Multi-station chip inspection device, inspection system, and inspection / control method

Abstract

The present invention relates to a multi-station chip inspection device, inspection system, and inspection / control method in the field of semiconductor inspection technology. The first inspection assembly includes an inspection device and a plurality of micropositioners distributed on the inspection device, each micropositioner being equipped with an inspection probe. The second inspection assembly is located at the top of the first inspection assembly and includes a turntable and a plurality of inspection fixtures distributed along the circumferential direction of the turntable. The plurality of inspection fixtures are capable of adsorbing chips under inspection onto their bottoms and are configured to rotate according to the turntable. Each inspection fixture is configured to rotate until it cooperates with any of the micropositioners, thereby bringing the corresponding inspection probe into contact with the adsorbed chip under inspection, and thereby performing a performance test of the chip under inspection. A turntable-type inspection device is used instead of a linear inspection device, and the plurality of inspection fixtures cooperate with the corresponding micropositioners to perform performance tests on multiple chips under inspection simultaneously.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor inspection, and particularly to a multi-station chip inspection device, an inspection system, and an inspection and control method.

Background Art

[0002] As electronic components in electronic products are required to have good performance and reliability, it is necessary to perform various performance inspections on chips to screen appropriate chips, thereby ensuring the performance and reliability of electronic components.

[0003] Conventional inspection devices are mainly linear. In this method, first, the die to be inspected is placed on an inspection jig, and after the inspection is completed, the inspected die is taken out, and then the next die to be inspected is put in. Since placing the die to be inspected, inspecting the electrical characteristics, and taking out the inspected die are all performed in one inspection jig, the inspection time is long and the productivity of the device is low.

[0004] Also, when performing an electrical characteristic inspection of a die (for example, a silicon carbide die), it is necessary to design an inspection device for performing a performance inspection of the silicon carbide die. Specifically, inspection probes are provided in the inspection device, and the inspection probes are brought into contact with the silicon carbide die to perform a performance inspection of the silicon carbide die. When the inspection device is used for a long time, the inspection probes may become dirty, the contact resistance of the inspection probes may increase, and even the inspection probes may fail. Therefore, it is necessary to clean the inspection probes.

[0005] In the prior art, it is common to clean the inspection probes using an independent cleaning device, and it is necessary to control the cleaning device to move it to the inspection probes to clean the inspection probes. Since the cleaning device and the inspection device are arranged independently and drive mechanisms need to be provided for the inspection device and the cleaning device respectively, a large amount of arrangement space is used.

Summary of the Invention

[0006] The first object of the first aspect of the present invention is to provide a multi-station chip inspection device and to solve the technical problem of the prior art, which is that chip inspection efficiency is low.

[0007] The second objective of the present invention is to simplify the structure of inspection jigs and reduce the development costs of inspection jigs.

[0008] A third object of the present invention is to provide a chip inspection system having the multi-station chip inspection device described above.

[0009] A fourth object of the present invention is to provide a chip inspection method for use in the multi-station chip inspection device described above.

[0010] The first object of the second aspect of the present invention is to provide a multi-station chip inspection device (also called a chip inspection and cleaning device) that also has a cleaning function, thereby solving the technical problem of the prior art that chip inspection devices and cleaning devices require a large amount of space.

[0011] The second object of the present invention is to provide a control method for use in the above-mentioned chip inspection and cleaning apparatus.

[0012] In particular, the present invention is A first inspection assembly includes an inspection device and a plurality of micropositioners distributed in the inspection device, each of which is provided with an inspection probe. A second inspection assembly provided at the top of the first inspection assembly, comprising a turntable and a plurality of inspection fixtures distributed along the circumferential direction of the turntable, wherein the plurality of inspection fixtures are capable of adsorbing a chip to be inspected to their bottom and are configured to rotate in accordance with the turntable, and each of the micropositioners comprises the second inspection assembly corresponding to one of the inspection fixtures, The present invention provides a multi-station chip inspection device, which is configured such that when any of the inspection fixtures rotates in cooperation with any of the micropositioners, the corresponding inspection probe is brought into contact with the adsorbed chip under inspection, thereby performing a performance inspection of the chip under inspection.

[0013] Optionally, the multi-station chip inspection device may be: The present invention further includes a plurality of drive mechanisms, each of which is connected to a single inspection fixture, and which drives the corresponding inspection fixture down when the corresponding inspection fixture rotates to the top of any of the micropositioners according to the turntable, so that the inspection probe on the corresponding micropositioner contacts the adsorbed chip under inspection.

[0014] Optionally, the multi-station chip inspection device may be: A loading assembly provided in a position close to the turntable, wherein the loading assembly is controlled to move downward of the inspection jig when the inspection jig rotates to a first target position, thereby causing the corresponding inspection jig to attract the chip to be inspected on the loading assembly, The present invention further includes an unloading assembly located near the turntable, which is controlled to move downward from the inspection fixture when the inspection fixture rotates to a second target position, thereby receiving the chip to be inspected on the corresponding inspection fixture.

[0015] Optionally, the multiple micropositioners are distributed in a circular pattern at the top of the inspection equipment, and the angle between two adjacent micropositioners is the same as the angle between two adjacent inspection fixtures.

[0016] Optionally, the multi-station chip inspection device may be: The further includes a plurality of temperature control assemblies, each of which is connected to a corresponding inspection fixture and used to heat or cool the corresponding inspection fixture, thereby performing high-temperature, low-temperature, or room-temperature testing on the chip under test.

[0017] Optionally, the first inspection assembly is: A first PCB substrate, which is mounted on top of the inspection equipment, is provided with at least one first positioning hole, the micropositioner is attached to the first PCB substrate by bolts, the micropositioner has a mounting position for mounting the chip to be inspected and at least one second positioning hole provided near the mounting position, so that a shaft pin passes through the second positioning hole and the first positioning hole to bring the bottom of the inspection probe on the micropositioner into sufficient contact with the first PCB substrate.

[0018] The inspection fixture may be optionally selected as follows: The first adsorption assembly is located at the bottom of the inspection jig and includes a gas channel provided inside for adsorbing the chip to be inspected.

[0019] Optionally, the multi-station chip inspection device may be: The first cleaning component further includes at least one first cleaning component mounted on the turntable, which is configured to rotate in accordance with the turntable to a corresponding micropositioner, thereby cleaning the inspection probe on the micropositioner.

[0020] Optionally, each of the first cleaning parts includes at least one brush, The turntable is provided to rotate, under control, any one of the first cleaning components to the corresponding micropositioner in conjunction, and then to rotate repeatedly under control, thereby causing the brush to reciprocate in conjunction, and thereby cleaning the inspection probe on the micropositioner.

[0021] Optionally, the multi-station chip inspection device further includes at least one second cleaning component attached to the turntable, each of which has at least one suction cup, and the suction cup is provided to suck air or jet air against the inspection probe when rotating above the corresponding micropositioner according to the turntable.

[0022] Optionally, the multi-station chip inspection device further includes at least one visual detection component attached to the turntable, which rotates according to the turntable and is provided to perform visual detection on the corresponding inspection probe.

[0023] Optionally, the first cleaning component, the second cleaning component or the visual detection component is provided between two adjacent inspection jigs.

[0024] In particular, the present invention further includes a loading device for providing an inspection chip, at least one of the above multi-station chip inspection devices located close to the loading device, receiving the inspection chip in the loading device, and performing a performance inspection on the inspection chip. Provided is a multi-station chip inspection system, including an unloading device located on a side away from the loading device of the multi-station chip inspection device, for removing the inspected chip that has completed a performance inspection in the multi-station chip inspection device.

[0025] In particular, the present invention further includes: a step of controlling and rotating the turntable, thereby rotating any one of the inspection jigs to a first target position in conjunction; a step of controlling the corresponding inspection jig to adsorb the inspected chip at the first target position; a step of controlling the turntable to rotate by a preset angle along a first direction, controlling the inspection jig to cooperate with the corresponding micropositioner, whereby the corresponding inspection probe contacts the adsorbed inspected chip, thereby performing a performance inspection on the inspected chip, wherein the first direction is a clockwise direction or a counterclockwise direction. The present invention provides a chip inspection method for use in the above multi-station chip inspection device.

