Electronic equipment

Abstract

To provide an electronic apparatus, equipped with a circuit board and a connector, in which the connector is connected to the circuit board by a simple method other than soldering.SOLUTION: An electronic apparatus 10 comprises: a first circuit board 30 having a first connection part 50; and a connector 20 having a terminal 28 and a contact keeping part 26. The terminal 28 has a contact part 288. The first connection part 50 has: a first base material layer 52; a first adhesive layer 54 disposed on the first base material layer 52; and first conducting wire 58 wired on the first adhesive layer 54. The contact part 288 of the terminal 28 is located on the first conducting wire 58. The contact keeping part 26 has bonding parts 262 and a coupling part 264. The bonding parts 262 are located on both sides of the contact part 288. The coupling part 264 couples the bonding parts 262 to each other. The bonding parts 262 are bonded to the first adhesive layer 54. The coupling part 264 presses the contact part 288 against the first conducting wire 58.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an electronic device that includes a circuit board and a connector. [Background technology]

[0002] This type of electronic device is disclosed, for example, in Patent Document 1.

[0003] Referring to Fig. 22, Patent Document 1 discloses a mobile phone as an electronic device 90. The electronic device 90 includes a connector 92 and a sub-board 98, which is a circuit board, in addition to various components not shown. The connector 92 includes a plurality of terminal portions 94. The sub-board 98 has a hard base material, and is connected to a main board (not shown), which is another circuit board. The terminal portion 94 of the connector 92 is fixed and connected to the sub-board 98 by soldering. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-171049 A Summary of the Invention [Problem to be solved by the invention]

[0005] When connecting a connector to a circuit board, the connector is often soldered to the circuit board as in Patent Document 1. However, soldering in industrial manufacturing requires a time-consuming process such as a reflow process.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide an electronic device that includes a circuit board and a connector, in which the connector is connected to the circuit board by a simple method other than soldering. [Means for solving the problem]

[0007] The present invention provides a first electronic device, An electronic device comprising a first circuit board and a connector, the first circuit board has a first connection portion; The first connection portion includes a first base layer, a first adhesive layer, and at least one first conductive wire, the first adhesive layer includes a pressure-sensitive adhesive and is disposed on the first base material layer in the vertical direction; the first conductive wire is routed on the first adhesive layer in the vertical direction, The connector includes at least one terminal and a contact maintaining portion, The terminal has a contact portion, the contact portion is located above the first conducting wire in the up-down direction and is in contact with the first conducting wire, The contact maintaining portion has an adhesive portion, The adhesive portions are located on both sides of the contact portion in a horizontal direction perpendicular to the up-down direction, the adhesive portion is located above the first adhesive layer in the up-down direction and is adhered to the first adhesive layer, The contact maintaining portion applies a downward force to the contact portion, pressing the contact portion against the first conducting wire. Provide electronic devices.

[0008] The present invention also provides a second electronic device, the first electronic device being: The contact maintaining portion has at least one connecting portion, the connecting portion connects the adhesive portions to each other in the horizontal direction, The connecting portion is located above the contact portion in the up-down direction and presses the contact portion against the first conducting wire. Provide electronic devices.

[0009] The present invention also provides a third electronic device, which is the first electronic device, The terminal has an extension, The extension portion extends upward from the contact portion, The extension portion is fixed to the contact maintaining portion on both sides in the horizontal direction. Provide electronic devices.

[0010] The present invention also provides a fourth electronic device, which is the third electronic device, The terminal has two protrusions, The protrusions protrude outward in the horizontal direction from the extensions and are embedded in the contact maintaining portion. Provide electronic devices.

[0011] Furthermore, the present invention provides a fifth electronic device, which is any one of the first to fourth electronic devices, the first circuit board has a wiring board portion in addition to the first connection portion, the wiring board portion includes a base layer separate from the first base layer and at least one conductive wire; The conductive wire is wired on the base material layer in the vertical direction and is connected to the first conductive wire. the first circuit board has a wiring board portion in addition to the first connection portion, the wiring board portion includes a base layer separate from the first base layer and at least one conductive wire; The conductive wire is wired on the base material layer in the vertical direction and is connected to the first conductive wire. Provide electronic devices.

[0012] Furthermore, the present invention provides a sixth electronic device, which is any one of the first to fourth electronic devices, the electronic device includes a second circuit board separate from the first circuit board, the second circuit board has a board connection portion, The board connection portion includes a base portion and at least one board terminal; the board terminal is disposed below the base in the up-down direction, the first circuit board has a second connection portion in addition to the first connection portion, the first connection portion and the second connection portion are provided on both ends of the first circuit board, The second connection portion includes a second base layer, a second adhesive layer, and at least one second conductive wire, the second adhesive layer includes a pressure-sensitive adhesive and is disposed on the second base material layer in the up-down direction; the second conductive wire is routed on the second adhesive layer in the vertical direction, the second adhesive layer is located below the base of the second circuit board in the up-down direction and is attached to the base; The second conducting wire is located below the board terminal of the second circuit board in the up-down direction and is pressed against the board terminal. Provide electronic devices.

[0013] The present invention also provides a seventh electronic device, which is the sixth electronic device, the first circuit board has a wiring board portion in addition to the first connection portion and the second connection portion, the wiring substrate portion is located between the first connection portion and the second connection portion, the wiring board portion includes a base layer separate from both the first base layer and the second base layer, and at least one conductive wire; the conductive wire is wired on the base material layer in the vertical direction, The first conductive wire is connected to the second conductive wire via the conductive wire. Provide electronic devices.

[0014] Furthermore, the present invention provides an eighth electronic device, which is any one of the first to seventh electronic devices, the at least one first conductive wire includes a plurality of the first conductive wires; The first conductive wires are arranged in the horizontal direction, the at least one terminal includes a plurality of terminals each corresponding to one of the first conductive wires; The terminals are aligned in the horizontal direction, each of the contact portions of the terminals is located above the corresponding first conducting wire in the up-down direction and is in contact with the corresponding first conducting wire; The at least one connecting portion includes a plurality of connecting portions each corresponding to one of the contact portions, the adhesive portion of the contact maintenance portion is located between all of the contact portions in the horizontal direction and is located outside two of the contact portions located at the outermost sides in the horizontal direction; The connecting portion connects all of the adhesive portions to each other in the horizontal direction, All of the adhesive portions are adhered to the first adhesive layer, Each of the connecting portions is located above the corresponding contact portion in the vertical direction and presses the corresponding contact portion against the corresponding first conducting wire. Provide electronic devices.

[0015] Furthermore, the present invention provides a ninth electronic device, which is any one of the first to eighth electronic devices, The connector includes a housing, The housing holds the terminals and is at least partially attached to the first adhesive layer. Provide electronic devices.

[0016] The present invention also provides, as a tenth electronic device, the ninth electronic device, The adhesive maintaining portion is integrally molded with the housing. Provide electronic devices.

