Conductive patterns and electromagnetic wave-transmitting films

Abstract

Embodiments of the present invention provide a conductive pattern and an electromagnetic wave-transmitting film including the conductive pattern. [Solution] The conductive pattern may include a first pattern having a cross-shaped hollow region inside, and a second pattern separated from the first pattern and positioned within the hollow region when projected from a planar direction.

Description

Technical Field

[0001] The present invention relates to a conductive pattern and an electromagnetic wave transmission film, and more particularly to a conductive pattern including a plurality of patterns and an electromagnetic wave transmission film.

Background Art

[0002] In recent years, with the development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth (registered trademark) have been applied to or incorporated into image display devices, electronic devices, buildings, the Internet of Things (IoT), and autonomous vehicles. Also, recently, as mobile communication technologies have evolved, for example, antennas for communicating in high-frequency or ultra-high-frequency bands have been widely applied to windows, home appliances, vehicle windows, building exteriors, and the like. For example, Wi-Fi operating in bands such as 2.4 GHz and 5 GHz, Bluetooth operating in the 2.45 GHz band, and 5G (5th-generation) communication systems operating in high-frequency bands (e.g., 28 GHz or higher) have been commercialized.

[0003] However, electromagnetic waves radiated from a transmitting unit may experience transmission loss due to the atmosphere or obstacles (e.g., walls or automobile glass) present on the transmission path before reaching the receiving unit.

[0004] Electromagnetic waves in high-frequency or ultra-high-frequency bands have a high transmission speed and a short wavelength, making diffraction difficult and the transmission distance relatively short. For example, electromagnetic waves sent from a base station antenna may be lost, attenuated, or dissipated in the process of passing through a wall or window before reaching the receiving unit. This may result in a decrease in signal efficiency and coverage, and an increase in the amount of energy used to compensate for signal loss.

[0005] Therefore, it is necessary to design additional configurations to suppress the loss of electromagnetic waves emitted from antennas or radars and to ensure reliability. For example, Patent Document 1 discloses an antenna module integrated into a display panel. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Korean Published Patent No. 10-2019-0009232 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] One objective of the present invention is to provide a conductive pattern having improved radio wave transmittance in a specific frequency band.

[0008] One objective of the present invention is to provide an electromagnetic wave-transmitting film having improved radio wave transmittance in a specific frequency band. [Means for solving the problem]

[0009] 1. A conductive pattern comprising a first pattern having a cross-shaped hollow region inside, and a second pattern separated from the first pattern and positioned within the hollow region when projected from a planar direction.

[0010] 2. In item 1 above, the outer periphery of the first pattern has a square shape, and is a conductive pattern.

[0011] 3. In item 2 above, the first pattern is a conductive pattern comprising a frame portion having a square ring shape and corner portions protruding from the four vertices of the frame portion toward the hollow region.

[0012] 4. In item 3 above, the frame portion is a conductive pattern having a square ring shape.

[0013] 5. In Item 3, the corner portion is a conductive pattern having a square shape.

[0014] 6. In Item 3, a conductive pattern satisfying the following Formula 3. [Formula 3] L1 / 100≦L2≦L1 / 50 (In the formula 3, L1 is the width of the hollow region, and L2 is the length of the corner portion.)

[0015] 7. In Item 2, the second pattern is a conductive pattern having a rectangular shape.

[0016] 8. In Item 7, the peripheral edge in the width direction of the second pattern is parallel to the peripheral edge in the width direction of the first pattern, and the peripheral edge in the longitudinal direction of the second pattern is parallel to the peripheral edge in the longitudinal direction of the first pattern. A conductive pattern.

[0017] 9. In Item 1, the first pattern and the second pattern have a solid structure with a filled interior. A conductive pattern.

[0018] 10. In Item 1, either one of the first pattern and the second pattern has a solid structure with a filled interior, and the other has a mesh structure. A conductive pattern.

[0019] 11. In Item 1, further including a dummy pattern formed in the hollow region. A conductive pattern.

[0020] 12. In Item 1, a conductive pattern satisfying the following Formula 1. [Formula 1] λ / 20≦P≦λ / 2 (In the formula 1, P is the width of the first pattern, and λ is the wavelength of the electromagnetic wave in the transmission target frequency band.)

[0021] 13. In Item 1, including a plurality of electrode layers arranged in sequence, Each of the plurality of electrode layers is a conductive pattern including at least one of the first pattern and the second pattern.

[0022] 14. In item 13 above, the first pattern and the second pattern are conductive patterns included in different electrode layers among the plurality of electrode layers.

[0023] 15. In item 14 above, the hollow region of the first pattern is a conductive pattern that entirely covers the second pattern in the planar direction.

[0024] 16. An electromagnetic wave transmission film includes a substrate and an electrode pattern layer disposed on the substrate and including a conductive pattern. The conductive pattern includes a first pattern including a frame portion having a rectangular ring shape and corner portions protruding from four vertices of the frame portion toward the center of the ring shape, and a second pattern spaced apart from the first pattern and disposed at the center of the ring shape when projected from the planar direction.

[0025] 17. In item 16 above, the corner portions have a square shape.

[0026] 18. In item 16 above, the electrode pattern layer includes a first electrode layer disposed on the substrate and including the first pattern, and a second electrode layer disposed on the first electrode layer and including the second pattern.

[0027] 19. In item 18 above, in the planar direction, the second pattern does not overlap the frame portion and the corner portions.

[0028] 20. In item 18 above, either one of the first electrode layer and the second electrode layer includes a metal mesh, and the other includes a metal oxide or a transparent conductive oxide.

Advantages of the Invention

[0029] An embodiment of the present invention may include a first pattern having a cross-shaped hollow region and a second pattern arranged within the hollow region in a planar direction. The conductive pattern can suppress reflection, attenuation, and phase shift of electromagnetic waves, and can increase the electromagnetic wave transmittance in a specific frequency band.

