Modular electronic equipment for flow control

Abstract

Semiconductor manufacturing systems are essential for realizing modern technology. Such systems include a central control unit, multiple fluid sources, multiple flow control units, and a processing chamber. The central control unit comprises a processor, memory, and a communication module. The multiple flow control units have a device controller having active components, sensors, and a communication module. The communication comprises a communication module, memory, a sensor drive circuit operably coupled to the sensor, and an active component drive unit operably coupled to the active component. The central control unit is configured to receive sensor data from the sensors of the multiple flow control units and transmit active component commands to the active component drive unit of the device controller to control the multiple flow control units.

Description

Technical Field

[0001] References to related applications This application claims the priority of U.S. Provisional Application No. 63 / 498,190, filed on April 25, 2023, the content of which is hereby incorporated by reference in its entirety.

Background Art

[0002] Systems and apparatuses for semiconductor processing utilize various electronic control strategies. In semiconductor manufacturing processes, multiple flow control devices are required to control and supply a wide range of fluids, including numerous gases and liquids. To enable complex processing steps, each flow control device must be controlled. The control required for flow control devices may be implemented locally on the flow control device, on individual active components of the flow control device, or on a central control device that directly controls the flow control device or its active components.

[0003] Current systems have challenges with high-cost control strategies that require dedicated solutions for each flow control device. As the scale and complexity of the system increase, development costs and time increase. Cost reduction, reliability improvement, realization of functionality expansion, and maintenance of minimal complexity are desired. Furthermore, cost reduction and improved maintainability of semiconductor processing systems and apparatuses are desired. Improvements to semiconductor processing systems and apparatuses are desired to reduce costs and complexity while improving functionality.

Summary of the Invention

[0004] This technology relates to systems and related methods for manufacturing semiconductor devices. These systems rely on various types of control electronics, which can be designed in a variety of ways. Currently available systems implement many custom electronic modules for semiconductor manufacturing systems and flow control devices, and these modules are often highly specialized for specific systems. Such systems can be used to realize a wide range of processes, such as semiconductor chip manufacturing and solar panel manufacturing.

[0005] In one embodiment, the present invention is a semiconductor manufacturing system having a central control unit, a plurality of fluid sources, a plurality of flow control units, and a processing chamber. The central control unit has a processor, memory, and a communication module. Each of the plurality of flow control units has a device controller having an inlet, an outlet, a fluid path connecting the inlet and outlet, a sensor fluidly connected to the fluid path, an active component fluidly connected to the fluid path, and a communication module, memory, a sensor circuit operably connected to the sensor, and an active component drive unit operably connected to the active component. The processing chamber is fluidly connected to the outlet of the plurality of flow control units, and the processing chamber is configured to contain a workpiece. The central control unit is configured to receive sensor data from the sensor circuit of the first of the plurality of flow control units and to transmit an active component command calculated based on the sensor data to the active component drive unit of the first of the plurality of flow control units.

[0006] In another embodiment, the present invention relates to a semiconductor manufacturing system comprising a central control unit, a fluid supply source, a first flow control device, a processing chamber, and a communication bus. The central control unit has a processor, memory, and a communication module. The first flow control device comprises a device controller having a fluid-connected inlet, outlet, fluid path connecting the inlet and outlet, a fluid-connected sensor to the fluid path, a fluid-connected active component to the fluid path, and a communication module, memory, a sensor circuit operably connected to the sensor, and an active component drive unit operably connected to the active component. The processing chamber is fluid-connected to the outlet of the first flow control device, and the processing chamber is configured to contain a workpiece. The communication bus operably connects the communication module of the central control unit and the communication module of the device controller. The device controller is configured to transmit sensor data messages, including sensor data, to the central control unit via the communication bus. The central control unit is configured to transmit active component messages to the device controller via the communication bus, the active component messages including active component commands at least partially determined based on a setpoint stored in the memory of the central control unit and the sensor data in the sensor data messages.

[0007] In yet another embodiment, the present invention relates to a semiconductor manufacturing system comprising a central control unit, a fluid supply source, a first flow control device, a processing chamber, and a communication bus. The central control unit has a processor, memory, and a communication module. The first flow control device has a device controller having a fluid-connected inlet, outlet, fluid path connecting the inlet and outlet, a fluid-connected sensor to the fluid path, a fluid-connected active component to the fluid path, and a communication module, memory, a sensor circuit operably connected to the sensor, and an active component drive unit operably connected to the active component. The processing chamber is fluid-connected to the outlet of the first flow control device, and the processing chamber is configured to contain a workpiece. The communication bus is operably connected to the communication module of the central control unit and the communication module of the device controller. The device controller is configured to transmit sensor data messages, including sensor data, to the central control unit via the communication bus. The central control unit implements a feedback control loop that utilizes sensor data from the first flow control device to control the active component of the first flow control device.

[0008] In yet another embodiment, the present invention is a semiconductor manufacturing method. In the first step, a first sensor data message, including first sensor data, is transmitted from the device controller of a first flow control device to a central control device, the first flow control device having a sensor operably connected to the device controller, the sensor detecting the characteristics of the fluid in the fluid path of the first flow control device. In the second step, a first active component command is calculated using a setpoint stored in the memory of the central control device and the first sensor data of the first sensor data message. In the third step, a first active component message, including the first active component command, is transmitted from the central control device to the device controller of the first flow control device. In the fourth step, the active component of the first flow control device is controlled according to the first active component command to supply fluid to a processing chamber containing the object to be processed. In the fifth step, a second sensor data message, including second sensor data, is transmitted from the device controller of the first flow control device to the central control device. In the sixth step, a second active component command is calculated using the setpoint and the second sensor data. In the seventh step, a second active component message is transmitted from the central control unit to the device controller of the first flow control unit, and the second active component message includes a second active component command. In the eighth step, the active component is controlled according to the second active component command to supply fluid to the processing chamber.

[0009] In another embodiment, the present invention relates to a semiconductor manufacturing system comprising a central control unit, a fluid supply source, a first flow control unit, a second flow control unit, and a processing chamber. The central control unit has a processor, memory, and a communication module. The first flow control unit has a device controller having a fluid-connected inlet, outlet, fluid path connecting the inlet and outlet, a fluid-connected sensor to the fluid path, and a communication module, memory, and sensor circuits operably connected to the sensor. The second flow control unit has a device controller having a fluid-connected inlet, outlet, fluid path connecting the inlet and outlet, an active component fluid-connected to the fluid path, and an active component drive unit operably connected to the active component. The processing chamber is fluid-connected to the outlets of the first and second flow control units, and the processing chamber is configured to contain a workpiece. The device controller of the first flow control unit is configured to transmit sensor data messages, including sensor data, to the central control unit. The central control unit is configured to send active component messages to the device controller of the second flow control unit, and the active component messages include active component commands that are at least partially determined based on setpoints stored in the central control unit's memory and sensor data in sensor data messages.

[0010] In yet another embodiment, the present invention is a semiconductor manufacturing method. In the first step, a first fluid is flowed through a first flow control device, a second fluid is flowed through a second flow control device, and the first and second fluids supplied from the first and second flow control devices are sent to a processing chamber containing an object to be processed. In the second step, first and second sensor data are transmitted from the first and second flow control devices to a central control device, and the first and second sensor data indicate the characteristics of the first and second fluids flowing through the first and second flow control devices. In the third step, first and second active component commands are calculated in the central control device using the first and second sensor data. In the fourth step, the first and second active component commands are transmitted from the central control device to the first and second flow control devices. In the fifth step, the active components of the first and second flow control devices are controlled according to the first and second active component commands. In the sixth step, the first and second sensor data from the first and second flow control devices are transmitted to the central control device. In the seventh step, the second active component command is recalculated using the first sensor data. In the eighth step, the second active component command is retransmitted from the central control device to the second flow control device. In the ninth step, the active component of the second flow control device is controlled according to the second active component command.

[0011] Further application areas of this technology will become clear from the detailed explanation below. While the detailed explanation and specific examples illustrate preferred implementations, it should be understood that they are for illustrative purposes only and do not limit the scope of application of this technology. [Brief explanation of the drawing]

[0012] The present invention will be better understood from the detailed description and accompanying drawings. Here:

[0013] [Figure 1] Figure 1 is a schematic diagram of a semiconductor device manufacturing process that utilizes one or more devices to control the flow.

