Piezoelectric vibration device manufacturing apparatus and method for manufacturing piezoelectric vibration device

Abstract

Provided are a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method by which a plurality of piezoelectric elements can be respectively disposed at predetermined positions in predetermined orientations on a plurality of holding members. The piezoelectric vibration device manufacturing apparatus comprises a suction head moving apparatus 12 for reciprocating a plurality of suction heads 20 simultaneously. The plurality of suction heads 20 respectively suction piezoelectric elements P using suction nozzles 28. At least one of a suction-head horizontal movement mechanism 21, a suction-head vertical movement mechanism 24, and a suction-head rotational movement mechanism 26, on the basis of information about the position of a plurality of piezoelectric elements P respectively suctioned by the plurality of suction nozzles 28 and information about the position of a plurality of holding members H supplied to a holding member supply position Sh, adjusts the position of the suction nozzles 28 each independently and separately so that the piezoelectric elements P respectively being suctioned by the plurality of suction nozzles 28 can be disposed on the corresponding holding members H.

Description

[Technical field]

[0001] The present invention relates to a piezoelectric vibration device manufacturing apparatus and a method for manufacturing a piezoelectric vibration device. [Background technology]

[0002] Piezoelectric vibration devices include, for example, quartz crystal resonators that use quartz crystal resonators. The quartz crystal resonator has a quartz crystal resonator, which is a piezoelectric element, and a holding member that holds the quartz crystal resonator. The quartz crystal resonator has the quartz crystal resonator held in the box-shaped holding member made of an insulator such as ceramic. The quartz crystal resonator is sealed in a state where the electrodes of the quartz crystal resonator and the electrodes in the holding member are joined.

[0003] The piezoelectric elements and the holding member are supplied to a piezoelectric vibration device manufacturing apparatus that manufactures such a piezoelectric vibration device. The piezoelectric vibration device manufacturing apparatus places the piezoelectric elements supplied by a transfer device such as a suction head in the holding member to which a bonding material has been applied. At this time, the piezoelectric elements need to be placed in the holding member so that parts other than the electrodes do not come into contact with the holding member. Thus, a piezoelectric vibration device manufacturing apparatus is known that places the piezoelectric elements, which have been positioned relative to the transfer device, in the holding member. For example, Patent Document 1 discloses an element component mounting apparatus that positions the supplied element components and then mounts the element components on an element mounting member wafer.

[0004] The device for mounting element components described in Patent Document 1 includes a tray on which the element components are temporarily placed in order to position them. The tray has a number of recesses on which the element components are temporarily placed. The wall surfaces of the recesses are exposed to the opening side of the recesses while inclining in the depth direction. The element components inserted into the recesses slide along the wall surfaces of the recesses and are placed on the bottom surface of the recesses. The element components are positioned on the bottom surface of the recesses by the wall surfaces of the recesses. The device for mounting element components transports the element components positioned on the bottom surfaces of the recesses onto the device mounting member wafer. This allows the device for mounting element components to be placed on the device mounting member wafer in predetermined positions and in predetermined orientations. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2012 / 99560 Summary of the Invention [Problem to be solved by the invention]

[0006] The element component mounting device transports the supplied plurality of element components to the tray by a suction moving means and positions them on the tray. Furthermore, the element component mounting device adsorbs the plurality of element components positioned on the tray by a suction part of the suction moving means and transports them onto the element mounting member wafer. Therefore, the plurality of element components may be displaced in position and orientation from the position at which they were positioned on the tray when adsorbed. Furthermore, the recess of the tray has a bottom surface of a size that creates a gap between the wall surface and the element components positioned on the bottom surface in order to place the element components in the recess. Therefore, the element components may be displaced in position and orientation with respect to the tray by the gap between the wall surface and the element components positioned on the bottom surface.

[0007] An object of the present invention is to provide a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method that are capable of arranging a plurality of piezoelectric elements on a plurality of holding members in predetermined positions and in predetermined orientations. [Means for solving the problem]

[0008] The present inventors have studied a piezoelectric vibration device manufacturing apparatus and a method for manufacturing a piezoelectric vibration device that can arrange a plurality of piezoelectric elements on a plurality of holding members in a predetermined position and a predetermined orientation without increasing the takt time. As a result of extensive studies, the present inventors have come up with the following configuration.

[0009] A piezoelectric vibration device manufacturing apparatus according to one embodiment of the present invention is a piezoelectric vibration device manufacturing apparatus for manufacturing a piezoelectric vibration device having at least a piezoelectric element and a holding member for holding the piezoelectric element, in which the piezoelectric element is joined to the holding member by a bonding material.

[0010] The piezoelectric vibration device manufacturing apparatus includes a plurality of suction heads for suctioning the piezoelectric elements one by one, and a suction head moving device that is equipped with the plurality of suction heads and moves the plurality of suction heads back and forth simultaneously between a piezoelectric element supply position where the plurality of piezoelectric elements are supplied to a holding member supply position where the plurality of holding members are supplied. The suction heads include a suction nozzle for suctioning the piezoelectric elements, a horizontal movement mechanism for the suction head that moves the suction nozzle in a horizontal direction, a vertical movement mechanism for the suction head that moves the suction nozzle in a vertical direction, and a rotational movement mechanism for the suction head that moves the suction nozzle in a rotational direction around a vertical axis.

[0011] At the piezoelectric element supply position, the multiple suction heads respectively suction the piezoelectric elements supplied to the piezoelectric element supply position by the multiple suction nozzles. The multiple suction heads are moved from the piezoelectric element supply position to the holding member supply position by the suction head moving device. At least one of the suction head horizontal movement mechanism, the suction head vertical movement mechanism, and the suction head rotational movement mechanism independently and individually adjusts positions of the multiple suction nozzles to positions where the piezoelectric elements respectively adsorbed by the multiple suction nozzles can be arranged on the corresponding holding members, based on information on the positions of the multiple piezoelectric elements adsorbed by the multiple suction nozzles and information on the positions of the multiple holding members supplied to the holding member supply position.

[0012] In the above-mentioned configuration, the plurality of suction heads each have a suction nozzle that suctions the piezoelectric elements and transports the piezoelectric elements. At this time, the suction heads adjust the positions of the plurality of suction nozzles independently and individually based on information on the positions of the plurality of suctioned piezoelectric elements and information on the positions of the plurality of holding members on which the plurality of suctioned piezoelectric elements are respectively arranged. As a result, the plurality of suction heads can individually adjust the positions of the plurality of suctioned piezoelectric elements to correspond to the horizontal and vertical positions of the holding member, taking into account the deviation during suction. Moreover, the plurality of suction heads individually adjust the positions of the suction nozzles based on information on the positions of the piezoelectric elements, which are numerical data, and information on the positions of the holding members. Therefore, the piezoelectric vibration device manufacturing apparatus does not need to temporarily place the piezoelectric elements for alignment. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members in predetermined positions and predetermined orientations without increasing the takt time.

[0013] From another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: The piezoelectric vibration device manufacturing apparatus includes a plurality of supply heads each supplying the bonding material to the holding member, and a supply head moving device that mounts the plurality of supply heads and moves the plurality of supply heads back and forth simultaneously between standby positions for the plurality of supply heads and a holding member supply position.

[0014] The supply head includes a supply device that supplies the bonding material, a supply head horizontal movement mechanism that moves the supply device in a horizontal direction, and a supply head vertical movement mechanism that moves the supply device in a vertical direction. The supply heads are moved from the standby position to the holding member supply position by the supply head movement mechanism. The above At least one of the vertical movement mechanisms for the supply head independently adjusts the positions of the supply devices so that the multiple supply devices can supply the bonding material to each of the multiple holding members based on information regarding the positions of the multiple holding members supplied to the holding member supply position.

[0015] In the above-mentioned configuration, the multiple supply heads each independently adjust the position of the supply device so that it corresponds to the horizontal position and vertical position of the holding member. This allows the supply device to eject bonding material to a predetermined position on the holding member. Moreover, the multiple supply heads each independently adjust the position of the supply device based on information regarding the positions of the multiple holding members, which is acquired numerical data. Therefore, the piezoelectric vibration device manufacturing apparatus does not need to align the holding member with the supply device. Therefore, the bonding material can be placed at a predetermined position on each of the multiple holding members without increasing the takt time. This allows multiple piezoelectric elements to be placed on each of the multiple holding members at a predetermined position and in a predetermined orientation.

[0016] According to another aspect, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: the plurality of supply heads independently and individually supply the bonding material from the plurality of supply devices to the plurality of holding members at the holding member supply position, and the plurality of suction heads independently and individually position the piezoelectric elements respectively adsorbed by the plurality of suction nozzles on the plurality of holding members to which the bonding material is supplied at the holding member supply position.

[0017] In the above-mentioned configuration, the supply heads adjust the horizontal and vertical positions of the supply devices independently and individually based on information on the position of the holding member. The supply devices independently and individually supply the bonding material to predetermined positions of the holding members. This allows the supply devices to eject the bonding material to predetermined positions on the holding members while taking into account the variation in the positions of the holding members. The suction heads also independently and individually adjust the horizontal and vertical positions of the suction nozzles based on information on the position of the piezoelectric element and information on the position of the holding member. The suction nozzles independently and individually place the piezoelectric elements on predetermined positions of the holding members. This allows the suction head to place the piezoelectric elements on the holding members while taking into account the variation in the shape of the holding members. Therefore, the piezoelectric elements can be placed on the holding members at predetermined positions and in predetermined orientations without increasing the takt time.

[0018] From another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: the positions of the respective supply heads are simultaneously adjustable by at least one of the horizontal movement mechanism for the supply heads or the vertical movement mechanism for the supply heads, and the positions of the respective suction nozzles of the respective suction heads are simultaneously adjustable by at least one of the horizontal movement mechanism for the suction heads, the vertical movement mechanism for the suction heads, or the rotational movement mechanism for the suction heads.

[0019] In the above-mentioned configuration, the piezoelectric vibration device manufacturing apparatus simultaneously adjusts the positions of the multiple suction heads and the multiple supply heads by the respective moving mechanisms, so that the time required to adjust the positions of the multiple suction heads and the multiple supply heads is reduced regardless of the number of the suction heads and the supply heads. Therefore, the supply material can be supplied to the predetermined positions of the multiple holding members without increasing the takt time. In addition, the multiple piezoelectric elements can be arranged in the predetermined positions of the multiple holding members in the predetermined orientation without increasing the takt time.

[0020] From another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: The piezoelectric vibration device manufacturing apparatus has a piezoelectric element position measuring device that measures, as information relating to the positions of the piezoelectric elements, the horizontal positions and orientations of the multiple piezoelectric elements respectively adsorbed by the multiple suction heads, and a holding member position measuring device that measures, as information relating to the positions of the holding members, the horizontal and vertical positions of the multiple holding members that are supplied to the holding member supply position.

[0021] In the above-mentioned configuration, the piezoelectric element position measuring device measures the horizontal position and orientation of the piezoelectric element when the plurality of suction nozzles each suction the piezoelectric element. That is, the piezoelectric element position measuring device measures the deviation of each of the plurality of piezoelectric elements suctioned by the suction nozzle. Furthermore, the holding member position measuring device measures not only the horizontal position but also the vertical position of each of the plurality of holding members supplied to the holding member supply position. Thus, the holding member position measuring device can independently and individually adjust the vertical position of the piezoelectric element to be placed on each of the plurality of holding members based on the vertical position of the corresponding holding member. Thus, it is possible to place a plurality of piezoelectric elements on a plurality of holding members at a predetermined position and in a predetermined orientation without increasing the takt time.

[0022] A method for manufacturing a piezoelectric vibration device according to an embodiment of the present invention includes a method for manufacturing a piezoelectric vibration device, the method including: Connected This is a method for manufacturing a piezoelectric vibration device that is bonded using a composite material.

[0023] A manufacturing method for a piezoelectric vibration device includes a piezoelectric element supplying step of supplying a plurality of the piezoelectric elements to a piezoelectric element supplying position, a piezoelectric element positioning step of positioning the plurality of piezoelectric elements at the piezoelectric element supplying position, a holding member supplying step of supplying a plurality of the holding members to the holding member supplying position, a holding member positioning step of positioning the plurality of the holding members at the holding member supplying position, a piezoelectric element transporting step of transporting the plurality of piezoelectric elements positioned at the piezoelectric element supplying position from the piezoelectric element supplying position to the holding member supplying position, and a piezoelectric element position adjusting step of independently and individually adjusting the positions of the plurality of piezoelectric elements based on information regarding the positions of the plurality of piezoelectric elements transported from the piezoelectric element supplying position to the holding member supplying position and information regarding the position of the holding member positioned at the holding member supplying position so that the plurality of piezoelectric elements transported from the piezoelectric element supplying position to the holding member supplying position can each be positioned on the corresponding holding member.