[0017] Furthermore, the present invention provides an eleventh electronic device, which is any one of the first to tenth electronic devices, The adhesive maintaining portion is made of resin, The contact portion of the terminal is insert molded into the adhesion maintaining portion. Provide electronic devices.

[0018] Furthermore, the present invention provides a twelfth electronic device, which is any one of the first to eleventh electronic devices, The contact portion of the terminal protrudes downward from the adhesive portion. Provide electronic devices. Effect of the Invention

[0019] The electronic device of the present invention includes a first circuit board (circuit board) provided with a first conductive wire (conductor) and a first adhesive layer (adhesive layer), and a connector provided with a terminal and a contact maintaining part. According to the present invention, when the contact maintaining part is pressed against the adhesive layer and adhered, the terminal is pressed against the conductive wire and comes into contact with it. In other words, according to the electronic device of the present invention, the connector can be connected to the circuit board by a simple method other than soldering.

[0020] For example, if an electronic device has a waterproof function, the waterproof function may be deteriorated during a reflow process at high temperatures. On the other hand, when manufacturing an electronic device of the present invention, there is no need to provide a reflow process. According to the present invention, deterioration of the waterproof function caused by the reflow process can be prevented. [Brief description of the drawings]

[0021] [Figure 1] 1 is a perspective view showing an electronic device according to an embodiment of the present invention; [Diagram 2] Fig. 2 is a top view showing the electronic device of Fig. 1. The hidden outline of the first circuit board and the outline of the held portion of the terminal embedded in the housing are drawn with dashed lines. [Diagram 3] 3 is a cross-sectional view showing the electronic device of Fig. 2 taken along line III-III, with a portion of the electronic device (encircled by a dashed line) depicted in an enlarged scale. [Figure 4] 2 is a rear view showing the electronic device of FIG. 1. [Diagram 5] 2 is a bottom view showing the connector of the electronic device in FIG. 1. [Figure 6] FIG. 6 is a front view showing the connector of FIG. 5. [Figure 7] FIG. 6 is a rear view showing the connector of FIG. 5. [Figure 8] FIG. 2 is a perspective view showing a first circuit board and a second circuit board of the electronic device of FIG. 1. The outline of a hidden conductive pattern of the second circuit board is drawn with a dashed line. A part of the first circuit board (two parts surrounded by dashed lines) is drawn in an enlarged manner. [Figure 9] Fig. 3 is an end view showing a schematic view of the electronic device taken along line IX-IX in Fig. 2. The second connection portion of the first circuit board is bonded to the board connection portion of the second circuit board. [Figure 10] 9 is another end view showing the electronic device of FIG. 2 along the line IX-IX, where the second connection portion is spaced apart from the substrate connection portion. [Figure 11] 9A to 9C are diagrams illustrating an example of a method for manufacturing the first circuit board in FIG. 8. [Figure 12] 3 is a top view showing a modified example of the electronic device in FIG. 2. [Figure 13] 13 is a cross-sectional view showing the electronic device of Fig. 12 taken along line XII-XII, with a portion of the electronic device (encircled by a dashed line) depicted in an enlarged scale. [Figure 14] 13 is a bottom view showing the connector of the electronic device of FIG. 12. [Figure 15] FIG. 15 is a rear view showing the connector of FIG. 14. [Figure 16] FIG. 13 is a perspective view showing a modified example of the electronic device in FIG. [Figure 17] FIG. 17 is a top view showing the electronic device of FIG. [Figure 18] 18 is a cross-sectional view showing the electronic device of Fig. 17 taken along line XVIII-XVIII, with a portion of the electronic device (encircled by a dashed line) depicted in an enlarged manner. [Figure 19] 19 is a cross-sectional view partially showing the electronic device of FIG. 17 taken along line XIX-XIX. [Figure 20] 17 is a bottom view showing the connector of the electronic device of FIG. 16. [Figure 21] 19 is a cross-sectional view showing a modified example of the electronic device in FIG. 18. [Figure 22] FIG. 1 is a perspective view showing a part of the electronic device of Patent Document 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Referring to FIG. 1, an electronic device 10 according to an embodiment of the present invention includes a connector 20, a first circuit board 30, and a second circuit board 70. The electronic device 10 is mounted inside an electronic device (not shown). The electronic device is not particularly limited, but may be, for example, a smartphone. The connector 20 is electrically connected to a mating connector (not shown). The first circuit board 30 electrically connects a mating electronic device (not shown) connected to the mating connector to the second circuit board 70 via the connector 20. The second circuit board 70 functions according to the mating electronic device. The electronic device 10 according to the present embodiment functions as described above. However, the present invention is not limited to this and can be applied to various electronic devices.

[0023] The electronic device 10 of the present embodiment includes only the connector 20, the first circuit board 30, and the second circuit board 70. The second circuit board 70 is formed separately from the first circuit board 30 and then connected to the first circuit board 30. In other words, the electronic device 10 includes the second circuit board 70 separate from the first circuit board 30 in addition to the first circuit board 30. However, the present invention is not limited to this. For example, a part of the first circuit board 30 may function as the second circuit board 70. That is, the electronic device 10 may include only the connector 20 and the first circuit board 30. On the other hand, the electronic device 10 may include another member in addition to the connector 20, the first circuit board 30, and the second circuit board 70.

[0024] The connector 20 of this embodiment will now be described.

[0025] 1 and 6, the connector 20 of this embodiment is a receptacle and can be mated with a mating connector (not shown) which is a plug. However, the present invention is not limited to this. For example, the connector 20 may be a plug. Furthermore, the standard and use of the connector 20 are not particularly limited. For example, the connector 20 may be a Universal Serial Bus (USB) connector, or a connector for connecting to a Subscriber Identity Module (SIM) card.

[0026] 5 to 7, a connector 20 of this embodiment includes a housing 22 made of an insulator, a metallic shell 24, a contact maintaining portion 26 made of an insulator, and a plurality of terminals 28 made of a conductor. The housing 22 holds the terminals 28. The shell 24 electromagnetically shields a portion of the terminals 28. The terminals 28 are partially attached to the contact maintaining portion 26.

[0027] The connector 20 of this embodiment includes only the above-mentioned components. However, the present invention is not limited to this. For example, the connector 20 may include other components such as a hold-down in addition to the above-mentioned components. Meanwhile, the housing 22 and the shell 24 may be provided as necessary. Also, the number of terminals 28 may be one. That is, the connector 20 may include at least one terminal 28 and a contact maintaining portion 26. The at least one terminal 28 may include a plurality of terminals 28.

[0028] The housing 22 of the present embodiment has a main portion 222 , a fixed portion 223 , a fitting portion 224 , a plate-like portion 226 , and a waterproof portion 228 .

[0029] 1 and 5, main part 222 is a rear part in the front-rear direction of housing 22. In this embodiment, the front-rear direction is the X direction. The front is the +X direction and the rear is the -X direction. With reference to Figs. 5 and 7, fixed part 223 in this embodiment is the lower surface of main part 222 in the up-down direction perpendicular to the front-rear direction. In this embodiment, the up-down direction is the Z direction. The up is the +Z direction and the down is the -Z direction.