[0014] [Figure 2] Figure 2 is a schematic diagram of a mass flow controller, which is one of the flow control devices available in the system of Figure 1.

[0015] [Figure 3] Figure 3 is a schematic diagram of an alternative configuration of the mass flow controller available in the system of Figure 1.

[0016] [Figure 4] Figure 4 is a block diagram showing the control system available in the system of Figure 1.

[0017] [Figure 5] Figure 5 is a block diagram showing another embodiment of the control system available in the system of Figure 1.

[0018] [Figure 6] Figure 6 is a block diagram showing another embodiment of the control system available in the system of Figure 1.

[0019] [Figure 7] Figure 7 is a flowchart showing a method for manufacturing a semiconductor.

[0020] [Figure 8] Figure 8 is a flowchart showing another method for manufacturing a semiconductor.

[0021] All drawings are schematic diagrams and are not necessarily to scale. Features numbered in a particular drawing are the same features unless otherwise stated, even if not numbered in other drawings.

Embodiments for Carrying Out the Invention

[0022] The following description of the preferred embodiments is illustrative only and is not intended to limit the invention in any way. The description of the illustrative embodiments is intended to be read in conjunction with the accompanying drawings, which are considered to be a part of the entire written description. In the description of the embodiments disclosed herein, references to directions or orientations are for convenience of description only and are not intended to limit the scope of the invention in any way. The description herein describes and explains some non-limiting combinations of features that may exist alone or in combination with other features. Further, the term "or" as used herein is interpreted as a logical operator that is true when one or more of its operands are true. Also, the expression "based on" as used herein is interpreted to mean "at least partially based on" and is thus not limited to the interpretation of "completely based on".

[0023] The features of the present invention can be implemented by software, hardware, firmware, or any combination thereof. The computer programs described herein are not limited to specific embodiments and can be implemented in an operating system, application program, foreground or background process, driver, or any combination thereof. The computer programs can be executed on a single computer or server processor or on multiple computers or server processors.

[0024] The processors described herein may be any central processing unit (CPU), microprocessor, microcontroller, arithmetic unit, or programmable device or circuit configured to execute computer program instructions (e.g., code). Various processors may be embodied in any suitable type of computer and / or server hardware (e.g., desktop, laptop, notebook, tablet, mobile phone, etc.) and may include all the usual accessory components necessary to form a functional data processing device, including, but not limited to, buses, software, data storage such as volatile and non-volatile memory, input / output devices, graphical user interfaces (GUIs), removable data storage, wired and / or wireless communication module devices including Wi-Fi, Bluetooth, LAN, etc.

[0025] The computer executable instructions or programs (e.g., software or code) and data described herein are programmed and tangibly embodied on non-temporary computer-readable media accessible and obtainable by the corresponding processor, as described herein, and by executing instructions encoded on this medium, they constitute the processor and instruct the processor to perform desired functions and processes. A device embodying such a programmable processor configured with non-temporary computer executable instructions or programs is referred to as a “programmable device” or simply “device,” and a group of intercommunicative programmable devices may be referred to as a “programmable system.” The non-temporary “computer-readable media” described herein include, but are not limited to, random access memory (RAM) and its various types, read-only memory (ROM) and its various types, USB flash memory, magnetic or optical data storage devices (e.g., internal / external hard disks, floppy disks, magnetic tapes, CD-ROMs, DVD-ROMs, optical discs, ZIP® drives, Blu-ray discs, etc.), which are written to and / or read by a processor operably connected to such media.

[0026] In certain embodiments, the present invention may be embodied in the form of computer-implemented processes and devices, such as processor-based data processing and communication systems or computer systems for performing those processes. The present invention may also be embodied in the form of software or computer program code embodied on a non-temporary computer-readable storage medium, wherein code segments of this program, when loaded and executed on a data processing and communication system or computer system, constitute a processor and generate specific logic circuits configured to perform the process.

[0027] Where circuits are illustrated and described in the following explanation, those skilled in the art will recognize that, for clarity, not all peripheral circuits and components are shown in the drawings, nor are all described in the text. Furthermore, the terms “connect” and “connect operably” may refer to the direct or indirect connection of two components of a circuit.

[0028] The following description of preferred embodiments is illustrative and not intended to limit the invention in any way. The description of explanatory embodiments is intended to be read in conjunction with the accompanying drawings, which are considered to be part of the whole written description. In the description of embodiments disclosed herein, references to direction or orientation are for illustrative purposes only and are not intended to limit the scope of the invention in any way. Relative terms such as “bottom,” “top,” “horizontal,” “vertical,” “up,” “down,” “upward,” “downward,” “left,” “right,” “top,” “bottom,” “front,” “back,” and their derivatives (e.g., “horizontally,” “downward,” “upward,” etc.) should be interpreted as referring to the direction being described at that time or the direction shown in the drawings. These relative terms are for illustrative purposes only and do not require the apparatus to be constructed or operated in a particular orientation unless expressly indicated otherwise. Terms such as “attached,” “fixed,” “connected,” “joined,” “interconnected,” and “secured” mean, unless otherwise specified, relationships in which structures are fixed or attached to one another, directly or indirectly through intervening structures, as well as movable or rigid attachments or relationships. The descriptions herein describe and illustrate several non-limiting combinations of features, which exist individually or in combination with other features. Furthermore, the term “or” as used herein is interpreted as a logical operator that is true if one or more of its operands are true. Also herein, the expression “based on” is interpreted as “based at least partially,” and therefore not limited to the interpretation “based entirely.”

[0029] Throughout this specification, "range" is used as an abbreviation to describe the individual values ​​and all values ​​contained within that range. Any value within a range can be selected as the end of that range. Furthermore, all references cited herein are incorporated entirely by citation. In the event of any conflict between the definitions in this specification and those of the cited references, this specification shall prevail.

[0030] Figure 1 is a schematic diagram showing an exemplary processing system 1000 for processing articles. The processing system 1000 can utilize multiple flow control devices 100 that are fluidically connected to a processing chamber 1300. Each of the multiple flow control devices 100 is fluidically connected to a fluid supply source 1010, and each fluid supply source 1010 supplies processing fluid to its respective flow control device 100. Optionally, multiple fluid supply sources 1010 may be fluidically connected to a single flow control device 100, or multiple flow control devices 100 may be fluidically connected to a single fluid supply source 1010. Each fluid supply source 1010 may supply a different process fluid, or some of the multiple fluid supply sources 1010 may supply a single process fluid.

[0031] Multiple flow control devices 100 are used to supply one or more different process fluids to a processing chamber 1300 via an outlet manifold 400. Articles such as semiconductors may be processed in the processing chamber 1300. Valves 1100 isolate the flow control devices 100 from the processing chamber 1300, allowing the flow control devices 100 to be selectively connected to or isolated from the processing chamber 1300. The processing chamber 1300 includes one or more dispensing devices for dispensing the process fluids supplied by the multiple flow control devices 100, allowing for selective or diffusive distribution of the fluids supplied by the multiple flow control devices 100.

[0032] Furthermore, the processing system 1000 may further include a vacuum source 1200 isolated from the processing chamber 1300 by a valve 1100, which allows for the discharge of the processing fluid to enable switching of the processing fluid within the same flow control device 100, or facilitates purging of one or more flow control devices 100. Each flow control device 100 has an independent bleed port connected to a vent manifold 500, which is connected to the vacuum source 1200 via a valve 1100. Optionally, the flow control device 100 may be a mass flow controller, flow splitter, or any other device that controls the flow rate of process fluid in a processing system that processes semiconductor devices such as semiconductor chips and solar panels. Furthermore, the valve 1100 may be integrated into the flow control device 100 as needed. In some implementations, this may eliminate the need for other specific valves 1100 within the processing system 1000.

[0033] Processes that can be performed with processing system 1000 include wet cleaning, photolithography, ion implantation, dry etching, atomic layer etching, wet etching, plasma ashing, rapid thermal annealing, furnace annealing, thermal oxidation, chemical vapor deposition, atomic layer deposition, physical vapor deposition, molecular beam epitaxy, laser lift-off, electrochemical deposition, chemical mechanical polishing, wafer testing, or other processes utilizing a controlled amount of process fluid.

