Module for a device for heat treatment of workpieces
The use of a thermally conductive base block with LED luminous areas and a suction device addresses the inefficiencies of existing heat treatment technologies, offering a cost-effective, energy-efficient, and precise heat treatment solution with high power density and scalability for workpieces.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- ILTHERM GMBH
- Filing Date
- 2024-05-28
- Publication Date
- 2026-06-30
Smart Images
Figure 2026521376000001_ABST
Abstract
Description
[Technical Field]
[0001] This disclosure relates to a module for a device for heat treatment of a workpiece, a device for heat treatment of a workpiece having at least one of the above modules, and a suction device for aspirating particles and / or gases released or produced during heat treatment of a workpiece. [Background technology]
[0002] The heat treatment of a workpiece is part of a very large number of different production and processing processes. These include, for example, ceramic sintering, melting or heat treatment of metals or ores, firing of cement or cement precursors, processing of mineral particles, and many others.
[0003] In the sense of the present invention, the term “workpiece” includes all predominantly solid materials to be processed. These can exist, for example, as green compacts, blanks, or semi-finished products, or in the form of larger, more cohesive units. Non-cohesive units, such as powders, green powders, or other precursors, are also included under the term “workpiece.”
[0004] In the sense of the present invention, heat treatment of a workpiece is understood to mean, in principle, all types of treatments in which the workpiece is heated at least partially. These include, for example, sintering processes, surface treatments, melting processes, firing of layers on a surface, and drying of surfaces, in particular drying of paints and varnishes on a surface.
[0005] In principle, heat treatment of a workpiece is possible through a wide variety of heating processes (for example, electrical heating, heating by exothermic reactions, especially combustion of gases, or absorption of radiation).
[0006] For the efficient design of the heating process, among other things, energy consumption is a relevant variable. In this case, heating of the workpiece by absorption of radiation is particularly advantageous from the perspective of efficiency. On the other hand, the devices (e.g., laser systems) required for this purpose are more expensive to procure and maintain than, for example, simple gas burners.
[0007] In addition to energy consumption, gas burners have the disadvantage that they can only be controlled in a limited manner on time and precisely.
[0008] Various devices and methods for generating and using radiation for the heat treatment of workpieces are known from the prior art, but these devices and methods have the individual disadvantages and limitations described above from the viewpoints of flexibility, process speed, and energy efficiency.
Summary of the Invention
Problems to be Solved by the Invention
[0009] Therefore, an object of the present invention is to provide an efficient and powerful device for the heat treatment of workpieces.
Means for Solving the Problems
[0010] This object is achieved according to the present invention by a module for a device for heat treatment of a workpiece according to claim 1 and by a device for heat treatment of a workpiece having said module according to claim 24.
[0011] According to the present invention, a module for a device for heat treatment of a workpiece has the following features, namely, - a thermally conductive base block with a base block side, and - at least one electrical input, and - An LED luminous area, wherein the LED luminous area is formed by at least one LED module, the at least one LED module is disposed on a side portion of the base block and is conductively connected to an electrical input portion. - A module luminous area having a module power density (BPD), wherein the module power density (BPD) corresponds to the total power emitted as light of the LED modules disposed on the side portion of the base block per total area of the side portion of the base block. - A separation layer between the LED module and the side portion of the base block, wherein the separation layer is electrically insulating and thermally conductive. and has The module further includes at least one electrical output portion, the at least one LED module is conductively connected to the at least one electrical output portion, the separation layer is electrically insulating, and the module power density (BPD) is greater than 20 W / cm 2 more.
[0012] The thermally conductive base block is not limited to a rectangular block with respect to its geometry. For example, the base block can have a basic shape of a triangle, a hexagon, or another polygon having a base block thickness d. The base material of the base block preferably consists of copper. The reason is that copper has particularly good thermal conductivity.
[0013] The at least one electrical input portion and output portion can be provided in the form of simple contacts or plugs.
[0014] The LED module preferably has an electrical contacting option, a socket, and an LED chip. The LED module can have a plurality of sockets and LED chips.
[0015] Furthermore, the size of the LED module can be matched to the size of the base block, and it is designed to precisely cover the area on the side of the base block in order to reduce the number of components, and consequently reduce complexity and manufacturing costs. In particularly advantageous embodiments, the isolation layer and the LED luminous area are created directly on top of the base block.
[0016] The LED luminous area is formed by the area of all the LED chips located within the LED module, which is positioned on the side of the base block. Therefore, the LED luminous area is the sum of their areas on the module that actually emit light. The emitted light is in the wavelength range of 100 nm to 1000 nm, preferably in the wavelength range of 200 nm to 600 nm.
[0017] The module luminous area describes the entire area of the module formed by the base block sides. Non-luminescent intermediate spaces between LED modules or LED chips also contribute to this.
[0018] Module power density (BPD) describes the power emitted as light per unit area of the base block side. The base block side of the module includes an emitting area (the area of the LED chip) and a non-emitting area (e.g., the middle space and edges).
[0019] The isolation layer is preferably formed of aluminum nitride. The decisive factor is the selection of a material that has good thermal conductivity as well as electrical insulation properties. The isolation layer does not need to be applied over the entire area of the base block side. For example, the isolation layer can be provided only in the area where the LED module is located.
[0020] The thickness of the separation layer is preferably less than 500 μm, more preferably less than 425 μm, more preferably less than 350 μm, more preferably less than 275 μm, more preferably less than 200 μm, more preferably less than 100 μm, more preferably less than 40 μm, more preferably less than 10 μm, and more preferably less than 2 μm. Such a smaller thickness makes it possible to optimize heat dissipation from the LED module.
[0021] In a particularly preferred embodiment, the separation layer has a thickness of (approximately) 375 μm, which can be an optimized compromise between heat dissipation and stability.
[0022] In the sense of the present invention, the term “workpiece” includes all materials to be processed that are mostly solid. These can exist, for example, as green compacts, blanks, or semi-finished products, or in the form of larger, more cohesive units. Non-cohesive units (e.g., powders, green powders, or other precursors) are also included under the term “workpiece.”
[0023] 20W / cm 2 A module power density (BPD) greater than the given one has proven particularly advantageous. This is because, given the corresponding module power density (BPD), a very large number of materials can already be heat-treated.
[0024] For example, 20 W / cm² 2 The module power density (BPD) already allows for sufficient energy input into the surface of several workpieces to be heat-treated. For example, it is possible to heat workpieces that absorb heat very well up to a temperature of 1100°C.
[0025] In principle, there is a relationship between module power density (BPD) and the achievable temperature of the workpiece to be heat-treated. This relationship is not necessarily linear with respect to temperature, because various factors are deterministic of the achievable temperature over a wide range of temperatures. In particular, over high temperature ranges, the achievable temperature may depend on the power density in the form of a fourth root.