[0026] Optionally, in the process of controlling the turntable to rotate by a preset angle along a first direction and controlling the inspection jig to cooperate with the corresponding micropositioner, the next inspection jig rotates to the first target position and adsorbs the next inspected chip. Optionally, the step of controlling the turntable to rotate by a preset angle along a first direction and controlling the inspection jig to cooperate with the corresponding micropositioner specifically includes: a step of controlling the turntable to rotate by the preset angle along the first direction, whereby the inspection jig is positioned above the corresponding micropositioner; a step of controlling a drive mechanism to drive the corresponding inspection jig to descend, whereby the inspection probe on the corresponding micropositioner contacts the adsorbed inspected chip.

[0027] In particular, the present invention further, The process involves receiving a control command to perform an inspection on the chip under inspection, controlling the turntable to rotate it, thereby causing one of the inspection fixtures to rotate in conjunction to the first target position, and A step of controlling the corresponding inspection jig to pick up the chip to be inspected at the first target position, The present invention provides a control method for a multi-station chip inspection device that also includes the above-described cleaning function, comprising the steps of: controlling the turntable to rotate it by a preset angle along a first direction; controlling the inspection fixture to cooperate with the corresponding micropositioner, thereby causing the corresponding inspection probe to contact the adsorbed chip under inspection, thereby performing a performance inspection of the chip under inspection, wherein the first direction is either clockwise or counterclockwise.

[0028] The control method may be optionally: The procedure further includes the step of receiving a control command to clean the inspection probe of a micropositioner, controlling the turntable to rotate, thereby rotating the first cleaning component in conjunction with the corresponding micropositioner, thereby cleaning the inspection probe on the micropositioner.

[0029] The step of optionally receiving a control command to clean the inspection probe of a micropositioner, controlling the turntable to rotate it, thereby rotating the first cleaning component in conjunction with the corresponding micropositioner, and thereby cleaning the inspection probe on the micropositioner, specifically involves: When a control command is received to perform cleaning on the inspection probe of the micropositioner, the turntable is controlled to rotate, thereby rotating the first cleaning part in conjunction with the corresponding micropositioner. The first step is to control the first brush of the first cleaning part to move downward, thereby causing the first brush to contact the inspection probe on the micropositioner, The steps include controlling the turntable to rotate it repeatedly, thereby causing the first brush to reciprocate in conjunction, and thereby performing positive cleaning on the inspection probe on the micropositioner, The steps include controlling the first brush to return it to its original position, controlling the second brush of the first cleaning part to move it downward, thereby causing the second brush to contact the inspection probe on the micropositioner, The steps include controlling the turntable to rotate it repeatedly, thereby causing the second brush to reciprocate in conjunction, and thereby performing reverse cleaning on the inspection probe on the micropositioner, The process includes the step of controlling and restoring the second brush.

[0030] Optionally, the control method, upon receiving a control command to clean the inspection probe of the micropositioner, controls the turntable to rotate, thereby rotating the first cleaning component in conjunction with the corresponding micropositioner, thereby cleaning the inspection probe on the micropositioner, and then further, The steps include controlling and rotating the turntable, thereby rotating the second cleaning part in conjunction with it above the corresponding micro-positioner, The steps include controlling the suction cup of the second cleaning part to move it downward, then controlling the suction cup to suck or blow air, thereby cleaning the inspection probe on the micropositioner, The step includes controlling the suction cup to return it to its original position.

[0031] According to some embodiments of the present invention, a first inspection assembly includes an inspection device and a plurality of micropositioners distributed on the inspection device, each micropositioner being equipped with an inspection probe. A second inspection assembly is provided at the top of the first inspection assembly, and the second inspection assembly includes a turntable and a plurality of inspection fixtures distributed along the circumferential direction of the turntable, each of which is capable of adsorbing a chip to be inspected to its bottom and is configured to rotate along the turntable, with each micropositioner corresponding to one inspection fixture. Each inspection fixture is configured to rotate until it cooperates with any of the micropositioners, thereby bringing the corresponding inspection probe into contact with the adsorbed chip to be inspected, and thereby performing a performance test of the chip to be inspected. The above technical solution uses a turntable-type inspection device instead of a linear inspection device, and the plurality of inspection fixtures cooperate with the corresponding micropositioners to perform performance tests on multiple chips to be inspected simultaneously, thereby shortening the inspection time and improving the inspection efficiency of the chips to be inspected.

[0032] Furthermore, since the inspection jig can hold the chip under inspection at its base, the inspection probe on the micropositioner can directly contact the chip under inspection. This eliminates the need to provide an adapter probe and adapter plate within the inspection jig to connect the chip under inspection and the inspection probe, thus simplifying the structure of the inspection jig and reducing development costs.

[0033] According to some embodiments of the present invention, a second inspection assembly is located below a turntable and has at least one micropositioner, the micropositioner having an inspection probe. An inspection fixture is mounted on the turntable and picks up the chip to be inspected, rotates with the turntable, thereby moving the chip to the corresponding micropositioner in conjunction, thereby bringing the chip to contact the corresponding inspection probe, and is used to inspect the chip. A first cleaning component is mounted on the turntable and rotates with the turntable to the corresponding micropositioner, thereby cleaning the inspection probe on the micropositioner. It may also be understood that the inspection fixture and the first cleaning component are integrated on the same turntable, and that the performance inspection of the chip and the cleaning of the inspection probe can be performed in conjunction with the inspection fixture and the first cleaning component using only one turntable, saving space, eliminating the need for a drive mechanism for the first cleaning component, and saving development costs.

[0034] The above and other objects, advantages, and features of the present invention will become even clearer to those skilled in the art from the detailed description of specific embodiments of the present invention with reference to the following drawings. [Brief explanation of the drawing]

[0035] Some specific embodiments of the present invention are described in detail below in an illustrative and non-limiting manner with reference to the drawings. In the drawings, the same reference numerals represent the same or similar parts or components. It will be understood by those skilled in the art that these drawings are not necessarily drawn in dimensional relationships. Here, [Figure 1] Figure 1 is a schematic diagram of a multi-station chip inspection device according to one embodiment of the present invention. [Figure 2] Figure 2 is a schematic diagram of the second inspection assembly, micropositioner, loading assembly, and unloading assembly in the multi-station chip inspection device shown in Figure 1. [Figure 3] Figure 3 is a schematic diagram of the first inspection assembly in the multi-station chip inspection device shown in Figure 1. [Figure 4] Figure 4 is a schematic diagram of an inspection jig and micropositioner according to one embodiment of the present invention. [Figure 5] Figure 5 is a schematic diagram of a micropositioner according to one embodiment of the present invention. [Figure 6] Figure 6 is a schematic diagram of the first suction assembly of an inspection jig according to one embodiment of the present invention. [Figure 7] Figure 7 is a schematic cross-sectional view of a first adsorption assembly according to one embodiment of the present invention. [Figure 8] Figure 8 is a schematic diagram of the drive mechanism of a multi-station chip inspection device according to one embodiment of the present invention. [Figure 9] Figure 9 is a schematic diagram of a multi-station chip inspection device according to another embodiment of the present invention. [Figure 10] Figure 10 is a schematic diagram of an unloading assembly according to one embodiment of the present invention. [Figure 11] Figure 11 is a schematic enlarged view of the suction nozzle of an unloading assembly according to one embodiment of the present invention. [Figure 12] Figure 12 is a schematic cross-sectional view of a first inspection assembly according to one embodiment of the present invention. [Figure 13] Figure 13 is a schematic diagram of a chip inspection and cleaning device according to one embodiment of the present invention. [Figure 14] Figure 14 is a schematic diagram of an inspection assembly according to one embodiment of the present invention. [Figure 15] Figure 15 is a schematic diagram of the micropositioner in the inspection assembly shown in Figure 13. [Figure 16] Figure 16 is a schematic diagram of an inspection jig and micropositioner according to one embodiment of the present invention. [Figure 17] Figure 17 is a schematic diagram of the suction assembly of an inspection jig according to one embodiment of the present invention. [Figure 18]Figure 18 is a schematic diagram of the structure of a first cleaning part according to one embodiment of the present invention. [Figure 19] Figure 19 is a schematic front view of a second cleaning part according to one embodiment of the present invention. [Figure 20] Figure 20 is a schematic side view of a second cleaning part according to one embodiment of the present invention. [Figure 21] Figure 21 is a schematic diagram of a visual detection component according to one embodiment of the present invention. [Figure 22] Figure 22 is a schematic block diagram of a multi-station chip inspection system according to one embodiment of the present invention. [Figure 23] Figure 23 is a schematic process diagram of a chip inspection method used in a multi-station chip inspection device according to one embodiment of the present invention. [Figure 24] Figure 24 is a schematic process diagram of a chip inspection method used in a multi-station chip inspection device according to another embodiment of the present invention. [Figure 25] Figure 25 is a schematic process diagram of a control method for a chip inspection and cleaning apparatus according to one embodiment of the present invention. [Figure 26] Figure 26 is a schematic process diagram of a control method for a chip inspection and cleaning apparatus according to another embodiment of the present invention. [Figure 27] Figure 27 is a schematic process diagram of a control method for a chip inspection and cleaning apparatus according to another embodiment of the present invention. [Modes for carrying out the invention]