[0034] Figure 2 shows a schematic diagram of an exemplary mass flow controller 101, which is one form of a flow control device 100 available in the processing system 1000. The mass flow controller 101 has a fluid source 1010 of process fluid, which is fluidically connected to an inlet 104. A fluid path 105 extends from the inlet 104 to an outlet 110, which is fluidically connected to an outlet manifold 400. The inlet 104 is fluidically connected to a proportional valve 120, which can change the mass and volume of process fluid flowing through it. The proportional valve 120 measures the mass flow rate of process fluid passing into volume P1 106. The proportional valve 120 can provide proportional control of the process fluid and does not need to be fully open or closed, but can instead take an intermediate state, allowing control of the mass flow rate of the process fluid.

[0035] Volume P1 106 is fluidically connected to the proportional valve 120, and Volume P1 106 is the sum of all volumes in the mass flow controller 101 between the proportional valve 120 and the flow limiter 160. A pressure transducer 130 is fluidically connected to Volume P1 106 to enable the measurement of the pressure in Volume P1 106. A shut-off valve 150 is located between the flow limiter 160 and the proportional valve 120 and may be used to completely stop the outflow of process fluid from Volume P1 106. Optionally, in another configuration, the flow limiter 160 may be located between the shut-off valve 150 and the proportional valve 120. The flow limiter 160 is fluidically connected to the outlet 110 of the mass flow controller 101. In the processing system, the outlet 110 is fluidly connected to a valve 1100 or directly to the processing chamber 1300. In this embodiment, the flow limiter 160 is located between the shut-off valve 150 and the outlet 110. In another embodiment, the shut-off valve 150 is positioned between the flow limiter 160 and the outlet 110. Therefore, the arrangement of the shut-off valve 150 and the flow limiter 160 can be reversed.

[0036] Finally, the bleed valve 180 is connected to the P1 volume 106 and the bleed port 190. In this embodiment, the bleed valve 180 is a proportional valve. The bleed valve 180 may be an on / off valve or any other type of valve suitable for controlling the fluid flow. Optionally, a second flow limiter 160 can be incorporated between the P1 volume and the bleed port 190. When a proportional valve is used as the bleed valve 180, it is possible to control the flow rate of the fluid through the bleed port 190. A characterized limiter 160 can contribute to improving the accuracy of fluid flow control, regardless of whether the bleed valve 180 is a proportional valve or an on / off valve. Preferably, the fluid flow rate through the bleed valve 180 is characterized, making it possible to estimate the flow rate at a given state of the bleed valve 180.

[0037] Inside the first shut-off valve 150 are a valve seat and a closing member. While the device 100 is supplying process fluid, the first shut-off valve 150 is in an open state, and the valve seat and closing member are not in contact. This allows the process fluid to flow, and the resistance to the fluid flow is negligible. When the first shut-off valve 150 is in a closed state, the closing member and valve seat are biased in the direction of contact by a spring, stopping the flow of process fluid through the first shut-off valve 150.

[0038] The flow limiter 160 is used in combination with the proportional valve 120 to measure the flow rate of the process fluid. In most embodiments, the flow limiter 160 provides a known limit to the fluid flow. A first characteristic flow limiter 160 may be selected to have a specific flow impedance to supply a desired range of mass flow rates for a particular process fluid. The flow limiter 160 has greater flow resistance than its upstream and downstream passages.

[0039] Optionally, the mass flow controller 101 includes one or more P2 pressure transducers downstream of the flow limiter 160 and the shut-off valve 150. The P2 pressure transducers are used to measure the pressure difference across the flow limiter 160. In some embodiments, the P2 pressure downstream of the flow limiter 160 may be obtained from another device 100 connected to the processing chamber, and the measured value may be transmitted to the mass flow controller 101.

[0040] Optionally, one or more temperature sensors 132 can be used to further improve the accuracy of the mass flow controller 101. These are installed near the P1 volume 106 in the base of the mass flow controller 101. Additional temperature sensors 132 can be placed in various locations, including near the proportional valve 120, pressure transducer 130, shut-off valve 150, and bleed valve 180.

[0041] The proportional valve 120, the shut-off valve 150, and the bleed valve 180 can be called active components because they are actively controlled to achieve desired control of the fluid passing through the multiple flow control devices 100. Active components do not have to be valves and can also include devices that selectively limit the flow rate or other devices that modify the characteristics of the fluid passing through the flow control devices. Other types of active components include flow regulators, transducers, or actuators.

[0042] Pressure transducers 130 and temperature sensors are sometimes referred to as sensors because they detect or sense the characteristics of the fluid in the fluid path 105 of multiple flow control devices 100. In other implementations, pressure transducers 130 or temperature sensors 130 are used to sense the characteristics of the fluid in the system but may be located outside of the multiple flow control devices. For example, if two flow control devices are fluidically connected by an outlet manifold 400, the pressure in one flow control device can be measured by a pressure transducer located in the other flow control device. Other types of sensors include transducers, flow sensors, accelerometers, gyroscopes, or other known devices for sensing characteristics in a system, including the characteristics of the fluid or the characteristics of the flow control devices 100.

[0043] In other implementations, such as those shown in Figure 3, the mass flow controller 101 can utilize an alternative configuration in which a flow limiter 160 is fluidically connected to an inlet 104, and the inlet 104 is fluidically connected to a fluid supply source 1010. The flow limiter 160 is fluidically connected to a proportional valve 120, and volume P1 106 is located between the flow limiter 160 and the proportional valve 120. A first pressure transducer 130 is fluidically connected to volume P1 106 to detect the pressure within volume P1 106. A second pressure transducer 130 functions as a P2 pressure transducer that detects the pressure between the proportional valve 120 and the outlet 110.

[0044] Optionally, the bleed valve 180 may or may not be included in the mass flow controller 101 in Figure 3. Furthermore, the second pressure transducer 130 may be omitted or located elsewhere. The proportional valve 120 may be replaced with an on / off valve, and the positions of the proportional valve 120 and the flow limiter 160 may be swapped. In this embodiment, the on / off valve 150 is omitted, but it can be incorporated before 18-160, after the proportional valve 120, or between the flow limiter 160 and the flow proportional valve 120. In yet another implementation, valve 1100 can be used instead of the on / off valve 150.

[0045] Referring to Figure 4, a block diagram shows the controller 250 for the processing system 1000 in Figure 1. This block diagram shows a device controller 260 and a central control unit 200. The device controller 260 provides an interface function to the flow control device 100 in the processing system 1000, enabling control of the flow control device 100. The device controller 260 comprises a communication module 262, at least one active component drive unit 264, at least one sensor drive unit 266, a processor 272, memory 274, and a power supply / regulation module 278.

[0046] Optionally, a single device controller 260 may operate multiple flow control devices 100, or each flow control device 100 may have its own dedicated device controller 260, each device controller 260 communicating with the central control unit 200 and other device controllers 260 via the communication bus 276. The communication module 262 is configured to provide a communication link between the device controllers 260 and the central control unit 200. The communication module 262 may be configured to communicate with the central control unit 200 and other device controllers 260 via the communication bus 276, as will be described in detail below.

[0047] The device controller 260 utilizes one or more active component drivers 264 to enable control of active components such as the proportional valve 120, the bleed valve 180, and the on / off valve 150. The active component drivers 264 may be valve drivers or other types of drivers necessary to operate solenoids, piezoelectric devices, or other devices required to operate the active components. The active component drivers 264 enable proportional control or on / off control of valves and other active components as needed. In some implementations, the active component drivers 264 are dedicated to a specific type of active component or are configured to be used with various types of active components.

[0048] The device controller 260 utilizes one or more sensor drivers 266, each configured to interface with the sensors of the flow control device 100. For example, a sensor driver 266 may be configured to generate sensor data from the pressure transducer 130 or the temperature sensor 132 of the mass flow controller 101. The sensor driver 266 may generate the sensor data as analog data or in digital format. The sensor driver 266 may be configured for a specific sensor type or configured to interface with various different sensor types. For example, the device controller 260 may implement a single type of sensor driver 266 capable of interfaceping with both the temperature sensor 132 and the pressure transducer 130. Alternatively, the device controller 260 may have a dedicated sensor driver 266 for each sensor type.