[0030] 1 and 6, the fitting portion 224 has a cylindrical shape extending along the front-rear direction. With reference to Fig. 1 and 5, the fitting portion 224 extends forward from the main portion 222. With reference to Fig. 6, the plate-shaped portion 226 has a flat plate shape parallel to a horizontal plane (XY plane) perpendicular to the up-down direction. The plate-shaped portion 226 is located inside the fitting portion 224 and extends forward from the main portion 222. With reference to Fig. 1 and 7, the waterproof portion 228 is located at the rear end of the main portion 222.

[0031] The waterproof portion 228 in this embodiment is a solidified adhesive. More specifically, the portion of the housing 22 excluding the waterproof portion 228 (main body portion) is formed by molding a resin. After the main body portion is formed, adhesive is injected so as to fill gaps in the main body portion and is solidified, thereby forming the waterproof portion 228. The housing 22 in this embodiment is made waterproof by the waterproof portion 228.

[0032] The housing 22 of this embodiment has the structure described above. However, the present invention is not limited to this, and the structure of the housing 22 can be modified in various ways as necessary. For example, the waterproof section 228 may be provided as necessary. Furthermore, the housing 22 may be formed of a single member, or may be formed by combining multiple members.

[0033] Referring to FIG. 1, each of the terminals 28 in this embodiment is a single metal plate having a bend. The terminals 28 in this embodiment are insert molded into the housing 22. The terminals 28 are arranged in a horizontal direction perpendicular to both the front-rear direction and the up-down direction. In this embodiment, the horizontal direction is the Y direction. The terminals 28 in this embodiment are arranged in a row in the horizontal direction. However, the present invention is not limited to this. For example, the terminals 28 may be arranged in two rows in the horizontal direction.

[0034] In this embodiment, each of the two terminals 28 (outer terminals 28) located on the horizontal outer side is larger than each of the three terminals 28 (inner terminals 28) located on the horizontal inner side. More specifically, the horizontal size of each of the outer terminals 28 is larger than the horizontal size of each of the inner terminals 28. However, the present invention is not limited to this. For example, all of the terminals 28 may have the same size.

[0035] 2 and 6, the terminals 28 of the present embodiment have the same structure. More specifically, each of the terminals 28 has a contact portion 282 (see FIG. 6), a held portion 284, an extension portion 286, and a contact portion 288.

[0036] 6, each of contact portions 282 of terminal 28 is disposed on plate-like portion 226 of housing 22 and extends in the front-rear direction. When connector 20 is in a mated state with a mating connector (not shown), contact portions 282 come into contact with mating terminals (not shown) of the mating connector, thereby electrically connecting connector 20 to the mating connector.

[0037] 2, each of the held portions 284 is embedded in and held in the main portion 222 and the waterproof portion 228 of the housing 22. Each of the held portions 284 extends along the front-rear direction. With reference to FIGS. 1 and 2, each of the extension portions 286 extends downward as a whole from the rear end of the held portion 284. Each of the contact portions 288 extends rearward from the lower end of the extension portion 286.

[0038] Each of the terminals 28 in this embodiment has the structure described above. However, the present invention is not limited to this. The structure of each of the terminals 28 can be modified in various ways as necessary as long as the contact portion 288 is provided.

[0039] 6, shell 24 in this embodiment is located inside fitting portion 224 of housing 22, and surrounds plate-like portion 226 of housing 22 in a vertical plane (YZ plane) perpendicular to the front-rear direction. That is, shell 24 surrounds and electromagnetically shields contact portions 282 of terminals 28 in the vertical plane.

[0040] 1 and 5, the contact maintaining portion 26 in this embodiment protrudes rearward from the rear end of the main portion 222 of the housing 22. The contact maintaining portion 26 has a flat plate shape parallel to a horizontal plane. The contact maintaining portion 26 is located near the lower end of the main portion 222 in the up-down direction and extends along the horizontal direction. The contact maintaining portion 26 in this embodiment is integrally molded with the housing 22. That is, the contact maintaining portion 26 is a part of the housing 22 and is made of the same resin as the housing 22. However, the present invention is not limited to this. For example, the contact maintaining portion 26 may be a separate member from the housing 22, as described later.

[0041] 1 and 3, in this embodiment, the contact portion 288 of the terminal 28 is insert-molded into the contact maintaining portion 26 together with the lower end of the extension portion 286 of the terminal 28. However, the present invention is not limited to this. For example, the contact portion 288 may be fixed to the lower surface of the contact maintaining portion 26.

[0042] 3, the contact maintaining unit 26 of the present embodiment has a plurality of connecting portions 264 and a plurality of adhesive portions 262. The connecting portions 264 and the adhesive portions 262 are arranged alternately in the horizontal direction. Two adhesive portions 262 are provided at both ends of the contact maintaining unit 26 in the horizontal direction. In other words, the adhesive portions 262 are located between all the connecting portions 264 in the horizontal direction and are located outside the two connecting portions 264 located outermost in the horizontal direction. The connecting portions 264 connect all the adhesive portions 262 to each other in the horizontal direction.

[0043] The connecting portions 264 are provided corresponding to the contact portions 288 of the terminals 28, respectively. Each of the connecting portions 264 is located above the corresponding contact portion 288 in the up-down direction. In other words, the portion of the contact maintaining portion 26 that is located above the contact portion 288 is the connecting portion 264, and the portion that is not located above the contact portion 288 is the adhesive portion 262. In this embodiment, each of the contact portions 288 is partially embedded inside the contact maintaining portion 26. However, the present invention is not limited to this. For example, the upper surface of each of the contact portions 288 may be flush with the lower surface of the contact maintaining portion 26.

[0044] The contact maintaining unit 26 of the present embodiment has two or more connecting portions 264 and three or more adhesive portions 262. However, the present invention is not limited to this. For example, when the number of terminals 28 is one, the contact maintaining unit 26 may have one connecting portion 264 and two adhesive portions 262. That is, the contact maintaining unit 26 may have at least one connecting portion 264 and at least two adhesive portions 262. The at least one connecting portion 264 may connect at least two adhesive portions 262 to each other in the horizontal direction. Furthermore, the at least one connecting portion 264 may include a plurality of connecting portions 264 each corresponding to a contact portion 288 of the terminal 28.

[0045] The second circuit board 70 (see FIG. 8) of the present embodiment will be described below.

[0046] 8, the second circuit board 70 of the present embodiment is an FPC (Flexible Printed Circuit) and has flexibility. That is, the second circuit board 70 is easily bent. However, the present invention is not limited to this. For example, the second circuit board 70 may be a rigid (that is, less easily bent) circuit board.