[0036] The embodiments of the present invention are described in detail below, with examples of embodiments shown in the figures. The same or similar reference numerals consistently represent the same or similar parts or parts having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and intended to clarify the present invention; they should not be considered limitations on the present invention.

[0037] In the description of this invention, the directions or positional relationships indicated by terms such as "up," "down," "left," and "right" are based on the directions or positional relationships shown in the drawings and are used for the purpose of describing and simplifying the description of this invention. It should be understood that these terms do not indicate, or implicitly indicate, that the devices or components in question must be provided in a specific direction, or configured and operated in a specific direction, and therefore should not be considered as limitations on this invention.

[0038] The terms “first” and “second” are used solely for descriptive purposes and should not be interpreted as indicating or implicitly indicating relative importance or the number of technical features covered. Thus, features limited by “first” and “second” may explicitly or implicitly include at least one such feature, i.e., one or more such features. In the description of this invention, “multiple” means at least two, for example, two, three, etc., unless otherwise specifically defined. When a feature “includes” one or more features covered by it, unless otherwise specifically stated, this does not exclude other features and may further include other features.

[0039] Unless otherwise clearly defined and limited, terms such as “connect” and “attach” are to be understood in a broad sense. Unless otherwise clearly defined, for example, a connection may be fixed, detachably connected, or integrated; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediary; or it may be internal communication between two parts or interaction between two parts. Those skilled in the art will be able to understand the specific meaning of the terms in this invention from the specific context.

[0040] Unless otherwise specified, all terms used in this embodiment (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art.

[0041] Figure 1 is a schematic diagram of a multi-station chip inspection device 100 according to one embodiment of the present invention; Figure 2 is a schematic diagram of the second inspection assembly 10 and micropositioners 22, loading assembly 40, and unloading assembly 30 in the multi-station chip inspection device 100 shown in Figure 1; Figure 3 is a schematic diagram of the first inspection assembly 20 in the multi-station chip inspection device 100 shown in Figure 1; Figure 4 is a schematic diagram of the inspection jig 12 and micropositioners 22 according to one embodiment of the present invention; and Figure 5 is a schematic diagram of the micropositioner 22 according to one embodiment of the present invention. As shown in Figures 1 to 5, in one embodiment, the multi-station chip inspection device 100 includes a first inspection assembly 20 and a second inspection assembly 10. The first inspection assembly 20 includes an inspection device 21 and a plurality of micropositioners 22 distributed on the inspection device 21, and each micropositioner 22 is provided with an inspection probe 221. The second inspection assembly 10 is located on top of the first inspection assembly 20 and includes a turntable 11 and a plurality of inspection fixtures 12 distributed along the circumferential direction of the turntable 11, the plurality of inspection fixtures 12 being capable of adsorbing a chip under test 200 to its bottom and being configured to rotate in accordance with the turntable 11, with each micropositioner 22 corresponding to one inspection fixture 12. When any of the inspection fixtures 12 rotates to cooperate with any of the micropositioners 22, the corresponding inspection probe 221 is brought into contact with the adsorbed chip under test 200, thereby performing a performance test of the chip under test 200.

[0042] In this embodiment, a turntable-type inspection device is used instead of a linear inspection device. Multiple inspection jigs 12 work in cooperation with corresponding micropositioners 22 to perform performance testing on multiple chips 200 under inspection simultaneously, thereby shortening the inspection time and improving the inspection efficiency of the chips 200 under inspection.

[0043] Furthermore, in this embodiment, since the inspection jig 12 can hold the chip to be inspected 200 to its bottom, the inspection probe 221 on the micropositioner 22 can directly contact the chip to be inspected 200. Therefore, there is no need to provide an adapter probe and an adapter plate inside the inspection jig 12 to connect the chip to be inspected 200 and the inspection probe 221. This simplifies the structure of the inspection jig 12 and reduces the development cost of the inspection jig 12.

[0044] Figure 6 is a schematic structural diagram of the first adsorption assembly 121 of an inspection jig 12 according to one embodiment of the present invention, and Figure 7 is a schematic cross-sectional view of the first adsorption assembly 121 according to one embodiment of the present invention. As shown in Figures 6 and 7, in this embodiment, the inspection jig 12 includes the first adsorption assembly 121, which is located at the bottom of the inspection jig 12, and a gas passage for adsorbing the chip 200 to be inspected is provided inside the first adsorption assembly 121. Inside the first adsorption assembly 121, there is a first gas passage 123 arranged horizontally and a second gas passage 124 arranged vertically, and the first gas passage 123 communicates with the second gas passage 124. A gas nozzle 122 is provided at one end of the first gas passage 123, and the gas nozzle 122 is connected to a vacuum device. The chip 200 to be inspected is located below the second gas passage 124. The vacuum device sequentially attracts the chip 200 to be inspected via the gas nozzle 122, the first gas flow path 123, and the second gas flow path 124. Here, the functional surface of the chip 200 to be inspected faces downwards, and the micropositioner 22 has an inspection probe 221, which contacts the functional surface of the chip 200 to perform a performance test of the chip 200.

[0045] Figure 8 is a schematic diagram of the drive mechanism 13 of a multi-station chip inspection device 100 according to one embodiment of the present invention. As shown in Figure 8, the multi-station chip inspection device 100 further includes a plurality of drive mechanisms 13, each drive mechanism 13 connected to a single inspection fixture 12, and the drive mechanism 13 drives the corresponding inspection fixture 12 down when the corresponding inspection fixture 12 rotates to the top of any of the micropositioners 22 according to the turntable 11, thereby causing the inspection probe 221 on the corresponding micropositioner 22 to contact the attracted chip 200 to be inspected, thereby enabling the inspection equipment 21 to perform performance testing of the chip 200 to be inspected. Here, the drive mechanism 13 is a motor and is mounted on the top of the corresponding inspection fixture 12.

[0046] Figure 9 is a schematic diagram of a multi-station chip inspection device 100 according to another embodiment of the present invention, and Figure 10 is a schematic diagram of an unload assembly 30 according to one embodiment of the present invention. As shown in Figures 9 and 10, in this embodiment, the multi-station chip inspection device 100 further includes a loading assembly 40 and an unload assembly 30, the loading assembly 40 is positioned close to the turntable 11, and the loading assembly 40 is controlled to move below the inspection jig 12 when the inspection jig 12 rotates to a first target position, thereby enabling the corresponding inspection jig 12 to pick up the chip 200 to be inspected on the loading assembly 40. The unload assembly 30 is positioned close to the turntable 11, and the unload assembly 30 is controlled to move below the inspection jig 12 when the inspection jig 12 rotates to a second target position, thereby enabling it to receive the chip 200 to be inspected on the corresponding inspection jig 12. Here, the structures of the loading assembly 40 and the unload assembly 30 are the same. In other embodiments, the structures of the loading assembly 40 and the unloading assembly 30 may be provided differently. The loading assembly 40 and the unloading assembly 30 are located on the left and right sides of the turntable 11, respectively.

