Processing information server, processing information providing method, program, and laser processing system

Abstract

To provide a machining information server, a machining information provision method, a program, and a laser machining system that can provide a customer with more appropriate machining parameters.SOLUTION: A machining information server comprises, for example: a specification information acquisition unit for acquiring request information including specification information indicating specifications of a machining object or machining portions for laser machining from a requester; a retrieval unit for retrieving from among specification information stored in a storage unit in association with actual information of laser machining; and information provision unit for providing the requester with response information based on the actual information that corresponds to the matching or similar specification information. The storage unit stores operation information indicating an operation state of the laser machining device as the actual information. The information provision unit provides the response information including control information of the laser machining device based on the operation information.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a processing information server, a processing information providing method, a program, and a laser processing system. [Background technology]

[0002] 2. Description of the Related Art Conventionally, laser processing devices have been known that perform processing such as welding and laser cutting by irradiating a processing object with laser light (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-44574 A Summary of the Invention [Problem to be solved by the invention]

[0004] When performing laser processing on a new processing object or processing area using this type of conventional laser processing device, if it was unclear how to set various processing parameters of the laser processing device, such as the laser light power, beam diameter, sweep speed, etc., for example, the processing parameters were changed to process multiple samples, and the processing parameters were determined based on the quality of the processing results of the samples.

[0005] However, such trial and error can be time-consuming and costly, and due to time or cost constraints, it can be difficult for a customer who owns a laser processing device to obtain appropriate processing parameters.

[0006] Therefore, an object of the present invention is to provide a processing information server, a processing information providing method, a program, and a laser processing system that can provide more appropriate processing parameters to a customer. [Means for solving the problem]

[0007] The processing information server of the present invention includes, for example, a specification information acquisition unit that acquires request information including specification information indicating the specifications of the object to be processed or the processing area to be processed from a requester, a search unit that searches for specification information that matches or is similar to the specification information acquired by the specification information acquisition unit from the specification information stored in a memory unit in correspondence with performance information of laser processing, and an information provision unit that provides the requester with answer information based on the performance information corresponding to the matching or similar specification information, wherein the memory unit stores operation information indicating the operating state of a laser processing apparatus as the performance information, and the information provision unit provides the answer information including control information of the laser processing apparatus based on the operation information.

[0008] In the processing information server, for example, the storage unit stores an image of the object to be processed or a processed portion as the performance information, and the information providing unit provides the response information including the image.

[0009] The processing information server includes a remote control unit that remotely controls a laser processing device to perform laser processing on the object to be processed or a sample of the processed portion based on the performance information.

[0010] In the processing information providing method of the present invention, for example, a computer acquires request information including specification information indicating the specifications of the object to be processed or the processing portion to be processed by laser processing from a requester, searches for specification information similar to the acquired specification information from the specification information stored in a memory unit in correspondence with performance information of laser processing, and provides answer information based on the performance information corresponding to the similar specification information to the requester, where operation information indicating the operating state of the laser processing device is stored in the memory unit as the performance information, and the answer information includes control information of the laser processing device based on the operation information.

[0011] The program of the present invention is a program that causes a computer to function, for example, as a specification information acquisition unit that acquires request information including specification information indicating the specifications of the object to be laser processed or the processing area from a requester, a search unit that searches for specification information similar to the specification information acquired by the specification information acquisition unit from the specification information stored in a memory unit in correspondence with performance information of laser processing, and an information provision unit that provides answer information based on the performance information corresponding to the similar specification information to the requester, wherein the memory unit stores operation information indicating the operating state of a laser processing apparatus as the performance information, and the information provision unit provides the answer information including control information of the laser processing apparatus based on the operation information.

[0012] The laser processing system of the present invention includes the processing information server, a laser processing device, and a control unit that controls the laser processing device based on information provided by the processing information server. Effect of the Invention

[0013] According to the present invention, it is possible to provide more appropriate processing parameters to a customer. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is an exemplary schematic configuration diagram of a processing information providing system according to the first embodiment. [Diagram 2] FIG. 2 is an exemplary schematic configuration diagram of the laser processing apparatus according to the first embodiment. [Diagram 3] FIG. 3 is an exemplary block diagram of the laser processing apparatus according to the first embodiment. [Figure 4] FIG. 4 is a schematic diagram showing an example of a laser light beam (spot) formed on the surface of an object to be processed by the laser processing apparatus of the first embodiment. [Diagram 5] FIG. 5 is a graph showing the light absorptance of each metal material versus the wavelength of the irradiated laser light. [Figure 6]FIG. 6 is an explanatory diagram showing the concept of the principle of the diffractive optical element included in the laser processing apparatus of the first embodiment. [Figure 7] FIG. 7 is a block diagram of the processing information server according to the first embodiment. [Figure 8] FIG. 8 is a flowchart illustrating an example of a processing procedure by the processing information server according to the first embodiment. [Figure 9] FIG. 9 is an exemplary schematic configuration diagram of the laser processing device according to the second embodiment. [Figure 10] FIG. 10 is a schematic diagram showing an example of a laser light beam (spot) formed on the surface of the processing object by the laser processing apparatus of the second embodiment. [Figure 11] FIG. 11 is a schematic diagram showing an example of a laser light beam (spot) formed on the surface of an object to be processed by the laser processing apparatus of the second embodiment. [Figure 12] FIG. 12 is an exemplary schematic configuration diagram of a laser processing apparatus according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Exemplary embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, and the actions and results (effects) brought about by the configurations are merely examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0016] The embodiments described below have similar configurations. Therefore, according to the configurations of the respective embodiments, similar actions and effects based on the similar configurations can be obtained. In addition, in the following, the similar configurations are given the same reference numerals, and duplicated descriptions may be omitted.

[0017] In each drawing, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X direction, the Y direction, and the Z direction intersect with each other and are perpendicular to each other. The Z direction is the normal direction of the surface Wa (machining surface) of the processing object W.

[0018] In addition, in this specification, ordinal numbers are given for the sake of convenience to distinguish between parts, members, parts, laser beams, directions, etc., and do not indicate priority or order.

[0019] [First embodiment] [Processing information system] Fig. 1 is a configuration diagram of a processing information providing system 1. As shown in Fig. 1, the processing information providing system 1 includes a processing information server 10, a client terminal 20, laser processing apparatuses 100-1 and 100-2 (100), and a simulator 40.

[0020] The processing information server 10 is a computer, and provides response information in response to request information from the client terminal 20. The request information includes specification information. The specification information includes, for example, information indicating the required specifications for laser processing, and information indicating the specifications of the object to be processed or the part to be processed by laser processing. The request information may also include information indicating a client ID, a response deadline, a form of response, future plans, and the like. The response information includes performance information based on past processing results, and proposal information based on the performance information. The specification information and response information (performance information, proposal information) will be described later.