[0030] The width of the first pattern can satisfy a predetermined equation with respect to the wavelength of the electromagnetic waves in the frequency band to be transmitted. This makes it possible to increase the electromagnetic wave transmittance in a specific band or to selectively transmit electromagnetic waves in a specific band.

[0031] The first pattern may include a rectangular ring-shaped frame and corner portions protruding from the frame. The length of the corner portion can satisfy a predetermined formula with respect to the width of the hollow region. This can further improve electromagnetic wave transmission. [Brief explanation of the drawing]

[0032] [Figure 1] Figure 1 is a schematic plan view showing a conductive pattern according to an exemplary embodiment. [Figure 2] Figure 2 is a schematic plan view showing a conductive pattern according to an exemplary embodiment. [Figure 3] Figure 3 is a schematic plan view showing an electromagnetic wave-transmitting film according to an exemplary embodiment. [Figure 4] Figure 4 is a schematic perspective view showing an electromagnetic wave-transmitting film according to an exemplary embodiment. [Figure 5] Figure 5 is a schematic perspective view showing an electromagnetic wave-transmitting film according to an exemplary embodiment. [Figure 6] Figure 6 is a schematic perspective view showing an electromagnetic wave-transmitting film according to an exemplary embodiment. [Figure 7] Figure 7 is a schematic perspective view showing a conductive pattern according to an exemplary embodiment. [Figure 8]Figure 8 is a schematic plan view showing a conductive pattern according to an exemplary embodiment. [Figure 9] Figure 9 is a schematic plan view of area A in Figure 8, enlarged. [Figure 10] Figure 10 is a schematic cross-sectional view showing an electromagnetic wave-transmitting film according to an exemplary embodiment. [Figure 11] Figure 11 is a schematic cross-sectional view showing an electromagnetic wave-transmitting film according to an exemplary embodiment. [Figure 12] Figure 12 is a schematic cross-sectional view showing a window structure according to an exemplary embodiment. [Figure 13] Figure 13 is a schematic plan view showing a window structure according to an exemplary embodiment. [Figure 14] Figure 14 is a graph showing the electromagnetic wave transmittance of electromagnetic wave-transmitting films for the examples and comparative examples. [Modes for carrying out the invention]

[0033] Embodiments of the present invention provide a conductive pattern and an electromagnetic wave-transmitting film including the conductive pattern.

[0034] Embodiments of the present invention will be described more specifically below with reference to the drawings. However, the drawings accompanying this specification illustrate preferred embodiments of the present invention and, together with the detailed description of the invention, serve to help further understand the technical concept of the present invention. Therefore, the present invention is not to be construed as being limited only to what is shown in the drawings.

[0035] The terms "upper part," "lower part," "top surface," and "bottom surface" used in this invention indicate the relative position of each component and do not imply an absolute hierarchical relationship.

[0036] Figure 1 is a schematic plan view showing a conductive pattern according to an exemplary embodiment.

[0037] In Figure 1, two directions parallel to the upper surface of the conductive pattern 11 and intersecting each other are defined as the first and second directions. For example, the first and second directions can intersect perpendicularly to each other. The direction perpendicular to the upper surface of the conductive pattern 11 is defined as the third direction. The definitions of these directions may be applied similarly in the remaining drawings.

[0038] As shown in Figure 1, the conductive pattern 11 may include a first pattern 12 and a second pattern 15 that are spaced apart from each other.

[0039] The conductive pattern 11 can allow electromagnetic waves in a certain frequency band to pass through and block electromagnetic waves in a certain frequency band from the incident electromagnetic waves. For example, the conductive pattern 11 can selectively transmit, amplify, or reflect electromagnetic waves in a specific frequency band from the electromagnetic waves incident on its surface.

[0040] For example, electromagnetic waves with wavelengths in the high-frequency or ultra-high-frequency bands, such as 4G / 5G, may experience increased reflection and interference due to their short wavelengths and difficulty in diffraction. As a result, loss and attenuation of electromagnetic waves increase as they pass through structures such as walls and glass, which can reduce antenna efficiency and coverage.

[0041] The conductive pattern 11 can selectively transmit or reflect electromagnetic waves in a specific frequency band by adjusting the phase, direction of propagation, and refractive index of the incident electromagnetic wave. This prevents signal loss even in high frequency bands and reduces the transmission power or energy required for antennas or radars to transmit and receive electromagnetic waves.

[0042] A hollow region 18 can be formed inside the first pattern 12. The hollow region 18 may mean an empty area in the first pattern 12, such as a slot, slit, hole, or cavity.

[0043] The hollow region 18 may have a cross shape. The electromagnetic properties of the conductive pattern 11 can be adjusted by the shape of the hollow region 18.

[0044] According to exemplary embodiments, the outer periphery of the first pattern 12 may have a rectangular shape. For example, the first pattern 12 may include a frame portion 13 having a rectangular ring shape, and corner portions 14 projecting from the four vertices of the frame portion 13 toward a hollow region 18 or the center of the ring shape.

[0045] The second pattern 15 may be positioned within the hollow region 18 of the first pattern 12 when viewed from a planar direction (e.g., a third direction). For example, the second pattern 15 may have the pattern shape of an independent island. The hollow region 18 of the first pattern 12 can completely cover the second pattern 15 in the planar direction.

[0046] The first pattern 12 and the second pattern 15 have the shapes described above, which allows for adjustment of the transmission and reflection characteristics of electromagnetic waves incident toward the upper or lower surface of the conductive pattern 11, for example. This improves the transmittance for electromagnetic waves in a desired band, or eliminates or attenuates electromagnetic waves in the cutoff frequency band by the conductive pattern 11.

[0047] Furthermore, by arranging the second pattern 15 within the hollow region 18 of the first pattern 12, the overall opening ratio of the conductive pattern 11 can be reduced. As a result, the conductive pattern 11 can have low thermal conductivity and high thermal resistance, and even when the conductive pattern 11 is applied to windows, home appliances, or automobile windows, the reduction in thermal insulation due to openings can be suppressed.

[0048] According to an exemplary embodiment, the frame portion 13 may have a square shape.

