PCB Connectors

Abstract

To improve a communication performance of a connector for a substrate.SOLUTION: A connector for a substrate 10 is connected to a circuit board 50 having a conductive path. The connector for a substrate 10 comprises: a connector housing 11 that is fitted with a mating connector; a plurality of inner conductors that is attached to the connector housing 11, and is connected to the conductive path of the circuit board 50; and a metal outer conductor 20 that is attached to the connector housing 11, and covers the plurality of inner conductors in a state of being electrically insulated with the plurality of inner conductors. The outer conductor 20 includes: two side walls 71; and a separation wall 72 that is arranged between the plurality of inner conductors while being arranged between the two side walls 71. In a lower end part of the two side walls 71, a side wall connection part 73 connected to the conductive path of the circuit board 50 is projected. In a lower end part of the separation wall 72, a separation wall connection part 74 connected to the conductive path of the circuit board 50 is projected.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a board connector. [Background technology]

[0002] A conventional board connector is described in JP 2008-59761 A. This connector includes an inner conductor connected to a conductive path formed on a circuit board, an outer conductor surrounding the inner conductor while being electrically insulated from the inner conductor, and a connector housing that accommodates the inner conductor and the outer conductor.

[0003] In the above-mentioned board connector, the inner conductor connected to the conductive path of the circuit board is surrounded by the outer conductor, thereby suppressing noise from entering the inner conductor from outside the board connector and also suppressing noise from leaking from the inner conductor to the outside of the board connector. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2008-59761 A Summary of the Invention [Problem to be solved by the invention]

[0005] When the number of poles of the inner conductor increases, signal leakage between the multiple inner conductors, i.e., so-called crosstalk, may occur, and communication performance may decrease. The present disclosure has been completed based on the above circumstances, and has an object to improve the communication performance of a board connector. [Means for solving the problem]

[0006] The present disclosure relates to a board connector that is connected to a circuit board having a conductive path, the board comprising: a connector housing that mates with a mating connector; a plurality of inner conductors that are attached to the connector housing and connected to the conductive path of the circuit board; and a metal outer conductor that is attached to the connector housing and covers the plurality of inner conductors while being electrically insulated from the plurality of inner conductors, the outer conductor having two side walls and a partition wall that is disposed between the two side walls and between the plurality of inner conductors, the two side walls having protruding side wall connection portions that are connected to the conductive path of the circuit board, and the partition wall having protruding partition wall connection portions that are connected to the conductive path of the circuit board. Effect of the Invention

[0007] According to the present disclosure, the communication performance of a board connector can be improved. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a board connector according to a first embodiment and a circuit board. [Diagram 2] FIG. 2 is an exploded perspective view showing the board connector. [Diagram 3] FIG. 3 is a perspective view showing the board connector. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a plan view showing the board connector. [Figure 6] FIG. 6 is a perspective view showing the outer conductor. [Figure 7] FIG. 7 is a perspective view showing the outer conductor as viewed from a different direction than that in FIG. [Figure 8] FIG. 8 is a rear view showing the board connector. [Figure 9] FIG. 9 is a perspective view of the board connector as viewed obliquely from below. [Figure 10] FIG. 10 is a cross-sectional view taken along line XX in FIG. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12] FIG. 12 is a bottom view showing the board connector. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] (1) The present disclosure provides a board connector to be connected to a circuit board having a conductive path, comprising: a connector housing adapted to mate with a mating connector; a plurality of inner conductors attached to the connector housing and connected to the conductive path of the circuit board; and a metallic outer conductor attached to the connector housing and covering the plurality of inner conductors while being electrically insulated from the plurality of inner conductors, the outer conductor having two side walls and a partition wall disposed between the two side walls and between the plurality of inner conductors, side wall connection portions protruding from lower ends of the two side walls and connected to the conductive path of the circuit board, and a partition wall connection portion protruding from the lower end of the partition wall and connected to the conductive path of the circuit board.

