High power density coupled magnetic elements and modules with low DC resistance

Abstract

A high power density coupled magnetic element and coupled magnetic module with low DC resistance are provided, which can achieve a high power density, low loss coupled magnetic effect. [Solution] The coupled magnetic element 1A includes a first iron core 11, an external coil 13, an internal coil 14, and a second iron core 12. The first iron core has a cover body 111 and an iron core post 112, and the cover body has a first storage chamber S1, and the iron core post is located within the first storage chamber. The external coil is located within the first storage chamber and has a storage space S3. The internal coil is removably located within the storage space and has an arrangement space S4 for storing the iron core post. The second iron core is removably coupled horizontally to the first iron core to form a partition, and the external coil, internal coil, and iron core post are located within the partition.

Description

[Technical Field]

[0001] The present invention relates to a magnetic element, and more particularly to a coupled, low-loss, high-power-density coupled magnetic element. [Background technology]

[0002] In the prior art, the trend in the development of electronic devices is to aim for high performance and high power density. For example, in power supplies, the inductors generally used are large in volume and occupy a relatively large amount of space, so how to reduce the size of inductor elements has become an important issue in the related technical fields.

[0003] Most conventional inductor elements are single units that are installed separately. To achieve high voltage resistance, it is necessary to increase the volume or connect multiple small inductors in series using the conductive layers of the circuit board. However, this method occupies more internal space, which is detrimental to miniaturizing electronic devices. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention addresses the shortcomings of the prior art by providing a coupled magnetic element with low DC resistance and high power density. [Means for solving the problem]

[0005] The low DC resistance, high power density, coupled magnetic component includes a first core, an external coil, an internal coil, and a second core. The first core has a cover body and a core post. The cover body has two first side walls and one first connecting wall, each of which forms a first storage chamber. The core post is connected to the first connecting wall and located within the first storage chamber. The external coil is removably located within the first storage chamber and includes two first side posts and a first connecting portion, each end of which is connected to the top end of each first side post, and the first connecting portion and each first side post form a storage space. The internal coil is removably positioned in the storage space and includes two second side columns, one second connecting portion, and two bottom pin portions, with both ends of the second connecting portion respectively connecting to the top ends of the second side columns and the bottom ends of the second side columns respectively connecting to the bottom pin portions, with the second side columns, the second connecting portion, and the two bottom pin portions forming an arrangement space to store the core column. The second core is removably connected to the first core horizontally to form a partition, and the external coil, the internal coil, and the core column are positioned in the partition.

[0006] The present invention also provides a high-power-density coupled magnetic module with low DC resistance, which includes two first cores, two external coils, an internal coil set, and a second core. The first cores are arranged opposite each other, each having a cover body and a core post. The cover body has two first side walls and a first connecting wall, each of which forms a first storage chamber. The core post is connected to the first connecting wall and positioned within the first storage chamber. Each external coil is removably positioned within the first storage chamber, each having two first side posts and a first connecting portion, each of which has two first side posts and a first connecting portion, each of which is connected to the top end of the first side post, and the first connecting portion and each of the first side posts form a storage space. The internal coil set includes two internal coils, each removably positioned within a corresponding storage space. Each internal coil includes two second side columns, one second connecting portion, and two bottom pin portions. Both ends of the second connecting portion are connected to the top ends of the corresponding second side columns, and the bottom ends of the corresponding second side columns are connected to the bottom pin portions. The second side columns, the second connecting portion, and the two bottom pin portions form an arrangement space. Each arrangement space accommodates one core column, and two adjacent bottom pin portions of the two internal coils are connected to each other. The second core is removably positioned between the two adjacent core columns and above the multiple bottom pin portions. Two adjacent bottom pins of the two internal coils are connected to each other. The two cover bodies are connected to each other horizontally. [Effects of the Invention]