[0049] The width (P) of the first pattern 12 and the frame portion 13 can be set considering the passband, cutoff frequency band, thickness and dielectric constant of the dielectric on which the conductive pattern 11 is arranged, and so on.

[0050] In one embodiment, the width (P) of the first pattern 12 or frame portion 13 can satisfy the following formula 1.

[0051] [Formula 1] λ / 20 ≤ P ≤ λ / 2

[0052] In the above formula 1, P is the width of the first pattern 12 or the frame portion 13, and λ may be the wavelength of the electromagnetic wave having the highest transmittance among the electromagnetic waves passing through the conductive pattern 11. For example, λ may be the wavelength of an electromagnetic wave having the frequency band to be transmitted.

[0053] Within the range of Equation 1, it is possible to further increase the electromagnetic wave transmittance in a specific band, or to further improve the shielding efficiency and selectivity for electromagnetic waves in a specific band. This makes it possible to increase the transmission selectivity for electromagnetic waves in a desired band, thereby improving signal efficiency at the operating frequency.

[0054] In some embodiments, the width of the hollow region 18 can satisfy the following equation 2.

[0055] [Formula 2] 0.8 × P ≤ L1 ≤ 0.99 × P

[0056] In the above formula 2, P may be the width of the first pattern 12 or the frame portion 13, and L1 may be the width of the hollow region 18.

[0057] Within the range of Equation 2, the electromagnetic wave transmittance of the conductive pattern 11 in a specific frequency band is further improved, and the conductive pattern 11 can have high visible light transmittance. As a result, for example, even when the conductive pattern 11 is applied to a glass substrate such as a window, the visibility of the electrodes or pattern can be suppressed.

[0058] In some embodiments, when viewed from a planar direction, the area of ​​the hollow region 18 may be 30% or less of the total area of ​​the conductive pattern 11. For example, the area of ​​the hollow region 18 is L1 2 -4L2 2 -L3 2 This can be calculated as follows. In one embodiment, the area of ​​the hollow region 18 may be 5% to 30%, 5% to 20%, or 10% to 20% of the total area of ​​the conductive pattern 11.

[0059] For example, in the conductive pattern 11, the area of ​​the first pattern 12 and the second pattern 15 may be 70% or more. In one embodiment, the area of ​​the first pattern 12 and the second pattern 15 is P 2 -L1 2 +4L2 2 +L3 2 It can be calculated using this method.

[0060] In one embodiment, the corner portion 14 may have a rectangular shape. For example, the corner portion 14 may have a square shape.

[0061] In one embodiment, the length (L2) of the corner portion 14 can satisfy the following equation 3.

[0062] [Formula 3] L1 / 100 ≤ L2 ≤ L1 / 50

[0063] In the above formula 3, L1 may be the width of the hollow region 18, and L2 may be the length of the corner portion 14.

[0064] Within the range of Equation 3, the region and area to which the corner portion 14 of the conductive pattern 11 is allocated can be adjusted to an appropriate range. This makes it possible to improve the transmission characteristics for electromagnetic waves in a desired frequency band.

[0065] According to an exemplary embodiment, the second pattern 15 may have a rectangular shape. For example, the second pattern 15 may have a square shape.

[0066] In some embodiments, the widthwise (e.g., first direction) periphery of the second pattern 15 may be parallel to the widthwise periphery of the first pattern 12. The longitudinal (e.g., second direction) periphery of the second pattern 15 may be parallel to the longitudinal periphery of the first pattern 12.

[0067] For example, the second pattern 15 may have the same shape or pattern as the outer periphery of the first pattern 12.

[0068] In one embodiment, the width (L3) of the second pattern 15 can satisfy the following equation 4.

[0069] [Formula 4] P / √2≦L3

[0070] In the above formula 4, P may be the width of the first pattern 12, and L3 may be the width of the second pattern 15.

[0071] Within the range of Equation 4, the aperture ratio of the conductive pattern 11 can be reduced, and the thermal resistance of the conductive pattern 11 can be increased. This makes it possible to improve both the electromagnetic wave transmittance and the heat insulation properties of the conductive pattern 11.

[0072] In one embodiment, the width (L3) of the second pattern 15 can satisfy the following equation 5.

[0073] [Formula 5] L3 ≤ L1 - (2 × L2)

[0074] Within the aforementioned range, the second pattern 15 does not need to overlap with the frame portion 13 and the corner portion 14 in the planar direction. Electrical insulation between the first pattern 12 and the second pattern 15 can be ensured, and the aperture ratio can be reduced while improving electromagnetic wave transmittance.

[0075] In some embodiments, when viewed from a planar direction, the area of ​​the second pattern 15 may be 50% or more of the total area of ​​the conductive pattern 11. For example, the area of ​​the second pattern 15 may be 50% to 90%, 50% to 85%, or 60% to 80% of the total area of ​​the conductive pattern 11.

[0076] According to exemplary embodiments, the conductive pattern 11 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or alloys containing at least one of these. These can be used individually or in combination of two or more.

[0077] In one embodiment, the conductive pattern 11 may include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa) alloy) to achieve low resistance and fine linewidth patterning.

[0078] In some embodiments, the conductive pattern 11 may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), zinc oxide (ZnOx), indium oxide (InOx), tin oxide (SnOx), cadmium tin oxide (CTO), gallium-doped zinc oxide (GZO), zinc tin oxide (ZTO), and indium gallium oxide (IGO).

[0079] In some embodiments, the conductive pattern 11 may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer and a metal layer, or a three-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer.

[0080] The metal layer may include the aforementioned metal or alloy. The transparent conductive oxide layer may include the aforementioned transparent conductive oxide. The metal layer can improve flexibility, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0081] In one embodiment, the conductive pattern 11 may also include a metamaterial. The metamaterial allows for adjustment of electromagnetic wave transmittance, refractive index, incident angle, and frequency band.

