Determination method, program, information processing apparatus, exposure apparatus, and article manufacturing method

Abstract

To provide a technique advantageous for achieving both highly accurate measurement and high throughput with respect to measurement of a surface shape of a substrate.SOLUTION: A determination method of determining a plurality of measurement points in order to perform processing of measuring a surface position of a substrate at the plurality of measurement points includes the steps of: acquiring a first parameter set including first and second parameter values, and acquiring a second parameter set including third and fourth parameter values; setting measurement points of a first group specified by the first parameter set; setting measurement points of a second group specified by the second parameter set; and detecting a set of the measurement points in which a distance between the measurement points is smaller than a predetermined threshold value among the set measurement points in the first group and the second group, and reducing the other measurement points leaving the one measurement point in the detected set.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a determination method, a program, an information processing apparatus, an exposure apparatus, and an article manufacturing method. [Background technology]

[0002] Lithography equipment such as exposure equipment and imprinting equipment is used to manufacture semiconductor devices, liquid crystal display elements, etc. As device patterns become finer, there is a demand for improved dimensional accuracy and overlay accuracy of resist patterns. For this reason, it is important to measure the surface shape of a substrate, such as its flatness or warpage, in advance (Patent Document 1).

[0003] One method for measuring the amount of warpage of a substrate is to rotate the substrate and scan a measurement point in the radial direction (Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6191534 [Patent Document 2] Patent No. 3841452 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to obtain the surface shape of a substrate with high accuracy, it is necessary to perform height measurements at many measurement points. However, the more measurement points there are, the more disadvantageous it can be in terms of measurement time, i.e., measurement throughput. On the other hand, if the number of measurement points is too few, the substrate surface shape cannot be captured correctly, which can be disadvantageous in terms of measurement accuracy. There is a demand for a method that can easily determine multiple measurement points that have a good balance in such a trade-off relationship.

[0006] The present invention provides a technique that is advantageous in achieving both high-precision measurement and high throughput in measuring the surface shape of a substrate. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a method for determining a plurality of measurement points in order to perform a process of measuring a surface position of a substrate at the plurality of measurement points in order to identify a surface shape of the substrate, the method comprising: To a first setting step of setting a first group of measurement points identified by the above; Contains the third and fourth parameter values The method includes a second setting step of setting a second group of measurement points specified by a second parameter set, and a deletion step of detecting a set of measurement points, among the set measurement points of the first group and the set measurement points of the second group, in which the distance between the measurement points is smaller than a predetermined threshold value, and deleting the other measurement points from the detected set, leaving one measurement point, and determining, as the plurality of measurement points, the measurement points remaining after the deletion in the deletion step from among the measurement points of the first group and the measurement points of the second group. death , The first parameter value and the third parameter value indicate the number of divisions when the region of the substrate is equally divided by one or more center lines, and the second parameter value and the fourth parameter value indicate the number of divisions when each of the one or more center lines is equally divided. A method for determining whether a Effect of the Invention

[0008] According to the present invention, it is possible to provide a technique that is advantageous in achieving both high-precision measurement and high throughput in measuring the surface shape of a substrate. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing the configuration of an exposure apparatus. [Diagram 2] 4 is a flow chart of a method for determining a plurality of measurement points. [Diagram 3] 6A to 6C are diagrams for explaining a process of determining a plurality of measurement points. [Figure 4] 6A to 6C are diagrams for explaining a process of determining a plurality of measurement points. [Diagram 5] FIG. 13 is a diagram showing an example of a plurality of measurement points arranged on a rectangular substrate. [Figure 6] FIG. 13 is a diagram showing an example of a plurality of measurement points arranged on a computational grid. [Figure 7] FIG. 13 is a diagram showing an example of a parameter value input screen. [Figure 8] FIG. 1 is a diagram showing the configuration of a measurement apparatus. [Figure 9] FIG. 2 shows the configuration of a host computer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] First Embodiment 1 is a schematic diagram of an exposure apparatus 1, which is an example of a lithography apparatus, in an embodiment. This embodiment is applied, for example, when measuring the amount of warpage of a substrate in a step-and-repeat or step-and-scan exposure apparatus. These methods move the substrate in a direction perpendicular to the optical axis of the projection optical system, and sequentially expose the image of a mask onto each shot position on the substrate located in the projection field of the projection optical system.

[0012] The exposure apparatus 1 is a type of lithography apparatus used in the photolithography process, which is a device manufacturing process. The exposure apparatus 1 exposes a substrate through an original by using a step-and-repeat method or a step-and-scan method, and transfers the mask pattern onto the substrate.

[0013] The light source 100 can output light in a plurality of wavelength bands as exposure light. The light emitted from the light source 100 is shaped into a predetermined shape via a shaping optical system (not shown) of the illumination optical system 104. The shaped light is incident on an optical integrator (not shown), where a large number of secondary light sources are formed to illuminate a reticle 109, which is an original (mask), with a uniform illuminance distribution.

