Multilayer ceramic electronic components

Abstract

To provide a multilayer ceramic electronic component capable of suppressing leakage of an electric field, which is generated in an electronic component, around the electronic component.SOLUTION: The present invention relates to a multilayer ceramic electronic component 1 comprising a multilayer ceramic electronic component main body 2, a first metal terminal 100A and a second metal terminal 100B. The multilayer ceramic electronic component further includes: a sheath material 3 covering the multilayer ceramic electronic component main body 2, a part of the first metal terminal 100A and a part of the second metal terminal 100B; and an electrostatic shield metal 200 embedded in the sheath material 3 and covering at least a part of the multilayer ceramic electronic component main body 2. The electrostatic shield metal 200 is disposed at a position between a surface of the sheath material 3 and a surface of the multilayer ceramic electronic component main body 2 and away from the multilayer ceramic electronic component main body 2.SELECTED DRAWING: Figure 6A

Description

[Technical field]

[0001] The present invention relates to a multilayer ceramic electronic component. [Background technology]

[0002] Conventionally, there are known multilayer ceramic electronic components covered with a resin exterior material. In such multilayer ceramic electronic components, metal terminals extending to the outside of the exterior material and external electrodes disposed on the surfaces of the main body of the multilayer ceramic electronic component are joined inside the exterior material by a joining material containing a metal such as solder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-145767 A Summary of the Invention [Problem to be solved by the invention]

[0004] Such multilayer ceramic electronic components have a problem in that the electric field generated within the electronic components leaks to the surroundings, making them susceptible to creeping discharge, for example.

[0005] An object of the present invention is to provide a multilayer ceramic electronic component capable of suppressing leakage of an electric field generated within the electronic component to the surroundings. [Means for solving the problem]

[0006] The multilayer ceramic electronic component according to the present invention includes a laminate including a plurality of laminated ceramic layers and a plurality of internal conductor layers laminated on the ceramic layers, the laminate including a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction and the width direction, a first external electrode disposed on the first end surface side, and a second external electrode disposed on the second end surface side, the laminate including a first external electrode disposed on the first end surface side, and a second external electrode disposed on the second end surface side. a first metal terminal connected to the second external electrode and a second metal terminal connected to the second external electrode, the multilayer ceramic electronic component further comprising an exterior material covering the multilayer ceramic electronic component body, a portion of the first metal terminal and a portion of the second metal terminal, and an electrostatic shielding metal embedded inside the exterior material and covering at least a portion of the multilayer ceramic electronic component body, the electrostatic shielding metal being disposed between a surface of the exterior material and a surface of the multilayer ceramic electronic component body and spaced apart from the multilayer ceramic electronic component body. Effect of the Invention

[0007] According to the present invention, it is possible to provide a multilayer ceramic electronic component capable of suppressing leakage of an electric field generated within the electronic component to the surroundings. [Brief description of the drawings]

[0008] [Figure 1] 1 is an external perspective view of a multilayer ceramic capacitor according to an embodiment of the present invention; [Diagram 2] 2 is a view of the multilayer ceramic capacitor of FIG. 1 as seen from the direction of arrow II. [Diagram 3] 3 is a view of the multilayer ceramic capacitor of FIG. 2 as seen in the direction of arrow III. [Figure 4] 4 is a view of the multilayer ceramic capacitor of FIG. 2 as seen in the direction of arrow IV. [Diagram 5] FIG. 2 is a diagram corresponding to FIG. 1 and is a virtual perspective view for explaining the internal structure of the multilayer ceramic capacitor. [Figure 6A] 5 is a cross-sectional view taken along line VIA-VIA of the multilayer ceramic capacitor 1 in FIG. [Figure 6B] 6B is a cross-sectional view taken along line VIB-VIB of the multilayer ceramic capacitor 1 in FIG. 6A. [Figure 7] 1 is an external perspective view showing the external appearance of a multilayer ceramic capacitor body before it is covered with an exterior material and before metal terminals are attached; [Figure 8] 8 is a cross-sectional view taken along line VIII-VIII of the multilayer ceramic capacitor body of FIG. 7. [Figure 9] 9 is a cross-sectional view taken along line IX-IX of the multilayer ceramic capacitor body of FIG. 8. [Figure 10] 9 is a cross-sectional view of the multilayer ceramic capacitor body taken along line XX in FIG. 8. [Figure 11] FIG. 5 is a view corresponding to FIG. 4, showing the metal terminals when the exterior material and the multilayer ceramic capacitor body are removed. [Figure 12A] 7 is an enlarged view of a portion XIIA of the multilayer ceramic capacitor shown in FIG. 6. [Figure 12B] 7 is an enlarged view of a portion XIIB of the multilayer ceramic capacitor shown in FIG. 6. [Figure 12C] FIG. 2 is a partial external perspective view of a first metal terminal. [Figure 13A] 7 is a schematic cross-sectional view taken along line XIII-XIII of the multilayer ceramic capacitor 1 in FIG. 6, illustrating the influence caused by the presence or absence of a first notch. FIG. [Figure 13B] 7 is a schematic cross-sectional view taken along line XIII-XIII of the multilayer ceramic capacitor 1 in FIG. 6, illustrating the influence caused by the presence or absence of a first notch. FIG. [Figure 14A] 2 is a diagram showing a first metal plate having a U-shaped cross section that constitutes the electrostatic shielding metal of the present embodiment. FIG. [Figure 14B] 14B is a cross-sectional view taken along line XIVB-XIVB of the first metal plate in FIG. 14A. [Figure 15A]3 is a diagram showing a flat second metal plate constituting the electrostatic shielding metal of the present embodiment; FIG. [Figure 15B] 15B is a cross-sectional view taken along line XVB-XVB of the second metal plate in FIG. 15A. [Figure 16A] 1 is a diagram showing a state in which an electrostatic shielding metal is disposed on a multilayer ceramic capacitor body according to an embodiment of the present invention. [Figure 16B] 16B is a cross-sectional view taken along line XVIB-XVIB of the multilayer ceramic capacitor body in which the electrostatic shielding metal shown in FIG. 16A is disposed. [Figure 17] 1 is an external perspective view showing a mounting structure in which a multilayer ceramic capacitor according to an embodiment of the present invention is mounted on a mounting board. [Figure 18] 3 is a diagram showing a modified example of the multilayer ceramic capacitor of the present embodiment, and corresponds to FIG. 2. FIG. [Figure 19A] FIG. 1 is a diagram showing a multilayer ceramic capacitor having a double structure. [Figure 19B] FIG. 1 is a diagram showing a triple-structure multilayer ceramic capacitor. [Figure 19C] FIG. 1 is a diagram showing a multilayer ceramic capacitor having a four-row structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, a multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to an embodiment of the present invention will be described. FIG. 1 is an external perspective view of the multilayer ceramic capacitor 1. FIG. 2 is a view taken along the direction of an arrow II of the multilayer ceramic capacitor 1 in FIG. 1. FIG. 3 is a view taken along the direction of an arrow III of the multilayer ceramic capacitor 1 in FIG. 2. FIG. 4 is a view taken along the direction of an arrow IV of the multilayer ceramic capacitor 1 in FIG. 2. FIG. 5 is a view corresponding to FIG. 1 and is a virtual perspective view for explaining the internal structure of the multilayer ceramic capacitor 1. FIG. 6A is a cross-sectional view taken along the line VIA-VIA of the multilayer ceramic capacitor 1 in FIG. 4. FIG. 6B is a cross-sectional view taken along the line VIB-VIB of the multilayer ceramic capacitor 1 in FIG. 6A.

[0010] The multilayer ceramic capacitor 1 has a multilayer ceramic capacitor body 2 as a multilayer ceramic electronic component body, metal terminals 100, an exterior material 3, and an electrostatic shielding metal 200. The multilayer ceramic capacitor body 2 is not shown in Figures 1 to 4 because it is covered with the exterior material 3. The multilayer ceramic capacitor body 2 and the electrostatic shielding metal 200 are shown in Figures 5 to 6B.

[0011] The multilayer ceramic capacitor body 2 will be described with reference to Figs. 7 to 10 in addition to Figs. 5 to 6B. Fig. 7 is an external perspective view showing the appearance of the multilayer ceramic capacitor body 2 before it is covered with the exterior material 3 and before the metal terminals 100 are attached. Fig. 8 is a cross-sectional view taken along line VIII-VIII of the multilayer ceramic capacitor body 2 in Fig. 7. Fig. 9 is a cross-sectional view taken along line IX-IX of the multilayer ceramic capacitor body 2 in Fig. 8. Fig. 10 is a cross-sectional view taken along line XX of the multilayer ceramic capacitor body 2 in Fig. 8.

[0012] The multilayer ceramic capacitor body 2 includes a laminate 10 and external electrodes 40 .

[0013] 7 to 10 show an XYZ orthogonal coordinate system. As shown in FIGS. 5 and 7, the length direction L of the multilayer ceramic capacitor body 2 and the laminate 10 corresponds to the X direction. The width direction W of the multilayer ceramic capacitor body 2 and the laminate 10 corresponds to the Y direction. The height direction T of the multilayer ceramic capacitor body 2 and the laminate 10 corresponds to the Z direction. Here, the cross section shown in FIG. 8 is also referred to as an LT cross section. The cross section shown in FIG. 9 is also referred to as a WT cross section. The cross section shown in FIG. 10 is also referred to as an LW cross section. Note that similar XYZ orthogonal coordinate systems are also shown in FIGS. 1 to 6B, 11, and 13A to 18.

[0014] As shown in Figures 5 to 10, the laminate 10 includes a first main surface TS1 and a second main surface TS2 facing each other in a height direction T, a first side surface WS1 and a second side surface WS2 facing each other in a width direction W perpendicular to the height direction T, and a first end surface LS1 and a second end surface LS2 facing each other in a length direction L perpendicular to the height direction T and the width direction W.

[0015] The laminate 10 has a substantially rectangular parallelepiped shape. The dimension of the laminate 10 in the length direction L is not necessarily longer than the dimension in the width direction W. The corners and ridges of the laminate 10 are preferably rounded. The corners are the parts where three faces of the laminate intersect, and the ridges are the parts where two faces of the laminate intersect. Incidentally, unevenness may be formed on a part or all of the surfaces constituting the laminate 10.

[0016] The dimensions of the laminate 10 are not particularly limited, but if the dimension of the laminate 10 in the length direction L is the L dimension, then the L dimension is preferably 0.2 mm or more and 10 mm or less. If the dimension of the laminate 10 in the height direction T is the T dimension, then the T dimension is preferably 0.1 mm or more and 10 mm or less. If the dimension of the laminate 10 in the width direction W is the W dimension, then the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0017] 8 and 9, the laminate 10 has an inner layer portion 11, and a first main surface side outer layer portion 12 and a second main surface side outer layer portion 13 arranged so as to sandwich the inner layer portion 11 in the height direction T. The inner layer portion 11 is also referred to as an effective layer portion.

[0018] The internal layer portion 11 includes a plurality of dielectric layers 20 as a plurality of ceramic layers, and a plurality of internal electrode layers 30 as a plurality of internal conductor layers. The internal layer portion 11 includes the internal electrode layer 30 located closest to the first main surface TS1 side to the internal electrode layer 30 located closest to the second main surface TS2 side in the height direction T. In the internal layer portion 11, the multiple internal electrode layers 30 are arranged opposite each other with the dielectric layer 20 interposed therebetween. The internal layer portion 11 is a portion that generates electrostatic capacitance and substantially functions as a capacitor.

[0019] The multiple dielectric layers 20 are made of a dielectric material. The dielectric material may be, for example, a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. The dielectric material may also be one in which a subcomponent such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound is added to the main components.

[0020] The thickness of the dielectric layer 20 is preferably 0.5 μm or more and 72 μm or less. The number of laminated dielectric layers 20 is preferably 10 to 700. The number of dielectric layers 20 is the total number of the dielectric layers in the inner layer portion 11 and the dielectric layers in the first main surface side outer layer portion 12 and the second main surface side outer layer portion 13.

[0021] The multiple internal electrode layers 30 (internal conductor layers 30) have multiple first internal electrode layers 31 (first internal conductor layers 31) and multiple second internal electrode layers 32 (second internal conductor layers 32). The multiple first internal electrode layers 31 are arranged on the multiple dielectric layers 20. The multiple second internal electrode layers 32 are arranged on the multiple dielectric layers 20. The multiple first internal electrode layers 31 and the multiple second internal electrode layers 32 are arranged alternately in the height direction T of the laminate 10 with the dielectric layer 20 interposed therebetween. The first internal electrode layers 31 and the second internal electrode layers 32 are arranged so as to sandwich the dielectric layer 20 therebetween.