[0082] In some embodiments, the conductive pattern 11 may include a solid structure. For example, the first pattern 12 and / or the second pattern 15 may have a solid structure. This can increase the thermal resistance of the conductive pattern 11 and decrease its thermal conductivity and thermal conduction rate.

[0083] In some embodiments, the conductive pattern 11 may include a mesh structure. For example, at least one of the first pattern 12 and the second pattern 15 may have a mesh structure.

[0084] The mesh structure of the conductive pattern 11 prevents the shape of the pattern from being visible to the user. This prevents the conductive pattern 11 from being visible to the user and impairing aesthetics, and improves transmittance and optical properties.

[0085] In some embodiments, the mesh structure may be defined by repeating unit cells. For example, the unit cells may mean spaces partitioned by interconnected conductive lines.

[0086] The unit cell may have a polygonal shape. The shape of the unit cell may be changed by the shape and arrangement of the dummy conductive lines. The unit cell may have a rhombus, rectangle, pentagon, hexagon, or the like, and may have a square shape, for example.

[0087] Figure 2 is a schematic plan view showing a conductive pattern 11 according to an exemplary embodiment.

[0088] As shown in Figure 2, the first pattern 12 and the second pattern 15 may have different structures from each other.

[0089] For example, the first pattern 12 may have a mesh structure, and the second pattern 15 may have a solid structure. By having the first pattern 12 and the second pattern 15 have different shapes, it is possible to improve both thermal insulation and transmittance of electromagnetic waves and visible light in specific frequency bands.

[0090] In one embodiment, the first pattern 12 may have a solid structure, and the second pattern 15 may have a mesh structure.

[0091] The electromagnetic wave-transmitting film according to an embodiment of the present invention may include the aforementioned conductive pattern.

[0092] Figure 3 is a schematic plan view showing an electromagnetic wave-transmitting film according to an exemplary embodiment.

[0093] As shown in Figure 3, the electromagnetic wave-transmitting film 10 may include a plurality of conductive patterns 11 arranged adjacent to each other. For example, the conductive patterns 11 may be arranged in a fixed periodicity.

[0094] By periodically arranging the conductive patterns 11, electromagnetic waves of a desired frequency band can be selectively passed through while suppressing reflection, interference, and annihilation of electromagnetic waves. The densely arranged conductive patterns 11 can improve the transmission concentration for electromagnetic waves with specific waveforms, thereby increasing signal efficiency and intensity.

[0095] For example, the electromagnetic wave-transmitting film 10 may be provided as an electromagnetic wave transmission device, an electromagnetic wave amplification device, a resonator, a filter, a frequency-selective surface (FSS), a reconfigurable intelligent surface (RIS), and the like.

[0096] The electromagnetic properties of the electromagnetic wave-transmitting film 10 can be adjusted by the arrangement period, arrangement spacing, and arrangement shape of the conductive pattern 11. For example, the arrangement period and arrangement shape of the conductive pattern 11 can be designed or adjusted considering a desired frequency band, the angle of incidence of electromagnetic waves, or the transmittance and reflectance of infrared, ultraviolet, and visible light.

[0097] In some embodiments, the conductive patterns 11 may be arranged such that the corners of the outer casing of the frame portion 13 are adjacent to each other. For example, the conductive patterns 11 may be arranged to be in contact with each other.

[0098] Figure 4 is a schematic perspective view of an electromagnetic wave-transmitting film according to an exemplary embodiment.

[0099] As shown in Figure 4, the first pattern 12 and the second pattern 15 may be arranged in the same layer. For example, the first pattern 12 and the second pattern 15 may be formed together within a single electrode layer.

[0100] In some embodiments, the electromagnetic wave-transmitting film 10 may include multiple electrode layers. For example, the electromagnetic wave-transmitting film 10 may include a laminated structure of sequentially arranged electrode layers.

[0101] According to exemplary embodiments, the first pattern 12 and the second pattern 15 may be arranged on different layers. For example, the first pattern 12 and the second pattern 15 may be formed on different layers among a plurality of electrode layers, respectively.

[0102] Figures 5 and 6 are schematic perspective views of an electromagnetic wave-transmitting film according to an exemplary embodiment, respectively.

[0103] As shown in Figure 5, the electromagnetic wave-transmitting film 10 may include a first electrode layer 20 and a second electrode layer 30 arranged sequentially.

[0104] The first electrode layer 20 may contain only the first pattern 12. For example, the first electrode layer 20 may have only the first pattern 12 having a cross-shaped hollow region 18, and the second pattern 15 may not be formed on the first electrode layer 20.

[0105] The second electrode layer 30 may contain only the second pattern 15. For example, the second electrode layer 30 may have only the second pattern 15 having an independent island pattern shape.

[0106] As explained in Figure 3 above, when projected in a planar direction (for example, a third direction), the second pattern 15 may completely overlap the hollow region 18 of the first pattern 12. For example, in the planar direction, the second pattern 15 does not have to overlap the frame and corner portions of the first pattern 12.

[0107] As shown in Figure 6, the first electrode layer 20 may include the second pattern 15, and the second electrode layer 30 may include the first pattern 12.

[0108] For example, by arranging the first pattern 12 and the second pattern 15 on different layers, the design can be facilitated even if the first pattern 12 and the second pattern 15 contain different materials and structures (e.g., a mesh structure or a solid structure).

[0109] In some embodiments, the first pattern 12 and the second pattern 15 are arranged on different layers or levels, and when projected from a planar direction, the aforementioned equations 1, 2, 3, 4, and / or 5 can be satisfied. This can improve the transmission characteristics of the electromagnetic wave transmission band of the electromagnetic wave transmission film 10, as well as the visible light transmittance and thermal insulation.

[0110] In some embodiments, each of the plurality of electrode layers may include a first pattern 12 and a second pattern 15.

[0111] Figure 7 is a schematic perspective view showing a conductive pattern according to an exemplary embodiment.

[0112] As shown in Figure 7, the first electrode layer 20 may include a first conductive pattern 21, and the second electrode layer 30 may include a second conductive pattern 31.