[0021] The client terminal 20 can transmit request information to the processing information server 10 and can receive response information from the processing information server 10 in response to the request information. That is, the client can use the processing information providing system 1 via the client terminal 20. The client terminal 20 is, for example, an electronic device such as a personal computer, a smartphone, or a tablet.

[0022] The laser processing device 100 performs laser processing by irradiating a processing object or a processing site with laser light. In this embodiment, the laser processing device 100-1 is available for use by a client (orderer), and the laser processing device 100-2 is available for use by an operator (orderee) of the processing information server 10. The laser processing device 100-1 and the laser processing device 100-2 may be the same model or different models. In addition, it is preferable that the laser processing device 100-2 can perform all of the laser processing that can be performed by the laser processing device 100-1.

[0023] The simulator 40 is a computer, and performs a simulation of laser processing of an object or a processing part by the laser processing device 100. The simulation is, for example, a numerical simulation. The simulator 40 performs calculations to simulate physical phenomena caused by laser processing under given processing conditions, such as the material of the object or the processing part, the power of the laser light, the beam diameter (spot diameter) of the laser light, and the sweep speed of the laser light on the object or the processing part, and can calculate values ​​indicating the surface or internal state of the object or the processing part obtained by the laser processing, or can visualize them typically.

[0024] The processing information server 10 and the client terminal 20 can communicate data indicating various information in accordance with a predetermined communication protocol via a communication network 30 including a wired or wireless communication line. The communication network 30 is also called an electric communication line or a computer network, and can take various forms.

[0025] The processing information server 10, the simulator 40, and the laser processing device 100-2 can directly communicate data indicating various information between each other without going through the communication network 30. However, this is not limited thereto, and the processing information server 10, the simulator 40, and the laser processing device 100-2 may communicate data indicating various information between each other via the communication network 30.

[0026] Moreover, the laser processing apparatus 100-1 can communicate data indicating various information with the processing information server 10 via the communication network 30. Moreover, the laser processing apparatus 100-1 can communicate data indicating various information directly with the client terminal 20 without going through the communication network 30. However, this is not limited thereto, and the laser processing apparatus 100-1 may communicate data indicating various information with the client terminal 20 via the communication network 30.

[0027] [Laser processing equipment] Fig. 2 is a schematic configuration diagram of the laser processing apparatus 100. As shown in Fig. 2, the laser processing apparatus 100 includes a laser device 111, a laser device 112, an optical head 120, and an optical fiber .

[0028] The laser devices 111 and 112 each have a laser oscillator and are configured to output laser light with a power of several kW, for example. The laser devices 111 and 112 may also have multiple semiconductor laser elements therein and be configured to output multimode laser light with a power of several kW as the total output of the multiple semiconductor laser elements. The laser devices 111 and 112 may also have various laser light sources such as a fiber laser, a YAG laser, and a disk laser.

[0029] The laser device 111 outputs a first laser light having a wavelength of 800 nm or more and 1200 nm or less. The laser device 111 is an example of a first laser device. The laser oscillator of the laser device 111 is an example of a first laser oscillator.

[0030] On the other hand, the laser device 112 outputs a second laser light having a wavelength of 570 [nm] or less. The laser device 112 is an example of a second laser device. The laser device 112 preferably outputs a second laser light having a wavelength of 400 [nm] or more and 570 [nm] or less. The laser oscillator of the laser device 112 is an example of a second laser oscillator.

[0031] The optical fibers 130 guide the laser beams output from the laser devices 111 and 112 to the optical head 120 .

[0032] The optical head 120 is an optical device for irradiating the laser light input from the laser devices 111 and 112 toward the workpiece W. The optical head 120 has a collimator lens 121, a condenser lens 122, a mirror 123, and a filter 124. The collimator lens 121, the condenser lens 122, the mirror 123, and the filter 124 may also be referred to as optical components.

[0033] The optical head 120 is configured to be able to change its position relative to the object W in order to sweep the laser light L while irradiating the laser light L on the surface Wa of the object W. The relative movement between the optical head 120 and the object W can be achieved by moving the optical head 120, moving the object W, or moving both the optical head 120 and the object W.

[0034] The optical head 120 may be configured to have a galvano scanner (not shown) or the like so as to be capable of sweeping the laser light L over the surface Wa.

[0035] The collimating lenses 121 (121-1, 121-2) each collimate the laser light input via the optical fiber 130. The collimated laser light becomes parallel light.

[0036] The mirror 123 reflects the first laser light that has been collimated by the collimator lens 121-1. The first laser light reflected by the mirror 123 travels in the opposite Z direction toward the filter 124. Note that in a configuration in which the first laser light is input to the optical head 120 so as to travel in the opposite Z direction, the mirror 123 is not necessary.

[0037] Filter 124 is a high-pass filter that transmits the first laser light and reflects but does not transmit the second laser light. The first laser light passes through filter 124 and travels in the opposite Z direction toward condenser lens 122. On the other hand, filter 124 reflects the second laser light that has been collimated by collimator lens 121-2. The second laser light reflected by filter 124 travels in the opposite Z direction toward condenser lens 122.

[0038] The condenser lens 122 condenses the first laser light and the second laser light as parallel light, and irradiates the object W to be processed with the condensed light as laser light L (output light).

[0039] The laser processing apparatus 100 also has a controller 141 and a controlled mechanism 145 whose operation is controlled by the controller 141. In this embodiment, the laser processing apparatus 100 has, as the controlled mechanism 145, for example, laser devices 111 and 112, a driving mechanism 150, and a gas supply mechanism 160.

[0040] The controller 141 can control, for example, switching between operation and non-operation of the laser devices 111 and 112, the power of the laser light emitted by the laser devices 111 and 112, and the like.

[0041] The driving mechanism 150 changes the relative position of the optical head 120 with respect to the workpiece W. The driving mechanism 150 has, for example, a rotation mechanism such as a motor, a speed reduction mechanism that reduces the rotation output of the rotation mechanism, a motion conversion mechanism that converts the rotation reduced by the speed reduction mechanism into linear motion, etc. The controller 141 can control the driving mechanism 150 so that the relative position of the optical head 120 with respect to the workpiece W in the X direction, Y direction, and Z direction changes.

[0042] The gas supply mechanism 160 supplies the gas G into the optical head 120 through the piping 161. The gas G supplied inside is discharged from the laser light L emission port of the optical head 120 toward the surface Wa of the workpiece W. The gas G is sprayed toward the surface Wa of the workpiece W. The gas G is, for example, air, oxygen, nitrogen, argon, helium, or a selective mixture of these. The gas G may be sprayed toward the workpiece W from a gas nozzle (not shown) provided separately from the optical head 120. If the molten metal can be blown away by increasing the discharge pressure or flow rate of various gases when the melted part of the workpiece W molten by the laser irradiation is in a liquid phase state, it becomes a cutting process, and if the gas flow rate is controlled to an extent that the melted part of the workpiece W is not blown away, it becomes a welding process. In the cutting process, it is preferable to use air, nitrogen, oxygen, or a mixture of them as the gas G. In this case, air or nitrogen is used as a kinetic energy source for blowing away the molten metal, and oxygen is used to promote a combustion reaction, especially for iron. In addition, in welding, since oxygen can cause defects due to the generation of oxides, it is preferable to use nitrogen, argon, or helium. If some oxidation is acceptable, air may be used in the hope of blowing away plasma and fumes. The controller 141 can, for example, switch between operating and stopping the gas supply mechanism 160 and control the flow rate of the discharged gas.

