Fixing mechanism for rectangular flexible substrate, plasma device, and circuit board component

Abstract

This invention provides a fixing mechanism for a rectangular flexible substrate that can effectively secure the rectangular flexible substrate. [Solution] The fixing mechanism for the rectangular flexible substrate has an electrostatic chuck structure for adsorbing the rectangular flexible substrate and comprises a mounting module including a mounting plate with a plurality of ventilation holes, a gas cooling module that provides gas, a clamp module including a clamp ring and an exhaust frame and located above the mounting plate along the height direction, and a drive module connected to the mounting plate and linked to raise and lower the mounting plate in the height direction. The drive module drives the mounting plate to move upward from a first position to a second position, bringing at least one of the mounting plate and the rectangular flexible substrate into contact with the clamp module in the initial position, and continuously pushes the clamp module upward to stop the mounting plate at a third position and stop the clamp module at the clamp position, and the clamp ring presses and fixes the rectangular flexible substrate by its own weight.

Description

Technical Field

[0001] The present invention relates to a fixing mechanism, a process device, and a circuit board member, and particularly to a fixing mechanism for a rectangular flexible printed board, a plasma device, and a circuit board member manufactured thereby.

Background Art

[0002] For example, advanced packaging technologies such as Embedded die in substrate (EDS), Embedded passive in substrate (EPS), and Fan out panel level package (FOPLP) generally include a composite circuit board. The rectangular flexible printed board of the composite circuit board contains organic materials, and a plasma etching process is used to form precise circuits. In the plasma etching process, the rectangular flexible printed board is horizontally placed in a vacuum chamber, and a process gas is decomposed into radicals using a plasma source and uniformly contacted with the surface of the rectangular flexible printed board, and further chemical dry etching is performed. Alternatively, by applying an electric field in the vacuum chamber, plasma is made to collide with the surface of the rectangular flexible printed board in a specific direction to perform physical dry etching. However, when such a rectangular flexible printed board undergoes plasma etching, temperature-related problems occur, and the yield decreases due to the large area and warping of the rectangular flexible printed board.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Conventionally, to fix rectangular flexible substrates flat, tape was attached to the back surface of the substrate. However, this process is complicated and time-consuming, leading to a decrease in process speed. Furthermore, tape attachment is prone to generating air bubbles, affecting process yield, and the tape itself, being a polymer material, can be etched. For this reason, some manufacturers use electrostatic mounting plates as a fixing mechanism to adsorb the rectangular flexible substrates. However, even this method does not effectively improve the problem of warping of the rectangular flexible substrates, and there is room for improvement.

[0004] Therefore, how to improve the fixing mechanism for a rectangular flexible substrate so that the rectangular flexible substrate can be easily and effectively fixed is a problem that those skilled in the art will try to solve. [Means for solving the problem]

[0005] To solve the above problems, this invention provides a fixing mechanism for a rectangular flexible substrate, a plasma apparatus, and a circuit board member. The structural arrangement of the fixing mechanism for the rectangular flexible substrate allows for easy and effective fixing of the rectangular flexible substrate, and enables the formation of precise hole features in the manufactured circuit board member.

[0006] According to one embodiment of the present invention, a fixing mechanism for a rectangular flexible substrate having a thickness of less than 0.6 mm includes a mounting plate for arranging the rectangular flexible substrate, the mounting plate having an electrostatic chuck structure for adsorbing the rectangular flexible substrate and a mounting module including a plurality of ventilation holes distributed on the surface of the mounting plate, a gas cooling module for providing gas to flow to the surface through the plurality of ventilation holes, a clamp module including a clamp ring corresponding to the periphery of the mounting plate in the height direction and an exhaust frame connected to the clamp ring, and located above the mounting plate along the height direction, and a drive module connected to the mounting plate for interlocking to raise and lower the mounting plate in the height direction, the drive module driving the mounting plate to move from a first position upward to a second position. The mounting plate and the rectangular flexible substrate are brought into contact with the clamp module in their initial position, and the clamp module is continuously pushed upward to stop the mounting plate in a third position and the clamp module in the clamp position, the clamp ring presses and fixes the rectangular flexible substrate by its own weight, and an air chamber space is formed between the mounting plate and the rectangular flexible substrate. When the mounting plate is stopped in the third position and the electrostatic chuck structure attracts the rectangular flexible substrate, gas is sent into the air chamber space from the plurality of ventilation holes, generating an upward thrust along the height direction on the rectangular flexible substrate, and the electrostatic attraction force per unit area of ​​the electrostatic chuck structure is greater than the thrust per unit area of ​​the gas on the rectangular flexible substrate, providing a fixing mechanism for a rectangular flexible substrate.

[0007] As a result, the fixing mechanism for the rectangular flexible substrate can hold the rectangular flexible substrate in place using a mounting plate with an electrostatic chuck structure, and the mounting plate and the rectangular flexible substrate are driven by a drive module to raise the clamping ring, thereby pressing and fixing the rectangular flexible substrate by its own weight. This prevents the rectangular flexible substrate from warping, avoids damage to the rectangular flexible substrate caused by mechanical clamping, and achieves the objective of easily and effectively fixing the rectangular flexible substrate.

[0008] According to the fixing mechanism for the rectangular flexible substrate of the above embodiment, the gas pressure in the air chamber space may exceed 3 torr.

[0009] According to the fixing mechanism for the rectangular flexible substrate of the above embodiment, the mounting module is located below the mounting plate in the height direction and may further include a cooling plate for cooling the gas.