[0049] The processor 272 and memory 274 of the device controller 260 can interface with the communication module 262, the sensor drive unit 266, and the active component drive unit 264. The memory 274 can store calibration data for the mass flow controller 101 or for other flow control devices 100, including sensors and active components. The memory 274 can also store setting values ​​for the mass flow controller 101 or other flow control devices 100. In other configurations described later, the setting values ​​may be stored elsewhere. The processor 272 can implement a control loop that relies on sensor data from the sensor drive unit 266 and control the active components of the mass flow controller 101 or other flow control devices 100 via the active component drive unit 264. In other embodiments, the control loop may be implemented outside the device controller 260.

[0050] The central control unit 200 comprises a communication module 210, a processor 222, memory 224, and a power supply / regulation module 226. The central control unit 200 coordinates the functions necessary to perform a desired process on semiconductor devices or other items to be processed. The communication module 210 of the system controller 200 sends and receives commands via a communication bus 276. The communication bus 276 is connected to the communication modules 262 of one or more device controllers 260 that operate one or more devices that control the flow 100. The communication bus 276 may connect the central control unit 200 to a single device controller 260 or to multiple device controllers 260. Each device controller 260 may operate an individual flow control device 100 or multiple flow control devices. In yet another implementation, some device controllers 260 may not control the gas flow control device 100. Instead, other types of process equipment may also be controlled by the device controller 101. Optionally, the communication bus 276 may incorporate a hub or other device that allows connection of all flow control devices 100 necessary to complete a desired set of processes on the items to be processed. Furthermore, multiple communication buses 276 may be provided to connect all the devices necessary to perform the desired process. In other implementations, the communication buses 276 may be replaced by multiple direct communication links between individual controllers 200, 260.

[0051] The communication bus 276 may be a serial bus, a parallel bus, or a combination of both. Therefore, the communication bus 276 may enable communication using any of the various protocols, including serial and parallel communication protocols. For example, communication modules 210 and 262 may transmit messages and other data packets using any of the various protocols. For example, data may be transmitted as sensor data messages and active component messages, where sensor data messages contain sensor data and active component messages contain active component commands. Other types of messages, such as setpoint messages, are transmitted via the communication bus 276, where setpoint messages contain desired setpoints for the flow control device 100. Various protocols may be used, including protocols using RS-232, RS-422, RS-485, and other standards. Other protocols include Ethernet, EtherCAT, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, BACnet, and other known communication protocols and standards that enable communication between the central control unit 200 and the device controller 260.

[0052] A power connection unit 277 can be provided, and the central control unit 200 supplies power from its power supply / adjustment module 226 to the power supply / adjustment module 278 of the device controller 260 via the power connection unit 277. In some embodiments, the power connection unit 277 may be integrated into the communication bus 276. In other embodiments, the power connection 277 may be provided from the central control unit 200 to the device controller 260 separately from the communication bus 276. Optionally, power may also be transmitted via the communication bus 276 in a manner similar to that of a Power over Ethernet ("PoE") type system where the communication bus is also the power bus.

[0053] The central control unit 200 is connected to the mains power supply, and the power / control module 226 converts the mains power supply to 12-24 volts DC. The power / control module 278 of the device controller 260 converts the 12-24 volts DC supplied from the power / control module 226 to 3.3 volts, 5 volts, or 12 volts DC that the device controller 260 can use directly. The power / control module 226 can also supply 3.3 volts, 5 volts, or 12 volts DC for use by the central control unit 200. In other implementations, each device controller 260 may be directly connected to the mains power supply, and the power / control module 278 may directly convert the mains power supply to the voltage level required by the device controller 260.

[0054] The processor 222 and memory 224 perform the desired processing on the object to be processed, store the parameters necessary to operate the system 1000, and execute the stored instructions. For example, memory 224 stores setting values ​​for multiple flow control devices 100, the processor uses the communication module 210 to send setting value messages to the device controller 260, and the device controller 260 controls its active components based on sensor data from its sensors and the setting value data in the setting value messages. Thus, a control loop is implemented within the device controller 260. Optionally, sensor data from other device controllers 260 of other flow control devices 100 may also be used to control the active components. This achieves fluid control. For example, the system can supply a gas or liquid at a desired mass flow rate for a desired period of time at a desired timing, in accordance with commands from the central control unit 200. The device controller 260 implements the necessary feedback control loop to control the active controllers.

[0055] In other implementations, the central control unit 200 stores setting value information in memory 224, and the processor 222 can implement the necessary feedback control loop for all flow control devices 100. Thus, sensor data messages from each device controller 260 of the flow control devices 100 are sent to the central control unit 200. The sensor data from the sensor data messages is used in combination with the setting values ​​stored in memory 224 to calculate active component commands and send active component messages to the device controller 260. The device controller 260 then controls the active component according to the active component commands, new sensor data is sent to the central control unit 200, the active component commands are recalculated and resent to the device controller 260. Thus, the feedback loop is performed in the central control unit. Furthermore, a configuration is also envisioned in which one flow control device 100 generates only sensor data and another flow control device incorporates only active components, with sensor data from the first flow control device used to control the active component in the second flow control device. In yet another configuration, it is also possible to use sensor data from the first and second flow control devices to calculate active component commands for the first flow control device.

[0056] Referring to Figure 5, another control unit 350 is shown, which has a central control unit 300 and a plurality of device controllers 360. The central control unit 300 comprises a processor 322, memory 324, a communication module 310, and a power supply / regulation module 326. A communication bus 376 and a power connection 377 connect the central control unit 300 to the plurality of device controllers 360. Optionally, each device controller 360 may not implement a processor. The device controller 360 may have a communication module 362, memory 374, an active component drive unit 364, a sensor drive unit 366, and a power supply / regulation module 378. Thus, sensor data is passed directly from the sensor drive unit 366 to the communication module 362. Similarly, active component commands are passed directly from the communication module 362 to the active component drive unit 364. As mentioned above, it is assumed that sensor data from different flow control devices 100 will be combined to calculate the active component commands for a single flow control device 100, and not all flow control devices 100 will necessarily incorporate both sensors and active components. The calibration values ​​for the sensors and active components are stored in memory 374.

[0057] Figure 6 further illustrates that in some implementations, sensor data from multiple flow control devices 100 are used to control the active components of a single flow control device 100, or sensor data from one flow control device 100 is used to control the active components of another flow control device 100. The controller 450 comprises a central control unit 400 and multiple device controllers 460. The central control unit 400 comprises a processor 422, memory 424, a communication module 410, and a power supply / regulation module 426. A communication bus 476 and power connections 477 connect the central control unit 400 to the multiple device controllers 460. Optionally, each device controller 460 may not implement a processor. Calibration values ​​for sensors and active components are stored in memory 474.

[0058] The first device controller 460 may include a communication module 462, a memory 474, an active component drive unit 464, a sensor drive unit 466, and a power supply / adjustment module 478. The second device controller 460 may include a communication module 462, a memory 474, an active component drive unit 464, and a power supply / adjustment module 478. The third device controller 460 may include a communication module 462, a memory 474, a sensor drive unit 466, and a power supply / adjustment module 478. The first, second, and third device controllers 460 may each operate the first, second, and third flow rate control devices 100, respectively.

[0059] Therefore, the second device controller 460 may control only active components via the active component drive unit 464, and the corresponding flow control device 100 may lack sensors. Similarly, the third device controller 460 may have only a sensor drive unit that generates sensor data from the sensors of the corresponding flow control device 100. The flow control device 100 connected to the third device controller may lack active components. Sensor data from the first and third device controllers 460 may be used by the central control unit 400 to calculate active component commands for the first and second flow control devices 100. These active component commands are executed by the associated device controllers 460.

[0060] Referring to Figure 7, a semiconductor manufacturing method is shown. In the first step, a first sensor data message is transmitted from the device controller of the first flow control device to the central control device. The first sensor data message includes first sensor data. The first flow control device has a sensor operably coupled to the device controller, and the first sensor data is generated by the sensor. The sensor senses the characteristics of the fluid in the fluid path of the first flow control device.