[0043] The laser processing apparatus 100 also has a camera 170, and a filter 127 and a mirror 128 as optical components that guide light to the camera 170. The filter 127 is provided between the mirror 123 and the filter 124. The filter 127 transmits the first laser light from the mirror 123 toward the filter 124, and reflects light (e.g., visible light) from the surface Wa toward the mirror 128. The light reflected by the mirror 128 is input to the camera 170. With this configuration, the camera 170 can capture an image on the surface Wa. The image captured by the camera 170 may include, for example, an image of the surface Wa and an image of the beam (spot) of the laser light L. Therefore, the image captured by the camera 170 can be said to be a detection result of a deviation of the spot formed on the surface Wa from a predetermined position, and the camera 170 can be said to be an example of the sensor 146 that detects the deviation. In addition, when the position of the spot in the angle of view of the captured image is fixed, the captured image only needs to include the irradiation target of the laser light L, and does not need to include an image of the spot.

[0044] Moreover, the controller 141 can detect the deviation of the spot from a predetermined position from the image captured by the camera 170, and control the driving mechanism 150 to correct the deviation. The controller 141 may also execute feedback control so that the deviation falls within a predetermined threshold. The controller 141 and the driving mechanism 150 are an example of a correction mechanism. With such a configuration, the accuracy of the irradiation position of the laser light can be improved.

[0045] 3 is a block diagram of the control mechanism 140 of the laser processing apparatus 100. The control mechanism 140 has, for example, a controller 141, a storage unit 142, a communication unit 143, an input / output unit 144, a controlled mechanism 145, a sensor 146, and a code reader 147.

[0046] The communication unit 143 communicates data with other devices capable of communicating with the laser processing apparatus 10, such as the processing information server 10 and the client terminal 20. The input / output unit 144 includes input devices such as a keyboard, a mouse, and a touch panel, and output devices such as a display and a speaker. The input / output unit 144 is a user interface for an operator of the laser processing apparatus 100.

[0047] The sensor 146 is a sensor that detects various physical quantities related to the operation of each part of the laser processing apparatus 100 and the installation environment of the laser processing apparatus 100. The detected values ​​by the sensor 146 are input to the controller 141. The controller 141 can execute control of each part based on the detected values ​​of the sensor 146.

[0048] The code reader 147 reads a display code such as a one-dimensional code or a two-dimensional code.

[0049] The controller 141 is a computer and has a processor (circuit) such as a CPU (central processing unit) and a main storage unit such as a RAM (random access memory) and a ROM (read only memory). The controller 141 is, for example, an MCU (micro controller unit). The storage unit 142 has a non-volatile storage device such as an SSD (solid state drive) or an HDD (hard disk drive). The storage unit 142 may also be referred to as an auxiliary storage device.

[0050] The processor operates as a communication control unit 141a, an input / output control unit 141b, a reading control unit 141c, an imaging control unit 141d, and an operation control unit 141e by reading out a program stored in a ROM or a storage unit 142 and executing each process. The programs may be provided in a computer-readable recording medium in an installable or executable format. The recording medium may also be called a program product. Values, tables, maps, and other information used in the arithmetic processing by the program and the processor may be stored in the ROM or the storage unit 142 in advance, or may be stored in a storage unit of a computer connected to a communication network and downloaded to the storage unit 142 via the communication network. The storage unit 142 stores data written by the processor. The arithmetic processing by the controller 141 may be performed at least partially by hardware. In this case, the controller 141 may include, for example, an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit).

[0051] The communication control unit 141a controls the communication unit 143 to transmit and receive data. The input / output control unit 141b controls the input / output unit 144 to input and output data. The reading control unit 141c controls the code reader 147 to read the display code. The photography control unit 141d controls the operation of the camera 170. In addition, the operation control unit 141e controls the operation of the controlled mechanism 145.

[0052] Furthermore, the controller 141 can write the detected values ​​and calculated values ​​to the storage unit 142. In other words, the storage unit 142 can store the detected values ​​by the sensor 146 and the calculated values ​​based on the detected values.

[0053] As described above, the laser processing apparatus 100 has the laser device 111 and the laser device 112. The controller 141 can switch between a state in which the optical head 120 irradiates only the first laser light from the laser device 111, a state in which the optical head 120 irradiates only the second laser light from the laser device 112, and a state in which the optical head 120 irradiates both the first laser light and the second laser light. Laser processing by irradiating the first laser light and the second laser light in parallel may also be referred to as hybrid laser processing.

[0054] [Example of beam in hybrid laser processing] FIG. 4 is a schematic diagram showing an example of a beam (spot) of laser light L including a first laser light and a second laser light irradiated onto a surface Wa of a processing object W. Each of beams B1 and B2 has, for example, a Gaussian-shaped power distribution in the radial direction of a cross section perpendicular to the optical axis direction of the beam. However, the power distribution of beams B1 and B2 is not limited to a Gaussian shape. In addition, in each diagram in which each beam B1, B2 is represented by a circle as in FIG. 4, the diameter of the circle representing the beams B1, B2 is the beam diameter of each beam B1, B2. The beam diameter of each beam B1, B2 includes the peak of the beam and is 1 / e of the peak intensity. 2 In the case of a non-circular beam (not shown), the diameter of the region with an intensity of 1 / e of the peak intensity in the direction perpendicular to the sweep direction SD is defined as the diameter of the region with an intensity of 1 / e 2 The length of the region where the intensity is equal to or greater than this can be defined as the beam diameter. The beam diameter on the surface Wa is called the spot diameter.

[0055] In the example of Fig. 4, the beam of laser light L is formed such that a beam B1 of the first laser light and a beam B2 of the second laser light overlap on the surface Wa, the beam B2 is larger (wider) than the beam B1, and the outer edge B2a of the beam B2 surrounds the outer edge B1a of the beam B1. In this case, the spot diameter D2 of the beam B2 is larger than the spot diameter D1 of the beam B1. On the surface Wa, the beam B1 is an example of a first spot, and the beam B2 is an example of a second spot.

[0056] 4, the beam (spot) of the laser light L on the surface Wa has a point-symmetric shape with respect to the center point C, so the shape of the spot is the same for any sweep direction SD. Therefore, in this case, the movement mechanism that relatively moves the optical head 120 and the workpiece W to sweep the laser light L on the surface Wa only needs to have at least a mechanism capable of relatively translating, and a mechanism capable of relatively rotating is not necessary.

