Connectors, Functional Boards and Board Level Architecture

Abstract

A connector (6), a functional substrate, and a board-level architecture are provided. The connector (6) includes an end protector (30) and lead frames (20). Each lead frame (20) includes a plurality of connection terminal groups (22) and a shielding layer (21 or 23). Each connection terminal group (22) includes two connection terminals (221 and 222) configured to transmit signals. Each connection terminal (221 or 222) has a first connection end that cooperates with insertion of a circuit board (5). The shielding layer (21 or 23) is configured to electromagnetically isolate the connection terminal groups (22) of adjacent lead frames (20). The end protector (30) includes a conductive structure (32) disposed between the first connection ends of the two connection terminals (221 and 222) of each connection terminal group (22). The conductive structure (32) is electrically connected to the corresponding shield layer (21 or 23) of the connection terminal group (22) and is configured to transmit a loop signal corresponding to the differential signal. In the above technical solution, the conductive structure (32) on the end protector 30 is used to improve the transmission path of the loop signal corresponding to the differential signal transmitted by each connection terminal group (22), thereby reducing crosstalk between the loop signals corresponding to different connection terminal groups (22) and improving the communication effect of the connector.

Description

[Technical field]

[0001] The present application relates to the field of communications technology, and in particular to connectors, functional boards, and board-level architecture. [Background technology]

[0002] In current communication device systems, the combination of a PCB-based backplane and a PCB-based daughterboard interconnect system is the most common interconnect architecture. The various daughterboards are connected to the backplane connectors. Through As the connecting bridge between the backplane and the daughterboard, the connector is a major architecture-level component. is .

[0003] Backplane connectors are usually required to be able to support product evolutionary upgrades throughout their life cycle. Especially for high-speed electrical performance, backplane connectors typically need to support at least two generations of rate upgrades. As the speed is upgraded, the system has more stringent requirements for the high-speed electrical performance of the connector. The most important electrical performance indicators are mainly crosstalk, loss, and reflection. Crosstalk is usually classified into far-end crosstalk and near-end crosstalk. Crosstalk is presented as the injection of noise into the victim network, which directly reduces the signal-to-noise ratio of the signal and reduces the signal transmission quality. for causes deterioration.

[0004] As the speed of current major communication products evolves to 56Gbps and even 112Gbps, crosstalk noise is becoming a major issue for backplane connectors. However, the backplane connectors of the prior art have excessive crosstalk noise and cannot meet the demand. Summary of the Invention

[0005] The present application provides a connector, a functional substrate, and a board level architecture for reducing crosstalk in the connector.

[0006] According to a first aspect, a connector is provided. The connector is used in a board level architecture to connect a backplane and a plug-in board. The connector includes an end protector and a plurality of stacked lead frames. The plurality of lead frames are stacked in a first direction. Each lead frame includes a plurality of connection terminal groups and a shielding layer. Each connection terminal group includes two connection terminals configured to transmit signals. Each connection terminal is configured to be inserted into the circuit board. Collaborate with The end protector has a first connection end. The shielding layer is configured to electromagnetically isolate the connection terminal groups in adjacent lead frames. The end protector has a conductive structure disposed between the first connection ends of the two connection terminals in each connection terminal group. The conductive structure is electrically connected to the corresponding shielding layer of the connection terminal group and configured to transmit a loop signal corresponding to the signal. In the above technical solution, the conductive structure on the end protector improves the transmission path of the loop signal corresponding to the differential signal transmitted by each connection terminal group, reduces the crosstalk between the loop signals corresponding to different connection terminal groups, and improves the communication effect of the connector.

[0007] In a specific possible solution, the end protector further includes a shielding structure configured to electromagnetically isolate two adjacent connection terminal groups of each lead frame, the shielding structure being electrically connected to the corresponding shielding layer of the terminal group. With the shielding structure disposed on the end protector, electromagnetic isolation is realized between different connection terminal groups of the lead frame.

[0008] In a specific feasible solution, the shielding structure includes a first protrusion and a second protrusion, a gap exists between the first protrusion and the second protrusion, and the first protrusion and the second protrusion are separately electrically connected to the corresponding shielding layer. The first protrusion and the second protrusion increase the contact area between the shielding structure and the shielding layer, further improve the electrical connection effect between the shielding structure and the shielding layer, and improve the electromagnetic isolation effect between different connection terminal groups.

[0009] In a specific feasible solution, each shielding layer is provided with a protruding structure used for one-to-one correspondence with a corresponding shielding structure, and the protruding structure is inserted into the gap between the first protrusion and the second protrusion of the corresponding shielding structure and electrically connected to both the first protrusion and the second protrusion. The protruding structure is electrically connected to the first protrusion and the second protrusion, which increases the contact area between the shielding structure and the shielding layer, further improves the electrical connection effect between the shielding structure and the shielding layer, and improves the electromagnetic isolation effect between different connection terminal groups.

[0010] In a specific possible solution, the protruding structures are different shapes, such as triangles or rectangles. The different protruding structures realize electrical connections to the first protrusion and the second protrusion.