[0061] In the second step, the first active component command is calculated using the setting value stored in the memory of the central control unit and the first sensor data of the first sensor data message. In the third step, the first active component message is transmitted from the central control unit to the device controller of the first flow control unit. The first active component message includes the first active component command.

[0062] In the fourth step, the active components of the first flow control device are controlled according to the first active component command. This causes the first flow control device to supply fluid to a processing chamber containing the articles to be processed. In the fifth step, the process is repeated such that a second sensor data message, including second sensor data, is sent from the device controller of the first flow control device to the central control device.

[0063] In the sixth step, a second active component command is calculated using the setpoint and the second sensor data. In the seventh step, a second active component message is sent from the central control unit to the device controller of the first flow control unit. The second active component message includes a second active component command. In the eighth step, the active component is controlled according to the second active component command, and fluid is supplied to the processing chamber.

[0064] In this way, a feedback control loop is executed by the central control unit, which commands the active components of the flow control device based on sensor data and setpoints stored in the central control unit. The setpoints correspond to the target operating parameters of the first flow control device. For example, if the flow control device is a mass flow controller 101, the setpoints may correspond to the desired mass flow rate supplied by the mass flow controller 101.

[0065] It is further conceivable that a third sensor data message, including third sensor data, is transmitted from the device controller of the second flow control device to the central control device. Next, a third active component command may be calculated using the set value and the third sensor data. The third active component command may be transmitted from the central control device to the device controller of the first flow control device in the third active component message. The active component of the first flow control device may then be controlled using the third active component command. This makes it possible for the first flow control device to change the flow rate it delivers based on the sensor data from the second flow control device.

[0066] In yet another possible configuration, a fourth sensor data message containing fourth sensor data may be transmitted from the device controller of the second flow control device to the central control device. A fifth sensor data message containing fifth sensor data may also be transmitted from the device controller of the first flow control device to the central control device. A fourth active component command may be calculated using the setpoint and the fourth and fifth sensor data. A fourth active component message may be transmitted from the central control device to the device controller of the first flow control device. The fourth active component message may contain a fourth active component command. The active component is then controlled according to the fourth active component command, and fluid can be supplied to the processing chamber.

[0067] As shown in Figure 8, another method for manufacturing semiconductors is illustrated. In the first step, a first fluid is flowed through a first flow control device, and a second fluid is flowed through a second flow control device. The first and second fluids are sent from the first and second flow control devices to a processing chamber containing the article to be processed. In the second step, first and second sensor data from the first and second flow control devices are transmitted to a central control device. The first and second sensor data represent the characteristics of the first and second fluids flowing through the first and second flow control devices.

[0068] In the third step, the first and second active component commands are calculated in the central control unit using the first and second sensor data. In the fourth step, the first and second active component commands are transmitted from the central control unit to the first and second flow control units. In the fifth step, the active components of the first and second flow control units are controlled according to the first and second active component commands.

[0069] In the sixth step, first and second sensor data from the first and second flow control devices are transmitted to the central control device. In the seventh step, the second active component command is recalculated using the first sensor data. In the eighth step, the second active component command is retransmitted from the central control device to the second flow control device. In the ninth step, the active component of the second flow control device is controlled according to the second active component command. Thus, this method controls the active component of the second flow control device using data from the sensors of the first flow control device.

[0070] Exemplary claim set

[0071] Exemplary Claim 1: A semiconductor manufacturing system comprising: a central control unit including a processor, memory, and a communication module; a plurality of fluid sources; a plurality of flow control devices, each of which a device controller includes an inlet and an outlet, a fluid path connecting the inlet and the outlet, a sensor fluidly coupled to the fluid path, an active component fluidly coupled to the fluid path, a communication module, memory, a sensor circuit operably coupled to the sensor, and an active component drive unit operably coupled to the active component; and a processing chamber fluidly coupled to the outlets of the plurality of flow control devices, the processing chamber being configured to contain articles to be processed; the semiconductor manufacturing system comprising: a central control unit including a processor, memory, and a communication module; a plurality of fluid sources; a plurality of flow control devices, each of which comprises a device controller including an inlet and an outlet, a fluid path connecting the inlet and the outlet, a sensor fluidly coupled to the fluid path, being calculated based on the sensor data;

[0072] Exemplary Claim 2: The system according to Exemplary Claim 1, wherein the central control device provides closed-loop control of the active component of the first device among the plurality of flow control devices.

[0073] Exemplary claim 3: The system according to exemplary claim 1 or exemplary claim 2, wherein the memory of the first device among the plurality of flow control devices stores calibration data.

[0074] Exemplary claim 4: The system according to any one of the exemplary claims 1 to 3, wherein the sensor is one of a pressure sensor or a temperature sensor.

[0075] Exemplary claim 5: The system according to any one of the exemplary claims 1 to 4, wherein the active component is a proportional valve.

[0076] Exemplary claim 6: The system according to any one of exemplary claims 1 to 5, wherein the central control unit uses the sensor data to execute a feedback control loop to control the active component of the first of the plurality of flow control units.

[0077] Exemplary claim 7: The system according to exemplary claim 6, wherein the central control unit implements a feedback control loop for each of the plurality of flow control units.

[0078] Exemplary claim 8: The system according to any one of exemplary claims 1 to 7, wherein the memory of the central control unit stores a set value, the set value corresponds to the target operating parameter of the first device among the plurality of flow control units.

[0079] Exemplary claim 9: The system according to any one of exemplary claims 1 to 8, wherein the device controller of the first device among the plurality of flow control devices is configured to transmit a sensor data message containing the sensor data.

[0080] Exemplary claim 10: The system according to any one of exemplary claims 1 to 9, further comprising a communication bus that operably connects the communication module of the central control unit to the communication module of the device controller of the first device among the plurality of flow control units.

[0081] Exemplary claim 11: The system according to exemplary claim 10, wherein the plurality of flow control devices communicate with the central control device via the EtherCAT protocol.

[0082] Exemplary claim 12: The system according to exemplary claim 10, wherein the plurality of flow control devices communicate with the central control device via one of Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet.

[0083] Exemplary claim 13: The system according to any one of exemplary claims 1 to 12, wherein the central control unit is configured to receive sensor data from the sensor circuit of the second unit of the plurality of flow control units and to transmit an active component command to the active component drive unit of the second unit of the plurality of flow control units. [

[0084] Exemplary claim 14: The system according to exemplary claim 13, wherein the active component command transmitted to the first of the plurality of flow control devices is calculated based at least in part on sensor data of the second of the plurality of flow control devices.

[0085] Exemplary claim 15: The system according to any one of exemplary claims 1 to 14, wherein the active component command is calculated based on a set value stored in the memory of the central control unit.

[0086] Exemplary Claim 16: A semiconductor manufacturing system comprising: a central control unit including a processor, memory, and a communication module; a fluid source; a device controller including an inlet, an outlet, a fluid path connecting the inlet and the outlet, a sensor fluidly coupled to the fluid path, an active component fluidly coupled to the fluid path, a communication module, memory, a sensor circuit operably coupled to the sensor, and an active component drive unit operably coupled to the active component; a processing chamber fluidly coupled to the outlet of the first flow control unit, the processing chamber being configured to contain articles to be processed; and a communication bus operably connecting the communication module of the central control unit and the communication module of the device controller, wherein the device controller is configured to transmit sensor data messages, including sensor data, to the central control unit via the communication bus, and the active component messages include active component commands determined at least in part based on a setpoint stored in the memory of the central control unit and the sensor data in the sensor data messages.

[0087] Exemplary claim 17: The system of exemplary claim 16, wherein the central control unit provides closed-loop control of the active component of the first flow control unit.

[0088] Exemplary claim 18: The system of exemplary claim 16 or exemplary claim 17, wherein the memory of the first flow control device stores calibration data.

[0089] Exemplary claim 19: The system according to any one of the exemplary claims 16 to 18, wherein the sensor is one of a pressure sensor or a temperature sensor.

[0090] Exemplary claim 20: The system according to any one of the exemplary claims 16 to 19, wherein the active component is a proportional valve.