[0047] In another embodiment, if there are multiple multi-station chip inspection devices 100, the unload assembly 30 of the previous multi-station chip inspection device 100 becomes the loading assembly 40 of the next multi-station chip inspection device 100. As can be seen with reference to Figure 9, the unload assembly 30 of the previous multi-station chip inspection device 100 receives the chip to be inspected 200 on the inspection fixture 12 of the previous multi-station chip inspection device 100 and links the chip to be inspected 200 to the loading position of the next multi-station chip inspection device 100, so that the inspection fixture 12 of the next multi-station chip inspection device 100 is used to pick up the chip to be inspected 200 on the unload assembly 30.

[0048] In some embodiments, there are two multi-station chip inspection devices 100, where the inspection fixture 12 of one of the multi-station chip inspection devices 100 is used to perform high-temperature inspection on the chip 200 under inspection, and the inspection fixture 12 of the other multi-station chip inspection device 100 is used to perform low-temperature inspection on the chip 200 under inspection. In these embodiments, by using two multi-station chip inspection devices 100, high-temperature inspection and low-temperature inspection are performed on the chip 200 under inspection, respectively. Since it is not necessary to heat the chip 200 under inspection from low temperature to high temperature or cool it from high temperature to low temperature on the same turntable 11, inspection time is saved and the productivity of the device is improved.

[0049] As shown in Figure 10, the unload assembly 30 includes a first slide rail 31, a second slide rail 32, and a second suction assembly 33, the first slide rail 31 extending along a first direction. The second slide rail 32 extends along a second direction perpendicular to the first direction and is connected to the first slide rail 31. The second suction assembly 33 is mounted on the second slide rail 32 and is used to pick up the chip 200 under test. The second suction assembly 33 moves along the first slide rail 31 and the second slide rail 32, thereby moving to a second target position on the corresponding multi-station chip inspection device 100 to receive the chip 200 under test. If the chip 200 under test needs to undergo performance testing on another multi-station chip inspection device 100, the second suction assembly 33 continues to move, transferring the chip 200 under test to the other multi-station chip inspection device 100, so that the inspection fixture 12 on the other multi-station chip inspection device 100 picks up the chip 200 under test. If the chip under test 200 does not need to undergo performance testing at another multi-station chip testing device 100, the second suction assembly 33 moves to the second target position, receives the chip under test 200, and then directly unloads it, i.e., moves to the unloading device 400. If the unloading assembly 30 is located between the two multi-station chip testing devices 100, the unloading assembly 30 may need to unload or load. If the unloading assembly 30 is located between the multi-station chip testing device 100 and the unloading device 400, it may be understood that the unloading assembly 30 only needs to unload.

[0050] Figure 11 is a schematic enlarged view of the suction nozzle 331 of an unload assembly 30 according to one embodiment of the present invention. As shown in Figure 11, in this embodiment, the suction nozzle 331 is provided at the top of the second suction assembly 33, the top of which has a mounting position for placing the chip to be inspected 200, and a vacuum suction gas flow path 332 is provided inside the suction nozzle 331, which communicates with the mounting position, so that when vacuuming is performed the chip to be inspected 200 on the mounting position is attracted, and the chip to be inspected 200 is prevented from sliding off during the transfer process. Here, a linear rotary actuator, i.e., a ZR actuator, is used as the second suction assembly 33, which can rotate and align with the chip to be inspected 200, thereby receiving the chip to be inspected 200 more reliably.

[0051] In this embodiment, the multiple micropositioners 22 are distributed in a circular pattern at the top of the inspection equipment 21, and the angle between two adjacent micropositioners 22 is the same as the angle between two adjacent inspection fixtures 12. This enables the inspection fixture 12 to rotate by a specific angle and then align with the next micropositioner 22, thereby enabling simultaneous performance testing of multiple chips 200 under inspection.

[0052] In this embodiment, the multi-station chip inspection device 100 further includes a plurality of temperature control assemblies, each temperature control assembly connected to a single inspection fixture 12, which is used to heat or cool the corresponding inspection fixture 12, thereby performing high-temperature inspection, low-temperature inspection, or room-temperature inspection on the chip 200 under inspection. Here, the temperature control assembly includes a heating sheet and a vortex tube, the heating sheet being provided at the top of the first adsorption assembly 121 and used to heat the first adsorption assembly 121, thereby heating the adsorbed chip 200 under inspection. A third gas flow path is provided within the first adsorption assembly 121, the third gas flow path is connected to the vortex tube, the vortex tube is used to create cold air, which enters the third gas flow path, thereby cooling the first adsorption assembly 121, thereby cooling the adsorbed chip 200 under inspection.

[0053] Figure 12 is a schematic cross-sectional view of a first inspection assembly 20 according to one embodiment of the present invention. As shown in Figure 12, in this embodiment, the first inspection assembly 20 further includes a first PCB substrate 23, which is mounted on top of the inspection equipment 21, and the first PCB substrate 23 is provided with at least one first positioning hole, and a micropositioner 22 is attached to the first PCB substrate 23 by bolts, and the micropositioner 22 has a mounting position for mounting the chip to be inspected 200 and at least one second positioning hole provided near the mounting position, so that the shaft pin passes through the second positioning hole and the first positioning hole to make sufficient contact between the bottom of the inspection probe 221 on the micropositioner 22 and the first PCB substrate 23.

[0054] In this embodiment, the gap between the micropositioner 22 and the first PCB substrate 23 is reduced by using a shaft pin, thereby allowing the inspection probe 221 to make close contact with the first PCB substrate 23, ensuring normal circuit continuity and guaranteeing the stability of the inspection of the chip 200 under test.

[0055] In this embodiment, the first inspection assembly 20 further includes a second PCB board 25, which is mounted on the inspection equipment 21 and located between the first PCB board 23 and the inspection equipment 21, and the second PCB board 25 is connected to the first PCB board 23. Here, that is, the second PCB board 25 is located above the inspection equipment 21, and the first PCB board 23 is located above the second PCB board 25. The circuit, via the metal contacts of the chip under test 200, sequentially passes through the inspection probe 221, the first PCB board 23, and the second PCB board 25 to reach the inspection equipment 21.

[0056] In this embodiment, the first inspection assembly 20 further includes a support assembly 24, which is provided between the first PCB substrate 23 and the second PCB substrate 25 and is used to support the first PCB substrate 23 when inspecting the chip 200 under inspection. When inspecting the chip 200 under inspection, a pressure of approximately 300 N is applied to the micropositioner 22, and since the material of the first PCB substrate 23 is glass fiber, a large deformation occurs when subjected to pressure. In order to reduce the amount of deformation, in this embodiment, a support assembly 24 is newly provided below the first PCB substrate 23, thereby reducing the amount of deformation of the first PCB substrate 23.

[0057] In this embodiment, the support assembly 24 further includes a metal plate 242, a first insulating plate 241, and a second insulating plate 243. The first insulating plate 241 is provided between the metal plate 242 and the first PCB substrate 23 and is used to electrically insulate the metal plate 242 from the first PCB substrate 23. The second insulating plate 243 is provided between the metal plate 242 and the second PCB substrate 25 and is used to electrically insulate the metal plate 242 from the second PCB substrate 25. Here, the metal plate 242 is made of 45-gauge steel and is used to support the first PCB substrate 23 when inspecting the chip 200 under test, thereby keeping the deformation of the first PCB substrate 23 to less than 50 μm. In other embodiments, the material of the metal plate 242 may be selected based on specific design requirements.

[0058] As can be seen in Figure 12, the first inspection assembly 20 may be understood to have the following components arranged sequentially from top to bottom: micropositioner 22, first PCB substrate 23, first insulating plate 241, metal plate 242, second insulating plate 243, second PCB substrate 25, and inspection equipment 21.

