Sensor mounting device and method for mounting the sensor mounting device to a power semiconductor device.

Abstract

The sensor mounting device (10) comprises a device body (11) having a first side (111) and an opposing second side (112), and a positioning structure (12) is disposed on the first side (111). The sensor mounting device (10) comprises at least one sensor position (14). At least one sensor element (15) is housed inside at least one sensor position (14). The sensor mounting device (10) further comprises at least one first mounting structure (18), the first mounting structure (18) configured to mount the sensor mounting device (10) to at least one corresponding second mounting structure (35) of a power semiconductor device (30).

Description

Technical Field

[0001] The present disclosure relates to a sensor mounting device, a power semiconductor device, and a method of mounting a sensor mounting device to a power semiconductor device.

Background Art

[0002] Monitoring of power semiconductor modules is becoming increasingly important in health monitoring, predictive maintenance, or improving response during failures. Therefore, various physical parameters such as chip temperature, input / output current, or applied voltage can be monitored temporarily or periodically during device operation. In particular, monitoring of output current is an important function not only for improving the operation and control of the power module of an application system but also for improving the control of the short-circuit fault mode. This monitoring is usually realized by a current sensor arranged adjacent to the output terminal or AC terminal of the power module or adjacent to the output bus bar of the application system. A power module with a built-in current sensor, particularly a Hall sensor, is a further option.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object is to attach a sensor element to a power semiconductor device in a simple manner while still enabling accurate measurement of the sensor element.

Means for Solving the Problems

[0004] This object is solved by the features of the independent claims. Advantageous embodiments are indicated in the dependent claims.

[0005] Embodiments of the present disclosure address, in whole or in part, the above disadvantages in the art, for example, as claimed in the independent claims. Further embodiments of a power semiconductor device, a sensor mounting device, and a method for mounting a sensor mounting device to a power semiconductor device are the subject matter of further claims.

[0006] A sensor mounting device is provided. The sensor mounting device comprises a device body having a first side and an opposing second side, the first side of which is provided with at least one positioning structure. The sensor mounting device further comprises at least one sensor position. At least one sensor element is housed inside the at least one sensor position. The sensor mounting device further comprises at least one first mounting structure, the at least one first mounting structure configured to mount the sensor mounting device to a corresponding at least one second mounting structure of a power semiconductor device.

[0007] This sensor mounting device provides a simple structure with a sensor element that can be easily integrated into existing power semiconductor devices. This makes it easier to utilize sensor elements for power semiconductor devices. Therefore, the setup and assembly of power semiconductor devices, such as power modules, becomes simpler and less expensive.

[0008] A further advantage is that power semiconductor devices, such as power modules, can be designed with greater flexibility. Customers need to mount sensor elements onto power modules. The first mounting structure simplifies assembly. The first mounting structure may be permanently or temporarily fixed to the second mounting structure. Thus, the sensor mounting device is permanently or temporarily fixed to the power semiconductor device. There is no need to manufacture a product with a sensor element built into the power semiconductor device, and a second product without a sensor element on the power semiconductor device. Using a mountable sensor mounting device eliminates the need to manufacture two versions of the product in parallel. This can further reduce manufacturing costs.

[0009] Furthermore, multiple power semiconductor devices equipped with a single common sensor mounting device can be operated using multiple sensor elements.

[0010] The positioning structure may be a recess and / or groove, a notch, a notch, a variety of depths, or a combination of these depths. Alternatively, the positioning structure may be a hole, such as a punched hole or a through hole. The positioning structure may be, for example, C-shaped, but may have any suitable geometric shape such as a circle, ellipse, triangle, square, rectangle, or other polygon. The shape of the positioning structure depends on the shape of the sensor element or part thereof to be positioned.

[0011] The sensor mounting device further comprises at least one first alignment structure. The first alignment structure facilitates the alignment of the sensor mounting device with the corresponding structure or mating structure of the power semiconductor device.

[0012] The first alignment structure may be located, for example, inside or adjacent to the positioning structure. Therefore, existing structures of power semiconductor devices can be used as further alignment structures to improve mounting. Because the sensor elements within the positioning structure are positioned in place by the first alignment structure, more accurate measurements can be performed using the sensor elements.

