Flexible radio frequency transition unit and electronic system including the flexible radio frequency transition unit

Abstract

Disclosed are a flexible radio frequency transition unit and an electronic system including the flexible radio frequency transition unit. The flexible radio frequency transition unit is configured to electrically connect a first electronic component and a second electronic component and to facilitate radio frequency telecommunication between them. The transition unit comprises a flexible dielectric film and a microstrip transmission line formed on the flexible dielectric film, the microstrip transmission line including an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. Furthermore, the transition unit is configured to enable radio frequency telecommunication between the first electronic component and the second electronic component over the entire range of the transition angle. The electronic system utilizes radio frequency communication and includes a first electronic component, a second electronic component, and the transition unit.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims priority to U.S. Patent Application No. 18 / 649,797, filed on April 29, 2024, and U.S. Provisional Patent Application No. 63 / 468,141, filed on May 22, 2023, the entire disclosure of which is incorporated herein by reference.

Background Art

[0002] The present disclosure generally relates to flexible radio frequency transition sections and electronic systems including such flexible radio frequency transition sections.

[0003] The complexity of printed circuit boards is increasing rapidly. This increase in complexity is due to various factors including higher frequencies, higher bandwidths, and / or miniaturization of components. With such an increase in complexity, it has become difficult to manufacture printed circuit boards with signal traces at desired numbers, densities, and positions, but there are no viable alternatives at present. As a result, printed circuit board manufacturers are in a situation where they have to make a trade - off between signal quality and signal density. These issues are expected to further increase in the future. Therefore, improved flexible radio frequency transition sections and / or electronic systems including such flexible radio frequency transition sections are required.

Summary of the Invention

[0004] This specification discloses a flexible radio frequency transition section and an electronic system including the flexible radio frequency transition section. The flexible radio frequency transition section is configured to electrically connect a first electronic component and a second electronic component and to facilitate radio frequency telecommunication between the first electronic component and the second electronic component. The flexible radio frequency transition section includes a flexible dielectric film and a microstrip transmission line. The microstrip transmission line is formed on the flexible dielectric film and includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. The transition section is configured to electrically connect the first electronic component and the second electronic component and to enable radio frequency telecommunication between the first electronic component and the second electronic component over the entire range of the transition angle.

[0005] The electronic system utilizes radio frequency communication and includes a first electronic component, a second electronic component, and the aforementioned transition section. The electrically conductive signal trace described above is configured to electrically connect the first electronic component and the second electronic component and to transmit a radio frequency signal between the first electronic component and the second electronic component. [Brief explanation of the drawing]

[0006] [Figure 1] This is a schematic diagram illustrating an example of a flexible radio frequency transition section that may be included in the electronic system described herein. [Figure 2] This is a schematic cross-sectional view of the flexible radio frequency transition section of Figure 1, cut along line 2-2 in Figure 1. [Figure 3] This is a schematic cross-sectional view of the flexible radio frequency transition section of Figure 1, cut along line 3-3 in Figure 1. [Figure 4] This is a schematic cross-sectional view of the flexible radio frequency transition section of Figure 1, cut along line 4-4 in Figure 1. [Figure 5] This is a schematic plan view showing an example of a flexible radio frequency transition section according to this disclosure. [Figure 6]This is a schematic plan view showing an example of a flexible radio frequency transition section according to this disclosure. [Figure 7] This is a schematic side view showing an example of the region of the flexible radio frequency transition section according to this disclosure. [Figure 8] This is a schematic cross-sectional view showing an example of the region of the flexible radio frequency transition section according to this disclosure. [Figure 9] This is a schematic cross-sectional view showing an example of the region of the flexible radio frequency transition section according to this disclosure. [Figure 10] This is a schematic side view showing an example of a connector that electrically connects three flexible radio frequency transition sections according to the present disclosure. [Figure 11] This figure shows an example of the transition angle of the flexible radio frequency transition section according to this disclosure. [Figure 12] This figure shows an example of the transition angle of the flexible radio frequency transition section according to this disclosure. [Figure 13] This figure shows an example of the transition angle of the flexible radio frequency transition section according to this disclosure. [Figure 14] This figure shows an example of the transition angle of the flexible radio frequency transition section according to this disclosure. [Figure 15] This figure shows an example of the transition angle of the flexible radio frequency transition section according to this disclosure. [Figure 16] This is a schematic diagram illustrating an example of an electronic system as described in this disclosure. [Figure 17] This is a schematic diagram illustrating an example of an electronic system as described in this disclosure. [Figure 18] This is a schematic diagram illustrating an example of an electronic system as described in this disclosure. [Figure 19] This is a schematic diagram illustrating an example of an electronic system as described in this disclosure. [Figure 20] This is a schematic diagram illustrating an example of an electronic system as described in this disclosure. [Figure 21] This is a schematic diagram illustrating an example of an electronic system as described in this disclosure. [Modes for carrying out the invention]

[0007] Figures 1 to 21 illustrate examples of a flexible radio frequency transition unit 100 and / or an electronic system 10 including the flexible radio frequency transition unit 100 according to the present disclosure. In each of Figures 1 to 21, elements that serve the same or at least substantially the same purpose are denoted by the same reference numerals. These elements are not necessarily described in detail with reference to each of Figures 1 to 21. Similarly, not all elements are indicated by reference numerals in each of Figures 1 to 21, but for consistency, relevant reference numerals may be used herein. Elements, components, and / or features described with reference to one or more of Figures 1 to 21 may be included in and / or used with any of Figures 1 to 21 without departing from the scope of the present disclosure.

[0008] Generally, elements that are likely to be included in a particular embodiment are shown with solid lines, and optional elements are shown with dashed lines. However, even elements shown with solid lines are not necessarily essential in all embodiments, and in some embodiments they may be omitted without departing the scope of this disclosure.

[0009] As shown collectively in Figures 1 to 21, the flexible radio frequency transition section 100 may also be referred to herein as the transition section 100, the interconnect 100, and / or the electrical interconnect 100. The transition section 100 is configured to connect a first electronic component 20 and a second electronic component 30, and may be configured, for example, to facilitate radio frequency (RF) telecommunications between them. In such a configuration, as will be described later, the transition section 100, the first electronic component 20, and the second electronic component 30 may at least partially form and / or define the electronic system 10. The transition section 100 includes a flexible dielectric film 120 and a microstrip transmission line 200. The microstrip transmission line 200 includes an electrically conductive signal trace 210 and an electrically conductive ground plane 240 for the electrically conductive signal trace 210.