[0022] The first internal electrode layer 31 has a first opposing portion 31A opposing the second internal electrode layer 32, and a first lead portion 31B led from the first opposing portion 31A to the first end face LS1. The first lead portion 31B is exposed at the first end face LS1.

[0023] The second internal electrode layer 32 has a second opposing portion 32A opposing the first internal electrode layer 31, and a second lead portion 32B led from the second opposing portion 32A to the second end face LS2. The second lead portion 32B is exposed at the second end face LS2.

[0024] In this embodiment, the first opposing portion 31A and the second opposing portion 32A face each other via the dielectric layer 20, forming a capacitance and exhibiting the characteristics of a capacitor.

[0025] The shapes of the first opposing portion 31A and the second opposing portion 32A are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded or the corners of the rectangular shape may be formed at an angle. The shapes of the first drawn-out portion 31B and the second drawn-out portion 32B are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded or the corners of the rectangular shape may be formed at an angle.

[0026] The dimension in the width direction W of the first opposing portion 31A and the dimension in the width direction W of the first drawn-out portion 31B may be the same dimension, or one of the dimensions may be smaller. The dimension in the width direction W of the second opposing portion 32A and the dimension in the width direction W of the second drawn-out portion 32B may be the same dimension, or one of the dimensions may be smaller.

[0027] The first internal electrode layer 31 and the second internal electrode layer 32 are made of an appropriate conductive material such as a metal such as Ni, Cu, Ag, Pd, Au, or an alloy containing at least one of these metals. When an alloy is used, the first internal electrode layer 31 and the second internal electrode layer 32 may be made of, for example, an Ag-Pd alloy.

[0028] The thickness of each of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably, for example, about 0.2 μm or more and 3.0 μm or less. The total number of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably 5 to 350.

[0029] The first main surface side outer layer portion 12 is located on the first main surface TS1 side of the laminate 10. The first main surface side outer layer portion 12 is an assembly of dielectric layers 20 as a plurality of ceramic layers located between the first main surface TS1 and the internal electrode layer 30 closest to the first main surface TS1. That is, the first main surface side outer layer portion 12 is formed of a plurality of dielectric layers 20 located between the first main surface TS1 and the internal electrode layer 30 located closest to the first main surface TS1 side among the plurality of internal electrode layers 30. The dielectric layer 20 used in the first main surface side outer layer portion 12 may be the same as the dielectric layer 20 used in the internal layer portion 11.

[0030] The second main surface side outer layer portion 13 is located on the second main surface TS2 side of the laminate 10. The second main surface side outer layer portion 13 is an assembly of dielectric layers 20 as a plurality of ceramic layers located between the second main surface TS2 and the internal electrode layer 30 closest to the second main surface TS2. That is, the second main surface side outer layer portion 13 is formed of a plurality of dielectric layers 20 located between the second main surface TS2 and the internal electrode layer 30 located closest to the second main surface TS2 side among the plurality of internal electrode layers 30. The dielectric layer 20 used in the second main surface side outer layer portion 13 may be the same as the dielectric layer 20 used in the internal layer portion 11.

[0031] As described above, the laminate 10 has a plurality of laminated dielectric layers 20 and a plurality of internal electrode layers 30 laminated on the dielectric layers 20. In other words, the multilayer ceramic capacitor 1 has the laminate 10 in which the dielectric layers 20 and the internal electrode layers 30 are alternately laminated.

[0032] The laminate 10 has a counter electrode portion 11E. The counter electrode portion 11E is a portion where the first counter portion 31A of the first internal electrode layer 31 and the second counter portion 32A of the second internal electrode layer 32 face each other. The counter electrode portion 11E is configured as a part of the inner layer portion 11. FIG. 8 shows the range in the length direction L of the counter electrode portion 11E. FIG. 9 shows the range in the width direction W of the counter electrode portion 11E. FIG. 10 shows the range in the width direction W and length direction L of the counter electrode portion 11E. The counter electrode portion 11E is also called a capacitor effective portion.

[0033] The laminate 10 has a side surface outer layer portion. The side surface outer layer portion has a first side surface outer layer portion WG1 and a second side surface outer layer portion WG2. The first side surface outer layer portion WG1 is a portion including the dielectric layer 20 located between the counter electrode portion 11E and the first side surface WS1. The second side surface outer layer portion WG2 is a portion including the dielectric layer 20 located between the counter electrode portion 11E and the second side surface WS2. In FIG. 9 and FIG. 10, the range of the width direction W of the first side surface outer layer portion WG1 and the second side surface outer layer portion WG2 is shown. The first side surface outer layer portion WG1 and the second side surface outer layer portion WG2 are also called W gaps or side gaps.

[0034] The laminate 10 has an end surface side outer layer portion. The end surface side outer layer portion has a first end surface side outer layer portion LG1 and a second end surface side outer layer portion LG2. The first end surface side outer layer portion LG1 is a portion including the dielectric layer 20 and the first lead portion 31B located between the counter electrode portion 11E and the first end surface LS1. The second end surface side outer layer portion LG2 is a portion including the dielectric layer 20 and the second lead portion 32B located between the counter electrode portion 11E and the second end surface LS2. FIG. 8 and FIG. 10 show the range of the length direction L of the first end surface side outer layer portion LG1 and the second end surface side outer layer portion LG2. The first end surface side outer layer portion LG1 and the second end surface side outer layer portion LG2 are also called L gaps or end gaps.

[0035] The external electrode 40 has a first external electrode 40A arranged on the first end face LS1 side, and a second external electrode 40B arranged on the second end face LS2 side.

[0036] The first external electrode 40A is preferably disposed at least on the first end face LS1 and a part of the first main surface TS1. In this embodiment, the first external electrode 40A is disposed on the first end face LS1, a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2. In this embodiment, the first external electrode 40A is connected to the first internal electrode layer 31 on the first end face LS1. The first external electrode 40A may be disposed, for example, extending from the first end face LS1 to a part of the first main surface TS1. In other words, the cross-sectional shape of the first external electrode 40A may be L-shaped (not shown). Of the first external electrode 40A, the portion disposed on the first main surface TS1 is connected to a first metal terminal 100A (described later) via a first bonding material 5A (described later).

[0037] It is preferable that the length L1 in the longitudinal direction L of the first external electrode 40A provided on the first main surface TS1 is 10% to 40% (e.g., 20 μm to 4000 μm) of the L dimension of the laminate 10. When the first external electrode 40A is also provided on the second main surface TS2, the first side surface WS1, and the second side surface WS2, it is preferable that the length L1 in the longitudinal direction L of the first external electrode 40A provided on these surfaces is also 10% to 40% (e.g., 20 μm to 4000 μm) of the L dimension of the laminate 10.

[0038] Moreover, it is preferable that the length W1 in the width direction W of the first external electrode 40A provided on the first main surface TS1 is substantially equal to the dimension W of the laminate 10 (for example, 0.1 mm or more and 10 mm or less). When the first external electrode 40A is also provided on the second main surface TS2, it is preferable that the length W1 in the width direction W of the first external electrode 40A provided on the second main surface TS2 is substantially equal to the dimension W of the laminate 10 (for example, 0.1 mm or more and 10 mm or less). When the first external electrode 40A is provided on at least one of the first side surface WS1 and the second side surface WS2, it is preferable that the length T1 in the height direction T of the first external electrode 40A provided on this portion is substantially equal to the dimension T of the laminate 10 (for example, 0.1 mm or more and 10 mm or less).

[0039] The second external electrode 40B is preferably disposed at least on the second end face LS2 and a part of the first main surface TS1. In this embodiment, the second external electrode 40B is disposed on the second end face LS2, a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2. In this embodiment, the first external electrode 40A is connected to the second internal electrode layer 32 on the second end face LS2. The second external electrode 40B may be disposed, for example, extending from the second end face LS2 to a part of the first main surface TS1. In other words, the cross-sectional shape of the second external electrode 40B may be L-shaped (not shown). Of the second external electrode 40B, the portion disposed on the first main surface TS1 is connected to a second metal terminal 100B (described later) via a second bonding material 5B (described later).

[0040] It is preferable that the length L2 in the longitudinal direction L of the second external electrode 40B provided on the first principal surface TS1 is 10% to 40% (e.g., 20 μm to 4000 μm) of the L dimension of the laminate 10. When the second external electrode 40B is also provided on the second principal surface TS2, the first side surface WS1, and the second side surface WS2, the length L2 in the longitudinal direction L of the second external electrode 40B provided on these surfaces is also 10% to 40% (e.g., 20 μm to 4000 μm) of the L dimension of the laminate 10.

[0041] Moreover, it is preferable that the length W1 in the width direction W of the second external electrode 40B provided on the first main surface TS1 is substantially equal to the dimension W of the laminate 10 (for example, 0.1 mm or more and 10 mm or less). When the second external electrode 40B is also provided on the second main surface TS2, it is preferable that the length W1 in the width direction W of the second external electrode 40B provided on the second main surface TS2 is substantially equal to the dimension W of the laminate 10 (for example, 0.1 mm or more and 10 mm or less). When the second external electrode 40B is provided on at least one of the first side surface WS1 and the second side surface WS2, it is preferable that the length T1 in the height direction T of the second external electrode 40B provided on this portion is substantially equal to the dimension T of the laminate 10 (for example, 0.1 mm or more and 10 mm or less).

[0042] 7, in this embodiment, the length L3 of the longitudinal direction L of the portion of the surface of the laminate 10 that is exposed from the external electrode 40 is preferably 20% to 80% (e.g., 40 μm to 8000 μm) of the L dimension of the laminate. In other words, the separation distance L3 between the first external electrode 40A and the second external electrode 40B is preferably 20% to 80% (e.g., 40 μm to 8000 μm) of the L dimension of the laminate.

[0043] As described above, in the laminate 10, the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 face each other via the dielectric layer 20, thereby forming a capacitance. Therefore, the characteristics of a capacitor are exhibited between the first external electrode 40A to which the first internal electrode layer 31 is connected and the second external electrode 40B to which the second internal electrode layer 32 is connected.

[0044] The first external electrode 40A has a first base electrode layer 50A and a first plating layer 60A disposed on the first base electrode layer 50A.

[0045] The second external electrode 40B has a second base electrode layer 50B and a second plating layer 60B disposed on the second base electrode layer 50B.

[0046] The first base electrode layer 50A is disposed on the first end face LS1. The first base electrode layer 50A is connected to the first internal electrode layer 31. In this embodiment, the first base electrode layer 50A is formed to extend from the first end face LS1 to a part of the first main surface TS1 and a part of the second main surface TS2, as well as a part of the first side surface WS1 and a part of the second side surface WS2.

[0047] The second base electrode layer 50B is disposed on the second end face LS2. The second base electrode layer 50B is connected to the second internal electrode layer 32. In this embodiment, the second base electrode layer 50B is formed to extend from the second end face LS2 to a part of the first main surface TS1 and a part of the second main surface TS2, as well as a part of the first side surface WS1 and a part of the second side surface WS2.

[0048] The first base electrode layer 50A and the second base electrode layer 50B of this embodiment are baked layers. The baked layer preferably contains a metal component and either a glass component or a ceramic component, or both. The metal component includes at least one selected from, for example, Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The glass component includes at least one selected from, for example, B, Si, Ba, Mg, Al, Li, etc. The ceramic component may be the same type of ceramic material as the dielectric layer 20, or a different type of ceramic material. The ceramic component includes at least one selected from, for example, BaTiO3, CaTiO3, (Ba,Ca)TiO3, SrTiO3, CaZrO3, etc.

[0049] The baked layer is, for example, a conductive paste containing glass and metal applied to the laminate and baked. The baked layer may be a laminated chip having an internal electrode layer and a dielectric layer and a conductive paste applied to the laminated chip, which are simultaneously baked, or a laminated chip having an internal electrode layer and a dielectric layer is baked to obtain a laminate, and then a conductive paste is applied to the laminate and baked. In the case where a laminated chip having an internal electrode layer and a dielectric layer and a conductive paste applied to the laminated chip are simultaneously baked, it is preferable to form the baked layer by baking a material to which a ceramic material is added instead of a glass component. In this case, it is particularly preferable to use the same type of ceramic material as the dielectric layer 20 as the ceramic material to be added. The baked layer may be a multi-layered layer.

[0050] The thickness in the longitudinal direction of the first base electrode layer 50A located on the first end face LS1 is preferably, for example, about 10 μm or more and 200 μm or less at the center in the height direction T and width direction W of the first base electrode layer 50A.

[0051] The thickness in the longitudinal direction of the second base electrode layer 50B located on the second end face LS2 is preferably, for example, about 10 μm or more and 200 μm or less at the center in the height direction T and width direction W of the second base electrode layer 50B.