[0010] According to the fixing mechanism for the rectangular flexible substrate of the above embodiment, the exhaust frame may include a plurality of guide holes, and the clamp module further includes a plurality of guide pins, and when the clamp module is in its initial position, each guide pin is inserted into each guide hole.

[0011] According to another embodiment of the present invention, the present invention comprises a side ring wall forming an internal space, an upper electrode mechanism provided above the side ring wall along the height direction, and a rectangular flexible substrate fixing mechanism for fixing a rectangular flexible substrate having a thickness of less than 0.6 mm, wherein the rectangular flexible substrate fixing mechanism is a mounting module located in the internal space and facing the upper electrode mechanism, and includes a mounting plate for arranging the rectangular flexible substrate, the mounting plate having an electrostatic chuck structure for adsorbing the rectangular flexible substrate and including a plurality of ventilation holes distributed on the surface of the mounting plate, a gas cooling module for providing gas to flow to the surface through the plurality of ventilation holes, a clamping ring corresponding to the periphery of the mounting plate in the height direction, and an exhaust frame connected to the clamping ring, and a clamping module located in the internal space and positioned between the mounting plate and the upper electrode mechanism along the height direction, and connected to the mounting plate and raising and lowering the mounting plate in the height direction The plasma apparatus comprises a drive module for interlocking the movement, the drive module drives the mounting plate to move upward from a first position to a second position, bringing at least one of the mounting plate and the rectangular flexible substrate into contact with the clamp module in its initial position, and continuously pushing the clamp module upward to stop the mounting plate at a third position and the clamp module at the clamp position, the clamp ring pressing and fixing the rectangular flexible substrate by its own weight, and forming an air chamber space between the mounting plate and the rectangular flexible substrate, and when the mounting plate stops at the third position and the electrostatic chuck structure adsorbs the rectangular flexible substrate, gas is sent into the air chamber space from the plurality of ventilation holes and generates an upward thrust in the height direction on the rectangular flexible substrate, and the electrostatic adsorption force per unit area of ​​the electrostatic chuck structure is greater than the thrust per unit area of ​​the gas on the rectangular flexible substrate, providing a plasma apparatus.

[0012] As a result, the plasma apparatus can adsorb a rectangular flexible substrate using a mounting plate with an electrostatic chuck structure, and the mounting plate and the rectangular flexible substrate are driven by a drive module to raise the clamping ring, thereby pressing and fixing the rectangular flexible substrate by its own weight. This prevents warping of the rectangular flexible substrate, avoids damage to the rectangular flexible substrate due to mechanical clamping, and achieves the objective of easily and effectively fixing the rectangular flexible substrate.

[0013] According to the plasma apparatus of the above embodiment, the gas pressure in the air chamber space may exceed 3 torr.

[0014] According to the plasma apparatus of the above embodiment, the mounting module is located below the mounting plate in the height direction and may further include a cooling plate for cooling the gas.

[0015] According to the plasma apparatus of the above embodiment, the cooling plate may include a plurality of flow paths corresponding to the plurality of ventilation holes.

[0016] According to the plasma apparatus of the above embodiment, the gas cooling module may further include an airflow tube connected to a cooling plate, and the gas is transmitted along the plurality of flow paths to the plurality of vents.

[0017] According to the plasma apparatus of the above embodiment, when the internal space is in an atmospheric environment and the mounting plate is in the first position, the airflow tube may apply negative pressure to the plurality of ventilation holes to vacuum-adsorb the rectangular flexible substrate.

[0018] According to the plasma apparatus of the above embodiment, the mounting module may further include an insulating plate interposed between the cooling plate and the lower electrode plate, and a lower electrode plate provided below the cooling plate.

[0019] According to the plasma apparatus of the above embodiment, when the plasma apparatus is in a supply state, the mounting plate is in a first position, the internal space is in an atmospheric environment, and the rectangular flexible substrate is placed on the mounting plate. The gas cooling module applies negative pressure to the plurality of vents to draw the gas away from the plurality of vents, so that the mounting plate attracts the rectangular flexible substrate by vacuum. When the internal space is converted from an atmospheric environment to a vacuum environment, the electrostatic chuck structure is activated to attract the rectangular flexible substrate by electrostatics. When the drive module drives the mounting plate upward from the first position to a third position, the gas cooling module stops applying negative pressure to the plurality of vents and sends gas to the surface.

[0020] According to the plasma apparatus of the above embodiment, when the plasma apparatus is in the discharge state, the mounting plate is in the third position, the gas cooling module stops supplying gas to the air chamber space between the rectangular flexible substrate and the mounting plate, applies negative pressure to the plurality of vents to separate the gas from the plurality of vents, the drive module drives the mounting plate downward from the third position to the first position, and the electrostatic chuck structure is closed.

[0021] The plasma apparatus according to the above embodiment includes a stopper ring comprising an upper ring portion connected to the upper edge of the side ring wall, a spacing wall extending downward from the upper ring portion and located inside the side ring wall, and a receiving portion projecting inward from the distal end of the spacing wall, wherein when the clamp module is in its initial position, the exhaust frame may further include a stopper ring that is received by the receiving portion.

[0022] According to the plasma apparatus of the above embodiment, the exhaust frame may include a plurality of guide holes, and the clamp module further includes a plurality of guide pins, and when the exhaust frame is received by the receiving portion, each guide pin is inserted into each guide hole.