[0010] The flexible dielectric film 120 has flexibility, supports the microstrip transmission line 200, and / or may include any suitable structure in which the microstrip transmission line 200 (including its electrically conductive signal trace 210 and electrically conductive ground plane 240) can be formed and / or defined. Examples of the flexible dielectric film 120 (which may also be referred to herein as film 120) include flexible polymer films and / or flexible polyimide films. In some examples, as described below, the flexible dielectric film 120 may include a plurality of film layers 122 and / or may be defined by the plurality of film layers 122. These examples are shown in FIGS. 1-4 and FIGS. 8-9.

[0011] The transition portion 100 is configured such that the electrically insulating region 124 of the film 120 extends between the electrically conductive signal trace 210 and the electrically conductive ground plane 240 and / or electrically insulates the electrically conductive signal trace and the electrically conductive ground plane from each other. This can be achieved in any suitable manner.

[0012] As an example, in the uppermost example of the microstrip transmission line 200 shown in FIG. 1, the electrically insulating region 124 may include and / or be the insulating film region 132. This insulating film region 132 may be defined on the surface of the flexible dielectric film 120 and / or the surface of its film layer 122. In other words, in such an example, the electrically conductive signal trace 210 and the electrically conductive ground plane 240 may be formed and / or defined on the surface of the flexible dielectric film 120 and / or the film layer 122, or on the same surface. Further, or alternatively, the electrically conductive signal trace 210 and the electrically conductive ground plane 240 may be spaced apart from each other on the surface of the flexible dielectric film 120 and / or the film layer 122 by the electrically insulating region 124.

[0013] As another example, in the example of the lowermost stage of the microstrip transmission line 200 shown in FIG. 1 and the example shown in relation to the cross-sectional view of FIG. 4, the electrical insulation region 124 may include an insulating film layer 126. In such an example, as shown in FIG. 4, the electrically conductive signal trace 210 is formed on the trace side 128 of the insulating film layer 126, and the electrically conductive ground plane 240 may be formed on the plane side 130 of the insulating film layer 126.

[0014] As described above, the flexible dielectric film 120 may include a plurality of film layers 122. In such an example, the electrically conductive signal trace 210 may be disposed and / or defined between two adjacent trace support film layers 134, as shown in FIGS. 2 to 4. Similarly, the electrically conductive ground plane 240 may be disposed and / or defined between two adjacent plane support film layers 136. In other words, the electrically conductive signal trace 210 may be at least partially or completely sandwiched and / or surrounded by the trace support film layer 134. Further, or alternatively, the electrically conductive ground plane 240 may be at least partially or completely sandwiched and / or surrounded by the plane support film layer 136. In some examples, as shown in FIGS. 2 to 3, the trace support film layer 134 may also be the plane support film layer 136. Alternatively, as shown in FIG. 4, at least one trace support film layer 134 may be different from at least one plane support film layer 136.

[0015] The microstrip transmission line 200 may be any suitable structure including electrically conductive signal traces 210 and / or electrically conductive ground plane 240. In some examples, the microstrip transmission line 200 may be configured to transmit high-frequency electrical signals along a signal conduction axis 212, as shown in Figures 1 to 4. The signal conduction axis 212 extends parallel to and / or coincides with the longitudinal axis of the microstrip transmission line 200, the electrically conductive signal traces 210 and / or the electrically conductive ground plane 240, and / or may also be referred to herein as the longitudinal axis.

[0016] Within the scope of this disclosure, the microstrip transmission line 200 may be a long microstrip transmission line. In this view, the ratio of length to width of the microstrip transmission line 200, the ratio of length to width of the electrically conductive signal trace 210, and / or the ratio of length to width of the electrically conductive ground plane 240 may be greater than 1. Examples of such ratios include at least 5, at least 10, at least 25, at least 50, at least 100, at least 250, at least 500, at least 1000, and at most 25000, at most 10000, at most 5000, and / or at most 1000.

[0017] The microstrip transmission line 200 may be formed from and / or defined by any suitable material. For example, the electrically conductive signal trace 210 may be formed from and / or defined by electrically conductive trace material, metal trace material, aluminum, and / or copper. As an additional example, the electrically conductive ground plane 240 may be formed from and / or defined by electrically conductive plane material, metal plane material, aluminum, and / or copper.

[0018] As described above, the transition section 100 is flexible. From this viewpoint, the transition section 100 may be configured to bend or flex without impairing its ability to provide radio frequency telecommunications and / or other functions disclosed herein. In other words, the transition section 100 may be configured to electrically connect the first electronic component 20 and the second electronic component 30 and to enable radio frequency telecommunications between them over the entire range of transition angles, as indicated by reference numeral 102 in Figures 2-4 and 11-15. In other words, a single transition section 100 may be configured to bend and / or flex to any desired transition angle 102 within the range of transition angles. Examples of transition angle ranges include at least 0 degrees, at least 5 degrees, at least 10 degrees, at least 15 degrees, at least 20 degrees, at least 30 degrees, at least 45 degrees, at least 90 degrees, and at most 350 degrees, at most 340 degrees, at most 330 degrees, at most 320 degrees, at most 310 degrees, at most 300 degrees, at most 270 degrees, at most 240 degrees, at most 210 degrees, at most 180 degrees, at most 150 degrees, at most 120 degrees, and / or at most 90 degrees. As shown in Figures 1 to 4, the transition angle 102 may be defined in a plane extending parallel to, or at least substantially parallel to, the signal conduction axis 212. Furthermore, or alternatively, the transition angle 102 may be defined in a plane perpendicular to, or at least substantially perpendicular to, the width of the microstrip transmission line, the width of the electrically conductive ground plane, the width of the electrically conductive signal trace, the trace side 128, and / or the plane side 130.