[0091] Exemplary claim 21: The system according to any one of the exemplary claims 16 to 20, wherein the central control unit uses the sensor data to execute a feedback control loop to control the active component of the first flow control unit.

[0092] Exemplary claim 22: The system according to exemplary claim 21, wherein the central control unit performs the feedback control loop of the first flow control unit.

[0093] Exemplary claim 23: The system according to any one of the exemplary claims 16 to 22, wherein the set value corresponds to a target operating parameter of the first flow control device.

[0094] Exemplary claim 24: The system according to any one of the exemplary claims 16 to 23, wherein the first flow control device communicates with the central control device via the EtherCAT protocol.

[0095] Exemplary claim 25: The system according to any one of the exemplary claims 16 to 23, wherein the first flow control device communicates with the central control device via one of Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet.

[0096] Exemplary claim 26: The system according to any one of exemplary claims 16 to 25, wherein the central control unit is configured to receive sensor data from the sensor circuit of the second flow control unit and to transmit an active component command to the active component drive unit of the second flow control unit.

[0097] Exemplary claim 27: The system according to exemplary claim 26, wherein the active component command transmitted to the first flow control device is calculated based at least in part on sensor data of the second flow control device.

[0098] Exemplary Claim 28: A semiconductor manufacturing system comprising: a central control unit including a processor, memory, and a communication module; a fluid source; a device controller including an inlet and outlet fluidly coupled to the fluid source, a fluid path connecting the inlet and the outlet, a sensor fluidly coupled to the fluid path, an active component fluidly coupled to the fluid path, a communication module, memory, a sensor circuit operably coupled to the sensor, and an active component drive unit operably coupled to the active component; a processing chamber fluidly coupled to the outlet of the first flow control unit and configured to contain articles to be processed; and a communication bus operably connecting the communication module of the central control unit and the communication module of the device controller, wherein the central control unit executes a feedback control loop utilizing sensor data from the first flow control unit to control the active component of the first flow control unit.

[0099] Exemplary claim 29: The system of exemplary claim 28, wherein the memory of the first flow control device stores calibration data.

[0100] Exemplary claim 30: The system of exemplary claim 28 or exemplary claim 29, wherein the sensor is one of a pressure transducer or a temperature sensor.

[0101] Exemplary claim 31: The system according to any one of the exemplary claims 28 to 30, wherein the active component is a proportional valve.

[0102] Exemplary claim 32: The system according to any one of the exemplary claims 28 to 31, wherein the memory of the central control unit stores a set value, the set value corresponding to a target operating parameter of the first flow control unit.

[0103] Exemplary claim 33: The system according to any one of the exemplary claims 28 to 32, wherein the device controller of the first flow control device is configured to transmit a sensor data message including the sensor data.

[0104] Exemplary claim 34: The system according to any one of the exemplary claims 28 to 33, wherein the first flow control device communicates with the central control device via the EtherCAT protocol.

[0105] Exemplary claim 35: The system according to any one of the exemplary claims 28 to 33, wherein the plurality of flow control devices communicate with the central control device via one of Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet.

[0106] Exemplary claim 36: The system according to any one of claims 28 to 35, wherein the central control unit is configured to receive sensor data from the sensor circuit of the second flow control unit and to transmit an active component command to the active component drive unit of the second flow control unit.

[0107] Exemplary claim 37: The system according to any one of the exemplary claims 28 to 36, wherein the active component command transmitted to the first flow control device is calculated based at least in part on sensor data of the second flow control device.

[0108] Exemplary claim 38: The system according to any one of the exemplary claims 28 to 37, wherein the active component command is calculated based on a set value stored in the memory of the central control unit.

[0109] Exemplary Claim 39: a) a step of transmitting a first sensor data message, comprising first sensor data, from a device controller of a first flow control device, to a central control device, wherein the first flow control device includes a sensor operably coupled to the device controller, the sensor sensing the characteristics of a fluid in a fluid path of the first flow control device; b) a step of calculating a first active component command using a setpoint stored in the memory of the central control device and the first sensor data of the first sensor data message; c) a step of transmitting a first active component message from the central control device to the device controller of the first flow control device, wherein the first active component message includes the first active component command; d) the first A method for manufacturing a semiconductor, comprising the steps of: a) controlling an active component of a flow control device in accordance with the first active component command to supply the fluid to a processing chamber containing an article to be processed; e) transmitting a second sensor data message, including second sensor data, from the device controller of the first flow control device to the central control device; f) calculating a second active component command using the setpoint and the second sensor data; g) transmitting a second active component message from the central control device to the device controller of the first flow control device, wherein the second active component message includes the second active component command; and h) controlling the active component in accordance with the second active component command to supply the fluid to the processing chamber.

[0110] Exemplary claim 40: The method according to exemplary claim 39, wherein steps a) to h) execute a feedback control loop in the central control unit that controls the active component of the first flow control unit.

[0111] Exemplary claim 41: The method of exemplary claim 39 or exemplary claim 40, wherein the active component is a proportional valve.

[0112] Exemplary claim 42: The method according to any one of the exemplary claims 39 to 41, wherein the flow control device is a mass flow controller.

[0113] Exemplary claim 43: The method according to any one of the exemplary claims 39 to 42, wherein the sensor is one of a pressure sensor or a temperature sensor.

[0114] Exemplary claim 44: The method according to any one of the exemplary claims 39 to 43, wherein the set value corresponds to a target operating parameter of the first flow control device.

[0115] Exemplary claim 45: The method according to any one of the exemplary claims 39 to 44, wherein the first flow control device communicates with the central control device via the EtherCAT protocol.

[0116] Exemplary claim 46: The method according to any one of the exemplary claims 39 to 44, wherein the first flow control device communicates with the central control device via one of Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet.

[0117] Exemplary Claim 47: A method according to any one of the exemplary claims 39 to 46, further comprising steps i), j), k), and l), wherein step i) comprises transmitting a third sensor data message, comprising third sensor data, from a device controller of a second flow control device to the central control device; step j) comprises calculating a third active component command using the setpoint and the third sensor data; step k) comprises transmitting a third active component message from the central control device to the device controller of the first flow control device, wherein the third active component message comprises the third active component command; and step l) comprises controlling the active component in accordance with the third active component command to deliver the fluid to the processing chamber.

[0118] Exemplary claim 48: A method according to any one of exemplary claims 39 to 46, further comprising steps i), j), k), and l), wherein step i) comprises transmitting a fourth sensor data message, including fourth sensor data, from a device controller of a second flow control device, to the central control device, and transmitting a fifth sensor data message, including fifth sensor data, from the device controller of the first flow control device, to the central control device; step j) comprises calculating a fourth active component command using the setpoint and the fourth and fifth sensor data; step k) comprises transmitting a fourth active component message from the central control device to the device controller of the first flow control device, wherein the fourth active component message includes the fourth active component command; and step l) comprises controlling the active component in accordance with the fourth active component command to supply the fluid to the processing chamber.

[0119] Exemplary Claim 49: A first flow control device comprising: a central control unit including a processor, memory, and a communication module; a fluid supply source; a device controller including an inlet and outlet fluidly coupled to the fluid supply source, a fluid path connecting the inlet to the outlet, a sensor fluidly coupled to the fluid path, a communication module, memory, and a sensor circuit operably coupled to the sensor; a second flow control device comprising: an inlet and outlet fluidly coupled to the fluid supply source, a fluid path connecting the inlet to the outlet, an active component fluidly coupled to the fluid path, a communication module, memory, and an active component drive unit operably coupled to the active component; the first flow control device and A system for manufacturing semiconductors comprising: a processing chamber fluidly coupled to the outlet of the second flow control device, the processing chamber being configured to contain an article to be processed; a system for manufacturing semiconductors comprising: a device controller of the first flow control device configured to transmit a sensor data message including sensor data to the central control device, the central control device configured to transmit an active component message to the device controller of the second flow control device, the active component message including an active component command determined at least in part on a set value stored in the memory of the central control device and the sensor data of the sensor data message.

[0120] Exemplary claim 50: The system of exemplary claim 49, wherein the sensor is one of a pressure sensor or a temperature sensor.

[0121] Exemplary claim 51: The system of exemplary claim 49 or exemplary claim 50, wherein the active component is a proportional valve.