[0026] Further increases in module power density (BPD) are advantageous because they enable additional thermal treatment possibilities, such as heat treatment at even higher temperatures.
[0027] The module according to the present invention has the advantage of producing a cost-effective and robust alternative to lasers or other optical systems, while simultaneously providing high feasible power. The use of LEDs enables particularly energy-efficient, and therefore cost-effective, light generation during operation. Furthermore, LEDs are more cost-effective to procure than, for example, laser systems. In addition, the module power density (BPD) can be precisely and easily adjusted via the power supply unit, which constitutes an advantage compared to, for example, a gas burner.
[0028] The module's preferred planar basic geometry further enables the module's scalability, allowing for a larger area of the workpiece to be heat-treated.
[0029] Furthermore, due to the possible module power density (BPD), additional light focusing is not required, which allows for the elimination of, for example, complex optical units.
[0030] Furthermore, the device according to the present invention enables homogeneous heat treatment of workpieces in a remarkably simple manner.
[0031] The objectives described above are similarly achieved by a device according to the present invention for heat treatment of a workpiece, the device comprising at least one module according to the present invention.
[0032] While a device can already be formed from a single module, it is advantageous for a device to be formed from multiple modules. This allows for a simpler implementation of the scalability being addressed.
[0033] 20W / cm 2 Due to the extremely high power density, a large amount of heat can be generated, which should be conducted away from the LED module to avoid damage. A thermally conductive separator conducts heat to a thermally conductive base block, and the thermally conductive base block then conducts heat away from the LED module.
[0034] In one embodiment of the present invention, the module according to the present invention comprises a cooling device configured to bring a base block into thermal contact with a coolant. If the thermally conductive base block is unable to dissipate sufficient heat from the LED module due to environmental factors, it can be cooled by the cooling device so that the maximum amount of heat that can be dissipated is increased.
[0035] In a preferred embodiment of the present invention, the cooling device includes at least one coolant inlet and at least one coolant outlet. Thus, the flow of coolant can be transmitted into and out of the cooling device. This allows for constant replacement of the coolant and further increases the amount of heat that can be dissipated.
[0036] In a particularly preferred embodiment of the present invention, the cooling device is configured to conduct coolant into the base block through at least one coolant inlet and to conduct coolant out of the base block through at least one coolant outlet. The cooling device, and consequently the coolant inlet and outlet, can be part of the base block. Thus, direct contact between the coolant and the base block is ensured, which further increases the amount of heat that can be dissipated.
[0037] At least one coolant inlet and coolant outlet can be provided in the form of a hose connection or hose coupling. The coolant is preferably water.
[0038] According to a further embodiment of the module, the LED luminous area covers at least 60%, preferably at least 70%, more preferably at least 80%, and more preferably at least 90% of the base block side.
[0039] According to the module embodiment, the LED luminous area has a luminous surface power density (LPD). The luminous surface power density (LPD) is the amount of power per LED luminous area (for example, 1 cm² of the LED luminous area). 2 This explains the power emitted as light (when it hits).
[0040] The larger the area of the base block side covered by the LED luminous area, the more uniform the light illumination becomes to the workpiece positioned at the working distance. Furthermore, a larger coverage rate requires a lower luminous surface power density (LPD) to achieve a specific module power density (BPD).
[0041] According to a further embodiment of the module, multiple LED modules form a luminous area, and the LED modules are configured to emit different wavelength ranges.
[0042] The maximum achievable luminous surface power density (LPD), and consequently the module power density (BPD), is limited by the available LEDs. The maximum power of an LED is substantially wavelength-dependent. With respect to the present invention, the maximum available LED power density for each wavelength is particularly advantageous.
[0043] The workpiece to be heat-treated absorbs light of different wavelengths to different degrees, and this absorption also depends on the temperature of the workpiece (in particular, the surface temperature). The advantage of this embodiment is that different wavelengths of light can be used for heat treatment of the workpiece, depending on the surface temperature of the workpiece to be treated.
[0044] Therefore, by selecting different wavelength ranges, it is possible to choose a wavelength range that is optimized for the workpiece to be heat-treated.
[0045] In the advanced example of the above embodiment, the first wavelength range is in the range of 425 nm to 600 nm, and the second wavelength range is in the range of 200 nm to 425 nm.
[0046] LEDs emitting in the first wavelength range are commercially readily and cost-effectively available (particularly 440 nm or 455 nm).
[0047] In the second wavelength range, LEDs emitting in wavelength ranges such as 405, 395, 385, 375, or 365 are preferably used. This is because they are equally readily and cost-effectively available.
[0048] According to a further embodiment of the module, a plurality of LED modules form a luminous area, and a plurality of electrical input and output sections are present, each of which is electrically connected to an LED module or a group of LED modules.
[0049] An LED module group is formed by a combination of individual LED modules, for example, by a combination of LED modules located in a row or in a region.
[0050] This embodiment has the advantage that individual LED modules or groups of LED modules can be electrically driven. Therefore, for example, the intensity of light emitted by the modules can be spatially varied.
[0051] Therefore, in cases where the LED module emits light in different wavelength ranges, for example, to heat the surface of a workpiece until a predefined surface temperature is reached, it is possible to first emit light in a first or second wavelength range onto the surface of the workpiece, and then emit light in a second or first wavelength range. For example, simultaneous emission of light in different wavelength ranges is also possible.
[0052] The versatility and usefulness of the module will also be improved as a result.
[0053] According to a further embodiment of the module, the base block has one or more channels, preferably lamellar structures, which allow the flow of a coolant, preferably a cooling fluid, through coolant inlets and coolant outlets. The channels can form structures located inside the base block, which cause good heat exchange between the base block and the cooling medium.
[0054] Lamellar structures (or other forms of channels) increase the area through which heat can dissipate from the base block into the coolant. Therefore, the possible cooling power is increased. Lamellar structures are particularly effective in this regard.
[0055] According to a further embodiment of the module, the distance between the base block side and the coolant that can be introduced through the coolant inlet is less than 1 cm.
[0056] This allows for rapid and efficient heat dissipation. In particular, when using LED luminous areas with high luminous surface power density (LPD), the thermal power generated as a byproduct can therefore be introduced into the coolant through the base block material. At distances greater than 1 cm, for example, the thermal conductivity coefficient of the base block material may not be sufficiently high, which limits the possibility of heat dissipation. As a result, individual LEDs may overheat. In extreme cases, the structural integrity of the module may be damaged as a result. At distances less than 1 cm, this is prevented.
[0057] According to some embodiments, the base block side can be the base block upper side. In a further preferred embodiment, the base block upper side is the side of the base block facing the workpiece.
