Analysis device, analysis system, and analysis method

Abstract

To output stable arithmetic results.SOLUTION: An analysis device includes: a vibration sensor that detects vibration of an apparatus; an arithmetic unit that defines a peak value based on a standard deviation of detection data of the vibration sensor; and a wireless communication device that transmits processed data output by arithmetic computations by the arithmetic unit.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an analysis device, an analysis system, and an analysis method. [Background technology]

[0002] A technique for detecting vibrations generated during operation of equipment using a vibration sensor to diagnose whether or not there is an abnormality in the equipment is known (for example, Patent Document 1). Effective calculations for monitoring and analyzing equipment vibrations include the peak value of acceleration, the root mean square value (RMS), the overall value, and the crest factor (CF) obtained by dividing the peak value by the root mean square. To obtain these values, calculations are performed to obtain the maximum absolute value, root mean square value, and root mean square value, and to divide the maximum absolute value by the root mean square value of the vibration waveform data acquired by the acceleration sensor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-020090 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, because the effective value and overall value are average values, errors in the calculation results are small even if there is variation in repeated measurements. On the other hand, because the peak value is one point in the acquired waveform, there is a possibility that errors in the calculation results will be large if there is variation in repeated measurements. For example, one method to reduce variation is to take the average of the top several points from the maximum peak value, but if the maximum peak is significantly larger than the other values, there will still be large variations and the possibility of large errors in the calculation results. Because the crest factor, which is particularly important for monitoring the status of equipment, depends on the peak value, there was a problem that large errors in the peak value could cause problems in monitoring the status of equipment.

[0005] The present disclosure aims to output stable calculation results. [Means for solving the problem]

[0006] According to the present disclosure, an analysis device is provided that includes a vibration sensor that detects vibrations of equipment, a calculation unit that performs calculations to determine a peak value based on the standard deviation of the detected data of the vibration sensor, and a wireless communication device that transmits processed data output by the calculations performed by the calculation unit. [Effects of the Invention]

[0007] According to the present disclosure, stable calculation results can be output in an oscillatory phenomenon that follows a normal distribution. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view schematically showing an analysis device according to a first embodiment. [Figure 2] FIG. 2 is a perspective view schematically showing the thermoelectric power generation module according to the first embodiment. [Figure 3] FIG. 3 is a block diagram showing the analysis device according to the first embodiment. [Figure 4] FIG. 4 is a flowchart showing the analysis method according to the first embodiment. [Figure 5] FIG. 5 is a diagram showing an example of detection data in the analysis method according to the first embodiment. [Figure 6] FIG. 6 is a diagram showing the histogram of FIG. [Figure 7] FIG. 7 is an explanatory diagram for explaining a method for defining a peak value in the analysis method according to the first embodiment. [Figure 8] FIG. 8 is a diagram schematically illustrating an analysis system according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, but the present disclosure is not limited thereto. The components of the embodiments described below can be combined as appropriate. In addition, some components may not be used.

[0010] In this embodiment, an XYZ Cartesian coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis within a predetermined plane is defined as the X-axis direction, the direction parallel to the Y axis perpendicular to the X axis within the predetermined plane is defined as the Y-axis direction, and the direction parallel to the Z axis perpendicular to the predetermined plane is defined as the Z-axis direction. The XY plane including the X axis and Y axis is parallel to the predetermined plane.

[0011] (First embodiment) [Analysis equipment] FIG. 1 is a cross-sectional view schematically showing an analysis device 1 according to this embodiment. The analysis device 1 is installed in a device B. The device B is provided in an industrial facility such as a factory. An example of the device B is a rotating machine. An example of the rotating machine is a motor that operates a pump.

[0012] As shown in Figure 1, the analysis device 1 includes a heat receiving section 2, a heat dissipation section 3, a peripheral wall section 4, a thermoelectric power generation module 5, a vibration sensor 6, a microcomputer 8, a wireless communication device 9, a heat transfer member 10, a substrate 11, and a power storage section 14.