[0024] In the above-mentioned configuration, the method for manufacturing a piezoelectric vibration device includes a piezoelectric element position adjustment step of independently and individually adjusting the positions of the multiple piezoelectric elements based on information about the position of the holding member and information about the position of the piezoelectric elements acquired during transportation in the piezoelectric element transportation step. The information about the position of the piezoelectric elements includes information about the positions taking into account the attitudes of the multiple piezoelectric elements during transportation. This eliminates the need to provide a separate step of positioning the attitude of the piezoelectric elements by temporary placement or the like after the piezoelectric element transportation step. Therefore, multiple piezoelectric elements can be placed on multiple holding members at predetermined positions and in predetermined orientations without increasing the takt time.

[0025] According to another aspect, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration: a bonding material supply position adjustment step of adjusting, at the holding member supply position, a supply position of the bonding material to be supplied to the holding member based on information regarding a position of the holding member supplied to the holding member supply position.

[0026] In the above-described configuration, in the bonding material supply position adjustment step, the positions at which the bonding material is supplied are individually adjusted to match the positions of the holding members. Moreover, since the bonding material supply positions are individually adjusted based on the acquired numerical data on the positions of the multiple holding members, there is no need to perform individual alignment for each holding member. Therefore, multiple piezoelectric elements can be arranged on multiple holding members at predetermined positions and in predetermined orientations without increasing the takt time.

[0027] From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration: The method for manufacturing a piezoelectric vibration device includes a bonding material supplying step of supplying the bonding material to each of the plurality of holding members at the holding member supplying position, and a piezoelectric element bonding step of arranging, at the holding member supplying position, the plurality of piezoelectric elements transported from the piezoelectric element supplying position to the holding member supplying position on each of the plurality of holding members to which the bonding material has been supplied.

[0028] In the above-mentioned configuration, in the bonding material supplying step, the supply positions of the bonding material on the multiple holding members are adjusted based on information on the positions of the multiple holding members. Also, in the piezoelectric element bonding step, the arrangement positions of the multiple piezoelectric elements on the multiple holding members are adjusted based on information on the positions of the piezoelectric elements and information on the positions of the holding members. Therefore, the multiple piezoelectric elements can be arranged on the multiple holding members at predetermined positions and with predetermined orientations.

[0029] From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration: the bonding material supply position adjustment step is a step of simultaneously adjusting the positions at which the bonding material is supplied to the multiple holding members, and the piezoelectric element position adjustment step is a step of simultaneously adjusting the positions of the multiple piezoelectric elements so that they can be respectively arranged on the holding members.

[0030] In the above-mentioned configuration, in the piezoelectric element position adjustment process, the arrangement positions of the multiple piezoelectric elements are adjusted simultaneously, and in the bonding material supply position adjustment process, the multiple supply positions of the bonding material are adjusted simultaneously. Therefore, regardless of the number of the piezoelectric elements arranged on the holding member, the time required to adjust the arrangement positions of the multiple piezoelectric elements and the supply position of the bonding material is reduced. Therefore, the supply material can be supplied to each of the multiple holding members at a predetermined position without increasing the takt time. In addition, each of the multiple piezoelectric elements can be arranged on each of the multiple holding members at a predetermined position and in a predetermined orientation without increasing the takt time.

[0031] From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration: a piezoelectric element position information acquisition step of acquiring information on the horizontal positions and orientations of the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position, and a holding member position information acquisition step of acquiring information on the horizontal and vertical positions of the plurality of holding members supplied to the holding member supply position.

[0032] In the above-mentioned configuration, the piezoelectric element position information acquisition step measures the horizontal positions and orientations of the piezoelectric elements in the piezoelectric element transport step. That is, the piezoelectric element position information acquisition step measures the attitude of the adsorbed piezoelectric elements. Furthermore, since the holding member position information acquisition step measures not only the horizontal positions of the multiple holding members but also the vertical positions of the multiple holding members, the vertical positions of the piezoelectric elements to be placed on each of the multiple holding members can be adjusted independently and individually based on the vertical positions of the corresponding holding members. Therefore, the multiple piezoelectric elements can be placed on each of the multiple holding members in a predetermined position and orientation without increasing the takt time.

[0033] [Piezoelectric vibration device] In this specification, a piezoelectric vibration device refers to an electronic component having a piezoelectric element that converts a force applied to a piezoelectric body into a voltage, or converts a voltage applied to a piezoelectric body into a force. Piezoelectric vibration devices include quartz crystal resonators and quartz crystal oscillators. Piezoelectric vibration devices are used in oscillator circuits, filter circuits, actuators, sensors, and the like.

[0034] [Piezoelectric element] In this specification, a piezoelectric element refers to a piezoelectric body that converts an applied force into a voltage, or converts an applied voltage into a force. In this embodiment, the piezoelectric element is a plate-shaped quartz crystal resonator piece cut from quartz crystal in a specific direction. The piezoelectric element has electrodes formed by deposition, sputtering, or the like.

[0035] [Holding material] In this specification, the holding member is a container made of an insulator for holding the piezoelectric element. In this embodiment, the holding member is a ceramic housing. The holding member has an electrode therein that is electrically connected to the piezoelectric element. The holding member has a recess therein in which the piezoelectric element can be placed.

[0036] [Joining material] In this specification, the bonding material refers to a conductive material that bonds the piezoelectric element to the holding container. The bonding material is, for example, solder, an adhesive, etc. In this embodiment, the bonding material is a thermosetting adhesive.

[0037] Relative Distance In this specification, relative distance means the distance between the centers of the parts.

[0038] [Location information] In this specification, information about a position means coordinates in the X direction, Y direction, Z direction, and θ direction of a specific point on a target device, part, etc., with an arbitrary point on the piezoelectric vibration device manufacturing apparatus as the origin. The coordinates in this embodiment are a coordinate system with an arbitrary point on the piezoelectric vibration device manufacturing apparatus as the origin. Effect of the Invention

[0039] According to one embodiment of the present invention, a plurality of piezoelectric elements can be arranged on a plurality of holding members in predetermined positions and in predetermined orientations without increasing the tact time. [Brief description of the drawings]

[0040] [Figure 1] FIG. 1 is a plan view showing an outline of the overall configuration of a piezoelectric vibration device manufacturing apparatus according to a first embodiment of the present invention. [Figure 2A] FIG. 2A is a plan view showing a plurality of piezoelectric elements and a tray supplied to the piezoelectric vibration device manufacturing apparatus according to the first embodiment of the present invention. [Figure 2B] FIG. 2B is a plan view showing an outline of a plurality of holding members supplied to a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention. [Diagram 3] FIG. 3 is a plan view showing an outline of the overall configuration of a plurality of suction heads included in a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention. [Figure 4] FIG. 4 is a view taken along the arrow A in FIG. [Diagram 5]FIG. 5 is a side view showing an outline of the overall configuration of a plurality of supply heads included in a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention. [Figure 6] FIG. 6 is a block diagram showing a control configuration of a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention. [Figure 7] FIG. 7 is a plan view showing an outline of a state in which a plurality of suction heads of a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention have transported piezoelectric elements to a holding member supply position. [Figure 8] FIG. 8 is a plan view showing an outline of a state in which the positions of the suction nozzles of the multiple suction heads of the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention have been adjusted. [Figure 9] FIG. 9 is a flow diagram of a method for manufacturing a piezoelectric vibration device according to an embodiment of the present invention. [Figure 10] Figure 10 is a plan view showing the operating states of a piezoelectric vibration device manufacturing apparatus in the holding member position information acquisition process, piezoelectric element supply process, holding member supply process, piezoelectric element positioning process, and holding member positioning process in a piezoelectric vibration device manufacturing method according to an embodiment of the present invention. [Figure 11] FIG. 11 is a plan view showing an operating state of a piezoelectric vibration device manufacturing apparatus in a bonding material supply position adjusting step and a bonding material supplying step in a manufacturing method for a piezoelectric vibration device according to an embodiment of the present invention. [Figure 12] FIG. 12 is a plan view showing the operating states of a piezoelectric vibration device manufacturing apparatus in a piezoelectric element transport step, a piezoelectric element position information acquisition step, a piezoelectric element position adjustment step, and a piezoelectric element bonding step in a manufacturing method for a piezoelectric vibration device according to an embodiment of the present invention. [Figure 13] FIG. 13 is a plan view showing the configuration of a piezoelectric vibration device manufacturing line including a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention. [Figure 14] FIG. 14 is a block diagram showing a control configuration of a piezoelectric vibration device manufacturing line including a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0041] Each embodiment will be described below with reference to the drawings. In each drawing, the same parts are given the same reference numerals, and the description of the same parts will not be repeated. Note that the dimensions of the components in each drawing do not faithfully represent the actual dimensions of the components and the dimensional ratios of each component.

[0042] In the following description of the piezoelectric vibration device manufacturing apparatus 1 according to an embodiment of the present invention, the direction in which the piezoelectric element P is transported to the piezoelectric element supply position Sp is defined as the "X direction". The direction perpendicular to the X direction in which the piezoelectric element P is transported from the piezoelectric element supply position Sp to the holding member supply position Sh is defined as the "Y direction". The direction perpendicular to the X direction and the Y direction is defined as the "Z direction". The direction of rotation around an axis extending in the Z direction is defined as the θ direction. In this embodiment, the X direction and the Y direction are directions on a horizontal plane. The Z direction is a vertical direction. However, this definition of the directions is not intended to limit the orientation of the piezoelectric vibration device manufacturing apparatus 1 during use.

[0043] In addition, in the following description, the expressions "fix," "connect," "join," "attach," and the like (hereinafter referred to as "fixation, etc.") include not only cases where members are directly fixed, etc. to each other, but also cases where members are fixed, etc. via other members. In other words, in the following description, the expression "fixation, etc." includes the meaning of direct and indirect fixation, etc. of members to each other.

[0044] [Embodiment 1] <Overall configuration of piezoelectric vibration device manufacturing equipment> 1 to 6, a piezoelectric vibration device manufacturing apparatus 1 according to a first embodiment of the piezoelectric vibration device manufacturing apparatus of the present invention will be described. FIG. 1 is a plan view showing an outline of the overall configuration of the piezoelectric vibration device manufacturing apparatus 1 according to the first embodiment of the present invention. FIG. 2A is a plan view showing a plurality of piezoelectric elements P and a tray T supplied to the piezoelectric vibration device manufacturing apparatus 1. FIG. 2B is a plan view showing an outline of a plurality of holding members H supplied to the piezoelectric vibration device manufacturing apparatus 1. FIG. 3 is a plan view showing an outline of the overall configuration of a plurality of suction heads 20 possessed by the piezoelectric vibration device manufacturing apparatus 1. FIG. 4 is a view seen from the arrow A in FIG. 3. FIG. 5 is a side view showing an outline of the overall configuration of a plurality of supply heads 30 possessed by the piezoelectric vibration device manufacturing apparatus 1. FIG. 6 is a block diagram showing a control configuration of the piezoelectric vibration device manufacturing apparatus 1.

[0045] 1, the piezoelectric vibration device manufacturing apparatus 1 has a stand 2, a piezoelectric element supplying device 10, a holding member supplying device 11, a suction head moving device 12, a supply head moving device 13, a camera 14 which is a piezoelectric element position measuring device, a laser measuring device 15 which is a holding member position measuring device, a control device 16, a suction head 20, and a supply head 30. The piezoelectric vibration device manufacturing apparatus 1 has each device arranged on a mounting surface which is a horizontal surface of the stand 2. A plurality of piezoelectric elements P and a plurality of holding members H are supplied to the piezoelectric vibration device manufacturing apparatus 1 from a supply line (not shown).

[0046] As shown in FIGS. 2A and 2B, a plurality of piezoelectric elements P are supplied to the piezoelectric vibration device manufacturing apparatus 1 while maintaining a relative distance therebetween. In this embodiment, a tray T, which is a container for the piezoelectric elements P, is provided with a plurality of recesses C in which the piezoelectric elements P are arranged. The recesses C are rectangular in plan view. On the tray T, a group of a plurality of recesses C provided in the X direction at intervals Px is arranged in the Y direction at intervals Py. In other words, on the tray T, a plurality of recesses C are arranged in a matrix shape positioned at intervals Px in the X direction and at intervals Py in the Y direction. The piezoelectric elements P are each positioned within the recesses C of the tray T. Note that the intervals Px and Py between adjacent recesses C are the intervals between the centers (intersections of diagonals) of the rectangular recesses C in plan view.