[0058] In a further preferred embodiment, the base block further includes a base block bottom side and a base block side surface, the base block bottom side may be on the opposite side of the base block top side, or diagonally opposite the base block top side.
[0059] According to the module embodiment, connection possibilities are provided on the bottom side of the base block.
[0060] The connecting means can be provided, for example, in the form of mechanical connecting means (such as threaded bores, eyelets, or latch connections) and / or in the form of form-fit connecting means (such as gluing, welding, or soldering). For example, this can result in the ability to fasten modules to holders.
[0061] According to a further embodiment of the module, the electrical input and / or electrical output sections and / or coolant inlet and / or coolant outlet sections are located on the bottom side of the base block.
[0062] This allows for particularly easy contact from the bottom side of the base block.
[0063] According to a further embodiment of the module, the electrical input and / or electrical output sections and / or coolant inlet and / or coolant outlet sections are located on the side surface of the base block.
[0064] This allows for the insertion and connection of multiple modules together to form a device according to the present invention, which comprises multiple modules in a particularly simple manner.
[0065] According to the embodiment of the device, the device is formed by modules arranged adjacent to one another and / or is expandable in a modular manner.
[0066] This enables the described scalability in a simple manner. Depending on the workpiece to be heat-treated, the device can be rapidly and easily adapted and, for example, increased in size.
[0067] In an advanced example of this embodiment, the electrical input and / or coolant inlet of each subsequent module is connected to the electrical output and / or coolant outlet of the preceding module.
[0068] This is possible in a particularly simple manner if the electrical input and / or output sections of the module, as well as the coolant inlet and / or coolant outlet sections, are located on the side surface of the base block of each module.
[0069] Advantageously, multiple electrical input and / or output sections, as well as coolant inlet and / or coolant outlet sections, are located on different base block side surfaces, and even if they are planar structures, they can be plugged together by modules to form a device.
[0070] In one embodiment of the present invention, each of one or more LED modules is covered by a first transparent component. In a preferred embodiment of the present invention, each first transparent component precisely covers one LED module. As a result, sensitive LED modules are protected from physical impacts (which could lead to damage). In particular, contact with the LED modules during installation and removal can lead to damage.
[0071] In one embodiment of the present invention, one or more first transparent components are made from glass. In a particularly preferred embodiment of the present invention, one or more first transparent components are made from quartz glass. In a further embodiment of the present invention, one or more first transparent components are made from sapphire crystal.
[0072] One or more first transparent components can be used to permanently mount the LED module while it is covered by them.
[0073] In a further embodiment of the module, the LED luminous area is covered by a second transparent component on the side of the LED module facing away from the side of the base block (upper part). In a preferred embodiment, one or more first transparent components are covered by a second transparent component on the side of one or more first transparent components facing away from the side of the base block (upper part), thereby protecting the LED module from physical impact.
[0074] The second transparent component is suitable for protecting the components of the module located between the thermally conductive base block and the second transparent component from gases and / or particles that are emitted or created onto the surface of the workpiece to be heat treated. The second transparent component is exchangeable, thus preventing the need to replace the LED module itself.
[0075] In one aspect of the present invention, the second transparent component is made from glass. In a particularly preferred aspect of the present invention, the second transparent component is made from fused quartz glass. In a further aspect of the present invention, the second transparent component consists of a sapphire crystal.
[0076] This prevents damage and / or soiling of the LED module.
[0077] According to a further embodiment of the module, the base block side has an area in the range from 1 cm 2 to 100 cm 2 , preferably in the range from 5 cm 2 to 25 cm 2 .
[0078] The corresponding variables have proven to be particularly advantageous. This is because these variables are easy to handle. Furthermore, they constitute a compromise between the area to be heat treated and thus the workpiece size and the power consumption and the cooling power consumption.
[0079] According to a further preferred embodiment of the module, the module power density (BPD) is greater than 35 W / cm 2 , more preferably greater than 50 W / cm 2 , more preferably greater than 80 W / cm 2 , more preferably greater than 100 W / cm 2 , more preferably greater than 130 W / cm 2 , more preferably greater than 200 W / cm 2It is larger than that. The BPD is preferably 1000 W / cm². 2 The following, and more preferably 600 W / cm² 2 The following, and more preferably 400 W / cm² 2 The following, and more preferably 300 W / cm² 2 The following applies:
[0080] According to a preferred embodiment, the module for the device for heat treatment of a workpiece has the following features, namely: - A thermally conductive base block comprising an upper side portion of the base block, a bottom side portion of the base block, and a side surface of the base block, - At least one electrical input section and at least one electrical output section, - At least one coolant inlet and at least one coolant outlet, - An LED luminous area having a luminous surface power density (LPD), wherein the LED luminous area is formed by at least one LED module, the at least one LED module is located on the upper side of the base block and is electrically connected to an electrical input section and an electrical output section, - A module luminous area having a module power density (BPD), where the module power density (BPD) corresponds to the total power of the LED modules arranged on the upper side of the base block per unit area of the upper side of the base block, and the module power density (BPD) is 20 W / cm². 2 Larger than that, preferably 35 W / cm² 2 Larger than that, and more preferably 50 W / cm² 2 Larger than that, and more preferably 80 W / cm² 2 Larger than that, and more preferably 100 W / cm² 2 Larger than that, and more preferably 130 W / cm² 2 Larger than that, and more preferably 200 W / cm². 2 A larger module luminous area, - A separation layer between the LED module and the upper side of the base block, wherein the separation layer is electrically insulating and thermally conductive, and It holds.
[0081] According to the device embodiment, the module luminous area of the module forms a device luminous area having a device power density (VPD), where the device power density (VPD) corresponds to the total power of the LED modules located on the base block side of the module per unit area of the device, and the device power density (VPD) is 20 W / cm². 2 Larger than that, preferably 35 W / cm² 2 Larger than that, and more preferably 50 W / cm² 2 Larger than that, and more preferably 80 W / cm² 2 Larger than that, and more preferably 100 W / cm² 2 Larger than that, and more preferably 130 W / cm² 2 Larger than that, and more preferably 200 W / cm². 2 It is larger than that.
[0082] In a preferred embodiment, the device power density (VPD) is 1000 W / cm². 2 The following, and more preferably 600 W / cm² 2 The following, and more preferably 400 W / cm² 2 The following, and more preferably 300 W / cm² 2 The following applies:
[0083] The device luminous area is defined similarly to the module luminous area as the total area of the device from which light is emitted, and similarly includes non-luminescent areas (e.g., intermediate spaces between LED modules, intermediate spaces between modules, and edge regions).
[0084] This, similar to the description related to module power density (BPD), allows for the thermal treatment of the workpiece by the device.
[0085] According to an advanced example of this embodiment, the variation in device power density (VPD) is less than 20%, preferably less than 10%, and more preferably less than 5% at a working distance of at least 1 cm.