[0007] One of the beneficial effects of the present invention is that, according to certain embodiments, the present invention provides a coupled magnetic element and module with low DC resistance and high power density, which has the technical advantages of high voltage resistance and high power density. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view of a coupled magnetic element with low DC resistance and high power density according to an embodiment of the present invention; [Figure 2] FIG. 2 is an exploded schematic view of the embodiment shown in FIG. 1. [Figure 3] 2 is a schematic diagram of an internal coil according to an embodiment of the present invention; [Figure 4] 2 is a schematic diagram of an internal coil according to an embodiment of the present invention; [Figure 5] 1 is a perspective view of a coupled magnetic element having low DC resistance and high power density according to another embodiment of the present invention; [Figure 6] FIG. 6 is an exploded schematic view of the embodiment shown in FIG. 5. [Figure 7] 1 is a perspective view of a coupled magnetic module with low DC resistance and high power density in accordance with an embodiment of the present invention; [Figure 8] FIG. 8 is an exploded schematic view of the embodiment shown in FIG. 7. [Figure 9] 2 is a schematic diagram of an internal coil set according to one embodiment of the present invention; [Figure 10] 2 is a schematic diagram of an internal coil set according to one embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0009] Referring to Figures 1 to 4, Figure 1 is a perspective view of a coupled magnetic element 1A with low DC resistance and high power density according to one embodiment of the present invention. Figure 2 is an exploded view of the embodiment shown in Figure 1. Figure 3 is a schematic view of an internal coil 14 according to one embodiment of the present invention. Figure 4 is a schematic view of an internal coil 14 according to one embodiment of the present invention. The difference between Figures 3 and 4 is the viewing angle.

[0010] The coupled magnetic element 1A with low DC resistance and high power density includes a first iron core 11, an external coil 13, an internal coil 14, and a second iron core 12. The first iron core 11 has a cover body 111 and an iron core post 112. The cover body 111 has two first side walls 1111 and a first connecting wall 1112. Each of the first side walls 1111 and the first connecting wall 1112 forms a first storage chamber S1, and the iron core post 112 is connected to the first connecting wall 1112 and located within the first storage chamber S1. The external coil 13 is removably positioned in the first storage chamber S1 and includes two first side columns 131 and a first connecting portion 132, both ends of which are connected to the top ends of the first side columns 131, and the first connecting portion 132 and each of the first side columns 131 form a storage space S3. The internal coil 14 is removably positioned in the storage space S3 and includes two second side columns 141, a second connecting portion 142, and two bottom pin portions 143, both ends of which are connected to the top ends of the second side columns 141, and the bottom ends of the second side columns 141 are connected to the bottom pin portions 143. The second side columns 141, the second connecting portion 142, and the two bottom pin portions 143 form an arrangement space S4 to store the core column 112. The second iron core 12 is removably connected to the first iron core 11 in the horizontal direction D1 to form a partition S, and the external coil 13, the internal coil 14, and the iron core column 112 are located within the partition S.

[0011] According to this embodiment, each first side column 131 includes a pillar body 1311 and a pin 1312, and the pin 1312 is located at the bottom end of the pillar body 1311, extends toward the outside of the pillar body 1311, and protrudes from the first iron core 11.

[0012] 3 and 4, each bottom pin portion 143 includes a body 1431 and a base 1432. The body 1431 is connected to the base 1432. The two bases 1432 are arranged opposite each other and are located outside each of the second side columns 141. The body 1431 has a side 1431a and a hypotenuse 1431b. Each side 1431a is connected to each of the second side columns 141, and a slot G is formed between the two hypotenuses 1431b. Furthermore, according to one embodiment, the body 1431 has a geometric shape, and a slot G is formed between two matching bodies 1431. For example, in this embodiment, the body 1431 is generally a right triangle, with three sides being the hypotenuse 1431b, the side 1431a, and the base, and the base and the body 1432 being continuous (integrally formed). According to one embodiment, the width of the slot G (ie, the distance between the two hypotenuses 1431b) is in the range of 0.1 mm to 0.5 mm.