[0011] The bulkhead connection portion is connected to the conductive path of the circuit board, and the inner conductor is covered by the side wall connected to the conductive path and the bulkhead connected to the conductive path. This improves electromagnetic symmetry between the inner conductor, the side wall, and the bulkhead, thereby suppressing signal leakage between the inner conductors separated by the bulkhead. This improves the communication performance of the board connector.

[0012] (2) It is preferable that each of the plurality of inner conductors has a board connection portion connected to the conductive path of the circuit board, and that the bulkhead connection portion and the board connection portion are arranged side by side.

[0013] By arranging the bulkhead connection parts and the board connection parts side by side, the symmetry between the bulkhead connection parts and the board connection parts is improved, which further suppresses signal leakage between the board connection parts.

[0014] (3) It is preferable that the multiple inner conductors form multiple sets of inner conductor pairs each consisting of two adjacent inner conductors, and the partition is disposed between adjacent inner conductor pairs among the multiple sets of inner conductor pairs.

[0015] Since signal leakage between adjacent inner conductor pairs is suppressed, the communication performance of the board connector can be further improved.

[0016] [Details of the embodiment of the present disclosure] The present disclosure will be described below with reference to the embodiments. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0017] <Embodiment 1> A first embodiment of the present disclosure will be described with reference to Figures 1 to 12. A board connector 10 according to this embodiment is attached to a circuit board 50. In the following description, the Z direction indicates the upward direction, the Y direction indicates the forward direction, and the X direction indicates the leftward direction. In addition, for multiple identical components, reference numerals may be given to only some of the components, and the reference numerals of the other components may be omitted.

[0018] [Circuit board 50] 1, a plurality of (eight in this embodiment) signal through holes 52 and a plurality of (six in this embodiment) ground through holes 51 are formed in the circuit board 50 so as to penetrate the circuit board 50 in the up-down direction. A signal land 53 (one example of a conductive path) through which a signal is transmitted is formed on the edge of the signal through hole 52 by a printed wiring technique. A ground land 54 (one example of a conductive path) which is electrically grounded is formed on the edge of the ground through hole 51 by a printed wiring technique. Electronic components (not shown) are mounted on the circuit board 50 by a known technique such as soldering.

[0019] [PCB connector 10] As shown in Figure 2, the board connector 10 has a connector housing 11, an outer conductor 20 attached to the connector housing 11, an upper dielectric 16 and a lower dielectric 17 housed inside the outer conductor 20, an upper inner conductor 18 (an example of an inner conductor) housed inside the upper dielectric 16, and a lower inner conductor 19 (an example of an inner conductor) housed inside the lower dielectric 17.

[0020] [Connector housing 11] The connector housing 11 is formed by injection molding an insulating synthetic resin. As shown in Fig. 3, the connector housing 11 has a hood portion 15 that opens forward and into which a mating connector (not shown) is fitted. As shown in Fig. 4, a back wall 30 is provided on the side of the connector housing 11 opposite the open end of the hood portion 15. A lock portion 31 is formed on the front end edge of the upper wall of the hood portion 15 so as to protrude downward. Although not shown in detail, the lock portion 31 engages with the mating connector fitted into the hood portion 15, thereby holding the mating connector within the hood portion 15.

[0021] 2, the rear surface of the back wall 30 has four corners on which locking protrusions 33 protruding rearward are formed. The locking protrusions 33 are formed in a cylindrical shape. The diameter of the locking protrusions 33 formed near the upper end of the back wall 30 is larger than the diameter of the locking protrusions 33 formed near the lower end of the back wall 30.

[0022] 2, a plurality of (four in this embodiment) tubular portion mounting holes 34, into which tubular portions 21 of the outer conductor 20 described later are inserted, are formed in the rear wall 30 in the front-rear direction. The cross-sectional shape of the tubular portion mounting holes 34 is a rectangle with rounded corners. The tubular portion mounting holes 34 are formed in pairs lined up in the left-right direction and in two rows lined up in the up-down direction.

