Capacitor unit and electronic device

Abstract

A capacitor unit (11) comprises: a plurality of capacitor elements (21a, 21b, 21c, 21d); and one or a plurality of heat transfer members (22a, 22b, 22c), each of which is provided in a location neighboring at least one of the plurality of capacitor elements (21a, 21b, 21c, 21d) and internally disperses received heat. Each heat transfer member (22a, 22b, 22c) has, on an outer surface that is covered by an insulating member (25), a first peeling suppressing section (50) that is provided at least in a location neighboring an exposed end section (221a, 221b, 221c), and has at least one of a protruding shape and a recessed shape.

Description

[Technical field]

[0001] The present disclosure relates to a capacitor unit and an electronic device. [Background technology]

[0002] Some electronic devices, for example, power conversion devices that convert input power and supply the converted power to a load, are equipped with a large-capacity capacitor unit. An example of a capacitor unit is disclosed in Patent Document 1. The capacitor unit disclosed in Patent Document 1 includes a heat conductive plate in contact with a capacitor element, and dissipates heat generated by the capacitor element to the outside of a housing that accommodates the capacitor element via the heat conductive plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2016 / 117441 Summary of the Invention [Problem to be solved by the invention]

[0004] In order to prevent the relative positional relationship between the capacitor elements from shifting, an insulating material such as resin is filled around the capacitor elements. For example, in the capacitor unit disclosed in Patent Document 1, the capacitor elements and the heat conduction plate are covered with an insulating material. In order to improve the cooling performance of the capacitor elements, it is preferable that the insulating material covers the heat conduction plate with the end of the heat conduction plate exposed. If the heat conduction plate and the insulating material are made of different materials and have different linear expansion coefficients, the heat stress generated at the interface between the insulating material and the heat conduction plate increases as the heat generation amount of the capacitor elements increases and the temperatures of the resin and the heat conduction plate rise. As a result, the insulating material peels off from the heat conduction plate, and moisture contained in the air around the capacitor unit penetrates into the gap created by the peeling.

[0005] The present disclosure has been made in consideration of the above-mentioned circumstances, and has an object to provide a capacitor unit having a structure that suppresses peeling of an insulating member, and an electronic device including the capacitor unit. [Means for solving the problem]

[0006] In order to achieve the above object, a capacitor unit of the present disclosure includes a plurality of capacitor elements, one or more heat transfer members, and an insulating member. The plurality of capacitor elements are provided with a gap between them. The heat transfer member is provided at a position adjacent to at least one of the plurality of capacitor elements, and disperses heat received from at least one of the plurality of capacitor elements therein. The insulating member covers the heat transfer member and the plurality of capacitor elements with an end of the heat transfer member exposed. The heat transfer member has an outer surface covered by the insulating member such that the exposed end Next to Contact position Set up Kicked off, a through hole penetrating the heat transfer member; and a protrusion formed at a position adjacent to the through hole and farther from the end portion than the through hole; The first peeling prevention portion has a first peeling prevention portion. Effect of the Invention

[0007] The heat transfer member included in the capacitor unit according to the present disclosure has a first separation prevention portion having at least one of a protruding shape and a recessed shape, thereby preventing separation of the insulating member. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a block diagram showing a configuration of an electronic device according to a first embodiment. [Diagram 2] 1 is a cross-sectional view of a capacitor unit according to a first embodiment; [Diagram 3] 3 is a cross-sectional view of the capacitor unit according to the first embodiment taken along line III-III in FIG. 2 . [Figure 4] 4 is a cross-sectional view of the capacitor unit according to the first embodiment taken along line IV-IV in FIG. 2 . [Diagram 5] FIG. 1 is a diagram showing a configuration of a capacitor element according to a first embodiment; [Figure 6]1 is a cross-sectional view of a capacitor unit according to a first embodiment; [Figure 7] 1 is a rear view of a capacitor unit according to a first embodiment; [Figure 8] 1 is a cross-sectional view of an electronic device according to a first embodiment. [Figure 9] FIG. 1 is a side view of a heat transfer member according to a first embodiment; [Figure 10] 10 is a cross-sectional view of the heat transfer member according to the first embodiment taken along line XX in FIG. [Figure 11] 1 is a cross-sectional view of the capacitor unit according to the first embodiment taken along line XI-XI in FIG. [Figure 12] FIG. 11 is a side view of a heat transfer member according to a second embodiment; [Figure 13] 13 is a cross-sectional view of the heat transfer member according to the second embodiment taken along line XIII-XIII in FIG. [Figure 14] 11 is a side view of a heat transfer member according to a third embodiment. [Figure 15] 13 is a bottom view of a heat transfer member according to embodiment 3. [Figure 16] 13 is a side view of a heat transfer member according to a fourth embodiment. [Figure 17] 17 is a cross-sectional view of the heat transfer member according to the fourth embodiment taken along line XVII-XVII in FIG. [Figure 18] Cross-sectional view of a capacitor unit according to a fifth embodiment. [Figure 19] FIG. 11 is a cross-sectional view of a first modified example of a heat transfer member according to an embodiment; [Figure 20] 13 is a bottom view of a second modified example of the heat transfer member according to the embodiment; [Figure 21] FIG. 13 is a cross-sectional view of a third modified example of a heat transfer member according to an embodiment. [Figure 22] FIG. 11 is a rear view of a first modified example of the capacitor unit according to the embodiment; [Diagram 23] 11 is a cross-sectional view of a second modified example of the capacitor unit according to the embodiment; [Figure 24] 24 is a cross-sectional view taken along line XXIV-XXIV in FIG. 23 of a capacitor unit according to a second modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] A capacitor unit and an electronic device according to embodiments of the present disclosure will be described in detail below with reference to the drawings, in which the same or equivalent parts are denoted by the same reference numerals.

[0010] (Embodiment 1) An example of the electronic device is a power conversion device that is mounted on a railroad car and converts DC power supplied from a DC power source into three-phase AC power and supplies it to an electric motor. Taking the power conversion device as an example, an electronic device 1 according to the first embodiment will be described below.

[0011] The electronic device 1 shown in FIG. 1 receives DC power from a power source (not shown), specifically, from a current collector. The current collector obtains power supplied from a substation via a power supply line. The power supply line is, for example, an overhead line or a third rail. The current collector is, for example, a pantograph or a current collector shoe. The electronic device 1 converts the DC power supplied from the current collector into three-phase AC power, and supplies the converted three-phase AC power to a load 91. In the first embodiment, the electronic device 1 is a three-level inverter, and the load 91 is a three-phase induction motor.