[0023] According to the plasma apparatus of the above embodiment, when the clamp module is positioned at the clamp position, the top of each guide pin may be lower than the exhaust frame.

[0024] According to the plasma device of the above embodiment, the exhaust frame may include an outer edge, an inner edge, and an exhaust member. The exhaust member is located between the outer edge and the inner edge, and the outer edge and the inner edge are respectively connected to two conductive sheets and grounded.

[0025] According to the plasma device of the above embodiment, the clamping ring may include an arm frame with one end connected to the inner edge, and a gasket provided at the other end of the arm frame and facing the mounting plate.

[0026] According to another embodiment of the present invention, there is provided a circuit board member formed by the plasma device of the above embodiment, including a rectangular flexible printed board and a plurality of conductive holes located on the rectangular flexible printed board.

[0027] Thereby, depending on the arrangement of the plasma device, precise conductive holes are formed in the circuit board member, which helps to form a precise circuit.

[0028] According to the circuit board member of the above embodiment, the rectangular flexible printed board includes an intermediate layer and a resin layer located on one side of the intermediate layer, and the plurality of conductive holes may be opened in the resin layer.

Brief Description of the Drawings

[0029] [Figure 1] It is a schematic side cross-sectional view showing a plasma device according to an embodiment of the present invention. [Figure 2] It is an exploded cross-sectional schematic view showing a part of the plasma device of the embodiment in FIG. 1. [Figure 3] It is an exploded schematic view showing the mounting module of the plasma device of the embodiment in FIG. 1. [Figure 4] It is a schematic side cross-sectional view showing a part of the plasma device of the embodiment in FIG. 1. [Figure 5] It is an exploded cross-sectional schematic view showing a part of the plasma device of the embodiment in FIG. 4. [Figure 6]This is a schematic diagram showing a circuit board component formed by the plasma apparatus of the embodiment shown in Figure 1. [Modes for carrying out the invention]

[0030] Embodiments of the present invention will be described below with reference to the drawings. For clarity, many practical details will also be described in the following description. However, readers should understand that these practical details do not limit the present invention. In other words, these practical details are not essential in some embodiments of the present invention. Also, for the sake of simplification of the drawings, certain conventional structures and elements are shown simply and schematically in the drawings, and repeated elements may be indicated by the same or similar reference numerals.

[0031] Furthermore, the terms "first," "second," "third," etc., used in this text are merely for describing different elements or components and do not restrict the elements / components themselves; therefore, the first element / component may also be called the second element / component. Moreover, the combinations of elements / components / mechanisms / modules used in this text are not common, ordinary, or conventional combinations generally known in this art, and whether the combination relationship can be easily completed by a person skilled in the art should not be judged by whether the elements / components / mechanisms / modules themselves are conventional.

[0032] Please refer to Figures 1 and 2. Figure 1 is a schematic side cross-sectional view showing a plasma apparatus according to one embodiment of the present invention, and Figure 2 is a schematic partial exploded cross-sectional view showing the plasma apparatus of the embodiment of Figure 1. The plasma apparatus (not shown) comprises a side ring wall 1210, an upper electrode mechanism 1300, and a fixing mechanism 1100 for a rectangular flexible substrate.

[0033] The side ring wall 1210 is formed surrounding the internal space S1. The upper electrode mechanism 1300 is provided above the side ring wall 1210 along the height direction Z. The rectangular flexible substrate fixing mechanism 1100 is used to fix the rectangular flexible substrate P11 (shown in Figure 6), and the thickness of the rectangular flexible substrate P11 is less than 0.6 mm. The rectangular flexible substrate fixing mechanism 1100 comprises a mounting module 1110, a gas cooling module (not shown), a clamp module 1120, and a drive module 1130. The mounting module 1110 is located in the internal space S1 so as to face the upper electrode mechanism 1300 and includes a mounting plate 1111. The mounting plate 1111 is used to position the rectangular flexible substrate P11 and has an electrostatic chuck structure for adsorbing the rectangular flexible substrate P11, and includes a plurality of ventilation holes 1111a (shown in Figure 3), the ventilation holes 1111a are distributed on the surface of the mounting plate 1111. The gas cooling module is for supplying gas to the surface through the vents 1111a. The clamp module 1120 is located in the internal space S1 and is positioned between the mounting plate 1111 and the upper electrode mechanism 1300 along the height direction Z. The clamp module 1120 includes a clamp ring 1121 and an exhaust frame 1122. The clamp ring 1121 corresponds to the periphery of the mounting plate 1111 in the height direction Z. The exhaust frame 1122 is connected to the clamp ring 1121. The drive module 1130 is connected to the mounting plate 1111 and is used to interlock the movement of the mounting plate 1111 to move up and down in the height direction Z. Here, the drive module 1130 moves the mounting plate 1111 upward from the first position to the second position, causing at least one of the mounting plate 1111 and the rectangular flexible substrate P11 to come into contact with the clamp module 1120 in its initial position, and then continuously pushes the clamp module 1120 upward to stop the mounting plate 1111 at the third position and stop the clamp module 1120 in the clamp position, and the clamp ring 1121 presses and fixes the rectangular flexible substrate P11 by its own weight and forms an air chamber space between the mounting plate 1111 and the rectangular flexible substrate P11.Here, the air chamber space is a minute gap formed by the surface roughness between the surface of the mounting plate 1111 and the rectangular flexible substrate P11, and the gas fills this gap, allowing the gas to remove the heat generated by the plasma irradiation of the rectangular flexible substrate P11. It should be noted that the air chamber space is extremely small and is not shown in the drawings, but the present invention is not limited to this. Here, when the mounting plate 1111 stops in the third position and the electrostatic chuck structure adsorbs the rectangular flexible substrate P11, gas is sent into the air chamber space from the ventilation hole 1111a, generating an upward thrust on the rectangular flexible substrate P11 along the height direction Z. The electrostatic adsorption force per unit area of ​​the electrostatic chuck structure is greater than the thrust per unit area of ​​the gas on the rectangular flexible substrate P11.

