components of the circuit carrier.

[0018] In a further embodiment, the core component has a support element positioned on the upper surface of the circuit carrier. The support element is particularly preferably positioned on the upper surface in the central region of the circuit carrier. The peripheral region of the circuit carrier may, particularly preferably, have no support element, or at least substantially have no support element. The outer circumference of the support element may extend at least partially along the boundary between the peripheral and central regions of the circuit carrier. The support element may be mounted on the circuit carrier, i.e., the upper surface of the circuit carrier, and therefore may be fixed to the circuit carrier, especially the upper surface of the circuit carrier. For example, the support element can be fixed to the circuit carrier by a shape-fitting method, for example by clip or clamp connections, or preferably by a material-locking method, for example by adhesive connections.

[0019] In a further embodiment, the sensor device has an upper housing element. The upper housing element can surround a core component. The upper housing element can, in particular, abut against the upper surface of a support element when the sensor device is assembled. The support element can, in particular, have a stop surface that abuts against the stop surface of the upper housing element. Forces acting on the core component can be transmitted to the upper housing element via the stop surface of the support element. By positioning the support element in the central region of the circuit carrier, the transmission of forces from the core component to the upper housing element can be configured such that the bending moment experienced by the core component is minimized. For this purpose, forces can be transmitted through a central region located in the center of the circuit carrier, and the central region is large enough to prevent deformation of the dome shape of the circuit carrier. Thus, the bending stress generated in the core component can be minimized. This increases the burst strength of the core component and reduces mechanical stress. This enables a compact design of the sensor device and reduces material usage.

[0020] According to a preferred embodiment, the sensor device comprises an upper housing element and a core component comprising a temperature sensor element, a pressure sensor element, a circuit carrier, and a support element.

[0021] In a further embodiment, the support elements are configured and positioned on the circuit carrier such that each distance of the support element from an edge point of the circuit carrier is at least 5%, preferably at least 10%, or at least 20%, of a straight line connecting the edge point to the opposite edge point of the circuit carrier and passing through the center point of the circuit carrier. This arrangement of the support elements in the central region of the circuit carrier ensures that forces exerted on the core component by the fluid are transmitted from a region of the core component that is sufficiently far from the edges of the core component. This prevents unwanted bending moments on the circuit carrier caused by forces exerted on the edges.

[0022] The outer circumference of the support element may extend along the boundary between the central and peripheral regions of the circuit carrier. The central region may occupy at least 10% of the circuit carrier's area. Preferably, the central region occupies at least 25% of the circuit carrier's area. This ensures that a sufficiently large area is available for the support element, and therefore that the support element can be large enough to transmit force to the upper housing element over a wide area rather than at a single point. This prevents force concentration that could introduce mechanical stress into the core components and shorten the lifespan of the sensor device.

[0023] The central region can be configured so as not to occupy more than 80% of the surface area of ​​the circuit carrier. Preferably, the central region occupies less than 60% of the surface area of ​​the circuit carrier. This ensures that the force acts sufficiently far from the edges of the circuit carrier, preventing the circuit carrier from bending.

[0024] The support element preferably has a frame surrounding the internal region in which the pressure sensor element is located, particularly when the pressure sensor element is positioned on the upper surface of the circuit carrier. In particular, the frame may have a height exceeding the height of the pressure sensor element. This allows the pressure sensor element, when mounted on the upper surface of the circuit carrier, to be positioned in a region completely enclosed laterally by the support element, while the support element itself can be taller in the vertical direction. As a result, no force is directly transmitted from the core component to the upper housing element, neither from the circuit carrier itself nor from the pressure sensor element. Instead, a support element is used for this purpose. Because the support element has a purely mechanical function, elements with measuring functions, such as the pressure sensor element, are protected from force concentration. The frame design can ensure that no point-like deformation occurs in the circuit carrier, and consequently the core component, because the force is transmitted across the entire surface of the upper housing element, rather than at a single point.

[0025] The internal region may preferably be filled with a molding material. The molding material may be a soft plastic such as silicone, for example, and protects the pressure sensor element.

[0026] The support element may comprise at least one web, i.e. one or more webs, extending away from the frame. The stop surface of the support element can be formed by the upper surface of the frame and at least one web. Thus, the at least one web also contributes to the transmission of forces to the upper housing element and further disperses the forces over a larger area, preventing the occurrence of mechanical stress concentration and overloading of the materials used. For example, the support element may have two webs, and one or more electrical components may be arranged on the circuit carrier between them. The two webs preferably have a height exceeding the height of the electrical components and can protect the electrical components in the same way as a pressure sensor.

[0027] According to a further embodiment, the upper housing element is part of the housing of the sensor device. In particular, the upper housing element and the lower housing element connectable to the upper housing element can form the housing of the sensor device. The fluid can be measured for temperature by the temperature sensor element and / or for pressure by the pressure sensor element and guided to the core component via the lower housing element. The upper housing element can have at least one contact element electrically connected to the circuit carrier.