[0014] The shape of the opening of the aperture stop 105 of the illumination optical system 104 is approximately circular, and the diameter of the opening, and therefore the numerical aperture (NA) of the illumination optical system 104, can be set to a desired value by the illumination system control unit 108. In this case, since the ratio of the numerical aperture of the illumination optical system 104 to the numerical aperture of the projection optical system 110 is the coherence factor (σ value), the illumination system control unit 108 can set the σ value by controlling the aperture stop 105 of the illumination optical system 104.

[0015] A half mirror 106 is disposed on the optical path of the illumination optical system 104, and a part of the exposure light illuminating the reticle 109 is reflected by the half mirror 106 and extracted. A photosensor 107 for ultraviolet light is disposed on the optical path of the reflected light from the half mirror 106, and generates an output corresponding to the intensity of the exposure light (exposure energy). The reticle 109 has a circuit pattern of a semiconductor device to be printed formed thereon, and is illuminated by the illumination optical system 104. The projection optical system 110 is disposed to reduce the pattern of the reticle 109 at a reduction ratio β (for example, β=1 / 2) and project one shot area on a substrate 115 coated with a photoresist. The projection optical system 110 may be a refractive or catadioptric optical system.

[0016] An aperture stop 111 with a nearly circular opening is disposed on the pupil plane (Fourier transform plane for the reticle) of the projection optical system 110, and the diameter of the opening can be controlled by an aperture stop driver 112 such as a motor. An optical element driver 113 moves an optical element that constitutes a part of the lens system in the projection optical system 110, such as a field lens, along the optical axis of the projection optical system 110. This improves the projection magnification while reducing various aberrations of the projection optical system 110, thereby reducing distortion errors. A projection system controller 114 controls the aperture stop driver 112 and the optical element driver 113 under the control of the main controller 103.

[0017] The substrate stage 116 that holds the substrate 115 can move in three-dimensional directions, and can move in the optical axis direction (Z direction) of the projection optical system 110 and in a plane (XY plane) perpendicular to that direction. Therefore, in FIG. 1, the Z axis extends parallel to the optical axis of the projection optical system 110 and in a direction from the substrate 115 toward the reticle 109, and the X and Y axes extend in directions perpendicular to each other on a plane perpendicular to the Z axis. In FIG. 1, the Y axis is within the plane of the drawing, and the X axis is perpendicular to the plane of the drawing and faces the front of the drawing. The XY plane position of the substrate stage 116 is detected by measuring the distance between the movable mirror 117 fixed to the substrate stage 116 with a laser interferometer 118. In addition, the positional deviation between the substrate 115 and the substrate stage 116 is measured using an alignment measurement system 124. A stage control unit 120 under the control of the main control unit 103 controls a stage driving unit 119 such as a motor based on the measurement results obtained using an alignment measurement system 124, thereby moving the substrate stage 116 to a predetermined XY plane position.

[0018] The projection optical system 121 and the detection optical system 122 detect the focus plane. The projection optical system 121 projects a plurality of light beams consisting of non-exposure light that does not expose the photoresist on the substrate 115, and the light beams are each collected and reflected on the substrate 115. The light beams reflected by the substrate 115 are incident on the detection optical system 122. Although not shown in the figure, a plurality of light receiving elements for position detection are arranged in the detection optical system 122 corresponding to the respective reflected light beams, and the light receiving surface of each light receiving element and the reflection point of each light beam on the substrate 115 are configured to be substantially conjugate by the imaging optical system. The positional deviation of the substrate 115 surface in the optical axis direction of the projection optical system 110 is measured as the positional deviation of light incident on the light receiving element for position detection in the detection optical system 122.

[0019] An aberration correction member 21 may be disposed on the optical path of the exposure light between the reticle 109 and the substrate 115. In the example of Fig. 1, the aberration correction member 21 is disposed between the reticle 109 and the projection optical system 110. The aberration correction member 21 may be configured as a unit independent of the projection optical system 110, or may be configured as a part of the projection optical system 110.

[0020] The main controller 103 performs exposure processing by controlling each part of the exposure apparatus in an integrated manner. The main controller 103 can be configured by an information processing device (computer device). The information processing device can be configured by, for example, a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), an ASIC (abbreviation of Application Specific Integrated Circuit), a general-purpose computer with a built-in program, or a combination of all or part of these.

[0021] The exposure apparatus 1 is connected to a host computer (information processing device), which is an external device different from the exposure apparatus 1. The connection between such a host computer and the exposure apparatus may be a wired connection or a wireless connection.