[0013] The heat receiving part 2 is installed in the device B. The heat receiving part 2 is a plate-shaped member. The heat receiving part 2 is made of a metal material such as aluminum or copper. The heat receiving part 2 receives heat from the device B. The heat of the heat receiving part 2 is transferred to the thermoelectric power generation module 5 via the heat transfer member 10.

[0014] The heat dissipation unit 3 faces the heat receiving unit 2 with a gap therebetween. The heat dissipation unit 3 is a plate-shaped member. The heat dissipation unit 3 is made of a metal material such as aluminum or copper. The heat dissipation unit 3 receives heat from the thermoelectric power generation module 5. The heat from the heat dissipation unit 3 is released into the atmospheric space surrounding the analysis device 1.

[0015] The heat receiving section 2 has a heat receiving surface 2A facing the surface of the device B, and an inner surface 2B facing the opposite direction to the heat receiving surface 2A. The heat receiving surface 2A faces the -Z direction. The inner surface 2B faces the +Z direction. The heat receiving surface 2A and the inner surface 2B are each flat. The heat receiving surface 2A and the inner surface 2B are each parallel to the XY plane. Within the XY plane, the outer shape of the heat receiving section 2 is substantially rectangular. However, the outer shape of the heat receiving section 2 does not have to be rectangular. The outer shape of the heat receiving section 2 may be circular, elliptical, or any polygonal shape.

[0016] The heat dissipation unit 3 has a heat dissipation surface 3A facing the atmospheric space and an inner surface 3B facing in the opposite direction to the heat dissipation surface 3A. The heat dissipation surface 3A faces the +Z direction. The inner surface 3B faces the -Z direction. The heat dissipation surface 3A and the inner surface 3B are both flat. The heat dissipation surface 3A and the inner surface 3B are both parallel to the XY plane. Within the XY plane, the outer shape of the heat dissipation unit 3 is substantially rectangular. However, the outer shape of the heat dissipation unit 3 does not have to be rectangular. The outer shape of the heat dissipation unit 3 may be circular, elliptical, or any polygonal shape.

[0017] In the XY plane, the outer shape and dimensions of the heat receiving section 2 are substantially equal to those of the heat dissipating section 3. However, the outer shape and dimensions of the heat receiving section 2 and the heat dissipating section 3 may be different.

[0018] The peripheral wall 4 is disposed between the peripheral edge of the inner surface 2B of the heat receiving portion 2 and the peripheral edge of the inner surface 3B of the heat dissipating portion 3. The peripheral wall 4 connects the heat receiving portion 2 and the heat dissipating portion 3. The peripheral wall 4 is made of synthetic resin.

[0019] In the XY plane, the peripheral wall 4 is annular. In the XY plane, the outer shape of the peripheral wall 4 is substantially rectangular. The heat receiving section 2, the heat dissipation section 3, and the peripheral wall 4 define an internal space 12 of the analysis device 1. The peripheral wall 4 has an inner surface 4B that faces the internal space 12. The inner surface 2B of the heat receiving section 2 faces the internal space 12. The inner surface 3B of the heat dissipation section 3 faces the internal space 12. The external space of the analysis device 1 is the atmospheric space surrounding the analysis device 1.

[0020] The heat receiving portion 2, the heat dissipating portion 3, and the peripheral wall portion 4 function as a housing of the analysis device 1 that defines the internal space 12. In the following description, the heat receiving portion 2, the heat dissipating portion 3, and the peripheral wall portion 4 will be collectively referred to as the housing 20 as appropriate.

