Domain Controllers and Removable Platforms

Abstract

A domain controller and a removable platform having a domain controller are provided, which reduce the stress experienced by a circuit board and reduce the risk of chip cracks. [Solution] A domain controller having a housing, in which a heat dissipation assembly and a circuit board are stacked in the housing, a first chip 310 is disposed on a side of the circuit board facing the heat dissipation assembly, a first heat dissipation boss is provided on the heat dissipation assembly, a compressed elastic member 400 is further provided on a side of the heat dissipation assembly facing away from the circuit board, a first end of the elastic member abuts the housing and a second end of the elastic member abuts the heat dissipation assembly so that the first heat dissipation boss abuts the first chip, and a support 121 abutting the circuit board is provided on the housing. The distance between the first heat dissipation boss and the first chip is shortened, and a corresponding support is disposed on the housing to support the circuit board.

Description

[Technical field]

[0001] The present application relates to chip assembly technology, and more particularly to domain controllers and removable platforms. [Background technology]

[0002] A domain controller is a critical network server that manages and controls computers, users, and resources within a domain. In the vehicle domain, the domain controller is responsible for managing and controlling various functions of the vehicle, including but not limited to powertrain, chassis control, intelligent cabin information processing, etc.

[0003] Because the domain controller needs to process a large amount of information, the heat dissipation performance of the domain controller directly affects its information processing capacity. In the related art, in order to improve the heat dissipation performance of the domain controller, the gap between the heat sink and the chip can be compressed, thereby reducing the thickness of the thermal conductive layer between the chip and the heat sink, so as to achieve the purpose of conducting the heat of the chip to the heat sink as quickly as possible. However, using the above method increases the stress experienced by the chip and the circuit board, and there is a risk of the chip cracking. Summary of the Invention [Problem to be solved by the invention]

[0004] In order to overcome the above-mentioned deficiencies in the related art, the present application aims to provide a domain controller and a removable platform, which can reduce the gap between the chip and the heat sink while reducing the stress experienced by the chip and the circuit board, and reduce the risk of the chip cracking. [Means for solving the problem]

[0005] In one aspect, the present application provides a domain controller having a housing, in which a heat dissipation assembly and a circuit board are stacked within the housing, a first chip is disposed on a side of the circuit board facing the heat dissipation assembly, a first heat dissipation boss is provided on the heat dissipation assembly, and a compressed elastic member is further provided on a side of the heat dissipation assembly facing away from the circuit board, a first end of the elastic member abuts against the housing and a second end of the elastic member abuts against the heat dissipation assembly, and the housing is provided with a support portion abutting against the circuit board, so that the first heat dissipation boss abuts against the first chip.

[0006] In one possible implementation, the elastic member comprises a spring, the housing is provided with a mounting groove, and the spring is disposed within the mounting groove.

[0007] In one possible implementation, the resilient member comprises a sealing ring or a leaf spring, the resilient member being arranged along a circumferential direction of the heat dissipation assembly.

[0008] In one possible implementation, the housing comprises an undercover and an upper housing, the circuit board is positioned adjacent to the undercover, and the support is positioned on the undercover, and the undercover, the upper housing, and the circuit board are connected by a first fastener to compress the elastic member between the upper housing and the heat dissipation assembly.

[0009] In one possible implementation, in a plane parallel to the circuit board, the projection of the first chip is within the projection range of the support.

[0010] In one possible implementation, a plurality of second chips are further provided on the side of the circuit board facing the heat dissipation assembly, arranged surrounding the first chip, and the heat dissipation assembly further includes a plurality of second heat dissipation bosses in one-to-one correspondence with the second chips.

[0011] In one possible implementation, a first thermally conductive layer is filled between the first heat dissipation boss and the first chip, and a second thermally conductive layer is filled between the second heat dissipation boss and the second chip, and the thickness of the second thermally conductive layer is greater than the thickness of the first thermally conductive layer.

[0012] In one possible implementation, the heat dissipation assembly comprises a heat spreader plate and a heat dissipation assembly body, the heat spreader plate being disposed on a side of the heat dissipation assembly body facing the circuit board, and both the first heat dissipation boss and a plurality of the second heat dissipation bosses being provided on the heat spreader plate.