[0028] In particular, the lower housing element may have a media connection channel configured to guide the fluid to the bottom surface of the core component in the central portion of the circuit carrier. In particular, the sensor device may be configured such that the fluid is guided to the core component. The sealing element may be arranged between the circuit carrier and the lower housing element, preferably directly adjacent to the sealing surface on the bottom surface of the circuit carrier. The sealing element may in particular surround the media connection channel such that the fluid is supplied only to the central region of the bottom surface of the circuit carrier and not to the peripheral region of the bottom surface of the circuit carrier. The sealing element can be arranged between the sealing surface of the circuit carrier and the sealing surface of the lower housing element and thus seals the bottom surface of the core component against the lower housing element.

[0029] The temperature sensor element can preferably extend into the media connection channel. Furthermore, a protective element, for example made of plastic or having plastic, can be inserted into the media connection channel. The protective element can surround the temperature sensor element laterally and protect it from external mechanical influences. The protective element can preferably be held in the media connection channel in a form-fitting and / or press-fit manner, for example by means of one or more webs on the outside that contact the inside of the media connection channel.

[0030] The axial direction can be defined as the direction towards the core component along the media connection channel. The lower housing element can extend axially beyond the core component. The lower housing element can have a flange portion that axially surrounds the lower end portion of the upper housing element. The bottom surface and the upper housing element can be configured such that the force transmitted from the core component to the stop surface of the upper housing element is transmitted from the upper housing element to the flange portion of the lower housing element. The core component can be configured to transmit force to the upper housing element via a support element, and the upper housing element is configured to transmit the force absorbed by the core component to the flange portion of the lower housing element. For this purpose, the upper housing element is configured to have sufficient rigidity. The upper housing element can directly abut against the flange portion. The flange portion can be sealed with a sealing material.

[0031] According to a further embodiment, in a method for manufacturing the plurality of core components or sensor devices described above, the core components are manufactured and calibrated within a composite assembly.

[0032] In a particularly preferred embodiment, the sensor device comprises a core component, a connector plug housing formed by an upper housing element, and a pressure connection portion for supplying a medium such as a fluid, formed by a lower housing element, wherein the force arising from the medium pressure is transmitted to the plug housing through the core component near the center of the force. In a particularly preferred embodiment, the core component comprises a circuit carrier having a pressure sensor element and a temperature sensor element, and evaluation electronic equipment formed from one or more electrical components on the circuit carrier. In a further preferred embodiment, the core component preferably further comprises a support element particularly having a frame. In a further preferred embodiment, the force arising from the medium pressure is transmitted directly to the upper housing element via the core component, or particularly preferably via the support element. The support element is preferably configured such that bending stress in the circuit carrier is minimized. In a further preferred embodiment, the lead wires of the temperature sensor element are connected to the circuit carrier, particularly to an electrical connection point, thereby it is particularly preferred that the temperature signal is transmitted from the pressure transport space and the medium transport space without passing through the central region of the circuit carrier.

[0033] The core components and, consequently, the sensor devices described herein, can be suitably used, for example, in automotive applications, thermal management applications, and in particular in refrigeration technologies using refrigerants. In particular, the core components and sensor devices can be used, for example, in sensor applications in automotive powertrains, and in coolant pressure sensors and hydrogen pressure sensors for monitoring in industrial processes.

[0034] Further advantages, advantageous embodiments, and further developments will become apparent from the embodiments described below in relation to the drawings. [Brief explanation of the drawing]

[0035] [Figure 1] A schematic diagram of a core component according to one embodiment is shown. [Figure 2] Schematic diagrams of a core component according to one embodiment are shown from different viewpoints. [Figure 3] A schematic diagram of the core component according to one embodiment is shown from yet another viewpoint. [Figure 4] A schematic diagram of the circuit carriers of the core component is shown. [Figure 5] A schematic diagram of a sensor device according to a further embodiment is shown. [Figure 6] A schematic diagram of a sensor device according to a further embodiment is shown. [Figure 7] A schematic diagram of the upper housing element of the sensor device is shown. [Figure 8] A schematic diagram of the lower housing element of the sensor device is shown. [Figure 9] A schematic diagram of the force flow in a sensor device is shown. [Modes for carrying out the invention]

[0036] In embodiments and drawings, elements that are identical, similar, or function identically may be designated by the same reference numeral. The sizes of the illustrated elements and their relative sizes should not be considered to scale; rather, individual elements such as layers, parts, components, and regions may be exaggerated for clarity and / or to improve understanding.

[0037] Figures 1 to 3 show the core component 100 from different viewpoints and are intended and configured for use in sensor devices, such as the sensor device 1000 described in relation to Figures 5 to 9. Figure 1 shows a top view of the top surface 100a of the core component 100. Figure 2 shows a top view of the bottom surface 100b of the core component 100. Figure 3 shows a simplified cross-sectional view of a part of the core component 100. The following description applies equally to Figures 1 to 3.

[0038] The core component 100 comprises a circuit carrier 102 and at least one sensor element 104, 105 on the circuit carrier 102. The core component 100 is intended and configured to measure at least one property of a medium, particularly a fluid, as part of a sensor device 1000. In the illustrated embodiment, the core component 100 has two sensor elements 104, 105 in the form of a pressure sensor element 104 and a temperature sensor element 105. Alternatively, other numbers and types of sensor elements are also possible. The sensor elements 104, 105 are mounted on the circuit carrier 102 and are electrically contacted in particular through the circuit carrier 102.