[0086] This variation is defined as a percentage deviation from the mean. This allows for uniform heat treatment of the workpiece without the formation of localized hot spots or excessively cold areas.
[0087] For example, a corresponding small variation is achieved in that the width of the non-luminous edge of the device constitutes up to 20%, preferably up to 10%, and more preferably up to 5% of the device's width. More preferably, for this purpose, the width of the non-luminous edge of individual modules is less than 1 mm, preferably less than 2 mm, and more preferably less than 3 mm.
[0088] In the module embodiment, descriptions related to variation also apply to the module.
[0089] In a further embodiment of the device, the device includes a process chamber, and at least one module is located inside or within the process chamber.
[0090] In the arrangement within the process chamber, at least one module is preferably positioned outside the window to the process chamber, and the light emitted by at least one module is radiated into the process chamber, preferably onto a sample stage or sample holder on which the workpiece to be processed can be fixed.
[0091] In a process chamber, ambient conditions for the material properties of the workpiece to be processed can be advantageously set. For example, the chamber may contain air pressure reduced to a vacuum or a protective gas to protect the workpiece to be processed from oxidation.
[0092] Furthermore, process chambers in which air pressure reduced to a vacuum can be generated offer a particularly advantageous effect on efficiency when using light in the short wavelength range.
[0093] Alternatively, the atmosphere inside the chamber may contain process gases. The chamber can be implemented as a closed chamber or as one or more open sides, for example, to allow for a continuous through-flow of the workpiece to be processed.
[0094] The process chamber may include a receiving section for the workpiece. The receiving section for the workpiece can be implemented in various ways. For example, it may be an insulating base on which the workpiece is positioned, or it may be a mechanism that allows powder to gradually spread within the case. Preferably, the external environment of the device is shielded by the process chamber from LED light emitted within the process chamber.
[0095] In a further embodiment of the device, the device has a mirror in the outer edge region of an area formed from the module, which is configured to reflect light emitted laterally by the module luminous area, preferably in the direction of the workpiece to be processed.
[0096] In the outer edge region of the area formed by the module, the power density of the LED light may tend to decrease outward and approach zero as the distance from the area formed by the module increases. As a result, in some cases, the entire formed area cannot be used for processing. Therefore, the area available for processing can be expanded by the corresponding placement and alignment of mirrors in the outer edge region of the area formed by the module.
[0097] The workpiece is heated to very high temperatures (e.g., 1100°C) during heat treatment by the module according to the present invention. The inventors recognize that in this case, evaporation from the treated workpiece or reactions on the surface of the treated workpiece may typically occur. The inventors also recognize that particles and / or gases produced or released therefrom, due to the high temperatures (e.g., from firing), may damage sensitive components. The described particles and / or gases that occur during the heating of the workpiece may lead to damage to the LED module of the module according to the present invention. If the particles and / or gases from the workpiece corrode the LED module, the performance of the module will be impaired. In addition, the power density across the module will be reduced and uneven, and the workpiece may no longer be heat-treated sufficiently strongly and uniformly. Consequently, the LED module will then have to be replaced.
[0098] Therefore, an object of the present invention is also to increase the service life of the module for heat treatment of workpieces with unchanging effectiveness.
[0099] A solution to this objective is made possible by the suction device according to the present invention.
[0100] A suction device according to the present invention, for aspirating gases and / or particles released or produced on the surface of a processed workpiece during heat treatment of the workpiece with the assistance of a module or device according to the present invention, comprises a turbomachinery, one or more lines, and a suction nozzle. The lines connect the turbomachinery to the suction nozzle, and the suction nozzle is configured to work in conjunction with the turbomachinery to generate (primarily) laminar flow outside the suction device and in the area surrounding the suction nozzle.
[0101] As a result of the (substantially) laminar flow generated in this way, particles and / or gases are discharged through the suction device before they can reach the LED luminous area of the LED module, thereby increasing the module's lifespan.
[0102] This extension of service life is achieved without reducing the effectiveness of the heat treatment.
[0103] On the other hand, the installation of transparent components (such as quartz glass) can be omitted, which reduces optical loss in the path between the LED module and the workpiece.
[0104] On the other hand, convection is reduced. When flow is generated in the area surrounding the workpiece to be processed, heat can be dissipated from the workpiece to the surrounding area by convection to an increased degree, requiring a higher power density of the module to achieve the same temperature at the workpiece. The suction device according to the present invention reduces this convection effect by generating (primarily) laminar flow (i.e., less turbulence), which results in heat convection away from the workpiece to be processed.
[0105] Therefore, the suction device according to the present invention enables protection of the module according to the present invention against emitted or generated particles and / or gases without significantly reducing its effectiveness, thereby ensuring the module's lifespan and effectiveness.
[0106] In one embodiment of the present invention, the turbomachinery is a fan. Other turbomachinery, such as fans and compressors, can also be used in the same way.
[0107] The turbomachinery is connected to the suction nozzle by a line, and a pressure difference is created at the input of the suction nozzle between the inside of the suction nozzle and the environment outside the suction nozzle.
[0108] The suction nozzle is configured to work in conjunction with one or more lines and turbomachinery to induce laminar fluid flow in the area surrounding the suction nozzle.
[0109] The configuration of the suction nozzle may depend on the turbomachinery, as well as the coupling or connection between the suction nozzle and the turbomachinery.
[0110] Laminar flow is distinguished by the fact that it substantially does not contain turbulence or vortices. When laminar flow occurs in the region between two objects, it is thus substantially guaranteed that the surrounding areas of each object remain undisturbed by the flow. However, the flow forms a threshold for gases and / or particles, which are created on or within one object and travel along a trajectory toward the other object. This is because they are absorbed into the trajectory flow from one object to the other and carried away along the flow.
[0111] In a preferred embodiment of the present invention, the suction device, one or more modules according to the present invention, and the workpiece to be processed are arranged such that (preferably) laminar flow occurs between the LED luminous area of one or more modules and the workpiece to be processed.
[0112] In a particularly preferred embodiment, the (substantially) laminar flow is directed obliquely to a plane perpendicular to at least one of the one or more LED luminous areas of one or more modules. Thus, it is possible to ensure that particles and / or gases created or emitted on the surface of the workpiece, whose trajectories are directed toward the LED luminous areas, are blocked by the flow and carried away from the LED luminous areas. In this case, substantially no vortices are formed, so convection occurs to a very small degree, and heat does not flow substantially away from the workpiece.