[0021] A seal member 13A is arranged between the peripheral edge of the inner surface 2B of the heat receiving unit 2 and the end face on the -Z side of the peripheral wall 4. A seal member 13B is arranged between the peripheral edge of the inner surface 3B of the heat dissipation unit 3 and the end face on the +Z side of the peripheral wall 4. Each of the seal members 13A and 13B includes, for example, an O-ring. The seal member 13A is arranged in a recess provided in the peripheral edge of the inner surface 2B. The seal member 13B is arranged in a recess provided in the peripheral edge of the inner surface 3B. The seal members 13A and 13B prevent foreign matter from the external space of the analysis device 1 from entering the internal space 12.

[0022] The thermoelectric power generation module 5 generates electric power by utilizing the Seebeck effect. The device B functions as a heat source for the thermoelectric power generation module 5. The thermoelectric power generation module 5 is disposed between the heat receiving unit 2 and the heat dissipation unit 3. The end face 51 on the -Z side of the thermoelectric power generation module 5 is heated, and a temperature difference is created between the end face 51 on the -Z side and the end face 52 on the +Z side of the thermoelectric power generation module 5, causing the thermoelectric power generation module 5 to generate electric power.

[0023] The end face 51 faces the -Z direction. The end face 52 faces the +Z direction. Each of the end faces 51 and 52 is flat. Each of the end faces 51 and 52 is parallel to the XY plane. Within the XY plane, the outer shape of the thermoelectric power generation module 5 is substantially rectangular.

[0024] The end face 52 faces the inner surface 3B of the heat dissipation section 3. The thermoelectric power generation module 5 is fixed to the heat dissipation section 3. The heat dissipation section 3 and the thermoelectric power generation module 5 are bonded together by, for example, an adhesive.

[0025] In the example shown in FIG. 1, the thermoelectric power generation module 5 is in contact with the heat dissipation section 3, but it may also be in contact with the heat reception section 2.

[0026] The vibration sensor 6 detects vibrations of the device B. The vibration sensor 6 is driven by the power generated by the thermoelectric power generation module 5. The vibration sensor 6 is disposed in the internal space 12. In this embodiment, the vibration sensor 6 is supported on the inner surface 2B of the heat receiving part 2.

[0027] An acceleration sensor is exemplified as the vibration sensor 6. The vibration sensor 6 may also be a velocity sensor or a displacement sensor. In this embodiment, the vibration sensor 6 can detect vibrations of the device B in three directions: the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0028] The microcomputer 8 controls the analysis device 1. The microcomputer 8 is driven by the power generated by the thermoelectric power generation module 5. The microcomputer 8 is disposed in the internal space 12. In this embodiment, the microcomputer 8 is supported by a substrate 11.

[0029] The wireless communication device 9 communicates with a management computer 100 (see FIG. 3, etc.) located outside the analysis device 1. The wireless communication device 9 is driven by the power generated by the thermoelectric power generation module 5. The wireless communication device 9 is disposed in the internal space 12. In this embodiment, the wireless communication device 9 is supported by a substrate 11.

[0030] The heat transfer member 10 connects the heat receiving section 2 and the thermoelectric power generation module 5. The heat transfer member 10 transfers heat from the heat receiving section 2 to the thermoelectric power generation module 5. The heat transfer member 10 is made of a metal material such as aluminum or copper. The heat transfer member 10 is a rod-shaped member that is long in the Z-axis direction. The heat transfer member 10 is disposed in the internal space 12.

[0031] The substrate 11 includes a control substrate. The substrate 11 is disposed in the internal space 12. The substrate 11 is connected to the heat receiving unit 2 via a support member 11A. The substrate 11 is connected to the heat dissipation unit 3 via a support member 11B. The substrate 11 is supported by the support members 11A and 11B so as to be spaced apart from the heat receiving unit 2 and the heat dissipation unit 3, respectively.

[0032] The power storage unit 14 stores the power generated by the thermoelectric power generation module 5. Examples of the power storage unit 14 include a capacitor or a secondary battery.