[0012] The electronic device 1 includes a terminal 1a connected to a current collector, a terminal 1b grounded, a capacitor unit 11 charged with power supplied from the current collector, and a power converter 12 that converts DC power supplied from the current collector via the capacitor unit 11 into three-phase AC power. The terminal 1a is preferably electrically connected to the current collector via a contactor, a filter reactor, or the like. The capacitor unit 11 includes a first capacitor C1 and a second capacitor C2. The first capacitor C1 and the second capacitor C2 are connected in series. The first capacitor C1 and the second capacitor C2 connected in series are connected between the terminals 1a and 1b.

[0013] The primary terminals of the power conversion unit 12 are connected to the terminal 1a, the terminal 1b, and the connection point of the first capacitor C1 and the second capacitor C2 connected in series. Three secondary terminals of the power conversion unit 12 corresponding to the U-phase, V-phase, and W-phase of the three-phase AC power are connected to corresponding input terminals of the load 91. The power conversion unit 12 has a plurality of switching elements controlled by a control device (not shown). For example, IGBTs (Insulated Gate Bipolar Transistors) are used as the plurality of switching elements. The control device controls the switching operation of the plurality of switching elements to switch on and off, so that the power conversion unit 12 performs power conversion. In detail, the power conversion unit 12 converts DC power supplied via the primary terminals into three-phase AC power for supplying to the load 91, and outputs the three-phase AC power from the secondary terminals.

[0014] As shown in Fig. 2, Fig. 3 which is a cross-sectional view taken along line III-III in Fig. 2, and Fig. 4 which is a cross-sectional view taken along line IV-IV in Fig. 2, capacitor unit 11 includes a plurality of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d, and heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c which disperse heat received from capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d inside. The internal temperature of capacitor unit 11 is specifically the temperature of each of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d. In Fig. 2, Fig. 3, and Fig. 4, the vertical direction is the Z-axis direction, and the arrangement direction of capacitor elements 21a, 21b, 21c, and 21d is the X-axis direction. The X-axis, Y-axis, and Z-axis are mutually orthogonal.

[0015] Capacitor unit 11 further includes a first conductor 23a electrically connected to the positive electrodes of capacitor elements 21a, 21b, 21c, and 21d, and a first conductor 33a electrically connected to the positive electrodes of capacitor elements 31a, 31b, 31c, and 31d. First conductors 23a and 33a are bus bars made of a conductor such as copper or aluminum.

[0016] Capacitor unit 11 further includes a second conductor 23b electrically connected to the negative electrodes of capacitor elements 21a, 21b, 21c, and 21d, and a second conductor 33b electrically connected to the negative electrodes of capacitor elements 31a, 31b, 31c, and 31d. Second conductors 23b and 33b are bus bars made of a conductor such as copper or aluminum.

[0017] The capacitor unit 11 further includes a first terminal 24a electrically connected to the first conductor 23a, a first terminal 34a electrically connected to the first conductor 33a, a second terminal 24b electrically connected to the second conductor 23b, and a second terminal 34b electrically connected to the second conductor 33b.

[0018] Capacitor unit 11 further includes an insulating member 25 that covers a portion of each of heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c and the entirety of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d. Insulating member 25 covers heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c while exposing ends 221a, 221b, 221c, 321a, 321b, and 321c of heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c, respectively.

[0019] The heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c included in the above-mentioned capacitor unit 11 have a first peeling suppression portion 50 provided at a position adjacent to the exposed end portions 221a, 221b, 221c, 321a, 321b, and 321c of the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c. As a result, the insulating member 25 is suppressed from peeling off the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c.

[0020] The details of each part of the capacitor unit 11 will be described below. As shown in Fig. 2, the capacitor elements 21a, 21b, 21c, and 21d are arranged in a row with a gap between them. In particular, the capacitor elements 21a, 21b, 21c, and 21d are arranged in the X-axis direction with the main surfaces of their exteriors oriented perpendicular to the X-axis. Similarly, the capacitor elements 31a, 31b, 31c, and 31d are arranged in the X-axis direction with a gap between them. In particular, the capacitor elements 31a, 31b, 31c, and 31d are arranged in the X-axis direction with the main surfaces of their exteriors oriented perpendicular to the X-axis.

[0021] The capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d have the same configuration, so the configuration of the capacitor element 21a will be described with reference to FIG. 5. The capacitor element 21a is a film capacitor, and includes a film 41c on which a positive electrode 41a is formed, and a film 41d on which a negative electrode 41b is formed. The films 41c and 41d are stacked and wound around a central axis. The film 41c is a plastic film, and a metal such as aluminum or zinc is evaporated onto the film 41c to form the positive electrode 41a. Similarly, the film 41d is a plastic film, and a metal such as aluminum or zinc is evaporated onto the film 41d to form the negative electrode 41b.

[0022] One end of the capacitor element 21a in the direction of the central axis corresponds to a positive terminal, and the other end corresponds to a negative terminal. In the example of FIG. 5, the upper end of the capacitor element 21a corresponds to a positive terminal, and the lower end of the capacitor element 21a corresponds to a negative terminal. The capacitor element 21a has a shape in which the outer shape of a cross section perpendicular to the central axis is an ellipse. The ellipse means an outer shape obtained by connecting the outer edges of two circles with the same diameter with two straight lines of the same length. The capacitor element 21a is provided with its central axis aligned with the Z-axis direction. In detail, as shown in FIG. 2 and FIG. 3, the upper end of the capacitor element 21a in the Z-axis direction corresponds to the positive terminal of the capacitor element 21a, and the lower end of the capacitor element 21a in the Z-axis direction corresponds to the negative terminal of the capacitor element 21a.

[0023] Heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c are provided adjacent to at least one of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d, and disperse heat transferred from at least one of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d internally.

[0024] In order to suppress a rise in temperature of each of the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d, it is preferable that the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c are provided between two adjacent capacitor elements among the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d. In the first embodiment, the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c are provided at positions adjacent to different capacitor elements among the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d.

[0025] In detail, heat transfer member 22a is provided between capacitor elements 21a and 21b and disperses heat received from capacitor elements 21a and 21b therein. Heat transfer member 22b is provided between capacitor elements 21b and 21c and disperses heat received from capacitor elements 21b and 21c therein. Heat transfer member 22c is provided between capacitor elements 21c and 21d and disperses heat received from capacitor elements 21c and 21d therein.