[0034] As a result, the plasma apparatus can adsorb the rectangular flexible substrate P11 using the mounting plate 1111 which has an electrostatic chuck structure, and the drive module 1130 drives the mounting plate 1111 and the rectangular flexible substrate P11 to push up the clamp ring 1121, pressing and fixing the rectangular flexible substrate P11 by its own weight. This prevents the rectangular flexible substrate P11 from warping and avoids damage to the rectangular flexible substrate P11 due to mechanical clamping. Furthermore, by sending gas into the airtight space between the back surface of the rectangular flexible substrate P11 and the mounting plate 1111 through the ventilation holes 1111a on the mounting plate 1111, the heat dissipation effect of the backside gas (BSG) is achieved, thereby achieving the objective of safely and effectively fixing the rectangular flexible substrate P11.

[0035] The plasma apparatus further comprises a chamber 1200 including a side ring wall 1210, an annular flange 1220, and a bottom wall 1230. The side ring wall 1210 has a rectangular cross-section in the width direction X and the length direction Y, the bottom wall 1230 is connected to the side ring wall 1210 to seal the lower opening of the internal space S1, and the annular flange 1220 is connected to the upper end of the side ring wall 1210. As a result, the plasma apparatus is more suitable for processing a rectangular flexible substrate P11 because the side ring wall 1210 is rectangular in shape.

[0036] The upper electrode mechanism 1300 may include a cover plate 1310, an air conduit 1320, and an air shower plate 1330, the cover plate 1310 may be mounted over the annular flange 1220 to seal the upper opening of the internal space S1. The air shower plate 1330 may be positioned below the cover plate 1310, leaving a space between it and the cover plate 1310, so as to divide the internal space S1 into a gas supply area between the air shower plate 1330 and the cover plate 1310 and an operating area below the air shower plate 1330. The air shower plate 1330 may include a plurality of through holes (not shown) to connect the gas supply area and the operating area. The gas conduit 1320 penetrates the cover plate 1310 and communicates with the gas supply area, thereby supplying process gas to the gas supply area and uniformly diffusing the process gas into the working area under a vacuum atmosphere through the through-holes in the air shower plate 1330. The process gas is, for example, a fluorine-based gas, a chlorine-based gas, oxygen, nitrogen, or an inert gas, and the inert gas may be, for example, argon or helium. In this embodiment, the material of the air shower plate 1330 may be metal, the capacitive coupling device of the plasma apparatus may be electrically connected to the air shower plate 1330, and the first power supply supplies first power to the capacitive coupling device so that the air shower plate 1330 can be used as an upper electrode and the process gas in the working area can be plasma-generated.

[0037] Please refer to Figures 3, 4, and 5 in conjunction with Figures 1 and 2. Figure 3 is an exploded schematic diagram showing the mounting module 1110 of the plasma apparatus in the embodiment of Figure 1. Figure 4 is a schematic side cross-sectional view showing a part of the plasma apparatus in the embodiment of Figure 1. Figure 5 is an exploded schematic cross-sectional view showing a part of the plasma apparatus in the embodiment of Figure 4. The mounting plate 1111 may, for example, have a two-electrode electrostatic chuck structure and may include a ceramic periphery plate, which can be used to localize the plasma and position the rectangular flexible substrate P11. A ceramic layer is formed in the interior area of ​​the ceramic periphery plate by spray coating, and two electrodes, positive and negative, are provided below the ceramic layer. By applying current, an electrostatic adsorption effect is produced, and the rectangular flexible substrate P11 can be adsorbed. In other embodiments, the mounting plate may have a single-electrode electrostatic chuck structure and may be manufactured from other materials, and is not limited to the above invention.

[0038] Furthermore, the mounting plate 1111 may further have a vacuum chuck structure that can be controlled to switch between electrostatic chuck mode and vacuum chuck mode. When a rectangular flexible substrate P11 is placed on the mounting plate 1111, the system can switch to vacuum chuck mode to attract the rectangular flexible substrate P11. When the internal space S1 is evacuated, the vacuum chuck mode is closed and the electrostatic chuck mode is opened to attract the rectangular flexible substrate P11 electrostatically. Finally, when the vacuum in the internal space S1 is broken, the electrostatic chuck mode is closed and the system switches to vacuum chuck mode to attract the rectangular flexible substrate P11, and then the vacuum chuck mode is closed to remove the rectangular flexible substrate P11. When the plasma device is in a supply state (placing the rectangular flexible substrate P11 in the internal space S1), the mounting plate 1111 is in a first position, the internal space S1 is in an atmospheric environment, and the rectangular flexible substrate P11 is placed on the mounting plate 1111. The gas cooling module applies negative pressure to the plurality of vent holes 1111a, drawing the gas away from the plurality of vent holes 1111a, causing the mounting plate 1111 to attract the rectangular flexible substrate P11 by vacuum. In other words, by generating negative pressure on the rectangular flexible substrate P11 through the plurality of vent holes 1111a, a pressure difference is created between the space above the rectangular flexible substrate P11 and the airtight space behind the rectangular flexible substrate P11, causing the rectangular flexible substrate P11 to be attracted to the mounting plate 1111. Next, the chamber 1200 of the plasma device starts vacuuming, and when the internal space S1 is converted from an atmospheric environment to a vacuum environment, the electrostatic chuck structure is activated and attracts the rectangular flexible substrate P11 by electrostatics. When the drive module 1130 drives the mounting plate 1111 upward from the first position to the third position, the gas cooling module stops applying negative pressure to the plurality of vent holes 1111a and sends gas to the surface of the mounting plate 1111. This fixes the rectangular flexible substrate P11 to the mounting plate 1111 and prepares the rectangular flexible substrate P11 for the plasma etching process.

