Wet process substrate clamping device
The clamping device addresses substrate damage and inefficiencies by using pivoting plates and a compression spring to securely clamp substrates of varying thicknesses, improving wet processing efficiency.
Patent Information
- Application Number
- JP2025001639U
- Authority / Receiving Office
- JP · JP
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2025-04-22
- Filing Date
- 2025-05-23
- Publication Date
- 2025-09-11
- Estimated Expiration
- 2035-05-23
AI Technical Summary
Conventional vertical conveyors using metal or magnetic clamps occupy excessive space, cause substrate damage through scratching and deformation, and fail to securely clamp thick substrates, leading to processing inefficiencies and yield loss.
A clamping device comprising first and second clamping plates with pivoting mechanisms and a compression spring, allowing for adjustable clamping of substrates of varying thicknesses using rubber or silicone pads, reducing the clamping area and ensuring secure fixation.
The device effectively reduces clamping area and securely clamps substrates of different thicknesses, minimizing damage and enhancing wet processing efficiency.
Smart Images
Figure 0003252789000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to the field of semiconductor wet processing, and more particularly to a substrate clamping device for wet processing. [Background technology]
[0002] In semiconductor wet processes, substrates undergo processes such as chemical spraying, electroplating, etching, cleaning, baking, etc. Conventional vertical conveyors vertically clamp the substrates to be processed and transport them along the required path to perform the above-mentioned processing operations. Summary of the Invention [Problem to be solved by the invention]
[0003] However, most conventional vertical conveyors use metal or magnetic clamps to clamp and secure the substrate, which occupies too much space when clamping the substrate, often affecting the wet process efficiency. Furthermore, the high hardness of metal clamps can cause scratches, indentations, and deformation on the substrate surface, affecting substrate yield. Furthermore, because magnetic clamps achieve clamping by magnetic force, the clamping force is insufficient for thick substrates, which can cause the substrate to fall during transport or processing, resulting in damage to the substrate and affecting the entire process.
[0004] After extensive research, the inventors discovered that the above object can be achieved by adopting the following configuration, and thus completed the present invention.
[0005] The present invention has been made in view of the above circumstances, and its main object is to provide a wet process substrate clamping device that can clamp substrates of different thicknesses in a fixed manner, effectively reducing the clamping area for the substrates, and making it more advantageous for wet processing of the substrates. [Means for solving the problem]
[0006] To achieve the above object, the wet process substrate clamping device of the present invention comprises a first clamping plate, a second clamping plate, a support rod, and a compression spring. The first clamping plate has a first clamping portion, a pair of first pivoting portions, and a first recess. The first clamping portion and the first recess are spaced apart in a first direction, and each of the first pivoting portions is spaced apart in a second direction and is located between the first clamping portion and the first recess along the first direction. The second clamping plate has a second clamping portion, a second pivoting portion, and a second recess. The second clamping portion and the second recess are spaced apart in the first direction, and the second pivoting portions are located between the second clamping portion and the second recess along the first direction and are located between the first pivoting portions along the second direction. The support rod penetrates the first and second pivot portions along the second direction, allowing the first and second clamping plates to pivot relative to the support rod between a clamping position and a release position. The compression spring has opposite ends housed in the first and second recesses, respectively, and resiliently abuts against the first and second clamping plates. When the first and second clamping plates are pushed by an external force, the first and second clamping plates pivot from the clamping position to the release position. When the external force is released from the first and second clamping plates, the compression spring pushes the first and second clamping plates to pivot to the clamping position.
[0007] According to one aspect of the present invention, the first clamping unit includes a pair of first clamping arms spaced apart along the second direction, and the second clamping unit includes a pair of second clamping arms spaced apart along the second direction, with each first clamping arm positioned to correspond to a corresponding second clamping arm.
[0008] According to one aspect of the present invention, the first clamping unit further includes a pair of first clamping pads, and the second clamping unit further includes a pair of second clamping pads, each of which is provided on one of the first clamping arms, and each of which is provided on one of the second clamping arms.