[0013] In one possible implementation, a plurality of position limiting holes are provided in the heat dissipation assembly body, and a plurality of position limiting posts are provided in the upper housing, the plurality of position limiting posts having a one-to-one correspondence with the plurality of position limiting holes, and the position limiting posts are configured to be inserted into the corresponding position limiting holes.

[0014] In another aspect, the present application provides a removable platform comprising a domain controller as described above. Effect of the Invention

[0015] The present application provides a domain controller and a removable platform including a housing, in which a heat dissipation assembly and a circuit board are stacked in the housing, a first chip is disposed on a side of the circuit board facing the heat dissipation assembly, a first heat dissipation boss is disposed on the heat dissipation assembly, and a compressed elastic member is further disposed on a side of the heat dissipation assembly facing away from the circuit board, and a first end of the elastic member abuts the housing, a second end of the elastic member abuts the heat dissipation assembly, and a support portion abutting the circuit board is disposed on the housing to make the first heat dissipation boss abut the first chip. The present application provides a domain controller and a removable platform including a housing, in which a heat dissipation assembly and a circuit board are stacked in the ... [Brief description of the drawings]

[0016] In order to more clearly describe the technical solutions in the embodiments of the present application or related art, the following briefly describes the drawings that need to be used in the description of the embodiments or related art. Of course, the drawings described below relate to some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative efforts. [Figure 1] FIG. 2 is an exploded view of a domain controller provided in accordance with one embodiment of the present application. [Diagram 2] FIG. 2 is a cross-sectional view of one of the domain controllers provided in accordance with one embodiment of the present application. [Diagram 3] 4 is another cross-sectional view of a domain controller provided in accordance with an embodiment of the present application; [Figure 4] FIG. 2 is a structural schematic diagram of an upper housing provided according to an embodiment of the present application at a first viewing angle. [Diagram 5]FIG. 2 is a structural schematic diagram of an upper housing provided according to an embodiment of the present application at a second viewing angle. [Figure 6] 1 is a structural diagram of a portion of a heat dissipation assembly provided according to an embodiment of the present application; [Figure 7] 1 is a structural schematic diagram of a circuit board provided according to an embodiment of the present application; [Figure 8] FIG. 2 is a structural schematic diagram of an undercover provided according to one embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions are hereinafter clearly and completely described with reference to the drawings related to the embodiments of the present application, and it should be understood that the described embodiments are only some of the embodiments of the present application, but not all of the embodiments thereof.

[0018] Based on the embodiments in this application, all other embodiments obtained by a person skilled in the art without performing creative labor shall fall within the scope of protection of this application. The following embodiments and features in the embodiments can be combined with each other unless they are inconsistent.

[0019] As described in the background art, in the related art, the gap between the heat sink and the chip is narrowed and the thickness of the thermally conductive layer filled between the chip and the heat sink is thinned, so that the circuit board and the chip are subjected to a large stress. For example, in some solutions, a spring is provided on the side of the heat sink that is away from the chip, so that the heat sink can be abutted against the chip by the elastic force of the spring, but in this solution, the pressure is ultimately transmitted to the circuit board, and at the same time, there is a risk of cracking the chip.

[0020] In view of this, the embodiments of the present application are intended to provide a domain controller and a removable platform, which includes a compressed elastic member disposed on a side of the heat dissipation assembly facing away from the circuit board, thereby firmly pressing the first heat dissipation boss against the first chip and shortening the distance between the first heat dissipation boss and the first chip, and a corresponding support portion disposed on the housing for supporting the circuit board, thereby reducing the stress experienced by the circuit board and reducing the risk of cracking the first chip.

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, in order to enable those skilled in the art to understand the present application in more detail, the present application will be described in detail with reference to the accompanying drawings.

[0022] FIG. 1 is an exploded view of a domain controller provided by one embodiment of the present application, FIG. 2 is a cross-sectional view of one of the domain controllers provided by one embodiment of the present application, FIG. 3 is another cross-sectional view of the domain controller provided by one embodiment of the present application, FIG. 4 is a structural schematic diagram of an upper housing provided by one embodiment of the present application at a first viewing angle, FIG. 5 is a structural schematic diagram of an upper housing provided by one embodiment of the present application at a second viewing angle, FIG. 6 is a structural diagram of a portion of a heat dissipation assembly provided by one embodiment of the present application, FIG. 7 is a structural schematic diagram of a circuit board provided by one embodiment of the present application, and FIG. 8 is a structural schematic diagram of an undercover provided by one embodiment of the present application.