[0039] After the plasma etching process of the plasma apparatus is completed, the plasma apparatus can be in an evacuation state (removing the rectangular flexible substrate P11 from the internal space S1), the mounting plate 1111 is in the third position, the gas cooling module stops supplying gas to the airtight space, applies negative pressure to the plurality of vents 1111a to draw the gas away from the plurality of vents 1111a, the drive module 1130 drives the mounting plate 1111 downward from the third position to the first position, and the electrostatic chuck structure is closed. When the internal space S1 is converted from a vacuum atmosphere to an atmospheric atmosphere (when the vacuum in the plasma apparatus chamber 1200 is broken), the gas cooling module stops applying negative pressure to the plurality of vents 1111a, and the mounting plate 1111 no longer attracts the rectangular flexible substrate P11. This allows the rectangular flexible substrate P11 to be removed from the mounting plate 1111.

[0040] As shown in Figures 2 and 3, the mounting module 1110 may further include a cooling plate 1112 located below the mounting plate 1111 in the height direction Z, which may include a plurality of flow channels 1112a corresponding to the plurality of ventilation holes 1111a. The gas cooling module may include an airflow tube 1140 connected to the cooling plate 1112 to supply gas to the plurality of flow channels 1112a. The air pressure in the air chamber space may be greater than 3 torr, which further improves the heat conduction capacity and effectively lowers the temperature of the rectangular flexible substrate P11. It should be noted that the gas cooling module may include, but is not limited to, a supply device for supplying gas, an exhaust device for separating the gas, and an airflow tube 1140.

[0041] Specifically, the cooling plate 1112 may be made of a metal material such as aluminum, and may have a heat dissipation effect and be used to cool the gas. Flow channels 1112a may be provided on the surface of the cooling plate 1112 facing the mounting plate 1111, distributed radially and concentrically and connected to the central hole of the cooling plate 1112. The airflow tube 1140 is connected to the cooling plate 1112 by penetrating a hole in the bottom wall 1230 and can communicate with the central hole, so that the gas supplied from the airflow tube 1140 can diffuse from the central hole into the flow channels 1112a. Since the vent hole 1111a corresponds to the flow channels 1112a, the gas can flow from below to above the mounting plate 1111, in particular into the airtight space between the mounting plate 1111 and the rectangular flexible substrate P11, via the flow channels 1112a.

[0042] The surface of the mounting plate 1111 is rough, which may prevent the rectangular flexible substrate P11 from being adsorbed flat. Therefore, by providing ventilation holes 1111a and supplying gas, the heat from the rectangular flexible substrate P11 can be guided to the mounting plate 1111 and further introduced to the cooling plate 1112. The gas may be, but is not limited to, a gas with good thermal conductivity such as helium or argon. In this embodiment, a cooling liquid may be passed through the cooling plate 1112 to improve the cooling effect, but is not limited to this.

[0043] The mounting module 1110 further includes an insulating plate 1113 interposed between the cooling plate 1112 and the lower electrode plate 1114, and a lower electrode plate 1114 provided below the cooling plate 1112. In other words, the lower electrode plate 1114, insulating plate 1113, cooling plate 1112, and mounting plate 1111 are stacked in order from bottom to top along the height direction Z, and the insulating plate 1113 can function as an insulator between the cooling plate 1112 and the lower electrode plate 1114. The lower electrode plate 1114 is connected to a second power supply, and the second power supply can supply a second power to the lower electrode plate 1114, so that the second power forms an electric field on the lower electrode plate 1114, allowing plasma to move from the upper electrode mechanism 1300 to the mounting plate 1111 and etch the rectangular flexible substrate P11.

[0044] The drive module 1130 may include a lift rod, etc., connected to the lower electrode plate 1114, which can raise or lower the lower electrode plate 1114, the insulating plate 1113, the cooling plate 1112, and the mounting plate 1111 along the height direction Z. The structure of the drive module 1130 is not the focus of the improvements of this invention, and details will not be repeated.

[0045] As shown in Figures 4 and 5, the exhaust frame 1122 may include an outer edge 1122a, an inner edge 1122b, and exhaust members 1122c. The exhaust members 1122c are located between the outer edge 1122a and the inner edge 1122b, and the outer edge 1122a and the inner edge 1122b are connected to two conductive sheets 1124 and 1125, respectively, and grounded. Specifically, the exhaust frame 1122 may include a plate body (not shown), where the outer edge 1122a is the side of the plate body closer to the side ring wall 1210, and the inner edge 1122b is the side of the plate body away from the side ring wall 1210. There are multiple exhaust members 1122c, which have a hollow structure and can penetrate the portion between the outer edge 1122a and the inner edge 1122b of the plate body. The plate body is made of a metal material, and the conductive sheets 1124 and 1125 are made of copper and are flexible. The conductive sheet 1124 is connected to the side ring wall 1210 via the outer edge 1122a and the stopper ring 1400 (which will be described in detail later), and the conductive sheet 1125 can be grounded via the inner edge 1122b and the bottom wall 1230.