[0047] The second circuit board 70 of the present embodiment includes a base 72 and a plurality of conductive patterns 78. The base 72 is a thin film member made of resin such as polyimide. Each of the conductive patterns 78 is a thin sheet made of metal such as copper, and is formed on the lower surface of the base 72. The conductive patterns 78 are arranged in the horizontal direction and extend along the front-rear direction. The second circuit board 70 of the present embodiment includes only the base 72 and the conductive patterns 78 formed as described above. However, the present invention is not limited to this. For example, the second circuit board 70 may include an electronic component (not shown) connected to the conductive patterns 78.

[0048] The second circuit board 70 has a board connection portion 80. In this embodiment, the board connection portion 80 is a front end portion of the second circuit board 70. Therefore, the board connection portion 80 has a base portion 72. The board connection portion 80 also has a plurality of board terminals 88. In this embodiment, each of the board terminals 88 is a front end portion of the conductive pattern 78. The board terminals 88 are disposed below the base portion 72 in the up-down direction. However, the present invention is not limited to this. For example, each of the board terminals 88 may be formed from a metal different from that of the conductive pattern 78, and may be connected to the conductive pattern 78.

[0049] The board connection section 80 of the present embodiment includes two or more board terminals 88 that respectively correspond to the terminals 28 (see FIG. 1) of the connector 20 (see FIG. 1). However, the present invention is not limited to this. For example, when the number of terminals 28 is one, the number of board terminals 88 may be one. That is, it is sufficient that the board connection section 80 includes at least one board terminal 88. The at least one board terminal 88 may include multiple board terminals 88.

[0050] The first circuit board 30 of this embodiment will be described below.

[0051] 1 and 2, the first circuit board 30 of the present embodiment has a wiring board portion 40, a first connection portion 50, and a second connection portion 60. The first connection portion 50 and the second connection portion 60 are provided on both ends in the front-rear direction of the first circuit board 30. The wiring board portion 40 is located between the first connection portion 50 and the second connection portion 60 in the front-rear direction.

[0052] The first connection portion 50 is a portion connected to the connector 20. The second connection portion 60 is a portion connected to the second circuit board 70. The wiring board portion 40 is a portion that connects the first connection portion 50 and the second connection portion 60 to each other. The first circuit board 30 of the present embodiment has the second connection portion 60 in addition to the first connection portion 50. Also, the first circuit board 30 of the present embodiment has the wiring board portion 40 in addition to the first connection portion 50 and the second connection portion 60. However, the present invention is not limited to this. For example, the wiring board portion 40 and the second connection portion 60 may be provided as necessary. Also, when the electronic device 10 does not have the second circuit board 70, the wiring board portion 40 may have a circuit (not shown) including necessary electronic components.

[0053] The first circuit board 30 of the present embodiment can be produced, for example, by the manufacturing method described below.

[0054] Referring to FIG. 11, first, in a preparation process, a main component 40X which is an FPC, a first component 50X having a first base material layer 52 and a first adhesive layer 54, and a second component 60X having a second base material layer 62 and a second adhesive layer 64 are prepared.

[0055] The main member 40X includes a base layer 42X and a plurality of conductive wires 48X. The base layer 42X is a thin film member made of resin such as polyimide. Each of the conductive wires 48X is a thin sheet made of metal such as copper, and is formed on the upper surface of the base layer 42X. The conductive wires 48X are aligned horizontally and extend in the front-rear direction between the front and rear ends of the base layer 42X.

[0056] When preparing the first member 50X, first, a thin film member is formed from a resin such as polyethylene terephthalate (PET) to be used as the first base layer 52. Next, a resin material containing a pressure-sensitive adhesive is placed on the first base layer 52 to form the first adhesive layer 54. As the resin material, for example, a polyester-based, polyurethane-based, acrylic-based, epoxy-based, phenol-based, silicone-based, polyolefin-based, polyimide-based, vinyl-based, natural polymer-based, or other material can be used.

[0057] The second member 60X is prepared by a method similar to that of the first member 50X. More specifically, first, a thin film member is formed from a resin such as PET to be used as the second base layer 62. Next, a second adhesive layer 64 is formed on the second base layer 62. Like the first adhesive layer 54, the second adhesive layer 64 is formed from a resin material containing a pressure-sensitive adhesive.

[0058] In a processing step after the preparation step, the base material layer 42X of the main component 40X is processed to form the base material layer 43X. More specifically, a portion of the base material layer 42X located in front of the imaginary deletion line 492X is removed while leaving a portion below the conductive wire 48X. In addition, a portion of the base material layer 42X located behind the imaginary deletion line 494X is removed while leaving a portion below the conductive wire 48X.

[0059] As a result of the processing step, a front conductor 482X and a rear conductor 484X are formed. The front conductor 482X protrudes forward from the front end of the base material layer 43X. The rear conductor 484X protrudes backward from the rear end of the base material layer 43X. Each of the front conductors 482X includes a remaining portion of the base material layer 42X fixed to the lower surface in addition to a front portion of the conductor 48X. Each of the rear conductors 484X includes a remaining portion of the base material layer 42X fixed to the lower surface in addition to a rear portion of the conductor 48X. However, the above-mentioned remaining portion of the base material layer 42X is not shown in the drawings except for FIG. 11. For example, in FIG. 9 and FIG. 10, the boundary between the rear portion of the conductor 48X in the rear conductor 484X and the remaining portion of the base material layer 42X is not drawn, and both are collectively shown as the second conductor 68.

[0060] 11, in an assembly step following the processing step, the front conductive wire 482X is pressed against an upper surface of the first adhesive layer 54 of the first member 50X. As a result, the front conductive wire 482X is adhered to and fixed to the first adhesive layer 54. Also, the rear conductive wire 484X is pressed against an upper surface of the second adhesive layer 64 of the second member 60X. As a result, the rear conductive wire 484X is adhered to and fixed to the second adhesive layer 64.

[0061] 8 together with FIG. 11, the first connection portion 50 of the present embodiment is formed of a first member 50X and a front conductor 482X bonded to the first member 50X. The second connection portion 60 of the present embodiment is formed of a second member 60X and a rear conductor 484X bonded to the second member 60X. The wiring board portion 40 of the present embodiment is formed of an intermediate portion of a base layer 42X and an intermediate portion of a conductor 48X formed on the upper surface of the base layer 42X.

[0062] 8, the first connection portion 50, the second connection portion 60, and the wiring board portion 40 of this embodiment are connected to each other without any gaps in the front-rear direction. The lower surface of the first base material layer 52 and the lower surface of the second base material layer 62 are at the same position in the up-down direction. Meanwhile, the base material layer 42X (see FIG. 11) is thinner than the first member 50X (see FIG. 11) and the second member 60X (see FIG. 11), respectively, so that the lower surface of the base material layer 42 is located above the lower surfaces of the first base material layer 52 and the second base material layer 62. The upper surface of the first adhesive layer 54 is located below the upper surface of the base material layer 42 by the thickness of the remaining portion of the base material layer 42X in the front conductive wire 482X (see FIG. 11). Similarly, the upper surface of the second adhesive layer 64 is located below the upper surface of the base material layer 42 by the thickness of the remaining portion of the base material layer 42X in the rear conductive wire 484X (see FIG. 11).