[0019] The transition section 100 may be bent and / or flexed to exhibit a plurality of transition angles, including at least a first transition angle 104 and a second transition angle 106, as shown in Figure 14. Such a configuration may result in improved spatial flexibility with respect to the arrangement of the first electronic component 20 and / or the second electronic component 30. Such a configuration may be referred to as an S-shape, at least a partial S-shape, a sigmoid shape, and / or at least a partial sigmoid shape configuration of the transition section 100.

[0020] As shown in Figures 1-2, 4, and 7, the transition section 100 may include an electrically conductive trace interface chip 220 (which may also be referred to herein as the trace chip 220). If present, the trace chip 220 may extend from the electrically conductive signal trace 210 and be configured to form an electrical connection with the first electronic component 20 and / or the second electronic component 30. As shown, the trace chip 220 may extend perpendicular to, or at least substantially perpendicular to, the longitudinal axis of the microstrip transmission line 200 and / or the electrically conductive signal trace 210. Furthermore, as shown, the trace chip 220 may extend through a corresponding region of the flexible dielectric film 120 and / or its film layer 122, thereby enabling and / or facilitating an electrical connection with the first electronic component and / or the second electronic component.

[0021] Within the scope of this disclosure, the transition unit 100 may include a plurality of trace chips 220. For example, as shown in Figure 7, the plurality of trace chips 220 may extend from a single electrically conductive signal trace 210 and / or one end thereof, and / or provide electrical communication. As another example, as shown in Figures 2 and 4, the transition unit 100 may include a first electrically conductive trace interface chip 222 (also referred to as the first trace chip 222) and a second electrically conductive trace interface chip 224 (also referred to as the second trace chip 224).

[0022] A first trace chip 222 may extend from a first trace end region 216 of an electrically conductive signal trace 210 and be configured to form an electrical connection with a first electronic component 20. Similarly, a second trace chip 224 may extend from a second trace end region 218 of an electrically conductive signal trace 210 and be configured to form an electrical connection with a second electronic component 30. As shown, the first trace chip 222 may extend perpendicular to, or at least substantially perpendicular to, the first trace end region 216 and / or extend through the corresponding first region of the flexible dielectric film. Similarly, the second trace chip 224 may extend perpendicular to, or at least substantially perpendicular to, the second trace end region 218 and / or extend through the corresponding second region of the flexible dielectric film.

[0023] As shown in Figures 1, 3, and 8-9, the transition section 100 may include an electrically conductive plane interface chip 246 (which may also be referred to herein as the plane chip 246). If present, the plane chip 246 may extend from the electrically conductive ground plane 240 and be configured to form an electrical connection with the first electronic component 20 and / or the second electronic component 30. As illustrated, the plane chip 246 may extend perpendicular to, or at least substantially perpendicular to, the longitudinal axis of the microstrip transmission line 200 and / or the electrically conductive ground plane 240. Furthermore, as illustrated, the plane chip 246 may extend through a corresponding region of the flexible dielectric film 120 and / or its film layer 122, thereby enabling and / or facilitating an electrical connection with the first electronic component and / or the second electronic component.

[0024] Within the scope of this disclosure, the transition section 100 may include a plurality of plane chips 246. For example, as shown in the example with respect to the trace chip 220 in Figure 7, the plurality of plane chips 246 may extend from a single electrically conductive ground plane 240 and / or one end thereof and / or provide electrical communication. As another example, as shown in Figure 3, the transition section 100 may include a first electrically conductive plane interface chip 248 (also referred to as the first plane chip 248) and a second electrically conductive plane interface chip 250 (also referred to as the second plane chip 250).

[0025] The first plane tip 248 may extend from a first plane end region 242 of an electrically conductive ground plane 240 and be configured to form an electrical connection with the first electronic component 20. Similarly, the second plane tip 250 may extend from a second plane end region 244 of an electrically conductive ground plane 240 and be configured to form an electrical connection with the second electronic component 30. As shown, the first plane tip 248 may extend perpendicular to, or at least substantially perpendicular to, the first plane end region 242 and / or through the corresponding first region of the flexible dielectric film. Similarly, the second plane tip 250 may extend perpendicular to, or at least substantially perpendicular to, the second plane end region 244 and / or through the corresponding second region of the flexible dielectric film.

[0026] In some examples, as best shown in Figures 2, 4, and 8-9, the transition section 100 and / or its microstrip transmission line 200 may include a plurality of stacked electrically conductive signal traces 210, each including at least a first stacked electrically conductive signal trace and a second stacked electrically conductive signal trace. In such a configuration, corresponding regions of the flexible dielectric film 120, e.g., corresponding film layers 122, may extend between and / or electrically isolate adjacent electrically conductive signal traces 210 (e.g., a first stacked electrically conductive signal trace and a second stacked electrically conductive signal trace). Also in such a configuration, as shown in Figures 2 and 4, the transition section 100 and / or its microstrip transmission line 200 may include conductive vias 226 that electrically connect adjacent electrically conductive signal traces 210 (e.g., a first electrically conductive signal trace and a second electrically conductive signal trace). Such a configuration can enable and / or facilitate an improvement in the current carrying capacity of the microstrip transmission line 200.

[0027] As shown in Figures 1, 6, and 10, the transition section 100 may include a plurality of microstrip transmission lines 200. The plurality of microstrip transmission lines 200 may include a plurality of electrically conductive signal traces 210 and a plurality of electrically conductive ground planes 240. In other words, each microstrip transmission line of the plurality of microstrip transmission lines 200 may include a corresponding electrically conductive signal trace 210 and a corresponding electrically conductive ground plane 240. The plurality of electrically conductive signal traces may extend parallel to each other, or at least substantially parallel, and / or extend within a single layer of the transition section 100 (which may also be referred to herein as a single trace layer). Similarly, the plurality of electrically conductive ground planes may extend parallel to each other, or at least substantially parallel, and / or extend within a single layer of the transition section 100 (which may also be referred to herein as a single plane layer). Multiple electrically conductive signal traces and / or multiple electrically conductive ground planes may extend along and / or parallel to the signal conduction axis 212.