[0009] According to one aspect of the present invention, each first clamping pad includes a first fixing portion, a first perforated portion, and a first support portion, and each first clamping arm has a first through-hole. In each first clamping pad, the first perforated portion is accommodated in the corresponding first through-hole, the first fixing portion abuts against one side of the corresponding first clamping arm that is away from the second clamping plate, and the first support portion abuts against one side of the corresponding first clamping arm that faces the second clamping plate.
[0010] According to one aspect of the present invention, each second clamping pad includes a second fixing portion, a second perforated portion, and a second support portion, and each second clamping arm has a second through-hole. In each second clamping pad, the second perforated portion is accommodated in the corresponding second through-hole, the second fixing portion abuts against one side of the corresponding second clamping arm that is away from the first clamping plate, and the second support portion abuts against one side of the corresponding second clamping arm that faces the first clamping plate.
[0011] According to one aspect of the present invention, each of the first clamping pads and each of the second clamping pads is made of rubber or silicone.
[0012] According to one aspect of the present invention, each first clamping plate further has a first recess, which is located between each first pivot portion along the second direction and accommodates at least a portion of the second pivot portion.
[0013] According to one aspect of the present invention, each second clamping plate further has a pair of second retraction grooves, each of which is located on opposite sides of the second pivot portion along the second direction and accommodates at least a portion of each first pivot portion.
[0014] According to one aspect of the present invention, each first pivot portion extends from the first clamping plate toward the second clamping plate and has a first pivot hole. The second pivot portion extends from the second clamping plate toward the first clamping plate and has a second pivot hole. The first and second pivot holes are coaxially arranged.
[0015] According to one aspect of the present invention, the support rod has one first pivot hole, a second pivot hole and another first pivot hole extending in sequence along the second direction. [Effects of the Invention]
[0016] The present invention is configured as described above and therefore has the following advantages. In the wet process substrate clamping device of the present invention, both ends of the compression spring are accommodated in the first and second recesses, respectively, and are elastically abutted against the first and second clamping plates, so that the first clamping portion of the first clamping plate and the second clamping portion of the second clamping plate can clamp and fix substrates of different thicknesses, effectively reducing the clamping area of the substrate and allowing for advantageous wet process processing of the substrate.
[0017] At least the following points will become clear from the description and drawings to be described later. [Brief explanation of the drawings]
[0018] [Figure 1] 1 is a perspective view showing an example of application of a substrate clamping device for wet processing in accordance with an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view of the embodiment of the present invention, excluding the support rod; [Figure 3] 1 is a schematic exploded view of an embodiment of the present invention, showing the support rods removed; FIG. [Figure 4] FIG. 2 is a side view of the present invention without the support rod. [Figure 5] 1 is a cross-sectional side view of a substrate clamping device for wet processing according to an embodiment of the present invention, showing the device in a release position; [Figure 6] 1 is a cross-sectional side view of a substrate clamping device for wet processing according to an embodiment of the present invention, showing the device in a clamping position; DETAILED DESCRIPTION OF THE INVENTION
[0019] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the invention according to the claims, and not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.
[0020] It should be understood that in this specification, the orientations or positional relationships indicated by terms such as "front," "rear," "left side," "right side," "front end," "rear end," "end," "longitudinal," "lateral," "vertical," "top," and "bottom" are used merely for the convenience of depicting the present invention and for the sake of simplicity of explanation, based on the orientations or positional relationships shown in the accompanying drawings, and do not indicate or imply that the specified devices or components must have a specific orientation, structure, or operation, and therefore should not be construed as limiting conditions of the present invention.
[0021] As used herein, terms such as "first," "second," "third," "fourth," and "fifth" are merely used to describe various components, kits, regions, layers, or sections, and are not intended to limit these components, kits, regions, layers, or sections. These terms are used merely to distinguish one element, kit, region, layer, or section from another. Unless clearly indicated otherwise in the context, the terms "first," "second," "third," "fourth," "fifth," and the like, as used herein, do not imply any order or hierarchy.