[0033] [Thermoelectric power generation module] FIG. 2 is a perspective view schematically illustrating a thermoelectric power generation module 5 according to this embodiment. As shown in FIG. 2, the thermoelectric power generation module 5 includes p-type thermoelectric semiconductor elements 5P, n-type thermoelectric semiconductor elements 5N, first electrodes 53, second electrodes 54, a first substrate 51S, and a second substrate 52S. The p-type thermoelectric semiconductor elements 5P and the n-type thermoelectric semiconductor elements 5N are alternately arranged in the XY plane. The first electrodes 53 are connected to the p-type thermoelectric semiconductor elements 5P and the n-type thermoelectric semiconductor elements 5N, respectively. The second electrodes 54 are connected to the p-type thermoelectric semiconductor elements 5P and the n-type thermoelectric semiconductor elements 5N, respectively. The lower surfaces of the p-type thermoelectric semiconductor elements 5P and the n-type thermoelectric semiconductor elements 5N are connected to the first electrodes 53. The upper surfaces of the p-type thermoelectric semiconductor elements 5P and the n-type thermoelectric semiconductor elements 5N are connected to the second electrodes 54. The first electrodes 53 are connected to the first substrate 51S. The second electrode 54 is connected to the second substrate 52S.

[0034] Each of the p-type thermoelectric semiconductor element 5P and the n-type thermoelectric semiconductor element 5N includes, for example, a BiTe-based thermoelectric material. Each of the first substrate 51S and the second substrate 52S is formed of an electrically insulating material such as ceramics or polyimide.

[0035] The first substrate 51S has an end surface 51. The second substrate 52S has an end surface 52. When the first substrate 51S is heated, a temperature difference is created between the +Z side end and the -Z side end of each of the p-type thermoelectric semiconductor element 5P and the n-type thermoelectric semiconductor element 5N. When a temperature difference is created between the +Z side end and the -Z side end of the p-type thermoelectric semiconductor element 5P, holes move in the p-type thermoelectric semiconductor element 5P. When a temperature difference is created between the +Z side end and the -Z side end of the n-type thermoelectric semiconductor element 5N, electrons move in the n-type thermoelectric semiconductor element 5N. The p-type thermoelectric semiconductor element 5P and the n-type thermoelectric semiconductor element 5N are connected via a first electrode 53 and a second electrode 54. A potential difference is created between the first electrode 53 and the second electrode 54 due to the holes and electrons. The potential difference created between the first electrode 53 and the second electrode 54 causes the thermoelectric power generation module 5 to generate power. A lead wire 55 is connected to the first electrode 53. The thermoelectric power generation module 5 outputs electric power via a lead wire 55 .

[0036] [Microcomputer] 3 is a block diagram showing the analysis device 1 according to this embodiment. As shown in Fig. 3, the thermoelectric power generation module 5, the power storage unit 14, the vibration sensor 6, the microcomputer 8, and the wireless communication device 9 are housed in a single housing 20.

[0037] The microcomputer 8 includes a detection data acquisition unit 81 , a calculation unit 82 , and a communication control unit 83 .

[0038] The detection data acquisition unit 81 acquires detection data from the vibration sensor 6 at a preset measurement time and sampling frequency (ODR: Output Data Rate). The detection data from the vibration sensor 6 includes a vibration waveform. The measurement time and sampling frequency need to be set within a range that satisfies certain conditions, such as the number of sampling points not exceeding an upper limit that depends on the memory capacity of the microcomputer 8.

[0039] The calculation unit 82 controls each part of the microcomputer 8 to execute a pre-stored program. The calculation unit 82 performs calculation processing based on the detection data of the vibration sensor 6 acquired by the detection data acquisition unit 81, and outputs processed data. The processed data refers to data generated by processing the detection data.

[0040] The calculation unit 82 can process the detection data of the vibration sensor 6 based on a vibration analysis method such as a fast Fourier transform (FFT) and output processed data. Before performing the FFT analysis, the calculation unit 82 may perform high pass filter (HPF) processing and low pass filter (LPF) processing as a band pass filter (BPF).