[0028] If the transition section 100 includes multiple microstrip transmission lines 200, the pitch, spacing, and / or minimum distance 214 (see Figure 1) between adjacent electrically conductive signal traces 210 can have and / or be defined as any appropriate size. For example, the pitch, spacing, and / or minimum distance may be at most 1000 micrometers, at most 900 micrometers, at most 800 micrometers, at most 700 micrometers, at most 600 micrometers, at most 500 micrometers, at most 400 micrometers, at most 300 micrometers, at most 200 micrometers, or at most 100 micrometers. For relatively small pitches, e.g., less than 300 micrometers, less than 200 micrometers, or less than 100 micrometers, such small pitches can be facilitated by forming adjacent electrically conductive signal traces 210 on different metal layers and / or different film layers 122 within the transition section 100.

[0029] Continuing to refer to Figures 1 and 6, if the transition section 100 includes a plurality of microstrip transmission lines 200, the transition section 100 may further include a plurality of ground connections 252. If present, the ground connections 252 may be configured to electrically connect the central regions of adjacent electrically conductive ground planes to one another, thereby reducing the likelihood of transmission line mode effects occurring within the microstrip transmission lines 200. The ground connections 252 may extend perpendicular to, or at least substantially perpendicular to, the signal conduction axis 212.

[0030] As described above, each electrically conductive ground plane 240 may include a corresponding first plane end region 242 and a corresponding second plane end region 244. As shown in Figure 1, the corresponding first plane end regions of adjacent electrically conductive ground planes may communicate with each other and / or be electrically connected to each other. Similarly, the corresponding second plane end regions of adjacent electrically conductive ground planes may also communicate with each other and / or be electrically connected to each other.

[0031] As described above, the transition unit 100 can electrically connect the first electronic component 20 and the second electronic component 30 within the electronic system 10. In other words, in the electronic system 10, the transition unit 100 can be configured to transmit radio frequency signals between the first electronic component and the second electronic component. For example, as shown in Figures 1 to 4, the first electronic component 20 may include one or more first contact points 22, and the second electronic component 30 may include one or more second contact points 32. In such a configuration, an electrically conductive trace interface chip 220 and / or an electrically conductive plane interface chip 246 may be configured to electrically interface with and / or electrically contact the first contact points 22 and / or the second contact points 32, thereby enabling and / or facilitating electrical connection. Examples of the first electronic component 20 and / or the second electronic component 30 include a device under test (DUT), a probe core, a daughter card, and / or a printed circuit board.

[0032] The electrical connection between the first electronic component and the second electronic component can be achieved in any suitable manner. For example, system 10 may further include a connector 40. If present, the connector 40 may be configured to hold the transition section 100 in a state of electrical communication with the first electronic component 20 (or its first contact position 22) and / or the second electronic component 30 (or its second contact position 32). The connector 40 may include any suitable structure. For example, the connector 40 may include a pressure connector configured to impart a retaining force to the transition section 100 in order to hold the transition section 100 in a state of electrical communication with the first electronic component 20 and / or the second electronic component 30. An example of a pressure connector is an elastic material and / or spring configured to generate a retaining force.

[0033] Within the scope of this disclosure, the transition unit 100 can electrically connect the first electronic component 20 and the second electronic component 30 without using solder, and / or without using solder connections between the transition unit and the first electronic component and / or between the transition unit and the second electronic component. For example, an electrically conductive signal trace 210 can electrically connect the first electronic component 20 and the second electronic component 30 without using solder connections. As another example, the electrical connection between the electrically conductive signal trace and the first electronic component does not involve solder. As yet another example, the electrical connection between the electrically conductive signal trace and the second electronic component does not involve solder.

[0034] As described above, the transition section 100 can be used to enable and / or facilitate a variety of novel and beneficial spatial arrangements between the first electronic component 20 and the second electronic component 30. Furthermore, or alternatively, the transition section 100 can be used to enable and / or facilitate the construction of an electronic system 10 that would otherwise be required to be built on a single printed circuit board, thereby mitigating the spatial constraints and / or signal quality-to-signal density trade-offs that may exist when a system functionally equivalent to the electronic system 10 is fabricated on a single printed circuit board. Furthermore, or alternatively, the transition section 100 can be used to enable and / or facilitate the construction of an electronic system 10 in which wear-prone and / or failure-prone components can be easily replaced without having to replace all components that may be present on a single printed circuit board. Examples of such spatial arrangements and / or electronic systems 10 are shown in Figures 11 to 21.

[0035] Figures 10 and 11 show that when the transition section 100 is used in combination with the connector 40, the transition section 100 can be used to join two or more electronic components that are orthogonal to each other, or at least substantially orthogonal, and oriented at right angles or at least substantially at right angles. Figure 12 shows that the transition section 100 can be used to join a first electronic component 20 and a second electronic component 30 at an acute transition angle 102, and Figure 13 shows that the transition section 100 can be used to join a first electronic component 20 and a second electronic component 30 at an obtuse transition angle 102. Figure 14 shows that a single transition section 100 can accommodate multiple transition angles 102, and Figure 15 shows that a single transition section 100 can be bent up to a transition angle 102 of 180 degrees. Both examples may enable and / or facilitate improved spacing and / or denser stacking of the first electronic component 20 and the second electronic component 30, thereby providing advantages in terms of space saving and / or thermal efficiency with respect to the electronic system 10.

[0036] Figure 16 is a bottom view of an electronic system 10 in the form of a probe system 11 configured to test the operation of a device under test (DUT) 50, and Figure 17 is a side view of the probe system of Figure 16. The probe system includes a transition section 100 integrated with the probe core 12 of the probe system. In Figures 16 and 17, the transition section 100 is used to electrically connect a plurality of second electronic components 30 formed on the transition section 100 to both a first electronic component 20 in the form of a film probe assembly 24 including a plurality of probes 26, and a third electronic component 38 in the form of a primary printed circuit board. Connectors 40 in the form of a spring package and space transformer of the probe system are used to maintain electrical communication between the first electronic component 20, the third electronic component 38, and the transition section 100.