[0022] FIG. 9 is a block diagram showing an example of the configuration of the host computer H. The CPU 201 is a processor that executes an operating system (OS) and various application programs. The ROM 202 is a memory that stores fixed data among the programs executed by the CPU 201 and parameters for calculation. The RAM 203 is a memory that provides a working area for the CPU 201 and a temporary storage area for data. The ROM 202 and the RAM 203 are connected to the CPU 201 via a bus 208. The input device 205 may include a mouse, a keyboard, etc. The display device 206 may be composed of a CRT or a liquid crystal display, etc. The external storage device 204 may be composed of a hard disk device, a CD, a DVD, a memory card, etc. The external storage device 204 stores various programs including a control program for the exposure process, history data (log) of the exposure process, etc. The input device 205, the display device 206, and the external storage device 204 are each connected to the bus 208 via an interface not shown. In addition, a communication device 207 for connecting to a network and communicating is also connected to the bus 208. The communication device 207 is used when connecting to a network N (e.g., a LAN) and performing data communication using a communication protocol such as TCP / IP to communicate with the exposure apparatus 1. The communication device 207 functions as a data transmitter and receiver, and can, for example, receive operation information from the main controller 103 in the exposure apparatus 1 and record it in a log stored in the external storage device 204. Some or all of the functions of the main controller 103 may be realized by the host computer H.

[0023] The function of measuring the surface shape of substrate 115 by exposure apparatus 1 will be described below.

[0024] The projection optical system 121 and the detection optical system 122 can function as a focus detection system that projects measurement light onto the surface of the substrate 115 for each shot area during the exposure operation to measure the surface position (height position) of the substrate 115. Furthermore, in this embodiment, the projection optical system 121 and the detection optical system 122 can also function as a measurement device that measures the height position (height measurement) of each of a plurality of measurement points on the substrate 115 before the exposure operation. By measuring the height of a plurality of measurement points in advance, the flatness or amount of warping of the substrate 115 can be obtained. The main control unit 103 can control the movement of the substrate stage 116 based on the surface shape of the substrate identified from the results measured by the measurement device.

[0025] The light projection optical system 121 projects measurement light consisting of non-exposure light that does not expose the photoresist on the substrate 115 onto one measurement point. The measurement light reflected at the measurement point is incident on the detection optical system 122. A signal of the image of the measurement light detected by the detection optical system 122 is transferred to the host computer H via, for example, the main control unit 103. This process is executed for each of the multiple measurement points. The host computer H determines the height position at each measurement point from the signal thus obtained, and determines the surface shape (flatness or amount of warping) of the substrate 115 from the height position at each measurement point.

[0026] In order to obtain the surface shape of a substrate with high accuracy, it is necessary to perform height measurements at many measurement points. However, the more measurement points there are, the more disadvantageous it can be in terms of measurement time, i.e., measurement throughput. On the other hand, if the number of measurement points is too few, the substrate surface shape cannot be captured correctly, which can be disadvantageous in terms of measurement accuracy. Below, we will explain a method that can easily determine multiple measurement points that are well-balanced in such a trade-off relationship.

[0027] In this embodiment, a plurality of measurement points are set on the boundary lines of the region when the substrate is divided into regions. For example, as shown in FIG. 3(a'), the region of the substrate is divided by one or more straight lines (center lines) passing through the center of the circular substrate so that the central angles are equal. In addition, the radius constituting the region boundary line (i.e., the center line) is equally divided into a predetermined number of regions. At that time, measurement points are set at each division point (including the center and the outer periphery points). FIG. 3(a) and (a') show an example in which the substrate is equally divided into eight regions by multiple center lines, and each radius is equally divided into three regions, d1, d2, and d3. The plurality of measurement points thus obtained are called "measurement points of the first group". The number of regions divided by one or more center lines so that the central angles are equal is called "angle division number" (first parameter value). In addition, the number of regions (d1, d2, d3) obtained by equally dividing the radii constituting those center lines is called "straight line division number" (second parameter value). 3(a) and (a') in the example, the number of angle divisions (first parameter value) is 8, and the number of linear divisions (second parameter value) is 3. The measurement points of the first group are determined by the number of angle divisions and the number of linear divisions.

[0028] In this embodiment, a second group of measurement points different from the first group of measurement points is set. The second group of measurement points is determined by an angle division number (third parameter value) and a line division number (fourth parameter value) different from the angle division number and line division number for which the first group of measurement points are determined. In the example of Fig. 3(b) and (b'), the angle division number (third parameter value) is 16, and the line division number (fourth parameter value) is 4.

[0029] The parameters do not have to be the number of angle divisions or the number of line divisions. For example, the value of the central angle may be used as a parameter instead of the number of angle divisions, and the length of the divided line segments (the distance between division points) may be used instead of the number of line divisions.

[0030] In this embodiment, a plurality of measurement points are set on the boundary lines of the regions obtained by dividing the substrate into regions.

[0031] A method for determining a plurality of measurement points in this embodiment will be described in detail with reference to the flowchart of Fig. 2. In one example, a program corresponding to the flowchart of Fig. 2 is stored in the external storage device 204 of the host computer H. The program is loaded into the RAM 203 in response to a start instruction from the CPU 201, and is then executed by the CPU 201.