[0013] The first alignment structure includes, for example, a slot, which may be partially or completely penetrated by an energizing structure such as a terminal used as a further alignment structure of the power semiconductor device. Alternatively, the first alignment structure is a bed stop, so that at least a portion of the power semiconductor device is in contact with the first alignment structure or alignment device. Thus, the sensor element is properly aligned with respect to the energizing structure such as a terminal. A terminal partially or completely penetrating the slot, such as the output terminal of a power module, at least supports the alignment and fixing of the sensor mounting device. Because the sensor element is located near the slot and therefore near the terminal, more accurate measurements of the output current from, for example, the output terminal can be made.

[0014] The positioning structure may have different designs, as long as the magnetic core and / or sensor element can be fitted inside the positioning structure. At least one positioning structure is, for example, C-shaped, particularly a C-shaped recess, but can have any suitable geometric shape such as circular, elliptical, triangular, square, rectangular or other polygonal. Depending on the shape requirements of the magnetic core, the positioning structure, such as a recess, can have any suitable shape. The magnetic core includes a gap, and at least one sensor position is located inside the gap after the magnetic core is mounted. By placing at least one sensor position inside the gap, the configuration can be made as compact as possible. The magnetic core surrounds, for example, at least one first alignment structure. In this case, proper alignment of the terminals and the magnetic core is facilitated.

[0015] A cap may be provided to protect the magnetic core and positioning structure from dust, debris, and other contaminants, and to ensure the longest possible operating time without maintenance. The cap may have the same shape as the magnetic core so as to completely cover the magnetic core.

[0016] The main body of the sensor mounting device may be made of any electrical insulating material. In particular, the electrical insulating material is a thermoplastic or thermosetting resin filled with particles or fibers made of inorganic material. These materials are robust and easy to process. The entire sensor mounting device may also be made of an electrical insulating material such as a thermoplastic or thermosetting resin filled with particles or fibers. Furthermore, the device body may include transfer molded parts and / or injection molded parts, or may be manufactured by a transfer molding process and / or an injection molding process. Alternatively, the device body may be manufactured by performing other applicable molding processes. These methods are simple methods for manufacturing the device body and can also be used to manufacture the rest of the sensor mounting device.

[0017] At least one sensor element is a sensor for detecting electrical parameters and / or electromagnetic parameters and / or magnetic parameters, such as current, voltage, electric field, magnetic field, and / or electromagnetic field. These parameters are not exhaustive, and the sensor element may be any sensor element configured to measure the electrical and / or electromagnetic properties of the device.

[0018] As an example, at least one sensor element is a Hall sensor and / or a Rogowski coil and / or an optical fiber sensor. While a Hall sensor can be used to monitor the current of a power semiconductor module, other types of current sensors, such as Rogowski coils or optical fibers, are also applicable. For example, when using a Hall sensor, the sensor consists of a magnetic core surrounding various components, such as terminals of a power semiconductor device or output busbars of an application system. The magnetic core has a gap, and the sensor element, such as the Hall sensor itself, is placed in the gap. The sensor element measures the magnetic field generated by the output current. Combining the three types of sensors can provide more accurate measurements across different devices.

[0019] The sensor mounting device comprises at least one third mounting structure configured to mount the sensor mounting device to at least one other device corresponding to at least a fourth mounting structure, such as a cooling device and / or an assembly printed circuit board. By securing the sensor mounting device to multiple structures, a more stable overall structure is provided, and improved mechanical support is offered.

[0020] The first, second, third, and fourth mounting structures include clamps and / or shoulders and / or screws and / or threads and / or adhesives. The mounting structures are used for mounting and securing the sensor mounting device and may be integrated fixing structures, such as clamps, available for mating with the corresponding mounting structure of the power semiconductor device. Alternatively, the fixing structure of the sensor mounting device may be different components permanently or temporarily available on the sensor mounting device and / or the power semiconductor device.

[0021] The first mounting structure is, for example, a clamp, which is fixed to the corresponding second mounting structure, for example, a shoulder. Alternatively, the first and second mounting structures are fixed in the reverse manner. Thus, the first mounting structure is the shoulder, and the second mounting structure is the clamp. The same applies to the third and fourth mounting structures. Not only the first and second mounting structures, but also the third and fourth mounting structures correspond to each other. Alternative mounting structures and their counterparts are, for example, screws and threads and / or adhesives and other adhesives.