[0047] A plurality of holding members H are supplied to the piezoelectric vibration device manufacturing apparatus 1 while maintaining a relative distance therebetween. In this embodiment, a group of the plurality of holding members H aligned in the X direction at intervals Px is aligned in the Y direction at intervals Py. That is, the plurality of holding members H are arranged in a matrix shape positioned at intervals Px in the X direction and at intervals Py in the Y direction. The plurality of holding members H are also formed in a sheet shape connected to each other. The plurality of holding members H arranged in a sheet shape are positioned so as to correspond to the intervals Px in the X direction and the intervals Py in the Y direction of the recesses C.

[0048] The holding member H is, for example, rectangular in plan view. The holding member H is, for example, configured to have a long side of 2.0 mm and a short side of 1.6 mm. The holding member H is, for example, configured to have a long side of 1.6 mm and a short side of 1.2 mm. The holding member H is, for example, configured to have a long side of 1.2 mm and a short side of 1.0 mm. The size of the sheet formed by connecting a plurality of holding members to each other is configured to be the same size regardless of the size of the holding members H. In other words, the number of holding members H included in the sheet differs depending on the size of the holding members H. By configuring in this way, the piezoelectric vibration device manufacturing apparatus 1 does not need to replace the suction head moving device 12, the supply head moving device 13, etc. described later even if the size of the holding members H is changed.

[0049] 1, the piezoelectric element supplying device 10 is a positioning device that transports a tray T containing a plurality of piezoelectric elements P to a piezoelectric element supplying position Sp and determines the position of the piezoelectric element P to be supplied at the piezoelectric element supplying position Sp. In this embodiment, the piezoelectric element supplying device 10 is a one-axis linear motion unit having a servo motor as an actuator and a ball screw unit as a linear motion mechanism. The piezoelectric element supplying device 10 is placed on a stand 2 with the direction in which the piezoelectric elements P are transported as the X direction when viewed vertically.

[0050] The piezoelectric element supplying device 10 has a tray placement section 10a on which a tray T is placed. The piezoelectric element supplying device 10 can move the tray placement section 10a to any position within an operating range according to the rotation amount of a servo motor. In the piezoelectric element supplying device 10, the tray T is supplied to the tray placement section 10a from an external supply line (not shown) at a piezoelectric element waiting position Wp. The tray T placed on the tray placement section 10a can be transported to a piezoelectric element supply position Sp. The piezoelectric element supplying position Sp in the piezoelectric element supplying device 10 is determined in advance. In addition, in the piezoelectric element supplying device 10, in order to position the piezoelectric element P to be supplied among the multiple piezoelectric elements P accommodated in the tray T to the piezoelectric element supply position Sp, the stop position of the tray placement section 10a is determined for each piezoelectric element P to be supplied based on the position of the piezoelectric element P to be supplied on the tray placement section 10a. The piezoelectric element supplying device 10 positions the piezoelectric element P to be supplied at the piezoelectric element supplying position Sp based on a stop position determined for each piezoelectric element P to be supplied.

[0051] The holding member supply device 11 is a device that transports a plurality of holding members H connected in a sheet shape to a holding member supply position Sh and determines the position of the holding members H to be supplied at the holding member supply position Sh. In this embodiment, the holding member supply device 11 is a one-axis linear motion unit having a servo motor as an actuator and a ball screw unit or the like as a linear motion mechanism. The holding member supply device 11 is disposed on the stand 2 with the direction in which the holding members H are transported as the X direction when viewed vertically.

[0052] The holding member supplying device 11 is disposed at a position adjacent to the piezoelectric element supplying device 10 on the stand 2. The holding member supplying device 11 has a holding member placing section 11a on which a plurality of holding members H are placed. The holding member supplying device 11 can move the holding member placing section 11a to any position within an operating range according to the rotation amount of a servo motor. In the holding member supplying device 11, a plurality of holding members H are supplied to the holding member placing section 11a from an external supply line (not shown) at a holding member standby position Wh. The holding member supplying device 11 can transport the plurality of holding members H placed on the holding member placing section 11a to a holding member supplying position Sh. The holding member supplying position Sh in the holding member supplying device 11 is determined in advance. Furthermore, in order to position a holding member H at an arbitrary position among the multiple holding members H arranged in a sheet shape at the holding member supply position Sh, the holding member supply device 11 determines a stop position of the holding member mounting portion 11a for each holding member H to be supplied based on the position of the holding member H to be supplied on the holding member mounting portion 11a. The holding member supply device 11 positions the holding member H to be supplied at the holding member supply position Sh based on the stop position determined for each holding member H to be supplied.

[0053] The suction head moving device 12 is a device that simultaneously moves the multiple suction heads 20. In this embodiment, the suction head moving device 12 is a one-axis linear motion unit having a servo motor as an actuator and a ball screw unit or the like as a linear motion mechanism. The suction head moving device 12 is disposed on the stand 2 with the direction in which the multiple suction heads 20 are transported as the Y direction when viewed vertically. The suction head moving device 12 is located above the piezoelectric element supply device 10 and the holding member supply device 11 in the vertical direction (Z direction).

[0054] The suction head moving device 12 has a suction head mounting part 12a on which the multiple suction heads 20 are mounted. The suction head mounting part 12a has a horizontal mounting surface on which the multiple suction heads 20 are mounted. The suction head moving device 12 can move the suction head mounting part 12a to any position within an operating range according to the rotation amount of a servo motor. The suction head moving device 12 reciprocates the multiple suction heads 20 mounted on the mounting surface of the suction head mounting part 12a between a piezoelectric element supply position Sp and a holding member supply position Sh.

[0055] In order to move the multiple suction heads 20 to the piezoelectric element supply position Sp, the suction head moving device 12 determines a stop position of the suction head mounting part 12a for each of the piezoelectric elements P to be supplied based on the position of the piezoelectric element P to be supplied on the tray mounting part 10a. Similarly, in order to move the multiple suction heads 20 to the holding member supply position Sh, the suction head moving device 12 determines a stop position of the suction head mounting part 12a for each of the holding members H to be supplied based on the position of the holding members H to be supplied on the holding member mounting part 11a.

[0056] The supply head moving device 13 is a device that simultaneously moves multiple supply heads 30. In this embodiment, the supply head moving device 13 is a one-axis linear motion unit having a servo motor as an actuator and a ball screw unit or the like as a linear motion mechanism. The supply head moving device 13 is disposed on the stand 2 with the direction in which the multiple supply heads 30 are transported being the Y direction when viewed vertically. The supply head moving device 13 is located above the holding member supply device 11 in the vertical direction (Z direction).

[0057] The supply head moving device 13 has a supply head mounting portion 13a on which the multiple supply heads 30 are mounted. The supply head mounting portion 13a has a horizontal mounting surface on which the multiple supply heads 30 are mounted. The supply head moving device 13 can move the supply head mounting portion 13a to any position within the operating range according to the rotation amount of the servo motor. The supply head moving device 13 can transport the multiple supply heads 30 mounted on the supply head mounting portion 13a from the standby position W to the holding member supply position Sh. In order to move the multiple supply heads 30 to the holding member supply position Sh, the supply head moving device 13 determines a stop position of the supply head mounting portion 13a for each holding member H to be supplied based on the position of the holding member H to be supplied on the holding member mounting portion 11a.

[0058] 3 and 4, the suction head 20 is a device that sucks the piezoelectric element P with a suction nozzle 28 and places it in a recess of a holding member H. The suction head 20 has a horizontal movement mechanism 21 for the suction head, a vertical movement mechanism 24 for the suction head, a rotational movement mechanism 26 for the suction head, and the suction nozzle 28.

[0059] The suction head horizontal movement mechanism 21 has a plate-shaped first suction head movement member 22 that moves in a first direction, and a plate-shaped second suction head movement member 23 that moves in a second direction different from the first direction. The first suction head movement member 22 can be moved in the first direction by a stepping motor and a cam mechanism that are actuators. The second suction head movement member 23 can be moved in the second direction by a stepping motor and a cam mechanism that are actuators.

[0060] The first suction head moving member 22 is disposed on the suction head mounting portion 12a of the suction head moving device 12. At this time, the first suction head moving member 22 is disposed so that the first direction, which is the moving direction, is the horizontal X direction when viewed in the vertical direction. This allows the first suction head moving member 22 to move in the horizontal X direction relative to the suction head mounting portion 12a.

[0061] The second suction head moving member 23 is disposed on the first suction head moving member 22. The second suction head moving member 23 is disposed so that the second direction, which is the moving direction, is the Y direction perpendicular to the X direction in the horizontal direction when viewed in the vertical direction. This allows the second suction head moving member 23 to move in the Y direction perpendicular to the X direction in the horizontal direction relative to the first suction head moving member 22.

[0062] The suction head horizontal movement mechanism 21 thus configured can move the suction head second movement member 23 in the X direction in the horizontal direction relative to the suction head mounting portion 12a by the suction head first movement member 22. The suction head horizontal movement mechanism 21 can also move the suction head second movement member 23 in the Y direction perpendicular to the X direction in the horizontal direction relative to the suction head first movement member 22. In other words, the suction head horizontal movement mechanism 21 can move the suction head second movement member 23 in the X direction in the horizontal direction relative to the suction head mounting portion 12a and in the Y direction perpendicular to the X direction.

[0063] The suction head vertical movement mechanism 24 has a plate-like suction head third movement member 25 that moves in a direction perpendicular to the first and second directions that are the movement directions of the suction head horizontal movement mechanism 21. The suction head third movement member 25 can be moved in the third direction by a servo motor that is an actuator and a ball screw unit or the like that is a linear motion mechanism.

[0064] The third moving member 25 for the suction head is Vertical movement mechanism for suction head 24 In this case, the third suction head moving member 25 is arranged so that the third direction, which is the moving direction, is the Z direction. This allows the third suction head moving member 25 to move in the X direction and the Y direction, which are horizontal directions, relative to the suction head mounting portion 12a, and to move in the Z direction, which is the vertical direction.

[0065] The suction head rotational movement mechanism 26 has a cylindrical suction head fourth movement member 27 that moves (rotates) around an axis extending in the third direction, which is the movement direction of the suction head vertical movement mechanism 24. The suction head fourth movement member 27 can be moved in the rotational direction by an actuator such as a stepping motor.

[0066] The fourth suction head moving member 27 is mounted on the suction head rotating mechanism 26. In this case, the fourth suction head moving member 27 is arranged so that the third direction, which is the rotation axis, is the Z direction. In other words, the fourth suction head moving member 27 is rotatable in the θ direction, which is the rotation direction around the vertical axis. As a result, the fourth suction head moving member 27 is movable in the X direction and the Y direction in the horizontal direction relative to the suction head mounting portion 12a, movable in the Z direction, which is the vertical direction, and rotatable in the θ direction.

[0067] The suction nozzle 28 is a nozzle that suctions the piezoelectric element P in the recess C of the tray T. The suction nozzle 28 is mounted on the fourth moving member 27 for the suction head. The suction nozzle 28 is arranged at the lower end of the fourth moving member 27 for the suction head. The suction nozzle 28 has a lower end shape that can suction the piezoelectric element P. The suction nozzle 28 also has a suction hole at the lower end. The suction nozzle 28 suctions the piezoelectric element P by making the pressure in the suction hole negative with the suction hole blocked by the piezoelectric element P. The suction nozzle 28 arranged on the fourth moving member 27 for the suction head is movable in the X direction and the Y direction in the horizontal direction relative to the suction head mounting portion 12a, movable in the Z direction which is the vertical direction, and rotatable in the θ direction.

[0068] Thus, the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotation movement mechanism 26 constituting the suction head 20 each have a servo motor as an actuator for each movement direction. Also, the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotation movement mechanism 26 are not configured to be linked with each other. In other words, the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotation movement mechanism 26 can move independently of each other in each movement direction.