[0032] In S1 (first acquisition step), the CPU 201 acquires a first parameter set including at least a first parameter value and a second parameter value for setting a first group of measurement points. In S2 (second acquisition step), the CPU 201 acquires a second parameter set including at least a third parameter value and a fourth parameter value for setting the second group of measurement points. These parameter sets can be acquired in accordance with a user operation via a setting screen displayed on the display device 206. For example, the display device 206 displays a setting screen as shown in FIG. 7. The setting screen can include, for example, the following: An input field 701 for the number of angular divisions of the first group (first parameter value), An input field 702 for the number of straight line divisions in the first group (second parameter value), An input field 703 for the number of angular divisions of the second group (third parameter value), An input field 704 for the number of straight line divisions in the second group (fourth parameter value).

[0033] The input fields 701 to 704 can be input by a user operation using the input device 205. Each input field may be configured so that the user directly inputs a numerical value, or alternatives may be presented by a pull-down menu or the like. In this embodiment, the distribution of the measurement points should be set so that the first group and the second group are different. Therefore, the first group and the second group do not have the same number of angle divisions and the same number of line divisions. Specifically, the number of angle divisions (first parameter value) of the first group and the number of angle divisions (third parameter value) of the second group are different from each other. In addition, the number of line divisions (second parameter value) of the first group and the number of line divisions (fourth parameter value) of the second group are different from each other. In one example, the number of angle divisions (third parameter value) is larger than the number of angle divisions (first parameter value) of the first group, and the number of line divisions (fourth parameter value) of the second group is larger than the number of line divisions (second parameter value) of the first group.

[0034] The input field 703 for the number of angle divisions of the second group and the input field 704 for the number of straight line divisions may be prohibited from inputting the same numbers as those inputted into the input field 701 for the number of angle divisions of the first group and the input field 702 for the number of straight line divisions, respectively.

[0035] The values ​​entered in each input field are confirmed by pressing (clicking) the Confirm button 705. Also, the values ​​entered in each input field are cleared by pressing (clicking) the Cancel button 706.

[0036] Instead of setting the parameter values ​​via such a setting screen, the parameter values ​​may be obtained from another external device or the like.

[0037] In S3 (first setting step), the CPU 201 sets a first group of measurement points based on the first parameter set (first parameter value and second parameter value) acquired in S1. In S1, the number of angle divisions (first parameter value) and the number of straight line divisions (second parameter value) of the first group are obtained. The CPU 201 creates one or more center lines according to these parameter values, and sets the measurement points of the first group at coordinate points on each center line. FIG. 3(a) is an example of the measurement points of the first group thus obtained. According to S1 and S3, the measurement points are set at first equal intervals on a first plurality of center lines, each of which has a first central angle between the center lines, with respect to the surface of the substrate.

[0038] In S4 (second setting step), the CPU 201 sets a second group of measurement points based on the second parameter set (third parameter value and fourth parameter value) input in S2. In S2, the number of angle divisions (third parameter value) and the number of straight line divisions (fourth parameter value) of the second group are obtained. The CPU 201 creates one or more center lines according to these parameter values, and sets the measurement points of the second group at coordinate points on each center line. FIG. 3(b) shows an example of the measurement points of the second group thus obtained. According to S2 and S4, the measurement points are set at second equal intervals different from the first equal intervals on a second plurality of center lines whose central angles between the center lines have a second angle different from the first angle with respect to the surface of the substrate.

[0039] In S5 (deletion step), if there is a set of overlapping or approximate measurement points among the measurement points of the first group and the measurement points of the second group, the CPU 201 deletes the rest of the set, leaving only one measurement point. For example, when comparing FIG. 3(a') with FIG. 3(b'), there may be a measurement point of the first group and a measurement point of the second group that overlap at the same coordinate point. For example, the measurement points located at the center of the substrate are a typical example. Therefore, the CPU 201 detects a set of measurement points among the measurement points of the first group and the measurement points of the second group, in which the distance between the measurement points is smaller than a predetermined threshold value. When such a set of measurement points is detected, the CPU 201 deletes the other measurement points from the set, leaving one measurement point. For example, the CPU 201 deletes the measurement points belonging to a predetermined group (for example, the second group) from the set.

[0040] In this embodiment, it is possible to add or delete individual measurement points. For example, in S6, the CPU 201 adds or deletes measurement points specified by the user via the input device 205. This step is advantageous, for example, when the tendency of the surface shape of each substrate to be used is known in advance.

[0041] Through the above process, the CPU 201 determines the measurement points remaining after the deletion in the deletion step S5, out of the measurement points in the first group and the measurement points in the second group, as the measurement points to be used for determining the surface shape of the substrate. According to the above-described determination method, a plurality of measurement points that are balanced in terms of the trade-off with the measurement time, i.e., the measurement throughput, can be determined easily in terms of user operation, thereby realizing a method for determining measurement points that is advantageous in achieving both high-precision measurement and high throughput.