[0063] The first connection portion 50 of the present embodiment includes a first base material layer 52, a first adhesive layer 54, and a plurality of first conductive wires 58. Each of the first conductive wires 58 of the present embodiment is a front conductive wire 482X (see FIG. 11).

[0064] The first base layer 52 is a thin film member made of a resin such as PET as described above. The first adhesive layer 54 is disposed on the first base layer 52 in the vertical direction. The first adhesive layer 54 contains a pressure-sensitive adhesive and is elastically deformable. Each of the first conductive wires 58 is made of a thin resin layer (the remaining part of the base layer 42X shown in FIG. 11) and a thin metal sheet on the resin layer (the front part of the conductive wire 48X shown in FIG. 11). Each of the first conductive wires 58 is wired on the first adhesive layer 54 in the vertical direction. In addition, each of the first conductive wires 58 protrudes upward from the first adhesive layer 54. The first conductive wires 58 are aligned in the horizontal direction and extend along the front-rear direction.

[0065] The first connection part 50 of the present embodiment has the above-mentioned structure and is flexible. That is, the first connection part 50 is easily flexible. However, as long as the first connection part 50 includes the first base material layer 52, the first adhesive layer 54, and the first conductive wire 58, the structure of the first connection part 50 can be modified in various ways as necessary. For example, the first base material layer 52 may be a rigid (i.e., less flexible) substrate.

[0066] 1 and 2, the first connection portion 50 of the present embodiment includes two or more first conducting wires 58 corresponding to the terminals 28 of the connector 20, respectively. However, the present invention is not limited to this. For example, when the number of terminals 28 is one, the number of first conducting wires 58 may be one. That is, it is sufficient that the first connection portion 50 includes at least one first conducting wire 58. The at least one first conducting wire 58 may include a plurality of first conducting wires 58. Furthermore, the at least one terminal 28 may include a plurality of terminals 28 corresponding to the first conducting wires 58, respectively.

[0067] 8, the second connection portion 60 of the present embodiment includes a second base material layer 62, a second adhesive layer 64, and a plurality of second conductive wires 68. Each of the second conductive wires 68 of the present embodiment is a rear conductive wire 484X (see FIG. 11).

[0068] The second base layer 62 is a thin film member made of a resin such as PET as described above. The second adhesive layer 64 is disposed on the second base layer 62 in the vertical direction. The second adhesive layer 64 contains a pressure-sensitive adhesive and is elastically deformable. Each of the second conductive wires 68 is made of a thin resin layer (the remaining part of the base layer 42X shown in FIG. 11) and a thin metal sheet on the resin layer (the rear part of the conductive wire 48X shown in FIG. 11). Each of the second conductive wires 68 is wired on the second adhesive layer 64 in the vertical direction. In addition, each of the second conductive wires 68 protrudes upward from the second adhesive layer 64. The second conductive wires 68 are aligned in the horizontal direction and extend along the front-rear direction.

[0069] The second connection part 60 of the present embodiment has the above-mentioned structure and is flexible. That is, the second connection part 60 is easily flexible. However, as long as the second connection part 60 includes the second base material layer 62, the second adhesive layer 64, and the second conductive wire 68, the structure of the second connection part 60 can be modified in various ways as necessary. For example, the second base material layer 62 may be a rigid (i.e., less flexible) substrate.

[0070] 1 and 2 together with FIG. 8, the second connection portion 60 of the present embodiment includes two or more second conducting wires 68 each corresponding to the terminals 28 of the connector 20 and each corresponding to the conductive patterns 78 of the second circuit board 70. However, the present invention is not limited to this. For example, when the number of terminals 28 and the number of conductive patterns 78 are one, the number of second conducting wires 68 may be one. That is, it is sufficient that the second connection portion 60 includes at least one second conducting wire 68. The at least one second conducting wire 68 may include a plurality of second conducting wires 68.

[0071] 8, the wiring board unit 40 of the present embodiment is an FPC as described above, and has flexibility. That is, the wiring board unit 40 is easily bent. However, the present invention is not limited to this. For example, the wiring board unit 40 may be a rigid (that is, less easily bent) circuit board.

[0072] The wiring board section 40 of this embodiment includes a base layer 42 and a plurality of conductors 48. Each of the conductors 48 of this embodiment is an intermediate portion of a conductor 48X (see FIG. 11). The base layer 42 is a thin film member made of a resin such as polyimide. Each of the conductors 48 is a thin metal sheet and is formed on the upper surface of the base layer 42. That is, the conductors 48 are wired on the base layer 42 in the up-down direction. The conductors 48 are arranged in the horizontal direction and extend along the front-rear direction. The wiring board section 40 of this embodiment has the above-mentioned structure. However, the present invention is not limited to this, and the structure of the wiring board section 40 can be modified in various ways as necessary. For example, the wiring board section 40 may include an insulating cover (not shown) that covers the conductors 48 from above.

[0073] 1 and 2 together with FIG. 8, the wiring board section 40 of the present embodiment includes two or more conductors 48 each corresponding to the terminals 28 of the connector 20 and each corresponding to the conductive patterns 78 of the second circuit board 70. However, the present invention is not limited to this. For example, when the number of terminals 28 and the number of conductive patterns 78 are one, the number of conductors 48 may be one. That is, it is sufficient for the wiring board section 40 to include at least one conductor 48. The at least one conductor 48 may include a plurality of conductors 48.

[0074] Referring to FIG. 8, the first base material layer 52 and the first adhesive layer 54 of the first connection portion 50 of this embodiment are formed separately from the base material layer 42 of the wiring board portion 40, as described above, and then combined with the wiring board portion 40. Similarly, the second base material layer 62 and the second adhesive layer 64 of the second connection portion 60 of this embodiment are formed separately from the base material layer 42, and then combined with the wiring board portion 40. That is, the wiring board portion 40 of this embodiment includes a base material layer 42 that is separate from both the first base material layer 52 and the second base material layer 62. However, the present invention is not limited to this. For example, the wiring board portion 40, the first connection portion 50, and the second connection portion 60 may each be part of a single member formed integrally with each other. That is, the wiring board portion 40 may include an adhesive layer similar to that of the first connection portion 50 and the second connection portion 60.

[0075] In this embodiment, the conductors 48 of the wiring board section 40 correspond to the first conductors 58 of the first connection section 50, and correspond to the second conductors 68 of the second connection section 60. Each of the conductors 48 is connected to the corresponding first conductors 58 and to the corresponding second conductors 68. In other words, each of the first conductors 58 is connected to the corresponding second conductors 68 through the corresponding conductors 48. In particular, in this embodiment, the conductors 48, the first conductors 58, and the second conductors 68 corresponding to each other are single wires formed integrally with each other. In detail, the first conductor 58 is the front end of the single wire, and the second conductor 68 is the rear end of the single wire. The conductor 48 is the middle part of the single wire. However, the present invention is not limited to this. For example, the conductors 48, the first conductors 58, and the second conductors 68 corresponding to each other may be formed separately from each other and then connected to each other.