[0059] Figure 13 is a schematic diagram of a chip inspection and cleaning device 100 according to one embodiment of the present invention, Figure 14 is a schematic diagram of an inspection assembly 20 according to one embodiment of the present invention, Figure 15 is a schematic diagram of a micropositioner 22 in the inspection assembly 20 shown in Figure 13, Figure 16 is a schematic diagram of an inspection jig 12 and a micropositioner 22 according to one embodiment of the present invention, and Figure 17 is a schematic diagram of a suction assembly (also called a first suction assembly) 121 of the inspection jig 12 according to one embodiment of the present invention. As shown in Figures 13 to 17, in a specific embodiment, the chip inspection and cleaning device 100 includes a turntable 11, an inspection assembly (also called a first inspection assembly) 20, at least one inspection jig 12, and at least one first cleaning part 80. The turntable 11 is provided to rotate under control. The turntable 11 and the inspection jig 12 can constitute a second inspection assembly 10. The inspection assembly 20 is located below the turntable 11 and has at least one micropositioner 22, on which an inspection probe 221 is located. An inspection fixture 12 is mounted on the turntable 11 and picks up the chip to be inspected 200 and rotates with the turntable 11, thereby moving the chip to be inspected 200 in conjunction with the corresponding micropositioner 22, thereby bringing the chip to be inspected 200 into contact with the corresponding inspection probe 221, and is used to inspect the chip to be inspected 200. A first cleaning part 80 is mounted on the turntable 11 and rotates with the turntable 11 to the corresponding micropositioner 22, thereby being provided to clean the inspection probe 221 on the micropositioner 22. Here, as shown in Figure 14, the inspection assembly 20 includes an inspection device 21 located below the turntable 11, with a micropositioner 22 mounted at the top of the inspection device 21. A motor 70 is attached to the top of the turntable 11, and the motor 70 rotates the turntable 11 in conjunction with the turntable.

[0060] In this embodiment, the inspection jig 12 and the first cleaning part 80 are integrated on the same turntable 11, and the performance inspection of the chip and the cleaning of the inspection probe 221 can be performed by linking the inspection jig 12 and the first cleaning part 80 using only one turntable 11, thus saving space, eliminating the need for the drive mechanism 13 of the first cleaning part 80, and saving development costs.

[0061] In some embodiments, as shown in Figure 13, there are multiple inspection fixtures 12 and multiple micropositioners 22, and the multiple inspection fixtures 12 cooperate with the corresponding micropositioners 22 to perform performance testing on multiple chips under inspection simultaneously. In this case, the chip inspection and cleaning device 100 may be considered a multi-station chip inspection device 100 with a cleaning function.

[0062] In this embodiment, the inspection jig 12 has a suction assembly 121 at its bottom for adsorbing the chip 200 to be inspected. Inside the suction assembly 121 is a gas passage, which is connected to a vacuum device. The vacuum device then creates a vacuum in the gas passage, thereby adsorbing the chip 200 to the bottom of the inspection jig 12.

[0063] In some specific embodiments, each of the first cleaning parts 80 includes at least one brush 81, and the turntable 11 is configured to be controlled to rotate one of the first cleaning parts 80 in conjunction with the corresponding micropositioner 22, and then rotate repeatedly in a controlled manner, thereby causing the brush 81 to reciprocate in conjunction, thereby cleaning the inspection probe 221 on the micropositioner 22. In these embodiments, the cleaning speed of the brush 81 can be controlled by controlling the rotational speed of the turntable 11.

[0064] This embodiment automates the cleaning of the inspection probe 221, saving labor costs, avoiding situations where manual cleaning is insufficient or damages the inspection probe 221, and effectively cleaning the inspection probe 221 by using the brush 81 instead of a cleaning sheet.

[0065] Figure 18 is a schematic diagram of the structure of a first cleaning component 80 according to one embodiment of the present invention. As shown in Figure 18, in a preferred embodiment, the first cleaning component 80 includes a plurality of brushes 81 arranged side by side, which rotate according to a turntable 11 and are configured to sequentially clean the inspection probe 221 on the micropositioner 22. That is, each first cleaning component 80 has a plurality of brushes 81, and there may be two such components. The turntable 11 first moves one brush 81 of the first cleaning component 80 to the micropositioner 22 in conjunction, and then rotates repeatedly, thereby causing the brush 81 to reciprocate in conjunction, thereby cleaning the inspection probe 221. Next, the other brush 81 of the first cleaning component 80 is moved in conjunction to a position facing the micropositioner 22, and then rotates repeatedly, causing the brush 81 to clean the inspection probe 221 in conjunction. Here, one brush 81 performs forward cleaning and the other brush 81 performs reverse cleaning, which can improve the cleaning effect of the inspection probe 221. In other embodiments, the number of brushes 81 may be determined based on specific design requirements.

[0066] As shown in Figure 13, the chip inspection and cleaning apparatus 100 further includes at least one drive mechanism 13, each drive mechanism 13 mounted on an inspection fixture 12, and is configured to drive the corresponding inspection fixture 12 downward when the corresponding inspection fixture 12 rotates above the corresponding micropositioner according to the turntable 11, thereby bringing the chip to be inspected 200, which is attracted to its bottom, into contact with the corresponding inspection probe 221. Here, the drive mechanism 13 is mounted on the top of the inspection fixture 12.

[0067] In some optional embodiments, as shown in Figure 13, there are multiple inspection fixtures 12, and consequently, multiple drive mechanisms 13.

[0068] Figure 19 is a schematic front view of a second cleaning component 50 according to one embodiment of the present invention, and Figure 20 is a schematic side view of a second cleaning component 50 according to one embodiment of the present invention. As shown in Figures 19 and 20, and also with reference to Figure 13, in some specific embodiments, the chip inspection and cleaning apparatus 100 further includes at least one second cleaning component 50, which is mounted on a turntable 11, and each of the second cleaning components 50 has at least one suction cup 51, which is configured to draw in or blow air onto the inspection probe 221 when rotated above the corresponding micropositioner according to the turntable 11. Here, a gas pipe 53 is provided inside the suction cup 51, which is connected to an external air supply device, and the force of the cleaning can be controlled by controlling the pressure of the gas pipe 53. The second cleaning component 50 cleans after the brush 81 has finished cleaning the inspection probe 221. After the brush 81 of the first cleaning part 80 has completed cleaning, the turntable 11 rotates the second cleaning part 50 in conjunction with it to move it to the micropositioner 22, and the air supply device sprays positive pressure air through the gas pipe 53, drawing in the foreign matter after cleaning with negative pressure. This prevents the foreign matter after cleaning by the brush 81 from remaining on the inspection probe 221, further improving the cleaning effect.

[0069] Figure 21 is a schematic structural diagram of a visual detection component 60 according to one embodiment of the present invention. As shown in Figure 21 and also with reference to Figure 13, in some specific embodiments, the chip inspection and cleaning apparatus 100 further includes at least one visual detection component 60, which is mounted on a turntable 11 and rotates according to the turntable 11, thereby enabling visual detection of the corresponding inspection probe 221. The visual detection component 60 observes the degree of contamination of the inspection probe 221 before cleaning it, and can observe the inspection probe 221 again after the first cleaning component 80 and the second cleaning component 50 have cleaned the inspection probe 221, thereby observing the effect of the cleaning. Here, the visual detection component 60 includes a light source 61, a lens 62, and a camera 63.

[0070] In some specific embodiments, the first cleaning component 80 includes at least one first drive component 82, each first drive component 82 connected to a brush 81, the first drive component 82 being configured to drive the brush 81 to move along the longitudinal direction under control, thereby adjusting the height of the brush 81. Specifically, when the brush 81 moves to the micropositioner 22 according to the turntable 11, the brush 81 is positioned above the micropositioner 22, and the first drive component 82 needs to move the brush 81 downward to a position where it interlocks and contacts the inspection probe 221, the turntable 11 then rotates repeatedly, thereby causing the brush 81 to reciprocate in an interlocking motion. By providing the first drive component 82, this embodiment can adjust the height of the brush 81 according to different heights of the micropositioner 22, thereby meeting the need for cleaning micropositioner 22 of different heights. If the first drive component 82 is not provided, the brush 81 will rotate according to the turntable 11 and then directly contact the inspection probe 221 on the micropositioner 22, eliminating the need to adjust the position of the brush 81 up and down. The first drive component 82 is a cylinder.