[0022] The additional sensor mounting device is mounted in the peripheral area of ​​the power semiconductor device, where at least some of the power terminals, particularly output terminals or AC terminals, are located. On the one hand, the sensor mounting device may be permanently connected, for example, by adhesive or by permanent fastening or screwing. On the other hand, fastening or screwing facilitates the temporary placement of the sensor mounting device.

[0023] Also, a power semiconductor device is provided. The power semiconductor device includes a housing body having a third side surface and at least one terminal, and the at least one terminal is disposed on the third side surface. The power semiconductor device further includes at least one second attachment structure, and the at least one second attachment structure is configured to be attached to a corresponding at least one first attachment structure of the sensor attachment device. The power semiconductor device may be any device that needs to monitor current. A typical power semiconductor device may be an IGBT, HEMT, MOSFET, thyristor, or diode based on silicon, silicon carbide, or gallium nitride. Further, the power semiconductor device can incorporate additional sensors, control devices, and / or passive devices. These devices may be disposed on a substrate structure or a control board.

[0024] At least one terminal of the power semiconductor device can be used as an additional alignment structure for improving the alignment between the power semiconductor device and the sensor attachment device, thus facilitating proper alignment between the current-carrying structure such as the terminal and the sensor element.

[0025] The realization of an additional sensor attachment device that can be easily fixed to the power semiconductor device provides a balance between customer requirements and the interests of power semiconductor device manufacturers in reducing the complexity of the product and the number of product variable parts related to manufacturing costs. Therefore, a single product without a sensor element such as a hall sensor is basic, and the sensor element can be optionally equipped according to customer requirements.

[0026] Furthermore, a method of attaching a sensor attachment device to a power semiconductor device is also provided. The method includes the steps of preparing a sensor attachment device, preparing a power semiconductor device, and attaching the sensor attachment device to the power semiconductor device, and at least one first attachment structure of the sensor attachment device is fixed to a corresponding at least one second attachment structure of the power semiconductor device.

[0027] This method provides for easily attaching a sensor mounting device to a power semiconductor device in order to measure the current of the power semiconductor device using at least one sensor element. By monitoring the operation of the power semiconductor device and adjusting and controlling the power semiconductor device based on the measured values, performance can be improved or a fault mode can be detected.

[0028] This method further includes aligning the sensor mounting device with the power semiconductor device, and at least one sensor position is arranged adjacent to the current-carrying structure of the power semiconductor device. Aligning the sensor mounting device with the power semiconductor device results in the alignment of at least one sensor element with respect to the current-carrying structure such as a terminal, enabling more accurate measurement of electrical, magnetic, and electromagnetic characteristics such as the output current. The current-carrying structure is used, for example, as at least one additional alignment structure and is fitted into the first alignment structure. For example, the current-carrying structure partially or completely penetrates at least one first alignment structure. Alternatively, the additional alignment structure abuts against at least one first alignment structure or alignment device. In this way, the current-carrying structure supports the alignment between the sensor mounting device and the power semiconductor device.

[0029] Also, the sensor mounting device may be attached to at least one other structure, for example, a cooling device and / or a printed circuit board. At least one third mounting structure of the sensor mounting device is fixed to at least one corresponding fourth mounting structure of at least one other structure. The cooling device may be a cooler or another heat sink. The cooler or another heat sink prevents overheating and maintains stable performance by cooling the power semiconductor device during operation.

[0030] This disclosure includes, based on embodiments and examples, several aspects of power semiconductor devices, sensor mounting devices, and methods for mounting sensor mounting devices to power semiconductor devices. All features described in relation to any one aspect are also disclosed in relation to other aspects in this disclosure, even if each feature is not explicitly referred to in the context of a particular aspect. For example, the methods described in this disclosure relate to methods for mounting sensor mounting devices to power semiconductor devices. Thus, features and advantages described in relation to power semiconductor devices or sensor mounting devices can also be applied to methods, and vice versa.

[0031] This disclosure may include various modifications and alternative forms, the details of which are shown in the drawings as examples and described in detail. It should be understood that this disclosure is not intended to limit itself to the specific embodiments and examples described. On the contrary, this disclosure encompasses all modifications, equivalents and alternatives that fall within the scope of this disclosure as defined by the appended claims.