[0069] The piezoelectric vibration device manufacturing apparatus 1 has a plurality of suction heads 20. The piezoelectric vibration device manufacturing apparatus 1 has, for example, four suction heads 20. The four suction heads 20 are mounted on the suction head mounting portion 12a of the suction head moving device 12. This allows the four suction heads 20 to be simultaneously moved between a piezoelectric element supply position Sp and a holding member supply position Sh by the suction head moving device 12. Meanwhile, the movable parts of the four suction heads 20 are not connected to each other. In other words, the suction nozzles 28 of the four suction heads 20 can be moved individually and independently in the X direction, Y direction, Z direction, and θ direction when mounted on the suction head mounting portion 12a.

[0070] The suction heads 20 are arranged in pairs in the X direction. In addition, in the Y direction, one suction head 20 is arranged next to the two suction heads 20 arranged in pairs in the X direction. That is, the four suction heads 20 are arranged in a matrix in the X and Y directions. The suction nozzles 28 of the suction heads 20 arranged in the X direction are arranged at intervals A, which is an integer multiple of the interval Px between the recesses C and the sheet-like holding member H provided on the tray T. The suction nozzles 28 of the suction heads 20 arranged in the Y direction are arranged at intervals B, which is an integer multiple of the interval Py between the recesses C and the sheet-like holding member H provided on the tray T.

[0071] With this configuration, the four suction heads 20 can respectively adsorb, at the piezoelectric element supply position Sp, one piezoelectric element P located on the tray T with each suction nozzle 28. That is, the four suction heads 20 can adsorb an arbitrarily selected piezoelectric element P, the A-th piezoelectric element P in the X direction from the arbitrarily selected piezoelectric element P, the B-th piezoelectric element P in the Y direction from the arbitrarily selected piezoelectric element P, and the A-th piezoelectric element P in the X direction and the B-th piezoelectric element P in the Y direction from the arbitrarily selected piezoelectric element P.

[0072] Similarly, at the holding member supply position Sh, the four suction heads 20 can place each of the piezoelectric elements P suctioned by the respective suction nozzles 28 in the recesses of the holding member H. In other words, the four suction heads 20 can respectively suction an arbitrarily selected holding member H, the A-th holding member H in the X direction from the arbitrarily selected holding member H, the B-th holding member H in the Y direction from the arbitrarily selected holding member H, and the A-th holding member H in the X direction and the B-th holding member H in the Y direction from the arbitrarily selected holding member H.

[0073] 5, the supply head 30 is a device that supplies bonding material into recesses of a plurality of sheet-like holding members H. The supply head 30 has a supply head horizontal movement mechanism 31, a supply head vertical movement mechanism 34, and a supply device 36.

[0074] The horizontal movement mechanism for supply head 31 has a first movement member for supply head 32 that moves in a first direction, and a second movement member for supply head 33 that moves in a second direction different from the first direction. The first movement member for supply head 32 can be moved in the first direction by a stepping motor and a cam mechanism that are actuators. The second movement member for supply head 33 can be moved in the second direction by a stepping motor and a cam mechanism that are actuators.

[0075] The first supply head moving member 32 is disposed on the supply head mounting portion 13a of the supply head moving device 13. At this time, the first supply head moving member 32 is disposed so that the first direction, which is the movement direction, is the X direction when viewed vertically. This allows the first supply head moving member 32 to move in the X direction in the horizontal direction relative to the supply head mounting portion 13a.

[0076] The second supply head moving member 33 is disposed on the first supply head moving member 32. The second supply head moving member 33 is disposed such that the second direction, which is the moving direction, is the Y direction perpendicular to the X direction in the horizontal direction when viewed in the vertical direction. This allows the second supply head moving member 33 to move in the Y direction in the horizontal direction relative to the first supply head moving member 32.

[0077] The horizontal movement mechanism for supply head 31 thus configured can move the second supply head movement member 33 in the X direction in the horizontal direction relative to the supply head mounting portion 13a by the first supply head movement member 32. Also, the horizontal movement mechanism for supply head 31 can move the second supply head movement member 33 in the Y direction perpendicular to the X direction in the horizontal direction relative to the first supply head movement member 32. In other words, the horizontal movement mechanism for supply head 31 can move the second supply head movement member 33 in the X direction in the horizontal direction and in the Y direction perpendicular to the X direction relative to the supply head mounting portion 13a.

[0078] The supply head vertical movement mechanism 34 has a plate-like supply head third movement member 35 that moves in a direction perpendicular to the first and second directions that are the movement directions of the supply head horizontal movement mechanism 31. The supply head third movement member 35 can be moved in the third direction by a servo motor as an actuator and a ball screw unit or the like as a linear motion mechanism.

[0079] The third supply head moving member 35 is disposed on the second supply head moving member 33. At this time, the third supply head moving member 35 is disposed so that the third direction, which is the moving direction, is the Z direction. This allows the third supply head moving member 35 to move in the X direction and Y direction horizontally relative to the supply head mounting portion 13a, and to move in the Z direction, which is the vertical direction.

[0080] The supply device 36 is a device that supplies a bonding material into the recess of the holding member H in which the piezoelectric element P is arranged. In this embodiment, the supply device 36 is a discharge device that discharges a predetermined amount of conductive adhesive. The supply device 36 is disposed on the third moving member 35 for the supply head. The supply device 36 has a discharge nozzle 36a shaped to be able to supply the bonding material into the recess of the holding member H below in the vertical direction (Z direction). The supply device 36 discharges the bonding material from the discharge nozzle 36a toward the vertical direction (Z direction) downward when viewed in the horizontal direction. In addition, the discharge nozzle 36a is configured to be movable in the Z direction when it comes into contact with the holding member H from the Z direction. The supply device 36 mounted on the third moving member 35 for the supply head is movable in the X direction and Y direction in the horizontal direction relative to the supply head mounting part 13a, and is also movable in the Z direction, which is the vertical direction.

[0081] The supply device 36 also has a cooling device 36b. The cooling device 36b is composed of a Peltier element, which is a semiconductor thermoelectric element, and an air-cooling fan for cooling the Peltier element. The cooling device 36b is located near the discharge nozzle 36a. The cooling device 36b maintains the temperature of the bonding material in the supply device 36 at an appropriate temperature. This allows the viscosity of the bonding material in the supply device 36 to be maintained within a certain range, thereby preventing the bonding material from clogging the discharge nozzle 36a.

[0082] The supply device 36 also has a contact sensor (not shown) that detects the position of the discharge nozzle 36a in the Z direction. The contact sensor is a sensor that detects the movement of the discharge nozzle 36a in the Z direction. Thus, the contact sensor can detect that the tip of the discharge nozzle 36a has come into contact with the holding member H. The control device 16, which will be described later, controls the supply device 36 with the position of the third supply head moving member 35 when the contact sensor detects the contact between the discharge nozzle 36a and the holding member H as the zero point. The contact sensor is disposed closer to the supply device 36 than a Z direction guide device (not shown) of the third supply head moving member 35. Preferably, the contact sensor is disposed on the Z axis of the discharge nozzle 36a.

[0083] Thus, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head constituting the supply head 30 each have a servo motor as an actuator for each movement direction. Moreover, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head are not configured to move in conjunction with each other. In other words, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head can move independently of each other.

[0084] The piezoelectric vibration device manufacturing apparatus 1 has a plurality of supply heads 30. The piezoelectric vibration device manufacturing apparatus 1 has, for example, four supply heads 30. The four supply heads 30 are arranged on the supply head mounting portion 13a of the supply head moving device 13. This allows the four supply heads 30 to be simultaneously moved between the standby position W and the holding member supply position Sh by the supply head moving device 13. Meanwhile, the movable parts of the four supply heads 30 are not connected to each other. In other words, the supply devices 36 of the four supply heads 30 can be moved individually and independently from each other in the X direction, Y direction, and Z direction when mounted on the supply head mounting portion 13a.

[0085] The supply heads 30 are arranged in pairs in the X direction. In addition, in the Y direction, one supply head 30 is arranged next to the two supply heads 30 arranged in the X direction. That is, the four supply heads 30 are arranged in a matrix in the X and Y directions. The discharge nozzles 36a of the supply devices 36 of the supply heads 30 arranged in the X direction are arranged at intervals A, which is an integer multiple of the interval Px of the sheet-like holding members H. The discharge nozzles 36a of the supply devices 36 of the supply heads 30 arranged in the Y direction are arranged at intervals B, which is an integer multiple of the interval Py of the sheet-like holding members H.

[0086] In addition, a confirmation camera 37 is mounted on the supply head mounting portion 13a to confirm the application diameter of the bonding material sprayed as a waste spray by the supply device 36. Furthermore, at a standby position W described later and below the supply device 36, a waste spray section 38 where the supply device 36 performs a waste spray is disposed.

[0087] With this configuration, the four supply heads 30 can supply bonding material to the holding member H at the holding member supply position Sh by each supply device 36 without moving the position of the supply device 36 by the supply head moving device 13 and the supply head horizontal movement mechanism 31. In other words, the four supply heads 30 can supply bonding material to an arbitrarily selected holding member H, the A-th holding member H in the X direction from the arbitrarily selected holding member H, the B-th holding member H in the Y direction from the arbitrarily selected holding member H, and the A-th holding member H in the X direction and B-th holding member H in the Y direction from the arbitrarily selected holding member H.

[0088] As shown in FIG. 1 and FIG. 6, the camera 14, which is a piezoelectric element position measuring device, is a camera that measures the position of the piezoelectric element P that is respectively adsorbed by the four suction nozzles 28 relative to the suction head 20. The camera 14 is located on the stand 2, vertically below the suction head moving device 12. The camera 14 is also disposed at a position that overlaps with the suction head 20 moved by the suction head moving device 12 when viewed in the vertical direction. The camera 14 is also installed so as to capture an image in the vertical direction upward. This allows the camera 14 to capture an image of the suction head 20 moved by the suction head moving device 12 and the piezoelectric element P that is respectively adsorbed by the suction head 20 from below the suction head 20. In other words, the camera 14 can capture an image for measuring the position of the piezoelectric element P that is respectively adsorbed by the four suction nozzles 28 relative to the suction head 20.

[0089] The laser measuring device 15, which is a holding member position measuring device, is a measuring device that measures the shape including the position of multiple holding members H connected in a sheet-like shape. The laser measuring device 15 is located on the stand 2 and vertically above the holding member supplying device 11. The laser measuring device 15 is also disposed at a position overlapping the sheet-like holding member H transported by the holding member supplying device 11 when viewed in the vertical direction. The laser measuring device 15 is also installed so as to irradiate a laser vertically downward. This allows the laser measuring device 15 to measure the sheet-like holding member H supplied to the holding member supplying device 11 from above the holding member H.

[0090] That is, the laser measuring device 15 can measure the shape in three dimensions based on the shape, position, and thickness information of each part in the vertical direction of each of the multiple holding members H connected in a sheet shape. Also, the laser measuring device 15 is configured to be rotatable and movable in the horizontal direction so as to match the horizontal position and degree of rotation of each holding member H. This allows the shape including the position of the holding members to be measured more accurately by laser scanning.

[0091] As shown in Fig. 6, the control device 16 controls the piezoelectric element supply device 10, the holding member supply device 11, the suction head moving device 12, the supply head moving device 13, the suction head 20, the supply head 30, the camera 14, and the laser measurement device 15. The control device 16 is substantially a CPU, a ROM, a RAM, etc. connected via a bus. Alternatively, the control device 16 may be configured as a one-chip LSI or the like. The control device 16 stores various programs and data for controlling the operations of the actuators, the camera 14, and the laser measurement device 15 and for processing image data.

[0092] The control device 16 is electrically connected to the servo motors of the piezoelectric element supply device 10, the holding member supply device 11, the suction head moving device 12, and the supply head moving device 13, and can be controlled independently and individually. The control device 16 is also electrically connected to the servo motors of the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotation movement mechanism 26 of the suction head 20, and can be controlled independently and individually. The control device 16 can also control the solenoid valve for suction switching of the suction head 20 (not shown). The control device 16 is also electrically connected to the servo motors of the supply head horizontal movement mechanism 31 and the supply head vertical movement mechanism 34, and can be controlled independently and individually. The control device 16 is also electrically connected to the four supply devices 36, and can be controlled independently and individually.

[0093] The control device 16 is electrically connected to the camera 14 and can control the camera 14. The control device 16 can also acquire images captured by the camera 14. The control device 16 is electrically connected to the laser measurement device 15 and can control the laser measurement device 15. The control device 16 can also acquire measurement values ​​for the positions and shapes of each of the multiple holding members H measured by the laser measurement device 15.