[0052] When the first base electrode layer 50A is provided on a portion of at least one of the first main surface TS1 or the second main surface TS2, the height-wise thickness of the first base electrode layer 50A provided on this portion is preferably, for example, approximately 5 μm or more and 40 μm or less at the center in the length direction L and width direction W of the first base electrode layer 50A provided on this portion.

[0053] When the first base electrode layer 50A is provided on a portion of at least one of the first side surface WS1 or the second side surface WS2, the widthwise thickness of the first base electrode layer 50A provided on this portion is preferably, for example, approximately 5 μm or more and 40 μm or less at the center in the length direction L and height direction T of the first base electrode layer 50A provided on this portion.

[0054] When the second base electrode layer 50B is provided on a portion of at least one of the first main surface TS1 or the second main surface TS2, the height-wise thickness of the second base electrode layer 50B provided on this portion is preferably, for example, approximately 5 μm or more and 40 μm or less at the center in the length direction L and width direction W of the second base electrode layer 50B provided on this portion.

[0055] When the second base electrode layer 50B is provided on a portion of at least one of the first side surface WS1 or the second side surface WS2, the widthwise thickness of the second base electrode layer 50B provided on this portion is preferably, for example, approximately 5 μm or more and 40 μm or less at the center in the length direction L and height direction T of the second base electrode layer 50B provided on this portion.

[0056] The first base electrode layer 50A and the second base electrode layer 50B are not limited to baked layers, but may be thin film layers. The thin film layer is a layer in which metal particles are deposited, formed by a thin film formation method such as sputtering or vapor deposition. The thin film layer preferably contains at least one metal selected from the group consisting of Mg, Al, Ti, W, Cr, Cu, Ni, Ag, Co, Mo, and V. This can increase the adhesive strength of the external electrode 40 to the laminate 10. The thin film layer may be a single layer or may be formed of multiple layers. For example, it may be formed of a two-layer structure of a NiCr layer and a NiCu layer.

[0057] When the thin film layer as the base electrode is formed by a sputtering electrode by a sputtering method, the sputtered electrode is preferably formed on a part of the first main surface TS1 and a part of the second main surface TS2 of the laminate 10. The sputtered electrode preferably contains at least one metal selected from, for example, Ni, Cr, Cu, etc. The thickness of the sputtered electrode is preferably 50 nm or more and 400 nm or less, and more preferably 50 nm or more and 130 nm or less.

[0058] As the base electrode layer, a sputtered electrode may be formed on a part of the first main surface TS1 and a part of the second main surface TS2 of the laminate 10, while a baked layer may be formed on the first end face LS1 and the second end face LS2. Alternatively, a plating layer (described later) may be formed directly on the laminate 10 without forming a base electrode layer on the first end face LS1 and the second end face LS2. When a baked layer is formed on the first end face LS1 and the second end face LS2, the baked layer may be disposed so as to extend not only on the first end face LS1 and the second end face LS2 but also on a part of the first main surface TS1 and a part of the second main surface TS2. In this case, the sputtered electrode may be disposed so as to overlap the baked layer.

[0059] The first plating layer 60A is disposed so as to cover the first base electrode layer 50A.

[0060] The second plating layer 60B is disposed so as to cover the second base electrode layer 50B.

[0061] The first plating layer 60A and the second plating layer 60B may contain at least one selected from, for example, Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, Au, etc. The first plating layer 60A and the second plating layer 60B may each be formed of a plurality of layers. The first plating layer 60A and the second plating layer 60B are preferably of a two-layer structure in which a Sn plating layer is formed on a Ni plating layer.

[0062] The first plating layer 60A is disposed so as to cover the first base electrode layer 50A. In this embodiment, the first plating layer 60A has a first Ni plating layer 61A and a first Sn plating layer 62A located on the first Ni plating layer 61A.

[0063] The second plating layer 60B is disposed so as to cover the second base electrode layer 50B. In the present embodiment, the second plating layer 60B has a second Ni plating layer 61B and a second Sn plating layer 62B located on the second Ni plating layer 61B.

[0064] The Ni plating layer prevents the first base electrode layer 50A and the second base electrode layer 50B from being eroded by solder serving as a bonding material 5 to be described later for bonding the multilayer ceramic capacitor body 2 and the metal terminal 100. The Sn plating layer improves the wettability of the solder serving as a bonding material 5 to be described later for bonding the multilayer ceramic capacitor body 2 and the metal terminal 100. This facilitates bonding between the multilayer ceramic capacitor body 2 and the metal terminal 100. When the first plating layer 60A and the second plating layer 60B each have a two-layer structure of a Ni plating layer and a Sn plating layer, the thickness of each of the Ni plating layer and the Sn plating layer is preferably 1 μm or more and 15 μm or less.

[0065] The first external electrode 40A and the second external electrode 40B of this embodiment may have a conductive resin layer containing, for example, conductive particles and a thermosetting resin. When a conductive resin layer is provided as the base electrode layer (first base electrode layer 50A, second base electrode layer 50B), the conductive resin layer may be disposed so as to cover the baked layer, or may be disposed directly on the laminate 10 without providing a baked layer. When the conductive resin layer is disposed so as to cover the baked layer, the conductive resin layer is disposed between the baked layer and the plating layer (first plating layer 60A, second plating layer 60B). The conductive resin layer may completely cover the baked layer, or may cover a part of the baked layer.

[0066] The conductive resin layer containing a thermosetting resin is more flexible than a conductive layer made of, for example, a plating film or a fired conductive paste. Therefore, even if the multilayer ceramic capacitor 1 is subjected to a physical shock or a shock caused by a thermal cycle, the conductive resin layer functions as a buffer layer. Therefore, the conductive resin layer suppresses the occurrence of cracks in the multilayer ceramic capacitor 1.

[0067] The metal constituting the conductive particles may be Ag, Cu, Ni, Sn, Bi, or an alloy containing them. The conductive particles preferably contain Ag. The conductive particles are, for example, Ag metal powder. Ag has the lowest resistivity among metals, so it is suitable as an electrode material. In addition, Ag is a precious metal, so it is resistant to oxidation and has high weather resistance. Therefore, Ag metal powder is suitable as a conductive particle.

[0068] The conductive particles may be metal powder with Ag coating on the surface. When using metal powder with Ag coating on the surface, the metal powder is preferably Cu, Ni, Sn, Bi or an alloy powder thereof. In order to make the base metal inexpensive while maintaining the characteristics of Ag, it is preferable to use Ag-coated metal powder.

[0069] Furthermore, the conductive particles may be Cu or Ni that has been subjected to an anti-oxidation treatment. The conductive particles may also be metal powders whose surfaces are coated with Sn, Ni, or Cu. When using metal powders whose surfaces are coated with Sn, Ni, or Cu, the metal powder is preferably Ag, Cu, Ni, Sn, Bi, or an alloy powder thereof.

[0070] The shape of the conductive particles is not particularly limited. The conductive particles may be spherical, flat, or the like, but it is preferable to use a mixture of spherical metal powder and flat metal powder.

[0071] The conductive particles contained in the conductive resin layer mainly play a role in ensuring the electrical conductivity of the conductive resin layer. Specifically, a plurality of conductive particles come into contact with each other to form an electrical path inside the conductive resin layer.

[0072] The resin constituting the conductive resin layer may contain at least one selected from various known thermosetting resins such as epoxy resin, phenol resin, urethane resin, silicone resin, and polyimide resin. Among them, epoxy resin, which has excellent heat resistance, moisture resistance, and adhesion, is one of the most suitable resins. In addition, it is preferable that the resin of the conductive resin layer contains a curing agent together with the thermosetting resin. When an epoxy resin is used as the base resin, the curing agent of the epoxy resin may be various known compounds such as phenol-based, amine-based, acid anhydride-based, imidazole-based, active ester-based, and amide-imide-based compounds.

[0073] The conductive resin layer may be formed of a plurality of layers. The conductive resin layer preferably has a thickness of 10 μm or more and 150 μm or less at its thickest portion.

[0074] Alternatively, a configuration may be adopted in which a first plating layer 60A and a second plating layer 60B, which will be described later, are disposed directly on the laminate 10 without providing the first base electrode layer 50A and the second base electrode layer 50B. That is, the multilayer ceramic capacitor 1 may be configured to include plating layers that are directly and electrically connected to the first internal electrode layer 31 and the second internal electrode layer 32. In such a case, the plating layers may be formed after a catalyst is disposed on the surface of the laminate 10 as a pretreatment.

[0075] Even in this case, the plating layer is preferably a multi-layer. The lower plating layer and the upper plating layer each preferably contain at least one metal selected from, for example, Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, or Zn, or an alloy containing these metals. The lower plating layer is more preferably formed using Ni, which has solder barrier properties. The upper plating layer is more preferably formed using Sn or Au, which has good solder wettability. For example, when the first internal electrode layer 31 and the second internal electrode layer 32 are formed using Ni, the lower plating layer is preferably formed using Cu, which has good bonding properties with Ni. The upper plating layer may be formed as necessary, and the external electrode 40 may be composed of only the lower plating layer. In addition, the plating layer may be the upper plating layer as the outermost layer, or another plating layer may be formed on the surface of the upper plating layer.

[0076] The thickness of each plating layer disposed without providing a base electrode layer is preferably 2 μm to 10 μm. The plating layer preferably does not contain glass. The metal ratio per unit volume of the plating layer is preferably 99 volume % or more.

[0077] In addition, when the plating layer is formed directly on the laminate 10, the thickness of the base electrode layer can be reduced. Therefore, the dimension in the height direction T of the multilayer ceramic capacitor body 2 can be reduced by the amount of the reduction in the thickness of the base electrode layer, and the height of the multilayer ceramic capacitor body 2 can be reduced. Alternatively, the thickness of the dielectric layer 20 sandwiched between the first internal electrode layer 31 and the second internal electrode layer 32 can be increased by the amount of the reduction in the thickness of the base electrode layer, and the thickness of the element can be improved. In this way, by forming the plating layer directly on the laminate 10, the design freedom of the multilayer ceramic capacitor can be improved.

[0078] If the lengthwise dimension of the multilayer ceramic capacitor body 2 including the laminate 10 and the external electrodes 40 is taken as L dimension, then the L dimension is preferably 0.2 mm or more and 10 mm or less. If the heightwise dimension of the multilayer ceramic capacitor body 2 is taken as T dimension, then the T dimension is preferably 0.1 mm or more and 10 mm or less. If the widthwise dimension of the multilayer ceramic capacitor body 2 is taken as W dimension, then the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0079] In this embodiment, the first surface S1 on the first end face LS1 side of the multilayer ceramic capacitor body 2 is formed by the surface of the first external electrode 40A arranged on the first end face LS1. The second surface S2 on the second end face LS2 side of the multilayer ceramic capacitor body 2 is formed by the surface of the second external electrode 40B arranged on the second end face LS2.

[0080] The metal terminal 100 will be described with reference to Figs. 11 to 12B in addition to Figs. 1 to 6A. Fig. 11 corresponds to Fig. 4, and is an arrow view seen in the height direction from the second main surface TS2 toward the first main surface TS1, showing the metal terminal 100 with the exterior material 3 and the multilayer ceramic capacitor body 2 removed. In Fig. 11, the contour shapes of the laminate 10 and the external electrodes 40 of the multilayer ceramic capacitor body 2 are indicated by two-dot chain lines. Fig. 12A is an enlarged view of the XIIA portion of the multilayer ceramic capacitor 1 shown in Fig. 6A. Fig. 12B is an enlarged view of the XIIB portion of the multilayer ceramic capacitor 1 shown in Fig. 6.

[0081] The metal terminal 100 includes a first metal terminal 100A and a second metal terminal 100B.

[0082] The first metal terminal 100A and the second metal terminal 100B are metal terminals mounted on a mounting surface of a mounting board (see mounting board 310 in FIG. 17) to be described later on, on which the multilayer ceramic capacitor 1 is to be mounted. The first metal terminal 100A and the second metal terminal 100B are, for example, plate-shaped lead frames. In this embodiment, the first main surface TS1 of the laminate 10 is a surface facing the mounting surface of the mounting board on which the multilayer ceramic capacitor 1 is to be mounted.

[0083] The first metal terminal 100A has a first joint portion 110A facing the first main surface TS1 and connected to the first external electrode 40A, a first rising portion 120A connected to the first joint portion 110A, extending away from the mounting surface of the mounting board, and facing the first end face LS1, a first extension portion 130A connected to the first rising portion 120A and extending in the length direction L away from the multilayer ceramic capacitor body 2, a first falling portion 140A connected to the first extension portion 130A and extending toward the mounting surface side of the mounting board, and a first mounting portion 150A connected to the first falling portion 140A and extending in a direction along the mounting surface of the mounting board. As shown in FIG. 6A and FIG. 12A, a gap portion G exists between the first rising portion 120A and the first surface S1 on the first end face LS1 side of the multilayer ceramic capacitor body 2.