[0042] <Second embodiment> In the second embodiment, the region of the substrate is divided into an inner peripheral region including the center of the substrate, and an outer peripheral region outside the inner peripheral region. In a first setting step S3, the CPU 201 sets a first group of measurement points in the inner peripheral region. FIG. 4(a) shows an example of the first group of measurement points set in the inner peripheral region. FIG. 4(a) shows an example in which the number of angle divisions is 8 and the number of straight line divisions is 1. Note that a straight line division number of 1 means that the line is not divided, and measurement points are set only at the intersections of the line and the outermost periphery of the inner peripheral region (excluding the center).

[0043] Next, in a second setting step S4, the CPU 201 sets a second group of measurement points in the outer peripheral region. Fig. 4(b) shows an example of the second group of measurement points set in the outer peripheral region. Fig. 4(b) shows an example in which the number of angle divisions is 16 and the number of line divisions is 2. Note that since the number of line divisions is 2, measurement points are set at the intersection of the innermost circumference of the outer peripheral region and the line, the intersection of the outermost circumference of the outer peripheral region and the line, and a point on the line between these two intersections.

[0044] FIG. 4(c) shows an example in which the first group of measurement points and the second group of measurement points are displayed in an overlapping manner.

[0045] The second embodiment is advantageous when it is known that the surface shape trends of each substrate being used tend to differ between the inner and outer circumferential regions.

[0046] <Third embodiment> The processes shown in the first and second embodiments are applicable not only to circular substrates but also to rectangular substrates. Figures 5(a) to 5(c) show how a plurality of measurement points are determined for a rectangular substrate. Figure 5(a) shows the first group of measurement points set when the number of angular divisions is 8 and the number of linear divisions is 6. In the case of a rectangular substrate, the lengths of the center lines (division lines) may differ from each other, so here, as an example, the "number of linear divisions" shows the number of linear divisions of the longest center line among the plurality of center lines. Figure 5(b) shows the second group of measurement points set when the number of angular divisions is 16 and the number of linear divisions is 8. Figure 5(c) shows an example in which the measurement points of the first group and the measurement points of the second group are superimposed and displayed.

[0047] There is no particular limitation on the means for identifying the positions of the measurement points to be set. For example, the positions may be identified by the central angle of the center line on which the measurement points are set and the distance from the center on the center line. Alternatively, the positions may be identified by coordinate values ​​in a computational grid set in a plane representing the substrate surface. Alternatively, the positions may be identified by specific coordinate values ​​in an exposure area (shot area) on the substrate. Alternatively, the positions may be identified by the interval of a curve in a spiral scan line from the substrate center and the interval of measurement points on the curve.

[0048] 6(a) to (c) show an example in which the region of a rectangular substrate is divided into an inner region including the center of the substrate and an outer region outside the inner region, and a first group of measurement points and a second group of measurement points are set, as in the second embodiment. The peripheral shape of the inner region is similar to the peripheral shape of the substrate. For example, as shown in FIG. 4(a), the peripheral shape of the inner region in the case of a circular substrate is circular. Also, as shown in FIG. 6(a), the peripheral shape of the inner region in the case of a rectangular substrate is rectangular.

[0049] Here, an example is shown in which the positions of the measurement points are expressed in a plurality of XY coordinates, as an example in which the first group of measurement points and the second group of measurement points are arranged at equal intervals at the intersections of a plurality of straight lines (computational grids) arranged in a grid pattern. In this embodiment, in the first setting step S3, the CPU 201 sets the first group of measurement points in the inner peripheral area. FIG. 6(a) shows an example of the first group of measurement points set in the inner peripheral area of ​​a rectangle. Here, in each quadrant of the area on the substrate center side divided by X=±120 mm and Y=±75 mm in the XY coordinates, the number of divisions in the X direction is 2, and the number of divisions in the Y direction is 1 (i.e., no division).

[0050] In the second setting step S4, the CPU 201 sets a second group of measurement points in the rectangular outer peripheral region. Fig. 6(b) shows the second group of measurement points set in the outer peripheral region. Here, in each quadrant of the region on the substrate edge side outside the region partitioned by X = ±200 mm and Y = ±150 mm in the XY coordinate system, the number of divisions in the X direction is 1 (i.e., no divisions) and the number of divisions in the Y direction is also 1 (i.e., no divisions).

[0051] FIG. 6(c) shows an example in which the set first group of measurement points and the set second group of measurement points are displayed in an overlapping manner.

[0052] Note that the specific values ​​of the number of divisions and the XY coordinates shown in each of the above-mentioned embodiments are merely examples, and the present invention is not limited to these values. Also, in each of the above-mentioned embodiments, the example of the measurement points of the first group and the measurement points of the second group is shown, but the measurement points of the third group or the groups thereafter may be set. In other words, there is no limit to the number of groups to be divided.