[0122] Exemplary claim 52: The system according to any one of the exemplary claims 49 to 51, wherein the central control unit uses sensor data from the first flow control unit to provide closed-loop control of the active component of the second flow control unit.

[0123] Exemplary claim 53: The system according to any one of the exemplary claims 49 to 52, wherein the central control unit performs a feedback control loop.

[0124] Exemplary claim 54: The system according to any one of the exemplary claims 49 to 53, further comprising a communication bus that operably connects the communication module of the central control unit to the communication module of the device controller of a first device among the plurality of flow control units.

[0125] Exemplary claim 55: The system according to any one of the exemplary claims 49 to 54, wherein the first flow control device and the second flow control device communicate with the central control device via the EtherCAT protocol.

[0126] Exemplary claim 56: The system according to any one of the exemplary claims 49 to 54, wherein the first flow control device and the second flow control device communicate with the central control device via one of Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet.

[0127] Exemplary Claim 57: a) a step of flowing a first fluid through a first flow control device and a second fluid through a second flow control device, wherein the first and second fluids are supplied from the first and second flow control devices to a processing chamber containing an article to be processed; b) a step of transmitting first and second sensor data from the first and second flow control devices to a central control device, wherein the first and second sensor data indicates the characteristics of the first and second fluids flowing through the first and second flow control devices; c) a step of calculating first and second active component commands in the central control device using the first and second sensor data; A method for manufacturing a semiconductor, comprising: d) transmitting the first and second active component commands from the central control unit to the first and second flow control units; e) controlling the active components of the first and second flow control units in accordance with the first and second active component commands; f) transmitting first and second sensor data from the first and second flow control units to the central control unit; g) recalculating the second active component command using the first sensor data; h) retransmitting the second active component command from the central control unit to the second flow control unit; i) controlling the active component of the second flow control unit in accordance with the second active component command.

[0128] Exemplary claim 58: The method of exemplary claim 57, wherein the first and second flow control devices are mass flow controllers.

[0129] Exemplary claim 59: The method of exemplary claim 57 or exemplary claim 58, wherein the properties of the first and second fluids are either pressure or temperature.

[0130] Exemplary claim 60: The method according to any one of exemplary claims 57 to 59, wherein step c) further comprises calculating the first and second active component commands based on the first and second setpoints, the first and second setpoints corresponding to the target mass flow rates of the first and second flow control devices.

[0131] Exemplary claim 61: The method according to any one of the exemplary claims 57 to 60, wherein the first and second flow control devices communicate with the central control device via the EtherCAT protocol.

[0132] Exemplary claim 62: The method according to any one of the exemplary claims 57 to 60, wherein the first and second flow control devices communicate with the central control device via one of Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet.

[0133] While the present invention has been described in relation to specific embodiments, including currently preferred modes of implementation, those skilled in the art will understand that numerous modifications and substitutions exist for the systems and techniques described above. It should be understood that other embodiments can be utilized and structural and functional modifications made without departing from the scope of the invention. Therefore, the spirit and scope of the invention should be interpreted broadly as set forth in the appended claims.

Claims

1. A central control unit comprising a processor, memory, and communication modules; Multiple fluid sources; A plurality of flow control devices, each of the plurality of flow control devices is An inlet fluidly coupled to one of the aforementioned multiple fluid supply sources, Exit, A fluid path connecting the inlet and the outlet, A sensor fluidically coupled to the aforementioned fluid path, Active components fluidly coupled to the fluid path, and A plurality of flow control devices, including a device controller that includes a communication module, memory, a sensor circuit operably coupled to the sensor, and an active component drive unit operably coupled to the active component; A processing chamber fluidly coupled to the outlets of the plurality of flow control devices, comprising a processing chamber configured to contain articles to be processed; The central control unit is configured to receive sensor data from the sensor circuit of the first of the plurality of flow control devices and to transmit an active component command to the active component drive unit of the first of the plurality of flow control devices, and the active component command is calculated based on the sensor data. Semiconductor manufacturing systems.

2. The central control device provides closed-loop control of the active component of the first device among the plurality of flow control devices. The system according to claim 1.

3. The memory of the first device among the plurality of flow control devices stores calibration data. The system according to claim 1 or claim 2.

4. The aforementioned sensor is one of a pressure sensor or a temperature sensor. The system according to any one of claims 1 to 3.

5. The active component is a proportional valve. The system according to any one of claims 1 to 4.

6. The central control unit executes a feedback control loop using the sensor data and controls the active component of the first device among the plurality of flow control devices. The system according to any one of claims 1 to 5.

7. The central control unit executes a feedback control loop for each of the plurality of flow control devices. The system according to claim 6.

8. The memory of the central control unit stores a set value, and this set value corresponds to the target operating parameter of the first device among the plurality of flow control devices. The system according to any one of claims 1 to 7.

9. The device controller of the first device among the plurality of flow control devices is configured to transmit a sensor data message including the sensor data. The system according to any one of claims 1 to 8.

10. The system further includes a communication bus that operably connects the communication module of the central control unit to the communication module of the device controller of the first device among the plurality of flow control units. The system according to any one of claims 1 to 9.

11. The plurality of flow control devices communicate with the central control unit via the Ethernet protocol. The system according to claim 10.

12. The plurality of flow control devices communicate with the central control device via one of the following: Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet. The system according to claim 10.

13. The central control unit is configured to receive sensor data from the sensor circuit of the second device among the plurality of flow control devices and to transmit an active component command to the active component drive unit of the second device among the plurality of flow control devices. The system according to any one of claims 1 to 12.

14. The active component command transmitted to the first of the plurality of flow control devices is calculated at least in part based on sensor data from the second of the plurality of flow control devices. The system according to claim 13.

15. The active component command is calculated based on a setting value stored in the memory of the central control unit. The system according to any one of claims 1 to 14.

16. A central control unit including a processor, memory, and communication modules; Fluid supply source and; A first flow rate control device, An inlet fluidly coupled to the aforementioned fluid supply source, Exit, A fluid path connecting the inlet and the outlet, A sensor fluidically coupled to the aforementioned fluid path, Active components fluidly coupled to the fluid path, and A first flow control device including a device controller that includes a communication module, a memory, a sensor circuit operably coupled to the sensor, and an active component drive unit operably coupled to the active component; A processing chamber fluidly coupled to the outlet of the first flow control device, the processing chamber being configured to contain an article to be processed; The system comprises a communication bus that operably connects the communication module of the central control unit and the communication module of the device controller; The device controller is configured to transmit a sensor data message containing sensor data to the central control unit via the communication bus; The central control unit is configured to transmit active component messages to the device controller via the communication bus, and the active component messages include active component commands determined at least in part based on setting values ​​stored in the memory of the central control unit and the sensor data of the sensor data messages; Semiconductor manufacturing systems.

17. The central control device provides closed-loop control of the active component of the first flow rate control device. The system according to claim 16.

18. The memory of the first flow control device stores calibration data. The system according to claim 16 or claim 17.

19. The aforementioned sensor is either a pressure sensor or a temperature sensor. The system according to any one of claims 16 to 18.

20. The active component is a proportional valve. The system according to any one of claims 16 to 19.

21. The central control unit executes a feedback control loop using the sensor data and controls the active components of the first flow control device. The system according to any one of claims 16 to 20.

22. The central control unit executes the feedback control loop of the first flow control unit. The system according to claim 21.

23. The set value corresponds to the target operating parameter of the first flow control device. The system according to any one of claims 16 to 22.

24. The first flow control device communicates with the central control device via the Ethernet protocol. The system according to any one of claims 16 to 23.

25. The first flow control device communicates with the central control device via one of the following: Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet. The system according to any one of claims 16 to 23.

26. The central control unit is configured to receive sensor data from the sensor circuit of the second flow rate control unit and to transmit an active component command to the active component drive unit of the second flow rate control unit. The system according to any one of claims 16 to 25.

27. The active component command transmitted to the first flow control device is calculated at least in part based on the sensor data of the second flow control device. The system according to claim 26.