[0076] The connection structure between first circuit board 30 and second circuit board 70 according to this embodiment will be described below.

[0077] 9 and 10 together with FIG. 4, the board connection portion 80 of the second circuit board 70 is pressed from above against the second connection portion 60 of the first circuit board 30, thereby being attached to the second connection portion 60.

[0078] In detail, first, when the board connection part 80 and the second connection part 60 in the state of FIG. 10 are pressed against each other, the second adhesive layer 64 of the second connection part 60 is compressed in the vertical direction in the region located under the second conductive wire 68. At this time, the second adhesive layer 64 is elastically deformed so as to protrude upward beyond the upper surface of the second conductive wire 68 in the region where the second conductive wire 68 does not exist along the vertical direction. According to this embodiment, as shown in FIG. 9, the elastically deformed second adhesive layer 64 fills the gap between the second conductive wires 68 adjacent to each other in the horizontal direction and the gap between the board terminals 88 adjacent to each other in the horizontal direction. The second adhesive layer 64 filled in the gap reaches the lower surface of the base 72 and adheres to the lower surface of the base 72. That is, the second adhesive layer 64 adheres to the base 72 by the action of the pressure-sensitive adhesive in the region where the second conductive wire 68 does not exist along the vertical direction.

[0079] Here, when the pressure pressing the board connection part 80 and the second connection part 60 against each other is released, the part of the second adhesive layer 64 located under the second conductive wire 68 that was compressed is elastically deformed by the elastic restoring force so as to recover the thickness in the vertical direction. With this elastic deformation, the part of the second adhesive layer 64 that was attached to the base part 72 is elastically deformed so as to be stretched beyond its natural length in the vertical direction. The board terminal 88 and the second conductive wire 68 are pressed against each other by the elastic restoring force of the second adhesive layer 64 that has been stretched in the vertical direction as described above, which tends to shrink in the vertical direction, and are stably contacted. As a result, the first circuit board 30 is electrically and stably connected to the second circuit board 70.

[0080] To sum up the above explanation, according to this embodiment, simply by pressing the board connection portion 80 of the second circuit board 70 against the second connection portion 60 of the first circuit board 30, the board terminal 88 and the second conductive wire 68 are reliably contacted with each other. According to the electronic device 10 of this embodiment, the second circuit board 70 can be connected to the first circuit board 30 in a simple manner without using any other members. However, the present invention is not limited to this. For example, the second circuit board 70 may be connected to the first circuit board 30 using a board-to-board connector. In this case, the second connection portion 60 of this embodiment does not need to be provided.

[0081] The connection structure between connector 20 (see FIG. 1) and first circuit board 30 according to this embodiment will be described below.

[0082] 3, the terminals 28 of the connector 20 are pressed from above against the first connection portion 50 of the first circuit board 30, and are thereby affixed to the first connection portion 50. In particular, according to this embodiment, when the connector 20 is pressed against the first connection portion 50, the first adhesive layer 54 of the first connection portion 50 is adhered to the contact maintaining portion 26 of the connector 20 while elastically deforming so as to fill in the gaps between the contact portions 288 of the terminals 28 adjacent to each other in the horizontal direction and the gaps between the first conducting wires 58 adjacent to each other in the horizontal direction, similar to the elastic deformation of the second adhesive layer 64 (see FIG. 9) of the second connection portion 60 (see FIG. 9) described above.

[0083] At this time, the contact portion 288 of at least one terminal 28 is located above at least one first conducting wire 58 in the vertical direction and is in contact with at least one first conducting wire 58. In particular, when the number of terminals 28 is two or more, each of the contact portions 288 is located above the corresponding first conducting wire 58 of the first connection portion 50 in the vertical direction and is in contact with the corresponding first conducting wire 58.

[0084] Moreover, at least one connecting portion 264 of the contact maintaining portion 26 is located above at least one contact portion 288 of the first connecting portion 50 in the vertical direction. At least two adhesive portions 262 of the contact maintaining portion 26 are located on both sides of at least one contact portion 288 in the horizontal direction. At least two adhesive portions 262 are located above the first adhesive layer 54 of the first connecting portion 50 in the vertical direction and are adhered to the first adhesive layer 54. The at least two adhesive portions 262 adhered in this manner apply a downward force to at least one connecting portion 264. As a result, at least one connecting portion 264 presses at least one contact portion 288 against at least one first conducting wire 58 of the first connecting portion 50.

[0085] In particular, when the number of terminals 28 is two or more, the adhesive portions 262 of the contact maintaining unit 26 are positioned between all of the contact portions 288 in the horizontal direction and are positioned outside the two contact portions 288 that are positioned outermost in the horizontal direction. All of the adhesive portions 262 are adhered to the first adhesive layer 54 of the first connection portion 50, and apply a downward force to the linking portions 264 of the contact maintaining unit 26. As a result, each of the linking portions 264 presses the corresponding contact portion 288 against the corresponding first conducting wire 58.

[0086] To summarize the above description, according to this embodiment, when the contact maintaining unit 26 is pressed against the first adhesive layer 54 of the first connecting unit 50 and bonded, the contact maintaining unit 26 applies a downward force to the contact portion 288, and presses the contact portion 288 of the terminal 28 against the first conducting wire 58. In particular, the connecting portion 264 of the contact maintaining unit 26 according to this embodiment directly applies a downward force to the contact portion 288. In other words, when the contact maintaining unit 26 is pressed against the first adhesive layer 54 of the first connecting unit 50 and bonded, the terminal 28 is pressed against the first conducting wire 58 by the contact maintaining unit 26 and comes into contact with it. That is, according to the electronic device 10 of this embodiment, the connector 20 can be connected to the first circuit board 30 by a simple method other than soldering.

[0087] According to this embodiment, the contact maintaining portion 26 and the first connecting portion 50 of the connector 20 are firmly fixed to each other by the first adhesive layer 54. Furthermore, the contact portion 288 of the terminal 28 and the first conducting wire 58 are pressed against each other by the restoring force of the elastically deformed first adhesive layer 54, and are in stable contact with each other. As a result, the connector 20 is electrically and stably connected to the first circuit board 30. Furthermore, referring to FIG. 4, the connector 20 is electrically and stably connected to the second circuit board 70 via the first circuit board 30.

[0088] 3, according to this embodiment, each of the contact portions 288 of the terminal 28 protrudes downward from the adhesive portion 262. With this structure, the amount of elastic deformation of the first adhesive layer 54 that is attached to the adhesive portion 262 and stretched in the vertical direction increases. That is, the elastic restoring force of the elastically deformed first adhesive layer 54 increases, and each of the contact portions 288 can be strongly pressed against the corresponding first conductive wire 58. However, the present invention is not limited to this. For example, each of the contact portions 288 may be completely embedded inside the contact maintenance portion 26. Each of the contact portions 288 may be recessed upward from the adhesive portion 262.