[0011] In a specific feasible solution, each shielding layer is provided with a notch corresponding to the first protrusion and the second protrusion of the corresponding shielding structure, and the first protrusion and the second protrusion are inserted into the corresponding notch and electrically connected to the corresponding shielding layer, respectively. The notch is engaged with the first protrusion and the second protrusion, which increases the contact area between the shielding structure and the shielding layer, further improves the electrical connection effect between the shielding structure and the shielding layer, and improves the electromagnetic isolation effect between different connection terminal groups.

[0012] In a specific feasible solution, the height of the shielding structure is greater than the height of the conductive structure, thus improving the electromagnetic isolation effect between different connection terminal groups.

[0013] In a specific feasible solution, a minimum distance between any connection terminal in each connection terminal group and a conductive structure corresponding to the connection terminal group is a first distance, a minimum distance between any connection terminal in each connection terminal group and a shield structure corresponding to the connection terminal group is a second distance, and the first distance is less than the second distance, thus improving the return path of the loop signal.

[0014] In a specific feasible solution, each connection terminal group further includes an insulating layer, the insulating layer encases the multiple connection terminal groups, the first connection end of each connection terminal is exposed outside the insulating layer, the insulating layer has a hollow structure, and each connection terminal group is partially exposed in the hollow structure. By hollowing out the insulating layer, the use of the insulating layer is reduced when ensuring the isolation effect between different connection terminal groups and between different connection terminals, and the dielectric loss caused by the characteristics of the insulating layer is further reduced.

[0015] In a specific feasible solution, one connection terminal in each connection terminal group is located on a first terminal layer, and the other connection terminal in the connection terminal group is located on a second terminal layer, the first terminal layer and the second terminal layer are stacked in a first direction, and the insulating layer includes a first sub-insulating layer and a second sub-insulating layer, the first sub-insulating layer envelops the first terminal layer, and the second sub-insulating layer envelops the second terminal layer. Different sub-insulating layers envelop different connection terminal layers, which makes it easy to manufacture and assemble.

[0016] In a specific possible solution, the first sub-insulation layer and the second sub-insulation layer each have a hollow structure, thus reducing the dielectric loss caused by the properties of the insulating layers.

[0017] In a specific feasible solution, the connector further includes an insulating housing, and each connection terminal has a second connection end configured to mate with the connector at the peer end, and the insulating housing encases the second connection end.

[0018] In specific possible solutions, the conductive structure and the end protector are one-piece structures, or the conductive structure and the end protector are split structures, and the conductive structure is electrically connected to the end protector. In this way, the conductive structure is arranged in different ways.

[0019] According to a second aspect, a functional substrate is provided. The functional substrate includes a circuit board and a connector according to any one of the aforementioned items disposed on the circuit board. A connection end of each connection terminal is electrically connected to a circuit layer of the circuit board. In the aforementioned technical solution, a shielding structure disposed on the end protector realizes electromagnetic isolation between different connection terminal groups in the lead frame. The conductive structure on the end protector improves the transmission path of loop signals corresponding to signals transmitted by each connection terminal group, reduces crosstalk between loop signals corresponding to different connection terminal groups, and improves the communication effect of the connector.

[0020] According to a third aspect, there is provided a board level architecture. The board level architecture includes a backplane and a plug-in board. At least one of the backplane and the plug-in board is the functional board described above. The backplane and the plug-in board include a connector. Through In the above technical solution, electromagnetic isolation is realized between different connection terminal groups on the lead frame by the shielding structure disposed on the end protector, and the conductive structure on the end protector improves the transmission path of the loop signal corresponding to the signal transmitted by each connection terminal group, reduces the crosstalk between the loop signals corresponding to different connection terminal groups, and improves the communication effect of the connector. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a schematic diagram of a structure of a board-level architecture in the prior art.

[0022] [Diagram 2]FIG. 2 is a schematic diagram of an application scenario of a connector according to an embodiment of the present application.

[0023] [Diagram 3] 1 is a schematic diagram of a connector structure according to an embodiment of the present invention;

[0024] [Figure 4] 1 is a schematic diagram of a lead frame structure according to one embodiment of the present invention;

[0025] [Diagram 5] FIG. 2 is a schematic exploded view of a lead frame according to an embodiment of the present application.

[0026] [Figure 6] FIG. 2 is a schematic exploded view of component A according to one embodiment of the present application.

[0027] [Figure 7] FIG. 2 is a schematic diagram of the simulation effect of signal insertion loss of a connector in the prior art and a connector provided in an embodiment of the present application.

[0028] [Figure 8] FIG. 2 is a schematic diagram showing a structure of an end protector according to an embodiment of the present application.

[0029] [Figure 9] FIG. 2 is a schematic exploded view of a lead frame mated to an end protector according to an embodiment of the present application;

[0030] [Figure 10] FIG. 2 is a schematic diagram corresponding to a lead frame mated with an end protector according to an embodiment of the present application.

[0031] [Figure 11] FIG. 1 is a schematic diagram of a signal transmission process in a connector in the prior art.