[0013] Referring again to FIG. 1, according to the embodiment shown in FIG. 1, the pin 1312 is located between two bases 1432, and the two bases 1432 correspond to each other.

[0014] The first iron core 11 and the second iron core 12 may be made of ferrite or a soft magnetic material. The cover body 111 and the iron core post 112 may be integrally molded or may be separate, separable elements. The outer shape of the second iron core 12 may be, for example, a flat plate. The external coil 13 has a generally arched shape. The external coil 13 may be, but is not limited to, a flat coil. The external coil 13 may be made of pressed copper plate or other types of conductive material. The internal coil 14 may be partially covered by the external coil 13. Each of the second side posts 141 and the second connecting portion 142 of the internal coil 14 has a generally different arched shape. The internal coil 14 may be, but is not limited to, a flat coil. The internal coil 14 may be made of pressed copper plate or other types of conductive material.

[0015] 1 to 4, the first iron core 11, the external coil 13, and the second iron core 12 form a first inductor, and the first iron core 11, the internal coil 14, and the second iron core 12 form a second inductor. The gap between the first iron core 11 and the second iron core 12 forms an air gap, and there are multiple air gaps between the first iron core 11 and the second iron core 12. The external coil 13 and the internal coil 14 are insulated from each other. According to this embodiment, by controlling the contact relationship between the first iron core 11, the second iron core 12, and the coils (the external coil 13 and the internal coil 14) and the arrangement of the air gaps, the magnetic flux path and coupling strength can be effectively adjusted, and the effect of precisely controlling the inductance can be achieved. At the same time, the coil winding method and core structure design shorten the conductor path and reduce conductor loss, effectively reducing the direct current resistance (DCR), achieving ultra-low DC resistance and improving the efficiency and overall power density of the coupled magnetic component.

[0016] In one embodiment, the coupled magnetic element 1A with low DC resistance and high power density of the present invention can also realize a magnetic element structure with ultra-high voltage resistance, low loss, and high power density by insulating the first iron core 11, the external coil 13, the internal coil 14, and the second iron core 12 with each other.

[0017] Referring to Figures 5 and 6, Figure 5 is a perspective view of a coupled magnetic element 1B with low DC resistance and high power density according to another embodiment of the present invention. Figure 6 is an exploded view of the embodiment shown in Figure 5. In this embodiment, the second core 12 includes two second side walls 121, a second connecting wall 122, and a core post 123. The second side walls 121 and the second connecting wall 122 form a second receiving chamber S2, and the core post 123 is located within the second receiving chamber S2. The second side wall 121 is detachably connected to the first side wall 1111. This structure allows the coupled magnetic element 1B with low DC resistance and high power density to achieve the effects of ultra-high voltage resistance, low loss, and high power density.

[0018] Referring to Figures 7 to 10, Figure 7 is a perspective view of a coupled magnetic module Z with low DC resistance and high power density according to one embodiment of the present invention. Figure 8 is an exploded schematic view of the embodiment shown in Figure 7. Figure 9 is a schematic view of an internal coil set 140 according to one embodiment of the present invention. Figure 10 is a schematic view of an internal coil set 140 according to one embodiment of the present invention. The difference between Figures 9 and 10 is the viewing angle.

[0019] The high power density coupled magnetic module Z with low DC resistance includes two first iron cores 11 (defined herein as first iron core 11A and first iron core 11B, respectively), two external coils 13 (defined herein as external coil 13A and external coil 13B, respectively), an internal coil set 140, and a second iron core 12.