[0053] <Fourth embodiment> In the first embodiment, an example in which an exposure apparatus is used as a measurement apparatus is shown, but it is possible to execute the processes shown in each of the above-mentioned embodiments using a measurement apparatus other than an exposure apparatus. Fig. 8 is a diagram showing an example of the configuration of a measurement apparatus (semiconductor measurement apparatus).

[0054] When the substrate 1005 is mounted on the substrate stage 1006, the detection unit 1010 measures the surface position of the substrate 1005 at a plurality of measurement points determined according to the determination method described in the above embodiment. The detection unit 1010 can include a projection optical system 1004 and an imaging unit 1012. The imaging unit 1012 has an imaging element 1012f. The control unit 1008 identifies the surface shape of the substrate 1005 based on position information of the substrate stage 1006 obtained by measurement by the measurement unit 1007 and the detection result by the detection unit 1010.

[0055] <Example> The effect of the multiple measurement points determined according to each of the above-mentioned embodiments was confirmed. As an example, the result of identifying the surface shape of the substrate using the multiple measurement points determined according to the first embodiment was compared with the result by the conventional method.

[0056] A board with a known amount of warpage was measured and the amount of warpage of the board was compared when the number of measurement points was 108 and when the number of measurement points was 56. Here, 56 measurement points were obtained by setting the first group of measurement points with an angle division number of 8 and a linear division number of 4, and setting the second group of measurement points with an angle division number of 16 and a linear division number of 3. Also, 108 measurement points were obtained by setting the first group of measurement points with an angle division number of 9 and a linear division number of 7, and setting the second group of measurement points with an angle division number of 16 and a linear division number of 3.

[0057] The same amount of warpage was obtained for both numbers of measurement points. Therefore, according to the method of the embodiment, it is possible to specify the surface shape of the substrate with fewer measurement points than the conventional method.

[0058] <Embodiment of the article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above-mentioned exposure apparatus (a step of exposing the substrate), and a step of developing the substrate on which the latent image pattern has been formed in the step. Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0059] (Other embodiments) The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0060] The disclosure of this specification includes at least the following determination method, program, information processing device, exposure apparatus, and article manufacturing method. (Item 1) A method for determining a plurality of measurement points in order to perform a process of measuring a surface position of a substrate at the plurality of measurement points in order to identify a surface shape of the substrate, the method comprising: a first obtaining step of obtaining a first parameter set including a first parameter value and a second parameter value; a second obtaining step of obtaining a second parameter set including a third parameter value and a fourth parameter value; a first setting step of setting a first group of measurement points identified by the acquired first parameter set; a second setting step of setting a second group of measurement points identified by the acquired second parameter set; a deletion step of detecting a set of measurement points, among the set first group of measurement points and the set second group of measurement points, in which a distance between the measurement points is smaller than a predetermined threshold value, and deleting the other measurement points from the detected set while leaving one measurement point; determining, as the plurality of measurement points, measurement points remaining after the deletion in the deletion step, among the first group of measurement points and the second group of measurement points. (Item 2) 2. The method of claim 1, wherein in the first setting step and the second setting step, measurement points are set on each center line when the area of ​​the substrate is equally divided by one or more center lines. (Item 3) the first parameter value and the third parameter value indicate the number of divisions when the region of the substrate is equally divided by the one or more center lines, the second parameter value and the fourth parameter value indicate the number of equal divisions of each of the one or more center lines, the first parameter value and the third parameter value are different from each other; the second parameter value and the fourth parameter value are different from each other; 3. The method according to item 2, (Item 4) the first parameter value and the third parameter value indicate central angles when the region of the substrate is equally divided by the one or more center lines, the second parameter value and the fourth parameter value indicate distances between division points when each of the one or more center lines is equally divided, the first parameter value and the third parameter value are different from each other; the second parameter value and the fourth parameter value are different from each other; 3. The method according to item 2, (Item 5) the third parameter value is greater than the first parameter value; The fourth parameter value is greater than the second parameter value. 5. The method according to item 3 or 4, (Item 6) In the first setting step, the first group of measurement points is set in an inner peripheral region including a center of the substrate; In the second setting step, the second group of measurement points is set in an outer circumferential region outside the inner circumferential region. 6. The method according to any one of items 2 to 5, (Item 7) 7. The method according to item 6, wherein the peripheral shape of the inner peripheral region is similar to the peripheral shape of the substrate. (Item 8) 8. A program for causing a computer to execute each step of the determination method according to any one of items 1 to 7. (Item 9) An information processing device for determining a plurality of measurement points in order to perform a process of measuring a surface position of a substrate at the plurality of measurement points by a measurement device and specifying a surface shape of the substrate, the information processing device comprising: a first acquiring means for acquiring a first parameter set including a first parameter value and a second parameter value; a second acquiring means for acquiring a second parameter set including a third parameter value and a fourth parameter value; a first setting means for setting a first group of measurement points identified by the acquired first parameter set; A second setting means for setting a second group of measurement points specified by the acquired second parameter set; a deletion means for detecting a set of measurement points among the set first group of measurement points and the set second group of measurement points, the set having a relationship in which a distance between the measurement points is smaller than a predetermined threshold value, and for deleting the other measurement points from the detected set while leaving one measurement point; determining, as the plurality of measurement points, measurement points remaining after deletion by the deletion means, among the measurement points of the first group and the measurement points of the second group. (Item 10) 10. The information processing device according to item 9, wherein the first setting means and the second setting means set measurement points on each center line when the area of ​​the substrate is equally divided by one or more center lines. (Item 11) the first parameter value and the third parameter value indicate the number of divisions when the region of the substrate is equally divided by the one or more center lines, the second parameter value and the fourth parameter value indicate the number of equal divisions of each of the one or more center lines, the first parameter value and the third parameter value are different from each other; The second parameter value and the fourth parameter value are different from each other. 11. The information processing device according to item 10, (Item 12) the first parameter value and the third parameter value indicate central angles when the region of the substrate is equally divided by the one or more center lines, the second parameter value and the fourth parameter value indicate distances between division points when each of the one or more center lines is equally divided, the first parameter value and the third parameter value are different from each other; the second parameter value and the fourth parameter value are different from each other; 11. The information processing device according to item 10, (Item 13) a display means for displaying a setting screen for setting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value; the first acquisition means acquires the first parameter value and the second parameter value in accordance with a user operation via the setting screen; the second acquisition means acquires the third parameter value and the fourth parameter value in accordance with a user operation via the setting screen. 13. The information processing device according to item 11 or 12. (Item 14) the setting screen has input fields for inputting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value by a user operation, An input field for inputting the third parameter value is prohibited from being input with a value that is the same as the first parameter value, and an input field for inputting the fourth parameter value is prohibited from being input with a value that is the same as the second parameter value. 14. The information processing device according to item 13, (Item 15) 8. A measuring apparatus for measuring a surface position of a substrate at a plurality of measurement points determined according to the method according to any one of items 1 to 7. (Item 16) 1. An exposure apparatus that projects a pattern of an original onto a substrate by a projection optical system to expose the substrate, comprising: a substrate stage that holds and moves the substrate; Item 16. A measurement apparatus according to item 15, arranged to measure a surface position of the substrate held by the substrate stage; a control unit that controls movement of the substrate stage based on a surface shape of the substrate that is identified from a result of measurement by the measuring device; An exposure apparatus comprising: (Item 17) Exposing a substrate using the exposure apparatus according to Item 16; developing the exposed substrate; and producing an article from the developed substrate.