[0032] [Figure 12] 1 is a schematic diagram of a simulation effect of signal crosstalk in a connector according to an embodiment of the present application and in a connector in the prior art;

[0033] [Figure 13] FIG. 2 is a schematic exploded view of an end protector according to an embodiment of the present application mated to a lead frame;

[0034] [Figure 14] FIG. 2 is a schematic diagram corresponding to the case where an end protector according to an embodiment of the present application is mated with a lead frame. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] To facilitate understanding of the connectors provided in the embodiments of the present application, the following will first explain some terms related to the connectors.

[0036] Shielding layer: The shielding layer is a whole metal sheet, which requires a ground signal and has an electromagnetic shielding effect.

[0037] Interconnect Terminal: An interconnect terminal is a metal lead used to transmit a signal or provide a return path for a signal.

[0038] Crosstalk: Crosstalk is When harmful signals are transferred from one network to another Interference caused by harmful electrical signals Wataru's It is a coupling effect. Crosstalk in this application is the crosstalk between different connection terminal groups.

[0039] Insertion Loss: Insertion loss is the loss of energy during the transmission of a signal from one end of a terminal to the other end of the terminal.

[0040] Lead Frame: The lead frame is the main structure containing the connector's signal terminals, shield conductors, and insulators.

[0041] The following first describes the application scenario of the connector provided in the embodiment of the present application. The connector provided in the embodiment of the present application is used on a function board, such as a backplane and a service board, and is used as a connection device for different function boards in a board-level architecture. See FIG. 1. The connector provided in the embodiment of the present application is used in a board-level architecture. A backplane 1 and a sub-board 2 are connected to the connector Through As shown in Fig. 1, the backplane 1 includes a first connector 4, and the sub-board 2 includes a second connector 3. When the backplane 1 and the sub-board 2 are connected, the first connector 4 and the second connector 3 mate with each other to implement the connection between the backplane 1 and the sub-board 2.

[0042] See Fig. 2. A sub-board is used as an example. Each sub-board includes a circuit board 5 and a connector 6 disposed on the circuit board 5. Both ends of the connector 6 have a first connection port 601 and a second connection port 602, respectively. The first connection port 601 is configured to match with the connector at the peer end. The second connection port 602 is configured to be electrically connected to the circuit board 5. In the signal transmission process, a signal flows into the circuit layer of the circuit board through the connection terminal, and a loop signal flows into the shield layer of the connector through the ground layer of the circuit board, thus forming a signal loop.

[0043] Figure 3 is a schematic diagram of the connector structure. The connector has three main components: Includes The three components are a lead frame 20, an insulating housing 10, and an end protector 30.

[0044] The lead frame 20 is the main structure of the connector. The connector in this embodiment of the present application includes a plurality of lead frames 20. The plurality of lead frames 20 are stacked in a first direction to form the main structure of the connector. The first direction is the direction indicated by the arrow in FIG. 3.

[0045] FIG. 4 is a schematic diagram of the structure of a lead frame 20. The lead frame 20 includes a component A and two shield layers. The first shield layer 21, the component A, and the second shield layer 23 are stacked in a first direction. The first shield layer 21 and the second shield layer 23 are respectively disposed on both sides of a connection terminal group 22. The component A includes a plurality of connection terminal groups and an insulating layer that encases the connection terminal groups. Each connection terminal group includes two connection terminals configured to transmit a signal. For example, the two connection terminals are configured to transmit a differential signal or another type of signal. In this embodiment of the present application, a differential signal is used as an example for explanation.

[0046] Each connection terminal is No. The connector has one connection end and a second connection end, the first connection end configured to be plugged into a circuit board to achieve an electrical connection between the connector and a circuit layer of the circuit board, and the second connection end configured to fit into a slot of the connector at a peer end to achieve an electrical connection between the two connectors.

[0047] The two shield layers are configured to shield the plurality of connection terminal groups. For ease of explanation, the two shield layers are referred to as a first shield layer 21 and a second shield layer 23, respectively. The first shield layer 21 and the second shield layer 23 are disposed on both sides of the plurality of connection terminal groups in a first direction.

[0048] The insulating housing 10 is configured to clamp a plurality of lead frames 20 and facilitates insertion and removal of connectors at the pier ends. Collaborate withWhen the insulating housing 10 is mated with the lead frame 20, it is clamped to the lead frame 20 and encases the second connection ends of the connection terminals. It should be understood that the second connection ends are encased by the insulating housing 10 and exposed for mating with slots of a connector at the pier end.

[0049] 5 is a schematic exploded view of the lead frame. The lead frame has three structures, namely, a connection terminal group 22, a shield layer, and an insulating layer 24.

[0050] There are a plurality of connection terminal groups 22. The plurality of connection terminal groups 22 are arranged in a single row in a second direction. The second direction is perpendicular to the first direction. The second direction refers to the direction in which the connector is inserted into or removed from the connector on the peer side.