[0026] Similarly, heat transfer member 32a is provided between capacitor elements 31a and 31b and disperses the heat received from capacitor elements 31a and 31b therein. Heat transfer member 32b is provided between capacitor elements 31b and 31c and disperses the heat received from capacitor elements 31b and 31c therein. Heat transfer member 32c is provided between capacitor elements 31c and 31d and disperses the heat received from capacitor elements 31c and 31d therein.

[0027] The heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c are preferably plate-like members having at least one main surface in contact with at least one of the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d. Contact includes direct contact and indirect contact. In the first embodiment, the heat transfer member 22a is a plate-like member, and one main surface of the heat transfer member 22a is in contact with the capacitor element 21a, and the other main surface of the heat transfer member 22a is in contact with the capacitor element 21b. The heat transfer member 22b is a plate-like member, and one main surface of the heat transfer member 22b is in contact with the capacitor element 21b, and the other main surface of the heat transfer member 22b is in contact with the capacitor element 21c. Heat transfer member 22c is a plate-shaped member, one main surface of heat transfer member 22c abuts against capacitor element 21c, and the other main surface of heat transfer member 22c abuts against capacitor element 21d.

[0028] Similarly, heat transfer member 32a is a plate-shaped member, one main surface of heat transfer member 32a abuts against capacitor element 31a, and the other main surface of heat transfer member 32a abuts against capacitor element 31b. Heat transfer member 32b is a plate-shaped member, one main surface of heat transfer member 32b abuts against capacitor element 31b, and the other main surface of heat transfer member 32b abuts against capacitor element 31c. Heat transfer member 32c is a plate-shaped member, one main surface of heat transfer member 32c abuts against capacitor element 31c, and the other main surface of heat transfer member 32c abuts against capacitor element 31d.

[0029] Since the heat transfer member 22a is a plate-like member that contacts the capacitor elements 21a and 21b with their faces, heat can be efficiently transferred from the capacitor elements 21a and 21b to the heat transfer member 22a. The same is true for the heat transfer members 22b, 22c, 32a, 32b, and 32c. This makes it possible to suppress an increase in the internal temperature of the capacitor unit 11.

[0030] It is preferable that the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c are formed from a material having high thermal conductivity, such as a metal such as copper or aluminum, graphite which is an anisotropic heat transport member, a clad material formed from dissimilar metals, or a highly thermally conductive ceramic.

[0031] The provision of heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c improves the efficiency of heat transfer from capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d to the outer surface of condenser unit 11, and heat generated in capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d is efficiently transferred to the outside of condenser unit 11. As a result, the temperature rise of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d is suppressed.

[0032] The first conductor 23a is in contact with the vertical upper ends of the capacitor elements 21a, 21b, 21c, and 21d, thereby being electrically connected to the positive electrodes 41a of the capacitor elements 21a, 21b, 21c, and 21d. Similarly, the first conductor 33a is in contact with the vertical upper ends of the capacitor elements 31a, 31b, 31c, and 31d, thereby being electrically connected to the positive electrodes 41a of the capacitor elements 31a, 31b, 31c, and 31d.

[0033] The second conductor 23b abuts against the vertical lower ends of the capacitor elements 21a, 21b, 21c, and 21d, thereby being electrically connected to the negative electrodes 41b of the capacitor elements 21a, 21b, 21c, and 21d. Similarly, the second conductor 33b abuts against the vertical lower ends of the capacitor elements 31a, 31b, 31c, and 31d, thereby being electrically connected to the negative electrodes 41b of the capacitor elements 31a, 31b, 31c, and 31d.

[0034] The first terminal 24a is attached to the first conductor 23a by a fastening member (not shown) in a state where it abuts against the first conductor 23a. As a result, the first terminal 24a is electrically connected to the first conductor 23a. The first terminal 34a is attached to the first conductor 33a by a fastening member (not shown) in a state where it abuts against the first conductor 33a. As a result, the first terminal 34a is electrically connected to the first conductor 33a.

[0035] Similarly, the second terminal 24b is attached to the second conductor 23b by a fastening member (not shown) in a state of contact with the second conductor 23b. As a result, the second terminal 24b is electrically connected to the second conductor 23b. The second terminal 34b is attached to the second conductor 33b by a fastening member (not shown) in a state of contact with the second conductor 33b. As a result, the second terminal 34b is electrically connected to the second conductor 33b.

[0036] The first capacitor C1 is realized by the above-mentioned capacitor elements 21a, 21b, 21c, and 21d, the first conductor 23a, the second conductor 23b, the first terminal 24a, and the second terminal 24b. The first terminal 24a corresponds to the positive terminal of the first capacitor C1, and the second terminal 24b corresponds to the negative terminal of the first capacitor C1. The first terminal 24a is electrically connected to the terminal 1a and the primary terminal of the power conversion unit 12 by a bus bar (not shown). The second terminal 24b is electrically connected to the primary terminal of the power conversion unit 12 and the second capacitor C2 by a bus bar (not shown).

[0037] The second capacitor C2 is realized by the above-mentioned capacitor elements 31a, 31b, 31c, and 31d, the first conductor 33a, the second conductor 33b, the first terminal 34a, and the second terminal 34b. The first terminal 34a corresponds to the positive terminal of the second capacitor C2, and the second terminal 34b corresponds to the negative terminal of the second capacitor C2. The first terminal 34a is electrically connected to the primary terminal of the power conversion unit 12 and the first capacitor C1 by a bus bar (not shown). The second terminal 34b is electrically connected to the terminal 1b and the primary terminal of the power conversion unit 12 by a bus bar (not shown).

[0038] The insulating member 25 is formed of a resin such as epoxy, urethane, or silicone. The insulating member 25 insulates the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d and the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c from each other. As shown in Fig. 3, the insulating member 25 covers the heat transfer members 22a, 22b, and 22c and the capacitor elements 21a, 21b, 21c, and 21d while exposing the ends 221a, 221b, and 221c of the heat transfer members 22a, 22b, and 22c. Specifically, insulating member 25 covers heat transfer members 22a, 22b, 22c and capacitor elements 21a, 21b, 21c, 21d while exposing ends 221a, 221b, 221c in the Y-axis direction of heat transfer members 22a, 22b, 22c which are plate-shaped members.

[0039] As shown in FIG. 4, the insulating member 25 further covers the heat transfer members 32a, 32b, 32c and the capacitor elements 31a, 31b, 31c, 31d while exposing the ends 321a, 321b, 321c of the heat transfer members 32a, 32b, 32c, specifically, the ends 321a, 321b, 321c in the Y-axis direction of the heat transfer members 32a, 32b, 32c, which are plate-shaped members.