[0084] The second metal terminal 100B has a second joint portion 110B facing the first main surface TS1 and connected to the second external electrode 40B, a second rising portion 120B connected to the second joint portion 110B, extending away from the mounting surface of the mounting board, and facing the second end face LS2, a second extension portion 130B connected to the second rising portion 120B and extending in the length direction L away from the multilayer ceramic capacitor body 2, a second falling portion 140B connected to the second extension portion 130B and extending toward the mounting surface side of the mounting board, and a second mounting portion 150B connected to the second falling portion 140B and extending in a direction along the mounting surface of the mounting board. As shown in FIG. 6A and FIG. 12B, a gap portion G exists between the second rising portion 120B and the second surface S2 on the second end face LS2 side of the multilayer ceramic capacitor body 2.

[0085] It is preferable that the first falling portion 140A and the second falling portion 140B extend toward the mounting surface of the mounting board to an extent that enables a gap to be provided between the exterior material 3 of the multilayer ceramic capacitor 1 and the mounting surface of the mounting board.

[0086] By employing such first metal terminal 100A and second metal terminal 100B, the distance between the mounting board and the multilayer ceramic capacitor body 2 can be increased, which has the effect of alleviating stress from the mounting board. Also, the thickness of the exterior material 3 provided on the mounting board side can be increased, which ensures insulation.

[0087] As shown in Figures 6A and 11, the separation distance L4 between the first mounting portion 150A of the first metal terminal 100A and the second mounting portion 150B of the second metal terminal 100B is longer than the separation distance L3 between the first external electrode 40A and the second external electrode 40B of the multilayer ceramic capacitor body 2.

[0088] The bonding material 5 bonds the multilayer ceramic capacitor body 2 and the metal terminal 100. The bonding material 5 includes a first bonding material 5A and a second bonding material 5B.

[0089] 6A, the first metal terminal 100A is connected to the first external electrode 40A via a first bonding material 5A. The second metal terminal 100B is connected to the second external electrode 40B via a second bonding material 5B.

[0090] The bonding material 5 is preferably a solder. For example, it may be a Pb-free solder. As the Pb-free solder, for example, a lead-free solder such as Sn-Sb, Sn-Ag-Cu, Sn-Cu, or Sn-Bi is preferable. For example, Sn-10Sb to Sn-15Sb solder can be used.

[0091] The electrostatic shielding metal 200 serving as a metal shield will be described with reference to FIGS. 5 to 6B, 12A, and 12B.

[0092] The electrostatic shielding metal 200 is embedded inside the exterior material 3. The electrostatic shielding metal 200 is disposed at a position between the surface of the exterior material 3 and the surface of the multilayer ceramic capacitor body 2, and at a position away from the multilayer ceramic capacitor body 2.

[0093] The electrostatic shielding metal 200 covers at least a part of the multilayer ceramic capacitor body 2. The electrostatic shielding metal 200 is preferably arranged to cover at least a part of the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the multilayer ceramic capacitor body 2, which face the mounting surface of the mounting board on which the multilayer ceramic electronic component is to be mounted. In this embodiment, the electrostatic shielding metal 200 is arranged to cover at least a part of the first main surface TS1. Note that the dimension in the width direction W of the electrostatic shielding metal 200 is preferably longer than the dimension in the width direction W of the portion of the surface of the laminate 10 that is exposed from the external electrode.

[0094] The electrostatic shielding metal 200 is preferably a tubular member having a substantially tubular shape. The electrostatic shielding metal 200 of the present embodiment is disposed so as to cover at least a part of the first main surface TS1, at least a part of the second main surface TS2, at least a part of the first side surface WS1, and at least a part of the second side surface WS2 of the laminate 10. That is, the electrostatic shielding metal 200 of the present embodiment has a first shielding portion 200A covering at least a part of the first main surface TS1, a second shielding portion 200B covering at least a part of the second main surface TS2, a third shielding portion 200C covering at least a part of the first side surface WS1, and a fourth shielding portion 200D covering at least a part of the second side surface WS2. The electrostatic shielding metal 200 is preferably a tubular member having a cross-sectional shape corresponding to the shape of the WT cross section of the laminate 10 of the multilayer ceramic capacitor body 2, for example, a rectangular cross-sectional shape. However, the electrostatic shielding metal 200 may be, for example, a tubular member having a circular cross section, or a tubular member having a polygonal cross section.

[0095] The electrostatic shielding metal 200 is preferably disposed so as to cover the portion of the surface of the laminate 10 that is exposed from the external electrode 40. The dimension L5 of the electrostatic shielding metal 200 in the length direction L is preferably longer than the dimension L3 of the portion of the surface of the laminate 10 that is exposed from the external electrode 40. More preferably, the dimension L5 of the electrostatic shielding metal 200 in the length direction L is longer than the dimension L0 of the laminated ceramic electronic component body in the length direction L. More preferably, the dimension L5 of the electrostatic shielding metal 200 in the length direction L is longer than the distance in the length direction connecting the position of the first end face LS1 side of the first cutout 160A of the first metal terminal 100A and the position of the second end face LS2 side of the second cutout 160B of the second metal terminal 100B. Alternatively, it is more preferable that the longitudinal dimension L5 of the electrostatic shielding metal 200 is longer than the longitudinal distance L6 connecting the bent portion B1 constituting the connection portion between the first joint 110A and the first rising portion 120A, and the bent portion B2 constituting the connection portion between the second joint 110B and the second rising portion 120B.

[0096] For example, a metal plate, a wire mesh, a metal thin film, etc. are used as a member constituting the electrostatic shielding metal 200. In this embodiment, a metal plate is used as a member constituting the electrostatic shielding metal 200.

[0097] The electrostatic shielding metal 200 of this embodiment is a substantially tubular member made of a metal plate. The electrostatic shielding metal 200 of this embodiment is made of a first metal plate 210 and a second metal plate 220, which will be described in detail in the description of the manufacturing method described later. As shown in FIG. 6B, the first metal plate 210 is made of a metal plate having a U-shaped cross section. The first metal plate 210 has two bent portions and covers three surfaces of the laminate 10, the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2. In this embodiment, the first metal plate 210 covers three surfaces of the laminate 10, the second main surface TS2, the first side surface WS1, and the second side surface WS2. The second metal plate 220 is made of a flat metal plate. The second metal plate 220 covers the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10 that are not covered by the first metal plate 210. In this embodiment, the second metal plate 220 covers the first main surface TS1 of the laminate 10.

[0098] The tubular electrostatic shielding metal 200 may have a slit or a joint provided along the length direction L. That is, the portion S where the first metal plate 210 and the second metal plate 220 are close to each other may be joined, or may be left as a slit without being joined. In particular, in a configuration using a bent metal terminal 100, it is easier to manufacture the electrostatic shielding metal 200 by using a tubular member having a slit or a joint than by using a seamless tubular member having neither a slit nor a joint. However, a seamless tubular member may be used.

[0099] The opening area of ​​the opening on the first end face LS1 side of the tubular electrostatic shielding metal 200 may be larger than the area of ​​the first surface S1 on the first end face LS1 side of the multilayer ceramic capacitor body 2. The opening area of ​​the opening on the second end face LS2 side of the tubular electrostatic shielding metal 200 may be larger than the area of ​​the second surface S2 on the second end face LS2 side of the multilayer ceramic capacitor body. This makes it difficult for the electrostatic shielding metal 200 to come into contact with the external electrode 40 of the multilayer ceramic capacitor body 2 or the metal terminal 100. In addition, manufacturing is facilitated.

[0100] As described above, it is preferable that the electrostatic shielding metal 200 has two bent portions and includes a member covering three of the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10 of the multilayer ceramic capacitor body 2. This facilitates manufacturing.

[0101] The specific form of the electrostatic shielding metal 200 is not limited to this. For example, the tubular electrostatic shielding metal 200 may be composed of two metal plates with an L-shaped cross section. In consideration of the manufacturing process, it is preferable that the tubular electrostatic shielding metal 200 is composed of two metal plates or a plurality of metal plates. However, the tubular electrostatic shielding metal 200 may be formed by winding one metal plate. Also, the tubular electrostatic shielding metal 200 may be a tubular member having neither slits nor joints.

[0102] The metal plate constituting the electrostatic shielding metal 200 is preferably a metal plate containing at least one of Ni and Al. The thickness of the metal plate constituting the electrostatic shielding metal 200 is preferably 0.05 mm or more and 0.2 mm or less. The electrostatic shielding metal 200 may be formed into a tubular shape by winding a wire mesh.

[0103] Between the first metal plate 210 and the multilayer ceramic capacitor body 2 and between the second metal plate 220 and the multilayer ceramic capacitor body 2, an insulating layer (see insulating layers 510, 520 in Figs. 14A to 16B) may be provided, which will be described in detail in the description of the manufacturing method described later. This facilitates the relative positioning of the multilayer ceramic capacitor body 2 and the electrostatic shielding metal 200, and facilitates the subsequent molding process of the exterior material 3. The multilayer ceramic capacitor body 2 and the insulating layer, the first metal plate 210 and the insulating layer, and the second metal plate 220 and the insulating layer may be bonded by an adhesive. The insulating layer and the adhesive may be made of the same material as the exterior material 3. The insulating layer may be, for example, a thermosetting epoxy resin. The adhesive may be, for example, an epoxy-based adhesive. In this embodiment, the insulating layer and the adhesive are made of the same material as the exterior material 3. Therefore, in Figs. 6A, 6B, 12A, and 12B, the insulating layer and the adhesive are not shown separately from the exterior material 3. However, the insulating layer and the adhesive may be made of a material different from that of the exterior material 3. The insulating layer has a function of insulating between the multilayer ceramic capacitor body 2 and the electrostatic shielding metal 200, similar to the exterior material 3, after the multilayer ceramic capacitor 1 is completed.

[0104] The exterior material 3 will be described with reference to Figs. 1 to 6B, 12A and 12B.

[0105] The exterior packaging material 3 includes a first main surface MTS1 and a second main surface MTS2 facing in a height direction T, a first side surface MWS1 and a second side surface MWS2 facing in a width direction W perpendicular to the height direction T, and a first end surface MLS1 and a second end surface MLS2 facing in a length direction L perpendicular to the height direction T and the width direction W. The first end surface MLS1 of the exterior packaging material 3 is the surface of the exterior packaging material 3 facing the first end surface LS1 of the laminate 10. The second end surface MLS2 of the exterior packaging material 3 is the surface of the exterior packaging material 3 facing the second end surface LS2 of the laminate 10.

[0106] The first side surface MWS1, the second side surface MWS2, the first end surface MLS1, and the second end surface MLS2 of the exterior packaging material 3 have a parting line PL near the center in the height direction T. The parting line PL is a line that corresponds to the parting surface of a mold used when molding the exterior packaging material 3. The surface of the exterior packaging material 3 has a draft slope with the parting line PL as the boundary.

[0107] The first side surface MWS1 of the exterior cladding material 3 has a surface MWS1A on the first main surface side and a surface MWS1B on the second main surface side. The second side surface MWS2 of the exterior cladding material 3 has a surface MWS2A on the first main surface side and a surface MWS2B on the second main surface side. The first end surface MLS1 of the exterior cladding material 3 has a surface MLS1A on the first main surface side and a surface MLS1B on the second main surface side. The second end surface MLS2 of the exterior cladding material 3 has a surface MLS2A on the first main surface side and a surface MLS2B on the second main surface side. These first main surface side and second main surface side surfaces are arranged separated by a parting line PL as a boundary.

[0108] Each of the surfaces MWS1A, MWS2A, MLS1A, and MLS2A on the first principal surface side has a draft gradient such that the cross-sectional area of ​​the LW cross section of the exterior material 3 decreases from the parting line PL toward the first principal surface TS1. Each of the surfaces MWS1B, MWS2B, MLS1B, and MLS2B on the second principal surface side has a draft gradient such that the cross-sectional area of ​​the LW cross section of the exterior material 3 decreases from the parting line PL toward the second principal surface TS2.

[0109] The exterior material 3 covers the multilayer ceramic capacitor body 2, the electrostatic shielding metal 200, the bonding material 5 connecting the multilayer ceramic capacitor body 2 and the metal terminal 100, and a part of the metal terminal 100. Specifically, the exterior material 3 is arranged so as to cover the entire multilayer ceramic capacitor body 2, the entire first bonding material 5A and the second bonding material 5B, a part of the first metal terminal 100A, and a part of the second metal terminal 100B.

[0110] For example, the exterior material 3 is arranged to cover the entire first joint portion 110A, the entire first rising portion 120A, and at least a part of the first extension portion 130A of the first metal terminal 100A. Also, the exterior material 3 is arranged to cover the entire second joint portion 110B, the entire second rising portion 120B, and at least a part of the second extension portion 130B of the second metal terminal 100B.