[0039] The circuit carrier has an upper surface 102a on the upper surface 100a of the core component 100, on which a pressure sensor element 104 is mounted. Furthermore, the circuit carrier 102 has a bottom surface 102b on the bottom surface 100b of the core component 100, opposite to the upper surface 102a, on which a temperature sensor element 105 is mounted. The upper surface 102a and the bottom surface 102b are connected to each other by a side surface 102c, and the distance from the upper surface 102a to the bottom surface 102b defines the thickness direction in which the thickness of the circuit carrier 102 is measured. The circuit carrier 102 is preferably plate-shaped as shown in the figure, so that the thickness of the circuit carrier 102 is smaller than the total dimension of the circuit carrier 102 perpendicular to the thickness direction. When the core component 100 is used as intended in the sensor device, the bottom surface 100b faces the fluid in which the temperature and pressure are measured. The upper surface 100a is positioned accordingly away from the fluid, and therefore, it is preferable that it does not come into contact with the fluid when the sensor device is used as intended.

[0040] The pressure sensor element 104 is intended and configured to determine the absolute or relative pressure of a fluid, i.e., a liquid or gas. The pressure sensor element 104 is configured to convert the pressure applied to a pressure-sensitive surface or pressure-sensitive area into an electrical signal that can determine the pressure level. The pressure sensor element 104 may comprise, for example, a bent plate whose surface and thickness are selected considering a desired measurement range. A medium is applied to the back side of the pressure sensor element 104 that faces the circuit carrier 102. The pressure sensor element 104 is preferably a piezoresistive silicon MEMS element.

[0041] The temperature sensor element 105 is intended and configured to generate an electrical signal of a magnitude corresponding to the temperature of the fluid. The temperature sensor element 105 may be an NTC thermistor. The temperature sensor element 105 can be projected into the medium being measured in order to detect the temperature with as little distortion as possible and to ensure the shortest possible response time. For this purpose, the temperature sensor element 105 has an elongated lead wire 105a, i.e., a contact line in the form of contact legs, which mounts the temperature sensor element 105 to the circuit carrier 102, and the contact line extends away from the bottom surface 102b of the circuit carrier 102. A sensor cell 105b having an NTC element is positioned at one end of the lead wire 105a opposite to the circuit carrier 102. Thus, the sensor cell 105b can be positioned away from the circuit carrier 102 in the fluid medium flow so that the temperature signal cannot be distorted, for example, by heat generated in other components of the circuit carrier 102.

[0042] Electrical connection points 101 are formed on the top surface 102a and bottom surface 102b of the circuit carrier 102, particularly in the form of adhesive pads, bonding pads, and / or solder pads, on which components such as sensor elements 104, 105 and other electrical components 106 such as semiconductor components, as well as other circuit elements such as resistors, capacitors, diodes, and other passive or active elements, can be mounted, i.e., mechanically and electrically connected. The electrical components 106 placed on the circuit carrier 102 can form, for example, control and evaluation electronic equipment or a part thereof, and can be interconnected with the pressure sensor element 104 and the temperature sensor element 105. For clarity, in Figures 1 and 2, only some of the electrical components 106 and some of the electrical connection points 101 are given reference numerals. In the illustrated embodiment, electrical contact portions 107, which are formed purely as an example on the edge of the circuit carrier 102 in the form of recesses on the side surface 102c, allow external contact with the circuit carrier 102 and, by extension, the core component 100.

[0043] The circuit carrier 102 has a substrate containing or made of a ceramic material, and / or a substrate containing or made of a plastic material, and the substrate may also be configured with or without a metal core. In particular, the circuit carrier 102 has a fluid-resistant material, such as an oxide and / or nitride ceramic containing aluminum and / or silicon, and / or a plastic such as FR4, FR4 with a metal core, or another plastic. For example, the circuit carrier 102 may comprise a ceramic substrate having a conductive structure, a printed circuit board (PCB), a printed circuit board having a metal core, or a molded interconnect device (MID), or these themselves. The selected material is configured to function as a circuit carrier, in particular, to perform the required mechanical functions and exhibit good bonding properties for, for example, bonding, glass soldering, and / or soldering.

[0044] The conductive structure 108 is formed inside and / or on the surface of the circuit carrier 102, for example, in the form of electrical vias 108a and / or conductor tracks 108b, through which an electrical connection point 101 on one side, i.e., on the top surface 102a or the bottom surface 102b, can be interconnected with the other side or an electrical connection point 101 on the same side. In particular, the circuit carrier 102 may have an electrical feedthrough 109, i.e., a conductive structure 108 that electrically connects a connection point 101 on the bottom surface 102b to a connection point 101 on the top surface 102a. Such a feedthrough 109 may also be called a signal feedthrough.