[0040] The insulating member 25 fixes the relative positional relationship between the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d, the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c, the first conductors 23a, 33a, the second conductors 23b, 33b, the first terminals 24a, 34a, and the second terminals 24b, 34b.

[0041] The insulating member 25 further covers the first conductors 23a, 33a, the second conductors 23b, 33b, the first terminals 24a, 34a, and the second terminals 24b, 34b, with a portion of each of the first terminals 24a, 34a and a portion of each of the second terminals 24b, 34b exposed. With a portion of each of the first terminals 24a, 34a and a portion of each of the second terminals 24b, 34b exposed, it becomes possible to electrically connect the bus bars to the first terminals 24a, 34a and the second terminals 24b, 34b.

[0042] For example, the components of capacitor unit 11 other than insulating member 25 are arranged inside a case (not shown), epoxy resin is filled into the case, and the case is hardened and then removed from the case, thereby obtaining capacitor unit 11 described above.

[0043] In order to improve the cooling performance, the capacitor unit 11 preferably further includes a cooling unit 26 thermally connected to the exposed ends 221a, 221b, 221c of the heat transfer members 22a, 22b, 22c and the exposed ends 321a, 321b, 321c of the heat transfer members 32a, 32b, 32c as shown in FIG. 6. The capacitor unit 11 preferably further includes a thermal interface material (TIM) 29 that abuts against the surface of the insulating member 25 facing the cooling unit 26 and the cooling unit 26 to reduce contact thermal resistance. The cooling unit 26 dissipates heat transferred from the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d through the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c. FIG. 6 is a view of the capacitor unit 11 taken along the same cross section as FIG. 3.

[0044] The cooling section 26 includes a heat receiving block 27 that directly contacts the exposed ends 221a, 221b, 221c of the heat transfer members 22a, 22b, 22c and the exposed ends 321a, 321b, 321c of the heat transfer members 32a, 32b, 32c, and a heat sink 28 that sinks heat transferred from the heat receiving block 27. The heat transfer members 22a, 22b, 22c, 32a, 32b, 32c are attached to one main surface 27a of the heat receiving block 27 by a fastening method such as fastening with a fastening member (not shown), bonding with an adhesive, brazing, welding, etc. The heat sink 28 is attached to the other main surface 27b of the heat receiving block 27 by a fastening method such as fastening with a fastening member (not shown), brazing, welding, etc.

[0045] The heat receiving block 27 is thermally connected to the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c, so that heat is transferred from the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d through the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c to the heat receiving block 27. The heat receiving block 27 is preferably made of a material with high thermal conductivity, such as a metal such as copper or aluminum, graphite which is a heat transport member having anisotropy, a clad material made of different metals, or a highly thermally conductive ceramic.

[0046] By the heat receiving block 27 being in contact with the end faces of the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c, the heat is directly transferred from the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c to the heat receiving block 27, improving the heat transfer efficiency. As a result, the cooling performance of the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d is improved, making it possible to suppress the rise in temperature of the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d.

[0047] The heat sink 28 radiates the heat transferred from the heat receiving block 27 to the surrounding air. The heat transferred from the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d to the heat receiving block 27 via the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c is radiated to the surrounding air by the heat sink 28. As a result, the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d are cooled. In the first embodiment, as shown in Figs. 6 and 7, the heat sink 28 has a plurality of fins whose main surfaces are parallel to the YZ plane. The heat sink 28 is preferably formed of a material with high thermal conductivity, for example, a metal such as copper or aluminum, graphite which is a heat transport member having anisotropy, a clad material formed of different metals, a highly thermally conductive ceramic, or the like.

[0048] The TIM 29 is formed of a heat dissipation sheet, grease, etc. The TIM 29 abuts against the surface of the insulating member 25 facing the cooling unit 26 and the main surface 27a of the heat receiving block 27, and covers the outer surfaces of the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c around the Y-axis direction. The TIM 29 enables efficient heat transfer from the insulating member 25 to the heat receiving block 27 of the cooling unit 26.

[0049] As shown in Fig. 8, electronic device 1 includes housing 13 that houses capacitor unit 11 having the above-described configuration and power conversion unit 12. To avoid complicating the drawing, illustration of power conversion unit 12 is omitted in Fig. 8.

[0050] An opening 13a is formed in the housing 13. The cooling section 26 of the capacitor unit 11 closes the opening 13a with a part of the cooling section 26 exposed to the outside of the housing 13 from the opening 13a. The cooling section 26 closes the opening 13a, thereby preventing air outside the housing 13, including foreign matter such as dust and moisture, from flowing into the inside of the housing 13 from the opening 13a. In detail, the heat receiving block 27 closes the opening 13a from inside the housing 13 with the heat radiator 28 exposed to the outside of the housing 13. Since the heat radiator 28 is exposed to the outside of the housing 13, the heat radiator 28 radiates heat transferred from the heat receiving block 27 to the air outside the housing 13. As a result, the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d are cooled. Since the temperature of the air outside the housing 13 is lower than the temperature of the air inside the housing 13, the cooling performance of the capacitor unit 11 is higher than that of a capacitor unit that dissipates heat into the air inside the housing.

[0051] When power is supplied to the electronic device 1 having the above configuration, specifically, when the electronic device 1 is electrically connected to the current collector, a current flows through the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d, and the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d generate heat. The heat generated in the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d is transferred to the heat receiving block 27 of the cooling unit 26 via the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c. The heat transferred to the heat receiving block 27 is dissipated to the air outside the housing 13 via the radiator 28 attached to the heat receiving block 27 or the housing 13 to which the heat receiving block 27 abuts. As a result, capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d are cooled, and a rise in temperature of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d is suppressed.

[0052] As described above, heat generated in capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d is dissipated to the air outside housing 13, thereby suppressing an increase in the air temperature inside housing 13. As a result, an increase in the internal temperature of capacitor unit 11 is suppressed.

[0053] As described above, when capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d generate heat during energization and the temperature rises, the temperatures of heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c adjacent to capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d and insulating member 25 rise. Since heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c and insulating member 25 are made of different materials, their linear expansion coefficients are different from each other. Therefore, when the amount of heat generated by capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d increases, the thermal stress generated at the interfaces between heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c and insulating member 25 increases.

[0054] The following describes a structure for suppressing peeling of the insulating member 25 from the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c due to thermal stress generated at the interfaces between the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c and the insulating member 25. Since the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c have the same structure, only the heat transfer member 22a will be described.