[0032] The attached drawings are included to provide further understanding. In the drawings, elements of the same structure and / or function may be indicated by the same reference numerals. It should be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale. [Brief explanation of the drawing]

[0033] [Figure 1] This is a perspective view showing a power semiconductor device. [Figure 2] This is a perspective view showing the sensor mounting device. [Figure 3] This is a perspective view showing a sensor mounting device and a power semiconductor device. [Figure 4] This is a schematic diagram illustrating the steps of a method for attaching a sensor mounting device to a power semiconductor device. [Modes for carrying out the invention]

[0034] Figure 1 is a perspective view showing a power semiconductor device 30. The power semiconductor device 30 has at least one terminal 33, the at least one terminal 33 being located on a third side surface 34 of the power semiconductor device 30. Furthermore, the power semiconductor device 30 has at least one second mounting structure 35, the at least one second mounting structure 35 being configured to be fixed to at least one corresponding first mounting structure 18 (not shown in Figure 1) of a sensor mounting device 10 (not shown in Figure 1). The second mounting structure 35 is a shoulder in Figure 1, but may be a clamp, for example. Alternatively, the second mounting structure 35 may be a screw, thread and / or adhesive or other adhesive.

[0035] Figure 2 is a perspective view showing the sensor mounting device 10. The sensor mounting device 10 includes a device body 11 having a first side surface 111 and an opposing second side surface 112. The device body 11 can be made of any electrical insulating material. In particular, thermoplastic or thermosetting resin materials filled with particles or fibers made of inorganic material can be used. The device body 11 may be manufactured by transfer molding, injection molding, or other applicable molding processes.

[0036] The positioning structure 12 is positioned on the first side 111 of the device body 11 and is configured to accommodate the magnetic core 13 and at least one sensor position 14. In this embodiment, the positioning structure 12 is a recess, but may be a notch, notch, groove or various depths. In this embodiment, the recess is C-shaped, but depending on the shape of the magnetic core, it may have any suitable geometric shape such as a circle, ellipse, triangle, square, rectangle or other polygon. In this embodiment, the magnetic core 13 is a corresponding C-shape and has a gap 16. The sensor position 14 is positioned inside the gap 16 after the magnetic core 13 is installed. To prevent dust, debris, and other contamination from contaminating the magnetic core 13 or the positioning structure 12, the magnetic core 13 is covered by a corresponding C-shaped cap 20. The magnetic core 13 and the cap 20 may have any suitable geometric shape that fits together with each other, such as a circle, ellipse, triangle, square, rectangle or other polygon.

[0037] At least one sensor element 15 (shown as a dotted square in Figure 2) is housed inside the sensor position 14. The device body 11 of the sensor mounting device 10 provides a positioning structure 12, such as a recess, for arranging at least one sensor element 15 and a magnetic core 13. For example, the sensor element 15 may be a current sensor. The current sensor may be any type of sensor, including a Hall sensor and / or a Rogowski coil and / or an optical fiber sensor. Depending on the type or application of the semiconductor device, the device body 11 may incorporate one current sensor or multiple current sensors, particularly three current sensors in the case of a 6-pack module. In such an example, each sensor element 15 corresponds to one magnetic core 13. Alternatively, one or more sensor elements 15 themselves and the magnetic core 13 may be integral components of the sensor mounting device 10.

[0038] Inside the positioning structure 12 is a first alignment structure 50 configured to align the sensor mounting device 10 with the power semiconductor device 30.

[0039] Furthermore, the sensor mounting device 10 comprises at least one first mounting structure 18, the at least one first mounting structure 18 configured to mount the sensor mounting device 10 to at least one corresponding second mounting structure 35 (not shown in Figure 2) of the power semiconductor device 30. In Figure 2, the first mounting structure 18 is realized as a clamp for forming a clamp connection with the corresponding second mounting structure 35 (not shown in Figure 2). Furthermore, the sensor mounting device 10 comprises at least one third mounting structure 19, the at least one third mounting structure 19 configured to mount the sensor mounting device 10 to a corresponding mounting structure of additional equipment such as a cooler, a printed circuit board (e.g., a control board or an assembly board).

[0040] Figure 3 is a perspective view showing the sensor mounting device 10 and the power semiconductor device 30. The sensor mounting device 10 is the same as that shown in Figure 2, and the power semiconductor device 30 is the same as that shown in Figure 1 in cross-section. Therefore, a detailed explanation is omitted.

[0041] The first alignment structure 50, i.e., the slot 17, can be partially or completely passed through by at least one further alignment structure, for example, at least one terminal 33 of a power semiconductor device 30. It is also possible to use different energizing structures 90 and corresponding first alignment structures 50 as further alignment structures.