[0113] The first conductive pattern 21 may include a first pattern 22 having a hollow region 28 and a second pattern 25 disposed within the hollow region 28. The second conductive pattern 31 may include a first pattern 32 having a hollow region 38 and a second pattern 35 disposed within the hollow region 38.

[0114] According to an exemplary embodiment, the conductive patterns 21, 31 contained in each electrode layer 20, 30 may overlap each other in the planar direction.

[0115] For example, the first pattern 22 included in the first conductive pattern 21 may overlap with the first pattern 32 included in the second conductive pattern 31. The second pattern 25 included in the first conductive pattern 21 may overlap with the second pattern 35 included in the second conductive pattern 31.

[0116] The overlapping of the conductive patterns 21 and 31 contained in each electrode layer 20 and 30 improves thermal insulation while preventing a decrease in electromagnetic wave transmittance.

[0117] In some embodiments, the first patterns 22, 32 and the second patterns 25, 35 included in each electrode layer 20, 30 may have different areas or sizes from each other.

[0118] For example, the size of the hollow regions 28, 38 contained in each electrode layer 20, 30 may increase sequentially as they move away from the lower substrate or dielectric layer. By increasing the area / size of the hollow regions 28, 38 as you move towards the upper layers of the electromagnetic wave-transmitting film 10, the electromagnetic wave transmittance can be further improved.

[0119] In some embodiments, when viewed from a planar direction, the hollow region 38 of the upper second electrode layer 30, which is located in the upper layer of the two adjacent electrode layers 20 and 30, can completely cover the hollow region 28 of the lower first electrode layer 20.

[0120] For example, the first pattern 22 and the second pattern 25 of the first conductive pattern 21 may have a larger size or area than the first pattern 32 and the second pattern 35 of the second conductive pattern 31, respectively. This prevents electromagnetic waves that have passed through the hollow region 28 of the lower layer from being reflected by the conductive pattern 31 of the upper layer and causing them to cancel each other out or disappear.

[0121] Figure 8 is a schematic plan view showing a conductive pattern 11 according to several embodiments.

[0122] As shown in Figure 8, the conductive pattern 11 may include a dummy pattern 16. The dummy pattern 16 may be formed within a hollow region 18 when viewed from a planar direction.

[0123] According to an exemplary embodiment, the dummy pattern 16 may have a mesh structure. The dummy pattern 16 may contain substantially the same material as the metal, alloy, metal oxide, or transparent conductive oxide used in the first pattern 12 and the second pattern 15.

[0124] The dummy pattern 16 may be physically separated from the first pattern 12 and the second pattern 15 by the separation region 19.

[0125] The dummy pattern 16 can equalize or level out the reflectance and refractive index around the first pattern 12 and the second pattern 15. This can suppress visibility due to optical deviations.

[0126] Figure 9 is a schematic plan view of area A in Figure 8, enlarged.

[0127] As shown in Figure 9, the dummy pattern 16 may include a plurality of conductive lines 161 that intersect each other.

[0128] In some embodiments, the mesh structure of the dummy pattern 16 may be defined by repeating unit cells 162. A unit cell 162 may mean a space partitioned by interconnected conductive lines 161.

[0129] In one embodiment, the unit cell 162 can have various polygonal shapes such as a rhombus, rectangle, pentagon, or hexagon, and may, for example, have a square shape.

[0130] The pitch and line width of the unit cell 162 and conductive line 161 can be determined by considering light transmittance, radio wave transmittance and / or thermal conductivity, etc.

[0131] In one embodiment, the pitch (W4) of each unit cell 162 may be approximately 50 μm to 200 μm, or approximately 50 μm to 150 μm.

[0132] In one embodiment, the line width (W1) of the conductive line 161 of the dummy pattern 16 may be approximately 1.5 μm to 7 μm, or approximately 3 μm to 5 μm.

[0133] In some embodiments, the dummy pattern 16 may include segmented portions 163 that cut the conductive lines 161.

[0134] For example, each unit cell 162 may include at least one segmented portion 163. This allows each unit cell 162 to be electrically isolated, thereby suppressing the generation of strong electric fields and uneven current density caused by current flow between the unit cells 162.

[0135] In one embodiment, segmented portions 163 may be formed on all sides belonging to each unit cell 162. For example, one segmented portion 163 may be formed on each side of the unit cell 162.

[0136] In one embodiment, the segmented portions 163 formed on opposite sides of the unit cell 162 may be offset from each other in a direction perpendicular to the extension direction of the opposite sides. By staggering and randomly arranging the segmented portions 163, visibility can be further improved.

[0137] In some embodiments, the width (W3) of each segment 163 may be approximately 3.0 μm to 10 μm. Within this range, the optical transmittance of the dummy pattern 16 can be improved while suppressing current flow, electric field generation, and moiré pattern formation.

[0138] In one embodiment, the width (W2) of the separation region 19 may be approximately 3.0 μm to 10 μm. For example, the separation distance between the conductive pattern 11 and the dummy pattern 16 may be approximately 3.0 μm to 10 μm.

[0139] Within the aforementioned range, the visibility of the conductive pattern 11 can be suppressed, and the insulation between the dummy pattern 16 and the first pattern 12 and the second pattern 15 can be improved.

[0140] Figures 10 and 11 are schematic cross-sectional views showing an electromagnetic wave-transmitting film according to an exemplary embodiment, respectively.

[0141] As shown in Figure 10, the electromagnetic wave-transmitting film may include a substrate 90 and an electrode pattern layer 100 disposed on the substrate 90.

[0142] The substrate 90 may include, for example, a transparent resin material. For example, the substrate 90 may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulosin resins such as diacetylcellulose and triacetylcellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, polyolefins having a cyclo- or norbornene structure, and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamides; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; sulfurized polyphenylene resins; vinyl alcohol resins; vinylidene chloride resins; vinylbutyral resins; arylate resins; polyoxymethylene resins; epoxy resins; urethane or acrylic urethane resins; and silicone resins. These can be used individually or in combination of two or more.