[0055] 9 and 10, which is a cross-sectional view taken along line XX in FIG. 9, heat transfer member 22a has a first peeling suppression portion 50 provided at least at a position adjacent to end portion 221a that is exposed and not covered by insulating member 25, on the outer surface covered by insulating member 25. Figures 9 and 10 show only heat transfer member 22a among the components of capacitor unit 11. The position adjacent to end portion 221a may be a position sufficiently close to end portion 221a, for example, within a range where the distance from one end of end portion 221a on the negative Y-axis direction side is 30 millimeters or less.

[0056] The first peeling suppressing portion 50 has at least one of a protruding shape and a recessed shape. In the first embodiment, the first peeling suppressing portion 50 has a plurality of recesses 51 arranged in the Z-axis direction. Each recess 51 has a shape recessed in the negative X-axis direction from the outer surface of the heat transfer member 22a. For example, when the heat transfer member 22a is formed of a flat plate member having a width in the X-axis direction of 10 mm, the length in the X-axis direction of the recess 51 is preferably in the range of 2 mm or more and 3 mm or more. The plurality of recesses 51 are arranged at intervals from each other in the Z-axis direction.

[0057] When the insulating member 25 is filled around the heat transfer member 22a, the insulating member 25 fills the recess 51 as shown in Fig. 11, which is a cross-sectional view taken along line XI-XI in Fig. 3. As a result, the insulating member 25 is prevented from peeling off from the heat transfer member 22a by an anchor effect.

[0058] It is preferable that the heat transfer member 22a has a polygonal shape with rounded corners in a direction from the exposed end 221a toward the portion covered with the insulating member 25, i.e., in a cross section perpendicular to the Y-axis direction. In the first embodiment, the heat transfer member 22a has a quadrangular shape with rounded corners in the XZ plane.

[0059] First peel-prevention portion 50 provided at a position adjacent to end portion 221a of heat transfer member 22a prevents insulating member 25 from peeling off from heat transfer member 22a, thereby preventing a gap from being generated between insulating member 25 and heat transfer member 22a. This prevents moisture contained in the air outside capacitor unit 11 from moving along end portion 221a and passing through the gap between insulating member 25 and heat transfer member 22a to reach capacitor elements 21a and 21b.

[0060] As described above, the heat transfer members 22a, 22b, and 22c included in the capacitor unit 11 according to the first embodiment have the first peeling suppression portion 50 provided at least at a position adjacent to the exposed ends 221a, 221b, and 221c on the outer surface covered by the insulating member 25. Similarly, the heat transfer members 32a, 32b, and 32c included in the capacitor unit 11 have the first peeling suppression portion 50 provided at least at a position adjacent to the exposed ends 321a, 321b, and 321c on the outer surface covered by the insulating member 25. The first peeling suppression portion 50 has at least one of a protruding shape and a recessed shape. The first peeling suppression portion 50 suppresses the insulating member 25 from peeling off the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c.

[0061] As described above, by providing first peel-off suppression portion 50, even if the amount of heat generated by capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d increases and thermal stress occurs at the interface between heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c and insulating member 25, peel-off of insulating member 25 is suppressed. Therefore, a capacitor unit 11 with high reliability in high-temperature environments is obtained.

[0062] As described above, in the capacitor unit 11, the peeling of the insulating member 25 is suppressed even when the amount of heat generated by the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d increases, so that the allowable temperature of the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d of the capacitor unit 11 is higher than that of a capacitor unit not provided with the first peeling suppression part 50. In other words, it is possible to increase the voltage applied to the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d, or to make the films 41c and 41d thinner. This relaxes the design constraints of the capacitor unit 11.

[0063] Increasing the voltage applied to capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d makes it possible to increase the capacity of capacitor unit 11. Reducing the thickness of films 41c and 41d makes it possible to reduce the size of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d, i.e., to reduce the size of capacitor unit 11.

[0064] (Embodiment 2) The shape of the first peel-prevention portion 50 is not limited to the above example, and may be any shape that can prevent the insulating member 25 from peeling off from the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c. Heat transfer members 22a, 22b, 22c, 32a, 32b, 32c having first peel-prevention portions 50 having shapes different from those in the first embodiment will be described in the second embodiment, focusing on the differences from the first embodiment.

[0065] Since the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c have the same structure, the heat transfer member 22a included in the capacitor unit 11 according to the second embodiment will be described with reference to Fig. 12 and Fig. 13, which is a cross-sectional view taken along line XIII-XIII in Fig. 12. Figs. 12 and 13 are diagrams showing only the heat transfer member 22a among the components of the capacitor unit 11. The first peeling suppression portion 50 is formed of a plurality of through holes 52 arranged in the Z-axis direction. Each through hole 52 penetrates the heat transfer member 22a in the X-axis direction.

[0066] When the insulating member 25 is filled around the heat transfer member 22a, the insulating member 25 is filled into the through holes 52. As a result, the insulating member 25 is prevented from peeling off from the heat transfer member 22a due to an anchor effect.

[0067] As described above, the first peeling suppression portion 50 of the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c included in the capacitor unit 11 according to the second embodiment is formed of a plurality of through holes 52. Since the through holes 52 are filled with the insulating member 25, the insulating member 25 located on one main surface side of the heat transfer member 22a and the insulating member 25 located on the other main surface side of the heat transfer member 22a are continuous with each other via the insulating member 25 filled in each through hole 52. Therefore, peeling of the insulating member 25 from the heat transfer member 22a is more reliably suppressed than in the first embodiment. The same effect can be obtained for the heat transfer members 22b, 22c, 32a, 32b, and 32c.

[0068] (Embodiment 3) The shape of the first peel-prevention portion 50 is not limited to the above example, and may be any shape that can prevent the insulating member 25 from peeling off from the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c. Heat transfer members 22a, 22b, 22c, 32a, 32b, 32c having first peel-prevention portions 50 having shapes different from those in the first and second embodiments will be described in the third embodiment, focusing on the differences from the first and second embodiments.

[0069] Since heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c have the same structure, heat transfer member 22a included in capacitor unit 11 according to embodiment 3 will be described with reference to Figures 14 and 15. First peeling prevention portion 50 is formed by slits 53 extending in the Z-axis direction.

[0070] When the insulating member 25 is filled around the heat transfer member 22a, the insulating member 25 is filled in the slits 53. As a result, the insulating member 25 is prevented from peeling off from the heat transfer member 22a due to an anchor effect.