[0041] The processed data generated by the calculation unit 82 includes at least one of the peak value, effective value, frequency, overall value, and crest factor of the vibration of the device B calculated from the detection data of the vibration sensor 6, for example.

[0042] The calculation unit 82 processes the detection data of the vibration sensor 6 to calculate the peak value of the vibration of the device B. The peak value of the vibration includes the maximum and minimum values ​​of the vibration. The peak value of the vibration may be the peak value of the entire range of the vibration waveform, or may be the peak value in each of multiple frequency ranges. The peak value of the vibration may be the peak value of acceleration, the peak value of velocity, or the peak value of displacement.

[0043] The calculation unit 82 calculates the standard deviation σ of the vibration waveform (e.g., acceleration data) acquired by the detection data acquisition unit 81. The calculation unit 82 extracts accelerations at each time point whose absolute value is greater than nσ, which is the value obtained by multiplying the standard deviation σ by a coefficient n, and calculates the average value of the absolute values ​​of the extracted accelerations. The calculation unit 82 defines the average value of accelerations whose absolute value is greater than the calculated nσ as the peak value of the vibration. The coefficient n is set in advance. The coefficient n is set in the range of 2≦n≦3. The coefficient n can be changed as appropriate. The coefficient n may be set by an operator via wireless communication from the management computer 100, for example.

[0044] The calculation unit 82 processes the detection data of the vibration sensor 6 to calculate the root mean square value (RMS) of the vibration of the device B. The calculation unit 82 may also divide the entire range of the vibration waveform detected by the vibration sensor 6 into multiple frequency ranges and calculate the root mean square value for each of the multiple frequency ranges. The root mean square value of the vibration may be the root mean square value of the acceleration, the root mean square value of the velocity, or the root mean square value of the displacement.

[0045] The calculation unit 82 processes the detection data of the vibration sensor 6 to calculate the vibration frequency of the device B. The calculation unit 82 also processes the detection data of the vibration sensor 6 to calculate an overall value of the vibration.

[0046] The calculation unit 82 can calculate the crest factor (CF) of device B based on the specified peak value and the calculated effective value. The crest factor is the ratio of the peak value to the effective value (peak value / effective value). For example, when diagnosing the condition of the bearing of a motor of a rotating device, a high crest factor indicates a tendency for the bearing to be damaged and for shock vibration to occur, while a low crest factor indicates a tendency for the bearing to be poorly lubricated and for the load on the motor to be increased.

[0047] The communication control unit 83 controls the wireless communication device 9 so that it communicates with the management computer 100. When the wireless communication device 9 receives setting data for setting a coefficient n for defining the peak value from the management computer 100, the communication control unit 83 outputs the received setting data to the calculation unit 82.

[0048] Furthermore, the communication control unit 83 controls the wireless communication device 9 so that the detection data of the vibration sensor 6 acquired by the detection data acquisition unit 81 is transmitted to the management computer 100. The wireless communication device 9 transmits the detection data of the vibration sensor 6 acquired by the detection data acquisition unit 81 to the management computer 100.

[0049] Furthermore, when the processing data is output by the calculation unit 82, the communication control unit 83 controls the wireless communication device 9 so that the processing data is transmitted to the management computer 100. The wireless communication device 9 transmits the processing data calculated by the calculation unit 82 to the management computer 100.

[0050] [Analysis method] 4 is a flowchart showing an analysis method according to this embodiment. In this embodiment, equipment B on which analysis device 1 is installed is a motor, which is a type of rotating machine. The motor operates a pump. In the analysis method according to this embodiment, the peak value, effective value, overall value, and crest factor of vibration are output as processed data in order to diagnose whether or not there is damage to the motor bearings.

[0051] In the analysis device 1, the coefficient n for defining the peak value is set by the calculation unit 82 based on setting data set, for example, via wireless communication from the management computer 100 (step S1).