[0113] In a further particularly preferred embodiment, the intersection point of (primarily) laminar flow and a plane perpendicular to at least one of the one or more LED luminous areas of one or more modules lies within the light field of the LED luminous area of one or more modules. Effective protection of the LED luminous area is consequently ensured. (primarily) laminar flow is usually not significant in one dimension. Therefore, there are two or more intersection points between the flow and the designated plane. It is sufficient if at least one intersection point lies within the light field of the LED luminous area of one or more modules. The amount of spatial points through which the light emitted by one or more LED luminous areas of one or more modules passes is designated as the light field.
[0114] Furthermore, the suction device may also include a filter suitable for filtering out the aspirated gas and / or particles so that they do not reach, for example, a turbomachinery and damage it, or are released back out of the suction device.
[0115] Furthermore, the suction device can be used in conjunction with multiple modules or devices according to the present invention, comprising one or more modules. In particular, a suction device including a process chamber can also be used together with one embodiment of the device.
[0116] In a further embodiment of the present invention, the suction device may also include a blowing device. In this case, the blowing device may be positioned to cause a fluid flow toward the suction nozzle. The suction area of the suction device is consequently enlarged. For example, when using a device according to the present invention consisting of multiple modules according to the present invention, a large LED luminous area may need to be protected. To satisfy this, the embodiments described are particularly suitable. In a preferred embodiment of the present invention, the blowing device causes a substantially laminar flow directed toward the suction nozzle.
[0117] In a further embodiment of the present invention, multiple suction devices can be used together.
[0118] The present invention is described in more detail below with reference to the accompanying drawings. [Brief explanation of the drawing]
[0119] [Figure 1a] This figure shows an embodiment of a module for a device for heat treatment of a workpiece, equipped with a cooling device. [Figure 1b] This figure shows an embodiment of a module for a device for heat treatment of workpieces. [Figure 2] Figure 1b shows further diagrams of the embodiment. [Figure 3] This figure shows a further embodiment of a module for a device for heat treatment of workpieces. [Figure 4] Figure 3 shows further diagrams of the embodiment. [Figure 5] This figure shows an embodiment of a device for heat treatment of a workpiece equipped with a module. [Figure 6] This figure shows an embodiment of the base body of a module for a device for heat treatment of workpieces. [Figure 7] This figure shows an embodiment of a device for heat treatment of a workpiece, including a process chamber and module. [Figure 8] This figure shows an embodiment of a system including a module for heat treatment of a workpiece, the workpiece to be treated, and a suction device. [Figure 9] This is a front view of an embodiment of a suction nozzle for a suction device. [Figure 10] This figure shows a) a side view and b) a cross-section parallel thereto of a suction nozzle for a suction device. [Modes for carrying out the invention]
[0120] Components shown in multiple figures are given the same reference numerals.
[0121] Figure 1a illustrates a first embodiment of module 1 for a device for heat treatment of workpieces. Module 1 has a base block 2 made of a thermally conductive material (e.g., copper). One or more LED modules 10 are arranged on the side portion 3 of the base block. The embodiment shown as an example in Figure 1 includes 45 LED modules. The LED module 10 preferably has electrical contact options, a socket, and at least one LED chip. The LED module 10 may have multiple sockets and LED chips. The actually light-emitting area of the LED module 10 is precisely formed by the sum of the areas of each LED chip of the LED module 10.
[0122] Module 1 includes a module luminous area 18 having a module power density BPD, where the module power density BPD corresponds to the total power of the LED modules 10 arranged on the base block side 3 per unit area of the base block side 3.
[0123] Figure 1a further shows an optional cooling device 1100 configured to bring the base block 2 into thermal contact with a coolant 14. Such a coolant 14 can be, for example, a dielectric liquid. Due to the fact that many liquids have a high coefficient of thermal conductivity compared to air and other gases, more efficient and powerful heat dissipation from the base block is thus ensured. However, the coolant 14 is not limited to such liquids.
[0124] The cooling device 1100 further includes an optional coolant inlet 8 and an optional coolant outlet 9. The number of inlets and outlets is not limited thereto. With the assistance of these inlets and outlets, the coolant 14 can be circulated, allowing the cooling of the base block, and consequently the cooling of the entire module, to dissipate more heat, resulting in a higher power density for the module.
[0125] The electrical input section 6 and output section 7 can be positioned on all sides of the base block and configured to allow electrical contact between the inlet section 6 and outlet section 7 and the LED module. In particular, the electrical inlet section 6 and outlet section 7 can be configured to come into contact with a dielectric liquid due to their dielectric properties when a dielectric liquid is used. Exemplary embodiments and locations of the electrical inlet and outlet sections are illustrated in the following figures.
[0126] The geometric form of base block 2, and consequently the geometric form of module 1, is not limited to a rectangle. Any type of polygon is possible, and a polygon that allows for complete surface filling is preferred. This is because otherwise, non-luminous intermediate spaces would be created.
[0127] Figure 1b illustrates a further embodiment of module 1 for a device for heat treatment of workpieces, in a perspective view of module 1 from above and to the side. Figure 2 shows the same module in a perspective view from below and to the side. The module has a thermally conductive base block 2 comprising a base block upper side portion 3, a base block bottom side portion 4, and a base block side surface 5. The distance between the base block upper side portion 3 and the base block bottom side portion 4 defines the thickness d of the base block 2.
[0128] Multiple LED modules 10 are arranged on the upper side portion 3 of the base block, and the light-emitting areas of the LED modules 10 collectively form an LED luminous area 11 having a luminous surface power density (LPD). Each LED module 10 has electrical contact options, a socket, and at least one LED chip. An LED module 10 can have multiple sockets and LED chips. The actually light-emitting area of the LED module 10 is precisely formed by the sum of the areas of each LED chip in the LED module 10.
[0129] The luminous surface power density (LPD) results from the power emitted as light per LED luminous area 11.
[0130] Module 1 includes a module luminous area 18 having a module power density BPD, where the module power density BPD corresponds to the total power of the LED modules 10 located on the upper side 3 of the base block per unit area of the upper side 3 of the base block. In this rectangular base block 2, the total area of the upper side 3 of the base block is calculated from the length of the base block side surface 5.
[0131] At the bottom side 4 of the base block, the respective electrical input 6 and electrical output 7 are located, which can be made contact, for example, in the form of electrical plug connections. These electrical input 6 and electrical output 7 are routed from the bottom side 4 of the base block to the top side 3 of the base block, so that the individual LED modules 10 can be electrically contacted.
[0132] Furthermore, optional coolant inlets 8 and optional coolant outlets 9 are located on the bottom side portion 4 of the base block. Through the coolant inlets 8, the coolant 14 can be conducted into the interior of the base block 2, where it absorbs the waste heat from the LED module 10 located on the upper side portion 3 of the base block. Through the coolant outlets 9, the coolant 14 is conducted from the interior to the exterior of the base block 2, enabling effective cooling of the base block 2.