[0071] As described above, the first peeling suppression portion 50 of the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c included in the capacitor unit 11 according to embodiment 3 is formed by the slit 53. By filling the insulating member 25 in the slit 53, peeling of the insulating member 25 from the heat transfer member 22a is suppressed over the entire heat transfer member 22a in the Z-axis direction. Therefore, peeling of the insulating member 25 from the heat transfer member 22a is suppressed more reliably than in embodiment 1. The same effect can be obtained for the heat transfer members 22b, 22c, 32a, 32b, and 32c.

[0072] (Embodiment 4) The shape of the first peel-prevention portion 50 is not limited to the above example, and may be any shape that can prevent the insulating member 25 from peeling off from the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c. Heat transfer members 22a, 22b, 22c, 32a, 32b, 32c having a first peel-prevention portion 50 having a shape different from that of embodiment 1-3 will be described in embodiment 4, focusing on the differences from embodiment 1-3.

[0073] A first peeling suppression portion 50 provided on a heat transfer member 22a of a capacitor unit 11 according to embodiment 4 has a protruding shape and a recessed shape. In detail, as shown in Fig. 16 and Fig. 17 which is a cross-sectional view taken along line XVII-XVII in Fig. 16, the first peeling suppression portion 50 has a recess 54 formed by a through hole and a protrusion 55 formed at a position adjacent to the recess 54. Figs. 16 and 17 show only the heat transfer member 22a among the components of the capacitor unit 11. The recess 54 and the protrusion 55 are formed by making a cut in the heat transfer member 22a and drawing out a part of the heat transfer member 22a in the X-axis direction.

[0074] When the insulating member 25 is filled around the heat transfer member 22a, the insulating member 25 is filled in the recess 54 formed by the through hole. As a result, the anchor effect prevents the insulating member 25 from peeling off from the heat transfer member 22a. The protrusion 55 is provided on the Y-axis negative direction side of the recess 54, thereby preventing moisture contained in the air outside the capacitor unit 11 from moving in the Y-axis negative direction along the heat transfer member 22a.

[0075] As described above, the first peeling suppression portion 50 of the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c included in the capacitor unit 11 according to embodiment 4 has the recess 54 and the protrusion 55. The insulating member 25 is filled in the recess 54, thereby suppressing the insulating member 25 from peeling off from the heat transfer member 22a. The provision of the protrusion 55 prevents moisture contained in the air outside the capacitor unit 11 from moving along the heat transfer member 22a and passing through the gap between the insulating member 25 and the heat transfer member 22a to reach the capacitor elements 21a and 21b, even if a gap is generated between the heat transfer member 22a and the insulating member 25.

[0076] (Embodiment 5) The structure that prevents insulating member 25 from peeling off from heat transfer members 22a, 22b, 22c, 32a, 32b, 32c is not limited to first peel-off preventive portion 50. A capacitor unit that prevents insulating member 25 from peeling off with a structure different from first peel-off preventive portion 50 will be described in embodiment 5, focusing on the differences from embodiment 1.

[0077] 18 includes covering members 62a, 62b, and 62c that cover outer surfaces of heat transfer members 22a, 22b, and 22c with ends 221a, 221b, and 221c of heat transfer members 22a, 22b, and 22c exposed. In capacitor unit 61, heat transfer members 22a, 22b, and 22c do not include first peeling suppression portion 50.

[0078] Although not shown, the capacitor unit 61 further includes covering members 62a, 62b, and 62c that cover outer surfaces of the heat transfer members 32a, 32b, and 32c while leaving the ends 321a, 321b, and 321c of the heat transfer members 32a, 32b, and 32c exposed. In the capacitor unit 61, the heat transfer members 32a, 32b, and 32c do not include the first peeling suppression portion 50.

[0079] Since the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c have the same structure, and the covering members 62a, 62b, and 62c have the same structure, the heat transfer member 22a and the covering member 62a that covers the heat transfer member 22a will be described. The heat transfer member 22a is covered by the covering member 62a with the end portion 221a exposed.

[0080] The covering member 62a is formed of a member having a linear expansion coefficient smaller than that of the heat transfer member 22a and larger than that of the insulating member 25, or a member having a linear expansion coefficient larger than that of the heat transfer member 22a and smaller than that of the insulating member 25. In other words, the linear expansion coefficient of the covering member 62a is smaller than that of the heat transfer member 22a and larger than that of the insulating member 25, or larger than that of the heat transfer member 22a and smaller than that of the insulating member 25. Therefore, the thermal stress at the interface between the heat transfer member 22a and the covering member 62a and the thermal stress at the interface between the covering member 62a and the insulating member 25 are both smaller than the thermal stress at the interface between the heat transfer member 22a and the insulating member 25 in the embodiment 1-4. The same applies to the heat transfer members 22b, 22c, 32a, 32b, and 32c.

[0081] As one example, heat transfer member 22a may be made of magnesium, covering member 62a may be made of polyethylene, and insulating member 25 may be made of epoxy resin. At this time, the linear expansion coefficient of covering member 62a is smaller than that of heat transfer member 22a and is larger than that of insulating member 25. As another example, the heat transfer member may be made of carbon steel, covering member 62a may be made of fluororesin, and insulating member 25 may be made of high-density polyethylene.

[0082] As described above, the capacitor unit 61 according to the fifth embodiment includes the covering members 62a, 62b, and 62c that cover the heat transfer members 22a, 22b, and 22c, and the covering members 62a, 62b, and 62c that cover the heat transfer members 32a, 32b, and 32c. The thermal stress at the interface between the heat transfer member 22a and the covering member 62a and the thermal stress at the interface between the covering member 62a and the insulating member 25 are both smaller than the thermal stress at the interface between the heat transfer member 22a and the insulating member 25 in the first to fourth embodiments. Therefore, the insulating member 25 is prevented from peeling off from the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c.

[0083] The present disclosure is not limited to the above-described embodiments. The above-described embodiments can be combined in any manner. As an example, the capacitor unit 61 may have the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c included in the capacitor unit 11 according to the first to fourth embodiments.

[0084] The heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c may be formed of heat pipes. In this case, the first peeling prevention portion 50 is preferably formed of a recess 51 or a slit 53 that does not penetrate the wall surface of the heat pipe.

[0085] The shape of the first peeling suppression portion 50 may be any shape as long as it can suppress the insulating member 25 from peeling off from the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c. As an example, the first peeling suppression portion 50 may be formed by roughening the surfaces of the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c with a file. As another example, the first peeling suppression portion 50 may be formed by etching the surfaces of the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c to form irregularities. As another example, the first peeling suppression portion 50 may be formed by a narrow portion having a cross-sectional area perpendicular to the Y-axis direction that is narrower than other portions. As another example, the through hole 52 may be formed as a through hole extending from a surface facing the X-axis positive direction of the heat transfer member 22a to a surface facing the X-axis negative direction, and extending in a direction intersecting the X-axis. The through holes 52 may be formed in multiple rows.