[0071] In a preferred embodiment, the first cleaning component 80 further includes at least one angle adjustment assembly 83, each angle adjustment assembly 83 connected to one first drive component 82 and one brush 81, and used to adjust the angle of the brush 81. In this embodiment, the angle of the brush 81 can be adjusted according to the needs during cleaning, thereby making the cleaning of the inspection probe 221 more convenient.

[0072] In some specific embodiments, the angle adjustment assembly 83 includes a first adjustment part 831 and a second adjustment part 832, the first adjustment part 831 being attached to a first drive part 82 and having at least one pair of mounting holes 833, each pair of mounting holes 833 comprising a plurality of mounting holes 833 spaced apart and arranged in an arc. The second adjustment part 832 has at least one arc-shaped mounting groove 834 and is connected to a brush 81, each mounting groove 834 corresponding to a pair of mounting holes 833, the second adjustment part 832 is rotatable relative to the first adjustment part 831 and is connected to the first adjustment part 831 by bolts passing through the mounting grooves 834 and mounting holes 833. As shown in Figure 18, the first adjustment part 831 has two sets of mounting holes 833 positioned opposite each other on the left and right sides of the brush 81, with each set of mounting holes 833 having three mounting holes 833, and all mounting holes 833 on each first adjustment part 831 are located in the same circular area. The second adjustment part 832 has two mounting grooves 834 positioned opposite each other on the left and right sides of the brush 81, and the two mounting grooves 834 are located in the same circular area. In other embodiments, the number of mounting holes 833 may be set according to specific design requirements. In this embodiment, the second adjustment part 832 can be adjusted manually, thereby rotating the second adjustment part 832 relative to the first adjustment part 831, and after rotating to the desired angle, the second adjustment part 832 can be connected to the first adjustment part 831 by a bolt. Since the brush 81 is connected to the second adjustment part 832, the angle of the brush 81 can be adjusted simultaneously with the rotation of the second adjustment part 832.

[0073] In some specific embodiments, as shown in Figure 13, there are multiple inspection fixtures 12, with a first cleaning component 80, a second cleaning component 50, or a visual detection component 60 placed between two adjacent inspection fixtures 12. There are also multiple micropositioners 22, and when the turntable 11 rotates until each micropositioner 22 corresponds to one inspection fixture 12, performance testing can be performed simultaneously on multiple chips 200 held by the inspection fixtures 12, improving the efficiency of chip inspection.

[0074] In some specific embodiments, there are multiple first cleaning parts 80, and the turntable 11 rotates until each of the multiple first cleaning parts 80 corresponds one-to-one with each of the multiple micropositioners 22, thereby satisfying the need to clean the inspection probes 221 on the multiple micropositioners 22 simultaneously and improving cleaning efficiency.

[0075] In some specific embodiments, the second cleaning component 50 includes at least one second drive component 52, each second drive component 52 connected to a suction cup 51, the second drive component 52 being controlled to drive the suction cup 51 to move along the longitudinal direction, thereby adjusting the height of the suction cup 51. Here, when the turntable 11 rotates the second cleaning component 50 in conjunction with the micropositioner 22, the second drive component 52 drives the suction cup 51 to move downward, and then blows or sucks air. On the one hand, the second drive component 52 can drive the suction cup 51 downward to a position closer to the micropositioner 22, so as to effectively blow away or suck up foreign matter, thereby improving the cleaning effect. On the other hand, the second drive component 52 can adjust the height of the suction cup 51 according to different micropositioner 22 heights, so as to meet the need to clean micropositioner 22 of different heights, thereby realizing the versatility of the chip inspection and cleaning device 100. The second drive component 52 is a cylinder.

[0076] Figure 22 is a schematic block diagram of a multi-station chip inspection system 1000 according to one embodiment of the present invention. As shown in Figure 22, in this embodiment, the multi-station chip inspection system 1000 includes a loading device 300, at least one multi-station chip inspection device 100 of any of the above embodiments, and an unloading device 400. The multi-station chip inspection device 100 is located close to the loading device 300 and is used to receive the chips 200 to be inspected at the loading device 300 and to perform performance testing on the chips 200 to be inspected. The unloading device 400 is located on the side of the multi-station chip inspection device 100 away from the loading device 300 and is used to remove the chips 200 to be inspected after performance testing has been completed at the multi-station chip inspection device 100. Here, the loading device 300 docks with the nearest loading assembly 40, and the unloading device 400 docks with the nearest unloading assembly 30. It may be understood that the loading device 300 places the chip under test 200 into the loading assembly 40, and the unloading assembly 30 places the chip after testing is complete into the unloading device 400.

[0077] Figure 23 is a schematic process diagram of a chip inspection method used in a multi-station chip inspection device 100 according to one embodiment of the present invention. As shown in Figure 23, in this embodiment, the chip inspection method used in the multi-station chip inspection device 100 of any of the above embodiments includes the following steps. Step S100 involves controlling and rotating the turntable 11, thereby rotating one of the inspection fixtures 12 in conjunction with it to the first target position. Step S200 involves controlling the corresponding inspection jig 12 to pick up the chip 200 to be inspected at the first target position. Step S300 involves controlling the turntable 11 to rotate it by a preset angle along a first direction, and controlling the inspection fixture 12 to cooperate with the corresponding micropositioner 22, thereby causing the corresponding inspection probe 221 to come into contact with the adsorbed chip 200, thereby performing a performance test of the chip 200, and the first direction is either clockwise or counterclockwise.

[0078] Figure 24 is a schematic process diagram of a chip inspection method used in a multi-station chip inspection device 100 according to another embodiment of the present invention. As shown in Figure 24, in this embodiment, step S300 includes the following steps. Step S310 involves controlling the turntable 11 to rotate it by a preset angle along a first direction, thereby positioning the inspection fixture 12 above the corresponding micropositioner 22. In step S320, the drive mechanism 13 is controlled to drive the corresponding inspection fixture 12 down, so that the inspection probe 221 on the corresponding micropositioner 22 comes into contact with the adsorbed chip 200.

[0079] In this embodiment, the turntable 11 is controlled to rotate by a preset angle along a first direction, and the inspection fixture 12 is controlled to cooperate with the corresponding micropositioner 22, so that the next inspection fixture 12 rotates to a first target position and picks up the next chip to be inspected 200. Here, the preset angle is set based on specific design requirements and is the same as the angle between two adjacent inspection fixtures 12. The first direction is either counterclockwise or clockwise.

[0080] In this embodiment, as shown in Figure 2, there are six inspection fixtures 12 and three micropositioners 22. The angle between two adjacent inspection fixtures 12 is 60°, and the angle between two adjacent micropositioners 22 is also 60°. Each micropositioner 22 corresponds to one inspection fixture 12, and the three micropositioners 22 perform inspections of different performance characteristics on the chip under test 200, such as AC, DC, and avalanche. In Figure 2, the leftmost inspection fixture 12 is named inspection fixture 1, and they are sequentially named inspection fixture 2, inspection fixture 3, inspection fixture 4, inspection fixture 5, and inspection fixture 6 in a counterclockwise direction. The leftmost micropositioner 22 is named micropositioner 1, and they are sequentially named micropositioner 2, micropositioner 3, and so on, in a counterclockwise direction. The loading assembly 40 is positioned below the inspection fixture 1. When inspecting the chip 200 to be inspected, the inspection fixture 1 picks up the chip 200 from the loading assembly 40, and then the turntable 11 rotates 60° counterclockwise, at which point the inspection fixture 1 is positioned above the micropositioner 1 and the inspection fixture 6 is positioned above the loading assembly 40. The inspection fixture 1 is driven by the drive mechanism 13 and moves downward until it cooperates with the micropositioner 1, thereby performing a performance test of the chip 200 to be inspected. Simultaneously, the inspection fixture 6 picks up the chip 200 to be inspected on the loading assembly 40. The turntable 11 then continues to rotate 60° counterclockwise, at which point the inspection fixture 1 is positioned above the micropositioner 2 and the inspection fixture 6 is positioned above the micropositioner 1. The inspection fixture 1 is driven by the drive mechanism 13 and moves downward until it cooperates with the micropositioner 2, thereby performing a performance test of the corresponding chip 200 to be inspected. The inspection fixture 6 is driven by the drive mechanism 13 and moves downward until it cooperates with the micropositioner 1, thereby performing a performance test of the corresponding chip 200 under test. Simultaneously, the inspection fixture 5 picks up the chip 200 under test on the loading assembly 40.Next, the turntable 11 continues to rotate 60° counterclockwise, at which point inspection fixture 1 is positioned above micropositioner 3, inspection fixture 6 is positioned above micropositioner 2, and inspection fixture 5 is positioned above micropositioner 1. Inspection fixture 3 moves downward while being driven by the drive mechanism 13 until it cooperates with micropositioner 3, thereby performing a performance test on the corresponding chip 200 under test. Inspection fixture 6 moves downward while being driven by the drive mechanism 13 until it cooperates with micropositioner 2, thereby performing a performance test on the corresponding chip 200 under test. Inspection fixture 5 moves downward while being driven by the drive mechanism 13 until it cooperates with micropositioner 1, thereby performing a performance test on the chip 200 under test. In other words, this embodiment can perform performance tests on three chips 200 under test simultaneously. Next, the turntable 11 rotates another 60°, and the inspection fixture 1 rotates to the second target position, with inspection fixture 6 positioned above the micropositioner 3, inspection fixture 5 above the micropositioner 2, and inspection fixture 4 above inspection fixture 1, and performance testing continues. The unload assembly 30 moves below the inspection fixture 1, thereby receiving the chip under test 200 from the inspection fixture 1 and transferring the chip under test 200 to the first target position of the next multi-station chip inspection device 100, so that the inspection fixture 12 on another turntable 11 continues to perform performance testing on the chip under test 200.