[0094] The piezoelectric vibration device manufacturing apparatus 1 configured in this manner has a plurality of suction heads 20 that can move the suction nozzles 28 independently and individually in the X direction, Y direction, Z direction, and θ direction. Furthermore, the piezoelectric vibration device manufacturing apparatus 1 can control the positions of the suction nozzles 28 in the plurality of suction heads 20 independently and individually. The piezoelectric vibration device manufacturing apparatus 1 also has a plurality of supply heads 30 that can move the bonding material supply devices 36 independently and individually in the X direction, Y direction, and Z direction. Furthermore, the piezoelectric vibration device manufacturing apparatus 1 can control the positions of the supply devices 36 in the plurality of supply heads 30 independently and individually.

[0095] <About the adsorption position of the piezoelectric element and the position of the holding member> Next, using Figures 2A and 2B, we will explain the position on the tray T of the piezoelectric element P to be adsorbed by the four suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention, and the position of the holding member H on which the piezoelectric element P is placed.

[0096] The suction nozzles 28 of the four suction heads 20 are spaced apart from each other by A times the interval Px in the X direction and B times the interval Py in the Y direction. Thus, the first suction head 20 of the four suction heads 20 suctions the first piezoelectric element P1 accommodated in a recess C at any position among the recesses C on the tray T in which the piezoelectric elements P are accommodated. The second suction head 20 of the four suction heads 20 suctions the second piezoelectric element P2 accommodated in a recess C that is A adjacent in the X direction from the recess C in which the first piezoelectric element P1 is accommodated. The third suction head 20 of the four suction heads 20 suctions the third piezoelectric element P3 accommodated in a recess C that is B adjacent in the Y direction from the recess C in which the first piezoelectric element P1 is accommodated. Of the four suction heads 20, the fourth suction head 20 suctions the fourth piezoelectric element P4 housed in a recess C that is A spaces in the X direction and B spaces in the Y direction away from the recess C housing the first piezoelectric element P1.

[0097] When the four suction heads 20 suck up the piezoelectric element P accommodated in the recess C adjacent in the X direction from the recess C in which the first piezoelectric element P1 is accommodated as the piezoelectric element P to be sucked, the four suction heads 20 suck up the piezoelectric element P accommodated in the recess C adjacent in the X direction from the recess C in which the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 are respectively accommodated as the piezoelectric element P to be sucked. When the four suction heads 20 suck up the piezoelectric element P accommodated in the recess C adjacent in the Y direction from the recess C in which the first piezoelectric element P1 is accommodated as the piezoelectric element P to be sucked, the four suction heads 20 suck up the piezoelectric element P accommodated in the recess C adjacent in the Y direction from the recess C in which the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 are respectively accommodated as the piezoelectric element P to be sucked.

[0098] Therefore, the four suction heads 20 suction the piezoelectric elements P accommodated in the recesses C included in four regions surrounded by a range from the recess C accommodating the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 to the recess C adjacent thereto in the (A-1)th position in the X direction, and a range from the recess C accommodating the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 to the recess C adjacent thereto in the (B-1)th position in the Y direction, in the multiple recesses C on the tray T. That is, the first suction head 20 suctions the piezoelectric element P in the first piezoelectric element region Rp1 including the recess C accommodating the first piezoelectric element P1. The second suction head 20 suctions the piezoelectric element P in the second piezoelectric element region Rp2 including the recess C accommodating the second piezoelectric element P2. The third suction head 20 suctions the piezoelectric elements P in the third piezoelectric element region Rp3 including the recess C in which the third piezoelectric element P3 is housed. The fourth suction head 20 suctions the piezoelectric elements P in the fourth piezoelectric element region Rp4 including the recess C in which the fourth piezoelectric element P4 is housed. In this manner, each suction head 20 suctions the piezoelectric elements P included in regions of the same shape and in a number corresponding to the number of suction heads 20.

[0099] The first suction head 20 suctioning the first piezoelectric element P1 places the first piezoelectric element P1 in the recess of the first holding member H1, which is the holding member H at an arbitrary position. The second suction head 20 suctioning the second piezoelectric element P2 places the second piezoelectric element P2 in the recess of the second holding member H2, which is the holding member H that is A units away from the first holding member H1 in the X direction. The third suction head 20 suctioning the third piezoelectric element P3 places the third piezoelectric element P3 in the recess of the third holding member H3, which is the holding member H that is B units away from the first holding member H1 in the Y direction. The fourth suction head 20 suctioning the fourth piezoelectric element P4, No. The fourth piezoelectric element P4 is disposed in a recess of the fourth holding member H4, which is the holding member H that is A pieces in the X direction and B pieces in the Y direction adjacent to the first holding member H1. In this manner, each holding member H holds the piezoelectric element P.

[0100] When placing the piezoelectric element P on the holding member H adjacent in the X direction from the first holding member H1 on which the first piezoelectric element P1 is placed, the four suction heads 20 place the piezoelectric element P on the holding member H adjacent in the X direction from the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4. When placing the piezoelectric element P in the recess of the holding member H adjacent in the Y direction from the first holding member H1 on which the first piezoelectric element P1 is placed, the four suction heads 20 place the piezoelectric element P in the recess of the holding member H adjacent in the Y direction from the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4.

[0101] Therefore, the four suction heads 20 place the piezoelectric elements P in the recesses of the holding members H included in four regions surrounded by the range from the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4 to the holding member H that is (A-1) units away in the X direction, and the range from the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4 to the holding member H that is (B-1) units away in the Y direction, in the multiple holding members H connected in a sheet shape. That is, the first suction head 20 places the first piezoelectric element P1 in the recesses of the holding members H in the first holding member region Rh1 including the first holding member H1. The second suction head 20 places the second piezoelectric element P2 in the recesses of the holding members H in the second holding member region Rh2 including the second holding member H2. The third suction head 20 places the third piezoelectric element P3 in a recess of the holding member H in the third holding member region Rh3 including the third holding member H3. The fourth suction head 20 places the fourth piezoelectric element P4 in a recess of the holding member H in the fourth holding member region Rh4 including the fourth holding member H4. In this way, each suction head 20 places the piezoelectric elements P in the recesses of the holding member H included in regions of the same shape and the number of which corresponds to the number of suction heads 20.

[0102] In addition, when the piezoelectric element P adsorbed from the recess C at any position in the first piezoelectric element region Rp1 by the suction head 20 is arranged on the holding member H at a position in the first holding member region Rh1 corresponding to the recess C in the first piezoelectric element region Rp1 in which the adsorbed piezoelectric element P was accommodated, the first holding member region Rh1 and the first piezoelectric element region Rp1 have the same shape. The second holding member region Rh2 and the second piezoelectric element region Rp2 have the same shape. The third holding member region Rh3 and the third piezoelectric element region Rp3 have the same shape. The fourth holding member region Rh4 and the fourth piezoelectric element region Rp4 have the same shape. In other words, the arrangement of the holding member H in the first holding member region Rh1 to the fourth holding member region Rh4 is the same as the arrangement of the piezoelectric element P in the first piezoelectric element region Rp1 to the fourth piezoelectric element region Rp4.

[0103] <Adjusting the placement position of the piezoelectric element> Next, adjustment of the position of the suction nozzle 28 in the suction head 20 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention will be described with reference to Figures 1, 7 and 8. Figure 7 is a plan view showing an outline of a state in which the multiple suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 have transported the piezoelectric element P to a holding member supply position Sh. Figure 8 is a plan view showing an outline of a state in which the multiple suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 have adjusted the position of the suction nozzle 28.

[0104] The control device 16 has information regarding the position of the holding member supply device 11, information regarding the position of the suction head moving device 12, information regarding the position of the supply head moving device 13, information regarding the position of the camera 14, information regarding the position of the laser measuring device 15, information regarding the position of the suction head 20, and information regarding the position of the supply head 30.

[0105] 1, the control device 16 measures the shapes of the multiple sheet-like holding members H transported by the holding member supply device 11 using the laser measurement device 15. At this time, the control device 16 obtains the measurement values ​​for the shapes of the multiple sheet-like holding members H measured by the laser measurement device 15. After obtaining the measurement values ​​for the shapes of the holding members H, the control device 16 transports the multiple sheet-like holding members H to a holding member supply position Sh by the holding member supply device 11.

[0106] The control device 16 calculates coordinate values ​​H(n) (x0, y0, z0, θ0) of the measured central position of each holding member H in the X direction, Y direction, and Z direction and the θ direction which is the longitudinal direction, from the acquired measurement values ​​of the multiple holding members H and the transport positions of the multiple holding members H in the holding member supply device 11 when measured by the laser measurement device 15. Here, (n) is the number of the holding member H. The control device 16 stores the measured coordinate values ​​H(n) (x0n, y0n, z0n, θ0n) of the holding member H as information Ih related to the position of the holding member H.

[0107] 7, the control device 16 controls the holding member supply device 11 so that the first holding member H1 to the fourth holding member H4, in which the first piezoelectric element P1 to the fourth piezoelectric element P4 are arranged, among the multiple holding members H are transported to the holding member supply position Sh based on a predetermined joining order of the piezoelectric elements P in the multiple holding members H. The control device 16 extracts H1 (x11, y11, z11, θ11), H2 (x12, y12, z12, θ12), H3 (x13, y13, z13, θ13), and H4 (x14, y14, z14, θ14), which are coordinate values ​​of the first holding member H1 to the fourth holding member H4 at the holding member supply position Sh, based on the information Ih related to the calculated position of the holding member H.

[0108] The control device 16 controls the suction head moving device 12 so that the four suction heads 20, which have respectively sucked the four piezoelectric elements P from the first piezoelectric element P1 to the fourth piezoelectric element P4, are transported to the holding member supply position Sh. The control device 16 controls the camera 14 so that the first piezoelectric element P1 to the fourth piezoelectric element P4, which have been respectively sucked by the suction nozzles 28 of the four suction heads 20, are photographed from below.

[0109] The control device 16 acquires the image captured by the camera 14. The control device 16 detects the suction head 20 and the first to fourth piezoelectric elements P1 to P4 adsorbed by the suction nozzle 28 from the acquired image. The control device 16 calculates P1 (x01, y01, θ01), P2 (x02, y02, θ02), P3 (x03, y03, θ03), and P4 (x04, y04, θ04), which are coordinate values ​​indicating the center positions in the X and Y directions and the longitudinal directions of the detected first to fourth piezoelectric elements P1 to P4, from the detected suction head 20 and the first to fourth piezoelectric elements P1 to P4 adsorbed by the suction nozzle 28, and the transport position of the suction head 20 in the suction head moving device 12 when the image was captured.

[0110] The control device 16 calculates coordinate values ​​P1(x11, y11, θ11), P2(x12, y12, θ12), P3(x13, y13, θ13), and P4(x14, y14, θ14) of the first holding member H1 to the fourth holding member H4 at the holding member supply position Sh, based on coordinate values ​​H1(x11, y11, θ11), H2(x12, y12, θ12), H3(x13, y13, θ13), and H4(x14, y14, θ14) in the X direction, Y direction, and θ direction at the holding member supply position Sh of the first holding member H1 to the fourth holding member H4, and stores this as information Ip regarding the position of the piezoelectric element P.

[0111] The control device 16 calculates Ap1 (x11, y11, z11, θ11), which is the amount of movement of the suction nozzle 28 in the X, Y, θ, and Z directions required to match P1 (x11, y11, θ11), which is the coordinate value of the first piezoelectric element P1 at the holding member supply position Sh, with H1 (x11, y11, θ11), which is the coordinate value of the corresponding first holding member H1 at the holding member supply position Sh. In the same manner, the control device 16 calculates Ap2(x11, y11, z11, θ11), Ap3(x13, y13, z13, θ13), and Ap4(x14, y14, z14, θ14), which are the adjustment amounts in the X direction, Y direction, and θ direction and the movement amount in the Z direction of the suction nozzle 28 required to match P2(x12, y12, θ12), P3(x13, y13, θ13), and P4(x14, y14, θ14), which are the coordinate values ​​of the second piezoelectric element P2 to the fourth piezoelectric element P4 at the holding member supply position Sh, with H2(x12, y12, θ12), H3(x13, y13, θ13), and H4(x14, y14, θ14), which are the corresponding coordinate values ​​of the second holding member H2 to the fourth holding member H4 at the holding member supply position Sh.