[0086] The location where the first peeling suppression part 50 is provided is not limited to the above example, and may be any location including a position adjacent to the exposed ends 221a, 221b, 221c of the heat transfer members 22a, 22b, 22c and the exposed ends 321a, 321b, 321c of the heat transfer members 32a, 32b, 32c. As an example, the first peeling suppression part 50 may be provided over the entire surfaces of the heat transfer members 22a, 22b, 22c, 32a, 32b, 32c.

[0087] As another example, recesses 51 may be provided on both the surface facing the positive direction of the X-axis and the surface facing the negative direction of the X-axis of heat transfer member 22a as shown in Fig. 19. As another example, slits 53 may be formed on both the surface facing the positive direction of the X-axis and the surface facing the negative direction of the X-axis of heat transfer member 22a as shown in Fig. 20. As another example, convex portions 55 protruding in the positive direction of the X-axis and convex portions 55 protruding in the negative direction of the X-axis may be provided in heat transfer member 22a alternately arranged in the Z-axis direction as shown in Fig. 21.

[0088] The shape of the insulating member 25 is not limited to the above example. As an example, as shown in Fig. 22, slits 25a may be formed on the surface of the insulating member 25 facing the cooling unit 26. By forming the slits 25a, the thermal stress applied to the insulating member 25 is reduced.

[0089] Capacitor unit 11, 61 may further include a structure for preventing insulating member 25 from peeling off from components of capacitor unit 11 other than heat transfer members 22a, 22b, 22c, 32a, 32b, 32c.

[0090] As an example, as shown in Fig. 23 and Fig. 24 which is a cross-sectional view taken along line XXIV-XXIV in Fig. 23, at least one of the first conductors 23a, 33a and the second conductors 23b, 33b may have a second peel-suppressing portion 70 that suppresses peeling of the insulating member 25. In the example of Fig. 23 and Fig. 24, the first conductors 23a, 33a and the second conductors 23b, 33b have the second peel-suppressing portion 70 that suppresses peeling of the insulating member 25 from the first conductors 23a, 33a and the second conductors 23b, 33b.

[0091] The second peeling prevention portion 70 is formed of a plurality of recesses 71 recessed in the Z-axis direction. The provision of the second peeling prevention portion 70 prevents the insulating member 25 from peeling off from the first conductors 23a, 33a and the second conductors 23b, 33b, causing gaps to form. As a result, moisture contained in the air outside the capacitor unit 11 is prevented from passing through the gaps between the insulating member 25 and the first conductors 23a, 33a and the second conductors 23b, 33b and reaching the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d.

[0092] The shape of the second peeling suppression portion 70 is not limited to the above example. As an example, the second peeling suppression portion 70 may be formed as a slit. As another example, the second peeling suppression portion 70 may be formed as a recess and a protrusion adjacent to each other.

[0093] The number of capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d included in capacitor unit 11, 61 is not limited to the above example and may be any number. In the embodiment, capacitor unit 11 has two capacitor groups, a first capacitor C1 and a second capacitor C2, but the number of capacitor groups may be any number. For example, the capacitor unit may have only first capacitor C1, or may have a third capacitor in addition to first capacitor C1 and second capacitor C2.

[0094] The configuration of the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d is not limited to the above example. As an example, the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d may be film capacitors using metal foil.

[0095] The number and shape of the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c may be any shape as long as the shape can disperse heat generated in the capacitor elements 21a, 21b, 21c, 21d, 31a, 31b, 31c, and 31d internally. As an example, the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c may be formed of rod-shaped members.

[0096] As another example, the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c may be plate-shaped members bent into a U-shape, or may be rod-shaped members bent into a U-shape. As another example, the heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c may be plate-shaped members in which a refrigerant is sealed in a flow path formed therein.

[0097] The positions at which heat transfer members 22a, 22b, 22c, 32a, 32b, and 32c are provided are not limited to the above examples. As an example, in addition to the above positions, heat transfer members may be provided at positions adjacent only to capacitor element 21d, specifically, at positions adjacent to the surface of capacitor element 21d facing the positive direction of the X-axis. As another example, heat transfer members may be provided between first conductor 23a and the surface of capacitor element 21a facing the negative direction of the X-axis.

[0098] The shape of the radiator 28 is arbitrary as long as it can radiate the heat transferred from the heat receiving block 27. As one example, the multiple fins of the radiator 28 can be changed arbitrarily according to the air flow near the radiator 28. As another example, the radiator 28 may have multiple rod-shaped protrusions. As another example, the radiator 28 may have a heat pipe, or may have a plate-shaped member in which a refrigerant is sealed in a flow path formed therein.

[0099] The position where the cooling unit 26 is provided is not limited to the above example. Specifically, the cooling unit 26 may be provided inside the housing 13, not outside the housing 13. In this case, the cooling unit 26 is preferably provided inside the housing 13, at a position where the air outside the housing 13 flows in.

[0100] There is no particular limitation on the method for attaching the insulating member 25 to the heat receiving block 27. For example, the insulating member 25 may be attached to the heat receiving block 27 by a method such as fastening with a fastening member or bonding with an adhesive.

[0101] The electronic device 1 is not limited to a three-level power conversion device, but may be any device equipped with a capacitor unit 11. As an example, the electronic device 1 may be a rectifier. The electronic device 1 is not limited to a railroad car, but may be mounted on any moving object such as an automobile, a ship, or an aircraft.