[0042] The first alignment structure 50 can have any geometric shape, as long as it is configured to couple with a corresponding feature of the power semiconductor device 30 or at least a part of the power semiconductor device 30, for example, at least one terminal 33 protruding from the third side surface 34. This facilitates proper alignment between the terminal 33 and the magnetic core 13, and therefore proper alignment with the sensor element 15 (shown as a dotted square in Figure 3).

[0043] As shown in Figure 3, the first mounting structure 18 is a clamp and is fixed to the corresponding second mounting structure 35, which is a shoulder. Alternatively, the first mounting structure 18 and the second mounting structure 35 are fastened in the reverse manner. Thus, the first mounting structure 18 is a shoulder and the second mounting structure 35 is a clamp.

[0044] As shown in Figure 3, the sensor mounting device 10 can be mounted on only one power semiconductor device 30. Alternatively, the sensor mounting device 10 may be implemented as a common device for multiple power semiconductor devices 30, for example, several equivalent power modules arranged in a row on a common substrate. In this embodiment, the sensor mounting device 10 may not only be fixed to the power module but may also be fixed via at least one third mounting structure 19 to at least one other device, for example, a cooler, heat sink, or a corresponding fourth mounting structure 41 (not shown in Figure 3) on a printed circuit board, such as a control board. This provides improved mechanical support. The third mounting structure 19 and the fourth mounting structure 41 (not shown in Figure 3) are interchangeable, as are the first mounting structure 18 and the second mounting structure 35. Alternative mounting structures and their counterparts are screws and threads and / or adhesives and other adhesives.

[0045] If necessary, further functionality or design options, such as alignment features for pin terminals or press-fit terminals and / or mechanical support features, and / or pins or bed stops for positioning the printed circuit board, can be added to the sensor mounting device 10. For this purpose, the sensor mounting device 10 further comprises an alignment structure for aligning the sensor mounting device 10 and the power semiconductor device 30 to, for example, a printed circuit board. The sensor mounting device 10 can be fixed to the printed circuit board using at least one third mounting structure 19 of the sensor mounting device 10. Furthermore, alignment pins that can pass through holes in the printed circuit board may be provided.

[0046] Figure 4 shows the steps for attaching the sensor mounting device 10 to the power semiconductor device 30. In the first step S1, the sensor mounting device 10 is prepared. In the second step S2, the power semiconductor device 30 is prepared.

[0047] In a further step S3, the sensor mounting device 10 is aligned with the power semiconductor device 30. At least one energizing structure 90, for example, terminal 33, is used as a further alignment structure and partially or completely penetrates the first alignment structure 50. Thus, the sensor element 15 is properly aligned with the terminal 33 used as the further alignment structure. The terminal 33, for example, the output terminal of a power module, partially or completely penetrates the slot 17 and supports the alignment and fixing of at least the sensor mounting device 10.

[0048] In step S4, the sensor mounting device 10 is attached to the power semiconductor device 30. At least one first mounting structure 18 of the sensor mounting device 10 is fixed to at least one corresponding second mounting structure 35 of the power semiconductor device 30.

[0049] In an optional step S5, the sensor mounting device 10 is mounted to at least one other device. At least one third mounting structure 19 of the sensor mounting device 10 is fixed to at least one corresponding fourth mounting structure 41 of at least one other device. The sensor mounting device 10 can be mounted to, for example, a cooling device and / or a printed circuit board. For this purpose, two different devices can be mounted to the sensor mounting device 10 using the third mounting structure 19. In this case, the cooling device comprises at least one fourth mounting structure 41, and the printed circuit board comprises at least one fifth mounting structure. The fifth mounting structure also includes at least one of a clamp, a shoulder, a screw, a thread, an adhesive or another adhesive.

[0050] The embodiments shown and described in the drawings represent exemplary embodiments of the power semiconductor device 30 and the sensor mounting device 10. Therefore, these embodiments do not constitute a complete list of all embodiments relating to improved configurations of the power semiconductor device 30 or the sensor mounting device 10. Actual configurations of the power semiconductor device 30 or the sensor mounting device 10 may differ from the exemplary embodiments described above. [Explanation of symbols]

[0051] 10 Sensor mounting device, 11 Device body, 111 First side, 112 Second side, 12 Positioning structure, 13 Magnetic core, 14 Sensor position, 15 Sensor element, 16 Magnetic core gap, 17 Slot, 18 First mounting structure, 19 Third mounting structure, 20 Cap, 30 Power semiconductor device, 33 Terminal, 34 Third side, 35 Second mounting structure, 41 Fourth mounting structure, 50 First alignment structure, 90 Current-carrying structure.