[0081] Figure 25 is a schematic process diagram of a control method for a chip inspection and cleaning apparatus 100 according to one embodiment of the present invention. As shown in Figure 25, in this embodiment, the control method includes the following steps. In step S101, when a control command is received to perform an inspection on the chip 200 to be inspected, the turntable 11 is controlled to rotate, thereby rotating one of the inspection fixtures 12 to the first target position in conjunction with it. Step S201 involves controlling the corresponding inspection jig 12 to pick up the chip 200 to be inspected at the first target position. Step S301 involves controlling the turntable 11 to rotate it by a preset angle along a first direction, and controlling the inspection fixture 12 to cooperate with the corresponding micropositioner 22, thereby causing the corresponding inspection probe 221 to contact the adsorbed chip 200, thereby performing a performance test of the chip 200, where the first direction is either clockwise or counterclockwise. Here, the preset angle may be set based on specific design requirements.

[0082] In step S101, a loading assembly is provided below the first target position, and the chip to be inspected 200 is located on the loading assembly. When the corresponding inspection fixture 12 rotates to the first target position, it is preferable to use the suction assembly 121 directly to pick up the chip to be inspected 200 on the loading assembly.

[0083] In some specific embodiments, step S301 specifically includes the following steps: Step 1 involves controlling the turntable 11 to rotate it by a preset angle along a first direction, thereby positioning the inspection fixture 12 above the corresponding micropositioner 22. Step 2 involves controlling the corresponding drive mechanism 13 to drive the inspection fixture 12 downward, thereby causing the corresponding inspection probe 221 to contact the attracted chip 200. Here, the drive mechanism 13 is mounted on the top of the inspection fixture 12.

[0084] In this embodiment, the control method further includes the following steps. In step S401, when a control command is received to clean the inspection probe 221 of the micropositioner 22, the turntable 11 is controlled to rotate, thereby rotating the first cleaning part 80 in conjunction with the corresponding micropositioner 22, and thereby cleaning the inspection probe 221 on the micropositioner 22. Note that there is no order relationship between steps S401 and S101.

[0085] In this embodiment, the turntable 11 may be controlled and rotated based on a control command, thereby rotating the inspection jig 12 to the micropositioner 22, thereby performing a performance test on the chip 200 under inspection, or the first cleaning part 80 to the micropositioner 22, thereby cleaning the inspection probe 221 on the micropositioner. By incorporating a control program into the turntable 11, the chip inspection and cleaning device 100 can achieve both the function of performing a performance test on the chip 200 under inspection and the function of cleaning the inspection probe 221.

[0086] Figure 26 is a schematic process diagram of a control method for a chip inspection and cleaning apparatus 100 according to another embodiment of the present invention. As shown in Figure 26, in some specific embodiments, step S401 specifically includes the following steps. In step S410, when a control command is received to perform cleaning on the inspection probe 221 of the micropositioner 22, the turntable 11 is controlled to rotate, thereby rotating the first cleaning part 80 in conjunction with the corresponding micropositioner 22. Step S420 involves controlling the first brush of the first cleaning part 80 to move downward, thereby causing the first brush to contact the inspection probe 221 on the micropositioner 22. Step S430 involves controlling the turntable 11 to rotate repeatedly, thereby causing the first brush to reciprocate in conjunction with it, thereby performing positive cleaning on the inspection probe 221 on the micropositioner 22. Step S440 involves controlling the first brush to return to its original position and controlling the second brush of the first cleaning part 80 to move downward, thereby causing the second brush to contact the inspection probe 221 on the micropositioner 22. Step S450 involves controlling the turntable 11 to rotate repeatedly, thereby causing the second brush to reciprocate in conjunction with it, thereby performing reverse cleaning against the inspection probe 221 on the micropositioner 22. Step S460 involves controlling the second brush to return it to its original position.

[0087] Here, the first brush and the second brush indicate that the first cleaning part 80 has two brushes 81. One brush 81 performs forward cleaning, and the other brush 81 performs reverse cleaning, thereby improving the cleaning effect of the inspection probe 221.

[0088] Figure 27 is a schematic process diagram of a control method for a chip inspection and cleaning apparatus 100 according to another embodiment of the present invention. As shown in Figure 27, this embodiment further includes the following steps after step S401. Step S501 involves controlling and rotating the turntable 11, thereby rotating the second cleaning part 50 in conjunction with the corresponding micro-positioner above it. In step S601, the suction cup 51 of the second cleaning part 50 is controlled to move downward, and then the suction cup 51 is controlled to suck or blow air, thereby cleaning the inspection probe 221 on the micropositioner. Step S701 is performed, and the suction cup 51 is controlled to return to its original position.

[0089] While this specification provides and describes in detail several exemplary embodiments of the present invention, those skilled in the art should understand that, without departing from the spirit and scope of the invention, many other variations or modifications that conform to the principles of the invention can still be directly determined or derived based on the content disclosed herein. Therefore, the scope of the present invention should be understood and determined to cover all such other variations or modifications. [Explanation of symbols]

[0090] 1000 Chip Inspection System 300 Loading Devices 400 Unload Devices 100 Multi-Station Chip Inspection Device / Chip Inspection and Cleaning Equipment 200 chips to be tested 10. Second Inspection Assembly 20. First Inspection Assembly 30 Unload Assembly 40 Loading Assembly 11 Turntable 12 Inspection fixtures 13 Drive mechanism 21 Inspection equipment 22 Micropositioner 121 First Adsorption Assembly 221 Test probe 31. First slide rail 32. Second slide rail 33. Second Adsorption Assembly 331 Suction Nozzle 332 Vacuum adsorption gas flow path 122 Gas Nozzle 123 First gas channel 124 Second gas channel 23. First PCB board 24 Support Assembly 241 First insulating plate 242 Metal plate 243 Second insulating plate 25. Second PCB board 70 Motor 80 First cleaning part 50 Second cleaning part 60 Visually detectable parts 81 Brushes 82 First drive component 83 Angle Adjustment Assembly 831 First Adjustment Part 832 Second Adjustment Part 833 Mounting holes 834 Mounting groove 51 Sucker 52 Second drive component 53 Gas pipe 61 Light source 62 lenses 63 Cameras

Claims

1. A first inspection assembly includes an inspection device and a plurality of micropositioners distributed in the inspection device, each of which is provided with an inspection probe. A second inspection assembly provided at the top of the first inspection assembly, comprising a turntable and a plurality of inspection fixtures distributed along the circumferential direction of the turntable, wherein the plurality of inspection fixtures are capable of adsorbing a chip to be inspected to their bottom and are configured to rotate in accordance with the turntable, and each of the micropositioners comprises the second inspection assembly corresponding to one of the inspection fixtures, A multi-station chip inspection device is provided to perform a performance inspection of the chip under inspection by bringing the corresponding inspection probe into contact with the adsorbed chip when any of the inspection fixtures are rotated in cooperation with any of the micropositioners.