[0023] Please refer to Figs. 1 to 8. An embodiment of the present application provides a domain controller having a housing, and the shape of the housing can be set according to the needs of assembly, for example, a prismatic or cylindrical shape. The housing can include, for example, an undercover 120 and an upper housing 110 that are assembled to the housing. A heat dissipation assembly 200 and a circuit board 300 are stacked in the housing, and the circuit board 300 is disposed adjacent to the undercover 120, and the heat dissipation assembly 200 is for conducting heat generated during the operation of the circuit board 300 so as to ensure the information processing capability of the domain controller.

[0024] Specifically, the first chip 310 is disposed on the side of the circuit board 300 facing the heat dissipation assembly 200, and the first chip 310 is a main chip that is responsible for the main information processing operation, and therefore generates a lot of heat. The heat dissipation assembly 200 is provided with a first heat dissipation boss 211, and a compressed elastic member 400 is further provided on the side of the heat dissipation assembly 200 that is away from the circuit board 300, with a first end of the elastic member 400 abutting against the housing and a second end of the elastic member 400 abutting against the heat dissipation assembly 200, and thus the first heat dissipation boss 211 abuts against the first chip 310 due to the elasticity of the elastic member 400, and the gap between the first heat dissipation boss 211 and the first chip 310 is reduced, which is advantageous to improving the heat dissipation speed of the first chip 310. The compression stroke amount of the elastic member 400 in the embodiment of the present application is designed to cover the sum of the height tolerance variation of the first chip 310, the manufacturing tolerance of the upper housing 110 when assembled with the circuit board 300, and the manufacturing tolerance of the first heat dissipation boss 211, ensuring that the gap between the first heat dissipation boss 211 and the first chip 310 after assembly is as small as possible.

[0025] In the embodiment of the present application, the housing is provided with a support portion 121 that is disposed on the undercover 120 and abuts against the circuit board 300, the first chip 310 is disposed on a first side of the circuit board 300, and the support portion 121 abuts against a second side of the circuit board 300 opposite to the first side, so that the support portion 121 provides a support force to the circuit board 300, the pressure applied from the elastic member 400 to the circuit board 300 is reduced, and the risk of cracking the first chip 310 can be reduced. Alternatively, it can be understood that by providing the support portion 121, the pressure applied from the elastic member 400 is ultimately transmitted to the undercover 120, and as a result, the stress applied to the circuit board 300 is reduced, and the occurrence of cracks in the first chip 310 due to bending of the circuit board 300 is avoided.

[0026] Optionally, the support 121 according to the embodiment of the present application comprises a protrusion provided on the undercover 120. In a plane parallel to the circuit board 300, the projection of the first chip 310 is within the projection range of the support 121, so that the projection area of ​​the support 121 completely covers the projection area of ​​the first chip 310, thereby providing a stable support force for the first chip 310.

[0027] In another possible embodiment, the support portion 121 can include a steel reinforcing structure, such as a rib member, attached to the undercover 120, and the multiple rib members can be arranged at intervals on the undercover 120 to provide stable support for the first chip 310 using multiple rib members.

[0028] In one possible embodiment, the elastic member 400 of the embodiment of the present application comprises a spring, and the housing is provided with a mounting groove 111, and the spring is disposed within the mounting groove 111, thereby utilizing the mounting groove to provide a circumferential restriction to the spring, thereby preventing instability and falling off during mounting and use of the spring.

[0029] For example, the number and positions of the springs may be determined depending on the shape of the heat dissipation assembly 200. For example, a plurality of springs may be arranged, and the plurality of springs may be distributed at intervals along the circumferential direction of the heat dissipation assembly 200, so that the heat dissipation assembly 200 can better abut against the circuit board 300 and apply a uniform force to each portion. As shown in Figures 1, 5, and 6, the heat dissipation assembly 200 in the embodiment of the present application is generally rectangular prism-shaped, so that four springs may be arranged to correspond to the four corners of the heat dissipation assembly 200, and accordingly, four mounting grooves 111 used for mounting the four springs may be arranged in the upper housing 110.