[0020] The first core 11A and the first core 11B are disposed facing each other, and the first core 11A has a cover body 111A and a core post 112A, and the cover body 111A has two first side walls 1111A and a first connecting wall 1112A, and the first side walls 1111A and the first connecting wall 1112A together form a first storage chamber S1. The first core 11B has a cover body 111B and a core post 112B, and the cover body 111B has two first side walls 1111B and a first connecting wall 1112B, and the first side walls 1111B and the first connecting wall 1112B together form a first storage chamber S1'. The core pillar 112A is connected to the first connecting wall 1112A and is located within the first storage chamber S1, and the core pillar 112B is connected to the first connecting wall 1112B and is located within the first storage chamber S1'.

[0021] The external coil 13A is removably positioned within the first storage chamber S1, and the external coil 13B is removably positioned within the first storage chamber S1'. The external coil 13A includes two first side columns 131A and a first connecting portion 132A. Both ends of the first connecting portion 132A are connected to the top ends of the first side columns 131A, and the first connecting portion 132A and each first side column 131A form a storage space S3. The external coil 13B includes two first side columns 131B and a first connecting portion 132B. Both ends of the first connecting portion 132B are connected to the top ends of the first side columns 131B, and the first connecting portion 132B and each first side column 131B form a storage space S3'.

[0022] The internal coil set 140 includes two internal coils 14 (defined herein as internal coil 14A and internal coil 14B, respectively). The internal coil 14A is removably positioned within the storage space S3, and the internal coil 14B is removably positioned within the storage space S3'. The internal coil 14A includes two second side columns 141A, a second connecting portion 142A, and two bottom pin portions 143A. Both ends of the second connecting portion 142A are respectively connected to the top ends of the second side columns 141A, and the bottom ends of each second side column 141A are respectively connected to the bottom pin portions 143A. The second side columns 141A, the second connecting portion 142A, and the two bottom pin portions 143A form an arrangement space S4, which accommodates the core column 112A. The internal coil 14B includes two second side columns 141B, a second connecting portion 142B, and two bottom pin portions 143B. Both ends of the second connecting portion 142B are connected to the top ends of the second side columns 141B, and the bottom ends of each second side column 141B are connected to the bottom pin portions 143B. The second side columns 141B, the second connecting portion 142B, and the two bottom pin portions 143B form an arrangement space S4', which accommodates the core column 112B. In the internal coil 14A and the internal coil 14B, the adjacent bottom pin portions 143A and 143B are connected to each other (see FIG. 9).

[0023] Second core 12 is removably positioned between first core 11A and first core 11B and above bottom pin portion 143A and bottom pin portion 143B.

[0024] The cover main body 111A and the cover main body 111B are coupled to face each other in the horizontal direction D1.

[0025] As shown in FIGS. 7 and 8, the first side column 131A includes a pillar 1311A and a pin 1312A. The pin 1312A is located at the bottom end of the pillar 1311A and extends toward the outside of the pillar 1311A while protruding from the cover body 111A. The first side column 131B includes a pillar 1311B and a pin 1312B. The pin 1312B is located at the bottom end of the pillar 1311B and extends toward the outside of the pillar 1311B while protruding from the cover body 111B. Each of the pins 1312A is located between two adjacent bases 1432 (described in detail below), and the adjacent two bases 1432 correspond to each other. Each of the pins 1312B is located between two adjacent bases 1432 (described in detail below), and the adjacent two bases 1432 correspond to each other.

[0026] As shown in FIGS. 9 and 10 , each bottom pin portion 143A, 143B includes a main body 1431 and a base 1432. The main body 1431 is connected to the base 1432. Taking the bottom pin portion 143A as an example, the two bases 1432 are arranged opposite each other and are located on the exterior of each second side column 141A. The main body 1431 has a side 1431a and a hypotenuse 1431b. The side 1431a is connected to the second side column 141A, and a slot G is formed between each of the two adjacent hypotenuses 1431b. In this embodiment, the two bases 1432 connected together are defined as a common base 1430. The common base 1430 may be formed integrally or may be two bases 1432 that can be individually detached. It should be noted that the sizes of the two outer bases 1432 may be the same or different. In some embodiments, the size of the common substrate 1430 is different from the size of the outer substrate 1432, for example, it may be larger than the outer substrate 1432 or it may be smaller than the outer substrate 1432. The structural design of the common substrate 1430 not only enhances the mechanical stability and conductive reliability between the internal coils 14, but also effectively shortens the current conduction path, reduces contact resistance, and achieves the purpose of reducing direct current resistance (DCR), thereby improving the efficiency and power density of the entire module.