[0089] 3 together with FIG. 5, the lower surface of the main portion 222 of the housing 22 (i.e., the fixed portion 223) is flush with the lower surface of the contact maintaining portion 26. When the connector 20 is pressed against the first connecting portion 50, the fixed portion 223 is adhered to the first adhesive layer 54 of the second connecting portion 60. That is, the housing 22 in this embodiment is at least partially attached to the first adhesive layer 54. The fixed portion 223 in this embodiment is a flat surface parallel to the horizontal plane with no irregularities, and has a large size in the horizontal plane. According to this embodiment, the connector 20 can be fixed to the first connecting portion 50 more firmly.

[0090] However, the present invention is not limited to the above-described embodiment. For example, if peeling of terminal 28 from first connection portion 50 can be prevented by simply adhering contact maintaining portion 26 to first adhesive layer 54, there is no need to provide fixed portion 223. The size of fixed portion 223 in the horizontal plane may be set as necessary.

[0091] 3, in this embodiment, the size (width) of the first conducting wire 58 in the horizontal direction is the same as the size (width) of the contact portion 288 in the horizontal direction. However, the present invention is not limited to this. For example, the width of the first conducting wire 58 may be larger than the width of the contact portion 288. On the other hand, the width of the first conducting wire 58 may be smaller than the width of the contact portion 288. In this case, the relatively narrow first conducting wire 58 may be positioned in the horizontal middle of the relatively wide contact portion 288. According to this structure, the first adhesive layer 54 adheres to the adhesive portion 262 and also adheres to both sides in the horizontal direction of the lower surface of the contact portion 288.

[0092] 1, the electronic device 10 of the present embodiment has a waterproof function due to the waterproof section 228. If the terminal 28 is soldered to the first conductive wire 58, the waterproof section 228 may partially melt and deform during a reflow process at high temperature, and gaps may occur between the terminal 28 and the waterproof section 228 and between the main section 222 of the housing 22 and the waterproof section 228. As a result, the waterproof function may deteriorate. On the other hand, when manufacturing the electronic device 10 of the present embodiment, there is no need to provide a reflow process. According to the present embodiment, it is possible to prevent deterioration of the waterproof function caused by the reflow process.

[0093] Referring to FIG. 1 together with FIG. 8, each of the first adhesive layer 54 of the first connecting portion 50 and the second adhesive layer 64 of the second connecting portion 60 may contain a resin component that is cured by ultraviolet light in addition to the pressure-sensitive adhesive. Also, when the connector 20 does not have a waterproof function, each of the first adhesive layer 54 and the second adhesive layer 64 may contain a resin component that is cured by heat in addition to the pressure-sensitive adhesive. In this case, after the connector 20 and the second circuit board 70 are fixed to the first circuit board 30, the first adhesive layer 54 and the second adhesive layer 64 may be cured by irradiation with ultraviolet light or heating. When the first adhesive layer 54 and the second adhesive layer 64 are cured, the connector 20 and the second circuit board 70 can be more firmly fixed to the first circuit board 30. On the other hand, when the first adhesive layer 54 and the second adhesive layer 64 are not cured, the first circuit board 30 can be easily peeled off from the connector 20 and the second circuit board 70 and replaced.

[0094] In addition to the various modifications already described, this embodiment can be modified in many ways.

[0095] For example, comparing Fig. 12 with Fig. 2, electronic device 10A according to a first modified example includes the same first circuit board 30 and second circuit board 70 as electronic device 10, but includes a connector 20A different from connector 20 of electronic device 10. Comparing Fig. 14 and Fig. 15 with Fig. 5 and Fig. 7, connector 20A includes housing 22A different from housing 22 of connector 20, and contact maintaining portion 26A different from contact maintaining portion 26 of connector 20. Except for this difference, connector 20A has the same structure as connector 20.

[0096] The contact maintaining portion 26A of this modified example is a separate member from the housing 22A. The housing 22A has a main portion 222A. The contact maintaining portion 26A is separated from the main portion 222A and located in front of the main portion 222A. In other words, the main portion 222A is not connected to the contact maintaining portion 26A. Except for this difference, the housing 22A has the same structure as the housing 22.

[0097] The contact maintaining portion 26A has a similar structure to the contact maintaining portion 26. More specifically, referring to Fig. 14 and Fig. 15, the contact maintaining portion 26A has a plurality of connecting portions 264A respectively corresponding to the contact portions 288 of the terminal 28, and a plurality of adhesive portions 262A. The adhesive portions 262A are positioned between all the contact portions 288 in the horizontal direction, and are positioned outside the two contact portions 288 positioned outermost in the horizontal direction. The connecting portions 264A connect all the adhesive portions 262A to each other in the horizontal direction.

[0098] The housing 22A, the terminals 28, and the contact maintaining portion 26A can be assembled in various ways. For example, the terminals 28 may be press-fitted into the housing 22A after being insert-molded into the contact maintaining portion 26A. Alternatively, the terminals 28 may be insert-molded into the housing 22A, and then the contact maintaining portion 26A may be fixed onto the contact portions 288 of the terminals 28.

[0099] Referring to FIG. 13, when the connector 20A is pressed against the first connecting portion 50, the first adhesive layer 54 of the first connecting portion 50 is elastically deformed so as to fill the gaps between the contact portions 288 of the terminals 28 adjacent to each other in the horizontal direction and the gaps between the first conducting wires 58 adjacent to each other in the horizontal direction, and is adhered to the contact maintaining portion 26A of the connector 20A. At this time, each of the connecting portions 264A is located above the corresponding contact portion 288 in the vertical direction. In addition, all of the adhesive portions 262A are adhered to the first adhesive layer 54, and apply a downward force to the connecting portion 264 of the contact maintaining portion 26. As a result, each of the connecting portions 264A presses the corresponding contact portion 288 against the corresponding first conducting wire 58. As can be understood from the above description, the present modified example also provides the same effect as the above-mentioned embodiment.

[0100] 16 and 17 with FIG. 12, electronic device 10B according to the second modification includes a connector 20B different from connector 20A of electronic device 10A. Connector 20B includes contact maintaining portion 26B and terminal 28B different from contact maintaining portion 26A and terminal 28 of connector 20A.

[0101] 17, 18, and 20, the contact maintaining unit 26B has a plurality of adhesive parts 262B. Each of the adhesive parts 262B has a similar structure to the adhesive part 262A (see FIG. 13) of the contact maintaining unit 26A (see FIG. 13) except that the size in the up-down direction and the size in the horizontal plane are larger. Also, the adhesive parts 262B are arranged in the same manner as the adhesive parts 262A.