[0046] The exhaust frame 1122 is positioned above the plate body so as to be bolted to the plate body, and may further include an exhaust net layer 1122d containing a plurality of exhaust holes, some of which can correspond to exhaust members 1122c. As shown in Figures 1 and 2, the exhaust frame 1122 and clamp ring 1121 can further divide the internal space S1 into an exhaust region below the working region, and the plasma flows from the working region to the exhaust region via the exhaust net layer 1122d and exhaust members 1122c, and the plasma is electrically neutralized because the exhaust frame 1122 is grounded, thereby achieving the effect of preventing damage to the elements when the plasma leaves.

[0047] The exhaust frame 1122 may further include a plurality of guide holes 1122e arranged at intervals along its outer edge 1122a. The clamp module 1120 may further include a plurality of guide pins 1123 that are inserted into each guide hole 1122e when the clamp module 1120 is in its initial position. This allows the exhaust frame 1122 to be guided by the guide pins 1123 when it moves up or down. Furthermore, when the clamp module 1120 is raised and positioned in the clamp position, the top of each guide pin 1123 may be lower than the exhaust frame 1122. Because the temperature in the operating region is high, if the guide pin 1123 is higher than the exhaust frame 1122 when the clamp module 1120 is positioned in the clamp position, it may expand due to the temperature and interfere with the guide hole 1122e. Therefore, the smooth operation can be improved by arranging the structure such that the top of the guide pin 1123 is lower than the exhaust frame 1122 when the clamp module 1120 is in the clamp position.

[0048] The clamp ring 1121 may include an arm frame 1121a, one end of which is connected to an inner edge 1122b, and a gasket 1121b provided at the other end of the arm frame 1121a and facing the mounting plate 1111. In this embodiment, the arm frame 1121a may be constructed by connecting a plurality of frame parts (not shown) to facilitate manufacturing, but in other embodiments, it may be integrally molded, but is not limited to the above invention. The arm frame 1121a may include a gasket groove (not shown), and the gasket 1121b may be housed in the gasket groove and have a portion protruding. The gasket 1121b may be made of an elastic material such as rubber, so that when the clamp ring 1121 is pressed by its own weight, the gasket 1121b contacts the rectangular flexible substrate P11, thereby preventing damage to the rectangular flexible substrate P11.

[0049] The plasma apparatus may further include a stopper ring 1400 comprising an upper ring portion 1410, a spacing wall 1420, and a receiving portion 1430. The upper ring portion 1410 is connected to the upper edge of the side ring wall 1210. The spacing wall 1420 is located inside the side ring wall 1210 so as to extend downward from the upper ring portion 1410. The receiving portion 1430 protrudes inward from the distal end of the spacing wall 1420. When the clamp module 1120 is in its initial position, the exhaust frame 1122 can be received by the receiving portion 1430.

[0050] Specifically, the upper ring portion 1410 is connected between the upper electrode mechanism 1300 and the annular flange 1220, and can therefore be indirectly connected to the side ring wall 1210 via the annular flange 1220. The spacing wall 1420 extends downward along the height direction Z at a constant height and approaches the exhaust frame 1122. In this embodiment, the guide pin 1123 is fastened to the spacing wall 1420, and the side surface of the guide hole 1122e may be an open structure, thereby accommodating the guide pin 1123 fastened to the spacing wall 1420. In other embodiments, the guide pin may be provided in the receiving portion, and the guide hole may be a complete columnar hole, but is not limited to the above.

[0051] As shown in Figures 1 and 2, initially, the mounting plate 1111 is in the first position and the clamp module 1120 is in its initial position. In this case, the door of the chamber 1200 can be opened and the rectangular flexible substrate P11 can be placed on the mounting plate 1111. Subsequently, the drive module 1130 moves the mounting plate 1111 upward to the second position, allowing the rectangular flexible substrate P11 to come into contact with the clamp ring 1121. The drive module 1130 continues to operate, pushing the clamp ring 1121 and exhaust frame 1122 upward, until, as shown in Figures 4 and 5, the mounting plate 1111 stops in the third position, the clamp module 1120 stops in the clamp position, and the clamp ring 1121 presses and secures the rectangular flexible substrate P11 by its own weight.

[0052] Please refer to Figure 6, a schematic diagram showing a circuit board member P1 formed by the plasma apparatus of the embodiment shown in Figure 1. The circuit board member P1 may be formed by the plasma apparatus and includes a rectangular flexible substrate P11 and a plurality of conductive holes P12, the plurality of conductive holes P12 located on the rectangular flexible substrate P11.

[0053] This allows for the formation of precise conductive holes P12 in the circuit board member P1 by arranging the plasma device, which helps in the formation of a precise circuit.