Claims

1. A sensor mounting device (10), The device comprises a body (11) having a first side (111) and an opposing second side (112), wherein at least one positioning structure (12) is disposed on the first side (111). It comprises at least one sensor position (14), and at least one sensor element (15) is housed inside the at least one sensor position (14), A sensor mounting device (10) comprising at least one first mounting structure (18), wherein the at least one first mounting structure (18) is configured to mount the sensor mounting device (10) to at least one corresponding second mounting structure (35) of a power semiconductor device (30).

2. The sensor mounting device (10) according to claim 1, wherein the positioning structure (12) is a recess and / or groove.

3. A sensor mounting device (10) according to claim 1 or 2, comprising at least one first alignment structure (50).

4. The sensor mounting device (10) according to claim 3, wherein the at least one first alignment structure (50) is housed inside or next to the at least one positioning structure (12).

5. The sensor mounting device (10) according to claim 3 or 4, wherein the at least one first alignment structure (50) includes a slot (17).

6. The sensor mounting device (10) according to any one of the preceding claims, wherein the magnetic core (13) is housed inside the at least one positioning structure (12).

7. The sensor mounting device (10) according to claim 6, wherein the magnetic core (13) surrounds the at least one first alignment structure (50).

8. The magnetic core (13) includes a gap (16), The sensor mounting device (10) according to any one of the preceding claims, wherein the at least one sensor position (14) is located in the gap (16).

9. The sensor mounting device (10) according to any one of the preceding claims, wherein the device body (11) includes an electrically insulating material including a transfer molded part and / or an injection molded part.

10. The sensor mounting device (10) according to any one of the preceding claims, wherein the at least one sensor element (15) is a sensor for detecting electrical parameters and / or electromagnetic parameters and / or magnetic parameters.

11. The sensor mounting device (10) according to any one of the preceding claims, wherein the at least one sensor element (15) is a sensor for detecting electric current.

12. The sensor mounting device (10) according to any one of the preceding claims, wherein the at least one sensor element (15) is a Hall sensor and / or a Rogowski coil and / or an optical fiber sensor.

13. It comprises at least one third mounting structure (19), The sensor mounting device (10) according to any one of the preceding claims, wherein the at least one third mounting structure (19) is configured to mount the sensor mounting device (10) to at least one corresponding fourth mounting structure (41) of at least one other device.

14. The sensor mounting device (10) according to any one of the preceding claims, wherein the at least one of the first, second, third, and fourth mounting structures (18, 35, 19, 41) includes at least one of a clamp, a shoulder, a screw, a thread, an adhesive, or another adhesive.

15. A power semiconductor device (30), The third aspect (34) and It comprises at least one terminal (33), the at least one terminal (33) being located on the third side surface (34), A power semiconductor device (30) comprising at least one second mounting structure (35), wherein the at least one second mounting structure (35) is configured to mount the power semiconductor device (30) to the corresponding at least one first mounting structure (18) of the sensor mounting device (10) according to any one of the preceding claims.

16. A method for attaching the sensor mounting device (10) described in claims 1 to 14 to a power semiconductor device (30), The steps include preparing the sensor mounting device (10), The steps include preparing the power semiconductor device (30), The steps include attaching the sensor mounting device (10) to the power semiconductor device (30), A method wherein the at least one first mounting structure (18) of the sensor mounting device (10) is fixed to the corresponding at least one second mounting structure (32) of the power semiconductor device (30).

17. The step includes aligning the sensor mounting device (10) with the power semiconductor device (30), The method according to claim 16, wherein the at least one sensor position (14) is located next to the energizing structure (90) of the power semiconductor device (30).

18. The method according to claim 16 or 17, wherein the sensor mounting device (10) is aligned with the power semiconductor device (30) by the energizing structure (90) which is fitted into the at least one first alignment structure (50).

19. The steps include attaching the sensor mounting device (10) to at least one other structure, The method according to any one of claims 16 to 18, wherein the at least one third mounting structure (19) of the sensor mounting device (10) is fixed to the corresponding at least one fourth mounting structure (41) of the at least one other device.

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