[0030] In another possible embodiment, the elastic member 400 may further include a structure such as a sealing ring or a leaf spring, in which case the elastic member 400 may be provided continuously around the circumference of the heat dissipation assembly 200 so that the heat dissipation assembly 200 abuts against the circuit board 300.

[0031] The elastic member 400 in the embodiment of the present application may be held in a compressed state by the assembly structure of the domain controller itself. For example, in order to compress the elastic member 400 between the upper housing 110 and the heat dissipation assembly 200, the undercover 120, the upper housing 110, and the circuit board 300 in the embodiment of the present application are connected by a first fastener 500. Please refer to Figures 1, 3, 5, 7, and 8. In the embodiment of the present application, the undercover 120 is provided with a plurality of first screw holes 122, and the first screw holes 122 may be protruding so that the first screw holes 122 provide partial support for the circuit board 300 and further reduce the stress that the circuit board 300 receives. The circuit board 300 is provided with a plurality of through holes 330 that correspond one-to-one to the first screw holes 122. The upper housing 110 is provided with a plurality of second screw holes 114 that correspond to the first screw holes 122 and the through holes 330. During assembly, the first fastener 500 passes through the first screw hole 122, the through hole 330, and the second screw hole 114 in sequence, and then connects the undercover 120, the upper housing 110, and the circuit board 300 together, while compressing the elastic member 400 between the upper housing 110 and the heat dissipation assembly 200. By locking the circuit board 300 to the housing with the first fastener 500, bending or deformation of the circuit board 300 can be prevented.

[0032] Optionally, the embodiment of the present application fills the space between the first heat dissipation boss 211 and the first chip 310 with a first heat conductive layer 610, which may be a heat conductive grease layer, such as a heat conductive silicone grease layer. Due to the existence of the elastic member 400, the gap between the first heat dissipation boss 211 and the first chip 310 is very small (tends to be set to zero), so the thickness of the first heat conductive layer 610 is very thin, and it can be seen that the provision of the first heat conductive layer 610 can accelerate the heat dissipation speed from the first chip 310 to the first heat dissipation boss 211, thereby eliminating the effect of the thermal resistance in the small gap between the first heat dissipation boss 211 and the first chip 310.

[0033] 1, 2, 6 and 7, a plurality of second chips 320 are further provided on the side of the circuit board 300 facing the heat dissipation assembly 200 according to the embodiment of the present application, the second chip 320 is an auxiliary chip and can assist the first chip 310 in processing information, and the plurality of second chips 320 can be arranged surrounding the first chip 310. A plurality of second heat dissipation bosses 212 are further provided on the heat dissipation assembly 200, and the plurality of second heat dissipation bosses 212 correspond one-to-one to the plurality of second chips 320, thereby dissipating heat from the plurality of second chips 320 using the plurality of second heat dissipation bosses 212.

[0034] Furthermore, a second heat conductive layer 620 is filled between the second heat dissipation boss 212 and the second chip 320, and the second heat conductive layer 620 may be a heat conductive grease layer, such as a heat conductive silicone grease layer. The second heat conductive layer 620 can accelerate the heat dissipation speed from the second chip 320 to the second heat dissipation boss 212. Since the embodiment of the present application is based on the first chip 310, the gap between the first heat dissipation boss 211 and the first chip 310 is first considered during design so that both are kept in a zero setting state, so that the gap between the second heat dissipation boss 212 and the second chip 320 is larger than the gap between the first heat dissipation boss 211 and the first chip 310, and the thickness of the second heat conductive layer 620 is larger than the thickness of the first heat conductive layer 610.

[0035] 6, the heat dissipation assembly 200 according to the embodiment of the present application includes a heat spreader plate 210 and a heat dissipation assembly body 220. The heat spreader plate 210 is disposed on the side of the heat dissipation assembly body 220 facing the circuit board 300. The heat spreader plate 210 can uniformly transfer heat to various parts of the heat dissipation assembly body 220, thereby improving the heat dissipation capacity. The first heat dissipation boss 211 and the multiple second heat dissipation bosses 212 are both disposed on the heat spreader plate 210.