[0057] The workpiece W may be made of a metal material. The metal material may be, for example, a copper-based metal material, an aluminum-based metal material, a nickel-based metal material, an iron-based metal material, a titanium-based metal material, a nickel-plated metal material, or the like, specifically, copper, a copper alloy, aluminum, an aluminum alloy, tin, nickel, a nickel alloy, iron, stainless steel, titanium, a titanium alloy, nickel-plated copper, a nickel-plated copper alloy, nickel-plated aluminum, a nickel-plated aluminum alloy, or the like.

[0058] [Wavelength and light absorption rate] Here, the light absorptance of metal materials will be explained. Fig. 5 is a graph showing the light absorptance of each metal material versus the wavelength of the irradiated laser light L. The horizontal axis of the graph in Fig. 5 is the wavelength, and the vertical axis is the absorptance. Fig. 5 shows the relationship between wavelength and absorptance for aluminum (Al), copper (Cu), gold (Au), nickel (Ni), silver (Ag), tantalum (Ta), and titanium (Ti).

[0059] Although the characteristics differ depending on the material, it can be seen that for each metal shown in Figure 5, the energy absorption rate is higher when using blue or green laser light (second laser light) than when using general infrared (IR) laser light (first laser light). This characteristic is prominent in copper (Cu), gold (Au), etc.

[0060] When a laser beam is irradiated onto a workpiece W, which has a relatively low absorption rate for the wavelength used, most of the light energy is reflected and does not affect the workpiece W as heat. Therefore, a relatively high power must be applied to obtain a melted region of sufficient depth. In this case, the center of the beam is suddenly energized, causing sublimation and forming a keyhole.

[0061] On the other hand, when a laser beam is irradiated onto a workpiece W having a relatively high absorptivity for the wavelength used, most of the input energy is absorbed by the workpiece W and converted into thermal energy. In other words, since there is no need to apply excessive power, no keyhole is formed and melting occurs by thermal conduction.

[0062] Therefore, in the laser processing apparatus 100, as an example, the wavelength of the first laser light, the wavelength of the second laser light, and the material of the object W to be processed are selected so that the absorptance of the second laser light in the object W to be processed is higher than the absorptance of the first laser light. In the example of Fig. 4, by sweeping the spot of the laser light L in the sweep direction SD, the part to be processed of the object W (hereinafter referred to as the part to be processed) is first irradiated with the second laser light by the region B2f located in front of the beam B2 of the second laser light in the sweep direction SD. Then, the part to be processed is irradiated with the beam B1 of the first laser light, and then the second laser light is irradiated again by the region B2b located behind the beam B2 of the second laser light in the sweep direction SD.

[0063] Therefore, a thermally conductive molten region is first generated in the processed portion by irradiation of the second laser light having a high absorptivity in the region B2f. Then, a deeper keyhole-shaped molten region is generated in the processed portion by irradiation of the first laser light. In this case, since a thermally conductive molten region is already formed in the processed portion, a molten region of a required depth can be formed by a first laser light having a lower power than when the thermally conductive molten region is not formed. Then, the molten state of the processed portion is changed by irradiation of the second laser light having a high absorptivity in the region B2b.

[0064] In addition, the inventors' experimental research has confirmed that defects such as sputtering and blowholes can be reduced in processing by irradiation with the laser light L of the beam as shown in Fig. 4. This is presumably because the molten pool of the workpiece W formed by the beam B2 and the beam B1 becomes more stable by preheating the workpiece W by the region B2f of the beam B2 before the arrival of the beam B1. Hybrid laser processing provides such advantages.

[0065] [DOE] 2, the optical head 120 has a DOE 125 (diffractive optical element) between the collimator lens 121-1 and the mirror 123. The DOE 125 shapes the shape of the beam B1 of the first laser light (hereinafter referred to as the beam shape).

[0066] FIG. 6 is an explanatory diagram showing the concept of the principle of the DOE 125. As conceptually illustrated in FIG. 6, the DOE 125 has a configuration in which, for example, a plurality of diffraction gratings 125a with different periods are superimposed. The DOE 125 can shape the beam shape by bending the parallel light in a direction influenced by each diffraction grating 125a or by superimposing the parallel light. The DOE 125 can also be called a beam shaper. The optical head 120 may have a beam shaper provided after the collimator lens 121-2 to adjust the beam shape of the second laser light, a beam shaper provided after the filter 124 to adjust the beam shapes of the first laser light and the second laser light, or the like. By appropriately adjusting the beam shape of the laser light L by the beam shaper, for example, effects such as improving the processing accuracy and suppressing processing defects can be obtained.

[0067] [Processing method] In laser processing using the laser processing device 100, first, the workpiece W is set so that the laser light L is irradiated onto the surface Wa. Then, while the laser light L including the beam B1 and the beam B2 is irradiated onto the surface Wa, the laser light L and the workpiece W are moved relatively to each other. As a result, the laser light L moves (sweeps) on the surface Wa in the sweep direction SD while being irradiated onto the surface Wa. As a result, the part irradiated with the laser light L is subjected to laser processing such as welding, laser cutting, and surface treatment.

[0068] [Processing information server] 7 is a block diagram of the processing information server 10. The processing information server 10 includes a controller 11, a storage unit 12, a communication unit 13, and an input / output unit 14.

[0069] The communication unit 13 communicates data with other devices with which it can communicate, such as the client terminal 20, the laser processing device 100, and the simulator 40. The input / output unit 14 includes input devices such as a keyboard, a mouse, and a touch panel, and output devices such as a display and a speaker. The input / output unit 14 is a user interface for the operator of the processing information server 10.

[0070] The controller 11 is a computer and has a processor (circuit) such as a CPU (central processing unit) and a main memory such as a RAM (random access memory) and a ROM (read only memory). The controller 11 is, for example, an MCU (micro controller unit). The memory unit 12 has a non-volatile memory device such as an SSD (solid state drive) or an HDD (hard disk drive). The memory unit 12 can also be called an auxiliary memory device.

[0071] The processor operates as a communication control unit 11a, an input / output control unit 11b, a similar processing search unit 11c, a remote control unit 11d, a trial request processing unit 11e, and an information storage unit 11f by reading out a program stored in a ROM or a storage unit 12 and executing each process. The programs may be provided in a computer-readable recording medium in an installable or executable format. The recording medium may also be called a program product. Values, tables, maps, and other information used in the arithmetic processing by the program and the processor may be stored in the ROM or the storage unit 12 in advance, or may be stored in a storage unit of a computer connected to a communication network and downloaded to the storage unit 12 via the communication network. The storage unit 12 stores data written by the processor. The arithmetic processing by the controller 11 may be performed at least partially by hardware. In this case, the controller 11 may include, for example, an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit). The operations of the communication control unit 11a, the similar processing search unit 11c, the remote control unit 11d, the trial request processing unit 11e, and the information storage unit 11f will be described later. The controller 11 also includes a processing execution unit other than the communication control unit 11a, the input / output control unit 11b, the similar processing search unit 11c, the remote control unit 11d, the trial request processing unit 11e, and the information storage unit 11f.