[0023] [Outer conductor 20] As shown in Fig. 5, the outer conductor 20 is attached to the rear of the connector housing 11. The outer conductor 20 is made of a conductive metal. Any metal can be appropriately selected as the metal constituting the outer conductor 20, such as zinc, copper, a copper alloy, aluminum, an aluminum alloy, etc. The outer conductor 20 is formed by a known method such as casting, die casting, cutting, etc. The outer conductor 20 is adapted to be in electrical contact with a mating outer conductor (not shown) accommodated in a mating connector.

[0024] As shown in Figure 6, the outer conductor 20 has multiple (four in this embodiment) cylindrical portions 21 extending in the front-to-rear direction, an inner conductor surrounding portion 22 extending rearward from the rear end edge of the cylindrical portion 21, and a flange 23 protruding in a direction intersecting the front-to-rear direction at the boundary between the cylindrical portion 21 and the inner conductor surrounding portion 22.

[0025] 6, the cross-sectional shape of the tubular portion 21 is a rectangle with rounded corners. The outer shape of the tubular portion 21 is set to be the same as or slightly smaller than the inner shape of the tubular portion mounting hole 34 of the rear wall 30. This allows the tubular portion 21 to be press-fitted into the tubular portion mounting hole 34 of the connector housing 11.

[0026] 7, a space extending in the front-rear direction is formed inside the cylindrical portion 21. An upper dielectric 16 and a lower dielectric 17, which will be described later, are press-fitted into the space inside the cylindrical portion 21 so that the upper dielectric 16 and the lower dielectric 17 are held in the cylindrical portion 21 in a non-removable state.

[0027] As shown in Fig. 8, the inner conductor surrounding portion 22 has a shape that opens downward when viewed from the rear. The inner conductor surrounding portion 22 has an upper wall 70, two side walls 71 extending downward from both left and right ends of the upper wall 70, and a partition wall 72 extending downward from near the center of the upper wall 70 in the left-right direction. The partition wall 72 is located between the two side walls 71. As shown in Fig. 9, an upper inner conductor 18 and a lower inner conductor 19, which will be described later, are accommodated inside the inner conductor surrounding portion 22 in a state in which they are surrounded from above, right, and left by the inner conductor surrounding portion 22.

[0028] 9, a plurality of (four in this embodiment) cylindrical sidewall connecting portions 73 protruding downward are provided at the lower ends of the two sidewalls 71, respectively. The sidewall connecting portions 73 are passed through the ground through-holes 51 of the circuit board 50, and are connected to the ground lands 54 formed on the inner surfaces formed on the hole edges of the ground through-holes 51 by a known method such as soldering.

[0029] 9, a plurality of (two in this embodiment) partition wall connections 74 each having a cylindrical shape protruding downward are provided at the lower end of the partition wall 72. The partition wall connections 74 are passed through the ground through holes 51 of the circuit board 50, and are connected to the ground lands 54 formed on the inner surface formed on the hole edge of the ground through holes 51 by a known method such as soldering.

[0030] 4, with the tubular portion 21 press-fitted into the tubular portion mounting hole 34, the flange 23 comes into contact with the rear surface of the rear wall 30 from behind. The portion of the flange 23 that corresponds to the die-cut hole 32 in the rear wall 30 closes the die-cut hole 32 from behind.

[0031] Figure 2 2, the flange 23 has locking recesses 26 formed at positions corresponding to the locking protrusions 33 of the rear wall 30, penetrating the flange 23 in the front-rear direction. The cross-sectional shape of the locking recesses 26 is circular. The inner shape of the locking recesses 26 is set to be approximately the same as the outer shape of the locking protrusions 33. "Approximately the same" includes cases where they are the same, and also includes cases where they are not the same but can be recognized as being substantially the same.

[0032] 10, after the rear end of the locking protrusion 33 is inserted into the locking recess 26, the rear end of the locking protrusion 33 is crushed by applying heat and pressure. As a result, the outer dimension of the rear end of the locking protrusion 33 becomes larger than the inner diameter of the locking recess 26, so that the locking protrusion 33 is held in the locking recess 26 in a non-dislodging state.