28. A central control unit including a processor, memory, and communication modules; Fluid supply source and; A first flow rate control device, An inlet fluidly coupled to the aforementioned fluid supply source, Exit, A fluid path connecting the inlet and the outlet, A sensor fluidically coupled to the fluid path, and An active component fluidly coupled to the aforementioned fluid path; A first flow control device comprising a device controller including a communication module, a memory, a sensor circuit operably coupled to the sensor, and an active component drive unit operably coupled to the active component; A processing chamber fluidly coupled to the outlet of the first flow control device, configured to contain an article to be processed; The device controller comprises a communication bus that operably connects the communication module of the central control unit and the communication module of the device controller; The central control unit executes a feedback control loop that utilizes sensor data from the first flow control unit in order to control the active components of the first flow control unit. Semiconductor manufacturing systems.

29. The memory of the first flow control device stores calibration data. The system as described in claim 28.

30. The aforementioned sensor is either a pressure transducer or a temperature sensor. The system according to claim 28 or claim 29.

31. The active component is a proportional valve. The system according to any one of claims 28 to 30.

32. The memory of the central control device stores a set value, and this set value corresponds to the target operating parameter of the first flow control device. The system according to any one of claims 28 to 31.

33. The device controller of the first flow control device is configured to transmit a sensor data message including the sensor data. The system according to any one of claims 28 to 32.

34. The first flow control device communicates with the central control device via the Ethernet protocol. The system according to any one of claims 28 to 33.

35. The plurality of flow control devices communicate with the central control device via either Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet. The system according to any one of claims 28 to 33.

36. The central control unit is configured to receive sensor data from the sensor circuit of the second flow rate control unit and to transmit an active component command to the active component drive unit of the second flow rate control unit. The system according to any one of claims 28 to 35.

37. The active component command transmitted to the first flow control device is calculated at least in part based on the sensor data of the second flow control device. The system according to any one of claims 28 to 36.

38. The active component command is calculated based on a setting value stored in the memory of the central control unit. The system according to any one of claims 28 to 37.

39. a) A step of transmitting a first sensor data message, including first sensor data, from a device controller of a first flow control device to a central control device, wherein the first flow control device includes a sensor operably coupled to the device controller, and the sensor senses the characteristics of the fluid in the fluid path of the first flow control device; b) A step of calculating a first active component command using the setting value stored in the memory of the central control unit and the first sensor data of the first sensor data message; c) A step of transmitting a first active component message from the central control unit to the device controller of the first flow control unit, wherein the first active component message includes the first active component command; d) The steps of controlling the active components of the first flow control device in accordance with the first active component command to supply the fluid to a processing chamber containing the article to be processed; e) The device controller of the first flow control device transmits a second sensor data message, including second sensor data, to the central control device; f) A step of calculating a second active component command using the set value and the second sensor data; g) A step of transmitting a second active component message from the central control unit to the device controller of the first flow control unit, wherein the second active component message includes a second active component command; h) The process comprises the steps of controlling the active component in accordance with the second active component command and supplying the fluid to the processing chamber: Method for manufacturing conductors:

40. Steps a) to h) are performed in the central control unit to execute the feedback control loop that controls the active components of the first flow control unit. The method according to claim 39.

41. The active component is a proportional valve. The method according to claim 39 or claim 40.

42. The flow control device is a mass flow controller. The method according to any one of claims 39 to 41.

43. The aforementioned sensor is either a pressure sensor or a temperature sensor. The method according to any one of claims 39 to 42.

44. The set value corresponds to the target operating parameter of the first flow control device. The method according to any one of claims 39 to 43.

45. The first flow control device communicates with the central control device via the Ethernet protocol. The method according to any one of claims 39 to 44.

46. The first flow control device communicates with the central control device via one of the following: Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet. The method according to any one of claims 39 to 44.

47. Further comprising steps i), j), k), and l), Step i) includes transmitting a third sensor data message, including third sensor data, from the device controller of the second flow control device to the central control device, Step j) includes calculating a third active component command using the set value and the third sensor data, Step k) includes transmitting a third active component message from the central control unit to the device controller of the first flow control unit, wherein the third active component message includes a third active component command. Step l) includes controlling the active component in accordance with the third active component command to deliver the fluid to the processing chamber, The method according to any one of claims 39 to 46.

48. Steps i), j), k), and l) are further included. Step i) includes transmitting a fourth sensor data message containing fourth sensor data from the device controller of the second flow control device to the central control device, and transmitting a fifth sensor data message containing fifth sensor data from the device controller of the first flow control device to the central control device, Step j) includes calculating a fourth active component command using the set value and the fourth and fifth sensor data, Step k) includes transmitting a fourth active component message from the central control unit to the device controller of the first flow control unit, wherein the fourth active component message includes the fourth active component command. Step l) includes controlling the active component in accordance with the fourth active component command to supply the fluid to the processing chamber, The method according to any one of claims 39 to 46.

49. A central control unit including a processor, memory, and communication modules; Fluid supply source and; A first flow rate control device, An inlet fluidly coupled to the aforementioned fluid supply source, The aforementioned exit, A fluid path connecting the inlet and the outlet, A sensor fluidically coupled to the fluid path, and A first flow control device including a communication module, a memory, and a device controller including a sensor circuit operably coupled to the sensor; A second flow rate control device, An inlet fluidly coupled to the aforementioned fluid supply source, Exit, A fluid path connecting the inlet and the outlet, Active components fluidly coupled to the fluid path, and A device controller including a communication module, a memory, and an active component drive unit operably coupled to the active component; A processing chamber is fluidly coupled to the outlets of the first and second flow control devices, and is configured to contain the articles to be processed; The device controller of the first flow control device is configured to transmit a sensor data message including sensor data to the central control device. The central control unit is configured to transmit an active component message to the device controller of the second flow control unit, and the active component message includes an active component command determined at least in part based on a set value stored in the memory of the central control unit and the sensor data of the sensor data message. Semiconductor manufacturing systems:

50. The aforementioned sensor is either a pressure sensor or a temperature sensor. The system according to claim 49.

51. The active component is a proportional valve. The system according to claim 49 or claim 50.

52. The central control unit uses sensor data from the first flow control unit to provide closed-loop control of the active component of the second flow control unit. The system according to any one of claims 49 to 51.

53. The central control unit executes a feedback control loop. The system according to any one of claims 49 to 52.

54. The system further includes a communication bus that operably connects the communication module of the central control unit to the communication module of the device controller of the first device among the plurality of flow control units. The system according to any one of claims 49 to 53.

55. The first and second flow control devices communicate with the central control device via the Ethernet protocol. The system according to any one of claims 49 to 54.

56. The first and second flow control devices communicate with the central control device via one of the following: Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet. The system according to any one of claims 49 to 54.

57. a) A step of flowing a first fluid through a first flow control device and a second fluid through a second flow control device, wherein the first and second fluids are sent from the first and second flow control devices to a processing chamber containing an article to be processed; b) A step of transmitting first and second sensor data from the first and second flow control devices to a central control device, wherein the first and second sensor data represent the characteristics of the first and second fluids flowing through the first and second flow control devices; c) The central control unit calculates first and second active component commands using the first and second sensor data; d) The step of transmitting the first and second active component commands from the central control unit to the first and second flow control units; e) The step of controlling the active components of the first and second flow control devices in accordance with the commands for the first and second active components; f) The step of transmitting the first and second sensor data from the first and second flow control devices to the central control device; g) The step of recalculating the second active component command using the first sensor data; h) The step of retransmitting the second active component command from the central control unit to the second flow control unit; i) Controlling the active component of the second flow control device in accordance with the second active component command; and the steps comprising: Semiconductor manufacturing methods:

58. The first and second flow control devices are mass flow controllers. The method according to claim 57.

59. The characteristics of the first and second fluids are either pressure or temperature. The method according to claim 57 or claim 58.

60. Step c) further includes calculating the first and second active component commands based on the first and second setpoints, wherein the first and second setpoints correspond to the target mass flow rates of the first and second flow control devices. The method according to any one of claims 57 to 59.

61. The first and second flow control devices communicate with the central control device via the Ethernet protocol. The method according to any one of claims 57 to 60.

62. The first and second flow control devices communicate with the central control device via one of the following: Ethernet, Modbus, Profibus, Profinet, DeviceNet, CANbus, Fieldbus, OPC, MQTT, or BACnet. The method according to any one of claims 57 to 60.

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