[0045] The circuit carrier 102, and by extension the core component 100, has a central region 113 and a peripheral region 114 surrounding the central region 114. The central region 113 and the peripheral region 114 are adjacent to each other laterally, i.e., along the top surface 102a and the bottom surface 102b, and therefore perpendicular to the thickness direction of the circuit carrier 102, as shown by dashed lines in Figures 2 and 3. Deviating from the shown circle, the central region 113 may also have a different shape. At least a portion of the central region 113 is the region of the circuit carrier 102 that is located in the pressure-holding region in the sensor device and is therefore potentially exposed to the pressure of the fluid being measured during the intended use in the sensor device. The peripheral region 114 is the region that is not located in the pressure-holding region. The central region 113 has a sealing region 113a adjacent to the peripheral region 114, the sealing region 113a having a sealing surface 113b on the bottom surface 102b, and sealing elements such as a sealing ring can be placed on the sealing surface 113b, as can be seen further in Figure 9 below. The sealing region 113a of the central region 113 having a sealing surface 113b on the bottom surface 102b is shown in Figures 2 and 3 as the region located between the dashed and dotted lines. On the bottom surface 102b, when used as intended in the sensor device, the peripheral region 114 of the circuit carrier 102 is separated from the pressure holding region, i.e., the central region 113, by the sealing elements on the sealing surface 113b.

[0046] Both the pressure sensor element 104 and the temperature sensor element 105 are mounted on the circuit carrier 102 in the central region 113. Thus, the temperature sensor element 105 is mounted on the bottom surface 102b in the central region 113 and is electrically connected to the first connection point 101a on the bottom surface 102b in the central region 113. In particular, the temperature sensor element 105 can be mounted using SMD technology and thus mounted on the circuit carrier 102 so that the first connection point 101a functions for mechanical and electrical connection. For example, the temperature sensor element 105 can be soldered to the first connection point 101a on the bottom surface 102b, bonded by conductive adhesive, or fixed by another suitable bonding method. As shown in Figure 3, the first connection point 101a is connected to a conductive structure 108 that extends from the central region 113 to the peripheral region 114, partially on the surface and inside the circuit carrier 102, or entirely inside the circuit carrier 102, and is connected to a second connection point 101b on the upper surface 102a in the peripheral region 114. For the temperature sensor element 105, an electrical feedthrough 109 for signal transmission can thus be provided on the circuit carrier 102, and as shown in Figure 3, the electrical feedthrough 109 is bridged or tunneled into the sealing region 113a by the conductive structure 108 of the electrical feedthrough 109 that extends inside the circuit carrier 102, so that it extends from the bottom surface 102b of the central region 113 to the upper surface 102a of the peripheral region 114. Purely illustrative, the conductive structure 108 shown in Figure 3 has a via 108a from the bottom surface 102b to the upper surface 102a and a conductive track 108b on the upper surface 102a. Alternatively, for example, via 108a may extend from the top surface 102a and bottom surface 102b into the interior of the circuit carrier 102 and be connected by an internal conductor track or form a conductor structure 108 for electrical feedthrough 109, or via 108a may extend from a second connection point 101b to the bottom surface 102b, with a conductor track 108b provided on the bottom surface 102b. The second connection point 101b allows for direct reading of an electrical signal from the temperature sensor element 105, such as an analog signal, which can be further processed by external signal processing.Furthermore, the second connection point 101b can be connected to the aforementioned additional electrical component 106, thereby allowing the core component 100 itself to process the electrical signal from the temperature sensor element 105.

[0047] The pressure sensor element 104 is mounted on the top surface 102a in the central region 113 of the circuit carrier 102, for example, by adhesive bonding, glass soldering, or soldering. In an alternative embodiment, the pressure sensor element 104 may also be mounted on the bottom surface 102b in the central region 113 of the circuit carrier 102. In the illustrated embodiment, the pressure sensor element 104 is mounted at a first connection point on the top surface 102, or is electrically connected to at least a first connection point and connected to a second connection point in the peripheral region 114 of the top surface 102a of the circuit carrier 102 via an internal conductor structure within the circuit carrier 102 and / or via conductor tracks on the top surface 102a. For example, the pressure sensor element 104 can be electrically connected by coupling wires.

[0048] As shown in Figure 2, the circuit carrier 102 is equipped with a feedthrough configured as a pressure feedthrough 112, which extends from the bottom surface 102b to the top surface 102a in the central region 113 and is configured as a continuous hole, or through hole. The pressure feedthrough 112 functions to supply the fluid to be measured from the bottom surface 102b of the circuit carrier 102 to the pressure sensor element 104 on the top surface 102a of the circuit carrier 102.

[0049] In the peripheral region 114, further electrical components 106 may be located on the bottom surface 102b at connection points 101, which are connected, for example, to electrical components 106 on the top surface 102a via internal conductor structures within the peripheral region 114. The illustrated components 106 and their arrangement are purely illustrative and should not be understood as limiting.

