Flexible light tape arranged in series

Abstract

This invention provides a flexible light tape that can be easily cut to the required length, suppressing the generation of scraps and excess materials, and reducing manufacturing and processing costs. [Solution] The series-arranged flexible light tape comprises a flexible substrate 1, on both sides of the flexible substrate 1, positive electrode wiring 2 and negative electrode wiring 3, respectively, and multiple connection areas 11 are provided at equal intervals on both sides of the surface of the flexible substrate 1. In the connection areas 11, a portion of the positive electrode wiring 2 and negative electrode wiring 3 is exposed. Based on the positive electrode wiring 2 and negative electrode wiring 3, multiple resistor / capacitor components 4 and flip chips 5 are mounted in series in the center of the surface of the flexible substrate 1. Fluorescent resin 6 is provided on the surfaces of the resistor / capacitor components 4 and flip chips 5. In addition, a center marker 12 is provided in each connection area 11. There is no need to pre-manufacture light tapes of a specific standard, and they can be accurately cut at the connection areas according to the length actually required. Furthermore, since power supply connections can be made directly using the connection areas at the cut points, no scraps or excess materials are generated, and the connection process is unnecessary. As a result, manufacturing and processing costs can be effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lighting devices, and particularly to a flexible light tape arranged in series.

Background Art

[0002] Flexible light tapes have a wide range of applications. For example, they can be installed on walls, plants or landscape structures for landscape decoration to create a specific atmosphere. They can also be installed on the loading platform of a vehicle or the edge of goods for contour warning purposes to issue warnings to the surroundings. Furthermore, by combining with sensors and installing them inside a cabinet, a configuration can be realized where the lights automatically turn on when the cabinet is opened.

[0003] However, because the applicable scenarios of flexible light tapes are extensive, even for the same type of flexible light tape, the required length varies depending on the usage scenario. When mass-produced based on specific specifications, it is necessary to connect or cut according to the actual usage demand, resulting in many end materials and surplus materials. In addition, since additional processing steps are required, there is a problem that the manufacturing and processing costs increase.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide a flexible light tape arranged in series that can be easily cut according to the desired length and can reduce the generation of surplus materials and connection processes.

Means for Solving the Problems

[0005] A flexible light tape arranged in series, comprising a flexible substrate, wherein a positive electrode wiring and a negative electrode wiring are provided on both sides of the flexible substrate, respectively, and a plurality of connection regions are provided at equal intervals on both sides of the surface of the flexible substrate. In the aforementioned connection region, a portion of the positive electrode wiring and the negative electrode wiring are exposed. Connected to the positive and negative terminal wiring, a plurality of resistors, capacitors, and flip chips are mounted in series on the central part of the surface of the flexible substrate. The surfaces of the resistor / capacitor components and the flip chip are provided with fluorescent resin. A central marker is provided in each of the aforementioned connection regions.

[0006] In one embodiment, the center marker indicates the cutting position in the connection region in a direction perpendicular to the axial direction of the flexible substrate, and the portion cut out at the cutting position constitutes a light tape unit.

[0007] In one embodiment, the two connection regions located at one end of the light tape unit are short-circuited, Of the connection regions located at the other end, the connection region corresponding to the positive electrode wiring is electrically connected to the positive electrode of the DC power supply, and the connection region corresponding to the negative electrode wiring is electrically connected to the negative electrode of the DC power supply.

[0008] In one embodiment, the connection region located at the end of the light tape unit is provided with a plurality of solder holes.

[0009] In one embodiment, a solder resist layer is provided on the surface of the flexible substrate and on the surfaces of the positive and negative electrode wiring provided on the flexible substrate. By partially removing the solder resist layer provided on the surfaces of the positive electrode wiring and the negative electrode wiring, a portion of the positive electrode wiring and the negative electrode wiring is exposed to form the connection region.

[0010] In one embodiment, a tin plating layer is formed on the surfaces of the positive electrode wiring and the negative electrode wiring in the connection region.

[0011] In one embodiment, a plurality of pads are provided on the surface of the flexible substrate, and the pads are electrically connected to the positive electrode wiring and the negative electrode wiring.

[0012] In one embodiment, the resistor / capacitor component or the flip chip is reflow soldered to the surface of the pad.

[0013] In one embodiment, a protective resin is provided between the surface of the flip chip and the fluorescent resin.

[0014] In one embodiment, a dam portion is provided around the light-emitting surface of the flip chip. [Effects of the Invention]

[0015] According to this invention, there is no need to pre-manufacture light tapes of a specific standard, and the tape can be precisely cut at the connection area according to the actual required length. Furthermore, since power supply connections can be made directly using the connection area at the cut point, no scraps or excess materials are generated, and the connection process is also unnecessary. Manufacturing and processing costs can be effectively reduced. [Brief explanation of the drawing]

[0016] To more clearly explain the technical solution in this invention, the drawings used in the embodiments are briefly described below. Note that the drawings described below relate to only some embodiments of this invention, and those skilled in the art can derive other drawings from these without requiring any creative effort.