[0033] [Dielectric] As shown in Fig. 11, the lower dielectric 17 is attached to the lower cylindrical mounting hole 34, and the upper dielectric 16 is attached to the upper cylindrical mounting hole 34. The upper dielectric 16 and the lower dielectric 17 are made of insulating synthetic resin by injection molding. The upper dielectric 16 and the lower dielectric 17 each have an inner conductor through hole 24 through which a straight portion 28 of an upper inner conductor 18 and a straight portion 28 of a lower inner conductor 19, which will be described later, penetrate in the front-rear direction. The lower dielectric 17 is formed to have a height dimension in the vertical direction smaller than that of the upper dielectric 16.

[0034] [Inner conductor] As shown in FIG. 11 , a lower internal conductor 19 is attached to the lower dielectric 17, and an upper internal conductor 18 is attached to the upper dielectric 16. The lower internal conductor 19 and the upper internal conductor 18 are formed by bending a tab-shaped metal plate material into a predetermined shape. The lower internal conductor 19 and the upper internal conductor 18 each have a straight portion 28 extending in the front-rear direction (a direction along the plate surface of the circuit board 50), and a bent portion 29 bent with respect to the straight portion 28 and extending diagonally downward and rearward (a direction intersecting the plate surface of the circuit board 50). In the front-rear direction, the length dimension of the straight portion 28 of the lower internal conductor 19 is smaller than the length dimension of the straight portion 28 of the upper internal conductor 18. In the up-down direction, the height dimension of the lower internal conductor 19 is smaller than the height dimension of the upper internal conductor 18.

[0035] 11, when the upper inner conductor 18 is assembled to the upper dielectric 16, the front end of the straight portion 28 of the upper inner conductor 18 protrudes forward beyond the front end of the upper dielectric 16. When the lower inner conductor 19 is assembled to the lower dielectric 17, the front end of the straight portion 28 of the lower inner conductor 19 protrudes forward beyond the front end of the lower dielectric 17. A mating inner conductor (not shown) accommodated in a mating connector can come into contact with the straight portion 28.

[0036] 11, bent portion 29 is bent obliquely downward with respect to straight portion 28, and protrudes further downward from the lower surface of connector housing 11. The lower end of bent portion 29 is further bent in a direction perpendicular to circuit board 50 to form board connection portion 75 that is electrically connected to signal land 53 formed on circuit board 50. Board connection portion 75 is inserted into signal through hole 52 formed on circuit board 50 and soldered thereto, thereby being electrically connected to signal land 53 formed on circuit board 50.

[0037] [Shielding material 80] As shown in FIG. 11, a metallic shielding member 80 is disposed between the lower dielectric 17 and the upper dielectric 16. The shielding member 80 is formed by pressing a conductive metal plate into a predetermined shape. Any metal such as copper, a copper alloy, aluminum, or an aluminum alloy can be appropriately selected as the metal constituting the shielding member 80. As shown in FIG. 2, the shielding member 80 has a substantially rectangular main body 81, rearward extensions 82 extending rearward from both left and right side edges of the main body 81, and a forward extension 83 extending forward from the upper end edge of the main body 81.

[0038] 11, the shielding member 80 is press-fitted from behind between the side wall 71 and the partition wall 72. By press-fitting the shielding member 80 between the side wall 71 and the partition wall 72, the shielding member 80 is held in a non-dislodging state relative to the outer conductor 20, and the shielding member 80 and the outer conductor 20 are electrically connected to each other.

[0039] As shown in Fig. 11, the outer conductor 20 has a groove 25 that opens to the rear between the upper and lower cylindrical portions 21. The vertical span dimension of the groove 25 is set to be equal to or slightly larger than the vertical thickness dimension of the front extension 83. The front extension 83 of the shielding member 80 is press-fitted into the groove 25 from the rear. This holds the shielding member 80 in a rearwardly prevented manner relative to the outer conductor 20, and electrically connects the shielding member 80 to the outer conductor 20.