[0050] The circuit carrier 10 does not have an electrical feedthrough extending from the bottom surface 102b of the central region 113 to the top surface 102a of the central region 113. This ensures that in the central region 113, which is the pressure-holding region of the sensor device, no leakage occurs to the circuit carrier 102 through the electrical feedthrough extending from the bottom surface 102b to the top surface 102a of the circuit carrier 102. Therefore, there is no direct signal feedthrough between the top surface 102a and the bottom surface 102b through the central region 113, i.e., the pressure-holding region of the circuit carrier 102. In particular, the pressure feedthrough 112 is the only feedthrough of the circuit carrier 102 in the central region, extending from the bottom surface 102b of the central region 113 to the top surface 102a of the central region 113. Since the second connection point 101b, which is interconnected with the first connection point 101a on which the temperature sensor 105 is mounted, is located outside the central region 113, it is possible to ensure that the signal from the temperature sensor element 105 is available on the upper surface 102a of the circuit carrier 102 without electrical feedthrough from the bottom surface 102b to the top surface 102a in the central region 113.

[0051] The interconnection structure integrated into the circuit carrier 102 comprises electrical connection points 101, internal conductor structures 108 if present, and surface conductor tracks if present, enabling the transmission of signals from sensor elements 104, 105, i.e., temperature and pressure signals in particular, as well as the interconnection of existing electrical components 106 for signal processing and / or control, and the conduction of output signals and supply voltages. In addition, the connection points function to secure electrical components by surface mounting, as described above using the example of the temperature sensor element 105.

[0052] The core component 100 further has a support element 103 on its upper surface 100a, the support element 103 positioned on the upper surface 102a in the central region 113 of the circuit carrier 102. The peripheral region 114 of the circuit carrier 102 preferably does not include the support element 103, or at least substantially does not include it, so that space for electrical components 106 exists on the upper surface 102a in the peripheral region 114. The outer circumference of the support element 103 may extend at least partially along the boundary between the peripheral region 114 and the central region 113 of the circuit carrier 102. In particular, the support element 103 may be fixed to the circuit carrier 102 by a shape-fit and / or material-locking method, for example by adhesive bonding. As will be described later, forces acting on the core component 100 can be transmitted to the upper housing element of the sensor device housing via the support element 103. The support element 103 extends vertically upward away from the upper surface 102a of the circuit carrier 102 and forms a resting surface that, when installed in the sensor device according to its intended use as will be described in more detail below, can contact the upper housing element and transmit force to the upper housing element.

[0053] The support element 103 has a frame 103a surrounding the internal region where the pressure sensor element 104 is located. Preferably, the frame 103a has a height that exceeds the height of the pressure sensor element 104. The pressure sensor element 104 is thus located in a region completely enclosed laterally by the support element 103, and the support element 103 protrudes in the height direction, so that forces from the core component 100 are not directly transmitted to the housing element of the sensor device, neither from the circuit carrier 102 itself nor from the pressure sensor element 104. Instead, the support element 103 is used for this purpose. Since the support element 103 has a purely mechanical function, elements with measuring functions, such as the circuit carrier 102 and the pressure sensor element 104, are protected from force concentration. The configuration with the frame 103a ensures that forces are transmitted over the entire surface rather than at a single point, thus ensuring that no localized stress states occur in the circuit carrier 102, and consequently in the core component 100. The internal region within the frame 103a is filled with molding material 110. The pressure sensor element 104 can be protected by a molding material 110, which may be a soft plastic such as silicone gel.

[0054] Furthermore, in the illustrated embodiment, the support element 103 has two webs 103b extending away from the frame 103a. The resting surface of the support element 103 described above is formed by the upper surface of the frame 103a and the webs 103b. Thus, the webs 103b also contribute to the transmission of force to the housing element of the sensor device, and by distributing the force over a wider area, the occurrence of mechanical stress concentration and overload of the material used are prevented. In the illustrated embodiment, an electrical component 106 is positioned between the two webs 103b on the circuit carrier 102, and this electrical component 106 may be particularly sensitive, and may be, for example, an integrated circuit or another semiconductor component. Preferably, the electrical component 106 can be protected in a similar manner to the pressure sensor 104 by the two webs 103b having a height above the electrical component 106 between them. As an alternative to the illustrated embodiment, the support element 103 may also have more or fewer webs and other geometric shapes.

[0055] Therefore, the support element 103 functions to house the functional elements of the core component 100 and to dissipate forces. In particular, the support element 103 functions to protect the pressure sensor element 104, and the frame 103a forms the boundary of the molding material 110, which is formed by, for example, gel, and passivates the pressure sensor element 104. The support element 103 functions to introduce force with the largest possible contact surface at the center of force on the circuit carrier 102 and to deflect the force to the connector housing with the largest possible contact surface at the center of force. The radii indicated to round the edges and corners of the support element 103 may function to reduce stress concentration.

[0056] As described, the circuit carrier 102 enables the mechanical and electrical connections of the electrical component 106 and the sensor elements 104 and 105. The core component 100 is preferably manufactured and calibrated within the composite assembly. In this way, the manufacturing process can be improved, particularly in terms of cost-effectiveness.

[0057] Figure 4 shows a schematic diagram of the central region 113 and peripheral region 114 of the circuit carrier 102, with a sealing region 113a, illustrating the preferred geometric characteristics of the circuit carrier 102. The central region 113 includes the geometric center MP of the circuit carrier in particular. The central region 113 includes at least 10% of the area of ​​the circuit carrier 102, preferably at least 25% of the area of ​​the circuit carrier 102. The outer contour of the central region 113 is defined, for example, by sealing elements and / or support elements, or parts of elements and / or support elements, and the outer edge or part of the outer edge of the frame 103a may form a boundary between the central region 113 and the peripheral region 114.