[0037] Figure 18 shows a configuration similar to that of Figures 16 and 17, but in Figure 18, the second electronic component 30 is a separate printed circuit board or daughter card that communicates with the probe core 12 via the transition section 100. In Figure 18, the second electronic component 30 is oriented perpendicular to, or at least substantially perpendicular to, both the first electronic component 20 and the third electronic component 38. Figure 19 shows an alternative orientation of the components shown in Figure 18. In Figure 19, the first electronic component 20, the second electronic component 30, and the third electronic component 38 extend parallel to each other, or at least substantially parallel to each other. Figure 20 shows that multiple different and / or separate second electronic components 30 can communicate with the probe core 12 via the transition section 100, or via a single transition section 100. Figure 21 highlights the spatial flexibility provided by the electronic system 10 utilizing the transition section 100. In particular, such an electronic system 10 may utilize a combination of rigid components 60 and flexible components 70 to improve overall space efficiency.

[0038] The configurations shown in Figures 16 to 21 may enable and / or facilitate the placement of one or more of the second electronic components 30 closer to the DUT 50 than is possible when using a conventional probe system that does not include the transition section 100. The configurations shown in Figures 16 to 21 may further, or alternatively, enable and / or facilitate higher frequency communication between the second electronic components 30 and the DUT 50 than is possible when using a conventional probe system. The configurations shown in Figures 16 to 21 may further, or alternatively, enable and / or facilitate the use of different second electronic components 30, thereby enabling different types of tests to be performed on the device under test 50 without the need to replace the entire probe core 12 as required in a conventional probe system.

[0039] Continuing to refer to Figures 16 to 21, the electronic system 10 in the form of the probe system 11 may include one or more additional structures that can be used in conjunction with a conventional probe system. For example, the probe system 11 may include a chuck 13 that defines a support surface 14 which can be configured to support the DUT 50. Examples of the chuck 13 include a temperature-controlled chuck, a thermal chuck, a vacuum chuck, and / or an electrically shielded chuck. Another example is the probe system 11 which may include a signal generation and analysis assembly 15 which can be configured to provide a test signal to the DUT and / or receive a result signal from the DUT, such as via the probe core 12. Examples of the signal generation and analysis assembly 15 include a power supply, an AC power supply, a DC power supply, a function generator, a signal analyzer, an electromagnetic signal generator, and / or an electromagnetic signal detector. Yet another example is the probe system 11 which may include a moving assembly 16 which can be configured to operatively translate and / or rotate the probe core 12 and the DUT 50 relative to each other. Examples of the moving assembly 16 include linear actuators, rotary actuators, rack and pinion mechanisms, lead screw and nut mechanisms, ball screw and nut mechanisms, motors, linear motors, servo motors, stepping motors, and / or piezoelectric actuators.

[0040] DUT50 may include any suitable structure configured to be tested by the probe system 11. Examples of DUT50 include electronic devices, optical devices, and / or optoelectronic devices. In some examples, DUT50 includes and / or may include a single, individual, and / or packaged DUT50. In some examples, DUT50 may be formed on and / or disposed on a substrate, the substrate may contain multiple distinct DUT50s.

[0041] In this specification, the term "and / or" placed between a first element and a second element means (1) the first element, (2) the second element, or (3) either the first element or the second element. If multiple elements are listed by "and / or," it is similarly interpreted, meaning "one or more" of the combined elements. Elements other than those specified by the "and / or" phrase may exist, whether related to the specified element or not. Therefore, as a non-restrictive example, a reference to "A and / or B," when used in conjunction with open wording such as "comprising," may in one embodiment refer only to A, optionally including elements other than B; in another embodiment refer only to B, optionally including elements other than A; and in yet another embodiment refer to both A and B, optionally including other elements. These elements may include elements, actions, structures, processes, operations, values, etc.

[0042] In this specification, when the phrase “at least one” is used in relation to an element list consisting of one or more elements, it should be understood to mean at least one element selected from any one or more elements contained in the element list, and not necessarily requiring at least one of every element explicitly enumerated in the element list, nor does it exclude any combination of elements contained in the element list. This definition also allows for the presence of elements other than those explicitly identified in the element list referred to by the phrase “at least one,” whether or not they are related to those identified elements. Thus, as an unrestrictive example, “at least one of A and B” (or synonymously, “at least one of A or B,” or “at least one of A and / or B”) may, in one embodiment, refer to one or more A's, but not B, and optionally include elements other than A; in another embodiment, refer to one or more B's, but not A, and optionally include elements other than B; and in yet another embodiment, refer to both one or more A's and one or more B's, but optionally include other elements. In other words, the phrases “at least one,” “one or more,” and “and / or” are open expressions that function both conjugately and selectively. For example, the expressions “at least one of A, B, and C,” “at least one of A, B, or C,” “one or more of A, B, and C,” “one or more of A, B, or C,” and “A, B, and / or C” can mean A only, B only, C only, A and B, A and C, B and C, A and B and C, and may also include any combination of at least one other element with any of these.

[0043] If any patent, patent application, or other document incorporated by reference herein (1) defines a term in a manner that conflicts with the non-incorporated portion of this disclosure, and / or (2) conflicts with any of the non-incorporated portions of this disclosure or any other document incorporated by reference, the non-incorporated portion of this disclosure shall prevail, and such term or incorporated disclosure shall apply dominantly only with respect to the document in which the term was defined and / or which incorporated disclosure was originally included.

[0044] In this specification, the terms “adapted” and “configured” mean that an element, component, or other subject matter is designed and / or intended to perform a given function. Therefore, the use of the terms “adapted” and “configured” should not be interpreted as merely meaning that a given element, component, or other subject matter is “capable of” performing that function, but rather that the element, component, and / or other subject matter is identified, created, implemented, utilized, programmed, and / or designed for the purpose of performing that function. Furthermore, an element, component, and / or other subject matter described as adapted to perform a particular function may also be described as configured to perform that function alternatively or additionally, and vice versa, within the scope of this disclosure.

[0045] In this specification, when the words “for example,” “as an example,” and / or simply “example” are used in relation to one or more components, features, details, structures, embodiments, and / or methods relating to this disclosure, they are intended to indicate that the components, features, details, structures, embodiments, and / or methods described are exemplary and non-exclusive examples of the components, features, details, structures, embodiments, and / or methods relating to this disclosure. Accordingly, such components, features, details, structures, embodiments, and / or methods are not intended to be restrictive, essential, exclusive, or exhaustive, and structurally and / or functionally similar and / or equivalent components, features, details, structures, embodiments, and / or methods are also included within the scope of this disclosure.