[0133] Furthermore, mechanical connecting means 15 are provided on the bottom side 4 of the base block. In Figure 2, these are embodied as bores with threads, but alternative connecting and fastening means are also possible. Through the mechanical connecting means 15, module 1 can be fastened to a holder or support structure.
[0134] The base block 2 is made of a thermally conductive material (e.g., copper) and may have one or more channels 13 (such as lamellar structures) inside that allow the flow of a coolant 14 (e.g., water). The corresponding structures (such as lamellar structures) for the channels 13 are shown in Figure 6, and the coolant inlet 8 and coolant outlet 9 are differently positioned on the side surface 5 of the base block.
[0135] The module power density (BPD) is 20 W / cm². 2 It is larger than that. This already allows for sufficient energy input into the surface of several workpieces to be heat-treated. For example, it is possible to heat a workpiece that absorbs heat very well up to a temperature of 1100°C.
[0136] The module power density (BPD) is advantageously, if necessary, preferably 35 W / cm². 2 More preferably up to 50W / cm² 2 More preferably 80W / cm² 2 More preferably 100W / cm² 2 Up to, more preferably 130 W / cm² 2 More preferably 200W / cm² 2 It is possible to increase it to an extremely high level. This is made possible by the higher energy input into the surface of the workpiece to be heat-treated. However, the module power density BPD is 1000 W / cm². 2 It should be less than 600 W / cm², preferably 600 W / cm². 2 Less than 400 W / cm², more preferably 400 W / cm². 2 Less than 300 W / cm², and more preferably 300 W / cm². 2 It is less than.
[0137] Figure 3 shows a further embodiment of Module 1 for a device for heat treatment of workpieces. In this case, multiple electrical inputs 6 and multiple electrical outputs 7, as well as multiple coolant inlets 8 and multiple coolant outlets 9, are arranged on the side surface 5 of the base block.
[0138] By arranging the respective input and output sections 6, 7, 8, and 9 on the base block side surface 5, multiple modules 1 can be connected in a simple manner to form device 100, as illustrated in Figure 5. Each of the input and output sections 6, 7, 8, and 9 is preferably designed as a plug connector or corresponding coupling.
[0139] In particular, the presence of multiple electrical input and output sections 6 and 7 further enables the driving of individual LED modules 10 or LED module groups 17. As a result, while other areas remain dark, specific areas of the module luminous area 18 can emit light. In this case, the LED module group 17 is formed by a combination of individual LED modules 10 (see Figure 5).
[0140] Figure 4 shows a side view of the embodiment from Figure 3. Also illustrated is an electrically insulating and thermally conductive separator layer 12 between the LED module 10 and the upper side portion 3 of the base block, provided in exemplary embodiments from Figures 1a and 1b. The separator layer 12 is preferably formed from aluminum nitride. The separator layer 12 does not need to be applied over the entire area on the upper side portion 3 of the base block. For example, the separator layer 12 may be provided only in the area of the upper side portion 3 of the base block in which the LED module 10 is located. The separator layer can have a variety of thicknesses. In preferred embodiments, the separator layer is less than 500 μm, more preferably less than 425 μm, more preferably less than 350 μm, more preferably less than 275 μm, more preferably less than 200 μm, more preferably less than 100 μm, more preferably less than 40 μm, more preferably less than 10 μm, and more preferably less than 2 μm thick. In a particularly preferred embodiment, the separator layer is 375 μm thick.
[0141] Figure 4 further shows an optional transparent component, such as a glass pane 16 (e.g., quartz glass), on the side of the LED module 10 facing away from the upper side 3 of the base block. As a result, it is possible to prevent damage and / or contamination to the LED module 10. In particular, during the heat treatment of a workpiece using module 1, gases, vapors, or other particles that contaminate the LED module 10 may be released from or created on the surface of the workpiece. Furthermore, due to the high temperature inside the workpiece, these particles, gases, or vapors may corrode the LED modules during the heat treatment, rendering them unusable and requiring replacement.
[0142] Figure 5 shows an embodiment of a device 100 for heat treatment of a workpiece having multiple modules 1.
[0143] Device 100 is formed by a plurality of modules 1a to 1l. In this case, each module has a plurality of electrical inputs 6 and a plurality of electrical outputs 7, as well as a plurality of coolant inlets 8 and a plurality of coolant outlets 9.
[0144] The enlarged view in Figure 5 shows, with reference to the connections between modules 1k and 1l, how each electrical input 6k of module 1k is connected to the electrical output 7l of module 1l, and how the electrical input 6l of module 1l is connected to the electrical output 7k of module 1k. This also applies to the coolant inlet 8k and coolant outlet 9l, as well as the coolant inlet 8l and coolant outlet 9k.
[0145] The module luminous areas 18 of modules 1a to 1l form a device luminous area 111 having a device power density VPD, which corresponds to the total power of the LED modules 10 located on the upper side 3 of the base block of modules 1a to 1l per unit area of the devices. The device luminous area 111 is defined similarly to the module luminous area 18 as the area corresponding to the total area of the devices 100 from which light is emitted, and similarly includes non-emitting regions (e.g., intermediate spaces between the LED modules 10, intermediate spaces between modules 1a to 1l, and edge regions).
[0146] The geometric form of device 100 is not limited to a rectangle. Any type of polygon is possible. In particular, a three-dimensional (i.e., not just a planar) device 100 can be formed according to the geometric form of module 1. For this purpose, combining modules 1 of different geometric shapes is particularly advantageous.
[0147] Figure 7 shows a further embodiment of device 100, which additionally includes a process chamber 110. Device 100 includes modules 1a and 1b in a known manner, which consist of a base block 2 having a base block upper side 3 and a base block bottom side 4 in a known manner, as well as further features illustrated in Figures 1 to 4. The device luminous area 111 is formed by the LED luminous areas 11 of modules 1a and 1b.
[0148] In the arrangement shown in Figure 7, modules 1a and 1b are positioned inside the process chamber 110, so that light emitted by the device luminous area 111 can be radiated onto the receiving section 120 (for example, a sample stage or sample holder). Alternatively, modules 1a and 1b can be positioned on the outer side of the window of the process chamber 110, so that light emitted by at least one module 1 is radiated into the process chamber 110, preferably onto the workpiece to be processed, which is located inside the receiving section 120.
[0149] Figure 8 shows an embodiment of the suction device 200 according to the present invention, including a turbomachinery 201, a line 202, and a suction nozzle 203. The line 202 connects the turbomachinery 201 to the suction nozzle 203, so that a pressure ratio not equal to 1 is generated between the internal and external environments in the suction nozzle. The suction nozzle 203 is configured so that a laminar flow 205 is generated in the area surrounding the suction nozzle. The configuration of the suction nozzle 203 may depend on the turbomachinery 201, the power provided by the turbomachinery 201, and the line 202.