[0022] As used herein, terms such as "substantially" and "about" are used to describe and depict small variations, unless otherwise defined. When linked to an event or circumstance, the term may include the exact time at which the event or circumstance occurred, as well as a close approximation to the time at which the event or circumstance occurred. For example, when linked to a numerical value, the term may include a variation range of ±10% or less of the numerical value, such as ±5% or less, ±4% or less, ±3% or less, ±2% or less, ±1% or less, ±0.5% or less, ±0.1% or less, or ±0.05% or less.
[0023] The detailed description and technical contents of the present invention are described below in conjunction with the accompanying drawings, which are for illustrative purposes only and are not intended to limit the present invention.
[0024] The wet process substrate clamping device according to the present invention is used to clamp a substrate A for wet process processing (e.g., liquid spraying, electroplating, etching, cleaning, baking, etc.). As shown in Figures 1 to 4, the wet process substrate clamping device according to the present invention includes a first clamping plate 10, a second clamping plate 20, a support rod 30, and a compression spring 40.
[0025] In this embodiment, the first clamping plate 10 has a rectangular plate shape, but the present invention is not limited thereto. It is understood that the outer shape of the first clamping plate 10 can be adjusted to meet different needs. The first clamping plate 10 includes a first clamping portion 11, a pair of first pivoting portions 12, a first pressing portion 13, and a first recess 14. The first recess 14 is formed in the first pressing portion 13. The first clamping portion 11 and the first pressing portion 13 are spaced apart along the first direction D1 and located at both ends of the first clamping plate 10, i.e., the first clamping portion 11 and the first recess 14 are spaced apart. Each first pivoting portion 12 is spaced apart along the second direction D2 and is located between the first clamping portion 11 and the first recess 14 of the first pressing portion 13 along the first direction D1. In this embodiment, the first direction D1 and the second direction D2 are substantially perpendicular to each other, but the present invention is not limited thereto, and the first direction D1 and the second direction D2 may be intersecting and non-parallel to each other. In other words, in this embodiment, the connecting line of each first pivot-connecting part 12 is substantially perpendicular to the connecting line of the first clamping part 11 and the first pressing part 13.
[0026] In this embodiment, the second clamping plate 20 has a rectangular plate shape, but the present invention is not limited thereto. It is understood that the outer shape of the second clamping plate 20 can be adjusted to meet different needs. The second clamping plate 20 has a second clamping portion 21, a second pivoting portion 22, a second pressing portion 23, and a second recess 24. The second recess 24 is formed in the second pressing portion 23. The second clamping portion 21 and the second pressing portion 23 are spaced apart from each other along the first direction D1, i.e., the second clamping portion 21 and the second recess 24 are spaced apart from each other. The second pivoting portion 22 is located between the second clamping portion 21 and the second recess 24 of the second pressing portion 23 along the first direction D1, and the second pivoting portion 22 is located between each of the first pivoting portions 12 along the second direction D2. In other words, in this embodiment, the second pivot portion 22, the second clamping portion 21, and the second pressing portion 23 are located on substantially the same straight line, and each of the first pivot portion 12 and the second pivot portion 22 is located on substantially another straight line, but the present invention is not limited thereto.
[0027] The support rod 30 extends through each of the first pivot portions 12 and the second pivot portions 22 along the second direction D2 to prevent the first clamping plate 10 and the second clamping plate 20 from separating from each other and to allow the first clamping plate 10 and the second clamping plate 20 to pivot relative to the support rod 30 between a clamping position P1 and a release position P2. Specifically, the support rod 30 is a round rod for pivoting the first clamping plate 10 and the second clamping plate 20. More specifically, each first pivot portion 12 extends from the first clamping plate 10 toward the second clamping plate 20 and has a first pivot hole 121. The second pivot portion 22 extends from the second clamping plate 20 toward the first clamping plate 10 and has a second pivot hole 221. The first pivot hole 121 and the second pivot hole 221 are arranged coaxially and are located on the same straight line. As a result, the support rod 30 can be inserted sequentially into one first pivot hole 121, the second pivot hole 221, and another first pivot hole 121 along the second direction D2, and the first clamping plate 10 and the second clamping plate 20 rotate relative to the support rod 30, thereby pivoting between the clamping position P1 and the release position P2.