[0046] In this specification, the phrase “at least substantially” may, when modifying a degree or relationship, include not only the “substantial” degree or relationship described, but the entire extent of the described degree or relationship. The substantial amount of the described degree or relationship may include at least 75% of the described degree or relationship. For example, if an object is said to be at least substantially formed from a material, it includes an object in which at least 75% of the object is formed from that material, and also an object in which it is entirely formed from that material. Similarly, if a first length is at least substantially the same length as a second length, it includes cases in which the first length is within 75% of the second length, and also cases in which the first length is the same length as the second length.

[0047] Exemplary and non-exclusive examples of flexible radio frequency transition units and electronic systems as provided in this disclosure are shown in the paragraphs listed below. It is also within the scope of this disclosure that individual steps of the methods described herein, including those included in the paragraphs listed below, may be additionally or alternatively referred to as “steps for” to perform the operations described.

[0048] A1. A flexible radio frequency transition unit configured to electrically connect a first electronic component and a second electronic component, and to facilitate radio frequency telecommunication between the first electronic component and the second electronic component, wherein the transition unit is: Flexible dielectric film, A flexible radio frequency transition section comprising a microstrip transmission line formed on a flexible dielectric film, wherein the microstrip transmission line includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace.

[0049] A2. The transition portion according to paragraph A1, wherein the flexible dielectric film comprises at least one of a flexible polymer film and a flexible polyimide film.

[0050] A3. The transition portion according to paragraph A1 or A2, wherein the electrically insulating region of the flexible dielectric film extends between the electrically conductive signal trace and the electrically conductive ground plane, thereby electrically insulating the electrically conductive signal trace from the electrically conductive ground plane.

[0051] A4. The transition portion according to paragraph A3, wherein the electrically insulating region of the flexible dielectric film includes an insulating film layer, the electrically conductive signal trace is formed on the trace side of the insulating film layer, and the electrically conductive ground plane is formed on the plane side of the insulating film layer.

[0052] A5. The transition portion according to paragraph A3 or A4, wherein the electrically insulating region of the flexible dielectric film includes an insulating film region defined on at least one surface of the flexible dielectric film and the film layer of the flexible dielectric film, and both the electrically conductive signal trace and the electrically conductive ground trace are formed on the surface.

[0053] A6. The above flexible dielectric film is a transition region according to any one of A1 to A5, comprising multiple film layers.

[0054] A7. The transition region according to A6, wherein the electrically conductive signal trace is defined between two adjacent trace-supporting film layers among the plurality of film layers.

[0055] A8. The transition region according to A6 or A7, wherein the electrically conductive ground plane is defined between two adjacent plane-supporting film layers among the plurality of film layers.

[0056] A9. The transition region described in paragraph A8, which is subordinate to paragraph A7, wherein the two adjacent plain support film layers are the two adjacent trace support film layers.

[0057] A10. The transition portion according to paragraph A8, which is dependent on paragraph A7, wherein at least one of the two adjacent plain support film layers is different from at least one of the two adjacent trace support film layers.

[0058] A11. The transition section according to any of paragraphs A1 to A10, wherein the electrically conductive signal trace is defined by at least one of an electrically conductive trace material, a metal trace material, aluminum, and copper.

[0059] A12. The transition section according to any of paragraphs A1 to A11, wherein the electrically conductive ground plane is defined by at least one of an electrically conductive plane material, a metallic plane material, aluminum, and copper.

[0060] A13. The transition unit according to any one of paragraphs A1 to A12, wherein the transition unit electrically connects a first electronic component and a second electronic component and is configured to enable radio frequency telecommunication between the first electronic component and the second electronic component over the entire range of the transition angle.

[0061] A14. The range of the above transition angles is, (i) at least 0 degrees, at least 5 degrees, at least 10 degrees, at least 15 degrees, at least 20 degrees, at least 30 degrees, at least 45 degrees, or at least 90 degrees, (ii) Transitions as described in paragraph A13, spanning between a maximum of 350 degrees, a maximum of 340 degrees, a maximum of 330 degrees, a maximum of 320 degrees, a maximum of 310 degrees, a maximum of 300 degrees, a maximum of 270 degrees, a maximum of 240 degrees, a maximum of 210 degrees, a maximum of 180 degrees, a maximum of 150 degrees, a maximum of 120 degrees, or a maximum of 90 degrees.

[0062] A15. The transition section according to A13 or A14, wherein the transition section includes a first transition angle and a second transition angle, and both the first transition angle and the second transition angle are selected from within the range of the above transition angles.

[0063] A16. The transition portion according to any of paragraphs A1 to A15, wherein the transition portion further includes an electrically conductive trace interface chip extending from the electrically conductive signal trace and configured to form an electrical connection with one of the first electronic component and the second electronic component, wherein the electrically conductive trace interface chip extends perpendicularly or substantially perpendicularly with respect to the longitudinal axis of the electrically conductive signal trace, and further optionally, the electrically conductive trace interface chip extends through a corresponding region of the flexible dielectric film.

[0064] A17. The above transition section further, (i) A first electrically conductive trace interface chip extending from the first trace end region of the electrically conductive signal trace and configured to form an electrical connection with the first electronic component, (ii) A transition portion according to any of paragraphs A1 to A16, comprising: (ii) a second electrically conductive trace interface chip extending from a second trace end region opposite to the first trace end region of the electrically conductive signal trace and configured to form an electrical connection with the second electronic component, wherein optionally each trace interface chip extends perpendicularly or substantially perpendicularly to the corresponding trace end region, and optionally each trace interface chip extends through the corresponding region of the flexible dielectric film.

[0065] A18. The transition portion further includes an electrically conductive plane interface chip extending from the electrically conductive ground plane and configured to form an electrical connection with one of the first electronic component and the second electronic component, wherein the electrically conductive plane interface chip extends perpendicularly or substantially perpendicularly with respect to the electrically conductive ground plane, and further optionally, the electrically conductive plane interface chip extends through a corresponding region of the flexible dielectric film, as described in any of paragraphs A1 to A17.