[0112] 8, the control device 16 controls the suction head horizontal movement mechanism 21 and the suction head rotation movement mechanism 26 of each suction head 20 to adjust the horizontal position and inclination of the suction nozzle 28 independently for each suction head 20 based on the calculated adjustment amounts in the X direction, Y direction, and θ direction and the movement amount in the Z direction of the four suction nozzles 28, Ap1 (x11, y11, z11, θ11), Ap2 (x11, y11, z11, θ11), Ap3 (x13, y13, z13, θ13), and Ap4 (x14, y14, z14, θ14). Furthermore, the control device 16 controls the suction head vertical movement mechanism 24 of each suction head 20 to arrange the first piezoelectric element P1 to the fourth piezoelectric element P4 within the first holding member H1 to the fourth holding member H4 based on the calculated movement amount in the Z direction. In other words, the control device 16 controls at least one of the horizontal movement mechanism 21 for the suction head, the vertical movement mechanism 24 for the suction head or the rotational movement mechanism 26 for the suction head of each suction head 20 in order to adjust the position of the suction nozzle 28 based on the information Ip regarding the position of the piezoelectric element P and the information Ih regarding the position of the holding member H.

[0113] <Adjustment of the bonding material supply position> Next, adjustment of the position of the discharge nozzle 36a in the supply head 30 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention will be described.

[0114] The control device 16 controls the supply head moving device 13 to transport the four supply heads 30 to the holding member supply position Sh. The control device 16 calculates the coordinate values ​​J1 (x11, y11), J2 (x12, y12), J3 (x13, y13), and J4 (x14, y14) of the four discharge nozzles 36a at the holding member supply position Sh based on information about the position of the supply heads 30 and the coordinate values ​​H1 (x11, y11, z11, θ11), H2 (x12, y12, z12, θ12), H3 (x13, y13, z13, θ13), and H4 (x14, y14, z14, θ14) of the first holding member H1 to the fourth holding member H4 at the holding member supply position Sh, and stores the calculated values ​​as information about the position of the bonding material.

[0115] The control device 16 calculates Aj1(x11, y11, z11), which is the adjustment amount in the X direction, Y direction, and θ direction and the movement amount in the Z direction of the discharge nozzle 36a required to match J1(x11, y11) which is the coordinate value at the holding member supply position Sh of one of the four supply devices 36, with H1(x11, y11, z11, θ11) which is the coordinate value at the holding member supply position Sh of the corresponding first holding member H1. Similarly, the control device 16 calculates Aj2(x12, y12, z12), Aj3(x13, y13, z13), and Aj4(x14, y14, z14), which are the adjustment amounts in the X direction and Y direction and the movement amount in the Z direction of the discharge nozzle 36a required to match the coordinate values ​​J2(x12, y12), J3(x13, y13), and J4(x14, y14) of the other three discharge nozzles 36a at the holding member supply position Sh with the coordinate values ​​H2(x12, y12, z12, θ12), H3(x13, y13, z13, θ13), and H4(x14, y14, z14, θ14) of the corresponding second holding member H2 to fourth holding member H4 at the holding member supply position Sh.

[0116] The control device 16 controls the horizontal movement mechanism 31 for each supply head 30 to adjust the horizontal position of the discharge nozzle 36a independently and individually for each supply head 30 based on the calculated adjustment amounts in the X direction, Y direction, and θ direction and movement amounts in the Z direction of the four suction nozzles 28, Aj1 (x11, y11, z11), Aj2 (x12, y12, z12), Aj3 (x13, y13, z13), and Aj4 (x14, y14, z14). Furthermore, based on Aj1 (x11, y11, z11), Aj2 (x12, y12, z12), Aj3 (x13, y13, z13), and Aj4 (x14, y14, z14), the control device 16 controls the supply head vertical movement mechanism 34 of each supply head 30 to vertically move the discharge nozzle 36a for each supply head 30 to place the bonding material in the recess of the holding member H. That is, based on the information Ip on the position of the piezoelectric element P and the information Ih on the position of the holding member H, the control device 16 controls at least one of the supply head horizontal movement mechanism 31 or the supply head vertical movement mechanism 34 of each supply head 30 to adjust the position of the supply device 36.

[0117] Next, the piezoelectric element mounting step S100 included in the manufacturing method of the piezoelectric vibration device by the piezoelectric vibration device manufacturing apparatus 1 will be described with reference to Figs. 9 to 12. Fig. 9 is a flow diagram of the piezoelectric element mounting step S100 included in the manufacturing method of the piezoelectric vibration device. Fig. 10 is a plan view showing the operation state of the piezoelectric vibration device manufacturing apparatus 1 in the holding member position information acquisition step S110, the piezoelectric element supply step S120, the holding member supply step S125, the piezoelectric element positioning step S130, and the holding member positioning step S135 in the piezoelectric element mounting step S100. Fig. 11 is a plan view showing the operation state of the piezoelectric vibration device manufacturing apparatus 1 in the bonding material supply position adjustment step S140 and the bonding material supply step S150 in the piezoelectric element mounting step S100. Fig. 12 is a plan view showing the operation state of the piezoelectric vibration device manufacturing apparatus 1 in the piezoelectric element transport step S160, the piezoelectric element position information acquisition step S170, the piezoelectric element position adjustment step S180, and the piezoelectric element bonding step S190 in the piezoelectric element mounting step S100.

[0118] As shown in FIG. 9, the piezoelectric element mounting process S100 includes a holding member position information acquisition process S110, a piezoelectric element supplying process S120, a holding member supplying process S125, a piezoelectric element positioning process S130, a holding member positioning process S135, a bonding material supply position adjusting process S140, a bonding material supplying process S150, a piezoelectric element transporting process S160, a piezoelectric element position information acquisition process S170, a piezoelectric element position adjusting process S180, and a piezoelectric element bonding process S190.

[0119] In an initial state of the piezoelectric vibration device manufacturing apparatus 1, a tray T containing a plurality of piezoelectric elements P is supplied to the tray mounting section 10a of the piezoelectric element supplying apparatus 10 from an external supply line (not shown). Also, a plurality of sheet-shaped holding members H are supplied to the holding member mounting section 11a of the holding member supplying apparatus 11 from an external supply line (not shown) (see FIG. 1).

[0120] The holding member position information acquisition process S110 is a process for acquiring information Ih relating to the positions of the multiple holding members H. In the holding member position information acquisition process S110, the laser measurement device 15 measures the shapes of the multiple holding members H while moving the multiple holding members H by the holding member supply device 11. The laser measurement device 15 transmits the measurement value to the control device 16. After the holding member position information acquisition process S110 is completed, the piezoelectric element mounting process S100 proceeds to a piezoelectric element supply process S120.

[0121] 10, the piezoelectric element supplying step S120 is a step of supplying a piezoelectric element P to be mounted on a holding member H, among the plurality of piezoelectric elements P accommodated in a tray T, to a piezoelectric element supplying position Sp. In the piezoelectric element supplying step S120, the piezoelectric element supplying device 10 transports a target piezoelectric element P, among the plurality of piezoelectric elements P accommodated in a tray T on the tray mounting section 10a, from a piezoelectric element waiting position Wp to a transport reference position of the piezoelectric element supplying position Sp, by the tray mounting section 10a. After the piezoelectric element supplying step S120 is completed, the piezoelectric element mounting step S100 transitions to a holding member supplying step S125.

[0122] The holding member supplying step S125 is a step of supplying a holding member H on which a piezoelectric element P is to be placed, out of the plurality of holding members H, to a holding member supplying position Sh. In the holding member supplying step S125, the holding member supplying device 11 transports a target holding member H, out of the plurality of holding members H on the holding member mounting section 11a, from the holding member standby position Wh to the transport reference position of the holding member supplying position Sh by the holding member mounting section 11a. After the holding member supplying step S125 is completed, the piezoelectric element mounting step S100 transitions to a piezoelectric element positioning step S130.

[0123] The piezoelectric element positioning step S130 is a step of positioning a piezoelectric element P to be bonded to a holding member H among the plurality of piezoelectric elements P transported to the transport reference position of the piezoelectric element supply position Sp. The piezoelectric element supplying device 10 positions the target piezoelectric element P among the plurality of piezoelectric elements P accommodated in a tray T at the transport reference position of the piezoelectric element supply position Sp at the piezoelectric element supply position Sp by the tray placement unit 10a. After the piezoelectric element positioning step S130 is completed, the piezoelectric element mounting step S100 transitions to a holding member positioning step S135.

[0124] The holding member positioning step S135 is a step of positioning a holding member H to which a piezoelectric element P is to be bonded, among the multiple holding members H transported to the transport reference position of the holding member supply position Sh. The holding member supply device 11 positions the target holding member H, among the multiple holding members H at the transport reference position of the holding member supply position Sh, at the holding member supply position Sh by the holding member placement unit 11a. After the holding member positioning step S135 is completed, the piezoelectric element mounting step S100 transitions to a bonding material supply position adjustment step S140.

[0125] 11, the bonding material supply position adjustment step S140 is a step of adjusting the position of the supply device 36 that supplies the bonding material. In the bonding material supply position adjustment step S140, the supply head moving device 13 transports the supply head 30 from the standby position W to the holding member supply position Sh. The supply head horizontal movement mechanism 31 of each supply head 30 adjusts the horizontal position of the discharge nozzle 36a for each supply head 30 independently and individually based on the adjustment amount of the discharge nozzle 36a of each supply device 36 in the X direction and the Y direction calculated by the control device 16. After the bonding material supply position adjustment step S140 is completed, the piezoelectric element mounting step S100 transitions to a bonding material supply step S150.

[0126] The bonding material supplying step S150 is a step of supplying the bonding material into the recess of the holding member H. In the bonding material supplying step S150, the vertical movement mechanism 34 for each supply head 30 moves the supply device 36 vertically downward for each supply head 30 independently and individually based on the movement amount in the Z direction of the discharge nozzle 36a of each supply device 36 calculated by the control device 16. The supply device 36 supplies the bonding material into the recess of the holding member H. The vertical movement mechanism 34 for each supply head 30 moves the supply device 36 vertically upward when the supply of the bonding material is completed. The supply head moving device 13 transports the supply head 30 from the holding member supply position Sh to the standby position W. After the bonding material supplying step S150 is completed, the piezoelectric element mounting step S100 transitions to the piezoelectric element transporting step S160.

[0127] As shown in FIG. 12, in the piezoelectric element transport step S160, the piezoelectric element P to be placed on the holding member H is supply position Sp to the holding member supply position Sh. In the piezoelectric element transport step S160, the suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 vertically downward at the piezoelectric element supply position Sp. Each suction head 20 sucks up a piezoelectric element P from the tray T with the suction nozzle 28. The suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 vertically upward at the piezoelectric element supply position Sp. The suction head moving device 12 transports the suction head 20 to the holding member supply position Sh. After the piezoelectric element transport step S160 is completed, the piezoelectric element mounting step S100 proceeds to the piezoelectric element position information acquisition step S170.

[0128] The piezoelectric element position information acquisition step S170 is a step of acquiring information Ip relating to the position of the adsorbed piezoelectric element P. In the piezoelectric element position information acquisition step S170, the camera 14 captures an image of the suction head 20 being transported by the suction head moving device 12 and the piezoelectric element P adsorbed to the suction nozzle 28. The camera 14 transmits the captured image to the control device 16. After the piezoelectric element position information acquisition step S170 is completed, the piezoelectric element mounting step S100 proceeds to a piezoelectric element position adjustment step S180.

[0129] The piezoelectric element position adjustment step S180 is a step of adjusting the position of the suction nozzle 28. In the piezoelectric element position adjustment step S180, the suction head horizontal movement mechanism 21 and the suction head rotational movement mechanism 26 of each suction head 20 adjust the horizontal position and orientation of the suction nozzle 28 independently and individually for each suction head 20, based on the adjustment amounts of each suction nozzle 28 in the X-direction, Y-direction, and θ-direction calculated by the control device 16 (see FIGS. 7 and 8). After the piezoelectric element position adjustment step S180 is completed, the piezoelectric element mounting step S100 transitions to a piezoelectric element bonding step S190.

[0130] The piezoelectric element bonding step S190 is a step of placing the piezoelectric element P in the recess of the holding member H to which the bonding material has been supplied, and bonding the piezoelectric element P to the holding member H. In the piezoelectric element bonding step S190, the suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 vertically downward for each suction head 20 independently and individually based on the Z-directional movement amount of each suction nozzle 28 calculated by the control device 16. As a result, the piezoelectric element P is bonded to the holding member H via the bonding material. Each suction head 20 releases the piezoelectric element P from the suction nozzle 28. The suction head vertical movement mechanism 24 of each suction head 20 moves the supply device 36 vertically upward. The suction head moving device 12 transports the suction head 20 to the piezoelectric element supply position Sp. After the piezoelectric element bonding step S190 is completed, the piezoelectric element mounting step S100 transitions to the piezoelectric element positioning step S130.