[0072] The communication control unit 11a controls the communication unit 13 to transmit and receive data. The input / output control unit 11b controls the input / output unit 14 to input and output data. The processes of the similar processing search unit 11c, the remote control unit 11d, the trial request processing unit 11e, and the information storage unit 11f will be described later.

[0073] In the storage unit 12, various information is stored as a processing information database 12a in association with each other. Tables 1 and 2 show an example of the processing information database 12a. As shown in Tables 1 and 2, in the processing information database 12a, specification information (Table 1) indicating the specifications of the laser processing, operation information (Table 2) of the laser processing device 100, images obtained in the processing results, and other information are stored in association with a processing ID for each processing result. The specification information, operation information, and images are information indicating the processing results and are examples of performance information. In addition, like an image, the processing information database 12a may include an ID (e.g., an image ID), and the information itself (e.g., image data) may be stored in a separate storage location. In this case, the processing information database 12a may also include the separate storage location. [Table 1]

[0074] As shown in Table 1, the specification information includes, for example, specification information of the workpiece W, specification information of the machining portion, machining results, or characteristics of the workpiece. All specification information is quantified and stored. The value (numerical value) of the specification information may be made dimensionless as appropriate.

[0075] Examples of the specification information of the workpiece W include information (SA1, ..., SB1, ...) indicating the material of the members constituting the workpiece W, and information (SD11, ..., SD21, ...) indicating the dimensions of each part of the workpiece W and the members. The dimensions are, for example, the size and thickness of each member. The specification information of the workpiece W may also include whether or not the surface Wa of the workpiece W has been finished, the type of the finishing treatment, whether or not the surface Wa has been plated, the type of the plating, whether or not each member has been heat treated, the type of the heat treatment, the surface roughness of the surface Wa, the processing state of the end faces, the connection posture of the members in the case of welding (layers, the number of layers, intersections, the angle of the intersections), etc.

[0076] Examples of the specification information of the processed part include information indicating the type of processing (SE11, ...), information indicating the position of the processed part (SE21, ...), and information indicating the width of the processed part (SE31, ...). The processed part is a bead in the case of welding, an end face in the case of laser cutting, and the surface in the case of surface treatment. Examples of the type of the processed part are lap welding, butt welding, lap fillet welding, spot welding, laser cutting, surface treatment, and the like. The position of the processed part is, for example, a distance from an end of a member, a distance from another processed part, and the like. In addition, the specification information of the processed part may include the length of the processed part, the welding depth in the case of welding, the depth direction (irradiation direction of laser light L) relative to the surface Wa of the welded part (welded metal) in the case of welding, and the surface roughness of the processed end face in the case of laser cutting.

[0077] Examples of the characteristics of the processing result or the workpiece include the number of spatters (SE41, ...) and tensile strength (SE51, ...). The characteristics may include mechanical characteristics other than tensile strength, optical characteristics, thermal characteristics, electrical characteristics, magnetic characteristics, physical properties, inspection indicators, etc. Note that the specification information is not limited to those described above. [Table 2]

[0078] As shown in Table 2, the operation information is information indicating the operation state such as the setting value and control value of each part of the laser processing apparatus 100, and includes optical parameters, sweep parameters, gas parameters, etc. The operation information may also be referred to as operation parameters. The optical parameters, sweep parameters, and gas parameters each include a plurality of parameters (CA11, ..., CB11, ..., CC11, ...). Examples of the optical parameters include whether or not each of the laser devices 111, 112 is used, the output of each of the laser devices 111, 112, the beam diameter of each laser light, the pulse frequency of each laser light, the pulse width (duty ratio) of each laser light, the irradiation angle of each laser light to the surface Wa, the presence or absence of a DOE, and the value of a parameter related to the DOE. Examples of the sweep parameters include a sweep direction, a sweep speed, the presence or absence of wobbling, the value of a parameter related to the wobbling, the presence or absence of weaving, and the value of a parameter related to the weaving. Examples of gas parameters include the presence or absence of gas, the type of gas, the gas flow rate, the gas discharge angle with respect to the surface Wa, and parameter values ​​related to the gas nozzle. Note that the operation information is not limited to the above. In addition, the operation information may or may not include control data for the controlled mechanism 145.

[0079] The image is an image of the processing result of the processing object W or the processed product photographed by a camera, an electron microscope, or the like, and is an image that helps to identify the type, state, quality, etc. of the laser processing and to judge whether it is acceptable or not. Examples of such images include an image of the surface Wa including the processed part of the processing object W, a cross-sectional image of a welded part, an image of a cut surface by laser cutting, an image of the surface Wa that has been subjected to surface treatment by laser processing, etc. Note that the images are not limited to those described above.

[0080] [Processing information server processing procedure] Fig. 8 is a flowchart showing an example of a processing procedure by the processing information server 10. As shown in Fig. 8, first, the controller 11 functions as a communication control unit 11a and receives request information from the client terminal 20 through the communication unit 13 (S1). In S1, the request information includes specification information of the laser processing that the client is going to try using the laser processing device 100-1. The communication control unit 11a is an example of a specification information acquisition unit.

[0081] Next, the controller 11 functions as a similar processing search unit 11c and searches the processing information database 12a to search for processing results similar to the laser processing indicated by the request information (S2). In S2, the similar processing search unit 11c judges the similarity of the laser processing based on the specification information. In other words, the similar processing search unit 11c searches for specification information similar to the specification information included in the request information (hereinafter referred to as the first specification information) from among a plurality of specification information (hereinafter referred to as the second specification information) for each processing ID stored in the processing information database 12a. Specifically, the similar processing search unit 11c calculates the similarity between, for example, a vector (hereinafter referred to as the first vector) based on each parameter included in the first specification information and a vector (hereinafter referred to as the second vector) based on each parameter included in each of the plurality of second specification information. Here, the parameters based on the first vector and the second vector are parameters included in the first vector and are appropriately selected from parameters included in the second vector that are greater than a predetermined ratio. The vectorization method may be a bag of words or a distributed representation using a neural network (e.g., Word2Vec). The similarity may be, for example, a cosine similarity or a Euclidean distance. The closer the cosine similarity is to 1, the higher the similarity, and the closer the Euclidean distance is to 0, the higher the similarity. When the similar processing search unit 11c finds a second vector having a similarity equal to or higher than a predetermined threshold and having the highest similarity to the first vector among the plurality of second vectors, the similar processing search unit 11c determines the specification information of the processing ID corresponding to the second vector as specification information similar to the specification information included in the request information. In other words, the similar processing search unit 11c determines the processing record of the processing ID corresponding to the second vector having a similarity equal to or higher than a threshold and having the highest similarity to the first vector among the plurality of second vectors as a processing record similar to the laser processing indicated by the request information (hereinafter referred to as similar processing). Here, having a similarity equal to or higher than a predetermined threshold indicates, for example, that the cosine similarity is equal to or higher than a predetermined threshold, or that the Euclidean distance is equal to or lower than a predetermined threshold.Furthermore, the processing results to be searched for may be narrowed down by the type of processed portion, the model of the laser processing device 100, the client ID, etc. The similar processing search unit 11c is an example of a search unit.