[0150] Figure 8 also shows Module 1 according to the present invention and a workpiece 204 to be heat-treated. The suction device and module are positioned relative to the workpiece such that a laminar flow 205 generated in the area surrounding the suction nozzle is generated between the LED luminous area 11 of Module 1 and the workpiece 204. The laminar flow is also directed obliquely to a plane perpendicular to the LED luminous area 11. In addition, at least one intersection point of the laminar flow and at least one such plane lies within the light field of the LED luminous area of Module 1. Any gases and / or particles produced or emitted on or within the surface of the workpiece 204 to be treated are thereby absorbed into the flow and carried away, so that the gases and / or particles do not reach the LED luminous area 11. Thus, the risk of contamination and damage to the module is greatly reduced.
[0151] Due to the laminar flow characteristics of 205, namely the stratification of the flow velocity, turbulence and vortices do not occur. Therefore, the heat treatment of the workpiece 204 is not hindered by the suction device 200. This is because no convection occurs that transports heat away from the workpiece 204 to be treated. This is particularly advantageous compared to other protective devices (e.g., glass panes), because as a result, an obstructing material for radiation is introduced into the beam path of the light. Absorption and reflection cause power loss, which in turn hinders the heat treatment.
[0152] Figure 9 shows a front view of an embodiment of the suction nozzle 203 in Figure 8. In this case, the white area constitutes the opening of the nozzle through which gas and / or particles can be drawn in.
[0153] Figure 10 shows a) an exemplary side view and b) an exemplary cross-section of an embodiment of the suction nozzle 203. In this embodiment, the suction nozzle includes a rounded lip 206. The suction nozzle 203 (in particular the lip 206) is configured in conjunction with the rest of the suction device structure (turbomachine 201 and line 202) to ensure that the flow generated in the area surrounding the suction nozzle 203 is laminar (see arrow in Figure 8). This is achieved particularly effectively, for example, by the rounded shape of the lip 206, because, among other things, the edgeless area promotes the formation of laminar flow. The entry of laminar flow into the opening of the suction nozzle 203 is also hardly obstructed by vortices between the openings. Further configurations of the suction nozzle and other parts of the system according to the present invention can be implemented.
[0154] Preferred embodiments of the subject matter claimed by the attached claims are described in the specification and drawings. The optional features disclosed in the specification, claims and drawings above can be used in various configurations, both individually and in any desired combination, for embodiments of the subject matter claimed herein in accordance with the attached claims.
[0155] The various aspects and embodiments described above can be combined to produce further embodiments. In light of the detailed description above, these and other modifications can be made to the embodiments. In general, the terms used in the following claims should not be construed to limit the claims to specific aspects and embodiments disclosed in the specification and claims, but rather to include all possible embodiments, along with the entire scope of equivalents for which these claims are entitled. [Explanation of symbols]
[0156] 1 module Modules 1a-1l 2 base blocks 3. Upper side of the base block 4. Base block bottom side 5. Side surface of the base block 6. Electrical input section, electrical inlet section 6a~6l Electrical Input Section 7. Electrical output section, electrical outlet section 7a~7l Electrical output section 8 Coolant inlet 8a~8l Coolant inlet 9 Coolant outlet 9a~9l Coolant outlet 10 LED modules 11 LED Luminous Area 12 separation layer 13 channels 14 Coolant 15 Mechanical connection means 16 Glass panes 17 LED module groups 18 Module Luminous Area 110 Process Chamber 111 Device Luminous Area 120 Receptor part 200 suction devices 201 Turbomachinery Line 202 203 Suction nozzle 204 Workpiece 205 Laminar flow 1100 Cooling Devices d Thickness of base block 2
Claims
1. A module (1) for a device (100) for heat treatment of a workpiece, - A thermally conductive base block (2) having a base block side portion (3), - At least one electrical input section (6), - An LED luminous area (11), wherein the LED luminous area (11) is formed by at least one LED module (10), the at least one LED module (10) is located on the base block side portion (3) and is electrically connected to the electrical input portion (6), - A module luminous area (18) having a module power density (BPD), wherein the module power density (BPD) corresponds to the total power emitted as light by the LED modules arranged on the base block side portion (3) per unit area of the base block side portion (3), - The separation layer (12) between the LED module (10) and the base block side portion (3), wherein the separation layer (12) is thermally conductive, and the separation layer (12) In module (1) which includes, The module (1) further comprises at least one electrical output section (7), the at least one LED module (10) is electrically connected to the at least one electrical output section (7), the isolation layer (12) is electrically insulating, and the module power density (BPD) is 20 W / cm². ２ Module (1), characterized by being larger than [a certain value].
2. The base block side portion (3) is the base block upper side portion (3), and the base block (2) further includes the base block bottom side portion (4) and the base block side surface (5), and the module is At least one coolant inlet (8) and at least one coolant outlet (9) It further includes, The module (1) according to claim 1, wherein the LED luminous surface has a luminous surface power density (LPD).
3. The module (1) according to claim 1, further comprising a cooling device configured to bring the base block into thermal contact with a coolant.
4. The module (1) according to claim 3, wherein the cooling device further includes at least one coolant inlet (8) and at least one coolant outlet (9).
5. The module (1) according to claim 4, wherein the cooling device is configured to receive a coolant through the coolant inlet (8) in the base block and to discharge the received coolant from the base block through the coolant outlet (9).
6. The module (1) according to any one of claims 1 to 5, characterized in that the LED luminous area (11) covers at least 60%, preferably at least 70%, more preferably at least 80%, and more preferably at least 90% of the upper side portion (3) of the base block.
7. The module (1) according to any one of claims 1 to 6, characterized in that a plurality of LED modules (10) form the LED luminous area (11) of the module (1), and the LED modules (10) are configured to emit different wavelength ranges.
8. The module (1) according to claim 7, wherein the first wavelength range is in the range of 425 nm to 600 nm, and the second wavelength range is in the range of 200 nm to 425 nm.
9. A module (1) according to any one of claims 1 to 8, characterized in that a plurality of LED modules (10) form the LED luminous area (11), and a plurality of electrical input sections (6) and output sections (7) are present, and each of the plurality of electrical input sections (6) and output sections (7) is electrically connected to an LED module (10) or an LED module group (17).
10. The module (1) according to any one of claims 1 to 9, wherein the base block (2) has one or more channels (13), preferably lamellar structures, and the one or more channels (13) allow the flow of a coolant (14), preferably a cooling fluid, through the coolant inlet (8) and the coolant outlet (9).
11. The module (1) according to any one of claims 1 to 10, characterized in that the distance between the upper side portion (3) of the base block and the coolant (14) that can be introduced through the coolant inlet portion (8) is less than 1 cm.