[0131] Furthermore, in the piezoelectric element bonding process S190, when the piezoelectric elements P have been bonded to all of the holding members H, the multiple holding members H to which the piezoelectric elements P are respectively bonded are transported from the holding member supply position Sh to the holding member standby position Wh. Furthermore, the multiple transported holding members H have information Ih regarding the positions of the multiple holding members H obtained by the laser measurement device 15 in order to check the mounting state of the piezoelectric elements P.

[0132] In the piezoelectric vibration device manufacturing apparatus 1 configured in this manner, a plurality of piezoelectric elements P are supplied in a state where they are arranged in a matrix while maintaining the relative distance between them. Similarly, a plurality of holding members H are supplied in a state where they are arranged in a matrix while maintaining the relative distance between them. This allows the piezoelectric vibration device manufacturing apparatus 1 to simultaneously obtain information Ip relating to the positions of the plurality of piezoelectric elements P adsorbed to the suction head 20 and information Ih relating to the positions of the holding members H.

[0133] Furthermore, the piezoelectric vibration device manufacturing apparatus 1 adjusts the positions of the multiple suction nozzles 28 in the X direction, Y direction, and θ direction independently and individually by the suction head horizontal movement mechanism 21 and the suction head rotation movement mechanism 26 based on the information on the position of each of the multiple piezoelectric elements P sucked by the suction head 20 and the information Ih on the position of the holding member H. This allows the multiple suction heads 20 to individually adjust the positions of the multiple piezoelectric elements P sucked by each of them according to the position of the holding member H. This allows the suction heads 20 to place the piezoelectric elements P in the recesses of the holding member H while taking into account the variation in the shape of the holding member H. Moreover, the multiple suction heads 20 can individually adjust the positions of the suction nozzles 28 based on the information Ip on the position of the piezoelectric elements P, which is numerical data, and the information Ih on the position of the holding member H, so there is no need to perform temporary placement for alignment or the like.

[0134] In addition, the multiple supply heads 30 adjust the positions at which the bonding material is supplied to match the positions of the holding members H by the horizontal movement mechanism 31 for the supply heads and the vertical movement mechanism 34 for the supply heads. Moreover, the multiple supply heads 30 can adjust the positions of the supply devices 36 individually by acquiring information Ih on the positions of the holding members H, which is numerical data, so there is no need to align the positions of the holding members H. In addition, the laser measurement device 15 measures not only the horizontal positions of the multiple holding members H supplied to the holding member supply position Sh, but also the vertical positions of the multiple holding members H. Therefore, the vertical positions of the piezoelectric elements P arranged on each of the multiple holding members H can be adjusted independently and individually according to the vertical positions of the holding members H. Therefore, the multiple piezoelectric elements P can be arranged in the recesses of the multiple holding members H at the predetermined positions and in the predetermined orientations with high accuracy without increasing the tact time.

[0135] The manufacturing method of the piezoelectric vibration device also includes a piezoelectric element position adjustment step S180 in which the positions of the multiple piezoelectric elements P are adjusted independently and individually based on information Ih on the position of the holding member H and information Ip on the position of the piezoelectric element P acquired during transportation in the piezoelectric element transport step S160. The camera 14 simultaneously photographs the piezoelectric element P adsorbed by the suction nozzle 28 of the suction head 20 and the suction nozzle 28. Therefore, the information Ip on the position of the piezoelectric element P takes into account the deviation of the piezoelectric element P relative to the multiple suction nozzles 28. Therefore, there is no need to provide a separate step of positioning the piezoelectric element P relative to the suction nozzle 28 by temporarily placing the piezoelectric element P after the piezoelectric element transport step S160. Furthermore, the bonding material supply position adjustment step S140 individually adjusts the supply position of the bonding material based on information Ih on the position of the holding member H, which is numerical data. Therefore, the manufacturing method of the piezoelectric vibration device does not require individual alignment for each holding member H. Therefore, the multiple piezoelectric elements P can be arranged in the recesses of the multiple holding members H at predetermined positions and in predetermined orientations without increasing the takt time.

[0136] [Embodiment 2] <Combination of piezoelectric vibration device manufacturing equipment> Next, a portion of a piezoelectric vibration device manufacturing line 100 according to a second embodiment of the present invention, which includes a piezoelectric vibration device manufacturing apparatus 1, will be described with reference to Figs. 13 and 14. Fig. 13 is a plan view showing the configuration of the piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing apparatus 1. Fig. 14 is a block diagram showing the control configuration of the piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing apparatus 1. A portion of the piezoelectric vibration device manufacturing line 100 in this embodiment is a mounting section 110 that mounts a piezoelectric element P on a holding member H.

[0137] 13, the mounting section 110 has a tray T housing a plurality of piezoelectric elements P, a transport device for transporting a plurality of holding members H arranged in a sheet-like shape, and a plurality of piezoelectric vibration device manufacturing apparatuses 1. In this embodiment, the mounting section 110 is composed of a robot moving apparatus 111 which is a transport device, a supply table 112, a transport robot 113, and four piezoelectric vibration device manufacturing apparatuses 1. The mounting section 110 is controlled by a line control device 120 (see FIG. 14) of the piezoelectric vibration device manufacturing line 100.

[0138] The robot moving device 111 and the transport robot 113 transport the tray T containing multiple piezoelectric elements P to the piezoelectric element supplying devices 10 of the four piezoelectric vibration device manufacturing apparatuses 1, respectively. The robot moving device 111 and the transport robot 113 also transport multiple holding members H arranged in a sheet shape to the holding member supplying devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1, respectively. Furthermore, the robot moving device 111 and the transport robot 113 collect the sheet-shaped holding members H to which the piezoelectric elements P are bonded from the holding member supplying devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1.

[0139] The robot moving device 111 is a device that moves the transport robot 113. The robot transport device is, for example, a one-axis linear motion unit having a servo motor as an actuator and a ball screw unit as a linear motion mechanism. The transport robot 113 is loaded on a movable part of the robot moving device 111. The robot moving device 111 is installed such that the direction in which the transport robot 113 is moved is the Y direction when viewed in the Z direction. Therefore, the robot moving device 111 is configured to be able to move the transport robot 113 to any position in the Y direction.

[0140] The supply table 112 is a table on which trays T, each housing a plurality of piezoelectric elements P, and sheet-like holding members H are stored. The trays T, each housing the piezoelectric elements P, and the sheet-like holding members H are supplied to the supply table 112 by a supply device in an upstream process (not shown) or by an operator. The supply table 112 is disposed at an end of the robot movement device 111.

[0141] The transport robot 113 supplies a tray T containing a piezoelectric element P to the piezoelectric element supplying device 10 of the piezoelectric vibration device manufacturing apparatus 1. The transport robot 113 also supplies a sheet-shaped holding member H to the holding member supplying device 11 of the piezoelectric vibration device manufacturing apparatus 1. The transport robot 113 is, for example, a two-arm horizontal articulated robot (SCARA robot) having two arms. The transport robot 113 is mounted on a movable part of the robot moving device 111. Therefore, the transport robot 113 is configured to be movable to any position in the Y direction by the robot moving device 111 when viewed in the Z direction. The transport robot 113 is also configured to be able to move the tray T and the sheet-shaped holding member H to one side (X+ direction side) in the X direction perpendicular to the Y direction (movement direction by the robot moving device 111) and the other side (X- direction side) in the X direction by each arm when viewed in the vertical direction.

[0142] Each of the four piezoelectric vibration device manufacturing apparatuses 1 independently bonds the piezoelectric element P to the holding member H. Two of the four piezoelectric vibration device manufacturing apparatuses 1 are arranged on one side of the robot moving device 111 when viewed in the vertical direction. The two piezoelectric vibration device manufacturing apparatuses 1 are arranged side by side in the Y direction. In this case, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the moving direction (Y direction) of the suction head moving device 12 is parallel to the moving direction of the robot moving device 111. Furthermore, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the piezoelectric element waiting position Wp of the piezoelectric element supplying device 10 and the holding member waiting position Wh of the holding member supplying device 11 are located on the robot moving device 111 side and within the movable range of the transport robot 113.

[0143] The other two of the four piezoelectric vibration device manufacturing apparatuses 1 are arranged on the other side of the robot moving device 111 when viewed in the vertical direction. The two piezoelectric vibration device manufacturing apparatuses 1 are also arranged side by side in the Y direction. In this case, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the movement direction (Y direction) of the suction head moving device 12 is parallel to the movement direction of the robot moving device 111. Furthermore, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the piezoelectric element standby position Wp of the piezoelectric element supplying device 10 and the holding member standby position Wh of the holding member supplying device 11 are located on the robot moving device 111 side and within the movable range of the transport robot 113.

[0144] The mounting unit 110 configured in this manner can supply the trays T stored on the supply table 112 to the piezoelectric element waiting positions Wp of the piezoelectric element supply devices 10 of the four piezoelectric vibration device manufacturing apparatuses 1 by the transport robot 113. The mounting unit 110 can also supply the sheet-shaped holding members H stored on the supply table 112 to the holding member waiting positions Wh of the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 by the transport robot 113. Furthermore, the mounting unit 110 can collect the sheet-shaped holding members H, each of which contains a piezoelectric element P, from the holding member waiting positions Wh of the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 by the transport robot 113. The mounting unit 110 is configured to supply the sheet-shaped holding members H collected by the transport robot 113 to a bonding agent curing furnace (not shown) downstream.

[0145] 13 and 14, at least one of the four piezoelectric vibration device manufacturing apparatuses 1 on the mounting section 110 starts manufacturing piezoelectric vibration devices when a control signal for starting production is input from the line control device 120 of the piezoelectric vibration device manufacturing line 100. The line control device 120 determines the number of piezoelectric vibration device manufacturing apparatuses 1 to be operated based on the production volume of piezoelectric element devices.

[0146] When the piezoelectric vibration device manufacturing apparatus 1 is in operation, for example, when it needs to supply a piezoelectric element P, it outputs a supply signal for the piezoelectric element P to the line control device 120. When the line control device 120 acquires the supply signal for the piezoelectric element P, it outputs a control signal to the transport device to supply the piezoelectric element P. The robot moving device 111 and the transport robot 113 supply the tray T containing a plurality of piezoelectric elements P from the supply table 112 to a piezoelectric element waiting position Wp in the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing apparatus 1.

[0147] When the piezoelectric vibration device manufacturing apparatus 1 is in operation, for example, it needs to eject the tray T containing the piezoelectric elements P, and outputs an ejection signal for the tray T containing the piezoelectric elements P to the line control device 120. When the line control device 120 acquires the ejection signal for the tray T containing the piezoelectric elements P, it outputs a control signal to the robot moving device 111 and the transport robot 113 to eject the tray T containing the piezoelectric elements P. The robot moving device 111 and the transport robot 113 retrieve the tray T containing the piezoelectric elements P from the holding member standby position Wh in the holding member supply device 11 of the piezoelectric vibration device manufacturing apparatus 1, and supply it to a bonding agent curing furnace (not shown).

[0148] In this way, by combining a plurality of piezoelectric vibration device manufacturing apparatuses 1, the piezoelectric vibration device manufacturing line 100 can flexibly respond to the production volume of piezoelectric vibration devices.

[0149] [Other embodiments] In the above embodiment, the piezoelectric vibration device manufacturing apparatus 1 has four suction heads 20 and four supply heads 30. However, it is sufficient for the piezoelectric vibration device manufacturing apparatus 1 to have a plurality of suction heads 20 and a plurality of supply heads 30.

[0150] Furthermore, in the above-described embodiment, the multiple supply heads 30 may be configured to be capable of simultaneously adjusting the positions of the respective supply devices 36. Furthermore, the multiple suction heads 20 may be configured to be capable of simultaneously adjusting the positions of the respective suction nozzles 28. This reduces the time required to adjust the positions of the multiple suction heads 20 and the multiple supply heads 30, regardless of the number of suction heads 20 and supply heads 30.

[0151] In the above embodiment, the piezoelectric vibration device manufacturing apparatus 1 measures the position of the piezoelectric element P relative to the suction head 20 from an image captured by the camera 14 as a piezoelectric element position measuring device. However, the piezoelectric element position measuring device may be any device that can measure the position of the piezoelectric element adsorbed to the suction nozzle. The piezoelectric element position measuring device may be, for example, a laser measuring device.