[0082] Next, in S2, if the processing information database 12a contains a similar process to the laser processing indicated by the request information (Yes in S3), the controller 11 further checks whether the processing information database 12a contains an image corresponding to the similar process, i.e., an image of the processing object W or the processing area (S4).

[0083] If there is an image in S4 (Yes in S4), the controller 11 functions as the communication control unit 11a and controls the communication unit 13 to transmit, i.e., provide, answer information including the image to the client terminal 20 (S5). The communication control unit 11a is also an example of an information providing unit.

[0084] If there is no image in S4 (No in S4), the controller 11 judges whether or not to process the sample with the laser processing device 100-1 available to the client (S6). In S6, the controller 11 can judge to process the sample with the laser processing device 100-1, for example, when the request information contains information indicating that the client wishes to create a sample with the laser processing device 100-1 and the laser processing device 100-1 has the capability to operate in the operating state indicated in the operating information corresponding to the similar processing.

[0085] When the sample is to be processed by the laser processing apparatus 100-1 (Yes in S6), the controller 11 determines whether or not to process the sample by remotely operating the laser processing apparatus 100-1 (S7). In S7, for example, when the request information includes information indicating that the client wishes to process the sample by remotely operating the laser processing apparatus 100-1, the controller 11 can determine that the sample is to be remotely processed by the laser processing apparatus 100-1.

[0086] If the answer is Yes in S7, the controller 11 functions as the remote control unit 11d and controls the laser processing device 100-1 corresponding to the client so as to process the sample according to the request information from the client. As a result, the sample is remotely processed (S8). In S8, it is assumed that the laser processing device 100-1 is set in advance to a state in which the processing object W can be processed. The remote control unit 11d calculates operation information (hereinafter, this is referred to as third operation information) of the laser processing device 100-1 corresponding to the first specification information (i.e., the specification information included in the request information) by, for example, interpolation or extrapolation based on the operation information of the processing ID determined to be similar processing in S3. Then, the remote control unit 11d remotely controls the laser processing device 100-1 while transmitting and receiving control data and detection data to and from the laser processing device 100-1 via the communication control unit 11a and the communication unit 13 so as to realize the operation according to the third operation information. The remote control unit 11d is an example of a control unit, and the processing information providing system 1 is an example of a laser processing system.

[0087] If the answer is No in S7, that is, if the client processes a sample using the laser processing apparatus 100-1, the controller 11 calculates third operation information and, if necessary, calculates control data for realizing the operation of the laser processing apparatus 100-1 based on the third operation information. The control data is, for example, control data for the controlled mechanism 145. Then, the communication control unit 11a controls the communication unit 13 to transmit the third operation information or the control data to the client terminal 20 or the laser processing apparatus 100-1 (S9). The third operation information or the control data is an example of control information and an example of response information.

[0088] In S9, the communication control unit 11a and the communication unit 13 can transmit the control information to the laser processing apparatus 100-1. In this case, the communication control unit 11a and the communication unit 13 may notify the client terminal 20 by e-mail or the like that the control information will be transmitted to the laser processing apparatus 100-1 or that the control information has been transmitted, and may disclose at least a part of the value of the control information in the notification.

[0089] Also, in S9, the communication control unit 11a and the communication unit 13 may transmit control information to the client terminal 20. In this case, the laser processing apparatus 100-1 acquires the control information from the client terminal 20. The data (data set) indicating the control information may be compressed data, may be at least partially encrypted data, or may be attached data of a notification such as an e-mail. Also, when the laser processing apparatus 100-1 has a code reader 147, the communication control unit 11a and the communication unit 13 may transmit a notification such as an e-mail including or attached with a display code such as a two-dimensional code to the client terminal 20. In this case, the client causes the code reader 147 to read the display code, so that the laser processing apparatus 100-1 can acquire the control information. The display code may indicate the data of the control information itself, or may indicate a URL or the like for accessing a website from which the laser processing apparatus 100-1 can acquire the data of the control information via the communication network 30.

[0090] If the answer is No in S3 and if the answer is No in S6, the controller 11 functions as the trial request processing unit 11e and executes a process of requesting the laser processing device 100-2 to create a sample that satisfies the first specification information, or a process of requesting the simulator 40 to perform a simulation to obtain control information that satisfies the first specification information, that is, a trial request (S10). In S10, the trial request processing unit 11e, for example, creates request data for executing the trial request, controls the communication control unit 11a and the communication unit 13 to transmit the request data to the laser processing device 100-2 or the simulator 40, or controls the input / output unit 14 to output a document indicating the request contents. In addition, in S10, the controller 11 may execute a trial request to create a sample in the laser processing device 100-2 based on the result of the simulation after the simulation in the simulator 40.

[0091] The trial request processing unit 11e waits for the creation of the sample or the completion of the simulation (S11), and when completed (Yes in S11), executes a process of providing the sample or an image of the sample, or an image obtained by the simulation (S12). In S12, the trial request processing unit 11e, for example, controls the communication control unit 11a and the communication unit 13 to send answer information including the image to the client terminal 20, and controls the input / output unit 14 to output a document for sending the sample to the client.

[0092] The above-mentioned processing procedure by the processing information server 10 is an example, and the processing information server 10 provides the client with answer information corresponding to the request information. For example, when the request information requests sending of a sample together with an image, or when the request information requests processing by remote control together with an image, the processing information server 10 executes processing corresponding to the request.

[0093] Also, for example, when an approval response is obtained from the client in response to the answer information, the information storage unit 11f (see FIG. 7) adds the first specification information, the control information, and the image to the processing information database 12a as processing results associated with the processing ID. Also, when an approval response is not obtained from the client after the sample is sent to the client and a sample is created again, S10 to S12 are repeatedly executed until an approval response is obtained from the client. Also, even with the same processing conditions (control information), there may be clients that approve and clients that do not approve. The approval / disapproval of the client may be stored in the processing information database 12a as client attribute information, and when the search process of S2 is executed, the search may be performed taking into account the attribute information for each client.

[0094] As described above, in this embodiment, the communication control unit 11a (specification information acquisition unit) acquires request information including specification information (first specification information) indicating the specification of the processing object W or processing portion of the laser processing from the client terminal 20 (client). The similar processing search unit 11c (search unit) searches for specification information that matches or is similar to the first specification information from among the specification information (second specification information) stored in the processing information database 12a of the storage unit 12 in association with the laser processing performance information. Then, the communication control unit 11a (information provision unit) provides answer information based on the performance information corresponding to the matching or similar specification information to the client terminal 20 or the laser processing device 100-1 (client).