2. The multi-station chip inspection device according to claim 1, further comprising a plurality of drive mechanisms, each of which is connected to a single inspection fixture, and which drives the corresponding inspection fixture down when the corresponding inspection fixture rotates to the top of any of the micropositioners according to the turntable, so that the inspection probe on the corresponding micropositioner contacts the adsorbed chip under inspection.

3. A loading assembly provided in a position close to the turntable, wherein when the inspection jig rotates to a first target position, the loading assembly is controlled to move downward of the inspection jig, thereby causing the corresponding inspection jig to attract the chip to be inspected on the loading assembly. The multi-station chip inspection device according to claim 1, further comprising: an unloading assembly provided in a position close to the turntable, which is provided to be controlled to move downward of the inspection jig when the inspection jig is rotated to a second target position, thereby receiving the chip to be inspected on the corresponding inspection jig.

4. A multi-station chip inspection device according to claim 1, wherein a plurality of the micropositioners are distributed in a circular manner at the top of the inspection equipment, and the angle between two adjacent micropositioners is the same as the angle between two adjacent inspection fixtures.

5. The multi-station chip inspection device according to claim 1, further comprising a plurality of temperature control assemblies, each of which is connected to a single inspection fixture and used to heat or cool the corresponding inspection fixture, thereby performing high-temperature inspection, low-temperature inspection, or room-temperature inspection on the chip under inspection.

6. The first inspection assembly, A multi-station chip inspection device according to claim 1, further comprising a first PCB board mounted on top of the inspection equipment, having at least one first positioning hole, the micropositioner being attached to the first PCB board by bolts, the micropositioner having a mounting position for mounting the chip to be inspected and at least one second positioning hole provided near the mounting position, thereby allowing a shaft pin to pass through the second positioning hole and the first positioning hole to bring the bottom of the inspection probe on the micropositioner into sufficient contact with the first PCB board.

7. The aforementioned inspection jig, The multi-station chip inspection device according to claim 1, comprising a first adsorption assembly located at the bottom of the inspection jig, the first adsorption assembly having a gas channel provided inside for adsorbing the chip to be inspected.

8. The multi-station chip inspection device according to claim 1 or 2, further comprising at least one first cleaning component mounted on the turntable, the first cleaning component being configured to rotate in accordance with the turntable to a corresponding micropositioner, thereby cleaning the inspection probe on the micropositioner.

9. Each of the first cleaning parts includes at least one brush, The multi-station chip inspection device according to claim 8, wherein the turntable is provided to be controlled to rotate one of the first cleaning parts in conjunction with the corresponding micropositioner, and then rotated repeatedly under control, thereby causing the brush to reciprocate in conjunction, thereby cleaning the inspection probe on the micropositioner.

10. The multi-station chip inspection device according to claim 8, further comprising at least one second cleaning component attached to the turntable, each having at least one suction cup, the suction cup being configured to draw in or blow air onto the inspection probe when rotated above the corresponding micropositioner according to the turntable.

11. The multi-station chip inspection device according to claim 10, further comprising at least one visual detection component mounted on the turntable, the visual detection component being configured to rotate according to the turntable so as to perform visual detection on the corresponding inspection probe.

12. The multi-station chip inspection device according to claim 11, wherein the first cleaning component, the second cleaning component, or the visual detection component is provided between two adjacent inspection fixtures.

13. A loading device for providing the chip to be tested, A multi-station chip inspection device according to at least one of claims 1 to 7, located near the loading device, for receiving the chip to be inspected at the loading device and performing performance testing of the chip to be inspected, A multi-station chip inspection system comprising: an unloading device located on the side of the multi-station chip inspection device away from the loading device, for removing the chip under inspection after performance testing has been completed in the multi-station chip inspection device.

14. The steps include controlling and rotating the turntable to rotate one of the inspection fixtures to the first target position, A step of controlling the corresponding inspection jig to pick up the chip to be inspected at the first target position, A chip inspection method for use in a multi-station chip inspection device according to any one of claims 1 to 7, comprising the steps of: controlling the turntable to rotate it by a preset angle along a first direction; controlling the inspection jig to cooperate with the corresponding micropositioner so that the corresponding inspection probe comes into contact with the adsorbed chip to be inspected, thereby performing a performance inspection of the chip to be inspected, wherein the first direction is clockwise or counterclockwise.

15. In the process of controlling the turntable to rotate it by a preset angle along the first direction and controlling the inspection jig to cooperate with the corresponding micropositioner, the next inspection jig rotates to the first target position and picks up the next chip to be inspected. The step of optionally controlling the turntable to rotate it by a preset angle along a first direction and controlling the inspection fixture to cooperate with the corresponding micropositioner specifically includes, The turntable is controlled to rotate along the first direction by a preset angle, thereby positioning the inspection fixture above the corresponding micropositioner. A chip inspection method according to claim 14, comprising the step of controlling a drive mechanism to drive and lower a corresponding inspection fixture so that the inspection probe on the corresponding micropositioner comes into contact with the adsorbed chip to be inspected.

16. The process involves receiving a control command to perform an inspection on the chip under inspection, controlling the turntable to rotate it, thereby rotating one of the inspection fixtures to the first target position, and A step of controlling the corresponding inspection jig to pick up the chip to be inspected at the first target position, A control method for use in a multi-station chip inspection device according to any one of claims 1 to 7, comprising the steps of: controlling the turntable to rotate it by a preset angle along a first direction; controlling the inspection jig to cooperate with the corresponding micropositioner so that the corresponding inspection probe comes into contact with the adsorbed chip to be inspected, thereby performing a performance inspection of the chip to be inspected, wherein the first direction is clockwise or counterclockwise.

17. The control method according to claim 16, further comprising the step of, upon receiving a control command to perform cleaning on the inspection probe of a micropositioner, controlling the turntable to rotate, thereby rotating the first cleaning component in conjunction with the corresponding micropositioner, thereby cleaning the inspection probe on the micropositioner.

18. When a control command is received to perform cleaning on the inspection probe of the micropositioner, the turntable is controlled to rotate, thereby rotating the first cleaning component in conjunction with the corresponding micropositioner, and thereby cleaning the inspection probe on the micropositioner. Specifically, this step involves: When a control command is received to perform cleaning on the inspection probe of the micropositioner, the turntable is controlled to rotate, thereby rotating the first cleaning part in conjunction with the corresponding micropositioner. The first brush of the first cleaning component is controlled to move downward, thereby causing the first brush to contact the inspection probe on the micropositioner, The steps include controlling the turntable to rotate it repeatedly, thereby causing the first brush to reciprocate in conjunction with it, and thereby performing positive cleaning on the inspection probe on the micropositioner, The first brush is controlled to return to its original position, and the second brush of the first cleaning part is controlled to move downward, so that the second brush contacts the inspection probe on the micropositioner, The steps include controlling the turntable to rotate it repeatedly, thereby causing the second brush to reciprocate in conjunction, and thereby performing reverse cleaning on the inspection probe on the micropositioner, The control method according to claim 17, characterized by comprising the step of controlling and restoring the second brush.

19. When a control command is received to clean the inspection probe of the micropositioner, the turntable is controlled to rotate, thereby rotating the first cleaning component in conjunction with the corresponding micropositioner, and after the step of cleaning the inspection probe on the micropositioner, further, The steps include controlling and rotating the turntable, thereby rotating the second cleaning part in conjunction with it to move it above the corresponding micro-positioner, The steps include controlling the suction cup of the second cleaning part to move it downward, then controlling the suction cup to suck or blow air, thereby cleaning the inspection probe on the micropositioner, The control method according to claim 17, comprising the step of controlling the suction cup to return it to its original position.

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