[0143] In some embodiments, the substrate 90 may include an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0144] In some embodiments, the substrate 90 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or glass.

[0145] According to one embodiment, glass can be provided as the substrate 90. For example, the substrate 90 can be the base material of an object to which an electromagnetic wave-transmitting film is attached. The base material may include, for example, glass such as the exterior walls of a building, windows, home appliances, or automobiles.

[0146] In some embodiments, the dielectric constant of the substrate 90 can be adjusted to a range of approximately 2 to 12.

[0147] The electrode pattern layer 100 may include an electrode layer 130 containing the aforementioned conductive pattern.

[0148] The electrode layer 130 may include the aforementioned metal, alloy, metal oxide, or transparent conductive oxide. In one embodiment, the electrode layer 130 may include a mesh structure. In one embodiment, the electrode layer 130 may include a solid structure.

[0149] In one embodiment, the electrode pattern layer 100 may further include a lower insulating layer 120 disposed between the substrate 90 and the electrode layer 130, and / or an upper insulating layer 160 disposed on the electrode layer 130.

[0150] The lower insulating layer 120 can be provided as a base film or buffer layer for the electrode pattern layer 100. The lower insulating layer 120 can improve the mechanical properties and stability of the electrode pattern layer 100, such as crack resistance.

[0151] The upper insulating layer 160 can be provided as a passivation layer or a protective film. The upper insulating layer 160 can prevent oxidation and corrosion of the metal or metal oxide contained in the electrode pattern layer 100.

[0152] In one embodiment, the lower insulating layer 120 and the upper insulating layer 160 may include an organic insulating material such as epoxy resin, acrylic resin, or imide resin, or an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride.

[0153] In one embodiment, a transparent film can be provided as a lower insulating layer 120 and an upper insulating layer 160. For example, the transparent film may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulosin resins such as diacetylcellulose and triacetylcellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, polyolefins having a cyclo- or norbornene structure, and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamides; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; sulfurized polyphenylene resins; vinyl alcohol resins; vinylidene chloride resins; vinylbutyral resins; arylate resins; polyoxymethylene resins; epoxy resins; urethane or acrylic urethane resins, etc. These can be used individually or in combination of two or more.

[0154] In some embodiments, the dielectric constants of the lower insulating layer 120 and the upper insulating layer 160 can be adjusted to a range of about 2 to 12, respectively. If the dielectric constant exceeds about 12, the refraction and reflection of the transmitted electromagnetic waves may relatively increase due to the high dielectric constant.

[0155] As shown in Figure 11, the electrode pattern layer 100 may include a plurality of electrode layers arranged sequentially from the top surface of the substrate 90.

[0156] In one embodiment, the electrode pattern layer 100 may include a first electrode layer 130 disposed on a substrate 90 and a second electrode layer 150 disposed on the first electrode layer 130. The laminated structure of the electrode layers 130 and 150 can improve thermal resistance.

[0157] The first electrode layer 130 and the second electrode layer 150 may each include the first pattern 12 and / or the second pattern 15.

[0158] In one embodiment, each of the first electrode layer 130 and the second electrode layer 150 may include both the first pattern 12 and the second pattern 15. The conductive pattern 11 included in the first electrode layer 130 and the conductive pattern 11 included in the second electrode layer 150 may overlap each other in a planar direction (e.g., a third direction).

[0159] In one embodiment, either the first electrode layer 130 or the second electrode layer 150 may include the first pattern 12, and the other may include the second pattern 15. In this case, the second pattern 15 may be located within the hollow region 18 of the first pattern 12 when projected from a planar direction.

[0160] The first electrode layer 130 and the second electrode layer 150 may each contain the aforementioned metals, alloys, metal oxides, and / or transparent conductive oxides.

[0161] In some embodiments, the first electrode layer 130 and the second electrode layer 150 may contain different materials. For example, one of the first electrode layer 130 and the second electrode layer 150 may be a mesh pattern layer containing a metal mesh, and the other may be a transparent electrode layer containing a metal oxide or a transparent conductive oxide.

[0162] The laminated structure of a mesh pattern layer and a transparent electrode layer can improve both signal efficiency and thermal insulation. For example, the mesh pattern layer improves electromagnetic wave transmission performance, and the transparent electrode layer can lower the thermal transmittance.

[0163] In some embodiments, the electrode pattern layer 100 may further include an interlayer insulating layer 140 disposed between the electrode layers 130 and 150. For example, the first electrode layer 130 and the second electrode layer 150 may be separated from each other as distinct layers with the interlayer insulating layer 140 in between.

[0164] In one embodiment, the interlayer insulating layer 140 may include the aforementioned organic insulating material or inorganic insulating material. In one embodiment, the aforementioned transparent film can be provided as the interlayer insulating layer 140.

[0165] In some embodiments, the dielectric constant of the interlayer insulating layer 140 can be adjusted to a range of about 2 to 12.

[0166] According to an exemplary embodiment, the electrode pattern layer 100 may further include an adhesive layer 110. The adhesive layer 110 may be formed on one surface of the electrode pattern layer 100 that is in contact with the substrate 90. For example, the electrode pattern layer 100 may be attached to the substrate 90 by the adhesive layer 110.

[0167] In some embodiments, the adhesive layer 110 may include an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0168] The window structure according to the embodiment of the present invention may include the aforementioned conductive pattern or electromagnetic wave-transmitting film.

[0169] Figure 12 is a schematic cross-sectional view showing a window structure according to an exemplary embodiment.

[0170] As shown in Figure 12, the window structure may include a substrate 90, as well as an electrode pattern layer 100 and a low-emission layer 200 disposed on the substrate 90.

[0171] The low-emissivity layer 200 can have high thermal resistance. For example, the low-emissivity layer 200 can have a lower surface thermal emissivity than the electrode pattern layer 100. Emissivity refers to the ratio of energy radiated from the surface to the energy radiated by the blackbody. A blackbody is an object that absorbs radiation of all wavelengths incident from the outside.