[0111] In this embodiment, the first extension portion 130A of the first metal terminal 100A protrudes from the first end face MLS1 of the outer casing 3 and is partially exposed. The second extension portion 130B of the second metal terminal 100B protrudes from the second end face MLS2 of the outer casing 3 and is partially exposed. More specifically, the first extension portion 130A of the first metal terminal 100A protrudes from the parting line PL of the first end face MLS1 of the outer casing 3 and is partially exposed. The second extension portion 130B of the second metal terminal 100B protrudes from the parting line PL of the second end face MLS2 of the outer casing 3 and is partially exposed.

[0112] The second main surface MTS2 of the packaging material 3 is preferably configured to be planar with a predetermined flatness. This makes it possible to prevent poor suction by a mounter of a mounting machine used when mounting the multilayer ceramic capacitor 1 on a mounting board. This makes it possible to reliably mount the multilayer ceramic capacitor 1 on the mounting board. As a result, it becomes possible to suppress the occurrence of mounting defects.

[0113] The minimum distance from the second main surface MTS2 of the packaging material 3 to the surface of the multilayer ceramic capacitor body 2 is preferably 450 μm or more and 750 μm or less. The minimum distance from the first main surface MTS1 of the packaging material 3 to the first joint 110A of the first metal terminal 100A is preferably 450 μm or more and 750 μm or less. The minimum distance from the first main surface MTS1 of the packaging material 3 to the second joint 110B of the second metal terminal 100B is preferably 450 μm or more and 750 μm or less. The minimum distance from the first side surface MWS1 of the packaging material 3 to the surface of the multilayer ceramic capacitor body 2 is preferably 200 μm or more and 500 μm or less. The minimum distance from the second side surface MWS2 of the packaging material 3 to the surface of the multilayer ceramic capacitor body 2 is preferably 200 μm or more and 500 μm or less. The minimum distance from the first end face MLS1 of the exterior material 3 to the surface of the multilayer ceramic capacitor body 2 is preferably 300 μm or more and 700 μm or less. The minimum distance from the second end face MLS2 of the exterior material 3 to the surface of the multilayer ceramic capacitor body 2 is preferably 300 μm or more and 700 μm or less. The average distance in the length direction L from the surface MLS1A on the first main surface side of the first end face MLS1 of the exterior material 3 to the first rising portion 120A of the first metal terminal 100A is preferably 200 μm or more and 650 μm or less. The average distance in the length direction L from the surface MLS2A on the first main surface side of the second end face MLS2 of the exterior material 3 to the second rising portion 120B of the second metal terminal 100B is preferably 200 μm or more and 650 μm or less.

[0114] The minimum distance d1 from the surface of the multilayer ceramic capacitor body 2 to the electrostatic shielding metal 200 is preferably 400 μm or more and 600 μm or less. The minimum distance d2 from the first joint 110A of the first metal terminal 100A to the electrostatic shielding metal 200 is preferably 400 μm or more and 600 μm or less. The minimum distance d2 from the second joint 110B of the second metal terminal 100B to the electrostatic shielding metal is preferably 400 μm or more and 600 μm or less. The minimum distance d3 from the surface of the exterior material 3 to the electrostatic shielding metal 200 is preferably 50 μm or more and 150 μm or less.

[0115] An exterior material 3 is filled between the multilayer ceramic capacitor body 2 and the electrostatic shielding metal 200. An exterior material 3 is filled between the metal terminal 100 and the electrostatic shielding metal 200. This makes it possible to ensure insulation between the multilayer ceramic capacitor body 2 and the electrostatic shielding metal 200 while suppressing an increase in size of the multilayer ceramic capacitor 1. In addition, because the electrostatic shielding metal 200 is embedded in the exterior material 3, it is possible to reduce the possibility of creeping discharge caused by exposure of the electrostatic shielding metal 200.

[0116] The exterior material 3 is preferably made of resin. For example, the exterior material 3 may be formed by molding an engineering plastic by a transfer molding method, an injection molding method, or the like. In particular, the material of the exterior material 3 is preferably made of a thermosetting epoxy resin. This ensures adhesion between the exterior material 3 and the multilayer ceramic capacitor body 2 and the metal terminals 100, and can improve the withstand voltage and moisture resistance. The exterior material 3 may be formed by painting a liquid or powdered silicone or epoxy resin, for example.

[0117] In this way, the exterior material 3 can ensure an insulating surface distance (creepage distance) between the conductors by covering a wide range of the conductor metal parts, such as the external electrode 40 and the metal terminal 100. In addition, by covering a wide range of the conductor metal parts with the exterior material 3, the risk of surface discharge can be avoided.

[0118] The shape of the exterior material 3 is not particularly limited. For example, it may be a truncated pyramid such as a pyramid. The shape of the corners of the exterior material 3 is not particularly limited and may be rounded.

[0119] 5, 6A, 11 to 12B, and Fig. 12C will be used to describe the configuration of the periphery of the joint between the external electrode 40 of the multilayer ceramic capacitor body 2 and the metal terminal 100, and details of the metal terminal 100. Fig. 12C is a partial external perspective view of the first metal terminal 100A.

[0120] 12C shows a part of the appearance of the first metal terminal 100A as a representative of the metal terminal 100. The first metal terminal 100A and the second metal terminal 100B are substantially symmetrical with respect to a WT cross section at the center of the longitudinal direction L of the multilayer ceramic capacitor 1. Therefore, an external perspective view (not shown) of the second metal terminal 100B is basically the same as an external perspective view of the first metal terminal 100A.

[0121] The first metal terminal 100A has a first cutout 160A, a first opening 170A, and a third cutout 180A.

[0122] The first cutout 160A extends continuously from the end of the first joint portion 110A to a position midway along the first rising portion 120A. As a result, for example, when molding the exterior material 3, the resin constituting the exterior material 3 flows through the first cutout 160A, making it easier to fill the gap G with the resin. In addition, by disposing the resin constituting the exterior material 3 in the first cutout 160A, the resin on one side of the first rising portion 120A of the first metal terminal 100A and the resin on the other side are connected by the resin in the first cutout 160A, making the structure stronger. Note that the cutout portion of the first cutout 160A extends to a position midway along the first rising portion 120A, so the strength of the first metal terminal 100A is ensured. In addition, since the first rising portion 120A in this embodiment is inclined, for example, when the exterior material 3 is molded, the resin constituting the exterior material 3 easily enters the gap portion G and flows through the first cutout 160A.

[0123] 12C, it is preferable that rising height T3 of first cutout 160A in height direction T is equal to or less than half the rising height T2 of first rising portion 120A in height direction T. This makes it possible to ensure the strength of first metal terminal 100A while ensuring the flowability of the resin constituting exterior material 3, for example, when molding exterior material 3.

[0124] The first joint portion 110A has a first joint piece 111A on the first side surface WS1 side and a second joint piece 112A on the second side surface WS2 side, which are separated by a first cutout 160A.

[0125] The first opening 170A is disposed in the first extension 130A. In this way, by providing the first opening 170A in the first metal terminal 100A in addition to the above-mentioned first cutout 160A, for example, when molding the exterior material 3, the flowability of the resin constituting the exterior material 3 can be further increased. In addition, by disposing the resin constituting the exterior material 3 in the first opening 170A, the resin on one side of the first extension 130A of the first metal terminal 100A and the resin on the other side are connected by the resin in the first opening 170A, so that the structure becomes stronger. With the above configuration, it is preferable that the same material constituting the exterior material 3 is disposed in the part of the first cutout 160A formed in the first rising portion 120A and the first opening 170A. This makes the structure of the multilayer ceramic capacitor 1 stronger.

[0126] The third cutout 180A extends continuously from the end of the first mounting portion 150A to a position midway along the first falling portion 140A.

[0127] 11 and 12C, the widthwise length W2 of the first joint portion 110A of the first metal terminal 100A is longer than the widthwise length W3 of the first rising portion 120A. This allows the first bonding material 5A to provide a wide bonding area between the first external electrode 40A and the first metal terminal 100A. In particular, even when the first notch 160A is provided as described above, the first bonding material 5A can provide a wide bonding area between the first external electrode 40A and the first metal terminal 100A.

[0128] The length W4 of the width direction W of the first cutout 160A may be approximately equal to the length W5 of the width direction W of the first opening 170A. The rising height T3 of the first cutout 160A in the height direction T may be approximately equal to the length L6 of the first opening 170A in the length direction L. For example, the area of ​​the first cutout 160A formed in the first rising portion 120A may be within a range of 50% to 200% of the area of ​​the first opening 170A. This allows the resin constituting the exterior material 3 to flow in a balanced manner, for example, when the exterior material 3 is molded.

[0129] The second metal terminal 100B has a second cutout 160B, a second opening 170B, and a fourth cutout 180B.

[0130] The second cutout 160B extends continuously from the end of the second joint portion 110B to a position midway along the second rising portion 120B. As a result, for example, when molding the exterior material 3, the resin constituting the exterior material 3 flows through the second cutout 160B, making it easier to fill the gap G with the resin. In addition, by disposing the resin constituting the exterior material 3 in the second cutout 160B, the resin on one side of the second rising portion 120B of the second metal terminal 100B and the resin on the other side are connected by the resin in the second cutout 160B, making the structure stronger. Note that the cutout portion of the second cutout 160B extends to a position midway along the second rising portion 120B, ensuring the strength of the second metal terminal 100B. In addition, since the second rising portion 120B in this embodiment is inclined, for example, when the exterior material 3 is molded, the resin constituting the exterior material 3 easily enters the gap portion G and flows through the second cutout 160B.

[0131] It is preferable that the rising height T3 of the second cutout 160B in the height direction T is equal to or less than half the rising height T2 of the second rising portion 120B in the height direction T. This makes it possible to ensure the strength of the second metal terminal 100B while ensuring the flowability of the resin constituting the exterior material 3, for example, when molding the exterior material 3.

[0132] The second joint portion 110B has a third joint piece 111B on the first side surface WS1 side and a fourth joint piece 112B on the second side surface WS2 side, which are separated by the second cutout 160B.

[0133] The second opening 170B is disposed in the second extension portion 130B. In this way, by providing the second opening 170B in the second metal terminal 100B in addition to the above-mentioned second cutout 160B, for example, when molding the exterior material 3, the flowability of the resin constituting the exterior material 3 can be further increased. In addition, by disposing the resin constituting the exterior material 3 in the second opening 170B, the resin on one side of the second extension portion 130B of the second metal terminal 100B and the resin on the other side are connected by the resin in the second opening 170B, so that the structure becomes stronger. With the above configuration, it is preferable that the same material constituting the exterior material 3 is disposed in the part of the second cutout 160B formed in the second rising portion 120B and the second opening 170B. This makes the structure of the multilayer ceramic capacitor 1 stronger.

[0134] The fourth cutout 180B extends continuously from the end of the second mounting portion 150B to a position midway along the second falling portion 140B.

[0135] 11, the widthwise length W2 of the second bonding portion 110B of the second metal terminal 100B is longer than the widthwise length W3 of the second rising portion 120B. This allows a wide bonding area between the second external electrode 40B and the second metal terminal 100B by the second bonding material 5B. In particular, even when the second notch 160B is provided as described above, a wide bonding area between the second external electrode 40B and the second metal terminal 100B by the second bonding material 5B can be ensured.

[0136] The length W4 of the second cutout 160B in the width direction W may be approximately equal to the length W5 of the second opening 170B in the width direction W. The rising height T3 of the second cutout 160B in the height direction T may be approximately equal to the length L6 of the second opening 170B in the length direction L. For example, the area of ​​the second cutout 160B formed in the second rising portion 120B may be within a range of 50% to 200% of the area of ​​the second opening 170B. This allows the resin constituting the exterior material 3 to flow in a balanced manner, for example, when the exterior material 3 is molded.

[0137] In this embodiment, the first joint portion 110A of the first metal terminal 100A is divided by a first cutout 160A. Also, the second joint portion 110B of the second metal terminal 100B is divided by a second cutout 160B. The effect of this will be described with reference to Figures 13A and 13B.

[0138] 13A and 13B are schematic cross-sectional views taken along line XIII-XIII of the multilayer ceramic capacitor 1 in FIG. 6, and are schematic views for explaining the influence caused by the presence or absence of the first notch 160A. The first metal terminal 100A and the second metal terminal 100B are generally symmetrical with respect to a WT cross section at the center of the length direction L of the multilayer ceramic capacitor 1. Therefore, the first metal terminal 100A will be illustrated and explained as a representative of the metal terminals 100.

[0139] FIG. 13A is a diagram illustrating a state of the multilayer ceramic capacitor body 2 that may occur when the first joint portion 110A is not provided with the first cutout 160A.