[0036] Alternatively, the heat spreader plate 210 according to the embodiment of the present application may be integrally connected to the heat dissipation assembly body 220 by welding.

[0037] Furthermore, in the embodiment of the present application, a plurality of position limiting holes 221 are provided in the heat dissipation assembly body 220, and a plurality of position limiting posts 112 are provided in the upper housing 110 so as to correspond one-to-one with the plurality of position limiting holes 221 and to be inserted into the corresponding position limiting holes 221, thereby achieving positioning during installation of the heat dissipation assembly 200.

[0038] In order to further improve the heat dissipation capability of the heat dissipation assembly 200, the heat dissipation assembly 200 according to the embodiment of the present application further includes a plurality of heat dissipation fins 230 provided on the side of the heat dissipation assembly body 220 facing away from the circuit board 300, and the upper housing 110 further includes a heat dissipation through hole 113, and the plurality of heat dissipation fins 230 are arranged to penetrate the heat dissipation through hole 113, thereby enabling the heat of the heat dissipation assembly body 220 to be dissipated to the external environment as quickly as possible.

[0039] Furthermore, in the embodiment of the present application, a thermally conductive grease layer 700 is filled between the upper housing 110 and the heat dissipation assembly body 220, and the thermally conductive grease layer 700 can transfer partial heat of the heat dissipation assembly body 220 to the upper housing 110, thereby improving the heat dissipation capacity.

[0040] Specifically, as shown in Figures 1, 2, and 5, a thermally conductive grease groove 115 is provided in the upper housing 110 of the embodiment of the present application, and a thermally conductive grease layer 700 can be filled into the thermally conductive grease groove 115. After the housing is assembled, the thermally conductive grease layer 700 is brought into contact with the heat dissipation assembly body 220 to transfer heat from the heat dissipation assembly body 220 to the upper housing 110.

[0041] Optionally, the thermally conductive grease layer 700 of the embodiment of the present application can be positioned on the side of the elastic member 400 facing the heat dissipation fin 230, thus making it easier to insert the glue gun into the upper housing 110 and inject grease into the thermally conductive grease groove 115, and avoiding interference between the glue gun and other components.

[0042] As shown in FIG. 1, the heat dissipation assembly 200 according to an embodiment of the present application may further include a fan 240, which is disposed on the side of the heat dissipation fins 230 away from the circuit board 300, for example, in the heat dissipation through hole 113 in the upper housing 110. The fan 240 is intended to increase the heat conduction rate and improve the heat dissipation capacity by transferring heat from the heat dissipation fins 230 to the external environment.

[0043] A fan cover 250 is connected to the side of the fan 240 that faces away from the circuit board 300, and the fan 240, the fan cover 250, and the upper housing 110 are connected by a second fastener 800 and integrated together.

[0044] Specifically, as shown in FIGS. 1 and 4, the upper housing 110 according to the embodiment of the present application is further provided with a plurality of fan fixing structures 116, which may include screw holes or guide posts, etc., and a through hole corresponding to the fan cover 250 is provided, and the second fastener 800 is fixed to the screw hole after passing through the through hole in order to connect the fan 240, the fan cover 250, and the upper housing 110 together.

[0045] An embodiment of the present application further provides a removable platform comprising the above domain controller.

[0046] Specifically, the removable platform according to the embodiment of the present application may be, for example, a vehicle, and the domain controller is disposed in the vehicle to manage and control various functions of the vehicle by processing data information. The domain controller is used to ensure that the chip can better dissipate heat, while at the same time reducing the stress experienced by the chip and the circuit board, and reducing the risk of the chip cracking.

[0047] In the description of this application, the orientations or positional relationships indicated by the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial direction," "diameter," "circumferential," and the like are based on those shown in the drawings, and are intended only to facilitate and simplify the description of this application, and are not intended to indicate or imply that the devices or components shown must have a specific orientation, be configured, or operate in a specific orientation, and are not to be understood as limiting this application.

[0048] In the present application, the terms "attached," "coupled," "connected," "fixed," and the like, unless otherwise expressly specified and limited, shall be understood in a broad sense. For example, they may be fixedly connected, detachably connected, or integrally connected, or may be directly connected, indirectly connected through an intermediate medium, communicated inside two components, or an interactive relationship between two components. Those skilled in the art will understand the specific meaning of the above terms in the present application according to the specific situation.