[0040] [Inner conductor pair] 2, two lower internal conductors 19 are attached adjacent to each other in the left-right direction to one lower dielectric 17. The two lower internal conductors 19 attached to one lower dielectric 17 form one lower internal conductor pair 84 (one example of an internal conductor pair). In this embodiment, two lower internal conductor pairs 84 are formed in one board connector 10.

[0041] Similarly, two upper internal conductors 18 are attached adjacent to each other in the left-right direction to one upper dielectric 16. The two upper internal conductors 18 attached to one upper dielectric 16 form one upper internal conductor pair 85 (one example of an internal conductor pair). In this embodiment, two upper internal conductor pairs 85 are formed in one board connector 10.

[0042] [Shield structure] 11, the front half of the straight portion 28 of the upper inner conductor 18 and the straight portion 28 of the lower inner conductor 19 are electromagnetically shielded by being covered by the tubular portion 21 of the outer conductor 20. As a result, the intrusion of noise from the outside into the portion of the straight portion 28 covered by the tubular portion 21 is suppressed, and the leakage of noise to the outside from the portion of the straight portion 28 covered by the tubular portion 21 is suppressed.

[0043] 11 , the rear half of the straight portion 28 of the upper inner conductor 18, the bent portion 29 of the upper inner conductor 18, and the bent portion 29 of the lower inner conductor 19 are covered by the inner conductor surrounding portion 22 of the outer conductor 20, and are thereby electromagnetically shielded. In detail, the upper wall 70 and two side walls 71 of the inner conductor surrounding portion 22 are adapted to prevent noise from entering the portions of the upper inner conductor 18 and the lower inner conductor 19 covered by the inner conductor surrounding portion 22 from the outside, and to prevent noise from leaking to the outside from the portions of the upper inner conductor 18 and the lower inner conductor 19 covered by the inner conductor surrounding portion 22.

[0044] As described above, the side wall connection portions 73 of the two side walls 71 are connected to the ground land 54 of the circuit board 50, thereby further preventing external noise from being mixed into the upper internal conductor 18 and the lower internal conductor 19, and further preventing noise from leaking to the outside from the upper internal conductor 18 and the lower internal conductor 19.

[0045] 12, the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the left side of the board connector 10 and the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the right side are separated by a partition wall 72. This prevents signals from leaking between the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the left side of the board connector 10 and the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the right side.

[0046] Since the bulkhead 72 is electrically connected to the ground land 54 of the circuit board 50 by the bulkhead connection portion 74, signal leakage between the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the left side of the board connector 10 and the lower inner conductor pair 84 and the upper inner conductor pair 85 arranged on the right side is further suppressed.

[0047] 11, an upper inner conductor pair 85 arranged on the upper side of the board connector 10 and a lower inner conductor pair 84 arranged on the lower side are separated by a shielding member 80. This prevents signals from leaking between the upper inner conductor pair 85 arranged on the upper side of the board connector 10 and the lower inner conductor pair 84 arranged on the lower side.

[0048] As described above, the shielding member 80 is electrically connected to the side wall 71 of the outer conductor 20 and the partition wall 72, thereby further suppressing signal leakage between the upper inner conductor pair 85 arranged on the upper side of the board connector 10 and the lower inner conductor pair 84 arranged on the lower side.

[0049] 1, the four board connecting portions 75 of the lower internal conductor 19 and the partition connecting portion 74 provided on the front side of the partition wall 72 are arranged in a row in the left-right direction. Moreover, the four board connecting portions 75 of the upper internal conductor 18 and the partition connecting portion 74 provided on the rear side of the partition wall 72 are arranged in a row in the left-right direction.

[0050] [An example of an assembly process according to an embodiment] Next, an example of an assembly process for the board connector 10 according to the present embodiment will be described. The assembly process for the board connector 10 is not limited to the following description.

[0051] The straight portion 28 of the lower inner conductor 19 is press-fitted from behind into the inner conductor through-hole 24 of the lower dielectric 17. The straight portion 28 of the upper inner conductor 18 is press-fitted from behind into the inner conductor through-hole 24 of the upper dielectric 16.