[0058] Each distance AA from the edge point P1 of the circuit carrier 102 to the central region 113 and / or support element is at least 5%, preferably at least 10% or at least 20%, of the length L of the straight line connecting edge point P1 to the opposite edge point P2 of the circuit carrier 102 and passing through the center point MP of the circuit carrier 102. The length L of the straight line represents the diameter of the circuit carrier 102 along the direction defined by P1 and P2. The described arrangement allows the central region 113, and therefore preferably the support element, to be positioned in the center of the circuit carrier 102 and at a sufficiently large distance from the edges of the circuit carrier 102.

[0059] Figures 5 and 6 show exploded views of the sensor device 1000, comprising the core component 100 described above, as well as the upper housing element 200 and the lower housing element 300, in external and cross-sectional views, respectively. For clarity, the elements of the core component 100 are not denoted by reference numerals in Figures 5 and 6. Therefore, please also refer to Figures 1 to 4 for a description of the core component 100 and its components. Figures 7 and 8 show cross-sectional views of the upper housing element 200 and the lower housing element 300. Figure 9 shows a cross-sectional view of the sensor device 1000, with the forces acting on the sensor device 1000 indicated by arrows. The force diagram in Figure 9 is intended solely to illustrate the principle of force distribution. No conclusions regarding the magnitude of the forces acting in each case can be drawn from the length and density of the arrows. The following explanation also applies equally to Figures 5 to 9.

[0060] The lower housing element 300 has a medium connection channel 302 that can supply a fluid whose pressure and temperature are measured to the sensor elements 104 and 105 of the core component 100. The upper housing element 200 is connected to the lower housing element 300 and surrounds the core component 100, thereby protecting the core component 100 from environmental influences, while the bottom surface 100b of the core component 100 is not covered by the upper housing element 200. The sensor device 1000 is configured so that the force exerted on the core component 100 by the fluid can be transmitted to the lower housing element 300 via the upper housing element 200. Hereinafter, the axial direction is defined as the orientation of the lower and upper housing elements 200 and 300 so that the axial direction in Figures 5 to 9 is upright. The medium connection channel 302 preferably extends in the axial direction.

[0061] The upper surface 102a of the circuit carrier 102 faces away from the media connection channel 302 of the lower housing element 300. The lower surface 102b of the circuit carrier 102 faces towards the media connection channel 302 of the lower housing element 300.

[0062] The force exerted on the core component 100 by the fluid is transmitted to the upper housing element 200 via the support element 103. By positioning the support element 103 in the central region 113 of the circuit carrier 102, it is ensured that the bending moment exerted on the core component 100 by the force is minimized. The force is transmitted to the upper housing element 200 by the support element 103 via the central region 113, and therefore via the center point of the core component 100. Because the central region 113 is used for force transmission, bending of the core component 100 that could occur if the force were transmitted through the peripheral region 114 can be avoided.

[0063] As described above, the central region 113 includes at least 10%, preferably 25%, of the area of ​​the circuit carrier 102, and since the support element 103 is positioned in the central region 113, it is ensured that the force is transmitted over a sufficiently wide area and is not nearly point-like, thereby avoiding the occurrence of individual force concentrations in the core component 100, which could otherwise lead to inaccurate measurements and / or reduced long-term stability.

[0064] The upper housing element 200 has a plastic element 201 and a contact element 202. The plastic element 201 is preferably configured as a plug connector and is essentially axially extended. The lower region of the plastic element 201 has a collar 203, i.e., a region with a larger cross-section than other regions of the upper housing element 200. The collar 203 of the upper housing element 200 has sufficient rigidity to deflect axial forces to the flange portion 301 of the lower housing element 300 that abuts the collar 203 in the axial direction.

[0065] The collar 203 is specially configured to surround the core component 100 and extend axially downward beyond the core component 100. Inside the collar 203, a stop surface 204 is formed, against which the support element 103 of the core component 100 abuts. Forces are transmitted from the support element 103 to the upper housing element 200 via the stop surface 204. The upper housing element 200 is configured to transmit these forces to the flange portion 301 of the lower housing element 300.

[0066] Furthermore, the upper housing element 200 has a contact element 202 that is electrically connected to the circuit carrier 102, for example, to a contact portion 107 located on the edge. The contact element 202 enables electrical contact between the circuit carrier 102 and external electronic equipment. The contact element 202 is configured as a metal spring-loaded contact pin. The contact element 202 is configured to be inserted, for example, into the contact portion 107 of the circuit carrier 102, thereby positioning the core component 100 during assembly.

[0067] Each of the contact elements 202 has two bends, and the contact elements 202 extend parallel to each other at a small distance apart in the axial upper region of the upper housing element 200, and are further spaced apart within the collar 203 of the upper housing element 200. The two bends impart a spring load to the contact elements 202. The plastic part 201 has a guide element that determines the path of the contact elements 202 and has a recess, thereby allowing the contact elements 202 to exhibit a spring action. This allows for correction of manufacturing tolerances.