[0051] The shielding layer includes a first shielding layer 21 and a second shielding layer 23. The first shielding layer 21 and the second shielding layer 23 are disposed on both sides of the lead frame. A plurality of connection terminal groups 22 are sandwiched between the first shielding layer 21 and the second shielding layer 23. The insulating layer 24 is disposed between the first shielding layer 21 and the second shielding layer 23, and envelops the connection terminal groups 22 to isolate adjacent connection terminal groups 22 and also isolate two connection terminals in each connection terminal group 22. The insulating layer 24 and the connection terminal groups 22 constitute a component A. It should be understood that the connection ends of the connection terminal groups 22 are exposed outside the insulating layer 24 so as to ensure connection to a corresponding device.

[0052] The first shield layer 21 and the second shield layer 23 are made of a common material with high electrical conductivity, such as a metal material with high electrical conductivity, for example, copper or aluminum. In addition, the shape of the first shield layer 21 and the second shield layer 23 is not particularly limited in this embodiment of the present application, as long as it can realize electromagnetic isolation for the lead frame.

[0053] In any solution, when multiple lead frames are placed side-by-side, adjacent lead frames are electromagnetically isolated by a shielding layer, in which case each lead frame includes only one shielding layer, reducing the amount of shielding layers used in the overall connector and reducing the cost of the connector.

[0054] From the above description, it can be seen that the shielding layer provided in this embodiment of the present application only includes the first shielding layer 21 and the second shielding layer 23 located on both sides of the surface with the larger surface area of ​​the two connection terminals. No metal shielding structure is disposed between two adjacent connection terminal groups on the lead frame. Instead, air is used as the insulating dielectric. Therefore, the size of the first connection terminal 221 and the second connection terminal 222 may be further increased to form the first connection terminal 221 and the second connection terminal 222 with the larger surface area.

[0055] FIG. 6 is a schematic exploded view of component A. Two connection terminals included in a connection terminal group are referred to as a first connection terminal 221 and a second connection terminal 222, respectively. The first connection terminal 221 and the second connection terminal 222 are stacked in a first direction. The first direction is the direction in which the multiple lead frames are stacked. During stacking, the two surfaces with larger areas of the first connection terminal 221 and the second connection terminal 222 are arranged opposite each other. The first connection terminals 221 in the multiple connection terminal groups are arranged in the same layer to form a first terminal layer. The second connection terminals 222 in the multiple connection terminal groups are arranged in the same layer to form a second terminal layer.

[0056] The insulating layer 24 includes a first sub-insulating layer 21 and a second sub-insulating layer 242. The first sub-insulating layer 241 encases one layer of the connection terminals, and the second sub-insulating layer 242 encases the other layer of the connection terminals. For example, the first sub-insulating layer 241 encases the first terminal layer, and the second sub-insulating layer 242 encases the second terminal layer. In addition to being used as a structure for separating the first terminal layer and the second terminal layer, the first sub-insulating layer 241 and the second sub-insulating layer 242 may be used as a support structure for the connection terminals in each connection terminal layer. For example, the first sub-insulating layer 241 encases the multiple first connection terminals 221 in the first terminal layer, thereby clamping the multiple first connection terminals 221. Similarly, the second sub-insulating layer 242 also clamps the multiple second connection terminals 222. The connection terminal groups can be formed simply by aligning and clamping the first sub-insulation layer 241 and the second sub-insulation layer 242. In this manner, the first connection terminal 221 and the second connection terminal 222 in each connection terminal group can be aligned such that they are stacked in a first direction.

[0057] In any solution, the insulating layer 24 may alternatively be made by using an integral structure. During manufacturing, the two connection terminal layers may be clamped together first, and then the integral structure of the insulating layer 24 may be formed using an injection molding process.

[0058] In any solution, an insulating layer 24 In order to ensure that the first connecting terminal 221 and the second connecting terminal 222 are stable after providing a hollow-out structure therein, the first sub-insulating layer 241 covers a portion of the first connecting terminal 221 that is close to the first connecting end and the second connecting end, and the second sub-insulating layer 242 covers a portion of the second connecting terminal 222 that is close to the first connecting end and the second connecting end, thereby ensuring the stability of the connecting terminals.

[0059] In order to facilitate understanding of the effects of the insulating layer and the shielding layer in the embodiment of the present application, the following will first describe the energy loss of the signal in the transmission process (i.e., the insertion loss of the signal). The insertion loss of the signal mainly includes two parts.

[0060] 1. Conductor loss caused by metal structures such as connection terminals and shielding layers, and the conductor loss is mainly related to the conductivity, roughness, and connection terminal width of the conductive structures.

[0061] 2. Dielectric loss caused by the insulating layer 24 filled between the connection terminal and the shielding layer, and the dielectric loss is mainly determined by the dielectric loss angle.

[0062] In order to reduce the insertion loss of the connector, the insulating layer 24 is provided with a hollow structure. According to the hollow structure, the amount of insulating material used is reduced, so that the electrical insulation is realized by using air as a dielectric between the connection terminals and the shielding layer. In addition, when the hollow structure is provided, the disposed insulating layer 24 covers the corresponding parts of each connection terminal, which are close to the first connection end, and the first connection end is exposed outside the insulating layer 24, so that the connection terminals can be positioned and tightened even after the hollow structure is provided to ensure the reliability when the connection terminals are connected to the circuit board.