[0152] In the above embodiment, the camera 14 is disposed on the stand 2. However, the camera may be mounted on the suction head.

[0153] In the above embodiment, the piezoelectric vibration device manufacturing apparatus 1 calculates the positions of the multiple holding members H from the measurement values ​​measured by the laser measurement device 15 as a holding member position measuring device. However, the holding member position measuring device may be any device that can measure the shapes of the multiple holding members. The holding member position measuring device may be a camera, etc.

[0154] In the above-described embodiment, the suction head moving device 12 is composed of a one-axis linear motion unit. However, the suction head moving device may be any device capable of moving the suction head from the piezoelectric element supply position to the holding member supply position. The suction head moving device may be, for example, a horizontal articulated robot or a vertical articulated robot. The same applies to the piezoelectric element supply device and the holding member supply device.

[0155] In the above embodiment, the piezoelectric vibration device manufacturing apparatus 1 supplies multiple holding members H to the holding member supply position Sh by one holding member supply device 11. However, the piezoelectric vibration device manufacturing apparatus may have multiple holding member supply devices. By having multiple holding member supply devices, the piezoelectric vibration device manufacturing apparatus can place piezoelectric elements on multiple holding members supplied by one holding member supply device while discharging multiple holding members on which piezoelectric elements have been placed by the other holding member supply device.

[0156] In the above embodiment, the tray T has the recess C for storing the piezoelectric element P. However, it is sufficient if the tray T can supply a plurality of piezoelectric elements arranged in a matrix.

[0157] In the above embodiment, the multiple holding members H supplied to the piezoelectric vibration device manufacturing apparatus 1 are connected in a sheet shape. However, it is sufficient that the multiple holding members can be supplied in a matrix-like arrangement. The multiple holding members may be housed in a tray in which multiple recesses are arranged in a matrix shape, for example.

[0158] In the above-described embodiment, the piezoelectric element supplying device 10, the holding member supplying device 11, the suction head moving device 12, the supply head moving device 13, the suction head horizontal moving mechanism 21, the suction head vertical moving mechanism 24, and the suction head rotational moving mechanism 26 of the suction head 20, and the supply head horizontal moving mechanism 31 and the supply head vertical moving mechanism 34 of the supply head 30 are one-axis linear motion units using a servo motor as an actuator, but are not limited thereto. The piezoelectric element supplying device 10, the holding member supplying device 11, the suction head moving device 12, the supply head moving device 13, the moving mechanism of the suction head 20, and the moving mechanism of the supply head 30 may be configured to control the amount of movement of a linear motor or the like.

[0159] In the above embodiment, the laser measurement device 15 is configured to be rotatable and movable in the horizontal direction so as to match the horizontal position and rotation degree of each holding member H. However, when the holding members are arranged with high accuracy relative to the holding member supply device, the laser measurement device may be configured to be movable only in the Y direction. In this case, the holding members are moved in the X direction by the holding member supply device. Thus, the laser measurement device can measure the shape of the sheet-like holding member. By configuring the laser measurement device to be movable only in the Y direction, rattling, positional deviation, etc. of the movable parts are suppressed, so that measurements can be made with higher accuracy. Alternatively, the laser measurement device may be fixed, and only the holding members may be moved in the X and Y directions by the holding member supply device.

[0160] In the above-described embodiment, the holding member H is a housing having a recess in which the piezoelectric element P can be placed. The holding member H has the piezoelectric element P placed in the recess. However, the holding member may be a flat plate-like member that does not have a recess in which the piezoelectric element can be placed. The holding member has the piezoelectric element placed on the flat surface of the flat plate-like member. In this case, the holding member is covered with a lid member (deep-drawn cap structure) having a recess.

[0161] In the second embodiment, the mounting section 110 has four piezoelectric vibration device manufacturing apparatuses 1. However, the mounting section may have one or more and three or less piezoelectric vibration device manufacturing apparatuses. The mounting section may also have five or more piezoelectric vibration device manufacturing apparatuses.

[0162] Although the embodiment of the present invention has been described above, the above-mentioned embodiment is merely an example for carrying out the present invention. Therefore, the present invention is not limited to the above-mentioned embodiment, and it is possible to carry out the above-mentioned embodiment by appropriately modifying it within the scope of the gist of the present invention. [Explanation of symbols]

[0163] 1. Piezoelectric vibration device manufacturing equipment 2 Mounting stand 10 Piezoelectric element supply device 10a Tray placement section 11 Holding member supply device 11a Holding member placement portion 12 Suction head moving device 12a Suction head mounting section 13 Supply head moving device 13a Supply head mounting section 14 Camera 15 Laser measurement equipment 16 Control device 20 Suction head 21 Horizontal movement mechanism for suction head 22 First moving member for suction head 23 Second moving member for suction head 24 Vertical movement mechanism for suction head 25 Third moving member for suction head 26 Rotational movement mechanism for suction head 27 Fourth moving member for suction head 28 Suction nozzle 30 Supply Head 31 Horizontal movement mechanism for supply head 32 First moving member for supply head 33 Second moving member for supply head 34 Vertical movement mechanism for supply head 35 Third moving member for supply head 36 Feeding device 36a Discharge nozzle 36b Cooling device 36c Contact Sensor 100 Piezoelectric vibration device manufacturing line 110 Mounting section 111 Robot Movement Device 112 Supply stand 113 Transport Robot 120 Line control device P Piezoelectric element P1 First piezoelectric element P2 Second piezoelectric element P3 3rd piezoelectric element P4 4th piezoelectric element H Holding member H1 First holding member H2 Second holding member H3 3rd holding member H4 Fourth retaining member Ip Information about the position of the piezoelectric element Ih Information on the location of the retaining member C recess

Claims

1. A piezoelectric element; A holding member for holding the piezoelectric element, A piezoelectric vibration device manufacturing apparatus for manufacturing a piezoelectric vibration device in which the piezoelectric element is bonded to the holding member by a bonding material, comprising: a plurality of suction heads each configured to suction one of the piezoelectric elements; a suction head moving device that has the plurality of suction heads mounted thereon and that simultaneously moves the plurality of suction heads back and forth between a piezoelectric element supply position where the plurality of piezoelectric elements are supplied to a holding member supply position where the plurality of holding members are supplied, The plurality of suction heads include a suction nozzle for suctioning the piezoelectric element; a suction head horizontal movement mechanism for moving the suction nozzle in a horizontal direction; a suction head vertical movement mechanism that moves the suction nozzle in a vertical direction; a suction head rotation movement mechanism that moves the suction nozzle in a rotation direction around a vertical axis; Each of the the piezoelectric elements supplied to the piezoelectric element supply position are respectively sucked by the plurality of suction nozzles at the piezoelectric element supply position, and the suction head moving device is moved from the piezoelectric element supply position to the holding member supply position; The suction head horizontal movement mechanism, the suction head vertical movement mechanism, and the suction head rotation movement mechanism are adjusting positions of the suction nozzles independently and individually based on information regarding the positions of the plurality of piezoelectric elements respectively picked up by the plurality of suction nozzles and information regarding the positions of the plurality of holding members supplied to the holding member supply position so that the piezoelectric elements respectively picked up by the plurality of suction nozzles can be arranged on the corresponding holding members; Piezoelectric vibration device manufacturing equipment.

2. 2. The piezoelectric vibration device manufacturing apparatus according to claim 1, a plurality of supply heads each supplying the bonding material to the holding member; a supply head moving device that carries the plurality of supply heads and simultaneously moves the plurality of supply heads back and forth between a standby position of the plurality of supply heads and the holding member supply position, The plurality of delivery heads include: A supply device for supplying the bonding material; a supply head horizontal movement mechanism for moving the supply device in a horizontal direction; and a supply head vertical movement mechanism for moving the supply device in a vertical direction, the supply head moving device moves the supply head from the standby position to the holding member supply position, At least one of the horizontal movement mechanism for the supply head and the vertical movement mechanism for the supply head is adjusting positions of the supply devices independently and individually based on information regarding positions of the plurality of holding members supplied to the holding member supply position so that the plurality of supply devices can supply the bonding material to the plurality of holding members, respectively; Piezoelectric vibration device manufacturing equipment.

3. 3. The piezoelectric vibration device manufacturing apparatus according to claim 2, The plurality of delivery heads include: At the holding member supply position, the bonding material is supplied to the holding members by the plurality of supply devices, respectively and independently; The plurality of suction heads include the piezoelectric elements respectively held by the plurality of suction nozzles are independently and individually disposed on the plurality of holding members to which the bonding material is supplied at the holding member supply position; Piezoelectric vibration device manufacturing equipment.

4. 4. The piezoelectric vibration device manufacturing apparatus according to claim 2, The plurality of delivery heads include: The positions of the respective supply devices can be simultaneously adjusted by at least one of the horizontal movement mechanism for the supply head or the vertical movement mechanism for the supply head. Piezoelectric vibration device manufacturing equipment.

5. 2. The piezoelectric vibration device manufacturing apparatus according to claim 1, The plurality of suction heads include the positions of the suction nozzles can be simultaneously adjusted by the suction head horizontal movement mechanism, the suction head vertical movement mechanism, and the suction head rotation movement mechanism. Piezoelectric vibration device manufacturing equipment.

6. 2. The piezoelectric vibration device manufacturing apparatus according to claim 1, a piezoelectric element position measuring device that measures the horizontal positions and orientations of the piezoelectric elements respectively picked up by the plurality of suction heads as information relating to the positions of the piezoelectric elements; a holding member position measuring device that measures horizontal and vertical positions of the plurality of holding members supplied to the holding member supply position as information regarding the positions of the holding members, Piezoelectric vibration device manufacturing equipment.

7. A piezoelectric element; A holding member for holding the piezoelectric element, A method for manufacturing a piezoelectric vibration device, in which the piezoelectric element is bonded to the holding member by a bonding material, comprising: a piezoelectric element supply step of supplying a plurality of the piezoelectric elements to a piezoelectric element supply position; a piezoelectric element positioning step of positioning the plurality of piezoelectric elements at a piezoelectric element supply position; a holding member supplying step of supplying a plurality of the holding members to a holding member supplying position; a holding member positioning step of positioning the plurality of holding members at a holding member supply position; a piezoelectric element transport step of transporting a plurality of the piezoelectric elements positioned at a piezoelectric element supply position from the piezoelectric element supply position to the holding member supply position; and a piezoelectric element position adjustment step of independently and individually adjusting the horizontal, vertical and rotational positions of the plurality of piezoelectric elements in a direction around a vertical axis so that the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position can be simultaneously arranged on the corresponding holding members, based on information regarding the positions of the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position and information regarding the position of the holding member positioned at the holding member supply position. A method for manufacturing a piezoelectric vibration device.

8. 8. The method for manufacturing a piezoelectric vibration device according to claim 7, a bonding material supply position adjustment process of adjusting, at the holding member supply position, a supply position of the bonding material to be supplied to the holding member based on information regarding a position of the holding member supplied to the holding member supply position; having A method for manufacturing a piezoelectric vibration device.

9. 9. The method for manufacturing a piezoelectric vibration device according to claim 8, a bonding material supplying step of supplying the bonding material to each of the plurality of holding members at the holding member supply position; a piezoelectric element bonding process for bonding the piezoelectric elements, which are transported from the piezoelectric element supply position to the holding member supply position, to the holding members to which the bonding material is supplied, at the holding member supply position, respectively. A method for manufacturing a piezoelectric vibration device.

10. 10. The method for manufacturing a piezoelectric vibration device according to claim 8, further comprising: The bonding material supply position adjusting step includes: a step of simultaneously adjusting positions at which the bonding material is supplied to each of the plurality of holding members; A method for manufacturing a piezoelectric vibration device.

11. 8. The method for manufacturing a piezoelectric vibration device according to claim 7, The piezoelectric element position adjustment step includes: a step of simultaneously adjusting the positions of the plurality of piezoelectric elements so that they can be respectively arranged on the holding member; A method for manufacturing a piezoelectric vibration device.

12. 8. The method for manufacturing a piezoelectric vibration device according to claim 7, a piezoelectric element position information acquisition step of acquiring information on horizontal positions and orientations of the piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position; and a holding member position information acquisition step of acquiring information regarding horizontal and vertical positions of the plurality of holding members to be supplied to the holding member supply position. A method for manufacturing a piezoelectric vibration device.

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