[0052] The detection data acquisition unit 81 acquires, as detection data, acceleration data for the number of sampling points of the measurement time and sampling frequency (ODR) set by the calculation unit 82 from the vibration sensor 6, that is, raw data of the vibration waveform (step S2).

[0053] 5 is a diagram showing an example of detected data in the analysis method according to this embodiment. The vertical axis of FIG. 5 represents the acceleration [m / s 2 ], and the horizontal axis represents time [msec].

[0054] The detection data acquisition unit 81 acquires acceleration waveform data as shown in Fig. 5 in step S2 shown in Fig. 4. As shown in Fig. 5, the acquired acceleration waveform data has variations in peak magnitude (maximum value Ph and minimum value Pl). In other words, if the acquired acceleration waveform data is processed as is, there is a possibility that errors in the calculation results will be large.

[0055] The calculation unit 82 calculates the standard deviation σ of the acceleration data acquired by the detection data acquisition unit 81 in step S2 (step S3).

[0056] Fig. 6 is a diagram showing the histogram of Fig. 5. The vertical axis of Fig. 6 indicates the number of sampling points, and the horizontal axis indicates the acceleration [m / s 2 7 is an explanatory diagram for explaining a method for defining a peak value in the analysis method according to this embodiment. The vertical axis of FIG. 7 represents the acceleration [m / s 2 ], and the horizontal axis represents time [msec].

[0057] As shown in Fig. 6, when the calculation unit 82 divides the acceleration data into a plurality of acceleration ranges and generates a histogram showing the number of sampling points for each acceleration range, the acceleration histogram will have a generally normal distribution. In the example shown in Fig. 6, one acceleration range is approximately 100 [m / s 2 ].

[0058] The calculation unit 82 extracts accelerations whose absolute values ​​are greater than nσ, which is n times the standard deviation σ calculated in step S3, and calculates the average value of the extracted accelerations (step S4). The calculation unit 82 calculates the average value of the absolute values ​​of all the extracted accelerations. The calculation unit 82 defines the average value of the accelerations whose absolute values ​​are greater than the calculated nσ as the peak value of vibration (step S5).

[0059] For example, when n=2, the calculation unit 82 calculates the normal distribution line B shown in FIG. +2σ The outer part Pha +2σ Acceleration included in line B -2σ The outer part Pla -2σ 7. In this way, the calculation unit 82 calculates the average value of the absolute values ​​of the acceleration included in the waveform data of the acceleration shown in FIG. +2σ The acceleration of the point where the value of the acceleration is greater than or equal to B -2σ The average value of the absolute values ​​of the accelerations at the points below is defined as the peak value of the vibration.

[0060] For example, when n=2.5, the calculation unit 82 calculates the normal distribution line B shown in FIG. +2.5σ The outer part Pha +2.5σ Acceleration included in line B -2.5σ The outer part Pla -2.5σ 7. In this way, the calculation unit 82 calculates the average value of the absolute values ​​of the acceleration included in the waveform data of the acceleration shown in FIG. +2.5σ The acceleration of the point where the value of the acceleration is greater than or equal to B -2.5σ The average value of the absolute values ​​of the accelerations at the points below is defined as the peak value of the vibration.

[0061] For example, when n=3, the calculation unit 82 calculates the normal distribution line B shown in FIG. +3σ The outer part Pha +3σ Acceleration included in line B -3σ The outer part Pla -3σ 7. In this way, the calculation unit 82 calculates the average value of the absolute values ​​of the acceleration included in the waveform data of the acceleration shown in FIG. +3σ The acceleration of the point where the value of the acceleration is greater than or equal to B -3σ The average value of the absolute values ​​of the accelerations at the points below is defined as the peak value of the vibration.