[0066] A19. The above transition section further, (i) A first electrically conductive plane interface chip extending from the first plane end region of the electrically conductive ground plane and configured to form an electrical connection with the first electronic component, (ii) A transition portion according to any of paragraphs A1 to A18, comprising: (ii) a second electrically conductive plane interface chip extending from a second plane end region opposite to the first plane end region of the electrically conductive ground plane and configured to form an electrical connection with the second electronic component, wherein optionally each plane interface chip extends perpendicularly or substantially perpendicularly to the corresponding plane end region, and optionally each plane interface chip extends through the corresponding region of the flexible dielectric film.

[0067] A20. The transition section according to any one of paragraphs A1 to A19, wherein the microstrip transmission line includes a plurality of stacked electrically conductive signal traces, each including at least a first stacked electrically conductive signal trace and a second stacked electrically conductive signal trace, the corresponding region of the flexible dielectric film extends between the first stacked electrically conductive signal trace and the second stacked electrically conductive signal trace, electrically insulating the first stacked electrically conductive signal trace and the second stacked electrically conductive signal trace, and further, the microstrip transmission line includes conductive vias that electrically connect the first stacked electrically conductive signal trace and the second stacked electrically conductive signal trace.

[0068] A21. The transition section according to any of paragraphs A1 to A20, wherein the transition section includes a plurality of microstrip transmission lines, each of which includes a plurality of electrically conductive signal traces and a plurality of electrically conductive ground planes, and each of the plurality of microstrip transmission lines includes a corresponding electrically conductive signal trace from the plurality of electrically conductive signal traces and a corresponding electrically conductive ground plane from the plurality of electrically conductive ground planes.

[0069] A22. Each of the above multiple electrically conductive signal traces is, (i) extending parallel or substantially parallel to each other, and / or (ii) The transition section described in paragraph A21, which extends within a single trace layer of the above transition section.

[0070] A23. Each of the above multiple electrically conductive ground planes is: (i) extending parallel or substantially parallel to each other, and / or (ii) A transition section according to any of paragraphs A21 to A22, which extends within a single plane layer of the above transition section.

[0071] A24. The above-mentioned multiple electrically conductive signal traces extend along the signal conduction axis, the transition section described in any of paragraphs A21 to A23.

[0072] A25. The transition section described in paragraph A24, wherein the minimum distance between adjacent electrically conductive signal traces, measured in a direction perpendicular to the above signal conduction axis, is at most 1000 micrometers, at most 900 micrometers, at most 800 micrometers, at most 700 micrometers, at most 600 micrometers, at most 500 micrometers, at most 400 micrometers, at most 300 micrometers, at most 200 micrometers, or at most 100 micrometers.

[0073] A26. The above-mentioned plurality of electrically conductive ground planes extend along the signal conduction axis, the transition section described in any of paragraphs A21 to A25.

[0074] A27. The transition section described in any of paragraphs A21 to A26, further comprising a plurality of ground connection sections that electrically connect the central regions of adjacent electrically conductive ground planes among the plurality of electrically conductive ground planes.

[0075] A28. The transition section described in paragraph A27, wherein the plurality of ground connections extend perpendicularly or substantially perpendicularly with respect to the signal conduction axis.

[0076] A29. The transition section according to any of paragraphs A21 to A28, wherein each of the plurality of electrically conductive ground planes includes a corresponding first plane end region and a corresponding second plane end region, and the corresponding first plane end regions of adjacent electrically conductive ground planes among the plurality of electrically conductive ground planes communicate electrically with each other, and furthermore, the corresponding second plane end regions of adjacent electrically conductive ground planes communicate electrically with each other.

[0077] B1. An electronic system that utilizes radio frequency communication, The first electronic component and The second electronic component, An electronic system comprising the transition section described in paragraphs A1 to A29, wherein the electrically conductive signal trace is configured to electrically connect the first electronic component and the second electronic component and to transmit a radio frequency signal between the first electronic component and the second electronic component.

[0078] B2. The system according to paragraph B1, further comprising a connector configured to maintain the transition unit in an electrical communication state with at least one of the first electronic component and the second electronic component.

[0079] B3. The system according to paragraph B2, wherein the connector includes a pressure connector configured to apply a retaining force to the transition portion in order to maintain the transition portion in an electrical communication state with at least one of the first electronic component and the second electronic component.

[0080] B4. The system according to paragraph B3, wherein the pressure connector includes at least one of an elastic material and a spring configured to generate the holding force.

[0081] B5. In the above system, (i) The electrically conductive signal traces electrically connect the first electronic component and the second electronic component without using soldering connections; (ii) The electrical connection between the electrically conductive signal trace and the first electronic component shall not be soldered; (iii) The electrical connection between the electrically conductive signal trace and the second electronic component shall not be soldered; A system described in any of paragraphs B1 to B4, wherein at least one of the following conditions is met. [Industrial applicability]

[0082] The electronic systems and transitions disclosed herein are applicable to the manufacturing and testing industries of electronic devices.

[0083] The information disclosed above is considered to encompass several distinct inventions, each possessing independent utility. While each of these inventions is disclosed in its preferred form, the specific embodiments disclosed and illustrated herein should not be construed as restrictive, as numerous variations are possible. The subject matter of the invention includes all novel and non-obvious combinations and partial combinations of the various elements, features, functions, and / or characteristics disclosed herein. Similarly, where a claim contains "one" or "first" element or equivalent expression, the claim should be understood to include one or more such elements, and not to require or exclude two or more such elements.

[0084] The following claims are intended to specifically identify particular combinations and subcombinations relating to one of the disclosed inventions that are novel and non-obvious. Inventions embodied in other combinations or subcombinations of features, functions, elements and / or characteristics may be claimed in this application or related applications by amendment of the claims or by filing new claims. Such amended or new claims, whether relating to a different invention or the same invention, and whether different, broader, narrower, or equivalent in scope compared to the original claims, shall be deemed to be included in the subject matter of the inventions disclosed herein.