[0061] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0062] 1: exposure apparatus, 100: light source, 103: main control unit, 104: illumination optical system, 110: projection optical system, 116: substrate stage

Claims

1. A method for determining a plurality of measurement points in order to perform a process of measuring a surface position of a substrate at the plurality of measurement points in order to identify a surface shape of the substrate, the method comprising: a first setting step of setting a first group of measurement points identified by a first parameter set including a first parameter value and a second parameter value; a second setting step of setting a second group of measurement points identified by a second parameter set including a third parameter value and a fourth parameter value; a deletion step of detecting a set of measurement points among the set first group of measurement points and the set second group of measurement points, the set of measurement points being in a relationship in which the distance between the measurement points is smaller than a predetermined threshold value, and deleting the other measurement points from the detected set while leaving one measurement point; determining, as the plurality of measurement points, the measurement points remaining after the deletion in the deletion step among the measurement points of the first group and the measurement points of the second group; the first parameter value and the third parameter value indicate the number of divisions when the region of the substrate is equally divided along one or more center lines, the second parameter value and the fourth parameter value indicate the number of equal divisions of each of the one or more center lines, A method for determining whether or not a

2. 2. The method according to claim 1, wherein in the first setting step and the second setting step, measurement points are set on each center line when the area of ​​the substrate is equally divided by the one or more center lines.

3. The first parameter value and the third parameter value are different from each other, the second parameter value and the fourth parameter value are different from each other; 2. The method of claim 1 .

4. A method for determining a plurality of measurement points in order to measure a surface position of a substrate at the plurality of measurement points in order to identify a surface shape of the substrate, comprising: a first setting step of setting a first group of measurement points identified by a first parameter set including a first parameter value and a second parameter value; a second setting step of setting a second group of measurement points identified by a second parameter set including a third parameter value and a fourth parameter value; a deletion step of detecting a set of measurement points among the set first group of measurement points and the set second group of measurement points, the set of measurement points being in a relationship in which the distance between the measurement points is smaller than a predetermined threshold value, and deleting the other measurement points from the detected set while leaving one measurement point; determining, as the plurality of measurement points, the measurement points remaining after the deletion in the deletion step among the measurement points of the first group and the measurement points of the second group; the first parameter value and the third parameter value indicate central angles when a region of the substrate is equally divided by one or more center lines, the second parameter value and the fourth parameter value indicate distances between division points when each of the one or more center lines is equally divided, A method for determining whether or not a

5. The determination method described in Claim 1, characterized in that in the first setting step and the second setting step, measurement points are set on each center line when the area of ​​the substrate is equally divided by the one or more center lines.