[0140] As shown in FIG. 13A, the WT cross section of the multilayer ceramic capacitor body 2 after the external electrode 40 is formed is curved so as to bulge slightly due to the manufacturing method. In FIG. 13A and FIG. 13B, the bulge is shown with emphasis. Due to such a bulge, if the first joint portion 110A does not have the first notch 160A in the reflow process for joining the multilayer ceramic capacitor body 2 to the first metal terminal 100A and the second metal terminal 100B, the multilayer ceramic capacitor body 2 may rotate and tilt. In this case, when the electrostatic shielding metal 200 is assembled, the electrostatic shielding metal 200 and the surface of the multilayer ceramic capacitor body 2 are partially close to each other. Therefore, the electrostatic shielding metal 200 and the external electrode 40 may come into contact with each other, and the first external electrode 40A and the second external electrode 40B may be short-circuited.

[0141] As shown in FIG. 13B and also as shown in FIG. 11, in this embodiment, the first joint portion 110A of the first metal terminal 100A has a first joint piece 111A on the first side surface WS1 side and a second joint piece 112A on the second side surface WS2 side, which are separated by the first notch 160A. Similarly, the second joint portion 110B of the second metal terminal 100B has a third joint piece 111B on the first side surface WS1 side and a fourth joint piece 112B on the second side surface WS2 side, which are separated by the second notch 160B. Therefore, as shown in FIG. 13B, the two joint pieces support the multilayer ceramic capacitor body, which is slightly curved, so that the multilayer ceramic capacitor body 2 is unlikely to tilt. Therefore, the distance between the electrostatic shielding metal 200 and the surface of the multilayer ceramic capacitor body 2 can be secured.

[0142] The first metal terminal 100A and the second metal terminal 100B each have a terminal body and a plating film disposed on the surface of the terminal body.

[0143] The terminal body is preferably made of Ni, Fe, Cu, Ag, Cr, or an alloy containing at least one of these metals as a main component. For example, the base metal of the terminal body can be an Fe-42Ni alloy, an Fe-18Cr alloy, or a Cu-8Sn alloy. From the viewpoint of heat dissipation, the base metal of the terminal body can be oxygen-free copper or a Cu-based alloy with high thermal conductivity. In this way, by making the material of the terminal body a copper-based material with good thermal conductivity, it is possible to achieve low ESR and low thermal resistance. In this embodiment, the base metal of the terminal body can be stainless steel or aluminum with low solder wettability. At least the surface of the base metal of the terminal body has a surface with lower solder wettability than the plating film on the outermost surface. The thickness of the terminal body is preferably about 0.05 mm or more and 0.5 mm or less.

[0144] The plating film preferably has an upper layer plating film disposed on the outermost surface of the plating film and a lower layer plating film disposed below the upper layer plating film. For example, the plating film may have a two-layer structure in which an upper layer plating film is formed on a lower layer plating film. The lower layer plating film is preferably made of Ni, Fe, Cu, Ag, Cr, or an alloy containing one or more of these metals as a main component. More preferably, the lower layer plating film is made of Ni, Fe, Cr, or an alloy containing one or more of these metals as a main component. By forming the lower layer plating film from an alloy containing high melting point Ni, Fe, Cr, or one or more of these metals as a main component, the heat resistance of the metal terminal 100 can be improved. The thickness of the lower layer plating film is preferably about 0.2 μm or more and 5.0 μm or less. The upper layer plating film is preferably made of an alloy containing Sn, Ag, Au, or one or more of these metals as a main component. More preferably, the upper layer plating film is made of Sn or an alloy containing Sn as a main component. By forming the upper layer plating film from Sn or an alloy containing Sn as a main component, it is possible to improve the solderability between the external electrode 40 and the metal terminal 100. The thickness of the upper layer plating film is preferably about 1.0 μm or more and 5.0 μm or less.

[0145] The upper layer plating film disposed on the outermost surface of the plating film has a surface that is more wettable to solder than the surface of the base metal of the terminal body. The upper layer plating film disposed on the outermost surface of the plating film has a surface that is more wettable to solder than the surface of the lower layer plating film. For example, the lower layer plating film is preferably a Ni plating film. The upper layer plating film is preferably a Sn plating film.

[0146] The first metal terminal 100A and the second metal terminal 100B may have an exposed surface in which the material inside the plating film of the outermost surface of the plating film is exposed on the surface. By providing an exposed surface on a part of the surface, it becomes difficult for solder to flow to that part, and therefore it is possible to prevent problems such as solder splash.

[0147] Here, the exposed surface may be a surface where a lower layer plating film is exposed. The lower layer plating film has a lower wettability with solder than the upper layer plating film. The exposed surface may be a surface where a base material of the terminal body is exposed. The surface of the base material of the terminal body has a lower wettability with solder than the upper layer plating film.

[0148] The exposed surface may be formed by performing a removal process after forming a plating film on the terminal body. The removal process may be, for example, various removal processes such as mechanical removal processes by grinding or polishing, removal processes by laser trimming, removal processes using a plating stripper such as sodium hydroxide, etc. Also, before forming the plating film, the part to be the exposed surface may be covered with a resist. In this case, the exposed surface is formed by removing the resist after forming the plating film.

[0149] If the lengthwise dimension of the multilayer ceramic capacitor 1 including the exterior material 3 and the metal terminals 100 is defined as L dimension, then the L dimension is preferably 3.2 mm or more and 20 mm or less. If the lengthwise dimension of the multilayer ceramic capacitor 1 in the stacking direction is defined as T dimension, then the T dimension is preferably 1.0 mm or more and 10 mm or less. If the widthwise dimension of the multilayer ceramic capacitor 1 is defined as W dimension, then the W dimension is preferably 1.5 mm or more and 20 mm or less.

[0150] Next, a method for manufacturing the multilayer ceramic capacitor 1 of this embodiment will be described. First, a method for manufacturing the multilayer ceramic capacitor body 2 will be described.

[0151] A dielectric sheet for the dielectric layer 20 and a conductive paste for the internal electrode layer 30 are prepared. The dielectric sheet and the conductive paste for the internal electrodes contain a binder and a solvent. The binder and the solvent may be known.

[0152] A conductive paste for the internal electrode layer 30 is printed in a predetermined pattern on the dielectric sheet by, for example, screen printing, gravure printing, etc. In this way, a dielectric sheet on which the pattern of the first internal electrode layer 31 is formed and a dielectric sheet on which the pattern of the second internal electrode layer 32 is formed are prepared.

[0153] A predetermined number of dielectric sheets on which the pattern of the internal electrode layer is not printed are laminated to form a portion that will become the first main surface side outer layer portion 12 on the first main surface TS1 side. A dielectric sheet on which the pattern of the first internal electrode layer 31 is printed and a dielectric sheet on which the pattern of the second internal electrode layer 32 is printed are laminated in order thereon to form a portion that will become the internal layer portion 11. A predetermined number of dielectric sheets on which the pattern of the internal electrode layer is not printed are laminated on the portion that will become the internal layer portion 11 to form a portion that will become the second main surface side outer layer portion 13 on the second main surface TS2 side. In this way, a laminated sheet is produced.

[0154] The laminated sheets are pressed in the lamination direction by means of a hydrostatic press or the like to produce a laminated block.

[0155] The laminated block is cut to a predetermined size to obtain laminated chips. At this time, corners and edges of the laminated chips may be rounded by barrel polishing or the like.

[0156] The laminated chip is fired to produce the laminate 10. The firing temperature depends on the materials of the dielectric layers 20 and the internal electrode layers 30, but is preferably 900° C. or higher and 1400° C. or lower.

[0157] A conductive paste that will become the first base electrode layer 50A and the second base electrode layer 50B is applied to both end surfaces of the laminate 10. In this embodiment, the first base electrode layer 50A and the second base electrode layer 50B are baked layers. A conductive paste containing a glass component and a metal is applied to the laminate 10 by a method such as dipping. Then, a baking process is performed to form the first base electrode layer 50A and the second base electrode layer 50B. The temperature of the baking process at this time is preferably 700°C or higher and 900°C or lower.

[0158] In addition, when the laminated chip before firing and the conductive paste applied to the laminated chip are fired at the same time, it is preferable to form the fired layer by firing a material to which a ceramic material is added instead of a glass component. In this case, it is particularly preferable to use the same type of ceramic material as that of the dielectric layer 20 as the ceramic material to be added. In this case, the conductive paste is applied to the laminated chip before firing, and the laminated chip and the conductive paste applied to the laminated chip are fired at the same time to form the laminate 10 with the fired layer.

[0159] When forming thin film layers as the first base electrode layer 50A and the second base electrode layer 50B, the thin film layers may be formed on a part of the first main surface TS1 and a part of the second main surface TS2 of the laminate 10. The thin film layers may be sputtered electrodes formed by a sputtering method, for example. When forming sputtered electrodes as the first base electrode layer 50A and the second base electrode layer 50B on a part of the first main surface TS1 and a part of the second main surface TS2 of the laminate 10, baked layers may be formed on the first end surface LS1 and the second end surface LS2. Alternatively, a plating layer, which will be described later, may be formed directly on the laminate 10 without forming base electrode layers on the first end surface LS1 and the second end surface LS2.

[0160] Thereafter, a first plating layer 60A is formed on the surface of the first base electrode layer 50A. A second plating layer 60B is formed on the surface of the second base electrode layer 50B. In this embodiment, a Ni plating layer and a Sn plating layer are formed as the plating layers. The Ni plating layer and the Sn plating layer are formed in sequence, for example, by barrel plating.

[0161] Through these manufacturing steps, the multilayer ceramic capacitor body 2 is manufactured.

[0162] Next, a method for manufacturing the first metal terminal 100A and the second metal terminal 100B will be described.

[0163] A plating film is applied to the terminal body constituting the first metal terminal 100A and the second metal terminal 100B. Then, in the portion where solder is not desired to be attached, at least the film constituting the outermost surface of the plating film is peeled off. This forms an exposed surface that exposes a surface with low solder wettability. Alternatively, plating is applied to the terminal body in a state where the surface of the portion where solder is not desired to be attached is masked with a resist or the like. This may form an exposed surface that exposes a surface with low solder wettability.

[0164] Next, a process for joining the multilayer ceramic capacitor body 2 to the first metal terminal 100A and the second metal terminal 100B will be described.

[0165] The first external electrode 40A and the first metal terminal 100A are joined by a first bonding material 5A. The second external electrode 40B and the second metal terminal 100B are joined by a second bonding material 5B. In this embodiment, the first bonding material 5A and the second bonding material 5B are solder. For example, when bonding is performed by reflow soldering, the first bonding material 5A and the second bonding material 5B are heated at a temperature of, for example, 270° C. or higher and 290° C. or lower for 30 seconds or longer.

[0166] The heating during the reflow melts the first bonding material 5A and the second bonding material 5B. The first bonding material 5A then solidifies, bonding the multilayer ceramic capacitor body 2 to the first metal terminal 100A. The second bonding material 5B then solidifies, bonding the multilayer ceramic capacitor body 2 to the second metal terminal 100B.

[0167] A process of disposing the electrostatic shielding metal 200 so as to cover the multilayer ceramic capacitor body 2 will be described with reference to Figs. 14A to 16B. Fig. 14A is a diagram showing a first metal plate 210 having a U-shaped cross section constituting the electrostatic shielding metal 200, and is an arrow view when viewed in the height direction from the first main surface TS1 side toward the second main surface TS2 side. Fig. 14B is a cross-sectional view taken along line XIVB-XIVB of the first metal plate 210 in Fig. 14A. Fig. 15A is a diagram showing a flat second metal plate 220 constituting the electrostatic shielding metal 200, and is an arrow view when viewed in the height direction from the second main surface TS2 side toward the first main surface TS1 side. Fig. 15B is a cross-sectional view taken along line XVB-XVB of the second metal plate 220 in Fig. 15A. Fig. 16A is a diagram showing a state in which the electrostatic shielding metal 200 is disposed on the multilayer ceramic capacitor body 2. FIG. 16B is a cross-sectional view taken along line XVIB-XVIB of the multilayer ceramic capacitor body 2 in which the electrostatic shielding metal 200 shown in FIG. 16A is disposed.

[0168] First, a first metal plate 210 having a U-shaped cross section as shown in FIG. 14A and FIG. 14B is prepared. The first metal plate 210 is formed by bending a single metal plate. In this embodiment, the first metal plate 210 having a U-shaped cross section configures a second shielding portion 200B covering at least a part of the second main surface TS2 of the laminate 10, a third shielding portion 200C covering at least a part of the first side surface WS1, and a fourth shielding portion 200D covering at least a part of the second side surface WS2. Next, a rectangular parallelepiped insulating layer 510 is bonded to the bottom surface of the U-shaped first metal plate 210 using an adhesive 511. This is the first metal shielding component 410.