[0063] Referring to FIG. 6, in order to provide a hollow structure in the insulating layer 24, the first sub-insulating layer 241 is provided with a first hollow structure 2411, so that a gap is formed between the first connecting terminal 221 and the first sub-insulating layer 241. Although a plurality of first hollow structures 2411 are illustrated in FIG. 4, it should be understood that the specific provision position, specific size, and specific amount of the first hollow structures 2411 are not limited in this embodiment of the present application. However, during manufacturing, the size and position of the first hollow structure 2411 may be determined based on actual requirements. This is not particularly limited here. Similarly, the second sub-insulating layer 242 is also provided with a second hollow structure 2421. The details will not be described again here. It can be seen from the structure shown in FIG. 6 that after the first hollow structure 2411 is provided on the first sub-insulating layer 241 and the second hollow structure 2421 is provided on the second sub-insulating layer 242, the amount of insulating material used can be greatly reduced, so that the first connecting terminal 221 and the second connecting terminal 222 are electrically insulated by the air in the two hollow structures (the first hollow structure 2411 and the second hollow structure 2421) to reduce the dielectric loss caused by the characteristics of the insulating layer 24.

[0064] From the above description, it can be seen that in the connector provided in this embodiment of the present application, there is mostly an air gap between the connection terminal and the shielding layer, that is, air is used as a dielectric between the connection terminal and the shielding layer. Air has the smallest dielectric constant and the smallest dielectric loss angle among known materials. Therefore, when the impedance of the connector remains unchanged, the use of air with a small dielectric constant can allow the design width of the connection terminal to be increased and can further reduce the conductor loss, and the use of air with a small loss angle can reduce the dielectric loss. Thus, in the connector provided in this embodiment of the present application, the insertion loss of the signal can be reduced from two perspectives, namely, the conductor loss and the dielectric loss.

[0065] To facilitate understanding of the lead frame provided in the embodiment of the present application, the following describes the process of manufacturing the lead frame. First, a copper sheet is cut to form a connection terminal. The first connection terminal 221 is tiled in one layer to form a first terminal layer. Then, an injection molding process is used to add an insulator around the connection terminal to form a first sub-insulation layer 241 to clamp the first connection terminal 221. In addition, a first hollow structure 2411 is formed during injection molding. The second terminal layer and the second sub-insulation layer 242 are formed as well. The first sub-insulation layer 241 and the second sub-insulation layer 242 are juxtaposed. Then, the first shield layer 21 and the second shield layer 22 are added outside the juxtaposed first sub-insulation layer 241 and second sub-insulation layer 242 to form a complete lead frame.

[0066] In order to facilitate understanding of the loss reduction effect achieved by the connector provided in the embodiment of the present application, a simulation is performed for the connector provided in the embodiment of the present application and the connector in the prior art. FIG. 7 shows the signal insertion loss obtained after performing the simulation for the connector in the prior art and the connector provided in the embodiment of the present application. The dashed line shows the insertion loss of the connector in the prior art, and the solid line shows the insertion loss of the connector provided in the embodiment of the present application. From FIG. 7, it can be seen that the insertion loss of the connector in the prior art at 29 GHz is about 1.51 dB, and the insertion loss of the connector provided in the embodiment of the present application at 29 GHz is about 0.95 dB. The connector provided in the embodiment of the present application realizes a reduction of 0.56 dB in the insertion loss, i.e., an improvement of about 37%. With the improvement, the loss meets the requirements of 112G applications.

[0067] FIG. 8 is a schematic diagram of the structure of an end protector. The end protector 30 is clamped to the shielding layers (first and second shielding layers) of the lead frames 20 so as to clamp the lead frames 20. In addition, the end protector 30 also acts as a connection structure and a conductive structure for a circuit board. When the end protector 30 is mated with the lead frames 20, the first connection ends of the connection terminals (including the first connection terminal 221 and the second connection terminal 222) in the lead frames 20 are exposed through the end protector 30, so that the first connection ends can be inserted into vias in the circuit layer and electrically connected to the circuit layer. When the end protector 30 is mated with the circuit board, the end protector 30 is electrically connected to the ground layer of the circuit layer, so that the end protector 30 and the shielding layer are grounded to realize a shielding effect for the connection terminals.

[0068] The end protector 30 is a frame structure made of a conductive material, such as a metallic material or a non-metallic conductive material. For example, the end protector 30 may be a frame structure made of a highly conductive material, such as copper or aluminum.