[0017] [Figure 1] This is a schematic perspective view of the series-arranged flexible light tapes according to this embodiment. [Figure 2] This is a schematic diagram of a partial structure of a series-arranged flexible light tape according to this embodiment. [Figure 3] This is a schematic diagram of another part of the series-arranged flexible light tape according to this embodiment.

Best Mode for Carrying Out the Invention

[0018] Hereinafter, the technical solution according to this embodiment will be described in detail with reference to the drawings. It should be noted that the embodiments described below are only some embodiments of the present invention, and do not limit all embodiments of the present invention. Based on the embodiments of the present invention, any other embodiments that can be conceived by those skilled in the art without creative labor are all included in the protection scope of the present invention.

[0019] Referring to FIGS. 1 to 3, the flexible light tape arranged in series according to this embodiment includes a flexible substrate 1, a positive electrode wiring 2 and a negative electrode wiring 3 respectively provided on both sides of the flexible substrate 1, a plurality of connection regions 11 provided at equal intervals on both sides of the surface of the flexible substrate 1, the positive electrode wiring 2 and the negative electrode wiring 3 partially exposed in the connection region 11, a plurality of resistor and capacitor components 4 and flip chips 5 connected to the positive electrode wiring 2 and the negative electrode wiring 3 and mounted in series at the central part of the surface of the flexible substrate 1, a fluorescent resin 6 covering the surfaces of the resistor and capacitor components 4 and the flip chips 5, a center mark 12 provided in each of the connection regions 11, and is provided with.

[0020] In this embodiment, there is no need to manufacture a light tape of a specific specification, and a long light tape roll of several tens of meters to more than one hundred meters can be manufactured. During use, a predetermined length can be measured according to the actually required length and cut based on the center mark 12.

[0021] On the other hand, if standardized light tapes are used, cutting is necessary if the length is excessive for a particular application, and splicing is necessary if the length is insufficient. Furthermore, cutting the ends may be necessary when splicing, inevitably resulting in scraps and surplus materials that are difficult to reuse.

[0022] In contrast, in this embodiment, by utilizing the connection region 11 formed at the end after cutting, the conductor can be easily connected, eliminating the need to perform tasks such as stripping the coating from the terminal, and thus simplifying assembly and processing.

[0023] In one embodiment, the center marker (12) indicates the cutting position in the connection region (11) in a direction perpendicular to the axial direction of the flexible substrate 1.

[0024] By cutting along the center marker (12), it is possible to ensure that both the end of the current light tape unit formed by the cut portion and the end of the light tape roll material awaiting cutting become usable connection areas (11), thereby facilitating subsequent wiring work.

[0025] Furthermore, the central marker 12 ensures sufficient working space in the connection areas 11 formed at both ends after cutting, thereby preventing the occurrence of connection areas 11 that become too small due to uneven cutting and make normal wiring work impossible, and further reducing the probability of generating scrap material.

[0026] In one embodiment, two connection regions 11 located at one end of the light tape unit are short-circuited. Of the connection regions 11 located at the other end, the connection region 11 corresponding to the positive electrode wiring 2 is electrically connected to the positive electrode of the DC power supply, and the connection region 11 corresponding to the negative electrode wiring 3 is electrically connected to the negative electrode of the DC power supply.

[0027] By short-circuiting one end and connecting the other ends to a power source, a DC power supply circuit is formed, allowing the light strip unit to be lit.

[0028] In one embodiment, in addition to the basic positive electrode wiring 2 and negative electrode wiring 3, multiple negative electrode wirings 3 can be provided, and by combining them with an external drive device, different light emission colors or different brightness light emission effects can be achieved.

[0029] In one embodiment, a plurality of solder holes are provided in the connection region 11 located at the end of the light tape unit.

[0030] The solder holes formed in the connection region 11 create a recessed structure with corners on the smooth surface of the connection region 11, thereby increasing the contact area and improving the solder joint strength between the conductor and the connection region 11.

[0031] In one embodiment, a solder resist layer is provided on the surface of the flexible substrate 1, and on the surfaces of the positive electrode wiring 2 and negative electrode wiring 3 provided on the flexible substrate 1. By partially removing the solder resist layer formed on the surfaces of the positive electrode wiring 2 and the negative electrode wiring 3, a portion of the positive electrode wiring 2 and the negative electrode wiring 3 is exposed to form a connection region 11.

[0032] In one embodiment, a tin plating layer is formed on the surfaces of the positive electrode wiring 2 and the negative electrode wiring 3 in the connection region 11.

[0033] By removing the solder resist layer, a portion of the positive electrode wiring 2 and negative electrode wiring 3 are exposed on the surface of the flexible substrate 1, making identification and wiring work easier.

[0034] Furthermore, by applying tin plating to all connection areas 11, excellent surface protection can be ensured even for intermediate connection areas 11 that are not used in wiring work, thereby suppressing the occurrence of electrochemical corrosion and the like.