[0102] 18 to 20, the terminal 28B has an extension portion 286 similar to that of the terminal 28 (see FIG. 1), but has a contact portion 288B different from the contact portion 288 (see FIG. 14) of the terminal 28. The contact portion 288B of this modification is the lower end surface of the extension portion 286. The extension portion 286 extends upward from the contact portion 288B. The extension portion 286 is molded in the contact maintaining portion 26B, is covered by the contact maintaining portion 26B on the horizontal surface, and is fixed to the contact maintaining portion 26B. That is, the extension portion 286 is fixed to the contact maintaining portion 26B on both sides in the horizontal direction. Except for the above-mentioned differences, the electronic device 10B has the same structure as the electronic device 10A (see FIG. 12).

[0103] 18, when the connector 20B is pressed against the first connecting portion 50, the first adhesive layer 54 of the first connecting portion 50 is adhered to the contact maintaining portion 26B of the connector 20B while elastically deforming like the connector 20A (see FIG. 13). At this time, the contact maintaining portion 26B indirectly applies a downward force to the contact portion 288B via the extension portion 286, and presses the contact portion 288B of the terminal 28B against the first conducting wire 58. As can be understood from the above description, according to this modification, the same effects as those of the above-described embodiment and the first modification can be obtained without providing the linking portion 264 (see FIG. 3) and the linking portion 264A (see FIG. 13) that directly apply a downward force to the contact portion 288B.

[0104] Comparing FIG. 21 with FIG. 18, electronic device 10C according to the third modification includes a connector 20C different from connector 20B of electronic device 10B. Connector 20C includes terminals 28C different from terminals 28B of connector 20B. Each of terminals 28C has two protrusions 287C. Protrusions 287C each protrude horizontally outward from extension 286 and are embedded in contact maintaining portion 26B. Except for the above-mentioned differences, electronic device 10C has the same structure as electronic device 10B.

[0105] As can be understood from the above description, this modification also provides the same effects as the second modification described above. In addition, this modification makes it possible to more reliably apply a downward force to the contact portion 288B. However, the present invention is not limited to this. For example, the protrusion 287C may be provided as necessary. Also, the extension 286 may be fixed to the contact maintaining portion 26B only on both sides in the horizontal direction. [Explanation of symbols]

[0106] 10,10A,10B,10C Electronic equipment 20,20A,20B,20C Connectors 22,22A Housing 222,222A Main section 223 Fixed part 224 Fitting part 226 Plate-shaped part 228 Waterproof section 24 Shell 26,26A,26B Contact maintenance part 262,262A,262B Adhesive part 264,264A connection part 28,28B,28C terminal 282 Contact part 284 Holding part 286 Extension 287C Protrusion 288,288B Contact part 30 1st circuit board 40 Wiring board section 42 Base material layer 48 Conductor 50 First connection part 52 1st base layer 54 1st adhesive layer 58 1st conductor 60 Second connection part 62 2nd base layer 64 Second adhesive layer 68 Second conductor 40X Main Part 42X,43X base material layer 48X conductor 482X Front conductor 484X Rear conductor 492X,494X Delete line 50X First component 60X Second component 70 Second circuit board 72 Base 78 Conductive Pattern 80 Board connection part 88 PCB terminal

Claims

1. An electronic device comprising a first circuit board and a connector, the first circuit board has a first connection portion; The first connection portion includes a first base layer, a first adhesive layer, and at least one first conductive wire, the first adhesive layer includes a pressure-sensitive adhesive and is disposed on the first base material layer in the vertical direction; the first conductive wire is wired on the first adhesive layer in the vertical direction, The connector includes at least one terminal and a contact maintaining portion, The terminal has a contact portion, the contact portion is located above the first conducting wire in the up-down direction and is in contact with the first conducting wire, The contact maintaining portion has an adhesive portion, The adhesive portions are located on both sides of the contact portion in a horizontal direction perpendicular to the up-down direction, the adhesive portion is located above the first adhesive layer in the up-down direction and is adhered to the first adhesive layer, the contact maintaining portion applies a downward force to the contact portion, pressing the contact portion against the first conducting wire; the first circuit board has a wiring board portion in addition to the first connection portion, the wiring board portion includes a base layer separate from the first base layer and at least one conductive wire, but does not include an adhesive layer; the conductive wire is wired on the base material layer in the vertical direction, The conductive wire and the first conductive wire are a single wire integrally formed with each other. electronic equipment.

2. 2. The electronic device according to claim 1, The contact maintaining portion has a connecting portion, the connecting portion connects the adhesive portions to each other in the horizontal direction, The connecting portion is located above the contact portion in the up-down direction and presses the contact portion against the first conducting wire. electronic equipment.

3. 2. The electronic device according to claim 1, The terminal has an extension, The extension portion extends upward from the contact portion, The extension portion is fixed to the contact maintaining portion on both sides in the horizontal direction. electronic equipment.

4. 4. The electronic device according to claim 3, The terminal has two protrusions, The protrusions protrude outward in the horizontal direction from the extensions and are embedded in the contact maintaining portion. electronic equipment.

5. 5. The electronic device according to claim 1, the electronic device includes a second circuit board separate from the first circuit board, the second circuit board has a board connection portion, The board connection portion includes a base portion and at least one board terminal; the board terminal is disposed below the base in the up-down direction, the first circuit board has a second connection portion in addition to the first connection portion and the wiring board portion, the first connection portion and the second connection portion are provided on both ends of the first circuit board, The second connection portion includes a second base layer, a second adhesive layer, and at least one second conductive wire, the second adhesive layer includes a pressure-sensitive adhesive and is disposed on the second base material layer in the up-down direction; the second conductive wire is routed on the second adhesive layer in the vertical direction, the second adhesive layer is located below the base of the second circuit board in the vertical direction and is attached to the base; The second conducting wire is located below the board terminal of the second circuit board in the vertical direction and is pressed against the board terminal. electronic equipment.

6. 6. The electronic device according to claim 5, the wiring substrate portion is located between the first connection portion and the second connection portion, The first conducting wire is connected to the second conducting wire via the conducting wire. electronic equipment.

7. 7. An electronic device according to claim 1, the at least one first conductor includes a plurality of the first conductors; The first conductive wires are aligned in the horizontal direction, the at least one terminal includes a plurality of terminals each corresponding to one of the first conductive wires; The terminals are aligned in the horizontal direction, each of the contact portions of the terminals is located above the corresponding first conducting wire in the up-down direction and is in contact with the corresponding first conducting wire; the adhesive portion of the contact maintenance portion is located between all of the contact portions in the horizontal direction and is located outside two of the contact portions located outermost in the horizontal direction; All of the adhesive portions are adhered to the first adhesive layer. electronic equipment.

8. An electronic device according to any one of claims 1 to 7, The connector includes a housing, The housing holds the terminals and is at least partially attached to the first adhesive layer. electronic equipment.

9. 9. The electronic device according to claim 8, The contact maintaining portion is integrally molded with the housing. electronic equipment.

10. 10. An electronic device according to claim 1, The contact maintaining portion is made of resin, The contact portion of the terminal is insert molded into the contact maintaining portion. electronic equipment.

11. An electronic device according to any one of claims 1 to 10, The contact portion of the terminal protrudes downward from the adhesive portion. electronic equipment.

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