[0095] According to such a configuration, the processing information server 10 can provide the client with processing parameters more appropriate to the client's needs through, for example, communication with the client. The client can obtain images and samples of the processing object W and the processing site that satisfy the required specifications, which are estimated to be obtained by the laser processing device 100-1. Therefore, the client can obtain advantages such as, for example, being able to know whether or not the laser processing that satisfies the required specifications can be performed by the laser processing device 100-1, and being able to obtain more appropriate control information setting values ​​(processing conditions) of the laser processing device 100-1 for performing laser processing that satisfies the required specifications.

[0096] In this embodiment, the communication control unit 11a can provide, as the response information, an image of the processed object W or the processed part having the same or similar specification information. With this configuration, for example, the client can check the state of the processed object W or the processed part having the same or similar specification information as the required specification by using the image, and can easily estimate the processed object W or the processed part that satisfies the required specification without creating a sample.

[0097] In the present embodiment, the communication control unit 11a can provide the control information of the laser processing apparatus 100-1 as the response information. With this configuration, for example, the client can obtain the control information of the laser processing apparatus 100-1 for obtaining the processing object W and the processing portion that satisfy the required specifications without performing trial and error, and can obtain the processing object W and the processing portion that have been subjected to laser processing by the laser processing apparatus 100-1 that satisfies the required specifications.

[0098] In addition, in this embodiment, the remote control unit 11d can remotely control the laser processing apparatus 100-1 based on the performance information having similar specification information. According to such a configuration, for example, the client can obtain the processing object W or the processing part that has been subjected to laser processing by the laser processing apparatus 100-1 to satisfy the required specifications without operating the laser processing apparatus 100-1 by himself. In addition, the processing information server 10 may be configured to acquire information on the welding state of the sample processed by remotely controlling the laser processing apparatus 100-1 from the client terminal 20. In this case, the processing information server 10 may be configured to determine whether the laser processing apparatus 100-1 has performed an operation that matches the control information from the acquired information on the welding state and the control information of the laser processing apparatus 100-1 by the remote control unit 11d. In addition, the processing information server 10 may be configured to notify the client terminal 20 of the determination result of whether the laser processing apparatus 100-1 has performed an operation that matches the control information. In addition, if the processing information server 10 determines that the laser processing apparatus 100-1 is not operating in accordance with the control information, it may be configured to determine that maintenance of the laser processing apparatus 100-1 is necessary and to notify the client terminal 20 of information to proceed with the maintenance.

[0099] [Second embodiment] FIG. 9 is a schematic diagram of the laser processing apparatus 100A of the second embodiment. As shown in FIG. 9, in this embodiment, the optical head 120 has a first portion 120-1, a second portion 120-2, and a third portion 120-3. The first portion 120-1 includes a collimating lens 121-1 and a mirror 123. The second portion 120-2 includes a collimating lens 121-2, a filter 124, and a condenser lens 122. The third portion 120-3 is interposed between the first portion 120-1 and the second portion 120-2. The first laser light reflected by the mirror 123 and output from the first portion 120-1 passes through the opening of the third portion 120-3, is input to the second portion 120-2, and is input to the filter 124. Moreover, the first portion 120-1, the second portion 120-2, and the third portion 120-3 are configured to be relatively slidable so that the optical axis of the laser light output from the first portion 120-1 and input to the second portion 120-2 can be shifted in a direction perpendicular to the optical axis (direction perpendicular to the Z direction) while remaining parallel. As an example, in this embodiment, the first portion 120-1 and the third portion 120-3 are configured to be relatively slidable in the X direction or in the opposite direction to the X direction without any change in posture with respect to the Z direction. Moreover, the second portion 120-2 and the third portion 120-3 are configured to be relatively slidable in the Y direction or in the opposite direction to the Y direction without any change in posture with respect to the Z direction. Specifically, the outlet of the first laser light in the first portion 120-1 and the inlet of the first laser light in the second portion 120-2 are provided with an annular, plate-shaped flange 120a that expands in a direction perpendicular to the optical axis direction of the first laser light. Between these two flanges 120a, a third portion 120-3 having an annular and plate-like shape extending in a direction perpendicular to the optical axis direction of the first laser light is sandwiched. The two flanges 120a and the third portion 120-3 can slide relatively along their contact surfaces without changing their posture with respect to the Z axis. A guide mechanism (not shown) is provided between the first portion 120-1 and the third portion 120-3, which guides the relative sliding in the X direction and can be fixed at any relative position in the X direction.Between the second part 120-2 and the third part 120-3, a guide mechanism (not shown) is provided that guides the relative slide in the Y direction and can be fixed at any relative position in the Y direction. The driving mechanism 181 changes the relative position between the first part 120-1 and the third part 120-3 in the X direction, and the driving mechanism 182 changes the relative position between the second part 120-2 and the third part 120-3 in the Y direction. The driving mechanisms 181 and 182 include, for example, a rotation mechanism such as a motor, a speed reduction mechanism that reduces the rotation output of the rotation mechanism, and a motion conversion mechanism that converts the rotation reduced by the speed reduction mechanism into a linear motion. The controller 141 can control the driving mechanisms 181 and 182 so that the relative positions of the first part 120-1, the second part 120-2, and the third part 120-3 are changed. The driving mechanisms 181 and 182 are an example of the controlled mechanism 145.

[0100] In this configuration, by adjusting the sliding positions of the two guide mechanisms, the optical axis of the first laser light input to filter 124 and output from filter 124 and the optical axis of the second laser light output from filter 124 can be shifted in a direction perpendicular to the optical axes. Since first portion 120-1 and laser device 111, and second portion 120-2 and laser device 112 are connected by flexible optical fiber 130, respectively, laser devices 111 and 112 can be fixed even if the position of first portion 120-1 or second portion 120-2 changes.

[0101] 10 and 11 show examples of beams B1 and B2 of laser light formed on the surface Wa of the workpiece W by the laser processing device 100A. As shown in FIGS. 10 and 11, the laser processing device 100A can arbitrarily change the relative positions of the beams B1 and B2. Research by the inventors has revealed that when at least a part of the beam B2 (second spot) is located forward of the beam B1 (first spot) in the sweep direction SD on the surface Wa as shown in FIGS. 10 and 11, and when the beams B1 and B2 are in contact with each other or at least partially overlap each other, the effect of preheating the beam B2 can be obtained. It has also been found that when at least a part of the beam B2 is located forward of the beam B1 in the sweep direction SD, the beams B1 and B2 may be spaced apart by a small distance. 10 and 11 are merely examples, and the arrangement of the beams B1, B2 obtained by the laser processing apparatus 100A and the size of each of the beams B1, B2 are not limited to the examples of FIGS.