[0169] Next, a flat second metal plate 220 is prepared as shown in Fig. 15A and Fig. 15B. In this embodiment, the flat second metal plate 220 constitutes a first shielding portion 200A that covers at least a part of the first main surface TS1 of the laminate 10. Next, a rectangular parallelepiped insulating layer 520 is bonded to the second metal plate 220 using an adhesive 521. This is called a second metal shielding component 420.

[0170] The thickness of the insulating layers 510, 520 is preferably 0.4 mm or more and 2 mm or less. The dimension in the length direction L of the insulating layers 510, 520 is preferably 50% or more and 80% or less of the dimension L3 in the length direction L of the portion of the surface of the laminate 10 that is exposed from the external electrode 40. The dimension in the width direction W of the insulating layers 510, 520 is preferably 50% or more and 80% or less of the dimension in the width direction W of the laminate 10.

[0171] 16A and 16B, a first metal shielding component 410 is bonded to the second main surface TS2 of the laminate 10 of the multilayer ceramic capacitor body 2 using an adhesive 512. Also, a second metal shielding component 420 is bonded to the first main surface TS1 of the laminate 10 of the multilayer ceramic capacitor body 2 using an adhesive 522. As a result, the electrostatic shielding metal 200 is arranged so as to cover the multilayer ceramic capacitor body 2.

[0172] Note that the portion S where the first metal plate 210 and the second metal plate 220 are close to each other as shown in FIG. 16B may be joined, or may not be joined and may remain as a slit.

[0173] According to this manufacturing method, the electrostatic shielding metal 200 can be easily arranged. In particular, even after the first metal terminal 100A and the second metal terminal 100B are joined to the multilayer ceramic capacitor body 2, the electrostatic shielding metal 200 can be easily arranged. Furthermore, according to this manufacturing method, the exposed surface of the laminate 10 of the multilayer ceramic capacitor body 2 can be easily covered with the electrostatic shielding metal 200. Note that the first metal terminal 100A and the second metal terminal 100B may be joined to the multilayer ceramic capacitor body 2 after the electrostatic shielding metal 200 is arranged so as to cover the multilayer ceramic capacitor body 2.

[0174] Next, the process of covering the multilayer ceramic capacitor body 2, the electrostatic shielding metal 200, the first bonding material 5A and the second bonding material 5B, a portion of the first metal terminal 100A, and a portion of the second metal terminal 100B with the exterior material 3 will be described.

[0175] The exterior material 3 is formed, for example, by a transfer molding method. Specifically, the multilayer ceramic capacitor before being covered with the exterior material 3, i.e., the multilayer ceramic capacitor body 2 provided with the metal terminals 100 and the electrostatic shielding metal 200, is placed in a mold. After that, the mold is filled with resin, and the resin is cured to form the exterior material 3. As a result, the exterior material 3 is provided so as to cover the multilayer ceramic capacitor body 2, the electrostatic shielding metal 200, the first bonding material 5A and the second bonding material 5B, a part of the first metal terminal 100A, and a part of the second metal terminal 100B. At this time, the exterior material 3 is also filled in the space between the multilayer ceramic capacitor body 2 and the electrostatic shielding metal 200. The exterior material 3 is also filled in the gap G.

[0176] The electrostatic shielding metal 200 may be formed of a metal thin film using plating, sputtering, vapor deposition, or the like. In this case, for example, first, in a first molding step, the exterior material 3 is provided so as to cover the multilayer ceramic capacitor body 2, the first bonding material 5A, the second bonding material 5B, a part of the first metal terminal 100A, and a part of the second metal terminal 100B. Then, in a thin film forming step, a metal thin film is formed as the electrostatic shielding metal 200 on the surface of the exterior material 3. Then, in a second molding step, the exterior material 3 is provided so as to cover the electrostatic shielding metal 200 formed in the thin film forming step. This allows the thickness of the electrostatic shielding metal to be thin, thereby suppressing an increase in the size of the multilayer ceramic capacitor 1.

[0177] When the electrostatic shielding metal 200 is formed from the above-mentioned metal plate, the process of forming the exterior material 3 can be reduced to a single molding process. When the electrostatic shielding metal 200 is formed from a metal thin film, a masking process needs to be performed after the first molding process to prevent a short circuit between the first metal terminal 100A and the second metal terminal 100B, but when the electrostatic shielding metal 200 is formed from a metal plate, such a masking process is not necessary.

[0178] Finally, if there is an unnecessary portion of the metal terminal 100, the unnecessary portion is cut off using a punching die or the like. Then, the metal terminal 100 is bent into a desired shape using a bending die or the like. In this manner, the metal terminal 100 may be formed by bending. That is, each connection portion of the metal terminal 100 that is bent may be formed by bending. Note that some bending is performed before the exterior material 3 is molded.

[0179] By the above-described manufacturing method, the multilayer ceramic capacitor 1 of the present embodiment is manufactured.

[0180] 17 shows a mounting structure 300 of the multilayer ceramic capacitor 1. FIG 17 is an external perspective view showing a mounting structure 300 in which the multilayer ceramic capacitor 1 of this embodiment is mounted on a mounting substrate 310.

[0181] The multilayer ceramic capacitor 1, which has been covered with the exterior material 3 and become a completed product, is then reflow-mounted as a component on a mounting board 310 via a bonding material 320 for mounting on a board.

[0182] Specifically, the first metal terminal 100A and the second metal terminal 100B are joined to the wiring member 312 arranged on the mounting surface 311 of the mounting substrate 310 via the bonding material 320 for mounting on the substrate. The second metal terminal 100B is joined to the wiring member 312 arranged on the mounting surface 311 of the mounting substrate 310 via the bonding material 320 for mounting on the substrate.

[0183] At this time, there is a risk that the bonding material 5 will melt and the volume of the bonding material 5 will expand, but since the exterior material 3 is filled in the gap G, the occurrence of problems such as solder splash can be suppressed.

[0184] A modified example of the multilayer ceramic capacitor 1 of this embodiment will be described below. In the following description, the same components as those in the above embodiment will be denoted by the same reference numerals, and detailed description will be omitted. Fig. 18A is a diagram showing a modified example of the multilayer ceramic capacitor 1 of this embodiment, and corresponds to Fig. 2.

[0185] In this modification, the configuration of the metal terminal is different from that of the above embodiment. The metal terminal of this modification has a first metal terminal 100C and a second metal terminal 100D.

[0186] Of the first metal terminal 100C, the configuration of the portion disposed inside the exterior material 3 is the same as the configuration of the first metal terminal 100A of the above embodiment. Of the second metal terminal 100D, the configuration of the portion disposed inside the exterior material 3 is the same as the configuration of the second metal terminal 100B of the above embodiment.

[0187] The first metal terminal 100C has a first extension 130C, a first falling portion 140C, and a first mounting portion 150C. The first extension 130C is connected to the first falling portion 140C immediately after protruding from the surface MLS1 on the first end face LS1 side of the exterior material 3. The connection portion between the first extension 130C and the first falling portion 140C is formed by bending at a substantially right angle. The first falling portion 140C extends toward the mounting surface in a direction substantially perpendicular to the mounting surface. The first mounting portion 150C extends along the mounting surface toward the center of the length direction L of the multilayer ceramic capacitor 1.

[0188] The second metal terminal 100D has a second extension 130D, a second falling portion 140D, and a second mounting portion 150D. The second extension 130D is connected to the second falling portion 140D immediately after protruding from the surface MLS2 on the second end face LS2 side of the exterior material 3. The connection portion between the second extension 130D and the second falling portion 140D is formed by bending at a substantially right angle. The second falling portion 140D extends toward the mounting surface in a direction substantially perpendicular to the mounting surface. The second mounting portion 150D extends along the mounting surface toward the center of the length direction L of the multilayer ceramic capacitor 1.

[0189] This makes it possible to shorten the dimension L8 in the longitudinal direction of the multilayer ceramic capacitor 1 including the first metal terminals 100C and the second metal terminals 100D, thereby making it possible to reduce the mounting area required when mounting the multilayer ceramic capacitor 1 on a mounting board.

[0190] Even in this case, it is preferable that the separation distance L7 between the end of the first mounting portion 150C of the first metal terminal 100C and the end of the second mounting portion 150D of the second metal terminal 100D is longer than the separation distance L3 between the first external electrode 40A and the second external electrode 40B of the multilayer ceramic capacitor body 2 shown in Figure 5.

[0191] In the multilayer ceramic capacitor body 2 of the present embodiment, the multiple first internal electrode layers 31 and the multiple second internal electrode layers 32 are alternately arranged in the height direction T of the laminate 10, but the configuration of the multilayer ceramic capacitor body 2 is not limited to this. The multiple first internal electrode layers 31 and the multiple second internal electrode layers 32 may be alternately arranged in the width direction W of the laminate 10.

[0192] In this case, the first lead portion of the first internal electrode layer 31 may be led to the first main surface TS1 on the first end face LS1 side, and the first external electrode 40A may be disposed only on the first end face LS1 side on the first main surface TS1. That is, the first external electrode 40A may not be provided on the first end face LS1. In this case, the first surface S1 on the first end face LS1 side of the multilayer ceramic capacitor body 2 is formed by the first end face LS1 of the laminate 10. Also, the second lead portion of the second internal electrode layer 32 may be led to the first main surface TS1 on the second end face LS2 side, and the second external electrode 40B may be disposed only on the second end face LS2 side on the first main surface TS1. That is, the second external electrode 40B may not be provided on the second end face LS2. In this case, the first surface S1 on the second end face LS2 side of the multilayer ceramic capacitor body 2 is formed by the second end face LS2 of the laminate 10. In this case, the bonding material 5 is less likely to wet into the gap G.

[0193] In the present embodiment, an example has been described in which one multilayer ceramic capacitor body 2 is covered with an exterior material 3 to form the multilayer ceramic capacitor 1, but this is not limiting. A plurality of multilayer ceramic capacitor bodies 2 as multilayer ceramic electronic component bodies may be covered with an exterior material 3 to form the multilayer ceramic capacitor 1 as the multilayer ceramic electronic component. For example, a plurality of multilayer ceramic capacitor bodies 2 arranged in parallel may be covered with an exterior material 3 to form the multilayer ceramic capacitor 1. For example, two or more stacked multilayer ceramic capacitor bodies 2 may be covered with an exterior material 3 to form the multilayer ceramic capacitor 1.

[0194] The configuration of the multilayer ceramic capacitor body is not limited to the configurations shown in Figures 7 to 10. For example, the multilayer ceramic capacitor body may be a multilayer ceramic capacitor having a double structure, a triple structure, or a quadruple structure as shown in Figures 19A, 19B, and 19C.

[0195] The multilayer ceramic capacitor body 2 shown in FIG. 19A is a multilayer ceramic capacitor body 2 having a double structure, and includes, as the internal electrode layer 30, a first internal electrode layer 33 and a second internal electrode layer 34, as well as a floating internal electrode layer 35 that is not drawn out to either the first end face LS1 or the second end face LS2. The multilayer ceramic capacitor body 2 shown in FIG. 19B is a multilayer ceramic capacitor body 2 having a triple structure, including a first floating internal electrode layer 35A and a second floating internal electrode layer 35B as the floating internal electrode layer 35. The multilayer ceramic capacitor body 2 shown in FIG. 19C is a multilayer ceramic capacitor body 2 having a quadruple structure, including a first floating internal electrode layer 35A, a second floating internal electrode layer 35B, and a third floating internal electrode layer 35C as the floating internal electrode layer 35. In this way, by providing the floating internal electrode layer 35 as the internal electrode layer 30, the multilayer ceramic capacitor body 2 has a structure in which the opposing electrode portion is divided into multiple parts. As a result, a plurality of capacitor components are formed between the opposing internal electrode layers 30, and these capacitor components are connected in series. This reduces the voltage applied to each capacitor component, thereby enabling the multilayer ceramic capacitor body 2 to withstand high voltage. It goes without saying that the multilayer ceramic capacitor body 2 of this embodiment may have a multi-row structure of four or more rows.

[0196] The multilayer ceramic capacitor body 2 may be a two-terminal type having two external electrodes, or a multi-terminal type having many external electrodes.

[0197] In the above-described embodiment, a multilayer ceramic capacitor using a dielectric ceramic is exemplified as a multilayer ceramic electronic component, but the multilayer ceramic electronic component of the present invention is not limited thereto, and can be applied to various multilayer ceramic electronic components such as a piezoelectric component using a piezoelectric ceramic, a thermistor using a semiconductor ceramic, an inductor using a magnetic ceramic, etc. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, examples of semiconductor ceramics include spinel ceramics, and examples of magnetic ceramics include ferrite.

[0198] The multilayer ceramic capacitor 1 serving as the multilayer ceramic electronic component of this embodiment provides the following advantages.