[0052] The lower dielectric 17 is attached to the outer conductor 20 from behind. As a result, the front end portion of the lower dielectric 17 is press-fitted into the cylindrical portion 21 of the outer conductor 20.

[0053] The shielding member 80 is attached to the outer conductor 20 from the rear. The front extension portion 83 of the shielding member 80 is press-fitted into the groove portion 25 of the outer conductor 20 from the rear, and the rear extension portion 82 of the shielding member 80 is press-fitted between the side wall 71 and the partition wall 72 from the rear.

[0054] The upper dielectric 16 is attached to the outer conductor 20 from behind. As a result, the front end portion of the upper dielectric 16 is press-fitted into the cylindrical portion 21 of the outer conductor 20.

[0055] The cylindrical portion 21 of the outer conductor 20 is press-fitted from behind into the cylindrical portion mounting hole 34 of the connector housing 11. At this time, the locking protrusion 33 is inserted into the locking recess 26 of the flange 23.

[0056] The rear end of the locking protrusion 33 is heated and pressurized to crush the rear end of the locking protrusion 33. This causes the outer conductor 20 to be held in the connector housing 11 in a non-dislodging state. This completes the manufacture of the board connector 10.

[0057] The board connector 10 and the circuit board 50 are connected as follows. As indicated by the arrow A in Fig. 1, the board connector 10 is assembled to the circuit board 50 from above. The side wall connection portion 73 and the bulkhead connection portion 74 are inserted from above into the ground through-hole 51 of the circuit board 50, and the board connection portion 75 of the bent portion 29 is inserted from above into the signal through-hole 52 of the circuit board 50. Thereafter, the side wall connection portion 73, the bulkhead connection portion 74, and the board connection portion 75 are connected to the ground land 54 and the signal land 53, respectively, by soldering. In this way, the board connector 10 and the circuit board 50 are connected.

[0058] [Effects of the embodiment] Next, the effects of the present embodiment will be described. The board connector 10 according to the present embodiment is a board connector 10 connected to a circuit board 50 having signal lands 53 and ground lands 54, and includes a connector housing 11 that fits with a mating connector, an upper inner conductor 18 and a lower inner conductor 19 that are attached to the connector housing 11 and connected to the signal lands 53 of the circuit board 50, and an upper inner conductor 18 that is attached to the connector housing 11 and electrically insulated from the upper inner conductor 18 and the lower inner conductor 19. The outer conductor 20 comprises an inner conductor 18 and a metallic outer conductor 20 covering the lower inner conductor 19, the outer conductor 20 having two side walls 71 and a partition wall 72 arranged between the two side walls 71 and between the multiple upper inner conductors 18 and between the multiple lower inner conductors 19, and a side wall connection portion 73 protruding downwardly from the lower ends of the two side walls 71 and a partition wall connection portion 74 protruding downwardly from the lower end of the partition wall 72 and connected to the ground land 54 of the circuit board 50.

[0059] By the bulkhead connection portion 74 connected to the ground land 54 of the circuit board 50, the upper inner conductor 18 and the lower inner conductor 19 are covered by the side wall 71 connected to the ground land 54 and the bulkhead 72 connected to the ground land 54. This improves electromagnetic symmetry between the side wall 71, the bulkhead 72, the upper inner conductor 18, and the lower inner conductor 19. As a result, it is possible to suppress signal leakage between the upper inner conductors 18 and between the lower inner conductors 19 separated by the bulkhead 72. This improves the communication performance of the board connector 10.

[0060] In addition, according to this embodiment, each of the upper internal conductor 18 and the lower internal conductor 19 has a board connection portion 75 that is connected to the signal land 53 of the circuit board 50, and the partition connection portion 74 and the board connection portion 75 are arranged side by side.

[0061] Arranging the bulkhead connecting portions 74 and the substrate connecting portions 75 side by side improves symmetry between the bulkhead connecting portions 74 and the substrate connecting portions 75. This further suppresses signal leakage between the substrate connecting portions 75.