[0069] The end protector 30 includes a plurality of windows 31. The plurality of windows 31 are arranged in a single row in the second direction and in a plurality of rows in the first direction. The plurality of windows 31 in each row correspond to a plurality of connection terminal groups in each lead frame 20. When the end protector 30 is mated with the lead frame 20, first connection ends of two connection terminals in each connection terminal group in the corresponding lead frame 20 are inserted into the window 31. The window 31 includes a conductive structure 32. The conductive structure 32 intersects the window 31 and is electrically connected to a side wall of the window 31. The conductive structure 32 divides the window 31 into a first sub-window 311 and a second sub-window 312. The first sub-window 311 and the second sub-window 312 respectively correspond to the first connection ends of the two connection terminals in the connection terminal group.

[0070] The end protector 30 further includes a shield structure 33. The shield structure 33 is configured to be oriented in a second direction. Single One shield structure 33 is arranged in a row. 33 In order to electromagnetically isolate two adjacent windows 31 using the shielding structure 33, the shielding structure 33 is disposed on both sides of each window 31 in the second direction. In addition, the shielding structure 33 may electromagnetically isolate two adjacent connection terminal groups in the same lead frame 20.

[0071] FIG. 9 is a schematic exploded view corresponding to the case where the lead frame is fitted to the end protector. FIG. 10 is a schematic exploded view corresponding to the case where the lead frame is fitted to the end protector. Overview 9 and 10. For ease of illustrating how the lead frame 20 mates with the end protector 30, the first shield layer 21 of the lead frame 20 is used as an example for the description in Figures 9 and 10. For how the second shield layer 23 mates with the end protector 30, refer to how the first shield layer 21 mates with the end protector 30.

[0072] The shielding structures 33 in the end protector 30 are configured to electromagnetically isolate adjacent connection terminal groups 22 in order to achieve electromagnetic isolation between adjacent connection terminal groups 22 in the lead frame. When the shielding structures 33 are positioned, the shielding structures 33 and the windows 31 are alternately arranged to ensure that there are shielding structures 33 on both sides of the windows 31 for isolation.

[0073] In any solution, the shielding structure 33 includes a first protrusion 331 and a second protrusion 332, and the first protrusion 331 and the second protrusion 332 are bar structures, and the length direction is a first direction. There is a gap between the first protrusion 331 and the second protrusion 332. The first protrusion 331 and the second protrusion 332 are arranged in a second direction when arranged. When mated with the first shielding layer 21, the first protrusion 331 and the second protrusion 332 are individually electrically connected to the corresponding first shielding layer 21, and the contact area between the shielding structure 33 and the first shielding layer 21 is increased by using the first protrusion 331 and the second protrusion 332, and further improves the electrical connection effect between the shielding structure 33 and the first shielding layer 21, and improves the electromagnetic isolation effect between different connection terminal groups.

[0074] In any solution, the first shield layer 21 comprises a protruding structure 211 configured to be electrically connected to the shielding structure 33. As shown in FIG. 7, the protruding structure 211 is inserted into the gap between the first protrusion 331 and the second protrusion 332 and is electrically connected to both the first protrusion 331 and the second protrusion 332. For example, the protruding structure 211 can be in different shapes, such as a triangle or a rectangle. Two opposite sides of the protruding structure 211 contact the first protrusion 331 and the second protrusion 332, respectively, to realize the electrical connection between the protruding structure 211 and the two protrusions. In addition, the protruding structure 211 can be snap-fitted into the first protrusion 331 and the second protrusion 332 to fasten the lead frame 20 to the end protector 30.

[0075] In an optional solution, the first shield layer 21 includes a first notch 212 and a second notch 213 corresponding to the first protrusion 331 and the second protrusion 332, respectively, and for fastening, the first protrusion 331 is inserted into the corresponding first notch 212, and the second protrusion 332 is inserted into the corresponding second notch 213. After being inserted, the first protrusion 331 and the second protrusion 332 are electrically connected to the corresponding first shield layer 21. With the first notch 212 and the second notch 213 respectively mated with the first protrusion 331 and the second protrusion 332, respectively, the contact area between the first shield layer 21 and the end protector 30 can be further increased. It should be understood that in this embodiment of the application, the end protector 30 and the first shield layer 21 may be fastened to each other only by snapping the protruding structure 211 onto the first protrusion 331 and the second protrusion 332, only by snapping the first protrusion 331 and the second protrusion 332 into the first notch 212 and the second notch 213, or by both fastening methods.

[0076] In any solution, the shielding structure 33 may alternatively use protrusions, i.e., one protrusion may be located on each side of the window 31. The protrusions snap into notches 212 in the first shielding layer 21 to achieve electrical connection.

[0077] The conductive structure 32 is a bar structure, and the length direction is a first direction. The conductive structure 32 crosses the window 31 and divides the window 31 into a first sub-window 311 and a second sub-window 312. 1 are inserted into the first sub-window 311 and the second sub-window 312 of the window 31, respectively.

[0078] The conductive structure 32 in this embodiment of the present application is signal Roo PFor ease of understanding, the signal transmission process between the connector and the circuit board will be described first below: A differential signal flows into the circuit layer of the circuit board through the connection terminal, and a loop signal flows into the shield layer of the connector through the ground layer of the circuit board, thus forming a signal loop. ground When transmitted from layer to shield layer, the loop signal will choose the path with the least loop inductance.