[0062] The calculation unit 82 processes the detection data of the vibration sensor 6 to calculate an effective value. The calculation unit 82 processes the detection data of the vibration sensor 6 to calculate an overall value. The calculation unit 82 calculates a crest factor based on the peak value determined in step S5 and the calculated effective value (step S6).

[0063] The calculation unit 82 transmits the calculated peak value, effective value, overall value, and crest factor as processed data to the wireless communication device 9. The wireless communication device 9 transmits the processed data to the management computer 100 (step S7).

[0064] Based on the transmitted processing data, the management computer 100 can monitor and manage the status of the device B. Based on the transmitted processing data, the management computer 100 can diagnose whether or not there is an abnormality in the device B.

[0065] [effect] As described above, according to this embodiment, the vibration sensor 6 is installed in the device B. The detection data of the vibration sensor 6 is output to the microcomputer 8. The calculation unit 82 of the microcomputer 8 determines the peak value based on the standard deviation σ of the detection data of the vibration sensor 6.

[0066] In this way, by defining the peak value from the average value of the quantitatively extracted range using the analysis method of the embodiment, the peak value can be calculated quantitatively and errors in the calculation results can be reduced. Therefore, even if there is variation in repeated measurements due to a small number of measurement points of the vibration waveform of the detection data or a short measurement time due to power limitations or the capabilities of the microcomputer 8, stable calculation results can be output, and the accuracy of status monitoring of device B can be improved.

[0067] In the embodiment, the processed data output by the calculation unit 82 is transmitted from the wireless communication device 9 to the management computer 100. Therefore, the management computer 100 can properly diagnose the device B based on the quantitatively calculated peak value and each value calculated from the peak value.

[0068] In this embodiment, the calculation unit 82 defines, as a peak value, an average value of acceleration whose absolute value is greater than nσ, which is the value obtained by multiplying the standard deviation σ by a coefficient n, for the data detected by the vibration sensor 6. The calculation unit 82 is able to change the coefficient n. That is, since the peak value can be defined based on the standard deviation σ multiplied by the coefficient n, the defined range of the peak can be easily changed depending on the diagnostic target, etc.

[0069] (Second embodiment) A second embodiment will now be described. In the following description, the same or equivalent components as those in the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be simplified or omitted.

[0070] [Analysis System] FIG. 8 is a diagram schematically illustrating an analysis system 200 according to this embodiment. As shown in FIG. 8, the analysis system 200 includes a plurality of analysis devices 1 installed in equipment B, a communication device 210, and a repeater 220. A plurality of pieces of equipment B are installed in an industrial facility. As described above, an example of equipment B is a motor that operates a pump. Equipment B may be installed underground. When equipment B operates, it generates heat. Equipment B functions as a heat source for the analysis devices 1.

[0071] The communication device 210 receives the detection data of the vibration sensor 6 and the processed data output by the calculation unit 82 transmitted from each of the plurality of analysis devices 1 via the repeater 220, and transmits them to the management computer 100. For example, the communication device 210 processes the detection data and processed data transmitted from each of the plurality of analysis devices 1 into a predetermined format, and then transmits them to the management computer 100. The detection data and processed data from each of the plurality of analysis devices 1 are aggregated by the communication device 210 and then transmitted to the management computer 100. The communication device 210 and the management computer 100 may communicate wirelessly or via wire.

[0072] The repeater 220 relays communication between the analysis device 1 and the communication device 210. A plurality of repeaters 220 are provided. The repeaters 220 and the communication device 210 communicate wirelessly.

[0073] The management computer 100 can monitor and manage the states of the multiple devices B based on the detection data of the vibration sensors 6 transmitted from each of the multiple analysis devices 1 and the processed data output by the calculation unit 82. The management computer 100 can diagnose whether or not there is an abnormality in the device B based on the detection data of the vibration sensors 6 transmitted from each of the multiple analysis devices 1 and the processed data output by the calculation unit 82.