[0028] Both ends of the compression spring 40 are accommodated in the first recess 14 of the first pressing portion 13 and the second recess 24 of the second pressing portion 23, respectively, so that both ends of the compression spring 40 elastically contact the first clamping plate 10 and the second clamping plate 20, respectively. Specifically, the first recess 14 is formed on one side of the first pressing portion 13 of the first clamping plate 10 facing the second clamping plate 20, and the second recess 24 is formed on one side of the second pressing portion 23 of the second clamping plate 20 facing the first clamping plate 10. This allows the compression spring 40 to elastically contact between the first clamping plate 10 and the second clamping plate 20, and applies a pre-compression elastic force to the first pressing portion 13 and the second pressing portion 23, thereby holding the first clamping plate 10 and the second clamping plate 20 at the clamping position P1 and clamping the substrate A (see FIGS. 2 and 4).
[0029] 5 and 6 are cross-sectional side views of a substrate clamping device for wet processing according to an embodiment of the present invention, showing the device at the release position P2 and the clamping position P1, respectively.
[0030] 5, when the first pressing portion 13 of the first clamping plate 10 and the second pressing portion 23 of the second clamping plate 20 are pressed by an external force (which may be pressed manually or by a mechanical device), the first clamping plate 10 and the second clamping plate 20 jointly compress the compression spring 40 and are pivoted from the clamping position P1 to the release position P2, with the first pivoting portion 12 and the second pivoting portion 22 as fulcrums. At this time, the first clamping portion 11 and the second clamping portion 21 assume an open state, and are able to release the substrate A or to clamp the substrate A between them and fix it.
[0031] 6, when the external force is released from the first clamping plate 10 and the second clamping plate 20, the compression spring 40 presses the first pressing portion 13 of the first clamping plate 10 and the second pressing portion 23 of the second clamping plate 20 by its own elasticity, and the first clamping plate 10 and the second clamping plate 20 pivot from the release position P2 to the clamping position P1, respectively, with the first pivoting portion 12 and the second pivoting portion 22 as fulcrums. At this time, the first clamping portion 11 and the second clamping portion 21 assume a closed state and clamp the substrate A so as to be fixed, or they abut against each other when the substrate A is not clamped therebetween.
[0032] In this embodiment, the first clamping unit 11 includes a pair of first clamping arms 111 spaced apart along the second direction D2, and the second clamping unit 21 includes a pair of second clamping arms 211 spaced apart along the second direction D2, but the present invention is not limited thereto. Each first clamping arm 111 is arranged to correspond to a corresponding second clamping arm 211. Therefore, when the first clamping unit 11 is positioned at the clamping position P1, the first clamping arms 111 of the first clamping unit 11 and the second clamping arms 211 of the second clamping unit 21 jointly clamp the substrate A. Thus, the first clamping plate 10 and the second clamping plate 20 securely clamp the substrate A due to the elastic force of the compression spring 40. Therefore, the first clamping plate 10 and the second clamping plate 20 clamp the substrate A in a fixed manner, corresponding to the substrates A of different thicknesses. That is, the lengths of the first clamping plate 10 and the second clamping plate 20 only need to be calculated and designed to match the thickness of the substrate A to be clamped, making it possible to process substrates of various thicknesses. In addition, the first clamping unit 11 and the second clamping unit 21 are provided with the first clamping arm 111 and the second clamping arm 211, respectively, which effectively reduces the clamping area of the substrate A while firmly clamping the substrate A, thereby facilitating wet processing of the substrate A.