[0102] According to this embodiment, the optical parameters can include the arrangement of the beams B1 and B2.

[0103] [Third embodiment] 12 is a schematic configuration diagram of a laser processing apparatus 100B of the third embodiment. In this embodiment, the optical head 120 has a galvano scanner 126 between the filter 124 and the condenser lens 122. Except for this point, the laser processing apparatus 100B has the same configuration as the laser processing apparatus 100 of the first embodiment.

[0104] The galvano scanner 126 has two mirrors 126a and 126b, and is a device that can move the irradiation position of the laser light L and sweep the laser light L without moving the optical head 120 by controlling the angles of the two mirrors 126a and 126b. The angles of the mirrors 126a and 126b are changed by, for example, a motor (not shown). With this configuration, a mechanism for relatively moving the optical head 120 and the workpiece W is not required, and, for example, an advantage is obtained that the device configuration can be made compact. The galvano scanner 126 is an example of the controlled mechanism 145.

[0105] The laser processing apparatus 100B also has a position adjustment mechanism 190 that variably sets the position of the collimator lens 121 in the optical axis direction. The position adjustment mechanism 190 can appropriately change the size (spot diameters D1, D2) of the beams B1, B2 on the surface Wa of the processing object W. That is, the position adjustment mechanism 190 can also be called a spot size variable mechanism. Note that a similar position adjustment mechanism 190 can also be applied to the condenser lens 122, and may also be applied to both the collimator lens 121 and the condenser lens 122, and can also be applied to the collimator lens 121 and the condenser lens 122 of the laser processing apparatuses 100, 100A of the other embodiments. The position adjustment mechanism 190 is an example of the controlled mechanism 145.

[0106] According to this embodiment, the optical parameters can include parameters related to the operation of the galvanometer scanner 126 and the sizes of the beams B1 and B2.

[0107] Although the embodiment of the present invention has been illustrated above, the above embodiment is merely an example and is not intended to limit the scope of the invention. The above embodiment can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the gist of the invention. In addition, the specifications of each configuration and shape (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented. [Explanation of symbols]

[0108] 1... Processing information provision system (laser processing system) 10... Processing information server 11…Controller 11a...Communication control unit (specification information acquisition unit, information provision unit) 11b... Input / output control unit 11c…Similar processing search section (search section) 11d...Remote control unit (control unit) 11e...Trial request processing unit 11f…Information storage section 12...Storage section 12a... Processing information database 13…Communications Department 14…Input / output section 20…Client terminal 30…Communications network 40…Simulator 100, 100-1, 100-2, 100A, 100B...Laser processing equipment 111...Laser device 112...Laser device 120...Optical head 120-1…First part 120-2…Second part 120-3…Third part 120a...Flange 121, 121-1, 121-2...Collimating lenses 122...Condenser lens 123…Mirror 124…Filter 125...DOE (diffractive optical element) 125a...Diffraction grating 126...Galvanometer scanner 126a, 126b…Mirror 127...Filter 128…Mirror 130...Optical fiber 140...Control mechanism 141…Controller 141a...Communication control unit 141b... Input / output control unit 141c...Reading control unit 141d...Shooting control unit 141e...operation control unit 142...Storage section 143…Communications Department 144…Input / output section 145…Controlled mechanism 146…Sensor 147…Code reader 150...Drive mechanism 160...Gas supply mechanism 161...Plumbing 170…Camera 181, 182...Drive mechanism 190...Position adjustment mechanism B1…Beam (first spot) B1a…Outer edge B2…Beam (second spot) B2a…Outer edge B2b…area B2f…area C...center point D1…Spot diameter (outer diameter) D2: Spot diameter (outer diameter) G…Gas L: Laser light SD…Sweep direction W…Processing target Wa…Surface X…direction Y...Direction Z...direction (thickness direction)

Claims

1. a specification information acquisition unit that acquires, from a request source, request information including specification information indicating specifications of an object to be processed or a processing site to be processed by irradiating a first laser beam having a wavelength of 800 [nm] or more and 1200 [nm] or less and a second laser beam having a wavelength of 570 [nm] or less; A search unit that searches for specification information that matches or is similar to the specification information acquired by the specification information acquisition unit from among specification information stored in a storage unit in association with laser processing performance information; an information providing unit that provides answer information based on the performance information corresponding to the matching or similar specification information to the request source; Equipped with The storage unit stores, as the performance information, operation information indicating an operation state of the laser processing apparatus, including information indicating an output of the first laser light and information indicating an output of the second laser light in laser processing performed in the past; The response information includes control information for the laser processing apparatus based on the operation information, A processing information server, wherein the operation information includes information indicating an arrangement of spots of the first laser light and spots of the second laser light on the surface of the object to be processed.

2. A specification information acquisition unit that acquires request information from a request source, the request information including specification information indicating the specifications of an object to be processed or a processing site to be processed by irradiating a first laser light having a wavelength of 800 nm or more and 1200 nm or less and a second laser light having a wavelength of 570 nm or less; A search unit that searches for specification information that matches or is similar to the specification information acquired by the specification information acquisition unit from among specification information stored in a storage unit in association with laser processing performance information; an information providing unit that provides answer information based on the performance information corresponding to the matching or similar specification information to the request source; Equipped with The storage unit stores, as the performance information, operation information indicating an operation state of the laser processing apparatus, including information indicating an output of the first laser light and information indicating an output of the second laser light in laser processing performed in the past; the laser processing is welding, The memory unit stores, as the performance information, the operation information and information indicating mechanical properties or electrical properties of the workpiece on which welding has been performed, The response information includes control information of the laser processing device based on the operation information and the performance information.

3. The processing information server according to claim 1 or 2, wherein the operation information includes information indicating a spot size of the first laser light on the surface of the workpiece and information indicating a spot size of the second laser light.

4. The storage unit stores an image of the object to be processed or a processed portion as the performance information, 4. The processing information server according to claim 1, wherein the information providing unit provides the answer information including the image.

5. A processing information server described in any one of claims 1 to 4, comprising a remote control unit that remotely controls a laser processing device to perform laser processing on a sample of the object to be processed or the processed area based on the performance information.

6. A processing information providing method in which a computer operates as the specification information acquisition unit, the search unit, and the information providing unit of the processing information server according to any one of claims 1 to 4, and provides the response information to the requester.

7. A processing information providing method in which a computer operates as the specification information acquisition unit, the search unit, the information providing unit, and the remote control unit of the processing information server described in claim 5, and provides the answer information to the requester.

8. A program for causing a computer to function as the specification information acquisition unit, the search unit, and the information providing unit of the processing information server according to any one of claims 1 to 4.

9. A program that causes a computer to function as the specification information acquisition unit, the search unit, the information provision unit, and the remote control unit of the processing information server described in claim 5.

10. A processing information server according to any one of claims 1 to 5; A laser processing device; A control unit that controls the laser processing device based on information provided by the processing information server; A laser processing system comprising:

Images