[0035] Furthermore, when soldering the end connection region 11 to the conductor, the good affinity between the tin plating layer on the surface and the soldering material does not adversely affect the joint strength.

[0036] In one embodiment, a plurality of pads are provided on the surface of the flexible substrate 1, and the pads are electrically connected to the positive electrode wiring 2 and the negative electrode wiring 3.

[0037] In one embodiment, a resistor / capacitor component 4 or a flip chip 5 is reflow soldered to the surface of the pad.

[0038] The aforementioned pads are similarly formed by removing the coating layer from the surface of the flexible substrate 1, and the number, size, and arrangement of the pads are determined according to the number, specifications, and arrangement method of the resistor / capacitor components 4 and flip chips 5 used.

[0039] Furthermore, the resistor / capacitor component 4 is configured according to the power supply specifications of the operating environment, and by realizing functions such as voltage stabilization, current limiting, and protection, it supplies a DC current suitable for the operating parameters of the flip chip 5.

[0040] In one embodiment, a protective resin is provided between the surface of the flip chip 5 and the fluorescent resin 6.

[0041] The cured protective resin protects the surfaces of the flip chip 5 and resistor / capacitor components 4, shielding them from external forces such as impact or compression. It can withstand larger torsional angles and smaller bending radii, resulting in a longer service life even in non-fixed environments.

[0042] In one embodiment, a dam section is provided around the light-emitting surface of the flip chip 5.

[0043] The dam section can improve lighting quality, and especially in flexible usage environments, it can suppress mutual interference caused by scattered light from adjacent flip chips 5, thereby improving the uniformity of the light emission effect.

[0044] According to this invention, there is no need to pre-manufacture light tapes of a specific standard, and the tape can be precisely cut at the connection area according to the actual required length. Furthermore, since power supply connections can be made directly using the connection area at the cut point, no scraps or excess materials are generated, and the connection process is also unnecessary. As a result, manufacturing and processing costs can be effectively reduced. [Explanation of Symbols]

[0045] 1 Flexible circuit board 2 Positive Wiring 3. Negative terminal wiring 4 Resistor and Capacitor Components 5 Flip Tips 6. Fluorescent resin 11 Connection Area 12 Center sign

Claims

1. A flexible substrate (1) is provided, Positive electrode wiring (2) and negative electrode wiring (3) are provided on both sides of the flexible substrate (1), Multiple connection regions (11) are provided at equal intervals on both sides of the surface of the flexible substrate (1). In the connection region (11), a portion of the positive electrode wiring (2) and the negative electrode wiring (3) is exposed. Connected to the positive electrode wiring (2) and the negative electrode wiring (3), a plurality of resistor / capacitor components (4) and a flip chip (5) are mounted in series on the central part of the surface of the flexible substrate (1). A fluorescent resin (6) is provided on the surface of the resistor / capacitor component (4) and the flip chip (5). A central marker (12) is provided in each of the aforementioned connection regions (11). A series-arranged flexible light tape characterized by the following features.

2. In a direction perpendicular to the axial direction of the flexible substrate (1), the center marker (12) indicates the cutting position in the connection region (11), The portion cut out at the specified cutting position constitutes the light tape unit. The series-arranged flexible light tape according to feature 1.

3. Two of the connection regions (11) located at one end of the light tape unit are short-circuited. Of the connection regions (11) located at the other end, the connection region (11) corresponding to the positive electrode wiring (2) is electrically connected to the positive electrode of the DC power supply, and the connection region (11) corresponding to the negative electrode wiring (3) is electrically connected to the negative electrode of the DC power supply. The series-arranged flexible light tape according to feature 2.

4. Multiple solder holes are provided in the connection region (11) located at the end of the light tape unit. The series-arranged flexible light tape according to feature 2.

5. A solder resist layer is provided on the surface of the flexible substrate (1) and on the surfaces of the positive electrode wiring (2) and the negative electrode wiring (3) provided on the flexible substrate (1). By partially removing the solder resist layer provided on the surfaces of the positive electrode wiring (2) and the negative electrode wiring (3), a portion of the positive electrode wiring (2) and the negative electrode wiring (3) is exposed, thereby forming the connection region (11). The series-arranged flexible light tape according to feature 1.

6. A tin plating layer is formed on the surfaces of the positive electrode wiring (2) and the negative electrode wiring (3) in the connection region (11). The series-arranged flexible light tape according to feature 5.

7. Multiple pads are provided on the surface of the flexible substrate (1). The pad is electrically connected to the positive electrode wiring (2) and the negative electrode wiring (3). The series-arranged flexible light tape according to feature 1.

8. The resistor / capacitor component (4) or the flip chip (5) is reflow soldered to the surface of the pad. The series-arranged flexible light tape according to feature 7.

9. A protective resin is provided between the surface of the flip chip (5) and the fluorescent resin (6). The series-arranged flexible light tape according to feature 1.

10. A dam section is provided around the light-emitting surface of the flip chip (5). The series-arranged flexible light tape according to feature 1.

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