[0054] Specifically, the rectangular flexible substrate P11 may include an intermediate layer P11a and a resin layer P11b located on one side of the intermediate layer P11a, and conductive holes P12 may be formed in the resin layer P11b. In the embodiment shown in Figure 6, the rectangular flexible substrate P11 includes two resin layers P11b located on both sides of the intermediate layer P11a, and may further include two metal layers P11c located on the side of the two resin layers P11b away from the intermediate layer P11a. Before etching with a plasma device, a plurality of micro-holes P11d are first formed in the two metal layers P11c by a laser, and when entered into the plasma device, the plasma can etch the resin layer P11b within the micro-holes P11d, thereby forming conductive holes P12 of good shape. In other embodiments, the substrate may not include a metal layer and may include a mask layer. Plasma can etch resin layers not covered by a mask layer, and the circuit board material may be a modified semi-additive process (mSAP) circuit board material, a photoimageable dielectric (PID) resin circuit board material, or an FOPLP circuit board material, but is not limited to the above invention.

[0055] As can be seen from the above embodiments, the rectangular flexible substrate fixing mechanism and plasma apparatus of the present invention can achieve the following effects: 1. By adsorbing the rectangular flexible substrate with a mounting plate having an electrostatic chuck structure, and driving the mounting plate and the rectangular flexible substrate with a drive module to push up the clamp ring, the rectangular flexible substrate is pressed and fixed by its own weight, thereby preventing warping of the rectangular flexible substrate, avoiding damage to the rectangular flexible substrate due to mechanical clamping, and achieving the objective of fixing the rectangular flexible substrate easily and effectively. 2. The combination of guide pins and guide holes can assist in guiding the upward movement of the clamp ring. 3. When the clamp module is positioned at the clamp position, the top of the guide pin is lower than the exhaust frame, thus avoiding the effect of thermal expansion of the guide pin on operation. 4. By grounding the exhaust frame, electrical neutralization during plasma discharge can be achieved, thus avoiding damage to the elements. 5. By arranging the clamp ring to include a gasket, damage to the rectangular flexible substrate due to the clamp ring can be avoided. Furthermore, the plasma apparatus of this invention can form conductive holes of good shape on a rectangular flexible substrate, thereby contributing to improved accuracy of subsequent circuit board components.

[0056] Although the present invention was conceived by the embodiments described above, these embodiments do not limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention is defined by the attached utility model claims. [Explanation of Symbols]

[0057] 1100: Fixing mechanism for rectangular flexible substrate 1110: Mounting module 1111: Mounting plate 1111a: Ventilation holes 1112: Cooling plate 1112a: Flow channel 1113: Insulating board 1114: Lower electrode plate 1120: Clamp Module 1121: Clamp Ring 1121a: Arm frame 1121b: Gasket 1122: Exhaust frame 1122a: Outer edge 1122b: Common marital 1122c: Exhaust component 1122d: Exhaust net layer 1122e: Guide hole 1123: Guide pin 1124, 1125: Conductive sheet 1130: Drive Module 1140: Airflow tube 1200: Chamber 1210: Side ring wall 1220: Annular flange 1230: Bottom wall 1300: Upper electrode mechanism 1310: Lid plate 1320: Air conduit 1330: Air shower board 1400: Stopper ring 1410: Upper ring section 1420: Spacing wall 1430: Receiving part P1: Circuit board component P11: Rectangular Flexible Circuit Board P11a: Middle class P11b: Resin layer P11c: Metal layer P11d: Micropore P12: Conductive hole S1: Internal space X: Width direction Y: Length direction Z: Height direction

Claims

1. A fixing mechanism for a rectangular flexible substrate with a thickness of less than 0.6 mm, The mounting plate includes a mounting plate for arranging the rectangular flexible substrate, the mounting plate having an electrostatic chuck structure for adsorbing the rectangular flexible substrate, and a mounting module including a plurality of ventilation holes distributed on the surface of the mounting plate, A gas cooling module for providing gas to flow to the surface through the plurality of vents, A clamping module located above the aforementioned mounting plate along the height direction, which includes a clamping ring corresponding to the periphery of the mounting plate described above in the height direction, and an exhaust frame connected to the clamping ring, A drive module connected to the mounting plate and linked to move the mounting plate up and down in the height direction, Equipped with, The drive module drives the mounting plate described above to move upward from the first position to the second position, bringing at least one of the mounting plate and the rectangular flexible substrate into contact with the clamp module in its initial position, and continuously pushes the clamp module upward to stop the mounting plate described above at the third position and stop the clamp module in the clamp position, the clamp ring presses and fixes the rectangular flexible substrate by its own weight, and forms an air chamber space between the mounting plate described above and the rectangular flexible substrate. A fixing mechanism for a rectangular flexible substrate, wherein when the mounting plate stops at the third position and the electrostatic chuck structure attracts the rectangular flexible substrate, the gas is sent into the air chamber space from the plurality of ventilation holes and generates an upward thrust along the height direction on the rectangular flexible substrate, and the electrostatic attraction force per unit area of ​​the electrostatic chuck structure is greater than the thrust per unit area of ​​the gas on the rectangular flexible substrate.

2. The fixing mechanism for a rectangular flexible substrate according to claim 1, wherein the gas pressure in the air chamber space exceeds 3 torr.

3. The fixing mechanism for a rectangular flexible substrate according to claim 1, wherein the mounting module is located below the mounting plate in the height direction and further includes a cooling plate for cooling the gas.

4. The fixing mechanism for a rectangular flexible substrate according to claim 1, wherein the exhaust frame includes a plurality of guide holes, and the clamp module further includes a plurality of guide pins, and when the clamp module is in the initial position, each of the guide pins is inserted into each of the plurality of guide holes.