[0102] The load 91 is not limited to a three-phase induction motor, but may be any device that receives power supply from the electronic device 1. For example, the load 91 may be an air conditioner, a lighting device, or the like. Various aspects of the present disclosure are summarized below as appendices. (Appendix 1) A plurality of capacitor elements spaced apart from one another; one or more heat transfer members provided adjacent to at least one of the plurality of capacitor elements and dispersing heat received from at least one of the plurality of capacitor elements therein; an insulating member that covers the heat transfer member and the plurality of capacitor elements with an end portion of the heat transfer member exposed; The heat transfer member has a first peeling suppression portion provided at least at a position sufficiently close to the exposed end portion on the outer surface covered by the insulating member, and having at least one of a protruding shape and a recessed shape. Capacitor unit. (Appendix 2) The first peeling prevention portion has a recess. 2. A capacitor unit as described in appendix 1. (Appendix 3) The recess is formed by a through hole penetrating the heat transfer member. 2. A capacitor unit as described in appendix 2. (Appendix 4) The recess is formed by a slit. 2. A capacitor unit as described in appendix 2. (Appendix 5) The first peeling prevention portion further includes a protrusion formed at a position adjacent to the recess. 5. A capacitor unit according to any one of appendixes 2 to 4. (Appendix 6) a covering member for covering an outer surface of the heat transfer member with the end of the heat transfer member exposed; the insulating member covers the entirety of the plurality of capacitor elements and the heat transfer member covered with the covering member; 6. A capacitor unit according to any one of appendix 1 to 5. (Appendix 7) a linear expansion coefficient of the covering member is smaller than a linear expansion coefficient of the heat transfer member and larger than a linear expansion coefficient of the insulating member, or is larger than a linear expansion coefficient of the heat transfer member and smaller than a linear expansion coefficient of the insulating member; 7. A capacitor unit as described in appendix 6. (Appendix 8) The heat transfer member has a polygonal shape with rounded corners in a cross section perpendicular to a direction from the exposed end toward a portion covered with the insulating member. 8. A capacitor unit according to any one of appendixes 1 to 7. (Appendix 9) a first terminal and a second terminal exposed from the insulating member; a first conductor electrically connecting the first terminal and a positive electrode of the capacitor element; a second conductor electrically connecting the second terminal and a negative electrode of the capacitor element; 9. A capacitor unit according to any one of appendix 1 to 8. (Appendix 10) At least one of the first conductor and the second conductor has a second peeling suppression portion provided on an outer surface and having at least one of a protruding shape and a recessed shape. 10. A capacitor unit as described in appended claim 9. (Appendix 11) a cooling unit that is thermally connected to the exposed end of the heat transfer member and that dissipates heat transferred from the plurality of capacitor elements via the heat transfer member; 11. A capacitor unit according to any one of appendixes 1 to 10. (Appendix 12) A slit is formed on an outer surface of the insulating member facing the cooling portion. 12. A capacitor unit as described in appended claim 11. (Appendix 13) A capacitor unit according to any one of claims 1 to 12, electronic equipment. (Appendix 14) A capacitor unit according to appendix 11 or 12; a power conversion unit that converts power supplied from a power source via the capacitor unit into power to be supplied to a load, and outputs the converted power; a housing that houses the capacitor unit and the power conversion unit, The cooling unit of the capacitor unit dissipates heat transferred from the plurality of capacitor elements via the one or more heat transfer members to air outside the housing. electronic equipment.

[0103] Various embodiments and modifications of the present disclosure are possible without departing from the broad spirit and scope of the present disclosure. The above-described embodiments are for explaining the present disclosure and do not limit the scope of the present disclosure. That is, the scope of the present disclosure is indicated by the claims, not the embodiments. Various modifications made within the scope of the claims and the scope of the disclosure equivalent thereto are considered to be within the scope of the present disclosure. [Explanation of symbols]

[0104] 1 electronic device, 1a, 1b terminal, 11, 61 capacitor unit, 12 power conversion section, 13 housing, 13a opening, 21a, 21b, 21c, 21d, 31a, 31b, 31c, 31d capacitor element, 22a, 22b, 22c, 32a, 32b, 32c heat transfer member, 23a, 33a first conductor, 23b, 33b second conductor, 24a, 34a first terminal, 24b, 34b second terminal, 25 insulating member, 25a, 53 slit, 26 cooling section, 27 heat receiving block, 27a, 27b main surface, 28 heat sink, 29 TIM, 41a positive electrode, 41b negative electrode, 41c, 41d film, 50 first peeling prevention section, 51, 54, 71 recess, 52 Through hole, 55 protruding portion, 62a, 62b, 62c covering member, 70 second peeling suppression portion, 91 load, 221a, 221b, 221c, 321a, 321b, 321c end portion, C1 first capacitor, C2 second capacitor.

Claims

1. A plurality of capacitor elements spaced apart from one another; one or more heat transfer members provided adjacent to at least one of the plurality of capacitor elements and dispersing heat received from at least one of the plurality of capacitor elements therein; an insulating member that covers the heat transfer member and the plurality of capacitor elements with an end portion of the heat transfer member exposed; The heat transfer member has a first peeling suppression portion provided at a position adjacent to the exposed end portion on the outer surface covered by the insulating member, the first peeling suppression portion having a through hole penetrating the heat transfer member and a convex portion formed at a position adjacent to the through hole and farther from the end portion than the through hole. Capacitor unit.

2. a covering member for covering an outer surface of the heat transfer member with the end of the heat transfer member exposed; the insulating member covers the entirety of the plurality of capacitor elements and the heat transfer member covered with the covering member; The capacitor unit according to claim 1 .

3. a linear expansion coefficient of the covering member is smaller than a linear expansion coefficient of the heat transfer member and larger than a linear expansion coefficient of the insulating member, or is larger than a linear expansion coefficient of the heat transfer member and smaller than a linear expansion coefficient of the insulating member; The capacitor unit according to claim 2 .

4. The heat transfer member has a polygonal shape with rounded corners in a cross section perpendicular to a direction from the exposed end toward a portion covered with the insulating member. The capacitor unit according to claim 1 .

5. a first terminal and a second terminal provided so as to be exposed from the insulating member; a first conductor electrically connecting the first terminal and a positive electrode of the capacitor element; a second conductor electrically connecting the second terminal and a negative electrode of the capacitor element; The capacitor unit according to claim 1 .

6. At least one of the first conductor and the second conductor has a second separation suppression portion provided on an outer surface and having at least one of a protruding shape and a recessed shape. The capacitor unit according to claim 5 .

7. a cooling unit that is thermally connected to the exposed end of the heat transfer member and that dissipates heat transferred from the plurality of capacitor elements via the heat transfer member; The capacitor unit according to claim 1 .

8. A slit is formed on an outer surface of the insulating member facing the cooling portion. The capacitor unit according to claim 7.

9. A capacitor unit comprising the capacitor unit according to any one of claims 1 to 3. electronic equipment.

10. A capacitor unit according to claim 7; a power conversion unit that converts power supplied from a power source via the capacitor unit into power to be supplied to a load, and outputs the converted power; a housing that houses the capacitor unit and the power conversion unit, the cooling unit of the capacitor unit dissipates heat transferred from the plurality of capacitor elements via the one or more heat transfer members to air outside the housing; electronic equipment.

Images