[0068] The sealant 206 is also applied to the outer surface 205 of the collar 203 and contacts the flange portion 301 of the lower housing element 300 by means of sealing the upper housing element 200 and the lower housing element 300. The sealant 206 seals the interior of the upper housing element 200 and the lower housing element 300 against environmental influences. Furthermore, the sealant 206 provides mechanical stabilization of the connection between the housing elements 200 and 300. The sealant 206 may also include a sealant that compensates for the difference in thermal expansion coefficients between the upper and lower housing elements 200 and 300. In this way, the formation of mechanical stress is reduced or avoided, and a long-term stable seal of the connection between the flange portion and the collar can be ensured.

[0069] The lower housing element 300 is configured to connect to the upper housing element 200. The lower housing element 300 may have a seal ring 303 located on the outside of the lower housing element. The lower housing element may also have a plug-shaped protective element 304.

[0070] The lower housing element 300 has a lower region with a large cross-section that surrounds the core component 100 and also surrounds the collar 203 of the upper housing element 200. The upper end of the upper region has an inwardly facing flange portion 301. This flange portion rests on the outer surface 205 of the collar 203 of the upper housing element 200, either directly or via a sealing material 206.

[0071] The sealing element 130, formed by the internal sealing ring, seals the media connection channel 302 to the core component 100. The sealing element 130 forms an axial seal with the lower housing element 300 and the core component 100. In particular, the sealing element 130 is positioned between the circuit carrier 102 of the core component 100 and the lower housing element 300, directly adjacent to the sealing surface 113b on the bottom surface 102b of the circuit carrier 102. The sealing element 130 can laterally surround the internal outlet opening of the media connection channel 302 facing the core component 100, thereby ensuring that fluid is supplied only to the central region 113 of the bottom surface 102b of the circuit carrier 102, and not to the peripheral region 114 of the bottom surface 102b of the circuit carrier 102. The sealing element 130 is positioned in a compressed state between the sealing surface 113b of the circuit carrier 102 and the sealing surface of the lower housing element 300, thereby sealing the bottom surface 100b of the core component 100 to the lower housing element 300.

[0072] The lower region of the lower housing element 300 is equipped with a medium connection channel 302 and has a smaller diameter than the upper region. The lower region with the medium connection channel 302 is designed to be tubular and hollow inside. In particular, the interior of the lower region forms the internal space of the medium connection channel 302, through which the fluid is guided to the core component 100. The outer wall of the lower region may be configured as a thread. A seal ring 303 can be positioned outside the lower housing element 300 at the transition from the lower region to the upper region. This seal ring is configured to seal the lower housing element 300 when the sensor device 1000 is installed. Alternative designs are possible for the seal region of the lower housing element 300.

[0073] The protective element 304 can be configured to surround the temperature sensor element 105 and thus mechanically protect it. At the same time, it must be possible to easily access the temperature sensor element 105 with fluid. Since the protective element 304 is not attached to the core component 100, it does not exert any mechanical stress on the core component 100. A double-sided morphological fit between the protective element 304 and the medium connection channel 302 in the lower region of the lower housing element 300 ensures that the protective element 304 is held within the lower housing element 300. The morphological fit can be formed by deformation, such as thermal bonding. The protective element 304 can be a plastic component in particular and may have at least one web 305 that can prevent twisting or slipping of the protective element 304 by press-fitting and / or morphological fitting with the wall of the medium connection channel 302. Furthermore, the protective element 304 can electrically and thermally insulate the temperature sensor element 105 from the lower housing element 300, thereby improving measurement accuracy. In an alternative embodiment, the sensor device 1000 may not have a protective element 304.

[0074] Pressure acts not only axially but also radially in the medium connection channel 302 formed in the lower housing element 300. The fluid flowing through the medium connection channel 302 exerts an axially upward force on the core component 100, as indicated by the arrow in Figure 9. This force is transmitted to the circuit carrier 102 that seals the medium connection channel 302 with the seal element 130. The force is transmitted to the support element 103 via the circuit carrier 102. The support element 103 has a stop surface that abuts against the stop surface 204 of the upper housing element 200, thereby transmitting the force from the support element 103 to the upper housing element 200. The upper housing element 200 is configured to transmit force to the flange portion 301 of the lower housing element 300, with which the collar 203 of the upper housing element 200 abuts axially, on the left side of the sensor device 1000, as shown simply as an example in Figure 9.

[0075] In the circuit carrier 102, force acts on the central region 113 but not on the peripheral region 114. The support element 103 is positioned in the central region 113 of the circuit carrier 102 and abuts against the stopping surface 204 of the upper housing element 200. Therefore, the support element 103 absorbs the force and transmits it to the upper housing element 200. This prevents the circuit carrier 102 from bending. Supports are not needed in the peripheral region 114 of the circuit carrier 102. Consequently, the peripheral region 114 of the circuit carrier 102 can be used for electrical components 106.

[0076] Features and embodiments described in relation to the drawings can be combined with each other according to further embodiments, even if not all combinations are explicitly described. Furthermore, embodiments described in relation to the drawings may have alternative or additional features according to the description of the general part.