[0074] The plurality of analysis devices 1 can transmit detection data and processing data independently. That is, the analysis device 1 can transmit detection data and processing data without being affected by other analysis devices 1.

[0075] For example, if equipment B and analysis device 1 are located underground and communication device 210 and management computer 100 are located above ground, a repeater 220 is installed so that the detection data and processing data sent from analysis device 1 can be smoothly transmitted to management computer 100.

[0076] [effect] As described above, in this embodiment, the analysis system 200 includes a plurality of analysis devices 1 installed in each of the plurality of devices B, and a communication device 210 that receives processing data transmitted from each of the plurality of analysis devices 1 and transmits the data to the management computer 100. Therefore, the management computer 100 can monitor and manage the status of the plurality of devices B, and diagnose whether or not there is an abnormality in the plurality of devices B.

[0077] [Other embodiments] In the above-described embodiment, the management computer 100 may be configured as one computer or as multiple computers.

[0078] In the above-described embodiment, the thermoelectric power generation module 5, the vibration sensor 6, the microcomputer 8, and the wireless communication device 9 are accommodated in one housing 20. The thermoelectric power generation module 5 may be accommodated in a first housing, and the vibration sensor 6, the microcomputer 8, and the wireless communication device 9 may be accommodated in a second housing. The first housing and the second housing may be separate housings. The power storage unit 14 may be disposed between the first housing and the second housing.

[0079] In the above-described embodiment, the function of the calculation unit 82 may be provided in the management computer 100. The detected data of the vibration sensor 6 may be transmitted to the management computer 100 via the wireless communication device 9, and the management computer 100 may output processed data. Also, the function of the management computer 100 may be provided in the microcomputer 8. For example, the calculation unit 82 may diagnose the presence or absence of an abnormality. [Explanation of symbols]

[0080] 1...analysis device, 2...heat receiving portion, 2A...heat receiving surface, 2B...inner surface, 3...heat dissipation portion, 3A...heat dissipation surface, 3B...inner surface, 4...peripheral wall portion, 4B...inner surface, 5...thermoelectric power generation module, 5N...n-type thermoelectric semiconductor element, 5P...p-type thermoelectric semiconductor element, 6...vibration sensor, 8...microcomputer, 9...wireless communication device, 10...heat transfer member, 11...substrate, 11A...supporting member, 11B...supporting member, 12...internal space , 13A...sealing member, 13B...sealing member, 14...storage unit, 20...housing, 51...end surface, 51S...first board, 52...end surface, 52S...second board, 53...first electrode, 54...second electrode, 55...lead wire, 81...detection data acquisition unit, 82...calculation unit, 83...communication control unit, 100...management computer, 200...analysis system, 210...communication device, 220...repeater, B...equipment.

Claims

1. A vibration sensor that detects vibration of the device; a calculation unit that extracts accelerations at respective points in time when the absolute value of the acceleration is greater than a standard deviation multiplied by a coefficient from the detection data of the vibration sensor, and calculates an average value of the extracted accelerations as a peak value; and a wireless communication device for transmitting processed data output by the calculation unit. Analysis device.

2. The calculation unit is capable of changing the coefficients. The analysis device according to claim 1 .

3. Equipped with a thermoelectric power generation module, The vibration sensor is driven by the power generated by the thermoelectric power generation module. The analysis device according to claim 1 or 2.

4. The analysis device according to any one of claims 1 to 3, a management computer that receives the processing data transmitted from the analysis device and diagnoses the device; Analysis system.

5. Obtaining detection data from a vibration sensor that detects vibration of an equipment; Extracting accelerations at each point in time when the absolute value of the acceleration is greater than a standard deviation multiplied by a coefficient from the detection data of the vibration sensor, and calculating an average value of the extracted accelerations as a peak value; and transmitting the processed data output by the calculation. Analysis method.

6. The vibration sensor is driven by power generated by a thermoelectric power generation module. The analysis method according to claim 5.

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