[0079] As shown by the solid and dashed arrows in Fig. 10, a differential signal is transmitted to the circuit board through the first connection terminal 221 and the second connection terminal 222, and a loop signal is transmitted to the first shield layer 21 through the conductive structure 32, thus forming a signal loop. The conductive structure 32 is located between the first connection terminal 221 and the second connection terminal 222, whereas the shield structure 33 is located on the side of the connection terminal group 22. From a comparison between the shielding structure 33 and the conductive structure 32, it can be seen that between the signal loop formed by the conductive structure 32 and the signal loop formed by the shielding structure 33, the signal loop formed by the conductive structure 32 encloses a smaller area and therefore has a smaller loop inductance. Therefore, to enter the first shielding layer 21, the loop signal selects the conductive structure 32 for entering the first shielding layer 32 and is transferred to a part that is in the first shielding layer 32 and close to the connection terminal. In this way, the loop signal corresponding to each connection terminal group is confined to the vicinity of the connection terminal group, avoiding crosstalk generated between the loop signals corresponding to different connection terminal groups.

[0080] In the signal transmission process in the prior art connector shown in FIG. 11, a differential signal (indicated by solid arrows) is transmitted to the circuit board through the connection terminal group 100, and a loop signal (indicated by dashed arrows) is transmitted to the shield layer through the shield structure 200. The shield structure 200 is made up of two connectionThe conductive structure 32 is located between the terminal groups 100. Therefore, crosstalk inevitably occurs between the loop signals corresponding to the two connection terminal groups 100. In this embodiment of the present application, the conductive structure 32 confines the loop signals to the vicinity of the connection terminal groups, thereby reducing the crosstalk between the loop signals corresponding to the two connection terminal groups.

[0081] In order to facilitate understanding of the signal crosstalk reduction effect achieved by the end protector provided in the present embodiment of the present application, a simulation was performed on the connector provided in the present embodiment of the present application and the connector in the prior art. In the prior art connector, the loop signal is transferred through the shield structure, whereas in the connector provided in the embodiment of the present application, the loop signal is transferred through the conductive structure. The comparison result is shown in FIG. 12. The solid line shows the simulation result of the connector provided in the embodiment of the present application, and the dashed line shows the simulation result of the connector in the prior art. From FIG. 12, it can be seen that the maximum crosstalk in the connector of the prior art reaches 20 dB at 40 GHz, which does not meet the requirements of 112 G applications in higher frequency bands. The connector provided in the embodiment of the present application significantly improves the crosstalk performance at 20 GHz and higher frequency bands. For example, there is an improvement of at least 10 dB in the frequency band of 30 GHz to 40 GHz, and there is an improvement of at least 20 dB in the frequency band of 40 GHz to 50 GHz. With this improvement, the crosstalk performance can meet the requirements of 112 G applications.

[0082] Fig. 13 is a schematic exploded view corresponding to the case where the end protector is mated with the lead frame. End protector Lead Frame M and 13 and 14, the window of the end protector is 31 Two opposing side walls of the window are provided with slots 34. Both ends of the conductive structure 32 are inserted into the slots 34 in one-to-one correspondence, respectively, and clamped to the two side walls of the window.

[0083] In any solution, the height of the shielding structure 33 is greater than the height of the conductive structure 32. That is, the conductive structure 32 is arranged low to ensure a sufficient separation distance between the conductive structure 32 and the first connection terminal 221 and between the conductive structure 32 and the second connection terminal 222 so as to avoid electrical connection between the conductive structure 32 and the first connection terminal 221 and between the conductive structure 32 and the second connection terminal 222.

[0084] In any solution, the height of the conductive structure 32 is greater than the height of the window 31 so that the conductive structure 32 is exposed outside the window 31 and snap-fitted into the first shield layer 21 .

[0085] In any solution, there may be one or more conductive structures 32. When multiple conductive structures 32 are used, the multiple conductive structures 32 may be arranged in the second direction.

[0086] In any solution, the conductive structure 32 and the end protector 30 may be of one piece or may be of split construction. When a split construction is used, the conductive structure 32 is snap-fitted into a window 31 in the end protector 30 and is electrically connected to the end protector 30.

[0087] In any solution, the minimum distance between any connection terminal in each connection terminal group and the conductive structure 32 corresponding to the connection terminal group is a first distance, and the minimum distance between any connection terminal in each connection terminal group and the shielding structure 33 corresponding to the connection terminal group is a second distance, and the first distance is less than the second distance.

[0088] An embodiment of the present application further provides a functional board. The functional board may be different functional boards, such as a backplane and a service board. The functional board includes a circuit board and a connector according to any one of the aforementioned items disposed on the circuit board. A connection end of each connection terminal is electrically connected to a circuit layer of the circuit board. In the aforementioned technical solution, electromagnetic isolation is realized between the lead frames by using a shielding layer, and electromagnetic isolation is realized between the lead frames by using a shielding structure disposed on the end protector. In By using the conductive structure on the end protector, electromagnetic isolation is realized between different connection terminals in the same connection terminal group, thus reducing the crosstalk in the connector, reducing the signal crosstalk between different lead frames, different connection terminal groups and different connection terminals, and improving the communication effect of the connector.