12. The module (1) according to any one of claims 1 to 11, wherein the base block side portion (3) is an upper base block side portion facing the workpiece to be processed, and the base block preferably further includes a base block bottom side portion (2) and a base block side surface (5).
13. The module (1) according to any one of claims 2 to 12, characterized in that the electrical input section (6) and / or the electrical output section (7) and / or the coolant inlet section (8) and / or the coolant outlet section (9) are arranged on the bottom side section (2) of the base block.
14. The module (1) according to any one of claims 2 to 12, characterized in that the electrical input section (6) and / or the electrical output section (7) and / or the coolant inlet section (8) and / or the coolant outlet section (9) are arranged on the base block side surface (2).
15. Module (1) according to any one of claims 1 to 14, characterized in that at least a portion of each LED module (10) of the at least one LED module (10) is covered by a first transparent component, preferably a glass pane, on the side of the LED module (10) facing away from the base block side portion (3).
16. The module (1) according to any one of claims 1 to 15, characterized in that the LED luminous area (11) is covered by a second transparent component (16), preferably a glass pane, on the side of the LED module (10) facing away from the base block side portion (3).
17. The module (1) according to claim 16, characterized in that the first transparent component is disposed between each of the LED modules (10) and the second transparent component.
18. The module (1) according to any one of claims 1 to 17, characterized in that the LED luminous area (11) is covered by quartz glass (16) on the side of the LED module (10) facing away from the upper side portion (3) of the base block.
19. The upper side portion (3) of the base block is 1 cm ２ From 100cm ２ A range of preferably 5 cm ２ 25cm ２ A module (1) according to any one of claims 1 to 18, characterized in that it has an area within the range of .
20. The module power density (BPD) is greater than 35 W / cm ２ and preferably greater than 50 W / cm ２ and more preferably greater than 80 W / cm ２ and more preferably greater than 100 W / cm ２ and more preferably greater than 130 W / cm ２ and more preferably greater than 200 W / cm ２ The module (1) according to any one of claims 1 to 19, which is greater than
21. The module power density (BPD) is 1000 W / cm². ２ The following, preferably 600 W / cm² ２ The following, preferably 400 W / cm² ２ The following, and more preferably 300 W / cm² ２ The module (1) according to any one of claims 1 to 20, which is as follows:
22. The module (1) according to any one of claims 1 to 21, wherein the LED luminous area (11) has a luminous surface power density (LPD) per LED luminous area resulting from the power emitted as light.
23. The module (1) according to any one of claims 1 to 22, wherein the separation layer (12) has a thickness of less than 500 μm, preferably less than 425 μm, more preferably less than 350 μm, more preferably less than 275 μm, more preferably less than 200 μm, more preferably less than 100 μm, more preferably less than 40 μm, more preferably less than 10 μm, and more preferably less than 2 μm.
24. A device (100) for heat treatment of a workpiece, wherein the device (100) comprises at least one module (1) as described in any one of claims 1 to 23.
25. The device (100) according to claim 24, characterized in that the device (100) is formed by modules (1) arranged adjacent to each other and / or is expandable in a modular manner.
26. The device (100) according to claim 25, characterized in that the electrical input section (6) and / or coolant inlet section (8) of each subsequent module (1) are connected to the electrical output section (7) and / or coolant outlet section (9) of the preceding module (1).
27. The module luminous area (18) of the module (1) forms a device luminous area (111) having a device power density (VPD), the device power density (VPD) corresponding to the total power of the LED modules arranged on the upper side (3) of the base block of the module (1) per total area of the device (1), and the device power density (VPD) is 20 W / cm². ２ A device (100) according to any one of claims 24 to 26, characterized in that it is larger than [a certain value].
28. The device (100) according to claim 27, characterized in that, at a working distance of at least 1 cm, the variation in the device power density (VPD) is less than 20%, preferably less than 10%, and more preferably less than 5%.
29. The device (100) according to any one of claims 24 to 28, wherein the device (100) includes a process chamber (110), and the at least one module (1) is located inside or in the process chamber (110).
30. The aforementioned device power density (VPD) is 35 W / cm². ２ Larger than 50 W / cm², preferably 50 W / cm² ２ Larger and more comfortable at 80 W / cm² ２ Larger and more preferably 100 W / cm² ２ Larger than that, and more preferably 130 W / cm² ２ Larger and more comfortable at 200W / cm² ２ A device (100) according to any one of claims 24 to 29, which is larger than the device (100) according to any one of claims 24 to 29.
31. The aforementioned device power density (VPD) is 1000 W / cm². ２ The following, preferably 400 W / cm² ２ The following, and more preferably 300 W / cm² ２ The device (100) according to any one of claims 24 to 30, which is as follows:
32. Use of the module (1) according to any one of claims 1 to 23 or the device (100) according to any one of claims 24 to 31 for heat treatment of a workpiece, preferably for heat treatment at a temperature above 500°C.
33. A suction device (200) for aspirating gases and / or particles released or created on the surface of a processed workpiece (204) during heat treatment of the workpiece (204), with the assistance of a module (1) according to any one of claims 1 to 23 or a device (100) according to any one of claims 24 to 31, - Turbomachinery (201), - One or more lines (202), - Suction nozzle (203) and Equipped with, A suction device (200) wherein the line (202) connects the turbomachinery (201) to the suction nozzle (203), and the suction nozzle (203) is configured to work in conjunction with one or more lines and the turbomachinery (201) to generate a laminar flow (205) outside the suction device (200) and in the area surrounding the suction nozzle (203).
34. The suction device (200) according to claim 33, further comprising a blowing device, the blowing device being positioned relative to the suction nozzle so as to be suitable for generating a fluid flow toward the suction nozzle, thereby expanding the suction area of the suction nozzle.
35. Preferably, the use of the suction device (200) according to claim 33 or 34 for suctioning gases and / or particles released or produced on the surface of the treated workpiece (204) during heat treatment of the workpiece (204), with the assistance of the module (1) according to any one of claims 1 to 23 or the device (100) according to any one of claims 24 to 31.
36. It is a system, - One or more modules (1) according to any one of claims 1 to 23, - One or more suction devices (200) according to claim 33 or 34, Equipped with, A system in which one or more modules (1) and one or more suction devices (200) can be positioned relative to the workpiece (204) such that the laminar flow (205) generated by the one or more suction devices (200) occurs between the workpiece (204) and the LED luminous area of the one or more modules (1), and the laminar flow (205) is directed obliquely to a plane perpendicular to at least one of the one or more LED luminous areas of the one or more modules (1).
37. The system according to claim 36, wherein the intersection point of the generated laminar flow and a plane perpendicular to at least one of the one or more LED luminous areas of the one or more modules (1) lies within the light illumination field of the one or more LED luminous areas of the one or more modules (1).