[0027] [Beneficial Effects of Examples] One of the beneficial effects of the present invention is that the high power density coupled magnetic element with low DC resistance provided by the present invention has the technical effects of high voltage resistance, low loss, and high power density, according to certain embodiments.

[0028] Furthermore, in one embodiment, the present invention's low-DC-resistance, high-power-density coupled magnetic element utilizes an optimized magnetic circuit design to achieve a high coupling coefficient between the two inductors, allowing them to interact with each other and improve energy conversion efficiency. At the same time, multiple air gaps are provided between the first and second cores, effectively improving the voltage-resistance capability and allowing for the adjustment of magnetic flux distribution and inductance as needed. Furthermore, the present invention's special coil winding and common substrate structural design effectively shorten the current path, reducing conductor losses and achieving ultra-low DC resistance (DCR). Through this comprehensive design, the present invention overcomes the technical bottlenecks of existing high-voltage, low-loss, and high-power-density magnetic elements on the market while simultaneously achieving low DC resistance, thereby contributing to the reduction of electronic device volume and meeting the demand for high performance and miniaturization.

[0029] In other words, the first inductor is formed by the first iron core, the outer coil, and the second iron core, and the second inductor is formed by the first iron core, the inner coil, and the second iron core. The air gap between the two allows the inductance to be adjusted to meet the circuit requirements. In one embodiment, the coupled magnetic element of the present invention integrates two inductor elements into a single piece, effectively reducing the number and footprint of elements on a printed circuit board assembly (PCBA), shortening the current conduction path, and reducing contact resistance and overall DC resistance. Meanwhile, the present invention maximizes space utilization and power density, enabling products to be more compact and functional, effectively resolving the challenges of the prior art.

[0030] The high power density coupled magnetic module with low DC resistance has a structure similar to the high power density coupled magnetic element with low DC resistance, and therefore has technical effects similar to the high power density coupled magnetic element with low DC resistance. [Explanation of symbols]

[0031] Z...High power density coupled magnetic module with low DC resistance 1A, 1B...High power density coupled magnetic elements with low DC resistance 11, 11A, 11B...First core 111, 111A, 111B...Cover body 1111, 1111A, 1111B...first side wall 1112, 1112A, 1112B...First connecting wall 112, 112A, 112B...Iron core pillar 12...Second core 121, 121A, 121B...Second side wall 122, 122A, 122B...Second connecting wall 123...Iron core pillar 13, 13A, 13B...External coil 131, 131A, 131B...First side pillar 1311,1311A,1311B...Column 1312,1312A,1312B...pins 132, 132A, 132B...first connection 140...Internal coil set 14, 14A, 14B...Internal coil 141, 141A, 141B...Second side pillar 142, 142A, 142B...Second connection 143, 143A, 143B...Bottom pin part 1430...Common base 1431...Main body 1431a...edge line 1431b...hypotenuse 1432...substrate D1...horizontal direction G...Slot S...Divider S1, S1'...First storage chamber S2...Second storage chamber S3, S3'...Storage space S4,S4'...location space

Claims

1. a first core having a cover body and a core post, the cover body having two first side walls and one first connecting wall, each of the first side walls and the first connecting wall forming a first storage chamber, the core post being connected to the first connecting wall and positioned within the first storage chamber; an external coil removably positioned within the first storage chamber, the external coil including two first side posts and a first connecting portion, both ends of the first connecting portion being connected to the top ends of the first side posts, the first connecting portion and each of the first side posts forming a storage space; an internal coil removably positioned within the storage space, the internal coil including two second side posts, one second connecting portion, and two bottom pin portions, each of which has both ends connected to a top end of one of the second side posts, and a bottom end of each of the second side posts connected to one of the bottom pin portions, the second side posts, the second connecting portions, and the bottom pin portions forming an arrangement space to store the core post; a second core removably coupled to the first core in a horizontal direction to form a partition, the second core having the outer coil, the inner coil, and the core pillar positioned within the partition; High power density coupled magnetic element with low DC resistance.