[0089] An embodiment of the present application further provides a board-level architecture. The board-level architecture includes a backplane and a plug-in substrate. At least one of the backplane and the plug-in substrate is a functional substrate. The backplane and the plug-in substrate include a connector. Through In the above technical solution, electromagnetic isolation is realized between the lead frames by using a shielding layer, and electromagnetic isolation is realized between the lead frames by using a shielding structure disposed on the end protector. In By using the conductive structure on the end protector, electromagnetic isolation is realized between different connection terminals in the same connection terminal group, thus reducing the crosstalk in the connector, reducing the signal crosstalk between different lead frames, different connection terminal groups and different connection terminals, and improving the communication effect of the connector.

[0090] Those skilled in the art will appreciate that ExampleIt is apparent that various modifications and variations can be made to the present application without departing from the scope thereof. Thus, the present application is intended to cover these modifications and variations of the present application as long as they fall within the scope defined by the claims of the present application and their equivalents.

Claims

1. an end protector and a plurality of lead frames; A connector, the plurality of lead frames are stacked in a first direction; each lead frame includes a plurality of connection terminal groups and a shielding layer, each connection terminal group includes two connection terminals configured to transmit different signals to a circuit board, each connection terminal has a first connection end configured for insertion into the circuit board, the plurality of connection terminal groups and the shielding layer are stacked in the first direction, and the shielding layer is configured to electromagnetically isolate the connection terminal groups of adjacent lead frames; the end protector is electrically connected to the ground layer of the circuit board and includes a plurality of windows corresponding to the plurality of connection terminal groups in each lead frame, the first connection ends of the two connection terminals in each connection terminal group in the corresponding lead frame are inserted into the windows, each window has a conductive structure located between the first connection ends of the two connection terminals in each connection terminal group, the conductive structure is electrically connected to a corresponding shield layer such that a loop signal corresponding to the different signals is transmitted from the ground layer of the circuit board to the shield layer through the conductive structure; connector.

2. 2. The connector of claim 1, wherein the end protector further includes a plurality of shielding structures each configured to electromagnetically isolate two adjacent groups of connection terminals in each lead frame, each shielding structure being electrically connected to the corresponding shielding layer.

3. 3. The connector of claim 2, wherein the shielding structure includes a first protrusion and a second protrusion, a gap is between the first protrusion and the second protrusion, and the first protrusion and the second protrusion are separately electrically connected to the corresponding shielding layer.

4. 4. The connector of claim 3, wherein each shielding layer includes a protruding structure adapted for one-to-one correspondence with a corresponding shielding structure, the protruding structure being inserted into a gap between the first protrusion and the second protrusion of the corresponding shielding structure and being electrically connected to both the first protrusion and the second protrusion.

5. 5. The connector of claim 3, wherein each shielding layer has a notch corresponding to a first protrusion and a second protrusion of a corresponding shielding structure, the first protrusion and the second protrusion being inserted into the corresponding notch, respectively, and electrically connected to the corresponding shielding layer.

6. The connector of any one of claims 2 to 5, wherein the height of the shielding structure is greater than the height of the conductive structure.

7. a minimum distance between any connection terminal in each connection terminal group and a conductive structure corresponding to the connection terminal group is a first distance, and a distance between any connection terminal in each connection terminal group and a shield structure corresponding to the connection terminal group is a second distance; the first distance is less than the second distance; The connector according to any one of claims 2 to 6.

8. Each of the connection terminal groups further includes an insulating layer, the insulating layer enveloping the plurality of connection terminal groups, and the first connection end of each of the connection terminals is exposed to an outside of the insulating layer; The insulating layer has a hollow structure, and each of the connection terminal groups is partially exposed within the hollow structure. The connector according to any one of claims 1 to 7.

9. one connection terminal in each connection terminal group is located on a first terminal layer, and another connection terminal in the connection terminal group is located on a second terminal layer, the first terminal layer and the second terminal layer are stacked in the first direction; the insulating layer includes a first sub-insulating layer and a second sub-insulating layer, the first sub-insulating layer enveloping the first terminal layer, and the second sub-insulating layer enveloping the second terminal layer; The connector according to claim 8.

10. 10. The connector of claim 9, wherein the first sub-insulation layer and the second sub-insulation layer each have the hollowed structure.

11. The connector further includes an insulating housing; Each connection terminal has a second connection end configured to mate with a connector at a pier end, and the insulating housing encases the second connection end. The connector according to any one of claims 1 to 10.

12. A functional board comprising a circuit board and the connector according to any one of claims 1 to 11 arranged on the circuit board, wherein connection ends of each connection terminal are electrically connected to a circuit layer of the circuit board.

13. 13. A board level architecture comprising a backplane and plug-in boards, at least one of the backplane and the plug-in boards being the functional board of claim 12, and the backplane and the plug-in boards being connected through a connector.

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