[0172] In one embodiment, the low-emissivity layer 200 may be a low-emissivity coating layer, and the window structure can be provided as low-emissivity glass.

[0173] The low-emission layer 200 may include a conductive layer 220. The conductive layer 220 reflects the thermal radiation rays incident on the low-emission layer 200, allowing the window structure to have high thermal resistance and low thermal conductivity.

[0174] The conductive layer 220 may contain silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or alloys containing at least one of these. These may be included individually or in combination of two or more.

[0175] The conductive layer 220 may include a metal film and a metal protective film. For example, the conductive layer 220 may have a laminated structure of a metal film and a metal protective film, and may have a two-layer structure of metal protective film-metal film, or a three-layer structure of metal protective film-metal film-metal protective film.

[0176] The metal film may include metals such as Ag, Ni, Pd, Pt, Cu, Au, or alloys containing at least one of these.

[0177] For example, the metal film may include copper (Cu), silver (Ag), or a silver alloy (e.g., a silver-palladium-copper (APC) alloy). This improves the durability of the metal film and allows for selective reflection of infrared radiation, thereby reducing its absorption rate for infrared light.

[0178] The metal protective film can act as a barrier layer against oxygen or air that penetrates into the interior of the low-emission layer 200, thereby preventing oxidation or corrosion of the metal film.

[0179] In one embodiment, the metal protective film may contain Ni, Cr, or a Ni-Cr alloy, or a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), zinc oxide (ZnOx), or an inorganic insulating material such as SiOx or SiNx.

[0180] In one embodiment, the conductive layer 220 may have a solid structure. For example, the conductive layer 220 may not contain any empty regions such as slits, holes, or cavities. This allows the low-emissivity layer 200 to have higher thermal resistance and lower thermal transmittance, thereby further improving the thermal insulation of the window structure.

[0181] According to an exemplary embodiment, the low-emission layer 200 may further include a lower protective layer 210 formed on the bottom surface of the conductive layer 220 and an upper protective layer 230 formed on the top surface of the conductive layer 220.

[0182] The lower protective layer 210 and the upper protective layer 230 can prevent physical and chemical damage to the conductive layer 220 from the external environment, and can suppress the generation of haze due to heat, thereby improving transparency.

[0183] In one embodiment, the lower protective layer 210 and the upper protective layer 230 may include inorganic insulating materials such as metal oxides, metal nitrides, or metal oxynitrides.

[0184] For example, the lower protective layer 210 and the upper protective layer 230 may contain inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, zinc oxide, zinc nitride, or zinc oxynitride. In one embodiment, the inorganic insulating material may further contain metals such as Sn, Nb, Al, Sb, Mo, Cr, Ti, and Ni.

[0185] The low-emissivity layer 200 may have low absorbance for wavelengths in the infrared or far-infrared region and can have high reflectivity for thermal radiation. This allows the window structure to block heat transmitted from the outside or reflect heat that would otherwise be directed from the inside back into the room, thereby improving heating and cooling efficiency.

[0186] For example, the low-emission layer 200 has high shielding and reflectivity across all wavelengths, and can therefore block wavelengths in the transmission frequency band. For instance, electromagnetic waves transmitted from a base station may be reflected by the low-emission layer 200, resulting in reduced signal gain and coverage indoors, or electromagnetic waves transmitted from an indoor antenna may not be received by an external base station.

[0187] In exemplary embodiments, the electrode pattern layer 100 may be located on the substrate 90 at the same level or on the same layer as the low-emission layer 200. This blocks radiation in the infrared or far-infrared region and increases transmittance and signal efficiency for electromagnetic radiation, such as microwaves. This allows for improved signal coverage and gain while maintaining or improving thermal insulation.

[0188] Figure 13 is a schematic plan view showing a window structure according to an exemplary embodiment.

[0189] As shown in Figure 13, the electrode pattern layer 100 and the low-emission layer 200 may be assigned to different regions on the substrate 90.

[0190] The location and size of the regions where the electrode pattern layer 100 and the low-emission layer 200 are formed can be designed or adjusted considering the surrounding environment or antenna driving conditions. For example, indoor and outdoor temperature, humidity, substrate thickness and dielectric constant, surrounding structures, dielectric constant and physical properties of said structures, window structure height and signal transmission path, electromagnetic wave frequency, incident angle and transmission distance, etc., can be considered.

[0191] In one embodiment, the electrode pattern layer 100 can be placed in an area adjacent to the antenna on the upper surface of the substrate 90, or in an area where electromagnetic waves in the target frequency band are concentrated. For example, the low-emission layer 200 can be placed in an area on the upper surface of the substrate 90 where heat rays or energy emitted from a heat source are most strongly transmitted, or in an area where the heat flow due to radiation is strongest.

[0192] According to exemplary embodiments, the low-emission layer 200 can be formed by methods such as vacuum deposition, physical deposition, chemical deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, anodizing, cluster ion beam deposition, screen printing, gravure printing, flexographic printing, offset printing, inkjet coating, dispenser printing, and photolithography.

[0193] In one embodiment, the low-emission layer 200 can be formed by a sputtering process.

[0194] Before forming the low-emission layer 200, a mask can be placed over a portion of the upper surface of the substrate 90. The mask may contain a polymer resin, an organic and / or inorganic insulating material, or a protective film or the like may be used as the mask.

[0195] A low-emission layer 200 is formed, allowing the mask to be removed from the substrate 90. In one embodiment, the mask can be removed by peel-off or lift-off, or by wet etching or dry etching processes.

[0196] An electrode pattern layer 100 can be attached to the area on the upper surface of the substrate 90 from which the mask has been removed. The electrode pattern layer 100 can be attached via an adhesive layer 110. For example, the electrode pattern layer 100 may be bonded to the substrate 90 by a transfer method. By forming the electrode pattern layer 100 and the low-emission layer 200 in separate processes, damage to the electrode pattern layer 100 due to high temperatures and heating associated with the formation of the low-emission layer 200 can be prevented.