Claims

1. A flexible radio frequency transition unit is configured to electrically connect a first electronic component and a second electronic component, and to facilitate radio frequency electrical communication between the first electronic component and the second electronic component, wherein the transition unit is Flexible dielectric film, The system comprises a microstrip transmission line formed on the flexible dielectric film, wherein the microstrip transmission line includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. The transition unit is a flexible radio frequency transition unit configured to electrically connect the first electronic component and the second electronic component, and to enable radio frequency telecommunication between the first electronic component and the second electronic component over the entire range of the transition angle.

2. The transition portion according to claim 1, wherein the flexible dielectric film comprises at least one of a flexible polymer film and a flexible polyimide film.

3. The transition portion according to claim 1, wherein the electrically insulating region of the flexible dielectric film extends between the electrically conductive signal trace and the electrically conductive ground plane, thereby electrically insulating the electrically conductive signal trace and the electrically conductive ground plane.

4. The transition portion according to claim 3, wherein the electrically insulating region of the flexible dielectric film includes an insulating film layer, the electrically conductive signal trace is formed on the trace side of the insulating film layer, and the electrically conductive ground plane is formed on the plane side of the insulating film layer.

5. The transition portion according to claim 3, wherein the electrically insulating region of the flexible dielectric film includes an insulating film region defined on at least one surface of the flexible dielectric film and the film layer of the flexible dielectric film, and both the electrically conductive signal trace and the electrically conductive ground trace are formed on the surface.

6. The transition section according to claim 1, wherein the flexible dielectric film comprises a plurality of film layers, the electrically conductive signal trace is defined between two adjacent trace-supporting film layers among the plurality of film layers, and the electrically conductive ground plane is defined between two adjacent plane-supporting film layers among the plurality of film layers.

7. The transition section according to claim 6, wherein the two adjacent plain support film layers are the two adjacent trace support film layers.

8. The transition portion according to claim 6, wherein at least one of the two adjacent plain support film layers is different from at least one of the two adjacent trace support film layers.

9. The transition section according to claim 1, wherein the range of the transition angle extends over an angle from at least 0 degrees to a maximum of 180 degrees.

10. The transition section according to claim 1, wherein the transition section includes a first transition angle and a second transition angle, and both the first transition angle and the second transition angle are selected from within the range of the transition angles.

11. The transition unit according to claim 1, further comprising an electrically conductive trace interface chip that extends from the electrically conductive signal trace and is configured to form an electrical connection with one of the first electronic component and the second electronic component.

12. The transition section further, (i) A first electrically conductive trace interface chip extending from the first trace end region of the electrically conductive signal trace and configured to form an electrical connection with the first electronic component, (ii) The transition unit according to claim 1, comprising: (ii) a second electrically conductive trace interface chip extending from a second trace end region opposite to the first trace end region of the electrically conductive signal trace and configured to form an electrical connection with the second electronic component.

13. The transition portion according to claim 1, further comprising an electrically conductive plane interface chip extending from the electrically conductive ground plane and configured to form an electrical connection with one of the first electronic component and the second electronic component.

14. The transition section further, (i) A first electrically conductive plane interface chip extending from a first plane end region of the electrically conductive ground plane and configured to form an electrical connection with the first electronic component, (ii) The transition unit according to claim 1, comprising: (ii) a second electrically conductive plane interface chip extending from a second plane end region opposite to the first plane end region of the electrically conductive ground plane and configured to form an electrical connection with the second electronic component.

15. The transition section according to claim 1, wherein the microstrip transmission line includes a plurality of stacked electrically conductive signal traces, each including at least a first stacked electrically conductive signal trace and a second stacked electrically conductive signal trace, the corresponding region of the flexible dielectric film extends between the first stacked electrically conductive signal trace and the second stacked electrically conductive signal trace, electrically insulating the first stacked electrically conductive signal trace and the second stacked electrically conductive signal trace, and further, the microstrip transmission line includes conductive vias that electrically connect the first stacked electrically conductive signal trace and the second stacked electrically conductive signal trace.

16. The transition unit according to claim 1, wherein the transition unit includes a plurality of microstrip transmission lines, the plurality of microstrip transmission lines include a plurality of electrically conductive signal traces and a plurality of electrically conductive ground planes, and each of the plurality of microstrip transmission lines includes a corresponding electrically conductive signal trace from the plurality of electrically conductive signal traces and a corresponding electrically conductive ground plane from the plurality of electrically conductive ground planes.

17. The transition section according to claim 16, wherein the plurality of electrically conductive signal traces extend along the signal conduction axis, and the minimum distance between adjacent electrically conductive signal traces, measured in a direction perpendicular to the signal conduction axis, is at most 1,000 micrometers.

18. The transition section according to claim 16, further comprising a plurality of ground connection sections that electrically connect the central regions of adjacent electrically conductive ground planes among the plurality of electrically conductive ground planes.

19. The transition unit according to claim 16, wherein each of the plurality of electrically conductive ground planes includes a corresponding first plane end region and a corresponding second plane end region, the corresponding first plane end regions of adjacent electrically conductive ground planes among the plurality of electrically conductive ground planes communicate electrically with each other, and further, the corresponding second plane end regions of adjacent electrically conductive ground planes communicate electrically with each other.

20. An electronic system that utilizes radio frequency communication, The first electronic component and The second electronic component, An electronic system comprising the transition unit described in claim 1, wherein the electrically conductive signal trace is configured to electrically connect the first electronic component and the second electronic component and to transmit a radio frequency signal between the first electronic component and the second electronic component.

21. The system according to claim 20, further comprising a connector configured to maintain the transition unit in an electrical communication state with at least one of the first electronic component and the second electronic component.

22. The system according to claim 21, wherein the connector includes a pressure connector configured to apply a retaining force to the transition portion in order to maintain the transition portion in an electrical communication state with at least one of the first electronic component and the second electronic component.

23. The system according to claim 22, wherein the pressure connector includes at least one of an elastic material and a spring configured to generate the holding force.

24. In the aforementioned system, (i) The electrically conductive signal trace electrically connects the first electronic component and the second electronic component without using soldering connections; (ii) The electrical connection between the electrically conductive signal trace and the first electronic component does not involve soldering; (iii) The electrical connection between the electrically conductive signal trace and the second electronic component does not involve soldering; The system according to claim 20, wherein at least one of the following is true.

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