6. the first parameter value and the third parameter value are different from each other; the second parameter value and the fourth parameter value are different from each other; 5. The method of claim 4.

7. the third parameter value is greater than the first parameter value; The fourth parameter value is greater than the second parameter value.

4. The method of claim 3.

8. In the first setting step, the first group of measurement points is set in an inner peripheral region including a center of the substrate; In the second setting step, the second group of measurement points is set in an outer circumferential region outside the inner circumferential region.

3. The method of claim 2 .

9. 9. The method according to claim 8, wherein the peripheral shape of the inner peripheral region is similar to the peripheral shape of the substrate.

10. A program for causing a computer to execute each step of the determination method according to any one of claims 1 to 9.

11. An information processing device for determining a plurality of measurement points in order to perform a process of measuring a surface position of a substrate at the plurality of measurement points by a measurement device and specifying a surface shape of the substrate, the information processing device comprising: a first setting means for setting a first group of measurement points identified by a first parameter set including a first parameter value and a second parameter value; a second setting means for setting a second group of measurement points identified by a second parameter set including a third parameter value and a fourth parameter value; a deletion means for detecting a set of measurement points among the set first group of measurement points and the set second group of measurement points, the set of measurement points being in a relationship in which the distance between the measurement points is smaller than a predetermined threshold value, and for deleting the other measurement points from the detected set while leaving one measurement point; determining, as the plurality of measurement points, the measurement points remaining after the deletion by the deletion means out of the measurement points of the first group and the measurement points of the second group; the first parameter value and the third parameter value indicate the number of divisions when the region of the substrate is equally divided along one or more center lines, the second parameter value and the fourth parameter value indicate the number of equal divisions of each of the one or more center lines, 23. An information processing apparatus comprising:

12. 12. The information processing apparatus according to claim 11, wherein the first setting means and the second setting means set measurement points on each center line when the area of ​​the substrate is equally divided by the one or more center lines.

13. The first parameter value and the third parameter value are different from each other, the second parameter value and the fourth parameter value are different from each other; 12. The information processing apparatus according to claim 11 .

14. An information processing device for determining a plurality of measurement points in order to measure a surface position of a substrate using a measuring device and perform a process of identifying a surface shape of the substrate, comprising: a first setting means for setting a first group of measurement points identified by a first parameter set including a first parameter value and a second parameter value; a second setting means for setting a second group of measurement points identified by a second parameter set including a third parameter value and a fourth parameter value; a deletion means for detecting a set of measurement points among the set first group of measurement points and the set second group of measurement points, the set of measurement points being in a relationship in which the distance between the measurement points is smaller than a predetermined threshold value, and for deleting the other measurement points from the detected set while leaving one measurement point; determining, as the plurality of measurement points, the measurement points remaining after the deletion by the deletion means out of the measurement points of the first group and the measurement points of the second group; the first parameter value and the third parameter value indicate central angles when a region of the substrate is equally divided by one or more center lines, the second parameter value and the fourth parameter value indicate distances between division points when each of the one or more center lines is equally divided, 23. An information processing apparatus comprising:

15. The information processing device described in Claim 14, characterized in that the first setting means and the second setting means set measurement points on each center line when the area of ​​the substrate is equally divided by the one or more center lines.

16. the first parameter value and the third parameter value are different from each other; the second parameter value and the fourth parameter value are different from each other; 15. The information processing apparatus according to claim 14,

17. a display means for displaying a setting screen for setting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value; a first acquisition means for acquiring the first parameter value and the second parameter value in accordance with a user operation via the setting screen; a second acquisition means for acquiring the third parameter value and the fourth parameter value in accordance with a user operation via the setting screen; 12. The information processing apparatus according to claim 11, further comprising:

18. the setting screen has input fields for inputting the first parameter value, the second parameter value, the third parameter value, and the fourth parameter value by a user operation, an input field for inputting the third parameter value is prohibited from being input with a value that is the same as the first parameter value, and an input field for inputting the fourth parameter value is prohibited from being input with a value that is the same as the second parameter value.

18. The information processing apparatus according to claim 17,

19. A measuring apparatus that measures a surface position of a substrate at a plurality of measurement points determined according to the determination method according to any one of claims 1 to 9.

20. 1. An exposure apparatus that projects a pattern of an original onto a substrate by a projection optical system to expose the substrate, comprising: a substrate stage that holds and moves the substrate; 20. The measurement apparatus according to claim 19, which is arranged to measure a surface position of the substrate held by the substrate stage; Based on the surface shape of the substrate identified from the result of measurement by the measurement device, A control unit that controls the movement of the substrate stage; An exposure apparatus comprising:

21. exposing a substrate using the exposure apparatus according to claim 20; developing the exposed substrate; and producing an article from the developed substrate.

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