[0049] In the description of this application, the terms "first" and "second" are used only for the convenience of describing different components, and are not to be understood as indicating or implying an order relationship or relative importance, or as implying the number of technical features being described. Thus, a feature defined by "first" or "second" may explicitly or implicitly include at least one of the feature.

[0050] Each example or embodiment in this application is described in order, with emphasis on the differences between each example and the other examples, and reference may be made to the same or similar parts of each example.

[0051] In the present description, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "examples," or "some examples" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the present application. In the present application, exemplary appearances of such terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0052] Finally, it should be noted that the above embodiments are merely for illustrating the technical solutions of the present application, and are not intended to limit the same. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art may still modify the technical solutions described in the above embodiments, or make equivalent substitutions for some or all of the technical features thereof, and such modifications or substitutions shall not depart from the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application. [Explanation of symbols]

[0053] 110, upper housing 111, mounting groove 112. Position restriction pillar 113, heat radiation passage hole 114, second screw hole 115, Thermally conductive grease groove 116 - Fan fixing structure 120. Undercover 121, Support part 122, first screw hole 200, heat dissipation assembly 210, Soaking plate 211, the first heat dissipation boss 212, the second heat dissipation boss 220, heat dissipation assembly body 221, position limit hole 230, heat dissipation fin 240, Fan 250, fan cover 300, circuit board 310, the first chip 320, second chip 330, through hole 400, elastic member 500, first fastener 610, first thermally conductive layer 620, second thermally conductive layer 700, thermally conductive grease layer 800, second fastener

Claims

1. 1. A domain controller comprising a housing, a heat dissipation assembly and a circuit board are stacked in the housing, a first chip is disposed on a side of the circuit board facing the heat dissipation assembly, a first heat dissipation boss is provided on the heat dissipation assembly, and a compressed elastic member is further provided on a side of the heat dissipation assembly facing away from the circuit board, a first end of the elastic member abuts against the housing and a second end of the elastic member abuts against the heat dissipation assembly, and the housing is provided with a support portion abutting against the circuit board so that the first heat dissipation boss abuts against the first chip.

2. 2. The domain controller of claim 1, wherein the resilient member comprises a spring, the housing has a mounting groove, and the spring is disposed within the mounting groove.

3. 2. The domain controller of claim 1, wherein the elastic member comprises a sealing ring or a leaf spring, and the elastic member is disposed along a circumferential direction of the heat dissipation assembly.

4. 2. The domain controller of claim 1, wherein the housing comprises an undercover and an upper housing, the circuit board is disposed adjacent to the undercover, the support is disposed on the undercover, and the undercover, the upper housing, and the circuit board are connected by a first fastener to compress the elastic member between the upper housing and the heat dissipation assembly.

5. 5. The domain controller according to claim 4, wherein a projection of the first chip is within a projection range of the support in a plane parallel to the circuit board.

6. 5. The domain controller according to claim 4, further comprising a plurality of second chips arranged surrounding the first chip on a side of the circuit board facing the heat dissipation assembly, and a plurality of second heat dissipation bosses in one-to-one correspondence with the plurality of second chips on the heat dissipation assembly.

7. 7. The domain controller according to claim 6, wherein a first thermally conductive layer is filled between the first heat dissipation boss and the first chip, and a second thermally conductive layer is filled between the second heat dissipation boss and the second chip, and a thickness of the second thermally conductive layer is greater than a thickness of the first thermally conductive layer.

8. 7. The domain controller of claim 6, wherein the heat dissipation assembly comprises a heat spreader plate and a heat dissipation assembly body, the heat spreader plate is disposed on a side of the heat dissipation assembly body facing the circuit board, and the first heat dissipation boss and the plurality of second heat dissipation bosses are both provided on the heat spreader plate.

9. 9. The domain controller of claim 8, wherein the heat dissipation assembly body is provided with a plurality of position limiting holes, the upper housing is provided with a plurality of position limiting posts, the plurality of position limiting posts correspond one-to-one with the plurality of position limiting holes, and the position limiting posts are configured to be inserted into the corresponding position limiting holes.

10. A removable platform comprising the domain controller according to any one of claims 1 to 9.

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