[0197] In some embodiments, the window structure may include an upper substrate and a lower substrate. For example, the window structure may take the form of a pair of glass.

[0198] In one embodiment, an air layer can be formed between the upper and lower substrates. The air layer may contain air or argon (Ar) gas. The air layer can further suppress heat flow by conduction and convection.

[0199] An electrode pattern layer 100 and a low-emission layer 200 can be formed on at least one of the upper and lower substrates. In one embodiment, the electrode pattern layer 100 and the low-emission layer 200 can be formed on one surface of the substrate facing the air layer.

[0200] The aforementioned window structure can be applied to various structures and objects such as windows of public transportation such as buses and subways, buildings, windows, vehicles, decorative structures, and directional signs (e.g., direction signs, emergency exit signs, emergency lights). The aforementioned window structure can improve thermal insulation and energy efficiency while increasing the efficiency of signal transmission and reception by antennas or radar.

[0201] The following are preferred embodiments to aid in understanding the present invention. These embodiments are merely illustrative and do not limit the scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications to the embodiments are possible within the scope of the present invention and the technical concept, and that such variations and modifications naturally fall within the scope of the appended claims. [Examples]

[0202] Experimental example Examples An electrode pattern layer containing the conductive pattern shown in Figures 1 and 4 was formed on glass (5mm thick). The electrode pattern layer was formed with a three-layer structure: a lower insulating layer, an electrode layer (IZO / APC / IZO), and an upper insulating layer. The electrode pattern layer was bonded to the glass via OCA (5μm thick).

[0203] The conductive pattern was formed to have a 3x3 arrangement. In each conductive pattern, the frame width (P) was 1,600 μm, the hollow region width (L1) was 1,400 μm, and the corner length (L2) was 25 μm. The width (L3) of the second pattern was set to 1,100 μm.

[0204] Comparative Example The electrode pattern layer was formed in the same manner as in Example 1, except that the first conductive pattern did not include corner portions. In the comparative example's conductive pattern, L2 was 0 μm, and the hollow region had a square shape.

[0205] Evaluation of radio wave transmission loss The amount of electromagnetic wave transmission through the window structure was evaluated. Electromagnetic waves were irradiated from the bottom surface of the lower substrate towards the top surface of the upper substrate. The electromagnetic wave transmission loss was measured in the frequency range of 27 GHz to 28.5 GHz as a relative value to the transmission amount in air.

[0206] Figure 14 is a graph showing the electromagnetic wave transmittance of electromagnetic wave-transmitting films for the examples and comparative examples.

[0207] As shown in Figure 14, the electromagnetic wave-transmitting film of the embodiment had high electromagnetic wave transmittance in the ultra-high frequency band, while the electromagnetic wave-transmitting film of the comparative example had low electromagnetic wave transmittance.

Claims

1. A first pattern having a cross-shaped hollow region inside, A conductive pattern comprising: a second pattern separated from the first pattern and positioned within the hollow region when projected from a planar direction.

2. The conductive pattern according to claim 1, wherein the outer periphery of the first pattern has a square shape.

3. The conductive pattern according to claim 2, wherein the first pattern includes a frame portion having a square ring shape and corner portions protruding from the four vertices of the frame portion toward the hollow region.

4. The conductive pattern according to claim 3, wherein the frame portion has a square ring shape.

5. The conductive pattern according to claim 3, wherein the corner portion has a square shape.

6. A conductive pattern according to claim 3, satisfying the following formula 3. [Formula 3] L １ / 100≦L ２ ≦L １ / 50 (In the above formula 3, L １ L is the width of the hollow region. ２ (This is the length of the aforementioned corner section.)

7. The conductive pattern according to claim 2, wherein the second pattern has a rectangular shape.

8. The periphery in the width direction of the second pattern is parallel to the periphery in the width direction of the first pattern. The conductive pattern according to claim 7, wherein the longitudinal periphery of the second pattern is parallel to the longitudinal periphery of the first pattern.

9. The conductive pattern according to claim 1, wherein the first pattern and the second pattern have a solid structure.

10. The conductive pattern according to claim 1, wherein either the first pattern or the second pattern has a solid structure, and the other includes a mesh structure.

11. The conductive pattern according to claim 1, further comprising a dummy pattern formed within the hollow region.

12. A conductive pattern according to claim 1, satisfying the following formula 1. [Formula 1] λ / 20 ≤ P ≤ λ / 2 (In the above equation 1, P is the width of the first pattern, and λ is the wavelength of the electromagnetic wave in the frequency band to be transmitted.)

13. It includes multiple electrode layers arranged sequentially, The conductive pattern according to claim 1, wherein each of the plurality of electrode layers includes at least one of the first pattern and the second pattern.

14. The conductive pattern according to claim 13, wherein the first pattern and the second pattern are included in mutually different electrode layers among the plurality of electrode layers.

15. The conductive pattern according to claim 14, wherein the hollow region of the first pattern covers the second pattern overall in the planar direction.

16. circuit board and The substrate includes an electrode pattern layer containing a conductive pattern, The aforementioned conductive pattern is A first pattern including a frame portion having a square ring shape, and corner portions protruding from the four vertices of the frame portion toward the center of the ring shape, An electromagnetic wave-transmitting film comprising: a second pattern separated from the first pattern and positioned in the center of the ring shape when projected from a planar direction.

17. The electromagnetic wave-transmitting film according to claim 16, wherein the corner portion has a square shape.

18. The electromagnetic wave transmitting film according to claim 16, wherein the electrode pattern layer comprises a first electrode layer disposed on the substrate and including the first pattern, and a second electrode layer disposed on the first electrode layer and including the second pattern.

19. The electromagnetic wave transmitting film according to claim 18, wherein in the planar direction, the second pattern does not overlap with the frame portion and the corner portion.

20. The electromagnetic wave transmitting film according to claim 18, wherein either the first electrode layer or the second electrode layer comprises a metal mesh, and the other comprises a metal oxide or a transparent conductive oxide.

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