[0062] Furthermore, according to this embodiment, the upper inner conductor 18 and the lower inner conductor 19 form an upper inner conductor pair 85 and a lower inner conductor pair 84, each consisting of two adjacent upper inner conductors 18 and lower inner conductors 19, and the partition 72 is arranged between the adjacent upper inner conductor pairs 85 and between the adjacent lower inner conductor pairs 84.

[0063] Since signal leakage between adjacent upper inner conductor pairs 85 is suppressed, and signal leakage between adjacent lower inner conductor pairs 84 is suppressed, the communication performance of the board connector 10 can be further improved.

[0064] <Other embodiments> (1) The outer conductor 20 may be formed by bending a metal plate.

[0065] (2) The locking protrusions 33 of the connector housing 11 may be press-fitted into the locking recesses 26 of the outer conductor 20 .

[0066] (3) In the present embodiment, the number of inner conductor pairs is four, but is not limited to this and may be two, three, five or more. Three or more inner conductor pairs may be arranged in the left-right direction, and three or more inner conductor pairs may be arranged in the up-down direction.

[0067] (4) The bulkhead connection portion 74 and the board connection portion 75 do not have to be aligned in a row.

[0068] (5) The number of bulkhead connectors 74 may be one, or three or more. [Explanation of symbols]

[0069] 10: PCB connector 11: Connector housing 15: Food section 16: Upper dielectric 17: Lower dielectric 18: Upper inner conductor 19: Lower inner conductor 20: Outer conductor 21: Cylinder part 22: Inner conductor enclosure 23: Flange 24: Inner conductor through hole 25: Groove 26: Locking recess 28: Straight section 29: Bend 30: Back wall 31: Rock Club 32: Die-cut hole 33: Locking protrusion 34: Barrel mounting hole 50: Circuit Board 51: Ground through hole 52: Signal through hole 53: Signal Land 54: Ground Land 70: Upper wall 71: Side wall 72: Bulkhead 73: Sidewall connection 74: Bulkhead connection 75: PCB connection part 80: Shielding material 81: Main body 82: Rear extension part 83: Front extension part 84: Lower inner conductor pair 85: Upper inner conductor pair

Claims

1. A board connector to be connected to a circuit board having a conductive path, a connector housing that mates with a mating connector; a plurality of inner conductors attached to the connector housing and connected to the conductive paths of the circuit board; a metal outer conductor attached to the connector housing and covering the plurality of inner conductors while being electrically insulated from the plurality of inner conductors; the outer conductor has two side walls and a partition disposed between the two side walls and between the plurality of inner conductors; A side wall connection portion protrudes from a lower end of each of the two side walls and is connected to the conductive path of the circuit board. a partition wall connecting portion protruding from a lower end portion of the partition wall and connected to the conductive path of the circuit board; each of the plurality of inner conductors has a board connection portion connected to the conductive path of the circuit board; The bulkhead connection portion and the board connection portion are arranged side by side in the board connector.

2. A board connector to be connected to a circuit board having a conductive path, a connector housing that mates with a mating connector; a plurality of inner conductors attached to the connector housing and connected to the conductive paths of the circuit board; a metal outer conductor attached to the connector housing and covering the plurality of inner conductors while being electrically insulated from the plurality of inner conductors; the outer conductor has two side walls and a partition disposed between the two side walls and between the plurality of inner conductors; A side wall connection portion protrudes from a lower end of each of the two side walls and is connected to the conductive path of the circuit board. a partition wall connecting portion protruding from a lower end portion of the partition wall and connected to the conductive path of the circuit board; The plurality of inner conductors form a plurality of inner conductor pairs, each of which is made up of two adjacent inner conductors; The partition wall is disposed between adjacent inner conductor pairs among the plurality of inner conductor pairs.

3. The plurality of inner conductors form a plurality of inner conductor pairs, each of which is made up of two adjacent inner conductors; 2. The board connector according to claim 1, wherein the partition wall is disposed between adjacent pairs of inner conductors among the plurality of inner conductor pairs.

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