5. Side ring walls that surround the internal space, An upper electrode mechanism provided above the side ring wall along the height direction, A fixing mechanism for a rectangular flexible substrate with a thickness of less than 0.6 mm, Equipped with, The fixing mechanism for the rectangular flexible substrate is: A mounting module located in the aforementioned internal space and facing the aforementioned upper electrode mechanism, comprising a mounting plate for arranging the rectangular flexible substrate, wherein the mounting plate has an electrostatic chuck structure for adsorbing the rectangular flexible substrate, and comprises a plurality of ventilation holes distributed on the surface of the mounting plate, A gas cooling module for providing gas to flow to the surface through the plurality of vents, A clamping module is located in the internal space and positioned between the aforementioned mounting plate and the upper electrode mechanism, including a clamping ring corresponding to the periphery of the mounting plate in the height direction, and an exhaust frame connected to the clamping ring, and is located in the height direction. A drive module connected to the mounting plate and linked to move the mounting plate up and down in the height direction, Equipped with, The drive module drives the mounting plate described above to move upward from the first position to the second position, bringing at least one of the mounting plate and the rectangular flexible substrate into contact with the clamp module in its initial position, and continuously pushes the clamp module upward to stop the mounting plate described above at the third position and stop the clamp module in the clamp position, the clamp ring pressing and fixing the rectangular flexible substrate by its own weight, and forming an air chamber space between the mounting plate described above and the rectangular flexible substrate. A plasma apparatus in which, when the mounting plate stops at the third position and the electrostatic chuck structure adsorbs the rectangular flexible substrate, the gas is sent into the air chamber space from the plurality of ventilation holes and generates an upward thrust along the height direction on the rectangular flexible substrate, and the electrostatic adsorption force per unit area of ​​the electrostatic chuck structure is greater than the thrust per unit area of ​​the gas on the rectangular flexible substrate.

6. The plasma apparatus according to claim 5, wherein the gas pressure in the aforementioned air chamber space exceeds 3 torr.

7. The plasma apparatus according to claim 6, wherein the mounting module is located below the mounting plate described above in the height direction and further includes a cooling plate for cooling the gas.

8. The plasma apparatus according to claim 7, wherein the cooling plate includes a plurality of flow paths corresponding to the plurality of ventilation holes.

9. The plasma apparatus according to claim 8, wherein the gas cooling module includes an airflow tube connected to the cooling plate, and the gas is transmitted along the plurality of flow paths to the plurality of vents.

10. The plasma apparatus according to claim 9, wherein, when the internal space is in an atmospheric environment and the mounting plate described above is in the first position, the airflow tube applies negative pressure to the plurality of ventilation holes to vacuum adsorb the rectangular flexible substrate.

11. The plasma apparatus according to claim 7, further comprising an insulating plate interposed between the cooling plate and the lower electrode plate, and a lower electrode plate provided below the cooling plate, in the mounting module.

12. When the plasma apparatus is in a supply state, the mounting plate described above is in the first position, the internal space is in an atmospheric environment, and the rectangular flexible substrate is placed on the mounting plate described above, the gas cooling module applies negative pressure to the plurality of vents to draw the gas away from the plurality of vents so that the mounting plate attracts the rectangular flexible substrate by vacuum, and when the internal space is converted from an atmospheric environment to a vacuum environment, the electrostatic chuck structure is activated to attract the rectangular flexible substrate by electrostatics, and when the drive module drives the mounting plate described above to move upward from the first position to the third position, the gas cooling module stops applying negative pressure to the plurality of vents and sends the gas to the surface, according to claim 5.

13. The plasma apparatus according to claim 5, wherein when the plasma apparatus is in an exhaust state, the mounting plate described above is in the third position, the gas cooling module stops supplying the gas to the air chamber space between the rectangular flexible substrate and the mounting plate described above, applies negative pressure to the plurality of vents to separate the gas from the plurality of vents, the drive module drives the mounting plate described above to move downward from the third position to the first position, and the electrostatic chuck structure is closed.

14. The upper ring portion connected to the upper edge of the side ring wall, A spacing wall extending downward from the upper ring portion and located on the inner side of the side ring wall, A receiving portion protruding inward from the distal end of the aforementioned gap wall, It is a stopper ring that includes, The plasma apparatus according to claim 5, wherein, when the clamp module is in the initial position, the exhaust frame further comprises a stopper ring that is received by the receiving portion.

15. The plasma apparatus according to claim 14, wherein the exhaust frame includes a plurality of guide holes, and the clamp module further includes a plurality of guide pins, and when the exhaust frame is received by the receiving portion, each of the plurality of guide pins is inserted into each of the plurality of guide holes.

16. The plasma apparatus according to claim 15, wherein, when the clamp module is positioned at the clamp position, the top of each of the plurality of guide pins is lower than the exhaust frame.

17. The plasma apparatus according to claim 5, wherein the exhaust frame includes an outer edge, an inner edge, and an exhaust member, the exhaust member being located between the outer edge and the inner edge, and the outer edge and the inner edge are each connected to two conductive sheets and grounded.

18. The plasma apparatus according to claim 17, wherein the clamp ring includes an arm frame with one end connected to the inner edge, and a gasket provided at the other end of the arm frame and facing the aforementioned mounting plate.

19. A circuit board member formed by the plasma apparatus described in claim 5, The rectangular flexible substrate and, Multiple conductive holes located in the rectangular flexible substrate, Circuit board components including these components.

20. The rectangular flexible substrate is The middle class, A resin layer located on one side of the intermediate layer, Includes, The circuit board member according to claim 19, wherein the plurality of conductive holes are formed in the resin layer.

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