[0199] (1) A multilayer ceramic electronic component 1 of the present embodiment includes a laminate 10 including a plurality of laminated ceramic layers 20 and a plurality of internal conductor layers 30 laminated on the ceramic layers 20, the laminate 10 including a first main surface TS1 and a second main surface TS2 opposing each other in a height direction, a first side surface WS1 and a second side surface WS2 opposing each other in a width direction perpendicular to the height direction, and a first end face LS1 and a second end face LS2 opposing each other in a length direction perpendicular to the height direction and the width direction, and a multilayer ceramic electronic component body 2 having a first external electrode 40A arranged on the side of the first end face LS1 and a second external electrode 40B arranged on the side of the second end face LS2. The multilayer ceramic electronic component 1 includes a first metal terminal 100A connected to the first external electrode 40A, and a second metal terminal 100B connected to the second external electrode, and further includes a multilayer ceramic electronic component body 2, an exterior material 3 covering a portion of the first metal terminal 100A and a portion of the second metal terminal 100B, and an electrostatic shielding metal 200 embedded inside the exterior material 3 and covering at least a portion of the multilayer ceramic electronic component body 2, the electrostatic shielding metal 200 being disposed between a surface of the exterior material 3 and a surface of the multilayer ceramic electronic component body 2 and at a position away from the multilayer ceramic electronic component body 2. This makes it possible to provide a multilayer ceramic electronic component that can prevent an electric field generated within the electronic component from leaking to the surroundings.

[0200] Conventionally, a multilayer ceramic electronic component covered with an exterior material has a configuration in which a large creepage distance is ensured and high voltage resistance performance is obtained by covering the electronic component body to which the metal terminals are connected with the exterior material. However, there is a problem that the electric field generated in the electronic component leaks to the surroundings, making it easy for creepage discharge to occur, which reduces the voltage resistance performance. In particular, when an object having a charge or potential is present near the electronic component body, the leakage electric field may become large. In addition, when the thickness of the exterior material is partially thinned due to processing variations such as positional deviation of the electronic component body, the physical distance between the electronic component body and the outside becomes small, and the leakage electric field may become large. In the configuration of this embodiment, since the electrostatic shielding metal 200 is disposed at a position between the surface of the exterior material 3 and the surface of the multilayer ceramic electronic component body 2, the leakage of the electric field to the outside is suppressed by the electrostatic shielding effect. Therefore, creepage discharge is less likely to occur.

[0201] (2) The electrostatic shielding metal 200 of this embodiment is disposed so as to cover at least a part of the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10, which face the mounting surface of the mounting board on which the multilayer ceramic electronic component 1 is to be mounted. This makes it possible to effectively prevent the electric field generated within the electronic component from leaking to the surroundings.

[0202] (3) The electrostatic shielding metal 200 of this embodiment is a tubular member arranged to cover at least a part of the first main surface TS1, at least a part of the second main surface TS2, at least a part of the first side surface WS1, and at least a part of the second side surface WS2 of the laminate 10. This makes it possible to more effectively prevent the electric field generated in the electronic component from leaking to the surroundings.

[0203] (4) In the multilayer ceramic electronic component 1 of this preferred embodiment, the electrostatic shielding metal 200, which is a tubular member, has slits or joints provided along the length direction, which allows for an easy manufacturing configuration.

[0204] (5) The lengthwise dimension L5 of the electrostatic shielding metal 200 of this embodiment is longer than the lengthwise dimension of the portion of the surface of the laminate 10 that is exposed from the first external electrode 40A and the second external electrode 40B. This makes it possible to more effectively prevent the electric field generated in the electronic component from leaking to the surroundings.

[0205] (6) The lengthwise dimension L5 of the electrostatic shielding metal 200 of this embodiment is longer than the lengthwise dimension L0 of the multilayer ceramic electronic component body 2. This makes it possible to more effectively prevent the electric field generated within the electronic component from leaking to the surroundings.

[0206] (7) The first metal terminal 100A and the second metal terminal 100B of this embodiment are metal terminals mounted on a mounting surface of a mounting board on which the multilayer ceramic electronic component 1 is to be mounted. The first main surface TS1 of the laminate 10 is a surface facing the mounting surface. The first external electrode 40A is disposed at least on the first main surface TS1 near the first end face LS1. The second external electrode 40B is disposed at least on the first main surface TS1 near the second end face LS2. The metal terminal 100A faces the first main surface TS1 and includes a first joint portion 110A connected to the first external electrode 40A, a first rising portion 120A connected to the first joint portion 110A and extending away from the mounting surface, a first extension portion 130A connected to the first rising portion 120A and extending away from the multilayer ceramic electronic component body 2, and a first falling portion 140A connected to the first extension portion 130A and extending toward the mounting surface. The second metal terminal 100B faces the first main surface TS1 and has a second joint portion 110B connected to the second external electrode 40B, a second rising portion 120B connected to the second joint portion 110B and extending away from the mounting surface, and a second mounting portion 150A connected to the first falling portion 140A and extending in a direction along the mounting surface. The second metal terminal 100B faces the first main surface TS1 and has a second joint portion 110B connected to the second external electrode 40B, a second rising portion 120B connected to the second joint portion 110B and extending away from the mounting surface, and a second mounting portion 150A connected to the second rising portion 120B and extending away from the multilayer ceramic electronic component body 2. The first extension 130A has a first extension 130B, a second falling portion 140B connected to the second extension 130B and extending toward the mounting surface, and a second mounting portion 150B connected to the second falling portion 140B and extending in a direction along the mounting surface. The first extension 130A protrudes from the surface MTS1 on the first end face LS1 side of the exterior material 3 and is partially exposed, and the second extension 130B protrudes from the surface MTS2 on the second end face LS2 side of the exterior material 3 and is partially exposed. By employing such first metal terminal 100A and second metal terminal 100B, the distance between the mounting board and the multilayer ceramic electronic component body 2 can be increased, and the effect of alleviating the stress from the mounting board can be obtained. In addition, the thickness of the exterior material 3 provided on the mounting board side can be increased, and insulation can be ensured.

[0207] (8) The lengthwise dimension L5 of the electrostatic shielding metal 200 of this embodiment is longer than the lengthwise distance connecting the bent portion B1 constituting the connection between the first joint portion 110A and the first rising portion 120A and the bent portion B2 constituting the connection between the second joint portion 110B and the second rising portion 120B. This makes it possible to more effectively prevent the electric field generated in the electronic component from leaking to the surroundings.

[0208] (9) The exterior material 3 of the present embodiment is a thermosetting epoxy resin, which ensures adhesion between the exterior material 3 and the multilayer ceramic capacitor body 2 and the metal terminals 100, and improves the withstand voltage and moisture resistance.

[0209] (10) The electrostatic shielding metal 200 of this embodiment is a metal plate. This makes it possible to more effectively prevent the electric field generated in the electronic component from leaking to the surroundings. In addition, it is easy to manufacture.

[0210] (11) The electrostatic shielding metal 200 of this embodiment has two bent portions and includes a member that covers three of the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the multilayer ceramic electronic component body 2. This makes it possible to more effectively prevent the electric field generated within the electronic component from leaking to the surroundings. In addition, it is easy to manufacture.

[0211] (12) The electrostatic shielding metal 200 of this embodiment is a wire mesh. This can prevent the electric field generated in the electronic component from leaking to the surroundings. In addition, the weight can be prevented from increasing.

[0212] (13) The electrostatic shielding metal 200 of the present embodiment is a metal thin film. This can prevent the electric field generated in the electronic component from leaking to the surroundings. In addition, it can prevent the size and weight from increasing.

[0213] The present invention is not limited to the configurations of the above-mentioned embodiments, and can be appropriately modified and applied within the scope of the present invention. Note that the present invention also includes a combination of two or more of the individual desirable configurations described in the above-mentioned embodiments. [Explanation of symbols]

[0214] 1. Multilayer ceramic capacitors (multilayer ceramic electronic components) 2. Multilayer ceramic capacitor body (multilayer ceramic electronic component body) 3 Exterior materials 10 Laminate LS1 First end face, LS2 Second end face WS1 1st side, WS2 2nd side TS1: first main surface, TS2: second main surface 20 Dielectric layer (ceramic layer) 30 Internal electrode layer (internal conductor layer) 31 First internal electrode layer 32 Second internal electrode layer 40 External electrode 40A First outer electrode 40B Second external electrode 100 metal terminals 100A, 200A First metal terminal 100B, 200B Second metal terminal 110A First Junction 110B Second joint 120A First riser 120B Second rising part 130A, 130C First extension 130B, 130D Second extension 140A, 140C First falling part 140B, 140D Second falling part 150A, 150C First mounting section 150B, 150D Second mounting section 200 Electrostatic shielding metal

Claims

1. a laminate including a plurality of laminated ceramic layers and a plurality of internal conductor layers laminated on the ceramic layers, the laminate including a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction and the width direction; a first external electrode disposed on the first end surface side, and a second external electrode disposed on the second end surface side; a first metal terminal connected to the first external electrode; a second metal terminal connected to the second external electrode, an exterior material covering the laminated ceramic electronic component body, a portion of the first metal terminal, and a portion of the second metal terminal; an electrostatic shielding metal that is embedded in the exterior material and covers at least a part of the laminated ceramic electronic component body, the electrostatic shielding metal is disposed between a surface of the exterior material and a surface of the multilayer ceramic electronic component body, and at a position spaced apart from the multilayer ceramic electronic component body; the first metal terminal and the second metal terminal are metal terminals mounted on a mounting surface of a mounting substrate on which the multilayer ceramic electronic component is to be mounted; the first metal terminal is a bent plate-like metal terminal, and has a first falling portion extending toward the mounting surface of the mounting board so as to provide a gap between the exterior material and the mounting surface of the mounting board, and a first mounting portion connected to the first falling portion and extending in a direction along the mounting surface of the mounting board; the second metal terminal is a bent plate-like metal terminal, and has a second falling portion extending toward the mounting surface of the mounting board so as to provide a gap between the exterior material and the mounting surface of the mounting board, and a second mounting portion connected to the second falling portion and extending in a direction along the mounting surface of the mounting board; the electrostatic shielding metal is a tubular member arranged to cover at least a part of the first main surface, at least a part of the second main surface, at least a part of the first side surface, and at least a part of the second side surface of the laminate; the tubular member is made of a metal plate and has a slit or a joint provided along the length direction; a multilayer ceramic electronic component, wherein an opening area of ​​the opening on the first end face side of the tubular member is larger than an area of ​​a first surface on the first end face side of the multilayer ceramic electronic component body, and an opening area of ​​the opening on the second end face side of the tubular member is larger than an area of ​​a second surface on the second end face side of the multilayer ceramic electronic component body.

2. 2. The multilayer ceramic electronic component according to claim 1, wherein the lengthwise dimension of the electrostatic shielding metal is longer than the lengthwise dimension of a portion of the surface of the laminate that is exposed from the first external electrode and the second external electrode.

3. 3. The laminated ceramic electronic component according to claim 1, wherein the length of said electrostatic shielding metal is longer than the length of said laminated ceramic electronic component body.

4. the first main surface of the laminate is a surface facing the mounting surface, the first external electrode is disposed at least on the first main surface on a side of the first end surface, the second external electrode is disposed at least on the first main surface on the second end surface side, The first metal terminal includes: a first joint portion facing the first main surface and connected to the first external electrode; a first rising portion connected to the first joint portion and extending away from the mounting surface; a first extension portion connected to the first rising portion and extending away from the multilayer ceramic electronic component body; the first falling portion being connected to the first extension portion and extending toward the mounting surface side; The second metal terminal includes: a second joint portion facing the first main surface and connected to the second external electrode; a second rising portion connected to the second joint portion and extending away from the mounting surface; a second extension portion connected to the second rising portion and extending away from the multilayer ceramic electronic component body; the second falling portion being connected to the second extension portion and extending toward the mounting surface side, The first extension portion protrudes from the surface of the exterior material on the first end face side and is partially exposed, 4. The multilayer ceramic electronic component according to claim 1, wherein the second extension portion protrudes from the surface of the exterior material on the second end face side and is partially exposed.

5. 5. The multilayer ceramic electronic component according to claim 4, wherein the longitudinal dimension of the electrostatic shielding metal is longer than a longitudinal distance connecting a bent portion constituting a connection portion between the first joint portion and the first rising portion, and a bent portion constituting a connection portion between the second joint portion and the second rising portion.

6. 5. The laminated ceramic electronic component according to claim 1, wherein the exterior material is a thermosetting epoxy resin.

7. The multilayer ceramic electronic component according to any one of claims 1 to 6, wherein the electrostatic shielding metal has two bent portions and includes a member covering three of the first main surface, the second main surface, the first side surface, and the second side surface of the multilayer ceramic electronic component body.

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