[0077] The present invention is not limited to the description based on embodiments. Rather, the present invention encompasses all new features and all combinations of features, including all combinations of the features of the claims, even if such features or combinations are not expressly described in the claims or embodiments. [Explanation of symbols]

[0078] 100 core components 100a top surface 100b bottom 101 Connection point 101a Connection point 101b Connection point 102 Circuit Carrier 102a Top side 102b Bottom 102c side 103 Support elements 103a frame 103b Web 104 Pressure sensor element 105 Temperature sensor element 105a lead wire 105b Sensor Cell 106 Electrical components 107 Contact area 108 Conductor Structure 108a Via 108b Conductor Track 109 Electrical feedthrough 110 Molding materials 112 Pressure feedthrough 113 Central area 113a Seal area 113b Sealing surface 114 Peripheral area 130 sticker elements 200 Upper housing element 201 Plastic elements 202 Contact elements 203 Colors 204 Stopping surface 205 Color exterior 206 Sealing material 300 Lower housing element 301 Flange section 302 Media Connection Channel 303 Seal ring 304 Protective elements 305 Web 1000 Sensor Devices AA distance P1 Edge point P2 edge point MP center point Length of the straight line from P1 to P2

Claims

1. A core component (100) for a sensor device (1000), A circuit carrier (102) having an upper surface (102a) and a bottom surface (102b) opposite to the upper surface (102a), Pressure sensor element (104), Temperature sensor element (105), Equipped with, The circuit carrier (102) has a central region (113) and a peripheral region (114) surrounding the central region (113), The central region (113) has a sealing region (113a) adjacent to the peripheral region (114), The pressure sensor element (104) and the temperature sensor element (105) are mounted on the circuit carrier (102) in the central region (113). At least the temperature sensor element (105) is mounted on the bottom surface (102b) in the central region (113) and electrically connected to the first connection point (101a) on the bottom surface (102b), The circuit carrier (102) does not have an electrical feedthrough from the bottom surface (102b) of the central region (113) to the top surface (102a) of the central region (113). Core component (100).

2. The core component (100) according to claim 1, wherein the first connection point (101a) is connected to a conductive structure (108) that extends into the interior of the circuit carrier (102) and extends from the central region (113) to the peripheral region (114).

3. The core component (100) according to claim 2, wherein the conductive structure (108) is connected in the peripheral region (114) to a second connection point (101b) on the upper surface (102a) of the circuit carrier (102).

4. The core component (100) according to any one of claims 1 to 3, wherein the pressure sensor element (104) is mounted on the upper surface (102a) in the central region (113).

5. The core component (100) according to claim 4, wherein the pressure feedthrough (112) extends from the bottom surface (102b) to the pressure sensor element (104) on the top surface (102a) in the central region (113).

6. The core component (100) according to claim 5, wherein the pressure feedthrough (112) is the sole feedthrough of the circuit carrier (102) from the bottom surface (102b) of the central region (113) to the top surface (102a) of the central region (113).

7. The core component (100) according to any one of claims 1 to 6, wherein the circuit carrier (102) has a sealing surface (113b) on the bottom surface (102b) in the sealing region (113a) for a sealing element (130).

8. The core component (100) according to any one of claims 1 to 7, wherein the support element (103) is positioned on the upper surface (102a) in the central region (113).

9. The core component (100) according to claim 8, wherein the support element (103) has a frame (103a) that surrounds the internal region in which the pressure sensor element (104) is arranged.

10. The core component (100) according to claim 9, wherein the internal region is filled with a molding material (110).

11. The core component (100) according to any one of claims 8 to 10, wherein the support element (103) has at least two webs (103b), and an electrical component (106) is mounted on the upper surface (102a) between the at least two webs (103b).

12. A sensor device (1000), A core component (100) according to any one of claims 1 to 11, An upper housing element (200) surrounding the core component (100), A sensor device (1000) equipped with the following.

13. The upper housing element (200) abuts against the upper surface of the support element (103), The sensor device (1000) according to claim 12, as referenced to any one of claims 8 to 11.

14. A lower housing element (300) having a medium connection channel (302) configured to guide fluid to the bottom surface (100b) of the core component (100). A sensor device (1000) according to claim 12 or 13, comprising the above.

15. The sensor device (1000) according to claim 14, wherein the sealing element (130) is disposed between the circuit carrier (102) and the lower housing element (300), directly adjacent to the sealing surface (113b) on the bottom surface (102a) of the circuit carrier (102).

16. The sensor device (1000) according to claim 14 or 15, further comprising a protective element (304) inserted into the media connection channel (302).

17. The axial direction extends toward the core component (100) along the media connection channel (302), The lower housing element (300) protrudes in the axial direction beyond the core component (100), The lower housing element (300) has a flange portion (301) that surrounds the axial lower end of the upper housing element (200). A sensor device (1000) according to any one of claims 14 to 16.

18. The core component (100) is configured to transmit force to the upper housing element (200) via the support element (103), The upper housing element (200) is configured to transmit the force received from the core component (100) to the flange portion (301) of the lower housing element (300). The sensor device (1000) according to claim 17, as referenced to claim 13.

19. The upper housing element (200) and the flange portion (301) are sealed to each other by a sealing material (206). The sensor device (1000) according to claim 17 or 18.

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