2. 2. The high power density coupled magnetic element with low DC resistance according to claim 1, wherein the second core includes two second side walls, one second connecting wall, and another core post, the second side walls and the second connecting wall forming a second storage chamber, the other core post being located within the second storage chamber, and each of the second side walls being removably connected to each of the first side walls.

3. 2. The coupled magnetic element with low DC resistance and high power density of claim 1, wherein each of the first side columns includes a column body and a pin, the pin being located at a bottom end of the column body, extending toward the outside of the column body, and protruding from the first iron core.

4. 2. The high power density coupled magnetic element with low DC resistance according to claim 1, wherein each of the bottom pin portions includes a main body and a base, the main body is connected to the base, the two bases are installed opposite each other, and each is located outside each of the second side columns, each of the main bodies has a side line and a hypotenuse, each of the side lines is connected to each of the second side columns, and there is a slot between the two hypotenuses.

5. 5. The high power density coupled magnetic element with low DC resistance according to claim 4, wherein the main body is generally a right triangle, the three sides of which are the hypotenuse, the edge, and the base, and the base is connected to the base.

6. two first cores arranged opposite to each other, each having a cover body and a core post, the cover body having two first side walls and one first connecting wall, each of the first side walls and the first connecting wall forming a first storage chamber, the core post being connected to the first connecting wall and positioned within the first storage chamber; two external coils, each removably positioned within each of the first storage chambers, each including two first side columns and one first connecting portion, both ends of the first connecting portion being connected to the top end of each of the first side columns, the first connecting portion and each of the first side columns forming a storage space; an internal coil set including two internal coils, each of the internal coils removably positioned in each of the storage spaces, each of the internal coils including two second side posts, one second connecting portion, and two bottom pin portions, each of which has both ends connected to the top end of each of the second side posts, and the bottom ends of each of the second side posts connected to each of the bottom pin portions, the second side posts, the second connecting portions, and each of the bottom pin portions form an arrangement space, each of which accommodates one of the iron core posts, and in each of the internal coils, two adjacent bottom pin portions are connected to each other; a second core removably positioned between two adjacent core posts and above the plurality of bottom pin portions; The cover bodies are joined to face each other in the horizontal direction. High power density coupled magnetic module with low DC resistance.

7. 7. The coupled magnetic module with low DC resistance and high power density as recited in claim 6, wherein each of the first side columns includes a column body and a pin, the pin being located at a bottom end of the column body, extending toward the outside of the column body, and protruding from the cover body.

8. 7. The coupled magnetic module with low DC resistance and high power density as claimed in claim 6, wherein each of the bottom pin portions includes a main body and a base, the main body is connected to the base, the two bases are installed opposite each other and are respectively located outside each of the second side columns, each of the main bodies has a side line and a hypotenuse, each of the side lines is respectively connected to each of the second side columns, and there is a slot between two adjacent hypotenuses.

9. 9. The coupled magnetic module with low DC resistance and high power density as claimed in claim 8, wherein each of the first side columns includes a column body and a pin, the pin being located at a bottom end of the column body, extending toward the outside of the column body, and protruding from the cover body, and each of the pins is located between two adjacent bases, and the two adjacent bases correspond to each other.

10. 9. The high power density coupled magnetic module with low DC resistance according to claim 8, wherein each of the main bodies is generally a right triangle, with three sides being the hypotenuse, the edge, and the base, and the base being connected to the base.

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