[0033] More specifically, the first clamping unit 11 further includes a pair of first clamping pads 112, and the second clamping unit 21 further includes a pair of second clamping pads 212. Each first clamping pad 112 is installed on each first clamping arm 111, and each second clamping pad 212 is installed on each second clamping arm 211. As a result, the first clamping unit 11 and the second clamping unit 21 jointly clamp the substrate A using each first clamping pad 112 and each second clamping pad 212, respectively, thereby further reducing the clamping area of the substrate A. In this embodiment, each first clamping pad 112 and each second clamping pad 212 is made of rubber or silicone, so that the substrate A is not damaged when clamped. However, the materials of the first sandwiching pad 112 and the second sandwiching pad 212 are not limited to those mentioned above, and may be any elastic or soft material.
[0034] Specifically, each first clamping pad 112 includes a first fixing portion 1121, a first perforated portion 1122, and a first support portion 1123. The outer diameter of the first perforated portion 1122 is smaller than the first fixing portion 1121 and the first support portion 1123. In this embodiment, the first fixing portion 1121 is a rivet type, but the present invention is not limited thereto. Each first clamping arm 111 has a first through hole 1111 whose inner diameter corresponds to the outer diameter of the first perforated portion 1122. In each first clamping pad 112, the first perforated portion 1122 is received in the corresponding first through hole 1111, and the first fixing portion 1121 abuts against one side of the corresponding first clamping arm 111 that is away from the second clamping plate 20 and is fixed to the corresponding first clamping arm 111. The first support portion 1123 abuts against one side of the corresponding first clamping arm 111 facing the second clamping plate 20, and clamps the substrate A.
[0035] Each second clamping pad 212 includes a second fixing portion 2121, a second perforated portion 2122, and a second support portion 2123. The outer diameter of the second perforated portion 2122 is smaller than the second fixing portion 2121 and the second support portion 2123. In this embodiment, the second fixing portion 2121 is a rivet, but the present invention is not limited thereto. Each second clamping arm 211 has a second through hole 2111 whose inner diameter corresponds to the outer diameter of the second perforated portion 2122. In each second clamping pad 212, the second perforated portion 2122 is received in the corresponding second through hole 2111, and the second fixing portion 2121 abuts against one side of the corresponding second clamping arm 211 that is away from the first clamping plate 10 and is fixed to the corresponding second clamping arm 211. The second support portion 2123 abuts against one side of the corresponding second clamping arm 211 facing the first clamping plate 10, and clamps the substrate A.
[0036] Specifically, each first clamping plate 10 further has a first retraction groove 15, and each second clamping plate 20 further has a pair of second retraction grooves 25. The first retraction grooves 15 are located between the first pivot portions 12 along the second direction D2, so that at least a portion of the second pivot portion 22 of the second clamping plate 20 is accommodated therein, preventing interference. The second retraction grooves 25 are located on opposite sides of the second pivot portion 22 along the second direction D2, so that at least a portion of the first pivot portion 12 of the first clamping plate 10 is accommodated therein, preventing interference.
[0037] In the wet process substrate clamping device of the present invention, both ends of the compression spring 40 are accommodated in the first recess 14 and the second recess 24, respectively, and are elastically abutted against the first clamping plate 10 and the second clamping plate 20, so that the first clamping portion 11 of the first clamping plate 10 and the second clamping portion 21 of the second clamping plate 20 clamp and fix the substrates A of different thicknesses, while effectively reducing the clamping area of the substrates A, allowing for advantageous wet process processing of the substrates A.
[0038] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means devised in different embodiments are also included in the technical scope of the present invention. [Explanation of symbols]
[0039] 10 1st clamping plate 11 First clamping part 111 First clamping arm 1111 First through hole 112 First clamping pad 1121 1st fixed part 1122 First drilling section 1123 1st support part 12 1st pivot joint 121 1st pivot hole 13 First pressing part 14 First recess 15 First Evacuation Ditch 20 Second clamping plate 21 Second clamping part 211 Second clamping arm 2111 Second through hole 212 Second clamping pad 2121 Second fixed part 2122 2nd drilling section 2123 Second support part 22 2nd pivot joint 221 2nd pivot hole 23 Second pressing part 24 Second recess 25 Second evacuation trench 30 Support rod 40 compression spring A board D1 1st direction D2 2nd direction P1 Clamping position P2 release position
Claims
1. a first clamping plate having a first clamping portion, a pair of first pivoting portions, and a first recessed portion, the first clamping portion and the first recessed portion being spaced apart along a first direction, the first pivoting portions being spaced apart along a second direction, and the first clamping plate being located between the first clamping portion and the first recessed portion along the first direction; a second clamping plate having a second clamping portion, a second pivoting portion, and a second recessed portion, the second clamping portion and the second recessed portion being spaced apart along the first direction, the second pivoting portion being disposed between the second clamping portion and the second recessed portion along the first direction, and being disposed between the first pivoting portions along the second direction; a support rod that is provided to penetrate each of the first pivot mounting portion and the second pivot mounting portion along the second direction, and the first clamping plate and the second clamping plate are pivotable relative to the support rod between a clamping position and a release position; a compression spring whose ends are accommodated in the first recess and the second recess, respectively, and elastically contact the first clamping plate and the second clamping plate; When the first clamping plate and the second clamping plate are pushed by an external force, the first clamping plate and the second clamping plate are pivoted from the clamping position to the release position, A wet process substrate clamping device characterized in that when the external force is released from the first clamping plate and the second clamping plate, the first clamping plate and the second clamping plate are pushed so as to pivot to the clamping position by the compression spring.
2. 2. The wet process substrate clamping device of claim 1, wherein the first clamping unit includes a pair of first clamping arms spaced apart along the second direction, and the second clamping unit includes a pair of second clamping arms spaced apart along the second direction, and each of the first clamping arms is arranged to correspond to each of the second clamping arms.
3. 3. The wet process substrate clamping device of claim 2, wherein the first clamping unit further includes a pair of first clamping pads, the second clamping unit further includes a pair of second clamping pads, each of the first clamping pads being installed on each of the first clamping arms, and each of the second clamping pads being installed on each of the second clamping arms.
4. 4. The wet process substrate clamping device of claim 3, wherein each of the first clamping pads comprises a first fixing portion, a first perforated portion, and a first support portion, each of the first clamping arms has a first through hole, and in each of the first clamping pads, the first perforated portion is accommodated in the corresponding first through hole, the first fixing portion abuts against one side of the corresponding first clamping arm that is away from the second clamping plate, and the first support portion abuts against one side of the corresponding first clamping arm that faces the second clamping plate.
5. 4. The wet process substrate clamping device of claim 3, wherein each of the second clamping pads comprises a second fixing portion, a second perforated portion, and a second support portion, each of the second clamping arms has a second through hole, and in each of the second clamping pads, the second perforated portion is accommodated in the corresponding second through hole, the second fixing portion abuts against one side of the corresponding second clamping arm that is away from the first clamping plate, and the second support portion abuts against one side of the corresponding second clamping arm that faces the first clamping plate.
6. 4. The substrate clamping device for wet process according to claim 3, wherein each of the first clamping pads and each of the second clamping pads are made of rubber or silicon.
7. 2. The wet process substrate clamping device of claim 1, wherein each of the first clamping plates further has a first recession groove, the first recession groove being located between each of the first pivot portions along the second direction and accommodating at least a portion of the second pivot portion.
8. 2. The wet process substrate clamping device of claim 1, wherein each of the second clamping plates further has a pair of second recesses, each of the second recesses being located on opposite sides of the second pivot portion along the second direction, and each of the second recesses accommodates at least a portion of each of the first pivot portions.
9. 2. The wet process substrate clamping device of claim 1, wherein each of the first pivot portions extends from the first clamping plate toward the second clamping plate and has a first pivot hole, and each of the second pivot portions extends from the second clamping plate toward the first clamping plate and has a second pivot hole, and each of the first pivot holes and the second pivot holes are arranged coaxially.
10. 10. The wet process substrate clamping device of claim 9, wherein the support rod has one of the first pivot holes, the second pivot hole, and another of the first pivot holes extending in the second direction.